WO2015019933A1 - Pellicule de démoulage - Google Patents

Pellicule de démoulage Download PDF

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Publication number
WO2015019933A1
WO2015019933A1 PCT/JP2014/070192 JP2014070192W WO2015019933A1 WO 2015019933 A1 WO2015019933 A1 WO 2015019933A1 JP 2014070192 W JP2014070192 W JP 2014070192W WO 2015019933 A1 WO2015019933 A1 WO 2015019933A1
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WO
WIPO (PCT)
Prior art keywords
release
release film
thickness
film
back surface
Prior art date
Application number
PCT/JP2014/070192
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English (en)
Japanese (ja)
Inventor
洋祐 中尾
土谷　雅弘
航平 宇都
Original Assignee
積水化学工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 積水化学工業株式会社 filed Critical 積水化学工業株式会社
Priority to KR1020157033856A priority Critical patent/KR102264950B1/ko
Priority to CN201480037650.1A priority patent/CN105359634B/zh
Priority to CN201911003268.XA priority patent/CN110602896B/zh
Publication of WO2015019933A1 publication Critical patent/WO2015019933A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/538—Roughness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/748—Releasability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1152—Replicating the surface structure of a sacrificial layer, e.g. for roughening

Definitions

  • the present invention relates to a release film suitable for production of a flexible circuit board, and relates to a release film capable of suppressing the generation of wrinkles while maintaining the release property.
  • the coverlay film is hot-press bonded to the flexible circuit board main body on which the copper circuit is formed with a thermosetting adhesive or a thermosetting adhesive sheet.
  • release films are widely used to prevent the coverlay film and the hot press plate from adhering to each other.
  • Patent Documents 1 to 3 release films made of various resins such as methylpentene resin, polyester resin, and syndiotactic polystyrene resin have been proposed (Patent Documents 1 to 3).
  • Patent Document 1 describes a release film made of a laminate containing a polymethylpentene resin.
  • Patent Document 2 describes a release film having a thin release layer containing a polybutylene terephthalate having a determined surface roughness, a cushion layer, and a sub-release layer.
  • Patent Document 3 describes a release film having a release layer and a cushion layer made of syndiotactic polystyrene resin.
  • An object of the present invention is to provide a release film that is suitable for production of a flexible circuit board, and that can suppress generation of wrinkles while maintaining the release property.
  • the present invention is a release film suitable for manufacturing a flexible circuit board, the surface and the back surface are roughened, the ten-point average roughness Rz of the surface is 4 ⁇ m or more and 20 ⁇ m or less, and The thickness of the release layer constituting the back surface is 35 ⁇ m or more (however, the ten-point average roughness Rz of the surface is 4 ⁇ m or more and 5 ⁇ m or less, and the thickness of the release layer constituting the back surface is 35 ⁇ m or more and 36 ⁇ m) It is a release film (except for the following cases).
  • the present invention is described in detail below.
  • the inventor is a release film in which both the front surface and the back surface are roughened, and the ten-point average roughness Rz of the surface and the thickness of the release layer constituting the back surface satisfy a predetermined range. If it exists, it discovered that generation
  • the release film of the present invention is a release film suitable for production of a flexible circuit board.
  • the release film of the present invention has a roughened surface and back surface. Since both the front and back surfaces are roughened, not only on one side, the release film of the present invention can suppress the occurrence of wrinkles while maintaining the release property.
  • roughened means a state in which the concavo-convex shape is formed by, for example, embossing, etching using chemicals or plasma, melt fracture at the time of film formation, or the like.
  • the roughened state can be confirmed with an optical microscope.
  • the ten-point average roughness Rz of the surface is 4 ⁇ m or more and 20 ⁇ m or less, and the thickness of the release layer constituting the back surface is 35 ⁇ m or more (however, the ten points of the surface Except when the average roughness Rz is 4 ⁇ m or more and 5 ⁇ m or less and the thickness of the release layer constituting the back surface is 35 ⁇ m or more and 36 ⁇ m or less).
  • the release film of the present invention generates wrinkles while maintaining the release property. It can be suppressed.
  • the ten-point average roughness Rz of the surface is smaller than the above range, a lot of wrinkles will occur in the release film.
  • the ten-point average roughness Rz of the surface exceeds the above range, the release property of the release film is deteriorated.
  • the thickness of the release layer constituting the back surface is smaller than the above range, many wrinkles are generated in the release film.
  • the upper limit of the thickness of the release layer constituting the back surface is not particularly limited, the preferable upper limit is 100 ⁇ m, and the more preferable upper limit is 50 ⁇ m.
  • the ten-point average roughness Rz of the surface is 4 ⁇ m or more and 20 ⁇ m or less, and the thickness of the release layer constituting the back surface is More preferably, it is 37 ⁇ m or more, or the ten-point average roughness Rz of the surface is 8 ⁇ m or more and 15 ⁇ m or less, and the thickness of the release layer constituting the back surface is 35 ⁇ m or more and less than 37 ⁇ m.
  • front surface means a surface on the flexible circuit board side in the manufacturing process of the flexible circuit board
  • back surface means a surface on the heat press plate side in the manufacturing process of the flexible circuit board.
  • ten-point average roughness Rz means that the altitude of the peak from the highest peak to the fifth peak in the reference length L is Yp1, Yp2, Yp3, Yp4 and Yp5, and the deepest valley bottom. Means the value obtained by the following formula (1), where Yv1, Yv2, Yv3, Yv4, and Yv5 are the elevations of the valley bottom from the first to the fifth depth. The larger the value of “ten-point average roughness Rz”, the rougher the surface, and the smaller the value, the smoother the surface.
  • a stylus type surface roughness measuring instrument for example, Surftest SJ-301 manufactured by Mitsutoyo Corporation
  • the range of the ten-point average roughness Rz of the surface and the thickness of the release layer constituting the back surface is the “ten-point average roughness Rz of the surface” obtained in Examples and Comparative Examples, and “ From “the thickness of the release layer constituting the back surface”, it is derived as a range in which the generation of wrinkles can be suppressed while maintaining the release property.
  • FIG. 1 is a graph plotting “surface ten-point average roughness Rz” and “thickness of the release layer constituting the back surface” obtained in Examples (excluding some Examples) and Comparative Examples. Indicates. In FIG.
  • the range of “10-point average roughness Rz of the surface” defined in the present invention and “the thickness of the release layer constituting the back surface” are indicated by hatching.
  • the upper limit of the “thickness of the release layer constituting the back surface” is not limited to the range indicated by the oblique lines in FIG.
  • a resin constituting the release film is obtained from a T die of an extruder.
  • examples include a method of pressing a cooling roll having a pattern processed on the surface of the resin film extruded to have a desired thickness, and transferring the pattern processed on the surface of the cooling roll to the surface of the resin film.
  • the method for producing the cooling roll with the pattern processed on the surface is not particularly limited, and examples thereof include a method of adjusting the roughness of the smooth portion of the roll after forming a concave pattern on the surface of the smooth roll. It is done.
  • the pattern processed on the surface of the cooling roll is not particularly limited, and examples thereof include a concavo-convex pattern having a single shape, and a concavo-convex pattern having a plurality of shapes obtained by superimposing fine concavo-convex patterns on a concavo-convex pattern made of a large blast material.
  • the release film of the present invention preferably has a glossy surface ratio of 35% to 85%. If the glossy surface ratio is less than 35%, the release property of the release film may be lowered. If the glossy surface ratio exceeds 85%, wrinkles may occur in the release film.
  • the “glossy surface ratio” means that the surface of the release film is magnified 20 times using an optical microscope, and the area of the smooth surface in the observation field (700 ⁇ m ⁇ 525 ⁇ m) is measured. It means the value obtained by calculating the percentage of the area of the smooth surface occupied.
  • the ten-point average roughness Rz of the back surface of the release film of the present invention is not particularly limited, but is preferably 1 to 45 ⁇ m, and may be the same as the ten-point average roughness Rz of the surface as described above.
  • the glossy surface ratio of the back surface is not particularly limited, but may be the same as the glossy surface ratio of the surface as described above.
  • the multilayer release film of the present invention is preferably subjected to a release treatment on the surface and / or the back surface for the purpose of improving the release property.
  • the release treatment method is not particularly limited.
  • a known method such as a method of applying or spraying a release agent such as silicone or fluorine on the surface and / or the back surface, a method of performing a heat treatment, a friction treatment, or the like. This method can be used.
  • These mold release processes may be used independently and 2 or more types may be used together.
  • the layer structure is not particularly limited, and two release layers constituting the surface and the back surface, and an intermediate layer, respectively. Or a single layer film composed of only one release layer constituting the front surface and the back surface.
  • the resin constituting the two release layers constituting the surface and the back surface is not particularly limited, and the release layer constituting the surface and the release piece constituting the back surface.
  • the layers may have the same resin composition or different resin compositions, but the release layer constituting the surface preferably contains a crystalline aromatic polyester resin.
  • the crystalline aromatic polyester resin is not particularly limited, and for example, polyethylene terephthalate resin, polybutylene terephthalate resin, polyhexamethylene terephthalate resin, polyethylene naphthalate resin, polybutylene naphthalate resin, butanediol terephthalate polytetramethylene glycol A polymer etc. are mentioned.
  • These crystalline aromatic polyester resins may be used alone or in combination of two or more. Among them, polybutylene terephthalate resin is preferably used because of excellent non-contamination and crystallinity.
  • the “polybutylene terephthalate resin” includes a copolymer of polybutylene terephthalate and polyether or polyester in addition to the resin of polybutylene terephthalate alone.
  • the polybutylene terephthalate resin is not particularly limited, and those generally used can be used. Specifically, for example, a block copolymer of polybutylene terephthalate and aliphatic polyether, polybutylene terephthalate and fat. And a block copolymer with an aliphatic polyester.
  • These polybutylene terephthalate resins may be used alone or in combination of two or more.
  • the crystalline aromatic polyester resin from the viewpoint of film film formability, it is preferable that a melt volume flow rate is less than 30 cm 3 / 10min, more preferably not more than 20 cm 3 / 10min.
  • the melt volume flow rate can be measured at a measurement temperature of 250 ° C. and a load of 2.16 kg in accordance with ISO 1133.
  • the thickness of the release layer constituting the surface is 1 ⁇ m or more and 20 ⁇ m or less. It is preferable.
  • the thickness of the release layer constituting the surface is less than 1 ⁇ m, wrinkles may occur in the release film.
  • the thickness of the release layer constituting the surface exceeds 20 ⁇ m, the release property of the release film may be deteriorated.
  • the more preferable lower limit of the thickness of the release layer constituting the surface is 5 ⁇ m, and the more preferable upper limit is 18 ⁇ m.
  • the two release layers constituting the front and back surfaces are within the range not impairing the effects of the present invention, and further, fibers, inorganic fillers, flame retardants, ultraviolet absorbers, antistatic agents, inorganic substances, higher fatty acid salts, etc.
  • the additive may be contained.
  • the release film of this invention consists of a multilayer film
  • the total thickness of the two release layers which respectively comprise the said surface and a back surface occupies the thickness exceeding half among the thickness of a release film.
  • the resin constituting the intermediate layer is not particularly limited, but the intermediate layer preferably contains a polyolefin resin.
  • the polyolefin resin is not particularly limited.
  • the intermediate layer may further contain a resin such as polystyrene, polyvinyl chloride, polyamide, polycarbonate, polysulfone, or polyester as long as the object of the present invention is not impaired.
  • middle layer may contain additives, such as a fiber, an inorganic filler, a flame retardant, a ultraviolet absorber, an antistatic agent, an inorganic substance, a higher fatty acid salt, in the range which does not impair the effect of this invention.
  • additives such as a fiber, an inorganic filler, a flame retardant, a ultraviolet absorber, an antistatic agent, an inorganic substance, a higher fatty acid salt, in the range which does not impair the effect of this invention.
  • middle layer is not specifically limited, A preferable minimum is 15 micrometers and a preferable upper limit is 80 micrometers.
  • a preferable minimum is 15 micrometers and a preferable upper limit is 80 micrometers.
  • the thickness of the intermediate layer is less than 15 ⁇ m, when the resin constituting the intermediate layer is softened by hot press bonding using a release film, a portion where the intermediate layer does not exist partially occurs, and the pressure is applied to the flexible circuit. It may not be possible to uniformly load the substrate. If the thickness of the intermediate layer exceeds 80 ⁇ m, wrinkles may occur in the release film.
  • a more preferable lower limit of the thickness of the intermediate layer is 30 ⁇ m, and a more preferable upper limit is 65 ⁇ m.
  • the release film of this invention is a single layer film
  • the said surface and the said back surface are comprised by one release layer.
  • the resin constituting the release layer is not particularly limited, but preferably contains a crystalline aromatic polyester resin.
  • the said crystalline aromatic polyester resin is not specifically limited, The same thing as the crystalline aromatic polyester resin contained in a multilayer film as mentioned above is mentioned. Moreover, the same thing as the polybutylene terephthalate resin contained in a multilayer film as mentioned above is used suitably.
  • the release layer constituting the single-layer film is within a range that does not impair the effects of the present invention, and further includes additives such as fibers, inorganic fillers, flame retardants, ultraviolet absorbers, antistatic agents, inorganic substances, and higher fatty acid salts. You may contain.
  • the thickness of the release film of the present invention is not particularly limited, but a preferable upper limit is 300 ⁇ m, a more preferable upper limit is 200 ⁇ m, and a further preferable upper limit is 150 ⁇ m.
  • the method for producing the release film of the present invention is not particularly limited. For example, after producing a multilayer film or a single layer film having a desired thickness, the surface of the obtained multilayer film or single layer film is described above. Examples include a method of adjusting the ten-point average roughness Rz of the surface and the thickness of the release layer constituting the back surface to satisfy the above range by a method using such a cooling roll.
  • the method for producing the multilayer film is not particularly limited.
  • a water-cooled or air-cooled coextrusion inflation method a method of forming a film by a coextrusion T-die method, After producing a film to be a release layer, an intermediate layer is laminated on this film by an extrusion lamination method, and then the other release layer is dry-laminated, a film to be one release layer, an intermediate layer, Examples thereof include a method of dry lamination of a film to be formed and a film to be the other release layer, a solvent casting method, a hot press molding method and the like.
  • the method of forming into a film by the co-extrusion T-die method is suitable from the point which is excellent in thickness control of each layer.
  • the release film of the present invention is a release film suitable for production of a flexible circuit board.
  • the use of the release film of the present invention is not particularly limited, but when the coverlay film is hot-press bonded to the flexible circuit board body formed with a copper circuit by a thermosetting adhesive or a thermosetting adhesive sheet, By sandwiching the release film of the present invention between the cover lay film and the hot press plate, it is possible to prevent the cover lay film and the hot press plate from adhering.
  • ADVANTAGE OF THE INVENTION is a release film suitable for manufacture of a flexible circuit board, Comprising: The release film which can suppress generation
  • the “ten-point average roughness Rz of the surface” and the “thickness of the release layer constituting the back surface” obtained in the examples (excluding some examples) and the comparative examples are plotted and specified in the present invention.
  • 5 is a graph showing the range of “ten-point average roughness Rz of the surface” and “thickness of the release layer constituting the back surface” by hatching. It is an optical microscope photograph of the release film surface whose glossy surface ratio was 38%. It is an optical microscope photograph of the release film surface whose glossy surface ratio was 42%. It is an optical microscope photograph of the release film surface whose glossy surface ratio was 72%. It is an optical microscope photograph of the release film surface whose glossy surface ratio was 82%. It is an optical microscope photograph of the release film surface whose glossy surface ratio was 77%. It is an optical microscope photograph of the release film surface whose glossy surface ratio was 0%.
  • Examples 1 to 38, Comparative Examples 1 to 18 A polybutylene terephthalate resin and a polypropylene resin are co-extruded and molded at a T die width of 400 mm using an extruder (GM Engineering Co., Ltd., GM30-28 (screw diameter 30 mm, L / D28)). Two polybutylene terephthalate resin layers having a thickness shown in Table 1 or 2 (a release layer constituting the back surface and a release layer constituting the surface) are laminated on the front and back of the polypropylene resin layer (intermediate layer), respectively. A three-layer resin film was obtained.
  • the cooling roll with the pattern processed on the surface is pressed against the release surface of the release layer constituting the surface of the obtained three-layer resin film, and the processed pattern is transferred to the surface of the cooling roll.
  • irregularities were formed on the release surface to obtain a release film.
  • the release surface on which the irregularities are formed is the front surface, and the other release surface is the back surface.
  • the surface and back surface roughened states of the obtained release film were confirmed with an optical microscope, the surface 10-point average roughness Rz was measured, and these results are shown in Table 1.
  • the ten-point average roughness Rz on the back surface of each of the release films obtained in Examples and Comparative Examples was in the range of 1.0 to 3.0 ⁇ m.
  • the FPC evaluation sample and the release film were taken out, peeled off the release film, and then the number of wrinkles transferred onto the coverlay surface was measured.
  • the number of wrinkles was 0, it was “ ⁇ ”, when it was 1-10, “ ⁇ ”, when it was 11-20, “ ⁇ ”, 21 or more.
  • the case was evaluated as “x”.
  • the number of wrinkles is 20 or less, it can be said that it has sufficient wrinkle resistance as a release film at the time of manufacturing a flexible circuit board. More preferably, the number of wrinkles is 10 or less.
  • the FPC evaluation sample and the release film were taken out and left on the desk, and the time until the release film was peeled off from the FPC evaluation sample was measured.
  • the color tone seen from the release film side changes when air enters between the release film and the FPC evaluation sample from the state where the release film and the FPC evaluation sample are in close contact with each other. Therefore, the time from when the FPC evaluation sample and the release film were taken out to when the change in color tone was completed was defined as the time until the release film was peeled off.
  • the time until the release film was peeled off was 30 seconds or less, “ ⁇ ”, when it exceeded 30 seconds but 60 seconds or less, “ ⁇ ”, when 60 seconds were exceeded but 90 seconds or less. In this case, “ ⁇ ” was assigned.
  • time until a release film peels is 60 seconds or less, it can be said that it has mold release property sufficient as a release film at the time of manufacturing a flexible circuit board. More preferably, the time until the release film is peeled off is 30 seconds or less.
  • ADVANTAGE OF THE INVENTION is a release film suitable for manufacture of a flexible circuit board, Comprising: The release film which can suppress generation

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

L'objet de la présente invention est de produire une pellicule de démoulage qui convient à la production d'une carte de circuit imprimé flexible, et qui peut empêcher la formation de rides, tout en maintenant l'aptitude au démoulage. La présente invention concerne une pellicule de démoulage qui convient à la production d'une carte de circuit imprimé flexible, et dont la surface avant et la surface arrière ont été soumises à une rugosification de surface. La rugosité moyenne en dix points (Rz) de la surface avant est comprise entre 4 µm et 20 µm (inclus), et l'épaisseur d'une couche de démoulage qui constitue la surface arrière est supérieure ou égale à 35 µm (sauf dans le cas où la rugosité moyenne en dix points (Rz) de la surface avant est comprise entre 4 µm et 5 µm (inclus) et où l'épaisseur de la couche de démoulage qui constitue la surface arrière est comprise entre 35 µm et 36 µm (inclus)).
PCT/JP2014/070192 2013-08-05 2014-07-31 Pellicule de démoulage WO2015019933A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020157033856A KR102264950B1 (ko) 2013-08-05 2014-07-31 이형 필름
CN201480037650.1A CN105359634B (zh) 2013-08-05 2014-07-31 脱模膜
CN201911003268.XA CN110602896B (zh) 2013-08-05 2014-07-31 脱模膜

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2013-162657 2013-08-05
JP2013162657 2013-08-05
JP2014121820A JP6223913B2 (ja) 2013-08-05 2014-06-12 離型フィルム
JP2014-121820 2014-06-12

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WO2015019933A1 true WO2015019933A1 (fr) 2015-02-12

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JP (1) JP6223913B2 (fr)
KR (1) KR102264950B1 (fr)
CN (2) CN105359634B (fr)
TW (2) TWI666123B (fr)
WO (1) WO2015019933A1 (fr)

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JP6223913B2 (ja) * 2013-08-05 2017-11-01 積水化学工業株式会社 離型フィルム
JP6391554B2 (ja) * 2015-12-14 2018-09-19 住友ベークライト株式会社 離型フィルム
JP6977848B1 (ja) * 2020-11-02 2021-12-08 住友ベークライト株式会社 離型フィルムおよび成型品の製造方法

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