WO2014076840A1 - Boîtier de convertisseur d'énergie - Google Patents

Boîtier de convertisseur d'énergie Download PDF

Info

Publication number
WO2014076840A1
WO2014076840A1 PCT/JP2012/079949 JP2012079949W WO2014076840A1 WO 2014076840 A1 WO2014076840 A1 WO 2014076840A1 JP 2012079949 W JP2012079949 W JP 2012079949W WO 2014076840 A1 WO2014076840 A1 WO 2014076840A1
Authority
WO
WIPO (PCT)
Prior art keywords
power converter
plate
case
resin plate
heat sink
Prior art date
Application number
PCT/JP2012/079949
Other languages
English (en)
Japanese (ja)
Inventor
潤平 小山
茂雄 神保
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to JP2014546827A priority Critical patent/JP6000370B2/ja
Priority to CN201290001142.4U priority patent/CN204168108U/zh
Priority to PCT/JP2012/079949 priority patent/WO2014076840A1/fr
Publication of WO2014076840A1 publication Critical patent/WO2014076840A1/fr

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
    • H05K7/20918—Forced ventilation, e.g. on heat dissipaters coupled to components the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels

Definitions

  • the present invention relates to a case of a power converter.
  • Patent Document 1 discloses a case-forming panel that is made of a material having elasticity when a case of an electronic computer is assembled, and has a shape in which grooves for partitioning surfaces are formed in advance, and a plurality of surfaces are developed. The use is described. Thus, according to Patent Document 1, the casing forming panel can be assembled by simply folding the casing forming panel.
  • Patent Document 2 describes that the case of an electronic switch is a case plate made of a synthetic resin that can be bent and formed in an integrated developed view. Thus, according to Patent Document 2, the electronic switch can be completed by mounting the electronic circuit portion on a predetermined portion of the case, so that the assembly workability can be greatly improved. Yes.
  • Patent Document 3 describes that when an electronic device is assembled, an electronic component is attached to the unfolded casing, and then the unfolded casing is bent to form the casing into a box shape. ing.
  • the housing since the housing is in the unfolded state at the timing of attaching the electronic component to the housing, the housing itself is less likely to become an obstacle when attaching the electronic component, and the electronic component can be easily It can be attached.
  • JP-A-6-275963 Japanese Utility Model Publication No. 62-43416 JP 2012-89671 A
  • the present invention has been made in view of the above, and an object of the present invention is to obtain a case of a power converter that can improve the workability of assembly and improve heat dissipation.
  • a case of a power converter according to one aspect of the present invention is a case of a power converter that houses a power converter, and the case includes a resin plate.
  • the heat sink that covers the power converter and that radiates heat from the power converter and that has a plurality of heat radiation fins is supported in a state where the plurality of heat radiation fins are opened. It is characterized by that.
  • the case of the power converter is configured to be formed by bending the resin plate, the power converter can be accommodated in the case without damaging the components in the power converter, and the tolerance is increased. Not susceptible to rattling caused by Thereby, the workability of assembly can be improved.
  • the power converter case covers the power converter and supports the heat sink with a plurality of radiating fins open, the heat generated by the power converter and radiated through the heat sink Can be easily released out of the case, improving heat dissipation. That is, the assembly workability can be improved and the heat dissipation can be improved.
  • FIG. 1 is a diagram illustrating a configuration of a case of the power converter according to the first embodiment.
  • FIG. 2 is a diagram illustrating a configuration (before bending) of a resin plate to be a case of the power converter according to the first embodiment.
  • FIG. 3 is a diagram illustrating a configuration (before combination) of the power converter and the heat sink in the first embodiment.
  • FIG. 4 is a diagram showing the configuration (after combination) of the power converter and the heat sink in the first embodiment.
  • FIG. 5 is a diagram showing a bending procedure of the resin plate in the first embodiment.
  • FIG. 6 is a diagram illustrating a bending procedure of the resin plate in the first embodiment.
  • FIG. 7 is a diagram showing a bending procedure of the resin plate in the first embodiment.
  • FIG. 8 is a diagram illustrating a configuration of a resin plate and a support portion to be a case of the power converter according to the second embodiment, and a bending procedure of the resin plate.
  • FIG. 9 is a diagram illustrating a bending procedure of the resin plate in the second embodiment.
  • FIG. 10 is a diagram illustrating the configuration of the case of the power converter according to the second embodiment and the procedure for bending the resin plate.
  • FIG. 11 is a diagram illustrating the configuration of the case of the power converter according to the second embodiment and the procedure for bending the resin plate.
  • FIG. 12 is a diagram illustrating a configuration of a resin plate and a cooling flow path forming unit to be a case of the power converter according to the third embodiment, and a bending procedure of the resin plate.
  • FIG. 13 is a diagram illustrating a bending procedure of the resin plate in the third embodiment.
  • FIG. 14 is a diagram illustrating the configuration of the case of the power converter according to the third embodiment and the procedure for bending the resin plate.
  • FIG. 15 is a diagram illustrating a wind flow in the case of the power converter according to the third embodiment.
  • FIG. 16 is a diagram showing a bending procedure of the resin plate in the modification of the first embodiment.
  • FIG. 17 is a diagram illustrating a wind flow in the case of the power converter according to the modification of the first embodiment.
  • FIG. 1 is a perspective view showing a configuration of a case 1 of the power converter.
  • FIG. 2 is a diagram illustrating a configuration of the resin plate RP that is to be the case 1 of the power converter.
  • FIG. 3 is a diagram showing a configuration of the power converter PT and the heat sink HS before being combined with each other.
  • FIG. 4 is a diagram illustrating a configuration of the power converter PT and the heat sink HS after being combined with each other.
  • the case 1 of the power converter accommodates the power converter PT.
  • the power converter PT converts electric power (for example, direct current power) received from a power source (not shown), generates electric power (for example, alternating current power) for driving the load, and supplies the generated electric power to the load.
  • the converter PT is, for example, a servo amplifier for driving a servo motor.
  • the power converter PT includes a substrate 2a and a plurality of electronic components 2b-1 to 2b-9 as shown in FIG.
  • the board 2a is, for example, a printed board.
  • Each electronic component 2b-1 to 2b-9 is mounted on the substrate 2a.
  • the electronic components 2b-8 and 2b-9 are electronic components that generate a larger amount of heat than the other electronic components 2b-1 to 2b-7.
  • a power module for example, a power module.
  • the power converter PT Since the power converter PT includes an electronic component having a large calorific value such as the electronic components 2b-8 and 2b-9, the power converter PT has a plurality of heat radiation fins F1 to F5 for heat dissipation. HS is used. Further, a heat sink HS is used for the power converter PT as its structure because of the usage method peculiar to the power converter PT, such as being attached to a board (not shown).
  • the heat sink HS includes a main plate portion 4b and a plurality of heat radiation fins 4a-1 to 4a-5.
  • the main plate portion 4b is, for example, a plate-like member.
  • the main plate portion 4b has a fitting portion 4f at the first side end (the end on the front side in FIG. 3), and fits into the second side end (the end on the depth side in FIG. 3). It has a joint part 4g.
  • the back surface 4b2 (see FIG. 3) of the main plate portion 4b is a surface on which an electronic component (for example, the electronic components 2b-8 and 2b-9) having a large calorific value should be brought into thermal contact.
  • a plurality of heat radiation fins 4a-1 to 4a-4 are provided on the surface 4b1 (see FIG. 3) of the main plate portion 4b.
  • the plurality of radiating fins 4a-1 to 4a-5 are configured to radiate the heat transmitted from the main plate portion 4b into the ambient atmosphere.
  • the plurality of heat radiation fins 4a-1 to 4a-4 rise from the surface 4b1 (see FIG. 3) of the main plate portion 4b and extend along the longitudinal direction of the main plate portion 4b, for example.
  • the radiating fin 4a-5 is connected to the end of the main plate portion 4b and rises from the end of the front surface 4b1 and the end of the back surface 4b2 of the main plate portion 4b. It extends along the direction.
  • the radiating fin 4a-1 has fitting portions 4c and 4d at the end opposite to the main plate portion 4b.
  • the power converter PT and the heat sink HS are combined as shown in FIG. 4, for example. That is, in the power converter PT, the board 2a (for example, a printed board) on which the plurality of electronic components 2b-1 to 2b-9 are mounted is fixed by the heat sink HS. For example, screwing or the like is used for connection between the heat sink HS and the substrate 2a of the power converter PT.
  • the heat sink HS is attached so as to be in thermal contact with an electronic component (for example, the electronic components 2b-8 and 2b-9) having a large calorific value among the plurality of electronic components 2b-1 to 2b-9 on the surface of the substrate 2a. It is done.
  • the rigidity of the heat sink HS is larger than that of the power converter PT, if the power converter PT is fixed by the heat sink HS, when the power converter PT receives vibration from the peripheral device through the panel, The vibration of the power converter PT can be suppressed. That is, the heat sink HS has both a function of radiating heat from the power converter PT and a function of suppressing vibration of the power converter PT.
  • an insulating case for example, a resin case
  • the case is preliminarily molded integrally so as to be a box shape with one end opened.
  • the case is slid along the substrate 2a of the power converter PT, and the case Consider the case of mounting to accommodate. In this case, there is a possibility that the case may damage the substrate 2a at the time of sliding, and the assembling workability is poor.
  • the power converter PT and the heat sink HS combined with each other are covered with an insulating case so as to be enclosed in a box shape from six directions, for example.
  • the heat generated by the power converter PT and radiated through the heat sink HS tends to stay in the case, so the heat dissipation tends to deteriorate.
  • the case 1 of the power converter is covered with the power converter PT by bending the resin plate RP and the heat sink HS is opened with the plurality of radiating fins 4a-1 to 4a-2 open. Aiming to improve the workability of the assembly and improve the heat dissipation by configuring it to support.
  • the power converter case 1 covers the power converter PT from five directions and supports the heat sink HS from at least three directions by bending the resin plate RP shown in FIG. 2, as shown in FIG. To do. That is, the case 1 includes a bottom plate 1a, a back plate 1b, a top plate 1c, a first side plate 1d, and a second side plate 1e.
  • the bottom plate 1a extends in a flat plate shape along the substrate 2a of the power converter PT, and covers the power converter PT and the heat sink HS from below in FIG.
  • the bottom plate 1a has a shape and a size corresponding to the substrate 2a (see FIG. 3) of the power converter PT in plan view.
  • the bottom plate 1a corresponds to, for example, a portion 1a '(see FIG. 2) that is placed on the work table as the bottom side when the resin plate RP is bent in the resin plate RP.
  • the back plate 1b is bent from the bottom plate 1a so as to cover the power converter PT on the opposite side of the heat sink HS. That is, the back plate 1b extends in a flat plate shape from the opposite end of the heat sink HS in the bottom plate 1a in a direction intersecting the substrate 2a of the power converter PT, and covers the power converter PT from the left in FIG. ing.
  • the back plate 1b corresponds to a portion 1b '(see FIG. 2) that is bent from the bottom plate 1a of the resin plate RP so as to cover the power converter PT on the opposite side of the heat sink HS.
  • the back plate 1b has fitting portions 1b1 and 1b2 on both side ends.
  • the back plate 1b may have recesses 1b3 to 1b5 so that electronic components (for example, the electronic components 2b2 to 2b4) do not interfere when the power converter PT is attached.
  • the top plate 1c is bent from the back plate 1b so as to cover the power converter PT on the opposite side of the bottom plate 1a. That is, the top plate 1c extends in a flat plate shape from the end of the back plate 1b opposite to the bottom plate 1a along the substrate 2a of the power converter PT so that the power converter PT is not covered with the heat sink HS. 1 is covered from above.
  • the top plate 1c covers the power converter PT from above in FIG. 1, and the heat sink HS is in a state in which a plurality of radiating fins 4a-1 to 4a-2 are opened on the upper side in FIG. .
  • the top plate 1c corresponds to a portion 1c '(see FIG. 2) that is bent from the back plate 1b of the resin plate RP so as to cover the power converter PT on the opposite side of the bottom plate 1a.
  • the top plate 1c supports the end on the back plate 1b side of the heat sink HS from the opposite side of the bottom plate 1a.
  • the top plate 1c has fitting portions 1c1 and 1c2 at the end on the heat sink HS side, and fitting portions 1c3 to 1c6 at both ends.
  • the fitting portions 1c1 and 1c2 are respectively connected to the fitting portions 4c and 4d in the heat radiation fin 4a-1 on the back plate 1b side from the opposite side of the bottom plate 1a among the plurality of heat radiation fins 4a-1 to 4a-5 of the heat sink HS. It is inserted.
  • fitting portions 1c1 and 1c2 have a concave shape and the fitting portions 4c and 4d have a convex shape
  • the fitting portions 1c1 and 1c2 may have a convex shape.
  • the fitting portions 4c and 4d may be recessed.
  • the first side plate 1d is bent from the bottom plate 1a so as to cover the power converter PT with the first side (the front side in FIG. 1). That is, the first side plate 1d extends in a flat plate shape from the end of the bottom plate 1a opposite to the second side plate 1e in a direction intersecting the substrate 2a of the power converter PT so as not to cover the heat sink HS.
  • the power converter PT is covered from the front side in FIG.
  • the first side plate 1d covers the power converter PT from the front side of the paper in FIG. 1, and the heat sink HS has a plurality of radiating fins 4a-1 to 4a-2 opened on the front side of the paper in FIG. It is in the state.
  • the first side plate 1d corresponds to a portion 1d 'that is bent from the bottom plate 1a of the resin plate RP so as to cover the power converter PT with the first side.
  • the first side plate 1d has a high back portion 1d1 and a low back portion 1d2.
  • the high-back portion 1d1 extends in a flat plate shape from the end of the bottom plate 1a opposite to the second side plate 1e in a direction intersecting the substrate 2a of the power converter PT.
  • the high-back portion 1d1 has the fitting portions 1d11 and 1d12 in the region on the top plate 1c side, and the fitting portion 1d13 in the region on the back plate 1b side.
  • the fitting portions 1d11 and 1d12 are fitted into the fitting portions 1c3 and 1c4 of the top plate 1c from the opposite side of the second side plate 1e, respectively.
  • the fitting portion 1d13 is fitted into the fitting portion 1b1 of the back plate 1b from the opposite side of the second side plate 1e.
  • FIG. 1 illustrates the case where the fitting portions 1d11, 1d12, and 1d13 are concave and the fitting portions 1c3, 1c4, and 1b1 are convex, but the fitting portions 1d11, 1d12, and 1d13 are convex.
  • the fitting portions 1c3, 1c4, 1b1 may be concave.
  • the high back portion 1d1 and the low back portion 1d2 correspond to the high back portion 1d1 'and the low back portion 1d2' of the portion 1d 'of the resin plate RP, respectively.
  • the high-profile portion 1d1 has a substrate support portion 1d14 in a region corresponding to the substrate 2a of the power converter PT.
  • the substrate support portion 1d14 has, for example, a convex portion protruding in a fin shape from the flat portion of the high-back portion 1d1 toward the substrate 2a and a concave portion recessed in a slit shape, and the end portion of the substrate 2a is fitted into the concave portion.
  • the vicinity of the end of the substrate 2a is supported.
  • the vicinity of the end of the substrate 2a can be supported from, for example, three directions, so that when the power converter PT receives vibration from a peripheral device via a board (not shown), the power converter PT Can be suppressed.
  • the first side plate 1d supports the first side end of the heat sink HS from the opposite side of the second side plate 1e.
  • the low profile portion 1d2 extends in a flat plate shape from the end of the bottom plate 1a opposite to the second side plate 1e in a direction intersecting the substrate 2a of the power converter PT.
  • the low profile portion 1d2 has a fitting portion 1d21 at the end on the heat sink HS side.
  • the fitting portion 1d21 is fitted into the fitting portion 4f of the main plate portion 4b of the heat sink HS from the opposite side of the second side plate 1e.
  • fitting portion 1d21 has a concave shape and the fitting portion 4f has a convex shape
  • the fitting portion 1d21 may have a convex shape
  • the fitting portion 4f has a concave shape. It may be a shape.
  • the second side plate 1e is bent from the bottom plate 1a so as to cover the power converter PT with the second side (the depth side in FIG. 1). That is, the second side plate 1e extends in a flat plate shape from the end of the bottom plate 1a opposite to the first side plate 1d in a direction intersecting the substrate 2a of the power converter PT so as not to cover the heat sink HS.
  • the power converter PT is covered from the paper depth side in FIG.
  • the second side plate 1e covers the power converter PT from the paper depth side in FIG. 1, and the heat sink HS has a plurality of radiating fins 4a-1 to 4a-2 opened on the paper depth side in FIG. It is in the state.
  • the second side plate 1e corresponds to a portion 1e 'that is bent from the bottom plate 1a of the resin plate RP so as to cover the power converter PT with the second side.
  • the second side plate 1e has a high back portion 1e1 and a low back portion 1e2.
  • the high-back portion 1e1 extends in a flat plate shape from the end of the bottom plate 1a opposite to the first side plate 1d in a direction intersecting the substrate 2a of the power converter PT.
  • the high-back portion 1e1 has the fitting portions 1e11 and 1e12 in the region on the top plate 1c side, and the fitting portion 1e13 in the region on the back plate 1b side.
  • the fitting portions 1e11 and 1e12 are fitted into the fitting portions 1c5 and 1c6 of the top plate 1c from the opposite side of the first side plate 1d, respectively.
  • the fitting portion 1e13 is fitted into the fitting portion 1b2 of the back plate 1b from the opposite side of the first side plate 1d.
  • FIG. 1 illustrates the case where the fitting portions 1e11, 1e12, 1e13 are concave and the fitting portions 1c3, 1c4, 1b1 are convex, but the fitting portions 1e11, 1e12, 1e13 are convex.
  • the fitting portions 1c3, 1c4, 1b1 may be concave.
  • the high back portion 1e1 and the low back portion 1e2 correspond to the high back portion 1e1 'and the low back portion 1e2' of the portion 1e 'of the resin plate RP, respectively.
  • the second side plate 1e supports the second side end portion of the heat sink HS from the opposite side of the second side plate 1e.
  • the low profile portion 1e2 extends in a flat plate shape from the end of the bottom plate 1a opposite to the second side plate 1e in a direction intersecting the substrate 2a of the power converter PT.
  • the low profile part 1e2 has the fitting part 1e21 in the edge part by the side of the heat sink HS.
  • the fitting portion 1e21 is fitted into the fitting portion 4g of the main plate portion 4b of the heat sink HS from the opposite side of the first side plate 1d.
  • fitting portion 1e21 has a concave shape and the fitting portion 4g has a convex shape
  • the fitting portion 1e21 may have a convex shape and the fitting portion 4g has a concave shape. It may be a shape.
  • FIGS. 5 to 7 and FIG. 5 to 7 are diagrams showing a procedure for bending the resin plate RP.
  • FIG. 1 is a diagram illustrating the configuration of the case 1 of the power converter, but it is also used as a diagram illustrating a bending procedure of the resin plate RP.
  • a resin plate RP is prepared.
  • the resin plate RP is, for example, a planar shape, and is integrally molded in advance as a single resin plate RP.
  • the angle between the portion 1a ′ and the portion 1b ′ is substantially perpendicular with the boundary between the portion 1a ′ corresponding to the bottom plate 1a and the portion 1b ′ corresponding to the back plate 1b in the resin plate RP as an axis.
  • the resin plate RP is bent. Thereby, the baseplate 1a and the backplate 1b are formed.
  • the power converter PT and the heat sink HS after being combined with each other by screwing or the like are placed on the bottom plate 1a.
  • the substrate 2a of the power converter PT is placed on the bottom plate 1a, and the outermost radiating fin 4a-5 in the heat sink HS is positioned outside the bottom plate 1a.
  • the electronic components 2b-2 to 2b-4 projecting from or easily projecting from the end of the substrate 2a opposite to the heat sink HS are accommodated in the recesses 1b3 to 1b5 of the back plate 1b and do not interfere with the back plate 1b. (See FIG. 7).
  • the angle formed between the back plate 1b and the portion 1c ′ is substantially perpendicular with the boundary between the back plate 1b of the resin plate RP and the portion 1c ′ corresponding to the top plate 1c as an axis.
  • the resin plate RP is bent. Thereby, the top plate 1c is formed.
  • the fitting portions 1c1 and 1c2 are respectively connected to the fitting portions 4c and 4d of the heat dissipating fins 4a-1 on the back plate 1b side of the heat dissipating fins 4a-1 to 4a-5 of the heat sink HS. It is fitted from the opposite side (see FIGS. 2 and 3). Thereby, the heat sink HS can be fixed, and the power converter PT can be fixed via the heat sink HS.
  • the resin plate RP is bent so that the angle formed by the bottom plate 1a and the portion 1d ′ is substantially a right angle with the boundary between the bottom plate 1a and the portion 1d ′ corresponding to the first side plate 1d in the resin plate RP as an axis. . Thereby, the first side plate 1d is formed.
  • the substrate 2a is fitted into the substrate support portion 1d14.
  • substrate 2a is fixed and the vibration resistance of the power converter PT can be improved.
  • the fitting portions 1d11 and 1d12 are fitted into the fitting portions 1c3 and 1c4 in the top plate 1c from the opposite side of the second side plate 1e, respectively, and the fitting portion 1d13 is fitted in the fitting portion 1b1 in the back plate 1b. Is fitted from the opposite side of the second side plate 1e (see FIG. 2).
  • the top plate 1c, the back plate 1b, and the first side plate 1d can be fixed to each other.
  • the fitting portion 1d21 is fitted into the fitting portion 4f of the main plate portion 4b of the heat sink HS from the opposite side of the second side plate 1e (see FIGS. 2 and 3). Thereby, the heat sink HS can be further fixed.
  • the resin plate RP is bent so that the angle formed between the bottom plate 1a and the portion 1e ′ is substantially perpendicular with the boundary between the bottom plate 1a and the portion 1e ′ corresponding to the second side plate 1e in the resin plate RP as an axis. . Thereby, the second side plate 1e is formed.
  • the fitting portions 1e11 and 1e12 are fitted into the fitting portions 1c5 and 1c6 on the top plate 1c from the opposite side of the first side plate 1d, respectively, and the fitting portion 1e13 is fitted on the back plate 1b.
  • 1b2 is fitted from the opposite side of the first side plate 1d (see FIG. 2).
  • the top plate 1c, the back plate 1b, and the second side plate 1e can be fixed to each other.
  • the fitting portion 1e21 is fitted into the fitting portion 4g of the main plate portion 4b of the heat sink HS from the opposite side of the first side plate 1d (see FIGS. 2 and 3). Thereby, the heat sink HS can be further fixed.
  • the case 1 of the power converter shown in FIG. 1 is completed by fitting the corresponding fitting portions while bending the resin plate RP or fitting the substrate 2a to the substrate support portion 1d14.
  • the power converter case 1 is the heat sink HS that covers the power converter PT by bending the resin plate RP and radiates heat from the power converter PT.
  • the heat sink HS having 4a-1 to 4a-5 is configured to be supported in a state where the plurality of radiating fins 4a-1 to 4a-5 are opened. That is, since the case 1 of the power converter is formed by bending the resin plate RP, there is no need to slide the board during assembly, and the electronic components 2b-1 to 2b- in the power converter PT are not required.
  • the power converter PT can be accommodated in the case 1 without damaging 9. Further, since the resin plate RP can be an integral member, it is not easily affected by looseness caused by tolerance.
  • the power converter case 1 covers the power converter PT and supports the heat sink HS with the plurality of heat radiation fins 4a-1 to 4a-5 opened, the power converter PT It is easy to release the heat generated and radiated through the heat sink HS to the outside of the case 1, and the heat dissipation can be improved. That is, the assembly workability can be improved and the heat dissipation can be improved.
  • the case 1 of the power converter is configured to be formed by bending the resin plate RP. Therefore, the management, storage, and transportation of the case 1 are easy, and manufacturing, storage, and transportation are performed. Cost can be easily reduced.
  • the power converter case 1 covers the power converter PT from five directions by bending the resin plate RP, and supports the heat sink HS from at least three directions. As a result, the power converter PT can be covered, and the heat sink HS can be supported in a state where the plurality of radiating fins 4a-1 to 4a-5 are opened.
  • the back plate 1b is bent from the bottom plate 1a so as to cover the power converter PT on the opposite side of the heat sink HS.
  • the top plate 1c is bent from the back plate 1b so as to cover the power converter PT on the opposite side of the bottom plate 1a, and supports the end of the heat sink HS on the back plate 1b side.
  • the first side plate 1d is bent from the bottom plate 1a so as to cover the power converter PT on the first side, and supports the first side end portion of the heat sink HS.
  • the second side plate 1e is bent so as to cover the power converter PT from the bottom plate 1a with the second side opposite to the first side, and is opposite to the first side end of the heat sink HS. 2nd side edge part is supported.
  • the case 1 of the power converter can cover the power converter PT from five directions by bending the resin plate RP, and can support the heat sink HS from at least three directions.
  • the heat sink HS is attached so as to be in thermal contact with the heat generating components 2b-8 and 2b-9 among the plurality of electronic components 2b-1 to 2b-9 on the surface of the substrate 2a. ing. Thereby, the heat sink HS can efficiently dissipate the heat generated from the components 2b-8 and 2b-9.
  • the top plate 1c, the first side plate 1d, and the second side plate 1e fix the substrate 2a via the heat sink HS.
  • the rigidity of the heat sink HS is larger than that of the power converter PT, if the power converter PT is fixed by the heat sink HS, when the power converter PT receives vibration from the peripheral device through the panel, The vibration of the power converter PT can be suppressed. That is, the vibration resistance of the power converter PT can be improved.
  • the first side plate 1d and the second side plate 1e are such that the substrate 2a is placed on the bottom plate 1a and the end of the heat sink HS on the back plate 1b side is supported by the top plate 1c. It is configured to be bent from the bottom plate 1a and to support the first side end portion and the second side end portion of the heat sink HS, respectively.
  • the power converter case 1 can be formed by bending the resin plate RP while gradually fixing the substrate 2a through the heat sink HS.
  • the end portion of the substrate 2a in the power converter PT is fitted into the substrate support portion 1d14 in the first side plate 1d by bending the resin plate RP.
  • the case 1 of the power converter is an integral resin case formed by bending from one resin plate RP.
  • the power converter case 1 is formed by bending a single resin plate RP, the power conversion is performed without damaging the electronic components 2b-1 to 2b-9 in the power converter PT.
  • the container PT can be accommodated in the case 1 and is not easily affected by play due to tolerance.
  • the resin plate RP is an integral member, management, storage, and transportation are easy.
  • the resin plate RP is a planar resin plate.
  • die for integrally molding a planar type resin board previously can be made low, and the manufacturing cost by the reduction of a mold cost and a molding equipment scale reduction can be reduced.
  • the planar resin plate is integrally molded in advance, the resin can easily flow into the mold, the shaping cycle can be shortened, and the manufacturing cost can be reduced.
  • the resin plate RP is a planar resin plate, that is, a planar member, storage and transportation space can be reduced.
  • FIG. A case 1i of a power converter according to the second embodiment will be described with reference to FIGS. Below, it demonstrates focusing on a different part from Embodiment 1.
  • FIG. FIG. 8 is a diagram illustrating the configuration of the resin plate RP and the support portion 5 to be a case of the power converter and the bending procedure of the resin plate RP.
  • FIG. 9 is a diagram illustrating a bending procedure of the resin plate RP.
  • FIG. 10 is a diagram illustrating the configuration of the case 1i of the power converter and the bending procedure of the resin plate RP.
  • FIG. 11 is a diagram showing the configuration of the power converter case 1i and the bending procedure of the resin plate RP, and the configuration when the power converter case is viewed from the first side (the front side in FIG. 10). Is shown.
  • the heat sink HS is omitted for simplification of illustration.
  • illustration of electronic components other than the high-profile components is omitted for simplification of illustration.
  • the power converter case 1i may be used such as being attached to a panel (not shown), and the power converter PT may be subject to vibration. Therefore, it is necessary to enhance the vibration resistance of the power converter PT.
  • the electronic components constituting the servo amplifier include tall components (for example, the electronic components 2b-1, 2b-2 shown in FIG. 2) that increase in height from the board. )
  • the high-profile parts (for example, the electronic parts 2b-1 and 2b-2) are supported only by contact with the substrate 2a, and are considered to be weak against vibration and need countermeasures.
  • the case 1i is used to support the high-profile parts (for example, the electronic parts 2b-1 and 2b-2).
  • the protruding members 5a to 5c are provided in advance in a position where the high-profile parts can be supported in the case 1i of the power converter, and when the board 2a is fitted into the case 1i, the protruding members 5a to 5c are high.
  • the case is preliminarily molded integrally so as to be a box shape with one end opened, and the case is slid along the substrate 2a of the power converter PT so that the case accommodates the power converter PT.
  • the case accommodates the power converter PT.
  • the power converter PT electronic components of various sizes are arranged at various positions on the substrate 2a, and when a protruding member is provided on the case itself, an electronic component other than the high-profile component is provided. It becomes difficult to fit the board into the case due to the contact between the component and the protruding member.
  • the support portion 5 is positioned so as to support the high-profile components (for example, the electronic components 2b-1 and 2b-2) by bending the resin plate RP.
  • the support portion 5 includes protruding members 5a to 5c rising from the resin plate RP.
  • the protruding members 5a to 5c rise from positions that do not interfere with the plurality of components 2b-1 to 2b-9 on the substrate 2a when the resin plate RP on the resin plate RP is bent (FIG. 8 to FIG. 8). FIG. 11).
  • the protruding members 5b and 5c are formed of a plurality of components 2b-1 to 2b-9 on the substrate 2a when the resin plate RP in the high back portion 1e1 ′ of the portion 1e ′ corresponding to the second side plate 1e is bent. Standing up from a position where it does not interfere with. For example, the protruding member 5a rises from a position where it does not interfere with the plurality of components 2b-1 to 2b-9 on the substrate 2a when the resin plate RP in the portion 1c 'corresponding to the top plate 1c is bent.
  • the procedure for bending the resin plate RP is different from that of the first embodiment in the following points.
  • the resin plate RP and the support portion 5 are prepared.
  • the resin plate RP has, for example, a planar shape, and the support portion 5 includes protruding members 5a to 5c rising from the resin plate RP.
  • the resin plate RP and the protruding members 5a to 5c are, for example, integrally molded in advance.
  • the angle between the portion 1a ′ and the portion 1b ′ is substantially perpendicular with the boundary between the portion 1a ′ corresponding to the bottom plate 1a and the portion 1b ′ corresponding to the back plate 1b in the resin plate RP as an axis.
  • the resin plate RP is bent. Thereby, the baseplate 1a and the backplate 1b are formed.
  • the power converter PT and the heat sink HS after being combined with each other by screwing or the like are placed on the bottom plate 1a.
  • the protruding members 5a to 5c are positioned so as not to interfere with the plurality of components 2b-1 to 2b-9 on the substrate 2a.
  • the angle formed between the bottom plate 1a and the portion 1e ' is an obtuse angle slightly larger than a right angle with the boundary between the bottom plate 1a and the portion 1e' corresponding to the second side plate 1e in the resin plate RP as an axis.
  • the resin plate RP is bent so as to be. Accordingly, the protruding members 5b and 5c are positioned so as to support the high-profile parts 2b-2 and 2b-1, respectively (see FIG. 11).
  • the obtuse angle slightly larger than the right angle is an angle determined so that the fitting portions 1c5 and 1c6 (see FIG. 2) do not interfere with the second side plate 1e and the protruding members 5b and 5c do not interfere with the top plate 1c. It is.
  • the boundary between the bottom plate 1a and the portion 1e ′ corresponding to the second side plate 1e in the resin plate RP is used as an axis. Then, the resin plate RP is bent so that the angle formed between the bottom plate 1a and the portion 1e 'is substantially a right angle. Thus, the second side plate 1e is formed, and the protruding members 5b and 5c are positioned so as to support the high-profile parts 2b-2 and 2b-1, respectively (see FIG. 11).
  • the resin plate RP is bent so that the angle formed between the bottom plate 1a and the portion 1d ′ is substantially perpendicular with the boundary between the bottom plate 1a and the portion 1d ′ corresponding to the first side plate 1d in the resin plate RP as an axis. . Thereby, the first side plate 1d is formed.
  • the angle formed between the back plate 1b and the portion 1c ′ is substantially perpendicular with the boundary between the back plate 1b of the resin plate RP and the portion 1c ′ corresponding to the top plate 1c as an axis.
  • the resin plate RP is bent.
  • the top plate 1c is formed, and the protruding member 5a is positioned so as to support the high-profile component 2b-1.
  • the resin plate RP is bent so that the angle formed by the bottom plate 1a and the portion 1e ′ is substantially perpendicular with the boundary between the bottom plate 1a and the portion 1e ′ corresponding to the second side plate 1e in the resin plate RP as an axis. .
  • the second side plate 1e is formed.
  • the fitting portions 1e11 and 1e12 are fitted into the fitting portions 1c5 and 1c6 of the top plate 1c from the opposite side of the first side plate 1d, respectively.
  • the support portion 5 in the case 1i of the power converter is positioned so as to support the high-profile parts 2b-2 and 2b-1 by bending the resin plate RP.
  • the power converter case 1i is formed by bending the resin plate RP, there is no need to slide the substrate during assembly, and the case is supported when the power converter PT is accommodated in the case 1i. It is possible to prevent the part 5 (for example, the protruding members 5a to 5c) from interfering with the plurality of electronic components 2b-1 to 2b-9 on the substrate 2a.
  • the high-profile parts 2b-2 and 2b-1 are supported by the support portion 5, the vibration resistance of the high-profile parts 2b-2 and 2b-1 can be improved.
  • the support portion 5 in the case 1i of the power converter includes protruding members 5a to 5c rising from the resin plate RP.
  • the protruding members 5a to 5c can be positioned so as to support the high-profile parts 2b-2 and 2b-1 by bending the resin plate RP.
  • the projecting members 5a to 5c stand up from positions where they do not interfere with the plurality of electronic components 2b-1 to 2b-9 when the resin plate RP on the resin plate RP is bent. Accordingly, when the power converter PT is accommodated in the case 1i, the protruding members 5a to 5c can be prevented from interfering with the plurality of electronic components 2b-1 to 2b-9 on the substrate 2a.
  • the resin plate RP and the protruding members 5a to 5c are integrally molded in advance. Accordingly, since the resin plate RP and the protruding members 5a to 5c are integrated members, management, storage, and transportation are easy.
  • FIG. 12 is a diagram illustrating a configuration of the resin plate RP and the cooling flow path forming unit 6 to be the case 1j of the power converter, and a bending procedure of the resin plate RP.
  • FIG. 13 is a diagram illustrating a bending procedure of the resin plate RP.
  • FIG. 14 is a diagram illustrating the configuration of the case of the power converter and the procedure for bending the resin plate.
  • FIG. 15 is a diagram showing the flow of wind in the case of the power converter, and shows a case where the case 1j of the power converter is viewed from the upper side of FIG.
  • the heat sink HS is brought into thermal contact with the electronic components 2b-8 and 2b-9 that generate a large amount of heat among the plurality of electronic components 2b-1 to 2b-9 in the power converter PT, thereby radiating a plurality of heatsinks. Heat is radiated from the fins 4a-1 to 4a-5.
  • the cooling flow path forming portion 6 is positioned so as to form a cooling air flow path to the electronic component 2b-1 that generates heat among the plurality of electronic components 2b-1 to 2b-9 by bending the resin plate RP. .
  • the cooling flow path forming portion 6 includes projecting members 6a to 6c rising from the resin plate RP.
  • the protruding members 6a to 6c rise from positions that do not interfere with the plurality of components 2b-1 to 2b-9 on the substrate 2a when the resin plate RP is bent on the resin plate RP (FIG. 12 to FIG. 12). (See FIG. 15).
  • the protruding members 6b and 6c are formed of a plurality of components 2b-1 to 2b-9 on the board 2a when the resin plate RP in the high back portion 1e1 ′ of the portion 1e ′ corresponding to the second side plate 1e is bent. Standing up from a position where it does not interfere with. For example, the protruding member 6a rises from a position where it does not interfere with the plurality of components 2b-1 to 2b-9 on the substrate 2a when the resin plate RP in the portion 1c 'corresponding to the top plate 1c is bent.
  • the second side plate 1 e has a structure corresponding to the cooling air flow path formed by the cooling flow path forming portion 6.
  • the second side plate 1e has an opening 1e14 in a region between the protruding member 6b and the protruding member 6c.
  • the heat sink HSj has a structure corresponding to the cooling air flow path formed by the cooling flow path forming unit 6.
  • the heat sink HSj has, for example, a notch 4h formed in a portion corresponding to an electronic component (for example, the electronic component 2b-1) to be radiated in the heat radiating fins 4a-1j on the most back plate 1b side.
  • a wall portion 4i is provided between the radiation fins 4a-1j and the radiation fins 4a-2 on the downstream side of the portion 4h.
  • the procedure for bending the resin plate RP is different from that of the first embodiment in the following points.
  • the resin plate RP and the cooling flow path forming unit 6 are prepared.
  • the resin plate RP has, for example, a planar shape, and the cooling flow path forming unit 6 includes projecting members 6a to 6c rising from the resin plate RP.
  • the resin plate RP and the protruding members 6a to 6c are, for example, integrally molded in advance.
  • the angle between the portion 1a ′ and the portion 1b ′ is substantially perpendicular with the boundary between the portion 1a ′ corresponding to the bottom plate 1a and the portion 1b ′ corresponding to the back plate 1b in the resin plate RP as an axis.
  • the resin plate RP is bent. Thereby, the baseplate 1a and the backplate 1b are formed.
  • the power converter PT and the heat sink HSj after being combined with each other by screwing or the like are placed on the bottom plate 1a.
  • the protruding members 6a to 6c are positioned so as not to interfere with the plurality of components 2b-1 to 2b-9 on the substrate 2a.
  • the angle formed between the bottom plate 1a and the portion 1e ′ is an obtuse angle slightly larger than a right angle with the boundary between the bottom plate 1a and the portion 1e ′ corresponding to the second side plate 1e in the resin plate RP as an axis.
  • the resin plate RP is bent so as to be. Accordingly, the protruding members 6b and 6c are positioned in the vicinity of the position corresponding to the flow path to be formed (see FIG. 15).
  • the obtuse angle slightly larger than the right angle is an angle determined so that the fitting portions 1c5 and 1c6 (see FIG. 2) do not interfere with the second side plate 1e and the protruding members 6b and 6c do not interfere with the top plate 1c. It is.
  • the boundary between the bottom plate 1a and the portion 1e ′ corresponding to the second side plate 1e in the resin plate RP is used as an axis. Then, the resin plate RP is bent so that the angle formed between the bottom plate 1a and the portion 1e 'is substantially a right angle. Thereby, the second side plate 1e is formed, and the protruding members 6b and 6c are located at positions corresponding to the flow paths to be formed (see FIG. 15).
  • the resin plate RP is formed such that the angle formed between the bottom plate 1a and the portion 1d ′ is an obtuse angle slightly larger than a right angle with the boundary between the bottom plate 1a and the portion 1d ′ corresponding to the first side plate 1d as the axis. Bend RP.
  • the protruding member 6a is positioned in the vicinity of the position corresponding to the flow path to be formed (see FIG. 15).
  • the obtuse angle slightly larger than the right angle is an angle determined so that the fitting portions 1c3 and 1c4 (see FIG. 2) do not interfere with the first side plate 1d and the protruding member 6a does not interfere with the top plate 1c. .
  • the boundary between the bottom plate 1a and the portion 1d ′ corresponding to the first side plate 1d in the resin plate RP is used as an axis. Then, the resin plate RP is bent so that the angle formed between the bottom plate 1a and the portion 1d ′ is substantially a right angle. Thus, the first side plate 1d is formed, and the protruding member 6a is positioned at a position corresponding to the flow path to be formed (see FIG. 15).
  • the angle formed between the back plate 1b and the portion 1c ′ is substantially perpendicular with the boundary between the back plate 1b of the resin plate RP and the portion 1c ′ corresponding to the top plate 1c as an axis.
  • the resin plate RP is bent. Thereby, the top plate 1c is formed.
  • the resin plate RP is bent so that the angle formed by the bottom plate 1a and the portion 1e ′ is substantially perpendicular with the boundary between the bottom plate 1a and the portion 1e ′ corresponding to the second side plate 1e in the resin plate RP as an axis. .
  • the second side plate 1e is formed.
  • the fitting portions 1e11 and 1e12 are fitted into the fitting portions 1c5 and 1c6 of the top plate 1c from the opposite side of the first side plate 1d, respectively.
  • the resin plate RP is bent so that the angle formed between the bottom plate 1a and the portion 1d ′ is substantially perpendicular with the boundary between the bottom plate 1a and the portion 1d ′ corresponding to the first side plate 1d in the resin plate RP as an axis. . Thereby, the first side plate 1d is formed. At this time, the fitting portions 1d11 and 1d12 are fitted into the fitting portions 1c3 and 1c4 of the top plate 1c from the opposite side of the second side plate 1e, respectively.
  • the fan 7 is attached to the first side (the front side in FIG. 14) of the heat sink HSj.
  • the cooling flow path forming portion 6 forms a cooling air flow path to the electronic component 2b-1 to be radiated in the space SP, the cooling air toward the notch 4h is efficiently After being exposed to the electronic component 2b-1 to be radiated, it is discharged to the outside through the opening 1e14 of the second side plate 1e.
  • the cooling flow path forming portion 6 in the case 1j of the power converter causes the electronic component 2b that generates heat among the plurality of electronic components 2b-1 to 2b-9 by bending the resin plate RP. Positioned to form a cooling air flow path to -1. That is, since the case 1j of the power converter is formed by bending the resin plate RP, there is no need to slide the substrate during assembly, and cooling is performed when the power converter PT is accommodated in the case 1j.
  • the flow path forming portion 6 (for example, the protruding members 6a to 6c) can be prevented from interfering with the plurality of electronic components 2b-1 to 2b-9 on the substrate 2a.
  • the cooling flow path forming portion 6 forms a cooling air flow path to an electronic component (for example, the electronic component 2b-1) that has a relatively large calorific value and is desired to radiate heat. It is possible to collect cooling air and improve heat dissipation efficiency.
  • the cooling flow path forming portion 6 in the case 1j of the power converter includes protruding members 6a to 6c rising from the resin plate RP.
  • the protruding members 6a to 6c can be positioned so as to form a cooling air flow path to the electronic component 2b-1 that generates heat by bending the resin plate RP.
  • the protruding members 6a to 6c stand up from positions where they do not interfere with the plurality of electronic components 2b-1 to 2b-9 when the resin plate RP on the resin plate RP is bent. Accordingly, when the power converter PT is accommodated in the case 1j, the protruding members 6a to 6c can be prevented from interfering with the plurality of electronic components 2b-1 to 2b-9 on the substrate 2a.
  • the resin plate RP and the protruding members 6a to 6c are integrally molded in advance. Therefore, since the resin plate RP and the protruding members 6a to 6c are integrated members, management, storage and transportation are easy.
  • the case of the power converter according to the present invention is useful for housing the power converter.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Dc-Dc Converters (AREA)

Abstract

L'invention concerne un boîtier de convertisseur d'énergie qui loge un convertisseur d'énergie, et qui est configuré de telle sorte que : un panneau de résine est courbé de façon à recouvrir le convertisseur d'énergie ; et un dissipateur thermique, qui dissipe une chaleur provenant du convertisseur thermique, et qui comprend une pluralité d'ailettes de dissipation thermique, est supporté de telle sorte que la pluralité d'ailettes de dissipation thermique de celui-ci sont dans un état ouvert.
PCT/JP2012/079949 2012-11-19 2012-11-19 Boîtier de convertisseur d'énergie WO2014076840A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2014546827A JP6000370B2 (ja) 2012-11-19 2012-11-19 電力変換器のケース
CN201290001142.4U CN204168108U (zh) 2012-11-19 2012-11-19 电力转换器的盒体
PCT/JP2012/079949 WO2014076840A1 (fr) 2012-11-19 2012-11-19 Boîtier de convertisseur d'énergie

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2012/079949 WO2014076840A1 (fr) 2012-11-19 2012-11-19 Boîtier de convertisseur d'énergie

Publications (1)

Publication Number Publication Date
WO2014076840A1 true WO2014076840A1 (fr) 2014-05-22

Family

ID=50730780

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2012/079949 WO2014076840A1 (fr) 2012-11-19 2012-11-19 Boîtier de convertisseur d'énergie

Country Status (3)

Country Link
JP (1) JP6000370B2 (fr)
CN (1) CN204168108U (fr)
WO (1) WO2014076840A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016072468A (ja) * 2014-09-30 2016-05-09 山洋電気株式会社 モータ制御ユニット
CN113179003A (zh) * 2021-01-19 2021-07-27 合肥工业大学 一种双主动全桥dc-dc变换器安全防护组件

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6243416U (fr) * 1985-09-04 1987-03-16
JPH06275963A (ja) * 1993-03-19 1994-09-30 Hitachi Ltd 電子機器用筐体
JP2004180424A (ja) * 2002-11-27 2004-06-24 Fuji Electric Fa Components & Systems Co Ltd 半導体電力変換装置のスタック構造
JP2007006635A (ja) * 2005-06-24 2007-01-11 Tdk Corp 電源装置
WO2008029638A1 (fr) * 2006-09-07 2008-03-13 Kabushiki Kaisha Yaskawa Denki Dispositif de commande de moteur
JP2008061474A (ja) * 2006-09-04 2008-03-13 Nissan Motor Co Ltd 電力変換装置
JP2009231720A (ja) * 2008-03-25 2009-10-08 Oriental Motor Co Ltd 電子機器の冷却構造

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6243416U (fr) * 1985-09-04 1987-03-16
JPH06275963A (ja) * 1993-03-19 1994-09-30 Hitachi Ltd 電子機器用筐体
JP2004180424A (ja) * 2002-11-27 2004-06-24 Fuji Electric Fa Components & Systems Co Ltd 半導体電力変換装置のスタック構造
JP2007006635A (ja) * 2005-06-24 2007-01-11 Tdk Corp 電源装置
JP2008061474A (ja) * 2006-09-04 2008-03-13 Nissan Motor Co Ltd 電力変換装置
WO2008029638A1 (fr) * 2006-09-07 2008-03-13 Kabushiki Kaisha Yaskawa Denki Dispositif de commande de moteur
JP2009231720A (ja) * 2008-03-25 2009-10-08 Oriental Motor Co Ltd 電子機器の冷却構造

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016072468A (ja) * 2014-09-30 2016-05-09 山洋電気株式会社 モータ制御ユニット
CN113179003A (zh) * 2021-01-19 2021-07-27 合肥工业大学 一种双主动全桥dc-dc变换器安全防护组件

Also Published As

Publication number Publication date
CN204168108U (zh) 2015-02-18
JPWO2014076840A1 (ja) 2017-01-05
JP6000370B2 (ja) 2016-09-28

Similar Documents

Publication Publication Date Title
JP6521171B2 (ja) 回路構成体
JP5335839B2 (ja) 電力変換モジュールの放熱装置
JPWO2005091692A1 (ja) モジュールの放熱構造及びこれを用いた制御装置
JP2009043863A (ja) 半導体装置
WO2014034564A1 (fr) Unité d'extérieur pour un dispositif de conditionnement d'air
JP5811986B2 (ja) 電気接続箱
JP6644354B1 (ja) 電子機器及び電子機器の製造方法
JP2010027733A (ja) リアクトルの冷却構造
JP6000370B2 (ja) 電力変換器のケース
JPH07249885A (ja) 冷却構造
JP2005142379A (ja) 電子機器装置
JP2014239105A (ja) 電源回路基板及びシャーシとの取付構造
JP4792482B2 (ja) モータ制御機器の放熱器と組付け部品との固定構造
JP6017823B2 (ja) ドライバ一体型モータ
CN201248224Y (zh) 散热装置
JP6892756B2 (ja) 放熱構造体
JP6705978B2 (ja) 電子機器及び電子機器の製造方法
TW200917944A (en) Electronic apparatus and method of fixing cooling fan
JP2010283222A (ja) 自動車
JP5873702B2 (ja) 電子部品ユニット
WO2024058186A1 (fr) Boîtier de jonction électrique
JP6282966B2 (ja) モータ制御ユニット
JP2016063632A (ja) 電気接続箱
JP5448072B2 (ja) 電装品取付構造
WO2017126086A1 (fr) Dispositif de conversion de puissance

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 201290001142.4

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 12888221

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2014546827

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 12888221

Country of ref document: EP

Kind code of ref document: A1