CN210607317U - 一种多色温多通道emc支架结构 - Google Patents
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- 239000002184 metal Substances 0.000 claims abstract description 30
- 229910052751 metal Inorganic materials 0.000 claims abstract description 30
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- 241000218202 Coptis Species 0.000 claims abstract description 3
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/20—Controlling the colour of the light
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Abstract
本实用新型提供了一种多色温多通道EMC支架结构，包括金属基片，所述金属基片周边设置有三个以上焊盘，所述焊盘作为金属基片的多区块电极，所述金属基片设置有碗杯状绝缘树脂围坝胶层，所述焊盘一部分位于绝缘树脂围坝胶层内，焊盘另一部分位于绝缘树脂围坝胶层外；所述绝缘树脂围坝胶层内部设置有至少一条的白色树脂隔板，所述白色树脂隔板将金属基片分隔成多个的区域，分别在不同区域内设置不同的LED芯片回路，所述LED芯片回路包括多个LED芯片，多个LED芯片中的头尾两个芯片与三个焊盘中任意两个焊盘连接，多个LED芯片相邻两个芯片之间通过金线连接，在不同的LED芯片回路的碗杯内分别封装有一荧光层，本实用新型能分区控制，达到不同色温效果。
Description
技术领域
本实用新型涉及LED灯技术领域，特别是一种多色温多通道EMC支架结构。
背景技术
EMC（Epoxy Molding Compound )是采用新的Epoxy材料和蚀刻技术在Molding设备的封装下的一种高度集成化的框架形式。
传统EMC多色温产品皆为多个发光二极管LED PKG结合在一起，少有在一个LEDPKG内有多种色温，在同一LED PKG发光面下的好处是光型好设计、现有LED光学透镜lens可以直接使用EMC多色温产品。而现有的技术缺点是：现有多色温产品为多个LED组成，实质上是整体产品大小超出原本产品许多，导致灯具LENS都需重新设计，设计形状有较多的限制，且传统支架为热电不分离，散热能力较差。
发明内容
为克服上述问题，本实用新型的目的是提供一种多色温多通道EMC支架结构，能多区域控制色温增加产品多样性，提升产品强度。
本实用新型采用以下方案实现：一种多色温多通道EMC支架结构，包括金属基片，所述金属基片周边设置有三个以上焊盘，所述焊盘作为金属基片的多区块电极，所述金属基片设置有碗杯状绝缘树脂围坝胶层，所述焊盘一部分位于绝缘树脂围坝胶层内，焊盘另一部分位于绝缘树脂围坝胶层外；所述绝缘树脂围坝胶层内部设置有至少一条的白色树脂隔板，所述白色树脂隔板将金属基片分隔成多个的区域，分别在不同区域内设置不同的LED芯片回路，所述LED芯片回路包括多个LED芯片，多个LED芯片中的头尾两个芯片与三个焊盘中任意两个焊盘连接，多个LED芯片相邻两个芯片之间通过金线连接，在不同的LED芯片回路的碗杯状绝缘树脂围坝胶层内分别封装有一荧光层，所述荧光层位于所述LED芯片上。
进一步的，所述焊盘有四个焊盘，且四个焊盘位于所述金属基片的四个角，且四个焊盘中分隔岛同侧两个焊盘作为多区块的负电极，剩余两个焊盘作为多区块的正电极。
进一步的，所述绝缘树脂围坝胶层内部设置有两条的白色树脂隔板，所述白色树脂隔板将金属基片分隔成三个的区域，三个区域内设置不同的LED芯片回路。
本实用新型的有益效果在于：1.在传统支架外型上设计多色温产品，实现产品直接替换，提高生产效率。
2.多区域控制色温增加产品多样性及应用市场。
3.本实用新型是热电分离式EMC支架，提升信赖性。
4.在不同回路的碗杯内分别点上荧光胶，分区控制，达到不同色温效果。
附图说明
图1是本实用新型的结构示意图。
图2是本实用新型的金属基片和焊盘结合在一起的结构示意图。
图3是本实用新型第一实施的去掉荧光层和LED芯片回路的结构示意图。
图4是本实用新型第一实施的剖面示意图。
图5是本实用新型第二实施的去掉荧光层和LED芯片回路的结构示意图。
图6是本实用新型第二实施的剖面示意图。
具体实施方式
下面结合附图对本实用新型做进一步说明。
请参阅图1至图4所示，本实用新型第一实施例提供了一种多色温多通道EMC支架结构，包括金属基片1，所述金属基片1周边设置有三个以上焊盘2，所述焊盘2作为金属基片的多区块电极，所述金属基片1设置有碗杯状绝缘树脂围坝胶层3，所述焊盘2一部分位于绝缘树脂围坝胶层3内，焊盘另一部分位于绝缘树脂围坝胶层3外；所述绝缘树脂围坝胶层内部设置有至少一条的白色树脂隔板4，所述白色树脂隔板4将金属基片1分隔成多个的区域11，分别在不同区域11内设置不同的LED芯片回路5，所述LED芯片回路5包括多个LED芯片51，多个LED芯片51中的头尾两个芯片与三个焊盘中任意两个焊盘连接，即将焊盘作为多区块的负电极和正电极，这样每个区域都可以设置不同的LED芯片回路；多个LED芯片51相邻两个芯片之间通过金线52连接，在不同的LED芯片回路5的碗杯状绝缘树脂围坝胶层内分别封装有一荧光层6，所述荧光层6位于所述LED芯片上。这样EMC支架结构不限于两个色温，也可是多个色温并存，只要正负极的电性可分开。这样多个色温LED芯片回路不会增加整体产品的大小。
请参阅图5和图6所示，本实用新型的第二实施例中所述焊盘有四个焊盘2，且四个焊盘位于所述金属基片的四个角，且四个焊盘中分隔岛同侧两个焊盘作为多区块的负电极，剩余两个焊盘作为多区块的正电极。该四个焊盘在实际生产中比较常用。
另外，所述绝缘树脂围坝胶层3内部设置有两条的白色树脂隔板4，所述白色树脂隔板4将金属基片分隔成三个的区域11，三个区域11内设置不同的LED芯片回路。这样能实现三个色温并存。
总之，本实用新型将支架设计为热电分离式支架，金属基片周边设置有三个以上焊盘；金属基片上设置至少一条的白色树脂隔板，且白色树脂隔板在碗杯状绝缘树脂围坝胶层内，该金属基片分隔成多个的区域，分别在不同区域内设置不同的LED芯片回路，该回路通过作为多区块的负电极和正电极的焊盘连接，这样在每个区域内都能设置独立的色温，不会增加整体产品的大小，且多区域控制色温增加产品多样性及应用市场。
以上所述仅为本实用新型的较佳实施例，凡依本实用新型申请专利范围所做的均等变化与修饰，皆应属本实用新型的涵盖范围。
Claims (3)
1.一种多色温多通道EMC支架结构，包括金属基片，所述金属基片周边设置有三个以上焊盘，所述焊盘作为金属基片的多区块电极，所述金属基片设置有碗杯状绝缘树脂围坝胶层，所述焊盘一部分位于绝缘树脂围坝胶层内，焊盘另一部分位于绝缘树脂围坝胶层外；其特征在于：所述绝缘树脂围坝胶层内部设置有至少一条的白色树脂隔板，所述白色树脂隔板将金属基片分隔成多个的区域，分别在不同区域内设置不同的LED芯片回路，所述LED芯片回路包括多个LED芯片，多个LED芯片中的头尾两个芯片与三个焊盘中任意两个焊盘连接，多个LED芯片相邻两个芯片之间通过金线连接，在不同的LED芯片回路的碗杯状绝缘树脂围坝胶层内分别封装有一荧光层，所述荧光层位于所述LED芯片上。
2.根据权利要求1所述的一种多色温多通道EMC支架结构，其特征在于：所述焊盘有四个焊盘，且四个焊盘位于所述金属基片的四个角，且四个焊盘中分隔岛同侧两个焊盘作为多区块的负电极，剩余两个焊盘作为多区块的正电极。
3.根据权利要求1所述的一种多色温多通道EMC支架结构，其特征在于：所述绝缘树脂围坝胶层内部设置有两条的白色树脂隔板，所述白色树脂隔板将金属基片分隔成三个的区域，三个区域内设置不同的LED芯片回路。
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