WO2014089948A1 - 多功能连续式磁控溅射镀膜装置 - Google Patents

多功能连续式磁控溅射镀膜装置 Download PDF

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Publication number
WO2014089948A1
WO2014089948A1 PCT/CN2013/074407 CN2013074407W WO2014089948A1 WO 2014089948 A1 WO2014089948 A1 WO 2014089948A1 CN 2013074407 W CN2013074407 W CN 2013074407W WO 2014089948 A1 WO2014089948 A1 WO 2014089948A1
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WIPO (PCT)
Prior art keywords
chamber
coating
target
vertical
magnetron sputtering
Prior art date
Application number
PCT/CN2013/074407
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English (en)
French (fr)
Inventor
赵玮
陈宇
Original Assignee
广东志成冠军集团有限公司
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Publication of WO2014089948A1 publication Critical patent/WO2014089948A1/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • C23C14/566—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3417—Arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3426—Material
    • H01J37/3429—Plural materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3435—Target holders (includes backing plates and endblocks)
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3464—Operating strategies

Definitions

  • Multifunctional continuous magnetron sputtering coating device Multifunctional continuous magnetron sputtering coating device
  • the invention relates to the field of magnetron sputtering coating technology, in particular to a multifunctional continuous magnetron sputtering coating device.
  • Magnetron sputtering coating technology is a widely used vacuum coating technology method, which is widely used in the fields of optics, microelectronics, abrasion resistance, corrosion resistance, decoration, etc., to provide reliable and stable thin film coating, which can be coated.
  • the product provides certain aspects of specific performance. For example, a layer of ⁇ film is applied to the surface of the glass to form a transparent conductive glass for producing LCD displays, touch screens, and the like.
  • Magnetron sputtering technology mainly uses a electric field on a sputtering target to excite a plasma in a rare gas state, and a positive ion bombards a sputter target mounted on a target by a combined control of a magnetic field and an electric field to make a target substance. It is sputtered onto the substrate in an atomic, molecular state to form the desired functional film.
  • the continuous magnetron sputtering coating equipment is connected in series through a plurality of vacuum chambers, and is divided into a vacuum to a rough vacuum transition chamber, a rough vacuum to a high vacuum transition chamber, a coating chamber and the like, and the vacuum system of each zone is independent. Perform a sealed transfer. Through this design, the vacuuming time can be effectively reduced, and the magnetron sputtering coating can be continuously performed one by one. It is mainly used for the coating of large-area flat substrate surfaces, such as glass.
  • the current continuous magnetron sputtering coating equipment is mainly divided into three categories according to the angle at which the coated substrate is placed: 1.
  • Vertical The vertical equipment is perpendicular to the horizontal plane, the coated substrate is vertical through the device, and the coating process is also vertical.
  • Chinese Patent Publication No. Chinese Patent Publication No.
  • CN 102181839 A discloses a "same-end continuous-flow continuous sputtering coating apparatus" comprising a vacuum chamber and a vacuum pumping device, the vacuum pumping device being in communication with a vacuum chamber, characterized in that The vacuum chamber is composed of two vacuum chambers of adjacent and communicating pre-extraction chambers and sputtering chambers
  • the utility model is characterized in that an isolation crucible is arranged between the two vacuum chambers, and a blind flange and a vacuum lock are respectively arranged at the end and the front end of the cavity, and a loading and unloading table is arranged outside the vacuum lock, and the workpiece is arranged in the sputtering chamber.
  • a rack transporting device comprising: a composite transport device in the pre-dip chamber, wherein the sputtering chamber is equipped with at least three pairs of oppositely arranged magnetron sputtering targets, the workpiece rack transport device being capable of cooperating with the workpiece holder and capable of The rack is transported from the loading and unloading station to the pre-extraction chamber and the sputtering chamber in turn, and is transported from the original road back to the loading and unloading station.
  • the coating process is minimized by dirt such as particles falling in the vacuum chamber, and is most suitable for coating products with high cleanliness requirements, such as IT0 glass coating.
  • this coating method has the following defects: a.
  • Horizontal type The horizontal equipment is parallel to the horizontal plane.
  • the coated substrate is horizontally passed through the equipment.
  • the coating process is also horizontal.
  • the coating process does not require fixtures, there is no invalid area, and various sizes can be plated at the same time.
  • the main problem is that dirt such as particles falling from the cavity may fall on the substrate, and it can only be applied to fields where the cleanliness of the substrate is not required.
  • Inclined type The tilting device is placed at an angle to the horizontal plane.
  • the coated substrate is slanted through the device, and the coating process is also oblique.
  • the advantages of the two devices are combined, but The overall tilting of the equipment makes it difficult to install and process.
  • An object of the present invention is to provide a multifunctional continuous magnetron sputtering coating device which can be used for vertical or tilt mounting of a coating substrate, which not only satisfies the needs of different substrate coatings, but also effectively prevents the cavity. Contaminants such as falling particles fall on the substrate to ensure that the substrate is not contaminated, thereby improving the coating quality.
  • the present invention adopts the following technical solutions:
  • a multifunctional continuous magnetron sputtering coating device comprising at least one coating chamber, wherein the interior wall of the coating has alternating vertical targets and inclined targets for magnetron sputtering coating, corresponding
  • the vertical target is provided with a movable vertical substrate carrier in the coating chamber, and a movable inclined substrate carrier is disposed in the coating chamber corresponding to the inclined target; the vertical substrate carrier
  • One end of the plating chamber is provided with a first sliding groove
  • the other end of the coating chamber is provided with an upright guiding wheel corresponding to the first sliding groove, and the bottom of the coating chamber corresponds to the first transmission.
  • the friction portion is provided with a friction transmission wheel, and the friction transmission wheel is connected to the power device outside the coating chamber through a transmission rotating shaft, and a magnetic fluid seal for sealing is disposed at a contact point between the transmission shaft and the coating chamber;
  • One side of the upright guide wheel is provided with an inclined guide wheel, and a second sliding groove is disposed at an end of the inclined substrate carrier corresponding to the inclined guide wheel, A substrate carrier disposed away from the second end portion and the friction drive friction drive wheel matches the second sliding groove.
  • the first side of the coating chamber is provided with a target port, and one side of the target port is rotated to set a first target door panel, the target The other side of the port is rotated to set the second target door panel such that the first target door panel and the second target door panel can be alternately closed at the target position.
  • At least one vertical target holder is disposed on the first target door panel, and the vertical target is detachably mounted on the vertical target base
  • At least one inclined target base is disposed on the second target door panel, and the inclined target is detachably mounted on the inclined target base.
  • the friction transmission wheel is a circular wheel, and a receiving place is disposed at a position in contact with the transmission friction portion.
  • the annular groove of the transmission friction portion is arranged such that the transmission friction portion can be just inserted into the annular groove of the friction transmission wheel, and the guiding can be effectively realized, and the substrate carrier can be prevented from swinging left and right during the movement. Even partial.
  • the seating surface of the vertical target base is perpendicular to the ground, and the target surface of the corresponding vertical target and the surface of the vertical substrate carrier are also Both are disposed perpendicular to the ground, and the seat surface of the inclined target seat is disposed at an angle ⁇ with the ground, and the target surface of the corresponding inclined target and the frame surface of the inclined substrate carrier are also disposed at an angle ⁇ with the ground.
  • two of the vertical target holders are arranged in parallel on the first target door panel, and two of the second target position panel are arranged in parallel. Tilt the target base.
  • a preferred embodiment of the multi-functional continuous magnetron sputtering coating device further includes a first coating buffer chamber and a second coating buffer chamber respectively disposed on both sides of the coating chamber, wherein the first coating buffer chamber is away from the coating film a first transition chamber is disposed on one side of the chamber, a second transition chamber is disposed on a side of the second coating buffer chamber away from the coating chamber, and the first transition chamber is disposed away from the side of the first coating buffer chamber.
  • the coating buffer chamber is arranged to pass through.
  • the chambers are kept independent during use, and vacuum pump units are provided for each chamber, and vacuum can be independently extracted for each chamber, so that continuous feeding can be performed.
  • the vacuum state in the coating chamber is not damaged during the process of entering and discharging the product, and the normal operation of the coating work is ensured.
  • the seat of the inclined target base The angle between the surface of the face, the target surface of the inclined target, and the surface of the inclined substrate carrier and the ground is an acute angle.
  • the angle ⁇ is 83 °.
  • the film introduction chamber, the first transition chamber, the first coating buffer chamber, the coating chamber, the second coating buffer chamber, the second transition chamber, and the sheet Vacuum pump units are separately installed in the chamber so that each chamber can independently draw a vacuum.
  • the film introduction chamber, the first transition chamber, the first coating buffer chamber, the second coating buffer chamber, the second transition chamber, and the ejection chamber are each provided with an upright guide wheel and an inclined guide disposed in the same manner as the interior of the coating chamber.
  • the first coating buffer chamber enters the coating chamber coating, and after the coating is completed, the second coating buffer chamber, the second transition chamber, and the ejection chamber are sent out, so that the entire production can be continuous, the production efficiency is improved, and the production auxiliary process is reduced.
  • a sealing ring for sealingly connecting with the target position is disposed around the first target door panel, and the second target door panel is disposed around the periphery. a sealing ring that is sealingly connected to the target port.
  • At least one ring seal is disposed around the first target door panel, and at least one ring seal is disposed around the second target door panel.
  • two sealing rings are disposed around the first target door panel, and two sealing rings are disposed around the second target door panel.
  • At least one annular sealing groove is formed at the target position corresponding to the first target door panel or the second target door panel, and a sealing ring is disposed in the groove.
  • the beneficial effects of the present invention are as follows: by setting up a vertical target and a tilt target which are alternately used at a target position of the coating chamber, and setting a vertical substrate bearing in the coating chamber corresponding to the vertical target and the inclined target.
  • the frame and the inclined substrate carrier enable the product to be coated with a vertical target when the coating requirements are not high.
  • the inclined target can be used for coating, and the product can be assembled by using the inclined substrate carrier.
  • FIG. 1 is a schematic structural view of a multi-functional continuous magnetron sputtering coating device according to the invention
  • FIG. 2 is a schematic structural view of a coating chamber of FIG.
  • Figure 3 is a schematic cross-sectional view of the coating chamber of Figure 2 when a vertical target is used;
  • Fig. 4 is a schematic cross-sectional view showing the coating chamber of Fig. 2 using a tilt target.
  • Coating chamber 101, connection port; 102, target position port; 103, first target door panel; 104, second target door panel; 105, vertical target; 106, inclined target; 107, vertical target holder; 108, inclined target seat; 109, upright guide wheel; 110, inclined guide wheel; 111, vertical substrate carrier; 112, inclined substrate carrier; 113, first transmission friction portion; 114, second transmission friction portion 115, a first sliding groove; 116, a second sliding groove; 117, a friction transmission wheel; 118, a transmission shaft; 119, a magnetic fluid seal;
  • the multifunctional continuous magnetron sputtering coating device described in this embodiment includes The feeding chamber 2, the first transition chamber 3, the first coating buffer chamber 4, the coating chamber 1, the second coating buffer chamber 5, the second transition chamber 6, and the ejection chamber 7 are disposed in the second chamber.
  • a loading station 9 is disposed on one side of a transition chamber 3
  • a blanking station 10 is disposed on a side of the outlet chamber 7 away from the second transition chamber 6, and an isolation gap is provided between the inlet chamber 2 and the first transition chamber 3.
  • a door 8 is disposed between the first transition chamber 3 and the first coating buffer chamber 4, and an isolating door 8 is disposed between the second coating buffer chamber 5 and the second transition chamber 6, and the second transition chamber 6 and the outlet are provided. Isolation tips 8 are provided between the chambers 7, and the first coating buffer chamber 4, the coating chamber 1, and the second coating buffer chamber 5 are connected to each other, and the vacuum state inside thereof is uniform.
  • An independent vacuum pump unit is disposed on the film introduction chamber 2, the first transition chamber 3, the first coating buffer chamber 4, the coating chamber 1, the second coating buffer chamber 5, the second transition chamber 6, and the ejection chamber 7, It is used for independent vacuum extraction work, which can not damage the vacuum state in the coating chamber 1 during continuous feeding and feeding, ensuring the normal operation of the coating work.
  • the coating chamber 1 is a rectangular parallelepiped box, and includes four sides perpendicular to the ground, which are respectively a first side, a second side, a third side, and a fourth side, and are disposed on the first side.
  • the target position port 102 is rotated to the left side of the target position port 102 to set the first target door plate 103, and the right side of the target position port 102 is rotated to provide the second target door plate 104, the first target door plate 103 and the second target position.
  • the outer dimensions of the door panel 104 are matched to the size of the target port 102 such that both the first target door panel 103 and the second target door panel 104 are alternately closed at the target port 102.
  • Two annular seal rings are disposed on the periphery of the first target door panel 103 so as to be sealingly connected to the target port 102 when closed to the target port 102, and two annular seal rings are disposed on the periphery of the second target door plate 104, so that The target port 102 can be sealingly connected when closed to the target port 102.
  • Two rectangular vertical target bases 107 are arranged in parallel on the first target door panel 103.
  • Each vertical target base 107 is detachably provided with a vertical target 105, and two rectangular tilts are arranged in parallel on the second target position door 104.
  • the target base 108 is provided with a tilting target 106 and a seating surface of the vertical target base 107 on each inclined target base 108.
  • the vertical target 105 mounted on the seat surface of the vertical target base 107 has a rectangular parallelepiped shape, so that the target surface of the vertical target 105 is also perpendicular to the ground, and the seat surface of the inclined target base 108 is on the ground.
  • the inclined target 106 mounted on the seat surface of the inclined target base 108 has a rectangular parallelepiped shape, so that the target surface of the inclined target 106 is also disposed at an angle of 83 ° to the ground.
  • Two rows of guide wheels which are an upright guide wheel 109 and an inclined guide wheel 110, are disposed in parallel at the top end of the coating chamber 1, and a friction transmission wheel 117 is disposed in the coating chamber 1 directly under the upright guide wheel 109.
  • the friction transmission wheel 117 is driven by the transmission.
  • the rotating shaft 118 is connected to the motor disposed outside the coating chamber 1, so that the motor can drive the friction transmission wheel 117 to rotate at a constant speed, and a magnetic fluid seal 119 for vacuum sealing the transmission shaft 118 is disposed at the contact of the transmission shaft 118 with the coating chamber 1. To achieve a reliable dynamic seal.
  • a vertical substrate carrier 111 may be disposed between the upright guide wheel 109 and the friction transmission wheel 117.
  • the outer surface of the vertical substrate carrier 111 is parallel to the target surface of the vertical target 105, so that the surface can be placed
  • the coating substrate on the surface of the vertical substrate carrier 111 is parallel to the vertical target 105, and the coating on the surface of the coating substrate is uniform to ensure the film layer is stable and reliable.
  • An inclined substrate carrier 112 may be disposed between the inclined guide wheel 110 and the friction transmission wheel 117.
  • the outer surface of the inclined substrate carrier 112 is parallel to the target surface of the inclined target 106, and is 83 with the ground.
  • the angle is set so that the coated substrate placed on the surface of the inclined substrate carrier 112 is parallel to the inclined target 106, thereby ensuring that the coated substrate placed on the surface of the inclined substrate carrier 112 is parallel to the inclined target 106.
  • the surface of the coated substrate is uniformly coated to ensure stable and reliable film layer, and when the coating substrate has high requirements on the quality of the film, the inclined substrate carrier 112 can be used because the inclined substrate carrier 112 and the ground are The 83 degree angle setting makes it impossible to apply the clamp to the coated substrate, thus avoiding the ineffective area of the coating.
  • the upper end of the vertical substrate carrier 111 is provided with a first sliding groove 115 matching the upright guide wheel 109, and the lower end of the vertical substrate carrier 111 is provided with a first transmission matched with the friction transmission wheel 117.
  • the friction portion 113 allows the vertical substrate carrier 111 to move uniformly within the coating chamber 1.
  • the upper end of the inclined substrate carrier 112 is provided with a second sliding groove 116 matching the inclined guiding wheel 110, and the lower end of the inclined substrate carrier 112 is provided with a second transmission friction portion matching the friction transmission wheel 117. 114, the inclined substrate carrier 112 can be uniformly moved within the coating chamber 1.
  • the friction transmission wheel 117 is a circular wheel, and an annular groove for accommodating the transmission friction portion is disposed in contact with the transmission friction portion, so that the transmission friction portion can be just inserted into the annular groove of the friction transmission wheel 117, and can be effective.
  • the guiding is achieved, and at the same time, the substrate carrier is not swayed or even tilted during the movement.
  • a connection port 101 communicating with the first coating buffer chamber 4 and the second coating buffer chamber 5 is disposed on the second side surface and the third side surface connected to the first side surface of the coating chamber 1, respectively, and the connection port is directly formed on the sheet feeding chamber 2 101 is provided with a sheet door, a sheet door is arranged on the outlet chamber 101, and a sealing structure is arranged at the inlet door and the exit door, so that the film chamber 2 and the ejection chamber 7 can be vacuum sealed. status.
  • the entrance chamber 2, the first transition chamber 3, the first coating buffer chamber 4, the second coating buffer chamber 5, the second transition chamber 6, and the ejection chamber 7 are each provided with an upright guide wheel 109 disposed in the same manner as the inside of the coating chamber 1. , the inclined guide wheel 110, the friction transmission wheel 117, the transmission shaft 118, the magnetic fluid seal 119, and the motor that controls the friction transmission wheel 117 to rotate at a constant position in the corresponding position outside each chamber, so that the substrate carrier can be continuously
  • the film introduction chamber 2, the first transition chamber 3, and the first coating buffer chamber 4 enter the coating chamber 1 for coating, and after the coating is completed, the second coating buffer chamber 5, the second transition chamber 6, and the ejection chamber 7 are sent out, so that the entire production can be Continuity, increase production efficiency, and reduce production support processes.
  • the coated substrate is loaded with a vertical substrate carrier 111:
  • the first target door panel 103 at the target port 102 on the coating chamber 1 is closed and sealed, and then the respective isolation tips 8 are closed;
  • the first coating buffer chamber 4, the coating chamber 1 and the second coating buffer chamber 5 are disposed in a penetrating manner, the first coating buffer chamber 4, the coating chamber 1 and the second coating buffer chamber 5 are collectively referred to as a coating chamber.
  • the vacuum pump unit 11 on the coating chamber group is opened, and the vacuum is extracted from the coating chamber group until the air pressure in the coating chamber group is the air pressure required for the coating, and the vacuum pump unit on the first transition chamber 3 and the second transition chamber 6 is opened. Vacuum is drawn inside the first transition chamber 3 and the second transition chamber 6, respectively, until the air pressure inside the chamber is 1/2 of the air pressure in the coating chamber group, and the film chamber 2 and the film chamber 7 are temporarily not evacuated;
  • the coating substrate is fixed on the vertical substrate carrier 111 at the loading station 9, the film opening door of the film feeding chamber 2 is opened, and the vertical substrate carrier 111 with the coating substrate is used. It is placed between the upright guide wheel and the friction transmission wheel in the film introduction chamber 2, and then the film entry door is closed, and the vacuum pump 11 is placed on the film introduction chamber 2 to evacuate the film introduction chamber 2 to make the vacuum inside.
  • the pressure is consistent with the value of the vacuum pressure in the first transition chamber 3;
  • the isolation door 8 between the film introduction chamber 2 and the first transition chamber 3 is opened by an external control device, and the vertical substrate carrier 111 is fed into the first transition by the vertical guide wheel and the friction transmission wheel.
  • the vacuum is applied to the first transition chamber 3 by the vacuum pump unit 11 disposed on the first transition chamber 3, and the internal air pressure value is consistent with the air pressure value in the coating chamber group, and then the first transition is opened by the external control device.
  • the isolation door 8 between the chamber 3 and the coating chamber group, and the vertical substrate carrier 111 is fed between the vertical guide wheel and the friction transmission wheel in the coating chamber group by the vertical guide wheel and the friction transmission wheel, and is closed. Separating the trick door 8, after the vertical substrate carrier 111 enters the coating chamber 1 from the first coating buffer chamber 4, and then performs magnetron sputtering coating;
  • the vacuum pump unit on the second transition chamber 6 is opened, and the vacuum is drawn in the second transition chamber 6, so that the pressure value in the second transition chamber 6 is consistent with that of the coating chamber group, and then The isolation door 8 between the coating chamber group and the second transition chamber 6 is opened, and the vertical substrate carrier 111 is fed into the vertical guide wheel and the friction transmission wheel in the second transition chamber 6;
  • the seventh step opening the isolation trick 8 between the second transition chamber 6 and the ejection chamber 7, and carrying the vertical substrate
  • the frame 111 is fed into the ejection chamber 7, and closes the isolation trick 8 between the second transition chamber 6 and the ejection chamber 7;
  • the eighth opening opening the atmospheric door on the ejection chamber 7, allowing air to enter In the chamber 7, the air pressure value in the chamber 7 to be discharged coincides with the atmospheric pressure, and the door opening of the film chamber 7 is opened, and the vertical substrate carrier 111 is sent out from the film chamber 7 to the unloading station 10, and then Unloading;
  • the ninth step repeating the first to eighth, and performing a continuous repeated coating process.
  • the operation steps are exactly the same as the above steps, and only the inclined substrate carrier 112 needs to be placed on the inclined guide wheel and the friction transmission. Between the wheels 117, and closing the second target door panel 104 at the target port 102.

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Abstract

本发明公开一种多功能连续式磁控溅射镀膜装置，包括至少一个镀膜室，镀膜室内壁上具有用于磁控溅射镀膜的可交替使用的立式靶和倾斜靶，对应立式靶在镀膜室内设置移动式的立式基材承载架，对应倾斜靶在镀膜室内设置移动式的倾斜式基材承载架。通过在镀膜室的靶位口处设置可交替使用的立式靶和倾斜靶，并对应设置立式基材承载架和倾斜式基材承载架，使得镀膜基材在不同要求时可以选用不同的靶材进行镀膜，并且立式靶和倾斜靶的可交替使用，还可以使得镀膜室能适应更多规格的产品镀膜，提高镀膜装置的通用性。

Description

多功能连续式磁控溅射镀膜装置 技术领域
本发明涉及磁控溅射镀膜技术领域， 尤其涉及一种多功能连续式磁控溅射 镀膜装置。
背景技术
磁控溅射镀膜技术是当前广泛应用的真空镀膜技术方法， 被普遍应用于光 学、 微电子、 耐磨、 耐蚀、 装饰等产业领域， 用以提供可靠而稳定的薄膜镀层， 可为被镀膜产品提供某方面特定性能。 比如在玻璃表面镀一层 ιτο 薄膜， 可以 形成透明导电玻璃， 用以生产 LCD显示器、 触摸屏等。
磁控溅射技术主要通过在溅射靶上的电场在稀薄气体状态下激发等离子 体， 通过磁场和电场的联合控制下使正离子轰击安装在靶上的被溅射靶材， 使 靶材物质以原子、 分子状态被溅射到衬底上， 进而形成需要的功能薄膜。
连续式磁控溅射镀膜设备是通过多个真空腔室串联连接， 分成大气向粗真 空过渡室， 粗真空向高真空过渡室， 镀膜室等不同功能区， 各个区真空系统独 立， 之间可以进行密封的传送。 通过这一设计可以有效的减少抽真空时间， 可 以一片接一片连续的进行磁控溅射镀膜。 其主要应用于大面积的平板基材表面 镀膜， 如玻璃。
当前的连续式磁控溅射镀膜设备按镀膜基材摆放的角度主要分为三类： 1、 立式： 立式设备与水平面垂直， 镀膜基材是垂直通过设备， 镀膜过程也 是垂直的， 例如， 中国专利文献 CN 102181839 A公开一种 "同端进出式连续溅 射镀膜设备"， 其包括真空腔体和真空抽气装置，所述真空抽气装置与真空腔体 相连通，其特征在于所述真空腔体由相邻且相通的预抽室和溅射室两个真空室 构成，两个真空室之间设有隔离闽，腔体的末端和前端分别设有盲法兰和真空锁 闽，所述真空锁闽外侧设有一个装卸片台，在溅射室内设置有工件架传输装置， 在预抽室内装有复合传输装置，所述溅射室内装有至少三对相对布置的磁控溅 射靶，所述工件架传输装置能够与工件架相配合， 并能将工件架从装卸片台依次 输送到预抽室、 溅射室， 并从原路输送回到装卸片台。 对于此镀膜设备， 其镀 膜过程受真空腔体内跌落的颗粒等污物的污染最小， 最适宜于对洁净度要求高 的镀膜产品， 如 IT0玻璃镀膜等。 但是此镀膜方式具有以下缺陷： a、 采用立式 设备时， 镀膜基材的固定装夹比较困难， 采用夹具固定会在固定位置处留下夹 具印， 导致边缘存在无效区， 镀膜工艺较难控制， 同时也不便于镀多种大小规 格的基材； b、 此镀膜方式是采用同端进出镀膜室镀膜， 这样的镀膜辅助用时间 较长， 生产效率不高， 浪费能源。
2、 卧式： 卧式设备与水平面平行， 镀膜基材是水平通过设备， 镀膜过程也 是水平的， 对于卧式设备， 其镀膜过程不需要夹具， 不存在无效区， 也可以同 时镀各种大小规格基材， 效率高， 应用方便。 但是其主要的问题是， 腔体跌落 的颗粒等污物会掉在基材上， 其只能应用于对基材洁净度要求不高的领域。
3、 倾斜式： 倾斜式设备与水平面成一定角度斜立摆放， 镀膜基材是斜立着 通过设备， 镀膜过程也是斜立的， 对于倾斜式设备， 综合了两种设备的优点， 但由于设备整体倾斜， 其安装加工都较困难。
发明内容
本发明的一个目的， 在于提供一种多功能连续式磁控溅射镀膜装置， 其既 可立式也可倾斜安装镀膜基材， 不仅能满足不同基材镀膜的需要， 还能有效防 止腔体内跌落的颗粒等污物掉在基材上， 保证基材不被污染， 进而提高镀膜质 为达上述目的， 本发明采用以下技术方案：
一种多功能连续式磁控溅射镀膜装置， 包括至少一个镀膜室， 其特征在于， 所述镀膜室内壁上具有用于磁控溅射镀膜的可交替使用的立式靶和倾斜靶， 对 应所述立式靶在所述镀膜室内设置移动式的立式基材承载架， 对应所述倾斜靶 在所述镀膜室内设置移动式的倾斜式基材承载架； 所述立式基材承载架的一端 设置有第一滑行凹槽， 另一端设置第一传动摩擦部， 所述镀膜室内侧顶部对应 所述第一滑行凹槽设置直立导向轮， 所述镀膜室内侧底部对应所述第一传动摩 擦部设置摩擦传动轮， 所述摩擦传动轮通过传动转轴与所述镀膜室外部的动力 装置连接， 所述传动转轴与所述镀膜室接触处设置用于密封的磁流体密封件； 在所述直立导向轮的一侧设置倾斜导向轮， 对应所述倾斜导向轮在所述倾 斜式基材承载架端部设置第二滑行凹槽， 在所述倾斜式基材承载架远离所述第 二滑行凹槽的一端设置与所述摩擦传动轮相匹配的第二传动摩擦部。 作为多功能连续式磁控溅射镀膜装置的一种优选方案， 所述镀膜室的第一 侧面开有靶位口， 所述靶位口的一侧转动设置第一靶位门板， 所述靶位口的另 一侧转动设置第二靶位门板， 以使所述第一靶位门板与所述第二靶位门板能交 替的关闭在所述靶位口处。
作为多功能连续式磁控溅射镀膜装置的一种优选方案， 所述第一靶位门板 上至少设置一个立式靶座， 在所述立式靶座上拆卸式安装有所述立式靶， 所述 第二靶位门板上至少设置一个倾斜靶座， 在所述倾斜靶座上拆卸式安装有所述 倾斜靶。 优选的， 所述摩擦传动轮为圆形轮， 其与传动摩擦部接触处设置有容纳所 述传动摩擦部的环形凹槽， 以使所述传动摩擦部能刚好嵌入到摩擦传动轮的环 形凹槽内， 并能有效的实现导向， 同时保证基材承载架在运动过程中不会左右 摇摆甚至偏倒。
作为多功能连续式磁控溅射镀膜装置的一种优选方案， 所述立式靶座的座 面与地面呈垂直设置， 对应的立式靶的靶面、 直立基材承载架的架面也均与地 面呈垂直设置， 所述倾斜靶座的座面与地面呈夹角 α设置， 对应的倾斜靶的靶 面、 倾斜式基材承载架的架面也均与地面呈夹角 α设置。
作为多功能连续式磁控溅射镀膜装置的一种优选方案， 所述第一靶位门板 上平行设置两个所述立式靶座， 所述第二靶位门板上平行设置两个所述倾斜靶 座。
作为多功能连续式磁控溅射镀膜装置的一种优选方案， 还包括分别设置在 所述镀膜室两侧的第一镀膜缓冲室和第二镀膜缓冲室， 所述第一镀膜缓冲室远 离镀膜室的一侧设置第一过渡室， 所述第二镀膜缓冲室远离镀膜室的一侧设置 第二过渡室， 所述第一过渡室远离第一镀膜缓冲室的一侧设置进片室， 所述第 二过渡室远离第二镀膜缓冲室的一侧设置出片室， 所述进片室与第一过渡室之 间、 所述第一过渡室与第一镀膜缓冲室之间、 所述第二镀膜缓冲室与第二过渡 室之间、 所述第二过渡室与出片室之间均设置用于隔绝各个腔室的隔离闽门， 所述第一镀膜缓冲室、 镀膜室、 第二镀膜缓冲室之间呈贯通设置。
通过在各个腔室之间设置隔离闽门， 使得各个腔室在使用过程中保持独立 状态， 并且对应各个腔室均设置真空泵机组， 可以独立的对各个腔室进行抽取 真空， 这样可以在连续送入和送出产品过程中不破坏镀膜室内的真空状态， 保 证镀膜工作的正常运行。
作为多功能连续式磁控溅射镀膜装置的一种优选方案， 所述倾斜靶座的座 面、 倾斜靶的靶面、 倾斜式基材承载架的架面与地面的夹角 α为锐角。
优选的， 所述夹角 α为 83 ° 。
作为多功能连续式磁控溅射镀膜装置的一种优选方案， 所述进片室、 第一 过渡室、 第一镀膜缓冲室、 镀膜室、 第二镀膜缓冲室、 第二过渡室以及出片室 上分别独立设置真空泵机组， 使各个腔室能独立抽取真空。
优选的， 所述进片室、 第一过渡室、 第一镀膜缓冲室、 第二镀膜缓冲室、 第二过渡室、 出片室内均设置有与镀膜室内部相同设置的直立导向轮、 倾斜导 向轮、 摩擦传动轮、 传动转轴、 磁流体密封件， 且均在各腔室外部对应位置设 置控制摩擦传动轮匀速转动的电机， 使得基材承载架能连续的由进片室、 第一 过渡室、 第一镀膜缓冲室进入镀膜室镀膜， 镀膜完成后由第二镀膜缓冲室、 第 二过渡室、 出片室送出， 使得整个生产可连续性， 提高生产效率， 减少生产辅 助工序。
作为多功能连续式磁控溅射镀膜装置的一种优选方案， 所述第一靶位门板 周边设置用于与所述靶位口密封连接的密封圈， 所述第二靶位门板周边设置用 于与所述靶位口密封连接的密封圈。
优选的， 所述第一靶位门板周边至少设置一圈密封圈， 所述第二靶位门板 周边至少设置一圈密封圈。
更加优选的， 所述第一靶位门板周边设置两圈密封圈， 所述第二靶位门板 周边设置两圈密封圈。
优选的， 在所述靶位口处对应第一靶位门板或第二靶位门板至少开设有一 圈环形的密封用凹槽， 在所述凹槽内设置密封圈。
更加优选的， 所述靶位口处开设有两圈环形的密封用凹槽， 在每个所述凹 槽内均设置密封圈。 对比现有技术， 本发明的有益效果为： 通过在镀膜室的靶位口处设置可交 替使用的立式靶和倾斜靶， 并对应立式靶和倾斜靶在镀膜室内设置立式基材承 载架和倾斜式基材承载架， 使得产品在镀膜要求不高时可以使用立式靶进行镀 膜， 当产品镀膜要求高时可以使用倾斜靶进行镀膜， 并利用倾斜式基材承载架 装配产品， 可以有效的避免装夹时的夹痕， 防止出现无效区， 并且立式靶和倾 斜靶的可交替使用， 使得镀膜室能适应更多规格的产品镀膜， 提高镀膜装置的 通用性。
附图说明
图 1为发明所述的多功能连续式磁控溅射镀膜装置的结构示意图； 图 2为图 1中镀膜室的结构示意图；
图 3为图 2中镀膜室使用立式靶时的剖视示意图；
图 4为图 2中镀膜室使用倾斜靶时的剖视示意图。
图中：
1、 镀膜室； 101、 连接口； 102、 靶位口； 103、 第一靶位门板； 104、 第二 靶位门板； 105、 立式靶； 106、 倾斜靶； 107、 立式靶座； 108、 倾斜靶座； 109、 直立导向轮； 110、 倾斜导向轮； 111、 立式基材承载架； 112、 倾斜基材承载架； 113、 第一传动摩擦部； 114、 第二传动摩擦部； 115、 第一滑行凹槽； 116、 第 二滑行凹槽； 117、 摩擦传动轮； 118、 传动转轴； 119、 磁流体密封件；
2、 进片室； 3、 第一过渡室； 4、 第一镀膜缓冲室； 5、 第二镀膜缓冲室； 6、 第二过渡室； 7、 出片室； 8、 隔离闽门； 9、 上料工位； 10、 下料工位； 11、 真 空泵机组。
具体实施方式
如图 1 所示， 此实施例中所述的多功能连续式磁控溅射镀膜装置， 包括依 次设置的进片室 2、 第一过渡室 3、 第一镀膜缓冲室 4、 镀膜室 1、 第二镀膜缓 冲室 5、 第二过渡室 6、 出片室 7， 在进片室 2远离第一过渡室 3的一侧设置上 料工位 9， 在出片室 7远离第二过渡室 6的一侧设置下料工位 10， 进片室 2和 第一过渡室 3之间设置隔离闽门 8，第一过渡室 3和第一镀膜缓冲室 4之间设置 隔离闽门 8， 第二镀膜缓冲室 5与第二过渡室 6之间设置隔离闽门 8， 第二过渡 室 6和出片室 7之间设置隔离闽门 8， 且第一镀膜缓冲室 4、 镀膜室 1、 第二镀 膜缓冲室 5呈连通设置， 其内部的真空状态一致。
在进片室 2、 第一过渡室 3、 第一镀膜缓冲室 4、 镀膜室 1、 第二镀膜缓冲 室 5、 第二过渡室 6、 出片室 7上均设置一套独立的真空泵机组， 用于进行独立 的抽取真空工作， 这样可以在连续送入和送出产品过程中不破坏镀膜室 1 内的 真空状态， 保证镀膜工作的正常运行。
如图 2〜4所示， 镀膜室 1为长方体箱体， 其包括四个与地面垂直的侧面， 分别为第一侧面、 第二侧面、 第三侧面和第四侧面， 在第一侧面上设置靶位口 102， 在靶位口 102的左侧转动设置第一靶位门板 103， 在靶位口 102的右侧转 动设置第二靶位门板 104，第一靶位门板 103和第二靶位门板 104的外形尺寸均 与靶位口 102的尺寸相匹配， 使得第一靶位门板 103和第二靶位门板 104均能 交替的关闭在靶位口 102处。
第一靶位门板 103外围设置两圈环形密封圈， 使其在关闭到靶位口 102处 时能与靶位口 102密封连接， 第二靶位门板 104外围设置两圈环形密封圈， 使 其在关闭到靶位口 102处时能与靶位口 102密封连接。
在第一靶位门板 103上平行设置两块矩形立式靶座 107， 每个立式靶座 107 上拆卸式设置一块立式靶 105，在第二靶位门板 104上平行设置两块矩形倾斜靶 座 108， 每个倾斜靶座 108上拆卸式设置一块倾斜靶 106， 立式靶座 107的座面 与地面呈垂直状态， 安装在立式靶座 107座面的立式靶 105为长方体形状， 因 此立式靶 105的靶面与地面也呈垂直状态，而倾斜靶座 108的座面与地面呈 83 ° 夹角设置， 安装在倾斜靶座 108座面的倾斜靶 106为长方体形状， 因此倾斜靶 106的靶面与地面也呈 83 ° 夹角设置。
在镀膜室 1 内部顶端平行设置两排导向轮， 分别为直立导向轮 109和倾斜 导向轮 110， 在直立导向轮 109正下方、 镀膜室 1内设置摩擦传动轮 117， 此摩 擦传动轮 117通过传动转轴 118与镀膜室 1外部设置的电机连接， 使得电机能 带动摩擦传动轮 117匀速的转动， 在传动转轴 118与镀膜室 1接触处设置用于 对传动转轴 118进行真空密封的磁流体密封件 119， 以实现可靠的动态密封。
在直立导向轮 109与摩擦传动轮 117之间可以安放立式基材承载架 111，此 立式基材承载架 111 的外表面与立式靶 105的靶面呈平行状态， 这样可以使得 安放在立式基材承载架 111表面的镀膜基材与立式靶 105平行， 进一歩使得镀 膜基材表面镀膜均匀， 保证膜层稳定可靠。
在倾斜导向轮 110与摩擦传动轮 117之间可以安放倾斜式基材承载架 112， 此倾斜式基材承载架 112的外表面与倾斜靶 106的靶面呈平行状态， 且均与地 面呈 83 ° 夹角设置， 这样可以使得安放在倾斜式基材承载架 112表面的镀膜基 材与倾斜靶 106平行， 进而保证安放在倾斜式基材承载架 112表面的镀膜基材 与倾斜靶 106 平行， 使得镀膜基材表面镀膜均匀， 保证膜层稳定可靠， 并且当 镀膜基材对膜层质量要求较高时， 可以使用此倾斜式基材承载架 112， 因为倾斜 式基材承载架 112与地面呈 83度夹角设置， 因此在安放镀膜基材时可以不适用 夹具， 这样就可以避免镀膜无效区。
立式基材承载架 111 的上端设置有与直立导向轮 109相匹配的第一滑行凹 槽 115，立式基材承载架 111的下端设置有与摩擦传动轮 117相匹配的第一传动 摩擦部 113， 使得立式基材承载架 111能在镀膜室 1内均匀的移动。
倾斜式基材承载架 112的上端设置有与倾斜导向轮 110相匹配的第二滑行 凹槽 116，倾斜式基材承载架 112的下端设置有与摩擦传动轮 117相匹配的第二 传动摩擦部 114， 使得倾斜式基材承载架 112能在镀膜室 1内均匀的移动。
摩擦传动轮 117 为圆形轮， 其与传动摩擦部接触处设置有容纳传动摩擦部 的环形凹槽， 以使传动摩擦部能刚好嵌入到摩擦传动轮 117 的环形凹槽内， 并 能有效的实现导向， 同时保证基材承载架在运动过程中不会左右摇摆甚至偏倒。
在与镀膜室 1 的第一侧面连接的第二侧面、 第三侧面分别设置与第一镀膜 缓冲室 4、 第二镀膜缓冲室 5连通的连接口 101， 在进片室 2上正对连接口 101 设置进片门， 在出片室 7上正对连接口 101设置出片门， 进片门和出片门处均 设置密封结构， 使得进片室 2和出片室 7内能保持真空密封状态。
进片室 2、 第一过渡室 3、 第一镀膜缓冲室 4、 第二镀膜缓冲室 5、 第二过 渡室 6、 出片室 7内部均设置与镀膜室 1内部相同设置的直立导向轮 109、 倾斜 导向轮 110、 摩擦传动轮 117、 传动转轴 118、 磁流体密封件 119， 且均在各腔 室外部对应位置设置控制摩擦传动轮 117匀速转动的电机， 使得基材承载架能 连续的由进片室 2、 第一过渡室 3、 第一镀膜缓冲室 4进入镀膜室 1镀膜， 镀膜 完成后由第二镀膜缓冲室 5、 第二过渡室 6、 出片室 7送出， 使得整个生产可连 续性， 提高生产效率， 减少生产辅助工序。
如图 2所示， 选择采用立式基材承载架 111装载镀膜基材：
第一歩、 将镀膜室 1上的靶位口 102处的第一靶位门板 103关闭并密封， 然后将各个隔离闽门 8关闭；
第二歩、 由于第一镀膜缓冲室 4、镀膜室 1以及第二镀膜缓冲室 5是呈贯通 设置的， 因此第一镀膜缓冲室 4、镀膜室 1以及第二镀膜缓冲室 5统称为镀膜室 组， 开启镀膜室组上的真空泵机组 11， 对镀膜室组内抽取真空， 直至镀膜室组 内的气压为镀膜时需要的气压， 开启第一过渡室 3和第二过渡室 6上的真空泵 机组， 分别对第一过渡室 3和第二过渡室 6内部抽取真空， 直至其内部的气压 为 1/2镀膜室组内的气压， 进片室 2和出片室 7暂不抽取真空；
第三歩、 在上料工位 9处将镀膜基材固定在立式基材承载架 111上， 开启 进片室 2的进片门， 将带有镀膜基材的立式基材承载架 111放入到进片室 2内 的直立导向轮和摩擦传动轮之间， 然后关闭进片门， 并通过进片室 2 上设置真 空泵机 11组对进片室 2抽取真空， 使其内部的真空压力与第一过渡室 3内的真 空压力值一致；
第四歩、通过外部控制装置打开进片室 2与第一过渡室 3之间的隔离闽门 8， 并利用直立导向轮和摩擦传动轮将立式基材承载架 111送入到第一过渡室 3内， 关闭进片室 2与第一过渡室 3之间的隔离闽门 8;
第五歩、 利用第一过渡室 3上设置的真空泵机组 11对第一过渡室 3抽取真 空， 使其内部的气压值与镀膜室组内的气压值一致， 然后通过外部控制装置打 开第一过渡室 3与镀膜室组之间的隔离闽门 8，并利用直立导向轮和摩擦传动轮 将立式基材承载架 111 送入到镀膜室组内的直立导向轮与摩擦传动轮之间， 关 闭隔离闽门 8，待立式基材承载架 111从第一镀膜缓冲室 4进入到镀膜室 1内后， 再进行磁控溅射镀膜；
第六歩、 镀膜完成后， 开启第二过渡室 6上的真空泵机组， 对第二过渡室 6 内进行抽取真空， 使第二过渡室 6 内的压力值与镀膜室组的保持一致， 然后将 镀膜室组与第二过渡室 6之间的隔离闽门 8开启， 将立式基材承载架 111送入 到第二过渡室 6内的直立导向轮和摩擦传动轮上；
第七歩、开启第二过渡室 6与出片室 7之间的隔离闽门 8， 将立式基材承载 架 111送入到出片室 7内， 并关闭第二过渡室 6与出片室 7之间的隔离闽门 8; 第八歩、 开启出片室 7上的大气闽门， 使空气进入出片室 7内， 待出片室 7 内的气压值与大气压一致， 开启出片室 7的出门口， 将立式基材承载架 111从 出片室 7送出至下料工位 10处， 然后进行卸料；
第九歩、 重复第一歩至第八歩， 进行连续的重复的镀膜工序。
如图 3所示， 选择采用倾斜式基材承载架 112装载镀膜基材时， 操作歩骤 与上述歩骤完全一致， 只需要将倾斜式基材承载架 112 安放到倾斜式导向轮和 摩擦传动轮 117之间， 并且将靶位口 102处的第二靶位门板 104关闭即可。
以上结合具体实施例描述了本发明的技术原理。 这些描述只是为了解释本 发明的原理， 而不能以任何方式解释为对本发明保护范围的限制。 基于此处的 解释， 本领域的技术人员不需要付出创造性的劳动即可联想到本发明的其它具 体实施方式， 这些方式都将落入本发明的保护范围之内。

Claims

权 利 要 求 书
1、 一种多功能连续式磁控溅射镀膜装置， 包括至少一个镀膜室， 其特征在 于，所述镀膜室内壁上具有用于磁控溅射镀膜的可交替使用的立式靶和倾斜靶， 对应所述立式靶在所述镀膜室内设置移动式的立式基材承载架， 对应所述倾斜 靶在所述镀膜室内设置移动式的倾斜式基材承载架； 所述立式基材承载架的一 端设置有第一滑行凹槽， 另一端设置第一传动摩擦部， 所述镀膜室内侧顶部对 应所述第一滑行凹槽设置直立导向轮， 所述镀膜室内侧底部对应所述第一传动 摩擦部设置摩擦传动轮， 所述摩擦传动轮通过传动转轴与所述镀膜室外部的动 力装置连接，所述传动转轴与所述镀膜室接触处设置用于密封的磁流体密封件; 在所述直立导向轮的一侧设置倾斜导向轮， 对应所述倾斜导向轮在所述倾 斜式基材承载架端部设置第二滑行凹槽， 在所述倾斜式基材承载架远离所述第 二滑行凹槽的一端设置与所述摩擦传动轮相匹配的第二传动摩擦部。
2、 根据权利要求 1所述的多功能连续式磁控溅射镀膜装置， 其特征在于， 所述镀膜室的第一侧面开有靶位口，所述靶位口的一侧转动设置第一靶位门板， 所述靶位口的另一侧转动设置第二靶位门板， 以使所述第一靶位门板与所述第 二靶位门板能交替的关闭在所述靶位口处。
3、 根据权利要求 2所述的多功能连续式磁控溅射镀膜装置， 其特征在于， 所述第一靶位门板上至少设置一个立式靶座， 在所述立式靶座上拆卸式安装有 所述立式靶， 所述第二靶位门板上至少设置一个倾斜靶座， 在所述倾斜靶座上 拆卸式安装有所述倾斜靶。
4、 根据权利要求 1所述的多功能连续式磁控溅射镀膜装置， 其特征在于， 所述立式靶座的座面与地面呈垂直设置， 对应的立式靶的靶面、 直立基材承载 架的架面也均与地面呈垂直设置， 所述倾斜靶座的座面与地面呈夹角 α设置， 对应的倾斜靶的靶面、 倾斜式基材承载架的架面也均与地面呈夹角 α设置。
5、 根据权利要求 3所述的多功能连续式磁控溅射镀膜装置， 其特征在于， 所述第一靶位门板上平行设置两个所述立式靶座， 所述第二靶位门板上平行设 置两个所述倾斜靶座。
6、 根据权利要求 2所述的多功能连续式磁控溅射镀膜装置， 其特征在于， 还包括分别设置在所述镀膜室两侧的第一镀膜缓冲室和第二镀膜缓冲室， 所述 第一镀膜缓冲室远离镀膜室的一侧设置第一过渡室， 所述第二镀膜缓冲室远离 镀膜室的一侧设置第二过渡室， 所述第一过渡室远离第一镀膜缓冲室的一侧设 置进片室， 所述第二过渡室远离第二镀膜缓冲室的一侧设置出片室， 所述进片 室与第一过渡室之间、 所述第一过渡室与第一镀膜缓冲室之间、 所述第二镀膜 缓冲室与第二过渡室之间、 所述第二过渡室与出片室之间均设置用于隔绝各个 腔室的隔离闽门， 所述第一镀膜缓冲室、 镀膜室、 第二镀膜缓冲室之间呈贯通 设置。
7、 根据权利要求 4所述的多功能连续式磁控溅射镀膜装置， 其特征在于， 所述倾斜靶座的座面、 倾斜靶的靶面、 倾斜式基材承载架的架面与地面的夹角 α为锐角。
8、 根据权利要求 1〜7任一所述的多功能连续式磁控溅射镀膜装置， 其特 征在于， 所述进片室、 第一过渡室、 第一镀膜缓冲室、 镀膜室、 第二镀膜缓冲 室、 第二过渡室以及出片室上分别独立设置真空泵机组， 使各个腔室能独立抽 取真空。
9、 根据权利要求 2〜7任一所述的多功能连续式磁控溅射镀膜装置， 其特 征在于， 所述第一靶位门板周边设置用于与所述靶位口密封连接的密封圈， 所 述第二靶位门板周边设置用于与所述靶位口密封连接的密封圈。
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