WO2014178260A1 - Module de caméra et son procédé de fabrication - Google Patents

Module de caméra et son procédé de fabrication Download PDF

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Publication number
WO2014178260A1
WO2014178260A1 PCT/JP2014/059966 JP2014059966W WO2014178260A1 WO 2014178260 A1 WO2014178260 A1 WO 2014178260A1 JP 2014059966 W JP2014059966 W JP 2014059966W WO 2014178260 A1 WO2014178260 A1 WO 2014178260A1
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WO
WIPO (PCT)
Prior art keywords
cover
image sensor
circuit board
conductive cover
conductive
Prior art date
Application number
PCT/JP2014/059966
Other languages
English (en)
Japanese (ja)
Inventor
優 稲村
幸裕 金子
和彦 恩田
Original Assignee
富士フイルム株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士フイルム株式会社 filed Critical 富士フイルム株式会社
Publication of WO2014178260A1 publication Critical patent/WO2014178260A1/fr

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/003—Alignment of optical elements
    • G02B7/005—Motorised alignment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/62—Optical apparatus specially adapted for adjusting optical elements during the assembly of optical systems
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras

Definitions

  • the present invention relates to a camera module incorporated in a portable device and a manufacturing method thereof.
  • an image pickup device is positioned between a lens and a substrate, and a conductive cover (shield cover) is placed on the substrate so as to cover the lens and the image pickup device.
  • a ground electrode is provided on the side surface, and a conductive adhesive is filled in a space formed between the side surface of the notch and the inner side surface of the conductive cover, and the conductive cover and the substrate are filled with the conductive adhesive.
  • the conductive adhesive is filled in the space between the notch portion of the substrate and the conductive cover from the bottom surface side of the substrate, the assembly of the camera module is simplified.
  • the present invention has been made in view of the above problems, and is intended to suppress the outflow of the conductive adhesive to the image sensor side without deteriorating the electromagnetic shielding property, and also to the lens and circuit on the conductive cover side. It is an object of the present invention to provide a camera module capable of adjusting a mounting position such as a position and an angle of an image sensor on a substrate side and a manufacturing method thereof.
  • a camera module of the present invention includes an image sensor and a circuit board having at least a part of a circuit for the image sensor, a lens unit, a conductive cover, a ground terminal, a sensor cover, an adhesive storage recess, a conductive With adhesive.
  • the lens unit guides light to the image sensor.
  • the conductive cover is attached to the circuit board and electromagnetically shields at least a part of the image sensor and the circuit for the image sensor.
  • the ground terminal is formed on the image sensor mounting surface of the circuit board and grounds the circuit.
  • the sensor cover is attached to the circuit board and covers at least a part of the image sensor and the circuit for the image sensor.
  • the adhesive storage recess is formed on the outer peripheral surface of the sensor cover to expose the ground terminal and a part of the conductive cover in a state where the image sensor is stored in the conductive cover and the circuit board is attached to the conductive cover. Is done.
  • the conductive adhesive is disposed in the adhesive storage recess, and conducts and fixes the ground terminal and the conductive cover.
  • outer peripheral surface of the sensor cover is preferably arranged close to the inner peripheral surface of the conductive cover.
  • the conductive adhesive is injected from the gap formed between the mounting end of the conductive cover and the circuit board. Is preferred.
  • the conductive cover is formed at the mounting end of the conductive cover at a position corresponding to the adhesive housing concave portion. It is preferable to have a notch leading to the portion, and the conductive adhesive is injected from this notch.
  • the adhesive accommodating recess is formed on the outer peripheral surface of the sensor cover in the circumferential direction on the entire circumference.
  • a plurality of adhesive accommodating recesses are formed on the outer peripheral surface of the sensor cover so as to be spaced apart in the circumferential direction.
  • the sensor cover has a metal film on at least a part of the outer peripheral surface, and the metal film is electrically connected to the ground.
  • the lens unit is preferably housed in a conductive cover.
  • the manufacturing method of the camera module of the present invention includes a lid assembly process, a conductive cover assembly process, and a ground connection process.
  • the lid assembly process includes an image sensor, a circuit board to which the image sensor is attached and having at least a part of a circuit for the image sensor, and a ground for grounding the circuit formed on a mounting surface of the image sensor on the circuit board.
  • assembling a lid having a recess includes an adhesive container formed on the outer peripheral surface of the sensor cover to expose the ground terminal.
  • a lens unit for guiding light to the image sensor is attached to a conductive cover for electromagnetically shielding the image sensor and the circuit from the outside.
  • the conductive adhesive is injected from the gap between the conductive cover and the circuit board into the adhesive housing recess partly covered with the conductive cover, Conductively fix the terminal and conductive cover.
  • the outflow of the conductive adhesive to the image sensor side can be suppressed without deteriorating the electromagnetic shielding property. Further, the mounting position such as the position and angle of the lens on the conductive cover side and the image sensor on the circuit board side can be adjusted.
  • FIG. 1 It is a perspective view of another embodiment which shows the state which attaches a conductive cover to a circuit board. It is a vertical sectional view which shows the state which attaches a conductive cover to the circuit board in another embodiment which changed the injection
  • the camera module 10 is formed in a rectangular parallelepiped shape by a metal conductive cover 11, a circuit board 12, and a conductive adhesive 13. ing.
  • the conductive cover 11 is a square cylinder with a top plate 11 a
  • the circuit board 12 is a rectangular plate having the same shape and the same size as the outer peripheral surface of the conductive cover 11.
  • the side on which the conductive cover 11 is attached is described as the upper side or the upper side
  • the circuit board 12 side is described as the lower side or the lower side.
  • the camera module 10 is mounted on a device such as a mobile phone, a smartphone, a tablet, or a mobile personal computer.
  • An image sensor 15 typified by a CMOS or a CCD is attached to the upper surface (image sensor attachment surface) 12 a of the circuit board 12.
  • Printed wiring patterns 12 c and 12 d are formed on both surfaces of the circuit board 12.
  • Various electrical components (not shown) are attached to the printed wiring pattern 12c on the upper surface 12a side to which the image sensor 15 is attached.
  • a drive circuit (image sensor circuit) for driving the image sensor 15 is configured by the printed wiring patterns 12c and 12d having these electrical components.
  • a large number of terminals are formed on the printed wiring pattern 12d on the lower surface 12b. Each terminal at one end of the flexible printed circuit board 16 is soldered to these terminals. The other end of the flexible printed board 16 has a connection terminal with an external device.
  • the circuit board 12 is disposed so as to close the opening 11b with the top plate 11a facing up and the opening 11b facing down.
  • a photographing opening 11c is formed at the center of the top plate 11a.
  • a lens unit 21 is disposed in the conductive cover 11 so as to face the imaging opening 11c.
  • the lens unit 21 includes, for example, three photographing lenses 22 to 24 and a lens barrel 25 that holds these lenses 22 to 24. It should be noted that one or more photographing lenses may be used.
  • the lens unit 21 is supported by the lens holder 26.
  • An actuator 30 is attached between the lens holder 26 and the conductive cover 11.
  • a voice coil motor having a coil 31 and a magnet 32 is used.
  • the lens holder 26 is supported by a spring member (not shown) so as to be movable in the direction of the optical axis CL.
  • the actuator 30 supplies a current to the coil 31 to move the lens holder 26 in the direction of the optical axis CL using the electromagnetic force generated with the magnet 32 as a driving force. Thereby, focus adjustment is performed, and a subject image is formed on the light receiving surface of the image sensor 15.
  • the conductive cover 11 is used as the yoke of the voice coil motor, the number of parts can be reduced by that amount, and the size of the actuator 30 can be reduced.
  • the actuator 30 is not limited to a voice coil motor, and may be a piezo actuator, a stepping motor, or the like.
  • a partition plate 35 is attached to the opening 11 b of the conductive cover 11.
  • the partition plate 35 has an opening 35a at the center.
  • the partition plate 35 covers the lens holder 26, the actuator 30, and other electrical components in the conductive cover 11.
  • the outer peripheral surface 35 b of the partition plate 35 is in close contact with the inner peripheral surface 11 d of the conductive cover 11.
  • connection wires (not shown) such as wires and flexible printed boards.
  • the connection line passes through a notch (not shown) provided in the partition plate 35.
  • the sensor cover 40 is attached to the circuit board 12 so as to cover the image sensor 15 and the drive circuit.
  • a transparent resin imaging window 41 is fitted in a portion corresponding to the image sensor light receiving surface of the sensor cover 40.
  • the sensor cover 40 protects various electrical components attached to the circuit board 12 in addition to preventing dust and the like from adhering to the light receiving surface of the image sensor 15.
  • the sensor cover 40 is made of heat resistant resin or metal. In the case of metal, an insulating layer is formed on the circuit board contact surface or the like.
  • the sensor cover 40 is formed in a rectangular plate shape that is slightly smaller than the inner peripheral surface 11 d of the conductive cover 11. As a result, the outer peripheral surface 40 a of the sensor cover 40 is disposed close to the inner peripheral surface 11 d of the conductive cover 11.
  • An adhesive accommodating recess 42 is formed on the outer peripheral surface 40a of the sensor cover 40 over the entire circumference in the circumferential direction.
  • the adhesive accommodating recess 42 has a vertical cross-sectional shape (vertical cross-sectional shape) formed in a rectangular shape so as to expose the upper surface 12 a of the outer peripheral edge of the circuit board 12.
  • the hook-shaped protrusion 43 regulates the outflow of the conductive adhesive 13. Thereby, the conductive adhesive 13 does not overflow into the upper surface of the sensor cover 40 or the conductive cover 11.
  • the cross-sectional shape of the adhesive accommodating recess 42 is not limited to a rectangle, and may be various shapes such as a triangle or a shape having an arc.
  • the circuit board 12 to which the sensor cover 40 is attached serves as a lid that covers the opening 11 b of the conductive cover 11.
  • the attachment end portion 11 e of the conductive cover 11 is provided so as to cover the adhesive accommodating recess 42 in the vertical direction by about half. Position. Therefore, a gap that is about half the height of the adhesive accommodating recess 42 is formed between the attachment end 11e and the circuit board 12 in the vertical direction. This gap becomes the adhesive injection port 45. From the injection port 45, for example, the tip of the injection nozzle 53 is inserted, and the conductive adhesive 13 is injected. Moreover, it replaces with injection
  • a ground terminal 50 for grounding the circuit board 12 is formed on the upper surface 12a of the circuit board 12 in which the adhesive accommodating recess 42 is formed. Moreover, the attachment end part 11e of the electroconductive cover 11 is located so that the upper part of the adhesive agent accommodation recessed part 42 may be covered. As a result, the adhesive accommodating recess 42 exposes the ground terminal 50 and a part of the conductive cover 11. Therefore, when the conductive adhesive 13 such as Ag paste or cream solder is injected from the adhesive injection port 45, the injected conductive adhesive 13 is attached to the ground terminal 50 and the mounting end 11e of the conductive cover 11. It contacts the inner peripheral surface 11d.
  • the conductive adhesive 13 such as Ag paste or cream solder
  • the amount of the conductive adhesive 13 to be injected depends on the viscosity of the conductive adhesive 13, the volume of the adhesive housing recess 42, and the protrusion clearance 51 between the hook-shaped protrusion 43 and the inner peripheral surface 11 d of the conductive cover 11. An appropriate amount is determined in advance according to the above. Therefore, the ground terminal 50 and the conductive cover inner peripheral surface 11d can be electrically connected, and the conductive adhesive 13 does not overflow from the protruding portion gap 51 or the adhesive inlet 45. Thus, when the conductive cover 11 covers the image sensor 15 and the circuit, the image sensor 15 and the circuit are electromagnetically shielded from the outside, and the flow of the electromagnetic field is limited. Note that some of the circuits for the image sensor 15 may be covered with another conductive cover. In order to include such a case, the circuit board 12 includes at least a part of the circuit for the image sensor 15.
  • the lens unit 21, the lens holder 26, and the actuator 30 are incorporated in the conductive cover 11. After this, the partition plate 35 is attached.
  • printed wiring patterns 12c and 12d are formed on the circuit board 12, and the image sensor 15 and various electrical components are attached to the printed wiring pattern 12c on the upper surface 12a side. These printed wiring patterns 12c and 12d and various electrical components constitute a drive circuit for the image sensor 15.
  • the sensor cover 40 is attached so as to cover the image sensor 15 and a part of the drive circuit.
  • an adhesive accommodating recess 42 is formed on the outer peripheral surface 40a. In this way, the lid is assembled.
  • connection lines for connecting the electrical components in the conductive cover 11 and the actuator 30 to the drive circuit are connected to the circuit board 12.
  • the positioning inspection device 60 includes a substrate fixing unit 61, a cover holding unit 62, a positioning inspection unit 63, and an adjustment mechanism 64.
  • the substrate fixing unit 61 fixes and holds the circuit board 12.
  • the board fixing unit 61 electrically connects the circuit board 12 of the camera module 10 to the positioning inspection unit 63.
  • the cover holding part 62 holds the conductive cover 11.
  • the adjustment mechanism 64 slightly shifts the cover holding portion 62 in the X-axis, Y-axis, and Z-axis directions, and slightly rotates around the X-axis, Y-axis, and Z-axis, so that the conductive cover 11 and the circuit board 12 are rotated. Adjust the mounting position.
  • the positioning inspection unit 63 drives the camera module 10 and photographs the test chart 65 via the lens unit 21. Based on the captured image data of the test chart 65, the positioning inspection unit 63 collates with the reference data, and obtains the position and rotation angle at which the conductive cover 11 and the circuit board 12 are appropriate. After the cover holder 62 is driven to the obtained position and rotation angle and the conductive cover 11 is reset, the test chart 65 is photographed, and the appropriate position and rotation angle are obtained again by the same processing. When the conductive cover 11 is in an appropriate position and angle with respect to the image sensor 15 of the circuit board 12 by repeating this, the adjustment process is ended. Note that the positioning inspection method is an example, and the operation of the camera module 10 may be confirmed and the mounting position may be adjusted by other methods.
  • the conductive adhesive 13 is automatically injected into the adhesive accommodating recess 42 from the adhesive injection port 45 by the injection nozzle 53, and the ground connection process is performed.
  • the conductive adhesive 13 is manually injected or applied to the adhesive housing recess 42 to perform the ground connection process.
  • the Ag paste When an Ag paste is used as the conductive adhesive 13, the Ag paste is solidified at room temperature, and the circuit board 12 and the conductive cover 11 are joined. Further, since the ground terminal 50 of the circuit board 12 is electrically connected to the conductive cover 11 via the conductive adhesive 13, the effect of electromagnetic shielding is enhanced.
  • the reflow solder When reflow solder is used as the conductive adhesive 13, the reflow solder is heated to a predetermined temperature and solidified after the injection.
  • the conductive adhesive 13 is injected into the adhesive housing recess 42.
  • the circumferential length of the adhesive accommodating recess 42 is secured to some extent, positioning and fixing can be performed at one location. Preferably there are two or more.
  • the mounting position and the mounting angle of the conductive cover 11 are adjusted with respect to the circuit board 12, and the circuit board 12 is positioned with respect to the conductive cover 11 and fixed with the conductive adhesive 13. Can do. In this way, a camera module 10 as shown in FIG. 2 is obtained.
  • the conductive adhesive 13 or a normal adhesive is injected into the remaining adhesive accommodating recess 42, and the circuit The adhesive may be filled over the entire circumference of the substrate 12.
  • the remaining adhesive accommodating recess 42 FIG. 7
  • the remaining adhesive accommodating recess 42 FIG. 4
  • a metal tape 70 so as to cover the attachment end portion 11e (see FIG. 4) of the conductive cover 11 continuous to the adhesive accommodating recess 42, and the effect of the electromagnetic shield may be further enhanced.
  • a metal film may be formed by metal vapor deposition.
  • a metal vapor deposition film may be formed on the outer peripheral surface 40a of the sensor cover 40 including the adhesive accommodating recess 42 in advance. This metal film is electrically connected to the ground terminal 50 by the conductive adhesive 13.
  • the electromagnetic shielding property can be improved. Therefore, when used in a mobile device such as a mobile phone, it is possible to prevent electromagnetic noise interference between the electronic components. As a result, for example, even if the antenna and the camera module 10 are close to each other, they are not affected by electromagnetic noise. For example, the image quality of a captured image is not deteriorated on the camera side, and the reception sensitivity is lowered on the antenna side. Absent.
  • data captured by the camera module 10 is stored in a flash memory on the mobile device side. Thereafter, the data is read out by the image data processing IC and subjected to image processing such as matrix calculation, signal interpolation, gamma correction, luminance / color difference conversion, and data compression.
  • image processing such as matrix calculation, signal interpolation, gamma correction, luminance / color difference conversion, and data compression.
  • the image data for one screen is sequentially sent to the display panel by the monitor driver, and through images are sequentially displayed on the display panel at a constant cycle.
  • the adhesive accommodating recess 42 is formed over the entire outer periphery 40 a of the sensor cover 40, but in the second embodiment, as shown in FIG. 8, the sensor cover 75 is provided.
  • a plurality of adhesive accommodating recesses 76 and ground terminals 77 are formed at positions separated from each other in the circumferential direction with respect to the outer peripheral surface.
  • the adhesive storage recess 76 is formed at the center of each side surface constituting the outer peripheral surface of the substantially rectangular parallelepiped sensor cover 75.
  • a rectangular notch 79 is formed in the attachment end portion 78e of the conductive cover 78 at a position corresponding to the adhesive accommodating recess 76 to serve as an adhesive injection port.
  • the attachment end portion 78e of the conductive cover 78 is about half the vertical length of the adhesive accommodating recess 76 as in the first embodiment.
  • a conductive cover 78 may be attached to the circuit board 12 so as to cover it.
  • the adhesive accommodating recess 76 is formed at the center of each side surface of the sensor cover 75, but the formation position is not limited to the center and may be an arbitrary position. Moreover, although one adhesive storage recess 76 is provided on one side, a plurality of adhesive storage recesses 76 may be formed on one side. Furthermore, although illustration is omitted, an adhesive storage recess may be formed at a corner portion of each side surface of the sensor cover 75. In the case where the adhesive storage recess is formed at the corner, the adhesive storage recess may be formed at, for example, one or more of the four corners. Preferably, the adhesive storage recess is preferably formed at two or more locations.
  • the circuit board 81 is configured in a rectangular plate shape slightly smaller than the shape of the inner peripheral surface 82 d of the conductive cover 82.
  • the circuit board 81 is positioned such that the side surface 81a of the circuit board 81 faces the inner peripheral surface 82d of the attachment end 82e of the conductive cover 82.
  • a gap 83 is formed between the side surface 81a of the circuit board 81 and the inner peripheral surface 82d of the attachment end portion 82e. This gap 83 serves as an inlet for the conductive adhesive 13.
  • the conductive adhesive 13 is injected into the injection port by, for example, an injection nozzle 53.
  • a notch may be formed in the attachment end portion 82e of the conductive cover 82, and the conductive adhesive 13 may be injected through the notch.
  • a cutout may be formed on the circuit board 81 side at a position corresponding to the adhesive accommodating recess 76 with respect to the circuit board 81 of the above embodiment. In this case, it is preferable to form a notch at the stage of substrate formation so that chips do not adhere to the substrate due to the formation of the notch.
  • the camera module 10 is a rectangular parallelepiped box with the conductive cover 11 and the circuit board 12, but the shape of the camera module is not only a rectangular parallelepiped but also a cube, a cylinder, an elliptic cylinder, or a polygonal cylinder. Or other three-dimensional objects.
  • the lens unit 21 is housed in the conductive cover 11, but the lens unit 21 may be provided outside the conductive cover 11. In addition, the lens unit 21 may be partially stored in the conductive cover 11.
  • the adhesive housing recess 42 when the adhesive housing recess 42 is formed on the outer peripheral surface 40 a of the sensor cover 40, the hook-like protrusion 43 is left on the upper side, but the adhesive so as to reach the upper surface of the sensor cover 40.
  • a storage recess 42 may be formed.
  • the outer peripheral surface 40a of the sensor cover 40 is made close to the inner peripheral surface of the conductive cover 11 over the entire periphery, but only the portion where the adhesive storage recess 42 is formed is close to the inner peripheral surface of the conductive cover 11. You may let them.
  • the camera module 10 in which the lens unit 21, the lens holder 26, and the actuator 30 are housed in the conductive cover 11 has been described.
  • the present invention may be applied.
  • the flexible printed circuit board 16 without attaching the flexible printed circuit board 16 to the circuit board 12, for example, a pin on the inspection apparatus side is brought into contact with a terminal formed on the back surface of the circuit board, and the image sensor 15 and the actuator 30 are driven. Although the attachment position is adjusted, the flexible printed circuit board 16 may be joined to the back surface terminal by soldering or the like, and connected to the inspection apparatus via the flexible printed circuit board 16.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Studio Devices (AREA)
  • Lens Barrels (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)

Abstract

L'invention concerne : un module de caméra caractérisé en ce qu'un écoulement d'un adhésif conducteur vers le côté capteur d'image est supprimé, les positions de fixation d'un capot conducteur et d'une carte à circuit peuvent être ajustées, et les caractéristiques de blindage électromagnétique sont élevées ; et un procédé de fabrication du module de caméra. Une unité de lentille (21) est fixée à un capot conducteur (11). Un capteur d'image (15) est fixé à une carte à circuit (12). Un capot de capteur (40) est fixé à la carte à circuit (12) de telle sorte que le capteur d'image (15) et un circuit pour le capteur d'image sont couverts avec le capot de capteur. Une borne de terre (50) est formée au niveau d'une partie périphérique de la carte à circuit (12). Une section évidée de stockage d'adhésif (42) est formée sur la surface circonférentielle externe du capot de capteur (40). La section évidée de stockage d'adhésif (42) expose à partir de celle-ci la borne de terre (50) et une partie de la surface circonférentielle interne (11d) du capot conducteur (11). Un adhésif conducteur (13) est injecté dans la section évidée de stockage d'adhésif (42) dont une partie est couverte avec le capot conducteur (11). La borne de terre (50) et le capot conducteur (11) sont électriquement connectés l'un à l'autre au moyen de l'adhésif conducteur (13), et les caractéristiques de blindage électromagnétique sont améliorées.
PCT/JP2014/059966 2013-05-01 2014-04-04 Module de caméra et son procédé de fabrication WO2014178260A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013-096628 2013-05-01
JP2013096628A JP2016130746A (ja) 2013-05-01 2013-05-01 カメラモジュール及びその製造方法

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WO2014178260A1 true WO2014178260A1 (fr) 2014-11-06

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016199776A1 (fr) * 2015-06-12 2016-12-15 日本電産コパル株式会社 Boîtier, dispositif de commande d'objectif le comprenant, dispositif d'imagerie, appareil électronique, et procédé de production de boîtier
JP2017003886A (ja) * 2015-06-12 2017-01-05 日本電産コパル株式会社 レンズ駆動装置、光学機器、電子機器、及びレンズ駆動装置の製造方法
US20170153413A1 (en) * 2015-12-01 2017-06-01 Tdk Taiwan Corp. Lens driving module
CN107111093A (zh) * 2014-12-26 2017-08-29 三美电机株式会社 透镜驱动装置、摄像机模块、以及摄像机搭载装置
WO2018113179A1 (fr) * 2016-12-20 2018-06-28 广东欧珀移动通信有限公司 Ensemble support, module fonctionnel et terminal mobile
US11019243B2 (en) 2017-05-30 2021-05-25 Sony Semiconductor Solutions Corporation Camera unit and mobile body
GB2578511B (en) * 2018-09-04 2021-09-29 Canon Kk Lens apparatus and camera system having the same
US11256071B2 (en) 2018-09-04 2022-02-22 Canon Kabushiki Kaisha Lens apparatus and imaging system including the same

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7441759B2 (ja) 2020-09-01 2024-03-01 アルプスアルパイン株式会社 レンズ駆動装置及びカメラモジュール

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005278034A (ja) * 2004-03-26 2005-10-06 Matsushita Electric Ind Co Ltd 撮像装置
JP2006033296A (ja) * 2004-07-14 2006-02-02 Seiko Precision Inc カメラモジュールおよび電子機器
JP2006308987A (ja) * 2005-04-28 2006-11-09 Nidec Copal Corp カメラモジュールの調整装置及び調整方法
WO2008102575A1 (fr) * 2007-02-21 2008-08-28 Konica Minolta Opto, Inc. Dispositif d'imagerie et son procédé de fabrication
KR100876110B1 (ko) * 2007-09-11 2008-12-26 삼성전기주식회사 카메라 모듈 및 그 제조방법
US20100158508A1 (en) * 2006-08-22 2010-06-24 Min Soo Kim Camera Module
JP2011199829A (ja) * 2010-02-26 2011-10-06 Sharp Corp カメラモジュール
JP2011205221A (ja) * 2010-03-24 2011-10-13 Toshiba Corp カメラモジュール
US20110285889A1 (en) * 2010-05-18 2011-11-24 Samsung Electronics Co., Ltd. Camera module and method of manufacturing the camera module
US20120039060A1 (en) * 2010-08-11 2012-02-16 Samsung Electro-Mechanics Co., Ltd. Camera module

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005278034A (ja) * 2004-03-26 2005-10-06 Matsushita Electric Ind Co Ltd 撮像装置
JP2006033296A (ja) * 2004-07-14 2006-02-02 Seiko Precision Inc カメラモジュールおよび電子機器
JP2006308987A (ja) * 2005-04-28 2006-11-09 Nidec Copal Corp カメラモジュールの調整装置及び調整方法
US20100158508A1 (en) * 2006-08-22 2010-06-24 Min Soo Kim Camera Module
WO2008102575A1 (fr) * 2007-02-21 2008-08-28 Konica Minolta Opto, Inc. Dispositif d'imagerie et son procédé de fabrication
KR100876110B1 (ko) * 2007-09-11 2008-12-26 삼성전기주식회사 카메라 모듈 및 그 제조방법
JP2011199829A (ja) * 2010-02-26 2011-10-06 Sharp Corp カメラモジュール
JP2011205221A (ja) * 2010-03-24 2011-10-13 Toshiba Corp カメラモジュール
US20110285889A1 (en) * 2010-05-18 2011-11-24 Samsung Electronics Co., Ltd. Camera module and method of manufacturing the camera module
US20120039060A1 (en) * 2010-08-11 2012-02-16 Samsung Electro-Mechanics Co., Ltd. Camera module

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10451956B2 (en) 2014-12-26 2019-10-22 Mitsumi Electric Co., Ltd. Lens driving device, camera module, and camera-equipped device
CN107111093A (zh) * 2014-12-26 2017-08-29 三美电机株式会社 透镜驱动装置、摄像机模块、以及摄像机搭载装置
EP3239755A4 (fr) * 2014-12-26 2018-08-22 Mitsumi Electric Co., Ltd. Dispositif d'entraînement de lentilles, module d'appareil photographique, et dispositif d'installation d'appareil photographique
CN107111093B (zh) * 2014-12-26 2020-01-03 三美电机株式会社 透镜驱动装置、摄像机模块、以及摄像机搭载装置
CN107636506B (zh) * 2015-06-12 2020-09-18 日本电产科宝株式会社 框体、具有该框体的透镜驱动装置、拍摄装置、电子设备、以及框体的制造方法
CN107636506A (zh) * 2015-06-12 2018-01-26 日本电产科宝株式会社 框体、具有该框体的透镜驱动装置、拍摄装置、电子设备、以及框体的制造方法
WO2016199776A1 (fr) * 2015-06-12 2016-12-15 日本電産コパル株式会社 Boîtier, dispositif de commande d'objectif le comprenant, dispositif d'imagerie, appareil électronique, et procédé de production de boîtier
JP2017003886A (ja) * 2015-06-12 2017-01-05 日本電産コパル株式会社 レンズ駆動装置、光学機器、電子機器、及びレンズ駆動装置の製造方法
US11036027B2 (en) 2015-06-12 2021-06-15 Nidec Copal Corporation Housing, lens drive device provided with same, imaging device, electronic apparatus, and housing production method
US20170153413A1 (en) * 2015-12-01 2017-06-01 Tdk Taiwan Corp. Lens driving module
US11300757B2 (en) 2015-12-01 2022-04-12 Tdk Taiwan Corp. Optical element driving mechanism
CN106814432B (zh) * 2015-12-01 2019-11-19 台湾东电化股份有限公司 镜头驱动模块
JP2017102448A (ja) * 2015-12-01 2017-06-08 台湾東電化股▲ふん▼有限公司 レンズ駆動モジュール
CN106814432A (zh) * 2015-12-01 2017-06-09 台湾东电化股份有限公司 镜头驱动模块
US10320961B2 (en) 2016-12-20 2019-06-11 Guangdong Oppo Mobile Telecommunications Corp., Ltd. Bracket assembly for functional component for mobile terminal
WO2018113179A1 (fr) * 2016-12-20 2018-06-28 广东欧珀移动通信有限公司 Ensemble support, module fonctionnel et terminal mobile
US11019243B2 (en) 2017-05-30 2021-05-25 Sony Semiconductor Solutions Corporation Camera unit and mobile body
GB2578511B (en) * 2018-09-04 2021-09-29 Canon Kk Lens apparatus and camera system having the same
US11256071B2 (en) 2018-09-04 2022-02-22 Canon Kabushiki Kaisha Lens apparatus and imaging system including the same
US11586095B2 (en) 2018-09-04 2023-02-21 Canon Kabushiki Kaisha Lens apparatus and camera system having the same

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