WO2015029819A1 - 露光装置 - Google Patents

露光装置 Download PDF

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Publication number
WO2015029819A1
WO2015029819A1 PCT/JP2014/071544 JP2014071544W WO2015029819A1 WO 2015029819 A1 WO2015029819 A1 WO 2015029819A1 JP 2014071544 W JP2014071544 W JP 2014071544W WO 2015029819 A1 WO2015029819 A1 WO 2015029819A1
Authority
WO
WIPO (PCT)
Prior art keywords
workpiece
mask
alignment mark
stage
exposure apparatus
Prior art date
Application number
PCT/JP2014/071544
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
智也 渡邉
尚弥 松岡
山根　茂樹
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to CN201480046673.9A priority Critical patent/CN105474104B/zh
Priority to JP2015534143A priority patent/JP6137323B2/ja
Publication of WO2015029819A1 publication Critical patent/WO2015029819A1/ja

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G03F9/7084—Position of mark on substrate, i.e. position in (x, y, z) of mark, e.g. buried or resist covered mark, mark on rearside, at the substrate edge, in the circuit area, latent image mark, marks in plural levels
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54426—Marks applied to semiconductor devices or parts for alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0557—Non-printed masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1527—Obliquely held PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration

Definitions

  • the present invention relates to an exposure apparatus used for manufacturing semiconductor devices, printed boards, LCDs, and the like.
  • the present invention relates to an exposure apparatus that aligns an alignment mark provided on the back surface of a workpiece and an alignment mark of a mask and exposes a mask pattern on the workpiece.
  • Another pattern with a fixed positional relationship with respect to the singular point on the other surface of the workpiece, with reference to a singular point such as a workpiece alignment mark, circuit or other workpiece pattern provided on one surface of the workpiece. May form. That is, this is a case where another pattern having a fixed positional relationship with the work alignment mark is formed on the surface opposite to the surface of the work provided with the work alignment mark.
  • Alignment between the mask and the workpiece is usually performed by detecting the position of the through hole and the position of the mask pattern by an alignment means (for example, an alignment microscope) so that they match.
  • an alignment means for example, an alignment microscope
  • the workpiece is generally opaque, when forming another pattern on the surface opposite to the surface provided with singular points such as workpiece alignment marks, patterns or holes provided on one surface of the workpiece, A singular point provided on one surface of the workpiece cannot be detected from the other surface (surface to be exposed) side of the workpiece.
  • photosensitive materials applied for exposure are opaque, and even if the workpiece is a transparent material, it can detect singular points such as alignment marks, patterns and holes from the exposed surface side. It is difficult.
  • Patent Document 1 discloses an exposure apparatus in which a mask alignment mark corresponding to a workpiece alignment mark is provided in a portion outside the workpiece size. Then, using a two-field microscope having two observation parts, or two microscopes whose relative positions do not change, and fixing with a fixing member that supports the microscope so as to match the distance between the workpiece alignment mark and the mask alignment mark Thus, a back surface alignment function that can detect the workpiece alignment mark and the mask alignment mark at the same time and align the mask and the workpiece is provided.
  • the exposure apparatus disclosed in Patent Document 1 has a two-field microscope having two observation units.
  • the distance between the two fields of the microscope or the distance between the two microscopes is mounted on the microscope.
  • a fixed distance is maintained depending on the length of the fixing member. Therefore, when a large temperature change occurs in the surrounding environment of the exposure apparatus, the length of the fixing member fluctuates due to thermal expansion, so the distance between the microscopes cannot be maintained at a constant distance, and There was a problem that it was impossible to align the mask and the workpiece.
  • the present invention has been made in view of such circumstances, and even an alignment mark provided on the back surface of the workpiece can be reliably aligned with the alignment mark of the mask, and the mask pattern can be accurately aligned with the workpiece. It is an object of the present invention to provide an exposure apparatus that exposes the top.
  • an exposure apparatus includes a mask provided with a mask alignment mark, a mask holder for holding the mask, and a surface opposite to the surface facing the surface provided with the mask alignment mark.
  • An exposure apparatus comprising: an imaging apparatus configured to capture an image of the workpiece, wherein the stage is internally arranged so that an image is formed at a position outside the size of the workpiece when imaging the workpiece alignment mark of the mounted workpiece.
  • An optical component that reflects light an odd number of times, and the stage driving device includes the optical component Based on the image formed through, characterized in that for aligning the mask alignment marks and the workpiece alignment marks.
  • the mask alignment mark and the work alignment mark can be aligned with high accuracy.
  • the image of the mask alignment mark and the image of the work alignment mark formed by the optical component can be adjusted using the stage driving device so as to be at the same position, the alignment accuracy deteriorates due to the temperature change of the surrounding environment. There is no fear.
  • the optical component is a columnar prism having a pentagonal cross section.
  • the optical component is a prismatic prism having a pentagonal cross-sectional shape
  • an image formed at a position outside the size of the workpiece can be made an upright image by reflecting light an odd number of times inside. it can. Therefore, it is possible to align the mask alignment mark and the work alignment mark with high accuracy.
  • the optical component is configured by combining a plurality of columnar prisms having a polygonal cross-sectional shape.
  • the optical component is configured by combining a plurality of columnar prisms having a polygonal cross-sectional shape, and reflects an image an odd number of times to thereby form an image formed at a position outside the workpiece size. It can be an erect image. Therefore, it is possible to align the mask alignment mark and the work alignment mark with high accuracy.
  • the optical component is configured by combining a prismatic prism having a polygonal cross section and a mirror.
  • the optical component is configured by combining a prismatic prism having a polygonal cross section and a mirror, so that it can reflect light an odd number of times inside and is formed at a position outside the workpiece size.
  • the image that is made can be an erect image. Therefore, it is possible to align the mask alignment mark and the work alignment mark with high accuracy.
  • the exposure apparatus uses the thickness A of the workpiece and the distance B between the workpiece and the mask, and uses the distance C between the stage and the mask when the mask alignment mark is imaged. Is preferably half the sum of the thickness A and the distance B.
  • the distance C between the stage and the mask at the time of imaging the mask alignment mark is (thickness A + distance B) / 2
  • the position in the height direction of the imaging apparatus is fixed. Also, focusing is easy, and a high-quality image can be taken. Therefore, it is possible to align the mask alignment mark and the work alignment mark with high accuracy.
  • the mask alignment mark and the work alignment mark can be aligned with high accuracy.
  • the image of the mask alignment mark and the image of the work alignment mark formed by the optical component can be adjusted using the stage driving device so as to be at the same position, the alignment accuracy deteriorates due to the temperature change of the surrounding environment. There is no fear.
  • An exposure apparatus captures an image of a workpiece alignment mark provided on the back surface of a workpiece to be imaged using an imaging device with a fixed height for imaging, and mask alignment mark of a mask And align.
  • the exposure apparatus according to the present embodiment includes a pair of imaging devices at both ends for imaging a workpiece alignment mark provided on the back surface of a workpiece mounted during exposure.
  • FIG. 1 is a sectional view showing the arrangement of an exposure apparatus according to an embodiment of the present invention.
  • an exposure apparatus 1 holds a pair of imaging apparatus 11, a mask 13 provided with a mask pattern (not shown) and a mask alignment mark 131, and the mask 13.
  • 14 includes a stage 15 on which 14 is mounted and fixed, and stage driving devices 16 and 17 that adjust the relative position between the mask 13 and the workpiece 14 by moving the stage 15.
  • the mask pattern itself may be used as the alignment mark.
  • the imaging device 11 is a camera whose position in the height direction is fixed. It is preferable that the imaging device 11 is an integral type provided with illumination around the lens. This is because the imaging device 11 can be made compact. Further, the imaging device 11 is arranged so as to capture the workpiece alignment mark 141 outside the size of the workpiece 14, not directly above the mask alignment mark 131 of the mask 13. The image formation is realized by providing an optical component described later.
  • the mask 13 is preferably a partly transparent plate, and a mask pattern (not shown) and a mask alignment mark 131 are provided on a surface 135 facing the workpiece 14. By aligning the position of the mask alignment mark 131 with the position of the work alignment mark 141 of the work 14, the mask pattern (circuit pattern) can be correctly exposed to a desired position on the work 14.
  • Work 14 is mounted on stage 15 and fixed.
  • the relative position between the mask 13 and the workpiece 14 can be adjusted by moving the stage 15 by the stage driving devices 16 and 17.
  • the stage driving device 16 moves the stage 15 in the vertical direction to adjust the distance between the mask 13 and the workpiece 14.
  • the stage driving device 17 moves the stage 15 in the front-rear and left-right directions or rotates the stage 15 to adjust the horizontal position of the mask 13 and the work 14.
  • the stage 15 includes an optical component that reflects light an odd number of times inside so that an image is formed at a position outside the size of the work 14.
  • a columnar prism 20 having a pentagonal cross section is provided as an optical component. By reflecting light within the columnar prism 20 an odd number of times, an image is formed as an erect image. Therefore, the mask alignment mark 131 of the mask 13 and the work alignment mark 141 of the work 14 can be aligned with high accuracy.
  • Examples of the material of the columnar prism 20 include borosilicate glass and synthetic quartz. The light reflected inside the columnar prism 20 may be visible light or infrared light.
  • FIG. 2 is a sectional view of the columnar prism 20 provided in the stage 15 of the exposure apparatus 1 according to the embodiment of the present invention. As shown in FIG. 2, the light is reflected an odd number of times (three times in FIG. 2) inside the columnar prism 20. Thereby, the reflected image is formed as an erect image at a position outside the size of the work 14.
  • the reason why the image is formed as an upright image is to facilitate alignment.
  • the formed image is an inverted image. Since the image is formed as an inverted image, the direction in which the image is displaced is opposite to the direction in which the stage 15 is actually moved to correct the displacement. Therefore, it is difficult to correctly align only by moving the stage 15.
  • the direction in which the image is shifted coincides with the direction in which the shift is corrected by moving the stage 15. It can be aligned correctly.
  • FIG. 3 is a cross-sectional view of another optical component provided in the stage 15 of the exposure apparatus 1 according to the embodiment of the present invention.
  • FIG. 3A is a sectional view of a composite prism in which a columnar prism 20a having a pentagonal cross section, a columnar prism 20b having a rectangular cross section, and a columnar prism 20c having a triangular cross section are combined. Is shown.
  • the position where the image is formed can be adjusted by adjusting the length of the columnar prism 20b.
  • the columnar prisms 20a, 20b, and 20c may be bonded with a transparent optical adhesive, or the columnar prisms 20a, 20b, and 20c may be melt bonded.
  • FIG. 3B shows a cross-sectional view of an optical component in which a columnar prism 20a having a pentagonal cross-sectional shape and a reflecting mirror (mirror body) 20d are combined.
  • a columnar prism 20a having a pentagonal cross-sectional shape and a reflecting mirror (mirror body) 20d are combined.
  • the position of the image is formed by adjusting the position of the reflecting mirror 20d. It can be adjusted.
  • FIG. 4 is a cross-sectional view for explaining a state during imaging of mask alignment mark 131 of exposure apparatus 1 according to the embodiment of the present invention.
  • the position of the pair of imaging devices 11 in the height direction is fixed. Therefore, focusing of the mask alignment mark 131 of the mask 13 to be imaged and the work alignment mark 141 of the work 14 is performed by moving the stage 15 in the vertical direction.
  • the thickness A (see FIG. 5) of the workpiece 14 is measured.
  • the distance between the mask 13 and the workpiece 14 at the time of exposure is defined as an exposure gap B (see FIG. 5).
  • the design value itself may be adopted as the thickness A of the workpiece 14.
  • the mask imaging gap C which is the distance between the mask 13 and the stage 15 at the time of imaging the mask alignment mark 131, is half of the sum of the thickness A of the workpiece 14 and the exposure gap B.
  • the height of the stage 15 is adjusted by the stage driving device 16 so as to be. In this way, even if the position of the imaging device 11 in the height direction is fixed by adjusting the height of the stage 15 so that the mask imaging gap C becomes (A + B) / 2, the mask The alignment mark 131 can be focused. Therefore, it is possible to align with high accuracy.
  • the imaging device 11 images the mask alignment mark 131 in a state where the height of the stage 15 is adjusted and focused, and stores information on the position of the captured mask alignment mark 131. Specifically, based on the captured image, the position information of the mask alignment mark 131 is extracted and stored.
  • FIG. 5 is a cross-sectional view for explaining a state during imaging of the work alignment mark 141 of the exposure apparatus 1 according to the embodiment of the present invention. Similar to FIG. 4, focusing of an image to be captured is performed by moving the stage 15 in the vertical direction.
  • the distance between the mask 13 and the stage 15 at the time of imaging the workpiece alignment mark 141 is A + B, that is, the distance between the mask 13 and the workpiece 14 is equal to the exposure gap B.
  • the stage 15 is moved up and down by the stage driving device 16 to adjust the height.
  • the imaging device 11 images the work alignment mark 141 and extracts and stores position information of the work alignment mark 141.
  • the stage 15 is moved in the front-rear and left-right directions and / or rotated by the stage driving device 17, so that both positions are To match. Specifically, the stage 15 is moved so that the position information of the work alignment mark 141 matches the position information of the mask alignment mark 131.
  • the workpiece 14 is imaged again to acquire position information of the workpiece alignment mark 141, and the stage 15 is moved so that the position information of the workpiece alignment mark 141 acquired again matches the position information of the mask alignment mark 131.
  • both pieces of positional information are made to coincide.
  • the mask pattern circuit pattern
  • the mask alignment mark 131 of the mask 13 and the workpiece alignment mark 141 of the workpiece 14 are aligned with high accuracy. It becomes possible to do. Further, since the image of the mask alignment mark 131 and the image of the work alignment mark 141 formed by the columnar prism 20 can be adjusted using the stage driving device 16 so as to be at the same position, the temperature change of the surrounding environment, etc. Therefore, there is no possibility that the alignment accuracy deteriorates.
  • the optical component is not limited to a prismatic prism having a cross-sectional shape or a combination of prisms having different shapes, and a plurality of mirrors can be used as long as light can be reflected an odd number of times inside. You may comprise combining.
  • the imaging device 11 and the optical component 20 are paired, but the imaging device 11 and the optical component 20 may each be a single unit.
  • the imaging device 11 is paired because, when the size of the workpiece 14 is large, the workpiece alignment mark 141 of the workpiece 14 and the mask alignment mark 131 of the mask 13 are imaged and the ⁇ accuracy of the alignment (rotation direction) In order to increase the accuracy).
  • the imaging device 11 and the optical component 20 are used alone. There may be.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multimedia (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
PCT/JP2014/071544 2013-08-26 2014-08-18 露光装置 WO2015029819A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201480046673.9A CN105474104B (zh) 2013-08-26 2014-08-18 曝光装置
JP2015534143A JP6137323B2 (ja) 2013-08-26 2014-08-18 露光装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013174388 2013-08-26
JP2013-174388 2013-08-26

Publications (1)

Publication Number Publication Date
WO2015029819A1 true WO2015029819A1 (ja) 2015-03-05

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PCT/JP2014/071544 WO2015029819A1 (ja) 2013-08-26 2014-08-18 露光装置

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JP (1) JP6137323B2 (zh)
CN (1) CN105474104B (zh)
WO (1) WO2015029819A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021044480A (ja) * 2019-09-13 2021-03-18 株式会社ディスコ 加工装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6980562B2 (ja) * 2018-02-28 2021-12-15 キヤノン株式会社 パターン形成装置、アライメントマークの検出方法及びパターン形成方法
CN111508368B (zh) * 2020-05-19 2021-11-16 云谷（固安）科技有限公司 显示面板及显示装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0729815A (ja) * 1993-07-14 1995-01-31 Ushio Inc マスクとワークとの位置合わせ装置およびそれを使用した位置合わせ方法
JP2000315638A (ja) * 1999-04-28 2000-11-14 Teosu Kk アライメント方法とその装置
JP2001235877A (ja) * 1999-12-14 2001-08-31 Sony Chem Corp 露光方法
JP2004077898A (ja) * 2002-08-20 2004-03-11 Topcon Corp 露光方法及び露光装置
JP2004531062A (ja) * 2001-05-14 2004-10-07 ウルトラテック インク 裏側アライメントシステム及び方法
JP2006024944A (ja) * 2004-07-09 2006-01-26 Asml Netherlands Bv アライメント方法及び装置、リソグラフィ装置、デバイス製造方法並びにアライメント・ツール

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3336955B2 (ja) * 1998-05-26 2002-10-21 ウシオ電機株式会社 裏面アライメント機能を備えた露光装置
JP5556774B2 (ja) * 2011-09-16 2014-07-23 ウシオ電機株式会社 露光装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0729815A (ja) * 1993-07-14 1995-01-31 Ushio Inc マスクとワークとの位置合わせ装置およびそれを使用した位置合わせ方法
JP2000315638A (ja) * 1999-04-28 2000-11-14 Teosu Kk アライメント方法とその装置
JP2001235877A (ja) * 1999-12-14 2001-08-31 Sony Chem Corp 露光方法
JP2004531062A (ja) * 2001-05-14 2004-10-07 ウルトラテック インク 裏側アライメントシステム及び方法
JP2004077898A (ja) * 2002-08-20 2004-03-11 Topcon Corp 露光方法及び露光装置
JP2006024944A (ja) * 2004-07-09 2006-01-26 Asml Netherlands Bv アライメント方法及び装置、リソグラフィ装置、デバイス製造方法並びにアライメント・ツール

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021044480A (ja) * 2019-09-13 2021-03-18 株式会社ディスコ 加工装置

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CN105474104A (zh) 2016-04-06
JP6137323B2 (ja) 2017-05-31
CN105474104B (zh) 2017-10-10
JPWO2015029819A1 (ja) 2017-03-02

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