WO2014098195A1 - Support de film de masquage pour placage et film de masquage l'utilisant - Google Patents

Support de film de masquage pour placage et film de masquage l'utilisant Download PDF

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Publication number
WO2014098195A1
WO2014098195A1 PCT/JP2013/084138 JP2013084138W WO2014098195A1 WO 2014098195 A1 WO2014098195 A1 WO 2014098195A1 JP 2013084138 W JP2013084138 W JP 2013084138W WO 2014098195 A1 WO2014098195 A1 WO 2014098195A1
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Prior art keywords
masking film
plating
film support
masking
less
Prior art date
Application number
PCT/JP2013/084138
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English (en)
Japanese (ja)
Inventor
文子 中村
林　虎雄
Original Assignee
ソマール株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ソマール株式会社 filed Critical ソマール株式会社
Priority to JP2014553213A priority Critical patent/JP6318091B2/ja
Priority to CN201380065494.5A priority patent/CN104968841B/zh
Publication of WO2014098195A1 publication Critical patent/WO2014098195A1/fr
Priority to HK16101021.3A priority patent/HK1213027A1/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1605—Process or apparatus coating on selected surface areas by masking
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means

Definitions

  • the present invention relates to a masking film support for plating and a masking film used when a plating process is partially performed in a manufacturing process of a wiring board, and more specifically, selectively to a specific part such as a connection terminal of a flexible printed circuit board.
  • the present invention relates to a masking film support for plating and a maskin film used for plating.
  • a wiring board is formed by laminating a conductive layer made of copper foil or the like on an insulating base material via an adhesive layer as desired, and forming the conductive layer of the laminate into an arbitrary circuit pattern by etching or the like. Manufactured.
  • the surface of the formed circuit pattern is partially formed with a plating layer for reducing electric resistance, protecting the circuit surface from oxidation and abrasion, or for decoration.
  • Examples of the method of partially forming a plating layer on the circuit pattern of the wiring board include a method of punching out a portion of the masking film that is not masked, that is, a portion of the circuit pattern where the plating layer is formed. This step is performed using a punching machine such as punching at room temperature. After the stamped masking film is attached to the circuit pattern of the wiring board so that the plating layer is not formed on the non-plated portion, a desired plating layer is formed by performing electrolytic plating or electroless plating.
  • the surface of the wiring board (printed board, flexible printed board, etc.) to which the masking film is attached has complex irregularities of the previously formed circuit pattern. Therefore, it is necessary for the masking film to follow and adhere to the unevenness to prevent the plating solution from entering the mask portion (hereinafter referred to as “following ability to circuit pattern” or “following ability”).
  • following ability to circuit pattern or “following ability”.
  • Patent Document 1 proposes a masking film in which an adhesive layer is provided on a masking film support made of polyimide or polyester having an opening.
  • Patent Document 2 proposes a masking film (Patent Document 2) having an adhesive layer made of a specific propylene-based copolymer. It is described that this masking film is excellent in plating solution penetration resistance, has good peelability after plating, and is excellent in stain resistance and discoloration resistance in non-plated portions.
  • a base material for example, polyester, polyamide, a single system (homopolypropylene), a block system having an ethylene component as a copolymer component, a random system, Propylene-based polymers such as grafts, low-density, high-density, linear-low-density, ultra-low-density, etc.
  • thermodimensional stability dimensional stability against heat
  • a masking film (Patent Document 3) in which an adhesive layer is provided on a masking film support made of polybutylene terephthalate has been proposed as a means for overcoming the drawbacks of the masking film.
  • Such a masking film has excellent followability to a circuit pattern, and is excellent in thermal dimensional stability.
  • the masking film has a problem that the masking film support is stretched during punching. Therefore, there is a demand for a masking film that can be punched with high accuracy while having good followability to a circuit pattern.
  • JP-A-62-243791 Chinese Patent Laid-Open No. 2003-213485 (Claims 1, 2, and specification paragraph [0026]) JP 2008-300441 A (Claim 1)
  • the present invention provides a masking film support for a plating film and a masking film having good followability to a circuit pattern, excellent thermal dimensional stability, high plating formation accuracy, and excellent punching workability. With the goal.
  • the present inventors have found that the above-mentioned problem can be achieved by using a plating masking film support in which a specific inorganic filler is contained in polybutylene terephthalate and the tensile elastic modulus near room temperature is a predetermined value.
  • the masking film support for plating of the present invention is a masking film support for plating made of a polybutylene terephthalate film containing an inorganic filler, and the inorganic filler is a clay mineral and is 23% of the masking film support.
  • the tensile elastic modulus at the time of ° C. is 700 MPa or more and 5000 MPa or less.
  • the content of the clay mineral is preferably 10 parts by mass or more and 40 parts by mass or less with respect to 100 parts by mass of the resin component contained in the polybutylene terephthalate film.
  • the clay mineral preferably has a Mohs hardness of 3 or less.
  • the clay mineral is preferably at least one selected from talc, kaolinite, pyrophyllite, and mica.
  • the thickness of the support is preferably 4 ⁇ m or more and 125 ⁇ m or less, and the average particle diameter of the clay mineral is preferably 2 ⁇ m or more and 10 ⁇ m or less.
  • the tensile elastic modulus at 90 ° C. of the masking film support for plating of the present invention is 100 MPa or more and 1000 MPa or less, and the heat shrinkage in the vertical and horizontal directions after heating at 85 ° C. for 30 minutes is 1% or less.
  • the difference in heat shrinkage between the vertical direction and the horizontal direction is preferably 1% or less.
  • the plating masking film of the present invention is characterized by having an adhesive layer on one surface of the plating masking film support.
  • a masking film for plating having good followability to a circuit pattern, excellent thermal dimensional stability, high plating formation accuracy, and excellent punching workability. Can be provided.
  • the masking film support for plating according to the present invention is a polybutylene terephthalate containing a specific inorganic filler.
  • the polybutylene terephthalate resin composition used in the masking film support for plating according to the present invention includes a method of polycondensation of 1,4-butanediol and terephthalic acid, and 1,4-butanediol and terephthalic acid. And a method of polycondensation with a lower alkyl ester.
  • any polybutylene terephthalate resin composition obtained by any method can be used.
  • polybutylene terephthalate resin may be a copolymer or a modified body, and other resin compositions such as polyethylene terephthalate, polyethylene naphthalate, polycarbonate, Acetyl cellulose, polyimide, polyamide, polyethersulfone, polyetherimide, aromatic polyamide, polysulfone, acrylic, polyvinyl chloride, fluororesin, and the like can also be added.
  • resin compositions such as polyethylene terephthalate, polyethylene naphthalate, polycarbonate, Acetyl cellulose, polyimide, polyamide, polyethersulfone, polyetherimide, aromatic polyamide, polysulfone, acrylic, polyvinyl chloride, fluororesin, and the like can also be added.
  • the masking film support for plating of the present invention is characterized by containing a clay mineral as an inorganic filler.
  • the clay mineral has a structure in which scale-shaped particles are arranged in layers.
  • the aspect ratio of the clay mineral added to the masking film support is preferably 3 to 70, more preferably 5 to 50, and even more preferably 7 to 20.
  • the aspect ratio of the clay mineral is the ratio of long side length to thickness (long side length / thickness), and can be calculated by scanning electron microscope (SEM) observation of the surface and cross section of the masking film support. it can.
  • SEM scanning electron microscope
  • the volume occupancy of the clay mineral occupying the masking film support varies depending on the thickness of the masking film support, so it cannot be generally stated, but it is preferably 2% to 20% by volume, and 4% to 15% by volume. More preferably, the content is 5% by volume to 10% by volume.
  • the volume occupancy ratio of the clay mineral in the masking film support can be calculated by observing the surface and cross section of the masking film support with a scanning electron microscope (SEM).
  • SEM scanning electron microscope
  • the masking film support for plating of the present invention to which clay mineral is added is less fragile than the support to which other inorganic fillers are added, it is difficult to break when peeling the masking film from the circuit pattern.
  • scale-like particles are arranged in layers and clay minerals having a large surface area are dispersed. Therefore, thermal dimensional stability can be improved as compared with the case where other inorganic fillers are contained.
  • the masking film support for plating according to the present invention containing clay minerals the effect that cannot be obtained by a support containing other inorganic fillers such that the thermal shrinkage in the vertical and horizontal directions becomes more uniform. is there.
  • the masking film support for plating of the present invention when used as a masking film for plating, it is high-definition even if it is bonded from any direction without selecting the bonding direction to the circuit pattern of the masking film. Plating treatment is possible.
  • an excellent effect that cannot be obtained with a configuration in which inorganic fillers such as spherical particles, acicular particles, and irregular particles are added is obtained.
  • the above clay minerals include talc, kaolinite, pyrophyllite, mica, montmorillonite, smectite, sericite, illite, glowconite, chlorite, zeolite, vermiculite, limonite, saponite, dickite, nacrite, boehmite, zonotrite, Examples thereof include dolomite, calcite, zeviolite, and wollastonite.
  • clay minerals having a Mohs hardness of 3 or less are preferable. By setting the Mohs hardness to 3 or less, it is possible to suppress a decrease in the life of the blade used for punching.
  • talc, kaolinite, pyrophyllite, and mica are easy to handle and can be manufactured at low cost. From such a viewpoint, it is preferable to use at least one selected from the above clay minerals.
  • the content of the clay mineral contained in the masking film support for plating of the present invention has a lower limit of 10 parts by mass or more, and further 15 parts by mass or more with respect to 100 parts by mass of the resin component contained in the polybutylene terephthalate film.
  • the upper limit is preferably 40 parts by mass or less, and more preferably 30 parts by mass or less.
  • the size of such a clay mineral varies depending on the thickness of the masking film support for plating according to the present invention and cannot be generally stated.
  • the lower limit is preferably an average particle diameter of 2 ⁇ m or more, more preferably 4 ⁇ m or more.
  • the upper limit is preferably 10 ⁇ m or less, more preferably 8 ⁇ m or less.
  • Such a masking film support for plating is the above-mentioned polybutylene terephthalate containing the above clay mineral, and has a non-stretching process such as a T-die method or an inflation method, or a stretching process such as uniaxial stretching or biaxial stretching. It can produce by doing. When produced by non-stretching, it can have better followability to the circuit pattern, and when produced by stretching, it can be more excellent in thermal dimensional stability.
  • the masking film support for plating On at least one surface of the masking film support for plating, plasma treatment, corona discharge treatment, flame treatment, ozone treatment, ultraviolet irradiation treatment, electron beam irradiation treatment, radiation irradiation treatment, acid treatment, alkali treatment, chemical treatment Easy adhesion treatment such as chemical treatment, sand blast treatment, embossing treatment, and easy application of an undercoat easy adhesion layer may be performed.
  • a surface treatment such as an antistatic treatment, a peeling treatment, a concealing treatment, an embossing treatment or the like, if necessary.
  • the masking film support does not impair the function as a masking film for plating of the present invention
  • other resins surfactants, pigments, lubricants, colorants, antistatic agents, flame retardants, antibacterial agents
  • additives such as an agent, an antifungal agent, an ultraviolet absorber, a light stabilizer, an antioxidant, a leveling agent, a flow regulator, and an antifoaming agent can be included.
  • the thickness of such a masking film support for plating is preferably 4 ⁇ m or more, 8 ⁇ m or more, and more preferably 12 ⁇ m or more, and the upper limit is 125 ⁇ m, from the viewpoint of followability to the circuit pattern and punching workability. In the following, it is preferable to be 100 ⁇ m or less, 75 ⁇ m or less, and further 50 ⁇ m or less.
  • the thickness By setting the thickness to 4 ⁇ m or more, the punching processability and the thermal dimensional stability are excellent, and the handleability can be improved.
  • the thickness By setting the thickness to 125 ⁇ m or less, the followability to the circuit pattern can be improved.
  • the tensile elastic modulus at 23 ° C. of the masking film support for plating of the present invention is 700 MPa or more and 5000 MPa or less. By defining the tensile elastic modulus at 23 ° C. within the above range, excellent punching workability and followability can be realized. Further, the tensile elastic modulus at 90 ° C. is 100 MPa or more and 1000 MPa or less, the heat shrinkage in the machine direction and transverse direction after heating at 85 ° C. for 30 minutes is 1% or less, and the heat shrinkage rate in the machine direction and transverse direction. The difference is preferably 1% or less.
  • the punching workability when punching the plated portion can be improved.
  • the followability to a circuit pattern can be made more excellent by making the tensile elasticity modulus in 23 degreeC into 4500 Mpa or less.
  • the thermal dimensional stability can be further improved.
  • the followability to the circuit pattern can be improved.
  • the masking film with higher thermal dimensional stability can be obtained. It can be set as the masking film which was more excellent in plating formation accuracy.
  • the masking film can be bonded from any direction without selecting the direction to be bonded to the circuit pattern. However, a high-definition plating process is possible.
  • the masking film for plating of the present invention has an adhesive layer on one surface of the above-described masking film support for plating.
  • the adhesive constituting the adhesive layer include acrylic adhesives, silicone adhesives, urethane adhesives, polyester adhesives, polyether adhesives, polyamide adhesives, fluorine adhesives, and rubber adhesives.
  • One or more pressure-sensitive adhesives selected from pressure-sensitive adhesives and the like are used.
  • acrylic resin those obtained by copolymerizing various vinyl monomers having a functional group, the main component of which is a vinyl monomer having an alkyl group, can be used.
  • vinyl monomers having an alkyl group include (meth) acrylic acid esters having an alkyl group having 1 to 18 carbon atoms, such as methyl (meth) acrylate, ethyl (meth) acrylate, isopropyl (meth) acrylate, and lauryl (meth).
  • the vinyl monomer having a functional group includes a vinyl monomer having a hydroxyl group, a vinyl monomer having a carboxyl group, a vinyl monomer having an amide group, a vinyl monomer having an amino group, a vinyl monomer having an alkoxy group, and an ethylene oxide group. Examples thereof include vinyl monomers.
  • examples of the vinyl monomer having a hydroxyl group include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate and the like.
  • examples of the vinyl monomer having a carboxyl group include acrylic acid, methacrylic acid, itaconic acid, maleic acid, and fumaric acid.
  • examples of the vinyl monomer having an amide group include (meth) acrylamide, N-methylol (meth) acrylamide, N-methoxymethyl (meth) acrylamide, N, N′-methylenebis (meth) acrylamide and the like.
  • Examples of the vinyl monomer having an amino group include dimethylaminoethyl (meth) acrylate and diethylaminoethyl (meth) acrylate.
  • Examples of the vinyl monomer having an alkoxy group include methoxyethyl (meth) acrylate, ethoxyethyl (meth) acrylate, butoxyethyl (meth) acrylate, phenoxyethyl (meth) acrylate, and the like.
  • Examples of the vinyl monomer having an ethylene oxide group include diethylene glycol (meth) acrylate, methoxydiethylene glycol (meth) acrylate, and methoxypolyethylene glycol (meth) acrylate.
  • monomers such as styrene, chlorostyrene, ⁇ -methylstyrene, vinyl toluene, vinyl chloride, vinyl acetate, acrylonitrile and the like can be copolymerized.
  • acrylic resins include tackifiers as desired, such as rosin, dammar, polymerized rosin, partially hydrogenated rosin, ester rosin, polyterpene resin, modified terpene, petroleum resin, cyclopentadiene resin, phenolic resin. Resins, styrene resins, xylene resins, coumarone indene resins, softeners, and fillers can be added.
  • polyepoxide compounds include sorbitol polyglycidyl ether, polyglycerol polyglycidyl ether, pentaerythritol polyglycidyl ether, diglocerol polyglycidyl ether, triglycidyl-tris (2-hydroxyethyl) isocyanurate, glycerol polyglycidyl ether, trimethylol Propane polyglycidyl ether, resorching glycidyl ether, neopentyl glycol diglycidyl ether, 1,6-hexanediol diglycidyl ether, bisphenol-S-diglycidyl ether, ethylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether
  • Polyisocyanate compounds include toluylene diisocyanate, 2,4-toluylene diisocyanate dimer, naphthylene-1,5-diisocyanate, o-toluylene diisocyanate, diphenylmethane diisocyanate, triphenylmethane triisocyanate, tris- (p-isocyanate). Phenyl) thiophosphite, polymethylene polyphenyl isocyanate, hexamethylene diisocyanate, trimethylhexanemethylene diisocyanate, isophorone diisocyanate, trimethylhexamethylene diisocyanate and the like.
  • an adhesive layer in such an adhesive layer, other resins, surfactants, pigments, lubricants, colorants, antistatic agents, flame retardants, as long as the function as the masking film for plating of the present invention is not impaired.
  • Various additives such as antibacterial agents, antifungal agents, ultraviolet absorbers, light stabilizers, antioxidants, leveling agents, flow regulators, antifoaming agents and the like can be included.
  • the above-mentioned adhesive and optionally used cross-linking agents and additives are dissolved or dispersed in a diluting solvent as necessary to form a coating solution, and this coating solution is used in a conventional method such as a bar coating method.
  • a coating solution is used in a conventional method such as a bar coating method.
  • examples thereof include a method of applying to a masking film support for plating by a known coating method, drying, and curing as necessary.
  • coating the said coating liquid to a separator and drying it can also bond and form with the masking film support body for plating.
  • the thickness of the adhesive layer varies depending on the depth and shape of the unevenness of the circuit pattern, it cannot be generally stated, but the lower limit is preferably 5 ⁇ m or more, more preferably 8 ⁇ m or more, and the upper limit is 50 ⁇ m or less, and further 30 ⁇ m or less. preferable.
  • the thickness of the adhesive layer 5 ⁇ m or more By making the thickness of the adhesive layer 5 ⁇ m or more, the infiltration of the plating solution can be prevented, and the followability to the circuit pattern can be made sufficient.
  • the thickness 50 ⁇ m or less the handleability and productivity are improved. Can be improved.
  • a separator on the surface having the adhesive layer from the viewpoint of handleability.
  • a separator is not particularly limited, and paper, synthetic paper, polyethylene laminated paper, plastic film, or the like can be used.
  • the plastic film include polyethylene terephthalate, polycarbonate, polypropylene, polyethylene, polyethylene naphthalate, polystyrene, polyarylate, acetyl cellulose, polyamide, polyimide, polyvinyl chloride, vinylidene chloride-vinyl chloride copolymer, (meth) acrylic acid ester.
  • examples include various synthetic resin films made of resin, fluorine-based resin, and the like.
  • the separator may be subjected to a release treatment by applying polyethylene wax or a silicone release agent to the surface in contact with the pressure-sensitive adhesive layer.
  • the surface of the separator is uneven for the purpose of transferring the unevenness to the adhesive layer, for example, the separator surface is provided with a resin layer containing a matting agent, the separator surface is sand-matted, or the separator itself is embossed. You may use what you did.
  • Example 1 content of the inorganic filler in a table
  • surface means polybutylene terephthalate.
  • the talc used in Example 1 is a talc with an aspect ratio of 10.
  • the volume occupation rate of the clay mineral occupying the volume of the entire masking film support was 9.7% by volume in Example 1, 10.1% by volume in Example 2, and 9.3% by volume in Example 3.
  • Example 4 was 9.3 vol%
  • Example 5 was 7.5 vol%
  • Comparative Example 1 was 13.1 vol%.
  • Masking film supports for plating of Examples 6 to 10 were obtained in the same manner as in Example 1 except that talc was used as the inorganic filler and the amount shown in Table 2 (inorganic filler content) was added.
  • the occupying ratio of talc in the total volume of the masking film support is 2.3% by volume in Example 6, 4.4% by volume in Example 7, and 7.4% by volume in Example 8. 9 was 13.9% by volume, and Example 10 was 15.1% by volume.
  • Masking film supports for plating of Examples 11 to 13 were obtained in the same manner as in Example 1 except that talc having the size (average particle diameter) shown in Table 3 was added as the inorganic filler.
  • the plating masking film supports of Examples 1 to 5 to which an equivalent amount (25% by mass) of clay mineral as in Comparative Example 1 was added all maintained good followability while maintaining heat following properties. It was confirmed that the dimensional stability and punching workability were improved.
  • Examples 1 to 5 to which the clay mineral was added had a tensile elastic modulus at 23 ° C. as compared with Comparative Example 2 to which the inorganic filler was not added and Comparative Example 1 to which the amorphous silica was added. high.
  • the excellent punching workability was obtained in the masking film for plating of the example by increasing the tensile elastic modulus in the vicinity of room temperature.
  • Examples 1 to 5 to which the clay mineral was added had a lower tensile elastic modulus at 90 ° C. than Comparative Example 1 to which the amorphous silica was added. For this reason, in the masking film for plating of an Example, it is thought that the outstanding tracking property to a circuit pattern was able to be maintained.
  • Example 1 to 5 the heat shrinkage rate in the vertical and horizontal directions after heating at 85 ° C. for 30 minutes is clearly smaller than that in Comparative Examples 1 and 2, and the thermal dimensional stability is excellent. It was confirmed that. Further, in Examples 1 to 5, the difference in thermal shrinkage between the vertical direction and the horizontal direction is less than 1%, which is clearly smaller than those of Comparative Examples 1 and 2, and is bonded to the circuit pattern according to the present invention. It was confirmed that a masking film for plating capable of high-definition plating can be obtained from any direction without selecting a direction.
  • the masking film support for plating of Reference Example 1 using an unstretched polypropylene film had good punching workability, but was confirmed to have low thermal dimensional stability. Furthermore, it was also confirmed that the followability to a circuit pattern was lower than the plating masking film support of Comparative Example 2 using a polybutylene terephthalate film. Moreover, the masking film support for plating of Reference Example 2 using a biaxially stretched polypropylene film had good thermal dimensional stability and excellent punching workability, but the followability to the circuit pattern was low. It was confirmed. The masking film support for plating of Reference Example 3 using a biaxially stretched polyethylene terephthalate film was also excellent in thermal dimensional stability and excellent in punching workability, but has low followability to the circuit pattern. Was confirmed.
  • Table 2 shows the results when talc is used as the inorganic filler and the content of talc is changed.
  • the content of talc was 10 parts by mass or more compared to Example 6 in which the content of talc was 5 parts by mass with respect to 100 parts by mass of the resin component contained in the polybutylene terephthalate film. It was confirmed that the thermal dimensional stability and punching workability were excellent.
  • the talc content was 40 parts by mass or less compared to Example 10 in which the content of talc was 45 parts by mass with respect to 100 parts by mass of the resin component contained in the polybutylene terephthalate film. It was confirmed that the followability to the pattern was excellent.
  • the content of the clay mineral is preferably 10 parts by mass or more and 40 parts by mass.
  • the masking film support for plating in the above examples had a tensile modulus at 23 ° C. of 700 MPa to 5000 MPa. It was found that by using such a masking film support for plating, a masking film for plating having good followability to a circuit pattern, excellent thermal dimensional stability, and excellent punching workability can be obtained. . Moreover, the tensile elasticity modulus at the time of 90 degreeC of the masking film support body for plating of the said Example is 100 Mpa or more and 1000 MPa or less, and the thermal contraction rate of the vertical direction and a horizontal direction after heating at 85 degreeC for 30 minutes is 1% or less Met.
  • a plating masking film support having the above physical properties By using a plating masking film support having the above physical properties, a plating masking film having good followability to a circuit pattern, excellent thermal dimensional stability, and excellent punchability can be obtained. I understood. Moreover, the masking film obtained by making the difference between the heat shrinkage ratios in the vertical direction and the horizontal direction after heating at 85 ° C. for 30 minutes 1% or less can be obtained from any direction without selecting the direction to be bonded to the circuit pattern. High-definition plating can be performed even if they are bonded together.
  • Example 8 and Example 1 in which the content of talc was 18 parts by mass and 25 parts by mass with respect to 100 parts by mass of the resin component contained in the polybutylene terephthalate film the followability to the circuit pattern and It was confirmed that the thermal dimensional stability was particularly excellent.
  • the content of the clay mineral is more preferably 15 parts by mass or more and 30 parts by mass or less with respect to 100 parts by mass of the resin component contained in the polybutylene terephthalate film.
  • Table 3 shows the results when 25 parts by mass of talc having different average particle diameters are added to 100 parts by mass of the resin component contained in the polybutylene terephthalate film.
  • any of the masking films for plating of Examples 11, 1, 12 and 13 to which talc having an average particle diameter of 2 ⁇ m, 4 ⁇ m, 8 ⁇ m and 10 ⁇ m was added excellent followability to a circuit pattern and thermal stability It has been found that it has the properties and punchability.
  • the plating masking films of Examples 1 and 12 having an average particle diameter of 4 ⁇ m and 8 ⁇ m are more preferable from the viewpoint of followability to the circuit pattern, thermal dimensional stability, and punching workability.

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  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
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  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
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  • Manufacture Of Macromolecular Shaped Articles (AREA)

Abstract

L'invention concerne un film de masquage et un support de film de masquage qui ont la capacité de bien s'adapter à des motifs de circuits, et qui présentent une meilleure stabilité dimensionnelle thermique, une haute précision de formation par placage et une meilleure aptitude au poinçonnage. Le support de film de masquage est obtenu par addition d'un minerai argileux, qui sert de charge inorganique, à un film de téréphtalate de polybutylène, et le support de film de masquage présente un module d'élasticité en traction de 700 à 5000 MPa à une température de 23 °C. Une couche adhésive est disposée sur une surface du support de film de masquage. La teneur du minerai argileux est de 10 à 40 parties en masse par rapport à 100 parties en masse d'un composant de résine inclus dans le film de téréphtalate de polybutylène.
PCT/JP2013/084138 2012-12-20 2013-12-19 Support de film de masquage pour placage et film de masquage l'utilisant WO2014098195A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2014553213A JP6318091B2 (ja) 2012-12-20 2013-12-19 めっき用マスキングフィルム支持体及びこれを用いたマスキングフィルム
CN201380065494.5A CN104968841B (zh) 2012-12-20 2013-12-19 电镀用屏蔽膜支持体及使用它的屏蔽膜
HK16101021.3A HK1213027A1 (zh) 2012-12-20 2016-01-29 電鍍用屏蔽膜支持體及使用它的屏蔽膜

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JP2015227486A (ja) * 2014-05-30 2015-12-17 ソマール株式会社 めっき用マスキングフィルム支持体及びこれを用いたマスキングフィルム
JP2016065189A (ja) * 2014-09-26 2016-04-28 ソマール株式会社 めっき用マスキングフィルム
JP6165943B1 (ja) * 2016-08-11 2017-07-19 株式会社フジクラ レジスト組成物
WO2018203537A1 (fr) * 2017-05-02 2018-11-08 積水化学工業株式会社 Feuille d'absorption de chocs et feuille adhésive sensible à la pression double face

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JPH11302611A (ja) * 1998-04-17 1999-11-02 Hitachi Chem Co Ltd メッキマスク用粘着フィルム
JP2003049136A (ja) * 2001-04-23 2003-02-21 Sekisui Chem Co Ltd マスキングテープ
JP2004002592A (ja) * 2001-06-29 2004-01-08 Sekisui Chem Co Ltd シート
JP2008300441A (ja) * 2007-05-29 2008-12-11 Nippon Mektron Ltd 配線基板のめっき方法及び配線基板
JP2010150498A (ja) * 2008-06-05 2010-07-08 Nitto Denko Corp 保護シートおよびその利用

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015227486A (ja) * 2014-05-30 2015-12-17 ソマール株式会社 めっき用マスキングフィルム支持体及びこれを用いたマスキングフィルム
JP2016065189A (ja) * 2014-09-26 2016-04-28 ソマール株式会社 めっき用マスキングフィルム
JP6165943B1 (ja) * 2016-08-11 2017-07-19 株式会社フジクラ レジスト組成物
JP2018024791A (ja) * 2016-08-11 2018-02-15 株式会社フジクラ レジスト組成物
WO2018203537A1 (fr) * 2017-05-02 2018-11-08 積水化学工業株式会社 Feuille d'absorption de chocs et feuille adhésive sensible à la pression double face

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JPWO2014098195A1 (ja) 2017-01-12
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HK1213027A1 (zh) 2016-06-24

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