WO2015030075A1 - Masque d'impression et procédé d'impression utilisant ledit masque - Google Patents

Masque d'impression et procédé d'impression utilisant ledit masque Download PDF

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Publication number
WO2015030075A1
WO2015030075A1 PCT/JP2014/072478 JP2014072478W WO2015030075A1 WO 2015030075 A1 WO2015030075 A1 WO 2015030075A1 JP 2014072478 W JP2014072478 W JP 2014072478W WO 2015030075 A1 WO2015030075 A1 WO 2015030075A1
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WO
WIPO (PCT)
Prior art keywords
printing
mask
pattern
holding member
groove pattern
Prior art date
Application number
PCT/JP2014/072478
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English (en)
Japanese (ja)
Inventor
水村　通伸
Original Assignee
株式会社ブイ・テクノロジー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社ブイ・テクノロジー filed Critical 株式会社ブイ・テクノロジー
Priority to CN201480047941.9A priority Critical patent/CN105492215A/zh
Priority to KR1020167004170A priority patent/KR20160047467A/ko
Publication of WO2015030075A1 publication Critical patent/WO2015030075A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/12—Stencil printing; Silk-screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1225—Screens or stencils; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N1/00—Printing plates or foils; Materials therefor
    • B41N1/24—Stencils; Stencil materials; Carriers therefor

Definitions

  • the present invention relates to a mask for printing a pattern on a substrate and a printing method using the mask, and more specifically, to suppress a positional deviation or deformation of a pattern by using a laminated structure of a mask base material and a holding member. And a printing method using the mask.
  • a conventional printing screen mask has a configuration in which, for example, a resist pattern is formed on a screen mesh stretched on a screen plate frame.
  • a resist pattern is formed on a screen mesh stretched on a screen plate frame.
  • resin fibers such as silk, nylon and polyester, stainless mesh, and the like are used.
  • the resist pattern is formed by applying a photosensitive emulsion on a screen mesh and drying it to form a photosensitive film, and then exposing and developing the photosensitive film in close contact with the photosensitive film.
  • a screen mask stretched on a screen frame is set on the printing surface at a slight distance, and ink (or paste) is supplied onto the screen mask. Then, while pressing the screen mask against the printing surface with the pressure of the squeegee, the ink is pushed out from the opening of the screen mask onto the printing surface, thereby transferring the pattern onto the printing surface (for example, Patent Document 1). reference).
  • the conventional printing mask and printing method have a problem in that the resist pattern is displaced or deformed due to the pressure applied when the ink is extended with the squeegee, and the pattern accuracy is not obtained.
  • the resist pattern is likely to be shifted or deformed in the lateral direction perpendicular to the extending direction of the wiring, and the pattern accuracy is significantly reduced.
  • a problem to be solved by the present invention that addresses such problems is a printing mask that attempts to suppress pattern misalignment and deformation by adopting a laminated structure of a mask base material and a holding member. And a printing method using the mask.
  • the printing mask according to the present invention is formed on the printing surface side, penetrates the printing groove pattern corresponding to the pattern to be printed, and the bottom surface of the printing groove pattern, and is smaller than the bottom surface width.
  • a mask base material having a through hole of an inner diameter, and a holding member having an opening pattern that is laminated on the mask base material and communicates with the transfer groove pattern through the through hole of the mask base material.
  • the printing groove pattern is connected in a peripheral region other than the through hole.
  • a plurality of the through holes may be provided on the bottom surface of the printing groove pattern.
  • the mask base material may be made of a resin film
  • the holding member may be a sheet shape
  • the opening pattern may be made of a magnetic metal material formed at a predetermined pitch in at least one of the longitudinal direction and the short side direction.
  • a plate-making frame that surrounds the periphery of the mask base material and the holding member and on which the both members are stretched may be further provided.
  • a printing method includes a printing groove pattern corresponding to a pattern to be printed formed on the printing surface side, and an inner diameter smaller than the bottom width of the printing groove pattern. And a holding member having an opening pattern that is laminated on the mask base material and communicates with the transfer groove pattern through the through holes of the mask base material and fills the transfer material.
  • the holding member is made of a sheet-like magnetic metal material
  • the step of arranging and fixing the printing surface of the printing mask includes fixing by attracting magnetic force from the side opposite to the printing surface of the substrate. Also good.
  • the transfer material may include a photoresist, and may be formed by printing a photoresist pattern on the substrate.
  • a laminated structure of a mask base material having a printing groove pattern and a through hole and a holding member having an opening pattern is formed, and the printing groove pattern is connected in a peripheral region other than the through hole.
  • the printing groove pattern is connected in the peripheral region other than the through-hole, so that it takes when the transfer material is extended with the squeegee. Due to the pressure, positional deviation and deformation of the printing groove pattern formed on the mask base material can be suppressed. Therefore, even a fine and close pattern can be printed with high pattern accuracy with little displacement and deformation of the printed pattern.
  • FIG. 1 is a perspective view of a schematic configuration showing an embodiment of a printing mask according to the present invention.
  • FIG. 2 is an enlarged view of a partial region of the printing mask illustrated in FIG. 1, and is a plan view of the partial region.
  • FIG. 2 is an enlarged view of a partial region of the printing mask shown in FIG. 1, and is a cross-sectional view taken along line X1-X1 ′ of FIG. 2A.
  • FIG. 2 is an enlarged view of a part of the printing mask shown in FIG. 1, and is a cross-sectional view taken along line X2-X2 ′ of FIG. 2A.
  • the printing method using the printing mask by this invention is shown, and it is a perspective view which shows the application
  • FIG. 3B is an enlarged cross-sectional view taken along line Y-Y ′ of FIG. 3A, showing a printing method using the printing mask according to the present invention.
  • the printing method using the printing mask by this invention is shown, and it is a perspective view which shows the process of peeling a printing mask from to-be-printed material.
  • FIG. 4B is an enlarged cross-sectional view of the printing mask taken along the line Z1-Z1 ′ of FIG. 4A, illustrating a printing method using the printing mask according to the present invention.
  • FIG. 4A is an enlarged cross-sectional view of a substrate to be printed along the line Z2-Z2 ′ of FIG. 4A, showing a printing method using a printing mask according to the present invention. It is a top view which shows the other structural example of the opening pattern in a holding member.
  • FIG. 1 is a diagram showing an embodiment of a printing mask according to the present invention.
  • This printing mask is printed by transferring a pattern of ink (or paste, photoresist, etc.) as a transfer material on a printing surface, and comprises a composite mask 1 and a metal frame (plate making frame) 2. .
  • the composite mask 1 is stretched inside a rectangular metal frame 2 and is held in a tensioned state.
  • the composite mask 1 is formed by laminating a resin film 4 as a mask base material and a holding member 3 as shown in FIG. 2A, FIG. 2B and FIG. It has a composite structure.
  • a printing groove pattern 4a corresponding to the pattern to be printed is formed.
  • the through-hole 4b is formed in the bottom face of the printing groove pattern 4a.
  • the thickness of the resin film 4 is, for example, about 12 ⁇ m to 24 ⁇ m.
  • a plurality of linear printing groove patterns 4a are arranged adjacent to each other.
  • holding members 3 On the upper surface side of the printing surface of the resin film 4, there are provided holding members 3 having slit-like opening patterns 3a arranged at a constant pitch in the lateral direction and made of a magnetic metal material in the form of a sheet.
  • the holding member 3 is for holding and fixing the composite mask 1 with magnetic force during printing, and has a thickness that can be held with magnetic force, for example, about 30 ⁇ m.
  • the opening pattern 3a of the holding member 3 communicates with the printing groove pattern 4a through the through hole 4b.
  • the inner diameter of the through hole 4b is smaller than the bottom width of the printing groove pattern 4a and the inner diameter of the opening pattern 3a, and the opening pattern 3a and the printing groove pattern 4a communicate with each other through one or more through holes 4b. ing.
  • the composite mask 1 is a peripheral region other than the through-holes 4b on the bottom surface of the printing groove pattern 4a (between adjacent through-holes 4b). Region) 4c.
  • the through-hole 4b in the mask base 4 allows the opening pattern 3a and the printing groove pattern 4a to communicate with each other, and the ink applied to the holding member 3 is transferred from the opening pattern 3a to the printing groove pattern 4a through the through-hole 4b. Functions to fill. Further, since the peripheral region 4c other than the through hole 4b is connected, it functions to suppress the deviation and deformation of the adjacent print groove pattern 4a.
  • the adjacent printing groove pattern 4a is connected in the peripheral region 4c other than the through hole 4b on the bottom surface of the printing groove pattern 4a.
  • the pattern is such that long straight lines are continuously arranged at a narrow pitch, or a pattern that is fine and close, the displacement or deformation in the lateral direction perpendicular to the extending direction of the linear pattern It can be suppressed in the peripheral region 4c.
  • the printing mask described above can be formed by, for example, the following manufacturing method.
  • the metal film is plated on the resin film 4 to form the holding member 3 and the holding member 3 is etched to form the slit-shaped opening pattern 3a.
  • a laser beam is irradiated through the opening pattern 3a of the holding member 3 to form the through hole 4b.
  • the through holes 4b can be formed in a matrix at a predetermined pitch in the opening pattern 3a or can be formed randomly.
  • a plurality of through holes 4b are arranged at the bottom for a large pattern and at least one for a small pattern.
  • the pitch and the like may be considered.
  • a laminated structure of the holding member 3 and the resin film 4 is stretched inside the metal frame 2. Then, in a state where tension is applied to the holding member 3 and the resin film 4, a laser beam or the like is irradiated from the printing surface side of the resin film 4 to form a printing groove pattern 4a corresponding to the pattern to be printed. At this time, the power of the laser beam and the irradiation time are set so that the depth of the printing groove pattern 3 a is shallower than the thickness of the resin film 4.
  • the resin film 4 in which the through-hole 4b was previously formed by the predetermined pitch or random can also be used.
  • the through hole 4b in the region other than the opening pattern 3a is covered with the holding member 3, the ink does not permeate the printing surface side.
  • the inner diameter, pitch, and arrangement of the through holes 4b are set so that one or more through holes 4b are arranged on the bottom surface of the printing groove pattern 4a. Good.
  • the metal frame 2 is mounted on a printing apparatus, the composite mask 1 is disposed on the substrate 5, and the magnet 6 (see FIG. 3B) is disposed on the lower surface (opposite to the printing surface) of the substrate 5.
  • the holding member 3 is attracted by a magnetic force to fix the composite mask 1.
  • the ink 7 is supplied onto the surface of the composite mask 1 (the surface of the holding member 3), and the squeegee 8 is moved to the arrow while pressing the composite mask 1 against the printing surface by the pressure of the squeegee 8.
  • the ink 7 is applied by moving in the direction.
  • the ink 7 applied to the surface of the holding member 3 is filled into the printing groove pattern 4a from the opening pattern 3a through the through holes 4b of the resin film 4. Subsequently, the ink 7 is extruded onto the printing surface of the substrate 5 to be applied and transferred.
  • the composite mask 1 is peeled from the substrate 5.
  • the composite mask 1 is peeled off from the substrate 5 without deformation, and the ink 7 in the printing groove pattern 4a is transferred onto the substrate 5 as shown in FIG. 7a is formed.
  • the holding member 3 is attracted by the magnetic force to fix the resin film 4, and the peripheral region 4c other than the through hole 4b at the bottom of the printing groove pattern 4a. Since the printing groove patterns are connected to each other, the displacement and deformation of the pattern of the resin film 4 can be suppressed by the pressure applied when the ink 7 is extended by the squeegee 8.
  • a pattern in which linear long wirings are arranged at a narrow pitch, which is difficult to form with conventional screen masks, or a fine and close pattern, for example, an extraction wiring pattern formed in a frame region of a touch panel is formed. Therefore, it is possible to perform printing with high pattern accuracy by suppressing the displacement and deformation of the printed wiring pattern.
  • a photoresist coating process an exposure process, a developing process, and an etching process are required to form a pattern.
  • a photoresist as a transfer material, By directly forming the pattern on the object to be etched by printing and performing etching using this resist pattern, the exposure process and the development process are not required, and the etching process can be greatly simplified.
  • the opening pattern of the holding member 3 is not limited to the slit shape, and may be an arrangement in which rectangular opening patterns 3b are arranged in a matrix form vertically and horizontally as shown in FIG.
  • the frame-like portions 3c and 3d of the holding member 3 between the adjacent opening patterns 3b can be reinforced in a vertically and horizontally connected state, and therefore, compared to the slit-like opening pattern 3a shown in FIG.
  • the deviation of the opening pattern 3b can be reduced when the ink 7 is applied by the squeegee 8.
  • an example in which the through-hole is circular has been shown.
  • the printing groove pattern can be filled with ink and adjacent printing groove patterns can be connected in the peripheral region, the shape is not limited to a circle. Absent.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Plates And Materials Therefor (AREA)
  • Printing Methods (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Screen Printers (AREA)

Abstract

La présente invention concerne un masque d'impression, ledit masque comprenant : un substrat de masque (4), qui comporte un motif de rainure d'impression (4a) formé sur son côté surface d'impression et correspondant à un motif à imprimer, et qui comporte des trous traversants (4b) qui traversent la surface inférieure du motif de rainure d'impression et qui ont un diamètre intérieur inférieur à la largeur de ladite surface inférieure; et un élément de maintien (3) qui est stratifié sur le substrat de masque et qui comporte un motif d'ouverture (3a) de communication avec l'intérieur du motif de rainure d'impression par le biais des trous traversants situés dans le substrat de masque, et de remplissage du motif de rainure d'impression par un matériau de transfert. De plus, le motif de rainure d'impression permet de supprimer un décalage de position et une déformation du motif de substrat de masque du fait qu'il est lié à des régions périphériques (4c) à l'extérieur des trous traversants.
PCT/JP2014/072478 2013-08-29 2014-08-27 Masque d'impression et procédé d'impression utilisant ledit masque WO2015030075A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201480047941.9A CN105492215A (zh) 2013-08-29 2014-08-27 印刷用掩膜以及使用该掩膜的印刷方法
KR1020167004170A KR20160047467A (ko) 2013-08-29 2014-08-27 인쇄용 마스크 및 이 마스크를 사용한 인쇄 방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013-177917 2013-08-29
JP2013177917A JP6159203B2 (ja) 2013-08-29 2013-08-29 印刷用マスク及びこのマスクを用いた印刷方法

Publications (1)

Publication Number Publication Date
WO2015030075A1 true WO2015030075A1 (fr) 2015-03-05

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Application Number Title Priority Date Filing Date
PCT/JP2014/072478 WO2015030075A1 (fr) 2013-08-29 2014-08-27 Masque d'impression et procédé d'impression utilisant ledit masque

Country Status (5)

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JP (1) JP6159203B2 (fr)
KR (1) KR20160047467A (fr)
CN (1) CN105492215A (fr)
TW (1) TW201529339A (fr)
WO (1) WO2015030075A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6377416B2 (ja) * 2014-06-05 2018-08-22 株式会社オプトニクス精密 スクリーン印刷版
CN107031175A (zh) * 2017-04-11 2017-08-11 京东方科技集团股份有限公司 一种丝网印刷掩膜版、机台、设备及丝网印刷方法
CN108940750B (zh) * 2018-09-27 2020-06-30 京东方科技集团股份有限公司 一种玻璃胶涂布掩膜板及涂胶机

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0781263A (ja) * 1993-09-14 1995-03-28 Dainippon Screen Mfg Co Ltd スクリーン印刷版
JP2007331195A (ja) * 2006-06-14 2007-12-27 Dainippon Printing Co Ltd メタルマスクおよび該メタルマスクを用いた印刷方法
JP2013146958A (ja) * 2012-01-20 2013-08-01 Mitsubishi Electric Corp メタルマスクおよび太陽電池の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0781263A (ja) * 1993-09-14 1995-03-28 Dainippon Screen Mfg Co Ltd スクリーン印刷版
JP2007331195A (ja) * 2006-06-14 2007-12-27 Dainippon Printing Co Ltd メタルマスクおよび該メタルマスクを用いた印刷方法
JP2013146958A (ja) * 2012-01-20 2013-08-01 Mitsubishi Electric Corp メタルマスクおよび太陽電池の製造方法

Also Published As

Publication number Publication date
CN105492215A (zh) 2016-04-13
TW201529339A (zh) 2015-08-01
JP2015044382A (ja) 2015-03-12
JP6159203B2 (ja) 2017-07-05
KR20160047467A (ko) 2016-05-02

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