WO2015004990A1 - 電力用半導体モジュール - Google Patents
電力用半導体モジュール Download PDFInfo
- Publication number
- WO2015004990A1 WO2015004990A1 PCT/JP2014/063015 JP2014063015W WO2015004990A1 WO 2015004990 A1 WO2015004990 A1 WO 2015004990A1 JP 2014063015 W JP2014063015 W JP 2014063015W WO 2015004990 A1 WO2015004990 A1 WO 2015004990A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- holding member
- external connection
- relay
- substrate
- terminal holding
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 79
- 239000000758 substrate Substances 0.000 claims abstract description 106
- 229910000679 solder Inorganic materials 0.000 claims abstract description 58
- 238000005476 soldering Methods 0.000 abstract description 7
- 239000007858 starting material Substances 0.000 description 11
- 229920003002 synthetic resin Polymers 0.000 description 9
- 239000000057 synthetic resin Substances 0.000 description 9
- 239000002184 metal Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 239000004020 conductor Substances 0.000 description 5
- 238000003466 welding Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 238000010030 laminating Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H45/00—Details of relays
- H01H45/02—Bases; Casings; Covers
- H01H45/04—Mounting complete relay or separate parts of relay on a base or inside a case
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
- F02N—STARTING OF COMBUSTION ENGINES; STARTING AIDS FOR SUCH ENGINES, NOT OTHERWISE PROVIDED FOR
- F02N11/00—Starting of engines by means of electric motors
- F02N11/08—Circuits or control means specially adapted for starting of engines
- F02N11/087—Details of the switching means in starting circuits, e.g. relays or electronic switches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0247—Electrical details of casings, e.g. terminals, passages for cables or wiring
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
- F02N—STARTING OF COMBUSTION ENGINES; STARTING AIDS FOR SUCH ENGINES, NOT OTHERWISE PROVIDED FOR
- F02N15/00—Other power-operated starting apparatus; Component parts, details, or accessories, not provided for in, or of interest apart from groups F02N5/00 - F02N13/00
- F02N15/02—Gearing between starting-engines and started engines; Engagement or disengagement thereof
- F02N15/04—Gearing between starting-engines and started engines; Engagement or disengagement thereof the gearing including disengaging toothed gears
- F02N15/06—Gearing between starting-engines and started engines; Engagement or disengagement thereof the gearing including disengaging toothed gears the toothed gears being moved by axial displacement
- F02N15/067—Gearing between starting-engines and started engines; Engagement or disengagement thereof the gearing including disengaging toothed gears the toothed gears being moved by axial displacement the starter comprising an electro-magnetically actuated lever
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
- F02N—STARTING OF COMBUSTION ENGINES; STARTING AIDS FOR SUCH ENGINES, NOT OTHERWISE PROVIDED FOR
- F02N11/00—Starting of engines by means of electric motors
- F02N11/08—Circuits or control means specially adapted for starting of engines
- F02N11/087—Details of the switching means in starting circuits, e.g. relays or electronic switches
- F02N2011/0874—Details of the switching means in starting circuits, e.g. relays or electronic switches characterised by said switch being an electronic switch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1031—Surface mounted metallic connector elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10424—Frame holders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the present invention relates to a power semiconductor module, and more particularly to a power semiconductor power module including a relay terminal for connection between a substrate and an external connection terminal.
- a device in which a drive device and a control device are integrated is required.
- relay terminals are used as an alternative to wire bonding.
- the current flowing through the relay terminal becomes large as the capacity increases, and the amount of heat generation is large. Therefore, a difference in thermal expansion occurs between the substrate and the relay terminal, stress is generated in the soldered portion, and there is a concern that the solder life may be reduced.
- the temperature cycle of the soldered portion is achieved by soldering the first layer made of the first material having a thermal expansion coefficient close to that of the substrate to the substrate.
- the thing which reduced the damage by repetition of and improved durability is known (for example, refer patent document 2).
- Patent Document 1 a copper material pre-annealed for the relay terminal is used, and a bend structure is adopted in the lower part, and as in Patent Document 2, the substrate and the thermal expansion coefficient approximate each other
- the structure in which the first layer made of the material of 1 is soldered to the substrate has the effect of alleviating the stress applied to the soldered part, which is generated due to the thermal expansion difference between the substrate and the relay terminal.
- the initial stress at the time of connection of the relay terminal and the external connection terminal can not be relaxed.
- the relay terminal is solder-bonded to the substrate by the solder reflow furnace together with the electronic component mounted on the substrate. These relay terminals and electronic components are mounted on the solder printed on the conductor pattern of the substrate.
- the timing of melting of the solder differs due to the variation of the temperature in the furnace and the difference of the heat capacity of the mounted parts, the tension of the solder melted first acts on the electronic parts and the electronic parts deviate from the predetermined position It is well known that they are soldered together. The same is true for the relay terminal, and for the above reason, it is soldered out of the predetermined position.
- This stress is constantly applied to the soldered portion as an initial stress, and is combined with the stress of the soldered portion due to the thermal expansion difference, resulting in a decrease in the solder life.
- the connection with the external connection terminal can not be sufficiently performed, and even if the connection can be made, the necessary welding strength and melting cross-sectional area can not be obtained. It will be a low product.
- An object of the present invention is to provide a power semiconductor module capable of relieving stress generated in a soldered portion of a relay terminal.
- a bonding surface of a substrate, a relay terminal connected to the substrate via a solder, an external connection terminal bonded to the relay terminal, and the solder And a non-conductive relay terminal holding member for holding an end of the relay terminal on the side.
- FIG. 1 is an exploded perspective view of a power semiconductor module according to a first embodiment of the present invention. It is the disassembled perspective view which looked the semiconductor module for electric power shown by FIG. 1A from another direction.
- FIG. 1 is a plan view of a power semiconductor module according to a first embodiment of the present invention.
- FIG. 3 is a cross-sectional view showing a cross section AA of FIG. 2;
- FIG. 6 is an exploded view of a power semiconductor module according to a second embodiment of the present invention. It is sectional drawing of the semiconductor module for electric power by the 2nd Embodiment of this invention.
- FIG. 7 is an exploded view of a power semiconductor module according to a third embodiment of the present invention.
- FIG. 12 is a cross-sectional view showing a cross section BB of FIG. 11;
- the configuration of the power semiconductor module according to the first to fourth embodiments of the present invention will be described below with reference to FIGS. 1 to 12.
- the power semiconductor module controls, for example, driving of a load (motor, solenoid, etc.) used in a vehicle.
- a load motor, solenoid, etc.
- the same parts are denoted by the same reference numerals.
- FIG. 1A is an exploded perspective view of a power semiconductor module 1 according to a first embodiment of the present invention.
- the power semiconductor module 1 of this embodiment is configured by laminating the substrate 2, the relay terminal holding member 6, and the external connection terminal holding member 11.
- the rectangular substrate 2 is provided with at least one through hole 5 engaged with the convex portion 7 (FIG. 1B) of the relay terminal holding member 6.
- FIG. 1A two through holes 5 are displayed as an example.
- the rectangular frame-shaped relay terminal holding member 6 is formed of an insulating member made of synthetic resin or the like.
- the relay terminal holding member 6 is provided with an opening OP1 inside.
- the relay terminals 9 and 10 are fitted and embedded in the relay terminal holding member 6.
- the relay terminals 9 and 10 are arranged so as to be determined at optimum positions when they are joined to the external connection terminals 13 and 14.
- the relay terminal holding member 6 is provided with at least one convex portion 8 engaged with the concave portion 12 of the external connection terminal holding member 11. In FIG. 1A, two convex portions 8 are displayed as an example.
- the relay terminal 9 is a power system terminal
- the relay terminal 10 is a signal system terminal.
- a specific example of the relay terminals 9 and 10 will be described later with reference to FIG.
- the square frame shaped external connection terminal holding member 11 is formed of an insulating member made of synthetic resin or the like.
- the external connection terminal holding member 11 has an opening OP2 inside.
- the external connection terminals 13 and 14 are fitted and embedded in the external connection terminal holding member 11.
- the external connection terminals 13 and 14 are arranged so as to be determined at optimum positions when they are joined to the relay terminals 9 and 10.
- the external connection terminal 13 is a power system terminal
- the external connection terminal 14 is a signal system terminal.
- the external connection terminals 13 and 14 are respectively connected to the relay terminals 9 and 10 to be connected to the substrate 2 via the relay terminals 9 and 10.
- FIG. 1B is an exploded perspective view of the power semiconductor module 1 shown in FIG. 1A as viewed from another direction.
- the external connection terminal holding member 11 is provided with at least one concave portion 12 that engages with the convex portion 8 (FIG. 1A) of the relay terminal holding member 6.
- FIG. 1B two recesses 12 are shown as an example.
- the relay terminal holding member 6 is provided with at least one convex portion 7 that engages with the concave portion 5 of the substrate 2.
- the convex part 7 is displayed two places as an example.
- FIG. 2 is a plan view of the power semiconductor module 1 according to the first embodiment of the present invention.
- the external connection terminals 13 and 14 and the relay terminals 9 and 10 are respectively welded. This welding is, for example, arc welding, resistance welding, etc., but is not limited thereto.
- the relay terminal holding member 6 holds the relay terminals 9 and 10 by the substantially U-shaped arm portion 6 a protruding toward the opening OP 1.
- FIG. 3 is a cross-sectional view showing a cross section AA of FIG.
- a wiring pattern 3 is formed on the metal base by a conductor via an insulating layer on a metal base, and a solder 4 is formed thereon.
- the relay terminals 9 and 10 are connected to the substrate 2 via the wiring pattern 3 and the solder 4.
- the relay terminals 9 and 10 are fitted with the fitting portion 17 of the relay terminal holding member 6 so as to be determined at an optimum position when they are joined to the external connection terminals 13 and 14. That is, the fitting portion 17 positions the relay terminals 9 and 10 such that the relay terminals 9 and 10 and the external connection terminals 13 and 14 at least contact at the time of bonding.
- the convex portion 8 provided on the relay terminal holding member 6 and the concave portion 12 provided on the external connection terminal holding member 11 are engaged, and the external connection terminals 13 and 14 are used as relay terminals 9 and 10, respectively. It is fitted with the fitting portion 18 of the external connection terminal holding member 11 so as to be determined at the optimum position at the time of joining.
- the relay terminals 9 and 10 and the external connection terminals 13 and 14 can secure necessary welding strength and a melting cross-sectional area.
- the nonconductive relay terminal holding member 6 holds the ends of the relay terminals 9 and 10 on the side of the joint surface with the solder 4. Further, as shown in FIG. 3, the external connection terminal holding member 11, the relay terminal holding member 6, and the substrate 2 are stacked.
- the relative positional accuracy between the relay terminals 9 and 10 and the external connection terminals 13 and 14 is improved. That is, the relay terminals 9 and 10 do not shift in position during the solder reflow. Therefore, when joining the relay terminals 9 and 10 and the external connection terminals 13 and 14, respectively, there is no need to forcibly bend and align the relay terminals 9 and 10, and stress on the soldered portion can be relaxed. , Can improve the solder life. The same effect can be obtained by performing solder reflow after laminating the external connection terminal holding member 11, the relay terminal holding member 6, and the substrate 2.
- FIG. 4 is an exploded view of a power semiconductor module 1 according to a second embodiment of the present invention.
- the jig 21 is a jig used at the time of solder reflow, and is used when the relay terminals 9 and 10 are soldered to the substrate 2.
- the jig 21 is provided with at least one convex portion 22 engaged with the through hole 15 of the substrate 2. Furthermore, the jig 21 is provided with at least one concave portion 23 engaged with the convex portion 25 of the relay terminal holding member 6.
- FIG. 4 as an example, one protrusion 22 and one recess 23 are displayed.
- a wiring pattern 3 is formed on the metal base by a conductor via an insulating layer on a metal base, and a solder 4 is formed thereon.
- the substrate 2 is provided with at least one or more through holes 15 that engage with the convex portions 24 of the external connection terminal holding member 11. In FIG. 4, one through hole 15 is displayed as an example.
- the through holes 15 engaged with the protrusions 24 of the external connection terminal holding member 11 of the substrate 2 play a role of engaging with the protrusions 22 of the jig 21 at the time of solder reflow.
- the relay terminal holding member 6 is formed of an insulating member made of synthetic resin or the like, and includes at least one convex portion 25 engaged with the concave portion 23 of the jig 21. In FIG. 4, as an example, one convex portion 25 is displayed.
- relay terminals 9 and 10 are fitted and embedded in the fitting portion 17 of the relay terminal holding member 6 so that the relay terminals 9 and 10 are determined at optimum positions when they are joined to the external connection terminals 13 and 14.
- the relay terminal 9 is a terminal of the power system, and the relay terminal 10 is a terminal of the signal system, and is joined to the wiring pattern 3 by the solder 4.
- the external connection terminal holding member 11 is formed of an insulating member made of synthetic resin or the like, and is provided with at least one convex portion 24 engaged with the through hole 15 of the substrate 2.
- one convex portion 24 is displayed as an example.
- the external connection terminals 13 and 14 are fitted and embedded in the fitting portion 18 of the external connection terminal holding member 11 so as to be determined at an optimal position when the relay connection terminals 9 and 10 are joined. .
- the external connection terminal 13 is a power system terminal
- the external connection terminal 14 is a signal system terminal, which are joined to the relay terminals 9 and 10 to form the substrate 2 via the relay terminals 9 and 10.
- the through holes 15 provided in the substrate 2 and the convex portions 22 provided in the jig 21 used for solder reflow are engaged, and the concave portions 23 provided in the jig 21 and the relay terminal holding member 6 are used.
- the provided convex portion 25 is engaged, and further, the relay terminals 9 and 10 are fitted with the fitting portion 17 of the relay terminal holding member 6.
- the relay terminals 9 and 10 are solder reflow-mounted on the substrate 2, the relay terminals 9 and 10 are disposed at predetermined positions without causing positional deviation.
- the relay terminals 9 and 10 are fitted with the fitting portion 17 of the relay terminal holding member 6 so as to be determined at an optimum position when they are joined to the external connection terminals 13 and 14.
- the through hole 15 provided in the substrate 2 and the convex portion 24 provided in the external connection terminal holding member 11 are engaged, and the external connection terminals 13 and 14 are joined to the relay terminals 9 and 10, respectively. It is fitted with the fitting portion 18 of the external connection terminal holding member 11 so as to be determined at the optimum position at that time.
- FIG. 5 is a cross-sectional view of a power semiconductor module according to a second embodiment of the present invention.
- the through holes 15 of the substrate 2 engage with the protrusions 22 of the jig 21.
- the substrate 2 is fixed to the jig 21.
- the convex portion 22 of the jig 21 is pulled out from the through hole 15 of the substrate 2 and, as shown in FIG. 5, the through hole 15 of the substrate 2 and the convex portion 24 of the external connection terminal holding member 11 Is engaged.
- the external connection terminal holding member 11 is fixed to the substrate 2.
- the substrate 2 and the relay terminal holding member 6 are stacked, and the substrate 2 and the external connection terminal holding member 11 are stacked. That is, the relay terminal holding member 6 and the external connection terminal holding member 11 are disposed on the substrate 2.
- the relative positional accuracy between the relay terminals 9 and 10 and the external connection terminals 13 and 14 is improved. That is, the relay terminals 9 and 10 do not shift in position during the solder reflow. Therefore, when joining the relay terminals 9 and 10 and the external connection terminals 13 and 14, respectively, there is no need to forcibly bend and align the relay terminals 9 and 10, and stress on the soldered portion can be relaxed. , Can improve the solder life. The same effect can be obtained even if the jig 21, the substrate 2, and the relay terminal holding member 6 are stacked, and after the jig 21, the substrate 2, and the external connection terminal holding member 11 are stacked, solder reflow is performed. Be
- FIG. 6 is an exploded view of a power semiconductor module 1 according to a third embodiment of the present invention.
- the jig 21 is a jig used at the time of solder reflow, and is used when the relay terminals 9 and 10 are soldered to the substrate 2.
- the jig 21 is provided with at least one convex portion 22 engaged with the through hole 16 of the substrate 2. Furthermore, the jig 21 is provided with at least one concave portion 23 engaged with the convex portion 25 of the relay terminal holding member 6. In FIG. 6, as an example, one convex portion 22 and one concave portion 23 are displayed.
- a wiring pattern 3 is formed on the metal base by a conductor via an insulating layer on a metal base, and a solder 4 is formed thereon.
- the substrate 2 is provided with at least one or more through holes 16 engaged with the convex portions 22 of the jig 21 at the time of solder reflow.
- one through hole 16 is displayed as an example.
- the relay terminal holding member 6 is formed of an insulating member made of synthetic resin or the like, and includes at least one convex portion 25 engaged with the concave portion 23 of the jig 21. In FIG. 6, as one example, one convex portion 25 is displayed.
- the relay terminals 9 and 10 are fitted and embedded in the fitting portion 17 of the relay terminal holding member 6 so as to be determined at an optimum position when joined to the external connection terminals 13 and 14. . Furthermore, the relay terminal holding member 6 is provided with at least one convex portion 8 that engages with the concave portion 12 of the external connection terminal holding member 11. In FIG. 6, one convex portion 8 is displayed as an example.
- the relay terminal 9 is a terminal of the power system, and the relay terminal 10 is a terminal of the signal system, and is joined to the wiring pattern 3 by the solder 4.
- the external connection terminal holding member 11 is formed of an insulating member made of synthetic resin or the like, and includes at least one concave portion 12 engaged with the convex portion 8 of the relay terminal holding member 6.
- the recess 12 is displayed at one place as an example.
- the external connection terminals 13 and 14 are fitted and embedded in the fitting portions 18 of the external connection terminal holding member 11 so as to be determined at optimum positions when the relay connection terminals 9 and 10 are joined.
- the external connection terminal 13 is a power system terminal
- the external connection terminal 14 is a signal system terminal, which are joined to the relay terminals 9 and 10 to form the substrate 2 via the relay terminals 9 and 10.
- the through hole 16 provided in the substrate 2 and the convex part 22 provided in the jig 21 used for solder reflow are engaged, and the concave part 23 provided in the jig 21 and the relay terminal holding member 6 are provided.
- the provided convex portion 25 is engaged, and further, the relay terminals 9 and 10 are fitted with the fitting portion 17 of the relay terminal holding member 6.
- the relay terminals 9 and 10 are fitted with the fitting portion 17 of the relay terminal holding member 6 so as to be determined at an optimum position when they are joined to the external connection terminals 13 and 14.
- the convex portion 8 provided on the relay terminal holding member 6 and the concave portion 12 provided on the external connection terminal holding member 11 are engaged, and the external connection terminals 13 and 14 are used as relay terminals 9 and 10, respectively. It is fitted with the fitting portion 18 of the external connection terminal holding member 11 so as to be determined at the optimum position at the time of joining.
- FIG. 7 is a cross-sectional view of a power semiconductor module 1 according to a third embodiment of the present invention.
- the through holes 16 of the substrate 2 engage with the convex portions 22 of the jig 21.
- the substrate 2 is fixed to the jig 21.
- the convex portion 22 of the jig 21 is pulled out from the through hole 16 of the substrate 2.
- the relay terminal holding member 6 and the substrate 2 are fixed by an adhesive or the like.
- the external connection terminal holding member 11, the relay terminal holding member 6, and the substrate 2 are stacked.
- the relative positional accuracy between the relay terminals 9 and 10 and the external connection terminals 13 and 14 is improved. That is, the relay terminals 9 and 10 do not shift in position during the solder reflow. Therefore, when joining the relay terminals 9 and 10 and the external connection terminals 13 and 14, respectively, there is no need to forcibly bend and align the relay terminals 9 and 10, and stress on the soldered portion can be relaxed. , Can improve the solder life. The same effect can be obtained by performing solder reflow after laminating the external connection terminal holding member 11, the relay terminal holding member 6, the substrate 2, and the jig 21.
- FIG. 8 is an exploded view of a power semiconductor module 1 according to a fourth embodiment of the present invention.
- the jig 21 is a jig used at the time of solder reflow, and is used when the relay terminals 9 and 10 are soldered to the substrate 2.
- the jig 21 is provided with at least one convex portion 22 engaged with the through hole 31 of the substrate 2. Furthermore, the jig 21 is provided with at least one concave portion 23 engaged with the convex portion 25 of the relay terminal holding member 6. In FIG. 8, as an example, one protrusion 22 and one recess 23 are displayed.
- a wiring pattern 3 is formed on the metal base by a conductor via an insulating layer on a metal base, and a solder 4 is formed thereon.
- the substrate 2 is provided with at least one or more through holes 31 engaged with the convex portions 33 of the intermediate member 32. In FIG. 8, one through hole 31 is displayed as an example.
- the through hole 31 engaged with the convex portion 33 of the intermediate member 32 of the substrate 2 plays a role of engaging with the convex portion 22 of the jig 21 at the time of solder reflow.
- the relay terminal holding member 6 is formed of an insulating member made of synthetic resin or the like, and includes at least one convex portion 25 engaged with the concave portion 23 of the jig 21. In FIG. 8, as an example, one convex portion 25 is displayed.
- relay terminals 9 and 10 are fitted and embedded in the fitting portion 17 of the relay terminal holding member 6 so as to be determined at an optimum position when they are joined to the external connection terminals 13 and 14.
- the relay terminal 9 is a terminal of the power system, and the relay terminal 10 is a terminal of the signal system, and is joined to the wiring pattern 3 by the solder 4.
- the intermediate member 32 is formed of an insulating member made of synthetic resin or the like, or a conductive member such as a magnetic body, and includes at least one convex portion 33 engaged with the through hole 31 of the substrate 2. Further, the intermediate member 32 is provided with at least one convex portion 34 engaged with the concave portion 35 of the external connection terminal holding member 11. In FIG. 8, as an example, one protrusion 33 and one protrusion 34 are displayed.
- the external connection terminal holding member 11 is formed of an insulating member made of synthetic resin or the like, and is provided with at least one concave portion 35 engaged with the convex portion 34 of the intermediate member 32.
- one recess 35 is displayed as an example.
- the external connection terminals 13 and 14 are fitted and embedded in the fitting portion 18 of the external connection terminal holding member 11 so as to be determined at an optimal position when the relay connection terminals 9 and 10 are joined. .
- the external connection terminal 13 is a power system terminal
- the external connection terminal 14 is a signal system terminal, which are joined with the relay terminals 9 and 10 to connect the circuit board 2 via the relay terminals 9 and 10.
- the through hole 31 provided in the substrate 2 and the convex part 22 provided in the jig 21 used for solder reflow are engaged, and the concave part 23 provided in the jig 21 and the relay terminal holding member 6 are provided.
- the provided convex portion 25 is engaged, and further, the relay terminals 9 and 10 are fitted with the fitting portion 17 of the relay terminal holding member 6.
- the relay terminals 9 and 10 are fitted with the fitting portion 17 of the relay terminal holding member 6 so as to be determined at an optimum position when they are joined to the external connection terminals 13 and 14.
- the projection 33 provided on the intermediate member 32 and the through hole 31 provided on the substrate 2 are engaged with each other, and the projection 34 provided on the intermediate member 32 and the terminal holding member 11 for external connection are provided.
- the concave portion 35 is engaged, and the external connection terminals 13 and 14 are fitted to the fitting portion 18 of the external connection terminal holding member 11 so as to be determined at an optimum position when the relay terminals 9 and 10 are joined. United.
- FIG. 9 is a cross-sectional view of a power semiconductor module 1 according to a fourth embodiment of the present invention.
- the through holes 31 of the substrate 2 engage with the convex portions 22 of the jig 21.
- the substrate 2 is fixed to the jig 21.
- the convex portion 22 of the jig 21 is pulled out of the through hole 31 of the substrate 2, and as shown in FIG. 9, the through hole 31 of the substrate 2 and the convex portion 33 of the intermediate member 32 engage. .
- the intermediate member 32 is fixed to the substrate 2.
- the substrate 2 and the relay terminal holding member 6 are stacked, and the substrate 2, the intermediate member 32 and the external connection terminal holding member 11 are stacked.
- the relative positional accuracy between the relay terminals 9 and 10 and the external connection terminals 13 and 14 is improved. That is, the relay terminals 9 and 10 do not shift in position during the solder reflow. Therefore, when joining the relay terminals 9 and 10 and the external connection terminals 13 and 14, respectively, there is no need to forcibly bend and align the relay terminals 9 and 10, and stress on the soldered portion can be relaxed. , Can improve the solder life. Also, even if the jig 21, the substrate 2, and the relay terminal holding member 6 are stacked, and the jig 21, the substrate 2, the intermediate member 32, and the external connection terminal holding member 11 are stacked, solder reflow is performed similarly. The effect of
- each through hole, a convex part, and a recessed part are cylindrical shapes, a combination of two or more is preferable, and when it is other than a cylindrical shape, one or more combinations of asymmetric shapes are preferable (Not shown).
- the relay terminal 9 of the power system and the relay terminal 10 of the signal system are relay terminals 9 of a plurality of power systems and relays of a plurality of signal systems.
- the terminal 10 may be configured of one relay terminal holding member.
- the relay terminal 9 of the power system as one single body and the relay terminal 10 of the signal system as one single body may be configured by the single relay terminal holding member (not shown).
- the power system external connection terminal 13 and the signal system external connection terminal 14 hold the external connection terminal 13 for a plurality of power systems and the external connection terminal 14 for a plurality of signal systems. You may be comprised by the member. Furthermore, the external connection terminal 13 of the power system as one single body and the external connection terminal 14 as the single single body may each be configured by the single external connection terminal holding member (not shown).
- FIG. 10 is a circuit diagram of an engine starting device as an application example of the present invention.
- the engine starting device 100 moves the pinion 104 in the direction of the arrow by the operation of the magnet switch 102 and meshes with the ring gear 105 connected to the engine. Then, the engine is started by operating the starter motor 103 and rotating the crankshaft of the engine to control fuel and ignition.
- An engine control unit 107 is connected to a battery 108 mounted on a vehicle via an ignition switch 109.
- the magnet switch 102 and the starter motor 103 are controlled by a starter control unit 106.
- the magnet switch 102 and the starter motor 103 are connected to the semiconductor switches 131 and 132, the free wheeling diodes 133 and 134, and the like via the external connection terminals 111, 112, 113, and 114 and the relay terminals 121, 122, 123, and 124, respectively. It is connected.
- the semiconductor switches 131 and 132 are connected to the starter control unit 106.
- the starter control unit 106 drives the semiconductor switches 131 and 132 based on the signal from the engine control unit 107.
- the starter control unit 106 is connected to the engine control unit 107 and the ignition switch 109 via the relay terminals 125, 126, 127 and 128 through the external connection terminals 115, 116, 117 and 118.
- the power semiconductor module of this embodiment is applied to the portion indicated by reference numeral 101.
- the relay terminals 121, 122, 123, 124 correspond to the power system relay terminals 9
- the relay terminals 125, 126, 127, 128 correspond to the signal system relay terminals 10.
- the external connection terminals 111, 112, 113, and 114 correspond to the external connection terminal 13 of the power system, and the relay terminals 115, 116, 117, and 118 correspond to the external connection terminal 14 of the signal system.
- FIG. 11 is a plan view of the power semiconductor module 101 shown in FIG. 10, and FIG. 12 is a cross-sectional view taken along the line BB in FIG.
- the semiconductor switch 132 is connected on the substrate 2 via the wiring pattern 3 and the solder 4, and to the relay terminal 123 for power system and the external connection terminal 113 via the wiring pattern 3 and the solder 4. It is connected.
- the external connection terminal 113 is connected to the starter motor 103 (FIG. 10).
- the starter control unit 106 is connected to the substrate 2 via the wiring pattern 3 and the solder 4, and via the wiring pattern 3 and the solder 4, the relay terminal 127 for signal system and the external connection terminal It is connected to 117.
- the external connection terminal 117 is connected to the engine control unit 107 (FIG. 10).
- the through holes 5 provided in the substrate 2 and the convex portions 7 provided in the relay terminal holding member 6 are engaged, and the relay terminals 121, 122, 123, 124 of the power system and The relay terminals 125, 126, 127, and 128 of the signal system are fitted with the fitting portions 17 of the relay terminal holding member 6.
- the power system relay terminals 121, 122, 123 and 124 and the signal system relay terminals 125, 126, 127 and 128 respectively correspond to the power system external connection terminals 111, 112, 113 and 114 and the signal system. It is fitted with the fitting portion 17 so as to be determined at an optimum position when it is joined to the external connection terminals 115, 116, 117, 118.
- the convex portion 8 provided on the relay terminal holding member 6 and the concave portion 12 provided on the external connection terminal holding member 11 are engaged with each other, and the power system external connection terminals 111, 112, 113, 114 and Optimal when the external connection terminals 115, 116, 117, 118 of the signal system are joined to the relay terminals 121, 122, 123, 124 of the power system and the relay terminals 125, 126, 127, 128 of the signal system, respectively. It is fitted with the fitting portion 18 of the external connection terminal holding member 11 so as to be determined at the proper position.
- the power system relay terminals 121, 122, 123, 124 and the signal system relay terminals 125, 126, 127, 128 and the power system external connection terminal 111 The relative position accuracy of the terminals 112, 113, 114 and the external connection terminals 115, 116, 117, 118 of the signal system is improved. Therefore, when joining the two, there is no need to forcibly bend and align the power system relay terminals 121, 122, 123, 124 and the signal system relay terminals 125, 126, 127, 128. By relieving stress on the part, the solder life can be improved, and a long-life engine starting device can be provided.
- the present invention is not limited to the embodiments described above, but includes various modifications.
- the above-mentioned embodiment explains the present invention intelligibly, and is not necessarily limited to one having all the described configurations.
- part of the configuration of one embodiment can be replaced with the configuration of another embodiment, and the configuration of another embodiment can be added to the configuration of one embodiment.
- the openings OP1 and OP2 formed inside the power semiconductor module 1 may be filled with resin. This can improve the vibration resistance and corrosion resistance of the joint.
- SYMBOLS 1 semiconductor module for electric power 2 ... substrate 3 ... wiring pattern 4 ... solder 5 ... through hole for engagement with a relay terminal holding member of a substrate 6 ... relay terminal holding member 7 ... engagement with a substrate of relay terminal holding member Applicable convex part 8 ... Engaging convex part 9 with relay terminal holding member with external connection terminal holding member ... Power system relay terminal 10 ... Signal system relay terminal 11 ... External connection terminal holding member 12 ...
- External connection terminal 14 for power system External connection terminal 15 for signal system: Through hole for engagement with external connection terminal holding member for substrate 16: Through-hole 17 for engagement with a jig on the substrate 17: Positioning for positioning the relay terminal in such a positional relationship as to be able to be joined with the external connection terminal 18: Possible to join the external connection terminal with the relay terminal Positioning to be determined in the proper positional relationship Part 21 ... Jig 22 ... Convex part for engagement with the substrate of the jig 23 ... Concave part 24 for engagement with the relay terminal holding member of the jig ... Convex part 25 for engagement with the substrate for the external connection terminal holding member ...
- Convex part 31 for engagement of the relay terminal holding member with the jig 31 Through hole 32 for engagement with the intermediate member of the board Intermediate member 33
- Convex part 34 for engagement with the substrate of intermediate member
- Engine starting device 101 ...
- Semiconductor module for electric power 102 ...
- Magnet switch 103 ...
- Starter motor 104 ...
- Pinion 105 ... Ring Gear 106:
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Abstract
Description
以下、図1~図3を用いて、第1の実施形態による電力用半導体モジュールの全体構成について説明する。
第1~第4の実施形態において、
基板の中継用端子保持部材との係合用貫通穴5、
中継用端子保持部材の基板との係合用凸部7、
中継用端子保持部材の外部接続用端子保持部材との係合用凸部8、
外部接続用端子保持部材の中継用端子保持部材との係合用凹部12、
基板の外部接続用端子保持部材との係合用貫通穴15、
基板の治具との係合用貫通穴16、
治具の基板との係合用凸部22、
治具の中継用端子保持部材との係合用凹部23、
外部接続用端子保持部材の基板との係合用凸部24、
中継用端子保持部材の治具との係合用凸部25、
基板の中間部材との係合用貫通穴31、
中間部材の基板との係合用凸部33、
中間部材の外部接続用端子保持部材との係合用凸部34、
及び、外部接続用端子保持部材の中間部材との係合用凹部35、
は、本発明の効果が得られれば、それぞれの貫通穴、凸部、凹部は自由に組み合わせても良い(図示しない)。なお、これらの貫通穴、凸部、凹部は、係合部として機能する。
第1~第4の実施形態及び第1の変形例において、電力系の中継用端子9、信号系の中継用端子10は、複数の電力系の中継用端子9及び複数の信号系の中継用端子10が1つの中継用端子保持部材で構成されても良い。また、ひとつの単体として電力系の中継用端子9及びひとつの単体として信号系の中継用端子10がそれぞれ単体の中継用端子保持部材で構成されても良い(図示しない)。
次に、図10~図12を用いて、本発明の実施形態による電力用半導体モジュール1を用いたエンジン始動装置を一応用例として説明する。
2…基板
3…配線パターン
4…はんだ
5…基板の中継用端子保持部材との係合用貫通穴
6…中継用端子保持部材
7…中継用端子保持部材の基板との係合用凸部
8…中継用端子保持部材の外部接続用端子保持部材との係合用凸部
9…電力系の中継用端子
10…信号系の中継用端子
11…外部接続用端子保持部材
12…外部接続用端子保持部材の中継用端子保持部材との係合用凹部
13…電力系の外部接続用端子
14…信号系の外部接続用端子
15…基板の外部接続用端子保持部材との係合用貫通穴
16…基板の治具との係合用貫通穴
17…中継用端子を外部接続用端子と接合可能な位置関係に定まるように位置決めする嵌合部
18…外部接続用端子を中継用端子と接合可能な位置関係に定まるように位置決めする嵌合部
21…治具
22…治具の基板との係合用凸部
23…治具の中継用端子保持部材との係合用凹部
24…外部接続用端子保持部材の基板との係合用凸部
25…中継用端子保持部材の治具との係合用凸部
31…基板の中間部材との係合用貫通穴
32…中間部材
33…中間部材の基板との係合用凸部
34…中間部材の外部接続用端子保持部材との係合用凸部
35…外部接続用端子保持部材の中間部材との係合用凹部
100…エンジン始動装置
101…電力用半導体モジュール
102…マグネットスイッチ
103…スタータモータ
104…ピニオン
105…リングギア
106…スタータ制御部
107…エンジンコントロールユニット
108…バッテリ
109…イグニッションスイッチ
111、112、113、114…電力系の外部接続用端子
115、116、117、118…信号系の外部接続用端子
121、122、123、124…電力系の中継用端子
125、126、127、128…信号系の中継用端子
131、132…半導体スイッチ
133、134…フリーホイールダイオード
Claims (13)
- 基板と、
前記基板にはんだを介して接続される中継用端子と、
前記中継用端子と接合される外部接続用端子と、
前記はんだとの接合面側の前記中継用端子の端部を保持する非導電性の中継用端子保持部材と、
を備えることを特徴とする電力用半導体モジュール。 - 請求項1に記載の電力用半導体モジュールであって、
前記中継用端子保持部材は、
前記基板と係合する第1係合部を有する
ことを特徴とする電力用半導体モジュール。 - 請求項2に記載の電力用半導体モジュールであって、
前記中継用端子保持部材は、
前記中継用端子と嵌合する嵌合部を備え、
前記嵌合部は、
前記中継用端子と前記外部接続用端子が接合可能な位置関係に定まるように前記中継用端子を位置決めする
ことを特徴とする電力用半導体モジュール。 - 請求項3に記載の電力用半導体モジュールであって、
前記外部接続用端子を保持する非導電性の外部接続用端子保持部材を備え、
前記中継用端子保持部材は、
前記外部接続用端子保持部材と係合する第2係合部を有する
ことを特徴とする電力用半導体モジュール。 - 請求項4に記載の電力用半導体モジュールであって、
前記外部接続用端子保持部材、前記中継用端子保持部材、前記基板が積層される
ことを特徴とする電力用半導体モジュール。 - 請求項1に記載の電力用半導体モジュールであって、
前記中継用端子保持部材は、
前記中継用端子を前記基板とはんだ接続する際に前記基板を固定する治具と係合する第1係合部を有する
ことを特徴とする電力用半導体モジュール。 - 請求項6に記載の電力用半導体モジュールであって、
前記中継用端子保持部材は、
前記中継用端子と嵌合する嵌合部を備え、
前記嵌合部は、
前記中継用端子と前記外部接続用端子が接合可能な位置関係に定まるように前記中継用端子を位置決めする
ことを特徴とする電力用半導体モジュール。 - 請求項7に記載の電力用半導体モジュールであって、
前記外部接続用端子を保持する非導電性の外部接続用端子保持部材を備え、
前記外部接続用端子保持部材は、
前記基板と係合する第2係合部を有する
ことを特徴とする電力用半導体モジュール。 - 請求項8に記載の電力用半導体モジュールであって、
前記基板と前記中継用端子保持部材が積層され、
前記基板と前記外部接続用端子保持部材が積層される
ことを特徴とする電力用半導体モジュール。 - 請求項7に記載の電力用半導体モジュールであって、
前記外部接続用端子を保持する非導電性の外部接続用端子保持部材を備え、
前記中継用端子保持部材は、
前記外部接続用端子保持部材と係合する第2係合部を有する
ことを特徴とする電力用半導体モジュール。 - 請求項10に記載の電力用半導体モジュールであって、
前記外部接続用端子保持部材、前記中継用端子保持部材、前記基板が積層される
ことを特徴とする電力用半導体モジュール。 - 請求項7に記載の電力用半導体モジュールであって、
前記外部接続用端子を保持する非導電性の外部接続用端子保持部材と、
前記基板と前記外部接続用端子保持部材の間に配置される中間部材と、を備え、
前記中間部材は、
前記基板と係合する第2係合部を有し、
前記外部接続用端子は、
前記中間部材と係合する第3係合部を有する
ことを特徴とする電力用半導体モジュール。 - 請求項12に記載の電力用半導体モジュールであって、
前記基板と前記中継用端子保持部材が積層され、
前記基板と前記中間部材と前記外部接続用端子保持部材が積層される
ことを特徴とする電力用半導体モジュール。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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JP2015526198A JP6040312B2 (ja) | 2013-07-10 | 2014-05-16 | 電力用半導体モジュール |
US14/903,713 US9666395B2 (en) | 2013-07-10 | 2014-05-16 | Power semiconductor module |
CN201480038801.5A CN105378921A (zh) | 2013-07-10 | 2014-05-16 | 功率半导体模块 |
EP14822617.8A EP3021358A4 (en) | 2013-07-10 | 2014-05-16 | Power semiconductor module |
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Application Number | Priority Date | Filing Date | Title |
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JP2013-144739 | 2013-07-10 | ||
JP2013144739 | 2013-07-10 |
Publications (1)
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WO2015004990A1 true WO2015004990A1 (ja) | 2015-01-15 |
Family
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PCT/JP2014/063015 WO2015004990A1 (ja) | 2013-07-10 | 2014-05-16 | 電力用半導体モジュール |
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US (1) | US9666395B2 (ja) |
EP (1) | EP3021358A4 (ja) |
JP (1) | JP6040312B2 (ja) |
CN (1) | CN105378921A (ja) |
WO (1) | WO2015004990A1 (ja) |
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WO2022130588A1 (ja) * | 2020-12-17 | 2022-06-23 | 三菱電機株式会社 | 半導体装置および半導体装置の製造方法 |
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DE102013226236A1 (de) * | 2013-12-17 | 2015-06-18 | Robert Bosch Gmbh | Elektrische Baugruppe |
JP6809294B2 (ja) * | 2017-03-02 | 2021-01-06 | 三菱電機株式会社 | パワーモジュール |
EP3588525B1 (en) | 2018-06-28 | 2022-02-16 | Black & Decker Inc. | Electronic switch module with oppositely-arranged power switches and discrete heat sinks |
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2014
- 2014-05-16 WO PCT/JP2014/063015 patent/WO2015004990A1/ja active Application Filing
- 2014-05-16 JP JP2015526198A patent/JP6040312B2/ja not_active Expired - Fee Related
- 2014-05-16 CN CN201480038801.5A patent/CN105378921A/zh active Pending
- 2014-05-16 US US14/903,713 patent/US9666395B2/en not_active Expired - Fee Related
- 2014-05-16 EP EP14822617.8A patent/EP3021358A4/en not_active Withdrawn
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EP3021358A4 (en) | 2017-11-22 |
EP3021358A1 (en) | 2016-05-18 |
JPWO2015004990A1 (ja) | 2017-03-02 |
JP6040312B2 (ja) | 2016-12-07 |
US20160172134A1 (en) | 2016-06-16 |
US9666395B2 (en) | 2017-05-30 |
CN105378921A (zh) | 2016-03-02 |
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