WO2014192482A1 - ガラス基板の切断方法及びガラス基板の製造方法 - Google Patents

ガラス基板の切断方法及びガラス基板の製造方法 Download PDF

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Publication number
WO2014192482A1
WO2014192482A1 PCT/JP2014/061849 JP2014061849W WO2014192482A1 WO 2014192482 A1 WO2014192482 A1 WO 2014192482A1 JP 2014061849 W JP2014061849 W JP 2014061849W WO 2014192482 A1 WO2014192482 A1 WO 2014192482A1
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Prior art keywords
glass substrate
laser light
cutting
laser beam
width direction
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PCT/JP2014/061849
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English (en)
French (fr)
Japanese (ja)
Inventor
高橋　秀幸
利之 植松
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旭硝子株式会社
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Application filed by 旭硝子株式会社 filed Critical 旭硝子株式会社
Priority to CN201480024048.4A priority Critical patent/CN105164073B/zh
Priority to JP2015519748A priority patent/JP6379392B2/ja
Priority to KR1020157026147A priority patent/KR20160013841A/ko
Publication of WO2014192482A1 publication Critical patent/WO2014192482A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/08—Severing cooled glass by fusing, i.e. by melting through the glass
    • C03B33/082—Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Definitions

  • the present invention relates to a glass substrate cutting method and a glass substrate manufacturing method.
  • a cutting method using a laser beam has been studied as a method for cutting a glass substrate.
  • Patent Document 1 discloses a method of cutting a glass substrate that is forcibly cooled by compressed gas or the like immediately after forming a notch recess having a predetermined depth by irradiating laser light.
  • Patent Document 2 discloses a method of cutting a glass substrate in which a glass substrate is irradiated while scanning with laser light, the glass is melted at a portion irradiated with the laser light, and the molten glass is blown off with an assist gas.
  • the present invention can cut a glass substrate with higher accuracy than the conventional glass substrate cutting method in which an assist gas is blown onto the glass substrate, and the occurrence of cracks in the glass substrate. It aims at providing the cutting method of the glass substrate which suppresses and can obtain a uniform cut surface.
  • the present invention is a method for cutting a glass substrate by irradiating a laser beam along a planned cutting line and irradiating one surface of the glass substrate with the laser beam.
  • a partial region in the width direction perpendicular to the planned cutting line of the glass substrate including the laser light irradiation region is curved in the width direction of the glass substrate, and the glass substrate is in the laser light irradiation region.
  • the laser light irradiation part from one surface of the substrate to the other surface is heated to a temperature higher than the vaporization portion, and the irradiation region of the laser light is relative to the glass substrate along the planned cutting line of the glass substrate.
  • the glass substrate can be cut with higher accuracy than the method for cutting a glass substrate using a conventional assist gas. Moreover, generation
  • Explanatory drawing of the cutting method of the glass substrate which concerns on embodiment of this invention
  • corrugation on the surface Explanatory drawing of the structural example of the conveyance roller provided with the supporting member
  • region of the width direction of a glass substrate Explanatory drawing of the heating process in the cutting method of the glass substrate which concerns on embodiment of this invention.
  • Explanatory drawing of the cooling process in the cutting method of the glass substrate which concerns on embodiment of this invention.
  • Explanatory drawing about the precipitate in the cooling process in the cutting method of the glass substrate which concerns on embodiment of this invention Explanatory drawing of the relationship between the conveyance speed of the glass substrate of Experimental example 1 of this invention, the energy density of a laser beam, and evaluation of a cut surface.
  • the glass substrate cutting method of the present embodiment is a method for cutting a glass substrate by irradiating a laser beam along a planned cutting line, and has the following configuration.
  • a part of the width direction (hereinafter also referred to as “the width direction of the glass substrate”) orthogonal to the planned cutting line of the glass substrate including the laser light irradiation region that irradiates one surface of the glass substrate with the laser light.
  • the region is curved in the width direction of the glass substrate.
  • heating is performed at a temperature higher than the temperature at which the laser light irradiation portion from one surface of the glass substrate to the other surface is vaporized.
  • the glass substrate cutting method is characterized in that the irradiation region of the laser beam is moved relative to the glass substrate along a planned cutting line of the glass substrate.
  • FIG. 1 schematically shows a configuration in which a glass substrate is cut by the glass substrate cutting method of the present invention as seen from the upper surface of the glass substrate on the side irradiated with laser light (one surface side).
  • the glass substrate 11 is conveyed in the direction indicated by the arrow A in FIG. 1, and a portion (laser light irradiation region) irradiated with a laser beam 12 oscillated from a laser oscillation device (not shown) is cut on the glass substrate. It can move along the planned line 13.
  • region of a laser beam is curved to the width direction of a glass substrate. Yes. This will be described below.
  • Wrinkles may occur in the glass substrate when the glass substrate is thin, especially when the glass substrate is being transported.
  • the surface of the glass substrate includes irregularities.
  • laser The distance D1 is between the oscillation device 23 and one surface of the glass substrate 11.
  • Method of curving a partial region in the width direction perpendicular to the planned cutting line of the glass substrate including the laser light irradiation region for irradiating the laser beam 12 on one surface of the glass substrate 11 in the width direction of the glass substrate Is not particularly limited.
  • curving in the width direction of a glass substrate curves the cross section of a glass substrate perpendicular
  • FIG. 3 shows a configuration example of the transport roller 32 provided with the support member 33.
  • 4 and FIG. 5 show a glass substrate on the side (one surface side) irradiated with laser light in a configuration example in which the conveyance roller 32 having the support member 33 shown in FIG. 3 is arranged on the conveyance path of the glass substrate.
  • the structure seen from the upper surface is shown typically.
  • a partial region in the width direction of the glass substrate including a laser light irradiation region protrudes from a region of the other part of the glass substrate.
  • the method of supporting a glass substrate from the other surface side of a glass substrate with a supporting member is mentioned.
  • the support member 33 when the support member 33 is arranged on a part of the width direction of the transport roller 32, the support member 33 causes the surface of a part of the region 31 of the glass substrate to be a region of another part of the glass substrate. It can be supported from the lower surface side (the other surface side) of the glass substrate so as to be higher than 34.
  • the conveyance roller 32 including the support member 33 can be obtained.
  • a partial region in the width direction of the glass substrate can be curved in the range indicated by the region 41 in FIG. That is, the cross section of the glass substrate perpendicular to the transport direction can be curved upward.
  • FIG. 4 shows an example in which the support member 33 is provided only on one end side in the width direction of the transport roller 32, but the embodiment is not limited thereto.
  • Support members 33 can be provided at a plurality of locations in the width direction of the glass substrate according to the number of planned cutting lines 13 of the glass substrate. For example, when both ends in the width direction of the glass substrate are cut, the support member 33 can be provided also on the other end side in the width direction of the transport roller 32.
  • the configuration of the support member 33 formed on the transport roller 32 is not particularly limited. As shown in FIG. 4, when the support member 33 is formed for each transport roller 32, for example, by arranging an O-ring on the transport roller 32 as the support member 33, a partial region in the width direction on the surface of the transport roller 32 is annular. Can be formed. Further, the support member 33 may be constituted by a tape-shaped guide member wound between a plurality of transport rollers, that is, a belt, instead of being provided for each transport roller 32 as shown in FIG. In this case as well, a partial region in the width direction orthogonal to the planned cutting line of the glass substrate 11 can be curved in the range indicated by the region 41 in FIG. That is, the cross section of the glass substrate perpendicular to the transport direction can be curved upward.
  • the structure of the support member is not particularly limited as described above, it is preferable that the support member is formed of a tape-shaped guide member wound between a plurality of conveying rollers as shown in FIG.
  • the support member is constituted by a tape-shaped guide member wound between the conveyance rolls, the glass substrate can be supported by the support member from the other surface side even between the conveyance rolls, and the curved portion of the glass substrate can be supported. This is because the shape can be kept uniform and the generation of wrinkles can be further suppressed.
  • the height H of the support member 33 shown in FIG. 3 is not particularly limited, and can be arbitrarily selected according to the thickness of the glass substrate to be cut.
  • the shape of the surface of the support member 33 that contacts the glass substrate is not particularly limited, and may be a flat shape as shown in FIG. 3 or a shape curved in the width direction of the transport roller. It may be.
  • the conveyance roller 32 with the portion 61 having a smaller diameter than the other portions, a concavity is formed on the surface of the conveyance roller 32.
  • the glass substrate is bent by the concave portion, and the glass substrate 11 can be curved in the vicinity of the boundary between the portion 61 having a smaller diameter than the other portion and the other portion as shown in FIG. That is, the cross section of the glass substrate perpendicular to the transport direction can be curved downward.
  • a holding member such as a conveyance roller or a table
  • a method may be used in which the partial area of the glass substrate 11 held by 40 protrudes from the holding member 40 and is bent by its own weight.
  • the holding member 40 is a table, at least one of the glass substrate 11 and the laser oscillation device is moved to cut the glass substrate 11.
  • the irradiation region of the laser beam 12 is on the inclined portion of the curved portion of the glass substrate. It is preferable that they are arranged. This is because, as shown in FIGS. 3, 6, and 14, in the inclined portion of the curved glass substrate, the conveyance roller 32 or the support member 33 that supports the glass substrate from the other surface (lower surface) side, or the holding member. A gap will be generated between the member 40 and the glass substrate 11. For this reason, when irradiating a laser beam, it can suppress that the conveyance roller 32, the support member 33, etc. are heated, and damage to the conveyance roller 32 etc. can be suppressed.
  • the incident angle of the laser beam 12 with respect to the glass substrate is not particularly limited.
  • the laser light 12 is emitted from the glass substrate in an uncurved region of the glass substrate, that is, the region 34 of another part of the glass substrate in FIG. 3, for example. Irradiation can be performed so as to be substantially perpendicular to the surface.
  • the angle at which the laser beam 12 is irradiated may be adjusted according to the tilt angle of the glass substrate in the irradiation region of the laser beam 12.
  • the glass substrate 11 may be irradiated with the laser beam 12 such that the surface of the glass substrate 11 and the laser beam 12 are substantially perpendicular to each other in the laser beam irradiation region.
  • the glass substrate is curved in a parabolic shape, a slope is formed on the right side in the drawing and the left side in the drawing. For this reason, as shown by the arrow 12 ′, the laser beam may be irradiated on the slope on the left side in the drawing.
  • the support member 33 protrudes from the region of the other part of the glass substrate, and is part of the glass substrate in the width direction of the glass substrate. It is preferable to support the glass substrate so that the irradiation region of the laser beam is arranged on the slope on the end side in the width direction. That is, it is preferable that the irradiation region of the laser light is on the slope on the end side in the width direction of the glass substrate.
  • the glass substrate is curved in the length direction of the glass substrate.
  • the range is not particularly limited. That is, even in the range of the laser beam irradiation region in the length direction of the glass substrate, a partial region in the width direction orthogonal to the planned cutting line of the glass substrate may be curved in the width direction of the glass substrate.
  • the length direction of a glass substrate here means the direction parallel to the conveyance direction of a glass substrate.
  • part of the glass substrate in the width direction including the planned cutting line of the glass substrate over a range from the laser beam irradiation region of the glass substrate to a portion separated by a predetermined distance along the planned cutting line of the glass substrate. It is preferable to curve the region in the width direction of the glass substrate.
  • the glass substrate is curved for a partial region in the width direction orthogonal to the planned cutting line of the glass substrate including at least the laser light irradiation region, it is compared with the case where the glass substrate is not curved.
  • the generation of wrinkles can be suppressed in the laser light irradiation region.
  • the degree of suppression of wrinkles may not be sufficient.
  • the glass substrate is cut with respect to a partial region in the width direction of the glass substrate including the planned cutting line of the glass substrate over a predetermined range upstream of the laser beam irradiation region in the conveyance direction of the glass substrate, for example.
  • the glass substrate is preferably curved so that the planned line is arranged on the slope.
  • the transport roller 32 including the support member 33 when the transport roller 32 including the support member 33 is disposed as illustrated in FIG. 4, the apex position of the transport roller 32 including the support member 33 disposed on the most upstream side in the transport direction of the glass substrate.
  • the irradiation region of the laser beam 12 comes downstream.
  • the laser light irradiation region is arranged on the downstream side in the transport direction of the glass substrate from the line XX ′.
  • the irradiation region of the laser light 12 is preferably disposed between the transport rollers 32 in order to prevent the transport rollers 32 and the like from being damaged when the laser beams are irradiated.
  • a partial region in the width direction perpendicular to the planned cutting line of the glass substrate including the irradiation region of the laser light is arranged in the width direction of the glass substrate. It is curved.
  • the laser light irradiation portion from the one surface to the other surface of the glass substrate is heated (heating step).
  • the region 14 which has already been irradiated with the laser light is separated from the laser light irradiation region by the conveyance of the glass substrate 11, and the laser light irradiation part (laser light is irradiated and the glass is vaporized after the laser light irradiation).
  • the peripheral part of 15 is cooled (cooling step).
  • FIGS. 1, 7, and 8 for convenience of description, the periphery of the laser light irradiation region is also illustrated as a flat shape.
  • the cutting line 13 of a glass substrate is shown in the figure, the line which concerns on an actual glass substrate is not necessarily provided.
  • composition of the glass substrate to which the glass substrate cutting method of the present embodiment can be applied is not particularly limited and can be applied to various glass substrates.
  • examples thereof include non-alkali borosilicate glass, borosilicate glass, soda lime glass, high silica glass, and other oxide-based glasses mainly composed of silicon oxide.
  • the thickness of the glass substrate is not particularly limited, and can be arbitrarily selected according to, for example, the output of the laser oscillation device to be used.
  • the thickness of the glass substrate is preferably 3.0 mm or less, more preferably 1.0 mm or less, further preferably 0.5 mm or less, and 0.2 mm or less. Particularly preferred.
  • the lower limit is not particularly limited.
  • the shape of the glass substrate shown in FIG. 1 is rectangular, but the shape of the glass substrate is not particularly limited.
  • a band-shaped glass substrate formed by a glass substrate forming apparatus such as a float method or a downdraw method may be used.
  • FIG. 7 is an enlarged view of the vicinity of the irradiation region of the laser beam 12 in the cross section taken along line BB ′ in FIG.
  • the heating step is performed in the laser light irradiation region by irradiating the glass substrate with the laser light 12 as described above.
  • the laser light irradiation portion 71 from one surface of the glass substrate to the other surface of the glass substrate is heated to a temperature higher than the temperature at which the glass vaporizes.
  • one surface of the glass substrate means a surface on which laser light is incident, and the other surface means an opposing surface.
  • glass is vaporized and a through-hole is formed in the laser beam irradiation direction (thickness direction of the glass substrate) in a short time.
  • peripheral portion 72 of the laser beam irradiation unit 71 is also heated by heat transfer from the laser beam irradiation unit.
  • the glass can be vaporized in the laser light irradiation portion in a short time. For this reason, the glass substrate can be processed with high accuracy without causing a positional shift and the like, and the occurrence of cracks in the glass substrate can be suppressed.
  • the irradiation condition of the laser beam in the heating process is not limited. In the laser beam irradiation region of the glass substrate, from one surface (surface on which laser light is incident) side of the glass substrate to the other surface side. What is necessary is just to select so that a laser beam irradiation part can be heated more than the vaporization temperature of glass.
  • the glass composition for example, from the thickness of the glass substrate that is the object to be cut, the glass composition, the conveyance speed of the glass substrate (the relative movement speed of the irradiation region of the laser light with respect to the glass substrate), etc.
  • the energy density of the laser beam and the like may be selected so that heating can be performed. For example, it can be calculated by conducting a preliminary test in advance.
  • the energy density of the laser light is E (W / mm 2 ), and the thickness of the glass substrate is t (mm).
  • E ⁇ 50 ⁇ t ⁇ v It is preferable to adjust the energy density of the laser beam to be irradiated so as to satisfy the above relationship.
  • the glass By cutting the glass substrate including the heating step in a state satisfying such regulations, the glass vaporizes the laser light irradiation part from one surface of the glass substrate to the other surface of the glass substrate in the laser light irradiation region. It can be surely heated above the temperature at which it is performed.
  • the spot diameter of the laser beam irradiated onto the glass substrate (the beam diameter of the laser beam on one surface of the glass substrate) is not limited, and can be selected depending on the required processing accuracy.
  • the type of laser to be used there is no particular limitation on the type of laser to be used, as long as the glass substrate can be heated at the irradiated portion by irradiating the glass substrate with oscillated laser light.
  • a CO 2 laser, an excimer laser, a copper vapor deposition laser, a YAG laser, or the like can be used.
  • the glass is vaporized in the laser light irradiation portion by irradiating the glass substrate with the laser light as described above.
  • the vaporized glass component gas
  • the means for removing the vaporized glass component is not particularly limited, and a mechanism for sucking the vaporized glass component, a mechanism for blowing off the glass component vaporized by gas, or the like can be used.
  • the arrangement may be selected according to the means used, and the heating process is not hindered and the vaporized glass component can be removed before adhering to the lens, mirror, etc. arranged on the optical path of the laser beam. That's fine. For example, as shown by reference numeral 73 in FIG. 7, it may be arranged in the vicinity of a portion irradiated with laser light.
  • the kind of gas to be used is not particularly limited, but since it is used around the portion where the glass substrate is heated by laser light, it is a nonflammable gas. Is preferably used. Specifically, for example, an inert gas such as nitrogen or argon, air, or the like can be used. In this case, in order to prevent displacement of the position of the glass substrate, it is preferable to supply the glass substrate so that no gas is applied to it.
  • the glass substrate is conveyed, so that the laser beam irradiation part after laser beam irradiation (the portion that has already been irradiated with the laser beam) is moved away from the laser beam irradiation region, The peripheral part of the laser beam irradiation part is cooled.
  • the peripheral portion 72 of the laser beam irradiation unit (portion that is vaporized by irradiation with the laser beam in the heating step) 71 is cooled.
  • the peripheral portion 72 is deposited on the glass substrate surface (one surface of the glass substrate and / or the other surface) as substantially thread-like precipitates 81 and 82 as shown in FIG.
  • the peripheral portion 72 on the glass substrate is caused by the stress generated in the peripheral portion 72. It is inferred that a part is excluded and precipitates.
  • the precipitates 81 and 82 are deposited on the upper surface (one surface) of the glass substrate, but may be deposited on the lower surface (the other surface) side.
  • the place where the precipitate is deposited in the cooling process is not particularly limited because it varies depending on the cooling condition and the like.
  • the deposits 81 and 82 are located downstream of the irradiation region of the laser beam 12 in the conveyance direction of the glass substrate. Therefore, it is deposited from a position outside the irradiation region of the laser beam 12.
  • the peripheral portion of the laser light irradiation portion is cooled at an appropriate cooling rate.
  • the cooling rate can be changed by the relative moving speed of the irradiation region of the laser beam with respect to the glass substrate. For this reason, it is preferable to select a relative moving speed of the irradiation region of the laser beam with respect to the glass substrate so that the precipitate is generated in the cooling process by performing a preliminary experiment or the like.
  • the relative moving speed of the irradiation region of the laser beam with respect to the glass substrate can be selected by a preliminary experiment or the like as described above, and is not specified but can be, for example, 144 (m / hour) or more.
  • the precipitate 81 and the precipitate 82 may adhere to each other depending on the temperature of the precipitates 81 and 82, the distance between them, or the like. Further, in some cases, when the precipitate 81 and the precipitate 82 are bonded, it becomes difficult for a part of the peripheral portion 72 to be discharged from the peripheral portion 72 of the laser light irradiation unit 71, and the cut surface of the glass substrate is a uniform cut surface. It may not be possible. However, in the glass substrate cutting method of the present embodiment, a partial region in the width direction orthogonal to the planned cutting line of the glass substrate including the laser light irradiation region is curved in the width direction of the glass substrate. Yes.
  • the glass substrate 91 and the glass substrate 92 on the other side are different in height. Therefore, the deposits 81 and 82 are prevented from adhering to each other in the vicinity of the laser beam irradiation unit 71, and as a result, the cut surface can be more reliably made a uniform cut surface.
  • the deposit 81 is deposited between the conveying rollers, and is deposited on the upper surface side or the lower surface side of the glass substrate 92 on the other side.
  • the precipitate 81 wraps around the lower end side of the conveying roller, but the precipitate 81 is deposited on the lower surface side of the glass substrate 92 on the other side.
  • it is located between the glass substrate 92 and the transport roller and does not hinder the behavior of the transport roller.
  • the means for removing the precipitate is not particularly limited, and can be easily removed by a method such as blowing off with gas, removing by suction, or removing with a brush or baffle plate.
  • a low-pressure gas so as to give vibration or the like to the glass substrate and not affect the cutting accuracy of the glass substrate.
  • the cooling step cools the peripheral portion 72 of the laser light irradiation portion after the laser light irradiation as described above, and the cooling temperature is not limited.
  • the peripheral part of the laser light irradiation part is cooled to a glass transition temperature or lower after the laser light irradiation part is heated.
  • the ambient temperature is preferably at least the glass transition temperature or less, preferably 100 ° C. or less, and particularly preferably 40 ° C. or less.
  • the ambient temperature referred to here is at least the temperature around the portion where the cooling process is performed, but is preferably the temperature around the entire glass substrate being cut.
  • the glass substrate cutting method of the present embodiment described so far can be preferably used particularly when the glass substrate is cut along a cutting line along the conveyance direction of the glass substrate.
  • both ends in the width direction of the glass substrate are cut along a cutting line along the conveyance direction of the glass substrate.
  • the glass substrate cutting method in the form can be preferably used. In this case, after cutting both ends in the width direction of the glass substrate, only the center portion in the width direction is used as a product, so both ends in the width direction of the glass substrate, that is, the ears, are separated from the conveyance path of the glass substrate after cutting. It is preferred that
  • an ear release means is provided on the downstream side of the heating step in the transport direction of the glass substrate, and the ear portion of the cut glass substrate is directed away from the transport direction of the glass substrate by the ear release means. Can be changed and separated.
  • the specific configuration of the ear release means is not particularly limited, for example, a conveyance roller that serves as a fulcrum for changing the direction of the ear portion of the glass substrate, and a carrier that contacts the ear portion of the glass substrate on the side opposite to the conveyance roller that serves as the fulcrum. It can be comprised by the ear
  • the separated ears of the glass substrate can be introduced into a sub-transport route different from the transport route and collected separately from the central portion of the glass substrate.
  • the method for cutting a glass substrate according to the present embodiment has been described using the glass substrate that is horizontally transported on the transport roller 32 as an example.
  • the method for cutting a glass substrate of the present embodiment is not limited to the cutting of a glass substrate that is horizontally conveyed, and is also applicable to a glass substrate that is formed by, for example, a downdraw method and is vertically conveyed. can do.
  • a partial region in the width direction orthogonal to the planned cutting line of the glass substrate including the irradiation region of the laser beam that irradiates the laser beam is pressed from one surface of the glass substrate with the pressing member. It can be curved in the width direction. And it can cut
  • the method for cutting the glass substrate of the present embodiment can be preferably used when cutting both ends in the width direction of the glass substrate. Also in this case, it is preferable that both ends in the width direction of the cut glass substrate are separated from the conveyance path of the glass substrate.
  • the glass substrate cutting method of the present invention has been described above, in the glass substrate cutting method, since the assist gas is not sprayed on the glass substrate, the displacement of the position of the glass substrate is suppressed. Cutting can be performed with high accuracy. In addition, the generation of cracks in the glass substrate during cutting can be suppressed, and a cut surface with uniform surface characteristics can be obtained.
  • the glass substrate cutting method of the present embodiment described above can be applied to a glass substrate manufacturing process to provide a glass substrate manufacturing method using the glass substrate cutting method.
  • the glass substrate can be cut with high accuracy, generation of cracks in the glass substrate can be suppressed at the time of cutting, and a uniform cut surface can be obtained.
  • the effect of shortening the polishing time of the cut surface in the polishing process or omitting the polishing process can be obtained.
  • Example 1 In this experimental example, the glass substrate was cut by changing the energy density of the laser beam and the relative movement speed of the irradiation region of the laser beam with respect to the glass substrate, and the cut surface of the cut glass substrate was evaluated.
  • a glass substrate (trade name: AN100, manufactured by Asahi Glass Co., Ltd.) made of non-alkali borosilicate glass having a length of 100 mm, a width of 100 mm, and a thickness of 0.1 mm according to the configuration shown in FIG.
  • the laser beam using a CO 2 laser was irradiated along the planned cutting line so that the spot diameter was about 0.3 mm and a predetermined energy density was obtained.
  • the ambient temperature (environmental temperature) of the glass substrate was room temperature (25 ° C.).
  • a support member 33 is provided on the conveyance roller 32, and a partial region in the width direction of the glass substrate including the laser light irradiation region irradiated with the laser light is provided.
  • a partial region in the width direction of the glass substrate including the laser light irradiation region irradiated with the laser light is provided.
  • the laser beam 12 was applied to the slope on the end side in the width direction of the glass substrate as indicated by an arrow 12 in FIG.
  • the support member 33 is provided on the two conveyance rollers 32, and an irradiation region of the laser beam 12 is disposed between the conveyance rollers 32 provided with the support member 33.
  • FIG. 10 is a graph showing a part of the results shown in Table 1.
  • the straight line Y indicates the minimum value of the relative movement speed (here, the conveyance speed of the glass substrate) of the laser light irradiation region where the precipitate is generated in the cooling process. In this case, 144 (m / hour) )Met.
  • the A evaluation is distributed in a range surrounded by the straight line X and the straight line Y.
  • the C evaluation is performed, and when the transport speed is slower than the straight line Y, the B evaluation is performed. It has become.
  • the glass substrate in the laser light irradiation area This is probably because the laser beam irradiation region from one surface to the other surface can be reliably heated to a temperature higher than the temperature at which the glass vaporizes.
  • the peripheral portion of the laser light irradiation region after laser light irradiation can be sufficiently cooled and removed as a precipitate from the cut surface portion. It is thought that it can be.
  • the glass substrate that has been evaluated as C sufficient energy of the laser beam cannot be imparted with respect to the relative movement speed of the irradiation region of the laser beam with respect to the glass substrate (the conveyance speed of the glass substrate).
  • the region it is considered that the other surface of the glass substrate could not be heated to a temperature higher than the temperature at which the glass vaporizes (the temperature could not be sufficiently raised in the entire range in the thickness direction of the glass substrate). For this reason, it is estimated that the glass substrate could not be cut.
  • the relative moving speed of the laser light irradiation area with respect to the glass substrate is not sufficient, and the cooling speed of the peripheral area of the laser light irradiation area after laser light irradiation becomes slow, and the peripheral area is deposited. It is assumed that the cut surface did not become uniform because it was not excluded as a product. Or, when the temperature of the peripheral part of the laser light irradiation area after laser light irradiation is cooled by transporting the glass substrate, it is not the desired cooling rate, so that the cut surface and its periphery have cracked It is inferred.
  • the energy density of the laser light can be appropriately selected for the A-evaluated glass substrate in accordance with the relative movement speed (glass substrate transport speed) of the laser light irradiation region with respect to the glass substrate. For this reason, it is considered that the laser beam irradiation region is heated from one surface of the glass substrate to the other surface at a temperature higher than the temperature at which the glass is vaporized. Furthermore, since the conveyance speed of the glass substrate is appropriate, the peripheral portion of the laser light irradiation region after laser light irradiation is cooled at an appropriate cooling rate, and the peripheral portion of the laser light irradiation region after laser light irradiation is a precipitate. It is considered that a uniform cut surface was obtained.
  • Example 2 In this experimental example, the energy density of the laser beam and the relative movement speed of the irradiation region of the laser beam with respect to the glass substrate are changed in the same manner as in Experimental Example 1 except that the thickness of the glass substrate to be cut is 0.2 mm. Then, the glass substrate was cut, and the cut surface of the glass substrate after cutting was evaluated.
  • Results are shown in Table 2 and FIG. FIG. 11 is a graph of the results in Table 2.
  • the straight line Y indicates the minimum value of the relative movement speed (here, the conveyance speed of the glass substrate) of the irradiation region of the laser beam, in which the precipitate is generated in the cooling process, and in this case, 144 (m / hour) )Met.
  • FIG. 3 In this experimental example, the energy density of the laser beam and the relative movement speed of the irradiation region of the laser beam with respect to the glass substrate are changed in the same manner as in Experimental Example 1 except that the thickness of the glass substrate to be cut is 0.3 mm. Then, the glass substrate was cut, and the cut surface of the glass substrate after cutting was evaluated.
  • FIG. 12 is a graph of the results in Table 3.
  • the straight line Y indicates the minimum value of the relative movement speed (here, the conveyance speed of the glass substrate) of the irradiation region of the laser beam, in which the precipitate is generated in the cooling process, and in this case, 144 (m / hour) )Met.
  • the glass substrate is cut by changing the energy density of the laser beam to be irradiated without changing the conveyance speed of the glass substrate.
  • the energy density of the laser beam is increased to be higher than the straight line X
  • the glass is vaporized in the laser beam irradiation region from one surface of the glass substrate to the other surface in the laser beam irradiation region. It was possible to heat to a temperature higher than the temperature to be evaluated, and it was confirmed that A was evaluated.
  • Example 4 In this experimental example, the energy density of the laser beam and the relative movement speed of the irradiation region of the laser beam with respect to the glass substrate are changed in the same manner as in Experimental Example 1 except that the thickness of the glass substrate to be cut is 0.6 mm. Then, the glass substrate was cut, and the cut surface of the glass substrate after cutting was evaluated.
  • FIG. 13 is a graph of the results in Table 4.
  • the straight line Y indicates the minimum value of the relative movement speed (here, the conveyance speed of the glass substrate) of the irradiation region of the laser beam, in which the precipitate is generated in the cooling process, and in this case, 144 (m / hour) )Met.
  • the energy density of the laser beam irradiated was lower than that of the straight line X. For this reason, sufficient energy of the laser beam cannot be imparted with respect to the relative movement speed of the laser beam irradiation region with respect to the glass substrate (the conveyance speed of the glass substrate), and the other surface of the glass substrate with respect to the laser beam irradiation portion It is considered that the glass substrate could not be heated to a temperature higher than the temperature at which it vaporizes. Therefore, it was considered that C evaluation was made because the glass substrate could not be cut.

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  • Organic Chemistry (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
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  • Processing Of Stones Or Stones Resemblance Materials (AREA)
PCT/JP2014/061849 2013-05-28 2014-04-28 ガラス基板の切断方法及びガラス基板の製造方法 WO2014192482A1 (ja)

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