WO2012093747A1 - Procédé et appareil d'inspection de substrats - Google Patents

Procédé et appareil d'inspection de substrats Download PDF

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Publication number
WO2012093747A1
WO2012093747A1 PCT/KR2011/000915 KR2011000915W WO2012093747A1 WO 2012093747 A1 WO2012093747 A1 WO 2012093747A1 KR 2011000915 W KR2011000915 W KR 2011000915W WO 2012093747 A1 WO2012093747 A1 WO 2012093747A1
Authority
WO
WIPO (PCT)
Prior art keywords
inspection
substrate
crack
indentation
tab
Prior art date
Application number
PCT/KR2011/000915
Other languages
English (en)
Korean (ko)
Inventor
오병준
전동철
박재성
김태영
박창건
Original Assignee
주식회사 에이앤아이
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 에이앤아이 filed Critical 주식회사 에이앤아이
Publication of WO2012093747A1 publication Critical patent/WO2012093747A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1306—Details
    • G02F1/1309—Repairing; Testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features

Definitions

  • the present invention relates to a method and apparatus for inspecting a substrate, and more particularly, to improve inspection of indentations, tab alignment, and cracks of a substrate at a time, in particular, an improved substrate inspection method for inspecting all substrates of various sizes; Relates to a device.
  • a substrate is an element of an image display device, and includes a flat panel display (FPD) including a semiconductor substrate.
  • FPD flat panel display
  • a substrate is largely manufactured through a TFT process, a cell process, and a module process.
  • the anisotropic conductive film has a structure such as double-sided tape in which an adhesive cured by heat and fine conductive balls are mixed therein, and is a representative material used for mounting.
  • conductive balls are intended for electrical conduction of circuits having finely spaced electrodes. It is a kind of connector that connects using heat and pressure.
  • the conductive ball in the anisotropic conductive film of the abutting portion is broken, and the electricity is passed between the two pads, and the remaining adhesive is filled and cured on the uneven surface other than the two pad portions to complete the tab attaching process.
  • the LCD substrate has a crimping tab, including a denting test for inspecting whether the electrode pattern of the tab and the electrode pattern of the LCD substrate are correctly attached and the shape and location of the conductive balls. Crack inspection is performed to check whether cracks have occurred in the LCD substrate.
  • the indentation test and the crack test are carried out through an indentation tester and a crack tester which respectively perform the corresponding test.
  • the driving unit allows the indentation inspection on the tab to be performed by the fixed area camera while moving the stage by the tab spacing of the LCD substrate.
  • the disclosed technology discloses only one configuration for inspecting indentations and cracks in one device, but a description of a device configuration and a method for inspecting tab alignment at a time is not disclosed. It was.
  • the substrate to be sampled and inspected is also set to one sheet per sheet from the top layer in the stacking order.
  • the present invention provides an indentation crack inspection table provided for simultaneously sampling inspection of the indentation inspection for inspecting the state of the conductive ball attached to the substrate and the crack inspection for inspecting the crack of the substrate portion to which the tab is attached;
  • a substrate inspection apparatus comprising a tab alignment inspection table for inspecting the tab alignment in one housing, wherein the indentation inspection and the crack inspection are sampled and inspected by the substrate, and the tab alignment inspection is performed by the whole inspection;
  • the indentation crack test stand has a substrate holder that is rotated by a drive source to rotate the loaded substrate;
  • the indentation inspection camera and the crack inspection camera installed on the indentation crack inspection table are installed in an inline form to inspect one side of the substrate, and the crack inspection camera is installed in advance along the inspection direction;
  • the tab alignment inspection table includes a tab alignment inspection camera, in which two tab alignment inspection cameras are formed in a pair so that the substrate holder for fixing the loaded substrate and three sides of the substrate can be simultaneously examined.
  • the inspection camera also provides a substrate
  • the present invention provides an indentation crack inspection table provided for simultaneously sampling inspection of the indentation inspection for inspecting the state of the conductive ball attached to the substrate and the crack inspection for inspecting the crack of the substrate portion to which the tab is attached;
  • a substrate inspection apparatus comprising a tab alignment inspection table for inspecting the tab alignment in one housing, wherein the indentation inspection and the crack inspection are sampled and inspected by the substrate, and the tab alignment inspection is performed by the whole inspection;
  • the indentation crack test stand has a substrate holder that is rotated by a drive source to rotate the loaded substrate;
  • the indentation inspection camera and the crack inspection camera installed on the indentation crack inspection table are installed in an inline form to inspect one side of the substrate, and the crack inspection camera is installed in advance along the inspection direction;
  • the tab alignment inspection table includes a substrate holder and a tab alignment inspection camera which are rotated by a driving source so as to rotate the loaded substrate, and the tab alignment inspection camera has two sets to inspect one side of the substrate. It also provides a substrate
  • the present invention it is possible to perform all the indentation inspection, crack inspection, tab alignment inspection of the substrate with one equipment, and to inspect the substrate of various sizes, thereby increasing the inspection efficiency and reducing the inspection time.
  • the effect of improving productivity can be obtained.
  • FIG. 6 is an explanatory view showing a substrate inspection method according to the present invention.
  • the indentation inspection is to take a photograph of the substrate 400 using the differential interference microscope optical system shown in Figure 3, expressing the protruding portion and the entering portion of the conductive ball in a specific pattern of contrast, indentation inspection of the expressed image
  • the digital image is transmitted through a frame grabber, such as a PC, and the transmitted image is transferred to a specific pattern of conductive ball, that is, an ACF tape through a machine vision algorithm.
  • a frame grabber such as a PC
  • the transmitted image is transferred to a specific pattern of conductive ball, that is, an ACF tape through a machine vision algorithm.
  • This is a test that detects the quality of the conductive ball by detecting the thermocompression state of the conductive ball (Tab Out Lead, IC ball bump conductive ball indentation, strength, distribution, etc.).
  • the substrate is conveyed to the indentation crack test stand 200 and loaded on the indentation crack test stand 200, and the subordinated board of the second step is performed. It is conveyed to the tab alignment inspection table 300 so as to carry out the process and loaded on the tab alignment inspection table 300.
  • the substrate on which the fourth step is performed is unloaded, waiting or returned for processing the subsequent process.
  • the sampling loss and the total inspection are effectively paralleled and efficiently controlled, thereby reducing the process loss and increasing the productivity.

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Nonlinear Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

La présente invention concerne un procédé et un appareil d'inspection de substrats. L'appareil d'inspection de substrats comprend : une station d'inspection des indentations et fissures qui est configurée pour effectuer simultanément une inspection par échantillonnage, pour une inspection des indentations, consistant à inspecter l'état d'une bille conductrice fixée sur un substrat, et pour une inspection des fissures, consistant à inspecter des fissures dans une partie du substrat à laquelle a été fixée une prise ; une station d'inspection de l'alignement des prises, afin d'effectuer une inspection intégrale de l'alignement des prises. La station d'inspection des indentations et des fissures et la station d'inspection de l'alignement des prises sont logées dans un seul boîtier. Le procédé d'inspection de substrats, qui exécute l'inspection par échantillonnage et l'inspection intégrale en utilisant l'appareil d'inspection de substrats, comprend les étapes suivantes : l'établissement d'un ordre d'objets devant être inspectés dans l'inspection par échantillonnage, parmi des substrats en attente qui sont empilés séquentiellement et qui sont des objets à inspecter ; le transfert des substrats devant être inspectés intégralement dans la première étape vers la station d'inspection de l'alignement des prises pour charger les substrats, effectuant ainsi l'inspection intégrale sur trois côtés du substrat en même temps ; le transfert d'un substrat devant être inspecté par échantillonnage vers la station d'inspection des indentations et des fissures pour charger le substrat devant être inspecté par échantillonnage lorsque le substrat est sélectionné, en fonction de l'ordre établi pendant la deuxième étape, et l'exécution de l'inspection par échantillonnage pour les inspections des indentations et des fissures, sous la forme d'un procédé dans lequel un côté du substrat est inspecté en ligne, puis est pivoté pour inspecter en ligne l'autre côté du substrat ; le transfert du substrat devant être inspecté par échantillonnage, pour lequel les inspections des indentations et des fissures sont achevées, vers la station d'inspection de l'alignement des prises, afin de charger le substrat et d'effectuer l'inspection intégrale de la même manière que dans la deuxième étape ; le déchargement du substrat pour lequel la deuxième étape et la quatrième étape sont complètement achevées.
PCT/KR2011/000915 2011-01-06 2011-02-11 Procédé et appareil d'inspection de substrats WO2012093747A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020110001235A KR101219285B1 (ko) 2011-01-06 2011-01-06 기판 검사방법 및 장치
KR10-2011-0001235 2011-01-06

Publications (1)

Publication Number Publication Date
WO2012093747A1 true WO2012093747A1 (fr) 2012-07-12

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PCT/KR2011/000915 WO2012093747A1 (fr) 2011-01-06 2011-02-11 Procédé et appareil d'inspection de substrats

Country Status (2)

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KR (1) KR101219285B1 (fr)
WO (1) WO2012093747A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105842253A (zh) * 2016-03-18 2016-08-10 奥士康科技股份有限公司 一种自动化pcb板光学检测方法
CN114245709A (zh) * 2021-12-28 2022-03-25 湖北金禄科技有限公司 密集线路网通板曝光显影段前抽检板防漏供给方法及装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000064315A (ko) * 1996-09-02 2000-11-06 야스카와 히데아키 액정표시패널의 검사장치, 액정표시패널의 검사방법 및 액정패널의 제조방법
KR20050082308A (ko) * 2004-02-18 2005-08-23 한동희 평판표시소자용 후처리 시스템
KR100797571B1 (ko) * 2006-06-13 2008-01-24 주식회사 에스에프에이 복합 검사기
KR20080019896A (ko) * 2006-08-29 2008-03-05 주식회사 에스에프에이 평판 표시장치의 패널 검사장치 및 그 방법, 그리고 평판표시장치의 회로기판 본딩 시스템 및 그 방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000064315A (ko) * 1996-09-02 2000-11-06 야스카와 히데아키 액정표시패널의 검사장치, 액정표시패널의 검사방법 및 액정패널의 제조방법
KR20050082308A (ko) * 2004-02-18 2005-08-23 한동희 평판표시소자용 후처리 시스템
KR100797571B1 (ko) * 2006-06-13 2008-01-24 주식회사 에스에프에이 복합 검사기
KR20080019896A (ko) * 2006-08-29 2008-03-05 주식회사 에스에프에이 평판 표시장치의 패널 검사장치 및 그 방법, 그리고 평판표시장치의 회로기판 본딩 시스템 및 그 방법

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105842253A (zh) * 2016-03-18 2016-08-10 奥士康科技股份有限公司 一种自动化pcb板光学检测方法
CN105842253B (zh) * 2016-03-18 2019-07-23 奥士康科技股份有限公司 一种自动化pcb板光学检测方法
CN114245709A (zh) * 2021-12-28 2022-03-25 湖北金禄科技有限公司 密集线路网通板曝光显影段前抽检板防漏供给方法及装置
CN114245709B (zh) * 2021-12-28 2023-10-20 湖北金禄科技有限公司 密集线路网通板曝光显影段前抽检板防漏供给方法及装置

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Publication number Publication date
KR20120079900A (ko) 2012-07-16
KR101219285B1 (ko) 2013-01-11

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