WO2014180141A1 - 新型led模组封装自动化成套设备 - Google Patents

新型led模组封装自动化成套设备 Download PDF

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Publication number
WO2014180141A1
WO2014180141A1 PCT/CN2013/089637 CN2013089637W WO2014180141A1 WO 2014180141 A1 WO2014180141 A1 WO 2014180141A1 CN 2013089637 W CN2013089637 W CN 2013089637W WO 2014180141 A1 WO2014180141 A1 WO 2014180141A1
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WIPO (PCT)
Prior art keywords
lens
positioning
led module
led
support
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PCT/CN2013/089637
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English (en)
French (fr)
Inventor
胡跃明
刘伟东
陈安
吴忻生
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South China University of Technology SCUT
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South China University of Technology SCUT
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Publication of WO2014180141A1 publication Critical patent/WO2014180141A1/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0362—Manufacture or treatment of packages of encapsulations

Definitions

  • the present invention mainly relates to the field of semiconductor applications and packaging, and more particularly to the field of LED module packaging technology.
  • High power LED It is a fourth-generation 'green lighting source' with small size, long life and high electro-optical conversion efficiency. In the light source manufacturing industry such as street lamps and floodlights, it has broad application prospects and is receiving more and more attention.
  • the LED module package is LED The key process at the end of luminaire manufacturing.
  • Figure 1 shows the LED connected lens module
  • 11 is the LED connected lens bracket before trimming
  • 12 is LED
  • 13 is LED chip
  • 14 is LED lens mounting groove
  • 15 is LED connecting lens bracket after trimming
  • 16 is single LED lens
  • 17 is the LED injection hole
  • 18 is the LED vent
  • Figure 1a is the front view of the LED cover lens
  • Figure 1b is the LED A schematic view after the lens is covered.
  • the packaging process of the LED module includes: LED conjoined lens, substrate loading, cover lens, and trimming of the LED conjoined lens holder after trimming, LED lens blanking and injection molding and other processes.
  • Traditional LED module package, LED connected lens, substrate loading and trimming LED The blanking of the connected lens holders is manual; the cover lens, trimming and injection molding processes are independent devices, and there is no effective integration between them.
  • the automation rate of the LED module package is not high.
  • the present invention aims to solve the above technical problems at least to some extent.
  • the invention provides a novel LED
  • the module packaging automation complete equipment comprises a conveying mechanism, a loading mechanism, a cover lens mechanism, a blanking mechanism, a crimping mechanism and a glue injection mechanism which are sequentially arranged along the conveying mechanism,
  • the conveying mechanism comprises two conveying guides arranged in parallel with each other, and the outer side of one end of the conveying rail is provided with a joint lens holder box and an LED a substrate cartridge, the timing belt is moved along the conveying rail under the driving of the servo motor, a tensioning wheel is arranged inside the conveying rail, a normal pressing block is arranged at the top of the conveying rail, and a support is arranged at the bottom;
  • the loading mechanism and the unloading mechanism of the LED module package adopt a single-arm truss structure, including a receiving frame 508 of the loading and unloading mechanism.
  • a horizontal cross arm supported, a y-direction motor driving the y to the timing belt is disposed at one end of the horizontal cross arm, and the horizontal cross arm is also vertically disposed with the y
  • the cover lens mechanism includes a vertically fixed first support truss, a first positioning substrate disposed on the first support truss from bottom to top, a lens trimming upper stencil, a first upper pressing plate, and a first z-direction motor. First z Driving the first positioning substrate, the lens trimming upper stencil, and the first upper pressing plate to the motor through the screw nut pair, and the lens positioning undercut stencil, the first positioning double thimble and the first z Positioning support;
  • the crimping mechanism includes a second fixed truss vertically fixed, a second positioning substrate disposed on the second supporting truss from bottom to bottom, a lens hot pressing upper stencil, a second upper pressing plate, and a second z-direction motor.
  • the glue injection mechanism comprises a vertically fixed third support truss, and a positioning platen, a guide block, an upper stencil, a third z arranged on the third support truss from bottom to top Providing a guiding injection piston rod and a glue injection head between the guide block and the upper stencil, the third z
  • the motor is driven to move the positioning platen, the guiding block and the upper stencil up and down through the second screw nut pair, and the lower stencil, the third positioning double thimble and the third z-direction positioning support are arranged below the positioning pressing plate.
  • the suction cup is a pneumatic double negative pressure suction cup.
  • the number of the supports is six or more.
  • the beneficial effects of the present invention are: the invention is in the conventional LED Based on the module blanking, cover lens and glue injection equipment, the loading mechanism, the unloading mechanism and the conveying mechanism are added, and the interface between the original equipment and the automatic loading, unloading and conveying mechanism is designed.
  • the integration between the devices is realized, and the packaging automation of the LED module is realized, which not only improves the The packaging efficiency of the LED module also saves labor costs.
  • Figure 1a is a schematic view of the LED lens assembly lens cover lens.
  • Figure 1b is a schematic view of the LED lens assembly lens cover lens.
  • Figure 2 is a schematic diagram of the new LED module package automation equipment.
  • Figure 3 shows the system block diagram of the LED module package device.
  • Figure 4 is a schematic diagram of the transmission mechanism in the LED module package complete equipment.
  • Figure 5a is a right side view of the loading and unloading mechanism in the LED module package complete equipment.
  • Figure 5b is a front view of the loading and unloading mechanism in the LED module package complete equipment.
  • Figure 5c is a top view of the loading and unloading mechanism in the LED module package complete equipment.
  • Figure 6a is a right side view of the cover lens mechanism in the LED module package assembly.
  • Figure 6b is a front view of the cover lens mechanism in the LED module package.
  • Figure 6c is a top plan view of the cover lens mechanism in the LED module package.
  • Figure 7a is a right side view of the crimping mechanism in the LED module package.
  • Figure 7b is a front view of the crimping mechanism in the LED module package.
  • Figure 7c is a top plan view of the crimping mechanism in the LED module package.
  • Figure 8a is a right side view of the glue injection mechanism in the LED module package.
  • Figure 8b is a front view of the glue injection mechanism in the LED module package.
  • Figure 8c is a top plan view of the glue injection mechanism in the LED module package.
  • a novel LED module package automation kit includes a transport mechanism 26, a loading mechanism 21, a cover lens mechanism 22, a blanking mechanism 23, and a crimping edge disposed along the transport mechanism 26 in sequence.
  • the conveying mechanism 26 includes two conveying guides 408 arranged in parallel with each other.
  • the timing belt 403 is moved along the conveying rail 408 under the driving of the servo motor 407, and a tensioning pulley 404 is disposed inside the conveying rail 408.
  • the top of the conveying guide 408 is provided with a normal pressing block 405 of the loading and unloading station, and the bottom is provided with a support 406; the conveying mechanism is corresponding to the loading station and the cover lens station of the LED module package from left to right. , blanking station, crimping station and injection station;
  • the conveying mechanism 26 adopts synchronous double pulley transmission, and the guide rail size is 50 mm. ⁇ 1000mm.
  • Each side belt 403 is designed with eight tensioning wheels 404.
  • the feeding station and the feeding station are designed with a normal pressing block 405 and a moving direction positioning block to realize the positioning of the LED lens holder;
  • the position, the crimping station and the glue injection station are designed with a double ejector structure 409 to realize the positioning of the LED substrate and the packaging of the LED module; at the same time, the double rails of the transmission mechanism are fixed on the six supports 406.
  • the loading mechanism 21 and the blanking mechanism 23 of the LED module package each adopt a one-arm truss structure, and include a joint lens holder cartridge 401 disposed at one end of one end of the conveying guide 408.
  • the LED substrate cartridge 402 further includes a horizontal cross arm supported by the loading and unloading mechanism support frame 508.
  • One end of the horizontal cross arm is provided with a y-direction motor 503 for driving the y to the timing belt 504, and the horizontal cross arm is further Vertically disposed is a vertical arm driven by the y-direction timing belt 504 to be movable back and forth along the horizontal cross arm, the vertical arm is provided with a first screw nut pair 506, a first screw nut pair 506 and a z-direction motor at the top of the vertical arm 505 drive connection, the bottom end of the vertical arm is provided with a suction cup 507, the loading mechanism mainly realizes that the LED substrate is taken out from the substrate box 402 and placed on the conveyor belt, and the LED connected lens is taken out from the connected lens case 401 and placed on the LED substrate. Align with it;
  • the loading mechanism 21 and the unloading mechanism 23 realize the movement in the y direction based on the timing belt 504 in the front and rear y directions, and the movement in the z direction based on the transmission of the first screw nut pair 506 in the height z direction.
  • the center distance of the y-direction timing belt 504 is 240 mm; the lengths of the y-direction and z-direction rails are 240 mm and 100 mm, and the y-direction rails are square rails.
  • the pick-up and positioning of the LED substrate and the LED connected lens are the same as that of the pneumatic double-negative suction cup 507, and the suction cup 507 has a diameter of 12 mm.
  • the cover lens mechanism 22 includes a first support truss 603 that is vertically fixed, and a first positioning substrate 601 and a lens cut edge that are disposed on the first support truss 603 from bottom to top. a stencil 602, a first upper pressing plate 604, and a first z-direction motor 605.
  • the first z-direction motor 605 drives the first positioning substrate 601, the lens trimming upper stencil 602, and the first upper pressing plate 604 to move up and down by the screw nut pair.
  • a lens trimming lower stencil 606, a first positioning double ejector pin 607, and a first z-direction positioning support 608 are further disposed under the first positioning substrate 601.
  • the cover lens mechanism is mainly based on a trimming die to achieve threshing of the LED connected lenses, and each lens is mounted to a lens groove in the substrate to achieve physical cooperation.
  • the trimming die of the cover lens mechanism is in the form of a conventional structure, including a lens trimming template 602 and a lens trimming lower stencil 606.
  • the first z-direction positioning support 608 continues to move upward along the height direction; meanwhile, the first upper pressing plate 604 and the lens trimming template 602 are at the first z acts on the motor 605 and moves down the screw rod, finally achieving the clamping of the upper and lower templates.
  • the LED conjoined lens realizes threshing of the lens under the action of the upper and lower template of the trimming.
  • the crimping mechanism 24 includes a second fixed truss 703 that is vertically fixed, and a second positioning substrate 701 that is disposed on the second supporting truss 703 from bottom to top, and the lens is hot pressed.
  • the second z-direction motor 705 drives the second positioning substrate 701, the lens hot pressing upper stencil 702, and the second upper pressing plate 704 through the screw nut pair.
  • a lens hot pressing lower stencil 706, a second positioning double ejector pin 707 and a second z-direction positioning support 708 are further disposed under the second positioning substrate 701.
  • the crimping mechanism is mainly based on the crimping die to achieve hot pressing of the edge of the LED lens, so that a tight fit is achieved between each lens and the lens groove.
  • the second z-direction positioning support 708 is jacked up along the height direction, and the second positioning double ejector pin 707 is matched with the positioning hole on the LED substrate. Double thimble joint positioning of LED substrate and connected lens.
  • the edged mold of the LED lens adopts a conventional structure, including a lens hot pressing upper template 702 and a lens hot pressing lower template 706.
  • the second z-direction positioning support 708 continues to move upward along the height direction; at the same time, the second upper pressing plate 704, the lens trimming template 702, and the second z-direction motor 705 Under the action, moving down the screw rod, finally achieving the clamping of the upper and lower templates.
  • the LED conjoined lens realizes a tight fit between each lens and the lens groove under the action of the upper and lower hot pressing templates.
  • the glue injection mechanism 25 includes a vertically fixed third support truss 803, and a positioning platen 804, a guide block 805, and an upper plate disposed on the third support truss 803 from bottom to top. 808, the third z-direction motor 806, between the guiding block 805 and the upper stencil 808, a guiding glue injection piston rod and a glue injection head 809 are provided, and the third z-direction motor 806 is driven by the second screw nut 807
  • the positioning platen 804, the guiding block 805, and the upper stencil 808 are moved up and down, and the lower stencil 801 and the third positioning double ejector pin 802 are disposed under the positioning pressing plate 804.
  • the glue injection mechanism mainly injects glue into the LED lens through the lens injection hole.
  • the third z-direction positioning support 810 is jacked up along the height direction, and the third positioning double ejector pin 802 is matched with the positioning on the LED substrate to realize the pair.
  • the LED substrate and the double thimble of the connected lens are jointly positioned. led
  • the injection of the lens is based on a guided injection piston rod and a glue injection head 809.
  • the third z-direction positioning support 810 continues to move upward along the height direction; meanwhile, the guiding injection piston rod and the injection molding head 809 are in the upper template 808 and the third z-direction motor. Under the action of 805, it moves down the screw rod, finally achieving the clamping and injection of the upper and lower templates.
  • the crimping mechanism supports the same truss and cover lens mechanism. The main differences are:
  • the crimping mechanism 24 becomes the lens hot pressing upper template 702 and the lens is hot pressed.
  • the lens hot pressing upper template 702 and the second upper pressing plate 704 of the crimping mechanism 24 include a heating function, and the hot pressing sleeve is realized by the heating rod. Heating.
  • the glue injection mechanism 25 supports the same truss and cover lens mechanism 22, the main differences are:
  • the lens trimming template 602 in the cover lens mechanism shown in Figs. 6a, 6b, and 6c is replaced with a guide injection piston rod and a glue injection head 809. And the size and shape accuracy of the guide injection piston rod and the injection head 809 are higher than the template 602 on the lens trim.
  • the guide block 805 of the injection molding mechanism has a total glue inlet, and the liquid glue corresponding to the glue injection rod. Connected holes.

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Abstract

提供了一种LED模组封装自动化成套设备，其包括LED模组封装的上料机构（21）、盖透镜机构（22）、下料机构（23）、压边机构（24）、注胶机构（25）和传送机构（26）六个部分，实现LED基板在各封装工艺，包括上料、盖透镜、下料、压边和注胶工艺之间的转换和集成化。该LED模组封装自动化成套设备在传统LED模组压边、盖透镜和注胶设备基础上，加入了上料机构、下料机构和传送机构，同时设计了各原有设备和自动化上料、下料和传送机构之间的接口，从而实现了各设备间的集成，实现了LED模组的封装自动化，这样不仅提高了LED模组的封装效率，同时也节约了劳动成本。

Description

新型LED模组封装自动化成套设备
技术领域
本发明主要涉及半导体应用与封装领域，尤其涉及 LED 模组封装技术领域。
背景技术
大功率 LED 体积小、寿命长、电光转换效率高，是第四代'绿色照明光源'。在路灯、投光灯等光源制造行业，具有广泛的应用前景，受到越来越多的重视。 LED 模组的封装是 LED 灯具制造的末端关键工艺。
如图 1 所示为 LED 连体透镜模组， 11 为切边之前的 LED 连体透镜支架， 12 为 LED 模组的基板，包括铝基板、陶瓷板等， 13 为 LED 芯片， 14 为 LED 透镜安装凹槽， 15 为切边之后的 LED 连体透镜支架， 16 为单粒 LED 透镜， 17 为 LED 注胶孔， 18 为 LED 排气孔，图 1a 为 LED 盖透镜之前的示意图，图 1b 为 LED 盖透镜之后的示意图。
LED 模组的封装工艺包括： LED 连体透镜、基板的上料，盖透镜，切边后 LED 连体透镜支架的下料， LED 透镜压边和注胶等多个工艺。传统 LED 模组的封装， LED 连体透镜、基板的上料以及切边后 LED 连体透镜支架的下料，都采用手工方式；而盖透镜、切边和注胶工艺采用独立的设备，彼此之间没有有效的集成， LED 模组封装的自动化率不高。
发明内容
针对上述技术问题，本发明旨在至少在一定程度上解决上述技术问题。
本发明提供一种新型 LED 模组封装自动化成套设备，包括传送机构，沿该传送机构依次设置的上料机构、盖透镜机构、下料机构、压边机构和注胶机构，
所述传送机构包括 2 根相互平行设置的传送导轨，该传送导轨一端的外侧设置有连体透镜支架料盒及 LED 基板料盒，同步带在伺服电机的驱动下沿传送导轨移动，所述传送导轨内侧设置有张紧轮、所述传送导轨顶部设置有上下料工位的法向压块，底部设置有支撑；
所述 LED 模组封装的上料机构和下料机构均采用单臂桁架结构，包括受上下料机构支撑架 508 支撑的水平横臂，所述水平横臂一端设置有驱动 y 向同步带移动的 y 向电机 , 所述水平横臂上还垂直设置有受 y 向同步带驱动可沿水平横臂来回移动的垂直臂，所述垂直臂设置有第一丝杆螺母副，第一丝杆螺母副与垂直臂顶端的 z 向电机传动连接，垂直臂底端设置有吸盘；
所述盖透镜机构包括垂直固定的第一支撑桁架，由下而上地设置在第一支撑桁架上的第一定位基板、透镜切边上模版、第一上压板、第一 z 向电机，所述第一 z 向电机通过丝杆螺母副驱动第一定位基板、透镜切边上模版、第一上压板上下移动，所述第一定位基板下方还设置有透镜切边下模版、第一定位双顶针和第一 z 向定位支座；
所述压边机构包括垂直固定的第二支撑桁架，由下而上地设置在第二支撑桁架上的第二定位基板、透镜热压上模版、、第二上压板、第二 z 向电机，所述第二 z 向电机通过丝杆螺母副驱动第二定位基板、透镜热压上模版、第二上压板上下移动，第二定位基板下方还设置有透镜热压下模版、第二定位双顶针和第二 z 向定位支座；
所述注胶机构包括垂直固定的第三支撑桁架，由下而上的设置在第三支撑桁架上的定位压板、导向块、上模版、第三 z 向电机，所述导向块、上模版之间设置有导向注胶活塞杆和注胶头，所述第三 z 向电机通过第二丝杆螺母副驱动定位压板、导向块、上模版上下移动，所述定位压板下方设置下模版、第三定位双顶针、 第三 z 向定位支座。
进一步地，所述吸盘为气动双负压吸盘。
进一步地，所述支撑的数量为 6 个或 6 个以上。
与现有技术相比，本发明的有益效果是：本发明在传统 LED 模组压边、盖透镜和注胶设备基础上，加入了上料机构、下料机构和传送机构，同时设计了各原有设备和自动化上料、下料和传送机构之间的接口，从而实现了各设备间的集成，实现了LED模组的封装自动化，这样不仅提高了 LED 模组的封装效率，同时也节约了劳动成本。
附图说明
图 1 是本发明制得的产物的 核磁共振碳谱图。
图 1a 为 LED 连体透镜模组盖透镜之前的示意图。
图 1b 为 LED 连体透镜模组盖透镜之后的示意图。
图 2 为新型 LED 模组封装自动化成套设备示意图。
图 3 为 LED 模组封装设备的系统框图。
图 4 为 LED 模组封装成套设备中的传送机构示意图。
图 5a 为 LED 模组封装成套设备中的上料、下料机构右视示意图。
图 5b 为 LED 模组封装成套设备中的上料、下料机构主视示意图。
图 5c 为 LED 模组封装成套设备中的上料、下料机构俯视示意图。
图 6a 为 LED 模组封装成套设备中的盖透镜机构右视示意图。
图 6b 为 LED 模组封装成套设备中的盖透镜机构主视示意图。
图 6c 为 LED 模组封装成套设备中的盖透镜机构俯视示意图。
图 7a 为 LED 模组封装成套设备中的压边机构右视示意图。
图 7b 为 LED 模组封装成套设备中的压边机构主视示意图。
图 7c 为 LED 模组封装成套设备中的压边机构俯视示意图。
图 8a 为 LED 模组封装成套设备中的注胶机构右视示意图。
图 8b 为 LED 模组封装成套设备中的注胶机构主视示意图。
图 8c 为 LED 模组封装成套设备中的注胶机构俯视示意图。
具体实施方式
下面结合附图和实施例对本发明作进一步详细的说明。
需要说明的是，附图仅用于示例性说明，不能理解为对本专利的限制；对于本领域技术人员来说，附图中某些公知结构及其说明可能省略是可以理解的。
下面结合附图对本发明的实施例进行进一步详细说明。
如图2、图3所示，一种新型LED模组封装自动化成套设备，包括传送机构26，沿该传送机构26依次设置的上料机构21、盖透镜机构22、下料机构23、压边机构24和注胶机构25，
如图4所示，所述传送机构26包括2根相互平行设置的传送导轨408，同步带403在伺服电机407的驱动下沿传送导轨408移动，所述传送导轨408内侧设置有张紧轮404、所述传送导轨408顶部设置有上下料工位的法向压块405，底部设置有支撑406；该传送机构从左至右以此对应LED模组封装的上料工位、盖透镜工位、下料工位、压边工位和注胶工位；
传送机构26采用同步双带轮传动的方式，导轨尺寸：50 mm ×1000mm。每边同步带403设计有八个张紧轮404，在上料工位、下料工位设计有法向压紧块405和运动方向的定位块，实现LED透镜支架的定位；在盖透镜工位、压边工位和注胶工位，设计有双顶针结构409，实现LED基板的定位和LED模组的封装；同时，传动机构的双导轨固定在六个支撑406上。
如图5a、5b、5c所示，所述LED模组封装的上料机构21和下料机构23均采用单臂桁架结构，包括设置在传送导轨408一端两侧的连体透镜支架料盒401及LED基板料盒402，还包括受上下料机构支撑架508支撑的水平横臂，所述水平横臂一端设置有驱动y向同步带504移动的y向电机503,所述水平横臂上还垂直设置有受y向同步带504驱动可沿水平横臂来回移动的垂直臂，所述垂直臂设置有第一丝杆螺母副506，第一丝杆螺母副506与垂直臂顶端的z向电机505传动连接，垂直臂底端设置有吸盘507，上料机构主要实现将LED基板从基板盒402取出并放到传送带上，将LED连体透镜从连体透镜盒401取出并放到LED基板上与其对位；
上料机构21和下料机构23在前后y方向上基于同步带504，实现y方向上的运动；在高度z方向上，基于第一丝杆螺母副506传动，实现z方向上的运动。y方向同步带504中心距为240mm；y方向和z方向导轨长度为240mm和100mm，且y方向导轨采用方形导轨。LED基板和LED连体透镜的拾取和定位，同采用气动双负压吸盘507吸附定位的方式，吸盘507直径为12mm。
如图6a、6b、6c所示，所述盖透镜机构22包括垂直固定的第一支撑桁架603，由下而上地设置在第一支撑桁架603上的第一定位基板601、透镜切边上模版602、第一上压板604、第一z向电机605，所述第一z向电机605通过丝杆螺母副驱动第一定位基板601、透镜切边上模版602、第一上压板604上下移动，所述第一定位基板601下方还设置有透镜切边下模版606、第一定位双顶针607和第一z向定位支座608。盖透镜机构主要基于切边模具，实现将LED连体透镜的脱粒，并使每粒透镜安装到基板中的透镜凹槽，实现物理配合。
当同步带403将LED基板和连体透镜传送到盖透镜工位时，第一z向定位支座608沿着高度方向顶起，第一定位双顶针607与LED基板上的定位孔配合，实现对LED基板和连体透镜的双顶针联合定位。盖透镜机构的切边模具采用传统结构形式，包括透镜切边上模板602和透镜切边下模版606。在LED基板和连体透镜经第一双顶针607定位之后，第一z向定位支座608沿着高度方向继续向上运动；同时，第一上压板604、透镜切边上模板602，在第一z向电机605作用下，沿着丝杆向下运动，最终实现上下模板的合模， LED连体透镜在切边上下模板的作用下，实现透镜的脱粒。
如图7a、7b、7c所示，所述压边机构24包括垂直固定的第二支撑桁架703，由下而上地设置在第二支撑桁架703上的第二定位基板701、透镜热压上模版702、、第二上压板704、第二z向电机705，所述第二z向电机705通过丝杆螺母副驱动第二定位基板701、透镜热压上模版702、第二上压板704上下移动，第二定位基板701下方还设置有透镜热压下模版706、第二定位双顶针707和第二z向定位支座708。压边机构主要基于压边模具，实现将LED透镜边缘的热压，使每粒透镜与透镜凹槽之间实现紧配合。
当同步带403将LED基板和连体透镜传送到压边工位时，第二z向定位支座708沿着高度方向顶起，第二定位双顶针707与LED基板上的定位孔配合，实现对LED基板和连体透镜的双顶针联合定位。LED透镜的压边模具采用传统结构形式，包括透镜热压上模板702和透镜热压下模板706。在LED基板和连体透镜双顶针定位之后，第二z向定位支座708沿着高度方向继续向上运动；同时，第二上压板704、透镜切边上模板702，在第二z向电机705作用下，沿着丝杆向下运动，最终实现上下模板的合模， LED连体透镜在上下热压模板的作用下，实现每粒透镜与透镜凹槽之间实现紧配合。
如图8a、8b、8c所示，所述注胶机构25包括垂直固定的第三支撑桁架803，由下而上的设置在第三支撑桁架803上的定位压板804、导向块805、上模版808、第三z向电机806，所述导向块805、上模版808之间设置有导向注胶活塞杆和注胶头809，所述第三z向电机806通过第二丝杆螺母副807驱动定位压板804、导向块805、上模版808上下移动，所述定位压板804下方设置下模版801、第三定位双顶针802、 第三z向定位支座810。注胶机构主要通过透镜注胶孔，往LED 透镜里边注胶。
当同步带403将LED基板和连体透镜传送到注胶工位时，第三z向定位支座810沿着高度方向顶起，第三定位双顶针802与LED基板上的定位配合，实现对LED基板和连体透镜的双顶针联合定位。LED 透镜的注胶，是基于导向注胶活塞杆和注胶头809实现的。在LED基板和连体透镜双顶针定位之后，第三z向定位支座810沿着高度方向继续向上运动；同时，导向注胶活塞杆和注胶头809在上模板808和第三z向电机805作用下，沿着丝杆向下运动，最终实现上下模板的合模和注胶。
基于模块化设计思想，压边机构支撑桁架跟盖透镜机构相同，主要区别在于：
（1）相比图6a、6b、6c所示的盖透镜机构22中的透镜切边上模板602和透镜切边下模板606，压边机构24变成透镜热压上模板702和透镜热压下模板706，没有切边功能；
（2）相比图6a、6b、6c所示的盖透镜机构22，压边机构24的透镜热压上模板702和第二上压板704包含多了加热功能，通过加热棒实现热压套筒的加热。
基于模块化设计思想，注胶机构25支撑桁架跟盖透镜机构22相同，主要区别在于：
（1）相比盖透镜机构22，注胶机构25中，图6a、6b、6c所示的盖透镜机构中的透镜切边上模板602，被换成导向注胶活塞杆和注胶头809；且导向注胶活塞杆和注胶头809尺寸和形位精度都比透镜切边上模板602要高。
（2）相比图6a、6b、6c所示的中盖透镜机构中的透镜切边上模板602，注胶机构的导向块805多了个总入胶口，以及注胶杆对应的液体胶连通孔。
显然，附图中描述位置关系的仅用于示例性说明，不能理解为对本专利的限制；本发明的上述实施例仅仅是为清楚地说明本发明所作的举例，而并非是对本发明的实施方式的限定。对于所属领域的普通技术人员来说，在上述说明的基础上还可以做出其它不同形式的变化或变动。这里无需也无法对所有的实施方式予以穷举。凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本发明权利要求的保护范围之内。

Claims (3)

  1. 一种新型LED模组封装自动化成套设备，其特征在于，包括传送机构(26，沿该传送机构(26依次设置的上料机构(21)、盖透镜机构(22)、下料机构(23)、压边机构(24)和注胶机构(25)，
    所述传送机构包括(26)根相互平行设置的传送导轨(408)，该传送导轨(408)一端的外侧设置有连体透镜支架料盒(401)及LED基板料盒(402)，同步带(403)在伺服电机(407)的驱动下沿传送导轨(408)移动，所述传送导轨(408)内侧设置有张紧轮(404)、所述传送导轨(408)顶部设置有上下料工位的法向压块(405)，底部设置有支撑(406)；
    所述LED模组封装的上料机构(21)和下料机构(23)均采用单臂桁架结构，包括受上下料机构支撑架(508)支撑的水平横臂，所述水平横臂一端设置有驱动y向同步带(504)移动的y向电机(503),所述水平横臂上还垂直设置有受y向同步带(504)驱动可沿水平横臂来回移动的垂直臂，所述垂直臂设置有第一丝杆螺母副(506)，第一丝杆螺母副(506)与垂直臂顶端的z向电机(505)传动连接，垂直臂底端设置有吸盘(507)；
    所述盖透镜机构包括垂直固定的第一支撑桁架(603)，由下而上地设置在第一支撑桁架(603)上的第一定位基板(601)、透镜切边上模版(602)、第一上压板(604)、第一z向电机(605)，所述第一z向电机(605)通过丝杆螺母副驱动第一定位基板(601)、透镜切边上模版(602)、第一上压板(604)上下移动，所述第一定位基板(601)下方还设置有透镜切边下模版(606)、第一定位双顶针(607)和第一z向定位支座(608)；
    所述压边机构包括垂直固定的第二支撑桁架(703)，由下而上地设置在第二支撑桁架(703)上的第二定位基板(701)、透镜热压上模版(702)、、第二上压板(704)、第二z向电机(705)，所述第二z向电机(705)通过丝杆螺母副驱动第二定位基板(701)、透镜热压上模版(702)、第二上压板(704)上下移动，第二定位基板(701)下方还设置有透镜热压下模版(706)、第二定位双顶针(707)和第二z向定位支座(708)；
    所述注胶机构包括垂直固定的第三支撑桁架(803)，由下而上的设置在第三支撑桁架(803)上的定位压板(804)、导向块(805)、上模版(808)、第三z向电机(806)，所述导向块(805)、上模版(808)之间设置有导向注胶活塞杆和注胶头(809)，所述第三z向电机(806)通过第二丝杆螺母副(807)驱动定位压板(804)、导向块(805)、上模版(808)上下移动，所述定位压板(804)下方设置下模版(801)、第三定位双顶针(802)、 第三z向定位支座(810)。
  2. 根据权利要求1所述LED模组封装自动化成套设备，其特征在于：所述吸盘(507)为气动双负压吸盘。
  3. 根据权利要求1所述LED模组封装自动化成套设备，其特征在于：所述支撑(406)的数量为6个或6个以上。
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