WO2014161184A1 - 一种测试倒装led 芯片的吸嘴、方法及测试机构 - Google Patents

一种测试倒装led 芯片的吸嘴、方法及测试机构 Download PDF

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Publication number
WO2014161184A1
WO2014161184A1 PCT/CN2013/073729 CN2013073729W WO2014161184A1 WO 2014161184 A1 WO2014161184 A1 WO 2014161184A1 CN 2013073729 W CN2013073729 W CN 2013073729W WO 2014161184 A1 WO2014161184 A1 WO 2014161184A1
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WIPO (PCT)
Prior art keywords
chip
suction nozzle
flip
led chip
test
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PCT/CN2013/073729
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English (en)
French (fr)
Inventor
唐群英
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深圳市智讯达光电科技有限公司
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Application filed by 深圳市智讯达光电科技有限公司 filed Critical 深圳市智讯达光电科技有限公司
Priority to CN201380002948.4A priority Critical patent/CN104520981B/zh
Priority to PCT/CN2013/073729 priority patent/WO2014161184A1/zh
Publication of WO2014161184A1 publication Critical patent/WO2014161184A1/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2607—Circuits therefor
    • G01R31/2632—Circuits therefor for testing diodes
    • G01R31/2635—Testing light-emitting diodes, laser diodes or photodiodes

Definitions

  • the present invention relates to the field of testing flip chip LED chips, and more particularly to a nozzle for flip chip LED chip test equipment, a method for testing a flip chip LED chip, and a test mechanism.
  • the flip chip (F ip Chip) is a leadless structure, generally containing a circuit unit.
  • the flip chip is used in a first layer chip and a carrier board package, and the package method is a chip face down to the substrate, without a wire bond.
  • the combination of flip-chip development reduces cost, increases speed, improves component reliability, uses metal ball connections, reduces package size, improves electrical performance, and solves the need for BGA to increase pin count.
  • FC is usually applied to CPUs with high clock speed or high frequency RF for better performance. Compared with the traditional slow wire bonding technology, FC is more suitable for high pin count and miniaturization. , versatile, high speed trend IC products.
  • the flip-chip LED chip must be tested after flip-chip manufacturing to verify the quality of the flip-chip LED chip.
  • the test process is usually performed on the test machine.
  • the test process in the prior art is to flip the device first.
  • the electrode of the LED chip faces downward, the nozzle of the test device sucks the chip from the light emitting surface, and the swing arm and the nozzle move the flip chip to the preset detection tray.
  • the detection tray is provided with a small thimble and a small nozzle, and the small thimble
  • the flip-chip LED chip electrode is turned on and emits light, and the photoelectric parameters of the chip are obtained by an integrating sphere provided above the detection tray.
  • the disadvantage of this type of test machine is that the nozzle is only used to move the flip-chip LED chip, and the test system is turned on by the probe on the electrode, and the flip-chip LED chip is also positioned on the detection tray, and Description
  • the object of the present invention is to provide a nozzle for a flip chip LED chip test device, which can be used to improve the test efficiency and accuracy.
  • Another object of the present invention is to provide a test method and test mechanism for a flip chip LED chip.
  • the electrodes of the chip are connected to the test system through probe electrical signals.
  • the present invention designs a nozzle with a transfer electrical signal, which directly replaces the probe, and the test is inverted.
  • the nozzle for mounting the LED chip comprises a nozzle body, a vacuum air passage is arranged in the nozzle body, and the vacuum tube is externally connected, and a contact surface close to the electrode surface of the flip-chip LED chip is arranged at one end of the vacuum air passage, in contact A conductive electrode is disposed on the surface, and a conductive line connected to the conductive electrode is disposed on the suction body, and the conductive electrode is connected to the test system through the conductive line.
  • the distribution of the conductive electrodes matches the electrodes of the flip-chip LED chip.
  • the flip chip LED chip usually has two electrodes, that is, a P electrode and an N electrode, and the contact electrodes on the contact surface are two, distributed on both sides of the evacuated air passage.
  • the nozzle body is made of an insulating material and can be made of bakelite, ceramic or plastic.
  • the nozzle body may also be made of tungsten steel or other metal.
  • the surface of the nozzle body is firstly coated with an insulating medium slurry by sintering, and then the conductive line and the conductive electrode are applied.
  • the method for testing a flip-chip LED chip by using the nozzle of the present invention comprises the steps of: sucking the electrode surface of the flip-chip LED chip with a suction nozzle, electrically connecting the conductive electrode on the contact surface of the nozzle and the electrode of the flip-chip LED chip respectively Go to the test location and start the test system to obtain the photoelectric parameters of the flip-chip LED chip.
  • the step further includes positioning the flip-chip LED chip prior to drawing the flip-chip LED chip with the nozzle.
  • a test mechanism for flip-chip LED chips is designed, comprising: a rotating disk, the rotating disk is mounted on the rotating mechanism, and at least three workstations are arranged on the rotating disk, and the workstation is mounted with the apparatus according to claim 1.
  • a nozzle, the conductive electrode of the nozzle is electrically connected to the test system, and the rotating disk is rotated by the cam divider in the rotating mechanism;
  • a loading assembly comprising a loading arm and a suction nozzle for feeding the flip chip to the nozzle;
  • a blanking assembly comprising a blanking arm and a suction nozzle, for flipping the LED chip from The nozzle is removed; the integrating sphere is used to collect the illuminating photoelectric parameters of the flip-chip LED chip.
  • the number of the workstations is at least three, and generally three, six, twelve or twenty.
  • the working process of the testing mechanism is that the light-emitting side of the flip-chip LED chip faces upward, the electrode is positioned downward, and is transferred from the loading component to the nozzle of the workstation, and the conductive electrode of the nozzle contacts the flip-chip LED chip, and the rotating disk drives the workstation. Rotate to the test position below the integrating sphere to start the test.
  • the test system obtains the photoelectric parameters of the chip, and rotates the disk to drive the workstation to the unloading position.
  • the chip is removed from the blanking component to complete the test.
  • the invention has the beneficial effects that: the nozzle can directly illuminate the test chip, and the chip test action is compressed, thereby improving the testing efficiency of the device, and also avoiding the test caused by the flipping and positioning of the chip during the chip testing process. A major problem that is not complete or misjudged.
  • FIG. 1 is a structural view of a flip chip LED chip in the prior art.
  • Figure 2 is a perspective view of the nozzle of the present invention.
  • Figure 3 is a side elevational view of the nozzle of the present invention.
  • Figure 4 is a schematic view of the contact surface of the nozzle of the present invention.
  • Figure 4 is a schematic view of the contact surface of the nozzle of the present invention.
  • Figure 5 is a side elevational view of the flip chip LED chip to be tested of the present invention.
  • Figure 6 is a front elevational view of the flip chip LED chip to be tested of the present invention.
  • Figure 7 is a schematic view of the nozzle of the present invention mounted on a swing arm.
  • Figure 8 is an enlarged view of a portion A in Figure 7.
  • Figure 9 is a cross-sectional view of Figure 8.
  • Figure 10 is a schematic view showing the structure of the testing mechanism of the present invention.
  • Figure 11 is an enlarged view of a portion B in Figure 8.
  • the structure diagram of the flip-chip LED chip 10 includes a sapphire layer 101, a P-GaN layer 102, a P electrode 103, an N_GaN layer 104, and an N electrode 105 with the light emitting surface facing up, the P electrode and the N electrode. Distributed on the opposite side of the light-emitting surface.
  • the nozzle 1 of the flip-chip LED chip of the embodiment includes a nozzle body 11 and a vacuuming air passage 12 in the nozzle body, and is provided at one end of the vacuuming air passage.
  • the contact surface 13 of the electrode surface of the LED chip 10 is flip-chip mounted, and a conductive electrode 14 is disposed on the contact surface, and the conductive electrode is connected to the test system through the conductive electrode 15 on the suction body, wherein the distribution of the conductive electrode is to be tested
  • the electrodes of the flip-chip LED chip are matched.
  • the nozzle body is electrically insulated and can be made of ceramic, bakelite or plastic.
  • As a conductive circuit one end is connected to the P and N electrodes of the corresponding flip-chip LED chip, and the other end is connected to the test circuit board through the swing arm 2, so that the chip is powered on and then lit for testing.
  • the electric nozzle and the plastic material of the nozzle body, the conductive circuit and the conductive electrode are made of electric metal (such as gold, silver, aluminum or copper), which is attached by heat pressing, the ceramic nozzle body, the conductive line and the conductive electrode. It is a high temperature 400 ⁇ 1 000 degree sintering method attached to a layer of electrical metal (such as gold, silver, aluminum or copper).
  • the nozzle body can also be made of tungsten steel or other metal materials, using a high temperature 400 ⁇ 1 000 degree sintering method, attached with a layer of insulating medium slurry, and then a layer of electrical metal (such as gold, silver, aluminum or copper) .
  • the nozzle 1 is mounted on the swing arm 2, and is moved by the swing arm.
  • the vacuum air passage is connected with the vacuuming device.
  • the swing arm is made of metal aluminum, and the connecting nozzle is provided on the swing arm.
  • the connecting line 21 of the conductive circuit and the test circuit board is formed by first oxidizing aluminum, oxidizing to a depth of more than 30, and then attaching a layer of electric metal (such as gold, silver, aluminum or the like at a high temperature of 350 to 650 degrees. copper).
  • a layer of electric metal such as gold, silver, aluminum or the like at a high temperature of 350 to 650 degrees. copper.
  • the connecting line can prevent the problem that the conductive wire is loosened due to the rapid movement of the swing arm during the test.
  • the testing process of the tester is: flip-chip LED chip faces up, the light-emitting surface is placed on the blue film, starting processing, using a wafer camera placed above the wafer table to identify a wafer, and calculating the wafer and picking up Deviation between positions, the wafer stage XY motor moves to bring the wafer to the pickup position;
  • the swing arm is turned to the picking position, and the lower small thimble is raised to lift the chip;
  • the swing arm is lowered to the picking height, the vacuum is turned on, the chip is sucked onto the nozzle, and the two conductive electrodes on the nozzle are respectively connected with the two electrodes of the flip-chip LED chip;
  • the swing arm rises to a safe height, then rotates to the test position, the test circuit board works, the flip LED chip is lit, and the emitted light is incident on the integrating sphere directly below the chip, and the integrating sphere carries out the light emitted by the chip. Calculate and obtain test data;
  • the machine has a workbench with several areas, each of which is used to place different parameter ranges. According to the test data, the table is moved to the corresponding position, then the swing arm is turned to the set position, then lowered to the set position, the vacuum is turned off, the chip is dropped onto the workbench, the swing arm is raised, and the Prepare the position, the whole action is completed.
  • Embodiment 2 Referring to FIG. 10 and FIG. 11, the structure of an existing testing machine will be described using the nozzle of Embodiment 1.
  • the mechanism for testing the flip-chip LED chip of this embodiment includes a book rotating disk 21, a loading assembly 22, a blanking assembly 23, and an integrating sphere 24.
  • Rotating discs are equally divided into six workstations 211, one of which is in the loading position, one in the test position, one in the unloading position, and the rest in the waiting position.
  • the workstation is equipped with the nozzle 10 as in the first embodiment, the end of the nozzle Down, a vacuum tube is attached, with the contact surface of the conductive electrode facing up.
  • the rotating disk is mounted on the rotating mechanism 25, and is rotated by the cam splitter inside the rotating mechanism.
  • An integrating sphere for the optical parameter test is placed directly above the test position, and the integrating sphere has its opening facing downward. During the test, the light-emitting side of the flip-chip LED chip is aligned upward with the opening of the integrating sphere.
  • the loading component comprises a loading swing arm and a suction nozzle 26, and the feeding component comprises a blanking arm and a suction nozzle, which are respectively responsible for loading and unloading the flip chip LED chip.
  • the working mechanism of the testing mechanism is that the light-emitting surface of the flip-chip LED chip faces upward, the electrode is positioned downward, and is transferred from the loading component to the nozzle of the workstation, and the vacuum is opened, and the conductive electrode of the nozzle contacts the flip-chip LED chip.
  • the rotating disk drives the workstation to rotate under the integrating sphere to start the test.
  • the test system works to make the LED light up.
  • the test system obtains the photoelectric parameters of the chip, the workstation goes to the blanking position, and the blanking component removes the chip to complete the testing work. 6

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
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Abstract

一种用于倒装LED芯片测试设备的吸嘴、测试倒装LED芯片的方法及测试机构。其中测试倒装LED芯片（10）的吸嘴（1）包括有吸嘴本体（11），在吸嘴本体（11）内设置有一抽真空气道（12），外接真空管，在抽真空气道（12）的一端设有紧贴倒装LED芯片（10）电极表面的接触面（13），所述接触面（13）上设有导电电极（14），吸嘴本体（11）上设有与导电电极（14）连接的导电线路，导电电极（14）通过导电线路连接到测试系统。该吸嘴的有益效果在于：因吸嘴可直接通电点亮测试芯片（10），简化了芯片（10）测试动作，提高了设备的测试效率，同时还避免在芯片（10）测试过程中因芯片（10）的翻转和定位所造成的测试不完全或误判的问题。

Description

一种测试倒装 LED芯片的吸嘴、 方法及测试机构
【技术领域】 本发明涉及倒装 LED芯片的测试领域， 尤其是一种用于倒装 LED芯片测试 设备的吸嘴、 测试倒装 LED芯片的方法以及测试机构。
说
【背景技术】
书
倒装芯片（F l ip Chip)是一种无引脚结构， 一般含有电路单元， 倒装芯片 使用在第一层芯片与载板接合封装， 封装方式为芯片正面朝下向基板， 无需引 线键合， 形成最短， 降低电阻； 倒装芯片的开发降低了成本， 提高速度， 提高 组件可靠性， 采用金属球连接， 缩小了封装尺寸， 改善电性表现， 解决了 BGA 为增加引脚数而需扩大体积的困扰。 再者， FC通常应用在时脉较高的 CPU或高 频 RF上， 以获得更好的效能， 与传统速度较慢的引线键合技术相比， FC更适合 应用在高脚数、 小型化、 多功能、 高速度趋势 IC的产品中。 目前， 倒装 LED芯片在制造后必须要对倒装 LED芯片进行测试， 以检验倒 装 LED芯片的好坏， 测试过程通常是在测试机上进行， 现有技术中的测试过程 是先将倒装 LED芯片电极面朝下， 测试设备的吸嘴从发光面吸取芯片， 摆臂和 吸嘴将倒装 LED芯片移动到预先设置的检测托盘， 检测托盘内设有小顶针和小 吸嘴， 小顶针接通倒装 LED芯片电极并发光， 通过设在检测托盘上方的积分球 取得芯片的光电参数。 这种测试机的不足在于， 吸嘴只是用于移动倒装 LED芯片， 另外通过探针 按在电极上接通测试系统， 倒装 LED芯片在检测托盘上还要进行定位， 以及可 说 明 书
能的芯片翻传， 会造成测试不完全或误判， 同时测试机的测试效率不高。 【发明内容】
本发明目的是提供一种用于倒装 LED芯片测试设备的吸嘴， 筒化测试设备 过程， 提高测试效率和准确度。
本发明另一目的是提供一种倒装 LED芯片的测试方法与测试机构。
为实现上述目的， 本发明是通过以下的技术方案来实现的：
在现在的倒装 LED芯片的测试设备中， 芯片的电极是通过探针电信号连接 到测试系统的， 本发明设计了一种带有传递电信号的吸嘴， 直接替代探针， 该 测试倒装 LED芯片的吸嘴包括有吸嘴本体， 在吸嘴本体内设有一抽真空气道， 外接真空管， 在抽真空气道的一端设有紧贴倒装 LED芯片电极面的接触面， 在 接触面上设有导电电极， 以及在吸觜本体上设有与导电电极连接的导电线路， 导电电极通过导电线路连接到测试系统。 所述的导电电极的分布与倒装 LED芯 片的电极相匹配。
倒装 LED芯片通常具有两个电极， 即 P电极和 N电极， 所述的接触面上导 面电极为两个， 分布在抽真空气道的两侧。
所述的吸嘴本体采用绝缘材料制成， 可以采用电木、 陶瓷或塑料制成。 所述的吸嘴本体还可以采用钨钢或其它金属制成， 利用烧结方式在吸嘴本 体表面先上一层绝缘介质浆料， 再上导电线路和导电电极。
利用本发明的吸嘴进行倒装 LED芯片的测试方法， 其步骤是： 用吸嘴吸取 倒装 LED芯片的电极面， 使吸嘴接触面上的导电电极与倒装 LED芯片的电极分 别电连接， 转到测试位置上启动测试系统获取倒装 LED芯片的光电参数。
步骤还包括在用吸嘴吸取倒装 LED芯片前对倒装 LED芯片进行定位。 根据本发明的吸嘴， 设计出一种倒装 LED芯片的测试机构， 其包括： 转动盘， 转动盘安装在转动机构上， 转动盘上设置至少 3个工作站， 工作 站安装有如权利要求 1所述的吸嘴， 吸嘴的导电电极与测试系统电连接， 转动 盘在转动机构内的凸轮分割器带动下旋转；
上料组件， 包括上料摆臂和吸料嘴， 用于将倒装 LED芯片上料到吸嘴上； 下料组件， 包括下料摆臂和吸料嘴， 用于将倒装 LED芯片从吸嘴上取下； 积分球， 用于收集倒装 LED芯片的发光光电参数。
优选的， 所述的工作站的数量是至少 3个， 通常可以选择为 3个、 6个、 12 个或 24个。
测试机构的工作流程是倒装 LED芯片的发光面朝上， 电极面向下定位放置， 由上料组件转移到工作站的吸嘴上， 吸嘴的导电电极与倒装 LED芯片接触， 转 动盘带动工作站旋转至积分球下方测试位置启动测试， 测试系统取得该芯片的 光电参数， 转动盘再带动工作站转到下料位置， 由下料组件取下芯片完成测试 工作。
本发明的有益效果在于： 因吸嘴可直接通电点亮测试芯片， 筒化了芯片测 试动作， 提高了设备的测试效率， 同时还避免在芯片测试过程中因芯片的翻转 和定位所造成的测试不完全或误判的重大问题。
【说明书附图】
图 1为现有技术中倒装 LED芯片的结构图。
图 2为本发明的吸嘴的立体示意图。
图 3为本发明的吸嘴的侧面示意图。
图 4为本发明的吸嘴的接触面的示意图。 图 4为本发明的吸嘴的接触面的示意图。
图 5为本发明的待测试的倒装 LED芯片的侧面示意图。
图 6为本发明的待测试的倒装 LED芯片的正面示意图。
图 7为本发明的吸嘴安装在摆臂上的示意图。
图 8为图 7中 A部分的放大图。
图 9为图 8中的剖面视图。
图 10为本发明的测试机构的结构示意图。
图 11为图 8中 B部分的放大图。
【具体实施方式】
以下结合附图与具体实施例对本发明的技术方案作进一步详细阐述。
实施例 1
结合图 1所示， 为倒装 LED芯片 10的结构图， 包括蓝宝石层 101、 P-GaN 层 1 02、 P电极 103、 N_GaN层 104和 N电极 105 , 其发光面向上， P电极和 N电 极分布在发光面的相对面上。
结合图 2、 图 3所示， 本实施例的倒装 LED芯片的吸嘴 1包括有吸嘴本体 11和在吸嘴本体内的抽真空气道 12 , 在抽真空气道的一端设有紧贴倒装 LED芯 片 1 0电极表面的接触面 1 3 , 在接触面上设有导电电极 14 , 导电电极通过吸觜 本体上的导电电极 15连接到测试系统， 其中导电电极的分布与所要测试的倒装 LED芯片的电极相匹配。
结合图 3、 图 4所示， 接触面 1 1上导面电极 14为两个， 分布在抽真空气道 12的两侧。
吸嘴本体是电绝缘的， 可以采用陶瓷、 电木或塑料等材料制成， 在表面制 作导电线路， 一端连接对应倒装 LED芯片的 P和 N两个电极， 另一端通过摆臂 2 连接到测试电路板上， 使芯片通电后点亮， 进行测试。 电木和塑料材质的吸嘴 本体， 导电线路和导电电极制作采用的是电金属（例如金、 银、 铝或铜） 热压 方式附著， 陶瓷的吸嘴本体， 导电线路和导电电极制作采用的是高温 400 ~ 1 000 度烧结方式附著上一层电金属 （例如金、 银、 铝或铜）。
吸嘴本体还可以采用钨钢或其它金属材料制成， 利用高温 400 ~ 1 000度烧 结方式， 附著上一层绝缘介质浆料， 再上一层电金属（例如金、 银、 铝或铜）。
结合图 7所示， 吸嘴 1是安装在摆臂 2上， 利用摆臂带动移动， 抽真空气 道与抽真空装置连接， 摆臂以金属铝制成， 在摆臂上设有连接吸嘴导电线路和 测试电路板的连接线路 21 ,连接线路的制作是先将铝氧化，氧化深度超过 30画， 再以高温 350 ~ 650度烧结方式附著上一层电金属 （例如金、 银、 铝或铜）。 连 接线路与附着导电电线相比， 可以防止测试过程中， 摆臂快速移动造成导电电 线松脱的问题。
测试机的测试过程是： 倒装 LED芯片电极面朝上， 发光面朝下放置在蓝膜 上， 开始加工， 利用设置在晶片台上方的晶片相机来识别一个晶片， 并计算出 该晶片与拾取位置间的偏差， 晶片台 XY电机移动使该晶片至拾取位置；
摆臂转到拾取位置， 下方小顶针升起将芯片顶起；
摆臂下降到拾取高度， 抽真空开启， 将芯片吸取到吸嘴上， 吸嘴上的两个 导电电极分别与倒装 LED芯片的两个电极连通；
摆臂上升到安全高度， 然后转动到测试位置， 测试电路板工作， 将倒装 LED 芯片点亮， 发射出来的光射到芯片正下方的积分球孔内， 积分球将芯片射出来 的光进行计算， 得到测试数据；
机台设有一工作台， 内设有若干个区域， 每个区域用来放置不同参数范围 的倒装 LED芯片； 根据测试数据， 工作台运行到相应位置， 这时摆臂转到放置位置， 然后下 降到设定位置， 抽真空关闭， 芯片下落到工作台上， 摆臂上升， 转到预备位， 整个动作完成。 实施例 2 结合图 10、 图 11所示， 利用实施例 1的吸嘴， 对现有的测试机的结构进行 说
改进， 筒化机构， 提高测试机的测试效率。 本实施例测试倒装 LED芯片的机构包括书一转动盘 21、 一上料组件 22、 一下 料组件 23和积分球 24。 转动盘等分设置了 6个工作站 211 , 其中一个处于上料 位置， 一个处于测试位置， 一个处于下料位置， 其余处于待料位置， 工作站安 装有如实施例 1中的吸嘴 10 , 吸嘴末端朝下， 接有真空管， 带有导电电极的接 触面朝上。 倒装 LED芯片放置过来时， 朝下的两个电极， 直接跟吸嘴上的导电 电极接触， 吸嘴的导电电极与测试系统电连接。 转动盘安装在转动机构 25上， 在转动机构内部的凸轮分割器带动下旋转。 在测试位置正上方设置有用于光参数测试的积分球， 积分球其开口朝下。 测试时， 倒装 LED芯片的发光面朝上对准积分球的开口。 上料组件包括上料摆臂和吸料嘴 26 , 下料组件包括下料摆臂和吸料嘴， 分 别负责倒装 LED芯片的上料和下料。 测试机构的工作流程是倒装 LED芯片的发光面朝上， 电极面向下定位放置， 由上料组件转移到工作站的吸嘴上， 吸真空打开， 吸嘴的导电电极与倒装 LED 芯片接触， 转动盘带动工作站旋转至积分球下方启动测试， 测试系统工作使 LED 点亮， 测试系统取得该芯片的光电参数， 工作站转到下料位置， 下料组件取下 芯片完成测试工作。 6

Claims

权 利 要 求 书
1、 一种测试倒装 LED芯片的吸嘴， 包括有吸嘴本体， 在吸嘴本体内设有一 抽真空气道， 外接真空管， 在抽真空气道的一端设有紧贴倒装 LED芯片电极面 的接触面， 其特征在于： 所述的接触面上设有导电电极， 吸嘴本体上设有与导 电电极连接的导电线路， 导电电极通过导电线路连接到测试系统。
2、 根据权利要求 1所述的吸嘴， 其特征在于： 所述的导电电极的分布与倒 装 LED芯片的电极相匹配。
3、 根据权利要求 1或 2所述的吸嘴， 其特征在于： 所述的吸嘴本体采用绝 缘材料制成。
4、 根据权利要求 3所述的吸嘴， 其特征在于： 所述的吸嘴本体采 用电木、 陶瓷或塑料制成。
5、 根据权利要求 1或 2所述的吸嘴， 其特征在于： 所述的吸嘴本体采用钨 钢制成， 利用烧结方式在吸嘴本体表面先上一层绝缘介质浆料， 再上导电线路 和导电电极。
6、 一种测试倒装 LED芯片的方法， 其特征在于包括步骤： 用如权利要求 1 所述的吸嘴吸取倒装 LED芯片的电极面，使吸嘴接触面上的导电电极与倒装 LED 芯片的电极分别电连接， 转到测试位置上， 启动测试系统获取倒装 LED芯片的 光电参数。
7、 根据权处要求 6所述的测试方法， 其特征在于： 还包括在用吸嘴吸取倒 装 LED芯片前对倒装 LED芯片进行定位的步骤。
8、 一种倒装 LED芯片的测试机构， 其特征在于包括：
转动盘， 转动盘安装在转动机构上， 转动盘上设置至少 4个工作站， 工作 站安装有如权利要求 1所述的吸嘴， 吸嘴的导电电极与测试系统电连接， 转动 盘在转动机构内的凸轮分割器带动下旋转；
上料组件， 包括上料摆臂和吸料嘴， 用于将倒装 LED芯片上料到吸嘴上； 权 利 要 求 书
下料组件， 包括下料摆臂和吸料嘴， 用于将倒装 LED芯片从吸嘴上取下； 积分球， 用于收集倒装 LED芯片的发光光电参数。
9、 根据权利要求 8所述的测试机构， 其特征在于： 所述的工作站的数量是 3个、 6个、 1 2个或 24个。
1 0、 根据权利要求 8所述的测试机构， 其特征在于： 其工作流程是倒装 LED 芯片的发光面朝上， 电极面向下定位放置， 由上料组件转移到工作站的吸嘴上， 吸嘴的导电电极与倒装 LED芯片接触， 转动盘带动工作站旋转至积分球下方测 试位置启动测试， 测试系统取得该芯片的光电参数， 转动盘再带动工作站转到 下料位置， 由下料组件取下芯片完成测试工作。
PCT/CN2013/073729 2013-04-03 2013-04-03 一种测试倒装led 芯片的吸嘴、方法及测试机构 WO2014161184A1 (zh)

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