WO2014207907A1 - 圧力制御装置、表面実装機および圧力制御方法 - Google Patents
圧力制御装置、表面実装機および圧力制御方法 Download PDFInfo
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- WO2014207907A1 WO2014207907A1 PCT/JP2013/067846 JP2013067846W WO2014207907A1 WO 2014207907 A1 WO2014207907 A1 WO 2014207907A1 JP 2013067846 W JP2013067846 W JP 2013067846W WO 2014207907 A1 WO2014207907 A1 WO 2014207907A1
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- Prior art keywords
- nozzle
- positive pressure
- pressure
- gas
- connection state
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D16/00—Control of fluid pressure
- G05D16/20—Control of fluid pressure characterised by the use of electric means
- G05D16/2006—Control of fluid pressure characterised by the use of electric means with direct action of electric energy on controlling means
- G05D16/2013—Control of fluid pressure characterised by the use of electric means with direct action of electric energy on controlling means using throttling means as controlling means
- G05D16/2026—Control of fluid pressure characterised by the use of electric means with direct action of electric energy on controlling means using throttling means as controlling means with a plurality of throttling means
- G05D16/2046—Control of fluid pressure characterised by the use of electric means with direct action of electric energy on controlling means using throttling means as controlling means with a plurality of throttling means the plurality of throttling means being arranged for the control of a single pressure from a plurality of converging pressures
- G05D16/2053—Control of fluid pressure characterised by the use of electric means with direct action of electric energy on controlling means using throttling means as controlling means with a plurality of throttling means the plurality of throttling means being arranged for the control of a single pressure from a plurality of converging pressures the plurality of throttling means comprising only a first throttling means acting on a higher pressure and a second throttling means acting on a lower pressure, e.g. the atmosphere
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
Definitions
- the present invention relates to a pressure control technique for controlling the pressure of gas supplied to a nozzle in a processing machine that ejects gas from a nozzle onto a member to be processed and performs a predetermined process on the member to be processed.
- a board loading machine, a printing machine, a surface mounting machine, an inspection machine, a board unloading machine, etc. are arranged in parallel from the upstream side to the downstream side in the board carrying direction along the board carrying line.
- line construction apparatuses printing machines, surface mounting machines, and inspection machines perform desired processing by ejecting positive pressure air from nozzles.
- the surface mounter described in Patent Document 1 is provided with two types of air circuits for supplying positive pressure air to the suction nozzle.
- weak positive pressure air Prior to component suction by the suction nozzle, weak positive pressure air is applied to the suction nozzle to prevent fine dust and the like from adhering to the tip of the nozzle. In addition, even after the component is picked up by the suction nozzle, a weak positive pressure air is applied to the suction nozzle and the function of smoothly detaching the component from the suction nozzle is exhibited. On the other hand, when replacing the suction nozzle, positive pressure air for removing the suction nozzle is applied to the suction nozzle to smoothly separate the suction nozzle.
- Each air circuit has a fixed air pressure supplied to the suction nozzle by a throttle valve. For this reason, the positive pressure that can be supplied to the suction nozzle is fixed to two types of positive pressure for suction nozzle separation and weak positive pressure. Therefore, in order to supply a positive pressure different from the positive pressure to the suction nozzle for other purposes, it is necessary to add an air circuit. For example, as described in Patent Document 2, when air is ejected from a suction nozzle to clean a component before suction, an air circuit that generates a positive pressure for cleaning the component described in Patent Document 1 Must be provided separately.
- Patent Document 1 describes a technique for controlling the positive pressure of air supplied to the suction nozzle by combining a pressure sensor and an electric control pressure reducing valve. Even if this is adopted, the following problems occur. That is, since expensive parts are used as compared with the air circuit, an increase in apparatus cost is inevitable. Also, the operation time of the electric control pressure reducing valve is very short, and it is necessary to strictly control this. For this reason, the use of the electric control pressure reducing valve causes a decrease in the stability of the pressure control, and the application time of the positive pressure to the suction nozzle may become shorter or longer than appropriate. As a result, the following problems may occur.
- the suction nozzle when a component that is sucked by the suction nozzle is mounted on the substrate, if the time for applying a positive pressure to the suction nozzle in the negative pressure state is not enough for an appropriate period of time, the suction nozzle will remain with negative pressure. May take the parts home. On the other hand, if the application time of the positive pressure is too long, the mounting position and mounting angle of the component may be shifted, or the already mounted component may be blown off.
- the present invention has been made in view of the above problems, and a pressure control device and a pressure control method capable of stably controlling the pressure of a gas supplied to a nozzle over a wide range, and a surface equipped with the pressure control device
- An object is to provide a mounting machine.
- a pressure control device and a pressure control method control the pressure of gas supplied to a nozzle in a processing machine that ejects gas from a nozzle to a member to be processed and performs a predetermined process on the member to be processed. It is.
- the pressure control device is characterized by a first positive pressure supply passage that supplies gas at a first positive pressure and a second positive pressure that supplies gas at a second positive pressure lower than the first positive pressure.
- a switching valve that selectively switches between the second connection states, and controls the connection state at the switching valve to adjust the pressure of the gas supplied to the nozzle in the range from the first positive pressure to the second positive pressure.
- a valve control unit that controls the features of the pressure control method include a step of preparing a first positive pressure gas, a step of preparing a second positive pressure gas lower than the first positive pressure, and a first positive pressure. The selective switching between the supply of gas to the nozzle and the supply of gas to the nozzle at the second positive pressure is controlled to change the pressure of the gas supplied to the nozzle from the first positive pressure to the second positive pressure. And a step of controlling in the range of pressure.
- the first positive pressure gas and the second positive pressure gas are prepared and can be selectively supplied to the nozzle. For this reason, gas can be supplied to a nozzle with the 1st positive pressure, and gas can be supplied to a nozzle with the 2nd positive pressure.
- gas can be supplied to the nozzle at a pressure intermediate between both positive pressures (hereinafter referred to as “intermediate pressure”). .
- intermediate pressure a pressure intermediate between both positive pressures
- the application target of the pressure control device is a processing machine in general that performs a predetermined process on a member to be processed by ejecting a gas from a nozzle to the member to be processed. It is preferable to configure.
- a surface mounting machine is a processing machine that ejects gas from a nozzle onto a component after mounting the negative pressure to a nozzle that has adsorbed the component, and mounts the component on the substrate from the nozzle.
- a switching valve that selectively switches between a first connection state in which the first positive pressure supply passage is connected to the nozzle connection passage and a second connection state in which the second positive pressure supply passage is connected to the nozzle connection passage;
- a control unit that controls a connection state of the switching valve.
- a control part when cleaning the nozzle which has not attracted
- the high pressure mode to be supplied is executed and the component is mounted from the nozzle to the substrate
- the second connection state is continued after the negative pressure supply to the nozzle is stopped, and the gas is supplied to the nozzle at the second positive pressure.
- the connection state at the switching valve is switched several times to lower than the first positive pressure.
- An intermediate pressure mode is executed in which gas is supplied to the nozzle at a third positive pressure that is higher than the second positive pressure to remove defective components from the nozzle.
- the nozzle cleaning is performed with a relatively high positive pressure (first positive pressure), so that clogging of the nozzle and the like can be reliably removed.
- the component can be mounted with a relatively low positive pressure (second positive pressure), and the component is mounted at a desired position and angle, and components already mounted around the component are blown away. Can be effectively prevented.
- the defective part can be removed from the nozzle with a positive pressure (third positive pressure) suitable for the disposal of the defective part, that is, the part can be discarded, and the defective part can be smoothly discarded.
- the control unit when cleaning the nozzle that is not adsorbing the component, the control unit continues the first connection state and supplies the gas to the nozzle at the first positive pressure.
- the high pressure mode to be supplied is executed and the component is mounted from the nozzle to the substrate
- the second connection state is continued after the negative pressure supply to the nozzle is stopped, and the gas is supplied to the nozzle at the second positive pressure.
- the connection state of the switching valve is switched a plurality of times to be lower than the first positive pressure and higher than the second positive pressure.
- the intermediate pressure mode for supplying gas to the nozzle at the third positive pressure is executed.
- the nozzle cleaning and the component mounting are executed using positive pressures suitable for each, and the nozzle cleaning process and the component mounting process are appropriately performed. Can be done.
- gas is supplied to the nozzle at a positive pressure (third positive pressure) suitable for them, so cleaning of the parts and boards before mounting is required. Can be done appropriately.
- the gas is discharged at the first positive pressure.
- the gas can be supplied to the nozzle at the second positive pressure, and further the gas can be supplied to the nozzle at the intermediate pressure. Therefore, the pressure of the gas supplied to the nozzle can be stably controlled over a wide range from the first positive pressure to the second positive pressure.
- FIG. 1 It is a top view which shows schematic structure of the surface mounter equipped with one Embodiment of the pressure control apparatus concerning this invention. It is a partial front view of the surface mounter shown in FIG. It is a partial side view which shows the nozzle vicinity of the mounting head with which the surface mounting machine of FIG. 1 is provided. It is a block diagram which shows the main electrical structures of the surface mounter shown in FIG. It is a timing chart which shows operation
- FIG. 1 is a plan view showing a schematic configuration of a surface mounter equipped with an embodiment of a pressure control device according to the present invention.
- FIG. 2 is a partial front view of the surface mounter shown in FIG.
- FIG. 3 is a partial side view showing the vicinity of the nozzle of the mounting head provided in the surface mounter of FIG.
- FIG. 4 is a block diagram showing the main electrical configuration of the surface mounter shown in FIG. In FIG. 1 to FIG. 3, XYZ rectangular coordinate axes are shown in order to clarify the directional relationship of each figure.
- the substrate transport mechanism 2 is disposed on the base 11, and the substrate S can be transported in a predetermined transport direction X. More specifically, the substrate transport mechanism 2 has a pair of conveyors 21 and 21 that transport the substrate S from the right side to the left side of FIG. And the conveyors 21 and 21 operate
- the substrate transport mechanism 2 carries out the substrate S.
- a component recognition camera 7 is disposed on the base 11.
- the component recognition camera 7 includes an illumination unit and a CCD (Charge Coupled Device) camera.
- the component recognition camera 7 images the component P sucked and held by the suction nozzle 611 of each mounting head 61 of the head unit 6 from below. . For this reason, it is possible to inspect the suction state of the component P by the suction nozzle 611 based on the captured image.
- the component supply unit 4 is arranged on the front side (+ Y axis direction side) and the rear side ( ⁇ Y axis direction side) of the substrate transport mechanism 2 configured as described above.
- These component supply units 4 include a number of tape feeders 41.
- Each tape feeder 41 is provided with a reel (not shown) around which a tape storing and holding the component P is wound, so that the component P can be supplied to the head unit 6. That is, each tape stores and holds small chip components P such as an integrated circuit (IC), a transistor, and a capacitor at predetermined intervals.
- IC integrated circuit
- transistor transistor
- the tape feeder 41 feeds the tape from the reel toward the head unit 6, so that the component P in the tape is intermittently fed to the component suction position, and as a result, the suction mounted on the mounting head 61 of the head unit 6.
- the part P can be picked up by the nozzle 611.
- the head unit 6 transports the component P to the substrate S while being sucked and held by the suction nozzle 611 of the mounting head 61 and transfers it to the component mounting position instructed by the user. Then, a total of twelve mounting heads 61 including six mounting heads 61F arranged in a line in the X-axis direction on the front side and six mounting heads 61R arranged in a line in the X-axis direction on the rear side are arranged. Have. That is, as shown in FIGS. 1 and 2, in the head unit 6, six mounting heads 61F extending in the vertical direction Z are arranged at an equal pitch in the X-axis direction (the direction in which the substrate S is transported by the substrate transport mechanism 2). It is provided in a row.
- a rear row configured in the same manner as the front row is provided on the rear side ( ⁇ Y-axis direction side) with respect to the mounting head 61F.
- the mounting head 61F and the mounting head 61R are arranged with a half pitch shift in the X-axis direction, and are arranged in a zigzag shape in plan view as shown in FIG. Therefore, when viewed from the Y-axis direction, as shown in FIG. 2, the twelve mounting heads 61 are arranged in a line in the X-axis direction without overlapping each other.
- a switching valve described below is provided for each mounting head 61 so that a positive pressure and a negative pressure can be supplied to each suction nozzle 611. That is, as shown in FIG. 3, the suction nozzle 611 mounted at the tip of each mounting head 61 is connected to the negative pressure / positive pressure switching valve 32 by the pipe 31a.
- pipes 31b and 31c are connected to the negative pressure / positive pressure switching valve 32.
- the pipe 31b is connected to a negative pressure generator 33 constituted by a vacuum pump or the like.
- the negative pressure / positive pressure switching valve 32 connects the pipe 31a only to the pipe 31b. To do. As a result, a negative pressure is supplied to the suction nozzle 611 via a negative pressure supply path constituted by the pipe 31a, the negative pressure / positive pressure switching valve 32, and the pipe 31b. On the other hand, when the switching signal is switched to the “positive pressure” level, the negative pressure / positive pressure switching valve 32 switches the connection destination of the pipe 31a from the pipe 31b to the pipe 31c.
- the pipe 31 c is connected to the pressure switching valve 34.
- pipes 31d and 31e are connected to the pressure switching valve 34.
- the pipe 31d is connected to a positive pressure generator 35 constituted by a compressor or the like, and is a supply passage for supplying compressed air having a relatively high pressure generated by the positive pressure generator 35, that is, “ It functions as a “first positive pressure supply passage”.
- the compressed air is set to “first positive pressure” suitable for cleaning the suction nozzle 611 as will be described later.
- the other pipe 31e is a branch pipe branched from the pipe 31d, and a regulator 36 is inserted in the middle thereof.
- the regulator 36 has a function of reducing the pressure of the compressed air flowing in through the pipes 31d and 31e to a “second positive pressure” suitable for a component mounting process described later.
- the air adjusted to a low pressure (second positive pressure) by the regulator 36 is supplied toward the pressure switching valve 34 through the pipe 31e.
- the pipe 31e functions as the “second positive pressure supply passage” of the present invention.
- the pressure switching valve 34 switches the connection state between the pipe 31c and the pipes 31d and 31e in accordance with a switching signal from the control unit 8. More specifically, while the switching signal is at the “high pressure” level, the pressure switching valve 34 switches to a state where the pipe 31d is connected to the pipe 31c, that is, the “first connection state”. On the other hand, when the switching signal is switched to the “low pressure” level, the pressure switching valve 34 switches the connection destination of the pipe 31c from the pipe 31d to the pipe 31e. That is, the pipe 31e is switched to the “second connection state” in which the pipe 31e is connected to the pipe 31c.
- the negative pressure / positive pressure switching valve 32 is switched to the positive pressure supply side, positive pressure is supplied to the suction nozzle 611 via the pipe 31c, the negative pressure / positive pressure switching valve 32, and the pipe 31a.
- the pressure of the air supplied to the suction nozzle 611 can be arbitrarily adjusted in the range from the first positive pressure to the second positive pressure by switching the connection state by the pressure switching valve 34. It has become.
- the supply line including the pipe 31c, the negative / positive pressure switching valve 32, and the pipe 31a corresponds to an example of the “nozzle connection passage” of the present invention.
- the switching signal to the negative pressure / positive pressure switching valve 32 and the pressure switching valve 34 is created by the main control unit 85 of the control unit 8 according to the program stored in the storage unit 86. Then, by switching the negative pressure / positive pressure switching valve 32 and the pressure switching valve 34, the component suction processing, component mounting processing (FIG. 5), nozzle cleaning processing (FIG. 6), nozzle replacement processing (FIG. 6), component cleaning processing ( 7), board cleaning processing (FIG. 7), component disposal processing (FIGS. 7 and 8), and the like are executed. Details of these processes will be described later with reference to FIGS.
- the main control unit 85 functions as the “valve control unit” of the present invention, and the pipes 31a, 31c to 31e, the negative / positive pressure switching valve 32, the pressure switching valve 34, and the main switching unit.
- the control unit 85 constitutes the “pressure control device” of the present invention.
- Each mounting head 61 can be moved up and down (moved in the Z-axis direction) with respect to the head unit 6 by a nozzle lifting drive mechanism (not shown) and rotated around the nozzle center axis by a nozzle rotation driving mechanism (not shown) 3 in the R direction).
- the nozzle raising / lowering drive mechanism raises and lowers the mounting head 61 between a lowered position (falling end) when sucking or mounting and a rising position (raising end) when carrying.
- the nozzle rotation drive mechanism is a mechanism for rotating the suction nozzle 611 as required, and can position the component P in a predetermined R-axis direction during mounting by rotation drive.
- These drive mechanisms are each composed of a Z-axis servo motor 72, an R-axis servo motor 73, and a predetermined power transmission mechanism.
- the drive control unit 82 of the control unit 8 controls the Z-axis servo motor 72 and the R-axis. By controlling the servo motor 73, each mounting head 61 is moved in the Z direction and the R direction.
- the head unit 6 transports the component P sucked by these mounting heads 61 between the component supply unit 4 and the substrate S and mounts it on the substrate S. And in the Y-axis direction (direction orthogonal to the X-axis and Z-axis directions). That is, the head unit 6 is supported so as to be movable along the X axis with respect to the mounting head support member 63 extending in the X axis direction. Further, both ends of the mounting head support member 63 are supported by a fixed rail 64 in the Y-axis direction, and are movable along the fixed rail 64 in the Y-axis direction.
- the head unit 6 is driven in the X-axis direction by the X-axis servomotor 65 via the ball screw 66, and the mounting head support member 63 is driven in the Y-axis direction by the Y-axis servomotor 67 via the ball screw 68. Is done.
- the head unit 6 can convey the component P adsorbed by the mounting head 61 from the component supply unit 4 to the target position.
- the head unit 6 includes a component inspection camera 91.
- the component inspection camera 91 includes an illumination unit and a CCD camera, and is used for inspecting the mounting state of each electronic component mounted on the substrate S.
- the drive control unit 82 moves the head unit 6 as appropriate, thereby moving the component inspection camera 91 above the mounting position of the component P. In this state, the image of the part P captured by the part inspection camera 91 is transferred to the image processing unit 84.
- the surface mounter 1 includes a display 92 and an alarm device 93 that function as an interface with the worker.
- the display 92 has a function as an input terminal that is configured with a touch panel and receives input from an operator.
- the alarm 93 notifies the operator of an error (abnormality) that has occurred in the surface mounter 1, and is constituted by an emergency light that notifies by light, an emergency buzzer that notifies by buzzer sound, or a combination thereof.
- the input / output control for the display 92 and the alarm 93 is executed by the input / output control unit 88 of the control unit 8.
- adsorption nozzle position indicates the tip position of the adsorption nozzle 611
- “mounting surface” indicates the adsorption nozzle at a height position suitable for mounting a component adsorbed by the adsorption nozzle 611.
- the nozzle tip position when 611 is positioned is shown.
- pressure switching valve” and “negative pressure / positive pressure switching valve” in FIGS. 5 to 8 indicate levels of switching signals given to the pressure switching valve 34 and the negative pressure / positive pressure switching valve 32, respectively.
- nozzle tip pressure in FIGS. 5 to 8 indicates the pressure at the tip of the suction nozzle 611.
- the surface mounter 1 is centrally controlled by the main control unit 85. That is, the main control unit 85 controls the entire surface mounter 1 by exchanging signals with each unit of the control unit 8 via the bus 87 based on the program and data stored in the storage unit 86. .
- the production program 861 production program stored in the storage unit 86 is read by the main control unit 85.
- the main control unit 85 controls each part of the surface mounter 1 according to the program 861, whereby the following basic operation is repeated and component mounting on the board S is executed.
- suction point The head unit 6 is moved to the upper position of the tape feeder 41 in which the component P to mount next was accommodated.
- the mounting head 61 is lowered in the Z-axis direction toward the part P, and the suction nozzle 611 is brought into contact with the part P. Then, the switching signal given to the negative pressure / positive pressure switching valve 32 is switched to the “negative pressure” level, the negative pressure is supplied to the suction nozzle 611, and the component P is sucked and held. Thereafter, the mounting head 61 holding the component P is lifted in the Z-axis direction. As shown in FIG. 5, the switching signal is maintained at the “negative pressure” level until the component P is moved to the mounting surface of the substrate S, and the negative pressure supply to the suction nozzle 611 is continued. Further, the switching signal applied to the pressure switching valve 34 is switched to the “low pressure” level to complete the preparation for supplying the “second positive pressure” suitable for component mounting.
- the head unit 6 is moved to a position above the component recognition camera 7. Then, the part recognition camera 7 picks up an image of the part P sucked and held by the suction nozzle 611, and confirms whether the part P is a non-defective or defective part including the suction state.
- the head unit 6 is moved to a position above the component mounting position where the component P is mounted. Then, the mounting head 61 is lowered in the Z-axis direction, and the component P held by suction by the mounting head 61 is moved to the mounting point. As shown in FIG. 5, the switching signal applied to the negative pressure / positive pressure switching valve 32 is switched to the “positive pressure” level at the time when the mounting point is reached (timing T ⁇ b> 1). As a result, the suction holding of the component P by the suction nozzle 611 is released, and air is supplied to the suction nozzle 611 at “second positive pressure”.
- the tip pressure of the suction nozzle 611 gradually increases from the timing T1, and air is jetted onto the upper surface of the component P at the “second positive pressure” at the timing T2.
- the component P is instantaneously separated from the suction nozzle 611 and mounted on the substrate S by this air ejection.
- the switching signal applied to the negative pressure / positive pressure switching valve 32 is switched to the “negative pressure” level (timing T3).
- the suction nozzle 611 needs to be cleaned at an appropriate timing. Further, the suction nozzle 611 may need to be replaced at the timing when the type of the component P to be mounted is changed. In these cases, a relatively high pressure is supplied to the suction nozzle 611 to perform nozzle cleaning processing and nozzle replacement processing. Therefore, in the present embodiment, in the nozzle cleaning process and the nozzle replacement process, the switching signals given to the negative pressure / positive pressure switching valve 32 and the pressure switching valve 34 are respectively set to the “positive pressure” level and the “high pressure” as shown in FIG. The first positive pressure is supplied to the suction nozzle 611 by switching to the “level”.
- the surface mounter 1 as in the invention described in Patent Document 2, it is possible to perform a so-called component cleaning process for cleaning the component P before suction, and the component cleaning process is performed by a designation from the user. Can be selectively executed. Of course, you may comprise so that a components cleaning process may be performed for every component adsorption
- an intermediate pressure between the “first positive pressure” and the “second positive pressure”, that is, an intermediate pressure air is supplied to the suction nozzle 611 and the intermediate pressure air is suitable for the component cleaning process. It is configured to erupt.
- the component cleaning process in the present embodiment will be described with reference to FIG.
- FIG. 7 is a timing chart showing the operation of each part of the apparatus in the parts cleaning process.
- the air supply at the “first positive pressure” to the suction nozzle 611 and the air supply at the “second positive pressure” to the suction nozzle 611 are alternately repeated.
- the pressure applied to the tip of the suction nozzle 611 changes in a pulsating manner between the “first positive pressure” and the “second positive pressure”, but the central pressure is the first positive pressure.
- the intermediate pressure is lower and higher than the second positive pressure.
- the pressure fluctuation range centered on the intermediate pressure is relatively narrow, and substantially the air supplied from the suction nozzle 611 to the component P.
- the jet pressure is stable at an intermediate pressure. Therefore, it is possible to effectively remove dust and foreign matters adhering to the component P without blowing off the component P.
- the switching signal applied to the pressure switching valve 34 is maintained at the “high pressure” level to be in the “first connection state”, and the switching signal applied to the pressure switching valve 34 is maintained at the “low pressure” level.
- the value of the intermediate pressure can be adjusted by controlling the ratio with the time of the “second connection state”. Therefore, the ratio may be controlled according to the type of component P. For example, for a relatively large component P, the intermediate pressure may be made closer to the “first positive pressure” by increasing the proportion of time in the “first connection state”. Conversely, in the small component P, the intermediate pressure may be made closer to the “second positive pressure” by increasing the proportion of time in which the “second connection state” is set. In this way, the component cleaning process can be performed using air of appropriate pressure for each component P.
- the substrate cleaning can be performed using the air ejected from the suction nozzle 611, and the substrate cleaning process can be selectively executed by the designation from the user.
- the positive pressure value of air here as well. This is because solder is printed on the substrate S before component mounting. If the air of “first positive pressure” used during the nozzle cleaning process or the nozzle replacement process is ejected to the substrate S, the printed pattern of the solder may be adversely affected. Conversely, if the “second positive pressure” air used during the component mounting process is ejected to the component P, there is a possibility that a sufficient substrate cleaning effect cannot be obtained.
- the switching signal given to the pressure switching valve 34 is alternately switched a plurality of times at the “high pressure” level and the “low pressure” level as shown in FIG. It is ejected from the suction nozzle 611.
- the ejection pressure of the air supplied from the suction nozzle 611 to the substrate S is stable at an intermediate pressure, and dust and foreign matters adhering to the substrate S can be effectively removed without adversely affecting the print pattern. Can be removed.
- substrate S may differ for every board
- the substrate cleaning process can be performed using air of appropriate pressure for each substrate S.
- the head unit 6 when the part P sucked by the suction nozzle 611 is a defective part, the head unit 6 is moved above the defective part discarding section (not shown). Then, after the supply of the negative pressure to the suction nozzle 611 is stopped, the positive pressure is supplied to the suction nozzle 611 and the defective part is discarded in the disposal unit. Also at this time, it is desirable to adjust the pressure of the air ejected from the suction nozzle 611 to an intermediate pressure as in the component cleaning process and the board cleaning process. Therefore, in the present embodiment, as shown in FIG.
- the switching signal given to the pressure switching valve 34 is alternately switched a plurality of times at the “high pressure” level and the “low pressure” level, and air of intermediate pressure is ejected from the suction nozzle 611.
- the jet pressure of the air supplied from the suction nozzle 611 to the substrate S is stable at an intermediate pressure, and the defective part P can be reliably discarded from the suction nozzle 611 to the disposal unit.
- the adhesion of the component P to the suction nozzle 611 may vary depending on the weight and surface properties (adhesion, hardness, etc.) of the component. Therefore, you may comprise so that the main control part 85 may control the said ratio according to the kind of defective component P.
- FIG. For example, when the component P that easily adheres to the suction nozzle 611 is discarded, it is desirable to increase the proportion of time in the “first connection state” to bring the intermediate pressure closer to the “first positive pressure”. On the contrary, when the component P that is difficult to adhere to the suction nozzle 611 is discarded, it is desirable to increase the ratio of the time in the “second connection state” to bring the intermediate pressure closer to the “second positive pressure”. .
- the intermediate pressure for each component P the component disposal processing can be performed smoothly.
- the nozzle tip pressure in a pulsed manner rather than narrowing the pressure fluctuation range and continuously blowing a substantially constant intermediate pressure to the part P as described above.
- the level switching period of the switching signal is set to be relatively long, and thus, a continuous pulsed pressure waveform, for example, a canine or triangular waveform You may blow out air.
- the high pressure (first positive pressure) air generated by the positive pressure generator 35 is supplied to the pipe 31d, the pressure switching valve 34, the pipe 31c, and the negative pressure / positive pressure switching valve 32.
- the nozzle cleaning process and the nozzle replacement process are performed by supplying the suction nozzle 611 as it is through the pipe 31a (high pressure mode).
- the air adjusted to a low pressure (second positive pressure) by the regulator 36 is directly supplied to the suction nozzle 611 via the pipe 31e, the pressure switching valve 34, the pipe 31c, the negative pressure / positive pressure switching valve 32, and the pipe 31a. Supplying parts and processing parts (low pressure mode).
- the air having the two types of pressure described above is alternately supplied to the suction nozzle 611 by the pressure switching valve 34 so that the nozzle tip pressure becomes an intermediate pressure (intermediate pressure mode).
- the pressure of the air supplied to the suction nozzle 611 over a wide range from high pressure (first positive pressure) to low pressure (second positive pressure) can be stably controlled only by controlling the connection state with the pressure switching valve 34. It is possible to control.
- a pressure control device capable of performing a wide range of pressure control with a small number of components can be provided at a low cost, which greatly contributes to the reduction of the device cost of the surface mounter 1.
- the pressure switching valve 34 maintains the state where the pipes 31d and 31c are connected (first connection state) and supplies the first positive pressure air to the suction nozzle 611, thereby maintaining the high pressure.
- the nozzle cleaning process and the nozzle replacement process can be performed while the operation is being performed. As a result, nozzle cleaning processing and nozzle replacement processing can be performed with high efficiency.
- the pressure switching valve 34 maintains the state where the pipes 31e and 31c are connected (second connection state) and supplies the second positive pressure air to the suction nozzle 611.
- the fluctuation in the pressure of the air supplied to the suction nozzle 611 during processing is suppressed, and a highly accurate component mounting process can be performed.
- an arbitrary positive pressure (third positive pressure) that is lower than the first positive pressure and higher than the second positive pressure by switching the two types of connection states a plurality of times. Air can be supplied, and each of the component cleaning process, the board cleaning process, and the component disposal process can be executed at an appropriate pressure.
- the surface mounter 1 corresponds to an example of the “processing machine” of the present invention
- the component P corresponds to an example of the “processed member” of the present invention
- the pressure switching valve 34 corresponds to an example of the “switching valve” of the present invention
- the regulator 36 corresponds to an example of the “pressure adjusting unit” in the present invention.
- the present invention is not limited to the above embodiment, and various modifications can be made to the above without departing from the spirit of the present invention.
- the ratio between the time of the first connection state and the time of the second connection state is maintained almost constant.
- the ratio may be changed.
- the third positive pressure value can be changed by changing the ratio.
- the pressure control apparatus concerning this invention is applied to the surface mounter 1
- the application object of this invention is not limited to this
- Gas is ejected to a to-be-processed member from a nozzle.
- the present invention can be applied to all processing machines that perform a predetermined process on a target member.
- gas is not limited to air, It can apply also to the processing machine which ejects gas other than air from a nozzle.
- the processing machine includes an inspection machine and a printing machine equipped with a system for mounting components on a substrate.
- the mask used for printing the solder paste on the substrate is the “member to be processed” of the present invention, and air is blown out from the nozzle toward the mask to remove the solder material remaining in the mask pattern opening and cleaning.
- the mask cleaning process can be performed satisfactorily by supplying air having a pressure suitable for the mask cleaning process to the nozzle.
- the surface mounter 1 is equipped with the negative pressure generating device 33 as the negative pressure generating source and the positive pressure generating device 35 as the positive pressure generating source.
- An arranged negative pressure generation source or positive pressure generation source may be used.
- an appropriate negative pressure generation source or positive pressure generation source is prepared as utility in a factory where the surface mounter 1 is installed, they may be used.
- the present invention relates to a general pressure control technique for controlling the pressure of gas supplied to a nozzle and the pressure control in a processing machine that ejects gas from a nozzle to a member to be processed and performs a predetermined process on the member to be processed. It can be applied to surface mounters that use technology.
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Abstract
Description
次に実装する部品Pが収納されたテープフィーダ41の上方位置にヘッドユニット6を移動させる。
部品Pに向けて実装ヘッド61をZ軸方向に下降させて吸着ノズル611を部品Pに当接させる。そして、負圧/正圧切替バルブ32に与える切替信号を「負圧」レベルに切り替えて吸着ノズル611に負圧を供給し、部品Pを吸着保持する。その後、部品Pを吸着保持した実装ヘッド61をZ軸方向に上昇させる。なお、図5に示すように、当該部品Pを基板Sの装着面に移動させるまで切替信号を「負圧」レベルに維持して吸着ノズル611への負圧供給を継続させる。また、圧力切替バルブ34に与える切替信号を「低圧」レベルに切り替えて部品装着に適した「第2の正圧」の供給準備を完了させている。
ヘッドユニット6を部品認識カメラ7の上方位置に移動させる。そして、部品認識カメラ7により吸着ノズル611に吸着保持される部品Pを撮像し、吸着状態を含めて部品Pが良品であるか不良部品であるかを確認する。
部品Pが良好であると確認されると、当該部品Pを実装する部品装着位置の上方位置までヘッドユニット6を移動させる。そして、実装ヘッド61をZ軸方向に下降させて当該実装ヘッド61で吸着保持されている部品Pを装着点に移動させる。図5に示すように、装着点に到達した時点(タイミングT1)で負圧/正圧切替バルブ32に与える切替信号を「正圧」レベルに切り替える。これによって、吸着ノズル611による部品Pの吸着保持を解除するとともに、「第2の正圧」でエアが吸着ノズル611に供給される。その結果、同図に示すように、吸着ノズル611の先端圧力はタイミングT1から徐々に上昇してタイミングT2では「第2の正圧」でエアを部品Pの上面に噴出する。このエア噴出によって部品Pが瞬間的に吸着ノズル611から離れ、基板Sに装着される。それに続いて、部品装着後の実装ヘッド61をZ軸方向に上昇させた後、負圧/正圧切替バルブ32に与える切替信号を「負圧」レベルに切り替える(タイミングT3)。
31a、31c…配管(ノズル接続通路)
31d…配管(第1の正圧供給通路)
31e…配管(第2の正圧供給通路)
32…負圧/正圧切替バルブ(ノズル接続通路)
34…圧力切替バルブ
36…レギュレータ(調圧部)
85…主制御部(バルブ制御部)
611…吸着ノズル
P…部品
S…基板
Claims (12)
- ノズルから気体を被処理部材に噴出して前記被処理部材に対して所定の処理を施す処理機において、前記ノズルに供給する前記気体の圧力を制御する圧力制御装置であって、
第1の正圧で前記気体を供給する第1の正圧供給通路と、
前記第1の正圧よりも低い第2の正圧で前記気体を供給する第2の正圧供給通路と、
前記ノズルに接続されるノズル接続通路と、
前記第1の正圧供給通路を前記ノズル接続通路に接続する第1の接続状態と、前記第2の正圧供給通路を前記ノズル接続通路に接続する第2の接続状態とを選択的に切り替える切替バルブと、
前記切替バルブでの接続状態を制御して前記ノズルに供給される前記気体の圧力を前記第1の正圧から前記第2の正圧の範囲で調整するバルブ制御部と
を備えることを特徴とする圧力制御装置。 - 請求項1に記載の圧力制御装置であって、
前記バルブ制御部は、
前記第1の接続状態を継続させて前記第1の正圧で前記気体を前記ノズルに供給する高圧モードと、
前記第2の接続状態を継続させて前記第2の正圧で前記気体を前記ノズルに供給する低圧モードと、
前記切替バルブでの接続状態を複数回切り替えて前記第1の正圧よりも低く、前記第2の正圧よりも高い、第3の正圧で前記気体を前記ノズルに供給する中間圧モードとを選択的に実行する圧力制御装置。 - 請求項2に記載の圧力制御装置であって、
前記バルブ制御部は、前記中間圧モードにおいて、前記第1の接続状態の時間と、前記第2の接続状態の時間との比率を制御して前記第3の正圧の値を変更する圧力制御装置。 - 請求項2に記載の圧力制御装置であって、
前記バルブ制御部は、前記第1の接続状態の時間と、前記第2の接続状態の時間との比率を制御して前記ノズルに供給される前記気体の圧力をパルス状に連続変化させる圧力制御装置。 - 請求項1ないし4のいずれか一項に記載の圧力制御装置であって、
前記第1の正圧を有する前記気体を前記第2の正圧に調整する調圧部を備え、
前記第1の正圧供給通路は第1の正圧の前記気体を発生させる正圧供給源に接続され、
前記第2の正圧供給通路は前記第1の正圧供給通路から分岐して設けられ、
前記調圧部は前記第2の正圧供給通路に設けられる圧力制御装置。 - 部品を吸着したノズルへの負圧供給を停止した後で前記ノズルから気体を前記部品に噴出して前記ノズルから基板に装着する表面実装機であって、
第1の正圧で前記気体を供給する第1の正圧供給通路と、
前記第1の正圧よりも低い第2の正圧で前記気体を供給する第2の正圧供給通路と、
前記ノズルに接続されるノズル接続通路と、
前記第1の正圧供給通路を前記ノズル接続通路に接続する第1の接続状態と、前記第2の正圧供給通路を前記ノズル接続通路に接続する第2の接続状態とを選択的に切り替える切替バルブと、
前記切替バルブでの接続状態を制御するバルブ制御部とを備え、
前記バルブ制御部は、
部品を吸着していない前記ノズルを清掃するときには、前記第1の接続状態を継続させて前記第1の正圧で前記気体を前記ノズルに供給する高圧モードを実行し、
前記部品を前記ノズルから前記基板に装着するときには、前記ノズルへの負圧供給を停止した後で前記第2の接続状態を継続させて前記第2の正圧で前記気体を前記ノズルに供給する低圧モードを実行し、
前記ノズルにより吸着されている部品が不良部品であるときには、前記ノズルへの負圧供給を停止した後で前記切替バルブでの接続状態を複数回切り替えて前記第1の正圧よりも低く、前記第2の正圧よりも高い、第3の正圧で前記気体を前記ノズルに供給して前記ノズルから前記不良部品を除去する中間圧モードを実行することを特徴とする表面実装機。 - 請求項6に記載の表面実装機であって、
前記バルブ制御部は、前記中間圧モードにおいて、前記ノズルにより吸着されている前記部品の種類に応じて前記第1の接続状態の時間と、前記第2の接続状態の時間との比率を制御して前記第3の正圧の値に変更する表面実装機。 - 請求項6に記載の表面実装機であって、
前記バルブ制御部は、前記中間圧モードにおいて、前記第1の接続状態の時間と、前記第2の接続状態の時間との比率を制御して前記ノズルに供給される前記気体の圧力をパルス状に連続変化させる表面実装機。 - 部品を吸着したノズルへの負圧供給を停止した後で前記ノズルから気体を前記部品に噴出して前記ノズルから基板に装着する表面実装機であって、
第1の正圧で前記気体を供給する第1の正圧供給通路と、
前記第1の正圧よりも低い第2の正圧で前記気体を供給する第2の正圧供給通路と、
前記ノズルに接続されるノズル接続通路と、
前記第1の正圧供給通路を前記ノズル接続通路に接続する第1の接続状態と、前記第2の正圧供給通路を前記ノズル接続通路に接続する第2の接続状態とを選択的に切り替える切替バルブと、
前記切替バルブでの接続状態を制御するバルブ制御部とを備え、
前記バルブ制御部は、
部品を吸着していない前記ノズルを清掃するときには、前記第1の接続状態を継続させて前記第1の正圧で前記気体を前記ノズルに供給する高圧モードを実行し、
前記部品を前記ノズルから前記基板に装着するときには、前記ノズルへの負圧供給を停止した後で前記第2の接続状態を継続させて前記第2の正圧で前記気体を前記ノズルに供給する低圧モードを実行し、
前記基板への装着前の部品または前記基板を前記気体により清掃するときには、前記切替バルブでの接続状態を複数回切り替えて前記第1の正圧よりも低く、前記第2の正圧よりも高い、第3の正圧で前記気体を前記ノズルに供給する中間圧モードを実行することを特徴とする表面実装機。 - 請求項9に記載の表面実装機であって、
前記バルブ制御部は、前記中間圧モードを実行して前記ノズルによる吸着前の部品を清掃するとき、前記部品の種類に応じて前記第1の接続状態の時間と、前記第2の接続状態の時間との比率を変更して前記第3の正圧の値を変更する表面実装機。 - 請求項9に記載の表面実装機であって、
前記バルブ制御部は、前記中間圧モードを実行して半田が印刷された基板を清掃するとき、前記半田の種類または印刷性状に応じて前記第1の接続状態の時間と、前記第2の接続状態の時間との比率を変更して前記第3の正圧の値を変更する表面実装機。 - ノズルから気体を被処理部材に噴出して前記被処理部材に対して所定の処理を施す処理機において、前記ノズルに供給する前記気体の圧力を制御する圧力制御方法であって、
第1の正圧の前記気体を準備する工程と、
前記第1の正圧よりも低い第2の正圧の前記気体を準備する工程と、
前記第1の正圧での前記気体の前記ノズルへの供給と、前記第2の正圧での前記気体の前記ノズルへの供給との選択的な切替を制御して前記ノズルに供給される気体の圧力を前記第1の正圧から前記第2の正圧の範囲で制御する工程と
を備えることを特徴とする圧力制御方法。
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| CN201380074049.5A CN105009705B (zh) | 2013-06-28 | 2013-06-28 | 压力控制装置、表面安装机及压力控制方法 |
| US14/888,572 US9980419B2 (en) | 2013-06-28 | 2013-06-28 | Pressure control device, surface mount machine and pressure control method |
| PCT/JP2013/067846 WO2014207907A1 (ja) | 2013-06-28 | 2013-06-28 | 圧力制御装置、表面実装機および圧力制御方法 |
| JP2015523789A JP5978399B2 (ja) | 2013-06-28 | 2013-06-28 | 圧力制御装置、表面実装機および圧力制御方法 |
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| WO2018158855A1 (ja) * | 2017-02-28 | 2018-09-07 | 株式会社Fuji | 部品移載装置 |
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| JP2018054463A (ja) * | 2016-09-29 | 2018-04-05 | セイコーエプソン株式会社 | 電子部品搬送装置および電子部品検査装置 |
| DE102019106682B4 (de) * | 2019-03-15 | 2022-07-07 | Bürkert Werke GmbH & Co. KG | Druckregler |
| CN110645366A (zh) * | 2019-11-05 | 2020-01-03 | 吴丹凯 | 一种可智能调控墙壁负压吸引的阀门装置 |
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Also Published As
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| US9980419B2 (en) | 2018-05-22 |
| US20160066484A1 (en) | 2016-03-03 |
| CN105009705A (zh) | 2015-10-28 |
| JPWO2014207907A1 (ja) | 2017-02-23 |
| CN105009705B (zh) | 2017-07-21 |
| JP5978399B2 (ja) | 2016-08-24 |
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