WO2015072594A1 - Appareil d'alignement de puce de machine de liaison de puce laser - Google Patents

Appareil d'alignement de puce de machine de liaison de puce laser Download PDF

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Publication number
WO2015072594A1
WO2015072594A1 PCT/KR2013/010326 KR2013010326W WO2015072594A1 WO 2015072594 A1 WO2015072594 A1 WO 2015072594A1 KR 2013010326 W KR2013010326 W KR 2013010326W WO 2015072594 A1 WO2015072594 A1 WO 2015072594A1
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WO
WIPO (PCT)
Prior art keywords
chip
substrate
bonding
module
vision
Prior art date
Application number
PCT/KR2013/010326
Other languages
English (en)
Korean (ko)
Inventor
최지웅
조진구
최정수
Original Assignee
(주)정원기술
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)정원기술 filed Critical (주)정원기술
Priority to PCT/KR2013/010326 priority Critical patent/WO2015072594A1/fr
Publication of WO2015072594A1 publication Critical patent/WO2015072594A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/75251—Means for applying energy, e.g. heating means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/755—Cooling means
    • H01L2224/75501—Cooling means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75753—Means for optical alignment, e.g. sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER

Definitions

  • the present invention relates to a chip aligning device of a laser chip bonding machine, and more particularly, to a substrate stage module, a bonding head module, and an alignment vision module, wherein an alignment vision module performs vision inspection to align positions of a substrate and a chip.
  • the bonding head module is lowered in the Z direction to bond by pressurization and laser irradiation, so that the bonding operation can be performed after precisely aligning the position of the substrate and the chip.
  • It has a cooler for air-cooling the align vision module itself and a heat insulation plate for minimizing the temperature influence of the lower substrate so that it can be improved
  • the substrate stage module has a heat sink between a heating plate and a cooling base plate for heating the substrate.
  • Flip chips which are semiconductor chips for such small and light electronic devices, have a separate wire or ball grid array (BGA) when mounted on a substrate. It is possible to bond as it is using the electrode pattern disposed on the bottom of the chip without using.
  • BGA ball grid array
  • a ball grid array (BGA) chip or a flip chip has a surface where an electrode is not formed on the upper surface of a wafer, thereby inverting the chip when mounted on a substrate.
  • a flipping process must be involved.
  • the chip supplied to the bonding head through the chip transferer must be exactly aligned with the bonding position of the substrate placed in the substrate stage module, and then supplied onto the substrate to be bonded by pressing and laser irradiation.
  • the alignment vision which has a 2-field recognition means is used normally.
  • the bonding process of the chip and the substrate requires very high precision. Therefore, the image of the chip and the substrate recognized as the alignment vision becomes information for causing the chip and the substrate to be aligned in position.
  • the prior art related to the present invention discloses a flip chip bonding apparatus of Patent Publication No. 10-2009-0131863, a bonding apparatus of Patent No. 0672227, and the like, in which a vision processor is fixed.
  • the present invention has been made to solve the above problems, and an object of the present invention is to provide a two-view field so that the position of the chip and the substrate can be accurately aligned in a laser bonding machine for bonding a semiconductor chip onto a substrate using a laser.
  • Using alignment vision with recognition means it is possible to maintain the measurement accuracy stably despite temperature changes and to realize high precision mounting by using solder balls even if the mounting mark of the chip is damaged or contaminated.
  • the present invention provides a chip aligning device for a laser chip bonding machine.
  • a preferred embodiment of the present invention comprises a substrate stage module, a bonding head module, and an alignment vision module in a bonding machine for bonding a chip picked up from a wafer onto a substrate so that the substrate is seated on the substrate stage module.
  • the alignment vision module performs vision inspection to align the positions of the substrate and the chip, and then the bonding head module descends in the Z direction to bond by pressurization and laser irradiation. After this is done, the bonding head module is raised in the Z direction to provide the chip aligning device of the laser chip bonding machine to return to the original position.
  • the substrate stage module includes a stage moving in the X and Y directions by a linear motor, a work table mounted on the stage and fixing the substrate by a vacuum suction force, and installed below the work table. It is made by including a heating plate and a cooling base plate, the heat sink and the insulating plate is interposed between the heating plate lower portion and the cooling base plate to operate by minimizing the damage caused by the heat of the linear motor for driving the substrate stage in the X, Y direction It is designed to keep the precision stable during control.
  • the bonding head module includes a block for up / down the bonding head, a load cell for pressing the chip secondary, a servo motor for aligning the bonding head in the ⁇ direction, and a heat source for bonding. It comprises a laser supply for supplying.
  • the alignment vision module includes two visions for inspecting a substrate and a chip, a cooler for cooling the vision by air cooling, and a heat insulation plate under the vision. Minimize the number and improve the inspection ability during vision inspection.
  • the alignment vision module is provided with an auto calibration function to prevent heat from being generated from the substrate stage module in the lower vision for inspecting the substrate, thereby causing distortion of the vision.
  • the alignment of the chip and the substrate using the existing alignment vision is made of a pattern matching algorithm, but in a specific embodiment of the present invention, the edges of the substrate and the chip are respectively detected, and each of the three edges is detected. It is programmed to extract X, Y, ⁇ and align the relative positions of the chip and the substrate by the extracted data.
  • the alignment vision module when using the alignment vision having a two-field recognition means, prevents the measurement accuracy from being lowered due to temperature change, thereby accurately measuring the positions of the chip and the substrate so that the center positions coincide. It can be aligned so as to provide a bonding machine that can reduce the positional shift in the bonding, and between the heating plate and the cooling base plate installed in the substrate stage module is interposed between the heat sink and the heat insulating plate X, Y The damage caused by the heat of the linear motor for driving in the direction can be minimized to enable precise operation control. Also, by implementing the alignment using the solder balls of the chip, high precision mounting is possible.
  • FIG. 1 is a front view showing a schematic configuration of a laser chip bonding machine according to the present invention
  • FIG. 2 is a side view showing a schematic configuration of a laser chip bonding machine according to the present invention
  • FIG. 3 is a perspective view of the substrate stage module shown in FIG.
  • FIG. 4 is a perspective view of the bonding head module shown in FIG.
  • FIG. 5 is a perspective view of the alignment vision module shown in FIG. 1.
  • the laser chip bonding device of the present embodiment includes a substrate stage module 10, a bonding head module 20, and a la
  • the vision module 30 is composed of the in-vision module 30 and the substrate is mounted on the substrate stage module 10 and the bonding vision module 30 receives the chip and the alignment vision module 30 checks the vision of the substrate and the chip. After aligning the position of the substrate and the chip by performing the bonding, the bonding head module 20 is lowered in the Z direction and bonding is performed by laser irradiation while the chip is pressed against the substrate, and then the bonding head module 20 is again Z Direction to return to its original position.
  • the substrate stage module 10 serves to move and heat (preheat) the substrate to a desired position in order to bond the chips, which is provided by a linear motor (not shown) as shown in FIGS. And a stage 11 moving in the Y direction, a work table 12 mounted on the stage 11 to fix a substrate (not shown) by a vacuum suction force, and a lower portion of the work table 12. It comprises a heating plate 13 and a cooling base plate 14 to be.
  • a linear motor for driving the substrate stage 11 in the X and Y directions between the heating plate 13 and the cooling base plate 14 by interposing a heat sink 15 and a heat insulating plate 16 from the top.
  • the heating plate 13 preheats the substrate to a temperature of about 80 ° C., and the cooling base plate 14 is always operated during operation of the equipment together with the heating plate 13 so that the heat generated from the heating plate 13 is reduced. It serves to block the fall down.
  • reference numeral 17 denotes an air-gyro module for adjusting the flatness of the work table 12
  • reference numeral 18 denotes a box for collecting defective parts (chips)
  • reference numeral 19 denotes a vision calibrator.
  • the bonding head module 20 bonds the chip onto the substrate, which is a block 22 for up / down the bonding head 21 and a chip as shown in FIG. 4.
  • the servo motor 24 is for aligning the bonding head 21 in the ⁇ direction. This means that the upper edge of the alignment vision 20 (not shown) has three edges of the chip adsorbed to the bonding head 21. The bonding head 21 is moved in the [theta] direction so that it can be accurately aligned with the substrate.
  • the alignment vision module 30 is for inspecting and aligning a substrate and a chip, which is two vision 31 and a cooler 32 for cooling the vision 31 by air cooling as shown in FIG. 5. It consists of).
  • reference numeral 33 denotes a tool holder 33 for storing a tool
  • 34 denotes a sensor for detecting a tool
  • 35 denotes a tool clamp.
  • reference numeral 36 is a heat insulating plate installed under the vision 31, which is to minimize the deformation of the lens due to the heat transferred from the substrate.
  • the substrate is placed on the work table 12 of the substrate stage module 10 and fixed by vacuum suction force, and the substrate is preheated by the heating plate 13 to bond the chip on the substrate, and is supplied from the wafer.
  • the received chip is measured by the alignment vision module 30 before the bonding is performed while maintaining the state of being adsorbed to the bonding head 21 of the bonding head module 20 by vacuum suction force. do.
  • the process of measuring the position of the substrate and the chip using the alignment vision module is as follows.
  • the chip is first recognized, the edge of the solder ball is detected, and the center of the solder ball is obtained.
  • Two or more solder balls formed on the bottom surface of the chip are each centered to make a line, and the center point of the horizontal and vertical solder balls is connected by a line to make an intersection point.
  • the secondary recognition is shifted diagonally to detect the edge of the solder ball to find the center of the solder ball.
  • the substrate recognizes three of the fiducial mark (fiducial mark) to obtain the center, and then use the three points to create a virtual rectangle to obtain the horizontal, vertical, center.
  • the bonding head After the inspection of the chip and the substrate is finished as described above to offset the offset (off-set) by the horizontal, vertical, and center of each other to drive the substrate stage module 10 and the bonding head module 20 to position the chip and the substrate After exactly matching, the bonding head finally descends to proceed with bonding.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)

Abstract

La présente invention concerne un appareil d'alignement de puce d'une machine de liaison de puce laser, comprenant un module d'étage de substrat (10), un module de tête de liaison (20) et un module de vision d'alignement (30), où dans un état dans lequel un module de tête de liaison (20) reçoit une puce dans un état dans lequel un substrat est placé sur le module d'étage de substrat (10), le module de vision d'alignement (30) aligne les positions du substrat et de la puce en effectuant une inspection visuelle, le module de tête de liaison (20) descend dans une direction Z afin d'effectuer la liaison au moyen d'une pression et d'un rayonnement laser, et le module de tête de liaison (20) monte à nouveau dans la direction Z de sorte à être renvoyé à sa position d'origine.
PCT/KR2013/010326 2013-11-14 2013-11-14 Appareil d'alignement de puce de machine de liaison de puce laser WO2015072594A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/KR2013/010326 WO2015072594A1 (fr) 2013-11-14 2013-11-14 Appareil d'alignement de puce de machine de liaison de puce laser

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/KR2013/010326 WO2015072594A1 (fr) 2013-11-14 2013-11-14 Appareil d'alignement de puce de machine de liaison de puce laser

Publications (1)

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WO2015072594A1 true WO2015072594A1 (fr) 2015-05-21

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI697088B (zh) * 2019-05-03 2020-06-21 南韓商普羅科技有限公司 用於覆晶雷射接合之系統
CN112349630A (zh) * 2020-11-03 2021-02-09 武汉智汇芯科技有限公司 一种用于激光二极管芯片高重复性位置识别的方法及装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030004063A (ko) * 2001-07-02 2003-01-14 우시오덴키 가부시키가이샤 레지스트 경화 장치의 워크 스테이지
KR20080079885A (ko) * 2007-02-28 2008-09-02 삼성테크윈 주식회사 칩 본딩 툴, 그 본딩 툴을 구비하는 플립 칩 본딩 장치 및 방법
KR101044622B1 (ko) * 2011-01-14 2011-06-29 주식회사 아이. 피. 에스시스템 반도체 칩 본딩장치
KR20110116845A (ko) * 2010-04-20 2011-10-26 세크론 주식회사 얼라인용 비전 장치 및 이를 셋팅하는 방법
KR20120017124A (ko) * 2010-08-18 2012-02-28 (주)큐엠씨 레이저 가공 방법 및 레이저 가공 장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030004063A (ko) * 2001-07-02 2003-01-14 우시오덴키 가부시키가이샤 레지스트 경화 장치의 워크 스테이지
KR20080079885A (ko) * 2007-02-28 2008-09-02 삼성테크윈 주식회사 칩 본딩 툴, 그 본딩 툴을 구비하는 플립 칩 본딩 장치 및 방법
KR20110116845A (ko) * 2010-04-20 2011-10-26 세크론 주식회사 얼라인용 비전 장치 및 이를 셋팅하는 방법
KR20120017124A (ko) * 2010-08-18 2012-02-28 (주)큐엠씨 레이저 가공 방법 및 레이저 가공 장치
KR101044622B1 (ko) * 2011-01-14 2011-06-29 주식회사 아이. 피. 에스시스템 반도체 칩 본딩장치

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI697088B (zh) * 2019-05-03 2020-06-21 南韓商普羅科技有限公司 用於覆晶雷射接合之系統
CN112349630A (zh) * 2020-11-03 2021-02-09 武汉智汇芯科技有限公司 一种用于激光二极管芯片高重复性位置识别的方法及装置
CN112349630B (zh) * 2020-11-03 2024-04-16 武汉智汇芯科技有限公司 一种用于激光二极管芯片高重复性位置识别的方法及装置

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