WO2014057908A1 - 駆動チップ及び表示装置 - Google Patents

駆動チップ及び表示装置 Download PDF

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Publication number
WO2014057908A1
WO2014057908A1 PCT/JP2013/077238 JP2013077238W WO2014057908A1 WO 2014057908 A1 WO2014057908 A1 WO 2014057908A1 JP 2013077238 W JP2013077238 W JP 2013077238W WO 2014057908 A1 WO2014057908 A1 WO 2014057908A1
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Prior art keywords
driving chip
liquid crystal
terminal group
terminal
chip according
Prior art date
Application number
PCT/JP2013/077238
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English (en)
French (fr)
Inventor
松井　隆司
武志 堀口
塩田　素二
Original Assignee
シャープ株式会社
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Publication date
Application filed by シャープ株式会社 filed Critical シャープ株式会社
Priority to CN201380052057.XA priority Critical patent/CN104704621B/zh
Priority to US14/433,711 priority patent/US9318454B2/en
Publication of WO2014057908A1 publication Critical patent/WO2014057908A1/ja

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/38—Effects and problems related to the device integration
    • H01L2924/381—Pitch distance

Definitions

  • the present invention relates to a driving chip and a display device including the driving chip.
  • liquid crystal display devices have been used as small and medium display devices such as portable information terminals.
  • the liquid crystal display device is equipped with a drive chip for driving the liquid crystal panel, and a COG (chip on glass) system in which the drive chip is directly mounted on the liquid crystal panel is used to cope with the thinning of the liquid crystal display device. It has been.
  • COG chip on glass
  • an ACF anisotropic conductive film
  • the driving chip and the liquid crystal panel are electrically connected by pressure bonding at a high temperature.
  • Patent Document 1 includes a base body including one surface having a first end and a second end parallel to the long side, and a third end and a fourth end parallel to the short side perpendicular to the long side, A plurality of input terminals formed at the first end along the long side of the base body, a plurality of first output terminals arranged along the long side at the second end, and the input terminal and the first output terminal; There is disclosed a drive chip including a dummy terminal formed between the two, and the dummy terminal formed in one or more rows along the long side.
  • Patent Document 1 since the dummy terminals are arranged in one or more rows in the long side direction of the driving chip, it is difficult to secure the circuit area because it is necessary to increase the size of the driving chip if the circuit area is to be secured.
  • An object of the present invention is to provide a drive chip that prevents a connection failure by suppressing warpage while securing a circuit area. It is another object of the present invention to provide a display device on which the driving chip is mounted.
  • the present invention is arranged in a staggered manner in a base body, two sets of terminal groups respectively disposed along opposite sides of the base body in the longitudinal direction, and two or more rows.
  • a narrow pitch portion having a narrow terminal pitch in the longitudinal direction
  • a rough pitch portion having a pitch in the longitudinal direction wider than the narrow pitch portion
  • a driving chip including bumps arranged in parallel in the rough pitch portion is provided.
  • the present invention by providing dummy bumps on the driving chip, the bending of the driving chip due to heat during crimping in the COG process is suppressed. As a result, the driving chip and the liquid crystal panel are maintained in parallel, and poor electrical connection between the driving chip and the liquid crystal panel is prevented. Further, by arranging the dummy bumps in parallel in the rough pitch portion where the circuit is not crowded, a sufficient circuit area can be secured without increasing the size of the driving chip.
  • FIG. 1 is an exploded perspective view showing a liquid crystal display device according to an embodiment of the present invention.
  • the liquid crystal display device 10 is drawn in a state where it is placed horizontally so that the display surface faces upward.
  • the liquid crystal display device 10 can be used as a television or computer display.
  • the liquid crystal display device 10 includes a backlight chassis 11, a light source unit 12, a light guide plate 13, an optical sheet 14, a panel frame 15, a liquid crystal panel 16 on which a driving chip 20 is mounted, and a bezel 17.
  • An assembly of the backlight chassis 11, the light source units 12 and 12, the light guide plate 13, and the optical sheet 14 is referred to as a backlight device 18.
  • the backlight chassis 11 is a box-shaped member that is a base for mounting (accommodating) each member of the backlight device 18 such as the light source unit 12, the light guide plate 13, and the optical sheet 14. It is desirable to use SECC (steel plate), Al, or the like as the material of the backlight chassis 11 in order to ensure rigidity and heat dissipation.
  • SECC steel plate
  • Al aluminum
  • the light source unit 12 includes an LED (Light Emitting Diode) which is a point light source and an LED substrate on which the LED is mounted.
  • LED Light Emitting Diode
  • a plurality of LEDs are arranged along the one side of the light guide plate 13 at a predetermined interval on the LED substrate.
  • the arrangement of the light source unit 12 employs an edge light system.
  • a metal substrate such as Al is often used as an LED substrate in consideration of heat dissipation and strength.
  • the two light source units 12 and 12 are provided along the opposite side surfaces of the light guide plate 13, but the light source unit 12 may be provided only along one side surface of the light guide plate 13.
  • the configuration may also be provided along the other side surface of the light guide plate 13. That is, the light source unit 12 may be provided along at least one of the side surfaces of the light guide plate 13.
  • the side faces the LED and serves as a light incident portion (light incident surface) that guides light from the LED into the light guide plate 13.
  • the light guide plate 13 has a pair of main surfaces (upper surface and lower surface) and a plurality of side surfaces (four surfaces in FIG. 1) formed therebetween.
  • the light guide plate 13 is a member that converts the LED light incident from its end face (side face) into a surface light source and derives it from the top face, and its material is acrylic, PC (polycarbonate), etc. from the viewpoint of thickness reduction and weight reduction. It is desirable to use this resin.
  • the optical sheet 14 is a general term for a diffusion sheet, a lens sheet, a brightness enhancement sheet, and the like, and is a combination of any one or a plurality of these sheets. Since the optical sheet 14 is stacked on the light guide plate 13 to irradiate the liquid crystal panel 16 with uniform light, if the sheet has wrinkles or bends, the display quality deteriorates.
  • the panel frame 15 is a frame-like member that holds the liquid crystal panel 16 so that the liquid crystal panel 16 and the optical sheet 14 do not contact each other, and it is desirable to use a resin such as PC as the material.
  • the panel frame 15 also has a role of suppressing warping and bending of the optical sheet 14.
  • the liquid crystal panel 16 is a member in which a liquid crystal element is injected between two transparent substrates.
  • the liquid crystal element is driven under the control of the drive chip 20 and is displayed by being illuminated by the backlight device 18.
  • the drive chip 20 includes a base body, a plurality of input terminals, and a plurality of output terminals, and is mounted on the liquid crystal panel 16 by the COG method. Then, the drive chip 20 converts image data input from the outside into a drive signal suitable for driving the liquid crystal panel 16 and applies it to the liquid crystal panel at an optimal timing.
  • the bezel 17 is a member that holds and holds the liquid crystal panel 16 in a frame shape, and covers the box-shaped backlight chassis 11 so as to cover it.
  • the material may be PC, ABS resin, CFRP (carbon fiber reinforced plastics), etc. for weight reduction. For further weight reduction, these materials may be used to integrally form a casing (not shown) as an exterior and the bezel 17.
  • FIG. 2 is a plan view of the drive chip according to the first embodiment of the present invention.
  • the drive chip 201 of the first embodiment which is an embodiment of the drive chip 20 described above, includes a base body 202, an input terminal group 203, an output terminal group 204, and dummy bumps 205.
  • the base main body 202 is an insulating material having a rectangular surface on which the terminal group is disposed, and has a thickness of 0.2 mm or less and a short-side length of 1.5 mm or more, for example. Inside the base body 202, a semiconductor element (not shown) for converting an image signal input from the outside into a drive signal necessary for driving is provided.
  • the input terminal group 203 and the output terminal group 204 are two sets of terminal groups respectively disposed along opposite sides of the base body 202 in the longitudinal direction.
  • the input terminal group 203 is formed by arranging rectangular terminals 203a in a straight line at equal intervals in one row.
  • the input terminal group 203 may be in two or more rows.
  • the output terminal group 204 is formed by arranging two rectangular terminals 204a smaller than the input terminals in a staggered manner in two rows. In the vicinity of the center of the output terminal group 204 in the longitudinal direction, the pitch in the longitudinal direction in which the terminals 204a are arranged to ensure a circuit area is wider than the surroundings (narrow pitch portions 204b and 204c, which will be described later). This will be referred to as a section 204c. On the other hand, since it is not necessary to secure a circuit area on both sides of the rough pitch portion 204c, the terminals 204a are densely arranged at a pitch narrower than the rough pitch portion 204c, and these portions are referred to as narrow pitch portions 204b and 204d.
  • the output terminal group 204 may have three or more rows.
  • the input terminal group 203 and the output terminal group 204 may be interchanged so that the input terminal group 203 is staggered and the output terminal group is linear. Further, both the terminal groups 203 and 204 may be in a staggered pattern or in a straight line with two or more rows.
  • the dummy bump 205 is a dummy bump that is not electrically connected.
  • the dummy bump 205 is disposed substantially at the center of the base body 202. That is, the dummy bumps 205 are arranged between the input terminal group 203 and the output terminal group 204 and in parallel with the rough pitch portion 204c.
  • the height (thickness) of the dummy bump 205 is equal to the height (thickness) of the input terminal group 203 and the output terminal group 204.
  • the dummy bump 205 has a larger area than the terminals 203a and 204a. Instead of the dummy bump 205, a functional bump that is electrically connected may be used.
  • FIG. 3 is a cross-sectional view in the short direction of the drive chip 201 in the liquid crystal display device on which the drive chip 201 of the first embodiment is mounted.
  • an ACF (anisotropic conductive film) 31 is sandwiched between the driving chip 201 and the liquid crystal panel 16 and the two terminal groups 203 are bonded by high pressure by a COG process. 204 and the conductive line 30 are electrically connected.
  • ACF 31 is schematically illustrated using a large number of conductive particles contained in ACF 31.
  • the dummy bumps 205 are pressure bonded to the liquid crystal panel 16 via the ACF 31.
  • FIG. 4 is a cross-sectional view in the short direction of the driving chip in the liquid crystal display device on which the driving chip of the comparative example is mounted.
  • the driving chip 100 of the comparative example has a configuration in which the dummy bump 205 is omitted from the driving chip 201 of the first embodiment.
  • the driving chip 100 is short due to the heat during the crimping in the COG process.
  • the liquid crystal panel 16 bends in the reverse direction and is bent in the reverse direction.
  • the gap between the output terminal group 204 and the terminals 204a in the outer row is increased with the liquid crystal panel 16, and sufficient flatness of the conductive particles in the ACF 31 cannot be obtained. Connection failure occurs.
  • the driving chip 201 according to the first embodiment by providing the dummy bump 205, the bending of the driving chip 201 due to heat at the time of pressure bonding in the COG process is suppressed. As a result, the driving chip 201 and the liquid crystal panel 16 are maintained in parallel (see FIG. 3), and sufficient flatness of the conductive particles is obtained in the ACF 31 that contacts all the terminals 203a and 204a. A poor electrical connection with the panel 16 is prevented.
  • the driving chip 201 of the first embodiment since the dummy bumps 205 are arranged in parallel to the rough pitch portion 204c where the circuit is not crowded, a sufficient circuit area can be secured without increasing the size of the driving chip 201. Can do.
  • FIG. 5 is a plan view of a driving chip according to the second embodiment of the present invention.
  • the driving chip 206 according to the second embodiment which is an embodiment of the driving chip 20 described above, includes two dummy bumps 205 according to the first embodiment.
  • symbol is attached
  • the two dummy bumps 205 are arranged along the longitudinal direction substantially at the center of the base body 202. That is, the two dummy bumps 205 are arranged in parallel to the rough pitch portion 204c between the input terminal group 203 and the output terminal group 204.
  • FIG. 6 is a plan view of another drive chip according to the second embodiment of the present invention.
  • the drive chip 207 of the second embodiment which is an embodiment of the drive chip 20 described above, is provided with three dummy bumps 205 of the first embodiment.
  • the three dummy bumps 205 are arranged along the longitudinal direction at substantially the center of the base body 202. That is, the three dummy bumps 205 are arranged between the input terminal group 203 and the output terminal group 204 and in parallel with the rough pitch portion 204c.
  • dummy bumps 205 may be provided.
  • the drive chip of the second embodiment is provided with a plurality of dummy bumps 205, and it is possible to more reliably prevent poor electrical connection between the drive chip and the liquid crystal panel 16 while securing a circuit area.
  • a functional bump may be used instead of the dummy bump 205.
  • FIG. 7 is a plan view of a drive chip according to a third embodiment of the present invention.
  • the driving chip 208 according to the third embodiment which is an embodiment of the driving chip 20 described above, has a rough pitch portion 204c arranged at the longitudinal end portion of the output terminal group 204 in the first embodiment.
  • symbol is attached
  • the dummy bumps 205 are disposed in the vicinity of the end of the base body 202 in the longitudinal direction. That is, the dummy bumps 205 are arranged between the input terminal group 203 and the output terminal group 204 and in parallel with the rough pitch portion 204c.
  • the dummy bumps 205 are arranged in parallel with the rough pitch portion 204c, so that the circuit area can be secured and the driving chip and the liquid crystal panel 16 can be secured. It can prevent poor electrical connection.
  • a functional bump may be used instead of the dummy bump 205.
  • a plurality of dummy bumps 205 may be provided as in the second embodiment.
  • the drive chip of the present invention can be used for a display device such as a liquid crystal display device, and can be particularly suitably used for a small-sized liquid crystal display device such as a portable information terminal.

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Abstract

　駆動チップは、ベース本体と、ベース本体の長手方向の対向する辺に沿ってそれぞれ配設された２組の端子群と、２列以上で千鳥状に配置された一方の端子群において、長手方向の端子のピッチが狭い狭ピッチ部と、長手方向の端子のピッチが狭ピッチ部より広いラフピッチ部と、２組の端子群の間であって、ラフピッチ部に並設されたダミーバンプとを備えた構成とする。

Description

駆動チップ及び表示装置
　本発明は、駆動チップ及びその駆動チップを備えた表示装置に関する。
　従来から、携帯情報端末等の中小型の表示装置として液晶表示装置が用いられている。液晶表示装置には液晶パネルを駆動するための駆動チップが搭載されており、液晶表示装置の薄型化に対応するため、駆動チップを液晶パネル上に直接実装するＣＯＧ（チップオングラス）方式が用いられている。ＣＯＧ方式では通常、駆動チップと液晶パネルとの間にＡＣＦ（異方性導電フィルム）を挟み、高温で圧着することにより、駆動チップと液晶パネルとを電気的に接続している。
　そして近年、液晶表示装置のさらなる薄型化が求められており、駆動チップも薄型化が要求されている。しかし、駆動チップを薄くすると、圧着の際の熱で駆動チップが撓むという問題が生じる。これにより、駆動チップと液晶パネルとの電気的接続不良が発生するおそれがある。
　特許文献１には、長辺と平行な第１端部と第２端部、及び長辺と垂直な短辺と平行な第３端部と第４端部とを有する一面を含むベース本体、ベース本体の長辺に沿って第１端部に形成される多数の入力端子、第２端部に長辺に沿って配列される多数の第１出力端子、及び入力端子と第１出力端子との間に形成されるダミー端子を含み、ダミー端子は、長辺に沿って１列以上で形成される駆動チップが開示されている。
特開２００５－２０３７５８号公報
　しかしながら、特許文献１では駆動チップの長辺方向に一列以上でダミー端子を並べているので、回路領域を確保しようとすると駆動チップのサイズを大きくしなければならず、回路領域の確保が難しい。
　本発明は、回路領域を確保しつつ、反りを抑制することで接続不良を防止する駆動チップを提供することを目的とする。また、その駆動チップを搭載した表示装置を提供することも目的とする。
　上記目的を達成するために本発明は、ベース本体と、前記ベース本体の長手方向の対向する辺に沿ってそれぞれ配設された２組の端子群と、２列以上で千鳥状に配置された一方の前記端子群において、長手方向の端子のピッチが狭い狭ピッチ部と、長手方向の端子のピッチが該狭ピッチ部より広いラフピッチ部と、前記２組の端子群の間であって、前記ラフピッチ部に並設されたバンプと、を備えた駆動チップとする。
　本発明によると、駆動チップにダミーバンプを設けることにより、ＣＯＧ工程における圧着の際の熱による駆動チップの撓みが抑制される。その結果、駆動チップと液晶パネルとが平行に維持され、駆動チップと液晶パネルとの電気的接続不良が防止される。また、ダミーバンプを回路の混み合っていないラフピッチ部に並設することにより、駆動チップのサイズを大きくしなくても十分に回路領域を確保することができる。
本発明の一実施形態の液晶表示装置を示す分解斜視図である。 本発明の第１実施形態の駆動チップの平面図である。 第１実施形態の駆動チップを搭載した液晶表示装置における駆動チップの短手方向の断面図である。 比較例の駆動チップを搭載した液晶表示装置における駆動チップの短手方向の断面図である。 本発明の第２実施形態の駆動チップの平面図である。 本発明の第２実施形態の他の駆動チップの平面図である。 本発明の第３実施形態の駆動チップの平面図である。
　以下に本発明の実施形態を図面を参照して説明する。
　図１は、本発明の一実施形態の液晶表示装置を示す分解斜視図である。図１において液晶表示装置１０は、表示面が上向きになるように水平に置かれた状態で描かれている。
　この液晶表示装置１０は、テレビやコンピュータのディスプレイとして利用できる。液晶表示装置１０は、バックライトシャーシ１１と、光源ユニット１２と、導光板１３と、光学シート１４と、パネルフレーム１５と、駆動チップ２０を搭載した液晶パネル１６と、ベゼル１７とを備えている。そして、バックライトシャーシ１１と、光源ユニット１２、１２と、導光板１３と、光学シート１４とを組み立てたものをバックライト装置１８と称する。
　バックライトシャーシ１１は、光源ユニット１２、導光板１３、光学シート１４などのバックライト装置１８の各部材を搭載（収容）するための土台となる部材であり箱形である。バックライトシャーシ１１の材料には、剛性及び放熱性を確保するため、ＳＥＣＣ（鋼板）やＡｌなどを用いることが望ましい。
　光源ユニット１２は、点状光源であるＬＥＤ（Light　Emitting　Diode）と、ＬＥＤを搭載するＬＥＤ基板とを含んでいる。なお、光源としては、ＬＥＤの他に線状光源である蛍光管などを用いてもよい。そして、ＬＥＤ基板上で複数のＬＥＤが導光板１３の一辺に沿って所定間隔で配設されている。光源ユニット１２の配置は、エッジライト方式を採用している。大型の液晶表示装置においては、ＬＥＤ基板として放熱性や強度を考慮してＡｌなどの金属基板を用いることが多い。
　また、光源ユニット１２をバックライトシャーシ１１に固定する固定手段としては、ネジや粘着剤を用いることができる。また、図１では２つの光源ユニット１２、１２がそれぞれ導光板１３の対向する側面に沿って設けられているが、導光板１３の一側面に沿ってのみ光源ユニット１２を設ける構成としてもよいし、導光板１３の他の側面に沿っても設ける構成としてもよい。つまり、光源ユニット１２は導光板１３の側面の少なくとも１つに沿って設ける構成とすればよい。ここで、側面はＬＥＤに対向し、ＬＥＤからの光を導光板１３内へ導く入光部（入光面）となる。
　導光板１３は、一対の主面（上面及び下面）とその間に形成された複数の側面（図１では４面）とを有する。導光板１３は、その端面（側面）から入射したＬＥＤの光を面光源へ変換して上面から導出する部材であり、その材料としては薄型化、軽量化の観点からアクリルやＰＣ（ポリカーボネート）などの樹脂を用いることが望ましい。
　光学シート１４は、拡散シート、レンズシート、輝度向上シート等の総称であり、これらのシートの何れか１枚又は複数枚を組み合わせたものである。光学シート１４は導光板１３上に重ねられ、液晶パネル１６に均一な光を照射するためのものであるので、シートに皺や撓みがあると表示品位の悪化原因となる。
　パネルフレーム１５は、液晶パネル１６と光学シート１４とが接触しないように液晶パネル１６を保持する額縁状の部材であり、その材料としてはＰＣなどの樹脂を用いることが望ましい。また、パネルフレーム１５には光学シート１４の反りや撓みを抑制する役割もある。
　液晶パネル１６は、２枚の透明基板の間に液晶素子が注入された部材であり、駆動チップ２０の制御によって液晶素子が駆動され、バックライト装置１８により照明されることで映像を表示する。
　駆動チップ２０は、ベース本体と、複数の入力端子と、複数の出力端子とを備え、液晶パネル１６にＣＯＧ方式で搭載される。そして、駆動チップ２０は外部から入力された画像データを液晶パネル１６の駆動に適合した駆動信号に変換し、最適なタイミングで液晶パネルに印加する。
　ベゼル１７は、額縁状で液晶パネル１６を押さえて固定する部材であり、箱形のバックライトシャーシ１１に蓋をするように被せられる。その材料としてはＳＥＣＣやＡｌなどの他、軽量化のためにＰＣ、ＡＢＳ樹脂、ＣＦＲＰ（（carbon　fiber　reinforced　plastics）炭素繊維強化プラスチック）などを用いてもよい。さらなる軽量化のためには、これらの材料を用い、外装となる筐体（不図示）とベゼル１７とを一体成形してもよい。
　以下、このような液晶表示装置１０における本発明の特徴的な構成である駆動チップ２０の実施形態について詳しく説明する。
＜第１実施形態＞
　図２は、本発明の第１実施形態の駆動チップの平面図である。上述した駆動チップ２０の一実施形態である第１実施形態の駆動チップ２０１は、ベース本体２０２、入力端子群２０３、出力端子群２０４、ダミーバンプ２０５を有している。
　ベース本体２０２は、端子群が配設される面が矩形の絶縁材であり、例えば、厚みが０．２ｍｍ以下、短手方向の長さが１．５ｍｍ以上である。ベース本体２０２の内部には、外部から入力される画像信号を駆動に必要な駆動信号に変換するための半導体素子（不図示）が備えられている。
　入力端子群２０３と出力端子群２０４は、ベース本体２０２の長手方向の対向する辺に沿ってそれぞれ配設された２組の端子群である。入力端子群２０３は、矩形の各端子２０３ａが１列に等間隔で直線状に並んで形成されている。なお、入力端子群２０３は２列以上であってもよい。
　出力端子群２０４は、入力端子より小さな矩形の各端子２０４ａが２列で千鳥状に配置されて形成されている。出力端子群２０４の長手方向の中央付近は、回路領域を確保するため端子２０４ａが配置される長手方向のピッチが周囲（後述する狭ピッチ部２０４ｂ、２０４ｃ）より広くなっており、この部分をラフピッチ部２０４ｃと称する。一方、ラフピッチ部２０４ｃの両側は回路領域を確保しなくてよいため端子２０４ａがラフピッチ部２０４ｃよりも狭いピッチで密に配置されており、この部分を狭ピッチ部２０４ｂ、２０４ｄと称する。なお、出力端子群２０４は３列以上であってもよい。
　なお、入力端子群２０３と出力端子群２０４は配置の形状を入れ替え、入力端子群２０３を千鳥状、出力端子群を直線状としてもよい。また、両端子群２０３、２０４とも千鳥状又は２列以上の直線状としてもよい。
　ダミーバンプ２０５は、電気的に接続されないダミーのバンプである。ダミーバンプ２０５はベース本体２０２のほぼ中央に配設される。つまり、ダミーバンプ２０５は入力端子群２０３と出力端子群２０４の間であって、ラフピッチ部２０４ｃに並設される。ダミーバンプ２０５の高さ（厚み）は、入力端子群２０３及び出力端子群２０４の高さ（厚み）と等しい。そして、ダミーバンプ２０５は各端子２０３ａ、２０４ａより大きな面積を有する。なお、ダミーバンプ２０５に代えて電気的に接続される機能バンプとしてもよい。
　図３は、第１実施形態の駆動チップ２０１を搭載した液晶表示装置における駆動チップ２０１の短手方向の断面図である。導電ライン３０が形成された液晶パネル１６を用い、駆動チップ２０１と液晶パネル１６との間にＡＣＦ（異方性導電フィルム）３１を挟み、ＣＯＧ工程によって高温で圧着することにより、両端子群２０３、２０４と導電ライン３０とを電気的に接続している。図３ではＡＣＦ３１をＡＣＦ３１に含まれる多数の導電粒子を用いて模式的に図示している。ダミーバンプ２０５はＡＣＦ３１を介して液晶パネル１６に圧着される。
　図４は、比較例の駆動チップを搭載した液晶表示装置における駆動チップの短手方向の断面図である。比較例の駆動チップ１００は第１実施形態の駆動チップ２０１からダミーバンプ２０５を省いた構成である。
　上述したように、ベース本体の厚みが０．２ｍｍ以下と薄く、ベース本体の短手方向の長さが１．５ｍｍ以上と長いため、ＣＯＧ工程における圧着の際の熱で駆動チップ１００が短手方向に撓み、液晶パネル１６が逆方向に撓んで逆反りの状態となる。その結果、特に出力端子群２０４の外列の端子２０４ａにおいて液晶パネル１６との隙間が大きくなり、ＡＣＦ３１中の導電粒子の十分な粒子扁平が得られず、駆動チップ１００と液晶パネル１６との電気的接続不良が発生する。
　これに対して、第１実施形態の駆動チップ２０１を搭載した液晶表示装置では、ダミーバンプ２０５を設けることにより、ＣＯＧ工程における圧着の際の熱による駆動チップ２０１の撓みが抑制される。その結果、駆動チップ２０１と液晶パネル１６とが平行に維持され（図３の参照）、全ての端子２０３ａ、２０４ａに接触するＡＣＦ３１において導電粒子の十分な粒子扁平が得られ、駆動チップ２０１と液晶パネル１６との電気的接続不良が防止される。
　また、第１実施形態の駆動チップ２０１において、ダミーバンプ２０５は回路の混み合っていないラフピッチ部２０４ｃに並設されるので、駆動チップ２０１のサイズを大きくしなくても十分に回路領域を確保することができる。
＜第２実施形態＞
　図５は、本発明の第２実施形態の駆動チップの平面図である。上述した駆動チップ２０の一実施形態である第２実施形態の駆動チップ２０６は、第１実施形態のダミーバンプ２０５を２つ配設したものである。その他、第１実施形態と同様の構成には同符号を付し、その詳細な説明を省略する。
　図５に示すように、２つのダミーバンプ２０５は、ベース本体２０２のほぼ中央に長手方向に沿って並んでいる。つまり、２つのダミーバンプ２０５は、入力端子群２０３と出力端子群２０４の間であって、ラフピッチ部２０４ｃに並設される。
　図６は、本発明の第２実施形態の他の駆動チップの平面図である。上述した駆動チップ２０の一実施形態である第２実施形態の駆動チップ２０７は、第１実施形態のダミーバンプ２０５を３つ配設したものである。図６に示すように、３つのダミーバンプ２０５は、ベース本体２０２のほぼ中央に長手方向に沿って並んでいる。つまり、３つのダミーバンプ２０５は、入力端子群２０３と出力端子群２０４の間であって、ラフピッチ部２０４ｃに並設される。
　なお、第２実施形態においてダミーバンプ２０５は４つ以上配設してもよい。このように、第２実施形態の駆動チップはダミーバンプ２０５を複数配設したものであり、回路領域を確保しつつ、より確実に駆動チップと液晶パネル１６との電気的接続不良を防止できる。なお、第１実施形態と同様に、ダミーバンプ２０５に代えて機能バンプとしてもよい。
＜第３実施形態＞
　図７は、本発明の第３実施形態の駆動チップの平面図である。上述した駆動チップ２０の一実施形態である第３実施形態の駆動チップ２０８は、第１実施形態においてラフピッチ部２０４ｃを出力端子群２０４の長手方向端部に配置したものである。その他、第１実施形態と同様の構成には同符号を付し、その詳細な説明を省略する。
　図７に示すように、ダミーバンプ２０５はベース本体２０２の長手方向端部付近に配設される。つまり、ダミーバンプ２０５は入力端子群２０３と出力端子群２０４の間であって、ラフピッチ部２０４ｃに並設される。
　このように、ラフピッチ部２０４ｃがベース本体２０２の端部付近に位置している場合でもダミーバンプ２０５をラフピッチ部２０４ｃに並設することで、回路領域を確保しつつ、駆動チップと液晶パネル１６との電気的接続不良を防止できる。なお、第１実施形態と同様に、ダミーバンプ２０５に代えて機能バンプとしてもよい。また、第３実施形態において第２実施形態のように、ダミーバンプ２０５を複数配設してもよい。
　本発明の駆動チップは、液晶表示装置をはじめとする表示装置に利用でき、特に携帯情報端末等の中小型の液晶表示装置に好適に利用することができる。
　　　１０　　液晶表示装置
　　　１１　　バックライトシャーシ
　　　１２　　光源ユニット
　　　１３、２１、３１、４１　　導光板
　　　１４　光学シート
　　　１５　　パネルフレーム
　　　１６　　液晶パネル
　　　１７　　ベゼル
　　　１８　　バックライト装置
　　　３０　　導電ライン
　　　３１　　ＡＣＦ
　　　２０１、２０６～２０８　　駆動チップ
　　　２０２　　ベース本体
　　　２０３　　入力端子
　　　２０３ａ、２０４ａ　　端子
　　　２０４　　出力端子
　　　２０４ｂ、２０４ｄ　　狭ピッチ部
　　　２０４ｃ　　ラフピッチ部
　　　２０５　　ダミーバンプ

Claims (10)

  1. 　ベース本体と、
    　前記ベース本体の長手方向の対向する辺に沿ってそれぞれ配設された２組の端子群と、
    　２列以上で千鳥状に配置された一方の前記端子群において、長手方向の端子のピッチが狭い狭ピッチ部と、長手方向の端子のピッチが該狭ピッチ部より広いラフピッチ部と、
    　前記２組の端子群の間であって、前記ラフピッチ部に並設されたバンプと、を備えた駆動チップ。
  2. 　前記バンプが複数配設されたことを特徴とする請求項１記載の駆動チップ。
  3. 　前記ラフピッチ部が前記一方の端子群の中央に位置することを特徴とする請求項１又は２記載の駆動チップ。
  4. 　前記ラフピッチ部が前記一方の端子群の端に位置することを特徴とする請求項１又は２記載の駆動チップ。
  5. 　前記ラフピッチ部を有する端子群が出力端子群であることを特徴とする請求項１～４の何れかに記載の駆動チップ。
  6. 　前記バンプは電気的に接続されないダミーバンプであることを特徴とする請求項１～５の何れかに記載の駆動チップ。
  7. 　前記バンプは電気的に接続される機能バンプであることを特徴とする請求項１～５の何れかに記載の駆動チップ。
  8. 　前記２組の端子群と前記バンプとの高さが等しいことを特徴とする請求項１～７の何れかに記載の駆動チップ。
  9. 　前記バンプが前記２組の端子群の各端子より大きな面積を有することを特徴とする請求項１～８の何れかに記載の駆動チップ。
  10. 　請求項１～９の何れかに記載の駆動チップがチップオングラス方式で搭載された表示装置。
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