WO2015049927A1 - コネクタ装置及び通信システム - Google Patents
コネクタ装置及び通信システム Download PDFInfo
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- WO2015049927A1 WO2015049927A1 PCT/JP2014/071706 JP2014071706W WO2015049927A1 WO 2015049927 A1 WO2015049927 A1 WO 2015049927A1 JP 2014071706 W JP2014071706 W JP 2014071706W WO 2015049927 A1 WO2015049927 A1 WO 2015049927A1
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- connector device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
- H01P5/087—Transitions to a dielectric waveguide
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
- H01P5/022—Transitions between lines of the same kind and shape, but with different dimensions
- H01P5/024—Transitions between lines of the same kind and shape, but with different dimensions between hollow waveguides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
- H01P5/10—Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced lines or devices with unbalanced lines or devices
- H01P5/107—Hollow-waveguide/strip-line transitions
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/38—Impedance-matching networks
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B3/00—Line transmission systems
- H04B3/02—Details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B5/00—Near-field transmission systems, e.g. inductive or capacitive transmission systems
- H04B5/20—Near-field transmission systems, e.g. inductive or capacitive transmission systems characterised by the transmission technique; characterised by the transmission medium
- H04B5/24—Inductive coupling
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B5/00—Near-field transmission systems, e.g. inductive or capacitive transmission systems
- H04B5/70—Near-field transmission systems, e.g. inductive or capacitive transmission systems specially adapted for specific purposes
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B5/00—Near-field transmission systems, e.g. inductive or capacitive transmission systems
- H04B5/70—Near-field transmission systems, e.g. inductive or capacitive transmission systems specially adapted for specific purposes
- H04B5/72—Near-field transmission systems, e.g. inductive or capacitive transmission systems specially adapted for specific purposes for local intradevice communication
Definitions
- the present disclosure relates to a connector device and a communication system.
- a dielectric waveguide having a dielectric block in which the entire surface other than the input / output portion of the signal is covered with a conductor film and a slot perpendicular to the traveling direction is formed on the bottom surface is used.
- a dielectric waveguide-microstrip conversion structure fixed on a circuit board via a spacer has been used (see, for example, Patent Document 1).
- the dielectric waveguide-microstrip conversion structure described in Patent Document 1 requires a reflector on the side opposite to the traveling direction, and requires a spacer, which makes it difficult to reduce the size. Also, the number of parts increases.
- This disclosure is intended to provide a connector device and a communication system that have a small number of parts and can be miniaturized.
- a connector device of the present disclosure includes: A waveguide cable; A substrate having a waveguide structure; A coupling for electromagnetically coupling the end of the waveguide cable and the waveguide structure; It is the composition provided with.
- a communication system of the present disclosure for achieving the above object is as follows.
- Comprising Connector device A waveguide cable;
- the waveguide mode is coupled between the substrate and the waveguide cable.
- the electromagnetic field can move smoothly because the electric field distribution is the same.
- the structure of the coupling portion for electromagnetically coupling the end portion of the waveguide cable and the waveguide structure can be simplified, the number of parts is small, and the size can be reduced.
- the waveguide mode is coupled between the substrate and the waveguide cable, it is possible to provide a connector device and a communication system that have a small number of components and can be miniaturized.
- the effects described here are not necessarily limited, and any of the effects described in the present specification may be used.
- the effect described in this specification is an illustration to the last, Comprising: It is not limited to this, There may be an additional effect.
- FIG. 1A is a block diagram illustrating an example of a configuration of a communication system to which the technology of the present disclosure is applied
- FIG. 1B is a block diagram illustrating an example of a specific configuration of a transmission unit and a reception unit in the communication system. is there.
- FIG. 2 is a perspective view illustrating a schematic configuration of the connector device according to the embodiment of the present disclosure.
- FIG. 3 is a cross-sectional view showing a cross-sectional structure of the connector device according to the present embodiment along the x direction of FIG.
- FIG. 4 is a perspective view showing an example of the configuration of the waveguide structure of the printed circuit board.
- 5A is a perspective view showing the top surface structure of the substrate, and FIG.
- FIG. 5B is a perspective view showing the top surface structure of the substrate in a state where the lower part of the ridge waveguide is mounted.
- 6A is a perspective view showing a lower portion of the ridge waveguide in an inverted state
- FIG. 6B is a perspective view showing an upper portion and a lower portion of the ridge waveguide in an inverted state.
- 7A is a cross-sectional view showing a cross-sectional structure of a monolithic ridge waveguide having ridges on both upper and lower sides
- FIG. 7B is a perspective view showing a cross-sectional structure of a dielectric-filled rectangular waveguide.
- FIG. 8 is a characteristic diagram showing coupling characteristics when a dielectric waveguide-microstrip line conversion structure is adopted.
- FIG. 9 is a characteristic diagram showing the coupling characteristics of the connector device according to the present embodiment that employs a coupling structure between waveguide modes.
- FIG. 10 is an enlarged cross-sectional view showing the structure along the x direction between the microstrip line and the waveguide structure in FIG.
- FIG. 11 is a characteristic diagram showing a coupling characteristic between the microstrip line and the impedance converter.
- FIG. 12 is a characteristic diagram showing coupling characteristics when a dielectric-filled rectangular waveguide is used instead of the ridge waveguide.
- FIG. 13 is a cross-sectional view illustrating the shape of the insertion opening of the metal guide according to the first modification.
- FIG. 14 is a perspective view illustrating the outline of the configuration of the connector device according to the second modification.
- 15 is a cross-sectional view showing a cross-sectional structure of a connector device according to Modification 2 along the y direction of FIG.
- FIG. 16 is a characteristic diagram illustrating the coupling characteristics of the connector device according to the second
- a communication system that transmits electromagnetic waves, particularly high-frequency signals such as microwaves, millimeter waves, and terahertz waves, using a waveguide as a medium is used to transmit signals between various devices such as electronic devices, information processing devices, and semiconductor devices. It is suitable for transmission and transmission of signals between circuit boards in one device (equipment).
- a waveguide for transmitting a high-frequency signal is called a waveguide cable because it has a function as a cable for connecting devices and circuit boards.
- millimeter waves are radio waves having a frequency of 30 [GHz] to 300 [GHz] (wavelengths of 1 [mm] to 10 [mm]).
- Gbps for example, 5 [Gbps] or more
- signals that require high-speed signal transmission in the Gbps order include data signals such as movie images and computer images.
- signal transmission in the millimeter wave band is excellent in interference resistance, and there is an advantage that it is not necessary to disturb other electric wiring in cable connection between devices.
- the waveguide structure may be configured by a dielectric substrate integrated waveguide (SIW).
- SIW dielectric substrate integrated waveguide
- the connector device and the communication system of the present disclosure can be configured by a printed board having conductor layers formed on both main surfaces of the dielectric.
- the waveguide structure was formed by two conductor layers formed on both main surfaces of the printed circuit board, and opposed to the main surface along the traveling direction of the electromagnetic wave. It can be set as the structure which consists of two conductor walls.
- the two conductor walls can be formed by continuously arranging columnar conductors in addition to the configuration formed by a single plate-like conductor.
- the columnar conductor can be configured by vias that electrically connect two conductor layers formed on both main surfaces of the printed circuit board.
- the coupling portion includes a through hole that penetrates the conductor layer on one main surface of the printed circuit board, and the waveguide passes through the through hole.
- the cable end and the waveguide structure can be electromagnetically coupled.
- the through-hole can be constituted by a slot formed between two conductor walls in a direction perpendicular to the traveling direction of the electromagnetic wave.
- vertical includes not only strictly vertical but also substantially vertical, and the presence of various variations in design or manufacturing is allowed.
- the coupling portion includes a ridge waveguide disposed between the through hole and the end portion of the waveguide cable. can do.
- the coupling portion may be configured to have a dielectric-filled rectangular waveguide (a rectangular waveguide in which a dielectric is filled in the tube).
- the waveguide cable is configured to be a dielectric waveguide cable in which a dielectric is filled in the waveguide. Can do.
- the coupling portion may be configured to hold the waveguide cable in parallel with the substrate.
- parallel includes not only strictly parallel but also substantially parallel, and the presence of various variations in design or manufacturing is allowed.
- the coupling portion may be configured to hold the waveguide cable perpendicular to the substrate.
- vertical includes not only strictly vertical but also substantially vertical, and the presence of various variations in design or manufacturing is allowed.
- the connector device and the communication system of the present disclosure including the above-described preferable configuration may include a guide member that connects the waveguide cable while positioning the waveguide cable with respect to the coupling portion. At this time, it can be set as the structure which has an insertion port into which a waveguide cable is inserted about a guide member.
- the width of the inner wall of the insertion port is set wider than the width of the electromagnetic wave path of the coupling portion, and the inner wall of the insertion port has a tapered shape in which the width gradually decreases from the outside toward the coupling portion. be able to.
- the waveguide structure of the substrate is connected to a micro strip line (MSL) via an impedance conversion unit. It can be configured.
- FIG. 1A is a block diagram illustrating an example of a configuration of a communication system to which the technology of the present disclosure is applied
- FIG. 1B is a block diagram illustrating an example of a specific configuration of a transmission unit and a reception unit in the communication system. is there.
- the communication system 1 includes a transmission unit 10 that transmits a high-frequency signal, a reception unit 20 that receives a high-frequency signal, and a transmission unit 10 and a reception unit 20. And a waveguide cable 30 for transmitting a high-frequency signal.
- the waveguide cable 30 may be configured with a hollow waveguide or may be configured with a dielectric waveguide.
- the high-frequency signal is a millimeter-wave band signal (millimeter-wave communication)
- millimeter-wave communication there are the following advantages. a) Since the millimeter wave communication can take a wide communication band, it is easy to increase the data rate. b) The frequency used for transmission can be separated from the frequency of other baseband signal processing, and interference between the millimeter wave and the frequency of the baseband signal hardly occurs. c) Since the millimeter wave band has a short wavelength, the waveguide structure determined according to the wavelength can be made small. In addition, electromagnetic shielding is easy because the distance attenuation is large and the diffraction is small. d) In normal wireless communication, the stability of a carrier wave has strict regulations to prevent interference and the like.
- the transmission unit 10 performs a process of converting the transmission target signal into a millimeter-wave band signal and outputting the signal to the waveguide cable 30.
- the receiving unit 20 receives a millimeter-wave band signal transmitted through the waveguide cable 30 and performs processing for returning (restoring) the original signal to be transmitted.
- the transmission unit 10 is provided in the first communication device 100
- the reception unit 20 is provided in the second communication device 200.
- the waveguide cable 30 also transmits a high-frequency signal between the first communication device 100 and the second communication device 200.
- the transmission unit 10 and the reception unit 20 are combined and arranged as a pair.
- the signal transmission method between the first communication device 100 and the second communication device 200 may be a one-way (one-way) transmission method or a two-way transmission method. .
- the transmission unit 10 (first communication device 100) and the reception unit 20 (second communication device 200) are arranged within a predetermined range.
- the “predetermined range” is not limited as long as the high-frequency signal is a millimeter-wave band signal, so long as the millimeter-wave transmission range can be limited.
- a range in which the distance is shorter than the distance between communication devices used in broadcasting or general wireless communication corresponds to the “predetermined range”.
- the transmission unit 10 and the reception unit 20 are arranged within a predetermined range, as illustrated in FIG. 1A, separate communication devices (electronic devices), that is, the first communication device 100 and the second communication device.
- the transmission unit 10 and the reception unit 20 may be arranged on separate circuit boards in one electronic device. In the case of this form, one circuit board corresponds to the first communication device 100 and the other circuit board corresponds to the second communication device 200.
- the transmission unit 10 and the reception unit 20 are arranged on different semiconductor chips in one electronic device.
- one semiconductor chip corresponds to the first communication device 100 and the other semiconductor chip corresponds to the second communication device 200.
- positioned in the separate circuit part on the same circuit board can be considered.
- one circuit unit corresponds to the first communication device 100 and the other circuit unit corresponds to the second communication device 200.
- the first communication device 100 and the second communication device 200 for example, the following combinations can be considered.
- the combinations exemplified below are only examples, and are not limited to these combinations.
- the first communication device 100 When the second communication device 200 is a battery-powered device such as a mobile phone, a digital camera, a video camera, a game machine, or a remote controller, the first communication device 100 performs the battery charger, image processing, and the like. A combination of what is called a base station can be considered. Further, when the second communication device 200 is a device having an appearance such as a relatively thin IC card, the first communication device 100 may be a combination of card reading / writing devices. The card reading / writing device is further used in combination with an electronic device main body such as a digital recording / reproducing device, a terrestrial television receiver, a mobile phone, a game machine, or a computer. Further, in the case of application to an imaging device, for example, the first communication device 100 is on the main substrate side and the second communication device 200 is on the imaging substrate side, and signal transmission is performed within one device (device). It will be.
- a battery-powered device such as a mobile phone, a digital camera, a video camera, a
- the transmission unit 10 includes, for example, a signal generation unit 11 that processes a signal to be transmitted and generates a millimeter-wave band signal.
- the signal generation unit 11 is a signal conversion unit that converts a signal to be transmitted into a millimeter-wave band signal, and includes, for example, an ASK (Amplitude Shift Keying) modulation circuit. Specifically, the signal generation unit 11 generates a millimeter-wave band ASK modulation wave by multiplying the millimeter-wave band signal supplied from the oscillator 111 and the transmission target signal by the multiplier 112, and sets the buffer 113. The structure which outputs via is taken.
- a connector device 40 is interposed between the transmission unit 10 and the waveguide cable 30.
- the receiving unit 20 includes, for example, a signal restoring unit 21 that processes a millimeter-wave band signal given through the waveguide cable 30 and restores the original transmission target signal.
- the signal restoration unit 21 is a signal conversion unit that converts a received millimeter-wave band signal into an original signal to be transmitted, and includes, for example, a square (square) detection circuit. Specifically, the signal restoration unit 21 converts the millimeter waveband signal (ASK modulated wave) given through the buffer 211 into a signal to be transmitted by squaring with the multiplier 212 and outputs the signal through the buffer 213. Adopted.
- a connector device 50 is interposed between the waveguide cable 30 and the receiving unit 20.
- the waveguide cable 30 is configured with a waveguide structure that transmits millimeter waves while confining them in the waveguide, and has a characteristic of efficiently transmitting electromagnetic waves in the millimeter wave band.
- the waveguide cable 30 may be a dielectric waveguide configured to include a dielectric material having a specific dielectric constant in a certain range and a dielectric loss tangent in a certain range. .
- the “certain range” may be a range in which the relative permittivity and the dielectric loss tangent of the dielectric material are within a range in which a desired effect can be obtained.
- the characteristics of the dielectric waveguide are not determined only by the dielectric material itself, but the transmission path length and the millimeter wave frequency (wavelength) are also involved in determining the characteristics. Accordingly, the relative permittivity and dielectric loss tangent of the dielectric material are not necessarily clearly defined, but can be set as follows as an example.
- the relative permittivity of the dielectric material is about 2 to 10 (preferably 3 to 6), and the dielectric loss tangent is 0.00001. It is desirable to set it to about 0.01 to 0.01 (preferably 0.00001 to 0.001).
- the dielectric material satisfying such conditions include those made of acrylic resin, urethane resin, epoxy resin, silicone, polyimide, and cyanoacrylate resin.
- FIG. 2 is a perspective view illustrating the outline of the configuration of the connector device according to the embodiment of the present disclosure.
- the connector device 40 according to the present embodiment electromagnetically connects a waveguide cable 41, a substrate 42 having a waveguide structure, an end portion of the waveguide cable 41, and the waveguide structure. And a coupling portion 43 that is coupled to each other.
- the propagation direction (traveling direction) of the electromagnetic wave in the waveguide structure of the waveguide cable 41 and the substrate 42 is the x direction
- the direction perpendicular to the main surface of the substrate 42 is the y direction
- the width direction of the substrate 42 Is the z direction.
- FIG. 3 shows a cross-sectional structure of the connector device 40 according to the present embodiment along the x direction of FIG.
- the waveguide cable 41 corresponds to the waveguide cable 30 of FIG. 1 and is made of, for example, a dielectric waveguide in which a waveguide 411 is filled with a dielectric 412.
- the waveguide cable 411 is not limited to a dielectric waveguide, and may be a hollow waveguide or the like.
- the substrate 42 is a plate-like dielectric substrate, conductor layers 421 and 422 are formed on both principal surfaces (upper surface / lower surface) of the dielectric, and two conductor layers 423 and 424 are provided between both principal surfaces, for example.
- This is a printed circuit board having four formed conductor layers (wiring layers).
- the board 42 may be described as a printed board 42.
- the first conductor layer 421 from the top is used as a signal line
- the second and third conductor layers 422 and 423 are used as ground lines.
- the waveguide structure 44 of the printed circuit board 42 is made of a dielectric substrate integrated waveguide (SIW).
- FIG. 4 shows an example of the configuration of the waveguide structure 44 of the printed circuit board 42.
- the waveguide structure 44 made of SIW is formed in a region E where the second and third conductor layers 422 and 423 of the substrate 42 are removed. Specifically, the two conductor layers 421 and 422 formed on both main surfaces of the region E from which the second and third conductor layers 422 and 423 are removed, and perpendicular to the main surface, And it consists of two conductor walls 425 and 426 formed to face each other along the traveling direction of the electromagnetic wave (propagation direction / x direction).
- the waveguide structure 44 is a pseudo-conductor having functions equivalent to those of a rectangular waveguide, in which two conductor layers 421 and 422 are upper and lower conductor walls and two conductor walls 425 and 426 are left and right conductor walls. It becomes a wave tube structure.
- the two conductor walls 425 and 426 serving as the left and right conductor walls are columnar conductors, for example, two conductor layers 421 and 422 formed on both main surfaces of the substrate 42 and two conductors formed between both main surfaces.
- a via 441 that electrically connects the layers 423 and 424 is formed continuously.
- the via 441 is exemplified as the columnar conductor forming the two conductor walls, but the present invention is not limited to this.
- the two conductor walls are not limited to the configuration in which the columnar conductors are continuously arranged. For example, two plate-shaped conductors are opposed to each other along the traveling direction of the electromagnetic wave. It is also possible in principle to have a configuration of arrangement.
- the waveguide structure 44 of the substrate 42 is connected to a microstrip line (MSL) 46 through an impedance converter 45.
- MSL microstrip line
- the connector device 40 As the connector device 40 according to the present embodiment, a configuration in which the waveguide structure 44 is connected to the microstrip line 46 via the impedance converter 45 is illustrated. It is also possible to have a configuration that is not performed.
- a through hole 427 penetrating the conductor layer 421 is formed on one main surface of the substrate 42 (main surface / upper surface on the side where the waveguide cable 41 is disposed).
- the coupling portion 43 includes the through hole 427, and electromagnetically couples the end portion of the waveguide cable 41 and the waveguide structure 44 through the through hole 427.
- the through-hole 427 is a slot formed between two left and right conductor walls of the waveguide structure 44 in a direction perpendicular to the traveling direction of the electromagnetic wave in the waveguide structure 44. Consists of. Here, “vertical” includes not only strictly parallel but also substantially vertical, and the presence of various variations in design or manufacturing is allowed.
- the ridge waveguide 47 may have a structure having ridges on both upper and lower sides, or a structure having ridges on one upper and lower sides (one side).
- FIG. It is a perspective view which shows an upper surface structure.
- FIG. 5B shows an upper surface structure of the substrate 42 in a state where a lower portion 47L of a ridge waveguide 47 described later is mounted.
- the coupling portion 43 includes a ridge waveguide 47 disposed between the through hole (slot) 427 and the end portion of the waveguide cable 41.
- the ridge waveguide 47 performs electromagnetic conversion between the end of the waveguide cable 41 and the waveguide structure 44 while performing impedance conversion to match impedance between the waveguide cable 41 and the waveguide structure 44.
- the coupling portion 43 adopts a so-called horizontal waveguide structure that holds the waveguide cable 41 parallel to the substrate 42 when electromagnetically coupling while performing impedance conversion. ing.
- parallel includes not only strictly parallel but also substantially parallel, and the presence of various variations in design or manufacturing is allowed.
- the ridge waveguide 47 may have a structure having ridges on both upper and lower sides, or may have a structure having ridges on one upper and lower sides (one side).
- a ridge waveguide 47 having a structure having ridges 471 and 472 on both upper and lower sides is used.
- the ridge waveguide 47 is divided into an upper part 47U including an upper ridge 471 and a lower part 47L including a lower ridge 472.
- 6A is a perspective view showing a lower portion 47L of the ridge waveguide 47 in an inverted state
- FIG. 6B is a perspective view showing an upper portion 47U and a lower portion 47L of the ridge waveguide 47 in an inverted state.
- the ridge waveguide 47 is not limited to the one having the two-divided structure, and as shown in FIG. 7A, the upper 47U and the lower 47L can be integrated.
- FIG. 7A is a cross-sectional view showing a cross-sectional structure of an integral ridge waveguide having ridges 471 and 472 on both upper and lower sides.
- the ridge waveguide 47 is used as a member that is electromagnetically coupled while performing impedance conversion.
- the member is not limited to the ridge waveguide 47.
- a dielectric-filled rectangular waveguide 48 in which a dielectric 482 is filled in a tube 481 can be used.
- FIG. 7B is a cross-sectional view showing a cross-sectional structure of a dielectric-filled rectangular waveguide.
- the ridge waveguide 47 is accommodated in, for example, a metallic guide member (hereinafter referred to as “metal guide”) 49 that connects the waveguide cable 41 while positioning the waveguide cable 41 with respect to the coupling portion 43.
- metal guide a metallic guide member
- the lower portion 47L of the ridge waveguide 47 is formed integrally with a metal guide 49, for example.
- the upper portion 47U of the ridge waveguide 47 is assembled so that the ridges 471 and 472 are opposed to the lower portion 47L of the ridge waveguide 47 formed integrally with the metal guide 49. Become. At this time, the upper portion 47U of the ridge waveguide 47 is smaller than the lower portion 47L so that a communication hole 473 communicating with the inside of the ridge waveguide 47 is formed between the back surface and the inner surface of the metal guide 49. The width is narrow.
- the ridge waveguide 47 accommodated in the metal guide 49 is opposed to the through-hole 427 in which the communication hole 473 is formed in one main surface of the substrate 41 described above, particularly as shown in FIG. It is positioned with respect to the substrate 41 so as to communicate.
- the waveguide structure 44 of the substrate 41 is electromagnetically coupled to the end portion of the waveguide cable 41 through the path of the through hole 427 ⁇ the communication hole 473 ⁇ the ridge waveguide 47.
- the metal guide 49 has an insertion port 49A into which the waveguide cable 41 is inserted (coupled).
- the width W 1 of the inner wall of the insertion port 49A is set wider than the width of the electromagnetic wave path of the coupling portion 43, more specifically, the width W 2 of the inner wall of the ridge waveguide 47, as shown in FIG. 6B. Is done.
- the waveguide cable 41 can be inserted into and removed from the metal guide 49.
- the length L of the metal guide 49 to the ridge waveguide 47 is set to 1 ⁇ 4 of the wavelength of the electromagnetic wave (see FIG. 3).
- the connector device 40 includes the waveguide cable 41 made of a dielectric waveguide, the substrate 42 having the waveguide structure 44 made of SIW, and the end of the waveguide cable 41. And a coupling portion 43 including a ridge waveguide 47 that electromagnetically couples the portion and the waveguide structure.
- the waveguide mode is coupled between the substrate 42 and the waveguide cable 41.
- the waveguide modes are coupled, the electromagnetic field can move smoothly because the electric field distribution is the same.
- the waveguide modes are coupled to each other, it is possible to widen the band of propagating electromagnetic waves.
- a dielectric waveguide-microstrip line conversion structure in which a dielectric waveguide having a slot perpendicular to the traveling direction formed on the bottom surface is fixed on a circuit board via a spacer is adopted.
- the band of S11 ⁇ 10 dB is about 30% of the center frequency.
- the waveguide mode coupling structure is adopted, as shown in FIG. 9, the band of S11 ⁇ 10 dB can be widened to 50% or more of the center frequency.
- S11 and S22 are S-parameter reflection coefficients
- S21 is an S-parameter transmission coefficient.
- FIG. 10 shows an enlarged view of the structure along the x direction between the microstrip line 46 and the waveguide structure 44 in FIG.
- the first conductive layer 421 is a signal line
- the second conductive layer 423 is a ground line.
- the impedance conversion unit 45 the first conductive layer 421 to the third conductive layer 424 are used.
- the waveguide structure 44 the first conductive layer 421 and the fourth conductive layer 422 are vertically moved in the region E (see FIG. 4) where the second and third conductive layers 422 and 423 are removed.
- the two conductor walls 425 and 426 in which the vias 441 are continuously arranged become the left and right conductor walls.
- the coupling characteristics between the microstrip line 46 and the impedance converter 45 are shown in FIG.
- the structure of the coupling portion 43 that electromagnetically couples the end portion of the waveguide cable 41 and the waveguide structure 44 can be simplified.
- the connector device 40 since a reflecting plate and a spacer are not required and the ridge waveguide 47 is accommodated in the metal guide 49, the connector device 40 with a small number of components and capable of being miniaturized can be realized. . In the communication system 1 using the connector device 40, the system can be simplified.
- MSL-waveguide conversion can be performed by connecting the microstrip line (MSL) 46 to the waveguide structure 44 made of SIW via the impedance conversion unit 45. Further, since the substrate 42 has the waveguide structure 44, the back surface of the substrate 42 can be grounded, so that a connector device (waveguide-micro) that needs to form a transmission line on the substrate back surface is provided. Compared to a stripline converter, there is also an advantage that it is not affected by the board installation location.
- the dielectric-filled rectangular waveguide 48 shown in FIG. 7B can be used for the coupling portion 43 instead of the ridge waveguide 47.
- the dielectric-filled rectangular waveguide 48 instead of the ridge waveguide 47 there is an advantage that the dimensional accuracy can be loosened as compared with the case where the ridge waveguide 47 is used.
- FIG. 12 shows coupling characteristics when a dielectric-filled rectangular waveguide 48 is used in place of the ridge waveguide 47.
- the width W 1 of the inner wall of the insertion port 49A is simply made larger than the width W 2 of the inner wall of the ridge waveguide 47. Is also set widely (see FIG. 6B).
- the inner wall of the insertion port 49 ⁇ / b> A is set in a tapered shape whose width gradually decreases from the outside toward the coupling portion 43, more specifically, toward the ridge waveguide 47. The composition is taken.
- the tip end portion of the waveguide cable 41 can be reliably guided into the coupling portion 43 by the tapered inner wall.
- the waveguide cable 41 can be easily attached, and the metal portion at the tip of the waveguide cable 41 can be reliably brought into contact with the ridge waveguide 47. And unnecessary radiation can be suppressed.
- FIG. 14 is a perspective view illustrating an outline of the configuration of the connector device according to the second modification
- FIG. 15 is a cross-sectional view illustrating a cross-sectional structure of the connector device according to the second modification along the y direction in FIG. .
- FIG. 16 shows the coupling characteristics of the connector device according to the second modification.
- the coupling portion 43 in the connector device 40 of the present disclosure basically has a simple structure in which the ridge waveguide 47 (or the dielectric-filled rectangular waveguide 48) is built. . Therefore, since the coupling portion 43 of the connector device of the present disclosure has a simple structure, the connector device 43 can be adapted to both the horizontal waveguide structure and the vertical waveguide structure.
- the waveguide cable 41, the substrate 42 having the waveguide structure, and the coupling portion 43 that electromagnetically couples the end portion of the waveguide cable 41 and the waveguide structure are provided.
- This connector device is the connector device 40 of the present disclosure.
- the connector device 40 according to the present disclosure includes It is not restricted to the connector apparatus which concerns on this aspect, It can also be set as the connector apparatus which concerns on the 2nd thru
- the connector device according to the second aspect including the substrate 42 having the waveguide structure 44 may be employed.
- the connector device according to the second aspect is used by being electromagnetically coupled to the end portion of the waveguide cable 41 through the coupling portion 43 in the waveguide structure 44.
- the connector device according to the third aspect including the substrate 42 having the waveguide structure 44 and the coupling portion 43 can also be adopted.
- the connector device according to the third aspect is used by being electromagnetically coupled to the end portion of the waveguide structure 44 waveguide cable 41 through the coupling portion 43.
- the connector device according to the fourth aspect including the waveguide cable 41 and the coupling portion 43 may be employed.
- the connector device according to the fourth aspect is used with the end portion of the waveguide cable 41 being electromagnetically coupled to the waveguide structure 44 of the substrate 42 through the coupling portion 43.
- the coupling portion 43 is divided into two parts.
- two divisions for example, a case where a ridge waveguide 47 (see FIG. 6B) having ridges 471 and 472 on both upper and lower sides is divided into an upper 47U side and a lower 47L side.
- the substrate 42 having the waveguide structure 44 and a first coupling portion (coupling portion including the upper portion 47U / coupling portion including the lower portion 47L) electromagnetically coupled to the waveguide structure 44 are provided. It can also be configured as such a connector device.
- the connector device includes a second coupling portion (a coupling portion including the lower portion 47L / a coupling portion including the upper portion 47U) attached to the end of the waveguide cable 41 at the first coupling portion. It is used by being electromagnetically coupled.
- a connector device comprising a waveguide cable 41 and a second coupling portion (a coupling portion including a lower portion 47L / a coupling portion including an upper portion 47U) attached to an end portion of the waveguide cable 41. It is also possible to take the configuration as follows.
- the first coupling portion (coupling portion including the upper portion 47U / coupling portion including the lower portion 47L) electromagnetically coupled to the waveguide structure 44 of the substrate 42 at the second coupling portion. ) And electromagnetically coupled.
- Connector device can also take the following structures.
- a connector device comprising: [2] The waveguide structure comprises a dielectric substrate integrated waveguide, The connector device according to [1] above. [3] The substrate comprises a printed circuit board having conductor layers formed on both principal surfaces of the dielectric, The waveguide structure has two conductor layers formed on both main surfaces of the printed circuit board, and two conductor walls formed perpendicular to the main surface and facing the traveling direction of the electromagnetic wave. Consisting of, The connector device according to [2] above.
- the two conductor walls are formed by continuously arranging columnar conductors.
- the columnar conductor includes a via that electrically connects two conductor layers formed on both main surfaces of the printed circuit board.
- the coupling portion includes a through hole penetrating the conductor layer on one main surface of the printed circuit board, and electromagnetically couples the end portion of the waveguide cable and the waveguide structure through the through hole.
- the through hole is composed of a slot formed between two conductor walls in a direction perpendicular to the traveling direction of the electromagnetic wave.
- the coupling portion includes a ridge waveguide disposed between the through hole and the end portion of the waveguide cable.
- the coupling portion includes a dielectric-filled rectangular waveguide disposed between the through hole and the end portion of the waveguide cable.
- the waveguide cable is a dielectric waveguide cable in which a dielectric is filled in the waveguide.
- the electromagnetic wave signal propagated from the waveguide structure of the substrate to the waveguide cable through the coupling portion is a high-frequency signal.
- the high-frequency signal is a millimeter-wave band signal.
- the coupling unit holds the waveguide cable parallel to the substrate.
- the coupling portion holds the waveguide cable perpendicular to the substrate.
- the guide member has an insertion port into which the waveguide cable is inserted.
- the width of the inner wall of the insertion opening is set wider than the width of the electromagnetic wave path of the coupling portion.
- the inner wall of the insertion port has a tapered shape in which the width gradually decreases from the outside toward the coupling portion.
- the waveguide structure of the substrate is connected to the microstrip line via the impedance converter.
- ⁇ Communication system having the connector device according to the first aspect A transmitter for transmitting a high-frequency signal; A receiving unit for receiving a high-frequency signal; A waveguide cable for transmitting a high-frequency signal between the transmitter and the receiver; A connector device for connecting at least one of the transmission unit and the reception unit and the waveguide cable; Comprising Connector device A waveguide cable; A substrate having a waveguide structure; A coupling for electromagnetically coupling the end of the waveguide cable and the waveguide structure; A communication system comprising: [21] ⁇ Connector device according to second aspect >> Comprising a substrate having a waveguide structure; Used by being electromagnetically coupled to the end of the waveguide cable and the waveguide structure, Connector device.
- Connector device [22] ⁇ Connector device according to third aspect >> A substrate having a waveguide structure; A coupling for electromagnetically coupling the waveguide structure to the end of the waveguide cable; A connector device comprising: [23] ⁇ Connector device according to fourth aspect >> A waveguide cable; A coupling portion for electromagnetically coupling an end portion of the waveguide cable to the waveguide structure of the substrate with respect to the substrate having the waveguide structure; A connector device comprising: [24] ⁇ Connector device according to fifth aspect >> A substrate having a waveguide structure; A first coupling portion electromagnetically coupled to the waveguide structure; With The first coupling portion is used by being electromagnetically coupled to the second coupling portion attached to the end of the waveguide cable. Connector device.
- Connector device [25] ⁇ Connector device according to sixth aspect >> A waveguide cable; A second coupling attached to the end of the waveguide cable; With The second coupling portion is used by being electromagnetically coupled to the first coupling portion that is electromagnetically coupled to the waveguide structure of the substrate. Connector device.
- SYMBOLS 1 Communication system, 10 ... Transmission part, 11 ... Signal generation part, 20 ... Reception part, 21 ... Signal restoration part, 30, 41 ... Waveguide cable, 40, DESCRIPTION OF SYMBOLS 50 ... Connector apparatus, 42 ... Board
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Abstract
Description
導波管ケーブルと、
導波管構造を有する基板と、
導波管ケーブルの端部と導波管構造とを電磁的に結合する結合部と、
を備える構成となっている。
高周波の信号を送信する送信部と、
高周波の信号を受信する受信部と、
送信部と受信部との間で高周波の信号を伝送する導波管ケーブルと、
送信部及び受信部の少なくとも一方と導波管ケーブルとを接続するコネクタ装置と、
を具備し、
コネクタ装置は、
導波管ケーブルと、
導波管構造を有する基板と、
導波管ケーブルの端部と導波管構造とを電磁的に結合する結合部と、
を備える構成となっている。
尚、ここに記載された効果に必ずしも限定されるものではなく、本明細書中に記載されたいずれかの効果であってもよい。また、本明細書に記載された効果はあくまで例示であって、これに限定されるものではなく、また付加的な効果があってもよい。
1.本開示のコネクタ装置及び通信システム、全般に関する説明
2.本開示の技術が適用される通信システム
3.実施形態の説明
3-1.実施形態に係るコネクタ装置
3-2.変形例1
3-3.変形例2
3-4.変形例3
電磁波、特に、マイクロ波、ミリ波、テラヘルツ波などの高周波の信号を、導波管を媒体として伝送する通信システムは、電子機器、情報処理装置、半導体装置などの各種の装置相互間の信号の伝送や、1つの装置(機器)における回路基板相互間の信号の伝送などに用いて好適なものである。この通信システムにおいて、高周波の信号を伝送する導波管は、装置相互間や回路基板相互間を接続するケーブルとしての機能を持つことから、導波管ケーブルと呼称される。
本開示の技術が適用される通信システム(本開示の通信システム)の構成の一例について、図1A及び図1Bを用いて説明する。図1Aは、本開示の技術が適用される通信システムの構成の一例を示すブロック図であり、図1Bは、本通信システムにおける送信部及び受信部の具体的な構成の一例を示すブロック図である。
a)ミリ波通信は通信帯域を広く取れるため、データレートを大きくとることが簡単にできる。
b)伝送に使う周波数が他のベースバンド信号処理の周波数から離すことができ、ミリ波とベースバンド信号の周波数の干渉が起こり難い。
c)ミリ波帯は波長が短いため、波長に応じて決まる導波構造を小さくできる。加えて、距離減衰が大きく回折も少ないため電磁シールドが行い易い。
d)通常の無線通信では、搬送波の安定度については、干渉などを防ぐために厳しい規制がある。そのような安定度の高い搬送波を実現するためには、高い安定度の外部周波数基準部品と逓倍回路やPLL(位相同期ループ回路)などが用いられ、回路規模が大きくなる。これに対して、ミリ波通信では、容易に外部に漏れないようにできるとともに、安定度の低い搬送波を伝送に使用することができ、回路規模の増大を抑えることができる。
[実施形態に係るコネクタ装置]
本実施形態では、送信部10と導波管ケーブル30との間に介在するコネクタ装置40に適用する場合を例に挙げて説明する。但し、送信部10と導波管ケーブル30との間に介在するコネクタ装置40への適用に限られるものではなく、導波管ケーブル30と受信部20との間に介在するコネクタ装置50に対しても、コネクタ装置40の場合と同様に適用可能である。
上記の実施形態では、金属ガイド49に対して導波管ケーブル41の抜き差しが可能にするために、単に、差し込み口49Aの内壁の幅W1をリッジ導波管47の内壁の幅W2よりも広く設定する構成を採っている(図6B参照)。変形例1では、図13に示すように、差し込み口49Aの内壁を、外側から結合部43、より具体的には、リッジ導波管47に向けて幅が徐々に狭くなるテーパー形状に設定する構成を採っている。このように、差し込み口49Aの内壁をテーパー形状にすることで、当該テーパー形状の内壁によって導波管ケーブル41の先端部を結合部43内に確実に案内できる。これにより、導波管ケーブル41の装着が容易になるとともに、リッジ導波管47に対して導波管ケーブル41の先端の金属部を確実に接触させることができるため、両者の結合部分における損失や不要輻射を抑えることができる。
上記の実施形態では、導波管ケーブル41を基板42に対して平行に保持する横型導波管構造の場合を例に挙げて説明したが、これに限られるものではない。例えば、導波管ケーブル41を基板42に対して垂直に保持する、所謂、縦型導波管構造とすることも可能である。ここで、「垂直」とは、厳密に垂直である場合の他、実質的に垂直である場合をも含み、設計上あるいは製造上生ずる種々のばらつきの存在は許容される。図14は、変形例2に係るコネクタ装置の構成の概略を示す斜視図であり、図15は、図14のy方向に沿った変形例2に係るコネクタ装置の断面構造を示す断面図である。
以上では、導波管ケーブル41、導波管構造を有する基板42、及び、導波管ケーブル41の端部と導波管構造とを電磁的に結合する結合部43を備える第1の態様に係るコネクタ装置を、本開示のコネクタ装置40としている。但し、導波管ケーブル41、導波管構造を有する基板42、及び、結合部43を備えるコネクタ装置を第1の態様に係るコネクタ装置とした場合、本開示のコネクタ装置40としては、第1の態様に係るコネクタ装置に限られるものではなく、以下に例示する第2乃至第6の態様に係るコネクタ装置とすることも可能である。
導波管構造44を有する基板42から成る第2の態様に係るコネクタ装置とする構成をとることもできる。第2の態様に係るコネクタ装置は、導波管ケーブル41の端部に対して導波管構造44にて結合部43を介して電磁的に結合されて用いられることになる。
(第3の態様)
導波管構造44を有する基板42と、結合部43とから成る第3の態様に係るコネクタ装置とする構成をとることもできる。第3の態様に係るコネクタ装置は、導波管構造44導波管ケーブル41の端部に対して結合部43を通して電磁的に結合されて用いられることになる。
(第4の態様)
導波管ケーブル41と、結合部43とから成る第4の態様に係るコネクタ装置とする構成をとることもできる。第4の態様に係るコネクタ装置は、導波管ケーブル41の端部が基板42の導波管構造44に対して結合部43を通して電磁的に結合されて用いられることになる。
(第5の態様)
導波管構造44を有する基板42と、導波管構造44と電磁的に結合した第1の結合部(上部47Uを含む結合部/下部47Lを含む結合部)とから成る第5の態様に係るコネクタ装置とする構成をとることもできる。第5の態様に係るコネクタ装置は、第1の結合部にて導波管ケーブル41の端部に取り付けられた第2の結合部(下部47Lを含む結合部/上部47Uを含む結合部)と電磁的に結合されて用いられることになる。
(第6の態様)
導波管ケーブル41と、導波管ケーブル41の端部に取り付けられた第2の結合部(下部47Lを含む結合部/上部47Uを含む結合部)とから成る第6の態様に係るコネクタ装置とする構成をとることもできる。第6の態様に係るコネクタ装置は、第2の結合部にて基板42の導波管構造44と電磁的に結合した第1の結合部(上部47Uを含む結合部/下部47Lを含む結合部)と電磁的に結合されて用いられることになる。
[1]《第1態様に係るコネクタ装置》
導波管ケーブルと、
導波管構造を有する基板と、
導波管ケーブルの端部と導波管構造とを電磁的に結合する結合部と、
を備えるコネクタ装置。
[2]導波管構造は、誘電体基板集積導波管から成る、
上記[1]に記載のコネクタ装置。
[3]基板は、誘電体の両主面に導体層が形成されたプリント基板から成り、
導波管構造は、プリント基板の両主面に形成された2つの導体層、及び、主面に対して垂直に、かつ、電磁波の進行方向に沿って対向して形成された2つの導体壁から成る、
上記[2]に記載のコネクタ装置。
[4]2つの導体壁は、柱状の導体が連続して配置されることによって形成される、
上記[3]に記載のコネクタ装置。
[5]柱状の導体は、プリント基板の両主面に形成された2つの導体層を電気的につなぐビアから成る、
上記[4]に記載のコネクタ装置。
[6]結合部は、プリント基板の一方の主面の導体層を貫通する貫通孔を含み、この貫通孔を通して導波管ケーブルの端部と導波管構造とを電磁的に結合する、
上記[3]から上記[5]のいずれかに記載のコネクタ装置。
[7]貫通孔は、電磁波の進行方向に対して垂直な方向に、2つの導体壁間に亘って形成されるスロットから成る、
上記[6]に記載のコネクタ装置。
[8]結合部は、貫通孔と導波管ケーブルの端部との間に配されたリッジ導波管を有する、
上記[6]又は上記[7]に記載のコネクタ装置。
[9]結合部は、貫通孔と導波管ケーブルの端部との間に配された誘電体充填方形導波管を有する、
上記[6]又は上記[7]に記載のコネクタ装置。
[10]導波管ケーブルは、導波管内に誘電体が充填された誘電体導波管ケーブルである、
上記[1]から上記[9]のいずれかに記載のコネクタ装置。
[11]基板の導波管構造から結合部を通して導波管ケーブルに伝搬される電磁波の信号は、高周波の信号である、
上記[1]から上記[10]のいずれかに記載のコネクタ装置。
[12]高周波の信号は、ミリ波帯の信号である、
上記[11]に記載のコネクタ装置。
[13]結合部は、導波管ケーブルを基板に対して平行に保持する、
上記[1]から上記[12]のいずれかに記載のコネクタ装置。
[14]結合部は、導波管ケーブルを基板に対して垂直に保持する、
上記[1]から上記[12]のいずれかに記載のコネクタ装置。
[15]導波管ケーブルを結合部に対して位置決めしつつ連結するガイド部材を有する、
上記[1]から上記[14]のいずれかに記載のコネクタ装置。
[16]ガイド部材は、導波管ケーブルが差し込まれる差し込み口を有する、
上記[15]に記載のコネクタ装置。
[17]差し込み口の内壁の幅は、結合部の電磁波の通路の幅よりも広く設定される、
上記[16]に記載のコネクタ装置。
[18]差し込み口の内壁は、外側から結合部に向けて幅が徐々に狭くなるテーパー形状をなしている、
上記[17]に記載のコネクタ装置。
[19]基板の導波管構造は、インピーダンス変換部を介してマイクロストリップ線路に接続される、
上記[1]から上記[18]のいずれかに記載のコネクタ装置。
[20]《第1態様に係るコネクタ装置を有する通信システム》
高周波の信号を送信する送信部と、
高周波の信号を受信する受信部と、
送信部と受信部との間で高周波の信号を伝送する導波管ケーブルと、
送信部及び受信部の少なくとも一方と導波管ケーブルとを接続するコネクタ装置と、
を具備し、
コネクタ装置は、
導波管ケーブルと、
導波管構造を有する基板と、
導波管ケーブルの端部と導波管構造とを電磁的に結合する結合部と、
を備える通信システム。
[21]《第2態様に係るコネクタ装置》
導波管構造を有する基板を備え、
導波管ケーブルの端部と導波管構造にて電磁的に結合されて用いられる、
コネクタ装置。
[22]《第3態様に係るコネクタ装置》
導波管構造を有する基板と、
導波管ケーブルの端部に対して導波管構造を電磁的に結合する結合部と、
を備えるコネクタ装置。
[23]《第4態様に係るコネクタ装置》
導波管ケーブルと、
導波管構造を有する基板に対して、当該基板の導波管構造に導波管ケーブルの端部を電磁的に結合させる結合部と、
を備えるコネクタ装置。
[24]《第5態様に係るコネクタ装置》
導波管構造を有する基板と、
導波管構造と電磁的に結合した第1の結合部と、
を備え、
第1の結合部にて導波管ケーブルの端部に取り付けられた第2の結合部と電磁的に結合されて用いられる、
コネクタ装置。
[25]《第6態様に係るコネクタ装置》
導波管ケーブルと、
導波管ケーブルの端部に取り付けられた第2の結合部と、
を備え、
第2の結合部にて基板の導波管構造と電磁的に結合した第1の結合部と電磁的に結合されて用いられる、
コネクタ装置。
Claims (20)
- 導波管ケーブルと、
導波管構造を有する基板と、
導波管ケーブルの端部と導波管構造とを電磁的に結合する結合部と、
を備えるコネクタ装置。 - 導波管構造は、誘電体基板集積導波管から成る、
請求項1に記載のコネクタ装置。 - 基板は、誘電体の両主面に導体層が形成されたプリント基板から成り、
導波管構造は、プリント基板の両主面に形成された2つの導体層、及び、主面に対して垂直に、かつ、電磁波の進行方向に沿って対向して形成された2つの導体壁から成る、
請求項2に記載のコネクタ装置。 - 2つの導体壁は、柱状の導体が連続して配置されることによって形成される、
請求項3に記載のコネクタ装置。 - 柱状の導体は、プリント基板の両主面に形成された2つの導体層を電気的につなぐビアから成る、
請求項4に記載のコネクタ装置。 - 結合部は、プリント基板の一方の主面の導体層を貫通する貫通孔を含み、この貫通孔を通して導波管ケーブルの端部と導波管構造とを電磁的に結合する、
請求項3に記載のコネクタ装置。 - 貫通孔は、電磁波の進行方向に対して垂直な方向に、2つの導体壁間に亘って形成されるスロットから成る、
請求項6に記載のコネクタ装置。 - 結合部は、貫通孔と導波管ケーブルの端部との間に配されたリッジ導波管を有する、
請求項6に記載のコネクタ装置。 - 結合部は、貫通孔と導波管ケーブルの端部との間に配された誘電体充填方形導波管を有する、
請求項6に記載のコネクタ装置。 - 導波管ケーブルは、導波管内に誘電体が充填された誘電体導波管ケーブルである、
請求項1に記載のコネクタ装置。 - 基板の導波管構造から結合部を通して導波管ケーブルに伝搬される電磁波の信号は、高周波の信号である、
請求項1に記載のコネクタ装置。 - 高周波の信号は、ミリ波帯の信号である、
請求項11に記載のコネクタ装置。 - 結合部は、導波管ケーブルを基板に対して平行に保持する、
請求項1に記載のコネクタ装置。 - 結合部は、導波管ケーブルを基板に対して垂直に保持する、
請求項1に記載のコネクタ装置。 - 導波管ケーブルを結合部に対して位置決めしつつ連結するガイド部材を有する、
請求項1に記載のコネクタ装置。 - ガイド部材は、導波管ケーブルが差し込まれる差し込み口を有する、
請求項15に記載のコネクタ装置。 - 差し込み口の内壁の幅は、結合部の電磁波の通路の幅よりも広く設定される、
請求項16に記載のコネクタ装置。 - 差し込み口の内壁は、外側から結合部に向けて幅が徐々に狭くなるテーパー形状をなしている、
請求項17に記載のコネクタ装置。 - 基板の導波管構造は、インピーダンス変換部を介してマイクロストリップ線路に接続される、
請求項1に記載のコネクタ装置。 - 高周波の信号を送信する送信部と、
高周波の信号を受信する受信部と、
送信部と受信部との間で高周波の信号を伝送する導波管ケーブルと、
送信部及び受信部の少なくとも一方と導波管ケーブルとを接続するコネクタ装置と、
を具備し、
コネクタ装置は、
導波管ケーブルと、
導波管構造を有する基板と、
導波管ケーブルの端部と導波管構造とを電磁的に結合する結合部と、
を備える通信システム。
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