WO2012167472A1 - 用于液晶面板的软板上芯片构造 - Google Patents

用于液晶面板的软板上芯片构造 Download PDF

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Publication number
WO2012167472A1
WO2012167472A1 PCT/CN2011/077043 CN2011077043W WO2012167472A1 WO 2012167472 A1 WO2012167472 A1 WO 2012167472A1 CN 2011077043 W CN2011077043 W CN 2011077043W WO 2012167472 A1 WO2012167472 A1 WO 2012167472A1
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WIPO (PCT)
Prior art keywords
chip structure
underlayer
liquid crystal
crystal panel
metal layer
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PCT/CN2011/077043
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English (en)
French (fr)
Inventor
廖良展
林柏伸
吴宇
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深圳市华星光电技术有限公司
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Priority to US13/264,856 priority Critical patent/US20120306047A1/en
Publication of WO2012167472A1 publication Critical patent/WO2012167472A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Definitions

  • the present invention relates to a soft on-board chip structure for a liquid crystal panel, and more particularly to a soft on-board chip structure capable of reducing deformation of a glass substrate of an array substrate when a chip structure on a soft board and a liquid crystal panel are thermocompression bonded.
  • Liquid crystal display Display LCD
  • LCD Liquid crystal display Display
  • FPD Fluorescence Deformation
  • the liquid crystal display panel In the current manufacturing process of the liquid crystal display panel, it can be roughly divided into an Array process, a middle cell process, and a rear module process.
  • the matrix process in the previous stage is to produce a thin film transistor (TFT) substrate (also called an array substrate) and a color filter (CF) substrate;
  • TFT thin film transistor
  • CF color filter
  • the middle segment forming process is responsible for combining the TFT substrate and the CF substrate, and injecting liquid crystal between the two.
  • the rear-end modular process is responsible for assembling the assembled panel with the backlight module, the panel driving circuit, the outer frame, and the like.
  • the assembly of the driving IC in the assembly process of the rear-end module is an assembly process in which the driving IC chip is combined with the LCD liquid crystal panel after being packaged.
  • package ICs for LCD driver ICs such as quad flat package (quad) Flat package, QFP), chip on glass (COG), tape automated bonding (tape automated) Bonding, TAB) and chip on chip (chip on Film, COF), etc.
  • the COF soft on-board chip structure is a process for driving the IC chip package because of its flexibility and smaller pitch.
  • FIG. 1 shows a top view of a conventional soft-board chip structure assembled to a liquid crystal panel.
  • FIG. 2 is a side cross-sectional view showing a conventional soft-board chip structure assembled to a liquid crystal panel.
  • a liquid crystal panel 91 has a color filter substrate 911 and a glass substrate 912 of an array substrate. The edge of the glass substrate 912 is provided with a flexible chip structure 92.
  • the on-chip structure 92 includes a glue underlayer 921, a metal layer 922, an adhesive layer 923, a driver chip 924, and an insulating protective layer 925.
  • the adhesive layer 921 is a flexible plastic substrate; a plurality of input ends 922a and a plurality of output ends 922b are disposed at two ends of the metal layer 922; and the adhesive layer 923 is disposed on the adhesive bottom layer 921. And the metal layer 922 and the adhesive layer 921 and the metal layer 922; the driving chip 924 is disposed on the outer surface of the adhesive layer 921 and electrically connected to the metal layer 922 ( The insulating protective layer 925 is disposed on the outer surface of the metal layer 922 and exposes the plurality of input ends 922a and the plurality of output ends 922b.
  • the on-chip structure 92 when the on-chip structure 92 is assembled with the glass substrate 912 of the array substrate, the plurality of output ends 922b of the chip-on-board configuration 92 of the flexible board and the glass
  • An anisotropic conductive film layer (anisotropic) is disposed between a plurality of contacts (not shown) at the edge of the substrate 912 Conductive film, ACF) 930, by heating and pressing (such as the direction of the arrow in FIG. 2) to the underlayer 921 above the plurality of output ends 922b, the plurality of output ends 922b and the plurality of glass substrates 912
  • the contacts are electrically connected to complete the assembly operation of the on-chip chip structure 92 and the liquid crystal panel 91.
  • the above assembly operation has a problem because the glass substrate 912 of the array substrate needs to be provided with a plurality of the on-chip structure 92, and the on-chip structure 92 is thermocompression bonded to the glass substrate. 912, thus causing deformation and undulation of the glass at the thermocompression bonding, so that the spacing of the upper and lower glass layers of the glass substrate 912 of the array substrate at the thermal compression bonding and the non-thermal compression bonding is different, thereby making light of different regions There is a difference in transmittance.
  • the present invention provides a soft on-board chip structure for a liquid crystal panel to solve the problem of the difference in the pitch of the glass substrate of the array substrate existing in the prior art.
  • the present invention provides a soft on-board chip structure for a liquid crystal panel, which is disposed on an edge of a glass substrate of an array substrate of a liquid crystal panel, and the chip structure on the soft board includes:
  • a glue bottom layer which is a rubber base layer of polyimide
  • a metal layer having a plurality of input ends and a plurality of output ends at both ends;
  • An adhesive layer disposed between the adhesive underlayer and the metal layer, and bonding the adhesive underlayer and the metal layer;
  • a driving chip disposed on an outer surface of the adhesive underlayer and electrically connected to the metal layer;
  • An insulating protective layer is disposed on an outer surface of the metal layer and exposing the plurality of input ends and the plurality of output ends;
  • the on-board chip structure further includes:
  • the present invention further provides a soft on-board chip structure for a liquid crystal panel, which is disposed on an edge of a glass substrate of an array substrate of a liquid crystal panel, and the chip structure on the soft board includes:
  • a metal layer having a plurality of input ends and a plurality of output ends at both ends;
  • An adhesive layer disposed between the adhesive underlayer and the metal layer, and bonding the adhesive underlayer and the metal layer;
  • a driving chip disposed on an outer surface of the adhesive underlayer and electrically connected to the metal layer;
  • An insulating protective layer is disposed on an outer surface of the metal layer and exposing the plurality of input ends and the plurality of output ends;
  • the on-board chip structure further includes:
  • the trench is disposed on the adhesive underlayer above the plurality of output ends of the metal layer, and the soft on-board chip structure is assembled with the glass substrate
  • An anisotropic conductive film layer is disposed between the plurality of output ends and the plurality of contacts on the edge of the glass substrate, and the adhesive underlayer is heated and pressurized on the plurality of output ends to make the plurality of The output ends are electrically connected to the plurality of contacts of the glass substrate.
  • the adhesive underlayer is a polyimide underlayer.
  • the at least one trench has a depth equal to or less than a thickness of the underlayer.
  • the at least one groove width is equal to or smaller than the thickness of the underlayer.
  • the at least one groove is linear.
  • the at least one groove is serrated.
  • the at least one groove is wavy.
  • the present invention further provides a soft on-board chip structure for a liquid crystal panel, which is disposed on an edge of a glass substrate of an array substrate of a liquid crystal panel, and the chip structure on the soft board includes:
  • a metal layer having a plurality of input ends and a plurality of output ends at both ends;
  • An adhesive layer disposed between the adhesive underlayer and the metal layer, and bonding the adhesive underlayer and the metal layer;
  • a driving chip disposed on an outer surface of the adhesive underlayer and electrically connected to the metal layer;
  • An insulating protective layer is disposed on an outer surface of the metal layer and exposing the plurality of input ends and the plurality of output ends;
  • the on-board chip structure further includes:
  • the adhesive underlayer is a polyimide underlayer.
  • the plurality of perforations have a depth equal to the thickness of the subbing layer.
  • the plurality of perforations have a diameter equal to or smaller than a thickness of the underlayer.
  • the invention provides a soft on-board chip structure for a liquid crystal panel, which is disposed on an edge of a glass substrate of an array substrate of a liquid crystal panel, wherein the chip structure on the soft board comprises a glue bottom layer, a metal layer, and a glue layer. A mixture layer, a driving chip and an insulating protective layer.
  • the soft on-board chip structure further includes at least one trench disposed on the adhesive underlayer above the plurality of output ends of the metal layer, the soft on-board chip structure and the array substrate When the glass substrate is assembled, the at least one groove prevents deformation damage of the glass substrate, and reduces a difference in brightness of the glass substrate at the thermal compression.
  • the invention provides a soft on-board chip structure for a liquid crystal panel, which is disposed on an edge of a glass substrate of an array substrate of a liquid crystal panel, wherein the chip structure on the soft board comprises a glue bottom layer, a metal layer, and a glue layer. A mixture layer, a driving chip and an insulating protective layer.
  • the soft on-board chip structure further includes at least one trench disposed on the adhesive underlayer above the plurality of output ends of the metal layer, the soft on-board chip structure and the array substrate When the glass substrate is assembled, the at least one groove prevents deformation damage of the glass substrate, and reduces a difference in brightness of the glass substrate at the thermal compression.
  • FIG. 1 is a top view of a conventional soft board chip structure assembled to a liquid crystal panel.
  • FIG. 2 is a side cross-sectional view showing a conventional soft-board chip structure assembled to a liquid crystal panel.
  • Fig. 3 is a top plan view showing a soft on-board chip structure assembled to a liquid crystal panel according to a first embodiment of the present invention.
  • FIG. 4 is a side cross-sectional view showing a soft on-board chip structure assembled to a liquid crystal panel according to a first embodiment of the present invention.
  • Fig. 5 is a top plan view showing a structure of a soft on-board chip assembled to a liquid crystal panel according to a second embodiment of the present invention.
  • Figure 6 is a top plan view showing a soft on-board chip structure assembled to a liquid crystal panel according to a third embodiment of the present invention.
  • Fig. 7 is a top plan view showing a structure of a soft on-board chip assembled to a liquid crystal panel according to a fourth embodiment of the present invention.
  • FIG. 3 is a top view showing a soft-board chip structure assembled on a liquid crystal panel according to a first embodiment of the present invention
  • FIG. 4 is a view showing a soft board according to a first embodiment of the present invention.
  • the upper chip structure is assembled in a side cross-sectional view of a liquid crystal panel.
  • a liquid crystal panel 10 has a color filter substrate 11 and a glass substrate 12 of an array substrate.
  • the edge of the glass substrate 12 is provided with a chip structure 20 on a soft board.
  • the on-board chip structure 20 includes an adhesive underlayer 21, a metal layer 22, an adhesive layer 23, a driving chip 24, and an insulating protective layer 25.
  • the adhesive bottom layer 21 is a flexible plastic substrate, such as polyimide (polyimide,
  • the metal layer 22 is, for example, a copper (Cu) metal layer, and the two ends of the metal layer 22 are provided with a plurality of input ends 22a and a plurality of output ends 22b;
  • the adhesive layer 23 is disposed on the Between the adhesive underlayer 21 and the metal layer 22, and bonding the adhesive underlayer 21 and the metal layer 22;
  • the driving chip 24 is disposed on the outer surface of the adhesive underlayer 21, and is electrically connected to the metal layer 22.
  • the insulating protective layer 25 is, for example, a green lacquer layer, and the insulating protective layer 25 is disposed on the outer surface of the metal layer 22, and exposes the plurality of input ends 22a and the plurality of Output 22b.
  • the on-board chip structure 20 further includes at least one trench 211a.
  • the trench 211a has a linear shape disposed above the plurality of output ends 22b of the metal layer 22.
  • the underlayer 21 of the gel On the underlayer 21 of the gel. Therefore, when the on-chip chip structure 20 is assembled with the glass substrate 12, the plurality of output ends 22b of the chip-on-board configuration 20 of the soft board and the plurality of contacts of the edge of the glass substrate 12 (not drawn An anisotropic conductive film layer (anisotropic) Conductive film, ACF) 30, the plurality of output ends 22b and the plurality of the glass substrates 12 are caused by heating and pressing (in the direction of the arrow in FIG. 4) to the adhesive underlayer 21 above the plurality of output ends 22b. The contacts are electrically connected to complete the assembly operation of the on-chip chip structure 20 and the liquid crystal panel 10.
  • the at least one trench 211a can make the material of the adhesive layer 21 laterally facing The gap formed by the at least one groove 211a is pushed to prevent deformation damage of the glass substrate 12 during assembly, and the difference in brightness of the glass substrate 12 at the thermal compression is reduced.
  • the depth of the at least one trench 211a is equal to or smaller than the thickness of the adhesive underlayer 21; the width of the at least one trench 211a is equal to or smaller than the thickness of the adhesive underlayer 21.
  • FIG. 5 is a top view of a soft-board chip structure assembled to a liquid crystal panel according to a second embodiment of the present invention.
  • the on-board chip structure 20 in this embodiment is similar to the on-board chip structure 20 of the first embodiment, so the same component symbols and names are used, but the difference is that at least one trench in this embodiment 211b is serrated.
  • the zigzag groove 211b enables the force applied to the rubber base layer 21 to be evenly dispersed in the X and Y directions in the horizontal direction.
  • FIG. 6 is a top view of a soft-board chip structure assembled to a liquid crystal panel according to a third embodiment of the present invention.
  • the on-board chip structure 20 in this embodiment is similar to the on-board chip structure 20 of the first embodiment and the second embodiment, so the same component symbols and names are used, but the difference is: in this embodiment At least one groove 211c is wavy. The undulating groove 211c also enables an average dispersion of the force applied to the underlayer 21 in the X and Y directions in the horizontal direction.
  • FIG. 7 is a top view of a soft-board chip structure assembled to a liquid crystal panel according to a fourth embodiment of the present invention.
  • the on-board chip structure 20 in this embodiment is as large as the on-board chip structure 20 of other embodiments of the present invention, so the same component symbols and names are used, but the difference is that the chip layout on the soft board 20 further includes a plurality of through holes 211d for replacing the grooves (211a, 211b, 211c) of other embodiments, the through holes 211d being provided on the adhesive underlayer 21 above the plurality of output ends 22b of the metal layer 22. .
  • the depth of the through hole 211d is equal to the thickness of the adhesive underlayer 21; the diameter of the plurality of through holes 211d is equal to or smaller than the thickness of the adhesive underlayer 21, thereby producing a groove similar to other embodiments (211a, 211b, 211c) effect.
  • the glass substrate of the array substrate is hot-pressed and deformed, which causes the glass of the array substrate to be deformed and undulated, so that the glass substrate of the array substrate is hot-pressed and free.
  • the on-board chip structure 20 of the present invention is provided with at least one trench (211a, 211b, 211c) or the plurality of vias 211d on the adhesive underlayer 21 above the plurality of output ends 22b of the metal layer 22.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
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Abstract

一种用于液晶面板（10）的软板上芯片构造（20），其设于一液晶面板（10）的一阵列基板的玻璃基板（12）的边缘，所述软板上芯片构造（20）包含一胶底层（21）、一金属层（22）、一粘合剂层（23）、一驱动芯片（24）及一绝缘保护层（25）。所述软板上芯片构造（20）另包含至少一个沟槽（211a、211b、211c），所述沟槽（211a、211b、211c）高于所述金属层（22）的多个输出端（22b）上方的所述胶底层（21）上，所述软板上芯片构造（20）与所述阵列基板的玻璃基板（12）组装时，所述至少一沟槽（211a、211b、211c）防止所述玻璃基板（12）发生变形损伤，并减少热压合处的所述玻璃基板（12）产生亮度差异。

Description

用于液晶面板的软板上芯片构造 技术领域
本发明涉及一种用于液晶面板的软板上芯片构造，特别是涉及一种可减少软板上芯片构造与液晶面板热压合时阵列基板的玻璃基板产生变形的软板上芯片构造。
 背景技术
液晶显示器(liquid crystal display，LCD)是利用液晶材料的特性来显示图像的一种平板显示装置(flat panel display，FPD)，其相较于其他显示装置而言更具轻薄、低驱动电压及低功耗等优点，已经成为整个消费市场上的主流产品。
现今液晶显示面板的制作过程中，大致可分为前段矩阵(Array)工艺、中段成盒(Cell)工艺及后段模块化(Module)工艺。前段的矩阵工艺为生产薄膜式晶体管(TFT)基板(又称阵列基板)及彩色滤光片(CF)基板；中段成盒工艺则负责将TFT基板与CF基板组合，并两者之间注入液晶与切割合乎产品尺寸之面板；后段模块化工艺则负责将组合后的面板与背光模块、面板驱动电路、外框等做组装的工艺。
其中，后段模块组装工艺中的驱动IC的组装，是将驱动IC芯片经过封装之后要与LCD液晶面板组合在一起的组装工艺。LCD用驱动IC芯片的封装形式有许多种类，例如四边扁平封装(quad flat package, QFP)、玻璃上芯片(chip on glass，COG)、带载自动键合(tape automated bonding，TAB)及软板上芯片(chip on film，COF)等。其中，COF软板上芯片构造因具有可挠性及更小的间距，因此成为驱动IC芯片封装的工艺。
请参照图1及图2所示，图1揭示现有一种软板上芯片构造组装于一液晶面板的上视图；图2揭示现有一种软板上芯片构造组装于一液晶面板的侧剖视图。如图1及图2所示，一液晶面板91具有一彩色滤光片基板911及一阵列基板的玻璃基板912，所述玻璃基板912的边缘设有一软板上芯片构造92。所述软板上芯片构造92包含:一胶底层921、一金属层922、一粘合剂层923、一驱动芯片924及一绝缘保护层925。所述胶底层921是一具挠性的塑胶基板；所述金属层922的两端设有多个输入端922a及多个输出端922b；所述粘合剂层923设于所述胶底层921及所述金属层922之间，并粘合所述胶底层921及所述金属层922；所述驱动芯片924设于所述胶底层921外表面，并与所述金属层922电性连接(未绘示)；所述绝缘保护层925设于所述金属层922外表面，并曝露所述多个输入端922a及所述多个输出端922b。
如图1及图2所示，当所述软板上芯片构造92与所述阵列基板的玻璃基板912组装时，所述软板上芯片构造92的所述多个输出端922b与所述玻璃基板912边缘的多个接点(未绘示)之间设有一各向异性导电膜层(anisotropic conductive film, ACF)930，通过加热加压(如图2中的箭头方向)于所述多个输出端922b上方的所述胶底层921，使所述多个输出端922b与所述玻璃基板912的多个接点电性连接，从而完成所述软板上芯片构造92与所述液晶面板91的组装作业。
然而，上述组装作业存在一问题，因为所述阵列基板的玻璃基板912需要设置多个所述软板上芯片构造92，而所述软板上芯片构造92是经热压合到所述玻璃基板912上，因此会导致热压合处的玻璃产生变形和起伏，使得阵列基板的玻璃基板912在热压合处及无热压合处的上下层玻璃的间距出现差异，因而使不同区域光的透射率有差异。
因此，有必要提供一种用于液晶面板的软板上芯片构造，以解决现有技术所存在的问题。
 技术问题
本发明提供一种用于液晶面板的软板上芯片构造，以解决现有技术所存在的阵列基板的玻璃基板间距出现差异的问题。
 技术解决方案
为达上述目的，本发明提供一种用于液晶面板的软板上芯片构造，其设于一液晶面板的一阵列基板的玻璃基板的边缘，所述软板上芯片构造包含：
一胶底层，是一聚酰亚胺的胶底层；
一金属层，两端设有多个输入端及多个输出端；
一粘合剂层，设于所述胶底层及所述金属层之间，并粘合所述胶底层及所述金属层；
一驱动芯片，设于所述胶底层外表面，并与所述金属层电性连接；及
一绝缘保护层，设于所述金属层外表面，并曝露所述多个输入端及所述多个输出端；
所述软板上芯片构造另包含：
至少一锯齿状的沟槽，所述沟槽设于所述金属层的多个输出端上方的所述胶底层上，所述软板上芯片构造与所述玻璃基板组装时，所述软板上芯片构造的所述多个输出端与所述玻璃基板边缘的多个接点之间设有一各向异性导电膜层，通过加热加压于所述多个输出端上方的所述胶底层，使所述多个输出端与所述玻璃基板的多个接点电性连接。为达上述目的，本发明另提供一种用于液晶面板的软板上芯片构造，其设于一液晶面板的一阵列基板的玻璃基板的边缘，所述软板上芯片构造包含：
一胶底层；
一金属层，两端设有多个输入端及多个输出端；
一粘合剂层，设于所述胶底层及所述金属层之间，并粘合所述胶底层及所述金属层；
一驱动芯片，设于所述胶底层外表面，并与所述金属层电性连接；及
一绝缘保护层，设于所述金属层外表面，并曝露所述多个输入端及所述多个输出端；
所述软板上芯片构造另包含：
至少一沟槽，所述沟槽设于所述金属层的多个输出端上方的所述胶底层上，所述软板上芯片构造与所述玻璃基板组装时，所述软板上芯片构造的所述多个输出端与所述玻璃基板边缘的多个接点之间设有一各向异性导电膜层，通过加热加压于所述多个输出端上方的所述胶底层，使所述多个输出端与所述玻璃基板的多个接点电性连接。
在本发明的一实施例中，所述胶底层是一聚酰亚胺的胶底层。
在本发明的一实施例中，所述至少一沟槽深度等于或小于所述胶底层的厚度。
在本发明的一实施例中，所述至少一沟槽宽度等于或小于所述胶底层的厚度。
在本发明的一实施例中，所述至少一沟槽呈直线状。
在本发明的一实施例中，所述至少一沟槽呈锯齿状。
在本发明的一实施例中，所述至少一沟槽呈波浪状。
为达上述目的，本发明另提供一种用于液晶面板的软板上芯片构造，其设于一液晶面板的一阵列基板的玻璃基板的边缘，所述软板上芯片构造包含：
一胶底层；
一金属层，两端设有多个输入端及多个输出端；
一粘合剂层，设于所述胶底层及所述金属层之间，并粘合所述胶底层及所述金属层；
一驱动芯片，设于所述胶底层外表面，并与所述金属层电性连接；及
一绝缘保护层，设于所述金属层外表面，并曝露所述多个输入端及所述多个输出端；
所述软板上芯片构造另包含：
多个穿孔，所述穿孔设于所述金属层的多个输出端上方的所述胶底层上，所述软板上芯片构造与所述玻璃基板组装时，所述软板上芯片构造的所述多个输出端与所述玻璃基板边缘的多个接点之间设有一各向异性导电膜层，通过加热加压于所述多个输出端上方的所述胶底层，使所述多个输出端与所述玻璃基板的多个接点电性连接。
在本发明的一实施例中，所述胶底层是一聚酰亚胺的胶底层。
在本发明的一实施例中，所述多个穿孔深度等于所述胶底层的厚度。
在本发明的一实施例中，所述多个穿孔直径等于或小于所述胶底层的厚度。
本发明提供一种用于液晶面板的软板上芯片构造，其设于一液晶面板的一阵列基板的玻璃基板的边缘，所述软板上芯片构造包含一胶底层、一金属层、一粘合剂层、一驱动芯片及一绝缘保护层。所述软板上芯片构造另包含至少一沟槽，所述沟槽设于所述金属层的多个输出端上方的所述胶底层上，所述软板上芯片构造与所述阵列基板的玻璃基板组装时，所述至少一沟槽防止所述玻璃基板发生变形损伤，并减少热压合处的所述玻璃基板产生亮度差异。
 有益效果
本发明提供一种用于液晶面板的软板上芯片构造，其设于一液晶面板的一阵列基板的玻璃基板的边缘，所述软板上芯片构造包含一胶底层、一金属层、一粘合剂层、一驱动芯片及一绝缘保护层。所述软板上芯片构造另包含至少一沟槽，所述沟槽设于所述金属层的多个输出端上方的所述胶底层上，所述软板上芯片构造与所述阵列基板的玻璃基板组装时，所述至少一沟槽防止所述玻璃基板发生变形损伤，并减少热压合处的所述玻璃基板产生亮度差异。
附图说明
图1：现有一种软板上芯片构造组装于一液晶面板的上视图。
图2：现有一种软板上芯片构造组装于一液晶面板的侧剖视图。
图3：本发明第一实施例的一种软板上芯片构造组装于一液晶面板的上视图。
图4：本发明第一实施例的一种软板上芯片构造组装于一液晶面板的侧剖视图。
图5：本发明第二实施例的一种软板上芯片构造组装于一液晶面板的上视图。
图6：本发明第三实施例的一种软板上芯片构造组装于一液晶面板的上视图。
图7：本发明第四实施例的一种软板上芯片构造组装于一液晶面板的上视图。
 本发明的最佳实施方式
为让本发明上述目的、特征及优点更明显易懂，下文特举本发明较佳实施例，并配合附图，作详细说明如下。再者，本发明所提到的方向用语，例如「上」、「下」、「前」、「后」、「左」、「右」、「内」、「外」、「侧面」等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。
请参照图3及图4所示，图3揭示本发明第一实施例的一种软板上芯片构造组装于一液晶面板的上视图；图4揭示本发明第一实施例的一种软板上芯片构造组装于一液晶面板的侧剖视图。如图3及图4所示，一液晶面板10具有一彩色滤光片基板11及一阵列基板的玻璃基板12，所述玻璃基板12的边缘设有一软板上芯片构造20。所述软板上芯片构造20包含:一胶底层21、一金属层22、一粘合剂层23、一驱动芯片24及一绝缘保护层25。所述胶底层21是一具挠性的塑胶基板，例如为聚酰亚胺(polyimide, PI)；所述金属层22例如为铜(Cu)金属层，所述金属层22的两端设有多个输入端22a及多个输出端22b；所述粘合剂层23设于所述胶底层21及所述金属层22之间，并粘合所述胶底层21及所述金属层22；所述驱动芯片24设于所述胶底层21外表面，并与所述金属层22电性连接(未绘示)；所述绝缘保护层25例如为绿漆层，所述绝缘保护层25设于所述金属层22外表面，并曝露所述多个输入端22a及所述多个输出端22b。
另外，所述软板上芯片构造20另包含至少一沟槽211a，如图4所示，所述沟槽211a呈一直线状的设于所述金属层22的多个输出端22b上方的所述胶底层21上。因此，当所述软板上芯片构造20与所述玻璃基板12组装时，所述软板上芯片构造20的所述多个输出端22b与所述玻璃基板12边缘的多个接点(未绘示)之间设有一各向异性导电膜层(anisotropic conductive film, ACF)30，通过加热加压(如图4中的箭头方向)于所述多个输出端22b上方的所述胶底层21，使所述多个输出端22b与所述玻璃基板12的多个接点电性连接，从而完成所述软板上芯片构造20与所述液晶面板10的组装作业。
由于，所述软板上芯片构造20是经热压将到所述玻璃基板12，当施加压力过大时，所述至少一沟槽211a可使所述胶底层21的材料侧向的朝所述至少一沟槽211a所形成的空隙推挤，从而防止所述玻璃基板12在组装时发生变形损伤，并减少热压合处的所述玻璃基板12产生亮度差异。优选的，所述至少一沟槽211a的深度等于或小于所述胶底层21的厚度；所述至少一沟槽211a的宽度等于或小于所述胶底层21的厚度。
请参照图5所示，图5是本发明第二实施例的一种软板上芯片构造组装于一液晶面板的上视图。本实施例中的软板上芯片构造20相似于第一实施例的软板上芯片构造20，因此沿用相同的组件符号与名称，但其不同之处在于：本实施例中的至少一沟槽211b呈锯齿状。所述锯齿状的沟槽211b能使施加于所述胶底层21的力量，在水平方向的X及Y方向上都能获得平均分散。
请参照图6所示，图6是本发明第三实施例的一种软板上芯片构造组装于一液晶面板的上视图。本实施例中的软板上芯片构造20相似于第一实施例及第二实施例的软板上芯片构造20，因此沿用相同的组件符号与名称，但其不同之处在于：本实施例中的至少一沟槽211c呈波浪状。所述波浪状的沟槽211c亦能使施加于所述胶底层21的力量，在水平方向的X及Y方向上都能获得平均分散。
请参照图7所示，图7是本发明第四实施例的一种软板上芯片构造组装于一液晶面板的上视图。本实施例中的软板上芯片构造20大至相似本发明其他实施例的软板上芯片构造20，因此沿用相同的组件符号与名称，但其不同之处在于：所述软板上芯片构造20另包含多个穿孔211d，用以取代其他实施例的沟槽(211a,211b,211c)，所述穿孔211d设于所述金属层22的多个输出端22b上方的所述胶底层21上。
优选的，所述穿孔211d的深度等于所述胶底层21的厚度；所述多个穿孔211d的直径等于或小于所述胶底层21的厚度，从而产生相似于其他实施例的沟槽(211a,211b,211c)的效果。
综上所述，相较于现有软板上芯片构造热压到阵列基板的玻璃基板时，会导致热压合处的玻璃产生变形和起伏，使得阵列基板的玻璃基板热压合处及无热压合处的上下层玻璃的间距出现差异，因而不同区域光的透射率有差异。本发明的软板上芯片构造20通过在所述金属层22的多个输出端22b上方的所述胶底层21上设有至少一沟槽(211a,211b,211c)或所述多个穿孔211d的设计，当将所述软板上芯片构造20是热压至所述阵列基板的玻璃基板12上时，可防止所述玻璃基板12在组装时发生变形损伤，并减少热压合处的所述玻璃基板12产生亮度差异。
本发明已由上述相关实施例加以描述，然而上述实施例仅为实施本发明的范例。必需指出的是，已公开的实施例并未限制本发明的范围。相反地，包含于权利要求书的精神及范围的修改及均等设置均包括于本发明的范围内。
 本发明的实施方式
工业实用性
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Claims (14)

  1. 一种用于液晶面板的软板上芯片构造，其设于一液晶面板的一阵列基板的玻璃基板的边缘，所述软板上芯片构造包含：
    一胶底层，是一聚酰亚胺的胶底层；
    一金属层，两端设有多个输入端及多个输出端；
    一粘合剂层，设于所述胶底层及所述金属层之间，并粘合所述胶底层及所述金属层；
    一驱动芯片，设于所述胶底层外表面，并与所述金属层电性连接；及
    一绝缘保护层，设于所述金属层外表面，并曝露所述多个输入端及所述多个输出端；
    所述软板上芯片构造的特征在于：所述软板上芯片构造另包含：
    至少一锯齿状的沟槽，所述沟槽设于所述金属层的多个输出端上方的所述胶底层上，所述软板上芯片构造与所述玻璃基板组装时，所述软板上芯片构造的所述多个输出端与所述玻璃基板边缘的多个接点之间设有一各向异性导电膜层，通过加热加压于所述多个输出端上方的所述胶底层，使所述多个输出端与所述玻璃基板的多个接点电性连接。
  2. 如权利要求1所述的用于液晶面板的软板上芯片构造，其特征在于：所述至少一沟槽深度等于或小于所述胶底层的厚度。
  3. 如权利要求1所述的用于液晶面板的软板上芯片构造，其特征在于：所述至少一沟槽宽度等于或小于所述胶底层的厚度。
  4. 一种用于液晶面板的软板上芯片构造，其设于一液晶面板的一阵列基板的玻璃基板的边缘，所述软板上芯片构造包含：
    一胶底层；
    一金属层，两端设有多个输入端及多个输出端；
    一粘合剂层，设于所述胶底层及所述金属层之间，并粘合所述胶底层及所述金属层；
    一驱动芯片，设于所述胶底层外表面，并与所述金属层电性连接；及
    一绝缘保护层，设于所述金属层外表面，并曝露所述多个输入端及所述多个输出端；
    所述软板上芯片构造的特征在于：所述软板上芯片构造另包含：
    至少一沟槽，所述沟槽设于所述金属层的多个输出端上方的所述胶底层上，所述软板上芯片构造与所述玻璃基板组装时，所述软板上芯片构造的所述多个输出端与所述玻璃基板边缘的多个接点之间设有一各向异性导电膜层，通过加热加压于所述多个输出端上方的所述胶底层，使所述多个输出端与所述玻璃基板的多个接点电性连接。
  5. 如权利要求4所述的用于液晶面板的软板上芯片构造，其特征在于：所述胶底层是一聚酰亚胺的胶底层。
  6. 如权利要求4所述的用于液晶面板的软板上芯片构造，其特征在于：所述至少一沟槽深度等于或小于所述胶底层的厚度。
  7. 如权利要求4所述的用于液晶面板的软板上芯片构造，其特征在于：所述至少一沟槽宽度等于或小于所述胶底层的厚度。
  8. 如权利要求4所述的用于液晶面板的软板上芯片构造，其特征在于：所述至少一沟槽呈直线状。
  9. 如权利要求4所述的用于液晶面板的软板上芯片构造，其特征在于：所述至少一沟槽呈锯齿状。
  10. 如权利要求4所述的用于液晶面板的软板上芯片构造，其特征在于：所述至少一沟槽呈波浪状。
  11. 一种用于液晶面板的软板上芯片构造，其设于一液晶面板的一阵列基板的玻璃基板的边缘，所述软板上芯片构造包含：
    一胶底层；
    一金属层，两端设有多个输入端及多个输出端；
    一粘合剂层，设于所述胶底层及所述金属层之间，并粘合所述胶底层及所述金属层；
    一驱动芯片，设于所述胶底层外表面，并与所述金属层电性连接；及
    一绝缘保护层，设于所述金属层外表面，并曝露所述多个输入端及所述多个输出端；
    所述软板上芯片构造的特征在于：所述软板上芯片构造另包含：
    多个穿孔，所述穿孔设于所述金属层的多个输出端上方的所述胶底层上，所述软板上芯片构造与所述玻璃基板组装时，所述软板上芯片构造的所述多个输出端与所述玻璃基板边缘的多个接点之间设有一各向异性导电膜层，通过加热加压于所述多个输出端上方的所述胶底层，使所述多个输出端与所述玻璃基板的多个接点电性连接。
  12. 如权利要求11所述的用于液晶面板的软板上芯片构造，其特征在于：所述胶底层是一聚酰亚胺的胶底层。
  13. 如权利要求11所述的用于液晶面板的软板上芯片构造，其特征在于：所述多个穿孔深度等于所述胶底层的厚度。
  14. 如权利要求11所述的用于液晶面板的软板上芯片构造，其特征在于：所述多个穿孔直径等于或小于所述胶底层的厚度。
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1475834A (zh) * 2002-07-26 2004-02-18 ��ʽ����������ʾ�� 显示装置
CN1542503A (zh) * 2003-04-30 2004-11-03 友达光电股份有限公司 软膜结构
CN101013237A (zh) * 2007-02-06 2007-08-08 京东方科技集团股份有限公司 波浪形涂布结构
KR20080001503A (ko) * 2006-06-29 2008-01-03 엘지.필립스 엘시디 주식회사 액정표시소자
CN201536453U (zh) * 2009-09-24 2010-07-28 北京京东方光电科技有限公司 Cof柔性电路板

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1475834A (zh) * 2002-07-26 2004-02-18 ��ʽ����������ʾ�� 显示装置
CN1542503A (zh) * 2003-04-30 2004-11-03 友达光电股份有限公司 软膜结构
KR20080001503A (ko) * 2006-06-29 2008-01-03 엘지.필립스 엘시디 주식회사 액정표시소자
CN101013237A (zh) * 2007-02-06 2007-08-08 京东方科技集团股份有限公司 波浪形涂布结构
CN201536453U (zh) * 2009-09-24 2010-07-28 北京京东方光电科技有限公司 Cof柔性电路板

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