WO2014086156A1 - 光伏组件铝背板绝缘方法 - Google Patents

光伏组件铝背板绝缘方法 Download PDF

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WO2014086156A1
WO2014086156A1 PCT/CN2013/080126 CN2013080126W WO2014086156A1 WO 2014086156 A1 WO2014086156 A1 WO 2014086156A1 CN 2013080126 W CN2013080126 W CN 2013080126W WO 2014086156 A1 WO2014086156 A1 WO 2014086156A1
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Prior art keywords
back plate
aluminum
insulating
aluminum back
photovoltaic module
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PCT/CN2013/080126
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English (en)
French (fr)
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高元准
薛松华
杨向华
龚佳琳
杨超
董仲
施晓丹
朱娟娟
夏吉东
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韩华新能源(启东)有限公司
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Priority to JP2015544322A priority Critical patent/JP2015537388A/ja
Priority to EP13859969.1A priority patent/EP2793274B1/en
Priority to BR112014018024A priority patent/BR112014018024A2/pt
Priority to US14/365,686 priority patent/US9385252B2/en
Priority to KR1020147016868A priority patent/KR101565458B1/ko
Publication of WO2014086156A1 publication Critical patent/WO2014086156A1/zh
Priority to ZA2014/05448A priority patent/ZA201405448B/en
Priority to IL234039A priority patent/IL234039A0/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042PV modules or arrays of single PV cells
    • H01L31/048Encapsulation of modules
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042PV modules or arrays of single PV cells
    • H01L31/048Encapsulation of modules
    • H01L31/049Protective back sheets
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02SGENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S30/00Structural details of PV modules other than those related to light conversion
    • H02S30/10Frame structures
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing

Definitions

  • the invention relates to a photovoltaic component aluminum back plate insulation technology, belonging to the field of photovoltaics.
  • Heat dissipation and water vapor permeability are important indicators for improving the power output and service life of photovoltaic modules.
  • Photovoltaic module heat dissipation and water vapor permeability problems It is inclined to use an aluminum backing material with good heat dissipation and moisture barrier properties.
  • the aluminum backing plate has poor insulation and is difficult to withstand a high voltage of 6000 to 8000 V, which is rarely used in crystalline silicon components.
  • a method for insulating aluminum backplane of photovoltaic module characterized in that the method comprises the following steps:
  • the silicone joint is sealed at the joint between the back plate and the aluminum frame.
  • Step (3) The method of insulating the square opening is to enclose the insulating film on the square opening section by insulating the small-section cross-section pad or by using a hem.
  • the invention cuts the aluminum back plate so that the length and width dimensions of the aluminum back plate are smaller than the length and width dimensions of the glass, and the electrode lead portion of the aluminum back plate is opened, so that it becomes a square opening, and when the component is laid out, the other party
  • the shape opening is insulated, and then laminated and laminated, and then the edged laminate is covered with insulating tape, which can effectively solve the aluminum back plate and the metal frame, the aluminum back plate and the electrode lead The problem of poor insulation.
  • the aluminum backsheet has good water vapor barrier properties and heat conduction, but it is currently used less in crystalline silicon photovoltaic modules, mainly due to poor insulation and difficult to withstand high voltages of 6KV. Since the invention adopts the shearing method, the length and width of the aluminum backing plate are smaller than the length and width of the glass.
  • the EVA is melted and solidified, and the side of the aluminum backing plate is sealed, and the insulating tape is used.
  • the edge of the laminate after the chamfering is edged, so that the cutting surface (side surface) of the backboard can be prevented from directly contacting the metal frame and short-circuited, and the insulating tape can be insulated and protected against the cutting surface (side surface) through the aluminum back plate.
  • the electrode lead portion is opened in a square shape, and then the square opening edge is insulated, so that the cross section of the square opening of the aluminum back plate can be prevented from short-circuiting with the electrode lead, thereby maximally improving the overall insulation withstand voltage performance of the aluminum back plate.
  • the present invention is compatible with conventional assembly lines of conventional industrialization. It can directly use existing conventional equipment, avoiding high investment in equipment, facilitating the industrialization and application of aluminum backboard, and improving the insulation withstand voltage performance of aluminum backsheet.
  • Figure 1 is a diagram of glass and aluminum backsheets.
  • Figure 2 shows the square opening of the aluminum backing plate.
  • Figure 3 is a cross-sectional view of the edge of the assembly laminate.
  • a method for insulating an aluminum backing plate of a photovoltaic module comprising the following steps:
  • the silicone joint is sealed at the joint between the back plate and the aluminum frame.
  • Step (3) The method of insulating the square opening is to enclose the insulating film on the square opening section by insulating the small-section cross-section pad or by using a hem.
  • the basic steps in the present invention such as the layout of the components, the lamination of the laminates by a laminator, the trimming of the laminated laminates, the framing and the installation of the junction boxes are all mature
  • the technical means therefore, in this embodiment, the methods of these steps are not elaborated.
  • the innovation of the invention lies in that the aluminum backing plate is sheared so that the size of the aluminum backing plate is smaller than the size of the glass, and after lamination is facilitated, the melt-solidified EVA seals and forms the original sharp and prickly edge section of the aluminum backing plate.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Photovoltaic Devices (AREA)
  • Manufacturing & Machinery (AREA)

Abstract

一种光伏组件铝背板绝缘方法,包括对铝背板(2)进行剪切,使得铝背板的尺寸均小于玻璃的尺寸4-5mm;对铝背板的电极引线(4)部位开方形开口;在组件排版敷设时,通过垫绝缘小料或采用绝缘膜包边的方法对方形开口(3)进行绝缘处理;再经过层压和层压件销边,采用0.5-1mm的绝缘胶带(7)对切边后的层压件进行包边;最后对层压件进行打硅胶(6)装框和装接线盒。方法操作方便、投资低、应用前景广泛。

Description

光伏组件铝背板绝缘方法
技术领域
本发明涉及一种光伏组件铝背板绝缘技术,属于光伏领域。
背景技术
散热性和水汽渗透性是提高光伏组件功率输出和使用寿命的重要指标。据申请人了解,目前国内外光伏行业中,针对 光伏组件散热性和水汽渗透性问题 ,倾向采用散热性和水汽阻隔性良好的铝背板材料。然而,铝背板的绝缘性较差,很难耐受6000~8000V的高压,目前晶体硅组件中很少使用。
发明内容
本发明的目的在于提供一种在光伏组件中使用铝背板,并改善其绝缘性的 光伏组件铝背板绝缘方法。
本发明的技术解决方案是:
一种 光伏组件铝背板绝缘方法 ,其特征是:包括如下步骤:
(1)对铝背板进行剪切,使得铝背板的长宽尺寸均小于玻璃的长宽尺寸;
(2)对铝背板的电极引线部位进行开口,使它成为方形开口;
(3)对组件进行排版敷设,并对方形开口进行绝缘处理;
(4)对排版敷设后的叠层进行层压;
(5)对层压后的层压件进行切边;
(6)采用绝缘胶带对切边后的层压件进行包边;
(7)采用填充硅胶后的边框对包边后的层压件进行装框,并安装接线盒。
步骤(7)装框完成后,还对背板和铝框结合处进行补硅胶密封。
步骤(3)对方形开口进行绝缘处理的方法是:对方形开口的剖面垫绝缘小料或采用包边的方式对方形开口剖面包裹绝缘膜。
本发明对铝背板进行剪切,使得铝背板的长宽尺寸均小于玻璃的长宽尺寸,对铝背板的电极引线部位进行开口,使它成为方形开口,在组件排版敷设时,对方形开口进行绝缘处理,再经过层压和层压件削边,然后采用绝缘胶带对切边后的层压件进行包边,可以有效的解决铝背板与金属边框,铝背板与电极引线的绝缘不良的问题。
铝背板有良好的水汽阻隔性和热传导,但是目前在晶体硅光伏组件的应用较少,主要是绝缘性不良,难以承受6KV的高压。由于本发明采用剪切方法,使得铝背板的长宽尺寸均小于玻璃的长宽尺寸,当组件层压时,EVA熔化和固化后,会对铝背板的侧面形成密封,同时采用绝缘胶带对削边后的层压件包边,这样既能避免背板的切削面(侧面)直接接触金属边框而短路,又能使绝缘胶带对切削面(侧面)起到绝缘保护,通过铝背板的电极引线部位开方形口,然后对方形开口边缘进行绝缘处理,可以避免铝背板的方形开口的横截剖面与电极引线接触短路,最大程度的提高铝背板的整体绝缘耐压性能。
本发明与目前普遍工业化的常规 组件生产线 可以良好兼容, 可以直接利用现有常规设备,避免了设备方面的高投资,有利于 铝背板的 工业化普及应用,提高 铝背板的绝缘耐压性能 。
附图说明
下面结合附图和实施例对本发明作进一步说明。
图1为玻璃和铝背板图。
图2为铝背板方形开口 图 。
图3为组件层压件边缘剖面图。
具体实施方式
一种 光伏组件铝背板绝缘方法 ,(如图1、图2、图3所示),包括如下步骤:
(1)对铝背板进行剪切,使得铝背板2的长宽尺寸均小于镀膜钢化玻璃的1长宽尺寸4~5mm;
(2)对铝背板2的电极引线4部位进行开口,使它成为方形开口3;
(3)对组件进行排版敷设(顺序为镀膜钢化玻璃1、EVA8 1 、电池片9、EVA8 2 和铝背板10,其中EVA8 1 、EVA8 2 组成EVA层8),并对方形开口3进行绝缘处理;
(4)对排版敷设后的叠层进行层压;
(5)对层压后的层压件进行切边;
(6)采用绝缘胶带7对切边后的层压件进行包边;
(7)采用填充有硅胶6(图中包括硅胶61、62)的铝框5对包边后的层压件进行,并安装接线盒;
步骤(7)装框完成后,还对背板和铝框结合处进行补硅胶密封。
步骤(3)对方形开口进行绝缘处理的方法是:对方形开口的剖面垫绝缘小料或采用包边的方式对方形开口剖面包裹绝缘膜。
本发明中的基本步骤方法,比如对组件进行排版敷设、采用层压机对层压件进行层压、对层压后的层压件进行切边、装框和安装接线盒都属于现有成熟的技术手段,因此在本实施例中,未对这些步骤的方法进行详细阐述。本发明的创新点在于对铝背板进行剪切,使得铝背板的尺寸均小于玻璃的尺寸,便于层压后,熔融固化的EVA将铝背板原本锋利多刺的边缘剖面封住并形成光滑连接,这样可以对铝背板边缘剖面形成第一道绝缘,也能避免锋利多刺的剖面将后续的绝缘胶带划伤刺破,同时采用0.5~1mm厚度的绝缘胶带包裹住铝背板边缘剖面和层压件边缘,这样又增加了铝背板边缘剖面的绝缘,采用填充有硅胶铝边框对层压件进行装框,这样又可以增加对铝背板边缘剖面的密封绝缘,同时,对铝背板的电极引线部位开方形开口并对方形开口剖面进行绝缘处理,使得穿过铝背板的电极引线不会与方形开口的剖面接触造成短路,这样可以解决铝背板制作的光伏组件的绝缘耐压失败的问题,提高铝背板在晶体硅组件中的应用。本发明具有突出的特点和显著的进步。
除上述实施例外,本发明还可以有其他实施方式。凡采用等同替换或等效变换形成的技术方案,均落在本发明要求的保护范围。

Claims (1)

1. 一种 光伏组件铝背板绝缘方法 ,其特征是:包括如下步骤:
(1)对铝背板进行剪切,使得铝背板的长宽尺寸均小于玻璃的长宽尺寸4-5mm;
(2)对铝背板的电极引线部位进行开口,使它成为方形开口;
(3)对组件进行排版敷设,并对方形开口进行绝缘处理;
(4)对排版敷设后的叠层进行层压;
(5)对层压后的层压件进行切边;
(6)采用绝缘胶带对切边后的层压件进行包边;
(7)采用填充硅胶后的边框对包边后的层压件进行装框,并安装接线盒。
2. 根据权利要求1所述的 光伏组件铝背板绝缘方法 ,其特征是:步骤(7)装框完成后,还对背板和铝框结合处进行补硅胶密封。
3. 根据权利要求1或2所述的 光伏组件铝背板绝缘方法 ,其特征是:步骤(3)对方形开口进行绝缘处理的方法是:对方形开口的剖面垫绝缘小料或采用包边的方式对方形开口剖面包裹绝缘膜。
PCT/CN2013/080126 2012-12-04 2013-07-25 光伏组件铝背板绝缘方法 WO2014086156A1 (zh)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2015544322A JP2015537388A (ja) 2012-12-04 2013-07-25 光起電力コンポーネントのアルミ後板の絶縁方法
EP13859969.1A EP2793274B1 (en) 2012-12-04 2013-07-25 Insulating method for aluminum back plate of photovoltaic module
BR112014018024A BR112014018024A2 (pt) 2012-12-04 2013-07-25 método para isolamento de uma placa de alumínio do módulo fotovoltaico
US14/365,686 US9385252B2 (en) 2012-12-04 2013-07-25 Method for insulating aluminum backboard of photovoltaic
KR1020147016868A KR101565458B1 (ko) 2012-12-04 2013-07-25 광발전 모듈의 알류미늄 뒷판 절연방법
ZA2014/05448A ZA201405448B (en) 2012-12-04 2014-07-23 Insulating method for aluminium back plate of photovoltaic module
IL234039A IL234039A0 (en) 2012-12-04 2014-08-10 Insulation method for the aluminum back plate of a photovoltaic module

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CN201210510019.1A CN102956755B (zh) 2012-12-04 2012-12-04 光伏组件铝背板绝缘方法
CN201210510019.1 2012-12-04

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EP (1) EP2793274B1 (zh)
JP (1) JP2015537388A (zh)
KR (1) KR101565458B1 (zh)
CN (1) CN102956755B (zh)
BR (1) BR112014018024A2 (zh)
CL (1) CL2014001938A1 (zh)
IL (1) IL234039A0 (zh)
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ZA (1) ZA201405448B (zh)

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DE102012214401A1 (de) * 2012-08-13 2014-02-13 Tesa Se Verfahren zur Herstellung eines Solarmoduls
CN102956755B (zh) * 2012-12-04 2015-04-01 韩华新能源(启东)有限公司 光伏组件铝背板绝缘方法
WO2014146317A1 (zh) * 2013-03-22 2014-09-25 韩华新能源(启东)有限公司 新型光伏组件
CN104112783B (zh) * 2013-04-22 2017-08-25 珠海兴业新能源科技有限公司 高性能绝缘太阳能光伏光热一体化板芯及其制备方法
CN104868000B (zh) * 2015-05-29 2016-10-05 苏州思博露光伏能源科技有限公司 轻质模块化的太阳能电池组件
CN106229374A (zh) * 2016-07-27 2016-12-14 无锡中洁能源技术有限公司 太阳能电池背板生产工艺
CN106229380A (zh) * 2016-08-27 2016-12-14 无锡中洁能源技术有限公司 一种带涂层太阳能背板的生产工艺
CN106206791A (zh) * 2016-08-27 2016-12-07 无锡中洁能源技术有限公司 一种具有高散热性太阳能电池背板的生产工艺
CN106206804A (zh) * 2016-08-27 2016-12-07 无锡中洁能源技术有限公司 一种有机绝缘型太阳能背板的生产工艺
CN106299001B (zh) * 2016-09-07 2019-04-23 珠海格力电器股份有限公司 一种抗pid效应的光伏组件
CN110729367B (zh) * 2018-06-28 2021-04-30 领凡新能源科技(北京)有限公司 自动贴覆装置和背板裁切系统
CN109104149A (zh) * 2018-09-27 2018-12-28 北京铂阳顶荣光伏科技有限公司 太阳能电池组件框架和太阳能电池装置
CN112422065A (zh) * 2020-12-03 2021-02-26 安徽大恒能源科技有限公司 一种全屏光伏组件边框及其装配工艺

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