WO2015017097A1 - Procédé et système permettant une détermination de plan de focalisation de laser dans un procédé de traçage par laser - Google Patents
Procédé et système permettant une détermination de plan de focalisation de laser dans un procédé de traçage par laser Download PDFInfo
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- WO2015017097A1 WO2015017097A1 PCT/US2014/046036 US2014046036W WO2015017097A1 WO 2015017097 A1 WO2015017097 A1 WO 2015017097A1 US 2014046036 W US2014046036 W US 2014046036W WO 2015017097 A1 WO2015017097 A1 WO 2015017097A1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/046—Automatically focusing the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
- B23K26/0661—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks disposed on the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/16—Composite materials, e.g. fibre reinforced
- B23K2103/166—Multilayered materials
- B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/42—Plastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
Definitions
- Embodiments of the present invention pertain to the field of semiconductor processing and, in particular, to methods of laser scribing semiconductor wafers.
- integrated circuits are formed on a wafer (also referred to as a substrate) composed of silicon or other semiconductor material.
- a wafer also referred to as a substrate
- layers of various materials which are either semiconducting, conducting or insulating are utilized to form the integrated circuits. These materials are doped, deposited and etched using various well- known processes to form integrated circuits.
- Each wafer is processed to form a large number of individual regions containing integrated circuits known as dice or dies.
- the wafer is "diced" to separate the individual die from one another for packaging or for use in an unpackaged form within larger circuits.
- the two main techniques that are used for wafer dicing are scribing and sawing.
- a diamond tipped scribe is moved across the wafer surface along pre-formed scribe lines. These scribe lines extend along the spaces between the dies. These spaces are commonly referred to as "streets.”
- the diamond scribe forms shallow scratches in the wafer surface along the streets.
- Scribing can be used for wafers that are about 10 mils (thousandths of an inch) or less in thickness. For thicker wafers, sawing is presently the preferred method for dicing.
- each die requires substantial cleaning to remove particles and other contaminants that result from the sawing process.
- Plasma dicing has also been used, but may have limitations as well.
- one limitation hampering implementation of plasma dicing may be cost.
- a standard lithography operation for patterning resist may render implementation cost prohibitive.
- Another limitation possibly hampering implementation of plasma dicing is that plasma processing of commonly encountered metals (e.g., copper) in dicing along streets can create production issues or throughput limits.
- One or more embodiments of the invention are directed to methods of dicing a semiconductor wafer including laser scribing a mask disposed over the semiconductor wafer.
- the laser scribing can be followed by a plasma etch to dice the wafer.
- semiconductor wafer includes determining a height of a semiconductor wafer under the mask in a dicing street using an optical sensor.
- the method includes patterning the mask with a laser scribing process.
- the laser scribing process focuses a scribing laser beam at a plane
- a method includes directing a laser beam to a dicing street of the semiconductor wafer, the laser beam to be transmitted through the mask and reflect from a layer disposed under the mask.
- the method includes detecting, with an optical sensor, a height of the layer disposed under the mask based on the reflected laser beam.
- the method includes determining a height of the semiconductor wafer in the dicing street based on the detected height of the layer disposed under the mask.
- the method further includes patterning the mask with a laser scribing process. The laser scribing process focuses a scribing laser beam at a plane corresponding to the determined height of the semiconductor wafer in the dicing street.
- a system for laser scribing a mask disposed over a semiconductor wafer includes a laser source to direct a laser beam to a dicing street of the semiconductor wafer, the laser beam to be transmitted through the mask and reflect from a layer disposed under the mask.
- the system includes an optical sensor to detect a height of the layer disposed under the mask based on the reflected laser beam.
- the system includes a processor to determine a height of the semiconductor wafer in the dicing street based on the detected height of the layer disposed under the mask.
- the system also includes a laser scribing module to pattern the mask with a laser scribing process. The laser scribing process is to focus a scribing laser beam at a plane corresponding to the determined height of the semiconductor wafer in the dicing street.
- Figure la illustrates laser scribing a semiconductor wafer with a focal plane at the wafer surface, in accordance with an embodiment of the present invention
- Figure lb illustrates a system for laser scribing a semiconductor wafer as in Figure la with a focal plane at the wafer surface, in accordance with an embodiment of the present invention
- Figure 2 is a flowchart representing operations in a method of laser scribing a mask in accordance with an embodiment of the present invention
- Figures 3A and 3B illustrate cross-sectional views of a semiconductor wafer including a plurality of integrated circuits before and after laser scribing, in accordance with embodiments of the present invention
- Figure 4 illustrates a cross-sectional view of a stack of materials that may be present in a street region of a semiconductor wafer, in accordance with embodiments of the present invention
- Figure 5 illustrates a plan view schematic of an integrated dicing system in accordance with an embodiment of the present invention.
- Figure 6 illustrates a block diagram of an exemplary computer system which controls automated performance of one or more operation in the methods described herein, in accordance with an embodiment of the present invention.
- Laser scribing may be used in applications such as integrated circuit dicing.
- a laser scribing process may be used to remove a mask layer, organic and inorganic dielectric layers, and/or device layers disposed over a semiconductor wafer or substrate.
- a subsequent plasma etch may be implemented to etch through the bulk of the wafer or substrate to yield die or chip singulation or dicing.
- a laser beam removes a mask layer, a passivation layer, and/or device layers to expose the silicon substrate for subsequent plasma etching. Focusing the scribing laser beam at the wafer surface facing laser irradiation (instead of, for example, focusing the laser beam on top of a mask layer) results in higher process quality. Higher process quality resulting from focusing the laser beam at the wafer surface is due, at least in part, to the greater sensitivity of device layers to laser processing conditions than mask layers. For example, device layers, which can include dielectric materials, can be more susceptible to delamination and cracking than mask layers.
- a method and apparatus to precisely place the laser focus plane on the wafer surface has the potential to improve dicing yield.
- accurately determining the laser focus plane of the wafer is difficult due to, for example, variations in wafer thickness, dicing tape thickness, and/or mask thickness.
- the wafer thickness variation can be approximately + 10 ⁇ from wafer to wafer.
- the wafer thickness variation can be approximately + 20 ⁇ from wafer to wafer.
- the tape thickness variation can be approximately + 10 ⁇ .
- different tapes having different thicknesses can be used resulting in further variations (e.g., a 10% thickness variation may be typical for different tapes).
- the thickness variation of a mask layer depends on nominal mask thickness and wafer surface conditions (e.g., bump height, bump density, and other factors affecting wafer surface conditions).
- a nominally 50 ⁇ thick wafer mounted on a tape frame can have a total thickness variation of up to 40 ⁇ from wafer to wafer due to variations in wafer and tape thicknesses. Additionally, access to the thickness variations of wafers and tapes of other nominal thicknesses is limited. Such wide variations in wafer, tape, and mask thickness can result in inaccurate laser focusing. Inaccurate laser focusing due to such difficulties may cause non-uniform laser scribing kerf width and/or scribing depth, which affects dicing quality. Other thickness variations which are greater than or less than the abovementioned ranges can also result in reduced yields when performing laser scribing according to existing methods.
- a method includes determining a height of a wafer in a dicing street with an infrared laser, and patterning a mask disposed over the wafer with a laser scribing process with a focus plane at the determined wafer height in the dicing street.
- Figure la illustrates laser scribing a semiconductor wafer with a focal plane at the wafer surface using the exemplary system in Figure lb, in accordance with an embodiment of the present invention.
- the laser scribing described herein can be used in a wafer dicing method.
- a chuck 102 holds a sample 108.
- the chuck 102 can be any suitable chuck for holding a substrate or wafer during processing.
- the chuck 102 can be a Johnsen-Rahbeck, coulombic electrostatic chuck (ESC), or other ESC to hold the sample 108.
- the sample 108 can include a semiconductor wafer or substrate over which one or more other layers are disposed.
- the sample 108 can include a wafer as illustrated in Figure 3A, Figure 3B, and Figure 4.
- Figures 3A and 3B illustrate cross-sectional views of a semiconductor wafer including a substrate layer, an integrated circuit or device layer, and a passivation layer.
- Figure 4 illustrates a cross-sectional view of a stack of materials that may be used in a street region of a semiconductor wafer or substrate.
- the sample 108 may include multiple layers as in Figures 3A, 3B, and 4, for simplicity, the sample 108 is depicted as a single layer.
- the sample 108 can be disposed on dicing tape 104 and supported by a frame 106.
- Figure lb illustrates an example of a scribing laser system 130.
- the system 130 includes a scribing laser source (e.g., a micromachining laser) that produces a scribing laser beam 114, which the system 130 directs through a focus lens 112 to the sample 108.
- the scribing laser beam 114 is focused with the focus lens 112 at a working distance 116 from the surface of the mask layer 110.
- the system 130 determines the height of the surface of the wafer.
- the system 100 employs a wafer surface detection module 150.
- the wafer surface detection module can include a surface detection laser 155 and a vision module or optical sensor 157.
- the wafer surface detection module can also include a detection module controller 159 to control operation of the surface detection laser 155 and the optical sensor 157.
- the controller 159 controls the parameters of the surface detection laser 155 and controls when the surface detection laser 155 and the optical sensor 157 are operating.
- the surface detection laser 155 emits a laser beam that reflects from the surface of the wafer.
- the surface detection laser 155 can emit a laser beam having a wavelength in the visible spectrum, the ultra-violet (UV), or infra-red (IR) ranges (the three totaling a broadband optical spectrum).
- the optical sensor 157 detects the reflected laser beam.
- the wafer surface detection module 150 determines the surface height based on the time between the emission and detection of the reflected laser beam and the laser triangulation principle.
- the "height" of the wafer surface can be measured from a reference point or plane 118.
- the reference point or plane 118 can also be referred to as a homing position.
- the mask layer 110 disposed above the wafer is formed from a material that permits transmission of the detection laser beam.
- the detection laser is transmitted through the mask layer 110 disposed over the wafer, and reflected from a layer under the mask layer.
- the mask layer 110 can be formed from PVA.
- an infrared laser detection beam is transmitted through a PVA mask layer and reflected from the wafer surface.
- the system 130 can employ other optical systems.
- the optical sensor can include a camera detecting light in the visible spectrum, or any other suitable optical sensor.
- the system employs a camera to automatically search for and identify an image plane of a target.
- a camera system can search for an alignment mark or a test pattern on the wafer surface along the dicing street of device wafers. Alignment marks typically have a short height (e.g., having a submicron height), so the thickness of alignment marks can be ignored in determining the position of image plane.
- the system can then use the position of the identified image plane, and compute the wafer surface height based on the identified image plane (e.g., using triangulation principles).
- the system performs the wafer height measurements in a dicing street.
- the system 130 can use the wafer surface detection module 150 to measure the height of the wafer surface at several different locations in the dicing streets on a wafer to get an average height of wafer surface.
- Performing measurements in the dicing street can result in more accurate measurements because dies can include layers with bumps (e.g., up to 50 ⁇ bumps).
- the dicing streets typically do not include large bumps such as those on other areas of the wafer. Therefore, taking measurements of the height of the wafer surface in the dicing street can avoid inaccurate readings resulting from the bumps on each die.
- other embodiments may include measuring the wafer height at other areas of the wafer without large bumps.
- the height of the semiconductor wafer surface obtained by the wafer surface detection module 150 is the desired laser focus plane.
- the system 150 reports the determined height of the wafer surface to a scribing laser controller 147 of a laser scribing module 140.
- the scribing laser controller can adjust the focus plane of a scribing laser 145 from wafer to wafer based on the determined height of the wafer. After adjusting the focus plane at the wafer surface, the scribing laser 145 scribes the wafer.
- the modules are illustrated separately for clarity, other configurations are possible.
- a single controller can encompass logic to control the scribing laser 145, the surface detection laser 155, and/or the optical sensor 157.
- FIG. 2 is a flowchart representing operations in a method of laser scribing a mask in accordance with an embodiment of the present invention.
- the method 200 begins with a laser detection system (e.g., the wafer surface detection module 150 of Figure lb) directing a laser beam to a dicing street of the semiconductor wafer at operation 202.
- a laser detection system e.g., the wafer surface detection module 150 of Figure lb
- the laser detection system directs the laser at a sample such as those depicted in Figures 3A and 4 in a dicing street.
- the laser beam is to be transmitted through the mask and reflect from the semiconductor surface disposed under the mask.
- An optical sensor detects the reflected laser beam at operation 204.
- the laser detection system can perform operations 202 and 204 one or more times.
- the system can take an average of the performed measurements.
- the system determines the height of the semiconductor wafer in the dicing street based on the reflected laser beam.
- a scribing laser patterns the mask with a laser scribing process. The laser scribing process focuses a scribing laser beam at a plane corresponding to the determined height of the semiconductor wafer in the dicing street.
- Figures 3A and 3B illustrate cross-sectional views of a semiconductor wafer including a plurality of integrated circuits before and after performance of a method of laser scribing the semiconductor wafer in accordance with embodiments of the present invention.
- the samples in Figures 3A and 3B include a front side mask 302 formed above a semiconductor wafer or substrate 304.
- the semiconductor wafer or substrate 304 has a diameter of at least 300 mm and has a thickness of 300 ⁇ to 800 ⁇ .
- the semiconductor substrate 304 has a diameter of ⁇ to 800 ⁇ .
- the mask is a conformal mask.
- Conformal mask embodiments advantageously ensure sufficient thickness of the mask over an underlying topography (e.g., 20 ⁇ bumps, not shown) to survive the duration of a plasma etch dicing operation.
- the mask is a non-conformal, planarized mask (e.g., thickness of the mask over a bump is less than thickness of the mask in a valley). Formation of a conformal mask may be by CVD, for example, or by any other process known in the art.
- the mask 302 covers and protects integrated circuits (ICs) formed on the surface of semiconductor wafer and also protects bump projecting or protruding up 10-20 ⁇ from the surface of the semiconductor wafer. The mask 302 also covers intervening streets formed between adjacent ones of the integrated circuits.
- a layer such as, but not limited to, a water-soluble layer (PVA, etc.) that permits transmission of a laser beam or other light source (e.g., a laser emitted by surface detection laser 155 of Figure lb) for determining the height of the wafer surface.
- the mask 302 can also include a photo-resist layer, and/or an I- line patterning layer.
- a polymer layer such as a photo-resist layer may be composed of a material otherwise suitable for use in a lithographic process.
- a water-soluble base coat may be disposed below a non- water- soluble overcoat.
- the basecoat then provides a means of stripping the overcoat while the overcoat provides plasma etch resistance and/or for good mask ablation by the laser scribing process.
- mask materials transparent to the laser wavelength employed in the scribing process contribute to low die edge strength.
- a water-soluble base coat, of PVA for example, as the first mask material layer, may function as a means of undercutting a plasma-resistant/laser energy absorbing overcoat layer of the mask so that the entire mask may be removed/lifted off from the underlying integrated circuit (IC) thin film layer.
- the water-soluble base coat may further serve as a barrier protecting the IC thin film layer from the process used to strip the energy absorbing mask layer.
- the laser energy absorbing mask layer is UV-curable and/or UV absorbing, and/or green-band (500-540 nm) absorbing.
- Exemplary materials include many photo-resists and polyimide (PI) materials conventionally employed for passivation layers of IC chips.
- the photo-resist layer is composed of a positive photo-resist material such as, but not limited to, a 248 nanometer (nm) resist, a 193 nm resist, a 157 nm resist, an extreme ultraviolet (EUV) resist, or a phenolic resin matrix with a diazonaphthoquinone sensitizer.
- the photo-resist layer is composed of a negative photo-resist material such as, but not limited to, poly-cis-isoprene and poly-vinyl-cinnamate.
- the semiconductor wafer or substrate 304 has disposed thereon or therein, as a portion of the integrated circuits 306, an array of semiconductor devices.
- semiconductor devices include, but are not limited to, memory devices or complimentary metal- oxide-semiconductor (CMOS) transistors fabricated in a silicon substrate and encased in a dielectric layer.
- CMOS complimentary metal- oxide-semiconductor
- a plurality of metal interconnects may be formed above the devices or transistors, and in surrounding dielectric layers, and may be used to electrically couple the devices or transistors to form the integrated circuits.
- Conductive bumps and passivation layers 308 may be formed above the interconnect layers.
- Materials making up the streets may be similar to or the same as those materials used to form the integrated circuits.
- streets may be composed of layers of dielectric materials, semiconductor materials, and metallization. In one embodiment, one or more of the streets includes test devices similar to the actual devices of the integrated circuits.
- Figure 3B illustrates the sample of 3A after laser scribing.
- the laser scribing process is performed generally to remove the material of the streets present between the integrated circuits 306, although embodiments of the invention may apply to other laser scribing applications.
- patterning the mask 302 with the laser scribing process includes forming trenches 310 partially into the regions of the semiconductor wafer between the integrated circuits.
- patterning the mask with the laser scribing process includes direct writing a pattern using a laser having a pulse width in the femtosecond range.
- a scribing laser with a wavelength in the visible spectrum or the ultra-violet (UV) or infra-red (IR) ranges may be used to provide a femtosecond-based laser, i.e., a laser with a pulse width on the order of the femtosecond (10 ⁇ 15 seconds).
- ablation is not, or is essentially not, wavelength dependent and is thus suitable for complex films such as films of the mask, the streets and, possibly, a portion of the semiconductor wafer or substrate.
- Laser parameters selection may be critical to developing a successful laser scribing and dicing process that minimizes chipping, microcracks, and delamination in order to achieve clean laser scribe cuts. The cleaner the laser scribe cut, the smoother an etch process that may be performed for ultimate die singulation.
- semiconductor device wafers many functional layers of different material types (e.g., conductors, insulators, semiconductors) and thicknesses are typically disposed thereon. Such materials may include, but are not limited to, organic materials such as polymers, metals, or inorganic dielectrics such as silicon dioxide and silicon nitride.
- a street between individual integrated circuits disposed on a wafer or substrate may include the similar or same layers as the integrated circuits themselves.
- Figure 4 illustrates a cross-sectional view of a stack of materials that may be used in a street region of a semiconductor wafer or substrate, in accordance with an embodiment of the present invention.
- a street region 400 includes the top portion 402 of a silicon substrate, a first silicon dioxide layer 404, a first etch stop layer 406, a first low K dielectric layer 408 (e.g., having a dielectric constant of less than the dielectric constant of 4.0 for silicon dioxide), a second etch stop layer 410, a second low K dielectric layer 412, a third etch stop layer 414, an undoped silica glass (USG) layer 416, a second silicon dioxide layer 418, and a layer of photoresist 420 or some other mask.
- Copper metallization 422 is disposed between the first and third etch stop layers 406 and 414 and through the second etch stop layer 410.
- the first, second and third etch stop layers 406, 410 and 414 are composed of silicon nitride, while low K dielectric layers 408 and 412 are composed of a carbon-doped silicon oxide material.
- the materials of street 400 may behave quite differently in terms of optical absorption and ablation mechanisms.
- dielectrics layers such as silicon dioxide, is essentially transparent to all commercially available laser wavelengths under normal conditions.
- metals, organics (e.g., low K materials) and silicon can couple photons very easily, particularly in response to nanosecond-based or picosecond-based laser irradiation.
- a femtosecond-based laser process is used to pattern a layer of silicon dioxide, a layer of low K material, and a layer of copper by ablating the layer of silicon dioxide prior to ablating the layer of low K material and the layer of copper.
- pulses of approximately less than or equal to 400 femtoseconds are used in a femtosecond-based laser irradiation process to remove a mask, a street, and a portion of a silicon substrate.
- pulses of approximately less than or equal to 500 femtoseconds are used.
- the femtosecond laser sources have a pulse width approximately in the range of 10 femtoseconds to 500 femtoseconds, although preferably in the range of 100 femtoseconds to 400 femtoseconds. In one embodiment, the femtosecond laser sources have a wavelength
- the laser and corresponding optical system provide a focal spot at the work surface approximately in the range of 3 microns to 15 microns, though preferably approximately in the range of 5 microns to 10 microns.
- the spacial beam profile of the scribing laser at the work surface may be a single mode (Gaussian) or have a shaped top-hat profile.
- the scribing laser source has a pulse repetition rate approximately in the range of 200 kHz to 10 MHz, although preferably approximately in the range of 500kHz to 5MHz.
- the laser source delivers pulse energy at the work surface approximately in the range of 0.5 ⁇ to 100 ⁇ , although preferably approximately in the range of ⁇ to 5 ⁇ .
- the laser scribing process runs along a work piece surface at a speed approximately in the range of 500mm/sec to 5m/sec, although preferably approximately in the range of 600mm/sec to 2m/sec.
- the scribing process may be run in single pass only, or in multiple passes, but, in an embodiment, preferably 1-2 passes.
- the scribing depth in the work piece is approximately in the range of 5 microns to 50 microns deep, preferably approximately in the range of 10 microns to 20 microns deep.
- the scribing laser may be applied either in a train of single pulses at a given pulse repetition rate or a train of pulse bursts.
- the kerf width of the laser beam generated is approximately in the range of 2 microns to 15 microns, although in silicon wafer scribing/dicing preferably approximately in the range of 6 microns to 10 microns, measured at the device/silicon interface.
- Scribing laser parameters may be selected with benefits and advantages such as providing sufficiently high laser intensity to achieve ionization of inorganic dielectrics (e.g., silicon dioxide) and to minimize delamination and chipping caused by underlayer damage prior to direct ablation of inorganic dielectrics. Also, parameters may be selected to provide meaningful process throughput for industrial applications with precisely controlled ablation width (e.g., kerf width) and depth. As described above, a femtosecond-based laser is far more suitable to providing such advantages, as compared with picosecond-based and nanosecond- based laser ablation processes. However, even in the spectrum of femtosecond-based laser ablation, certain wavelengths may provide better performance than others.
- inorganic dielectrics e.g., silicon dioxide
- parameters may be selected to provide meaningful process throughput for industrial applications with precisely controlled ablation width (e.g., kerf width) and depth.
- ablation width e.g., kerf width
- a femtosecond-based laser process having a wavelength close to or in the UV range provides a cleaner ablation process than a femtosecond-based laser process having a wavelength close to or in the IR range.
- a femtosecond-based laser process suitable for semiconductor wafer or substrate scribing is based on a laser having a wavelength of approximately less than or equal to 540 nanometers.
- pulses of approximately less than or equal to 400 femtoseconds of the laser having the wavelength of approximately less than or equal to 540 nanometers are used.
- dual laser wavelengths e.g., a combination of an IR laser and a UV laser
- plasma etching and die singulation may be performed after the laser scribing process.
- a process tool 500 includes a factory interface 502 (FI) having a plurality of load locks 504 coupled therewith.
- a cluster tool 506 is coupled with the factory interface 502.
- the cluster tool 506 includes one or more plasma etch chambers, such as anisotropic plasma etch chamber 508 and isotropic plasma etch chamber 514.
- a laser scribe apparatus 510 is also coupled to the factory interface 502.
- the overall footprint of the process tool 500 may be, in one embodiment, approximately 3500 millimeters (3.5 meters) by approximately 3800 millimeters (3.8 meters), as depicted in Figure 5.
- the laser scribe apparatus 510 houses a femtosecond-based laser.
- the femtosecond-based laser is suitable for performing a laser ablation portion of a hybrid laser and etch singulation process, such as the laser ablation processes described above.
- a moveable stage is also included in laser scribe apparatus 500, the moveable stage configured for moving a wafer or substrate (or a carrier thereof) relative to the femtosecond- based laser.
- the femtosecond-based laser is also moveable.
- the overall footprint of the laser scribe apparatus 510 may be, in one embodiment, approximately 2240 millimeters by approximately 1270 millimeters, as depicted in Figure 5.
- the laser scribe apparatus 510 can also include a laser detection module as described with reference to Figures la and lb (or other apparatus for detecting height of a wafer) to direct a laser beam to a dicing street of the semiconductor wafer.
- the detection laser beam is to be transmitted through the mask and reflect from a layer disposed under the mask.
- the laser detection module can also include an optical sensor to detect a height of the layer disposed under the mask based on the reflected laser beam.
- a laser detection module or system can also be embodied elsewhere (e.g., as a separate module).
- the one or more plasma etch chambers 508 is configured for etching a wafer or substrate through the gaps in a patterned mask to singulate a plurality of integrated circuits.
- the one or more plasma etch chambers 508 is configured to perform a deep silicon etch process.
- the one or more plasma etch chambers 508 is an Applied Centura® SilviaTM Etch system, available from Applied Materials of Sunnyvale, CA, USA.
- the etch chamber may be specifically designed for a deep silicon etch used to create singulate integrated circuits housed on or in single crystalline silicon substrates or wafers.
- a high-density plasma source is included in the plasma etch chamber 508 to facilitate high silicon etch rates.
- more than one etch chamber is included in the cluster tool 506 portion of process tool 500 to enable high
- the factory interface 502 may be a suitable atmospheric port to interface between an outside manufacturing facility with laser scribe apparatus 510 and cluster tool 506.
- the factory interface 502 may include robots with arms or blades for transferring wafers (or carriers thereof) from storage units (such as front opening unified pods) into either cluster tool 506 or laser scribe apparatus 510, or both.
- Cluster tool 506 may include other chambers suitable for performing functions in a method of singulation.
- a deposition chamber 512 is included in place of an additional etch chamber.
- the deposition chamber 512 may be configured for mask deposition on or above a device layer of a wafer or substrate prior to laser scribing of the wafer or substrate, e.g., by a uniform spin-on process.
- the deposition chamber 512 is suitable for depositing a uniform layer with a conformality factor within approximately 10%.
- the isotropic plasma etch chamber 514 is employs a downstream plasma source, such as a high frequency magnetron or inductively coupled source disposed a distance upstream of a process chamber where a substrate is housed during isotropic etch processing described elsewhere herein.
- a downstream plasma source such as a high frequency magnetron or inductively coupled source disposed a distance upstream of a process chamber where a substrate is housed during isotropic etch processing described elsewhere herein.
- the isotropic plasma etch chamber 514 is plumbed to use exemplary non-polymerizing plasma etch source gases, such as one or more of NF 3 or SF 6 , Cl 2 or S1F 4 , and one or more oxidizers, such as 0 2 .
- Figure 6 illustrates a computer system 600 within which a set of instructions, for causing the machine to execute one or more of the scribing methods discussed herein may be executed.
- the exemplary computer system 600 includes a processor 602, a main memory 604 (e.g., read-only memory (ROM), flash memory, dynamic random access memory (DRAM) such as synchronous DRAM (SDRAM) or Rambus DRAM (RDRAM), etc.), a static memory 606 (e.g., flash memory, static random access memory (SRAM), etc.), and a secondary memory 618 (e.g., a data storage device), which communicate with each other via a bus 630.
- main memory 604 e.g., read-only memory (ROM), flash memory, dynamic random access memory (DRAM) such as synchronous DRAM (SDRAM) or Rambus DRAM (RDRAM), etc.
- static memory 606 e.g., flash memory, static random access memory (SRAM), etc.
- secondary memory 618 e.g.,
- Processor 602 represents one or more general-purpose processing devices such as a microprocessor, central processing unit, or the like. More particularly, the processor 602 may be a complex instruction set computing (CISC) microprocessor, reduced instruction set computing (RISC) microprocessor, very long instruction word (VLIW) microprocessor, etc. Processor 602 may also be one or more special-purpose processing devices such as an application specific integrated circuit (ASIC), a field programmable gate array (FPGA), a digital signal processor (DSP), network processor, or the like. Processor 602 is configured to execute the processing logic 626 for performing the operations and steps discussed herein.
- CISC complex instruction set computing
- RISC reduced instruction set computing
- VLIW very long instruction word
- Processor 602 may also be one or more special-purpose processing devices such as an application specific integrated circuit (ASIC), a field programmable gate array (FPGA), a digital signal processor (DSP), network processor, or the like.
- ASIC application specific integrated circuit
- FPGA field programm
- the computer system 600 may further include a network interface device 608.
- the computer system 600 also may include a video display unit 610 (e.g., a liquid crystal display (LCD) or a cathode ray tube (CRT)), an alphanumeric input device 612 (e.g., a keyboard), a cursor control device 614 (e.g., a mouse), and a signal generation device 616 (e.g., a speaker).
- a video display unit 610 e.g., a liquid crystal display (LCD) or a cathode ray tube (CRT)
- an alphanumeric input device 612 e.g., a keyboard
- a cursor control device 614 e.g., a mouse
- a signal generation device 616 e.g., a speaker
- the secondary memory 618 may include a machine-accessible storage medium
- the software 622 may also reside, completely or at least partially, within the main memory 604 and/or within the processor 602 during execution thereof by the computer system 600, the main memory 604 and the processor 602 also constituting machine- readable storage media.
- the software 622 may further be transmitted or received over a network 620 via the network interface device 608.
- machine-accessible storage medium 631 is shown in an exemplary embodiment to be a single medium, the term “machine-readable storage medium” should be taken to include a single medium or multiple media (e.g., a centralized or distributed database, and/or associated caches and servers) that store the one or more sets of instructions.
- the term “machine-readable storage medium” shall also be taken to include any medium that is capable of storing or encoding a set of instructions for execution by the machine and that cause the machine to perform any one or more of the methodologies of the present invention.
- the term “machine- readable storage medium” shall accordingly be taken to include, but not be limited to, solid-state memories, optical and magnetic media, and other non-transitory machine-readable storage medium.
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Laser Beam Processing (AREA)
- Dicing (AREA)
Abstract
La présente invention se rapporte, dans des modes de réalisation, à un procédé de traçage par laser d'un masque disposé sur une tranche de semi-conducteur, ledit procédé consistant à déterminer la hauteur du semi-conducteur sur lequel est disposée une couche de masque avant de tracer par laser la couche de masque. Selon un mode de réalisation, le procédé consiste à : déterminer la hauteur de la tranche de semi-conducteur sous le masque dans une bande de découpage en dés à l'aide d'un capteur optique et décorer d'un motif le masque avec un procédé de traçage par laser. Le procédé de traçage par laser concentre un faisceau laser de traçage selon un plan qui correspond à la hauteur déterminée de la tranche de semi-conducteur dans la bande de découpage en dés. Des exemples de la détermination de la hauteur de la tranche de semi-conducteur peuvent consister à diriger un faisceau laser vers la bande de découpage en dés de la tranche de semi-conducteur qui est transmis à travers le masque et réfléchi par la tranche et à identifier une image sur une surface de la tranche sous le masque avec une caméra.
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US201361860796P | 2013-07-31 | 2013-07-31 | |
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US14/035,402 | 2013-09-24 | ||
US14/035,402 US20150037915A1 (en) | 2013-07-31 | 2013-09-24 | Method and system for laser focus plane determination in a laser scribing process |
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WO2015017097A1 true WO2015017097A1 (fr) | 2015-02-05 |
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US (1) | US20150037915A1 (fr) |
TW (1) | TWI629750B (fr) |
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CN110587157A (zh) * | 2019-08-28 | 2019-12-20 | 东莞南玻太阳能玻璃有限公司 | 一种太阳能压花玻璃激光钻孔辅助液及其制备方法 |
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US20080180697A1 (en) * | 2006-12-20 | 2008-07-31 | Disco Corporation | Measuring instrument and laser beam machine for wafer |
JP2011199673A (ja) * | 2010-03-19 | 2011-10-06 | Seiko Instruments Inc | 水晶基板のエッチング方法、圧電振動片、圧電振動子、発振器、電子機器、および電波時計 |
US20110312157A1 (en) * | 2010-06-22 | 2011-12-22 | Wei-Sheng Lei | Wafer dicing using femtosecond-based laser and plasma etch |
US20130017668A1 (en) * | 2011-07-11 | 2013-01-17 | Wei-Sheng Lei | Wafer dicing using hybrid split-beam laser scribing process with plasma etch |
Cited By (5)
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WO2017185100A1 (fr) * | 2016-04-22 | 2017-10-26 | Texas Instruments Incorporated | Procédé permettant d'améliorer les performances d'un transistor |
US10431684B2 (en) | 2016-04-22 | 2019-10-01 | Texas Instruments Incorporated | Method for improving transistor performance |
US12087859B2 (en) | 2016-04-22 | 2024-09-10 | Texas Instruments Incorporated | Method for improving transistor performance |
CN110190010A (zh) * | 2019-05-17 | 2019-08-30 | 福建兆元光电有限公司 | 半导体晶片划片装置及划片方法 |
CN110190010B (zh) * | 2019-05-17 | 2024-04-23 | 福建兆元光电有限公司 | 半导体晶片划片装置及划片方法 |
Also Published As
Publication number | Publication date |
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US20150037915A1 (en) | 2015-02-05 |
TWI629750B (zh) | 2018-07-11 |
TW201515150A (zh) | 2015-04-16 |
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