Classifications

• • H—ELECTRICITY
  • H03—ELECTRONIC CIRCUITRY
  • H03F—AMPLIFIERS
  • H03F1/00—Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
  • H03F1/30—Modifications of amplifiers to reduce influence of variations of temperature or supply voltage or other physical parameters
• • H—ELECTRICITY
  • H03—ELECTRONIC CIRCUITRY
  • H03F—AMPLIFIERS
  • H03F1/00—Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
  • H03F1/02—Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation
  • H03F1/0205—Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation in transistor amplifiers
  • H03F1/0211—Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation in transistor amplifiers with control of the supply voltage or current
  • H03F1/0216—Continuous control
  • H03F1/0222—Continuous control by using a signal derived from the input signal
• • H—ELECTRICITY
  • H03—ELECTRONIC CIRCUITRY
  • H03F—AMPLIFIERS
  • H03F1/00—Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
  • H03F1/02—Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation
  • H03F1/0205—Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation in transistor amplifiers
  • H03F1/0211—Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation in transistor amplifiers with control of the supply voltage or current
  • H03F1/0216—Continuous control
  • H03F1/0222—Continuous control by using a signal derived from the input signal
  • H03F1/0227—Continuous control by using a signal derived from the input signal using supply converters
• • H—ELECTRICITY
  • H03—ELECTRONIC CIRCUITRY
  • H03F—AMPLIFIERS
  • H03F1/00—Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
  • H03F1/32—Modifications of amplifiers to reduce non-linear distortion
  • H03F1/3241—Modifications of amplifiers to reduce non-linear distortion using predistortion circuits
• • H—ELECTRICITY
  • H03—ELECTRONIC CIRCUITRY
  • H03F—AMPLIFIERS
  • H03F1/00—Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
  • H03F1/32—Modifications of amplifiers to reduce non-linear distortion
  • H03F1/3241—Modifications of amplifiers to reduce non-linear distortion using predistortion circuits
  • H03F1/3294—Acting on the real and imaginary components of the input signal
• • H—ELECTRICITY
  • H03—ELECTRONIC CIRCUITRY
  • H03F—AMPLIFIERS
  • H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
  • H03F3/005—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements using switched capacitors, e.g. dynamic amplifiers; using switched capacitors as resistors in differential amplifiers
• • H—ELECTRICITY
  • H03—ELECTRONIC CIRCUITRY
  • H03F—AMPLIFIERS
  • H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
  • H03F3/189—High-frequency amplifiers, e.g. radio frequency amplifiers
• • H—ELECTRICITY
  • H03—ELECTRONIC CIRCUITRY
  • H03F—AMPLIFIERS
  • H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
  • H03F3/20—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers
  • H03F3/21—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only
• • H—ELECTRICITY
  • H03—ELECTRONIC CIRCUITRY
  • H03F—AMPLIFIERS
  • H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
  • H03F3/20—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers
  • H03F3/21—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only
  • H03F3/211—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only using a combination of several amplifiers
• • H—ELECTRICITY
  • H03—ELECTRONIC CIRCUITRY
  • H03F—AMPLIFIERS
  • H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
  • H03F3/20—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers
  • H03F3/24—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers of transmitter output stages
  • H03F3/245—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers of transmitter output stages with semiconductor devices only
• • H—ELECTRICITY
  • H03—ELECTRONIC CIRCUITRY
  • H03F—AMPLIFIERS
  • H03F2200/00—Indexing scheme relating to amplifiers
  • H03F2200/102—A non-specified detector of a signal envelope being used in an amplifying circuit
• • H—ELECTRICITY
  • H03—ELECTRONIC CIRCUITRY
  • H03F—AMPLIFIERS
  • H03F2200/00—Indexing scheme relating to amplifiers
  • H03F2200/111—Indexing scheme relating to amplifiers the amplifier being a dual or triple band amplifier, e.g. 900 and 1800 MHz, e.g. switched or not switched, simultaneously or not
• • H—ELECTRICITY
  • H03—ELECTRONIC CIRCUITRY
  • H03F—AMPLIFIERS
  • H03F2201/00—Indexing scheme relating to details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements covered by H03F1/00
  • H03F2201/32—Indexing scheme relating to modifications of amplifiers to reduce non-linear distortion
  • H03F2201/3206—Multiple channels are combined and amplified by only one amplifier
• • H—ELECTRICITY
  • H03—ELECTRONIC CIRCUITRY
  • H03F—AMPLIFIERS
  • H03F2203/00—Indexing scheme relating to amplifiers with only discharge tubes or only semiconductor devices as amplifying elements covered by H03F3/00
  • H03F2203/20—Indexing scheme relating to power amplifiers, e.g. Class B amplifiers, Class C amplifiers
  • H03F2203/21—Indexing scheme relating to power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only
  • H03F2203/211—Indexing scheme relating to power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only using a combination of several amplifiers
  • H03F2203/21181—Indexing scheme relating to power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only using a combination of several amplifiers the supply current of a power amplifier being continuously controlled, e.g. by controlling current sources or resistors
• • H—ELECTRICITY
  • H03—ELECTRONIC CIRCUITRY
  • H03F—AMPLIFIERS
  • H03F2203/00—Indexing scheme relating to amplifiers with only discharge tubes or only semiconductor devices as amplifying elements covered by H03F3/00
  • H03F2203/20—Indexing scheme relating to power amplifiers, e.g. Class B amplifiers, Class C amplifiers
  • H03F2203/21—Indexing scheme relating to power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only
  • H03F2203/211—Indexing scheme relating to power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only using a combination of several amplifiers
  • H03F2203/21184—Indexing scheme relating to power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only using a combination of several amplifiers the supply current of a power amplifier being continuously measured, e.g. by a resistor, a current mirror, to produce a controlling signal
• • H—ELECTRICITY
  • H03—ELECTRONIC CIRCUITRY
  • H03F—AMPLIFIERS
  • H03F2203/00—Indexing scheme relating to amplifiers with only discharge tubes or only semiconductor devices as amplifying elements covered by H03F3/00
  • H03F2203/20—Indexing scheme relating to power amplifiers, e.g. Class B amplifiers, Class C amplifiers
  • H03F2203/21—Indexing scheme relating to power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only
  • H03F2203/211—Indexing scheme relating to power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only using a combination of several amplifiers
  • H03F2203/21193—Indexing scheme relating to power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only using a combination of several amplifiers the supply voltage of a power amplifier being continuously controlled, e.g. by an active potentiometer

Definitions

• the present invention relates to envelope tracking systems having an RF input path to a signal input of a power amplifier and an envelope path to a supply input of a power amplifier.
• envelope tracking systems may be utilised in cellular systems or WiFi systems for example.
• Envelope tracking power amplifier systems are known in the art, and generally comprise the provision of an input signal to be amplified on an RF input path to a signal input of a power amplifier, and an envelope path for generating a modulated power supply based on the input signal, with the modulated power supply being provided to a powe supply input of the power amplifier.
• FIG. 1(a) An exemplary prior art envelope tracking power amplifier system is illustrated in Figure 1(a) .
• a signal to be amplified in this example being a complex signal having I and Q components , is generated by a source block 108.
• the signal to be amplified is provided to a delay block 106 which provides a delay alignment .
• the output of the delay block 106 provides a signal to the RF input path and a signal to the envelope path .
• the signal in the RF input path is provided to an RF up-conversion block 104 which converts the input signal to an RF signal, and then provides the input to a power amplifier 102.
• the envelope path receives the signal from the delay block 106 in a envelope detector block 11 , which detects the envelope of this signal.
• the thus detected envelope is provided to an envelope shaping block 112 which shapes the envelope, and the output of the envelope shaping block 112 is delivered to a supply modulator 110.
• the output of the supply modulator 110 provides the modulated supply voltage to a supply terminal of the power amplifier 102.
• the output of the power amplifier 102 provides an RF output signal .
• the delay block 106 provides delay adjustment to maintain precise timing alignment between the RF signal in the input path applied to the input of the power amplifier 102 and the modulated power sup ly voltage applied to the supply terminal of the power amplifier 102.
• the envelope shaping block 112 comprises a shaping table and implements an envelope shaping function, and may be provided in order to remove signal troughs from the signal in the envelope path .
• RF linearisation of the circuit of Figure 1(a) may be achieved by adjusting the envelope shaping function of the envelope shaping block 112.
• Figure 1 (b) represents an alternative implementation of a prior art envelope tracking power amplifier system.
• the system of Figure 1 (b) corresponds to the system of Figure 1(a), and like reference numerals are used to illustrate similar elements.
• Figure 1(b) but additionally includes a DPD (digital pre-distortion) block 116 positioned between the output signal of the delay block 106 and the input of the RF up-conversion block 104.
• the DPD block 116 provides pre- distortion of the RF waveform and acts in addition to or alternatively to the envelope shaping function 112, to achieve RF linearization of the system.
• the pre-distortion of the complex signal occurs after the point at which the envelope is detected.
• Figure 1(c) illustrates a further modification to the arrangement of Figure 1(a) for a prior art envelope tracking power amplifier system .
• the system of Figure 1(c) corresponds to the system of Figure 1 (a) , and like reference numerals are used to illustrate similar elements .
• a DPD block 118 is connected between the output of the source block 108 and the input to the delay block 106.
• pre-distortion is applied before the point at which the envelope is detected.
• This pre-di stortion function provided by the DPD block 118 either alternatively to or additional to the envelope shaping block 112 , achieves RF linearization of the system.
• Prior art envelope tracking systems maintain a 1 : 1 relationship between the instantaneous supply voltage applied to the power amplifier and the instantaneous envelope of the RF input signal applied to the power amplifier . That is, for each value of the envelope of the RF input there is one corresponding value of supply voltage.
• a DPD block needs only to be one-dimensional and receive only a signal representing the signal input to the power amplifier .
• the operation of the non-linear envelope detection operation provided by the envelope detector block 114 increases the bandwidth of the signal in the envelope path .
• the supply modulator bandwidth i.e. the bandwidth in the envelope path, is chosen to be 1.5 to 3 times the bandwidth of the RF path.
• the maximum bandwidth an envelope tracking system can support is typically determined by the design of the supply modulator 110.
• the maximum current and vol age signal slew rate the supply modulator can support without introducing significant distortion typically determines the maximum bandwidth of the envelope tracking system.
• the maximum RF bandwidth required for the RF input path of most current cellular systems is 20MHz, but it is expected that this will rise to 40MHz or higher in future systems.
• Future iFi systems such as 802. llac will be required to support an RF ( radio frequency) bandwidth in the input path of up to 160MHz .
• the bandwidth of the supply modulator and the RF to envelope delay matching requirements can be significantly reduced by using partial envelope tracking. This requires a reduced bandwidth supply reference signal to be generated in the envelope path, subject to the constraint that the instantaneous voltage of the supply reference signal must be greater than the instantaneous voltage of the full bandwidth RF envelope signal at all times in order to provide sufficient supply voltage to amplify the input signal in the power amplifier 102.
• Figure 2 illustrates a plot of voltage supply against time for a envelope signal having a reduced bandwidth and for an envelope signal ha i g a full (normal) bandwidth .
• Reference numeral 202 identifies the supply voltage for a reduced bandwidth envelope signal
• reference numeral 204 illustrates the supply voltage for a full bandwidth envelope signal .
• the invention provides an envelope tracking power amplifier system comprising an RF path and an envelope path, the envelope path comprising : a plurality of envelope detectors for detecting the envelope of a plurality of contiguous frequency bands of an input signal and each generating an output signal; and a combiner for combining the output of the envelope detectors .
• the envelope path may further comprise a corresponding plurality of filters each adapted to receive the input signal and for generating inputs to the envelope detectors of a specific equency band .
• Each envelope detector may be adapted to receive an input signal of a specific frequency band.
• the input signal may provide an input to an RF amplifier, and further comprising envelope processing circuitry for providing an input to a modulator providing a modulated power supply to the RF amplifier based on the combined output of the envelope detectors .
• the envelope processing circuitry may include an envelope shaping block.
• the envelope tracking power supply may further comprise a digital p e-disto t ion block arranged to receive a signal representative of a powe amplifier input a d a signal representative of the power ampl i ier supply voltage .
• the digital pre-distortion block may be provided in the input path .
• the digital pre-disto tion block may provide an input to the power amplifier.
• the envelope tracking powe supply may further comprise a delay block for aligning the power amplifier supply voltage and the power amplifier input voltage .
• the delay block applies a delay to the signal in the input path .
• the invention also provides an envelope tracking power amplifier system comprising an RF input path and an envelope path for providing a modulated powe amplifier supply, further comprising : a plurality of envelope detectors for detecting the envelope of a plurality of frequency bands of an input signal and each generating an output signal; a combiner for combining the output of the envelope detectors to provide a composite envelope signal; and a digital pre-distortion block arranged to receive a signal representative of a power amplifier input and a signal representative of the powe amplifier supply voltage .
• the digital pre-distortion block may be provided in the input path .
• the digital pre-distortion block may provide an input to the power ampl i bomb .
• the envelope tracking power amplifier may further comprise envelope processing circuitry for providing a input to a modulator providing a modulated power supply to the RF arcpi i ier based on the composite envelope signal.
• the envelope process ing circuitry may include an envelope shaping block .
• the digital pre-distortion block may receive a shaped composite envelope signal and the input signal.
• the envelope tracking powe amplifier may further comprise : a plurality of input paths each for receiving an input signal of a particular requency; and a combiner for combining the signals on the inputs paths and for providing the combined input signals to the digital re-distortion block.
• the envelope tracking power suppl may further comprise a delay block for aligning he power amplifier suppl voltage and the power ampl i bomb input voltage .
• the delay block may ap ly a delay to the signal in the input path .
• the envelope tracking power amplifier may further comprise : a plurality of input paths each for receiving an input signal of a particular frequency; a plurality of digital pre-distortion blocks arranged to receive a signal representative of a powe amplifier input in the respective input path and the signal representative of the power amplifier supply voltage; and a plurality of power amplifiers each for receiving an input signal in the respective input path; wherein the power supply for each of the plurality of power amplifiers is provided in dependence on the composite envelope signal.
• the envelope tracking power supply may further comprise a delay block in each of the plurality of input paths for aligning the power amplifier suppl voltage and the respective power amplifier input voltage in each input path .
• the invention further provides an envelope tracking power amplifier comprising: a plurality of envelope detectors for detecting the envelope of a plurality of frequency bands of an input signal and each generating an output signal ; a combiner for combining the output of the envelope detectors to provide a composite envelope signal ; and a plurality of input paths each for receiving an input signal of a particular frequency; a plurality of digital pre-distortion blocks arranged to receive a signal representative of a power amplifier input in the respective input path and the signal representative of the power amplifier supply voltage ; and a plurality of power amplifiers each for receiving an input signal in the respective input path; where n the power supply for each of the plurality of power amplifiers is provided in dependence on the composite envelope signal .
• the invention further provides a method adapted to perform the functions of a y defined apparatus .
• Figures 1(a) to 1(c) illustrate prior art implementations of an envelope tracking power amplifier system for achieving RF linearisation
• Figure 2 illustrates the waveforms of a modulated supply voltage for a reduced envelope path bandwidth and for a full envelope path bandwidth
• Figure 3 illustrates an implementation of an envelope tracking power amplifier system having a reduced e velope bandwidth and a two-dimensional DPD element to achieve RF linearisation
• Figures 4(a) to 4(d) illustrate the principle of generating sub-band signals in accordance with arrangements
• Figures 5(a) and 5(b) illustrate the implementation o circuitry in the envelope path to reduce the bandwidth of the envelope signal in accordance with arrangements i which a source signal is divided into sub-bands;
• Figures 6(a) and 6(b) illustrate circuit y in the envelope path to generate a signal of reduced bandwidth in dependence upon the carrier signals being generated separately .
• a two-dimensional DPD block receives a signal representing the instantaneous supply input to the power amplifier and a signal representing the signal input to the power amplifier .
• FIG. 3 An implementation of an envelope tracking power amplifier system incorporating a two-dimensional DPD block is illustrated in Figure 3.
• a two- dimensional DPD block is identified by reference numeral 302 , and is located between the output of the delay block 106 and the input to the RF up-conversion block 10 .
• the two- dimensional DPD block in this arrangement has two inputs ⁇ referring to its t o dimensions ) , so that in addition to receiving the output of the delay block 106 on a line 304 (as in Figure 1(a)), the DPD block additionally receives as a second input the output of the envelope shaping block 112 on a line 306.
• FIG. 3 Additionally illustrated in Figure 3 is a block 308 which applies a bandwidth reduction in the envelope path in accordance with prior art techniques , which is connected between the output of the envelope detector 114 and the input of the e velo e shaping table 112.
• Figure 4(a) illustrates a plot of amplitude against frequency for the spectrum of input IQ signal .
• the signal has a frequency spectrum deviation which extends from -Fm/2 to Fm/2 as denoted by reference numerals 402 and 404 respectively .
• the spectrum of a given signal will be symmetrical about zero Hz.
• the spectrum has an amplitude denoted by reference numeral 406 in Figure 4(a).
• Figure 4 (b) illustrates a plot of amplitude against frequency for the spectrum of the reference signal in the envelope path resulting from such an input signal spectrum. This is the spectrum of the signal of Figure 4(a) after envelope detectio .
• the mathematical operation of the envelope detector results in a signal of a larger bandwidth .
• this signal has a bandwidth which extends to a point on the frequency axis denoted by reference numeral 412, which is well in excess of the frequency Fm denoted by reference numeral 410.
• the bandwidth of this signal extends from a point 408 representing a zero frequency to the point 412, which is in excess of the frequency Fm denoted by point 410.
• this signal has an amplitude of value denoted b reference numeral 414 until the frequency Fm, and then after frequency Fm the amplitude of this signal drops significantly until it gradually approaches zero at the frequency denoted by reference numeral 12.
• the bandwidth (»Fm) of the envelope signal as shown in Figure 4 (b) is greater than the bandwidth (Fm) of the input signal as shown in Figure 4 (a) .
• each spectrum signal has a amplitude as denoted by reference numeral 424.
• a first sub-band has a spectrum which extends from a frequency -Fm/2 as denoted by reference numeral 416 to zero as denoted by reference numeral 418.
• a second sub-band has a band with which it extends from frequency zero as denoted by reference numeral 418 to a frequency Fm/2 as denoted by reference numeral 420.
• Figure 4 (b) illustrates the envelope spectrum of the signals associated with these two sub-bands in the envelope path after they are applied to the envelope detector.
• each sub-band has its own spectrum. It can be assumed that the spectrum denoted by plot 420 corresponds to the first sub-band and the spectrum, denoted by plot 428 corresponds to the second sub-band .
• the respective sub-bands 420 and 428 have respective amplitudes denoted by reference numerals 438 and 440 at a zero frequency denoted by reference numeral 430, which amplitude generally extends to e frequency Fm/2 denoted by reference numeral 432.
• reference numerals 438 and 440 will be the same, and they are shown at different levels in Figure 4(d) for illustration purposes.
• the amplitude of the respective spectrum significantly drops, such that the amplitude then decreases gradually towards zero, the amplitude of the spectrum, denoted by plot 420 approaching an amplitude of zero as denoted by reference nume al 434 on the frequency axis, and the amplitude of plot 428 approaching zero as represented by the reference numeral 436 on the frequency axis .
• each of the sub- bands overlay one another.
• the envelope spect um of each of the sub-band signals is independent of its carrier f equency.
• the bandwidth of the sub-band envelope spectrums are 1/n of the bandwidth of the full bandwidth of the e velope signal, in this case Fin/2. This can be seen in Figure 4(d) .
• a reduced bandwidth reference signal can be calculated as the sum of the individual sub-band envelope signals. This signal has the same bandwidth as each of the sub-band envelopes, and furthermore meets the essential criteria that the reduced bandwidth envelope signal always has an amplitude greater than the full bandwidth envelope signal : adding together the spectra of the two sub-bands if Figure 4(d), for example, gives an amplitude of the amplitude 433 plus the amplitude 440, which will exceed the amplitude 424. This is shown in Figure 2, in which the amplitude of the reduced bandwidth envelope 202 is always greater than the amplitude of the full bandwidth envelope 204.
• FIG. 5(a) An example implementation of an envelope tracking power amplifier in accordance with these principles is illustrated in Figure 5(a) .
• Like reference numerals are used to illustrate components which correspond to components of earlier figures .
• the envelope detection block 502 comprises a plurality of sub-band filters which will correspond to the number of sub-bands the baseband signal is being divided up into .
• the baseband signal is being divided into n sub-bands , and thus a first sub-band filter 508i and a n th sub-band filter 508 n are illustrated. It will be apparent that the number of sub-band filters corresponds to the number of sub-bands .
• the plurality of envelope detectors detect the envelope of a plurality of contiguous f equency bands of the input signal .
• each sub-band filter provides an input to a envelope detection block.
• the output of sub-band filter 508i provides an input to an envelope detection block 506i
• the output of sub-band filte 508 n provides an input to an envelope detection block 506 n .
• the number of envelope detection blocks corresponds to the number of sub-band filters, and in turn corresponds to the number of sub-bands the baseband signal is divided into .
• each envelope detection block in the example of Figure 5(a) the output of e velope detection blocks 506i to 506n, are combined in a combiner 504 which generates at its output the combined outputs of the envelope detection blocks .
• the combined output of the output of the combiner 504 is provided as an input to the e velope shaping function 112.
• OFDM is a modulation method favoured for many current a d future communication systems , on account o its high spectral efficiency and multi-path immunity.
• OFDM comprises a large number (denoted N) of narrow sub-carriers, each of which is modulated at a relatively slow rate.
• N is typically chosen to be a power of 2, to allow efficient computation of the modulation using inverse fast Fourier transforms (FFTs) .
• FFTs inverse fast Fourier transforms
• I f n is also chosen to be a power of 2 (typical 2 or 4) then the sub-band envelopes can be efficiently calculated by sharing hardware already required to calculate the full bandwidth signal .
• Figure 5(b) illustrates an implementation in which hardware can be shared in this way .
• Figure 5(b) illustrates an alternative implementation, in which the input signal for the envelope path is generated directly from the baseband. Again, like re erence numerals are used in Figure 5(b) to identify elements which correspond to elements of earlier Figures .
• the source block 108 and delay block 106 are adapted to generate the signal to the two dimensional DPD block 302 on line 304and to produce sub-band envelop signals .
• the envelope path obtains a signal directly from the baseband .
• the source block 108 of Figure 5(a) is replaced in Figure 5(b) by a baseband modulator denoted by reference numeral 512 , which may be an orthogonal frequency division multiplexing (OFDM) modulator including multiple sub-band outputs .
• OFDM orthogonal frequency division multiplexing
• the baseband modulator 512 includes a block 514 for generating a continuous full band signal to the delay alignment block 106.
• the modulator includes blocks 516i to 516 n which generate discrete sub-band signals, corresponding to the number of sub-bands the baseband signal is divided into, t e composite of which is a signal of contiguous frequency signals .
• Each sub-band block 516i to 516 n generates a signal to a respective en elope detector 518i to 518 n .
• the outputs of he envelope detectors 518i to 518 n are combined by the combiner 520 to generate a signal for the envelope sha ing function 112.
• the plurality of envelope detectors detect the envelope of a plurality of contiguous frequency bands of the input signal .
• the envelope bandwidth reduction technique described abo e allows a large reduction in envelope path bandwidth . For example, if four sub-bands are sed the envelope bandwidth is reduced to 1/4 that of a conventional full bandwidth envelope tracking system. However, the average voltage of the reduced bandwidth supply voltage is higher than that of a full bandwidth system, resulting in less envelope tracking efficiency improvement . It should be noted, however, that useful efficiency enhancement may still be obtained with bandwidth reduction factors of 4 or e en 8 for signals using high order carrier modulation (e.g. 256 QAM) , exhibiting ve y high PAPR (peak to average powe ratio) , such as 802. llac MCS9.
• high order carrier modulation e.g. 256 QAM
• PAPR peak to average powe ratio
• the envelope spectrum of each of the sub- band signals is independent of its carrier frequency .
• the technique is not restricted to envelope bandwidth reduction for contiguous wideband signals, but can be used to generate a modulated supply for two or more independent frequency separated carriers , such as may be present in LTE ( long-term evolution ) carrier aggregation.
• the resulting supply bandwidth is that of the highest bandwidth carrier irrespective of the carrier separation.
• Figures 6(a) and 6 (b) illustrate exempla y implementations of the foregoing techniques applied to a envelope tracking power amplifier system in which independent frequency separated carriers are utilized, rathe than a composite signal of contiguous frequency bands .
• reference numerals are used in the Figures to refer to elements which correspond to elements shown in earlier Figures .
• the delay block 106 receives one input which is the signal to be amplified.
• the envelope path directly receives an envelope signal.
• discrete independent carrier signals are generated by discrete independent carrier signal generation blocks denoted by reference numerals 602i to 602 n . It is assumed in this example that n carrier signals may be generated.
• the output of each carrier generation block 602 i to 602 n is provided to a combiner 608, which generates on its output a combined signal to the delay block 106.
• each discrete carrier generation block 602 i to 602 n is input to a respective envelope detection block 604 i to 604 n ⁇
• the output of each envelope detection block 604 i to 604 n is combined by a combiner 606, which generates a combined output signal to the envelope shaping function 112 .
• Figure 6(a) provides a system architecture in which a single wideband power amplifier is used to amplify the independent carriers .
• the bandwidth of he two dimensional DPD block 302 must be sufficiently high to accommodate all the car ier frequencies.
• the architecture as illustrated in Figure 6(a) is best suited to intra-band carrier aggregation where the carrier separation between the independent carrier frequencies is relatively small .
• Figure 6 (b) illustrates a alternative implementation, in which multiple power amplifiers are used rather than a single power amplifier .
• a single envelope path for he multiple power amplifiers is used in combination with multiple RF input paths .
• n power amplifiers representative of an example of multiple power amplifiers being provided.
• the RF input pa hs whilst being multiple RF input paths, correspond in their functionality to the input paths of foregoing Figures, and thus the DPD block, the RF up- conversion block and the power amplifier are denoted by subscripts .
• a first RF input path comprises a DPD block 302i, and an RF up-convers ion block 104i, and a power amplifier 102 i .
• a further RF input path denoted to be the nth RF input path, comprises a DPD block 302 n , an RF up-conversion block 1 04 rw and a power amplifier 102 n .
• the outputs of the power amplifiers 1 02 i to 102 n are combined in a combiner 610 to provide a single output signal.
• the carrier provided by the carrier generation block 602i provides an input signal to a delay alignment block 1 06 i , which provides an input to t e DPD block 302 i .
• An nth carrier generation block 602 n provides an input to a delay alignment block ⁇ , which provides an input to the DPD block 302 n .
• the carrier generation block 602 i to 602 n generate inputs to respective envelope detection blocks 604 i to 604 n , which are combined in the combiner 606 to provide an input to the envelope shaping function 1 12 .
• Figure 6(b) illustrates an architecture in which a single modulator is used to provide a single modulated supply to two simultaneously active power amplifiers , which may have large carrier frequency separation .
• the DPD bandwidth requirement for this variant is no greater than that required for a conventional one dimensional DPD solution .
• the envelope tracking system described herein may be utilized in a number of diffe ent applications.
• the e velope tracking system may be implemented in a cellular system or a iFi system, such as in a wireless handset or infrastructure element of a wireless system.

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