WO2014132504A1 - 加工装置および加工方法 - Google Patents
加工装置および加工方法 Download PDFInfo
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- WO2014132504A1 WO2014132504A1 PCT/JP2013/081563 JP2013081563W WO2014132504A1 WO 2014132504 A1 WO2014132504 A1 WO 2014132504A1 JP 2013081563 W JP2013081563 W JP 2013081563W WO 2014132504 A1 WO2014132504 A1 WO 2014132504A1
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- laser
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- processing
- processing apparatus
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0652—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
Definitions
- the present invention relates to a processing apparatus and a processing method for performing processing by irradiating a member to be processed with a laser.
- Patent Document 1 discloses a laser processing method for performing hole processing by irradiating a workpiece with laser beams having at least two types of wavelengths, and a first laser beam having a spot diameter smaller than the diameter of the hole.
- Patent Document 1 describes an apparatus for shifting the irradiation position of the first laser beam by combining galvanometer mirrors.
- Patent Document 2 describes a structure in which a coil is provided on a structure that holds a lens, a permanent magnet is provided on a base, and the lens is rotated by driving the coil to rotate a condensing point. ing.
- Patent Document 3 previously filed by the present applicant includes a CO 2 laser oscillator and an excimer laser oscillator, and uses a CO 2 laser beam and an excimer laser beam as two lasers, and irradiates the CO 2 laser beam.
- the processing apparatus for subsequently removing the carbonized layer or the heat-affected layer generated on the cut surface by irradiating the excimer laser beam on and near the cut surface Are listed.
- the processing apparatus described in Patent Document 3 uses an excimer laser beam as a laser beam having a ring-shaped cross section, and inserts a CO 2 laser beam into the hollow portion of the laser beam so that the optical axes of both laser beams are the same. Thereafter, it is described that both laser beams are transmitted through the same transmission path, guided to the vicinity of a cutting or drilling portion of the plastic member or FRP member, and the laser beams are separated again in the vicinity.
- JP 2011-110598 A Japanese Patent No. 2828871 Japanese Patent No. 283215
- the workpiece can be processed appropriately by turning the laser irradiation position. Moreover, like the processing apparatus described in Patent Document 3, the workpiece can be appropriately processed by using two lasers.
- the processing apparatuses described in Patent Documents 1 to 3 have a problem that the apparatus configuration needs to be complicated in order to increase the processing accuracy.
- the present invention has been made in view of the above, and an object of the present invention is to provide a processing apparatus and a processing method capable of performing processing with higher accuracy with a simple configuration.
- a processing apparatus of the present invention is a processing apparatus that performs processing by irradiating a workpiece with a laser, and the laser is applied to the workpiece.
- the control device includes at least heat of the workpiece.
- the first rotation mechanism and the second rotation mechanism are controlled based on the relationship between the allowable thickness of the sound layer and the number of rotations of the laser irradiated to the workpiece, and the first prism and the second It is characterized by adjusting the number of rotations of the prism and the difference in phase angle.
- the first rotation mechanism includes a first spindle that holds the first prism and has a hollow optical path portion of the laser, and the first spindle is rotatably inserted.
- a first hollow motor for rotating the spindle, wherein the second rotation mechanism holds the second prism and the optical path portion of the laser is hollow, and the second spindle rotates. It is preferable to have a second hollow motor that is freely inserted and rotationally drives the second spindle.
- an error of a phase angle difference between the first hollow motor and the second hollow motor is within 0.1 °.
- the processing includes at least one of cutting, drilling, welding, cladding, surface modification, surface finishing, and laser additive manufacturing.
- control device controls the allowable thickness of the heat-affected layer by controlling the number of rotations of the first prism and the second prism.
- the heat-affected layer preferably includes at least one of a remelted layer, an oxide layer, a crack, and dross.
- the workpiece is made of Inconel (registered trademark), Hastelloy (registered trademark), stainless steel, ceramic, steel, carbon steel, heat resistant steel, ceramics, silicon, titanium, tungsten, resin, plastics, It is preferably made of any material of fiber reinforced plastic, composite material, and Ni-base heat-resistant alloy.
- control device has a relationship between at least the allowable thickness of the heat-affected layer of the workpiece, the number of revolutions of the laser to be irradiated on the workpiece, and the revolution diameter of the laser. Based on this, it is preferable to control the first rotation mechanism and the second rotation mechanism to adjust the rotation speed and the phase angle difference between the first prism and the second prism.
- the processing method of the present invention is a processing method for performing processing by irradiating a workpiece with a laser, the output step of outputting a laser, Based on the relationship between the allowable thickness of the heat-affected layer of the workpiece and the number of rotations of the laser applied to the workpiece, the difference between the rotation speed and the phase angle of the first prism and the second prism is calculated.
- a determining step for determining, a rotating step for rotating the first rotating mechanism and the second rotating mechanism by the determined rotation speed and the difference in phase angle, and an irradiation step for irradiating the workpiece while rotating the laser beam It is characterized by having.
- the processing preferably includes at least one of cutting, drilling, welding, cladding, surface modification, surface finishing, and laser additive manufacturing.
- the heat-affected layer preferably includes at least one of a remelted layer, an oxide layer, a crack, and dross.
- the determining step has a relationship between at least the allowable thickness of the heat-affected layer of the workpiece, the number of revolutions of the laser irradiated on the workpiece, and the radius of the laser. Based on this, it is preferable to determine the rotational speed and the phase angle difference between the first prism and the second prism.
- the configuration is simple. There is an effect that can be done.
- by controlling the difference in phase angle between the first prism and the second prism and making the turning diameter of the laser irradiated to the workpiece variable it is possible to perform processing with a turning diameter suitable for the processing conditions. It becomes like this. As a result, the required machining quality can be satisfied, and it is possible to perform machining with higher accuracy at high speed.
- FIG. 1 is a schematic diagram illustrating a configuration example of a processing apparatus according to the first embodiment.
- FIG. 2 is an explanatory diagram showing a schematic configuration of the irradiation head according to the first embodiment.
- FIG. 3 is an enlarged schematic diagram showing an enlarged view from the laser turning portion to the nozzle of the irradiation head according to the first embodiment.
- FIG. 4 is an explanatory diagram of the irradiation position of the laser irradiated on the workpiece.
- FIG. 5 is an explanatory view of a cross section of a workpiece to be drilled.
- FIG. 6 is a flowchart illustrating an example of a control operation of the machining apparatus.
- FIG. 1 is a schematic diagram illustrating a configuration example of a processing apparatus according to the first embodiment.
- FIG. 2 is an explanatory diagram showing a schematic configuration of the irradiation head according to the first embodiment.
- FIG. 3 is an enlarged schematic diagram showing an enlarged view from the laser
- FIG. 7 is an explanatory diagram of a laser irradiation operation performed by the processing apparatus.
- FIG. 8 is a schematic diagram illustrating an example of a locus of a laser irradiated by the processing apparatus.
- FIG. 9 is a schematic diagram illustrating an example of a locus of a laser irradiated by the processing apparatus.
- FIG. 10 is a schematic diagram illustrating an example of a locus of a laser irradiated by the processing apparatus.
- FIG. 11 is a schematic diagram illustrating an example of a laser trajectory when drilling in multiple times.
- FIG. 12 is an explanatory diagram of the cutting operation by the processing apparatus.
- FIG. 13 is an explanatory diagram of a heat-affected layer of a workpiece to be cut.
- FIG. 14 is an explanatory diagram of a welding operation performed by the processing apparatus.
- FIG. 15 is an explanatory diagram of a heat-affected layer of a workpiece processed by welding.
- FIG. 16 is an explanatory diagram of the operation of the cladding process by the processing apparatus.
- FIG. 17 is an explanatory diagram of the heat-affected layer of the workpiece processed by the cladding process.
- FIG. 18 is an explanatory diagram of the operation of surface modification processing by the processing apparatus.
- FIG. 19 is an explanatory diagram of a heat-affected layer of a workpiece subjected to surface modification processing.
- FIG. 20 is an explanatory diagram showing a schematic configuration of an irradiation head according to the second embodiment.
- FIG. 1 is a schematic diagram illustrating a configuration example of a processing apparatus according to the first embodiment.
- the processing apparatus 10 includes a laser oscillator 12, a guide optical system 14, an irradiation head 16, a processing stage 20, an X-axis moving mechanism 22, a C-axis rotating mechanism 24, and a Y-axis moving.
- a mechanism 26, a Z-axis moving mechanism 28, and a control device 30 are included.
- the processing apparatus 10 includes a portal bridge 32 that surrounds the processing stage 20.
- the processing apparatus 10 processes the workpiece W by irradiating the workpiece W held on the processing stage 20 with a laser.
- the horizontal plane of the processing stage 20 is the XY plane
- the direction orthogonal to the horizontal plane of the processing stage 20 is the Z-axis direction.
- the rotation direction around the Z axis is the C axis direction.
- the workpiece W is, for example, a plate-like member.
- various materials such as Inconel (registered trademark), Hastelloy (registered trademark), stainless steel, ceramic, steel, carbon steel, heat resistant steel, ceramics, silicon, titanium, tungsten, resin, plastics, A member made of a Ni-base heat-resistant alloy or the like can be used.
- carbon fiber reinforced plastic CFRP: Carbon Fiber Reinforced Plastics
- GFRP Glass Fiber Reinforced Plastics
- GTT Glass-mat Reinforced Thermoplastics
- the processing is any one of cutting, drilling, welding, cladding, surface modification, surface finishing, and laser additive manufacturing, and these processes can be combined. .
- the laser oscillator 12 is a device that outputs a laser, and is attached to the portal bridge 32 of the processing device 10.
- a fiber laser output device that outputs a laser using an optical fiber as a medium, or a short pulse laser output device that outputs a short pulse laser is used.
- a fiber laser output device for example, a Fabry-Perot type fiber laser output device or a ring type fiber laser output device can be used, and the laser is oscillated when these output devices are excited.
- silica glass to which a rare earth element such as erbium (Er), neodymium (Nd), ytterbium (Yb) is added can be used.
- a titanium sapphire laser can be used as a laser oscillation source, and a pulse having a pulse width of 100 picoseconds or less can be oscillated.
- a laser that oscillates in nanosecond order pulses such as a YAG laser or a YVO4 laser, can also be used.
- the guide optical system 14 is an optical system that guides the laser output from the laser oscillator 12 to the irradiation head 16.
- the guide optical system 14 is an optical fiber, for example.
- the guide optical system 14 has one end connected to the laser emission port of the laser oscillator 12 and the other end connected to the laser incident end of the irradiation head 16.
- the guide optical system 14 guides the laser from the laser emission port of the laser oscillator 12 to the incident end of the irradiation head 16.
- the irradiation head 16 irradiates the workpiece W while turning the laser guided by the guide optical system 14. Further, the irradiation head 16 offsets the laser light path before refraction and the laser light path irradiated to the workpiece W by refracting the laser with a prism. Further, the irradiation head 16 focuses the laser and irradiates the workpiece W. The irradiation head 16 is covered with an irradiation head cover 16a. The structure of the irradiation head 16 will be described later.
- the processing stage 20 is a mechanism that holds the workpiece W placed on the surface.
- the surface holding the workpiece W is a horizontal plane (XY plane) with respect to a reference plane (for example, an installation surface of the processing apparatus 10).
- the X-axis moving mechanism 22 is an X-axis stage that supports the processing stage 20, and moves the workpiece W to a predetermined position in the X-axis direction by moving the processing stage 20 in the X-axis direction.
- the C-axis rotation mechanism 24 is disposed between the X-axis movement mechanism 22 and the processing stage 20. That is, the C-axis rotating mechanism 24 is supported by the X-axis moving mechanism 22 and supports the processing stage 20. The C-axis rotating mechanism 24 rotates the workpiece W to a predetermined position in the C-axis direction by rotationally driving the processing stage 20 in the C-axis direction.
- the Y-axis moving mechanism 26 moves the irradiation head 16 in the Y-axis direction while supporting the Z-axis moving mechanism 28. Thereby, the Y-axis moving mechanism 26 moves the irradiation head 16 to a predetermined position in the Y-axis direction.
- the Z-axis moving mechanism 28 moves the irradiation head 16 to a predetermined position in the Z-axis direction while supporting the irradiation head 16.
- the processing apparatus 10 uses an X-axis movement mechanism 22, a C-axis rotation mechanism 24, a Y-axis movement mechanism 26, and a Z-axis movement mechanism 28, and uses an X-axis direction, a Y-axis direction, a Z-axis direction, By relatively moving the processing stage 20 and the irradiation head 16 in the four axial directions, the relative positional relationship between the workpiece W and the laser is moved in the four axial directions.
- the control device 30 is connected to the laser oscillator 12, the irradiation head 16, the X-axis moving mechanism 22, the C-axis rotating mechanism 24, the Y-axis moving mechanism 26, and the Z-axis moving mechanism 28, and controls the operation of each part. For example, the control device 30 adjusts various conditions of the laser output from the laser oscillator 12 or uses an X-axis moving mechanism 22, a C-axis rotating mechanism 24, a Y-axis moving mechanism 26, and a Z-axis moving mechanism 28 to irradiate the irradiation head.
- the 16 and the processing stage 20 are moved to adjust the position of the irradiation head 16 with respect to the workpiece W, and the allowable thickness of the heat-affected layer is detected from the conditions (material, thickness, etc.) of the workpiece W and the processing conditions. Or the number of turns and the turning radius R, which will be described later, of the laser irradiated to the workpiece W from the irradiation head 16 are controlled.
- FIG. 2 is an explanatory diagram showing a schematic configuration of the irradiation head according to the first embodiment.
- FIG. 3 is an enlarged schematic diagram showing an enlarged view from the laser turning portion to the nozzle of the irradiation head according to the first embodiment.
- FIG. 4 is an explanatory diagram of the irradiation position of the laser irradiated on the workpiece.
- the irradiation head 16 includes a collimating optical system 34, a laser turning unit 35, a reflecting optical system 36, a condensing optical system 37, a nozzle 38, an indexing mechanism 39, and an imaging unit 40. And a gap detection means 41.
- the irradiation head 16 includes a collimating optical system 34, a laser turning unit 35, a reflecting optical system 36, a condensing optical system 37, and a nozzle from the upstream side toward the downstream side in the optical path of the laser L output from the guide optical system 14. They are arranged in the order of 38.
- the irradiation head 16 irradiates the laser beam L output from the guide optical system 14 toward the workpiece W facing the nozzle 38.
- the collimating optical system 34 is disposed so as to face the end face from which the laser L of the guide optical system 14 is emitted. That is, the collimating optical system 34 is disposed between the guide optical system 14 and the laser turning unit 35.
- the collimating optical system 34 includes a collimator lens or the like, and uses the laser L output from the guide optical system 14 as collimated light and emits the laser L toward the laser turning unit 35.
- the laser turning unit 35 rotates the laser L around the center P of the optical path, and turns the irradiation laser on the workpiece W, that is, the irradiation position IP of the laser L.
- the laser swivel unit 35 includes a first prism 51, a second prism 52, a first rotation mechanism 53, and a second rotation mechanism 54.
- the first prism 51 refracts the laser L and tilts it with respect to the optical axis OA.
- the second prism 52 controls the position where the laser L refracted by the first prism 51 is refracted again and condensed. As a result, the laser L that has passed through the laser swivel unit 35 is output in an optical path that is deviated from the optical path of the laser L before passing through.
- the first rotation mechanism 53 includes a first spindle 55 that holds the first prism 51, and a first hollow motor 56 that is inserted into the first spindle 55 and rotates the first spindle 55.
- the second rotation mechanism 54 includes a second spindle 57 that holds the second prism 52, and a second hollow motor 58 that is inserted into the second spindle 57 and rotates the second spindle 57.
- the first spindle 55 and the second spindle 57 are cylindrical members having a hollow optical path of the laser L, and are supported via a bearing 59 and a bearing 60.
- the bearing 59 and the bearing 60 are rolling bearings such as rolling ball bearings, for example.
- the first rotation mechanism 53 and the second rotation mechanism 54 are capable of synchronous rotation and relative rotation.
- the first hollow motor 56 has a hollow rotor 61 fixed to the outer peripheral surface of the first spindle 55, and a stator 62 disposed to face the hollow rotor 61.
- the first hollow motor 56 rotates the first prism 51 together with the first spindle 55.
- the second hollow motor 58 includes a hollow rotor 63 fixed to the outer peripheral surface of the second spindle 57 and a stator 64 disposed so as to face the hollow rotor 63.
- the second hollow motor 58 rotates the second prism 52 together with the second spindle 57.
- the first rotating mechanism 53 and the second rotating mechanism 54 are respectively composed of a rotating part (first spindle 55 and hollow rotor 61, second spindle 57 and hollow rotor 63) and a fixing part (stator 62, stator 64).
- An encoder 65 for detecting the relative position and the rotational speed is provided.
- the encoder 65 includes an identifier 66 that is fixed to the rotating unit side, and a detection unit 67 that is fixed to the fixed unit side and detects the identifier 66.
- the encoder 65 can detect the relative position of the rotating unit by detecting the identifier 66 by the detecting unit 67.
- the encoder 65 outputs the detected information on the rotational speed and rotational position (phase angle) of the rotating unit to the control device 30.
- the encoder 65 for example, it is preferable to use a detection device that detects the rotational position (phase angle) with a resolution of several thousandths (0.001 degrees or less).
- the first rotation mechanism 53 and the second rotation mechanism 54 can change the phase angle difference between the first prism 51 and the second prism 52.
- the laser irradiation point is irradiated from the center P of the optical path of the rotation axis by a distance corresponding to the phase angle difference between the first prism 51 and the second prism 52 (turning radius R). Eccentricity can be achieved up to the position IP.
- the laser irradiation point is the turning radius R. Draw a circular orbit.
- the laser irradiation point can be rotated while increasing or decreasing the turning diameter of the laser irradiation point. It is also possible to draw a trajectory.
- the difference in phase angle between the first hollow motor 56 and the second hollow motor 58 is the relative rotational position (phase angle) between the first hollow motor 56 and the second hollow motor 58. This is the angle of deviation.
- the error in the phase angle difference between the first hollow motor 56 and the second hollow motor 58 refers to an error in the phase shift angle between the first hollow motor 56 and the second hollow motor 58.
- the turning radius R means a distance from the center P of the optical path to the irradiation position IP of the laser L irradiated to the workpiece W. This is the radius at which the irradiated laser L turns around the center P.
- the turning radius R is variable because the turning radius R of the laser L irradiated to the workpiece W is changed by changing the phase angle difference between the first prism 51 and the second prism 52.
- the number of turns refers to the number of times per unit time that the irradiation position IP of the laser L irradiated to the workpiece W turns around the center P.
- the reflection optical system 36 includes a first reflection mirror 71 that reflects the laser L that has passed through the laser turning section 35, and a first reflection mirror 71 that reflects the laser L reflected by the first reflection mirror 71 again. It has a two-reflection mirror 72, a cylinder part 73, and a nozzle mounting part 74.
- the reflection optical system 36 reflects the laser L output from the laser turning unit 35 toward the condensing optical system 37 by the first reflection mirror 71 and the second reflection mirror 72.
- the second reflection mirror 72 is a half mirror, and allows the imaging unit 40 to image the processed part of the workpiece W.
- the cylinder part 73 and the nozzle mounting part 74 are connected by a joint part 75.
- the condensing optical system 37 has a plurality of lenses, and the laser L reflected by the second reflecting mirror 72 is collected by the plurality of lenses, and the laser L having a predetermined focal length and focal depth is collected. Form.
- the condensing optical system 37 irradiates the workpiece W with a laser L having a predetermined spot diameter.
- the nozzle 38 has a hollow conical shape whose diameter gradually decreases toward the front side in the traveling direction of the laser L.
- the nozzle 38 is mounted on the nozzle mounting portion 74 via the condensing optical system 37.
- the nozzle 38 has a translucent member 77 for preventing the condensing optical system 37 from being contaminated by sputtering or the like generated at the processing point of the workpiece W.
- the nozzle 38 is supplied with an assist gas from an assist gas supply source 78 and can inject the assist gas toward the workpiece W.
- the indexing mechanism 39 has an indexing shaft 81, a hollow motor 82, and an indexing angle detecting means 83.
- the index shaft 81 is connected to the nozzle mounting portion 74 and rotates integrally with the nozzle mounting portion 74.
- the index shaft 81 is supported by a bearing 84 so as to be rotatable around the Y axis.
- the bearing 84 is, for example, a static pressure bearing (fluid bearing).
- the hollow motor 82 includes a hollow rotor 85 fixed to the outer peripheral surface of the indexing shaft 81 and a stator 86 disposed to face the hollow rotor 85.
- the hollow motor 82 drives the nozzle 38 mounted on the nozzle mounting portion 74 around the indexing shaft 81 (in the direction of the arrow d) so as to swing around the indexing shaft 81 as a rotation center. That is, the hollow motor 82 drives the nozzle 38 so as to be able to swing around the Y axis.
- the indexing mechanism 39 rotates the nozzle mounting portion 74 of the reflective optical system 36 around the indexing shaft 81 as the center of rotation, and the second reflection disposed coaxially with the indexing shaft 81 with this rotation. Since the mirror 72 can be rotated, the laser L reflected by the second reflecting mirror 72 can be emitted from the nozzle 38 even if the indexing angle is changed.
- the index angle detection means 83 includes an encoder that detects a relative position (index angle) between the rotating portion (index shaft 81 and hollow rotor 85) and the fixed portion (stator 86). The encoder outputs information of the detected index angle of the rotating unit to the control device 30.
- the imaging means 40 is, for example, a camera having a CCD (Charge Coupled Device) image sensor or the like.
- the imaging unit 40 images the irradiation position IP of the laser L, the turning radius R, and the like, generates image data from the captured image, and outputs the image data to the control device 30.
- the imaging means 40 is mounted on the nozzle mounting portion 74 at a position facing the nozzle 38 with the nozzle mounting portion 74 interposed therebetween.
- the imaging means 40 is arranged coaxially with the center P of the optical path.
- the gap detection means 41 is a gap measuring device using laser light.
- the gap detector 41 detects a gap between the focal point of the laser L irradiated to the workpiece W and the workpiece W.
- the gap detection unit 41 outputs the detected gap to the control device 30.
- the gap detection means 41 is connected to the imaging means 40 and is arranged coaxially with the center P of the optical path.
- FIG. 5 is an explanatory view of a cross section of a workpiece to be drilled.
- FIG. 6 is a flowchart illustrating an example of a control operation of the machining apparatus.
- the processing apparatus 10 determines a processing mode as shown in FIG. 6 (step ST1).
- the processing device 10 performs any of cutting, drilling, welding, cladding, surface modification, surface finishing, and laser additive manufacturing, which are input by an operator or other operator.
- An operation indicating whether to execute is confirmed, and a processing mode is determined based on the confirmed operation.
- the processing apparatus 10 determines the material and thickness of the workpiece W (step ST2). For example, the processing device 10 (the control device 30) confirms an operation of inputting the material and thickness of the workpiece W input by the worker, and based on the confirmed operation, the material and thickness of the workpiece W To decide.
- the processing device 10 determines the processing conditions (step ST3). For example, the processing device 10 (the control device 30) inputs the processing conditions such as the position, shape, and depth of processing performed on the workpiece W in the processing mode determined in step ST1 input by the worker. Then, based on the confirmed operation, processing conditions such as the position, shape, and depth of the processing performed on the workpiece W are determined.
- the processing apparatus 10 determines the allowable thickness of the heat affected layer Wa (see FIG. 5) (step ST4).
- the processing device 10 acquires the processing mode determined in step ST1, the material and thickness of the workpiece W determined in step ST2, and the processing conditions determined in step ST3, respectively.
- the allowable thickness of the heat-affected layer Wa is determined with reference to a control map (processing condition control map) that defines the correlation between the material and thickness of the workpiece W, the processing conditions, and the allowable thickness of the heat-affected layer Wa.
- the processing device 10 determines the allowable number of turns and the allowable turning diameter of the laser L (step ST5). For example, the processing apparatus 10 (the control apparatus 30), based on the allowable thickness of the heat affected layer Wa determined in step ST4, the thickness TH (see FIG. 5) of the heat affected layer Wa, the number of turns of the laser L, and the turn diameter R. Is determined with reference to a control map (swivel condition control map) that defines the correlation between the allowable number of revolutions of the laser L and the allowable diameter range of the laser L so that the thickness TH of the heat-affected layer Wa does not exceed the allowable thickness.
- the turning radius R is not essential, so only the number of turns may be determined.
- the processing device 10 determines the difference between the rotation speed and the phase angle of the first prism 51 and the second prism 52 (step ST6). For example, the processing device 10 (the control device 30) determines the number of turns included in the allowable number of turns of the laser L determined in step ST5 as the number of rotations of the first prism 51 and the second prism 52, and turns the laser L. Referring to a control map (phase angle control map) that defines the correlation between the diameter R and the difference in phase angle between the first prism 51 and the second prism 52, it is included in the allowable turning radius range of the laser L determined in step ST5. The phase angle difference to be determined is determined as the phase angle difference between the first prism 51 and the second prism 52.
- a control map phase angle control map
- the processing apparatus 10 determines the laser output (step ST7).
- the processing device 10 acquires the allowable thickness of the heat affected layer Wa determined in step ST4, and determines a correlation between the thickness TH of the heat affected layer Wa and the output of the laser L ( With reference to the laser output control map), the peak output and pulse width of the laser L are selected, and the laser output is determined.
- the processing device 10 performs processing on the workpiece W (step ST8).
- the processing device 10 (the control device 30) oscillates the laser oscillator 12 based on the laser output determined in step ST7 and emits the laser L, and at the same time, determines the difference between the rotational speed and the phase angle determined in step ST6.
- the rotation of the first hollow motor 56 and the second hollow motor 58 is adjusted, the workpiece L is irradiated with the laser L, and the machining is executed.
- the processing apparatus 10 (control apparatus 30) performs the processing on the workpiece W by the above-described steps ST1 to ST8.
- step ST8 when the machining mode determined in step ST1 is drilling, in step ST8, the laser L emitted from the laser oscillator 12 enters the incident end of the irradiation head 16 via the guide optical system 14, and FIG. 4 and FIG. 5, the first prism 51 and the second prism 52 that rotate in the direction of the arrow a are refracted by the difference between the rotational speed and the phase angle determined in step ST6, and the laser L before refraction is reflected. Irradiation is performed at a position eccentric from the center P of the optical path coaxial with the optical axis OA.
- the laser irradiation point turns around the optical path center P of the rotation axis that is coaxial with the optical axis OA of the laser L before refraction. Then, the irradiation position IP of the laser L moves on the virtual circle IC having the center P as the center of rotation, and a hole Wb is made in the workpiece W.
- the hole diameter is almost determined by the set value.
- the turning radius R in addition to the number of turnings to control the amount of scattered matter on the heat-affected layer Wa and the front and back surfaces.
- FIG. 7 is an explanatory diagram of a laser irradiation operation performed by the processing apparatus.
- FIG. 8 is a schematic diagram illustrating an example of a locus of a laser irradiated by the processing apparatus.
- FIG. 9 is a schematic diagram illustrating an example of a locus of a laser irradiated by the processing apparatus.
- FIG. 10 is a schematic diagram illustrating an example of a locus of a laser irradiated by the processing apparatus.
- FIG. 11 is a schematic diagram illustrating an example of a laser trajectory when drilling in multiple times.
- the processing apparatus 10 sets the ON / OFF cycle of the laser L to the non-rotation cycle of the irradiation position IP.
- An integer multiple is preferable. That is, the processing apparatus 10 irradiates the irradiation position IPa with the laser L in the first round and the laser L in the second round by shifting the ON / OFF period of the laser L and the turning period of the irradiation position IP.
- the position IPb can be irradiated. That is, the processing apparatus 10 can sequentially shift the irradiation position by repeating ON / OFF of the laser L in the third and subsequent rounds. Thereby, the processing apparatus 10 can irradiate the laser L efficiently to the region to be processed of the workpiece W by shifting the irradiation position of the laser L in each round.
- the processing apparatus 10 can process with high precision also to the to-be-processed member W which has the thickness which becomes difficult for the laser L to enter by irradiating the laser L in a spiral shape.
- the processing apparatus 10 can also irradiate the workpiece W with the laser L along an elliptical or heart-shaped trajectory TR. That is, the processing apparatus 10 continuously changes the phase angle difference between the first prism 51 and the second prism 52 while rotating the first prism 51 and the second prism 52, thereby changing the turning radius R of the laser L.
- the workpiece W can be irradiated with the laser L along various trajectories TR.
- the processing apparatus 10 can irradiate the workpiece W with the laser L along the trajectory TR having various shapes by controlling the rotation and the phase angle difference between the first prism 51 and the second prism 52. .
- the processing apparatus 10 irradiates the workpiece W with the laser L with a circular trajectory TRa smaller than the hole diameter of the target hole to be drilled in the first round, and the target to drill in the second round.
- the workpiece W is irradiated with the laser L along a circular trajectory TRb having the same size as the hole diameter.
- the turning radius Ra of the laser L in the first round is set to be smaller than the target hole, and the turning radius Rb of the laser L in the second round is calculated from a theoretical optical value for turning the target hole.
- the turning diameter is corrected so that the thickness TH of the heat-affected layer Wa is within the allowable thickness range in the target hole later.
- the heat spread is increased in the first round when the laser beam L is first irradiated to the workpiece W, but the processing apparatus 10 suppresses the heat spread by making a hole smaller than the target hole in the first round.
- the target hole can be drilled. That is, since the processing apparatus 10 can perform rough processing in the first round and finish processing in the second round, processing can be performed with high accuracy.
- the machining apparatus 10 performs drilling by irradiating the workpiece W with the laser L with a turning radius R that is the same as the hole diameter of the target hole.
- the machining time can be shortened compared to the case where the mechanism 22, the Y-axis moving mechanism 26, and the C-axis rotating mechanism 24 are driven to perform drilling.
- the processing apparatus 10 sets the error of the phase angle difference between the first hollow motor 56 and the second hollow motor 58 to be within 0.1 °. That is, it is preferable that the processing apparatus 10 sets the error of the phase angle difference between the first prism 51 and the second prism 52 to be within 0.1 °.
- the control device 30 includes the first prism 51 determined in step ST6 described above based on the rotation speed and rotation position (phase angle) of the first spindle 55 and the second spindle 57 output from the encoder 65. The error of the phase angle difference from the second prism 52 is set to within 0.1 °.
- the processing apparatus 10 is based on the optical characteristic of the 1st prism 51 and the 2nd prism 52, the shift
- the laser L can be irradiated for processing.
- the processing apparatus 10 preferably rotates the first prism 51 and the second prism 52 at 20 rpm or more when the output frequency of the laser L is less than 1 kHz, and the first prism 51 when the output frequency of the laser L is 1 kHz or more. It is preferable to rotate the second prism 52 at 200 rpm or more. That is, the processing apparatus 10 preferably sets the number of revolutions of the laser L irradiated to the workpiece W to 20 rpm or more when the output frequency of the laser L is less than 1 kHz, and 200 rpm or more when the output frequency of the laser L is 1 kHz or more. It is preferable to do.
- the processing apparatus 10 can perform the processing at a higher speed by adjusting the rotational speeds of the first prism 51 and the second prism 52 in accordance with the output frequency of the laser L, and further improve the processing accuracy. It can. That is, when the output frequency of the laser L is relatively high, the processing apparatus 10 relatively rotates the laser L at a high speed because the energy of the laser L applied to the workpiece W is relatively high. When the output frequency of the laser L is relatively low, the energy of the laser L applied to the workpiece W is relatively low, so that the laser L is rotated relatively slowly.
- the processing apparatus 10 can easily control the thickness TH of the heat-affected layer Wa, and the processing accuracy can be increased. Further, by rotating the laser L irradiated to the workpiece W at a relatively high speed, even if the laser L is output at a relatively high power, the thermal influence (the influence of thermal damage) is suppressed, and the heat affected layer Wa The processing speed can be increased while suppressing the thickness TH and maintaining the processing quality.
- the processing apparatus 10 uses a metal material such as a steel plate as the workpiece W, so that cutting, drilling, welding, cladding, surface modification, surface finishing, or laser lamination modeling is preferably performed. And the cut surface can be made into a more suitable shape. Thereby, the processing apparatus 10 can make processing precision high. Further, since the processing apparatus 10 can suppress the output of the laser L from being concentrated on a part by irradiating the laser L while turning, the high-power laser L can be used. Therefore, it can be suitably used for welding and cladding, and can also be suitably used for materials having high heat resistance.
- the processing apparatus 10 rotates the first rotation mechanism 53 with the first hollow motor 56 and rotates the second rotation mechanism 54 with the second hollow motor 58, the first hollow motor 56 and the second hollow motor 56 are driven. Since the radial direction of the motor 58 can be reduced, the irradiation head 16 can be reduced in size. That is, the enlargement of the processing apparatus 10 can be suppressed.
- control device 30 determines the number of rotations of the first rotation mechanism 53 and the second rotation mechanism 54, thereby processing the workpiece W while setting the thickness TH of the heat-affected layer Wa to an allowable thickness or less. can do.
- FIG. 12 is an explanatory diagram of the cutting operation by the processing apparatus.
- FIG. 13 is an explanatory diagram of a heat-affected layer of a workpiece to be cut.
- FIG. 14 is an explanatory diagram of a welding operation performed by the processing apparatus.
- FIG. 15 is an explanatory diagram of a heat-affected layer of a workpiece processed by welding.
- FIG. 16 is an explanatory diagram of the operation of the cladding process by the processing apparatus.
- FIG. 17 is an explanatory diagram of the heat-affected layer of the workpiece processed by the cladding process.
- FIG. 18 is an explanatory diagram of the operation of surface modification processing by the processing apparatus.
- FIG. 19 is an explanatory diagram of a heat-affected layer of a workpiece subjected to surface modification processing.
- the processing apparatus 10 scans the irradiation head 16 in the direction of arrow b, which is an arbitrary direction in the XY plane (horizontal plane), as shown in FIGS. 12 and 13. It is possible to irradiate in the direction of the arrow b while turning the laser L like TR, and to suppress the thickness TH of the heat affected layer Wa to an allowable thickness or less. Thereby, the processing apparatus 10 can irradiate the workpiece W with the irradiation width D with the laser L and cut the workpiece W with the irradiation width D.
- the processing apparatus 10 controls the number of revolutions of the laser L applied to the workpiece W by controlling the number of rotations of the first prism 51 and the second prism 52, and the thickness TH of the heat affected layer Wa is controlled.
- the allowable thickness can be controlled.
- the processing apparatus 10 irradiates the laser L while scanning the irradiation head 16 in the arrow b direction (any direction in the XY plane) as shown in FIGS. 14 and 15.
- the processing apparatus 10 can weld one to-be-processed member W1 which is groove shape, such as I shape, and the other to-be-processed member W2 by the welding part Wc, for example.
- the processing apparatus 10 controls the rotational speed of the first prism 51 and the second prism 52, thereby turning the laser L irradiated to the groove between the one processed member W1 and the other processed member W2.
- the allowable thickness of the thickness TH of the heat-affected layer Wa can be controlled by controlling the number.
- the processing apparatus 10 scans the irradiation head 16 in the arrow b direction (any direction in the XY plane) as shown in FIGS. 16 and 17.
- the processing apparatus 10 can form the build-up portion Wd on the workpiece W.
- the processing apparatus 10 controls the number of revolutions of the laser L applied to the workpiece W by controlling the number of rotations of the first prism 51 and the second prism 52, and the thickness TH of the heat affected layer Wa is controlled. The allowable thickness can be controlled.
- the processing apparatus 10 scans the irradiation head 16 in the arrow b direction (any direction in the XY plane) as shown in FIGS. 18 and 19, Irradiate in the direction of arrow b while turning the laser L as shown by the trajectory TR. Thereby, the processing apparatus 10 irradiates the workpiece W with the irradiation width Da, for example, to smooth the surface of the workpiece W or to refine the material particles on the surface of the workpiece W. In other words, the surface modified portion We can be formed by modifying the surface of the workpiece W.
- the processing apparatus 10 controls the number of revolutions of the laser L applied to the workpiece W by controlling the number of rotations of the first prism 51 and the second prism 52, and the thickness TH of the heat affected layer Wa is controlled.
- the allowable thickness can be controlled.
- the heat-affected layer Wa of the workpiece W includes at least one of a remelted layer, an oxide layer, a crack, and dross formed by the laser L irradiated to the workpiece W.
- the remelted layer is a layer in which the solid of the workpiece W is liquefied by the irradiation of the laser L during processing and is solidified again.
- the remelted layer differs depending on the processing mode, in the case of drilling or cutting, the remelted layer is not a layer formed at the tip of the laser L irradiation direction (traveling direction), but is orthogonal to the laser L irradiation direction (traveling direction).
- the remelted layer has a direction orthogonal to the irradiation direction (traveling direction) of the laser L when the processing mode is welding, cladding, surface modification, surface finishing, or laser additive manufacturing. Formed on the periphery of the welded portion Wc formed by irradiating the laser L, the periphery of the welded portion Wd, the periphery of the welded portion Wd, the region below and the surface modified portion We It is what is done.
- the oxidized layer is an oxide film formed on the inner peripheral surface or cut surface of the hole Wb of the workpiece W when oxygen is used as the assist gas when the workpiece W is a metal or the like.
- the crack is a fine crack (micro crack) generated on the inner peripheral surface or the cut surface of the hole Wb of the workpiece W during the rapid heating of the workpiece W by the laser L irradiation.
- the dross is a deposit that is solidified by adhering to the inner peripheral surface or the cut surface of the hole Wb of the workpiece W as a molten material that has been liquefied when drilling or cutting the workpiece W. is there.
- the thickness of the heat-affected layer Wa of the workpiece W includes the thickness of the remelted layer, the thickness of the oxide film, the depth of cracks, and the thickness of deposits.
- the permissible thickness is determined when the workpiece W is subjected to processing including at least one of cutting processing, drilling processing, welding processing, cladding processing, surface modification processing, surface finishing processing, and laser additive manufacturing.
- the thickness TH of the heat-affected layer Wa of the inner peripheral surface, the cut portion and the welded portion Wc, the thickness TH of the heat-affected layer Wa of the build-up portion Wd and the surface modified portion We, etc., as a processed product The thickness is within a range that is acceptable for the workpiece W.
- the allowable thickness varies depending on the processing mode, but in the case of drilling or cutting, the allowable thickness is a length in a direction orthogonal to the irradiation direction (traveling direction) of the laser L.
- the allowable thickness is the length in the irradiation direction (traveling direction) of the laser L and the irradiation of the laser L when the processing mode is welding, cladding, surface modification, surface finishing, or laser additive manufacturing. It is the length in the direction orthogonal to the direction.
- FIG. 20 is an explanatory diagram showing a schematic configuration of an irradiation head according to the second embodiment. Since the basic configuration of the irradiation head 16 according to the second embodiment is the same as that of the irradiation head 16 of the processing apparatus 10 according to the first embodiment, description of the configuration of the same portion is omitted.
- the optical paths of the lasers L of the collimating optical system 34, the laser swivel unit 35, and the condensing optical system 37 are integrally connected in a straight line (coaxial).
- the irradiation head 16 includes a collimating optical system 34, a laser turning unit 35, a condensing optical system 37, and a nozzle 38.
- the irradiation head 16 is arranged in the order of the collimating optical system 34, the laser turning portion 35, the condensing optical system 37, and the nozzle 38 from the upstream side to the downstream side in the optical path of the laser L output from the guide optical system 14. Is done.
- the irradiation head 16 irradiates the workpiece L disposed at a position facing the nozzle 38 with the laser L output from the guide optical system 14.
- the laser turning unit 35 is rotationally driven by the first rotating mechanism 53 and is driven by the hollow cylindrical first spindle 55 that supports the first prism 51 and the second rotating mechanism 54 to support the second prism 52. And a hollow cylindrical second spindle 57.
- the irradiation head 16 rotates the laser L around the center P of the optical path to rotate the irradiation position IP of the laser L irradiated to the workpiece W.
- the irradiation head 16 irradiates the workpiece W by controlling the number of rotations of the first rotation mechanism 53 and the second rotation mechanism 54 and the phase angle difference between the first prism 51 and the second prism 52.
- the turning diameter R, the number of turns, the trajectory TR, etc. of the laser L can be changed in accordance with the machining mode.
- FIG. 21 is a diagram illustrating a processing example of a member to be processed by the processing apparatus.
- 22 is a view of the workpiece shown in FIG. 21 as viewed from the opposite side.
- the laser L irradiating the workpiece W has a laser peak power of 100 W to 20 kW, a frequency of 5 Hz to 10 kHz, a pulse width of 1 ⁇ s to 100 ms, an irradiation time of 10 ms to 10 S, a focal length of 40 to 400 mm, and a rotation number of 20 ⁇ 5000 rpm.
- the assist gas is oxygen having a pressure of 0.1 to 1 MPa, but may be air or nitrogen, or may be a rare gas such as argon gas (Ar) or xenon gas (Xe).
- Ar argon gas
- Xe xenon gas
- FIGS. 21 and 22 show the results of processing by the processing apparatus 10 under the above conditions.
- FIG. 21 shows the front surface (laser incident side) of the workpiece W
- FIG. 22 shows the back surface of the workpiece W.
- a hole Wb was formed in the workpiece W. It was found that the processing apparatus 10 was processed with high accuracy by performing processing under the above conditions, even when the laser irradiation time was 0.2 S, with less distortion and unevenness around the hole Wb.
- the turning diameter R of the laser L irradiated to the workpiece W can be simply changed by changing the phase angle difference between the first prism 51 and the second prism 52. Therefore, there is an effect that the processing apparatus 10, that is, the laser processing apparatus can be made simple and compact. Further, by controlling the difference in phase angle between the first prism 51 and the second prism 52 and changing the turning radius R of the laser L irradiated to the workpiece W, the turning radius suitable for the processing mode and processing conditions is changed. Processing can be performed with R. As a result, the required processing quality can be satisfied, and it is possible to perform processing with higher accuracy at high speed.
- the first prism 51 and the second prism 52 are controlled separately, so that the turning radius R of the laser L irradiated to the workpiece W can be set to an arbitrary turning radius R. Can be set to That is, the processing apparatus 10 can irradiate the workpiece W with the laser L suitable for the type of processing (processing mode).
- the control device 30 controls the rotation speeds of the first prism 51 and the second prism 52 so that the thickness TH of the heat affected layer Wa is controlled to be an allowable thickness. Therefore, the heat-affected layer Wa of the workpiece W can be controlled. Therefore, the processing apparatus 10 can perform processing on the workpiece W with high accuracy.
- the processing device 10 uses a fiber laser output device or a short pulse laser output device.
- the processing device 10 is not limited to this, and the laser L capable of processing the workpiece W is processed. Any laser output device may be used.
- the processing apparatus 10 can utilize various laser output apparatuses, and can use a laser output apparatus suitable for the processing application.
- the fiber laser output device may be a laser output device that uses either a continuous wave operation method or a pulsed operation method.
- the fiber laser output device can easily be used for cutting and welding because it is easy to obtain a high output in the case of continuous wave oscillation. In the case of pulse oscillation, it is easy to suppress the thermal influence. It can be suitably used for processing and the like.
- the light intensity distribution of the cross section of the laser L irradiated to the workpiece W may be Gaussian mode (single mode) or multimode.
- the fiber laser output device can be suitably used for welding processing, cutting processing, and extremely fine drilling because it is easy to narrow down the spot diameter at the irradiation position IP and easily obtain a high output in the case of the Gaussian mode.
- the multi-mode it is easy to suppress the thermal influence on the base material, so that it can be suitably used for surface modification processing, surface finishing processing, brazing processing, and the like.
- the processing apparatus 10 processes the plate-shaped to-be-processed member W
- the shape of the to-be-processed member W is not specifically limited, It can be set as various shapes.
- the processing apparatus 10 may perform processing on the workpiece W by combining cutting processing, drilling processing, welding processing, cladding processing, surface modification processing, surface finishing processing, and laser additive manufacturing.
- the processing apparatus 10 can irradiate with a trajectory TR having a bending point or irradiate with a trajectory TR having a curved shape by controlling the irradiation position IP of the laser L.
- the processing apparatus 10 can perform various types of processing for irradiating the workpiece W while turning the laser L.
- the processing apparatus 10 can increase the processing accuracy, it is preferable to use a metal material such as a steel plate as the workpiece W.
- the processing device 10 is not limited to this, and Inconel (registered trademark) is used as the workpiece W. ), Hastelloy (registered trademark), stainless steel, ceramic, steel, carbon steel, ceramics, silicon, titanium, tungsten, resin, plastics, fiber reinforced plastic, composite material, Ni-base heat-resistant alloy It only has to be done.
- the processing apparatus 10 can reduce or remove the thermal influence (the influence of thermal damage), it can be used for various materials and composites that need to be processed by reducing or removing the thermal influence. Thereby, the processing apparatus 10 can process a various material.
- the processing apparatus 10 may move the workpiece W or the irradiation head 16 in order to move the relative position between the irradiation position IP of the laser L and the workpiece W.
- the processing member W and the irradiation head 16 may be moved. Thereby, the processing apparatus 10 can process the workpiece W at a higher speed.
- the processing apparatus 10 which changes the turning diameter R of the said laser while turning the laser L on the to-be-processed member W was demonstrated, the processing apparatus 10 is the turning diameter R of the laser L irradiated. If the rotation speed of the first prism 51 and the second prism 52 is controlled so that the moving speed of the irradiation position IP of the turning laser (for example, the linear speed on the virtual circle IC) is constant, Good. Thereby, the processing apparatus 10 can make the energy per unit time constant at the irradiation position IP of the laser L irradiated to the workpiece W.
- the processing apparatus 10 images the pilot hole drilled in the workpiece W with the imaging means 40, measures the hole diameter from the image data of the captured pilot hole, and the conditions of the measured hole diameter and the irradiated laser L (
- the thickness TH of the heat-affected layer Wa is estimated from the peak output, pulse width, swirling number, swirling diameter R, etc.), and the laser falls within the allowable thickness range of the heat-affected layer Wa from the estimated thickness TH of the heat-affected layer Wa.
- the turning number of L and the turning diameter R are determined, and the controller 30 determines the rotational speed and phase angle difference between the first hollow motor 56 and the second hollow motor 58 based on the determined turning number of the laser L and the turning diameter R. It is also possible to control and to make a main hole. Thereby, the processing apparatus 10 can control more accurately so that the thickness TH of the heat-affected layer Wa of the workpiece W is within the allowable thickness range.
- the machining apparatus 10 uses an X-axis moving mechanism 22, a C-axis rotating mechanism 24, a Y-axis moving mechanism 26, a Z-axis moving mechanism 28, and an indexing mechanism 39, so that the X-axis direction, the Y-axis direction, and the Z-axis direction.
- the processing stage 20 and the irradiation head 16 By moving the processing stage 20 and the irradiation head 16 relative to each other in the five-axis direction including the direction, the C-axis direction, and the swinging direction, the relative positional relationship between the workpiece W and the laser L to be irradiated is determined in the five-axis direction. It may be moved to.
- At least one of the first hollow motor 56 and the second hollow motor 58 may be an ultrasonic motor. Thereby, the processing apparatus 10 can easily improve the positioning accuracy of the phase angle (rotational position) of the first hollow motor 56 and the second hollow motor 58.
- the number of rotations of the laser L irradiated to the workpiece W may be increased, or the pulse width of the laser L may be shortened. Thereby, the processing apparatus 10 can make the thickness TH of the heat affected layer Wa thinner.
- a control map (a scattered matter control map) that defines the correlation between the amount of scattered matter from the irradiation position IP of the laser L on the workpiece W and the number of rotations of the laser L
- the first prism 51 and The rotational speed of the second prism 52 and the phase angle difference between the first prism 51 and the second prism 52 are determined, and the first hollow motor 56 and the second hollow motor 58 are controlled by the determined rotational speed and the phase angle difference. It may be rotated.
- the processing apparatus 10 can suppress the thickness TH of the heat-affected layer Wa and the amount of scattered matter.
- the guide optical system 14 is an optical fiber.
- the guide optical system 14 is not limited thereto, and may be guided to the irradiation head 16 by combining a mirror or a lens and reflecting or condensing the laser L. .
- the irradiation head 16 can be utilized with various processing apparatuses.
- the processing stage 20 that is relatively moved by the X-axis moving mechanism 22 has been described.
- the processing stage 20 may be an XY stage or an XYZ stage.
- the irradiation head 16 may be relatively moved in three directions of XYZ, or the irradiation head 16 may be supported by an arm and moved in the C direction in addition to the three axis directions of XYZ.
- the processing apparatus 10 can utilize the existing processing apparatus, for example.
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Abstract
Description
図1は、第1実施形態に係る加工装置の構成例を示す模式図である。
次に、第2実施形態に係る照射ヘッド16について説明する。図20は、第2実施形態に係る照射ヘッドの概略構成を示す説明図である。第2実施形態に係る照射ヘッド16の基本的構成は、第1実施形態に係る加工装置10の照射ヘッド16と同様であるので、同一部分の構成の説明は省略する。第2実施形態に係る照射ヘッド16は、コリメート光学系34、レーザ旋回部35、集光光学系37のそれぞれのレーザLの光路が直線状(同軸上)に並んで一体的に連結される。
ここで、加工装置10を用いて被加工部材Wに施した加工の実験例について説明する。図21は、加工装置による被加工部材の加工例を示す図である。図22は、図21に示す被加工部材を反対側から見た図である。
12 レーザ発振器
14 案内光学系
16 照射ヘッド
16a 照射ヘッドカバー
20 加工ステージ
22 X軸移動機構
24 C軸回転機構
26 Y軸移動機構
28 Z軸移動機構
30 制御装置
32 門形ブリッジ
34 コリメート光学系
35 レーザ旋回部
36 反射光学系
37 集光光学系
38 ノズル
39 割出機構
40 撮像手段
41 ギャップ検出手段
51 第1プリズム
52 第2プリズム
53 第1回転機構
54 第2回転機構
55 第1スピンドル
56 第1中空モータ
57 第2スピンドル
58 第2中空モータ
59,60 軸受
61,63 中空ロータ
62,64 ステータ
65 エンコーダ
66 識別子
67 検出部
71 第1反射ミラー
72 第2反射ミラー
73 筒部
74 ノズル装着部
75 継手部
77 透光部材
78 アシストガス供給源
81 割出軸
82 中空モータ
83 割出角度検出手段
84 軸受
85 中空ロータ
86 ステータ
91 溶接ワイヤ
92 肉盛り材ワイヤ
a,b,d 矢印
IC 仮想円
D,Da 照射幅
IP,IPa,IPb 照射位置
L レーザ
OA 光軸
P 中心
R,Ra,Rb 旋回径
TH 厚み
TR,TRa,TRb 軌跡
W 被加工部材
W1 一方の被加工部材
W2 他方の被加工部材
Wa 熱影響層
Wb 穴
Wc 溶接部
Wd 肉盛り部
We 表面改質部
Claims (12)
- 被加工部材にレーザを照射して加工処理を行う加工装置であって、
前記レーザを前記被加工部材に対して旋回させるレーザ旋回部と、前記レーザ旋回部で旋回された前記レーザを集光させる集光光学系と、を有する、前記被加工部材に前記レーザを照射する照射ヘッドと、
前記照射ヘッドの動作を制御する制御装置と、を有し、
前記レーザ旋回部は、前記レーザを屈折させる第1プリズムと、前記第1プリズムと対面する位置に配置され当該第1プリズムから出力された前記レーザを屈折させる第2プリズムと、前記第1プリズムを回転させる第1回転機構と、前記第2プリズムを回転させる第2回転機構と、を有し、
前記制御装置は、少なくとも前記被加工部材の熱影響層の許容厚みと、前記被加工部材に照射させる前記レーザの旋回数と、の関係に基づいて、前記第1回転機構および前記第2回転機構を制御し、前記第1プリズムおよび前記第2プリズムの回転数と位相角の差とを調整することを特徴とする加工装置。 - 前記第1回転機構は、前記第1プリズムを保持し且つ前記レーザの光路の部分が中空の第1スピンドルと、前記第1スピンドルが回転自在に内挿され当該第1スピンドルを回転駆動する第1中空モータと、を有し、
前記第2回転機構は、前記第2プリズムを保持し且つ前記レーザの光路の部分が中空の第2スピンドルと、前記第2スピンドルが回転自在に内挿され当該第2スピンドルを回転駆動する第2中空モータと、を有していることを特徴とする請求項1に記載の加工装置。 - 前記第1中空モータと前記第2中空モータとの位相角の差の誤差が0.1°以内であることを特徴とする請求項1または請求項2に記載の加工装置。
- 前記加工処理は、切断加工、穴あけ加工、溶接加工、クラッディング加工、表面改質加工、表面仕上げ加工、レーザ積層造形の少なくとも1つを含むことを特徴とする請求項1から請求項3のいずれか一項に記載の加工装置。
- 前記制御装置は、前記第1プリズムおよび前記第2プリズムの回転数を制御することで前記熱影響層の許容厚みを制御することを特徴とする請求項1から請求項4のいずれか一項に記載の加工装置。
- 前記熱影響層は、再溶融層、酸化層、クラック、ドロスの少なくとも1つを含むことを特徴とする請求項1から請求項5のいずれか一項に記載の加工装置。
- 前記被加工部材は、インコネル(登録商標)、ハステロイ(登録商標)、ステンレス、セラミック、鋼、炭素鋼、耐熱鋼、セラミックス、シリコン、チタン、タングステン、樹脂、プラスチックス、繊維強化プラスチック、複合材、Ni基耐熱合金のいずれかの材料で作成されていることを特徴とする請求項1から請求項6のいずれか一項に記載の加工装置。
- 前記制御装置は、少なくとも前記被加工部材の熱影響層の許容厚みと、前記被加工部材に照射させる前記レーザの旋回数と、前記レーザの旋回径と、の関係に基づいて、前記第1回転機構および前記第2回転機構を制御し、前記第1プリズムおよび前記第2プリズムの回転数と位相角の差とを調整することを特徴とする請求項1から請求項7のいずれか一項に記載の加工装置。
- 被加工部材にレーザを照射して加工処理を行う加工方法であって、
レーザを出力する出力ステップと、
少なくとも前記被加工部材の熱影響層の許容厚みと、前記被加工部材に照射される前記レーザの旋回数と、の関係に基づいて、第1プリズムおよび第2プリズムの回転数と位相角の差とを決定する決定ステップと、
第1回転機構および第2回転機構を決定した回転数と位相角の差とで回転させる回転ステップと、
前記被加工部材に対して前記レーザを旋回させつつ照射する照射ステップと、を有することを特徴とする加工方法。 - 前記加工処理は、切断加工、穴あけ加工、溶接加工、クラッディング加工、表面改質加工、表面仕上げ加工、レーザ積層造形の少なくとも1つを含むことを特徴とする請求項9に記載の加工方法。
- 前記熱影響層は、再溶融層、酸化層、クラック、ドロスの少なくとも1つを含むことを特徴とする請求項9または請求項10に記載の加工方法。
- 前記決定ステップは、少なくとも前記被加工部材の熱影響層の許容厚みと、前記被加工部材に照射させる前記レーザの旋回数と、前記レーザの旋回径と、の関係に基づいて、前記第1プリズムおよび前記第2プリズムの回転数と位相角の差とを決定することを特徴とする請求項9から請求項11のいずれか一項に記載の加工方法。
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