WO2015041387A1 - Appareil d'élimination de substances étrangères de plateau de gestionnaire d'essai pour dispositif à semi-conducteurs - Google Patents

Appareil d'élimination de substances étrangères de plateau de gestionnaire d'essai pour dispositif à semi-conducteurs Download PDF

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Publication number
WO2015041387A1
WO2015041387A1 PCT/KR2013/010719 KR2013010719W WO2015041387A1 WO 2015041387 A1 WO2015041387 A1 WO 2015041387A1 KR 2013010719 W KR2013010719 W KR 2013010719W WO 2015041387 A1 WO2015041387 A1 WO 2015041387A1
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WO
WIPO (PCT)
Prior art keywords
inner diameter
compressed air
tray
adsorption module
diameter portion
Prior art date
Application number
PCT/KR2013/010719
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English (en)
Korean (ko)
Inventor
김병노
박종선
이상은
Original Assignee
주식회사 넥스트솔루션
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Publication of WO2015041387A1 publication Critical patent/WO2015041387A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards

Definitions

  • the present invention relates to a test handler for semiconductor devices, and more particularly, to a tray debris removal device for a test handler for semiconductor devices for removing foreign matters and opaque devices in trays for mounting and transporting semiconductor devices.
  • Semiconductor devices are handled in trays for a variety of reasons, including preventing damage to the product and ease of handling.
  • the movement between the process devices of the semiconductor device is made by an operator and an automation system, but the device transfer in the process facility is made by a pick and place device, and the seed tray movement is made by a seed tray conveying device, collectively referred to as a tray transfer.
  • the seed tray feeder is referred to herein as a tray transfer.
  • a transfer unit is provided.
  • the device mounted on the sea tray located in the loading unit is transferred to the test tray located in the loading unit by the loading side picker head, and then the tester applies an electrical signal through the test head to perform a predetermined test procedure for determining good or bad. Going through.
  • the device is withdrawn from the loading unit and the empty seed tray is moved to the unloading unit by the tray transfer unit.
  • the device that has been tested is placed in the unloading part in the test tray, and the device in the test tray is removed by the unloading part picker head.
  • the empty seed tray is moved to the unloading unit in the loading unit as described above, the empty seed tray is installed due to an operator's mistake or an error in the loading unit in mounting the tested device to the empty seed tray moved to the unloading unit.
  • Devices that do not complete the test may be mounted in the tray.
  • foreign matter such as dust and other broken pieces may be present in the pocket in the empty seed tray.
  • there is a foreign material or a device that has not completed the test in the empty C tray there is a problem of contaminating a normal device that is transferred from the test tray after the test is normally completed.
  • the untested device is defective, there is a problem that the test device is shipped with the normal devices.
  • the empty seed tray is set at an angle of 90 degrees or more, and remains in the pocket by vibrating or shaking.
  • the method of removing the existing device or foreign material is used.
  • Such a device is commonly referred to as a diverter or a piton, and in this case, the process and structure are complicated, and there is a problem in that a separate space must be secured to shake off the foreign matter.
  • the empty seed tray of the unloading part is divided into plural sections to perform vacuum suction operation several times to remove the remaining devices in the empty seed tray. It was made. In this case, however, there is a disadvantage that the foreign material can not be removed.
  • the unloading part picker head needs to be repeatedly moved, lowered, attracted, raised, detected, moved, and separated from the empty seed tray several times, which makes the entire test handler's test process complicated and time-consuming. There was this.
  • the present invention has been made in view of the above, and has been developed to improve the removal of unidentified devices and foreign substances, etc. mounted on the sea tray located in the unloading unit by a simple method. Its purpose is to provide a tray debris removal device.
  • the tray foreign material removing apparatus of the test handler for semiconductor devices of the present invention for achieving the above object is an unloading part picker which is installed in the apparatus main body of the test handler and transfers the tested device from the test tray to an empty seed tray of the unloading part. Head; A debris adsorption module installed on the unloading unit picker head so as to be elevated; An adsorption module lifting unit for driving the foreign matter adsorption module to the lifting and lowering of the unloading unit picker head; And a compressed air supply unit for supplying compressed air of high pressure to generate a suction force in the suction unit of the foreign matter adsorption module.
  • the suction module lifting unit the fixed block is installed on the unloading unit picker head;
  • a lifting block connected to the foreign substance adsorption module; It is preferably included between the fixed block and the elevating block, the elevating drive unit for elevating and driving the elevating block.
  • the foreign material adsorption module the module body connected to the lifting block; A first body of a pipe type supported by the module main body, having a compressed air injection hole, and having an upper end and a lower end opened; A second body of a pipe-type inserted into and coupled to the inside of the first body by overlapping a predetermined portion and having a lower end and an upper end; And a dust collecting chamber installed in communication with the second body and accommodating foreign substances sucked therein, wherein the compressed air injected from the compressed air inlet is introduced between the first body and the second body.
  • An additional portion is formed, and between the lower end of the second body and the inner circumference of the first body is in communication with the annular space portion is preferably formed a jet gap for high-pressure injection of compressed air toward the inner diameter of the second body.
  • the first body, the first coupling portion is formed at the lower end is coupled to the suction nozzle member;
  • a second coupling part formed at an inner circumference of the upper end and coupled to the second body, wherein the inside of the first body has a taper part from the first coupling part at the lower end to the second coupling part at the upper end of the first body;
  • the second inner diameter portion formed to extend from the neck portion and the first inner diameter portion, and the compressed air inlet is formed sequentially.
  • the second body the compressed air guide flange of the lower portion; An outer diameter reducing portion extending upwardly with an outer diameter smaller than the compressed air guide flange portion to form the annular space portion between the second inner diameter portion; And an extension part extending upward from the outer diameter reducing part to be exposed to the outside of the first body, wherein the jet gap is formed between the guide flange part and the second inner diameter part, thereby compressing the annular space part.
  • air is guided to blow out the inside of the second body.
  • the stepped portion forming the boundary between the first inner diameter portion and the second inner diameter portion is formed with a compressed air guide surface formed to be inclined upward toward the second body toward the center of the second inner diameter portion from the inner surface of the second inner diameter portion is formed
  • the guide flange portion facing the guide surface may be rounded to correspond to the compressed air guide surface to form the jet gap.
  • the inner diameter of the second body is preferably formed smaller than the inner diameter of the first inner diameter portion.
  • a suction nozzle member coupled to the lower end of the first body, having a suction port for suctioning foreign matter by the vacuum suction input generated from the first body.
  • the suction nozzle member is provided so as to communicate with the lower end of the plurality of first body arranged in a row,
  • the suction port has a slit shape.
  • a dust collection chamber connected to the foreign matter adsorption module, collecting the foreign matter sucked.
  • the device or the foreign matter in the empty seed tray at the unloading position can be removed by a simple structure and operation.
  • the standby operation time of the test handler can be shortened compared to the prior art, thereby increasing productivity and increasing reliability of the product.
  • 1 is a diagram illustrating a general unloading side picker head.
  • FIGS. 2 to 5 are views illustrating an operation of removing the foreign matter of the empty seed tray of the unloading unit by using the tray foreign matter removing device of the test handler for semiconductor devices according to the embodiment of the present invention.
  • Figure 6 is a perspective view showing a foreign material removal apparatus according to an embodiment of the present invention.
  • FIG. 7 is a plan view of the foreign material removing apparatus shown in FIG.
  • FIG. 8 is a front view of the foreign matter removing apparatus shown in FIG. 6.
  • FIG. 9 is a side view of the foreign material removing apparatus shown in FIG. 6.
  • FIG. 10 is a bottom view of the foreign material removing apparatus shown in FIG. 6.
  • 11 to 13 are cross-sectional views taken from the foreign matter adsorption module.
  • a tray debris removing device of a test handler for a semiconductor device is installed in the apparatus main body 10 of the test handler, and the test is completed from the test tray 20.
  • Unloading part picker head 50 for moving the device 30 to the empty seed tray 40 of the unloading part A, and foreign matter adsorption so as to be elevated on one side of the unloading part picker head 50.
  • It is provided with a suction nozzle member 400 which is installed at the lower end of the air supply unit 300 and the foreign matter adsorption module 100.
  • the unloading unit picker head 50 which moves the device 30 tested in the test tray 20 to the empty seed tray 40 located in the unloading unit A is selected.
  • the head driving unit 55 is installed to be independently moved in the X, Y, Z axis direction.
  • the unloading unit picker head 50 is provided with a plurality of suction nozzles 51 for moving and holding the device 30 by vacuum suction.
  • the configuration of the unloading unit picker head 50 and the picker head driving unit 55 having the above configuration is not intended to limit the present invention, and the detailed description thereof will be omitted since it can be easily understood from a known technique.
  • the foreign material adsorption module 100 is to generate a suction force at the lower end by the compressed air supplied from the compressed air supply unit 300 to suck the foreign material of the empty seed tray 40 or to remove the unidentified device (30 '). It is to.
  • the foreign material adsorption module 100 is installed on the one side of the unloading unit picker head 50 by the adsorption module lifting unit 200 so as to be movable up and down. 6, 8, 9 and 11 to 13, the foreign material adsorption module 100 is the module main body 101 is coupled to the lifting block 220 of the adsorption module lifting unit 200. And a first body 110 supported by the module body 101 and having a compressed air inlet 111, and a second body 120 overlapping with the first body 110 by a predetermined portion.
  • the first body 110 has a pipe structure in which both ends are open, and a compressed air injection hole 111 into which compressed air is injected is formed at one side.
  • Compressed air inlet 111 is compressed air supply pipe 140 is coupled, the compressed air supply pipe 140 is connected to the compressed air supply unit 300 receives the compressed air through the compressed air inlet 111 through the first body ( Compressed air is injected into the annular space B between the 110 and the second body 120.
  • the first coupling part 112 to which the suction nozzle member 400 to be described later is coupled to the lower end of the first body 110 is provided, and the second body 120 is coupled to the inner circumference of the upper end. It has two coupling parts 113. Inside the first body 110, the first inner diameter part 115 and the second inner diameter part 116 are sequentially formed from the first coupling part 112 at the lower end to the second coupling part 113 at the upper end. It is composed.
  • the first coupling part 112 has a configuration in which the inner diameter is stepped so that the suction nozzle member 400 is tightly coupled with the sealing member 160 interposed therebetween.
  • the first inner diameter portion 115 has an inner diameter of a predetermined size from the first coupling portion 112 to the second inner diameter portion 116.
  • the second inner diameter portion 116 corresponds to a section from the first inner diameter portion 115 to the second coupling portion 113, and from the first inner diameter portion 115 to have a larger inner diameter than the first inner diameter portion 115. It is expanded.
  • the second inner diameter portion 116 also has an inner diameter larger than the first inner diameter portion 115, but extends to the second coupling portion 113 without changing the inner diameter.
  • the compressed air injection hole 111 is formed in communication with the second inner diameter part 116.
  • the stepped portion 117 that forms the boundary between the first inner diameter portion 115 and the second inner diameter portion 116 may be formed from the inner surface of the second inner diameter portion 116.
  • the compressed air guide surface 117a formed to be inclined upward in the C direction toward the center is formed. That is, the first inner diameter portion 115 is further extended toward the second inner diameter portion 116 is formed to overlap a predetermined portion.
  • the second inner diameter portion 116 is formed to extend more than the first inner diameter portion 115, and extends to the second coupling portion 113 with a constant inner diameter.
  • the second coupling part 113 may be formed to have a larger inner diameter by extending more than the second inner diameter part 116, and a screw thread may be formed at an inner circumference for coupling with the second body 120.
  • the second body 120 is a part inserted into the interior of the first body 110 is coupled, it has a pipe structure that is open at both ends. Specifically, the second body 120 extends to the upper portion of the compressed air guide flange portion 121 at the bottom and the guide flange portion 121 and the annular space portion B between the second inner diameter portion 116. And an extension part 125 extending upward from the outer diameter reduction part 123 and exposed to the outside of the first body 110 to be connected to the dust collecting chamber 500. do.
  • the guide flange portion 121 has a larger outer diameter than the outer diameter reducing portion 123, and the inner diameter has a round surface 121a formed to be rounded toward the lower end.
  • the outer diameter of the guide flange portion 121 has an outer diameter smaller than that of the second inner diameter portion 116. Therefore, a fine gap G1 through which compressed air passes is formed between the guide flange portion 121 and the second inner diameter portion 116, so that the compressed air introduced into the annular space B is shown in FIG. As described above, the high pressure is transmitted to the air jet gap G2 between the round surface 121a and the compressed air guide surface 117a through the gap G1. Compressed air that is ejected into the second body 120 through the air jet gap G2 is discharged while forming a strong air flow toward the upper portion of the second body 120, that is, the outlet side.
  • the outer surface of the guide flange portion 121 is formed in a curved shape, that is, streamlined, and the compressed air guide surface 117a facing the guide flange portion 121 is also formed in a rounded curved shape to compress the flow introduced. It is possible to guide the air to flow more smoothly into the jet gap (G2).
  • foreign matter, dust, and the unidentified device 30 ′ of the empty seed tray 40 may be sucked or adsorbed to pass through the first and second bodies 110 and 120 to be collected in the dust collecting chamber 500. Then, the unidentified device 30 'adsorbed can be collected by being transferred to the container 60 adjacent to the seed tray 40, as shown in FIG. 4, in the state of being sucked by the suction port 401 of the suction nozzle member 400. have.
  • the coupling part 126 may include a screw thread, but may be configured to be coupled to the first body 110 by using a bolt.
  • a stopper 127 for determining a coupling position at which the second body 120 is inserted into and coupled to the first body 110 may be protruded from the outside of the second body 120. When the stopper 127 contacts the upper end of the first body 110 and the second body 120 is inserted into the first body 110 until it is no longer coupled, the air jet gap G2 is combined. It is possible to secure a minimum interval of). In addition, when the distance between the air jet gaps G2 is to be widened, the stopper 127 may be adjusted by adjusting the coupling position so as to be spaced apart in contact with the end of the first body 110.
  • the upper end of the second body 120 is bent in a curved shape for smooth flow of air is connected to the dust chamber 500.
  • the inner diameter of the second body 120 is smaller than the inner diameter of the first inner diameter portion 115 of the first body (110). Therefore, the generation of suction force in the suction node member 400 may be improved by the compressed air discharged into the second body 120 through the jet gap G2.
  • the foreign material adsorption module 100 having the above configuration is arranged in a plurality of intervals. Therefore, the compressed air supply unit 300 is connected to each foreign matter adsorption module 100 is configured to supply the compressed air. And the suction nozzle member 400 is commonly connected to the lower end of the plurality of foreign matter adsorption module 100, the upper portion of the plurality of foreign matter adsorption module 100 is all connected to one dust collection chamber (500).
  • the adsorption module lifting unit 200 is installed on the fixed block 210 coupled to the unloading unit picker head 50, the lifting block 220 supporting the foreign substance adsorption module 100, and the fixed block 210. And a lifting driving unit 230 for elevating and driving the lifting block 220.
  • the elevating driving unit 230 may include any one of a linear motor, a hydraulic cylinder, and a pneumatic cylinder installed between the fixed block 210 and the elevating block 220.
  • the foreign matter adsorption module 100 may be moved up and down a predetermined distance while being supported by the unloading unit picker head 50 by the adsorption module lifting unit 200 having the above configuration. Therefore, when the device 30 of the test tray 20 is moved by using the unloading unit picker head 50, the foreign matter adsorption module 100 is positioned at an elevated position as shown in FIG. 2. Before moving the device 30 of the test tray 20 using the unloading unit picker head 50, the foreign material or the unidentified device 30 ′ of the empty seed tray 40 located in the unloading unit A is removed. During the suction and adsorption and removal operation, as shown in FIG. 3, the foreign matter adsorption module 100 is lowered than the unloading unit picker head 50.
  • the compressed air supply unit 300 is connected to each of the plurality of foreign matter adsorption module 100 to supply compressed air.
  • the compressed air supply unit 300 may include a blowing fan, a pneumatic pump, a compressor, and the like.
  • the suction nozzle member 400 is coupled to the lower portion of the foreign matter adsorption module 100, and more specifically, is coupled to communicate with the entire lower portion of the foreign matter adsorption module 100, and a suction port 401 is formed at a lower end thereof.
  • One suction port 401 may be formed in a long slit structure, a plurality may be formed at regular intervals.
  • the suction port 401 may be formed in plurality in a small circle. Therefore, the foreign matter is sucked into the dust collecting chamber 500 through the suction port 401 and collected by suction, and after collecting the unidentified device 30 ', the recovery container 60 disposed adjacent to the seed tray 40 is provided. Can be recovered and removed.
  • a sensing device for determining whether the unidentified device has been adsorbed may be further mounted. If the detection device detects that the unidentified device is adsorbed, the operation of adsorbing the unidentified device is repeated. If the adsorption of the unidentified device is not detected, the foreign material suction and the unidentified device removal operation are stopped, and the next process is performed. Can be. Therefore, foreign matters and unidentified devices in the empty seed tray of the unloading portion A can be completely removed.
  • the dust collecting chamber 500 is connected to communicate with the foreign matter adsorption module 100.
  • the dust collecting chamber 500 has a recovery space for recovering foreign matter therein, and an outlet 510 through which the discharge pressure escapes is formed at the upper portion thereof.
  • the transparent window 520 is installed on one side to check the inside of the dust chamber 500 from the outside.
  • the outlet 510 may be provided with a filter (not shown) for filtering the discharge of foreign matter.
  • the foreign matter adsorption module 100 installed on the unloading unit picker head 50 is lowered, the foreign matter adsorption module 100 is lowered from the empty seed tray 40 by lowering the unloading unit picker head 50. Close to the top. At this time, the compressed air is supplied from the compressed air supply unit 300 to the foreign material adsorption module 100 to maintain a suction force generated in the suction port 401 of the suction nozzle member 400.
  • the foreign material adsorption module 100 moves the unloading unit picker head 50 horizontally, that is, from one end of the seed tray 40 to the other end in a state in which the foreign matter adsorption module 100 is close to the empty seed tray 40. Then, the unidentified device 30 ′ remaining in the empty seed tray 40 while moving is adsorbed to the suction port 401 of the suction nozzle member 400, and the foreign matter is sucked into the suction port 401 to collect the dust collection chamber 500. ) Is recovered. Therefore, the empty seed tray 40 from which the foreign matter and the unidentified device 30 'are removed is in a clean state.
  • This operation is performed by an operation of moving the unloading unit picker head 50 from one end of the seed tray 40 to the other end once. Therefore, the operation of removing the foreign matter in the seed tray 40 can be made concise, which can shorten the time.
  • a recovery container 60 may be further installed adjacent to the empty seed tray 40 of the unloading unit A to collect the unidentified device 30 '. That is, as shown in FIG. 3 while passing through the empty seed tray 40, the device 30 'adsorbed to the suction nozzle unit 400, as shown in FIG. The supply can be dropped and collected in the recovery container 60 by stopping the supply.
  • a seed tray for transferring a good device and a seed tray for transferring a defective device may be disposed adjacent to each other. Therefore, as described above, the foreign material or the unidentified device 30 'can be removed while the unloading unit picker head 50 passes through each of the plurality of sea trays located in the unloading unit.
  • the foreign matter adsorption module 100 After removing the foreign matter or the unidentified device 30 'of the empty seed tray 40 in this manner, the foreign matter adsorption module 100 is raised to its original position, and as shown in FIG. 5, the unloading part picker head 50 is removed. By moving toward the test tray 20, the operation of moving the tested device 30 to the empty seed tray 40 is performed.
  • the present invention it is possible to quickly and effectively remove foreign substances or devices on the empty seed tray of the unloading portion, and to shorten the time for removing such work. As a result, it is possible to shorten the sorting time of the test through the test handler, thereby improving the productivity and improving the reliability of the product by removing the remaining device and the foreign matter in the seed tray.
  • the configuration of the device is simplified because the configuration and space for vibration are unnecessary by changing the posture of the empty seed tray at a vertical or higher angle in a separate space. There is an advantage that the size can be reduced.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

La présente invention porte sur un appareil d'élimination de substances étrangères de plateau de gestionnaire d'essai pour dispositif à semi-conducteurs L'appareil est caractérisé par le fait qu'il comporte une tête de dispositif de saisie de partie de déchargement installée sur le corps principal du gestionnaire d'essai et qu'il transfère un dispositif essayé du plateau d'essai à un plateau de germe vide d'une partie de déchargement, un module d'adsorption de substances étrangères installé sur la tête de dispositif de saisie de partie de déchargement d'une manière telle qu'il peut s'élever, une unité d'élévation de module d'adsorption destinée à entraîner le module d'adsorption de substances étrangères de manière à l'élever et l'abaisser sur la tête de dispositif de saisie de déchargement, et une unité d'alimentation en air comprimé pour fournir de l'air comprimé haute pression afin de générer une force d'aspiration depuis une partie d'aspiration du module d'adsorption de substances étrangères.
PCT/KR2013/010719 2013-09-17 2013-11-25 Appareil d'élimination de substances étrangères de plateau de gestionnaire d'essai pour dispositif à semi-conducteurs WO2015041387A1 (fr)

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WO2015041387A1 true WO2015041387A1 (fr) 2015-03-26

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KR102043633B1 (ko) * 2014-01-21 2019-11-13 (주)테크윙 반도체소자 테스트용 핸들러
KR102283393B1 (ko) * 2019-11-08 2021-07-29 세메스 주식회사 커스터머 트레이 스택커
KR102488826B1 (ko) * 2021-04-09 2023-01-17 양해춘 하이브리드 이젝터를 구비한 픽 앤 플레이스 시스템
KR102518092B1 (ko) * 2021-05-03 2023-04-06 매그나칩 반도체 유한회사 디스플레이 드라이버 ic의 신뢰성 테스트 방법

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KR20050107936A (ko) * 2004-05-10 2005-11-16 주식회사 대우일렉트로닉스 광 픽업 클리닝 장치
KR20110071617A (ko) * 2009-12-21 2011-06-29 제이트론 테크놀로지 코포레이션 테스트 셀 컨디셔너 대용 청소 장치
KR20120027580A (ko) * 2010-09-13 2012-03-22 삼성전자주식회사 반도체 장치용 테스트 핸들러 및 이를 이용한 반도체 장치 테스트 방법
KR20130099782A (ko) * 2012-02-29 2013-09-06 (주)제이티 소자검사장치

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