WO2023158108A1 - Appareil et procédé d'inspection électrique de cartes de circuits imprimés - Google Patents

Appareil et procédé d'inspection électrique de cartes de circuits imprimés Download PDF

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Publication number
WO2023158108A1
WO2023158108A1 PCT/KR2023/000619 KR2023000619W WO2023158108A1 WO 2023158108 A1 WO2023158108 A1 WO 2023158108A1 KR 2023000619 W KR2023000619 W KR 2023000619W WO 2023158108 A1 WO2023158108 A1 WO 2023158108A1
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WO
WIPO (PCT)
Prior art keywords
clamp
printed circuit
circuit board
module
unit
Prior art date
Application number
PCT/KR2023/000619
Other languages
English (en)
Korean (ko)
Inventor
황선오
이장노
장정표
윤종대
Original Assignee
주식회사 코엠에스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 코엠에스 filed Critical 주식회사 코엠에스
Publication of WO2023158108A1 publication Critical patent/WO2023158108A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers

Definitions

  • the present invention relates to an electrical inspection device and method for electrical inspection of a printed circuit board, and more specifically, to an electrical inspection device and method capable of quickly and accurately performing an electrical inspection of a printed circuit board using one shuttle. will be.
  • a printed circuit board is configured to attach various semiconductors and passive elements, and is configured to connect each part to each other.
  • PCB printed circuit board
  • a plurality of pads for mounting electronic components are formed on the printed circuit board, and an electrical test is performed to check electrical connections between the respective pads before shipment of the printed circuit board.
  • the purpose of the printed circuit board electrical inspection apparatus and electrical inspection method according to an embodiment of the present invention is to solve the problems described above.
  • a printed circuit board electrical inspection apparatus includes a stacker module loaded with a printed circuit board; a first pickup module that picks up the printed circuit board loaded on the stacker module; a shuttle module configured to receive the printed circuit board from the first pick-up module and to be movable in a state in which the printed circuit board is fixedly seated; an inspection module performing an electrical inspection of the printed circuit board seated on the shuttle module; and a second pick-up module that picks up the printed circuit board on which the electrical test is completed by the test module and transfers it to the stacker module.
  • the stacker module includes a load stacker loaded with a printed circuit board before electrical inspection; A pass stacker for loading printed circuit boards that have been judged to be good products from the inspection module after electrical inspection; A re-inspection stacker for loading the printed circuit board determined to require re-inspection from the inspection module after the electrical inspection; and a pail stacker for stacking printed circuit boards that have been judged to be defective by the inspection module after the electrical inspection.
  • the first pickup module transfers the printed circuit board loaded on the load stacker to the shuttle module, and the second pickup module transfers the inspected printed circuit board to at least one of the pass stacker, the review stacker, and the pail stacker. It is desirable to do
  • the laser marking module further includes a laser marking module that performs laser marking before transferring the printed circuit board that has been determined to be defective received from the second pick-up module to the pail stacker, wherein the laser marking module includes the printed circuit board that has been determined to be defective.
  • the shuttle module may include a seating unit for seating the printed circuit board; a clamp unit for fixing the printed circuit board seated on the seating unit; and a transfer rail for guiding movement of the clamp unit to the inspection module.
  • the shuttle module further includes a surface plate disposed under the transfer rail to support the transfer rail.
  • the clamp unit may include a first clamp unit clamping one side of the printed circuit board; and a second clamp part disposed to face the first clamp part and clamping the other side of the printed circuit board, wherein at least one of the first clamp part and the second clamp part is formed to be movable in the X-axis direction. It is desirable to be
  • the first clamp unit includes a first clamp, a second clamp, and a third clamp sequentially spaced apart from each other at predetermined intervals, and the second clamp unit corresponds to the first clamp, the second clamp, and the third clamp, respectively.
  • a fourth clamp, a fifth clamp, and a sixth clamp are included, and the first to sixth clamps are preferably driven independently of each other.
  • the second clamp and the fifth clamp are fixedly installed in the first clamp part and the second clamp part, respectively, and the first clamp and the third clamp are configured to be movable by a preset distance within the first clamp part, ,
  • the fourth clamp and the sixth clamp are preferably configured to be movable by a predetermined distance within the second clamp unit.
  • the second clamp and the fifth clamp are fixedly installed in the first clamp part and the second clamp part, respectively, and the first clamp and the third clamp are configured to be rotatable by a preset angle within the first clamp part, , It is preferable that the fourth clamp and the sixth clamp are configured to be rotatable by a preset distance within the second clamp unit.
  • a first camera that checks a fiducial mark of the printed circuit board and detects a position of a pad in the printed circuit board; and a second camera for checking whether the position of the pad identified by the first camera and the position of the jig press of the inspection module match.
  • a printed circuit board electrical inspection method includes the steps of a first pick-up module picking up a printed circuit board loaded on a load stacker and transferring it to a shuttle module; fixing and flattening the printed circuit board by the shuttle module; Conducting, by an inspection module, an electrical inspection of the printed circuit board received from the shuttle module; and transferring, by a second pick-up module, the printed circuit board on which the electric test is completed to at least one of a pass stacker, a retest stacker, and a fail stacker based on the test result of the test module.
  • the shuttle module includes a seating unit for seating the printed circuit board; a clamp unit for fixing the printed circuit board seated on the seating unit; and a transfer rail for guiding movement of the seating unit to the inspection module.
  • the step of fixing and flattening the printed circuit board may include: seating the printed circuit board delivered by the first pick-up module to the seating unit; moving the printed circuit board upward by the seating unit so that the horizontal position of the printed circuit board corresponds to the clamp unit; clamping and flattening the printed circuit board by the clamp unit; identifying a position of a pad in the printed circuit board by checking a fiducial mark of the printed circuit board by a first camera; and moving the clamp unit to the inspection module through the transfer rail.
  • the clamp unit includes a first clamp part clamping one side of the printed circuit board; and a second clamp part disposed to face the first clamp part and clamping the other side of the printed circuit board.
  • the first clamp unit includes a first clamp, a second clamp, and a third clamp disposed sequentially spaced apart at predetermined intervals, and the second clamp unit corresponds to the first clamp, the second clamp, and the third clamp, respectively.
  • a fourth clamp, a fifth clamp, and a sixth clamp are included, and the first to sixth clamps preferably operate independently of each other.
  • At least one of the first clamp part and the second clamp part moves in the X-axis direction and contacts one side and the other side of the printed circuit board, respectively. ; clamping one side and the other side of the printed circuit board by the second clamp and the fifth clamp; clamping one side of the printed circuit board with the first clamp and the third clamp, and clamping the other side of the printed circuit board with the fourth clamp and the sixth clamp; It is preferable to include; moving at least one of the first clamp part and the second clamp part to move away from each other along the X-axis direction to apply tension in the X-axis direction of the printed circuit board.
  • the second clamp and the fifth clamp are fixedly installed in the first clamp part and the second clamp part, respectively, and the first clamp and the third clamp move within the first clamp part by a preset distance or set in advance. It is configured to be rotatable by an angle, and the fourth clamp and the sixth clamp are preferably configured to be movable by a preset distance or rotatable by a preset angle within the second clamp unit.
  • the second pick-up module transfers the printed circuit board on which the electrical inspection is completed to at least one of a pass stacker, a recheck stacker, and a pail stacker; picking up, by the second pickup module, the printed circuit board on which the electrical test is completed; seating the printed circuit board on a laser marking table by the second pickup module; Marking a defective mark on the printed circuit board by a laser marking unit; Preferably, the second pick-up module picks up the printed circuit board marked with the defect mark and transfers it to the pail stacker.
  • the two shuttles when installing the inspection jig, the two shuttles must be set in the same alignment, which requires a long-term setting by a skilled technician.
  • the printed circuit according to an embodiment of the present invention Since the board electrical inspection device and electrical inspection method operate only one shuttle, even if you are not a highly skilled technician, you can easily set the inspection jig, so the effect of solving the problems of the above-described two-shuttle method can be expected.
  • FIG. 1 is a conceptual diagram briefly illustrating a printed circuit board electrical inspection apparatus according to an embodiment of the present invention.
  • Figure 2 is a perspective view of the shuttle module of the configuration of the printed circuit board electrical inspection device according to an embodiment of the present invention.
  • FIG. 3 is a plan view of the clamp unit in FIG. 2;
  • 4 to 7 are plan views for explaining the planarization process of the printed circuit board performed by the clamp unit.
  • FIG. 8 is a flowchart illustrating a printed circuit board electrical inspection method in time series according to an embodiment of the present invention.
  • FIG. 9 is a flowchart illustrating steps of fixing and flattening the printed circuit board in FIG. 8 in a time-sequential manner.
  • FIG. 10 is a flowchart illustrating steps of clamping and flattening the printed circuit board in FIG. 9 chronologically.
  • FIG. 11 time-sequentially illustrates steps in which the second pick-up module transfers the printed circuit board for which electrical inspection has been completed to at least one of the pail stackers when it is determined that the printed circuit board is defective as a result of inspection by the inspection module in FIG. 10; It is a flowchart.
  • a printed circuit board electrical inspection apparatus is for inspecting the connection state between pads formed on a printed circuit board, and as shown in FIG. 1, the stacker module 100, the first pickup module ( 210), the shuttle module 300, the inspection module 400, the second pickup module 220 and the laser marking module 500.
  • the stacker module 100 has a configuration for loading the printed circuit board 10 before electrical inspection and the printed circuit board 10 after electrical inspection, and can be divided into a plurality of stacker units as shown in FIG. 1, Specifically, the stacker module 100 may be divided into a load stacker 110, a pass stacker 120, a review stacker 130, and a fail stacker 140 and the like.
  • the load stacker 110 is configured to load the printed circuit board 10 before the electrical inspection
  • the pass stacker 120 is configured to load the printed circuit board 10 that has received a good quality judgment from the inspection module 400 after the electrical inspection.
  • the re-inspection stacker 130 is configured to load the printed circuit board 10 determined to require re-inspection from the inspection module 400 after the electrical inspection, and the fail stacker 140 is configured to load the printed circuit board 10 determined to be defective from the inspection module 400. It is a configuration for loading the printed circuit board (10).
  • the first pickup module 210 is a component that performs a function of picking up the printed circuit board 10 loaded on the load stacker 110 among the stacker modules 100 and delivering it to the shuttle module 300 .
  • the first pickup module 210 can pick up the printed circuit board 10 by vacuum adsorbing the upper surface of the printed circuit board 10 and transfer the picked up printed circuit board 10 to the shuttle module 300. It is preferably configured to be movable in three directions of the X-axis, Y-axis, and Z-axis so as to be.
  • the shuttle module 300 receives the printed circuit board 10 from the first pickup module 210 and is formed to be movable in a state in which the printed circuit board 10 is fixedly seated, as shown in FIG. Likewise, it is configured to include a seating unit 310, a clamp unit 320, a transfer rail 330, and a surface plate 340.
  • the seating unit 310 is a configuration in which the printed circuit board 10 delivered by the first pickup module 210 is seated, and is configured to be movable in the Z-axis direction, that is, up and down, and the clamp unit 320 is a seating unit It performs a function of fixing the printed circuit board 10 seated on the 310, and is composed of a pair of clamp parts 350 and 360 to clamp one side and the other side of the printed circuit board 10. .
  • the printed circuit board 10 seated on the seating unit 310 moves upward until it reaches the same height as the pair of clamp parts 350 and 360 by the lifting of the seating unit 310 .
  • the shuttle module 300 may include a sensor capable of detecting the printed circuit board 10 in order to limit the movement of the printed circuit board 10 in the upper direction, and as an example shown in FIG. 2, a pair
  • the laser sensor may be installed at a position corresponding to a height at which the clamp portions 350 and 360 of the printed circuit board 10 can be easily clamped.
  • clamp unit 320 is configured to include a pair of clamp parts 350 and 360 as described above, specifically, as shown in FIG. 3, the first clamp part 350 and the second clamp part 360 ) is configured to include.
  • the first clamp unit 350 is configured to clamp one side of the printed circuit board 10, and the second clamp unit 360 is arranged to face the first clamp unit 350 to clamp the other side of the printed circuit board. At least one of the first clamp unit 350 and the second clamp unit 360 is formed to be movable along the X-axis direction, that is, in the width direction of the printed circuit board 10 .
  • each of the first clamp unit 350 and the second clamp unit 360 includes three clamps.
  • the first clamp unit 350 includes first clamps 351 sequentially spaced apart at preset intervals, It includes a second clamp 352 and a third clamp 353, and the second clamp part 360 corresponds to the first clamp 351, the second clamp 352, and the third clamp 353, respectively.
  • Four clamps 361, a fifth clamp 362 and a sixth clamp 363 are provided.
  • the second clamp 352 corresponds to the center clamp of the first clamp part 350
  • the fifth clamp 362 corresponds to the center clamp of the second clamp part 360 and is the center clamp of the second clamp. 352 and the fifth clamp 362 are fixedly installed to the first clamp part 350 and the second clamp part 360, respectively.
  • first clamp 351 and the third clamp 353 correspond to the side clamps of the first clamp part 350, and move within the first clamp part 350 by a preset distance or rotate by a preset angle. configured to be able to
  • the fourth clamp 361 and the sixth clamp 363 correspond to the side clamps of the second clamp part 360, and move within the second clamp part 360 by a preset distance or rotate by a preset angle. configured to be able to
  • the transfer rail 330 performs a function of guiding the movement of the clamp unit 320 to the inspection module 400, and a driving motor that generates power for the clamp unit 320 to move along the transfer rail 330.
  • the clamp unit 320 can move in a straight line along the transfer rail 330, and it is preferable to apply a high-power motor for fast electrical inspection.
  • the shuttle module 300 may be configured to support the transfer rail 330 by disposing a heavy surface plate 340 under the transfer rail 330 .
  • the inspection module 400 is a component that performs an electrical inspection of the printed circuit board 10 seated on the shuttle module 300, and a probe unit in which a plurality of probes are arranged and an inspection jig corresponding to the inserted printed circuit board 10. It is made of, and the electrical connection of the pattern formed inside the printed circuit board 10 is inspected.
  • the printed circuit board electrical inspection device may further include a first camera and a second camera so that the probe or inspection jig can be accurately aligned at a position corresponding to the pad of the printed circuit board 10 .
  • the first camera checks the fiducial mark of the printed circuit board 10 before inspecting the printed circuit board 10 and locates the pad formed in the printed circuit board 10 based on the fiducial mark. perform the function of
  • the second camera performs a function of checking whether the position of the pad confirmed by the first camera and the position of the inspection jig of the inspection module 400 match.
  • the second pickup module 220 picks up the printed circuit board 10 that has been inspected by the inspection module 400 and transfers it to the stacker module 100 .
  • the second pick-up module 220 transfers the printed circuit board 10 judged to be a good product in the inspection module 400 to the pass stacker 120, and re-inspects the printed circuit board 10 determined to require re-inspection. It is delivered to the dragon stacker 130.
  • the second pickup module 220 directly transfers the printed circuit board 10 to the stacker module 100, that is, the pail stacker 140. It is not transmitted, but first transmitted to the laser marking module 500.
  • the laser marking module 500 is a component that performs laser marking before transferring the printed circuit board 10 that has been determined to be defective received from the second pick-up module 220 to the pail stacker 120 .
  • This laser marking module 500 is specifically a laser marking table 510 for seating the printed circuit board 10 that has been judged to be defective, a laser marking unit for marking defective marks on the printed circuit board 10 using a laser, and It is configured to include a dust absorption unit 520 that removes dust generated during the marking process of the laser marking unit.
  • the printed circuit board 10 marked with the defective mark by the laser marking module 500 is transferred to the pail stacker 140 by the second pick-up unit 220 .
  • the first pickup module 210 picks up the printed circuit board 10 loaded on the load stacker (!10) Transferring to the shuttle module 300 (S100), the shuttle module 300 fixing and flattening the printed circuit board 10 (S200), printing the inspection module 400 received from the shuttle module 300 Conducting an electrical test of the circuit board 10 (S300), based on the test result of the test module 400, the second pickup module 220 transfers the electrically tested printed circuit board 10 to the pass stacker 120. ), the step of delivering to at least one of the recheck stacker 130 and the fail stacker 140 (S400) is sequentially performed.
  • the step of fixing and flattening the printed circuit board 10 by the shuttle module 300 (S200) can be subdivided into five steps as shown in FIG.
  • the step of seating the printed circuit board delivered by the first pick-up module 210 on the seating unit 310 of the shuttle module 300 (S210) and the horizontal position of the printed circuit board 10 is the shuttle module 300
  • the step (S220) of moving the printed circuit board 10 in an upward direction by the seating unit 310 so as to correspond to the clamp unit 320 of the is sequentially performed.
  • the clamp unit 320 clamps and flattens the printed circuit board 10 (S230), and the first camera checks the fiducial mark of the printed circuit board 10 to determine the printed circuit board 10.
  • the step of determining the position of the pad inside (S240) proceeds sequentially, and finally, the step of moving the clamp unit 320 to the inspection module 400 through the transfer rail 330 (S250) is performed.
  • the step (S230) of clamping and flattening the printed circuit board 10 by the clamp unit 320 may be subdivided into a plurality of steps as shown in FIG. 10 .
  • At least one of the first clamp unit 350 and the second clamp unit 360 formed to face each other in the clamp unit 320 moves along the X-axis direction, that is, in the width direction of the printed circuit board 10, so as to move the printed circuit board.
  • a step (S231) of contacting one side and the other side of the substrate 10 is performed.
  • the second clamp 352, which is the center clamp of the first clamp unit 350, and the fifth clamp 362, which is the center clamp of the second clamp unit 360 clamp one side and the other side of the printed circuit board 10.
  • the first clamp 351 and the third clamp 353, which are side clamps of the first clamp unit 350, clamp one side of the printed circuit board 10, and the second clamp unit 360 The step (S233) of clamping the other side of the printed circuit board 10 by the fourth clamp 361 and the sixth clamp 363, which are side clamps, is sequentially performed.
  • a step (S234) of applying tension in the X-axis direction to the printed circuit board 10 is performed. Specifically, as shown in FIG. 4, in a state in which all clamps are clamping the printed circuit board 10 At least one of the first clamp unit 350 and the second clamp unit 360 moves away from each other along the X-axis direction, that is, along the width direction of the printed circuit board 10, thereby moving in the X-axis direction of the printed circuit board 10. will apply tension to
  • a step of applying tension in the X-axis direction to the edge region of the printed circuit board 10 is performed. Specifically, as shown in FIG. 5, the side of the first clamp unit 350 The first clamp 351 and the third clamp 353, which are clamps, and the fourth clamp 361 and the sixth clamp 363, which are side clamps of the second clamp unit 360, are moved in opposite directions along the X axis. By moving, tension in the X-axis direction is applied to the edge area of the printed circuit board.
  • the printed circuit board is moved by moving the first clamp 351 and the fourth clamp 361 and the third clamp 353 and the sixth clamp 363 in opposite directions. Tension in the Y-axis direction is applied to the edge region of (10).
  • the side clamp is set in the X-axis direction or the Y-axis within the first clamp unit 350 or the second clamp unit 360 by a preset distance.
  • the edge of the printed circuit board 10 is formed so that the side clamp is rotatable at a preset angle within the first clamp part 350 or the second clamp part 360. It is also possible to apply tension to the region.
  • the first clamp 351 and the sixth clamp 363 are rotated in one direction at a preset angle, while the third clamp 353 and the fourth clamp 361 are rotated in advance.
  • the other direction at a set angle it is possible to simultaneously apply tension to the edge region of the printed circuit board 10 in the X-axis direction and the Y-axis direction (theta tension).
  • the step of transferring the electrically inspected printed circuit board to the stacker module 100 is shown in FIG. 11 in detail. As shown, it can be subdivided into four detailed steps.
  • the second pick-up module 220 picks up the printed circuit board 10 for which the electrical test has been completed (S410), and the second pick-up module 220 places the printed circuit board 10 on the laser marking table 510.
  • the step of doing (S420) is performed sequentially.
  • the laser marking unit marks the defective mark on the printed circuit board 10 (S430), and the second pickup module 220 picks up the printed circuit board 10 marked with the defective mark to the pail stacker 140.
  • the delivery step (S440) is performed.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Environmental & Geological Engineering (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)

Abstract

Un appareil d'inspection électrique de cartes de circuits imprimés selon un mode de réalisation de la présente invention comprend : un module d'empilement sur lequel une carte de circuit imprimé est chargée ; un premier module de ramassage qui prend la carte de circuit imprimé chargée sur le module d'empilage ; un module de navette qui reçoit la carte de circuit imprimé du premier module de ramassage et qui est formé de manière à être mobile dans un état où la carte de circuit imprimé repose en toute sécurité ; un module d'inspection qui effectue une inspection électrique de la carte de circuit imprimé reposant sur le module de navette ; et un second module de ramassage qui prend la carte de circuit imprimé pour laquelle l'inspection électrique a été achevée par le module d'inspection, et qui la transfère au module d'empilage.
PCT/KR2023/000619 2022-02-21 2023-01-13 Appareil et procédé d'inspection électrique de cartes de circuits imprimés WO2023158108A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2022-0022181 2022-02-21
KR1020220022181A KR20230125518A (ko) 2022-02-21 2022-02-21 인쇄회로기판 전기검사장치 및 전기검사방법

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WO2023158108A1 true WO2023158108A1 (fr) 2023-08-24

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PCT/KR2023/000619 WO2023158108A1 (fr) 2022-02-21 2023-01-13 Appareil et procédé d'inspection électrique de cartes de circuits imprimés

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WO (1) WO2023158108A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100533333B1 (ko) * 2001-06-21 2005-12-05 에버테크노 주식회사 인쇄회로기판의 롬라이팅 및 기능 검사 시스템
KR101399540B1 (ko) * 2012-11-28 2014-05-27 바이옵트로 주식회사 검사 장치
KR101815592B1 (ko) * 2011-06-01 2018-01-05 해성디에스 주식회사 인쇄회로기판의 검사 방법
KR101999651B1 (ko) * 2018-05-09 2019-07-15 바이옵트로 주식회사 검사 장치
KR20190129729A (ko) * 2018-05-10 2019-11-20 (주) 현대테크 인쇄회로기판 검사 장치

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4726606B2 (ja) 2005-10-26 2011-07-20 ヤマハファインテック株式会社 プリント基板の電気検査装置、検査治具および検査治具の固定確認方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100533333B1 (ko) * 2001-06-21 2005-12-05 에버테크노 주식회사 인쇄회로기판의 롬라이팅 및 기능 검사 시스템
KR101815592B1 (ko) * 2011-06-01 2018-01-05 해성디에스 주식회사 인쇄회로기판의 검사 방법
KR101399540B1 (ko) * 2012-11-28 2014-05-27 바이옵트로 주식회사 검사 장치
KR101999651B1 (ko) * 2018-05-09 2019-07-15 바이옵트로 주식회사 검사 장치
KR20190129729A (ko) * 2018-05-10 2019-11-20 (주) 현대테크 인쇄회로기판 검사 장치

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