WO2014109320A1 - 印刷検査装置による不良原因の推定（分類）方法 - Google Patents

印刷検査装置による不良原因の推定（分類）方法 Download PDF

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Publication number
WO2014109320A1
WO2014109320A1 PCT/JP2014/050090 JP2014050090W WO2014109320A1 WO 2014109320 A1 WO2014109320 A1 WO 2014109320A1 JP 2014050090 W JP2014050090 W JP 2014050090W WO 2014109320 A1 WO2014109320 A1 WO 2014109320A1
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WIPO (PCT)
Prior art keywords
area
circuit board
solder
printed circuit
data
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Application number
PCT/JP2014/050090
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English (en)
French (fr)
Japanese (ja)
Inventor
有以 三宅
Original Assignee
株式会社Ｄｊｔｅｃｈ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 株式会社Ｄｊｔｅｃｈ filed Critical 株式会社Ｄｊｔｅｃｈ
Priority to CN201480014511.7A priority Critical patent/CN105074439B/zh
Publication of WO2014109320A1 publication Critical patent/WO2014109320A1/ja

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
    • G01N2021/95661—Inspecting patterns on the surface of objects for PCB's for leads, e.g. position, curvature
    • G01N2021/95669—Inspecting patterns on the surface of objects for PCB's for leads, e.g. position, curvature for solder coating, coverage
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

Definitions

  • the present invention relates to an inspection technique for inspecting solder printing on a printed circuit board.
  • the surface mounting system includes a solder printing device, an electronic component mounting device, a reflow furnace, and the like.
  • the solder printing apparatus prints paste-form cream solder containing powdered solder at a predetermined position on the printed circuit board where electronic components are mounted.
  • the electronic component mounting apparatus mounts a predetermined electronic component on each solder printed portion of a printed circuit board that has undergone a solder printing process.
  • the reflow furnace heats a printed circuit board on which electronic components are mounted, melts the solder, and performs soldering.
  • Patent Document 1 Japanese Patent Application Laid-Open No. 2004-228688 discloses a method of performing inspection by imaging a substrate after processing in each apparatus, adjusting the size and orientation of an image of a region to be inspected, and displaying the images side by side. According to this method, product quality verification and quality control can be facilitated.
  • an object of the present invention is to provide a printing inspection method and a printing inspection apparatus for accurately grasping the cause of an abnormality in a printing process in a solder printing inspection apparatus for inspecting a substrate on which cream solder is printed.
  • a printed circuit board print inspection method is (1) a print inspection method for inspecting a printed circuit board on which solder is printed by a solder printing apparatus.
  • a print inspection method for inspecting a printed circuit board on which solder is printed by a solder printing apparatus was calculated by a method capable of specifying a three-dimensional shape, and based on the imaged information, a numerical value of at least one of the volume, area, and height of the solder to be inspected was calculated.
  • the data of each area is generated by arranging the numerical value of at least one item of each solder in the order of the design value of the solder area corresponding to each numerical value, and the printed circuit board is divided into a plurality of areas.
  • area-specific data in which the numerical value of the at least one item of solder included in each area is associated with the corresponding area is generated for each item, and the imaging is performed. Based on the information, for each of the plurality of areas, and generating a substrate deformation amount data indicating the amount of deformation with respect to the reference position of the printed circuit board to be inspected.
  • a graph showing the relationship between the numerical value of any of the items and the design value of the solder area corresponding to the numerical value is generated, and the graph is displayed on the screen.
  • a print inspection apparatus is a print inspection apparatus for inspecting a printed board on which solder is printed by a solder printing apparatus, and is a method capable of specifying a three-dimensional shape of a solder to be inspected on a printed board.
  • An imaging unit that captures an image
  • an arithmetic unit that calculates a numerical value of at least one of the volume, area, and height of each solder to be inspected based on information captured by the imaging unit, and the arithmetic unit
  • An area-specific data generation unit that generates area-specific data for each item, in which numerical values of the calculated at least one item of each solder are arranged in the order of the design value of the solder area corresponding to each numerical value;
  • An area in which the printed circuit board is divided into a plurality of areas and the numerical value of the at least one item of solder included in each area is associated with the corresponding area.
  • Substrate deformation amount data indicating a deformation amount with respect to a reference position of a printed circuit board to be inspected for each of the plurality of areas based on information captured by the image capturing unit and an area-specific data generation unit that generates data for each item
  • the cause of the abnormality in the printing process can be accurately grasped.
  • FIG. 1 is a system configuration diagram showing a configuration of a surface mounting system including a print inspection apparatus. It is a block diagram which shows the structure of a printing inspection apparatus. It is a functional block diagram which shows the function of a printing inspection apparatus. An example of a graph representing data by area size for each item of volume (graph (A)), area (graph (B)), and height (graph (C)), and printed circuit board printed with cream solder A schematic diagram is shown. It is an example of the inspection result screen classified by area which displayed the inspection result of each block visually. It is an example of the inspection result screen according to area of the board
  • FIG. 1 is a diagram illustrating a configuration example of a surface mounting system 15 including a print inspection apparatus 1 according to the present embodiment.
  • the surface mounting system 15 includes a solder printing device 2, a printing inspection device 1, an electronic component mounting device 4, a post-mounting inspection device 6, a reflow furnace 8, and an appearance inspection device 10.
  • the surface mounting system 15 is a system for soldering and mounting a predetermined electronic component at a predetermined position on the surface of the printed circuit board.
  • the configuration of the surface mounting system 15 is not limited to that shown in FIG. 1, and may be another device configuration such as having a plurality of electronic component mounting devices 4.
  • the solder printing apparatus 2 prints paste-like cream solder containing solder powder on a predetermined position of the printed circuit board. Printing is usually performed by a screen printing method using a mask.
  • the print inspection apparatus 1 inspects whether or not the printed circuit board on which the cream solder is printed by the solder printing apparatus 2 is appropriately printed. Details of the print inspection apparatus 1 will be described later.
  • the electronic component mounting device 4 is a device for mounting electronic components on a printed circuit board on which cream solder is printed, and is also called a chip mounter or a surface mounting device. The electronic component mounting device 4 can position the electronic component at a predetermined position where the cream solder is printed with high accuracy.
  • the post-mounting inspection device 6 inspects whether or not each electronic component is accurately arranged at a predetermined position on the printed circuit board on which the electronic component is arranged by the electronic component mounting device 4.
  • the reflow furnace 8 heats the printed circuit board on which the electronic component is mounted, melts the solder, and fixes the electronic component with the solder.
  • the appearance inspection apparatus 10 inspects whether or not the electronic component is finally properly mounted on the printed circuit board on which the electronic component is fixed.
  • the devices of the surface mounting system 15 described above are connected to each other by a conveyor or the like, and the printed circuit board is sequentially conveyed from the solder printing device 2 to the appearance inspection device 10 to mount electronic components.
  • FIG. 2 is a configuration diagram showing the configuration of the print inspection apparatus 1.
  • the print inspection apparatus 1 according to the present embodiment includes a control unit 20, an auxiliary storage device 26, a substrate transport unit 28, an inspection unit 30, a display unit 40, and the like. These components may be connected via the bus 50.
  • the control unit 20 controls various processes performed by the print inspection apparatus 1.
  • the control unit 20 includes a processor 22 and a memory 24.
  • the processor 22 executes a control program stored in the memory 24, the auxiliary storage device 26, and the like and a program such as an OS (Operation System) to control various processes.
  • the processor 22 is, for example, a CPU (Central Processing Unit) or MPU (Micro Processing Unit).
  • the memory 24 stores a program and provides a temporary work area to the processor 22.
  • the memory 24 is, for example, a semiconductor memory, and includes a ROM (Read Only Memory), a RAM (Random Access Memory), and the like.
  • the memory 24 of this embodiment includes an inspection processing control program 24a and a motor driver 24b as control programs.
  • the inspection processing control program 24a is a program for controlling the inspection unit 30 to inspect the printed circuit board.
  • the motor driver 24b is a program for causing the board carrying unit 28 to carry the printed board. Each function realized by executing each program will be described later.
  • the control unit 20 may include an ASIC (Application Specific Specific Integrated Circuit) that realizes part or all of the functions of the print inspection apparatus 1. For example, part or all of the function of performing the printed circuit board inspection process performed by the control unit 20 by controlling the inspection unit 30 may be realized by an ASIC.
  • ASIC Application Specific Specific Integrated Circuit
  • the auxiliary storage device 26 is a device that stores various information, programs, and the like.
  • the auxiliary storage device 26 further includes an inspection object information DB (database) 26a, a threshold value DB 26b, and an inspection result information DB 26c.
  • the inspection object information DB 26a stores inspection object data such as the position and shape of solder to be inspected. When performing a printed circuit board inspection process to be described later, an inspection is performed based on inspection object data stored in the inspection object information DB 26a.
  • the threshold value DB 26b stores various reference values (in this embodiment, ideal values, allowable ranges, etc.) used for determination processing in inspection processing described later.
  • the inspection result information DB 26 c stores inspection result information performed by the print inspection apparatus 1. These information and database may be stored in the memory 24 or may be stored and managed in another computer or the like connected to the print inspection apparatus 1 so as to be communicable. In this case, the auxiliary storage device 26 is not necessarily provided.
  • the auxiliary storage device 26 may be a hard disk drive, other magnetic storage device, optical storage device, semiconductor storage device such as flash memory, or any combination thereof.
  • the substrate transport unit 28 transports a printed circuit board to be inspected in the print inspection apparatus 1.
  • the board conveyance unit 28 receives the printed board on which the solder is printed from the solder printing apparatus 2, conveys the printed board to the inspection position, and sends the printed board after the inspection to the electronic component mounting apparatus 4.
  • the substrate transport unit 28 includes a motor 28a and a conveyor 28b.
  • the drive of the motor 28a is controlled by the controller 20, and the conveyor 28b is operated by the motor 28a to sequentially convey the printed circuit boards.
  • the processor 22 controls the substrate transport unit 28 (motor 28a) to transport the printed circuit board.
  • the inspection unit 30 inspects the printed circuit board on which the cream solder which is the main function of the print inspection apparatus 1 is printed. Specifically, the inspection unit 30 captures an image of the printed circuit board and generates image data necessary to determine whether the printed circuit board is normal.
  • the inspection unit 30 includes an X-axis robot 32, a Y-axis robot 34, a Z-axis robot 36, and an imaging unit 38 that is an imaging unit.
  • the X-axis robot 32, the Y-axis robot 34, and the Z-axis robot 36 are mechanisms that move the camera 38a and the illumination device 38b of the imaging unit 38 in the X-axis direction, the Y-axis direction, and the Z-axis direction, respectively.
  • the board transport direction in which the printed board is transported is the X axis
  • the direction orthogonal to the X axis in the XY plane is the Y axis.
  • the X-axis robot 32 moves the camera 38a and the illumination device 38b in the X-axis direction
  • the Y-axis robot 34 moves the camera 38a and the like in the Y-axis direction
  • the Z-axis robot 36 has a Z-axis orthogonal to the XY plane.
  • the camera 38a or the like is moved in the direction.
  • Each of the X-axis robot 32 to the Z-axis robot 36 only needs to have a movement range so that it can move within the range necessary for imaging the printed circuit board at the position where the print inspection apparatus 1 captures the printed circuit board.
  • the imaging unit 38 includes a camera 38a and a lighting device 38b.
  • the imaging unit 38 captures an image for specifying the three-dimensional shape of the solder on the printed circuit board by a so-called light cutting method using a triangulation method. Specifically, line light called slit light or the like is irradiated from the illumination device 38b, and the reflected light is imaged by the camera 38a.
  • the linear light parallel to the Y-axis direction is slid in the X-axis direction to perform imaging, and the X-axis robot 32 and the Y-axis robot 34 are operated so that the entire printed circuit board is imaged. .
  • the calculation unit 106 calculates solder height data on the printed circuit board, and finally the printed solder in the imaging target area (inspection area) on the printed circuit board.
  • the area, volume, and height are specified.
  • the display unit 40 displays various screens. In the present embodiment, in particular, the display unit 40 visually displays a result of a print inspection process, which will be described later, or displays a setting screen for the print inspection process.
  • the display unit 40 may be a liquid crystal display, for example.
  • FIG. 3 is a functional block diagram illustrating functions of the print inspection apparatus 1 according to the present embodiment.
  • the print inspection apparatus 1 includes a robot control unit 100, a substrate transport control unit 102, an imaging processing control unit 104, a calculation unit 106, an area size data generation unit 108 which is an area data generation unit, and area data.
  • a generation unit 110, a substrate warpage amount calculation unit 112, a substrate warpage amount area-specific data generation unit 114, a determination unit 116, a display control unit 118, and a storage control unit 120 are provided.
  • the substrate warpage amount calculation unit 112 and the substrate warpage amount area-specific data generation unit 114 constitute a substrate deformation amount data generation unit.
  • Each functional block is realized by the processor 22 executing an inspection processing control program 24a or the like stored in the memory 24, the auxiliary storage device 26, or the like. Part or all of the functions may be realized by the ASIC.
  • the robot control unit 100 controls the X-axis robot 32, the Y-axis robot 34, and the Z-axis robot 36.
  • the robot control unit 100 moves the camera 38a and the illumination device 38b of the imaging unit 38 based on inspection target data such as solder position information stored in the inspection target information DB 26a.
  • the substrate transfer control unit 102 controls the motor 28a to drive the conveyor 28b.
  • the imaging processing control unit 104 controls the imaging unit 38 to image the printed circuit board.
  • the imaging processing control unit 104 causes the camera 38a to image the inspection area to be imaged based on the inspection target data stored in the inspection target information DB 26a.
  • the imaging processing control unit 104 can obtain image information that can specify the three-dimensional shape of the printed circuit board by causing the imaging unit 38 to image the inspection area. Further, the imaging processing control unit 104 can also acquire identification information for specifying the printed circuit board by imaging the printed circuit board. For example, if a code such as a two-dimensional code in which identification information is recorded is printed on a printed board, the identification information can be acquired by reading the code. Based on the identification information, information such as the position of the solder (inspection area) imaged by the corresponding printed circuit board can be acquired from the inspection object information DB 26a.
  • the calculation unit 106 calculates information such as the volume and area of the solder to be inspected and the height of the printed solder, based on the image data controlled by the imaging processing control unit 104 and captured by the imaging unit 38. .
  • the calculation unit 106 can calculate the height, volume, and area of the target solder based on the data captured by the imaging unit 38 using the light cutting method as described above.
  • the three-dimensional shape of the solder to be inspected is specified by the light cutting method.
  • the present invention is not limited to this, and any method and means can be used as long as the method can specify the three-dimensional shape. There may be. For example, a spot light method using a triangulation method other than the light cutting method, a spatial coding method, an interference method, an optical radar method, or the like may be used.
  • the data generation unit by area size 108 generates data for each item by area size (data by area) from the data for each item of solder volume, area, and height calculated by the calculation unit 106.
  • the inspection data of each item in the area to be inspected is data in which the solder printing area is rearranged in order from the smallest solder printing area.
  • the printed area of the solder to be arranged according to the area is a design value of the area of the solder to be printed in each inspection area (therefore, the area of the actually printed solder calculated from the imaging data by the imaging unit 38 is Deviation may occur with respect to the design area value).
  • the design value of the print area of the solder in the inspection area a is 1 mm 2
  • the design value of the print area of the solder in the inspection area b is 7 mm 2
  • the design value of the print area of the inspection area c is 3 mm 2
  • the inspection items are the volume, area, and height of the solder
  • the inspection data of each item is rearranged by the area of the inspection area to generate data for each item.
  • FIG. 4 data by area size for each item of volume (graph (A)), area (graph (B)), and height (graph (C)) generated by the data generating unit by area size 108 is shown.
  • An example of the represented graph is shown.
  • a printed circuit board (D) on which cream solder is printed is shown below the graph of FIG.
  • the printed circuit board (D) schematically shows only a to c among a plurality of cream solder printing areas. If the graphs in FIGS. 4A to 4C are data generated by imaging the printed circuit board (D), for example, the areas of the inspection areas a to c are a, c and b.
  • Each item of data in the inspection areas a to c corresponds to, for example, data at positions indicated by arrows in FIG.
  • the target ideal value and the allowable range to be handled as non-defective products are set, respectively, and it is judged how much there is a deviation from those values and ranges.
  • the test result can be stored in the test result information DB 26c, or visually displayed on the display unit 40 or the like.
  • the ideal value is indicated by a broken line, and the allowable range is filled with a dot pattern.
  • the ideal value and the allowable range are acquired from the threshold value DB 26 b of the auxiliary storage device 26 by the area size-specific data generation unit 108. In the example shown in FIG.
  • the area-specific data generation unit 110 virtually divides the printed circuit board into m-row ⁇ n-column areas (hereinafter, each divided area is also referred to as “block”), and the inspection result of the inspection area in one block
  • the average value is calculated as the inspection result value of the block.
  • the number of m rows and n columns differs depending on the size and type of the substrate to be inspected, and can be set to an arbitrary number of 1 or more. For example, if one inspection area is included in one block, the solder volume, area, and height in that area are used as the inspection value for that block. If a plurality of areas are included in one block, the inspection value of each area included in one block is obtained, and the average value thereof is set as the inspection value of the block.
  • one inspection area one solder area
  • a value is adopted in each of the straddling blocks and counted repeatedly.
  • the data such as the volume and height of the solder are stored in A to D.
  • Each of the four blocks of D is counted as a numerical value in that block.
  • FIG. 5 shows an example of an area-by-area inspection result screen (area-by-area image) on which the inspection result of each block generated by the area-by-area data generation unit 110 is visually displayed.
  • the direction from the A column to the J column is the X-axis direction (conveying direction of the conveyor 28b), and the direction from the first row to the tenth row is the Y-axis direction.
  • the block color is changed according to the amount (or ratio) of deviation from the ideal value.
  • the filling pattern is changed.
  • blocks with values within the specified range from the ideal value are green, blocks with less than the specified value from the ideal value are blue, blocks with a specified value greater than the specified value are yellow and red (values closer to the ideal value are yellow, The far value is red).
  • blue is indicated by a hatched pattern
  • green is indicated by a coarse dot pattern
  • yellow is indicated by a finer dot pattern.
  • a black pattern can be used as a block pattern having no inspection area.
  • FIG. 5 shows the area-by-area inspection result screen for the cream solder height
  • the areas of the E row and the F row are larger than the ideal value, that is, the solder height tends to be higher than the ideal value.
  • the areas of the A, B, I, and J columns are less than the ideal value, that is, the solder height tends to be lower than the ideal value.
  • the ideal value is set to green, and colors such as blue, yellow, and red are set according to the deviation from the ideal value.
  • the present invention is not limited to this.
  • the amount of deviation from the ideal value and the color may be displayed in more detail in association with each other.
  • the display changes with gradation such as green, light blue, blue, and dark blue. can do.
  • the display is changed in gradation such as green, yellow-green, yellow, orange, and red.
  • the board warpage amount calculation unit 112 calculates the warpage amount (deformation amount) of the printed circuit board based on the imaging processing result by the imaging unit 38.
  • the amount of warpage of the board is a value indicating how much the printed board on the conveyor is distorted (or displaced) upward or downward from the reference plane (reference position in the Z-axis direction).
  • the method for obtaining the warpage amount of the substrate is not particularly limited as long as the warpage amount of the substrate can be obtained. For example, when imaging the printed circuit board with the imaging unit 38, the Z-axis robot moves the imaging unit 38 up and down so that the distance between the printed circuit board surface and the imaging unit 38 (camera 38a and illumination device 38b) is constant. Take an image while A board warpage amount indicating how much the printed board is deformed from the reference position can be obtained from the movement amount of the Z-axis robot.
  • the board warp amount area-specific data generation unit (hereinafter also referred to as “warp amount data generation unit”) 114 divides the printed circuit board into m rows ⁇ n columns in the same manner as the area-specific data generation unit 110, and Data (substrate deformation amount data) indicating how much the substrate warpage amount deviates from the ideal value is generated.
  • the generated data can be visually displayed as in FIG.
  • FIG. 6 shows an example of a substrate warpage amount inspection result screen (area-specific substrate deformation amount image) on which the warpage amount inspection result of each block generated by the warpage amount data generation unit 114 is visually displayed. As in FIG.
  • the hatched portion in the third row indicates a portion that is too small relative to the ideal value (displayed in blue in the actual screen, for example), and the first, second, fourth, and fifth rows indicated by the coarsest dots
  • the portion indicates the portion closest to the ideal value (displayed in green on an actual screen, for example), and the sixth to tenth lines indicate portions that are excessive from the ideal value.
  • Lines 7, 8, and 10 eg, yellow on an actual screen
  • line 6 eg, bright yellow on an actual screen
  • line 9 eg, red on an actual screen
  • the determination unit 116 is applied to the printed circuit board on which the cream solder to be inspected is printed. It is determined whether or not there is an abnormality, and if there is an abnormality, what kind of abnormality is present. Details of the determination process will be described with reference to the flowchart of FIG.
  • the display control unit 118 causes the display unit 40 to display the screens shown in FIGS. 4 to 6 based on the above-described area size data, area data, and substrate warpage area data.
  • the storage control unit 120 stores inspection result data in the inspection result information DB 26C or the like.
  • 7 and 8 are flowcharts showing the flow of the print inspection process.
  • the board conveyance control unit 102 moves the conveyor 28b
  • the robot control unit 100 moves the camera 38a and the like of the imaging unit 38 to a predetermined imaging position
  • the imaging processing control unit 104 puts the printed circuit board to be inspected on the imaging unit 38.
  • An image is taken (step 101).
  • Step 102 data such as the volume, area, and height of solder in each inspection area is calculated from the image data captured by the calculation unit 106, and the board warpage amount calculation unit 112 calculates the warpage amount of the printed circuit board ( Step 102).
  • the data generation unit by area size 108, the data generation unit by area 110, and the data generation unit by substrate warp area by area 114 each generate corresponding data (step 103).
  • the determination unit 116 determines whether there is an abnormality based on the area size data generated by the area size data generation unit 108 (step 104). Specifically, the determination unit 116 determines whether or not the data by area size of each item such as volume and height is out of a preset allowable range.
  • the determination unit 116 determines whether there is an abnormality based on the area-specific data generated by the area-specific data generation unit 110 (step 105). Specifically, the determination unit 116 determines whether or not the data for each area of each block is within an allowable range set in advance for determination of the data for each area. to decide.
  • step 105 If it is determined that there is no abnormality (Yes in step 105), the determination unit 116 determines that there is no abnormality in the printed circuit board to be inspected (step 106) and ends the process.
  • the determination unit 116 determines whether the abnormality of the area-specific data recognized in step 105 is local based on the area-specific data. Is determined (step 107). Specifically, based on the data for each area, the determination unit 116 determines whether the block exists only in a part of the entire substrate when there is an excessive or insufficient block outside the allowable range, or the entire block is excessive or insufficient. Judgment is made. When an excessive or insufficient block exists in a part, it is determined that the abnormality is local.
  • the determination unit 116 determines that the abnormality is not local based on the data for each area (that is, the abnormality is general and wide-ranging) (No in step 107)
  • the determination unit 116 determines the substrate warp amount area. The presence / absence of abnormality is determined based on the data for each area of the substrate warp generated by the separate data generation unit 114 (step 108). Specifically, the determination unit 116 determines that there is an abnormality when the amount of warpage exceeds a preset allowable range.
  • the determination unit 116 When it is determined that there is no abnormality with respect to the amount of substrate warpage (Yes in step 108), the determination unit 116 has no abnormality with respect to the area size data, and there is an abnormality with respect to the area data. The cause of the failure is specified based on the determination result that there is no abnormality in the substrate warpage amount. Specifically, the determination unit 116 determines that there is no problem with the printed circuit board itself, and thus determines that the defect is caused by printing conditions or an apparatus abnormality. More specifically, the determination unit 116 is a defect caused by printing pressure or printing speed. (Step 109).
  • the determination unit 116 determines that the defect is caused by local deformation of the substrate, substrate loss, clearance abnormality, or the like.
  • the clearance is the distance between the screen printing mask and the substrate during cream solder printing. If there is a local deformation or defect in the substrate, the clearance is not constant throughout the substrate, which causes an overall solder printing abnormality on the printed circuit board.
  • the determination unit 116 determines the substrate warpage amount in the same manner as in step 108 based on the substrate warpage amount area-specific data. The presence or absence of abnormality is determined (step 111). If it is determined that there is no abnormality with respect to the data for each area of the substrate warpage (Yes in step 111), the determination unit 116 has no abnormality for the data for each area size, there is a local abnormality for the data for each area, and the amount of substrate warpage. The cause of the defect is specified based on the determination result that there is no abnormality. Specifically, the determination unit 116 determines that the defect is caused by printing conditions or an apparatus abnormality (step 112). More specifically, the determination unit 116 has no problem with the printed circuit board, and the abnormality is local. Therefore, local clogging of the metal mask for printing cream solder and support of the circuit board are partially insufficient. It can be determined that this is the cause.
  • the determination unit 116 determines that there is an abnormality based on the substrate warp amount area-specific data (No in step 111)
  • the determination unit 116 has no abnormality for the area-size data and the local abnormality for the area-specific data.
  • the determination unit 116 determines that there is no abnormality in the printed solder and that the printed board itself is defective due to deformation of the printed board (step 113).
  • the printing pressure is generally high at the portion where the substrate is warped upward (the portion warped toward the screen mask during printing). This is because the printing pressure is low in the downwardly warped portions, and local printing abnormalities due to deformation of the printed circuit boards occur.
  • the determination unit 116 determines in step 104 that there is an abnormality in the area size data (No in step 104, following 1 in FIG. 8), the determination unit 116 generates area-specific data as in step 105. The presence / absence of an abnormality is determined based on the area-specific data generated by the unit 110 (step 114).
  • the determination unit 116 determines that there is an abnormality for the area-size data and that there is no abnormality for the area-specific data on the printed circuit board. It is determined that the failure is caused by other factors such as when foreign matter such as dust or dirt is mixed (step 115).
  • the determination unit 116 determines whether the abnormality in the area-specific data is local based on the area-specific data (step 107) ( Step 116).
  • the determination unit 116 determines that the abnormality is not local (that is, the abnormality is global and wide-ranging) based on the data by area (No in step 116), the determination unit 116 is the same as step 108. Then, the presence / absence of abnormality is determined based on the data for each area of the substrate warp (step 117). If it is determined that there is no abnormality (Yes in step 117), it is determined that the defect is caused by printing conditions or apparatus abnormality, and more specifically, it is determined that the defect is caused by printing pressure or printing speed. (Step 118). This is because the abnormality is overall and there is no problem in the amount of warping of the substrate, and it is considered that this is caused by a printing condition or an apparatus abnormality that is easily influenced as a whole.
  • step 117 determines that there is an abnormality (No in step 117), there is an abnormality in the data by area size, there is an overall abnormality in the data by area, and there is an abnormality in the data by area of the substrate warp amount. Therefore, it is recognized that the defect is caused by the printing condition or the cause of the printed circuit board itself (step 119). More specifically, the determination unit 116 determines that the defect is caused by local deformation of the substrate, substrate loss, clearance abnormality, or the like. This is because there is an abnormality in the area-by-area data of the substrate warp amount.
  • the abnormal portion is deformed or cracked. This is because it is assumed that there was a defect such as that the printing was not normally performed. If there is local deformation or defect on the substrate, the clearance is not constant throughout the substrate, which causes an abnormality in solder printing.
  • the determination unit 116 determines the presence / absence of abnormality based on the substrate warpage amount area data (step 120). ). If it is determined that there is no abnormality with respect to the data for each area of the substrate warpage (Yes in step 120), the determination unit 116 has an abnormality for the data for each area size, the abnormality is local for the data for each area, and the amount of the substrate warpage. The cause of the defect is specified based on the determination result that there is no abnormality. Specifically, the determination unit 116 determines that the defect is caused by printing conditions or an apparatus abnormality (step 121). More specifically, the determination unit 116 has no problem with the printed circuit board, and the abnormality is local. Therefore, local clogging of the metal mask for printing cream solder and support of the circuit board are partially insufficient. Judgment is caused by what happened.
  • FIG. 9 and FIG. 10 show an example of a screen visually displaying a graph of volume data for each area size and volume data for each area in the case where the determination in step 121 is made.
  • the portion indicated by the arrow A is locally reduced, and it can be seen that there is an abnormality in the insufficient direction centering on the block C-4 as shown in FIG.
  • the area of the determined portion has a relationship corresponding to the area value indicated by the arrow A in FIG. 9).
  • the local insufficient or excessive solder is often caused by clogging of the metal mask.
  • a local abnormality is present, and the cause is identified as a high possibility of clogging of the metal mask. be able to.
  • the determination unit 116 determines that there is an abnormality in Step 120 (No in Step 120)
  • the determination unit 116 has an abnormality with respect to the data by area size, the abnormality is local with respect to the data by area, and the amount of substrate warpage.
  • the defect is caused by the printed circuit board (step 122).
  • step 113 since there is a local abnormality in the amount of warpage of the substrate, for example, a portion where the substrate is warped upward (a portion warped toward the screen mask during printing) is marked. This is because the pressure is increased as a whole, and the printing pressure is lowered at the portion warped downward, and local printing abnormalities due to deformation of the printed circuit board occur.
  • the final determination result can be stored in the inspection result information DB 26c by the storage control unit 120, or the display control unit 118 can display that an abnormality has occurred in the display unit 40 together with the cause of the abnormality.
  • FIG. 11A is an image that visually displays area-specific data on the volume
  • FIG. 11B is an image that visually displays area-specific data on the amount of substrate warpage.
  • the volume of the solder as shown in FIG. 11A, the number of lines 3 is too small, and the vicinity of line 9 is too large.
  • the substrate warpage amount is conversely the vicinity of line 3 is excessive, and the lines 6 to 10 are excessive.
  • the portion of lines 6 to 10 has the printed circuit board warped in the negative direction from the reference position, and the cream solder has been supplied excessively.
  • the amount of solder supplied to the portion warped in the plus direction so that the substrate swells is reduced, and the volume of the solder is too small. Therefore, when such data is obtained, it is possible to estimate a state in which there is an abnormality in the amount of warping of the substrate, and as a result, variations have occurred in the amount of solder supplied.
  • the evaluation printed circuit board in which different inspection areas are gradually distributed without variation from a small size to a large size is printed on the solder printing apparatus 2.
  • the printed circuit board for evaluation is inspected by the print inspection apparatus 1, and data for each area size is generated.
  • FIG. 12 the graph of the data according to the area size produced
  • the area size is smaller than about 0.15 and is below the allowable volume range.
  • the solder printing apparatus 2 has a design capable of solder printing of a size of 0.100 or larger, all inspection values of a size of 0.1 or larger must be within the allowable range. There is. Therefore, when such a result is obtained as the inspection result of the printed circuit board for evaluation, it is necessary to adjust the printing conditions of the solder printing apparatus 2 so as to fall within the allowable range with a size of 0.1 or more. There is.
  • the printed circuit board for evaluation is printed again, and the inspection by the printing inspection apparatus 1 results in the inspection value being within the allowable range within 0.1 or more. It can be seen that the conditions are set to the optimum conditions. On the other hand, for example, as a result of the adjustment, the inspection value with the area size near 0.1 falls within the allowable range as in the data by area size shown in FIG. 13, but falls below the allowable range with an area size larger than 0.5. If the inspection value of the area size that should be within the allowable range does not fall within the allowable range even after repeated adjustments, it is a deterioration or failure of the solder printing apparatus 2 itself, not the printing conditions. I understand that.
  • the optimum printing condition of the solder printing apparatus 2 can be derived by printing the evaluation printed circuit board on the solder printing apparatus 2 and performing the print inspection process by the print inspection apparatus 1 of the present embodiment. Further, depending on whether or not the inspection value can be adjusted so as to fall within the allowable range, performance evaluation such as deterioration of the solder printing apparatus 2 can be performed.
  • the printing inspection apparatus 1 of this embodiment described above when a printed circuit board printed by the solder printing apparatus 2 is inspected and a defect occurs, the cause can be accurately identified. Therefore, the occurrence of defects can be effectively suppressed, and the solder printing process can be performed efficiently.
  • each configuration is described as being provided in one print inspection apparatus 1, but the configuration is not limited thereto, and each configuration and each functional block are distributed and held in a plurality of devices, and the overall configuration of the present embodiment.
  • a print inspection system that performs an inspection by performing a print inspection method may be used.
  • a print inspection apparatus performs an imaging process of a printed circuit board, and an external computer performs a calculation process for specifying the three-dimensional shape of solder, a determination process for specifying the presence or absence of printing defects, and the cause thereof It may be an inspection system.
  • step 104 of the flow of FIG. 7 described above it is determined whether or not the data by area size is out of a certain allowable range regardless of the area size.
  • an ideal curve of data by area size may be set in advance, and a predetermined range from the ideal curve may be set as an allowable range.
  • the allowable range along the ideal curve it is possible to determine the presence or absence of abnormality in the data by area size more accurately.
  • FIG. 9 if the entire range is within the allowable range, but is locally too small or excessive, and all are set within the same allowable range, there is an abnormality in the judgment by area size. Although it is determined that there is no error, the possibility that it is determined that there is an abnormality increases in the case of an allowable range along the ideal curve, and more accurate determination is possible.

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  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Immunology (AREA)
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PCT/JP2014/050090 2013-01-11 2014-01-07 印刷検査装置による不良原因の推定（分類）方法 WO2014109320A1 (ja)

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JP6444909B2 (ja) * 2016-02-22 2018-12-26 東京エレクトロン株式会社 基板処理方法、基板処理装置及びコンピュータ読み取り可能な記録媒体
CN110291855B (zh) * 2017-02-13 2021-09-14 株式会社高迎科技 检查在印刷电路板贴装的部件的装置、其运转方法及计算机可读记录介质
JP2019185730A (ja) * 2018-03-30 2019-10-24 キヤノン株式会社 画像処理装置、画像処理方法及びプログラム
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JP7092563B2 (ja) * 2018-06-08 2022-06-28 マクセルフロンティア株式会社 印字検査機
JP7131127B2 (ja) * 2018-06-27 2022-09-06 オムロン株式会社 外観検査システム、外観検査結果の表示方法、および、外観検査結果の表示プログラム
WO2020005001A1 (ko) * 2018-06-28 2020-01-02 주식회사 고영테크놀러지 기판에 실장된 부품의 실장 불량 원인을 결정하는 전자 장치 및 방법
CN109936923B (zh) * 2019-03-25 2020-10-13 北京百度网讯科技有限公司 用于确定芯片贴装数据的方法和装置
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JP6870031B2 (ja) * 2019-06-19 2021-05-12 名古屋電機工業株式会社 クリームはんだ印刷工程検査システム
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