WO2014205874A1 - 一种表面贴装式led支架、led器件及led显示屏 - Google Patents

一种表面贴装式led支架、led器件及led显示屏 Download PDF

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Publication number
WO2014205874A1
WO2014205874A1 PCT/CN2013/078757 CN2013078757W WO2014205874A1 WO 2014205874 A1 WO2014205874 A1 WO 2014205874A1 CN 2013078757 W CN2013078757 W CN 2013078757W WO 2014205874 A1 WO2014205874 A1 WO 2014205874A1
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WO
WIPO (PCT)
Prior art keywords
surface mount
boss
cup
bracket
led
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PCT/CN2013/078757
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English (en)
French (fr)
Inventor
李漫铁
晏思平
李振宁
谢振胜
屠孟龙
Original Assignee
深圳雷曼光电科技股份有限公司
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Publication of WO2014205874A1 publication Critical patent/WO2014205874A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements

Definitions

  • the invention relates to the technical field of LED display, in particular to a surface mount LED bracket, an LED device and an LED display screen.
  • LED Light Emitting Diodes
  • SMD Surface Mounted Devices
  • LED Light Emitting Diodes
  • SMD Light Emitting Diode
  • LED technology is widely used because it helps to improve production efficiency and facilitate application in different facilities.
  • a surface mount LED device generally includes a support formed of a metal substrate and an insulating base, a plurality of light emitting wafers, and an encapsulant, the insulating base partially surrounding the metal substrate to form a metal substrate. The bottom of the bowl. The plurality of light emitting wafers are disposed in a cup of the holder, and the encapsulant encapsulates the cup.
  • the light-emitting wafers having different parameters are in the same shape of the cup. Some or all of the corresponding light patterns will not be consistent. Therefore, in the existing surface mount LED device, a plurality of light emitting chips are packaged in the same bowl, and the light shape may be inconsistent. When the surface-mounted LED device with inconsistent light shape is assembled into a display screen, the display screen will be caused to affect the observation effect.
  • the technical problem to be solved by the present invention is to provide a surface mount LED bracket, an LED device and an LED display screen, which can independently adjust the light output shape of different light emitting chips in the LED device, and improve the uniformity of the light shape of the LED device.
  • the present invention adopts a technical solution to provide a surface mount LED bracket including an insulating base, the insulating base including an outer boss and at least one inner boss, the convex a table is disposed at a periphery of the insulating base to form a bracket cup having an accommodating space, and the at least one inner boss is disposed in the bracket cup to separate the bracket cup into independent at least Two sub-cups, wherein the highest point of the outer boss is higher than the highest point of the inner boss or the highest point of the inner boss, and the outer boss faces the side of the receiving space
  • the sides have a slope between 1 and 30, and the sides of the inner boss have a slope between 1 and 30.
  • the height of the outer boss is a value between 0.3 and 2 mm.
  • the present invention adopts another technical solution to provide a surface mount LED device, including a surface mount LED support, a conductive substrate, at least two light emitting chips, and an encapsulant;
  • the mounted LED bracket includes an insulating base including an outer boss and at least one inner boss, the outer boss being disposed at a periphery of the insulating base to form a bracket cup having a receiving space
  • the at least one inner boss is disposed in the bracket cup to divide the bracket cup into independent at least two sub-cups;
  • the conductive substrate is disposed on the bracket of the surface mount LED bracket a bottom portion of the bowl, the at least two illuminating wafers are respectively disposed in different sub-cups of the LED holder, and are respectively connected with the conductive substrates in the different sub-cups, and the encapsulant is filled in the
  • the bracket cup of the LED bracket is used to seal the at least two illuminating wafers in different sub-cups of the bracket cup.
  • the highest point of the outer boss of the surface mount LED bracket is higher than the highest point of the inner boss or is equal to the highest point of the inner boss.
  • the side of the outer boss of the surface mount type LED holder facing the accommodating space has a slope of 1° to 30°
  • the side of the inner boss has a slope of 1° to 30°
  • the height of the outer boss of the surface mount type LED holder is a value between 0.3 and 2 mm.
  • the conductive substrate disposed at the bottom of the sub-cup includes a first region and a second region insulated from each other, and a positive electrode of the illuminating wafer in the sub-cup is connected to the first region, a negative electrode and the second Regional connection.
  • the highest point of the encapsulant is level with the highest point of the outer boss of the LED bracket.
  • the encapsulant comprises a proportion of encapsulating glue and a diffusion powder
  • the encapsulating glue comprises an A glue and a B glue, wherein the ratio of the A glue, the B glue and the diffusion powder is 1: (0.7-1.3) Between: (0.03-0.5).
  • the present invention adopts another technical solution to provide a display screen including at least one surface mount LED device and an LED driving circuit, and the LED driving circuit and the at least one surface mount type LED device connection;
  • the surface mount LED device comprises a surface mount LED holder, a conductive substrate, at least two light emitting chips and an encapsulant;
  • the surface mount LED holder comprises an insulating base, the insulation The base includes an outer boss and at least one inner boss, the outer boss is disposed at a periphery of the insulating base to form a bracket cup having an accommodation space, and the at least one inner boss is disposed at the a bracket cup to divide the bracket cup into independent at least two sub-cups;
  • the conductive substrate is disposed at a bottom of the bracket cup of the surface mount LED holder, the at least two illumination Wafers are respectively disposed in different sub-cups in the surface mount LED holder, and are respectively connected to the conductive substrates in the different sub-cups, and the encapsulant is filled in
  • the highest point of the outer boss of the surface mount LED bracket is higher than the highest point of the inner boss or is equal to the highest point of the inner boss.
  • the side of the outer boss of the surface mount type LED holder facing the accommodating space has a slope of 1° to 30°
  • the side of the inner boss has a slope of 1° to 30°
  • the height of the outer boss of the surface mount type LED holder is a value between 0.3 and 2 mm.
  • the conductive substrate disposed at the bottom of the sub-cup includes a first region and a second region insulated from each other, and a positive electrode of the illuminating wafer in the sub-cup is connected to the first region, a negative electrode and the second Regional connection.
  • the highest point of the encapsulant is equal to the highest point of the outer boss of the surface mount LED holder.
  • the encapsulant comprises a proportion of encapsulating glue and a diffusion powder
  • the encapsulating glue comprises an A glue and a B glue, wherein the ratio of the A glue, the B glue and the diffusion powder is 1: (0.7-1.3) Between: (0.03-0.5).
  • the present invention provides independent at least two sub-cups in the bracket cup of the surface mount LED bracket, and independently adjusts the shape of different independent sub-cups to achieve independent adjustment.
  • the light-emitting shape of the illuminating wafer disposed in the different sub-cups improves the uniformity of the light shape of the LED device, thereby improving the illuminating display effect.
  • FIG. 1 is a schematic plan view showing an embodiment of a surface mount type LED holder of the present invention
  • FIG. 2 is a cross-sectional structural view of the surface mount LED holder shown in FIG. 1 along the A-A direction;
  • FIG. 3 is a schematic plan view showing an embodiment of a surface mount LED device of the present invention.
  • FIG. 4 is a cross-sectional structural view of the surface mount LED device shown in FIG. 3 along the B-B direction.
  • FIG. 5 is a schematic structural view of an embodiment of an LED display screen of the present invention.
  • FIG. 1 is a schematic plan view showing an embodiment of a surface mount LED holder according to the present invention
  • FIG. 2 is a cross-sectional structural view of the surface mount LED holder shown in FIG. 1 along the A-A direction
  • the surface mount LED bracket includes an insulating base 110.
  • the insulating base 110 includes an outer boss 111 and at least one inner boss 112.
  • the outer boss 111 is disposed on the insulating base 110.
  • a periphery of the bracket to form a bracket cup 113 having an accommodating space, the at least one inner boss 112 being disposed in the bracket cup 113 to divide the bracket cup 113 into independent at least two sub-cups 114.
  • the inner boss 112 is elongated, and both ends of the inner boss 112 are respectively adhered to the outer boss 111 to divide the outer boss 112 into at least two portions, and the inner boss 112 is separated from the at least one inner boss 112.
  • the respective portions of the spaced outer bosses 111 form a sub-cup 114.
  • the highest point of the outer boss 111 is higher than the highest point of the inner boss 112 or the highest point of the inner boss 112, that is, the height h1 of the outer boss 111 is greater than or equal to that of the inner boss 112.
  • the height h2 is such that the LED holder fills the encapsulant.
  • the sub-cup 114 in the holder cup 113 is used to place at least one illuminating wafer (not shown). Since the parameters of different manufacturers of illuminating wafers, structure and size of illuminating wafer, illuminating color, illuminating brightness or light-emitting shape are not completely the same, when assembling LED devices with the LED brackets, different sub-cups 114 are used.
  • the illuminating wafers having different parameters are disposed, wherein the shape of each of the sub-cups 114 corresponds to the parameters of the illuminating wafers disposed in the sub-cups 114 to make the illuminating patterns of the illuminating wafers in the different sub-cups 114 uniform.
  • the shape of the sub-cup 114 is determined by the height and side slope of the outer boss 111 and the inner boss 112 of the insulating base 110.
  • the height h1 of the outer boss 111 is a value between 0.3 and 2 millimeters (mm), for example, the height h1 of the outer boss 111 is 1.2 mm, and the inner boss height h2 is 0.7.
  • the side surface 1111 of the outer boss 111 facing the accommodating space side and the side surface 1121 of the inner boss 112 have a slope of 1° to 30°, that is, the side surface 1111 of the outer boss 111 facing the accommodating space side.
  • the angle ⁇ between the angle ⁇ and the normal direction of the bottom surface of the bracket cup 113 is between 1° and 30°, and the sides 1121 of the inner bosses 112 are respectively at an angle ⁇ with the normal direction of the bottom surface of the bracket cup 113.
  • the angle value is between 1° and 30°.
  • the slope of the side surface 1111 of the outer boss 111 facing the accommodating space side is 20°, and the slope of one side surface 1121 of the inner boss 112 is 10°, and the other side surface 1121 The slope is 15°.
  • the heights of the outer bosses 111 and the inner bosses 112 constituting the different child cups 114, the slopes of the side faces 1111 of the outer bosses in the different child cups 114, and the slopes of the side faces 1121 of the inner bosses 112 may be
  • the parameters of the light-emitting wafers placed in the corresponding sub-cups 114 are set to be different to control the light-emitting shape of the light-emitting wafers disposed in the different sub-cups 114.
  • the height of the outer boss of the surface mount type LED holder of the present invention is not limited to the above-mentioned height value range, and the slope of the side surface of the outer boss facing the accommodating space side and the side of the inner side of the inner boss is not limited to The above range of the slope, the range of the height value and the range of the slope are only preferred ranges.
  • the height of the outer boss may also be a value outside the above numerical range, and the side of the outer boss facing the accommodating space side and The sides of the inner bosses may have a slope outside the range of the slope, which is not limited herein.
  • the LED bracket further includes a metal pin 120 corresponding to the number of 114 cups, one end of the metal pin 120 is disposed at the periphery of the bottom 115 of the insulating base 110, and the metal pin 120 is further One end passes through the bottom 115 of the insulating base 110 to the corresponding sub-cup 114.
  • outer boss 111 and the inner boss 112 of the insulating base 110 are integrally injection molded to form at least two sub-cups 114 in the bracket cup 113, or the outer boss 111 and the inner boss 112 may not be integrally formed.
  • the outer boss 111 and the inner boss 112 are respectively independent insulating mechanisms, and are combined in combination to divide the bracket cup 113 formed by the outer boss 111 into at least two sub-cups 114.
  • the insulating base 110 is entirely made of a plastic material.
  • the insulating base may be made of other insulating materials, or the insulating base may be made of an insulating material, for example, an insulating substrate.
  • the sides of the outer boss and the inner boss are made of an insulating material, and thus are not limited herein.
  • the inner boss is not limited to a long strip shape.
  • the inner boss may also be any strip-shaped boss of any shape conforming to the requirements of the light-emitting shape of the light-emitting wafer placed therein, such as an arc shape, an S shape, etc., to separate the outer bosses, and A sub-cup is formed with the corresponding partial outer boss.
  • the inner boss may also be a closed-shaped boss, such as a circular shape, the inner boss is disposed in the bracket cup, does not adhere to the outer boss, and the inner and outer sides of the inner boss separate the bracket cup Cups for different child bowls.
  • the bracket cup is divided into two independent sub-cup cups by using the inner boss, and the heights of the different sub-cups and the side slopes of the inner and outer bosses are independently set independently, and can be independently and accurately
  • the light-emitting shape of the illuminating wafers of the different sub-cups is controlled, and the light-emitting shape of the illuminating wafers with different parameters placed on different sub-cups is controlled as much as possible to improve the illuminating display effect.
  • FIG. 3 is a schematic plan view showing an embodiment of the surface mount LED device of the present invention
  • FIG. 4 is a cross-sectional structural view of the surface mount LED device shown in FIG. 3 along the B-B direction.
  • the surface mount LED device includes a surface mount LED holder 310, a conductive substrate 320, at least two light emitting wafers 330, and an encapsulant 340.
  • the surface mount LED bracket 310 is the surface mount LED bracket described in the above embodiment.
  • FIG. 1 and FIG. 2 and the above description of the embodiments, and details are not described herein.
  • the conductive substrate 320 is a metal substrate, for example, a copper metal substrate.
  • the conductive substrate 320 is disposed at the bottom of the bracket cup 3113 of the surface mount LED holder 310, and the conductive substrate 320 is not attached to the surface of the bracket cup 3113.
  • the insulating base pedestal 3115 of the mounted LED holder 310 is such that the insulating pedestal bottom 3115 supports the conductive substrate 320.
  • the conductive substrate 320 is separated into at least two portions 321 , 322 , 323 by at least one inner protrusion 3112 of the LED holder 310 , and at least two portions 321 , 322 , 323 of the conductive substrate 320 are respectively disposed on the bracket cup 3113 .
  • the bottoms of the different bowls 3114 are insulated, and at least two portions 321, 322, 323 of the conductive substrate 320 are insulated from each other.
  • At least two portions 321 , 322 , 323 of the conductive substrate 320 corresponding to the bottom disposed in the sub-cup 3114 respectively include a first region 3211 and a second region 3212 insulated from each other, and at least two of the conductive substrates 320
  • the first region 3211 and the second region 3212 of the portions 321, 322, 323 are respectively connected to the metal pin 312 of the LED holder 310 to reach one end of the corresponding sub-cup 3114. As shown in FIG.
  • the bracket cup 3113 of the LED bracket 310 is divided into three sub-cups 3114 by two inner bosses 3112, and the bottom portions of the three sub-cups 3114 are respectively provided with mutually insulated conductive substrates 321, 322, 323, that is, LEDs.
  • the insulating base bottom 3115 of the bracket 310 is provided with six metal pins 312 respectively passing through the insulating base bottom 3115 and the first and second regions 3211 of the conductive substrates 321, 322, 323. 3212 connection.
  • the at least two illuminating wafers 330 are respectively disposed in different sub-cups 3114 in the LED holder 310, and the shapes of the at least two sub-cups 3114 of the LED holder 310 are respectively correspondingly disposed in the sub-cup 3114
  • the parameters of the illuminating wafer 330 are correspondingly adjusted to independently adjust the light-emitting patterns of the illuminating wafers 330 disposed in the different sub-cups 3114, so that the light-emitting patterns of the illuminating wafers 330 in the different sub-cups 3114 are uniform.
  • the illuminating wafers 330 of the different sub-cups 3114 are respectively connected to the conductive substrates 320 in the bottom of the sub-cups 3114.
  • the positive electrode 331 of the light-emitting chip 330 is connected to the first region 3211 of the conductive substrate 320 at the bottom of the corresponding sub-cup 3114 by a wire to be connected to one of the metal pins 312 of the LED holder 310, and the negative electrode 332 of the light-emitting chip 330 passes.
  • the wire is connected to the second region 3212 of the conductive substrate 320 at the bottom of the corresponding sub-cup 3114 to be coupled to the other of the metal pins 312 of the LED holder 310.
  • the metal pins 312 of the LED holder 310 are respectively connected to the power supply circuit to supply power to the at least two light-emitting chips 330 to drive light.
  • the encapsulant 340 is filled in the accommodating space of the holder cup 3113 of the LED holder 310 to seal the at least two illuminating wafers 330 in different sub-cups 3114 of the holder cup 3113.
  • the highest point of the encapsulant 340 is equal to the highest point of the outer boss 3111 of the LED holder 310 to ensure that the encapsulant 340 can completely fill the housing space of each sub-cup 3114.
  • the colloid 340 is also not limited to the highest point and the highest point of the outer boss 3111. In other embodiments, the highest point of the encapsulant can also be level with the highest point of the inner boss, or the highest point of the encapsulant is inside and convex. Waiting between the highest point of the station.
  • the encapsulant 340 includes a package glue and a diffusion powder disposed in a ratio
  • the package glue includes an A glue and a B glue.
  • the package glue is an epoxy resin or a silica gel.
  • the ratio of the A glue to the B glue is generally between 1: (0.7 and 1.3), and the ratio of the A glue, the B glue and the diffusion powder of the entire package gel 340 is 1: (0.7 - 1.3) : (0.03 -0.5) between.
  • the ratio range is only the ratio of the A glue, the B glue and the diffusion powder in the encapsulant.
  • the ratio of the A glue, the B glue and the diffusion powder in the encapsulant may also be The above ratio ranges are not intended to limit the present invention.
  • At least two portions 321 , 322 , and 323 of the conductive substrate 320 are insulated from each other, but in specific applications, at least two portions 321 , 322 , and 323 of the conductive substrate 320 are not limited to Insulating each other, when the driving voltages of the illuminating wafers 330 disposed in the different sub-cups 3114 are the same, the first regions of the at least two portions 321 , 322 , 323 of the conductive substrate 320 can be electrically conductive to each other, the conductive substrate The second regions of at least two portions 321, 322, 323 of 320 may be electrically conductive to each other.
  • the surface mount LED holder of the present invention may also include the above-mentioned conductive substrate.
  • the conductive substrate in the surface mount LED device is a conductive substrate of a surface mount LED holder. Therefore, in the product layout, the attribution of the above conductive substrate to the surface mount LED bracket or the surface mount LED device belongs to the protection scope of the present invention.
  • At least two sub-cups are provided in the bracket cup of the surface mount type LED holder, and the shape of the different sub-cups are separately controlled to be independently adjusted in different sub-cups.
  • the light-emitting shape of the light-emitting chip with different parameters improves the uniformity of the light-emitting shape of the light-emitting chip with different parameters in the surface-mount LED device, and improves the light-emitting display effect.
  • FIG. 5 is a schematic structural diagram of an embodiment of an LED display screen according to the present invention.
  • the LED display screen includes at least one surface mount LED device 510 and an LED driving circuit 520, and the LED driving circuit 520 is respectively connected to the at least one surface mount LED device 510 to the at least one surface.
  • the mounted LED device 510 provides a driving voltage for driving the at least one surface mount LED device 510 to perform display, wherein the surface mount LED device 510 is the surface mount LED device described in the above embodiment.
  • FIG. 1 to FIG. 4 and the text description of the above embodiment, and details are not described herein.
  • the above technical solution is provided with at least two sub-bowl cups in the bracket cup of the surface mount type LED bracket, and the outer shape of the different sub-bowl cups are separately controlled to realize independent adjustment in different sub-bowls.
  • the light-emitting shape of the light-emitting chip in the cup improves the uniformity of the light shape of the LED device, thereby improving the light-emitting display effect.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Led Device Packages (AREA)

Abstract

一种表面贴装式LED支架、LED器件及LED显示屏，该表面贴装式LED支架包括绝缘基座（110），该绝缘基座（110）包括外凸台（111）和至少一个内凸台（112），该外凸台（111）设置在绝缘基座（110）的外围，以形成具有容置空间的支架碗杯（113），该至少一个内凸台（112）设置在支架碗杯（113）内，以将支架碗杯（113）分隔成独立的至少两个子碗杯（114），其中，外凸台（111）的最高点高于内凸台（112）的最高点或与内凸台的最高点持平，外凸台（111）的朝向容置空间一侧的侧面具有1°至30°间的斜率，内凸台（112）的侧面具1°至30°间的斜率。通过独立调节LED器件内不同发光晶片的出光光形，提高了LED器件光形的一致性。

Description

一种表面贴装式LED支架、LED器件及LED显示屏
【技术领域】
本发明涉及LED显示技术领域，特别是涉及一种表面贴装式LED支架、LED器件及LED显示屏。
【背景技术】
表面贴装（Surface Mounted Devices，简称SMD）式发光二极管（Light Emitting Diode，简称LED）是一种可直接把电转化为光的固态半导体器件，表面贴装式LED技术有助于提高生产效率，以及便于不同设施应用，故得到广泛应用。
现有技术中，表面贴装式LED器件一般包括金属基板和绝缘的基座构成的支架、多个发光晶片和封装胶体，所述绝缘基座将所述金属基板部分包围，以形成以金属基板为底的碗杯。所述多个发光晶片设置在所述支架的碗杯中，并所述封装胶体将碗杯封装。
然而，由于LED器件中的多个发光晶片的生产厂商、发光晶片结构和尺寸、发光颜色、发光亮度或出光光形等参数并不完全相同，而参数不同的发光晶片在相同形状的碗杯中分别对应的出光光形会部分或者全部无法形成一致。故现有表面贴装式LED器件中多个发光晶片封装在同一碗杯，会出现光形不一致的情况。当用光形不一致的表面贴装式LED器件拼装成显示屏时，则会造成显示屏的花屏，影响观测效果。
【发明内容】
本发明主要解决的技术问题是提供一种表面贴装式LED支架、LED器件及LED显示屏，能够独立调节LED器件内不同发光晶片的出光光形，提高了LED器件光形的一致性。
为解决上述技术问题，本发明采用一种技术方案为：提供一种表面贴装式LED支架，包括绝缘基座，所述绝缘基座包括外凸台和至少一个内凸台，所述外凸台设置在所述绝缘基座的外围，以形成具有容置空间的支架碗杯，所述至少一个内凸台设置在所述支架碗杯内，以将所述支架碗杯分隔成独立的至少两个子碗杯，其中，所述外凸台的最高点高于所述内凸台的最高点或与所述内凸台的最高点持平，所述外凸台的朝向容置空间一侧的侧面具有1°至30°间的斜率，所述内凸台的侧面具有1°至30°间的斜率。
其中，所述外凸台的高度为0.3至2毫米间的数值。
为解决上述技术问题，本发明采用另一种技术方案为：提供一种表面贴装式LED器件，包括表面贴装式LED支架、导电基板、至少两个发光晶片和封装胶体；所述表面贴装式LED支架包括绝缘基座，所述绝缘基座包括外凸台和至少一个内凸台，所述外凸台设置在所述绝缘基座的外围，以形成具有容置空间的支架碗杯，所述至少一个内凸台设置在所述支架碗杯内，以将所述支架碗杯分隔成独立的至少两个子碗杯；所述导电基板设置于所述表面贴装式LED支架的支架碗杯内的底部，所述至少两个发光晶片分别设置在所述LED支架中的不同子碗杯中，并分别与所述不同子碗杯中的导电基板连接，所述封装胶体填充在所述LED支架的支架碗杯中，以将所述至少两个发光晶片密封在所述支架碗杯的不同子碗杯中。
其中，所述表面贴装式LED支架的外凸台的最高点高于所述内凸台的最高点或与所述内凸台的最高点持平。
其中，所述表面贴装式LED支架的外凸台的朝向容置空间一侧的侧面具有1°至30°间的斜率，所述内凸台的侧面具有1°至30°间的斜率。
其中，所述表面贴装式LED支架的外凸台的高度为0.3至2毫米间的数值。
其中，设置在所述子碗杯底部的导电基板包括相互绝缘的第一区域和第二区域，所述子碗杯中的发光晶片的正极与所述第一区域连接，负极与所述第二区域连接。
其中，所述封装胶体的最高点与所述LED支架的外凸台的最高点持平。
其中，所述封装胶体包括比例设置的封装胶水和扩散粉，所述封装胶水包括有A胶和B胶，其中，所述A胶、B胶和扩散粉的比例在1∶(0.7-1.3)∶(0.03-0.5)之间。
为解决上述技术问题，本发明采用再一种技术方案为：提供一种显示屏，包括至少一个表面贴装式LED器件和LED驱动电路，所述LED驱动电路与所述至少一个表面贴装式LED器件连接；其中，所述表面贴装式LED器件包括表面贴装式LED支架、导电基板、至少两个发光晶片和封装胶体；所述表面贴装式LED支架包括绝缘基座，所述绝缘基座包括外凸台和至少一个内凸台，所述外凸台设置在所述绝缘基座的外围，以形成具有容置空间的支架碗杯，所述至少一个内凸台设置在所述支架碗杯内，以将所述支架碗杯分隔成独立的至少两个子碗杯；所述导电基板设置于所述表面贴装式LED支架的支架碗杯内的底部，所述至少两个发光晶片分别设置在所述表面贴装式LED支架中的不同子碗杯中，并分别与所述不同子碗杯中的导电基板连接，所述封装胶体填充在所述表面贴装式LED支架的支架碗杯中，以将所述至少两个发光晶片密封在所述支架碗杯的不同子碗杯中。
其中，所述表面贴装式LED支架的外凸台的最高点高于所述内凸台的最高点或与所述内凸台的最高点持平。
其中，所述表面贴装式LED支架的外凸台的朝向容置空间一侧的侧面具有1°至30°间的斜率，所述内凸台的侧面具有1°至30°间的斜率。
其中，所述表面贴装式LED支架的外凸台的高度为0.3至2毫米间的数值。
其中，设置在所述子碗杯底部的导电基板包括相互绝缘的第一区域和第二区域，所述子碗杯中的发光晶片的正极与所述第一区域连接，负极与所述第二区域连接。
其中，所述封装胶体的最高点与所述表面贴装式LED支架的外凸台的最高点持平。
其中，所述封装胶体包括比例设置的封装胶水和扩散粉，所述封装胶水包括有A胶和B胶，其中，所述A胶、B胶和扩散粉的比例在1∶(0.7-1.3)∶(0.03-0.5)之间。
区别于现有技术，本发明在表面贴装式的LED支架的支架碗杯内设有独立至少两个子碗杯，通过分别控制不同的所述独立的子碗杯的形状，以实现独立地调节设置在不同子碗杯中的发光晶片的出光光形，提高了LED器件光形的一致性，进而提高发光显示效果。
【附图说明】
图1是本发明表面贴装式LED支架一实施方式的平面结构示意图；
图2是图1所示的表面贴装式LED支架沿A-A方向的截面结构示意图；
图3是本发明表面贴装式LED器件一实施方式的平面结构示意图；
图4是图3所示的表面贴装式LED器件沿B-B方向的截面结构示意图
图5是本发明LED显示屏一实施方式的结构示意图。
【具体实施方式】
下面结合附图和具体的实施方式进行说明。
请参阅图1和图2，图1是本发明表面贴装式LED支架一实施方式的平面结构示意图，图2是图1所示的表面贴装式LED支架沿A-A方向的截面结构示意图。本实施方式中，表面贴装式LED支架包括绝缘基座110，所述绝缘基座110包括外凸台111和至少一个内凸台112，所述外凸台111设置在所述绝缘基座110的外围，以形成具有容置空间的支架碗杯113，所述至少一个内凸台112设置在所述支架碗杯113内，以将所述支架碗杯113分隔成独立的至少两个子碗杯114。具体，内凸台112为长条状，内凸台112的两端分别与外凸台111粘连，以将外凸台112分成至少两部分，内凸台112与被至少一个内凸台112分隔开的外凸台111相应部分构成子碗杯114。其中，所述外凸台111的最高点高于所述内凸台112的最高点或与内凸台112的最高点持平，即外凸台111的高度h1大于或者等于内凸台112的的高度h2，以便于所述LED支架填充封装胶体。
本实施方式中，支架碗杯113内的子碗杯114用于放置至少一个的发光晶片（图未示）。由于不同的发光晶片的生产厂商、发光晶片结构和尺寸、发光颜色、发光亮度或出光光形等参数并不完全相同，故在用所述LED支架组装LED器件时，在不同的子碗杯114中设置参数不同的发光晶片，其中，每个子碗杯114的形状与设置在子碗杯114中的发光晶片的参数对应，以使不同子碗杯114中的发光晶片的出光光形一致。
具体地，子碗杯114的形状由绝缘基座110的外凸台111和内凸台112的高度和侧面斜率决定。本实施方式中，外凸台111的高度h1为0.3至2毫米（mm）间的数值，如外凸台111的高度h1为1.2毫米，内凸台高度h2为0.7。外凸台111的朝向容置空间一侧的侧面1111和内凸台112两侧的侧面1121均具有1°至30°间的斜率，即外凸台111的朝向容置空间一侧的侧面1111与支架碗杯113底面法线方向间的夹角α的角度值在1°至30°间，内凸台112两侧的侧面1121分别与与支架碗杯113底面法线方向间的夹角β的角度值在1°至30°间，例如，外凸台111的朝向容置空间一侧的侧面1111的斜率为20°，内凸台112一侧面1121的斜率为10°，另一侧面1121的斜率为15°。其中，构成不同子碗杯114的外凸台111和内凸台112的高度、不同子碗杯114内的外凸台的侧面1111的斜率和内凸台112的侧面1121的斜率，均可根据放置在对应子碗杯114内的发光晶片的参数而设置为不相同，以控制设置在不同子碗杯114内的发光晶片的出光光形。当然，本发明表面贴装式LED支架的外凸台的高度并不限于上述高度数值范围，外凸台的朝向容置空间一侧的侧面和内凸台两侧的侧面的斜率也不限在上述斜率范围，上述高度数值范围和斜率范围仅为优选范围，在其他实施方式中，外凸台的高度也可为上述数值范围外的数值，外凸台的朝向容置空间一侧的侧面和内凸台两侧的侧面还可具有上述斜率范围之外的斜率，在此不作限定。
进一步地，LED支架还包括数量与子碗杯114个数对应的金属管脚120，所述金属管脚120的一端设置在绝缘基座110的底部115外围，且所述金属管脚120的另一端穿过绝缘基座110底部115到达对应的子碗杯114。
另外，绝缘基座110的外凸台111和内凸台112一体注塑成型，形成支架碗杯113内的至少两个子碗杯114，或者，外凸台111与内凸台112也可不一体成型，如外凸台111与内凸台112分别为独立绝缘机构，通过组合方式组合起来，以将外凸台111构成的支架碗杯113分隔成至少两个子碗杯114。
本实施方式中，绝缘基座110整体均由塑料材料构成，当然，在其他实施方式中，绝缘基座也可由其他绝缘材料构成，或者绝缘基座的部分由绝缘材料构成，例如，绝缘基板的外凸台和内凸台的侧面为绝缘材料，故在此不作限定。
另外需要说明的是，本发明表面贴装式LED支架中，内凸台并不限为长条状。在其他应用实施方式中，内凸台还可以为其他符合放置其中的发光晶片出光光形要求的任意形状的条形凸台，例如为弧形、S形等，以将外凸台分隔，并与对应部分外凸台形成子碗杯。进一步地，内凸台还可为封闭形状的凸台，如圆形，所述内凸台设置在支架碗杯中，不与外凸台粘连，内凸台的内外侧将支架碗杯中分隔为不同的子碗杯。
本实施方式中，利用内凸台将支架碗杯分隔成独立的至少两个子碗杯，通过对不同的子碗杯的高度和内、外凸台的侧面斜率独立地进行不同设置，可独立精确地控制不同子碗杯的发光晶片的出光光形，进而实现使放置在不同子碗杯的不同参数的发光晶片的出光光形尽量一致，提高发光显示效果。
请参阅图3和图4，图3是本发明表面贴装式LED器件一实施方式的平面结构示意图，图4是图3所示的表面贴装式LED器件沿B-B方向的截面结构示意图。本实施方式中，表面贴装式LED器件包括表面贴装式LED支架310、导电基板320、至少两个发光晶片330和封装胶体340。其中，表面贴装式LED支架310为上面实施方式所述的表面贴装式LED支架，其具体说明请参阅图1、2以及上面实施方式文字描述，在此不作赘述。
导电基板320为金属基板，例如为铜金属基板，导电基板320设置于表面贴装式LED支架310的支架碗杯3113内的底部，且导电基板320不在支架碗杯3113内的一面贴附在表面贴装式LED支架310的绝缘基座底部3115上，以使绝缘基座底部3115支撑导电基板320。所述导电基板320被LED支架310的至少一个内凸台3112分隔成至少两部分321、322、323，所述导电基板320的至少两部分321、322、323分别对应设置在支架碗杯3113的不同子碗杯3114内的底部，且导电基板320的至少两部分321、322、323相互之间绝缘。
进一步地，对应设置在子碗杯3114内的底部的导电基板320的至少两个部分321、322、323，分别包括相互绝缘的第一区域3211和第二区域3212，导电基板320的至少两个部分321、322、323的第一区域3211和第二区域3212分别与LED支架310的金属管脚312到达对应子碗杯3114的一端连接。如图3所示，LED支架310的支架碗杯3113被两个内凸台3112分隔成三个子碗杯3114，三个子碗杯3114底部分别设置相互绝缘的导电基板321、322、323，即LED支架310的绝缘基座底部3115设置有6个金属管脚312，所述6个金属管脚312分别穿过绝缘基座底部3115与导电基板321、322、323的第一、第二区域3211、3212连接。
所述至少两个发光晶片330分别设置在所述LED支架310中的不同子碗杯3114中，所述LED支架310的至少两个子碗杯3114的形状分别与对应设置在所述子碗杯3114中的发光晶片330的参数对应，以独立调节设置在不同子碗杯3114中的发光晶片330的出光光形，使不同子碗杯3114中的发光晶片330的出光光形一致。不同子碗杯3114的发光晶片330分别与所处子碗杯3114底部中的导电基板320连接。进一步地，发光晶片330的正极331通过导线与对应子碗杯3114底部的导电基板320的第一区域3211连接，以与LED支架310的其中一个金属管脚312连接，发光晶片330的负极332通过导线与对应子碗杯3114底部的导电基板320的第二区域3212连接，以与LED支架310的其中另一个金属管脚312连接。所述LED支架310的金属管脚312分别与供电电路连接，以向所述至少两个发光晶片330供电，驱动发光。
所述封装胶体340填充在所述LED支架310的支架碗杯3113的容置空间中，以将所述至少两个发光晶片330密封在所述支架碗杯3113的不同子碗杯3114中。本实施方式中，所述封装胶体340的最高点与所述LED支架310的外凸台3111的最高点持平，以保证封装胶体340能够完全填充各子碗杯3114的容置空间，当然，封装胶体340也不限其最高点与外凸台3111的最高点，在其他实施方式中，封装胶体的最高点也可与内凸台的最高点持平，或者封装胶体的最高点在内、外凸台的最高点之间等。
具体地，封装胶体340包括比例设置的封装胶水和扩散粉，所述封装胶水包括A胶和B胶，一般，封装胶水为环氧树脂或硅胶。本实施方式中，A胶与B胶的比例一般在1∶(0.7-1.3)之间，封装胶体340整体的A胶、B胶和扩散粉的比例在1∶(0.7-1.3)∶(0.03-0.5)之间。需要说明的是，上述比例范围仅是封装胶体中的A胶、B胶和扩散粉的比例的优选，在其他实施方式中，封装胶体中的A胶、B胶和扩散粉的比例也可为上述比例范围之外的比例值，故上述比例范围并不作为对本发明的限定。
需要说明的是，本实施方式中，导电基板320的至少两部分321、322、323相互之间绝缘，但在具体应用中，所述导电基板320的至少两部分321、322、323不限为相互间绝缘，在设置在不同子碗杯3114中的发光晶片330的驱动电压相同时，所述导电基板320的至少两部分321、322、323的第一区域间可相互导电，所述导电基板320的至少两部分321、322、323的第二区域间可相互导电。
另外，在另一实施方式中，本发明表面贴装式LED支架也可包括上述的导电基板，对应地，表面贴装式LED器件中的导电基板即为表面贴装式LED支架的导电基板，故在产品布局上，将上述导电基板归属于表面贴装式LED支架或表面贴装式LED器件均属于本发明保护范围。
本实施方式在表面贴装式LED支架的支架碗杯内设有独立至少两个子碗杯，通过分别控制不同的所述独立的子碗杯的形状，以独立地调节设置在不同子碗杯中的不同参数的发光晶片的出光光形，提高表面贴装式LED器件中不同参数的发光晶片出光光形的一致性，提高发光显示效果。
请参阅图5，图5是本发明LED显示屏一实施方式的结构示意图。本实施方式中，LED显示屏包括至少一个表面贴装式LED器件510和LED驱动电路520，LED驱动电路520分别与所述至少一个表面贴装式LED器件510连接，以向所述至少一个表面贴装式LED器件510提供驱动电压，驱动所述至少一个表面贴装式LED器件510发光实现显示，其中，表面贴装式LED器件510为上面实施方式中所述的表面贴装式LED器件，其具体说明请参阅图1至4以及上面实施方式的文字描述，在此不作赘述。
上述技术方案在表面贴装式的LED支架的支架碗杯内设有独立至少两个子碗杯，通过分别控制不同的所述独立的子碗杯的形状，以实现独立地调节设置在不同子碗杯中的发光晶片的出光光形，提高了LED器件光形的一致性，进而提高发光显示效果。
以上所述仅为本发明的实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (16)

  1. 一种表面贴装式LED支架，其中，
    包括绝缘基座，所述绝缘基座包括外凸台和至少一个内凸台，所述外凸台设置在所述绝缘基座的外围，以形成具有容置空间的支架碗杯，所述至少一个内凸台设置在所述支架碗杯内，以将所述支架碗杯分隔成独立的至少两个子碗杯，其中，所述外凸台的最高点高于所述内凸台的最高点或与所述内凸台的最高点持平，所述外凸台的朝向容置空间一侧的侧面具有1°至30°间的斜率，所述内凸台的侧面具有1°至30°间的斜率。
  2. 根据权利要求1所述的表面贴装式LED支架，其中，
    所述外凸台的高度为0.3至2毫米间的数值。
  3. 一种表面贴装式LED器件，其中，
    包括表面贴装式LED支架、导电基板、至少两个发光晶片和封装胶体；
    所述表面贴装式LED支架包括绝缘基座，所述绝缘基座包括外凸台和至少一个内凸台，所述外凸台设置在所述绝缘基座的外围，以形成具有容置空间的支架碗杯，所述至少一个内凸台设置在所述支架碗杯内，以将所述支架碗杯分隔成独立的至少两个子碗杯；
    所述导电基板设置于所述表面贴装式LED支架的支架碗杯内的底部，所述至少两个发光晶片分别设置在所述表面贴装式LED支架中的不同子碗杯中，并分别与所述不同子碗杯中的导电基板连接，所述封装胶体填充在所述表面贴装式LED支架的支架碗杯中，以将所述至少两个发光晶片密封在所述支架碗杯的不同子碗杯中。
  4. 根据权利要求3所述的表面贴装式LED器件，其中，
    所述表面贴装式LED支架的外凸台的最高点高于所述内凸台的最高点或与所述内凸台的最高点持平。
  5. 根据权利要求3所述的表面贴装式LED器件，其中，
    所述表面贴装式LED支架的外凸台的朝向容置空间一侧的侧面具有1°至30°间的斜率，所述内凸台的侧面具有1°至30°间的斜率。
  6. 根据权利要求3所述的表面贴装式LED器件，其中，
    所述表面贴装式LED支架的外凸台的高度为0.3至2毫米间的数值。
  7. 根据权利要求3所述的表面贴装式LED器件，其中，
    设置在所述子碗杯底部的导电基板包括相互绝缘的第一区域和第二区域，所述子碗杯中的发光晶片的正极与所述第一区域连接，负极与所述第二区域连接。
  8. 根据权利要求3所述的表面贴装式LED器件，其中，
    所述封装胶体的最高点与所述表面贴装式LED支架的外凸台的最高点持平。
  9. 根据权利要求3所述的表面贴装式LED器件，其中，
    所述封装胶体包括比例设置的封装胶水和扩散粉，所述封装胶水包括有A胶和B胶，其中，所述A胶、B胶和扩散粉的比例在1∶(0.7-1.3)∶(0.03-0.5)之间。
  10. 一种LED显示屏，其中，
    包括至少一个表面贴装式LED器件和LED驱动电路，所述LED驱动电路与所述至少一个表面贴装式LED器件连接；
    其中，所述表面贴装式LED器件包括表面贴装式LED支架、导电基板、至少两个发光晶片和封装胶体；所述表面贴装式LED支架包括绝缘基座，所述绝缘基座包括外凸台和至少一个内凸台，所述外凸台设置在所述绝缘基座的外围，以形成具有容置空间的支架碗杯，所述至少一个内凸台设置在所述支架碗杯内，以将所述支架碗杯分隔成独立的至少两个子碗杯；所述导电基板设置于所述表面贴装式LED支架的支架碗杯内的底部，所述至少两个发光晶片分别设置在所述表面贴装式LED支架中的不同子碗杯中，并分别与所述不同子碗杯中的导电基板连接，所述封装胶体填充在所述表面贴装式LED支架的支架碗杯中，以将所述至少两个发光晶片密封在所述支架碗杯的不同子碗杯中。
  11. 根据权利要求10所述的LED显示屏，其中，
    所述表面贴装式LED支架的外凸台的最高点高于所述内凸台的最高点或与所述内凸台的最高点持平。
  12. 根据权利要求10所述的LED显示屏，其中，
    所述表面贴装式LED支架的外凸台的朝向容置空间一侧的侧面具有1°至30°间的斜率，所述内凸台的侧面具有1°至30°间的斜率。
  13. 根据权利要求10所述的LED显示屏，其中，
    所述表面贴装式LED支架的外凸台的高度为0.3至2毫米间的数值。
  14. 根据权利要求10所述的LED显示屏，其中，
    设置在所述子碗杯底部的导电基板包括相互绝缘的第一区域和第二区域，所述子碗杯中的发光晶片的正极与所述第一区域连接，负极与所述第二区域连接。
  15. 根据权利要求10所述的LED显示屏，其中，
    所述封装胶体的最高点与所述表面贴装式LED支架的外凸台的最高点持平。
  16. 根据权利要求10所述的LED显示屏，其中，
    所述封装胶体包括比例设置的封装胶水和扩散粉，所述封装胶水包括有A胶和B胶，其中，所述A胶、B胶和扩散粉的比例在1∶(0.7-1.3)∶(0.03-0.5)之间。
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106847803A (zh) * 2017-03-28 2017-06-13 山东晶泰星光电科技有限公司 一种集成ic的表面贴装式rgb‑led封装模组
CN110085725A (zh) * 2019-04-18 2019-08-02 惠州市长方照明节能科技有限公司 一种可调色led拉伸支架
CN113078254A (zh) * 2021-03-18 2021-07-06 江门市迪司利光电股份有限公司 一种双源发光led封装方法和封装结构
CN118299374A (zh) * 2024-06-06 2024-07-05 江西斯迈得半导体有限公司 一种发光器件及其制备方法

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9195281B2 (en) 2013-12-31 2015-11-24 Ultravision Technologies, Llc System and method for a modular multi-panel display
US9582237B2 (en) 2013-12-31 2017-02-28 Ultravision Technologies, Llc Modular display panels with different pitches
CN103904069A (zh) * 2014-03-13 2014-07-02 黄云仙 一种固定于同一芯片上的双灯珠结构
CN105024001A (zh) * 2014-04-21 2015-11-04 重庆四联光电科技有限公司 Led支架碗杯结构及具有该支架碗杯结构的led灯珠
US9311847B2 (en) 2014-07-16 2016-04-12 Ultravision Technologies, Llc Display system having monitoring circuit and methods thereof
CN104700726A (zh) * 2015-04-01 2015-06-10 矽照光电（厦门）有限公司 一种led显示装置
CN108305871A (zh) * 2018-01-26 2018-07-20 深圳市天成照明有限公司 一种多杯型支架内置ic的灯珠
CN111223976A (zh) * 2020-01-14 2020-06-02 昆山琉明光电有限公司 高亮度的led封装方法及结构

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1808714A (zh) * 2004-12-10 2006-07-26 安捷伦科技有限公司 具有隔室的发光二极管显示器
JP2008034487A (ja) * 2006-07-26 2008-02-14 Matsushita Electric Works Ltd 発光装置
CN102064171A (zh) * 2010-10-22 2011-05-18 友达光电股份有限公司 发光二极管装置
CN202150455U (zh) * 2011-07-27 2012-02-22 深圳路升光电科技有限公司 全彩表面贴装元件及支架
CN102544319A (zh) * 2012-01-05 2012-07-04 深圳雷曼光电科技股份有限公司 Led支架、led及led封装工艺
CN203339216U (zh) * 2013-06-24 2013-12-11 深圳雷曼光电科技股份有限公司 一种表面贴装式led支架、led器件及led显示屏

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101039994B1 (ko) * 2010-05-24 2011-06-09 엘지이노텍 주식회사 발광소자 및 이를 구비한 라이트 유닛

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1808714A (zh) * 2004-12-10 2006-07-26 安捷伦科技有限公司 具有隔室的发光二极管显示器
JP2008034487A (ja) * 2006-07-26 2008-02-14 Matsushita Electric Works Ltd 発光装置
CN102064171A (zh) * 2010-10-22 2011-05-18 友达光电股份有限公司 发光二极管装置
CN202150455U (zh) * 2011-07-27 2012-02-22 深圳路升光电科技有限公司 全彩表面贴装元件及支架
CN102544319A (zh) * 2012-01-05 2012-07-04 深圳雷曼光电科技股份有限公司 Led支架、led及led封装工艺
CN203339216U (zh) * 2013-06-24 2013-12-11 深圳雷曼光电科技股份有限公司 一种表面贴装式led支架、led器件及led显示屏

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106847803A (zh) * 2017-03-28 2017-06-13 山东晶泰星光电科技有限公司 一种集成ic的表面贴装式rgb‑led封装模组
CN106847803B (zh) * 2017-03-28 2023-09-15 山东捷润弘光电科技有限公司 一种集成ic的表面贴装式rgb-led封装模组
CN110085725A (zh) * 2019-04-18 2019-08-02 惠州市长方照明节能科技有限公司 一种可调色led拉伸支架
CN113078254A (zh) * 2021-03-18 2021-07-06 江门市迪司利光电股份有限公司 一种双源发光led封装方法和封装结构
CN118299374A (zh) * 2024-06-06 2024-07-05 江西斯迈得半导体有限公司 一种发光器件及其制备方法

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