WO2015071929A1 - 部品撮像装置及びこれを用いた表面実装機 - Google Patents

部品撮像装置及びこれを用いた表面実装機 Download PDF

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Publication number
WO2015071929A1
WO2015071929A1 PCT/JP2013/006676 JP2013006676W WO2015071929A1 WO 2015071929 A1 WO2015071929 A1 WO 2015071929A1 JP 2013006676 W JP2013006676 W JP 2013006676W WO 2015071929 A1 WO2015071929 A1 WO 2015071929A1
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WIPO (PCT)
Prior art keywords
component
illumination
lead
unit
imaging
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Application number
PCT/JP2013/006676
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English (en)
French (fr)
Japanese (ja)
Inventor
大西　正志
Original Assignee
ヤマハ発動機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by ヤマハ発動機株式会社 filed Critical ヤマハ発動機株式会社
Priority to CN201380080372.3A priority Critical patent/CN105684568B/zh
Priority to JP2015547283A priority patent/JP6224727B2/ja
Priority to PCT/JP2013/006676 priority patent/WO2015071929A1/ja
Publication of WO2015071929A1 publication Critical patent/WO2015071929A1/ja

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement

Definitions

  • the present invention relates to a component imaging apparatus for imaging an electronic component provided with an extension terminal such as a lead or a hemispherical or spherical ball terminal, and a surface mounter of the electronic component using the component imaging apparatus.
  • the component imaging apparatus of this type includes an illumination unit and an imaging unit disposed below the movement path of the electronic component.
  • the illumination unit illuminates the bottom surface of the electronic component body and a lead or a hemispherical or spherical ball terminal extending in a direction perpendicular to the bottom surface.
  • the imaging unit receives reflected light from the illuminated electronic component.
  • An image obtained by the light reception is a recognition image of the electronic component, and is an object of the image processing.
  • an illumination unit that emits nondirectional illumination light is generally used so that no shadow occurs in the electronic component to be imaged.
  • a recognition image in which the electronic component is entirely illuminated may be obtained, which may make it difficult to recognize the component based on the image processing.
  • the recognition image of the lead tip of the leaded electronic component or the ball terminal tip of the electronic component with ball terminal the light image of the bottom of the component body or the root portion of the lead in the case of the leaded electronic component The reflection may make it difficult to recognize the position of the lead end or the ball terminal end.
  • Patent Document 1 discloses a component mounting apparatus having a function of irradiating scanning light to a leaded electronic component using a polygon mirror and performing three-dimensional measurement of the electronic component by a light cutting method. According to this apparatus, since the three-dimensional shape of the electronic component is grasped, measurement of the lead end position is also possible, but a dedicated member for three-dimensional measurement is required, and the cost of the apparatus is increased at a large scale.
  • Patent Document 2 discloses a component mounting apparatus including a second illumination unit that illuminates a lead of an electronic component at an irradiation angle close to horizontal, in addition to a first illumination unit that illuminates the bottom surface of the electronic component. According to this device, if only the second illumination unit is turned on to perform imaging, it is possible to acquire a recognition image of the leading end of the lead without reflection of the bottom surface of the electronic component. However, it is necessary to arrange the second illumination unit so that the illumination light is irradiated only to the lead, and there is a problem that the degree of freedom of the arrangement of the illumination fixture is extremely limited.
  • the present invention has an object to provide a component imaging apparatus capable of acquiring a recognition image capable of easily performing measurement of a lead tip position and a ball terminal tip position, and a surface mounter of an electronic component using the component imaging apparatus. I assume.
  • a component imaging device includes a component body and an extension terminal extended from the component body, and the extension terminal extends in a direction perpendicular to the bottom surface of the component body. It is a component imaging apparatus having a function of imaging the tip of the extension terminal of an electronic component having a lead terminal tip, wherein an imaging optical axis is disposed in a first direction passing through the bottom surface of the component body, and the imaging optical axis An imaging unit having an imaging area predetermined along the direction, and an illumination optical axis inclined with respect to the imaging optical axis and intersecting the imaging optical axis, and illumination having directivity along the illumination optical axis An illumination unit that emits light, and the imaging unit and the illumination unit are controlled to form the intersection of the imaging light axis and the illumination optical axis, the detection in which the imaging area intersects the illumination light A recognition image of the tip of the extension terminal passing through the area is acquired It includes a control unit, a.
  • a surface mounter includes a component holding member for holding a component for mounting, an elevating mechanism for raising and lowering the component holding member in the vertical direction, and a moving device for moving the component holding member in the horizontal direction.
  • a mounting unit for transporting the mounting component from the component supply unit and mounting the mounting component on the substrate; and the component imaging apparatus for imaging the mounting component held by the component holding member as the electronic component;
  • a detection unit that detects the position of the tip of the extension terminal of the mounting component based on the image of the mounting component captured by the imaging unit; and the position of the tip of the extension terminal of the mounting component
  • a controller configured to adjust the horizontal mounting position on the substrate based on the detection result.
  • FIG. 1 is a plan view of a surface mounter using a component imaging device according to the present invention.
  • FIG. 2 is an overall perspective view of the component imaging apparatus.
  • FIG. 3 is a schematic view schematically showing the configuration of the component imaging apparatus.
  • FIG. 4 is a view showing an imaging condition of a lead end of an electronic component by the component imaging device according to the basic embodiment of the present invention.
  • FIG. 5 is a view showing an imaging condition of the lead end of the electronic component by the component imaging device according to the comparative example.
  • FIG. 6 (A) is a side view of an example of the leaded electronic component
  • FIG. 6 (B) is a bottom view thereof.
  • FIG. 7 (A) is a side view of an example of the leaded electronic component, FIG.
  • FIG. 7 (B) is a side view of different angles
  • FIG. 7 (C) is a bottom view thereof
  • FIG. 8A is a side view of an example of the leaded electronic component
  • FIG. 8B is a bottom view thereof
  • FIG. 9A is a side view of an example of the leaded electronic component
  • FIG. 9B is a bottom view thereof
  • FIG. 10 is a photograph of an example of a leaded electronic component.
  • FIG. 11A is a photograph of a recognition image acquired by the component imaging apparatus according to the comparative example
  • FIG. 11B is a photograph of the recognition image acquired by the component imaging apparatus according to the present invention.
  • FIG. 12 is a block diagram showing the configuration of the surface mounter.
  • FIG. 12 is a block diagram showing the configuration of the surface mounter.
  • FIG. 13 is a flowchart of the component recognition operation by the component imaging device according to the present invention.
  • FIG. 14A is a view showing an imaging situation by the component imaging device according to the first embodiment of the present invention
  • FIG. 14B is a view showing a recognition image obtained.
  • FIG. 15A is a view showing another imaging situation by the component imaging device according to the first embodiment
  • FIG. 15B is a view showing an acquired recognition image
  • FIG. 15C is a view showing a synthesis recognition image It is.
  • FIG. 16 is a flowchart of the component recognition operation by the component imaging device of the first embodiment.
  • FIG. 17A is a view showing an imaging situation by the component imaging apparatus according to the second embodiment
  • FIG. 17B is a view showing another imaging situation by the component imaging apparatus.
  • FIG. 17A is a view showing an imaging situation by the component imaging apparatus according to the second embodiment
  • FIG. 18A is a view showing an imaging situation by the component imaging apparatus according to the third embodiment
  • FIG. 18B is a view showing another imaging situation by the component imaging apparatus.
  • FIG. 19A shows an imaging condition by the component imaging apparatus according to the fourth embodiment
  • FIG. 19B shows a lead detection width thereof
  • FIG. 19C shows the component imaging apparatus
  • FIG. 19D is a diagram showing another imaging situation
  • FIG. 19D is a diagram showing its lead detection width.
  • FIG. 20A is a view showing an imaging condition by the component imaging device according to the fifth embodiment
  • FIG. 20B is a view showing another imaging condition by the component imaging device.
  • FIG. 21A is a view showing an imaging situation by the component imaging device according to the sixth embodiment
  • FIG. 21B is a view showing another imaging situation by the component imaging device.
  • 22 (A) is an explanatory view of a lead detection area
  • FIG. 22 (B) is a view showing an imaging condition by the component imaging device according to the seventh embodiment
  • FIG. 22 (C) is a diagram by the component imaging device It is a figure which shows another imaging condition.
  • FIG. 23 is a flowchart showing the operation of the part recognition calibration process.
  • FIG. 24A is a perspective view of an adjustment target for imaging optical axis
  • FIG. 24B is a view showing an imaging condition of the adjustment target
  • FIG. 24C is a view showing a recognition image thereof .
  • FIG. 25A is a view showing an imaging condition of the adjustment target for adjusting the illumination optical axis
  • FIG. 25B is a view showing a recognition image thereof.
  • FIG. 26 is a diagram showing a modification of the imaging unit.
  • the surface mounter 1 includes a base 2, a transport unit 3, a component supply unit 4, a component moving unit 5 (mounting unit), and a detection unit 10.
  • the base 2 is formed in a rectangular shape in a plan view, and supports each part of the surface mounter 1.
  • the transport unit 3 is provided to cross the top of the base 2 in the left-right direction (X direction) in FIG. 1 and transports the printed wiring board 7 (substrate).
  • the component supply unit 4 is provided at both ends of the base 2 so as to sandwich the transport unit 3 and supplies electronic components (components for mounting) to be mounted on the printed wiring board 7.
  • the component moving unit 5 is provided above the base 2 and transports the electronic component from the component supply unit 4 toward the printed wiring board 7 on the transport unit 3 and mounts the electronic component on the printed wiring board 7. .
  • the detection unit 10 picks up an electronic component by the component imaging device 11 described later, and recognizes the electronic component or detects the lead end position of the electronic component based on the recognition image obtained by the imaging.
  • the direction in which the transport unit 3 extends is indicated as the X direction
  • the horizontal direction orthogonal to the X direction is indicated as the Y direction.
  • the transport unit 3 is configured by a pair of conveyors 6 arranged at intervals in the Y direction.
  • the pair of conveyors 6 is a belt conveyor, and conveys the printed wiring board 7 in the X direction while supporting both ends of the printed wiring board 7 in the Y direction.
  • An electronic component supply device is attached to the component supply unit 4.
  • FIG. 1 shows an example in which a large number of tape feeders 12 are mounted as the electronic component supply device.
  • a component imaging device 11 is disposed between the side of the conveyor 6 and the component supply unit 4.
  • the component moving unit 5 includes the Y rail unit 13, the X rail unit 14, and the head unit 15.
  • the Y-rail units 13 are provided on both ends of the base 2 in the X direction across the transport unit 3 in a pair.
  • the X rail unit 14 is movably supported by the Y rail unit 13 in the Y direction.
  • the head unit 15 is movably supported in the X direction by the X rail unit 14.
  • the head unit 15 includes a plurality of suction heads (not shown).
  • suction heads are provided with suction nozzles 16 (component holding members; see FIG. 3) which can protrude from the lower end face thereof, and suction head driving devices 20 (see FIG. 12) described later.
  • the suction head has a function of sucking and holding the electronic component by the suction nozzle 16 and releasing the suction at a position near the upper side of the substrate 2 to mount the electronic component on the substrate 2. Further, the suction head has a function of moving the suction nozzle 16 up and down in the vertical direction by the suction head driving device 20, and a function of rotating the suction nozzle 16 around an axis in the vertical direction. Since the head unit 15 is movable in the Y direction and the X direction by the Y rail unit 13 and the X rail unit 14, the suction nozzle 16 can freely move to a desired position in the horizontal direction.
  • FIG. 2 is an overall perspective view of the component imaging device 11, and FIG. 3 is a schematic view schematically showing the configuration of the component imaging device 11.
  • the component imaging device 11 is mounted on a housing 30, a camera 31 (imaging unit) and a lens unit 33 accommodated in the housing 30, and a top plate 30T of the housing 30, and emits nondirectional illumination light.
  • An illumination unit 35 and a laser illumination unit 40 (illumination unit) attached to the upper periphery of the illumination unit 35 and emitting directional illumination light are provided.
  • the electronic component to be imaged in the component imaging device 11 is, for example, a semiconductor component such as a DIP (Dual inline Package) in which a large number of leads project downward from the package portion, or a QFP (Quad Flat Package)
  • the ball terminal is a semiconductor component projecting downward.
  • FIG. 2 and FIG. 3 the electronic component 17 provided with the component main body B which has a rectangular parallelepiped shape, and the lead
  • the lead L includes a lead end La (FIG. 4) extending downward in a direction perpendicular to the flat bottom surface Ba of the component body B.
  • CSP Chip size package
  • the electronic component 17 is moved in the X direction so as to pass above the component imaging device 11 in a state of being adsorbed by the suction nozzle 16, and the component imaging device 11 acquires an image of the electronic component 17 during the passage. .
  • a light image of the electronic component illuminated by the illumination unit 35 or the laser illumination unit 40 is incident on the camera 31.
  • the camera 31 comprises a line sensor 32, which converts the light image into an electrical signal.
  • the imaging element arrangement direction of the line sensor 32 is the Y direction.
  • the imaging optical axis A2 of the camera 31 is disposed in the Z direction (first direction), which is a direction passing through the bottom surface Ba of the component body B.
  • the imaging optical axis A2 may be arranged to be inclined with respect to the Z direction.
  • the lens unit 33 includes an imaging lens (not shown), and forms an optical image of the electronic component 17 on the light receiving surface of the line sensor 32.
  • the illumination unit 35 is an illumination device for illuminating the electronic component 17 from all directions on the lower side thereof.
  • the illumination unit 35 has an octagonal dome shape in top view, and a number of illumination LEDs are mounted on the inner wall surface thereof. Each LED is generally directed to the imaging optical axis A2.
  • the illumination unit 35 emits illumination light 35L from the entire periphery of the imaging optical axis A2 toward the imaging optical axis A2.
  • the non-directional illumination light 35 L is irradiated to the electronic component 17 passing across the imaging optical axis A2.
  • the laser illumination unit 40 has an illumination optical axis A1 that is inclined with respect to the imaging optical axis A2 and intersects the imaging optical axis A2, and illuminates the illumination light 40L having directivity along the illumination optical axis A1.
  • the laser illumination unit 40 includes a light source unit 41 including a laser element that emits laser light, and an optical system unit 42 that converts the laser light into linear parallel light and outputs it.
  • a semiconductor laser is preferably used as the laser element.
  • As the optical system unit 42 a unit including a cylindrical lens can be illustrated.
  • the illumination unit 35 that emits non-directional illumination light 35 L is exclusively used when acquiring a recognition image of a general-purpose component that does not include a lead in the component imaging device 11.
  • the laser illumination unit 40 that emits directional illumination light 40L is used when acquiring a recognition image of the electronic component 17 provided with the lead L from which the component imaging device 11 extends downward, particularly the lead end La of the lead L Be done. This is because when non-directional illumination light 35 L is used at the time of imaging the lead tip La, not only the lead tip La but also other parts are reflected in the recognition image, and the position of the lead tip La is accurate This is because recognition may not be possible.
  • this point will be described in detail.
  • FIG. 4 is a view showing an imaging condition of the lead end La of the electronic component 17 by the component imaging device 11 according to the basic embodiment of the present invention.
  • the electronic component 17 is assumed to move in the arrow A3 direction (X direction).
  • the camera 31 has a predetermined imaging area 31A in a height area in the Z direction along which the electronic component 17 is moved by movement along the imaging optical axis A2.
  • the imaging area 31A is a lens so that an optical image of the moving electronic component 17 forms an image on the imaging element of the line sensor 32 shown in FIG. 4 and an image can be obtained with a desired compactness. It is determined by the optical specification of the unit 33, the Z-direction arrangement position, and the size of the imaging device.
  • the laser illumination unit 40 illuminates the illumination light 40L made of linear parallel light along the illumination optical axis A1 obliquely crossing the imaging optical axis A2.
  • an area where the imaging area 31A, which is a partial area on the imaging optical axis A2, intersects the illumination light 40L is generated.
  • This intersection area is a detection area from which a recognition image can be acquired. In other words, only the part illuminated in this detection area and viewed from the vertically lower side is recognized by the camera 31 as an optical image.
  • the intersection (point p1) of the imaging optical axis A2 and the illumination optical axis A1 is aligned with the portion to be detected of the electronic component 17.
  • the portion to be detected is the lead end La of the lead L.
  • the horizontal plane in the moving direction A3 of the electronic component 17 including the intersection becomes a recognition surface for the electronic component 17.
  • the illumination light 40L is emitted from the obliquely lower side of the electronic component 17 toward the intersection. Therefore, the illumination light 40L illuminates the lead tip La (point p1) of the lead L present in the imaging region 31A.
  • the illumination optical axis A1 is not set at an angle close to horizontal so that only the lead L can be illuminated.
  • the illumination light 40L is at the vertical direction middle portion (point p2) of the other lead L adjacent to the lead L in the imaging region 31A, and the root portion of the other lead L adjacent to the other lead Illuminate point p3). Therefore, reflected light is generated at points p1, p2 and p3.
  • the reflected light incident on the camera 31 is only the reflected light from the point p1. That is, the illumination light 40L is light having directivity and is projected in an oblique direction, and it is possible to pass a portion (detection region) illuminated by the illumination light 40L in the imaging region 31A.
  • the camera 31 can capture an optical image of the lead end La with good contrast.
  • conveyance of the electronic component 17 in the direction of arrow A3 slightly proceeds from the state of FIG. 4, and even if the illumination portion of the point p2 enters the imaging region 31A, the reflected light is not incident on the camera 31.
  • the lead L extends vertically downward, and the camera 31 is disposed vertically below the lead L.
  • the intersection area extends horizontally in the Y direction (see FIG. 3).
  • the leads L (lead ends La) of the leads 17 on both sides of the electronic component 17 arrange the imaging elements in the Y direction with only one movement of the arrow A3 (FIG. 4) of the electronic component 17.
  • the image is captured by the line sensor 32.
  • FIG. 5 is a view showing an imaging condition of the lead end La of the electronic component 17 by the component imaging device according to the comparative example.
  • the case where imaging of lead tip La is performed using non-directional illumination light 35L which illumination unit 35 emits is illustrated.
  • the illumination light 35L evenly illuminates the lead L of the electronic component 17 and the bottom surface Ba of the component body B. Therefore, even if the imaging area of the camera 31 is limited as in FIG. 4, all reflected light present in the imaging area is incident on the camera 31.
  • the camera 31 can not capture only the light image of the lead tip La with a good contrast. Therefore, it becomes difficult to recognize the position of the lead tip La from the recognition image acquired by the imaging.
  • FIG. 6A is a side view of the electronic component 171 provided with the L-shaped lead L1
  • FIG. 6B is a bottom view thereof.
  • the lead L1 includes a root portion L11 extending horizontally from the side surface of the component main body B1, and a hanging portion L12 extending vertically downward from the protruding end of the root portion L11 to the bottom surface Ba1.
  • the illumination light 35L is irradiated to such an electronic component 171
  • not only the lead end La1 but also the root portion L11 is also lighted. Therefore, in addition to the light image of the lead tip La1, the light image of the root portion L11 is reflected in the recognition image.
  • FIG. 7 (A) is a side view of the electronic component 172 provided with the L-shaped lead L2 in which the lead width is changed
  • FIG. 7 (B) is a side view of different angles
  • FIG. It is a bottom view.
  • the lead L2 includes a root portion L21 having a wide lead width, and a protrusion L22 having a narrow lead width.
  • the root portion L21 extends horizontally from the side surface of the component main body B2 and has an L-shaped shape bent downward.
  • the protrusion L22 is continuous with the tip of the root portion L21 and extends vertically downward with respect to the bottom surface Ba2.
  • FIG. 8A is a side view of the electronic component 173 provided with the T-shaped lead L3, and FIG. 8B is a bottom view thereof.
  • the lead L3 includes a root portion L31 extending horizontally from the side surface of the component main body B3 and a hanging portion L32 extending vertically downward to the bottom surface Ba3 from an intermediate position of the root portion L31.
  • the illumination light 35L is irradiated to such an electronic component 173, not only the lead end La3 but also the root portion L31 is also lighted.
  • FIG. 9 (A) is a side view of the electronic component 174 provided with the linear lead L4, and FIG. 9 (B) is a bottom view thereof.
  • the lead L4 extends vertically downward directly from the bottom surface Ba4 of the component body B4.
  • the illumination light 35L is irradiated to such an electronic component 172, not only the lead end La4 but also the flat bottom surface Ba4 will be mirrored.
  • FIG. 10 is a photograph of an example of the electronic component 17 to be imaged.
  • the electronic component 17 is the same as the electronic component 17 illustrated in FIGS. 4 and 5.
  • the lead L extends vertically downward from the side surface of the component body B to the bottom surface Ba, and includes a root portion LB having a wide lead width and a protrusion LT having a narrow lead width.
  • the type is the same as the type shown in FIG.
  • FIG. 11A is a recognition image acquired by the configuration of the comparative example
  • FIG. 11B is a photograph of the recognition image acquired by this embodiment.
  • the recognition image of the comparative example the root portion LB and the step portion at the boundary between the root portion LB and the projection portion LT are strongly reflected and reflected, and the bottom surface Ba of the component main body B is also reflected weakly and reflected . Therefore, it is difficult to recognize the position of the lead tip La.
  • the position recognition of the lead tip La can not be performed unless image processing is performed after setting a threshold for discriminating “white” and “black” on the identification image to be unique to the electronic component.
  • the recognition image of the present embodiment only the light image of the white dot-like lead tip La is reflected in a clear contrast on the background image of the black background. Therefore, position recognition of the lead end La can be completed by simple image processing.
  • the surface mounter 1 further includes a control unit 8 (control unit) for controlling the operation of each part of the surface mounter 1, an X rail unit drive unit 18, a head unit drive unit 19 and a suction head drive unit 20. ing.
  • the X rail unit drive 18 generates a driving force for moving the X rail unit 14 (FIG. 1) in the Y direction on the Y rail unit 13.
  • the head unit driving device 19 generates a driving force for moving the head unit 15 in the X direction on the X rail unit 14.
  • the suction head driving device 20 generates driving force for moving the suction nozzle up and down in each suction head provided in the head unit 15 and rotating it about an axis in the vertical direction.
  • These driving devices 18 and 19 constitute a part of the “moving mechanism” of the present invention, and the suction head driving device 20 constitutes the “lifting mechanism” of the present invention.
  • the control device 8 functionally includes a main control unit 21, a storage unit 22, an axis control unit 23, a conveyor control unit 24, a camera control unit 25, an illumination control unit 26 and an image processing unit 27.
  • the main control unit 21 integrally performs various controls in the surface mounter 1.
  • the main control unit 21 particularly controls the axis control unit 23, the camera control unit 25, and the illumination control unit 26 so that the component moving unit 5 detects the above-described electronic component 17 (lead tip La).
  • the camera 31 and the illumination unit 35 or the laser illumination unit 40 are operated while moving so as to pass through the area, and control is performed to acquire a recognized image of the electronic component 17 or the lead tip La.
  • the storage unit 22 stores various information related to the printed wiring board 7 and the electronic component 17.
  • the information on the electronic component 17 is, for example, information such as the type of the electronic component, the number and arrangement of the leads L, and the height position of the lead tip La.
  • the axis control unit 23 controls the operation of the X rail unit 14, the head unit 15, and the suction head by controlling the X rail unit driving device 18, the head unit driving device 19, and the suction head driving device 20.
  • the conveyor control unit 24 controls the conveyance of the printed wiring board 7 by controlling the operation and the stop of the pair of conveyors 6 that constitute the conveyance unit 3.
  • the camera control unit 25 controls an imaging operation of the camera 31.
  • the camera control unit 25 controls the shutter timing of the camera 31, the shutter speed (exposure amount), and the like.
  • the illumination control unit 26 controls the light emission operation of the illumination unit 35 and the laser illumination unit 40.
  • the illumination control unit 26 acquires component information with reference to the storage unit 22 for the electronic component extracted from the tape feeder 12 and determines which of the illumination unit 35 or the laser illumination unit 40 is to be lit. Then, the illumination control unit 26 operates the selected illumination unit in a predetermined routine.
  • the image processing unit 27 applies known image processing technology to the recognized image acquired by the camera 31 (line sensor 32) to extract various inspection information from the recognized image. For example, based on the inspection information extracted by the image processing unit 27, it is possible to determine whether suction deviation of the electronic component 17 by the suction nozzle 16 or bending of the lead L is within the allowable range or floating of the lead end La. It is determined whether or not it is within the range.
  • FIG. 13 is a flowchart of the component recognition operation by the component imaging device 11 of the present embodiment.
  • the electronic component (the electronic component being conveyed by the head unit 15) for which a recognition image is to be obtained by the illumination control unit 26 is the recognition of the component itself or the lead end La of the electronic component 17 It is determined whether it is recognition (step S1).
  • the electronic components 17 having the leads L are mounted with the lead tips La of the plurality of leads inserted into the lead holes of the printed wiring board 7. It is determined by the amount of displacement of the lead, and recognition of the lead tip La is required.
  • the electronic component 17 not having the lead L is mounted in such a manner that the center of the electronic component 17 coincides with the predetermined mounting position. It becomes settled by the amount of deviation from a position, and recognition of parts itself is needed.
  • the illumination control unit 26 lights the illumination unit 35 that emits nondirectional illumination light 35L. Further, the camera control unit 25 causes the camera 31 to perform an imaging operation (step S2). Then, the image processing unit 27 analyzes the recognition image acquired by the camera 31 to obtain the suction deviation of the electronic component (step S3).
  • the illumination control unit 25 turns on the laser illumination unit 40 that emits directional illumination light 40L. Further, the camera control unit 25 causes the camera 31 to perform an imaging operation (step S4). Then, the image processing unit 27 analyzes the recognition image acquired by the camera 31 to obtain the suction deviation of the electronic component based on the position information of the lead end La (step S5).
  • FIGS. 14 to 18 various embodiments in the case of acquiring a recognized image of the electronic component 17 having the leads L having different lengths are shown in FIGS. 19 to 22.
  • the seventh embodiment shows various embodiments in the case where the detection width of the lead L is variable.
  • First Embodiment 14 (A) and 15 (A) are diagrams showing imaging conditions by the component imaging device according to the first embodiment, and FIGS. 14 (B) and 15 (B) are recognitions obtained by each imaging FIG. 15C is a view showing an image, and FIG. 15C is a view showing a composite recognition image.
  • the electronic component 175 to be imaged in the first embodiment includes a component body B5, and first and second leads L51 and L2 having different heights of projection from the bottom surface of the component body B5 downward (in FIG. 10, upward). including.
  • an example corresponding to imaging of the electronic component 175 by software using the device configuration of the basic embodiment and the control device 8 shown in FIG. 12 is shown.
  • the first lead L51 is a long lead having a relatively high position (first position) in which the protruding height of the lead end La51 in the Z direction (first direction) is relatively high.
  • the second lead L52 is a short lead in which the protrusion height of the lead tip La52 is at a relatively low position (second position).
  • first leads L51 and second leads L2 are horizontally aligned on both side surfaces of the component main body B5.
  • the main control unit 21 performs a first recognition operation for acquiring a recognition image of the lead end La51 of the first lead L51 and a second recognition operation for acquiring a recognition image of the lead end La52 of the second lead L52. And performing the recognition operation. That is, the main control unit 21 executes the recognition operation for the number of times according to the protrusion height type of the lead. In the first recognition operation, as shown in FIG.
  • a detection area (recognition surface) where the imaging area along the imaging optical axis A2 of the camera 31 and the illumination light 40L of the laser illumination unit 40 intersect is After the height of the electronic component 175 held by the suction nozzle 16 (component holding member) is adjusted by the suction head driving device 20 (lifting mechanism) so that the lead end La51 of the first lead L51 passes through, The part 175 is moved by the head unit 15. In the second recognition operation, as shown in FIG. 15A, the electronic component 175 held by the suction nozzle 16 so that the lead end La52 of the second lead L52 passes through the detection area (recognition surface). The electronic component 175 is moved by the head unit 15 after its height is adjusted by the suction head driving device 20.
  • the recognition image acquired in the first recognition operation is an image in which only the light image I-La51 of the lead end La51 of the first lead L51 is captured.
  • the broken line I-B5 indicates a portion corresponding to the outer shape of the component main body B5, but this portion is out of the recognition surface and will not be reflected in the recognition image. The same applies to the lead tip La52.
  • the recognition image acquired by the second recognition operation is an image in which only the light image I-La 52 of the lead end La 52 of the second lead L 52 is captured.
  • FIG. 16 is a flowchart of component recognition processing performed by the control device 8 in the first embodiment.
  • component information of the electronic component specifically, the component type, the number and arrangement of leads, and the protrusion height are read from the storage unit 22 (step S11).
  • the illumination control unit 26 turns on the laser illumination unit 40.
  • the axis control unit 23 controls the head unit driving device 19 so that the suction end 16 of the first lead L51 coincides with the recognition surface as shown in FIG. 14A.
  • the position in the Z direction head lowering position
  • step S13 first recognition operation
  • the recognition image acquired by this imaging operation is an image including only the light image I-La 51 of the lead end La 51 shown in FIG. 14 (B).
  • the main control unit 21 determines whether or not there is a lead tip with a different protruding height to be recognized in the electronic component 175 (step S14). In this case, since the second lead L52 remains (YES in step S14), the main control unit 21 determines to perform an imaging operation for the lead tip La 52 (step S15). Then, as shown in FIG. 15A, the axis control unit 23 sets the Z-direction position (head lowering position) of the suction nozzle 16 so that the lead end La 52 matches the recognition surface (step S12). ). Thereafter, an operation of capturing a recognition image of the lead tip La 52 is executed (step S13; second recognition operation). The recognition image acquired by this imaging operation is an image including only the light image I-La 52 of the lead end La 52 shown in FIG. 15 (B).
  • step S14 When there is no other lead tip having a different protrusion height to be recognized in the electronic component 175 (NO in step S14), subsequently, a plurality of recognized images obtained by the plurality of imaging operations in step S13 by the image processing unit 27 Image processing is performed to form one recognized image.
  • the recognition images obtained by the first and second recognition operations are combined to create a combined recognition image shown in FIG.
  • the image processing unit 27 obtains a parameter for evaluating bending, lifting, and the like of the lead, a parameter for evaluating the appropriateness of the suction state by the suction nozzle 16, and the like based on the composite recognition image.
  • the main control unit 21 determines whether the electronic component 175 can be mounted on the printed wiring board 7 based on these parameters (step S16).
  • recognition images of the lead tips La1 and La2 of the first and second leads L51 and L52 having different protrusion heights are respectively acquired and combined to form one recognition image. Be done. Therefore, even in the component imaging apparatus according to the present invention, the electronic apparatus having leads with different projecting heights limits the area for acquiring an image to the detection area where the illumination light 40L and the imaging area of the camera 31 intersect.
  • the recognition image of the lead tip La1 or La2 of the component 175 can be reliably acquired. Even when three or more types of leads with different protrusion heights are present, recognition obtained by multiple recognition operations in which the height in the Z direction of the electronic component 175 is changed for each type and the lead tip is made to coincide with the recognition surface Image processing is performed to combine the images.
  • FIG. 17A and FIG. 17B are diagrams showing imaging conditions by the component imaging device according to the second embodiment.
  • an example corresponding to imaging of the electronic component 175 provided with the first lead L51 and the second lead L2 having different protruding heights is shown by hardware.
  • an example in which one laser illumination unit 40 is disposed is shown.
  • the component imaging device according to the second embodiment includes a first laser illumination unit 401 (illumination unit at one height position) and a second laser illumination unit arranged with different height positions in the Z direction (first direction). 402 (illumination part of other height positions) is provided.
  • the first and second laser illumination units 401 and 402 have illumination optical axes that intersect at the same angle with the imaging optical axis A2, and radiate directional illumination lights 401L and 402L along the illumination optical axes. .
  • the illumination light 401L is made of the first lead L51. The light is irradiated with the lead tip La1 as a target.
  • the illumination light 402L is a second lead by aligning the height position of the lead end La2 of the second lead L52 with a horizontal recognition surface including the intersection of the imaging optical axis A2 and the illumination optical axis of the illumination light 402L.
  • the light is irradiated with the lead tip La2 of L52 as a target.
  • the control configuration of the component imaging apparatus according to the second embodiment is, for example, a configuration that applies the control device 8 shown in FIG. 12 and causes the illumination control unit 26 to control the lighting operation of the first and second laser illumination units 401 and 402. It can be done.
  • the main control unit 21 performs a first recognition operation for acquiring a recognition image of the lead end La51 of the first lead L51, and a second recognition operation for acquiring a recognition image of the lead end La52 of the second lead L52. And performing the recognition operation.
  • the illumination control unit 26 operates the first laser illumination unit 401 while stopping the second laser illumination unit 402. As a result, only the lead tip La51 is illuminated by the illumination light 401L, and a recognition image including only an optical image of the lead tip La51 is acquired in the first recognition operation.
  • the illumination control unit 26 operates the second laser illumination unit 402 while stopping the first laser illumination unit 401.
  • the illumination control unit 26 operates the second laser illumination unit 402 while stopping the first laser illumination unit 401.
  • the recognition images obtained by the first and second recognition operations are synthesized, and a synthesized recognition image similar to the image shown in FIG. 15C is created.
  • the difference in height direction between the illumination portions of the first laser illumination unit 401 and the second laser illumination unit 402 in which the illumination lights are parallel to each other one height position and another height position Imaging when the absolute value of the difference between the height position of the lead end La51 of the first lead L51 and the height position of the lead end La52 of the second lead L52 matches the absolute value of the difference between If the height position of the lead end La1 of the first lead L51 is aligned with the horizontal recognition surface including the intersection of the optical axis A2 and the illumination optical axis of the illumination light 401L, the imaging optical axis A2 and the illumination optical axis of the illumination light 402L The height position of the lead tip La2 of the second lead L52 coincides with the horizontal recognition surface including the intersection point of Therefore, it is not necessary to adjust the position of the suction nozzle 16 in the Z direction in accordance with the protrusion height of the lead tip as in the first embodiment.
  • the recognition image of the lead tip La1 and the lead tip La2 is acquired by one recognition operation of moving the electronic component 175 in the X direction by the head unit 15 while irradiating both the illumination light 401L and the illumination light 402L. .
  • FIG. 18A and FIG. 18B are diagrams showing an imaging situation by the component imaging device according to the third embodiment.
  • This third embodiment also shows an example corresponding to imaging of the electronic component 175 provided with the first lead L51 and the second lead L2 having different protruding heights by means of hardware.
  • the component imaging device of the third embodiment is the same as the first embodiment in that it is configured by one laser illumination unit 40, but differs in that the laser illumination unit 40 includes a mechanism for moving in the Z direction.
  • the component imaging apparatus moves the support member 51 supporting the laser illumination unit 40 and the support member 51 to adjust the height position of the laser illumination unit 40 in the Z direction (illumination device 52 (illumination) Part lifting mechanism).
  • the control configuration of the component imaging device according to the third embodiment can be, for example, a configuration that applies the control device 8 shown in FIG. 12 and causes the axis control unit 23 to control the operation of the lifting device 52.
  • the main control unit 21 performs a first recognition operation for acquiring a recognition image of the lead end La51 of the first lead L51, and a second recognition operation for acquiring a recognition image of the lead end La52 of the second lead L52. And performing the recognition operation.
  • the illumination light 40L is irradiated with a target of the intersection of the imaging optical axis A2 and the horizontal line which is the moving path of the lead end La51 of the first lead L51.
  • the lifting device 52 sets the position of the support member 51 in the Z direction. As a result, only the lead tip La51 is illuminated by the directional illumination light 40L, and a recognition image including only the light image of the lead tip La51 is acquired in the first recognition operation.
  • the lifting device 52 uses as a target the intersection of the imaging optical axis A2 and the horizontal line which is the moving path of the lead end La52 of the second lead L52.
  • the support member 51 is moved in the Z direction to a position where the illumination light 40L can be emitted.
  • the recognition images obtained by the first and second recognition operations are synthesized, and a synthesized recognition image similar to the image shown in FIG. 15C is created.
  • the lead detection width indicates a range set as an area for imaging the lead L in the direction from the lead end La of the normal lead L to the root. For example, if a short range in the vicinity of the lead end La is set as the lead detection width, only a slight bend or float in the lead L will cause the lead end La to deviate from the recognition surface. It gets out of the way. Therefore, the leading end La of the lead L does not appear in the recognized image, and it is determined that the electronic component 17 can not be mounted.
  • the lead detection width is set by the detection area. That is, if the point at which the illumination light 40L intersects with the imaging region 31A can be expanded in the vertical direction, the recognition surface including the intersecting point for recognition of the lead tip La is expanded in the vertical direction, and the lead detection width Can be extended.
  • the protruding height of the lead L may be different depending on the type of the electronic component 17. For example, in the case of an electronic component in which the protrusion height of the lead L is short, if the lead detection width is set wide relative to the protrusion height of the lead L, a recognition image in which the bottom surface of the component body B glows is captured There are times when Even in such a case, an imaging operation suitable for each electronic component can be performed by changing the lead detection width according to the protrusion height of the lead of the electronic component to be imaged.
  • the detection width adjustment mechanism for adjusting the lead detection width is preferably a mechanism for adjusting the illumination width of the illumination light 40L emitted by the laser illumination unit 40.
  • the illumination width By adjusting the illumination width, the width with which the illumination light 40L can be irradiated to the lead L, that is, the lead detection width can be easily adjusted.
  • the fourth embodiment shows a specific example in which the lead detection width is made variable by the adjustment mechanism of the illumination width.
  • FIGS. 19 (A) and 19 (C) are diagrams showing imaging conditions by the component imaging device according to the fourth embodiment
  • FIGS. 19 (B) and 19 (D) are the lead detection widths in respective imagings.
  • FIG. The component imaging apparatus according to the fourth embodiment includes a light source unit 41 having a laser element, and an optical system unit 42 having a cylindrical lens 42L (optical lens) for converting laser light into linear parallel light.
  • the unit 40 is included.
  • the component imaging device is provided with a lens moving mechanism consisting of a lens supporting member 53 and a lens driving device 54.
  • the lens support member 53 is a member for supporting the cylindrical lens 42L at its peripheral edge.
  • the lens drive device 54 moves the lens support member 53 so that the cylindrical lens 42L moves along the illumination light axis A1.
  • the control configuration of the component imaging device according to the fourth embodiment can be, for example, a configuration that applies the control device 8 shown in FIG. 12 and causes the axis control unit 23 to control the operation of the lens drive device 54.
  • FIG. 19A shows a state in which the cylindrical lens 42L is disposed at a predetermined default position.
  • This default position is the position where the cylindrical lens 42L is closest to the light source unit 41 on the light path. Since the laser element of the light source unit 41 emits diffused light, when the cylindrical lens 42L approaches the light source unit 41, it enters the refracting surface of the cylindrical lens 42L when the diffusion degree of the diffused light is small. Therefore, the illumination width of the illumination light 40L, that is, the width of the output light beam in the cross-sectional direction having the refracting surface of the cylindrical lens 42L becomes small.
  • FIG. 19B shows an example in which the lead L is irradiated with the illumination light 40L having a narrow illumination width.
  • a region where the illumination light 40L intersects with the lead L is the lead detection width.
  • the lead detection width is relatively short upward from the lead end La of the lead L.
  • FIG. 19C shows a state in which the lens driving device 54 moves the lens support member 53 such that the cylindrical lens 42L is separated from the light source unit 41 more than the default position in the optical path.
  • the diffused light emitted from the laser element has a relatively high degree of diffusion and enters the refracting surface of the cylindrical lens 42L. Therefore, the illumination width of the illumination light 40LW emitted from the cylindrical lens 42L is relatively large.
  • FIG. 19D shows an example in which the lead L is irradiated with illumination light 40LW having a wide and narrow illumination width.
  • the lead detection width by the illumination light 40LW is relatively long upward from the lead end La of the lead L.
  • the imaging region 31A which is a partial region on the imaging optical axis A2 intersects with the illumination light 40L. It is possible to vertically expand or reduce the detection area from which the recognition image can be acquired, and the lead detection width can be freely adjusted. Therefore, inspection specifications for various types of electronic components and leads can be accommodated.
  • FIG. 20A and FIG. 20B are diagrams showing an imaging situation by the component imaging device according to the fifth embodiment.
  • the component imaging apparatus of the fifth embodiment includes an angle adjustment mechanism that adjusts the inclination of the illumination optical axis A1 of the laser illumination unit 40 for adjusting the lead detection width.
  • the angle adjustment mechanism includes a holding member 55 for holding the laser lighting unit 40, and an elevation device 56 for adjusting the height position of the laser lighting unit 40 in the Z direction by moving the holding member 55.
  • the control configuration of the component imaging device according to the fifth embodiment can be, for example, a configuration that applies the control device 8 shown in FIG. 12 and causes the axis control unit 23 to control the operation of the lifting device 56.
  • the holding member 55 not only holds the laser illumination unit 40, but also includes a mechanism that shifts the tilt angle of the laser illumination unit 40 in conjunction with the movement of the holding member 55 in the Z direction.
  • the intersection angle of the illumination optical axis A1 with the imaging optical axis A2 is ⁇ 1.
  • the illumination optical axis A1 at this time points on a point on the imaging optical axis A2 through which the lead end La passes.
  • the crossing angle ⁇ 2 ( ⁇ 1) allows the illumination optical axis A1 to point to the point without change.
  • the tilt angle of the laser illumination unit 40 is shifted so that> ⁇ 2).
  • the illumination light 40L is parallel light having a width in the vertical direction, and the illumination width is constant in the present embodiment. Therefore, the illumination width for the lead L becomes closer as the crossing angle ⁇ approaches the imaging optical axis A2 at a right angle As it becomes smaller. That is, the width at which the lead L is irradiated by the illumination light 40L at the intersection angle ⁇ 2 becomes shorter than the width at which the lead L is irradiated by the illumination light 40L at the intersection angle ⁇ 1.
  • the lead detection width can be freely adjusted by adjusting the crossing angle ⁇ of the illumination light axis A1 with respect to the imaging optical axis A2.
  • FIG. 21A and FIG. 21B are diagrams showing an imaging situation by the component imaging device according to the sixth embodiment.
  • the component imaging apparatus of the sixth embodiment includes a laser illumination module 40M (illumination unit) formed by modularizing three laser illumination units 403, 404, and 405 as the detection width adjustment mechanism.
  • the three laser illumination units 403, 404, and 405 have illumination optical axes intersecting at the same angle with the imaging optical axis A2, and are arranged at different height positions in the Z direction.
  • the control configuration of the component imaging device according to the sixth embodiment can be, for example, a configuration that applies the control device 8 shown in FIG. 12 and causes the illumination control unit 26 to control the operation of the laser illumination module 40M.
  • the first laser illumination unit 403 (first illumination unit) of the laser illumination module 40M irradiates the illumination light 403L with a tip region (first region) near the lead tip La of the lead L as a target.
  • the second laser illumination unit 404 (second illumination unit) illuminates the illumination light 404L with the middle region (second region) of the lead L as a target.
  • the third laser illumination unit 405 irradiates the illumination light 405L with a region near the root of the lead L as a target.
  • the illumination control unit 26 When narrowing the illumination width for the lead L, as shown in FIG. 21A, the illumination control unit 26 lights only the first laser illumination unit 403, and only the tip region near the lead tip La is used as a target The illumination light 403L is irradiated. In this case, the lead detection width is narrow.
  • the illumination control unit 26 lights all three laser illumination units 403, 404, and 405, as shown in FIG. Illumination lights 404L, 405L, and 406L are irradiated with the tip area, the intermediate area, and the vicinity of the root as targets.
  • two of the first and second laser illumination units 403 and 404 can also be turned on. In this case, the lead detection width can be made wider than in the case of FIG.
  • the seventh embodiment is an embodiment for adjusting the lead detection width, and the seventh embodiment adjusts the lead detection width by software using the apparatus configuration of the basic embodiment shown in FIG. 4 and the control device 8 shown in FIG. An embodiment will be described based on FIGS. 22 (A) to 22 (C).
  • FIG. 22A is an explanatory diagram of a lead detection area
  • FIGS. 22B and 22C are diagrams showing an imaging situation by the component imaging device according to the seventh embodiment.
  • the lead detection is a region in the Z direction where the lead L can be imaged.
  • the area is T / sin ⁇ It can be determined by The above fourth to sixth embodiments are embodiments in which the lead detection area is made variable by means of hardware.
  • the lead detection area is fixed, and the lead detection width is adjusted by adjusting the approach length of the lead L to the lead detection area.
  • FIG. 22 (B) shows an example in which the holding position of the electronic component 17 by the suction nozzle 16 is set at a relatively lower position, whereby the lead L has entered relatively deep into the lead detection area. In this case, the lead detection width extending upward from the lead end La is relatively wide.
  • the holding position of the electronic component 17 by the suction nozzle 16 is set relatively higher than in the case of FIG. 22B, whereby the lead L is relatively shallow and the lead detection area It shows an example of entering inside.
  • the lead detection width is relatively narrow, and only the portion near the lead end La is to be imaged.
  • the lead detection width can be freely adjusted by adjusting the holding position of the electronic component 17 by the suction nozzle 16 without requiring a mechanism for adjusting the illumination width. .
  • the main control unit 21 reads initial operation condition data from the storage unit 22 (step S21).
  • the initial operating condition data is, for example, initial operating conditions of the laser illumination unit 40, the head unit 15, and the camera 31 (line sensor 32).
  • the head unit 15 includes data such as the moving speed in the X direction and the height of the suction nozzle 16 in the Z direction.
  • the camera 31 it is data such as an F value and a shutter speed.
  • the main control unit 21 sets the operation conditions of each device of the surface mounter 1 including the above-described laser illumination unit 40, the head unit 15, and the camera 31 based on the read initial operation condition data (step S22). Then, the main control unit 21 causes the head unit 15 (the suction nozzle 16) to try and suction a lead-attached electronic component to be recognized or a dummy component for calibration (step S23). Subsequently, the main control unit 21 causes the laser illumination unit 40 and the camera 31 to operate in synchronization with each other while moving the head unit 15 so that the sucked electronic component passes through the detection area, and recognizes the trial of the electronic component An image is captured (step S24).
  • step S25 it is checked whether or not the leading end La of the lead L of the lead L included in the electronic component can be recognized in the trial recognition image. If the lead tip La can not be recognized (NO in step S25), the initial operation condition data read in step S21 is changed (step S26). Then, the changed operation condition data is newly set (step S23), and the same process is repeated. On the other hand, when the lead end La can be clearly recognized (YES in step S25), the calibration is ended.
  • FIG. 24 (A) is a perspective view of the adjustment target 60 for imaging optical axis A2
  • FIG. 24 (B) is a view showing an imaging condition of the adjustment target 60 with the camera 31
  • FIG. 24 (C) is its view It is a figure which shows the recognition image I-60 obtained by imaging.
  • the adjustment target 60 is a square flat plate member, and is provided with a black ground color surface 61 on the imaging surface, and a white recognition line 62 drawn on a line dividing the ground color surface 61 into left and right halves. There is.
  • the recognition line 62 consists of a long white line and a short line respectively arranged at a distance from each other. In adjusting the optical axis, the operator first causes the target for adjustment 60 to be adsorbed to the suction nozzle 16.
  • adjustment is performed to match the image sensor array direction of the line sensor 32 with the recognition line 62.
  • the camera 31 picks up an image of the adjustment target 60 while the illumination unit 35 is turned on to emit nondirectional illumination light 35L.
  • the operator adjusts the light image I-62 of the white recognition line 62 in the recognition image I-60 to be completely observed up to the short lines at both ends. The position around the central axis of the suction nozzle 16 of the target 60 is adjusted.
  • FIG. 25 (A) is a view showing an imaging condition of the adjustment target 60 for adjustment of the illumination optical axis A1
  • FIG. 25 (B) is a view showing the recognition image I-60A.
  • the laser illumination unit 40 While turning off the illumination unit 35, the laser illumination unit 40 is turned on to illuminate the adjustment target 60 with the illumination light 40L. At this time, if the illumination optical axis A1 (the illumination light 40L) does not properly point the recognition line 62 of the adjustment target 60, the light image I-62A of the recognition line 62 is incomplete in the recognition image I-60A. It looks like The operator adjusts the installation position of the laser illumination unit 40 so that the complete light image I-62A is observed in the recognition image I-60A, as shown in FIG. 25 (B). By the above operation, alignment between the illumination optical axis A1 and the imaging optical axis A2 is completed.
  • the component imaging device 11 which concerns on this invention was assembled
  • the component imaging device 11 can be applied to various devices other than the surface mounter 1 that require imaging of the electronic component 17.
  • the present invention can be applied to a component inspection apparatus that inspects the electronic component 17.
  • the component imaging device 11 according to the present invention is applied to the imaging recognition of the lead end La of the electronic component 17 with a lead.
  • the present invention can also be applied to the case of imaging and recognizing the ball terminal tip of an electronic component in which a hemispherical ball or a spherical ball terminal is provided on the bottom surface Ba of the component body B as the electronic component 17.
  • FIG. 26 is a diagram showing an optical path when the two-dimensional area sensor 32A is used as an imaging unit.
  • a device for limiting the imaging area along the imaging optical axis is required.
  • two slit plates 341 and 342 are disposed on the imaging optical axis A2.
  • the light incident on the two-dimensional area sensor 32A is only the light that has passed through the slits of both of the slit plates 341 and 342.
  • the moving mechanism consisting of the Y rail unit 13, the X rail unit 14 and the head unit 15 is exemplified as the moving mechanism.
  • the movement mechanism may be any mechanism that can hold the electronic component 17 and carry it in the air.
  • the imaging region (detection region) side may be moved by moving the camera 31 without moving the electronic component 17 .
  • a component imaging device includes a component body and an extension terminal extended from the component body, and the extension terminal extends in a direction perpendicular to the bottom surface of the component body. It is a component imaging apparatus having a function of imaging the tip of the extension terminal of an electronic component having a lead terminal tip, wherein an imaging optical axis is disposed in a first direction passing through the bottom surface of the component body, and the imaging optical axis An imaging unit having an imaging area predetermined along the direction, and an illumination optical axis inclined with respect to the imaging optical axis and intersecting the imaging optical axis, and illumination having directivity along the illumination optical axis An illumination unit that emits light, and the imaging unit and the illumination unit are controlled to form the intersection of the imaging light axis and the illumination optical axis, the detection in which the imaging area intersects the illumination light A recognition image of the tip of the extension terminal passing through the area is acquired It includes a control unit, a.
  • a detection region in which the imaging region of the imaging unit intersects with the illumination light having directivity emitted by the illumination unit is formed.
  • a recognition image of the extension terminal tip is acquired.
  • tip of electronic components will not be reflected in the said recognition image. That is, even if the illumination light is irradiated also to other parts of the electronic component other than the leading end of the extension terminal, the light image is not captured by the imaging unit unless the irradiation site is in the detection area. Therefore, according to the component imaging device, it is possible to obtain a recognized image in which the contrast between the tip of the extension terminal and the other portion is clarified.
  • the imaging unit includes a line sensor
  • the illumination unit includes a laser element that emits laser light, and an optical system that converts the laser light into linear light. According to this configuration, it is possible to realize an imaging unit having an imaging area predetermined along the imaging optical axis with a simple configuration.
  • the electronic component includes a lead extending from the component body as the extension terminal, and the tip of the extension terminal to be imaged is a bottom surface of the component body in the lead.
  • the lead tip may extend in a direction perpendicular to the direction. According to this configuration, when the lead tip passes through the detection area, a recognition image of the lead tip is acquired. Therefore, according to the component imaging device, it is possible to obtain a recognized image in which the contrast between the lead end and the other portion is clarified.
  • the electronic component includes a hemispherical or spherical ball terminal extended from the component body as the extension terminal, and the tip of the extended terminal to be imaged is the component body of the ball terminal.
  • the tip end of the ball terminal may be perpendicular to the bottom surface of the ball terminal.
  • the electronic component is an electronic component in which the leads having a plurality of projecting heights with different projecting heights in the first direction of the tip of the lead are arranged in a direction orthogonal to the first direction.
  • the control unit executes a recognition operation of causing the detection region to pass the tip end of the lead and acquiring the recognition image a plurality of times according to the projection heights of the leads of the plurality of projection heights.
  • the plurality of recognition images obtained by the plurality of recognition operations may be combined to perform image processing for forming one recognition image.
  • recognition images of the lead tips of the leads of a plurality of protrusion heights having different protrusion heights are acquired, and these are combined to form one recognized image. Therefore, even with the component imaging apparatus according to the present invention in which the detection area is limited, it is possible to reliably acquire a recognition image of the lead tip of the electronic component having the leads having different projecting heights.
  • the illumination unit includes illumination units at a plurality of height positions at different height positions in the first direction, and the illumination units at the plurality of height positions have a plurality of projection heights different from one another. It is arranged to emit illumination light with each of the lead tips of the leads at a projecting height as a target, and the control unit is configured to illuminate the illumination unit at one height position of the illumination units at the plurality of height positions. In the case of operation, illumination units at other height positions among the illumination units at a plurality of height positions can be stopped.
  • the component imaging device described above comprises: a support member for supporting the illumination unit; and an illumination unit elevation mechanism for adjusting the height position of the illumination unit in the first direction by moving the support member.
  • the illumination unit raising and lowering mechanism adjusts height positions of the illumination unit in the first direction in a plurality of recognition operations targeting the lead tip of a plurality of different projection heights, and the plurality of different pluralities are different.
  • the support member may be moved so as to emit illumination light with each of the lead tips at the height of the projection as a target.
  • the component imaging device further includes a detection width adjustment mechanism that adjusts the detection width in the first direction of the lead by adjusting the illumination width of the illumination light emitted by the illumination unit.
  • the lead detection width can be made variable according to the protrusion height of the lead of the electronic component to be imaged.
  • the illumination width the width in which the illumination light can be irradiated to the lead, that is, the lead detection width can be easily adjusted.
  • the illumination unit includes a laser element that emits laser light, and an optical lens that adjusts an illumination width by the laser light
  • the detection width adjustment mechanism includes the optical lens.
  • the detection width adjustment mechanism adjusts the illumination width by adjusting a crossing angle of the illumination optical axis with respect to the imaging optical axis. It can be configured to include.
  • the illumination width can be made smaller as the intersection angle is made closer to a right angle with respect to the imaging optical axis.
  • the illumination unit includes a first illumination unit and a second illumination unit having different height positions in the first direction, and the first illumination unit is the lead
  • the second illumination unit emits illumination light to a first area which is a predetermined area in the height direction and a second area which is an area different from the first area of the lead as a target.
  • the control unit operates only one of the first illumination unit and the second illumination unit to irradiate illumination light with only one of the first area and the second area as a target. And controlling both the first illumination unit and the second illumination unit to emit illumination light with both the first area and the second area as targets.
  • Wide light It can be configured to perform the control of the width.
  • switching between the narrow illumination width and the wide illumination width can be instantaneously performed by the lighting control of the first illumination unit and the second illumination unit.
  • the component imaging apparatus further includes an illumination unit that emits nondirectional illumination light, and the control unit operates the illumination unit when the acquisition target of the recognition image is the tip of the extension terminal.
  • the acquisition target of the recognition image is a general-purpose component including a component main body without the extension terminal, it is preferable to operate the illumination unit. According to this configuration, the component imaging device can recognize both the extended terminal tip and the general-purpose component.
  • a surface mounter includes a component holding member for holding a component for mounting, a lifting and lowering mechanism for lifting and lowering the component holding member in the vertical direction, and a moving mechanism for moving the component holding member in the horizontal direction.
  • a mounting unit for transporting the mounting component from the component supply unit and mounting the mounting component on the substrate; and the component imaging apparatus for imaging the mounting component held by the component holding member as the electronic component;
  • a detection unit that detects the position of the tip of the extension terminal of the mounting component based on the image of the mounting component captured by the imaging unit; and the position of the tip of the extension terminal of the mounting component
  • a controller configured to adjust the horizontal mounting position on the substrate based on the detection result.
  • a surface mounter includes a component holding member for holding a component for mounting, an elevating mechanism for vertically moving the component holding member, and movement for moving the component holding member in the horizontal direction.
  • a mounting unit for transporting the mounting component from the component supply unit and mounting the mounting component on the substrate, and the component imaging apparatus for imaging the mounting component held by the component holding member as the electronic component
  • a detection unit that detects the position of the lead end of the mounting component based on the image of the mounting component captured by the imaging unit, and a detection result of the position of the lead tip of the mounting component.
  • a control device for adjusting the mounting position in the horizontal direction on the substrate the control device raising and lowering the component holding member by the elevating mechanism to obtain the imaging optical axis and the illumination width of the illumination light; Determined by By adjusting the penetration length of the lead to the lead detection region that adjusts the detection width in the first direction of the lead.
  • the detection width of the lead can be adjusted by adjusting the height position of the mounting component in the first direction by the elevating mechanism without requiring the mechanism for adjusting the illumination width.
  • a surface mounter includes a component holding member for holding a component for mounting, an elevating mechanism for vertically moving the component holding member, and movement for moving the component holding member in the horizontal direction.
  • a mounting unit for transporting the mounting component from the component supply unit and mounting the mounting component on the substrate, and the component imaging apparatus for imaging the mounting component held by the component holding member as the electronic component
  • a detection unit that detects the position of the lead end of the mounting component based on the image of the mounting component captured by the imaging unit, and a detection result of the position of the lead tip of the mounting component.
  • a control device for adjusting the mounting position in the horizontal direction on the substrate, and the control device changes the detection area in each recognition operation at a plurality of height positions by the elevation mechanism. That as the lead tips of the projection height passes, moving the component holding member in the vertical direction.
  • a component imaging apparatus capable of acquiring a recognition image capable of easily measuring the lead tip position, and a surface mounter of an electronic component using the component imaging apparatus. it can.

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  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Length Measuring Devices By Optical Means (AREA)
PCT/JP2013/006676 2013-11-13 2013-11-13 部品撮像装置及びこれを用いた表面実装機 WO2015071929A1 (ja)

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JP2015547283A JP6224727B2 (ja) 2013-11-13 2013-11-13 部品撮像装置及びこれを用いた表面実装機
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JP2020096203A (ja) * 2020-03-19 2020-06-18 株式会社Ｆｕｊｉ 挿入部品の画像処理方法
CN112509935A (zh) * 2019-09-13 2021-03-16 株式会社东芝 半导体检査装置以及半导体装置的检査方法
CN114375617A (zh) * 2019-09-02 2022-04-19 松下知识产权经营株式会社 安装基板的制造方法以及部件安装装置
WO2022107286A1 (ja) * 2020-11-19 2022-05-27 株式会社Fuji 画像処理装置、実装装置、実装システム、画像処理方法及び実装方法
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CN108575086A (zh) * 2017-03-08 2018-09-25 台达电子电源(东莞)有限公司 电子元器件接脚位置采集装置、识别装置及自动插件机
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WO2019067657A1 (en) 2017-09-28 2019-04-04 Universal Instruments Corporation IMPROVED WIRE POINT LIGHTING DEVICE, SYSTEM, AND METHOD
TWI696825B (zh) * 2019-08-15 2020-06-21 捷智科技股份有限公司 利用二維影像辨識技術對待測電子零組件的連接端子執行品管檢測的品管檢測裝置及其方法
CN115432032B (zh) * 2022-09-30 2023-04-28 哈尔滨市科佳通用机电股份有限公司 基于光截法的地铁轨道几何形位参数动态检测方法

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WO2022107286A1 (ja) * 2020-11-19 2022-05-27 株式会社Fuji 画像処理装置、実装装置、実装システム、画像処理方法及び実装方法
WO2022244249A1 (ja) * 2021-05-21 2022-11-24 株式会社Fuji リード曲がり検出方法および実装装置

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