WO2015068866A1 - Dispositif de dépôt de substance organique et procédé de dépôt de substance organique l'utilisant - Google Patents

Dispositif de dépôt de substance organique et procédé de dépôt de substance organique l'utilisant Download PDF

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Publication number
WO2015068866A1
WO2015068866A1 PCT/KR2013/009960 KR2013009960W WO2015068866A1 WO 2015068866 A1 WO2015068866 A1 WO 2015068866A1 KR 2013009960 W KR2013009960 W KR 2013009960W WO 2015068866 A1 WO2015068866 A1 WO 2015068866A1
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Prior art keywords
substrate
organic material
scanning unit
moving
coupled
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PCT/KR2013/009960
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English (en)
Korean (ko)
Inventor
이영종
박찬석
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주식회사 선익시스템
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Publication of WO2015068866A1 publication Critical patent/WO2015068866A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition

Definitions

  • the present invention relates to an organic material deposition apparatus and an organic material deposition method using the same.
  • the deposition process is performed on a plurality of substrates in one chamber, but the tact time can be reduced by performing a transfer process or an alignment process on another substrate during the deposition process of one substrate.
  • the present invention relates to an organic material deposition apparatus and a deposition method using the same, which can reduce loss of organic material generated during a transfer process or an alignment process for a substrate.
  • OLED Organic Luminescence Emitting Device
  • the flat panel display device using the organic light emitting diode has a fast response speed and a wide viewing angle, which has emerged as a next generation display device.
  • the manufacturing process is simple, the production cost can be reduced more than the existing liquid crystal display device.
  • the hole injection layer, the hole transport layer, the light emitting layer, the electron transport layer, and the electron injection layer which are the remaining constituent layers except the anode and the cathode electrode, are organic thin films, and the organic thin film is deposited on the substrate by a vacuum thermal deposition method. Will be deposited on.
  • a substrate is transferred into a vacuum chamber, a shadow mask in which a predetermined pattern is formed is aligned with the transferred substrate, and heat is applied to the crucible containing the organic material to sublimate the organic material on the substrate onto the substrate. It is made by deposition on.
  • the organic material is continuously sublimed in the crucible during the substrate transfer process and the shadow mask alignment process, so there is a problem that the organic material is lost.
  • the deposition process is performed on a plurality of substrates in one chamber, and a tact time can be reduced by performing a transfer process or an alignment process for another substrate during the deposition process of one substrate,
  • a tact time can be reduced by performing a transfer process or an alignment process for another substrate during the deposition process of one substrate.
  • a first substrate is divided into a first deposition region and a second deposition region, the first substrate is drawn in and out of the first deposition region in the first radiation direction from one center point, the second radiation at the center point
  • a process chamber in which a second substrate is drawn in and out of the second deposition region in a direction;
  • a transfer unit configured to transfer the organic material deposition source, wherein the organic material deposition source is coupled to the organic material deposition source so that the organic material deposition source is sprayed onto the surface of the first substrate or the second substrate.
  • a scanning unit which linearly moves along the surface of the first substrate or the second substrate; Scanning unit moving means coupled to the scanning unit and reciprocating the scanning unit to be located in the first deposition region or the second deposition region;
  • the scanning unit moving unit is coupled, the organic deposition apparatus including a scanning unit rotating means for rotating the scanning unit moving unit so that the linear organic material deposition source is parallel to one side of the first substrate or the second substrate. Is provided.
  • the scanning unit may include a moving frame including a pair of first guide bars facing each other and a first connection bar connecting the pair of first guide bars; A first rail along a length direction of the first guide bar; A first moving block coupled to the organic material deposition source and moving along the first rail; And it may include a first drive unit for moving the first moving block.
  • the first rail may include a flat rail coupled along the first guide bar and having a flat upper surface, and a mountain rail coupled along a length direction of the flat rail
  • the first moving block includes: A block body; A circular roller rotatably coupled to one side end of the block body and supported on an upper surface of the flat rail; It may include a groove roller rotatably coupled to the other side end of the block body and the groove groove is formed along the outer circumference so that the mountain rail is inserted, the first drive unit, along the longitudinal direction of the first guide bar
  • the LM motor may include a magnet row in which the N poles and the S poles are alternately arranged, and a coil part disposed to face the magnet row.
  • the scanning unit pivot means may include a rotation frame including a pair of second guide bars facing each other and a second connection bar connecting the pair of second guide bars, in this case, the scanning unit shifting means. Is, a second rail coupled in the longitudinal direction of the second guide bar; A second moving block coupled to the scanning unit and moving along the second rail; And a second driving unit for moving the second moving block.
  • the scanning unit rotation means the rotary rail is formed in a circular shape on the bottom surface of the process chamber;
  • the rotating frame is coupled, and may further include a rotating block moving along the rotating rail.
  • the first guide bar includes a pair of webs in which a plurality of holes are formed along a length direction and disposed to face each other, and a plurality of holes are formed in a length direction and transverse directions at one end and the other end of the pair of webs. It may include a box-shaped beam (beam) consisting of an upper flange and a lower flange coupled to.
  • beam box-shaped beam
  • the second guide bar has a web in which a plurality of holes are formed along a length direction, an upper flange coupled to one end of the web in a transverse direction, and the second rail coupled to an upper side thereof, and a cross direction at the other end of the web. It may include an I-beam (beam) consisting of a lower flange coupled to.
  • a method of depositing an organic material using the organic material deposition apparatus comprising the steps of: loading the first substrate in the first radial direction and seating on the first substrate loading portion; Moving the scanning unit to the first deposition region by the scanning unit moving means; Rotating the scanning unit moving unit by the scanning unit rotating unit such that the linear organic material deposition source is parallel to one side of the first substrate; Depositing organic particles on the first substrate by linearly moving the organic material deposition source along a surface of the first substrate; Simultaneously depositing organic particles on the first substrate and loading the second substrate in the second radial direction and seating the second substrate loading portion on the second substrate loading portion; Moving the scanning unit to the second deposition region by the scanning unit moving means when the deposition on the first substrate is completed; Rotating the scanning unit moving unit by the scanning unit rotating unit such that the linear organic material deposition source is parallel to one side of the second substrate;
  • the scanning unit comprises a step of depositing the organic particles on the second substrate by linearly moving the organic material deposition source is
  • the deposited first substrate is withdrawn from the process chamber, a new first substrate is loaded in the first radial direction and seated on the first substrate loading portion. It may further comprise the step of.
  • the second substrate After depositing the organic particles on the second substrate, the second substrate, which has been deposited, is withdrawn from the process chamber, and a new second substrate is loaded in the second radial direction and seated on the second substrate loading portion. It may further comprise the step of.
  • a deposition process is performed on a plurality of substrates in one chamber, and a tack time is performed by performing a transfer process or an alignment process on another substrate during the deposition process of one substrate. It is possible to reduce the loss of the organic material generated during the transfer process or the alignment process to the substrate.
  • FIG. 1 is a cross-sectional view for explaining the configuration of an organic material deposition apparatus according to an embodiment of the present invention.
  • Figure 2 is a longitudinal cross-sectional view for explaining the configuration of the organic material deposition apparatus according to an embodiment of the present invention.
  • Figure 3 is a perspective view from above of the transfer unit of the organic material deposition apparatus according to an embodiment of the present invention.
  • Figure 4 is a perspective view from below of the transfer unit of the organic material deposition apparatus according to an embodiment of the present invention.
  • FIG. 5 is a cross-sectional view showing a portion of an organic material deposition apparatus according to an embodiment of the present invention.
  • FIG. 6 is a perspective view showing a part of an organic material deposition apparatus according to an embodiment of the present invention.
  • FIG. 7 is a flow chart of an organic material deposition method according to another embodiment of the present invention.
  • FIG. 1 is a cross-sectional view for explaining the configuration of the organic material deposition apparatus according to an embodiment of the present invention
  • Figure 2 is a longitudinal cross-sectional view for explaining the configuration of the organic material deposition apparatus according to an embodiment of the present invention
  • Figure 3 is a perspective view of the transfer unit of the organic material deposition apparatus according to an embodiment of the present invention from the top
  • Figure 4 is a perspective view of the transfer unit of the organic material deposition apparatus according to an embodiment of the present invention.
  • 5 is a cross-sectional view showing a part of an organic material deposition apparatus according to an embodiment of the present invention
  • Figure 6 is a perspective view showing a part of an organic material deposition apparatus according to an embodiment of the present invention.
  • the center point 12 the robot arm 14, the first radial direction 15, the first substrate 16, the second radial direction 18, the second substrate 20, and the first The deposition region 22, the second deposition region 24, the process chamber 26, the first substrate loading portion 28, the second substrate loading portion 30, the organic material deposition source 32, and the transfer unit 33.
  • the organic material deposition apparatus is divided into a first deposition region 22 and a second deposition region 24, and the first substrate 16 in the first radial direction 15 at one center point 12.
  • a process chamber which draws in and out of the first deposition region 22 and draws in and out of the second deposition region 24 in the second radial direction 18 from the center point 12. 26);
  • a linear organic material deposition source 32 for spraying organic material particles; It includes a transfer unit 33 for transferring the organic material deposition source (32).
  • the transfer unit 33 is the organic material deposition source 32 is coupled, the organic material deposition source (so that the organic particles are sprayed on the surface of the first substrate 16 or the second substrate 20 (
  • the scanning unit moving unit 36 is coupled to the scanning unit moving unit 36 such that the linear organic material deposition source 32 is parallel to one side of the first substrate 16 or the second substrate 20.
  • the process chamber 26 is divided into a first deposition region 22 and a second deposition region 24, and the first substrate 16 is disposed in the first radial direction 15 at one center point 12.
  • the second substrate 20 may be drawn in and out of the deposition region 22, and the second substrate 20 may be drawn in and out of the second deposition region 24 in the second radial direction 18 at the center point 12.
  • the process chamber 26 is a place where organic material deposition is performed on the substrate therein, and the inside may be maintained in a vacuum state by a vacuum pump. When the organic material is deposited at atmospheric pressure, the inside may be maintained at atmospheric pressure.
  • the process chamber 26 may be divided into a plurality of deposition regions 22 and 24 such that deposition may be performed on a plurality of substrates in one process chamber 26.
  • the deposition regions 22 and 24 denote virtual spaces in which organic deposition may be performed on one substrate according to the movement of the organic deposition source 32.
  • the process chamber 26 may be divided into the first deposition region 22 and the second deposition region 24 by the center line of the process chamber 26.
  • organic particles are deposited on the first substrate 16.
  • the organic particles on the second substrate 20 are deposited. Deposition takes place.
  • the first substrate 16 is drawn into or withdrawn from one center point 12 to the first deposition region 22 of the process chamber 26 in the first radial direction 15, and the second substrate 20 is the center point. In (12) it is introduced into or withdrawn from the second deposition region 24 of the process chamber 26 in the second radial direction 18. That is, the first substrate 16 and the second substrate 20 are drawn in or drawn out from the process chamber 26 with a predetermined slope.
  • the substrate may be drawn into or withdrawn from the process chamber 26 by a robot arm 14 in a transfer chamber connected to the process chamber 26, in which case the robot arm ( Since the substrate is taken in and out of the process chamber 26 in the radial direction at the center of rotation of 14, the substrate can be drawn in and out of the process chamber 26 with a constant inclination.
  • the rotation center of the robot arm 14 constituting the center point 12 is formed.
  • the first substrate 16 is drawn in and out of the process chamber 26 in the first radial direction with respect to the second substrate 20, and the second substrate 20 is at the center of rotation of the robot arm 14 constituting the center point 12.
  • the first arm 16 and the second substrate 20 are not limited to drawing in and out of the process chamber 26 by the robot arm 14.
  • the organic material deposition apparatus according to the present exemplary embodiment may be applied.
  • the rotation center of the robot arm 14 is the center point described above. Without forming (12), the point where the two virtual inclination lines which the inclination direction of the 1st board
  • the first substrate 16 and the second substrate 20 are loaded on the first substrate loading unit 28 and the second substrate loading unit 30, respectively.
  • the organic particles are ejected upward from the organic material deposition source 32 so that the organic material may be deposited on the substrate, and the first substrate below the first substrate loading part 28 and the second substrate loading part 30. 16 and the second substrate 20 are attached, respectively.
  • the shadow mask may be formed in each of the substrate loading units 30 and 32. 40 may be disposed on the surface of the substrate, and the substrate and the shadow mask 40 may be aligned with each other.
  • the organic material deposition source 32 is coupled to the transfer unit 33, and the organic material deposition source 32 moves between the first deposition region 22 and the second deposition region 24 by the transfer unit 33. Deposition of organics is carried out.
  • the transfer unit 33 includes a scanning unit 34 for linearly moving the organic material deposition source 32 along the surface of the first substrate 16 or the second substrate 20 and a reciprocating movement of the scanning unit 34.
  • Scanning unit rotation means for rotating the scanning unit movement means 36 such that the scanning unit movement means 36 and the linear organic material deposition source 32 are parallel to one side of the first substrate 16 or the second substrate 20. Means 38.
  • the linear organic material deposition source 32 injects organic particles onto the surface of the first substrate 16 or the second substrate 20.
  • the linear organic material deposition source 32 is linearly moved in the direction of the other side facing one side of the substrate to deposit the organic material on the substrate, it is configured in a linear corresponding to the width of the substrate.
  • the deposition of the organic material on the substrate is performed by applying heat to the crucible of the organic material deposition source 32 in which the organic material is contained and depositing organic particles sublimated in the crucible on the substrate.
  • the organic material deposition source 32 is coupled to the scanning unit 34, and the scanning unit 34 supplies the organic material deposition source 32 to spray the organic particles onto the surface of the first substrate 16 or the second substrate 20. It linearly moves along the surface of the first substrate 16 or the second substrate 20. As described above, since the organic material deposition source 32 linearly moves in the direction of the other side facing one side of the substrate to deposit the organic material on the substrate, the organic material deposition source 32 is linearly moved by the scanning unit 34.
  • the scanning unit 34 is coupled to the scanning unit moving unit 36, and the scanning unit moving unit 36 scans the scanning unit 34 so that the scanning unit 34 is positioned in the first deposition region 22 or the second deposition region 24.
  • the part 34 is reciprocated.
  • the scanning unit moving means 36 may include a scanning unit that has completed the deposition process in the first deposition region 22 ( 34 is moved to the second deposition region 24. By the scanning unit moving means 36, the scanning unit 34 reciprocates between the first deposition region 22 and the second deposition region 24 to perform the deposition process on the substrates located in each deposition region.
  • the scanning unit moving unit 38 is coupled to the scanning unit moving unit 36 and the scanning unit so that the linear organic material deposition source 32 is parallel to one side of the first substrate 16 or the second substrate 20. Rotate the moving means 36.
  • the scanning part moving means 38 is coupled to the scanning part moving means 36, the scanning part moving means 36 is coupled to the scanning part 34, and the scanning part 34 is connected to the scanning part moving means 36.
  • the organic material deposition source 32 is coupled by the source support 97.
  • the scanning unit 34 is moved to the first deposition region 22 by the scanning unit moving means 36 Is moved straight.
  • the organic material deposition source 32 of the scanning unit 34 moved to the first deposition region 22 is not parallel to one side of the inclinedly loaded first substrate 16, so that the scanning unit rotates by the scanning unit rotating means 38.
  • the moving means 36 is rotated, the linear organic material deposition source 32 is parallel to one side of the first substrate 16.
  • the scanning unit 34 moves the organic material deposition source 32 linearly from one side of the first substrate 16 to the other side to move.
  • the organic particles ejected from are deposited on the first substrate 16.
  • the scanning unit rotating unit 38 rotates to its original position and the organic material deposition source 32 is moved by the scanning unit moving unit 36.
  • the combined scanning unit 34 is linearly moved to the second deposition region 24.
  • the scanning unit rotating means 38 is used.
  • the scanning unit moving means 36 is rotated, the linear organic material deposition source 32 is parallel to one side of the second substrate 20.
  • the scanning unit 34 moves the organic material deposition source 32 linearly from one side of the second substrate 20 to the other side direction. Organic particles that are ejected during the migration process are deposited on the second substrate 20.
  • FIG. 3 is a perspective view of the transfer unit 33 of the organic material deposition apparatus according to the present embodiment from above
  • FIG. 4 is a perspective view of the transfer unit 33 of the organic material deposition apparatus according to the present embodiment viewed from below.
  • the transfer unit 33 according to the present embodiment will be described in detail.
  • the scanning unit 34 may include a moving frame 58 including a pair of first guide bars 45 facing each other and a first connection bar 46 connecting the pair of first guide bars 45.
  • a first moving block 52 coupled to the first rail 50 and the organic material deposition source 32 along the length direction of the first guide bar 45 and moving along the first rail 50; And a first driver for moving the first moving block 52.
  • the moving frame 58 is a support for supporting the organic material deposition source 32, and is composed of a pair of first guide bars 45 facing each other and a first connection bar 46 connecting them.
  • the first guide bar 45 may be provided with a linear motion guide (LM guide) for guiding the linear movement of the organic material deposition source 32 along the longitudinal direction.
  • LM guide linear motion guide
  • the first guide bar 45 includes a pair of webs 74 in which a plurality of holes 82 are formed along a length direction and are disposed to face each other, and a plurality of holes 82 are formed along a length direction. It may be composed of a box-shaped beam (80) consisting of the upper flange 76 and the lower flange 78 is coupled to one end and the other end of the pair of web 74 in the transverse direction.
  • the box-shaped beam 80 is rectangular in cross section and has high structural rigidity, and can reduce the weight of the moving frame 58 by forming a plurality of holes 82 in the web 74 or the flanges 76 and 78. .
  • the first rail 50 is coupled to the upper portion of the first guide bar 45 in the longitudinal direction, and the first moving block 52 moving along the first rail 50 is coupled to the first rail 50. do.
  • a source support 97 for coupling the organic material deposition source 32 is coupled to the first moving block 52 to perform a linear reciprocating movement along the first rail 50.
  • the first driving unit (not shown) provides a driving force to move the first moving block 52 along the first rail 50.
  • the first rail 50 is coupled along the first guide bar 45 and is coupled to the flat rail 90 having a flat upper surface, and along the longitudinal direction of the flat rail 90. It consists of a mountain rail (92).
  • the first moving block 52 is a block body 84, a circular roller 86 rotatably coupled to one side end of the block body 84, and supported on an upper surface of the flat rail 90, and a block.
  • the first drive unit includes a magnet train 94 in which the N poles and the S poles are alternately arranged along the longitudinal direction of the first guide bar 45, and a coil unit 95 disposed to face the magnet train 94. It may be composed of an LM motor 96 having a).
  • the flat rail 90 has a flat upper surface along the longitudinal direction, and the circular roller 86 of the first moving block 52 is supported on the flat upper surface.
  • a ridge rail 92 having a reverse V-shaped ridge formed along the length direction is coupled to a side end of the flat rail 90, and a groove of the first moving block 52 is formed in the ridge of the ridge rail 92.
  • the grooved groove 87 of the roller 88 is inserted.
  • the organic material deposition source 32 may be directly coupled to the block body 84, or the source support 97 may be coupled to the block body 84.
  • a circular roller 86 supported on the flat upper surface of the flat rail 90 is rotatably coupled, and at the other end, a groove roller 88 supported on the ridge of the mountain rail 92. ) Is rotatably coupled.
  • Friction between the upper surface of the flat rail 90 and the outer circumferential surface of the circular roller 86 can be minimized to minimize dust generation during driving.
  • the ridge portion of the groove roller 88 is inserted into the grooved groove 87 of the groove roller 88, the organic material deposition source 32 is prevented from being separated from the rail during driving.
  • the LM motor 96 used as the first driving unit may include a magnet string 94 and a coil portion 95.
  • the magnet string 94 includes a plurality of magnets such that N poles and S poles are alternately arranged.
  • the first guide bar 45 may be installed along the longitudinal direction, and the coil unit 95 may be coupled to the organic material deposition source 32 or the source support 97. As the current is applied to the coil unit 95, the coil unit 95 facing the magnet train 94 alternately generates repulsive force and attraction force, thereby providing driving force to the first moving block 52. .
  • the scanning unit pivot means 38 includes a rotation frame having a pair of second guide bars 54 facing each other and a second connection bar 56 connecting the pair of second guide bars 54 ( 48).
  • the scanning unit moving means 36 includes a second rail 60 coupled with the second guide bar 54 along the longitudinal direction of the second guide bar 54, and the scanning unit 34 is coupled to the second rail 60.
  • a second moving block 62 moving along; And a second driver (not shown) for moving the second moving block 62.
  • the second guide bar 54 includes a web 66 in which a plurality of holes 82 are formed along the length direction, and is laterally coupled to one end of the web 66, and a second rail 60 is coupled to the upper portion thereof.
  • the upper flange 68 and the lower flange 70 which is coupled to the other end of the web 66 in the lateral direction may be composed of an I-beam 72 (beam).
  • the I-shaped beam 72 is structurally rigid with respect to the vertical load as the I-shaped cross section, and the plurality of holes 82 are formed in the web 66 of the I-shaped beam 72 to form the rotating frame 48. The weight can be reduced.
  • the second rail 60 is coupled along the length of the second guide bar 54 in the longitudinal direction, and the second moving block 62 moving along the second rail 60 is coupled to the second rail 60. do.
  • the scanning unit 34 is coupled to the second moving block 62 so that the scanning unit 34 linearly reciprocates as the second moving block 62 moves.
  • the second driving unit (not shown) provides a driving force so that the second moving block 62 can move along the second rail 60.
  • the LM motor described above may be used as the second driving unit.
  • the scanning unit rotation means 38, the rotary rail 63 and the rotation frame 48 are arranged in a circular shape on the bottom surface of the process chamber 26 is coupled, and moves along the rotary rail 63 May comprise a rotating block 64.
  • the rotary rail 63 is disposed on the bottom surface of the process chamber 26 in a circular shape with respect to the center of rotation.
  • four circular arc-shaped rails having the same radius are disposed in a circular manner to rotate the rotary rail 63. It was made up.
  • Rotating blocks 64 are disposed on each rail having an arc shape and rotated along the rotary rails 63.
  • Rotating frame 48 is coupled to the rotary block 64 is to rotate along the rotary rail (63).
  • the scanning unit moving means 36 mounted thereon can be rotated, and thus the scanning unit
  • the organic material deposition source 32 coupled to the moving means 36 may be parallel to one side of the first substrate 16 or the second substrate 20.
  • the blocking plate 44 is disposed to face the first substrate 16 or the second substrate 20, and the organic material deposition linearly moved by the scanning unit moving means 36. It moves in a direction opposite to the source 32 to cover the first substrate 16 or the second substrate 20.
  • the blocking plate 44 moves in the opposite direction to the first substrate ( 16). This is to prevent parasitic deposition in which organic particles evaporated from the organic material deposition source 32 during the deposition of the second substrate 20 are scattered and deposited on the first substrate 16.
  • the blocking plate 44 moves in the opposite direction to cover the second substrate 20. Done.
  • the partition wall 42 is coupled to the process chamber 26 and is located between the first substrate loading portion 28 and the second substrate loading portion 30.
  • the partition wall 42 is formed by extending a predetermined distance from the upper end to the lower end inside the process chamber 26, and the blocking plate 44 is disposed in the transverse direction with respect to the lower end of the partition 42.
  • FIGS. 8 to 15 are flowcharts of the organic material deposition method according to another embodiment of the present invention.
  • the first substrate 16, 16 ′ the second substrate 20, the first deposition region 22, the second deposition region 24, the process chamber 26, and the first substrate loading
  • the unit 28, the second substrate loading unit 30, the organic material deposition source 32, the scanning unit 34, the scanning unit moving unit 36, and the scanning unit rotating unit 38 are illustrated.
  • the organic material deposition method is a method of depositing an organic material using the organic material deposition apparatus described above, loading the first substrate 16 in a first radial direction and seating on the first substrate loading portion 28. Steps;
  • the scanning unit moving means 36 moving the scanning unit 34 to the first deposition region 22; Rotating the scanning unit 34 by the scanning unit rotating means 38 such that the linear organic deposition source 32 is parallel to one side of the first substrate 16; Scanning the organic material source on the first substrate 16 by linearly moving the organic material deposition source 32 along the surface of the first substrate 16; Simultaneously depositing organic particles on the first substrate 16 and loading the second substrate 20 in a second radial direction and seating on the second substrate loading portion 30;
  • the scanning unit rotating means 38 rotating the scanning unit 34 to its original position;
  • the scanning unit moving means 36 moving the scanning unit 34 to the second deposition region 24; Rotating the scanning unit 34 by the scanning unit rotating means 38 such that the linear organic material deposition source 32 is parallel to one side
  • the first deposition region 22 in which the first substrate 16 is drawn in and out in the first radial direction from one center point, and the second deposition direction in the second radial direction from the center point 12 is formed.
  • 2 is a method of depositing an organic material on a substrate in a process chamber 26 partitioned by a second deposition region 24 into which the substrate 20 is drawn out.
  • Organic deposition is performed on the first substrate 16 in the first deposition region 22 and organic deposition is performed on the second substrate 20 in the second deposition region 24.
  • the first substrate 16 is loaded in the first radial direction and seated on the first substrate loading unit 28 (S100). .
  • the substrate may be drawn into or taken out of the process chamber 26 by a robot arm provided in a transfer chamber connected to the process chamber 26, with respect to the center of rotation of the robot arm. Since the substrate is drawn in and out of the process chamber 26 in the radial direction, the substrate may be disposed with a constant inclination in the process chamber 26.
  • the first substrate 16 when the first substrate 16 is seated on the first substrate loading portion 28 of the process chamber 26 by the robot arm, the first substrate 16 may be disposed in the first radial direction with respect to the rotation center of the robot arm constituting the center point. The substrate 16 is seated on the first substrate loading portion 28.
  • the shadow mask is disposed on the surface of the first substrate 16, and the first substrate 16 and the shadow mask are aligned.
  • the scanning unit moving unit 36 moves the scanning unit 34 to the first deposition region 22 (S200).
  • the scanning unit 34 is moved to the first deposition region 22 to perform the deposition process on the first substrate 16.
  • the present embodiment relates to a method of depositing a plurality of substrates with one organic material deposition source 32, the scanning unit 34 is a linear reciprocating movement between the deposition region by the scanning unit moving means 36 do.
  • the scanning unit rotating means 38 rotates the scanning unit moving means 36 so that the linear organic material deposition source 32 is parallel to one side of the first substrate 16 ( S300). Since the first substrate 16 and the second substrate 20 are inclined to each other and introduced into the process chamber 26, the first substrate 16 and the second substrate 20 are seated on the first substrate loading portion 28 and the second substrate loading portion 30, respectively. As the deposition source 32 linearly moves against the surface of the substrate, the linear organic material deposition source 32 may have a longitudinal direction in order to efficiently deposit organic matter on the first substrate 16 or the second substrate 20.
  • the scanning unit rotating means 38 rotates the scanning unit moving unit 36 so that one side of the substrate is parallel.
  • the scanning unit 34 linearly moves the organic material deposition source 32 along the surface of the first substrate 16 to deposit organic particles on the first substrate 16 (S400). ).
  • the organic material deposition source 32 is linearly moved by the scanning unit 34 in the other side direction facing one side of the first substrate 16 to deposit organic particles on the first substrate 16.
  • the deposition of the organic material on the first substrate 16 is performed by applying heat to the crucible of the organic material deposition source 32 in which the organic material is contained and depositing organic particles sublimated in the crucible onto the substrate.
  • the organic material deposition source 32 After the organic material deposition source 32 reaches the other side of the first substrate 16, the organic material deposition source 32 is linearly moved in the opposite direction again to prepare for the deposition process on the second substrate 20.
  • the organic particles are deposited on the first substrate 16 and the second substrate 20 is loaded in the second radial direction to be seated on the second substrate loading part 30 ( S500).
  • the second substrate 20 may be seated on the second substrate loading part 30 during the deposition process on the first substrate 16, thereby reducing the tack time, and the second substrate during the deposition process on the first substrate 16.
  • the loading of 20 can be made to reduce the loss of organic material.
  • the shadow mask is disposed on the surface of the second substrate 20, and the second substrate 20 is aligned with the shadow mask.
  • the term “simultaneously” includes not only the same time, but also means that the deposition process of the first substrate 16 and the loading process of the second substrate 20 are overlapped.
  • the scanning unit moving unit 36 moves the scanning unit 34 to the second deposition region 24. (S600).
  • the scanning unit rotating means 38 rotates the scanning unit moving means 36 to its original position, and the scanning unit moving means 36 includes: As shown in FIG. The scanning unit 34 is moved to the second deposition region 24. In this process, as shown in FIG. 13, the first substrate 16 on which the organic material deposition is completed may be taken out of the process chamber 26 in the first radial direction.
  • the scanning unit rotating means 38 rotates the scanning unit moving means 36 so that the linear organic material deposition source 32 is parallel to one side of the second substrate 20 ( S700). Similar to the step of rotating the first substrate 16, the second substrate 20 is loaded in an inclined direction in the second radial direction with respect to the process chamber 26 to be seated on the second substrate loading part 30. Therefore, in order to deposit organic material on the second substrate 20 efficiently as the organic material deposition source 32 moves linearly against the surface of the substrate, the length direction of the organic material deposition source 32 and the second substrate 20 are increased. The scanning unit rotating unit 38 rotates the scanning unit moving unit 36 so that one side of the parallel sides thereof is parallel.
  • the scanning unit 34 linearly moves the organic material deposition source 32 to deposit organic particles on the second substrate 20 (S800). Since the organic material deposition source 32 linearly moves in the other side direction facing one side of the second substrate 20 to deposit organic material on the second substrate 20, the organic material deposition source 32 using the scanning unit 34. Will move linearly.
  • a new first substrate 16 ′ may be loaded onto the first substrate loading unit 28 in the first radial direction to be seated.
  • the new first substrate 16 ′ is seated on the first substrate loading portion 28, it is aligned with the shadow mask 40 and waits for the next deposition process.
  • the second substrate 20 on which the organic material deposition is completed is withdrawn from the process chamber 26 in the second radial direction, and a new second substrate is loaded on the second substrate. Loaded into the part 30 to be seated. Once the new second substrate is seated in the second substrate loading portion 30, it aligns with the shadow mask and waits for the next deposition process.
  • the deposition process is performed on a plurality of substrates in one chamber, and the tact time is reduced by performing a transfer process or an alignment process on another substrate during the deposition process of one substrate. It is possible to reduce the loss of organic material generated during the transfer process or the alignment process to the substrate.

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

L'invention porte sur un dispositif de dépôt de substance organique et sur un procédé de dépôt de substance organique l'utilisant. La présente invention concerne un dispositif de dépôt de substance organique et un procédé de dépôt l'utilisant, dans lesquels des processus de dépôt sont conduits par rapport à une pluralité de substrats à l'intérieur d'une chambre unique et, durant un processus de dépôt par rapport à un substrat, un processus de transfert ou un processus d'alignement par rapport à un autre substrat est conduit, réduisant ainsi un temps takt et réduisant une perte de matériaux de substance organique se produisant durant des processus pour transférer ou aligner des substrats.
PCT/KR2013/009960 2013-11-05 2013-11-05 Dispositif de dépôt de substance organique et procédé de dépôt de substance organique l'utilisant WO2015068866A1 (fr)

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KR1020130133604A KR20150051732A (ko) 2013-11-05 2013-11-05 유기물 증착 장치 및 이를 이용한 유기물 증착 방법
KR10-2013-0133604 2013-11-05

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KR102617955B1 (ko) * 2016-07-15 2023-12-26 주식회사 선익시스템 위치보정 및 윤활제 자동주입이 가능한 증착장치

Citations (3)

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Publication number Priority date Publication date Assignee Title
KR20100120081A (ko) * 2009-05-04 2010-11-12 삼성모바일디스플레이주식회사 유기물 증착 장치 및 증착 방법
KR101237507B1 (ko) * 2012-08-06 2013-02-26 주식회사 선익시스템 유기물 증착 장치 및 유기물 증착 방법
KR101239906B1 (ko) * 2012-08-06 2013-03-06 주식회사 선익시스템 유기물 증착 장치 및 이를 이용한 유기물 증착 방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100120081A (ko) * 2009-05-04 2010-11-12 삼성모바일디스플레이주식회사 유기물 증착 장치 및 증착 방법
KR101237507B1 (ko) * 2012-08-06 2013-02-26 주식회사 선익시스템 유기물 증착 장치 및 유기물 증착 방법
KR101239906B1 (ko) * 2012-08-06 2013-03-06 주식회사 선익시스템 유기물 증착 장치 및 이를 이용한 유기물 증착 방법

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