WO2014088357A1 - 인쇄회로기판 및 그 제조방법 - Google Patents
인쇄회로기판 및 그 제조방법 Download PDFInfo
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- WO2014088357A1 WO2014088357A1 PCT/KR2013/011247 KR2013011247W WO2014088357A1 WO 2014088357 A1 WO2014088357 A1 WO 2014088357A1 KR 2013011247 W KR2013011247 W KR 2013011247W WO 2014088357 A1 WO2014088357 A1 WO 2014088357A1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1637—Composition of the substrate metallic substrate
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/54—Contact plating, i.e. electroless electrochemical plating
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
- H05K3/462—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar double-sided circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/467—Adding a circuit layer by thin film methods
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
- H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0323—Carbon
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/072—Electroless plating, e.g. finish plating or initial plating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/073—Displacement plating, substitution plating or immersion plating, e.g. for finish plating
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Definitions
- the present invention relates to a printed circuit board using aluminum and a method for manufacturing the same, and a printed circuit board and a method for manufacturing the same that can increase the heat dissipation and bending strength using aluminum.
- a printed circuit board generally called a printed circuit board (PCB) is a component that is configured to allow various devices to be mounted or to make an electrical connection between devices due to integrated wiring.
- a printed circuit board having various forms and various functions according to the development of technology. Substrates are being manufactured.
- the demand for printed circuit boards is increasing along with the growth of consumer electronics, telecommunications, semiconductor equipment, industrial equipment, and automotive electric control.In particular, as printed circuit board products become smaller and lighter as electronic components become smaller and more advanced. And high value-added products.
- Patent Document 1 relates to a printed circuit board and a manufacturing method for improving the heat dissipation characteristics of the substrate by using an aluminum substrate as a base substrate, and improving the heat dissipation characteristics limited by using a conventional CCL substrate.
- a center layer having a circuit pattern formed thereon, and an etching resistor pattern formed on both surfaces thereof, an insulation layer stacked on both sides of the center layer, an additional circuit layer stacked on the insulation layer and formed with a circuit pattern, and the aluminum core;
- the structure is disclosed.
- Patent Document 2 by changing the insulating layer to aluminum to improve the heat dissipation and flexural reinforcement performance, and by constructing a circuit on both sides, the via hole treatment is used to change the overall nonconductor together with the surface roughness formation.
- the structure is in close contact with each other and constitutes a circuit on both sides of aluminum, and it is disclosed that the anodization depth is 10 to 100 ⁇ m, which is excellent in electric shock at 30 ⁇ m and is excellent in insulation function.
- the aluminum core in the process of performing electroless copper plating.
- the surface of the corrosion In this case, the copper film formed in the electroless copper plating process is not completely in contact with the lower aluminum core layer, and in the subsequent electrolytic copper plating process, the surface of the copper film is lifted after plating and the adhesion is poor, resulting in deterioration of the reliability of the product. There is a problem.
- the printed circuit board manufactured by the conventional technology as described above is stable in the adhesion to the copper film by performing anodizing treatment on the aluminum core in office automation equipment, portable terminals, etc., where the application temperature range is relatively stable.
- Substrate applied to the electronic control field of the automobile, in particular, the substrate applied to the engine room has a problem that the adhesion between the aluminum thin film and the copper film is reduced because of the harsh environment.
- Patent Document 1 is a method of laminating insulators on both sides of a semi-processed aluminum plate, and is connected to the aluminum plate due to the characteristics of the circuit corrosion process, and thus, an independent part or a circuit cannot be formed when energizing.
- the whole is defined by a specific electrode of (+) or (-). Therefore, a large number of processing steps are required to produce a multi-layer substrate, or there is a difficulty in simplifying a product by integrating circuits.
- An object of the present invention is to solve the problems described above, to provide a printed circuit board and a method of manufacturing the same that can increase the heat radiation function and bending strength.
- Another object of the present invention is to provide a printed circuit board and a method of manufacturing the same, which can improve the reliability of a product by preventing breakage (cracking) of the substrate in harsh environmental conditions applied to automobiles.
- Another object of the present invention is to provide a printed circuit board and a method for manufacturing the same, which reduce weight of automotive electronic parts by using aluminum which is relatively lighter than copper.
- Still another object of the present invention is to provide a printed circuit board and a method of manufacturing the same, which can shorten the manufacturing time of the printed circuit board and reduce the manufacturing cost thereof.
- Still another object of the present invention is that aluminum is bonded to the insulating layer by laminating the aluminum around the insulator, so that various types of circuits can be implemented as needed, and thus, the circuit can be integrated to simplify the product. It is to provide a circuit board and a method of manufacturing the same.
- the printed circuit board according to the exemplary embodiments of the present invention may include an insulating layer made of an insulator material, an aluminum base layer bonded to both sides of the insulating layer and having a circuit pattern formed on a surface thereof, and the base layer being the insulating layer.
- a double-sided substrate including a bonding member interposed therebetween for bonding to the substrate, a second insulating layer formed on the base layer on the double-sided substrate, and a second base layer bonded on the second insulating layer by using a second bonding member.
- the plating layer comprises the metal layer It may be formed to cover.
- the substitution layer may be a zincate treatment to replace the surface of the base layer with zinc, and the substitution layer may be formed to have a thickness equal to that of the metal layer.
- the plating layer may be formed using electroless or electrolytic plating.
- the plating layer may be formed of a substitution plating layer formed on the surface of the substitution layer by electrolytic plating or electroless plating, and an electroplating layer of copper on the substitution plating layer.
- the substitution plating layer may be formed to cover all of the metal layers, and the electrolytic plating layer may be formed to cover the substitution plating layer.
- the substitution plating layer may be formed on the substitution layer except for the metal layer, or may be formed to cover a portion of the metal layer, and the electrolytic plating layer may be formed to cover a portion of the metal layer in which the substitution plating layer is not formed.
- the double-sided substrate may be formed by stacking one or two or more.
- two or more double-sided substrates may be stacked, and an insulating layer may be formed between each double-sided substrate.
- the base layer is formed of an aluminum material, it is possible to perform a surface treatment for forming the surface roughness of the base layer.
- the circuit pattern may be formed by any one of a chemical method, a mechanical method, or may be formed alone.
- the method of manufacturing a printed circuit board providing an insulating layer of an insulator material, bonding a base layer of a predetermined thickness on the insulating layer using a bonding member, Forming a double-sided substrate by forming a predetermined circuit pattern on the base layer, forming a second insulating layer to fill the circuit pattern of the double-sided substrate, and forming a second bonding member on the second insulating layer.
- the metal layer by metalizing the exposed surface of the insulating layer and the bonding member and the second insulating layer and the second bonding member of the double-sided substrate exposed inside the via hole.
- the method may further include forming the plating layer.
- the plating layer may be formed to cover the metal layer.
- the forming of the substitution layer may be performed so that the thickness of the substitution layer is equal to the thickness of the metal layer based on the thickness of the metal layer.
- the forming of the substitution layer may be formed by replacing the surfaces of the base layer and the insulating layer with zinc by using a zincate method.
- the plating layer may be formed to cover part or all of the metal layer.
- the forming of the plating layer may include forming a substitution plating layer on the surface of the substitution layer by using electrolytic plating or electroless plating, and using an electroplating layer of copper on the substitution plating layer. It may comprise the step of forming.
- prior to bonding the base layer to the insulating layer may further comprise the step of forming roughness on the surface of the base layer.
- the method of manufacturing a printed circuit board providing an insulating layer of an insulator material, bonding the base layer of a predetermined thickness on the insulating layer using a bonding member Forming a double-sided substrate by forming a predetermined circuit pattern on the base layer; stacking two or more double-sided substrates on which the circuit pattern is formed; between the stacked double-sided substrates and the stacked double-sided substrates Forming an insulating layer on the upper and lower surfaces, respectively, bonding a second base layer of aluminum material to the upper and lower surfaces of the laminated double-sided substrate by using a second bonding member, respectively; Forming a via hole penetrating through the second insulating layer and the second bonding member and the second base layer, the surface of the second base layer and the inside of the via hole; Forming a substitution layer by surface-treating zinc-exposed portions, forming a plating layer using electrolytic plating or electroless plating on the substitution layer, and
- the via hole after forming the via hole, to form a metal layer for metalizing each of the insulating layer and the bonding member and the second insulating layer and the second bonding member of the double-sided substrate exposed inside the via hole; It may further comprise a step.
- the forming of the substitution layer may be performed such that the thickness of the substitution layer is equal to the thickness of the metal layer based on the thickness of the metal layer.
- the forming of the substitution layer it may be formed by replacing the surface of the base layer and the insulating layer with zinc using a zincate method.
- the forming of the plating layer, the step of forming a substitution plating layer using the electrolytic plating or electroless plating on the surface of the substitution layer, and the electroplating layer of copper material using the electrolytic plating on the substitution plating layer It may include forming a.
- prior to bonding the base layer to the insulating layer may further comprise the step of forming roughness on the surface of the base layer.
- the polyimide adhesive sheet capable of absorbing the change rate according to the thermal expansion coefficient of aluminum is used to prevent breakage of the substrate even under severe conditions where vibration and temperature change are sudden, Product reliability can be improved.
- the roughness is formed on the surface of the base layer, it is possible to shorten the manufacturing time of the printed circuit board, and to use a relatively inexpensive aluminum, thereby reducing the manufacturing cost have.
- the printed circuit board and the manufacturing method according to the present invention by applying the conventional lamination, plating, circuit forming method while reducing the manufacturing cost of the printed circuit board, it is possible to improve the strength of the power supply, heat dissipation, bending Is also obtained.
- 1 to 6 are schematic views for explaining a method of manufacturing a printed circuit board according to an embodiment of the present invention.
- FIGS. 7 to 12 are schematic diagrams for describing a method of manufacturing a multilayer board using the printed circuit board formed by FIGS. 1 to 6.
- a base layer 103 ′ formed of aluminum foil having a predetermined thickness is provided.
- surface roughness may be formed by soft etching using an sulfuric acid-based surface or performing an oxidation treatment.
- the base layer 103 having the surface roughness is joined to the upper and lower sides of the insulating layer 101 made of an insulator material by using the joining member 102.
- the bonding member 102 may use an epoxy-based adhesive sheet such as a polyimide insulating adhesive sheet or a glass epoxy resin, which is a bonding material having excellent adhesive performance and insulating function.
- the bonding member 102 may use a similar thermal expansion coefficient to the base layer 103.
- the polyimide can withstand a high temperature of 400 ° C or higher and a low temperature of -269 ° C, and thus can absorb the change rate according to the thermal expansion coefficient of aluminum (23.03 ⁇ 10 -6 / ° C).
- the base layer 103 may be heated to a predetermined temperature and applied by applying a predetermined pressure.
- a dry film 104 is coated on the base layer 103, and as shown in FIG. 4, the film is exposed and developed for a predetermined time to obtain a predetermined pattern ( 105).
- the circuit pattern 106 is formed by removing the base layer 103 based on the pattern 105 of the dry film 104, and as shown in FIG. 6.
- the printed circuit board is formed by removing the dry film 104 on the base layer 103 on which the pattern 106 is formed.
- the circuit pattern 106 is formed by selectively removing only the base layer 103 exposed by the pattern 105 using hydrochloric acid-based acid etching while the dry film 104 is bonded on the base layer 103. can do.
- hydrochloric acid series ferric chloride, cupric chloride, sodium chlorate and the like can be used.
- the formation of the direct circuit pattern 106 on the base layer 103 has been described as an example, but the present invention is not limited thereto, and the electroplating or electroless plating on the base layer 103 is performed. It is also possible to form the circuit layer 106 on the plating layer after forming the plating layer by using.
- the circuit pattern 106 is formed using a chemical method, but the present invention is not limited thereto, and the circuit pattern 106 may be formed by a mechanical method using punching or the like. . It is also possible to form only the through-holes so as to connect the electrodes or the metal layer even if the circuit pattern is not.
- FIGS. 7 to 12 are schematic diagrams for describing a method of manufacturing a multilayer board using the printed circuit board manufactured in FIGS. 1 to 6.
- the printed circuit board manufactured in FIGS. 1 to 6 will be referred to as a 'duplex board'.
- an insulating layer 107 having a predetermined thickness is formed to fill the circuit pattern 106 in the double-sided substrate manufactured according to FIGS. 1 to 6.
- the base layer 109 is bonded to the insulating layer 107 using the bonding member 108.
- the base layer 109 is an aluminum foil having a predetermined thickness
- the bonding member 108 may use a polyimide insulating adhesive sheet or an epoxy series.
- the via hole 110 is formed to penetrate through the double-sided substrate, the insulating layer 107, the bonding member 108, and the base layer 109.
- the via hole 110 may be formed using a drill or laser processing.
- the metal layer 111 is formed.
- the metal layer 111 may form a carbon plating layer by using carbon direct plating.
- the base layers 103 and 109 formed are electrically connected to each other.
- the surface of the base layer 109 is subjected to zincate (zinc substitution plating) treatment to form a substitution layer 112 having a predetermined thickness.
- the substitution layer 112 is formed by replacing a portion of the surface of the base layer 109 with a zinc film.
- the thickness of the substitution layer 112 is formed to the same thickness based on the thickness of the metal layer 111.
- the substitution layer 112 having a predetermined thickness is formed on the surface of the base layer 109 except for the metal layer 111.
- aluminum may be prevented from being oxidized in the air, thereby protecting the surface of the base layer 109.
- by replacing the surface of the base layer 109 with a zinc film it is possible to prevent the surface of the base layer 109 from being corroded during the electroless plating and electrolytic plating process to be performed later.
- the substitution plating layer 113 is formed on the substitution layer 112 using electrolytic plating or electroless plating.
- the substitution plating layer 113 may be formed on the substitution layer 112 by performing substitution plating with a metal film having strong chemical resistance.
- the substitution plating layer 113 may perform substitution plating using nickel (Ni) to substitute and form the substitution layer 112 with a nickel film.
- Ni nickel
- the present invention is not limited only to nickel, and it is also possible to perform substitution plating with another metal having strong chemical resistance, for example, gold (Au) or silver (Ag).
- the present invention is not limited thereto, and the metal layer 111 and the substitution layer 112 are used. ) May also be considered to be substituted by the substitution plating layer 113.
- the substitution plating layer 113 may be formed only on the substitution layer 112 except for the metal layer 111, or may be formed to cover part or all of the metal layer 111.
- an electrolytic plating layer is formed on the substitution plating layer 113.
- the electroplating layer 114 is also formed on the substitution plating layer 113 inside the via hole 110.
- the electroplating layer 114 may be a copper film by copper plating.
- the electrolytic plating layer 114 is formed using electrolytic plating.
- the thickness of the electroplating layer 114 may be formed to 20 ⁇ m or more.
- At least one layer of the substitution plating layer 113 and the electroplating layer 114 is formed on the surface of the metal layer 111.
- the substitution plating layer 113 is formed only on the substitution layer 112 except for the metal layer 111
- the electroplating layer 114 is formed to cover both the substitution plating layer 113 and the metal layer 111
- Only the electroplating layer 114 is formed on the metal layer 111.
- the substitution plating layer 113 is formed to cover a part of the metal layer 111
- the electroplating layer 114 is formed to cover both the substitution plating layer 113 and the metal layer 111.
- the electroplating layer 114 covers the substitution plating layer 113, and the substitution plating layer 113 and the electroplating layer 114 are disposed on the metal layer 111. Two layers of are formed.
- the dry film 115 is apply
- the electrolytic plating layer 114, the substitution plating layer 113, the substitution layer 112, and the base layer 109 are removed by using the dry film 115 having the pattern 116 formed thereon.
- Circuit pattern 117 is formed.
- the circuit pattern 117 is removed using the dry film 115 to remove the electrolytic plating layer 114, the substitution plating layer 113, the substitution layer 112, and the base layer 109 by using hydrochloric acid-based acid etching. Can be formed.
- the method of forming the circuit pattern 117 after applying the dry film 115 and forming the pattern is the same as in the above-described embodiment, overlapping description is omitted.
- the double-sided substrate is formed by laminating two layers, but the present invention is not limited thereto.
- three or more high-layer substrates may be formed. It is possible to form.
- FIG. 12 it is possible to form a high-layered substrate by stacking two double-sided substrates manufactured according to FIGS. 1 to 6 up and down.
- a multi-layer substrate by laminating three or more double-sided substrates in the manner described in FIG.
- an insulating layer 107 is interposed between the stacked double-sided substrates to electrically separate the double-sided substrates.
- the insulating layer 107, the bonding member 108, and the base layer 108 are formed on the uppermost and lower surfaces of the double-sided substrates stacked.
- via holes are formed in the same manner as described with reference to FIGS. 7 to 11, and the metal layer 111, the substitution layer 112, the substitution plating layer 113, and the electroplating layer 114 are sequentially formed, and then the dry film 115 is formed.
- the circuit pattern 117 is formed by a chemical method using hydrochloric acid-based acid etching using the dry film 115.
- the chemical method may selectively remove the layer since the electroplating layer 114, the substitution plating layer 113, and the substitution layer 112, as well as the second base layer 109, are removed.
- the printed circuit board manufactured according to the present invention can be applied to automotive electronic parts and the like.
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Abstract
Description
Claims (24)
- 절연체 재질의 절연층, 상기 절연층의 양측면 상에 접합 형성되고 표면에 회로 패턴이 형성된 알루미늄 재질의 베이스층, 상기 베이스층을 상기 절연층에 접합시키기 위해서 개재되는 접합 부재를 포함하여 형성된 양면 기판;상기 양면 기판에서 상기 베이스층 상에 형성된 제2 절연층;상기 제2 절연층 상에 제2 접합부재를 이용하여 접합되는 제2 베이스층;상기 양면 기판 및 상기 제2 절연층과 상기 제2 베이스층을 관통하여 형성되는 비아홀;상기 제2 베이스층의 표면과 상기 비아홀 내부로 노출된 부분을 아연화시키는 표면 처리하여 형성된 치환층;상기 치환층 상에 형성되는 도금층; 및상기 도금층 상에 형성되는 제2 회로 패턴;을 포함하는 인쇄회로기판.
- 제1항에 있어서,상기 비아홀 내부에서 노출된 상기 양면 기판의 절연층과 접합 부재 및 제2 절연층과 제2 접합부재의 표면을 금속화시켜서 형성되는 금속층을 더 포함하고,상기 도금층은 상기 금속층을 덮도록 형성되는 인쇄회로기판.
- 제2항에 있어서,상기 치환층은 상기 베이스층의 표면을 아연으로 치환하는 징케이트(zincate) 처리가 수행되고,상기 치환층은 상기 금속층의 두께와 같은 두께로 형성되는 인쇄회로기판.
- 제3항에 있어서,상기 도금층은 무전해 또는 전해 도금을 이용하여 형성된 인쇄회로기판.
- 제4항에 있어서,상기 도금층은 상기 치환층 표면에 전해 도금 또는 무전해 도금으로 형성되는 치환 도금층과, 상기 치환 도금층 상에 전해 도금으로 형성된 구리 재질의 전해 도금층으로 형성되는 인쇄회로기판.
- 제5항에 있어서,상기 치환 도금층은 상기 금속층을 전부 덮도록 형성되고,상기 전해 도금층은 상기 치환 도금층을 덮도록 형성되는 인쇄회로기판.
- 제5항에 있어서,상기 치환 도금층은 상기 금속층을 제외한 상기 치환층 상에 형성되거나, 상기 금속층의 일부를 덮도록 형성되고,상기 전해 도금층은 상기 치환 도금층이 형성되지 않은 금속층 부분을 덮도록 형성되는 인쇄회로기판.
- 제1항에 있어서,상기 양면 기판은 1개 또는 2개 이상이 적층되어 형성되는 인쇄회로기판.
- 제8항에 있어서,상기 양면 기판이 2개 이상 적층되고, 각 양면 기판 사이에는 절연층이 형성되는 인쇄회로기판.
- 제1항에 있어서,상기 베이스층은 알루미늄 재질로 형성되고, 상기 베이스층의 표면 조도를 형성하기 위한 표면처리를 수행하는 인쇄회로기판.
- 제1항에 있어서,상기 회로 패턴은 화학적 방법, 기계적 방법 중 어느 하나의 방법으로 형성되거나, 홀로 형성된 인쇄회로기판.
- 절연체 재질의 절연층을 제공하는 단계;상기 절연층 상에 소정 두께의 베이스층을 접합 부재를 이용하여 접합하는 단계;상기 베이스층 상에 소정의 회로 패턴을 형성하여 양면 기판을 형성하는 단계;상기 양면 기판의 상기 회로 패턴을 채우도록 제2 절연층을 형성하는 단계;상기 제2 절연층 상에 제2 접합 부재를 이용하여 알루미늄 재질의 제2 베이스층을 접합하는 단계;상기 양면 기판 및 상기 제2 절연층과 상기 제2 접합 부재, 상기 제2 베이스층을 관통하는 비아홀을 형성하는 단계;상기 제2 베이스층의 표면과 상기 비아홀 내부로 노출된 부분을 아연화시키는 표면 처리하여 치환층을 형성하는 단계;상기 치환층 상에 전해 도금 또는 무전해 도금을 이용하여 도금층을 형성하는 단계; 및상기 도금층 상에 제2 회로 패턴을 형성하는 단계;를 포함하는 인쇄회로기판의 제조방법.
- 제12항에 있어서,상기 비아홀을 형성한 후,상기 비아홀 내부로 노출된 상기 양면기판의 상기 절연층과 상기 접합 부재 및 상기 제2 절연층과 상기 제2 접합부재의 노출 면을 금속화시켜서 금속층을 형성하는 단계를 더 포함하고,상기 도금층은 상기 금속층을 덮도록 형성되는 인쇄회로기판의 제조방법.
- 제13항에 있어서,상기 치환층을 형성하는 단계는 상기 금속층의 두께를 기준으로 상기 치환층의 두께가 상기 금속층의 두께와 같아지도록 형성되는 인쇄회로기판의 제조방법.
- 제13항에 있어서,상기 치환층을 형성하는 단계는, 징케이트(zincate) 방법을 이용하여 상기 베이스층 및 상기 절연층의 표면을 아연으로 치환시키는 인쇄회로기판의 제조방법.
- 제13항에 있어서,상기 도금층을 형성하는 단계는, 상기 금속층의 일부 또는 전부를 덮도록 상기 도금층을 형성하는 인쇄회로기판의 제조방법.
- 제16항에 있어서,상기 도금층을 형성하는 단계는,상기 치환층 표면에 전해 도금 또는 무전해 도금을 이용하여 치환 도금층을 형성하는 단계와, 상기 치환 도금층 상에 전해 도금을 이용하여 구리 재질의 전해 도금층을 형성하는 단계를 포함하는 인쇄회로기판의 제조방법.
- 제12항에 있어서,상기 베이스층을 상기 절연층에 접합하기 이전에 상기 베이스층의 표면에 조도를 형성하는 단계를 더 포함하는 인쇄회로기판의 제조방법.
- 절연체 재질의 절연층을 제공하는 단계;상기 절연층 상에 소정 두께의 베이스층을 접합 부재를 이용하여 접합하는 단계;상기 베이스층 상에 소정의 회로 패턴을 형성하여 양면 기판을 형성하는 단계;상기 회로 패턴이 형성된 상기 양면 기판을 2개 이상 복수개 적층하는 단계;상기 적층된 양면 기판들 사이와 적층된 양면 기판에서 상면과 하면에 각각 절연층을 형성하는 단계;상기 적층된 양면 기판에서 상면 및 하면에 각각 제2 접합 부재를 이용하여 알루미늄 재질의 제2 베이스층을 접합하는 단계;상기 적층된 양면 기판들과 상기 제2 절연층 및 상기 제2 접합 부재 및 상기 제2 베이스층을 관통하는 비아홀을 형성하는 단계;상기 제2 베이스층의 표면 및 상기 비아홀 내부로 노출된 부분을 아연화시키는 표면 처리하여 치환층을 형성하는 단계;상기 치환층 상에 전해 도금 또는 무전해 도금을 이용하여 도금층을 형성하는 단계; 및상기 도금층 상에 회로 패턴을 형성하는 단계;를 포함하는 인쇄회로기판의 제조방법.
- 제19항에 있어서,상기 비아홀을 형성한 후,상기 비아홀 내부로 노출된 상기 양면 기판의 절연층과 접합 부재 및 상기 제2 절연층과 상기 제2 접합 부재의 각각의 면을 금속화시키는 금속층을 형성하는 단계를 더 포함하는 인쇄회로기판의 제조방법.
- 제20항에 있어서,상기 치환층을 형성하는 단계는, 상기 금속층의 두께를 기준으로 상기 치환층의 두께가 상기 금속층의 두께와 같아지도록 형성되는 인쇄회로기판의 제조방법.
- 제21항에 있어서,상기 치환층을 형성하는 단계는, 징케이트(zincate) 방법을 이용하여 상기 베이스층 및 상기 절연층의 표면을 아연으로 치환시키는 인쇄회로기판의 제조방법.
- 제19항에 있어서,상기 도금층을 형성하는 단계는,상기 치환층 표면에 전해 도금 또는 무전해 도금을 이용하여 치환 도금층을 형성하는 단계와, 상기 치환 도금층 상에 전해 도금을 이용하여 구리 재질의 전해 도금층을 형성하는 단계를 포함하는 인쇄회로기판의 제조방법.
- 제19항에 있어서,상기 베이스층을 상기 절연층에 접합하기 이전에 상기 베이스층의 표면에 조도를 형성하는 단계를 더 포함하는 인쇄회로기판의 제조방법.
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CN201380063632.6A CN105103663A (zh) | 2012-12-07 | 2013-12-06 | 印刷电路板及其制造方法 |
EP13861374.0A EP2931008A4 (en) | 2012-12-07 | 2013-12-06 | PCB AND MANUFACTURING METHOD THEREFOR |
KR1020137032719A KR20150094794A (ko) | 2012-12-07 | 2013-12-06 | 인쇄회로기판 및 그 제조방법 |
US14/732,309 US9769921B2 (en) | 2012-12-07 | 2015-06-05 | Printed circuit board and manufacturing method therefor |
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KR1020120141576A KR20140073757A (ko) | 2012-12-07 | 2012-12-07 | 인쇄회로기판 및 그 제조방법 |
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US14/732,309 Continuation US9769921B2 (en) | 2012-12-07 | 2015-06-05 | Printed circuit board and manufacturing method therefor |
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JP3165617B2 (ja) * | 1995-03-27 | 2001-05-14 | シャープ株式会社 | 多層プリント配線基板及びその製造方法 |
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KR100950916B1 (ko) * | 2008-05-06 | 2010-04-01 | 삼성전기주식회사 | 인쇄회로기판의 제조방법 및 이에 의해 제조된인쇄회로기판 |
JP4605409B2 (ja) * | 2008-08-21 | 2011-01-05 | 上村工業株式会社 | アルミニウム又はアルミニウム合金の表面処理方法 |
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2012
- 2012-12-07 KR KR1020120141576A patent/KR20140073757A/ko unknown
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2013
- 2013-12-06 KR KR1020137032719A patent/KR20150094794A/ko active IP Right Grant
- 2013-12-06 EP EP13861374.0A patent/EP2931008A4/en not_active Withdrawn
- 2013-12-06 WO PCT/KR2013/011247 patent/WO2014088357A1/ko active Application Filing
- 2013-12-06 CN CN201380063632.6A patent/CN105103663A/zh active Pending
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2015
- 2015-06-05 US US14/732,309 patent/US9769921B2/en active Active
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US20020127379A1 (en) * | 2000-11-09 | 2002-09-12 | Matsushita Electric Industrial Co., Ltd. | Circuit board and method for manufacturing the same |
JP2004179291A (ja) | 2002-11-26 | 2004-06-24 | Ibiden Co Ltd | 配線板および配線板の製造方法 |
US20050178669A1 (en) * | 2004-02-17 | 2005-08-18 | Strubbe John L. | Method of electroplating aluminum |
KR100674321B1 (ko) | 2005-09-02 | 2007-01-24 | 삼성전기주식회사 | 방열특성이 향상된 인쇄회로기판 및 그 제조방법 |
US20120111622A1 (en) * | 2007-04-09 | 2012-05-10 | Nitto Denko Corporation | Double-Sided Pressure-Sensitive Adhesive Tape or Sheet For Use In Wiring Circuit Board And Wiring Circuit Board Having The Double-Sided Pressure-Sensitive Ahesive Tape |
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KR20110067921A (ko) * | 2009-12-15 | 2011-06-22 | 삼성전기주식회사 | 기판 제조용 캐리어 부재 및 이를 이용한 기판의 제조방법 |
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Also Published As
Publication number | Publication date |
---|---|
EP2931008A1 (en) | 2015-10-14 |
KR20140073757A (ko) | 2014-06-17 |
CN105103663A (zh) | 2015-11-25 |
US20150271917A1 (en) | 2015-09-24 |
EP2931008A4 (en) | 2016-08-17 |
US9769921B2 (en) | 2017-09-19 |
KR20150094794A (ko) | 2015-08-20 |
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