WO2014054409A1 - 多層熱回復物品 - Google Patents
多層熱回復物品 Download PDFInfo
- Publication number
- WO2014054409A1 WO2014054409A1 PCT/JP2013/074954 JP2013074954W WO2014054409A1 WO 2014054409 A1 WO2014054409 A1 WO 2014054409A1 JP 2013074954 W JP2013074954 W JP 2013074954W WO 2014054409 A1 WO2014054409 A1 WO 2014054409A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- adhesive composition
- heat recovery
- recovery article
- adhesive layer
- adhesive
- Prior art date
Links
- 239000000853 adhesive Substances 0.000 claims abstract description 47
- 230000001070 adhesive effect Effects 0.000 claims abstract description 47
- 239000000203 mixture Substances 0.000 claims abstract description 46
- 239000012790 adhesive layer Substances 0.000 claims abstract description 44
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims abstract description 43
- 239000010410 layer Substances 0.000 claims abstract description 40
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 20
- 239000000155 melt Substances 0.000 claims abstract description 5
- 238000011084 recovery Methods 0.000 claims description 24
- 239000005038 ethylene vinyl acetate Substances 0.000 claims description 12
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims description 12
- 238000002834 transmittance Methods 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 238000003860 storage Methods 0.000 claims description 7
- 239000004952 Polyamide Substances 0.000 claims description 6
- 229920002647 polyamide Polymers 0.000 claims description 6
- -1 polyethylene Polymers 0.000 claims description 5
- 239000004698 Polyethylene Substances 0.000 claims description 4
- 229920000573 polyethylene Polymers 0.000 claims description 4
- 229920000728 polyester Polymers 0.000 claims description 3
- 239000011342 resin composition Substances 0.000 claims description 3
- 238000001125 extrusion Methods 0.000 abstract description 16
- 239000000758 substrate Substances 0.000 abstract description 7
- 230000000052 comparative effect Effects 0.000 description 10
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- 238000004132 cross linking Methods 0.000 description 5
- 235000012438 extruded product Nutrition 0.000 description 5
- 239000011777 magnesium Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 150000002894 organic compounds Chemical class 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 239000003963 antioxidant agent Substances 0.000 description 4
- 238000000921 elemental analysis Methods 0.000 description 4
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 description 4
- 229910052749 magnesium Inorganic materials 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000006229 carbon black Substances 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000011256 inorganic filler Substances 0.000 description 3
- 229910003475 inorganic filler Inorganic materials 0.000 description 3
- 230000005865 ionizing radiation Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910052623 talc Inorganic materials 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 229910052791 calcium Inorganic materials 0.000 description 2
- 150000001768 cations Chemical class 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 239000005042 ethylene-ethyl acrylate Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000000454 talc Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000004078 waterproofing Methods 0.000 description 2
- BHPQYMZQTOCNFJ-UHFFFAOYSA-N Calcium cation Chemical compound [Ca+2] BHPQYMZQTOCNFJ-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 101000969770 Homo sapiens Myelin protein zero-like protein 2 Proteins 0.000 description 1
- 239000004831 Hot glue Substances 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- JLVVSXFLKOJNIY-UHFFFAOYSA-N Magnesium ion Chemical compound [Mg+2] JLVVSXFLKOJNIY-UHFFFAOYSA-N 0.000 description 1
- 102100021272 Myelin protein zero-like protein 2 Human genes 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 229910001424 calcium ion Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000010382 chemical cross-linking Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000002734 clay mineral Substances 0.000 description 1
- 239000000306 component Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 1
- REZZEXDLIUJMMS-UHFFFAOYSA-M dimethyldioctadecylammonium chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCCCC[N+](C)(C)CCCCCCCCCCCCCCCCCC REZZEXDLIUJMMS-UHFFFAOYSA-M 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000002149 energy-dispersive X-ray emission spectroscopy Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000002687 intercalation Effects 0.000 description 1
- 238000009830 intercalation Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- 229910001425 magnesium ion Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- OCVGJDJNUJPSFB-UHFFFAOYSA-N methyl octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OC.CCCCCCCCCCCCCCCCCC(=O)OC OCVGJDJNUJPSFB-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052901 montmorillonite Inorganic materials 0.000 description 1
- 229930014626 natural product Natural products 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 150000002892 organic cations Chemical class 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910021647 smectite Inorganic materials 0.000 description 1
- 229910001415 sodium ion Inorganic materials 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- SFVFIFLLYFPGHH-UHFFFAOYSA-M stearalkonium chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCCCC[N+](C)(C)CC1=CC=CC=C1 SFVFIFLLYFPGHH-UHFFFAOYSA-M 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- WSNJABVSHLCCOX-UHFFFAOYSA-J trilithium;trimagnesium;trisodium;dioxido(oxo)silane;tetrafluoride Chemical compound [Li+].[Li+].[Li+].[F-].[F-].[F-].[F-].[Na+].[Na+].[Na+].[Mg+2].[Mg+2].[Mg+2].[O-][Si]([O-])=O.[O-][Si]([O-])=O.[O-][Si]([O-])=O.[O-][Si]([O-])=O WSNJABVSHLCCOX-UHFFFAOYSA-J 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B1/00—Layered products having a non-planar shape
- B32B1/08—Tubular products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/304—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl halide (co)polymers, e.g. PVC, PVDC, PVF, PVDF
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/306—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl acetate or vinyl alcohol (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
- B32B27/322—Layered products comprising a layer of synthetic resin comprising polyolefins comprising halogenated polyolefins, e.g. PTFE
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J131/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid, or of a haloformic acid; Adhesives based on derivatives of such polymers
- C09J131/02—Homopolymers or copolymers of esters of monocarboxylic acids
- C09J131/04—Homopolymers or copolymers of vinyl acetate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
- H01B3/305—Polyamides or polyesteramides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
- H01B3/441—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from alkenes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
- H01B3/448—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from other vinyl compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/24—All layers being polymeric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/102—Oxide or hydroxide
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
- B32B2307/402—Coloured
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/714—Inert, i.e. inert to chemical degradation, corrosion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/726—Permeability to liquids, absorption
- B32B2307/7265—Non-permeable
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/732—Dimensional properties
- B32B2307/734—Dimensional stability
- B32B2307/736—Shrinkable
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2597/00—Tubular articles, e.g. hoses, pipes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/414—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of a copolymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/04—Presence of homo or copolymers of ethene
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/04—Presence of homo or copolymers of ethene
- C09J2423/046—Presence of homo or copolymers of ethene in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2427/00—Presence of halogenated polymer
- C09J2427/006—Presence of halogenated polymer in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2431/00—Presence of polyvinyl acetate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2477/00—Presence of polyamide
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2477/00—Presence of polyamide
- C09J2477/006—Presence of polyamide in the substrate
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
- H02G15/00—Cable fittings
- H02G15/08—Cable junctions
- H02G15/18—Cable junctions protected by sleeves, e.g. for communication cable
- H02G15/1806—Heat shrinkable sleeves
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
Definitions
- the present invention relates to a multilayer heat recovery article having an adhesive layer on the inner surface.
- Heat-shrinkable tubes such as heat-shrinkable tubes and heat-shrinkable caps that are heat-shrinkable in the radial direction are used for insulation wire connection and terminal treatment of various equipment wiring, metal tube waterproofing, corrosion protection, etc.
- Heat-shrinkable tubes such as heat-shrinkable tubes and heat-shrinkable caps that are heat-shrinkable in the radial direction are used for insulation wire connection and terminal treatment of various equipment wiring, metal tube waterproofing, corrosion protection, etc.
- a heat-shrinkable tube is covered with a connection portion of an insulated wire and heated, the heat-shrinkable tube shrinks and adheres along the shape of the connection portion, so that it can be protected from injury and the like.
- a heat-shrinkable tube with an adhesive having an adhesive layer provided on the inner surface is used.
- Patent Document 1 describes a heat recovery article having an adhesive composition layer formed on the inner surface.
- a hot melt adhesive such as an ethylene-vinyl acetate copolymer (EVA), an ethylene-ethyl acrylate copolymer (EEA), or a polyamide resin is used.
- a heat-shrinkable tube having an adhesive layer is formed by extruding an outer layer and an inner layer (adhesive layer) in a tube shape, then expanding (expanding diameter) in the radial direction under heating, and cooling to fix its shape. It is manufactured by.
- the outer layer material may be crosslinked by crosslinking ionizing radiation after extrusion.
- coat the heat-shrinkable tube on the outside of the substrate to be treated and then heat it to heat-shrink the outside.
- the inner adhesive layer is flowed to fill the space between the substrate to be treated and the outer layer.
- Patent Document 2 describes a heat-shrinkable tube in which an adhesive layer has two thermoplastic resin layers.
- the adhesive layer used for the inner layer of the heat recovery article is required to have high fluidity because it is necessary to easily adhere to the adherend to ensure the filling property during heat shrinkage.
- the fluidity is too high, the shape of the adhesive layer is not stable when extruding the heat-recovery article, and the thickness variation of the adhesive layer increases.
- the inner diameter of the adhesive layer is small, the cavity inside the adhesive layer is filled, and it may be difficult to expand the diameter.
- the present invention has been made in view of the above-mentioned problems, and it is possible to secure adhesiveness with a substrate to be processed by improving the embedding property at the time of heat shrinkage and to reduce the thickness variation of the adhesive layer at the time of extrusion molding. It is an object to provide a heat recovery article.
- the present invention includes a thermoplastic resin having a melt flow rate of 15 g / 10 min to 1000 g / 10 min at a temperature of 190 ° C. and a load of 2.16 kg, and an organically treated layered silicate, a temperature of 150 ° C., and a shear rate.
- a multilayer heat recovery article having an adhesive layer made of an adhesive composition having a shear viscosity at 0.1 s ⁇ 1 of 1000 Pa ⁇ s or more and an outer layer on the outer periphery of the adhesive layer.
- an adhesive layer having good fluidity By containing a thermoplastic resin having a melt flow rate of 15 g / 10 min to 1000 g / 10 min at a temperature of 190 ° C. and a load of 2.16 kg in the adhesive composition, an adhesive layer having good fluidity can be obtained.
- the adhesion to the substrate to be treated during heat shrinkage is improved.
- the adhesive composition contains an organically treated layered silicate, and the fluidity of the adhesive layer during extrusion molding is increased by setting the shear viscosity at a temperature of 150 ° C. and a shear rate of 0.1 s ⁇ 1 to 1000 Pa ⁇ s or more.
- the thickness variation of the adhesive layer can be reduced.
- a heat-recovery article that can improve the filling property at the time of heat shrinkage and improve the adhesion to the substrate to be treated, and can reduce the thickness variation of the adhesive layer at the time of extrusion molding.
- FIG. 1 is a schematic sectional view showing an example of the heat recovery article of the present invention.
- An outer layer 2 is provided on the outer periphery of the tubular adhesive layer 1.
- the adhesive layer 1 is made of an adhesive composition having a thermoplastic resin having a melt flow rate of 15 g / 10 min to 1000 g / 10 min at a temperature of 190 ° C. and a load of 2.16 kg, and an organically treated layered silicate. .
- Melt flow rate is an index that represents the fluidity of the resin, and is measured under the conditions of a temperature of 190 ° C. and a load of 2.16 kg in accordance with JIS K7210 using an extrusion plastometer defined in JIS K6760. is there.
- the thermoplastic resin used in the adhesive composition any resin can be used as long as it has an MFR of 15 g / 10 min or more and 1000 g / 10 min or less.
- EVA ethylene-vinyl acetate copolymer
- ESA ethylene-ethyl acrylate copolymer
- saturated copolymer polyester etc.
- thermoplastic resin having an MFR of more than 1000 g / 10 minutes is too fluid to be stably extruded. Moreover, the fluidity
- the MFR of the thermoplastic resin is more preferably 100 g / 10 min or more and 800 g / 10 min or less.
- ethylene-vinyl acetate copolymer and polyamide can be particularly preferably used because of excellent dispersibility of the organically treated layered silicate.
- An ethylene-vinyl acetate copolymer and polyamide may be used alone, or both may be mixed.
- the ethylene-vinyl acetate copolymer those having a vinyl acetate content of 12 mass% to 46 mass% are particularly preferred. If vinyl acetate content is 12 mass% or more, dispersion
- the organically treated layered silicate is obtained by organically treating layered silicates (clay mineral, clay) such as montmorillonite, bentonite and smectite. Between the layered silicate planes, intermediate layer cations such as magnesium ions, sodium ions, and calcium ions are present to maintain a layered crystal structure. This intermediate layer cation is ion-exchanged with the organic cation by organic treatment.
- the organic compound is chemically bonded to the surface of the silicate plane and introduced between layers (intercalation), thereby increasing the interlayer distance between the silicate planes and improving the dispersibility in the thermoplastic resin.
- layered silicate either a natural product or a synthetic product can be used.
- An organically treated layered silicate is dispersed in a thermoplastic resin to adjust the viscosity of the adhesive composition.
- the shear viscosity at a temperature of 150 ° C. and a shear rate of 0.1 s ⁇ 1 is 1000 Pa ⁇ s or more.
- the viscosity is a value measured with a rotary rheometer.
- the adhesive composition When passing through a die during extrusion molding, the adhesive composition is subjected to high shear stress and has high fluidity. However, after passing through the die, the shear stress applied to the adhesive composition is reduced. If the viscosity of the adhesive composition in this state is low, the adhesive layer is deformed after passing through the die, resulting in variation in thickness or filling of the internal cavity. However, when the shear viscosity at a temperature of 150 ° C. and a shear rate of 0.1 s ⁇ 1 is 1000 Pa ⁇ s or more, the viscosity of the adhesive composition increases immediately after passing through the die, so that the flow of the adhesive layer after passing through the die is increased. The thickness variation can be reduced.
- the shear viscosity at a temperature of 150 ° C. and a shear rate of 100 s ⁇ 1 of the adhesive composition is preferably 200 Pa ⁇ s or less.
- the viscosity in the low shear rate region is increased as described above, the extrudability is improved.
- the viscosity in the high shear rate region is still high, the fluidity at the time of heat shrinkage is lowered and good adhesion is achieved. It is because it cannot be obtained.
- the heat loss at 300 ° C. of the adhesive composition is preferably 1% or more.
- the adhesive composition includes an organically treated layered silicate. When this organically treated layered silicate is heated to 300 ° C., the organic compound contained in the organically treated layered silicate decomposes and loses weight. Therefore, the heat loss at 300 ° C. is a measure of the amount of organic compound contained in the organically treated layered silicate. It becomes.
- the amount of the organic compound contained in the organically treated silicate is preferably 20% to 60%.
- the organically treated layered silicate having a small organic compound content has a low dispersibility in the thermoplastic resin, and it is difficult to finely disperse the layered silicate.
- the heat loss at 300 ° C. is a value obtained by measuring the mass loss at 300 ° C. based on the mass at 50 ° C., measured by increasing the temperature at 10 ° C./min up to 400 ° C. with a thermal analyzer.
- the organically treated layered silicate is contained in the adhesive composition.
- the organically treated layered silicate contains silicon (Si) and magnesium (Mg)
- the presence of the organically treated layered silicate can also be confirmed by elemental analysis of the adhesive composition to confirm the presence of Si and Mg. can do.
- the storage elastic modulus at 110 ° C. of the adhesive composition is preferably 0.1 MPa or less.
- the storage elastic modulus is measured by changing the strain from 0.001% to 10% in the vibration measurement of the rotary rheometer, and is taken as the value of the storage elastic modulus at the time of 0.1% strain.
- the storage elastic modulus is higher than 0.1 MPa, the shape is maintained even when stress is applied, so that the filling property of the adhesive layer when the outer layer contracts deteriorates.
- the pressure is 0.1 MPa or less, the adhesive layer is easily melted when the outer layer contracts, so that the filling property when the outer layer contracts is good.
- the content of the organically treated layered silicate is arbitrarily adjusted so that the shear viscosity at a temperature of 150 ° C. and a shear rate of 0.1 s ⁇ 1 is 1000 Pa ⁇ s or more.
- the organically treated layered silicate is contained in an amount of 1 part by mass or more and 20 parts by mass or less with respect to 100 parts by mass of the thermoplastic resin, the viscosity can be adjusted well, which is preferable.
- the good dispersion of the organically treated layered silicate in the thermoplastic resin can be determined using the light transmittance at a wavelength of 850 nm as an index. If the transmittance of light having a wavelength of 850 nm at a converted thickness of 1.0 mm is 30% or more, the organically treated layered silicate is presumably finely dispersed. In addition, when the layered silicate which is not organically processed is used, since the dispersibility is not good, it is estimated that the transmittance
- the transmittance of light with a wavelength of 850 nm at a converted thickness of 1.0 mm does not exceed 30%. However, if the converted thickness is 0.05 mm, the transmittance of light having a wavelength of 850 nm is 20% or more.
- additives other than the above thermoplastic resin and organically treated layered silicate may be mixed.
- antioxidants, colorants, lubricants, heat stabilizers, ultraviolet absorbers and the like are used as additives.
- These materials are mixed by an arbitrary mixer such as an open roll, a pressure kneader, a single-screw mixer, a twin-screw mixer, etc. to prepare an adhesive composition.
- the resin composition constituting the outer layer includes one or more selected from the group consisting of polyethylene, polyester, polyamide and fluororesin as a resin component, and flame retardants, antioxidants, colorants, lubricants, thermal stability as necessary. Agents, UV absorbers, etc. are mixed.
- the resin composition constituting the outer layer and the adhesive composition constituting the adhesive layer can be extruded using a known melt extrusion molding machine to obtain a multilayer extruded product.
- the multilayer extruded product is expanded to a predetermined outer shape by a method such as introducing compressed air into the tube while being heated to a temperature equal to or higher than the melting point, and then cooled to fix the shape to obtain a multilayer heat recovery article.
- a multilayer heat recovery article having excellent heat resistance is obtained.
- a crosslinking method methods such as crosslinking by irradiation with ionizing radiation, chemical crosslinking, and thermal crosslinking can be used.
- the shape of the multilayer heat recovery article can be designed arbitrarily.
- the inner diameter of the outer layer is 1.0 mm to 30 mm
- the thickness of the outer layer is 0.1 mm to 10 mm
- the thickness of the adhesive layer is about 0.1 mm to 10 mm
- the inner diameter of the adhesive layer is 0.00.
- it is about 1 mm to 8.5 mm.
- the multilayer heat-recovery article of the present invention is excellent in the extrudability of the adhesive layer, it can be satisfactorily extruded even when the inner diameter of the adhesive layer is as small as 1.0 mm or less.
- the multilayer heat recovery article of the present invention includes a heat shrink tube and a heat shrink cap.
- the heat-shrinkable tube is tube-shaped and may be long or cut to an appropriate length.
- a heat-shrink cap is one in which one end of a heat-shrink tube cut to an appropriate length is closed by heating and shrinking.
- Adhesive compositions were prepared by melting and mixing the thermoplastic resins, fillers, and antioxidants of the formulation shown in Tables 1 and 2.
- the obtained adhesive composition was used as an inner layer (adhesive layer), polyethylene having a melting point of 125 ° C. as an outer layer, outer layer inner diameter 2.8 mm, outer layer thickness 0.9 mm, inner layer (adhesive layer) inner diameter 0.6 mm, inner layer (adhesion) Agent layer)
- a tube-shaped two-layer extruded product having a thickness of 1.0 mm was prepared.
- the extruded product was irradiated with ionizing radiation to crosslink the outer layer, then expanded so that the outer diameter of the outer layer was 7.5 mm, cooled, and fixed in shape to obtain a heat-shrinkable tube.
- the adhesive layer contains an amount of antioxidant that does not crosslink, so that crosslinking is inhibited.
- the outer layer was peeled from the heat-shrinkable tube to make only the inner layer (adhesive layer), and the following series of evaluations were performed.
- Shear viscosity measurement The shear viscosity at a temperature of 150 ° C. was measured using a rotary rheometer (RCM302 manufactured by Anton Paar Co., Ltd.). The shear viscosity was 1 when the shear rate was 0.1 s ⁇ 1 , and the shear viscosity 2 when the shear rate was 100 s ⁇ 1 .
- the adhesive composition was pressed at a temperature of 150 ° C. to prepare a sheet having a thickness of 1.0 mm, and the transmittance of light having a wavelength of 850 nm was measured using a spectrophotometer. Since the adhesive compositions of Example 10 and Comparative Example 8 contained carbon black and were black, a 0.05 mm thick sheet was prepared and measured in the same manner.
- Elemental analysis of the adhesive composition was performed by energy dispersive X-ray spectroscopy. Among them, Mg, Si, and Ca were detected. The above results are shown in Tables 1 and 2.
- EVA1 MFR 150 g / 10 min, ethylene-vinyl acetate copolymer having a vinyl acetate content of 28% by mass
- EVA2 MFR 800 g / 10 min, ethylene-vinyl acetate copolymer having a vinyl acetate content of 28% by mass
- EVA3 MFR 150 g / 10 min
- EVA4 MFR 2 g / 10 min, ethylene-vinyl acetate copolymer with 5% by mass of vinyl acetate
- Polyethylene MFR 145 g / 10 min, density 0.915
- Organically treated layered silicate 1 Layered silicate treated with dimethyldistearylammonium chloride
- Organically treated layered silicate 2 Layered silicate treated with benzyldimethylstearylammonium chloride
- Organically treated swelling mica Syn
- Wollastonite manufactured by Kinsei Matec Corporation, SH1800 Talc: MICRO ACE SG95 manufactured by Nippon Talc Co., Ltd.
- Carbon black carbon black having an arithmetic average particle size of 24 nm, a nitrogen adsorption specific surface area of 93 m 2 / g, and a bulk density of 360 kg / m 3
- the adhesive compositions of Examples 1 to 10 are excellent in extrusion moldability and pass the waterproof test. These adhesive compositions contain 1% by mass or more and 20% by mass or less of organically treated layered silicate with respect to 100 parts by mass of the resin.
- the shear viscosity of the adhesive composition when the shear rate is 0.1 s ⁇ 1 is 1000 Pa ⁇ s or more, and the shear viscosity when the shear rate is 100 s ⁇ 1 is 200 Pa ⁇ s or less. From this, it can be seen that the adhesive composition of the present invention is excellent in extrusion moldability and in embedding property (waterproof property).
- Example 10 Si and Mg were detected by elemental analysis. Moreover, the transmittance
- the adhesive composition of Example 10 has a transmittance of 20% or more at a thickness of 0.05 mm.
- Example 11 and Reference Example 1 had a slightly high shear viscosity at a shear rate of 100 s ⁇ 1 and failed in the waterproof test. However, if the thickness of the adhesive layer is increased or the heat shrinkage temperature is high, it is presumed that the flowability of the adhesive layer at the time of thermal shrinkage is good and may be usable.
- Comparative Example 1 and Comparative Example 2 do not contain an organically treated silicate.
- Comparative Example 1 the viscosity at a low shear rate is too low and the extrusion moldability is unacceptable.
- Comparative Example 2 the extrusion moldability is good, but the flowability of the resin is poor and the waterproof test fails.
- Comparative Example 3 contains an organically treated silicate, but the shear viscosity is low at a shear rate of 0.1 s ⁇ 1 and the press moldability is unacceptable.
- Comparative Examples 4 to 9 do not contain an organically treated silicate and contain an inorganic filler. In either case, the shear viscosity is low at a shear rate of 0.1 s ⁇ 1 and the press moldability is unacceptable. In addition, the transmittance of light with a wavelength of 850 nm is less than 30%, and it can be seen that the inorganic filler not subjected to organic treatment has poor dispersibility with respect to the thermoplastic resin. In Comparative Example 9 in which the content of the inorganic filler (layered silicate) was increased, the shear viscosity was increased at a shear rate of 0.1 s -1 compared to Comparative Example 8, but the extrusion moldability was unacceptable. It is enough. On the other hand, the waterproof test fails because the shear viscosity increases at a shear rate of 100 s ⁇ 1 .
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
熱収縮時の埋まり性を良好として被処理基材との密着性を向上できるとともに、押出成形時の接着剤層の厚みばらつきを低減できる熱回復物品を提供する。190℃、2.16kg荷重でのメルトフローレートが15g/10分以上1000g/10分以下の熱可塑性樹脂と、有機処理層状珪酸塩とを有し、温度150℃剪断速度0.1s-1での剪断粘度が1000Pa・s以上である接着剤組成物からなる接着剤層と、前記接着剤層の外周に外層を有する多層熱回復物品。接着剤組成物の温度150℃剪断速度100s-1での剪断粘度が200Pa・s以下であると、より好ましい。
Description
本発明は内面に接着剤層を有する多層熱回復物品に関する。
径方向に熱収縮性を有する熱収縮チューブ、熱収縮キャップ等の熱回復物品は、絶縁電線の接続部や各種機器内配線の端末処理、金属管の防水、防食等のための被覆等に使用されている。たとえば熱収縮チューブを絶縁電線の接続部にかぶせて加熱すると、熱収縮チューブが接続部分の形状に沿って収縮して密着するため外傷等から保護できる。防水等のため接続部分に高度の密着性が要求される場合は内面に接着剤層を設けた接着剤つきの熱収縮チューブが用いられる。たとえば特許文献1には、内面に接着剤組成物層が形成された熱回復物品が記載されている。接着剤層には、エチレン-酢酸ビニル共重合体(EVA)、エチレン-エチルアクリレート共重合体(EEA)、ポリアミド樹脂等のホットメルト接着剤が用いられる。
接着剤層を有する熱収縮チューブは、外層と内層(接着剤層)とをそれぞれチューブ状に押出成形した後、加熱下で径方向に膨張(拡径)し、冷却してその形状を固定することで製造される。押出成形後に電離性放射線を架橋して外層材料を架橋することもある。使用時には被処理基材の外側に熱収縮チューブを被覆した後、加熱して外側を熱収縮させると同時に、内側の接着剤層を流動させて被処理基材と外層との間を埋めて密着させる。特許文献2には、接着剤層を二層の熱可塑性樹脂層とした熱収縮チューブが記載されている。
熱回復物品の内層に使用される接着剤層には、熱収縮時には容易に被着体と密着して埋まり性を確保する必要があるため、流動性が高いことが要求される。しかし流動性が高すぎると熱回復物品を押出成形する際に接着剤層の形状が安定せず、接着剤層の厚みばらつきが大きくなる。特に接着剤層の内径が小さい場合には接着剤層内部の空洞が埋まり、拡径作業が困難となる可能性がある。
本発明は上記の問題に鑑みてなされたものであり、熱収縮時の埋まり性を良好として被処理基材との密着性を確保できるとともに、押出成形時の接着剤層の厚みばらつきを低減できる熱回復物品を提供することを課題とする。
本発明は、温度190℃、荷重2.16kgでのメルトフローレートが15g/10分以上1000g/10分以下の熱可塑性樹脂と、有機処理層状珪酸塩とを有し、温度150℃、剪断速度0.1s-1での剪断粘度が1000Pa・s以上である接着剤組成物からなる接着剤層と、前記接着剤層の外周に外層を有する多層熱回復物品である。
温度190℃、荷重2.16kgでのメルトフローレートが15g/10分以上1000g/10分以下の熱可塑性樹脂を接着剤組成物に含有することにより、流動性が良好な接着剤層を得られ、熱収縮時の被処理基材への密着性が向上する。また有機処理層状珪酸塩を接着剤組成物に含有し、温度150℃、剪断速度0.1s-1での剪断粘度を1000Pa・s以上とすることで押出成形時の接着剤層の流動性を抑制でき、接着剤層の厚みばらつきを低減できる。
本発明により、熱収縮時の埋まり性を良好として被処理基材との密着性を向上できるとともに、押出成形時の接着剤層の厚みばらつきを低減できる熱回復物品を得ることができる。
図1は本発明の熱回復物品の一例を示した断面模式図である。チューブ状の接着剤層1の外周に、外層2を有している。接着剤層1は、温度190℃、荷重2.16kgでのメルトフローレートが15g/10分以上1000g/10分以下の熱可塑性樹脂と、有機処理層状珪酸塩とを有する接着剤組成物からなる。
メルトフローレート(MFR)は樹脂の流動性を表す指標であり、JIS K6760で規定された押出し形プラストメータを用いJIS K7210に準拠して温度190℃、荷重2.16kgの条件で測定したものである。接着剤組成物に使用する熱可塑性樹脂はMFRが15g/10分以上1000g/10分以下のものであれば任意のものを使用できる。例えばエチレン-酢酸ビニル共重合体(EVA)、ポリアミド、エチレン-エチルアクリレート共重合体(EEA)、飽和共重合ポリエステル等が例示でき、外層の種類や被処理基材の種類に応じて任意のものを選択して使用できる。
MFRが1000g/10分を超える熱可塑性樹脂を使用した接着剤組成物は、流動性が大きすぎるので安定して押出成形するのが困難となる。またMFRが15g/10分未満の熱可塑性樹脂を使用した接着剤組成物は、熱収縮時の流動性が低下する。熱可塑性樹脂のMFRは100g/10分以上800g/10分以下がより好ましい。
上記の樹脂のなかでも、エチレン-酢酸ビニル共重合体及びポリアミドは、有機処理層状珪酸塩の分散性に優れるため特に好ましく使用できる。エチレン-酢酸ビニル共重合体、ポリアミドをそれぞれ単独で用いても良いし、両者を混合しても良い。エチレン-酢酸ビニル共重合体として、酢酸ビニル含有量が12質量%以上46質量%以下のものが特に好ましい。酢酸ビニル含有量が12質量%以上であれば有機処理層状珪酸塩の分散が容易となる。一方46質量%より高くなると材料の固着が発生し、取扱いが困難となる。
有機処理層状珪酸塩とはモンモリロナイト、ベントナイト、スメクタイト等の層状珪酸塩(粘土鉱物、クレー)を有機処理したものである。層状に積層した珪酸塩平面の間には、マグネシウムイオン、ナトリウムイオン、カルシウムイオン等の中間層カチオンが存在して層状の結晶構造を保っている。有機処理することでこの中間層カチオンが有機カチオンとイオン交換される。有機化合物が珪酸塩平面の表面に化学的に結合して層間に導入(インターカレーション)されることで珪酸塩平面間の層間距離が大きくなり、熱可塑性樹脂への分散性が向上する。層状珪酸塩としては天然品、合成品のいずれも使用できる。
有機処理層状珪酸塩を熱可塑性樹脂に分散させて接着剤組成物の粘度を調整する。温度150℃、剪断速度0.1s-1での剪断粘度を1000Pa・s以上とする。なお粘度は回転式レオメーターで測定した値とする。
押出成形時にダイスを通過する際、接着剤組成物には高い剪断応力がかかり流動性が高くなっている。しかしダイスを通過した後は接着剤組成物にかかる剪断応力は低減する。
この状態での接着剤組成物の粘度が低いとダイスを通過した後で接着剤層が変形して厚みばらつきが生じたり内部の空洞部分が埋まったりする。しかし温度150℃、剪断速度0.1s-1での剪断粘度を1000Pa・s以上とすると、ダイスを通過した直後に接着剤組成物の粘度が高くなるためダイス通過後の接着剤層の流動を抑えることができ、厚みばらつきを低減できる。
この状態での接着剤組成物の粘度が低いとダイスを通過した後で接着剤層が変形して厚みばらつきが生じたり内部の空洞部分が埋まったりする。しかし温度150℃、剪断速度0.1s-1での剪断粘度を1000Pa・s以上とすると、ダイスを通過した直後に接着剤組成物の粘度が高くなるためダイス通過後の接着剤層の流動を抑えることができ、厚みばらつきを低減できる。
接着剤組成物の温度150℃、剪断速度100s-1での剪断粘度を200Pa・s以下とすると好ましい。上記のように低剪断速度域での粘度を高くすると押出成形性が良好となるが、高剪断速度域での粘度も高いままであると熱収縮時の流動性が低下して良好な密着性が得られないからである。
接着剤組成物の300℃での熱減量が1%以上であると好ましい。接着剤組成物には有機処理層状珪酸塩が含まれる。この有機処理層状珪酸塩を300℃に加熱すると有機処理層状珪酸塩に含まれる有機化合物が分解して減量するため、300℃での熱減量は有機処理層状珪酸塩に含まれる有機化合物量の目安となる。有機処理珪酸塩に含まれる有機化合物量は20%~60%とすることが好ましい。有機化合物含有量が少ない有機処理層状珪酸塩は熱可塑性樹脂への分散性が低下し、層状珪酸塩を微分散させることが難しい。なお300℃での熱減量は熱分析装置で400℃まで10℃/分で温度を上昇させて測定し、50℃の質量を基準にして300℃時の質量減を算出した値である。
接着剤組成物中に有機処理層状珪酸塩が含まれることは熱減量測定で確認できる。また有機処理層状珪酸塩はケイ素(Si)及びマグネシウム(Mg)を含むため、接着剤組成物を元素分析してSi、Mgの存在を確認することによっても、有機処理層状珪酸塩の存在を確認することができる。
接着剤組成物の110℃での貯蔵弾性率が0.1MPa以下であると好ましい。貯蔵弾性率は回転式レオメーターの振動測定において、歪を0.001%から10%まで変化させて測定し、0.1%歪時の貯蔵弾性率の値とする。貯蔵弾性率が0.1MPaよりも高いと応力を加えても形状を維持するため、外層収縮時の接着層の埋まり性が悪化する。0.1MPa以下であると外層収縮時に接着層が容易に溶融するため外層収縮時の埋まり性が良い。
有機処理層状珪酸塩の含有量は、温度150℃、剪断速度0.1s-1での剪断粘度が1000Pa・s以上となるように任意に調整する。熱可塑性樹脂100質量部に対して有機処理層状珪酸塩を1質量部以上20質量部以下含有させると良好に粘度を調整でき、好ましい。
有機処理層状珪酸塩が熱可塑性樹脂に良好に分散していることは、波長850nmの光の透過率を指標として判断できる。換算厚み1.0mmでの波長850nmの光の透過率が30%以上であれば有機処理層状珪酸塩が良好に微分散していると推定される。なお有機処理していない層状珪酸塩を使用した場合は分散性が良好でないため換算厚み1.0mmでの波長850nmの光の透過率は30%未満となると推定される。
接着剤組成物中にカーボン等の黒色フィラーを混合して黒色とした場合は、換算厚み1.0mmでの波長850nmの光の透過率は30%以上とならない。しかし換算厚みを0.05mmとすると波長850nmの光の透過率は20%以上となる。
接着剤組成物には、上記の熱可塑性樹脂、有機処理層状珪酸塩以外の添加物を混合しても良い。例えば酸化防止剤、着色剤、滑材、熱安定剤、紫外線吸収剤等が添加物として使用される。これらの材料はオープンロール、加圧ニーダー、単軸混合機、二軸混合機等任意の混合機で混合して接着剤組成物を作成する。
多層熱回復物品の外層には従来の熱収縮チューブに用いられている任意の材料を用いることができる。外層を構成する樹脂組成物は、ポリエチレン、ポリエステル、ポリアミド及びフッ素樹脂からなる群から選ばれる1種以上を樹脂成分とし、必要に応じて難燃剤、酸化防止剤、着色剤、滑材、熱安定剤、紫外線吸収剤等を混合したものとする。
外層を構成する樹脂組成物と接着剤層を構成する接着剤組成物とを既知の溶融押出成形機を用いて押出成形して多層押出成形品を得ることができる。この多層押出成形品を融点以上の温度に加熱した状態でチューブ内に圧縮空気を導入する等の方法により所定の外形に膨張した後、冷却して形状を固定して多層熱回復物品が得られる。押出成形した後に外層材料を架橋すると耐熱性に優れる多層熱回復物品が得られる。架橋方法としては電離放射の照射による架橋、化学架橋、熱架橋等の方法を用いることができる。
多層熱回復物品の形状は任意に設計することができる。押出成形時(膨張前)において外層の内径が1.0mm~30mm、外層の肉厚が0.1mm~10mm、接着剤層の厚みが0.1mm~10mm程度、接着剤層の内径が0.1mm~8.5mm程度とするのが一般的である。本発明の多層熱回復物品は接着剤層の押出成形性に優れているため、特に接着剤層の内径が1.0mm以下と小さい場合でも良好に押出成形可能である。なお接着剤層のみをチューブ状に押出成形したものを膨張した外層チューブ内部にセットし、収縮させて使うことも可能である。
本発明の多層熱回復物品としては、熱収縮チューブ、熱収縮キャップが含まれる。熱収縮チューブはチューブ状のものであり、長尺のものであっても、適当な長さに切断したものでも良い。熱収縮キャップとは、適当な長さに切断した熱収縮チューブの片端を加熱収縮して閉じたものである。
次に、本発明を実施例に基づいてさらに詳細に説明する。実施例は本発明の範囲を限定するものではない。
(実施例1~11、参考例1、比較例1~9)
(接着剤組成物の作成、押出成形性の評価)
表1、表2に示す配合処方の熱可塑性樹脂とフィラー、及び酸化防止剤を溶融混合して接着剤組成物を作製した。得られた接着剤組成物を内層(接着剤層)とし、融点125℃のポリエチレンを外層として外層内径2.8mm、外層厚み0.9mm、内層(接着剤層)内径0.6mm、内層(接着剤層)厚み1.0mmのチューブ状二層押出成形品を作製した。適当な長さに切断した押出成形品の一方の端から空気を入れ、逆側の端から空気が出てくることを確認できたものを合格とした。接着剤層の厚みばらつきが大きいとチューブ内部が接着剤で埋まって閉じてしまうため、空気が通り抜けることができない。
(接着剤組成物の作成、押出成形性の評価)
表1、表2に示す配合処方の熱可塑性樹脂とフィラー、及び酸化防止剤を溶融混合して接着剤組成物を作製した。得られた接着剤組成物を内層(接着剤層)とし、融点125℃のポリエチレンを外層として外層内径2.8mm、外層厚み0.9mm、内層(接着剤層)内径0.6mm、内層(接着剤層)厚み1.0mmのチューブ状二層押出成形品を作製した。適当な長さに切断した押出成形品の一方の端から空気を入れ、逆側の端から空気が出てくることを確認できたものを合格とした。接着剤層の厚みばらつきが大きいとチューブ内部が接着剤で埋まって閉じてしまうため、空気が通り抜けることができない。
(熱収縮チューブの製造)
押出成形品に電離放射線を照射して外層を架橋した後、外層の外径が7.5mmとなるように膨張させた後冷却して形状を固定して熱収縮チューブを得た。なお接着剤層には架橋しない程度の量の酸化防止剤が含まれているため架橋は阻害される。
押出成形品に電離放射線を照射して外層を架橋した後、外層の外径が7.5mmとなるように膨張させた後冷却して形状を固定して熱収縮チューブを得た。なお接着剤層には架橋しない程度の量の酸化防止剤が含まれているため架橋は阻害される。
(熱収縮チューブの評価:防水試験)
絶縁電線1本と絶縁電線4本とを溶接したハーネスの溶接部分に熱収縮チューブをかぶせ、180℃の恒温槽中で床面に水平に置き、90秒加熱し収縮させて熱収縮チューブと溶接部分とを密着させた。このサンプルを水中に入れ、絶縁電線1本の片端から200kPaの空気を30秒間吹き込み、水中でのバブル発生の有無を確認した。バブルが発生しないものを合格、バブルが発生したものを不合格とした。
絶縁電線1本と絶縁電線4本とを溶接したハーネスの溶接部分に熱収縮チューブをかぶせ、180℃の恒温槽中で床面に水平に置き、90秒加熱し収縮させて熱収縮チューブと溶接部分とを密着させた。このサンプルを水中に入れ、絶縁電線1本の片端から200kPaの空気を30秒間吹き込み、水中でのバブル発生の有無を確認した。バブルが発生しないものを合格、バブルが発生したものを不合格とした。
熱収縮チューブから外層を剥離して内層(接着剤層)のみとし、以下に示す一連の評価を行った。
(剪断粘度測定)
回転式レオメーター(アントンパール(株)製RCM302)を用いて温度150℃での剪断粘度を測定した。剪断速度0.1s-1のときの剪断粘度を剪断粘度1、剪断速度100s-1のときの剪断粘度を剪断粘度2とした。
回転式レオメーター(アントンパール(株)製RCM302)を用いて温度150℃での剪断粘度を測定した。剪断速度0.1s-1のときの剪断粘度を剪断粘度1、剪断速度100s-1のときの剪断粘度を剪断粘度2とした。
(貯蔵弾性率測定)
回転式レオメーター(アントンパール(株)製RCM302)を用いて歪を0.001%から10%まで変化させて振動測定を行い、0.1%歪時の貯蔵弾性率を測定した。
回転式レオメーター(アントンパール(株)製RCM302)を用いて歪を0.001%から10%まで変化させて振動測定を行い、0.1%歪時の貯蔵弾性率を測定した。
(300℃熱減量測定)
得られた接着剤組成物の熱減量を熱分析装置で測定した。室温から400℃まで10℃/分で温度上昇し、50℃の質量を基準として300℃での質量減を算出した。
得られた接着剤組成物の熱減量を熱分析装置で測定した。室温から400℃まで10℃/分で温度上昇し、50℃の質量を基準として300℃での質量減を算出した。
(透過率測定)
接着剤組成物を温度150℃でプレス加工して厚み1.0mmのシートを作成し、分光光度計を用いて波長850nmの光の透過率を測定した。なお実施例10と比較例8の接着剤組成物にはカーボンブラックが入っており黒色であるため、厚み0.05mmのシートを作成して同様に測定した。
接着剤組成物を温度150℃でプレス加工して厚み1.0mmのシートを作成し、分光光度計を用いて波長850nmの光の透過率を測定した。なお実施例10と比較例8の接着剤組成物にはカーボンブラックが入っており黒色であるため、厚み0.05mmのシートを作成して同様に測定した。
(元素分析)
エネルギー分散型X線分光法で接着剤組成物の元素分析を行った。Mg、Si、Caのうち含有するものを検出した。以上の結果を表1及び表2に示す。
エネルギー分散型X線分光法で接着剤組成物の元素分析を行った。Mg、Si、Caのうち含有するものを検出した。以上の結果を表1及び表2に示す。
(脚注)
EVA1:MFR150g/10分、酢酸ビニル含有量28質量%のエチレン-酢酸ビニル共重合体
EVA2:MFR800g/10分、酢酸ビニル含有量28質量%のエチレン-酢酸ビニル共重合体
EVA3:MFR150g/10分、酢酸ビニル含有量19質量%のエチレン-酢酸ビニル共重合体
EVA4:MFR2g/10分、酢酸ビニル含有量5質量%のエチレン-酢酸ビニル共重合体
ポリエチレン:MFR145g/10分、密度0.915の低密度ポリエチレン
有機処理層状珪酸塩1:塩化ジメチルジステアリルアンモニウムで処理した層状珪酸塩 有機処理層状珪酸塩2:塩化ベンジルジメチルステアリルアンモニウムで処理した層状珪酸塩
有機処理膨潤性雲母:タルクから合成した合成フッ素雲母を塩化ジメチルジステアリルアンモニウムで処理したもの
層状珪酸塩:上記有機処理層状珪酸塩1に使用した層状珪酸塩
炭酸カルシウム:白石カルシウム(株)製、白艶華CCR
ワラストナイト:キンセイマテック(株)製、SH1800
タルク:日本タルク(株)製 MICRO ACE SG95
カーボンブラック:算術平均粒子径24nm、窒素吸着比表面積93m2/g、嵩密度360kg/m3のカーボンブラック
EVA1:MFR150g/10分、酢酸ビニル含有量28質量%のエチレン-酢酸ビニル共重合体
EVA2:MFR800g/10分、酢酸ビニル含有量28質量%のエチレン-酢酸ビニル共重合体
EVA3:MFR150g/10分、酢酸ビニル含有量19質量%のエチレン-酢酸ビニル共重合体
EVA4:MFR2g/10分、酢酸ビニル含有量5質量%のエチレン-酢酸ビニル共重合体
ポリエチレン:MFR145g/10分、密度0.915の低密度ポリエチレン
有機処理層状珪酸塩1:塩化ジメチルジステアリルアンモニウムで処理した層状珪酸塩 有機処理層状珪酸塩2:塩化ベンジルジメチルステアリルアンモニウムで処理した層状珪酸塩
有機処理膨潤性雲母:タルクから合成した合成フッ素雲母を塩化ジメチルジステアリルアンモニウムで処理したもの
層状珪酸塩:上記有機処理層状珪酸塩1に使用した層状珪酸塩
炭酸カルシウム:白石カルシウム(株)製、白艶華CCR
ワラストナイト:キンセイマテック(株)製、SH1800
タルク:日本タルク(株)製 MICRO ACE SG95
カーボンブラック:算術平均粒子径24nm、窒素吸着比表面積93m2/g、嵩密度360kg/m3のカーボンブラック
実施例1~10の接着剤組成物は、押出成形性に優れており、また防水性試験にも合格している。これらの接着剤組成物には有機処理層状珪酸塩が樹脂100質量部に対して1質量%以上20質量%以下含まれている。接着剤組成物の剪断速度0.1s-1のときの剪断粘度はいずれも1000Pa・s以上であり、剪断速度100s-1のときの剪断粘度は200Pa・s以下である。このことから本発明の接着剤組成物が、押出成形性に優れると共に埋まり性(防水性)にも優れることがわかる。
実施例1~10のすべてにおいて、元素分析でSi及びMgが検出されている。また波長850nmの光の透過率は実施例10を除くすべてで厚み1.0mmで30%以上であり、有機処理層状珪酸塩が良好に分散していることがわかる。なお実施例10の接着剤組成物は厚み0.05mmでの透過率が20%以上である。
実施例11及び参考例1の接着剤組成物は剪断速度100s-1のときの剪断粘度がやや高く、防水試験で不合格となった。しかし接着剤層の厚みを厚くしたり加熱収縮温度が高い条件であれば熱収縮時の接着剤層の流れ性は良好となり使用可能となる場合もあると推測される。
比較例1、比較例2の接着剤組成物には有機処理珪酸塩が含まれていない。比較例1は低剪断速度での粘度が低すぎて押出成形性が不合格である。比較例2は、押出成形性は良好であるが樹脂の流れ性が悪く防水試験で不合格となる。比較例3には有機処理珪酸塩が含まれているが、剪断速度0.1s-1のときの剪断粘度が低く押成形性が不合格である。
比較例4~9は有機処理珪酸塩を含まず、無機フィラーを含んでいる。いずれも剪断速度0.1s-1のときの剪断粘度が低く押成形性が不合格である。またいずれも波長850nm光の透過率が30%未満であり、有機処理していない無機フィラーは熱可塑性樹脂に対する分散性が悪いことがわかる。無機フィラー(層状珪酸塩)の含有量を多くした比較例9は、比較例8に比べると剪断速度0.1s-1のときの剪断粘度が上がっているが押出成形性は不合格であり不十分である。一方剪断速度100s-1のときの剪断粘度が高くなることから防水性試験が不合格となる。
1接着剤層
2外層
2外層
Claims (9)
- 190℃、2.16kg荷重でのメルトフローレートが15g/10分以上1000g/10分以下の熱可塑性樹脂と、有機処理層状珪酸塩とを有し、温度150℃、剪断速度0.1s-1での剪断粘度が1000Pa・s以上である接着剤組成物からなる接着剤層と、前記接着剤層の外周に外層を有する多層熱回復物品。
- 前記接着剤組成物の温度150℃、剪断速度100s-1での剪断粘度が200Pa・s以下である、請求項1に記載の多層熱回復物品。
- 前記接着剤組成物の300℃での熱減量が1%以上である、請求項1又は2に記載の多層熱回復物品。
- 前記接着剤組成物の110℃での貯蔵弾性率が0.1MPa以下である、請求項1~3のいずれか1項に記載の多層熱回復物品。
- 前記有機処理層状珪酸塩の含有量は、前記熱可塑性樹脂100質量部に対して1質量部以上20質量部以下である、請求項1~4のいずれか1項に記載の多層熱回復物品。
- 前記熱可塑性樹脂はエチレン-酢酸ビニル共重合体又は/及びポリアミドである、請求項1~5のいずれか1項に記載の多層熱回復物品。
- 前記接着剤組成物の換算厚み1.0mmでの波長850nmの光の透過率が30%以上である、請求項1~6のいずれか1項に記載の多層熱回復物品。
- 前記接着剤組成物は黒色であり、換算厚み0.05mmでの波長850nmの光の透過率が20%以上である、請求項1~6のいずれか1項に記載の多層熱回復物品。
- 前記外層が、ポリエチレン、ポリエステル、ポリアミド、及びフッ素樹脂からなる群から選ばれる1種以上を樹脂成分とする樹脂組成物からなる、請求項1~8のいずれか1項に記載の多層熱回復物品。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP13844472.4A EP2905132B1 (en) | 2012-10-01 | 2013-09-16 | Multilayer thermally restorable article |
CN201380004126.XA CN103974828B (zh) | 2012-10-01 | 2013-09-16 | 多层可热恢复物品 |
US14/365,644 US20150004408A1 (en) | 2012-10-01 | 2013-09-16 | Multilayer thermally restorable article |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012218990A JP5711713B2 (ja) | 2012-10-01 | 2012-10-01 | 多層熱回復物品 |
JP2012-218990 | 2012-10-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2014054409A1 true WO2014054409A1 (ja) | 2014-04-10 |
Family
ID=50434739
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2013/074954 WO2014054409A1 (ja) | 2012-10-01 | 2013-09-16 | 多層熱回復物品 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20150004408A1 (ja) |
EP (1) | EP2905132B1 (ja) |
JP (1) | JP5711713B2 (ja) |
CN (1) | CN103974828B (ja) |
WO (1) | WO2014054409A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015151928A1 (ja) * | 2014-03-31 | 2015-10-08 | 住友電気工業株式会社 | 多層熱回復物品、ワイヤスプライス及びワイヤハーネス、並びに多層熱回復物品用接着剤の製造方法 |
WO2016009904A1 (ja) * | 2014-07-15 | 2016-01-21 | 住友電工ファインポリマー株式会社 | 熱収縮チューブ及び熱収縮キャップ並びに電線束の防水方法 |
WO2016033185A1 (en) * | 2014-08-27 | 2016-03-03 | 3M Innovative Properties Company | Inorganic multilayer lamination transfer films |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6002027B2 (ja) | 2012-12-20 | 2016-10-05 | 住友電気工業株式会社 | 多層熱回復物品、ワイヤスプライス及びワイヤハーネス |
JP5651161B2 (ja) | 2012-12-20 | 2015-01-07 | 住友電気工業株式会社 | 多層熱回復物品、ワイヤスプライス及びワイヤハーネス |
JP5771254B2 (ja) * | 2013-09-26 | 2015-08-26 | 住友電気工業株式会社 | 多層熱回復物品、ワイヤスプライス及びワイヤハーネス |
JP5824497B2 (ja) | 2013-11-06 | 2015-11-25 | 住友電気工業株式会社 | 熱回復物品、ワイヤスプライス及びワイヤハーネス |
CN104968714B (zh) * | 2013-11-06 | 2019-04-23 | 住友电气工业株式会社 | 热复原物品、接线和线束 |
TW201618961A (zh) | 2014-08-27 | 2016-06-01 | 3M新設資產公司 | 電多層層壓轉印膜 |
GB2550939A (en) * | 2016-06-01 | 2017-12-06 | Ultra Electronics Ltd | Flexible hose |
DE102020130402A1 (de) * | 2020-11-18 | 2022-05-19 | Dr. Ing. H.C. F. Porsche Aktiengesellschaft | Flexibles Leiterelement |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05214305A (ja) * | 1991-07-26 | 1993-08-24 | Sumitomo Electric Ind Ltd | 難燃性接着剤及び熱収縮性チューブ |
JPH08230037A (ja) | 1994-11-04 | 1996-09-10 | Sumitomo Electric Ind Ltd | 接着性チューブ、複合チューブ及びそれを用いた封止方法 |
WO1999035206A1 (fr) * | 1998-01-12 | 1999-07-15 | Sumitomo Electric Industries, Ltd. | Composition de resine adhesive et articles thermoretractables realises avec cette composition |
JP2000129042A (ja) | 1998-10-23 | 2000-05-09 | Sumitomo Electric Ind Ltd | アイオノマーと直鎖状ポリオレフィンを用いた熱回復物品 |
CN1789362A (zh) * | 2005-12-28 | 2006-06-21 | 上海应用技术学院 | 有机化蒙脱土改性乙烯-醋酸乙烯热熔胶粘剂的一步制备法 |
JP2011148876A (ja) * | 2010-01-20 | 2011-08-04 | Tosoh Corp | エチレン−酢酸ビニル共重合体樹脂組成物及びそれからなるホットメルト接着剤 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ATE159270T1 (de) * | 1991-08-12 | 1997-11-15 | Allied Signal Inc | Bildung polymerer nanokomposite aus blättrigem schichtmaterial durch ein schmelzverfahren |
JP3591848B2 (ja) * | 1992-08-05 | 2004-11-24 | 住友電気工業株式会社 | チュ−ブ |
US5914160A (en) * | 1994-11-04 | 1999-06-22 | Sumitomo Electric Industries, Ltd. | Adhesive tube composite tube and method for sealing using the same |
GB9518950D0 (en) * | 1995-09-15 | 1995-11-15 | Solvay Interox Ltd | Polymers having improved processability |
JP3599472B2 (ja) * | 1996-03-21 | 2004-12-08 | オリヱント化学工業株式会社 | 黒色ポリアミド樹脂組成物 |
WO1999010422A1 (en) * | 1997-08-27 | 1999-03-04 | The Dow Chemical Company | Rheology modification of low density polyethylene |
US6548587B1 (en) * | 1998-12-07 | 2003-04-15 | University Of South Carolina Research Foundation | Polyamide composition comprising a layered clay material modified with an alkoxylated onium compound |
DE10130889A1 (de) * | 2001-06-27 | 2003-01-30 | Henkel Teroson Gmbh | Kleb-/ Dichtstoffe mit hohem elektrischen Widerstand |
FR2836480B1 (fr) * | 2002-02-26 | 2005-04-01 | Atofina | Adhesifs thermofusibles a base de copolymeres greffes a blocs polyamides |
JP2004358696A (ja) * | 2003-06-02 | 2004-12-24 | Ube Ind Ltd | ポリアミド系燃料チュ−ブ |
KR101399699B1 (ko) * | 2005-03-17 | 2014-05-27 | 다우 글로벌 테크놀로지스 엘엘씨 | 관능화된 에틸렌/α-올레핀 혼성중합체 조성물 |
WO2007033115A1 (en) * | 2005-09-12 | 2007-03-22 | Dow Global Technologies Inc. | Automotive parts prepared from ethylene/alpha -olefins compositions |
US20080057313A1 (en) * | 2006-09-01 | 2008-03-06 | Sirarpi Bicakci-Jenkins | Thermoset Cross-Linked Polymeric Compositions And Method Of Manufacture |
US9038034B2 (en) * | 2009-12-22 | 2015-05-19 | Intel Corporation | Compiling for programmable culling unit |
JP6002027B2 (ja) * | 2012-12-20 | 2016-10-05 | 住友電気工業株式会社 | 多層熱回復物品、ワイヤスプライス及びワイヤハーネス |
JP5651161B2 (ja) * | 2012-12-20 | 2015-01-07 | 住友電気工業株式会社 | 多層熱回復物品、ワイヤスプライス及びワイヤハーネス |
-
2012
- 2012-10-01 JP JP2012218990A patent/JP5711713B2/ja active Active
-
2013
- 2013-09-16 US US14/365,644 patent/US20150004408A1/en not_active Abandoned
- 2013-09-16 WO PCT/JP2013/074954 patent/WO2014054409A1/ja active Application Filing
- 2013-09-16 EP EP13844472.4A patent/EP2905132B1/en active Active
- 2013-09-16 CN CN201380004126.XA patent/CN103974828B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05214305A (ja) * | 1991-07-26 | 1993-08-24 | Sumitomo Electric Ind Ltd | 難燃性接着剤及び熱収縮性チューブ |
JPH08230037A (ja) | 1994-11-04 | 1996-09-10 | Sumitomo Electric Ind Ltd | 接着性チューブ、複合チューブ及びそれを用いた封止方法 |
WO1999035206A1 (fr) * | 1998-01-12 | 1999-07-15 | Sumitomo Electric Industries, Ltd. | Composition de resine adhesive et articles thermoretractables realises avec cette composition |
JP2000129042A (ja) | 1998-10-23 | 2000-05-09 | Sumitomo Electric Ind Ltd | アイオノマーと直鎖状ポリオレフィンを用いた熱回復物品 |
CN1789362A (zh) * | 2005-12-28 | 2006-06-21 | 上海应用技术学院 | 有机化蒙脱土改性乙烯-醋酸乙烯热熔胶粘剂的一步制备法 |
JP2011148876A (ja) * | 2010-01-20 | 2011-08-04 | Tosoh Corp | エチレン−酢酸ビニル共重合体樹脂組成物及びそれからなるホットメルト接着剤 |
Non-Patent Citations (1)
Title |
---|
See also references of EP2905132A4 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015151928A1 (ja) * | 2014-03-31 | 2015-10-08 | 住友電気工業株式会社 | 多層熱回復物品、ワイヤスプライス及びワイヤハーネス、並びに多層熱回復物品用接着剤の製造方法 |
US9393755B2 (en) | 2014-03-31 | 2016-07-19 | Sumitomo Electric Industries, Ltd. | Multilayered heat-recoverable article, wire splice, wire harness, and method for producing adhesive for multilayered heat-recoverable article |
JPWO2015151928A1 (ja) * | 2014-03-31 | 2017-04-13 | 住友電気工業株式会社 | 多層熱回復物品、ワイヤスプライス及びワイヤハーネス、並びに多層熱回復物品用接着剤の製造方法 |
WO2016009904A1 (ja) * | 2014-07-15 | 2016-01-21 | 住友電工ファインポリマー株式会社 | 熱収縮チューブ及び熱収縮キャップ並びに電線束の防水方法 |
CN106457738A (zh) * | 2014-07-15 | 2017-02-22 | 住友电工超效能高分子股份有限公司 | 热收缩管、热收缩帽以及电线束的防水方法 |
US10269472B2 (en) | 2014-07-15 | 2019-04-23 | Sumitomo Electric Fine Polymer, Inc. | Heat-shrinkable tube, heat-shrinkable cap, and method of waterproofing electrical wire bundle |
WO2016033185A1 (en) * | 2014-08-27 | 2016-03-03 | 3M Innovative Properties Company | Inorganic multilayer lamination transfer films |
US9776384B2 (en) | 2014-08-27 | 2017-10-03 | 3M Innovative Properties Company | Inorganic multilayer lamination transfer films |
Also Published As
Publication number | Publication date |
---|---|
EP2905132A4 (en) | 2016-06-01 |
EP2905132B1 (en) | 2020-06-17 |
CN103974828A (zh) | 2014-08-06 |
EP2905132A1 (en) | 2015-08-12 |
JP5711713B2 (ja) | 2015-05-07 |
JP2014069522A (ja) | 2014-04-21 |
CN103974828B (zh) | 2016-05-18 |
US20150004408A1 (en) | 2015-01-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5711713B2 (ja) | 多層熱回復物品 | |
EP2937873B1 (en) | Multilayered heat recoverable article, wire splice and wire harness | |
US9525281B2 (en) | Multilayered heat-recoverable article, wire splice, and wire harness | |
CA2535503C (en) | Heat shrinkable laminated covering | |
US9692222B2 (en) | Heat-recoverable article, wire splice, and wire harness | |
JP5824497B2 (ja) | 熱回復物品、ワイヤスプライス及びワイヤハーネス | |
JP6717808B2 (ja) | 熱回復物品、熱回復物品の製造方法、ワイヤスプライス及びワイヤハーネス | |
CN105246677B (zh) | 多层热可逆物品、线结、线束和用于制造多层热可逆物品用胶粘剂的方法 | |
EP3050699B1 (en) | Multilayer heat recovery article, wire splice and wire harness | |
CN106589569A (zh) | 一种无卤阻燃防粘黏热缩套管及其制备方法 | |
JP2018100311A (ja) | 熱回復物品、熱回復物品の製造方法、ワイヤスプライス及びワイヤハーネス |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 13844472 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 14365644 Country of ref document: US |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2013844472 Country of ref document: EP |
|
NENP | Non-entry into the national phase |
Ref country code: DE |