CN101013237A - 波浪形涂布结构 - Google Patents

波浪形涂布结构 Download PDF

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Publication number
CN101013237A
CN101013237A CN200710063601.7A CN200710063601A CN101013237A CN 101013237 A CN101013237 A CN 101013237A CN 200710063601 A CN200710063601 A CN 200710063601A CN 101013237 A CN101013237 A CN 101013237A
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wave
shaped
coating layer
cof
tab
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周耀东
金炯昊
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BOE Technology Group Co Ltd
Beijing BOE Optoelectronics Technology Co Ltd
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BOE Technology Group Co Ltd
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Priority to CN200710063601.7A priority Critical patent/CN101013237A/zh
Publication of CN101013237A publication Critical patent/CN101013237A/zh
Priority to US11/956,041 priority patent/US20080187720A1/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/2457—Parallel ribs and/or grooves

Abstract

本发明涉及一种波浪形涂布结构，包括涂覆在TAB/COF上的S/R涂布层，所述S/R涂布层上设置有使其边缘形成波浪状的数个凹部。所述凹部的宽度为1～10个引线单位，所述凹部的形状为矩形、梯形、U形或V形。本发明通过在S/R涂布层的边缘设置数个凹部，使S/R涂布层的边缘形成波浪状，该波浪状边缘中没有涂覆S/R涂布层的区域形成一个在压接时ACF粒子可被排斥到的空间，增大ACF粒子的流动空间，减少ACF粒子的堆积，最终避免TAB/COF引线短路。

Description

波浪形涂布结构
技术领域
本发明涉及一种应用于LCD生产用TAB/COF结构，特别是一种TAB/COF上S/R的波浪形涂布结构。
背景技术
驱动芯片集成电路(简称TAB/COF，Tape Automated Bonding，简称TAB；Chip On Film，简称COF)制作流程中，主要采用外部引线压接(OuterLead Bonding，简称OLB)方式。OLB压接是通过一定密度的导电粒子使COF引线和面板引线进行纵向导通(横向不导通)，导电粒子为各向异性导电胶(Anisotropic Conductive Film，简称ACF)。而TAB/COF上涂布绝缘焊锡(Solider Resistance，简称S/R)的目的是为了在压接过程中防止异物入侵。
现有技术的S/R涂布层为类矩形状(如图6所示)，在压接区域的边缘为直线形(如图7所示)。该种直线形S/R涂布结构在实际生产中存在如下技术缺陷：
(1)压接时，如果S/R涂布层超出面板边缘时，出现COF引线暴露，会引起异物P(Particle)导致的TAB/COF引线短路，如图8所示；
(2)如果为了防止异物进入而调整S/R涂布区位置靠近面板时，则有可能导致ACF粒子在S/R涂布区边缘形成堆积，也会导致TAB/COF引线短路，如图9所示。
一般，COF引线宽27μm，ACF导电粒子的直径为4μm。现有技术一般通过提高S/R涂布层边缘直线形的精度来解决上述问题，使直线形的精度达到±0.1mm以内。该方法的优点是实现过程较简单，实施成本较低。但将直线形精度大幅度提高比较难以实现，而且现有技术的方法无法防止ACF粒子堆积。
发明内容
本发明的目的是提供一种，有效解决现有技术直线形S/R涂布结构出现ACF在S/R涂布区边缘形成堆积导致TAB/COF引线短路等技术缺陷。
为了实现上述目的，本发明提供了一种波浪形涂布结构，包括涂覆在TAB/COF上的S/R涂布层，所述S/R涂布层上设置有使其边缘形成波浪状的数个凹部。
所述凹部设置在S/R涂布层的玻璃基板与TAB/COF压接区域，所述凹部的宽度为1～10个引线单位，优选为1～6个引线单位。
所述凹部的形状为矩形、梯形、U形或V形。
本发明提出了一种具有波浪状边缘的波浪形涂布结构，通过在S/R涂布层的边缘设置数个凹部，使S/R涂布层的边缘形成波浪状，在防止异物进入的同时，该波浪状边缘中没有涂覆S/R涂布层的区域形成一个在压接时ACF粒子可被排斥到的空间，增大ACF粒子的流动空间，减少ACF粒子的堆积，最终避免TAB/COF引线短路。进一步地，本发明降低了生产流程中引线缺陷的不良率，并简化了生产管理。
下面通过附图和实施例，对本发明的技术方案做进一步的详细描述。
附图说明
图1为本发明波浪形涂布结构的示意图；
图2为本发明S/R涂布层凹部的结构示意图；
图3a～图3c为本发明梯形、U形和V形凹部的结构示意图；
图4为本发明引线间设置凹部的结构示意图。
图5a～图5c为本发明U形、梯形和矩形凹部的结构示意图；
图6为现有技术S/R涂布结构的示意图；
图7为图6中局部A的放大图；
图8、图9为压接示意图。
具体实施方式
图1为本发明波浪形涂布结构的示意图。如图1所示，S/R涂布层10涂覆在TAB/COF 100上，整体上仍呈矩形状。TAB/COF的上部为印刷电路板与TAB/COF压接(Bonding PCB)区域20，下部为玻璃基板与TAB/COF压接(Bonding Cell)区域30。印刷电路板与TAB/COF压接区域20中引线之间的间距较大，为400μm左右，不会产生ACF粒子堆积现象。玻璃基板与TAB/COF压接区域30中引线之间的间距较小，为60μm左右，容易产生ACF粒子堆积现象，以至导致TAB/COF引线短路。本发明在玻璃基板与TAB/COF压接区域中S/R涂布层10的边缘设置有数个凹部40，使S/R涂布层的边缘形成波浪状，以增大该区域内ACF粒子的流动空间，减少ACF粒子的堆积，最终实现避免TAB/COF引线短路的目的。
图2为本发明S/R涂布层凹部的结构示意图。本实施例的凹部40为矩形状，依次设置在S/R涂布层的边缘上，形成一种波浪状边缘。该波浪状边缘中没有涂覆S/R涂布层的区域因此形成一个在压接时ACF粒子可被排斥到的空间，因此可减少ACF粒子的堆积。凹部40的宽度T可以为1～10个引线单位，优选为1～6个引线单位，在压接时可以达到在防止异物(Particle)进入的同时，通过凹部40在TAB/COF引线之间留出一定的空间，增大ACF粒子的流动，从而减少ACF粒子的堆积。其中，引线单位是指TAB/COF引线宽度和引线间宽度之和。
在本发明上述技术方案基础上，凹部的形状可以进一步是梯形(如图3a所示)、U形(如图3b所示)、V形(如图3c所示)或本领域技术人员惯常采用的形状。
当凹部的宽度为1个引线单位时，本发明上述技术方案增大ACF粒子的流动空间以减少ACF粒子堆积的效果更明显。图4为本发明引线间设置凹部的结构示意图。本实施例的凹部40为V形状，依次设置在S/R涂布层的边缘上，形成一种波浪状边缘。该波浪状边缘中没有涂覆S/R涂布层的区域因此形成一个在压接时ACF粒子可被排斥到的空间，因此可减少ACF粒子的堆积。V形的宽度T可以为1个引线单位，也可以等于引线间宽度，V形的高度B可以为200μm～300μm。这样，在压接时可以达到在防止异物(Particle)进入的同时，通过V形在引线之间留出一定的空间，增大ACF粒子的流动，从而减少ACF粒子的堆积。
在本发明上述技术方案基础上，凹部的形状可以进一步是U形(如图5a所示)、梯形(如图5b所示)、矩形(如图5c所示)或本领域技术人员惯常采用的形状。
最后所应说明的是，以上实施例仅用以说明本发明的技术方案而非限制，尽管参照较佳实施例对本发明进行了详细说明，本领域的普通技术人员应当理解，可以对本发明的技术方案进行修改或者等同替换，而不脱离本发明技术方案的精神和范围。

Claims (9)

1.一种波浪形涂布结构，包括涂覆在TAB/COF上的S/R涂布层，其特征在于，所述S/R涂布层上设置有使其边缘形成波浪状的数个凹部。
2.如权利要求1所述的波浪形涂布结构，其特征在于，所述凹部设置在S/R涂布层的玻璃基板与TAB/COF压接区域。
3.如权利要求1所述的波浪形涂布结构，其特征在于，所述凹部的宽度为1～10个引线单位。
4.如权利要求1所述的波浪形涂布结构，其特征在于，所述凹部的宽度为1～6个引线单位。
5.如权利要求1所述的波浪形涂布结构，其特征在于，所述凹部的宽度为1个引线单位。
6.如权利要求1～5任一所述的波浪形涂布结构，其特征在于，所述凹部的形状为矩形。
7.如权利要求1～5任一所述的波浪形涂布结构，其特征在于，所述凹部的形状为梯形。
8.如权利要求1～5任一所述的波浪形涂布结构，其特征在于，所述凹部的形状为U形。
9.如权利要求1～5任一所述的波浪形涂布结构，其特征在于，所述凹部的形状为V形。
CN200710063601.7A 2007-02-06 2007-02-06 波浪形涂布结构 Pending CN101013237A (zh)

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CN200710063601.7A CN101013237A (zh) 2007-02-06 2007-02-06 波浪形涂布结构
US11/956,041 US20080187720A1 (en) 2007-02-06 2007-12-13 Wave-shaped coating structure

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012167472A1 (zh) * 2011-06-06 2012-12-13 深圳市华星光电技术有限公司 用于液晶面板的软板上芯片构造
US9204529B2 (en) 2012-04-10 2015-12-01 Tpk Touch Solutions (Xiamen) Inc. Bonding structure
WO2020133260A1 (zh) * 2018-12-28 2020-07-02 深圳市柔宇科技有限公司 一种改善导电粒子聚集的fpc、导电结合结构和触控传感器

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3792554B2 (ja) * 2001-03-26 2006-07-05 シャープ株式会社 表示モジュール及びフレキシブル配線板の接続方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012167472A1 (zh) * 2011-06-06 2012-12-13 深圳市华星光电技术有限公司 用于液晶面板的软板上芯片构造
US9204529B2 (en) 2012-04-10 2015-12-01 Tpk Touch Solutions (Xiamen) Inc. Bonding structure
WO2020133260A1 (zh) * 2018-12-28 2020-07-02 深圳市柔宇科技有限公司 一种改善导电粒子聚集的fpc、导电结合结构和触控传感器

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