WO2015039506A1 - 喷墨头的制造方法及喷墨头 - Google Patents

喷墨头的制造方法及喷墨头 Download PDF

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Publication number
WO2015039506A1
WO2015039506A1 PCT/CN2014/084095 CN2014084095W WO2015039506A1 WO 2015039506 A1 WO2015039506 A1 WO 2015039506A1 CN 2014084095 W CN2014084095 W CN 2014084095W WO 2015039506 A1 WO2015039506 A1 WO 2015039506A1
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WO
WIPO (PCT)
Prior art keywords
piezoelectric actuator
pressure chamber
vibration plate
plate
inkjet head
Prior art date
Application number
PCT/CN2014/084095
Other languages
English (en)
French (fr)
Inventor
邹赫麟
孙莎
周毅
Original Assignee
大连理工大学
珠海纳思达企业管理有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 大连理工大学, 珠海纳思达企业管理有限公司 filed Critical 大连理工大学
Priority to JP2016541782A priority Critical patent/JP6213795B2/ja
Publication of WO2015039506A1 publication Critical patent/WO2015039506A1/zh
Priority to US15/046,361 priority patent/US9776406B2/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14201—Structure of print heads with piezoelectric elements
    • B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1607—Production of print heads with piezoelectric elements
    • B41J2/161—Production of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1623—Manufacturing processes bonding and adhesion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1631—Manufacturing processes photolithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1637—Manufacturing processes molding
    • B41J2/1639—Manufacturing processes molding sacrificial molding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14201—Structure of print heads with piezoelectric elements
    • B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
    • B41J2002/14241—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm having a cover around the piezoelectric thin film element
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2002/1437—Back shooter
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49083—Heater type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49401—Fluid pattern dispersing device making, e.g., ink jet

Definitions

  • the present invention relates to printing device technology, and more particularly to a method of manufacturing an ink jet head and an ink jet head. Background technique
  • An ink jet printhead is a device for printing a predetermined color image by ejecting a small amount of ink droplets at a desired position on the recording sheet.
  • Chinese Patent No. CN200410031366. 1 discloses a method for manufacturing an ink jet head, in which a pressure chamber and a nozzle plate are formed on a silicon substrate, and then a pressure layer is provided to protect the pressure chamber and the nozzle hole, and then in the silicon. The substrate is etched to form a liquid supply channel, and finally the resist layer is removed. During the processing, the process is complicated, the number of steps is large, and the chamber and the nozzle holes are easily damaged when the resist layer is removed.
  • the present invention provides a method of manufacturing an ink jet head and an ink jet head to simplify the process and improve the yield of the ink jet head.
  • a first aspect of the invention provides a method of manufacturing an inkjet head, comprising:
  • the lower surface of the vibrating plate forms a pressure chamber and a nozzle hole, and the pressure chamber is The nozzle hole and the liquid supply hole are in communication.
  • an inkjet head comprising:
  • a vibrating plate a surface of the vibrating plate is provided with a piezoelectric actuator, a surface of the piezoelectric actuator is provided with a protective film, and the protective film is configured to cooperate with the vibrating plate to actuate the piezoelectric Sealed to prevent the piezoelectric actuator from being corroded;
  • a pressure chamber disposed on a lower surface of the vibrating plate, the pressure chamber covering a position of the piezoelectric actuator in the vibrating plate, a lower surface of the pressure chamber being formed with the pressure chamber Connected nozzle holes;
  • a substrate on the surface of the vibrating plate wherein a groove is formed in a position corresponding to the piezoelectric actuator in the substrate, and the substrate and the vibrating plate are provided with a liquid supply hole, and the liquid supply hole and the liquid supply hole The pressure chamber is connected.
  • the present invention provides a method of manufacturing an ink jet head by providing a protective film on the surface of the piezoelectric actuator and fitting the protective film to the vibrating plate to seal the piezoelectric actuator, thereby ensuring subsequent substrate alignment.
  • the piezoelectric actuator is not corroded.
  • the method adopts a process of etching the substrate and the vibrating plate to form a pressure chamber and a nozzle hole, thereby forming a pressure chamber. In the chamber process, it is no longer necessary to provide a resist layer on the pressure chamber and the nozzle hole, and the process of removing the resist layer is omitted, thereby simplifying the process steps.
  • the step of removing the resist layer is omitted, the nozzle plate and the nozzle hole can be prevented from being damaged during the manufacturing process, and the yield of the ink jet head can be improved.
  • FIG. 1 is a flow chart of a method for manufacturing an inkjet head according to an embodiment of the present invention.
  • FIG. 1 is a schematic diagram of each step of a method for manufacturing an inkjet head according to an embodiment of the present invention.
  • 201 substrate; 202 vibration plate; 203: piezoelectric actuator:
  • an embodiment of the present invention provides a method for manufacturing an inkjet head, and the specific steps are as follows:
  • step S101 a vibrating plate 202 is disposed on the lower surface of the substrate 201.
  • the vibrating plate 202 is made of silicon nitride material to improve the elasticity of the vibrating plate 202 and improve the vibrating effect.
  • the vibrating plate 202 may also be made of silicon dioxide or zirconia.
  • a piezoelectric actuator 203 is disposed on the surface of the vibrating plate 202.
  • the piezoelectric actuator 203 may include a piezoelectric ceramic, an upper electrode and a lower electrode.
  • the piezoelectric actuator 203 is a driving component, and converts an applied voltage into mechanical energy, so that the vibration plate 202 moves up and down in a subsequent step.
  • the resulting volume of the pressure chamber in turn ejects the ink from the nozzle holes formed in subsequent subsequent steps.
  • the piezoelectric actuator 203 is disposed on the lower surface of the vibrating plate 202, whereby the piezoelectric actuator 203 can be placed in the pressure chamber formed in the subsequent step, and the vibration effect can be improved.
  • step S103 a protective film is disposed on the surface of the piezoelectric actuator 203.
  • the protective film 204 cooperates with the vibration plate 202 to seal the piezoelectric actuator 203 for preventing the piezoelectric actuator 203 from being corroded.
  • the protective film 204 on the surface of the piezoelectric actuator 203 and sealing the protective film 204 with the vibration plate 202 to seal the piezoelectric actuator 203 it is possible to ensure the subsequent etching of the substrate 201 and the vibration plate 202.
  • the piezoelectric actuator 203 is not corroded, and the piezoelectric actuator 203 can be prevented from being immersed in the ink for a long time to be corroded.
  • the protective film 204 is made of a silicon nitride or silicon oxide material, and the protective film 204 has better corrosion resistance after using a silicon nitride or silicon oxide material, and at the same time, since the silicon nitride or silicon oxide material has hardness, when pressed
  • the piezoelectric actuator 203 can function as a vibration to improve the vibration effect, wherein the protective film 204 can be formed by sputtering or chemical vapor deposition. .
  • step S104 the substrate 201 and the vibration plate 202 are etched to form a recess 205 at a position corresponding to the piezoelectric actuator 203 in the substrate 201, and A liquid supply hole 206 is formed in the substrate 201 and the vibration plate 202.
  • the piezoelectric actuator 203 Since the piezoelectric actuator 203 is sealed by the protective film 204 and the vibration plate 202, it is etched. The etching of the piezoelectric actuator 203 is not caused during the engraving.
  • a groove 205 is formed at a position corresponding to the piezoelectric actuator 203 in the substrate 201, and when the piezoelectric actuator 203 drives the vibration plate 202 to vibrate, the vibration plate 202 can be convex toward the side of the groove 205, thereby The vibration space is increased, and the vibration effect of the vibration plate 202 is improved.
  • a liquid supply hole 206 formed in the substrate 201 and the vibration plate 202 is used to allow ink to flow in.
  • step S105 a pressure chamber 207 and a nozzle hole 208 are formed on the lower surface of the vibrating plate 202, so that the pressure chamber 207 covers the piezoelectric actuator 203 in the vibrating plate 202. In the position, the pressure chamber 207 is in communication with the nozzle hole 208 and the liquid supply hole 206.
  • the pressure chamber 207 communicates with the nozzle hole 208 and the liquid supply hole 206, the ink flows into the pressure chamber 207 from the liquid supply hole 206, and the vibration plate 202 is vibrated by the piezoelectric actuator 203 to be in the pressure chamber 207.
  • the ink is ejected from the nozzle holes 208.
  • the method firstly etches the substrate 201 and the vibration plate 202, and then forms the pressure chamber 207 and the nozzle hole 208, the pressure chamber 207 and the nozzle hole need not be formed in the process of forming the pressure chamber 207.
  • the provision of a resist layer on 208 also eliminates the need to remove the resist layer, thus simplifying the process steps.
  • the step of removing the resist layer is omitted, the nozzle plate and the nozzle hole can be prevented from being damaged during the manufacturing process, and the yield of the ink jet head can be improved.
  • step S 105 includes steps S 106-S 1 10 .
  • step S106 forming a pressure chamber layer on the lower surface of the vibrating plate 202.
  • the pressure chamber layer 209 can be made of SU8 photoresist to make the pressure chamber layer 209 and the vibrating plate 202 more adhesively, thereby further connecting the subsequently formed pressure chamber 207, and of course the pressure chamber.
  • Other photoresists may be used for the layer 209, which is not specifically limited in the present invention.
  • step S107 exposure through the first mask 301 to cure the sidewalls of the pressure chamber layer 209.
  • step S108 a nozzle plate is disposed on the lower surface of the pressure chamber layer 209. Layer 210.
  • the nozzle plate layer 210 can be made of SU8 photoresist, so that the nozzle plate layer 210 and the pressure chamber layer 209 are more adhesively bonded, so that the subsequently formed nozzle plate is more firmly connected.
  • the nozzle plate layer 210 is also Other photoresists may be used, which are not specifically limited in the present invention.
  • step S109 preferably, exposure through the second mask 302 causes the nozzle plate layer 210 to cure other portions than the nozzle holes 208.
  • step S 1 10 is developed to form a pressure chamber 207 and a nozzle orifice 208, and the pressure chamber 207 is in communication with the nozzle orifice 208 and the supply orifice 206.
  • the portion of the pressure chamber layer 209 and the nozzle plate layer 2 10 that are not cured during exposure is removed by development to form the pressure chamber layer 209 and the nozzle holes 208.
  • the pressure chamber layer 209 and the nozzle hole 208 are formed by optical methods, and the manufactured product has good quality.
  • the pressure chamber layer 209 and the nozzle hole 208 can be formed by laser processing, mechanical blasting or chemical methods. The present invention does not specifically limit this.
  • the step 1 1 1 is further included.
  • a step 1 1 1 is provided on the upper surface of the substrate 201.
  • the cover plate 21 1 has an opening, and the opening communicates with the liquid supply hole 206. This completes the manufacture of the ink jet head.
  • a method for manufacturing an ink jet head according to an embodiment of the present invention forming a liquid supply hole by an etching process
  • an embodiment of the present invention provides an inkjet head, comprising: a vibration plate 202, a surface of the vibration plate 202 is provided with a piezoelectric actuator 203, and a surface of the piezoelectric actuator 203 is provided.
  • the pressure chamber 207 is disposed at a lower surface of the vibrating plate 202, the pressure chamber 207 covers a position of the piezoelectric actuator 203 in the vibrating plate 202, and a lower surface of the pressure chamber 207 is formed with the pressure chamber 207 a communicating nozzle hole 208;
  • a cover plate 211 is disposed on the upper surface of the substrate 201, the cover The plate 21 1 is opened with an opening that communicates with the liquid supply hole 206.
  • the protective film 204 is provided on the surface of the piezoelectric actuator 203, and the protective film 204 is sealed with the vibration plate 202 to seal the piezoelectric actuator 203, the substrate 201 and the vibration plate 202 can be secured. During the etching process, the piezoelectric actuator 203 is not corroded. Therefore, in the manufacturing process of the inkjet head, the substrate 201 and the vibration plate 202 can be etched first, and then the pressure chamber 207 and the nozzle hole are formed. 208.
  • the piezoelectric actuator 203 is disposed on the lower surface of the vibrating plate 202, whereby the piezoelectric actuator 203 can be placed in the pressure chamber 207, thereby improving the vibration effect.
  • the protective film 204 is made of a silicon nitride or silicon oxide material, and after the silicon nitride or silicon oxide material is used, the protective film 204 has better corrosion resistance, and at the same time, since the silicon nitride or silicon oxide material has more The hardness is such that when the piezoelectric actuator 203 is placed in the pressure chamber 207, the piezoelectric actuator 203 acts as a vibration to further improve the vibration effect.
  • the vibration plate 202 is made of a silicon nitride material to improve the elasticity of the vibration plate 202 and improve the vibration effect.
  • the vibration plate 202 may also be a silica or zirconia and silicon dioxide laminate. .

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)

Abstract

提供一种喷墨头制造方法以及喷墨头。该方法包括：在基板（201）下表面设置振动板（202）；在所述振动板表面设置压电致动器（203）；在所述压电致动器的表面设置保护膜（204），以使所述保护膜与所述振动板配合将所述压电致动器密封，用于防止所述压电致动器被腐蚀；对所述基板进行蚀刻，以在所述基板中的与所述压电致动器相对应的位置处形成凹槽（205），并在所述基板和振动板上形成供液孔（206）；在所述振动板下表面形成压力腔室（207）及喷嘴孔（208），使所述压力腔室覆盖所述振动板中所述压电致动器所在位置，并使所述压力腔室与所述喷嘴孔和供液孔连通。该方法简化了工艺步骤，提高了喷墨头的成品率。

Description

喷墨头的制造方法及喷墨头
技术领域
本发明涉及打印设备技术，尤其涉及一种喷墨头的制造方法及喷墨头。 背景技术
喷墨打印头是用于在记录板上所需的位置通过喷射少量油墨液滴 来打印预定颜色图像的装置。 喷墨打印头有两种驱动方法： 一种是喷墨 打印头使用加热源在油墨中生成的气泡膨胀力喷射油墨液滴的热驱动 方法； 另一种是喷墨打印头通过压电体的变形产生施加在油墨上的压 力， 从而喷射油墨液滴。
压电式喷墨打印头内部必须形成复杂而精确地油墨流动路径。 中国 专利 CN200410031366. 1 公开了一种喷墨头的制造方法， 其中， 在硅基 底上先形成压力腔室及喷嘴板， 之后通过设置抗蚀剂层来保护压力腔室 及喷嘴孔， 再在硅基底蚀刻形成供液通道， 最后再去除抗蚀剂层。 在加 工过程中， 工艺复杂， 歩骤多， 并且在去除抗蚀剂层时易造成腔室及喷 嘴孔损坏。 发明内容 本发明提供一种喷墨头的制造方法及喷墨头， 以简化工艺歩骤， 提 高喷墨头的成品率。
本发明第一方面提供一种喷墨头的制造方法， 包括：
在基板下表面设置振动板；
在所述振动板表面设置压电致动器；
在所述压电致动器的表面设置保护膜， 以使所述保护膜与所述振动 板配合将所述压电致动器密封， 用于防止所述压电致动器被腐蚀；
对所述基板及振动板进行蚀刻， 以在所述基板中的与所述压电致动 器相对应的位置处形成凹槽， 并在所述基板和振动板上形成供液孔； 在所述振动板下表面形成压力腔室及喷嘴孔， 并使所述压力腔室与 所述喷嘴孔和供液孔连通。
本发明另一方面提供一种喷墨头包括：
振动板， 所述振动板表面设有压电致动器， 所述压电致动器的表面 设有保护膜， 所述保护膜用于与所述振动板配合以将所述压电致动器密 封， 以防止所述压电致动器被腐蚀；
压力腔室， 设置在所述振动板下表面， 所述压力腔室覆盖所述振动 板中所述压电致动器所在位置， 所述压力腔室的下表面形成有与所述压 力腔室连通的喷嘴孔；
基板， 位于所述振动板上表面， 所述基板中对应于所述压电致动器 的位置处形成有凹槽， 所述基板和振动板设有供液孔， 所述供液孔与所 述压力腔室连通。
基于上述， 本发明提供的喷墨头的制造方法， 通过在压电致动器的 表面设置保护膜， 并使保护膜与振动板配合将压电致动器密封， 从而可 以保证在随后对基板及振动板进行蚀刻过程中， 压电致动器不会受到腐 蚀， 另外， 本方法采用先对基板及振动板进行蚀刻， 后形成压力腔室及 喷嘴孔的制造过程， 因此， 在形成压力腔室过程中， 无需再在压力腔室 及喷嘴孔上设置抗蚀剂层， 也省去了去除抗蚀剂层的歩骤， 因此简化了 工艺歩骤。 同时， 由于省去了去除抗蚀剂层的歩骤， 因此能够使喷嘴板 及喷嘴孔在制作过程中不易被破坏， 提高喷墨头的成品率。 附图说明
图 1为本发明实施例提供的一种喷墨头的制造方法的流程图； 图 2-图 1 1为本发明实施例提供的一种喷墨头的制造方法各歩骤的 示意图。
附图标记：
201： 基板； 202 振动板； 203： 压电致动器:
204： 保护膜； 205 凹槽； 206： 供液孔；
207： 压力腔室； 208 喷嘴孔； 209： 压力腔室层;
210： 喷嘴板层； 2 1 1 301： 第一掩膜； 302： 第二掩膜。 具体实施方式 请参考图 1， 本发明实施例提供一种喷墨头的制造方法， 具体歩骤 如下：
请参考图 2， 歩骤 S 101 , 在基板 201下表面设置振动板 202。
优选的， 所述振动板 202采用氮化硅材料， 以提高振动板 202的弹 性， 提高振动效果， 当然， 振动板 202也可采用二氧化硅或氧化锆材料。
请参考图 3，歩骤 S 102 ,在所述振动板 202表面设置压电致动器 203。 其中压电致动器 203可包括压电陶瓷、 上电极及下电极， 所述压电 致动器 203为驱动元件， 将外加电压转化为机械能， 使振动板 202上下 运动改变在后续歩骤中形成的压力腔室的体积大小进而将墨水从后续 歩骤中形成的喷嘴孔挤出。
优选的， 在振动板 202的下表面设置压电致动器 203， 由此压电致 动器 203可处于后续歩骤中形成的压力腔室中， 可提高振动效果。
请参考图 4， 歩骤 S 103 , 在所述压电致动器 203的表面设置保护膜
204， 以使所述保护膜 204与所述振动板 202配合将所述压电致动器 203 密封， 用于防止所述压电致动器 203被腐蚀。
通过在压电致动器 203的表面设置保护膜 204， 并使保护膜 204与 振动板 202配合将压电致动器 203密封，从而可以保证在随后对基板 201 及振动板 202进行蚀刻过程中， 压电致动器 203不会受到腐蚀， 也可防 止压电致动器 203长期浸泡在墨水中而被腐蚀。
优选的， 所述保护膜 204采用氮化硅或氧化硅材料， 采用氮化硅或 氧化硅材料后保护膜 204的抗腐蚀性更好， 同时由于氮化硅或氧化硅材 料具有硬度， 当压电致动器 203位于后续歩骤中形成的压力腔室中时， 压电致动器 203可起到振动的作用， 提高振动效果， 其中保护膜 204可 采用溅射法或者化学气相沉淀法形成。
请参考图 5， 歩骤 S 104 , 对所述基板 201及振动板 202进行蚀刻， 以在所述基板 201中的与所述压电致动器 203相对应的位置处形成凹槽 205， 并在所述基板 201和振动板 202上形成供液孔 206。
由于压电致动器 203被保护膜 204与振动板 202所密封， 因此在蚀 刻过程中， 不会造成压电致动器 203的腐蚀。 在基板 201中的与压电致 动器 203相对应的位置处形成凹槽 205， 当压电致动器 203带动振动板 202振动时， 振动板 202可向凹槽 205—侧凸起， 从而增大了振动空间， 提高了振动板 202的振动效果。 同时， 当振动板 202向凹槽 205—侧凸 起时， 会增大后续歩骤中形成的压力腔室的体积， 使更多地墨水流入压 力腔室， 保证了喷射时喷出的墨水量。 在基板 201和振动板 202上形成 的供液孔 206用于使墨水流入。
请参考图 10， 歩骤 S 105 , 在所述振动板 202下表面形成压力腔室 207及喷嘴孔 208， 使所述压力腔室 207覆盖所述振动板 202中所述压 电致动器 203所在位置， 并使所述压力腔室 207与所述喷嘴孔 208和供 液孔 206连通。
由于压力腔室 207与喷嘴孔 208和供液孔 206连通， 墨水由供液孔 206流入到压力腔室 207中，通过压电致动器 203带动振动板 202振动， 将压力腔室 207中的墨水由喷嘴孔 208喷出。
由于本方法采用先对基板 201及振动板 202进行蚀刻， 后形成压力 腔室 207及喷嘴孔 208的制造过程， 因此，在形成压力腔室 207过程中， 无需再在压力腔室 207及喷嘴孔 208上设置抗蚀剂层， 也省去了去除抗 蚀剂层的歩骤， 因此简化了工艺歩骤。 同时， 由于省去了去除抗蚀剂层 的歩骤， 因此能够使喷嘴板及喷嘴孔在制作过程中不易被破坏， 提高喷 墨头的成品率。
优选的， 歩骤 S 105包括歩骤 S 106-S 1 10。
请参考图 6， 歩骤 S 106 , 在所述振动板 202下表面形成压力腔室层
209。
优选的， 压力腔室层 209可采用 SU8光刻胶， 以使压力腔室层 209 与振动板 202粘合度更好， 进而使后续形成的压力腔室 207连接更为牢 固， 当然压力腔室层 209也可采用其他光刻胶， 本发明对此不做具体限 定。
请参考图 7， 歩骤 S 107 , 经第一掩膜 301曝光， 以将所述压力腔室 层 209的四周侧壁固化。
请参考图 8， 歩骤 S 108 , 在所述压力腔室层 209下表面设置喷嘴板 层 210。
优选的， 喷嘴板层 210可采用 SU8光刻胶， 以使喷嘴板层 210与压 力腔室层 209粘合度更好， 进而使后续形成的喷嘴板连接更为牢固， 当 然喷嘴板层 210也可采用其他光刻胶， 本发明对此不做具体限定。
请参考图 9， 歩骤 S 109 , 优选的， 经第二掩膜 302曝光， 以使所述 喷嘴板层 210除喷嘴孔 208的位置外的其他部分固化。
请参考图 10，歩骤 S 1 10 , 显影， 以形成压力腔室 207和喷嘴孔 208， 并使所述压力腔室 207与所述喷嘴孔 208和供液孔 206连通。
通过显影， 将压力腔室层 209及喷嘴板层 2 10在曝光过程中未固化 的部分去除， 从而形成压力腔室层 209及喷嘴孔 208。
本实施例中，通过采用光学方法形成压力腔室层 209及喷嘴孔 208， 制造出的产品质量好， 当然也可通过激光加工、 机械喷砂或化学方法形 成压力腔室层 209及喷嘴孔 208， 本发明对此不做具体限定。
优选的， 在振动板 202下表面形成压力腔室 207及喷嘴孔 208， 并 使所述压力腔室 207与所述喷嘴孔 208和供液孔 206连通之后， 还包括 歩骤 1 1 1。
请参考图 1 1， 歩骤 1 1 1， 在基板 201上表面设置盖板 21 1， 所述盖 板 21 1开有开口， 所述开口与所述供液孔 206连通。 由此完成对于喷墨 头的制造。
本发明实施例提供的喷墨头的制造方法， 通过蚀刻工艺形成供液孔
206， 且通过光学方法形成压力腔室层 209及喷嘴孔 208， 由此可避免使 用粘合剂， 因此不会出现粘合剂堵塞供液孔 206及喷嘴孔 208的问题。
请参考图 1 1， 本发明实施例提供一种喷墨头， 包括： 振动板 202， 所述振动板 202表面设有压电致动器 203， 所述压电致动器 203的表面 设有保护膜 204， 所述保护膜 204用于与所述振动板 202配合以将所述 压电致动器 203密封，以防止所述压电致动器 203被腐蚀；压力腔室 207， 设置在所述振动板 202下表面， 所述压力腔室 207覆盖所述振动板 202 中所述压电致动器 203所在位置， 所述压力腔室 207的下表面形成有与 所述压力腔室 207连通的喷嘴孔 208 ; 基板 201， 位于所述振动板 202 上表面， 所述基板 201中对应于所述压电致动器 203的位置处形成有凹 槽 205， 所述基板 201和振动板 202设有供液孔 206， 所述供液孔 206 与所述压力腔室 207连通； 盖板 21 1， 设置于所述基板 201上表面， 所 述盖板 21 1开有开口， 所述开口与所述供液孔 206连通。
本实施例中， 由于在压电致动器 203的表面设有保护膜 204， 且保 护膜 204与振动板 202配合将压电致动器 203密封， 从而可以保证在对 基板 201及振动板 202进行蚀刻过程中，压电致动器 203不会受到腐蚀， 由此， 在喷墨头的制造过程中， 可实现先对基板 201及振动板 202进行 蚀刻， 后形成压力腔室 207及喷嘴孔 208， 因此， 在形成压力腔室 207 过程中， 无需再在压力腔室 207及喷嘴孔 208上设置抗蚀剂层， 也省去 了去除抗蚀剂层的歩骤， 因此简化了工艺歩骤， 另外也还可防止压电致 动器 203长期浸泡在墨水中而被腐蚀。
本实施例中，优选的， 压电致动器 203设于所述振动板 202下表面， 由此压电致动器 203可处于压力腔室 207中， 进而提高振动效果。
本实施例中， 优选的， 保护膜 204采用氮化硅或氧化硅材料， 采用 氮化硅或氧化硅材料后保护膜 204的抗腐蚀性更好， 同时由于氮化硅或 氧化硅材料具有更佳的硬度，当压电致动器 203位于压力腔室 207中时， 压电致动器 203可起到振动的作用， 进一歩提高振动效果。
本实施例中， 优选的， 振动板 202采用氮化硅材料， 以提高振动板 202的弹性， 提高振动效果， 当然， 振动板 202也可采用二氧化硅或氧 化锆与二氧化硅叠层材料。
最后应说明的是： 以上各实施例仅用以说明本发明的技术方案， 而非对 其限制； 尽管参照前述各实施例对本发明进行了详细的说明， 本领域的普通 技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改， 或者对其中部分或者全部技术特征进行等同替换； 而这些修改或者替换， 并 不使相应技术方案的本质脱离本发明各实施例技术方案的范围。

Claims

权 利 要 求 书
1、 一种喷墨头的制造方法， 其特征在于， 包括：
在基板下表面设置振动板；
在所述振动板表面设置压电致动器；
在所述压电致动器的表面设置保护膜， 以使所述保护膜与所述振动 板配合将所述压电致动器密封， 用于防止所述压电致动器被腐蚀；
对所述基板及振动板进行蚀刻， 以在所述基板中的与所述压电致动 器相对应的位置处形成凹槽， 并在所述基板和振动板上形成供液孔； 在所述振动板下表面形成压力腔室及喷嘴孔， 使所述压力腔室覆盖 所述振动板中所述压电致动器所在位置， 并使所述压力腔室与所述喷嘴 孔和供液孔连通。
2、 根据权利要求 1所述的喷墨头的制造方法， 其特征在于， 在所 述振动板表面设置压电致动器包括：
在所述振动板的下表面设置压电致动器。
3、 根据权利要求 1或 2所述的喷墨头的制造方法， 其特征在于， 所述保护膜采用氮化硅或氧化硅材料。
4、 根据权利要求 1或 2所述的喷墨头的制造方法， 其特征在于， 所述振动板采用氮化硅材料。
5、 根据权利要求 1或 2所述的喷墨头的制造方法， 其特征在于， 在所述振动板下表面形成压力腔室及喷嘴孔， 使所述压力腔室覆盖所述 振动板中所述压电致动器所在位置， 并使所述压力腔室与所述喷嘴孔和 供液孔连通包括：
在所述振动板下表面形成压力腔室层；
经第一掩膜曝光， 以将所述压力腔室层的四周侧壁固化；
在所述压力腔室层下表面设置喷嘴板层；
经第二掩膜曝光， 以使所述喷嘴板层除喷嘴孔的位置外的其他部分 固化；
显影， 以形成压力腔室和喷嘴孔， 并使所述压力腔室与所述喷嘴孔 和供液孔连通。
6、 根据权利要求 5所述的喷墨头的制造方法， 其特征在于， 所述 压力腔室层和喷嘴板层采用 SU8光刻胶。
7、 根据权利要求 1或 2所述的喷墨头的制造方法， 其特征在于， 在所述振动板下表面形成压力腔室及喷嘴孔之后， 还包括：
在所述基板上表面设置盖板， 所述盖板开有开口， 所述开口与所述 供液孔连通。
8、 一种根据权利要求 1-7任一项所述的喷墨头制造方法制造的喷 墨头， 其特征在于， 包括：
振动板， 所述振动板表面设有压电致动器， 所述压电致动器的表面 设有保护膜， 所述保护膜用于与所述振动板配合以将所述压电致动器密 封， 以防止所述压电致动器被腐蚀；
压力腔室， 设置在所述振动板下表面， 所述压力腔室覆盖所述振动 板中所述压电致动器所在位置， 所述压力腔室的下表面形成有与所述压 力腔室连通的喷嘴孔；
基板， 位于所述振动板上表面， 所述基板中对应于所述压电致动器 的位置处形成有凹槽， 所述基板和振动板设有供液孔， 所述供液孔与所 述压力腔室连通；
9、 根据权利要求 8所述的喷墨头还包括设置于所述基板上表面的 盖板， 所述盖板开有开口， 所述开口与所述供液孔连通。
10、 根据权利要求 8所述的喷墨头， 其特征在于， 所述压电致动器 设于所述振动板下表面。
11、 根据权利要求 8、 9或 10所述的喷墨头， 其特征在于， 所述保 护膜采用氮化硅或氧化硅材料。
12、 根据权利要求 8、 9或 10所述的喷墨头， 其特征在于， 所述振 动板采用氮化硅材料。
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