WO2014042430A1 - Procédé de régénération d'un agent de polissage contenant de l'oxyde de cérium usé - Google Patents

Procédé de régénération d'un agent de polissage contenant de l'oxyde de cérium usé Download PDF

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Publication number
WO2014042430A1
WO2014042430A1 PCT/KR2013/008221 KR2013008221W WO2014042430A1 WO 2014042430 A1 WO2014042430 A1 WO 2014042430A1 KR 2013008221 W KR2013008221 W KR 2013008221W WO 2014042430 A1 WO2014042430 A1 WO 2014042430A1
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WO
WIPO (PCT)
Prior art keywords
ceria
abrasive
containing waste
regenerating
sludge
Prior art date
Application number
PCT/KR2013/008221
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English (en)
Korean (ko)
Inventor
곽익순
조승범
노준석
김종필
문원재
Original Assignee
주식회사 엘지화학
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 주식회사 엘지화학 filed Critical 주식회사 엘지화학
Priority to CN201380047642.0A priority Critical patent/CN104619433B/zh
Priority to JP2015531850A priority patent/JP5943529B2/ja
Priority claimed from KR1020130108822A external-priority patent/KR101539420B1/ko
Publication of WO2014042430A1 publication Critical patent/WO2014042430A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
    • B09B—DISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
    • B09B3/00—Destroying solid waste or transforming solid waste into something useful or harmless
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
    • B09B—DISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
    • B09B3/00—Destroying solid waste or transforming solid waste into something useful or harmless
    • B09B3/40—Destroying solid waste or transforming solid waste into something useful or harmless involving thermal treatment, e.g. evaporation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
    • B09B—DISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
    • B09B5/00—Operations not covered by a single other subclass or by a single other group in this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se

Definitions

  • the present invention relates to a regeneration method of ceria-containing waste abrasive. More specifically, the present invention effectively removes impurities contained in ceria-containing waste abrasives, while allowing ceria-containing waste abrasives to be recycled to ceria-containing regenerated abrasives having an appropriate particle size distribution and crystal size, and thus a desired polishing rate. It is about a reproduction method of.
  • TV CRT tubes and TFT-LCD glass substrates used as liquid crystal panels are produced with poor surface flatness and roughness due to the increase in production process.
  • original glass is used as TV CRT tubes or liquid crystal panel glass substrates.
  • the TFT-LCD glass panel used as a liquid crystal panel has been examined in various ways to improve the brightness, viewing angle and contrast of the product, and such characteristics are affected by the surface of the glass substrate for TFT-LCD. It is known to receive.
  • companies producing glass substrates are making efforts to improve the surface of glass substrates, and various glass substrate abrasives are used.
  • an abrasive containing ceria (Ce0 2 ) is widely used as a general abrasive.
  • Such ceramic containing abrasives are disposed of as waste sludge due to a decrease in polishing efficiency after a certain time of glass polishing process. This is because, after a certain time of polishing, the polishing efficiency of the abrasive decreases and there is a possibility that a large amount of scratches may occur due to the generation of a bend between the abrasive particles.
  • impurities derived from the polishing pad generated in the polishing process are introduced into the abrasive slurry to further increase the possibility of scratching.
  • the present invention provides a method for regenerating waste material containing ceria that effectively removes impurities contained in ceria-containing waste abrasive material and enables regeneration to ceria-containing recycled abrasive material having an appropriate particle size distribution and crystal size, and thus a desired polishing rate. To provide.
  • the present invention comprises the steps of dissolving ceria (Ce0 2 ) -containing waste sludge in a solvent solution containing a strong base and hydrofluoric acid; Cleaning the ceria-containing waste sludge to remove silica (Si0 2 ) -containing impurities; Drying the washed ceria-containing waste sludge in a compact disc dreyer; And calcining the waste sludge to a temperature of 80 CTC or more in the presence of a flux comprising ammonium salt, alkali metal salt, metal oxide, metal oxyacid or alkaline earth metal salt.
  • a flux comprising ammonium salt, alkali metal salt, metal oxide, metal oxyacid or alkaline earth metal salt.
  • dissolving ceria (Ce0 2 ) -containing waste sludge in a dissolving solution containing a strong base and hydrofluoric acid Cleaning the ceria-containing waste sludge to remove silica (Si0 2 ) -containing impurities; The washed ceria-containing waste sludge was subjected to a compact disc dreyer. Drying; And calcining the waste sludge to a temperature of 800 ° C. or higher in the presence of a flux comprising ammonium salt, alkali metal salt, metal oxide, metal oxyacid or alkaline earth metal salt.
  • the ceria-containing waste sludge derived from the waste abrasive is dissolved in a predetermined solution of a solvent to dissolve impurities derived from a glass substrate, and the like.
  • the ceria-containing waste abrasive material can be recycled into regenerated abrasives.
  • the drying process is carried out in a compact disc dreyer instead of a conventional oven dryer, the high temperature firing using a predetermined flux in the firing process to the waste containing ceria
  • the abrasive can be recycled.
  • Such drying and firing processes mainly dry the moisture used in the solvent solution treatment and cleaning process for removing the impurities, restore the surface state of the recycled abrasive, and also include impurities or metal-containing impurities derived from polishing pads or back pads. To further remove other impurities.
  • the pad impurities can be removed more efficiently, while optimizing the particle size distribution and crystal size of the reclaimed abrasive, And it was confirmed that the formation of the macroparticles according to this can be suppressed.
  • an oven drying method using a conventional oven dryer may require a filter press process as a previous step and a subsequent crushing process, which requires a process, to increase process cost and decrease yield.
  • the CD dryer instead of the oven drying method it is possible to process several steps in one process and to increase the yield. Therefore, according to the regeneration method of one embodiment, the waste abrasive containing ceria Effective removal of the contained impurities allows for the regeneration and recycling of recycled abrasives, exhibiting an appropriate particle size distribution and crystal size, and thus a desired polishing rate, and reduced scratching by large particles.
  • the efficiency and yield of these regeneration processes can also be significantly improved.
  • FIG. 1 schematically illustrates an example of a method for regenerating waste ceria-containing waste abrasive according to one embodiment at each step.
  • the ceria-containing waste abrasive and the waste sludge derived therefrom may be derived from a ceria-containing abrasive used for polishing a glass substrate in a TFT-LCD manufacturing process.
  • the ceria-containing waste sludge and the like include silica (SiO 2 ) and alumina (Al 2 O 3 ) derived from a glass substrate as main impurities.
  • the waste sludge or waste abrasive material may include, as impurities, various polishing pads that have undergone polishing, various organic substances derived from back pads used to support the glass substrate to be polished, and the like.
  • a metal component-containing impurity such as nickel (Ni).
  • a process of dissolving ceria (CeO 2 ) -containing waste sludge in a dissolving solution containing a strong base and hydrofluoric acid may be performed.
  • sodium hydroxide or potassium hydroxide may be used as the strong base, which may dissolve impurities such as silica derived from the glass substrate.
  • the hydrofluoric acid is mainly glass As a component used as an etching solution, this can also dissolve impurities such as silica and alumina derived from the glass substrate.
  • a dissolving solution containing a strong base and hydrofluoric acid for example, a strong base such as sodium hydroxide or potassium hydroxide, and an aqueous solution of a dissolving agent containing hydrofluoric acid
  • Impurities, such as silica or alumina, derived from glass substrates may be dissolved by the dissolving agent and separated from the waste sludge.
  • the concentration of the strong base and the hydrofluoric acid in the solution solution can be appropriately adjusted.
  • the strong base and / or hydrofluoric acid are each about 0.01 to 20 M, or about 0.1 to It is suitably included at a concentration of 15M, or about 1-10M.
  • the concentrations of the strong base and the hydrofluoric acid are too low, the removal efficiency of impurities may be lowered.
  • the concentration of the strong base and the hydrofluoric acid is too high, the amount of the raw material used may increase unnecessarily.
  • black may further include a step of solid-liquid separation by treating the waste sludge treated with the solvent solution by a method such as centrifugation, filtration or sedimentation during the progress of the washing process.
  • the waste sludge and glass substrate-containing impurities such as silica or alumina dissolved in the solvent solution are solid-liquid separated to remove and remove impurities from the waste sludge, deionized water, water or
  • the impurities can be more completely removed through the progress of the cleaning process using other aqueous solvents.
  • the process such as centrifugation, filtration or sedimentation, containing ceria-containing waste sludge from which impurities are removed by a conventional centrifugation process, and containing pure water Separation of the liquid component (centrifugal separation process), sedimentation of the ceria-containing waste sludge from which the impurities have been removed, and separation of the liquid component containing impurities therefrom (sedimentation process), or ceria from which the impurities are removed using a filter or the like. It is possible to proceed by a method such as filtration and separation (filtration step) of the liquid component containing impurities from the containing waste sludge. In addition, of course, the centrifugation, filtration, or settling may be performed in combination of two or more.
  • the washing step using the aqueous solvent in order to more effectively wash and remove impurities dissolved in the solvent solution, it can proceed to the aqueous medium adjusted to pH 1 to 4 or pH 10 to 14.
  • an acid or a base may be appropriately dissolved in the water or deionized water and used as a washing liquid.
  • the flux to be used in the sintering process to be described later may be added to the waste sludge to be recycled.
  • the washed ceria-containing waste sludge may be dried with a CD disc (Compact Disc dreyer).
  • the water used in the above-described solvent solution treatment process and cleaning process can be dried and removed from the waste sludge from which the impurities have been removed, and the waste sludge subjected to the drying process is about one increase of 0 / ° or less, Or it may be dried to have a water content of about 0 to 1% by weight.
  • the drying process may be performed using a CD dryer, which is a type of disc type dryer, in this drying process.
  • This CD dryer is a type of disk type dryer in which the waste sludge is dried on a rotating disk that is heat-supplied.
  • abrasive particles eg, ceria particles
  • the progress of the drying step can also be improved.
  • the recycled ceria-containing recycled abrasive may have an appropriate average particle size of about 0.5 to 3.0, and the generation of large particles of about 6.0 may be suppressed and scratches may be generated.
  • the drying proceeds efficiently to easily obtain a recycled abrasive having a water content of about 1% by weight or less.
  • the dried waste sludge in the presence of a predetermined flix containing an ammonium salt, alkali metal salt, metal oxide, metal oxygen acid, or alkaline earth metal salt It can proceed to the process of firing at a temperature of about 800 ° C or more.
  • the surface and crystal properties of the ceria-containing abrasive contained in the waste sludge can be restored, thereby increasing the polishing rate of the recycled abrasive, and also used to support the polishing pad or the glass substrate to be polished.
  • Various organic substances derived from the back pad, or other impurities such as metal component-containing impurities such as iron (Fe), chromium (Cr) or nickel (Ni), can be removed.
  • the surface properties or crystal properties of the regenerated abrasive may be adjusted to a desired range after the firing process.
  • the particle size distribution and the crystal size of the recycled abrasive can be controlled to an appropriate range, and generation of macroparticles can be suppressed.
  • such flux is used while the flux is in a content range corresponding to about 1 to 1.5% by weight relative to the weight of the waste sludge. It was found that by using and controlling the temperature of the firing process in the range of about 800 to 900 ° C., the particle size distribution and crystal size of the recycled abrasive can be more optimized.
  • the particle size distribution and crystal size of the recycled abrasive are about Optimized to a crystal size of from 3.0 to 3.0, or from about 1.0 ai to 3.0 and from about 60 to 90 nm, or from about 70 to 90 nm, while the production of macroparticles is suppressed, so that the polishing rate of the recycled abrasive is controlled well and the formation of macroparticles The occurrence of scratches can be suppressed.
  • the recycled abrasive obtained by the method of one embodiment can be used more preferably.
  • the flux may be ammonium salts such as ammonium fluoride, ammonium chloride, ammonium phosphate or ammonium sulfate; Alkali metal salts or alkaline earth metal salts such as sodium chloride, sodium fluoride, sodium hydroxide, potassium hydroxide potassium chloride, sodium borate or barium chloride; Metal oxides such as boron oxide; It may be a metal oxygen acid such as boric acid (H 3 B0 3 ), may be used together two or more selected from them.
  • ammonium salts such as ammonium fluoride, ammonium chloride, ammonium phosphate or ammonium sulfate
  • Alkali metal salts or alkaline earth metal salts such as sodium chloride, sodium fluoride, sodium hydroxide, potassium hydroxide potassium chloride, sodium borate or barium chloride
  • Metal oxides such as boron oxide
  • It may be a metal oxygen acid such as boric acid (H 3 B0 3 ), may be used together two or
  • the surface characteristics or crystal properties of the regenerated abrasive material can be adjusted to a desired range, so that the particle size distribution and the crystal size of the regenerated abrasive material can be controlled to an appropriate range. have.
  • the flux may be wet mixed in the previously advanced cleaning step, or dry mixed immediately before the firing process, and may be wet mixed in the cleaning step as appropriate.
  • the firing step may be performed for about 1 to 4 hours at the above-mentioned temperature.
  • an optimized ceria-containing regenerated abrasive having a crystal size of about 60 to 90 nm and an average particle size of about 0.5 to 3.0 / zm and suppressing the formation of large particles can be obtained. If the crystal size or the average particle size is too small, the polishing rate of the regenerated abrasive may be uneven. On the contrary, if the crystal size or the average particle size is too large, Scratch may occur in the polishing process using the regenerated abrasive, or the grinding and classification process that proceeds as necessary after the firing process may be unnecessarily inefficient.
  • the efficiency of the regeneration process is greatly reduced, and the surface characteristics of the regenerated abrasive are rather damaged during the progress of the grinding process.
  • the properties of the recycled abrasive may be degraded.
  • the grinding or classification process may be further performed. It may proceed in a manner well known to those skilled in the art.
  • the grinding process may be performed using a jet-mill, etc.
  • the classification process may be performed using a wind classifier such as a cyclone, a dry classifier, a dipole or a tripole tip. This can be done using a classifier or sieve for classifying.
  • a ceria-containing regenerated abrasive material can be obtained in which impurities are substantially completely effectively removed, exhibiting an optimized crystal size and particle size distribution, and suppressed generation of large particles even before the grinding or classification process. Therefore, such ceria-containing regenerated abrasives can be used alone or in combination with new abrasives, and can be recycled for polishing of glass substrates for LCDs, etc., which can contribute greatly to the economics and yield of the process.
  • the present invention while effectively removing impurities contained in the ceria-containing waste abrasive, it exhibits an appropriate particle size distribution and crystal size, and thus a desired polishing rate, and regenerates and recycles the recycled abrasive having reduced scratches caused by the large particles.
  • FIG. 1 is a view schematically showing an example of a method for regenerating waste ceria-containing waste abrasive according to one embodiment for each step.
  • FIG. 2 is a graph showing particle size distribution of ceria-containing regenerated abrasive dried and regenerated in a CD dryer in Examples 1 and 2.
  • FIG. 1 is a view schematically showing an example of a method for regenerating waste ceria-containing waste abrasive according to one embodiment for each step.
  • FIG. 2 is a graph showing particle size distribution of ceria-containing regenerated abrasive dried and regenerated in a CD dryer in Examples 1 and 2.
  • FIG. 1 is a view schematically showing an example of a method for regenerating waste ceria-containing waste abrasive according to one embodiment for each step.
  • FIG. 2 is a graph showing particle size distribution of ceria-containing regenerated abrasive dried and regenerated in a CD dryer in Examples 1 and 2.
  • FIG. 3 is a graph showing the particle size distribution of ceria-containing regenerated abrasive dried and dried in an oven dryer in Comparative Example 1.
  • FIG. 4 is an SEM photograph of the recycled abrasive obtained in Example 2.
  • FIG. 5 is an SEM photograph of the recycled abrasive obtained in Comparative Example 2.
  • the waste sludge containing ceria (Ce0 2 ) was dissolved in an aqueous solution of a dissolving agent containing hydrofluoric acid and sodium hydroxide at a concentration of 10 M, respectively. Subsequently, the resultant was centrifuged with a centrifuge (product name: Supra22k, Hanil Cimed) to solid-liquid separation, and the waste sludge was washed with deionized water adjusted to pH 7 to remove impurities from glass substrates such as silica and alumina Separated and removed from the sludge.
  • a centrifuge product name: Supra22k, Hanil Cimed
  • the drying process was carried out for 10 seconds at a temperature of 12CTC under a rotation of 3rpm. After the drying process, it was confirmed that the water content of the waste sludge is 1% by weight or less.
  • the particle size distribution after the drying process was measured by a particle size analyzer (product name: LA950, Horiba) and illustrated by the black line in FIG. 2. In addition, it was confirmed that it was about 2.28 as a result of the average particle size measurement at this time.
  • the drying process was carried out in the same manner as in Example 1, except that the rotation speed of the CD dryer was 7 rpm. After the drying process, it was confirmed that the water content of the waste sludge became 1 weight 0 /. Or less.
  • the particle size distribution after the drying process was measured by a particle size analyzer (product name: LA950, Horiba) and illustrated as a red line in FIG. 2. Moreover, it was confirmed that it was about 1.73 // m as a result of the average particle size measurement at this time.
  • Example 3 Regeneration of Ceria-containing Waste Abrasives
  • Example 3 The regenerated abrasive of Example 3 was obtained in the same manner as in Example 2, except that the firing temperature was 80 CTC.
  • Example 4 Regeneration of Ceria-Containing Waste Abrasives
  • Example 4 Regeneration of Example 4 in the same manner as in Example 2, except that 1.5% by weight of ammonium fluoride (relative to the weight of the waste sludge targeted for the first regeneration) was added in the washing process and the firing process was carried out in the presence thereof. An abrasive was obtained.
  • Example 5 Regeneration of Ceria-Containing Waste Abrasives
  • Example 6 KOH 1.5 weight 0 / ⁇ instead of 1 weight 0 / ⁇
  • the recycled abrasive of Example 6 was obtained in the same manner as in Example 2, except that the weight of the waste sludge to be recycled) was added and the firing process was carried out in the presence thereof.
  • Comparative Example 1 Regeneration of Ceria-Containing Waste Abrasives
  • the drying process was carried out in the same manner as in Example 1, except that the drying process was performed for 24 hours at a temperature of 150 ° C. using the Obon dryer instead of the CD dryer. After the drying step, it was confirmed that the water content of the waste sludge became 1 weight 0 /. Or less.
  • the particle size distribution after the drying process was measured by a particle size analyzer (product name: LA950, Horiba) and illustrated as a red line in FIG. 3.
  • a large number of large particles of about 6.34 / ai and more than about 10 were present.
  • the regenerated abrasive of Comparative Example 2 was obtained in the same manner as in Example 2, except that the firing process was performed without adding ammonium fluoride in the washing process and without the ammonium fluoride at a firing temperature of 950 ° C. 2 and 3 and the average particle size measurement results of Examples 1 and 2 and Comparative Example 1 described above. It has been found that recycled abrasives can be obtained, and the production of large particles that can cause scratches is also greatly reduced. In particular, it was confirmed in Example 2 that the rotational speed of the CD dryer is 7 rpm, the generation of large particles due to the aggregation between particles is further reduced, and the average particle size can be more optimized.
  • Comparative Example 1 in which the drying process was performed with an oven dryer, a large number of coarse particles were generated during the drying process, so that the average particle size was very large, and as shown in FIG. 3, the particle size exceeded about 10 or more. A large number of large particles were found to exist. Therefore, when polishing was performed with the regenerated abrasive obtained in Comparative Example 1, it was confirmed that scratching was likely to occur, or it was necessary to excessively grind or classify the process in order to reduce large particles.
  • the crystal size was measured by the method of Sherrer equation ( ⁇ os & ), and the average particle size of each recycled abrasive was measured by a particle size analyzer (product name: LA950, Horiba). In addition, the polishing rate using the recycled abrasive was measured. Polishing rate was measured by the ratio with respect to the polishing rate before regeneration.
  • Table 1 The measurement results for the crystal size, average particle size and polishing rate are summarized in Table 1 below. 4 and 5 show SEM photographs of the reclaimed abrasives obtained in Example 2 and Comparative Example 2.
  • the regenerated abrasive of Example 2 in which the firing temperature was further optimized and the flux was used, showed a desirable surface shape as the abrasive, and formation of large particles was not observed.
  • the regenerated abrasives were found to have a relatively high firing temperature and no flux was used, so that the formation of large particles was observed, resulting in a high probability of scratching.

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  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)

Abstract

La présente invention concerne un procédé de régénération d'un agent de polissage contenant de l'oxyde de cérium usé, le procédé permettant la régénération en tant qu'agent de polissage contenant de l'oxyde de cérium régénéré, présentant une distribution granulaire et une taille des cristaux appropriées et présentant un taux de polissage souhaité conforme, tout en supprimant efficacement les impuretés contenues dans l'agent de polissage contenant de l'oxyde de cérium usé. L'invention concerne un procédé de régénération de l'agent de polissage contenant de l'oxyde de cérium usé comprenant les étapes consistant : à dissoudre de la boue contenant de l'oxyde de cérium (CeO2) usé dans un solvant contenant un alcali fort et de l'acide fluorhydrique ; à nettoyer la boue contenant de l'oxyde de cérium usé et à supprimer la silice (SiO2) contenant des impuretés ; à sécher la boue contenant de l'oxyde de cérium usé épurée au moyen d'un séchoir à disque compact (CD) ; et, en présence d'un flux comprenant un sel d'ammonium, un sel métallique alcalin, un oxyde métallique, un acide d'oxygène métallique ou un métal alcalino-terreux, à fritter la boue usée à une température supérieure ou égale à 800 °C.
PCT/KR2013/008221 2012-09-13 2013-09-11 Procédé de régénération d'un agent de polissage contenant de l'oxyde de cérium usé WO2014042430A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201380047642.0A CN104619433B (zh) 2012-09-13 2013-09-11 含氧化铈废磨料的再生方法
JP2015531850A JP5943529B2 (ja) 2012-09-13 2013-09-11 セリア含有廃研磨材の再生方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20120101731 2012-09-13
KR10-2012-0101731 2012-09-13
KR10-2013-0108822 2013-09-11
KR1020130108822A KR101539420B1 (ko) 2012-09-13 2013-09-11 세리아 함유 폐연마재의 재생 방법

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003094337A (ja) * 2001-09-21 2003-04-03 E & E:Kk ウエハ研磨廃液の処理方法と、その再利用管理システム
KR20080036816A (ko) * 2006-10-24 2008-04-29 동우 화인켐 주식회사 디스플레이용 유리패널의 연마를 위한 폐연마재의 재생방법
KR20090097323A (ko) * 2008-03-11 2009-09-16 허인랑 슬러리 재생장치 및 그 재생방법
KR101051207B1 (ko) * 2011-02-09 2011-07-21 윤종훈 희토류 금속 산화물을 기반으로 하는 ｌｃｄ 및 ｐｄｐ 유리패널용 재생 무기 연마재 및 이를 제조하기 위한 무기 연마재 폐슬러지 재생 방법
KR20120021478A (ko) * 2010-08-03 2012-03-09 주식회사 랜코 세리아계 연마재의 재생방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003094337A (ja) * 2001-09-21 2003-04-03 E & E:Kk ウエハ研磨廃液の処理方法と、その再利用管理システム
KR20080036816A (ko) * 2006-10-24 2008-04-29 동우 화인켐 주식회사 디스플레이용 유리패널의 연마를 위한 폐연마재의 재생방법
KR20090097323A (ko) * 2008-03-11 2009-09-16 허인랑 슬러리 재생장치 및 그 재생방법
KR20120021478A (ko) * 2010-08-03 2012-03-09 주식회사 랜코 세리아계 연마재의 재생방법
KR101051207B1 (ko) * 2011-02-09 2011-07-21 윤종훈 희토류 금속 산화물을 기반으로 하는 ｌｃｄ 및 ｐｄｐ 유리패널용 재생 무기 연마재 및 이를 제조하기 위한 무기 연마재 폐슬러지 재생 방법

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