WO2014101063A1 - 窄边框液晶模块 - Google Patents

窄边框液晶模块 Download PDF

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Publication number
WO2014101063A1
WO2014101063A1 PCT/CN2012/087734 CN2012087734W WO2014101063A1 WO 2014101063 A1 WO2014101063 A1 WO 2014101063A1 CN 2012087734 W CN2012087734 W CN 2012087734W WO 2014101063 A1 WO2014101063 A1 WO 2014101063A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
liquid crystal
crystal module
flexible circuit
narrow bezel
Prior art date
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PCT/CN2012/087734
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English (en)
French (fr)
Inventor
李全
Original Assignee
深圳市华星光电技术有限公司
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Application filed by 深圳市华星光电技术有限公司 filed Critical 深圳市华星光电技术有限公司
Priority to US13/812,523 priority Critical patent/US9217889B2/en
Publication of WO2014101063A1 publication Critical patent/WO2014101063A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G02F1/133317—Intermediate frames, e.g. between backlight housing and front frame
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
    • G02F2201/50—Protective arrangements
    • G02F2201/503—Arrangements improving the resistance to shock

Definitions

  • the present invention relates to a liquid crystal module, and more particularly to a narrow bezel liquid crystal module.
  • the narrow bezel design is a trend, and the frame of the mature product module can achieve a thickness of less than 5 cm (mm) and has a narrower border. Design requirements, especially in the design of large size, high resolution modules.
  • the technology of driving chip packaging is also toward a trend of thinner thickness and smaller area, for example, Chip-on-chip flexible package component (chip On film, COF).
  • the flexible chip package of the chip-on-chip type has a driving chip (such as a gate chip) packaged on a surface of the flexible circuit board, and one end of the flexible circuit board is respectively passed by the flexible circuit board through the metal bumps The surface circuit of the glass substrate and the other end are bonded to a driving circuit board.
  • a driving chip such as a gate chip
  • the space between the plastic frame and the front frame is used to accommodate the chip-type flexible package assembly and the drive.
  • the circuit board when the space between the plastic frame and the front frame is reduced and the flexible circuit board of the flexible package assembly is easily lifted up, it is easy to cause peeling and damage of the flexible circuit board during assembly. The problem will reduce the assembly yield of the narrow-border LCD module.
  • the present invention provides a narrow-border liquid crystal module to solve the problem of flaking and damage on a flexible circuit board of a chip-on-chip flexible package assembly (COF) caused by a narrow design trend of the frame in the prior art.
  • COF chip-on-chip flexible package assembly
  • the main object of the present invention is to provide a narrow-border liquid crystal module, which can effectively prevent the problem of flaking and damage on the flexible circuit board of the chip-type flexible package assembly under the trend of narrowing the frame design. Relatively improve the assembly yield of the narrow-border liquid crystal module.
  • an embodiment of the present invention provides a narrow bezel liquid crystal module, the narrow bezel liquid crystal module comprising:
  • a display panel comprising an upper glass substrate and a lower glass substrate
  • a backlight module comprising at least one optical film, a back plate and at least one plastic frame, wherein the back plate carries the optical film, and the plastic frame surrounds the back plate and is used to carry the display panel;
  • a front frame surrounding the plastic frame and used to fix the display panel, and an accommodation space is formed between the front frame and the plastic frame;
  • At least one on-chip chip type flexible package assembly located in the accommodating space, and having at least one chip and a flexible circuit board, the chip being fixed on the flexible circuit board facing the plastic frame On the surface, one end of the flexible circuit board is electrically coupled to the lower glass substrate, and the other end is electrically coupled to a driving circuit board;
  • the guiding block is a conductive foam block, wherein the guiding block is located in the accommodating space and is fixed on an inner side surface of the front frame, and passes through a double-sided tape
  • the inner side of the front frame is in close engagement with the inner side of the front frame, and the guiding block has a guiding slope facing the flexible circuit board.
  • a guiding slope of the guiding block has a gap with the flexible circuit board.
  • the guiding slope of the guiding block contacts the flexible circuit board.
  • the guiding block is a strip having a triangular or trapezoidal cross section, which is coupled to the inner side of a corner of the front frame.
  • another embodiment of the present invention provides another narrow bezel liquid crystal module, the narrow bezel liquid crystal module comprising:
  • a display panel comprising an upper glass substrate and a lower glass substrate
  • a backlight module comprising at least one optical film, a back plate and at least one plastic frame, wherein the back plate carries the optical film, and the plastic frame surrounds the back plate and is used to carry the display panel;
  • a front frame surrounding the plastic frame and used to fix the display panel, and an accommodation space is formed between the front frame and the plastic frame;
  • At least one on-chip chip type flexible package assembly located in the accommodating space, and having at least one chip and a flexible circuit board, the chip being fixed on the flexible circuit board facing the plastic frame On the surface, one end of the flexible circuit board is electrically coupled to the lower glass substrate, and the other end is electrically coupled to a driving circuit board;
  • At least one guiding block is located in the accommodating space and is fixed on an inner side surface of the front frame, and the guiding block has a guiding slope facing the flexible circuit board.
  • the guiding block is a foam block.
  • the foam block is a conductive foam.
  • the guiding block is a silicone block.
  • the silica gel block has a hardness of less than 30 degrees.
  • a guiding slope of the guiding block has a gap with the flexible circuit board.
  • the guiding slope of the guiding block contacts the flexible circuit board.
  • the guiding block is tightly engaged with the inner side surface of the front frame by a double-sided tape.
  • the guiding block is a strip having a triangular or trapezoidal cross section, which is coupled to the inner side of a corner of the front frame.
  • another embodiment of the present invention provides another narrow bezel liquid crystal module, wherein the narrow bezel liquid crystal module includes:
  • a display panel comprising an upper glass substrate and a lower glass substrate
  • a backlight module comprising at least one plastic frame, the plastic frame is used to carry the display panel;
  • a front frame surrounding the plastic frame and used to fix the display panel, and an accommodation space is formed between the front frame and the plastic frame;
  • the at least one flexible package assembly is located in the accommodating space and has a flexible circuit board. One end of the flexible circuit board is electrically coupled to the lower glass substrate, and the other end is electrically coupled. On a driver circuit board; and
  • At least one guiding block is located in the accommodating space and is fixed on an inner side surface of the front frame, and the guiding block has a guiding slope facing the flexible circuit board.
  • the flexible package component is a chip package type or a glass chip type flexible package assembly.
  • the narrow-border liquid crystal module of the present invention has at least one guiding block located in the accommodating space and fixed on an inner side surface of the front frame, and the guiding block has a guiding
  • the inclined surface facing the flexible circuit board can effectively prevent the problem of flaking and damage on the flexible circuit board of the chip-type flexible package assembly during assembly, so as to relatively improve the assembly of the narrow-frame liquid crystal module Yield rate.
  • FIG. 1 is a cross-sectional view showing a combination of a narrow bezel liquid crystal module according to a first embodiment of the present invention
  • FIG. 2 is a cross-sectional view showing a combination of a narrow bezel liquid crystal module according to a second embodiment of the present invention
  • FIG 3 is a cross-sectional view showing the combination of a narrow bezel liquid crystal module according to a third embodiment of the present invention.
  • a first embodiment of the present invention provides a narrow bezel liquid crystal module 100.
  • the narrow bezel liquid crystal module 100 includes a display panel 110 , a backlight module 120 , a front frame 130 , and at least one film . Chip type On film, The flexible package assembly 140 of the COF) and at least one guiding block 150. DETAILED DESCRIPTION OF THE INVENTION The detailed construction, assembly relationship, and operation principle of the above-described respective components of the first embodiment will be described in detail below with reference to Figs.
  • the display panel 110 includes an upper glass substrate 111 and a lower glass substrate 112, wherein the upper glass substrate 111 and the A transparent liquid crystal layer (not shown) on the upper surface of the lower glass substrate 112 has a connecting portion for electrical connection.
  • the connecting portion may also be located on the lower surface or the end surface of the lower glass substrate 112, but is not limited thereto.
  • the backlight module 120 includes at least one optical film 121, a back plate 122, and at least one plastic frame 123.
  • the optical film 121 is located below the lower glass substrate 112 and is carried by the back plate 122.
  • the optical film 121 is described.
  • the optical film 121 may include, for example, at least one optical film 121a. (optical thin films), a light guide plate 121b and a reflector 121c (reflector), but is not limited thereto, wherein the optical film 121a is disposed in front of the light guide plate 121b, and the reflection plate 121c is disposed behind the light guide plate 121b.
  • the backing plate 122 is usually stamped from a metal plate, and the backing plate 122 has a bottom plate and a plurality of side plates.
  • the bottom plate of the back plate 122 and the lower surface of the optical film 121 (or between the side plates of the back plate 122 and the side surface of the optical film 121) further have at least one backlight, such as a circuit board with several LEDs (ie light strips, light Bar).
  • the plastic frame 123 is usually made of plastic or composited with a metal plate, and the plastic frame 123 has a body portion and a shoulder portion.
  • the body portion of the plastic frame 123 is an upright plate body surrounding the back plate 122; and the shoulder portion of the plastic frame 123 is formed by the body portion extending horizontally inwardly.
  • the lower surface of the lower glass substrate 112 is provided with a cushion 113, such as foam, which is disposed on the lower glass substrate 112 and the shoulder of the plastic frame 123. Between so as to provide shock absorption.
  • the front frame 130 is usually formed by stamping a metal plate, and surrounds the plastic frame 123 to fix the display panel 110, and an accommodation space is formed between the front frame 130 and the plastic frame 123. 200.
  • the on-chip chip type flexible package assembly 140 is located in the accommodating space 200 and has at least one chip. 141 and a flexible printed circuit (FPC) 142.
  • the chip 141 is, for example, a gate driving chip, which is fixed on a surface of the flexible circuit board 142 facing the plastic frame 123, and one end of the flexible circuit board 142 passes through a metal bump.
  • the thermal bonding technique is electrically coupled to the connection portion on the upper surface, the lower surface or the end surface of the lower glass substrate 112, and the other end is electrically coupled to a driving circuit board (driving) Circuit board) 160, the driving circuit board 160 can control the chip 141, so that the chip 141 controls the thin film transistor array (TFT) of the lower glass substrate 112 through the flexible circuit board 142 Array) Switching of the circuit.
  • driving circuit board 160 driving circuit board 160 can control the chip 141, so that the chip 141 controls the thin film transistor array (TFT) of the lower glass substrate 112 through the flexible circuit board 142 Array) Switching of the circuit.
  • the narrow bezel liquid crystal module 100 has at least one guiding block 150 located in the receiving space 200 and fixed to the front frame 130.
  • the guiding block 150 has a guiding slope 151 facing the flexible circuit board 142, and the guiding block is a foam block with buffer shock absorption function.
  • the foam block is preferably a conductive foam.
  • the guiding block 150 may also be a silicone block, and the hardness of the silicone block is less than 30 degrees or the guiding block 150 may also be other blocks that have the same shock absorption effect. Shaped material. It should be noted that the guiding slope 151 of the guiding block 150 and the flexible circuit board 142 may have a gap between the guiding slope 150 and the flexible guiding plate 150. Circuit board 142 is not in contact.
  • the guiding block 150 is tightly engaged with the inner side surface of the front frame 130 by a double-sided tape. As shown in FIG. 1 and FIG. 2, the guiding block 150 is a strip having a triangular cross section and is coupled to the two inner side surfaces of a corner of the front frame 130.
  • Blocking of the guiding slope 151 of the block 150 effectively avoids the problem of flaking and damage of the flexible circuit board 142 of the flexible package assembly 140 to smoothly guide the lower end of the flexible circuit board 142 (and drive The circuit board 160) faces downward and falls at a predetermined assembly position, so the present invention can certainly improve the assembly yield of the narrow bezel liquid crystal module.
  • the package structure of the second embodiment of the present invention is similar to the first embodiment of the present invention, and the same component name and figure number are generally used, but the difference of the second embodiment is: in the present invention
  • the guiding slope 151 of the guiding block 150 can also be loosely fitted or tightly abutted against the outer surface of the flexible circuit board 142, which can also effectively avoid The problem that the flexible circuit board 142 of the flexible package assembly 140 is peeled off and damaged is relatively improved to improve the assembly yield of the narrow bezel liquid crystal module.
  • the package structure of the third embodiment of the present invention is similar to the first embodiment of the present invention, and generally uses the same component name and figure number, but the third embodiment is characterized by: third in the present invention.
  • the guiding block 150 is a stripe having a trapezoidal cross section, which is coupled to the two inner side faces of a corner of the front frame 130.
  • the chip-on-chip flexible package assembly COF
  • COG chip On The flexible package assembly of the glass, COG, wherein the chip 141 is directly disposed on the transparent surface circuit of the upper surface or the lower surface of the lower glass substrate 112, and the flexible circuit board 142 does not have a chip thereon.
  • the guiding slope 151 of the guiding block 150 can also effectively avoid the problem of flaking and damage of the flexible circuit board 142 of the flexible package assembly 140, so as to relatively improve the narrow-border liquid crystal module. Assembling the yield rate.
  • the chip-type flexible package component As described above, compared to the existing narrow-border liquid crystal module, the chip-type flexible package component (Gate) The aging of the COF) and the partial flaking cause the chip-type flexible package assembly to be lifted up and stabbed the display panel.
  • the narrow-framed liquid crystal module of the present invention increases the installation of the guide block. After that, it can indeed have a blocking effect, thereby defining the space in which the chip-type flexible package assembly or the flexible circuit board (FPC) exists to achieve a narrow bezel design.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

提供一种窄边框液晶模块（100），包含：一显示面板（110）；一背光模块（120），包含至少一胶框（123），胶框（123）承载显示面板（110）；一前框（130），围绕于所述胶框（123）周围并用以固定显示面板（110），且前框（130）与胶框（123）之间形成一容置空间（200）；至少一挠性封装组件（140），位于容置空间（200）内，并具有一挠性电路板（142），电性耦接于显示面板（110）及一驱动电路板（160）之间；及至少一导引块（150），位于容置空间（200）内及固定在前框（130）的一内侧面上，并具有一导引斜面（151）面对所述挠性电路板（142）。本发明可避免挠性封装组件（140）出现上翻剥落及损伤的问题。

Description

窄边框液晶模块 技术领域
本发明是有关于一种液晶模块，特别是有关于一种窄边框液晶模块。
 背景技术
现今，半导体封装产业为了满足各种高密度封装的需求，逐渐发展出各种不同型式的封装设计，其中各种不同的封装构造的设计概念多是为了让高密度封装产品更加薄型化，以便适用于日益轻薄短小的电子产品中，例如窄边框液晶显示器。
在使用发光二极管(LED)背光模块的液晶模组中，窄边框设计是一种趋势，目前成熟的产品模组的边框可以做到小于5厘米(mm)的厚度，并有向更窄边框迈进的设计需求，特别是在大尺寸、高分辨率模组的设计中。为了在发光二极管(LED)液晶模组中实施窄边框设计，并因应电子产品朝轻薄短小、功能好及速度快发展，驱动芯片封装的技术也朝向厚度愈薄、面积愈小的趋势发展，例如膜上芯片型的挠性封装组件(chip on film, COF)。所述膜上芯片型的挠性封装组件是将驱动芯片(如闸极芯片)封装在挠性电路板一表面上，并且挠性电路板的一端由挠性电路板通过金属凸块分别与一玻璃基板的表面电路，及另一端则接合至一驱动电路板。
然而，由于在使用发光二极管(LED)背光模块的液晶模组中，液晶模组在组装时，其胶框与前框之间的空间用以容置膜上芯片型的挠性封装组件与驱动电路板，然而当胶框与前框之间的空间被缩小且挠性封装组件的挠性电路板又容易向上翘起时，则在组装期间即容易因此导致挠性电路板上翻剥落及损伤的问题，会降低窄边框液晶模块的组装良品率。
故，有必要提供一种窄边框液晶模块，以解决现有技术所存在的问题。
 技术问题
有鉴于此，本发明提供一种窄边框液晶模块，以解决现有技术因边框窄化设计趋势所造成的膜上芯片型的挠性封装组件(COF)的挠性电路板上翻剥落及损伤的问题。
 技术解决方案
本发明的主要目的在于提供一种窄边框液晶模块，其可以在因边框窄化设计趋势下，有效防止膜上芯片型的挠性封装组件的挠性电路板上翻剥落及损伤的问题，以相对提高窄边框液晶模块的组装良品率。
为达成本发明的前述目的，本发明一实施例提供一种窄边框液晶模块，所述窄边框液晶模块包含：
一显示面板，包含一上玻璃基板及一下玻璃基板；
一背光模块，包含至少一光学膜片、一背板及至少一胶框，其中所述背板承载所述光学膜片，及所述胶框围绕于所述背板周围并用以承载所述显示面板；
一前框，围绕于所述胶框周围并用以固定所述显示面板，且所述前框与胶框之间形成一容置空间；
至少一膜上芯片型的挠性封装组件，位于所述容置空间内，并具有至少一芯片及一挠性电路板，所述芯片固定在所述挠性电路板朝向所述胶框的一表面上，所述挠性电路板的一端电性耦接于所述下玻璃基板上，及另一端电性耦接于一驱动电路板；及
至少一导引块，所述导引块为一导电泡棉块，其中所述导引块位于所述容置空间内及固定在所述前框的一内侧面上，并通过一双面胶与所述前框的内侧面紧密接合，且所述导引块具有一导引斜面，其面对所述挠性电路板。
在本发明的一实施例中，所述导引块的导引斜面与所述挠性电路板之间具有一间隙。
在本发明的一实施例中，所述导引块的导引斜面接触所述挠性电路板。
在本发明的一实施例中，所述导引块为一个截面呈三角形或梯形的条状物，其结合在所述前框的一角隅位置的内侧面上。
再者，本发明另一实施例提供另一种窄边框液晶模块，所述窄边框液晶模块包含：
一显示面板，包含一上玻璃基板及一下玻璃基板；
一背光模块，包含至少一光学膜片、一背板及至少一胶框，其中所述背板承载所述光学膜片，及所述胶框围绕于所述背板周围并用以承载所述显示面板；
一前框，围绕于所述胶框周围并用以固定所述显示面板，且所述前框与胶框之间形成一容置空间；
至少一膜上芯片型的挠性封装组件，位于所述容置空间内，并具有至少一芯片及一挠性电路板，所述芯片固定在所述挠性电路板朝向所述胶框的一表面上，所述挠性电路板的一端电性耦接于所述下玻璃基板上，及另一端电性耦接于一驱动电路板；及
至少一导引块，位于所述容置空间内及固定在所述前框的一内侧面上，所述导引块具有一导引斜面，其面对所述挠性电路板。
在本发明的一实施例中，所述导引块为一泡棉块。
在本发明的一实施例中，所述泡棉块为一导电泡棉。
在本发明的一实施例中，所述导引块为一硅胶块。
在本发明的一实施例中，所述硅胶块的硬度小于30度。
在本发明的一实施例中，所述导引块的导引斜面与所述挠性电路板之间具有一间隙。
在本发明的一实施例中，所述导引块的导引斜面接触所述挠性电路板。
在本发明的一实施例中，所述导引块通过一双面胶与所述前框的内侧面紧密接合。
在本发明的一实施例中，所述导引块为一个截面呈三角形或梯形的条状物，其结合在所述前框的一角隅位置的内侧面上。
再者，本发明又一实施例提供另一种窄边框液晶模块，其中所述窄边框液晶模块包含：
一显示面板，包含一上玻璃基板及一下玻璃基板；
一背光模块，包含至少一胶框，所述胶框用以承载所述显示面板；
一前框，围绕于所述胶框周围并用以固定所述显示面板，且所述前框与胶框之间形成一容置空间；
至少一挠性封装组件，位于所述容置空间内，并具有一挠性电路板，所述挠性电路板的一端电性耦接于所述下玻璃基板上，及另一端电性耦接于一驱动电路板；及
至少一导引块，位于所述容置空间内及固定在所述前框的一内侧面上，所述导引块具有一导引斜面，其面对所述挠性电路板。
在本发明的一实施例中，所述挠性封装组件为膜上芯片型或玻璃上芯片型的挠性封装组件。
 有益效果
与现有技术相比较，本发明的窄边框液晶模块，通过设置至少一导引块位于所述容置空间内及固定在所述前框的一内侧面上，所述导引块具有一导引斜面，其面对所述挠性电路板，可以在组装期间有效防止膜上芯片型的挠性封装组件的挠性电路板上翻剥落及损伤的问题，以相对提高窄边框液晶模块的组装良品率。
 附图说明
图1为本发明第一实施例窄边框液晶模块的组合剖视图；
图2为本发明第二实施例窄边框液晶模块的组合剖视图；
图3为本发明第三实施例窄边框液晶模块的组合剖视图。
 本发明的最佳实施方式
以下各实施例的说明是参考附加的图式，用以例示本发明可用以实施的特定实施例。再者，本发明所提到的方向用语，例如上、下、顶、底、前、后、左、右、内、外、侧面、周围、中央、水平、横向、垂直、纵向、轴向、径向、最上层或最下层等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。
请参照图1所示，本发明第一实施例提供一种窄边框液晶模块10，所述窄边框液晶模块100包含：一显示面板110、一背光模块120、一前框130、至少一膜上芯片型(chip on film, COF)的挠性封装组件140及至少一导引块150。本发明将于下文利用图1至2逐一详细说明第一实施例上述各组件的细部构造、组装关系及其运作原理。
请再参照图1所示，在本发明第一实施例的窄边框液晶模块100中，所述显示面板110包含一上玻璃基板111及一下玻璃基板112，其中所述上玻璃基板111及所述下玻璃基板112之间具有一液晶层，且所述下玻璃基板112的上表面的透明表面电路(未绘示)具有一连接部，作为电性连接之用。在本发明实施例中，所述连接部也可位于所述下玻璃基板112的下表面或端面，但不限于此。所述背光模块120包含至少一光学膜片121、一背板122及至少一胶框123，其中所述光学膜片121位于所述下玻璃基板112的下方，并以所述背板122承载所述光学膜片121。在本发明实施例中，所述光学膜片121例如可以包含至少一光学薄膜121a (optical thin films)、一导光板121b (light guide plate)及一反射板121c (reflector)，但不限于此，其中所述光学薄膜121a设置于所述导光板121b的前方，而所述反射板121c设置于所述导光板121b的后方。所述背板122通常由金属板冲压制成，所述背板122具有一底板及数个侧板。所述背板122的底板及所述光学膜片121的下表面之间(或所述背板122的侧板及所述光学膜片121的侧表面之间)另具有至少一背光源，例如为具有数个发光二极管的电路板(即灯条，light bar)。
接着，在本发明第一实施例的窄边框液晶模块100中，所述胶框123通常由塑料制成或由塑料与金属板复合而成，所述胶框123具有一本体部及一肩部，其中所述胶框123的本体部是一直立的板体，其围绕于所述背板122周围；而所述胶框123的肩部则是由本体部水平向内延伸而成的，并用以承载所述显示面板110。值得一提的是，在本发明实施例中，所述下玻璃基板112的下表面设有一缓冲垫113，例如泡棉，其设置在所述下玻璃基板112及所述胶框123的肩部之间，以便提供吸震作用。另外，所述前框130通常由金属板冲压制成，其围绕于所述胶框123周围并用以固定所述显示面板110，且所述前框130与胶框123之间形成一容置空间200。在本发明实施例中，所述膜上芯片型的挠性封装组件140位于所述容置空间200内，并具有至少一芯片(chip) 141及一挠性电路板(flexible printed circuit, FPC) 142。所述芯片141例如为闸极(gate)驱动用芯片，其固定在所述挠性电路板142朝向所述胶框123的一表面上，而所述挠性电路板142的一端通过金属凸块热压合技术电性耦接于所述下玻璃基板112的上表面、下表面或端面上的连接部，及另一端则电性耦接于一驱动电路板(driving circuit board) 160，所述驱动电路板160可以控制所述芯片141，以便所述芯片141通过所述挠性电路板142控制所述下玻璃基板112的薄膜晶体管数组(TFT array)电路的开关切换。
再者，在本发明第一实施例的窄边框液晶模块100中，所述窄边框液晶模块100具有至少一导引块150，其位于所述容置空间200内及固定在所述前框130的一内侧面上。在本发明实施例中，所述导引块150具有一导引斜面151，其面对所述挠性电路板142，且所述导引块为一具缓冲吸震作用的泡棉块，又所述泡棉块优选为一导电泡棉。在本发明另一实施例中，所述导引块150也可以为一硅胶块，且所述硅胶块的硬度小于30度或者所述导引块150也可以为同样具缓冲吸震作用的其他块状材料。值得一提的是，所述导引块150的导引斜面151与所述挠性电路板142之间可以具有一间隙，也就是所述导引块150的导引斜面151与所述挠性电路板142并无接触。
再者，所述导引块150通过一双面胶与所述前框130的内侧面紧密接合。如图1及图2所示，所述导引块150为一个截面呈三角形的条状物，其结合在所述前框130的一角隅位置的二内侧面上。上述特征的优点在于：在将所述前框130组装在所述背光模块120上的期间，所述导引块150的设置可在所述挠性电路板142发生变形时，经由所述导引块150的导引斜面151的阻挡，而有效避免所述挠性封装组件140的挠性电路板142上翻剥落及损伤的问题，以顺利导引所述挠性电路板142的下端(及驱动电路板160)朝下并落在预定组装位置，故本发明确实能相对提高窄边框液晶模块的组装良品率。
此外，请参照图2所示，本发明第二实施例的封装构造相似于本发明第一实施例，并大致沿用相同组件名称及图号，但第二实施例的差异特征在于：在本发明第二实施例的窄边框液晶模块100中，所述导引块150的导引斜面151也可松配合或紧配合的抵靠接触所述挠性电路板142的外侧表面，其同样可以有效避免所述挠性封装组件140的挠性电路板142上翻剥落及损伤的问题，以相对提高窄边框液晶模块的组装良品率。
请参照图3所示，本发明第三实施例的封装构造相似于本发明第一实施例，并大致沿用相同组件名称及图号，但第三实施例的差异特征在于：在本发明第三实施例的窄边框液晶模块100中，所述导引块150为一个截面呈梯形的条状物，其结合在所述前框130的一角隅位置的二内侧面上。另外，膜上芯片型的挠性封装组件(COF)也可改为玻璃上芯片型(chip on glass，COG)的挠性封装组件，其中所述芯片141直接设于所述下玻璃基板112的上表面或下表面的透明表面电路上，此时所述挠性电路板142上不具有芯片，仅单纯电性耦接于所述下玻璃基板112及驱动电路板160之间。在本实施例中，所述导引块150的导引斜面151同样可以有效避免所述挠性封装组件140的挠性电路板142上翻剥落及损伤的问题，以相对提高窄边框液晶模块的组装良品率。
如上所述，相较于现有窄边框液晶模块因为膜上芯片型的挠性封装组件(Gate COF)的老化、局部剥落时，造成所述芯片型的挠性封装组件向上翘起而刺伤显示面板的缺点，本发明的所述窄边框液晶模块在增加了所述导引块的装设后，其确实可以有一阻挡的效果，进而限定所述芯片型的挠性封装组件或所述挠性电路板(FPC)所存在的空间，以达到窄边框的设计。
本发明已由上述相关实施例加以描述，然而上述实施例仅为实施本发明的范例。必需指出的是，已公开的实施例并未限制本发明的范围。相反地，包含于权利要求书的精神及范围的修改及均等设置均包括于本发明的范围内。
 本发明的实施方式
工业实用性
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Claims (15)

  1. 一种窄边框液晶模块，所述窄边框液晶模块包含：
    一显示面板，包含一上玻璃基板及一下玻璃基板；
    一背光模块，包含至少一光学膜片、一背板及至少一胶框，其中所述背板承载所述光学膜片，及所述胶框围绕于所述背板周围并用以承载所述显示面板；
    一前框，围绕于所述胶框周围并用以固定所述显示面板，且所述前框与胶框之间形成一容置空间；
    至少一膜上芯片型的挠性封装组件，位于所述容置空间内，并具有至少一芯片及一挠性电路板，所述芯片固定在所述挠性电路板朝向所述胶框的一表面上，所述挠性电路板的一端电性耦接于所述下玻璃基板上，及另一端电性耦接于一驱动电路板；及
    至少一导引块，所述导引块为一导电泡棉块，其中所述导引块位于所述容置空间内及固定在所述前框的一内侧面上，并通过一双面胶与所述前框的内侧面紧密接合，且所述导引块具有一导引斜面，其面对所述挠性电路板。
  2. 如权利要求1所述的窄边框液晶模块，其中所述导引块的导引斜面与所述挠性电路板之间具有一间隙。
  3. 如权利要求1所述的窄边框液晶模块，其中所述导引块的导引斜面接触所述挠性电路板。
  4. 如权利要求1所述的窄边框液晶模块，其中所述导引块为一个截面呈三角形或梯形的条状物，其结合在所述前框的一角隅位置的内侧面上。
  5. 一种窄边框液晶模块，所述窄边框液晶模块包含：
    一显示面板，包含一上玻璃基板及一下玻璃基板；
    一背光模块，包含至少一光学膜片、一背板及至少一胶框，其中所述背板承载所述光学膜片，及所述胶框围绕于所述背板周围并用以承载所述显示面板；
    一前框，围绕于所述胶框周围并用以固定所述显示面板，且所述前框与胶框之间形成一容置空间；
    至少一膜上芯片型的挠性封装组件，位于所述容置空间内，并具有至少一芯片及一挠性电路板，所述芯片固定在所述挠性电路板朝向所述胶框的一表面上，所述挠性电路板的一端电性耦接于所述下玻璃基板上，及另一端电性耦接于一驱动电路板；及
    至少一导引块，位于所述容置空间内及固定在所述前框的一内侧面上，所述导引块具有一导引斜面，其面对所述挠性电路板。
  6. 如权利要求5所述的窄边框液晶模块，其中所述导引块为一泡棉块。
  7. 如权利要求6所述的窄边框液晶模块，其中所述泡棉块为一导电泡棉。
  8. 如权利要求5所述的窄边框液晶模块，其中所述导引块为一硅胶块。
  9. 如权利要求8所述的窄边框液晶模块，其中所述硅胶块的硬度小于30度。
  10. 如权利要求5所述的窄边框液晶模块，其中所述导引块的导引斜面与所述挠性电路板之间具有一间隙。
  11. 如权利要求5所述的窄边框液晶模块，其中所述导引块的导引斜面接触所述挠性电路板。
  12. 如权利要求5所述的窄边框液晶模块，其中所述导引块通过一双面胶与所述前框的内侧面紧密接合。
  13. 如权利要求5所述的窄边框液晶模块，其中所述导引块为一个截面呈三角形或梯形的条状物，其结合在所述前框的一角隅位置的内侧面上。
  14. 一种窄边框液晶模块，所述窄边框液晶模块包含：
    一显示面板，包含一上玻璃基板及一下玻璃基板；
    一背光模块，包含至少一胶框，所述胶框用以承载所述显示面板；
    一前框，围绕于所述胶框周围并用以固定所述显示面板，且所述前框与胶框之间形成一容置空间；
    至少一挠性封装组件，位于所述容置空间内，并具有一挠性电路板，所述挠性电路板的一端电性耦接于所述下玻璃基板上，及另一端电性耦接于一驱动电路板；及
    至少一导引块，位于所述容置空间内及固定在所述前框的一内侧面上，所述导引块具有一导引斜面，其面对所述挠性电路板。
  15. 如权利要求14所述的窄边框液晶模块，其中所述挠性封装组件为膜上芯片型或玻璃上芯片型的挠性封装组件。
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