WO2014041941A1 - 基板処理装置及びデバイス製造方法 - Google Patents

基板処理装置及びデバイス製造方法 Download PDF

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Publication number
WO2014041941A1
WO2014041941A1 PCT/JP2013/071823 JP2013071823W WO2014041941A1 WO 2014041941 A1 WO2014041941 A1 WO 2014041941A1 JP 2013071823 W JP2013071823 W JP 2013071823W WO 2014041941 A1 WO2014041941 A1 WO 2014041941A1
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WO
WIPO (PCT)
Prior art keywords
substrate
temperature
processing apparatus
medium
pattern
Prior art date
Application number
PCT/JP2013/071823
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
鈴木　智也
Original Assignee
株式会社ニコン
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社ニコン filed Critical 株式会社ニコン
Priority to KR1020157006339A priority Critical patent/KR101861904B1/ko
Priority to KR1020187028868A priority patent/KR101923360B1/ko
Priority to JP2014535457A priority patent/JP6256338B2/ja
Priority to KR1020187007927A priority patent/KR101890099B1/ko
Priority to KR1020187018983A priority patent/KR101908269B1/ko
Priority to KR1020187033760A priority patent/KR101973349B1/ko
Priority to CN201380047645.4A priority patent/CN104620178B/zh
Publication of WO2014041941A1 publication Critical patent/WO2014041941A1/ja
Priority to HK15107671.4A priority patent/HK1207162A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/24—Curved surfaces

Definitions

  • the present invention relates to a substrate processing apparatus and a device manufacturing method for processing a substrate on a curved surface of a substrate support member.
  • Patent Document 1 In an exposure apparatus used in a photolithography process, an exposure apparatus that exposes a substrate by rotating a cylindrical or columnar mask as disclosed in the following Patent Document is known (for example, Patent Document 1). reference).
  • the position of the mask pattern can be used to satisfactorily project and expose an image of the mask pattern onto the substrate. Information needs to be obtained accurately. Therefore, it is desired to devise a technique that can accurately acquire positional information of a cylindrical or columnar mask and can accurately adjust the positional relationship between the mask and the substrate.
  • a position information acquisition mark (scale, grid, etc.) is formed in a predetermined position on the pattern forming surface of the mask with a predetermined positional relationship with respect to the pattern.
  • a configuration is disclosed in which the position information of the pattern in the circumferential direction of the pattern forming surface or the position information in the direction of the rotation axis of the mask is acquired by detecting the mark.
  • An aspect of the present invention has been made in view of the above circumstances, and an object of the present invention is to provide a substrate processing apparatus and a device manufacturing method that suppress expansion and contraction of a substrate and improve processing accuracy.
  • a substrate support member that has a curved surface curved with a constant radius from a predetermined axis, a portion of the substrate is wound around the curved surface, and supports the substrate, and the substrate as viewed from the axis.
  • a processing unit that is disposed around the substrate support member and that processes the substrate on the curved surface at a specific position in the circumferential direction, and a temperature adjustment device that adjusts the temperature of the substrate before being supplied to the substrate support member A substrate processing apparatus is provided.
  • the second aspect of the present invention there is provided a device manufacturing method for forming a pattern on a substrate using the substrate processing apparatus according to the first aspect of the present invention.
  • the substrate is supported while supporting a part in the longitudinal direction of the flexible elongated substrate along the support surface curved in the longitudinal direction of the substrate support member. Conveying at a predetermined speed in the longitudinal direction, and transferring a pattern constituting the electronic device to the substrate supported by the support surface at a specific position in the longitudinal direction among the support surfaces of the substrate support member And controlling the temperature so that the temperature on the upstream side in the transport direction of the substrate with respect to the support surface of the substrate support member and the temperature on the support surface of the substrate have a predetermined difference.
  • a device manufacturing method is provided.
  • the expansion and contraction of the substrate can be suppressed and the processing accuracy can be improved.
  • FIG. 1 is a diagram illustrating a configuration of a device manufacturing system according to the first embodiment.
  • FIG. 2 is a schematic diagram showing the overall configuration of the processing apparatus (exposure apparatus) according to the first embodiment.
  • FIG. 3 is a schematic diagram showing the arrangement of illumination areas and projection areas in FIG.
  • FIG. 4 is a schematic diagram showing a configuration of a projection optical system applied to the processing apparatus (exposure apparatus) of FIG.
  • FIG. 5 is a perspective view of a rotating drum applied to the processing apparatus (exposure apparatus) of FIG.
  • FIG. 6 is a perspective view for explaining the relationship between a detection probe and a reading device applied to the processing apparatus (exposure apparatus) in FIG.
  • FIG. 7 is an explanatory diagram for explaining the position of the reading device when the scale disk according to the first embodiment is viewed in the rotation center line direction.
  • FIG. 8 is an explanatory diagram for explaining the temperature adjustment device according to the first embodiment.
  • FIG. 9 is an explanatory diagram for explaining an example of the alignment mark.
  • FIG. 10 is an explanatory diagram schematically illustrating an example of a change in the alignment mark due to the expansion and contraction of the substrate.
  • FIG. 11 is a flowchart illustrating an example of a procedure for correcting processing of the processing apparatus (exposure apparatus) according to the first embodiment.
  • FIG. 12 is a schematic diagram showing an overall configuration of a processing apparatus (exposure apparatus) according to the second embodiment.
  • FIG. 13 is a schematic diagram showing an overall configuration of a processing apparatus (exposure apparatus) according to the third embodiment.
  • FIG. 14 is a schematic diagram showing an overall configuration of a processing apparatus (exposure apparatus) according to the fourth embodiment.
  • FIG. 15 is a schematic diagram showing an overall configuration of a processing apparatus (exposure apparatus) according to the fifth embodiment.
  • FIG. 16 is a schematic diagram showing an overall configuration of a processing apparatus (exposure apparatus) according to the sixth embodiment.
  • FIG. 17 is a flowchart showing a device manufacturing method using the processing apparatus (exposure apparatus) according to the first embodiment.
  • a substrate processing apparatus that performs exposure processing on a substrate is an exposure apparatus.
  • the exposure apparatus is incorporated in a device manufacturing system that manufactures devices by performing various processes on the exposed substrate. First, a device manufacturing system will be described.
  • FIG. 1 is a diagram illustrating a configuration of a device manufacturing system according to the first embodiment.
  • a device manufacturing system 1 shown in FIG. 1 is a line (flexible display manufacturing line) for manufacturing a flexible display as a device. Examples of the flexible display include an organic EL display.
  • the device manufacturing system 1 sends out the substrate P from the supply roll FR1 in which the flexible substrate P is wound in a roll shape, and continuously performs various processes on the delivered substrate P.
  • a so-called roll-to-roll system is adopted in which the processed substrate P is wound around the collection roll FR2 as a flexible device.
  • the substrate P which is a film-like sheet
  • the substrates P sent out from the supply roll FR1 are sequentially supplied to n processing apparatuses U1, U2. , U3, U4, U5,... Un, and the example until being wound around the collecting roll FR2.
  • n processing apparatuses U1, U2. , U3, U4, U5,... Un and the example until being wound around the collecting roll FR2.
  • a foil (foil) made of a resin or a metal such as stainless steel or an alloy is used.
  • the resin film material include polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin, and vinyl acetate resin. Includes one or more.
  • the thermal expansion coefficient may be set smaller than a threshold corresponding to the process temperature or the like, for example, by mixing an inorganic filler with a resin film.
  • the inorganic filler may be, for example, titanium oxide, zinc oxide, alumina, silicon oxide or the like.
  • the substrate P may be a single layer of ultrathin glass having a thickness of about 100 ⁇ m manufactured by a float process or the like, or a laminate in which the above resin film, foil, or the like is bonded to the ultrathin glass. It may be.
  • the substrate P configured in this way becomes a supply roll FR1 by being wound in a roll shape, and this supply roll FR1 is mounted on the device manufacturing system 1.
  • the device manufacturing system 1 to which the supply roll FR1 is mounted repeatedly executes various processes for manufacturing one device on the substrate P sent out from the supply roll FR1. For this reason, the processed substrate P is in a state where a plurality of devices are connected. That is, the substrate P sent out from the supply roll FR1 is a multi-sided substrate.
  • the substrate P may be one obtained by modifying and activating the surface in advance by a predetermined pretreatment, or one having a fine partition structure (uneven structure) for precise patterning formed on the surface.
  • the treated substrate P is recovered as a recovery roll FR2 by being wound into a roll.
  • the collection roll FR2 is attached to a dicing device (not shown).
  • the dicing apparatus to which the collection roll FR2 is mounted divides the processed substrate P for each device (dicing) to form a plurality of devices.
  • the dimension in the width direction (short direction) is about 10 cm to 2 m
  • the dimension in the length direction (long direction) is 10 m or more.
  • substrate P is not limited to an above-described dimension.
  • the X direction is a direction connecting the supply roll FR1 and the recovery roll FR2 in the horizontal plane, and is the left-right direction in FIG.
  • the Y direction is a direction orthogonal to the X direction in the horizontal plane, and is the front-rear direction in FIG.
  • the Y direction is the axial direction of the supply roll FR1 and the recovery roll FR2.
  • the Z direction is the vertical direction, and is the vertical direction in FIG.
  • the device manufacturing system 1 includes a substrate supply device 2 that supplies a substrate P, processing devices U1 to Un that perform various processes on the substrate P supplied by the substrate supply device 2, and processing is performed by the processing devices U1 to Un.
  • the substrate recovery apparatus 3 that recovers the substrate P and the host controller 5 that controls each device of the device manufacturing system 1 are provided.
  • the substrate supply device 2 is rotatably mounted with a supply roll FR1.
  • the substrate supply apparatus 2 includes a driving roller DR1 that sends out the substrate P from the mounted supply roll FR1, and an edge position controller EPC1 that adjusts the position of the substrate P in the width direction (Y direction).
  • the driving roller DR1 rotates while sandwiching both front and back surfaces of the substrate P, and feeds the substrate P to the processing apparatuses U1 to Un by feeding the substrate P in the transport direction from the supply roll FR1 to the collection roll FR2.
  • the edge position controller EPC1 sets the substrate P so that the position at the end (edge) in the width direction of the substrate P is within the range of about ⁇ 10 ⁇ m to about ⁇ 10 ⁇ m with respect to the target position.
  • the position of the substrate P in the width direction is corrected by moving P in the width direction.
  • the substrate collection device 3 is rotatably mounted with a collection roll FR2.
  • the substrate collection apparatus 3 includes a drive roller DR2 that draws the processed substrate P toward the collection roll FR2, and an edge position controller EPC2 that adjusts the position of the substrate P in the width direction (Y direction).
  • the substrate collection device 3 rotates while sandwiching the front and back surfaces of the substrate P by the driving roller DR2, pulls the substrate P in the transport direction, and rotates the collection roll FR2, thereby winding the substrate P.
  • the edge position controller EPC2 is configured in the same manner as the edge position controller EPC1, and corrects the position in the width direction of the substrate P so that the end portion (edge) in the width direction of the substrate P does not vary in the width direction. .
  • the processing device U1 is a coating device that applies a photosensitive functional liquid to the surface of the substrate P supplied from the substrate supply device 2.
  • a photosensitive functional liquid for example, a photoresist, a photosensitive silane coupling material, a UV curable resin liquid, or the like is used.
  • the processing apparatus U1 is provided with a coating mechanism Gp1 and a drying mechanism Gp2 in order from the upstream side in the transport direction of the substrate P.
  • the coating mechanism Gp1 includes a pressure drum roller R1 around which the substrate P is wound, and a coating roller R2 facing the pressure drum roller R1.
  • the coating mechanism Gp1 sandwiches the substrate P between the impression cylinder roller R1 and the application roller R2 in a state where the supplied substrate P is wound around the impression cylinder roller R1.
  • the application mechanism Gp1 applies the photosensitive functional liquid by the application roller R2 while rotating the impression cylinder roller R1 and the application roller R2 to move the substrate P in the transport direction.
  • the drying mechanism Gp2 blows drying air such as hot air or dry air, removes the solute (solvent or water) contained in the photosensitive functional liquid, and dries the substrate P coated with the photosensitive functional liquid.
  • a photosensitive functional layer is formed on the substrate P.
  • the processing device U2 is a heating device that heats the substrate P conveyed from the processing device U1 to a predetermined temperature (for example, about several tens to 120 ° C.) in order to stabilize the photosensitive functional layer formed on the surface of the substrate P. It is.
  • the processing apparatus U2 is provided with a heating chamber HA1 and a cooling chamber HA2 in order from the upstream side in the transport direction of the substrate P.
  • the heating chamber HA1 is provided with a plurality of rollers and a plurality of air turn bars therein, and the plurality of rollers and the plurality of air turn bars constitute a transport path for the substrate P.
  • the plurality of rollers are provided in rolling contact with the back surface of the substrate P, and the plurality of air turn bars are provided in a non-contact state on the surface side of the substrate P.
  • the plurality of rollers and the plurality of air turn bars are arranged to form a meandering transport path so as to lengthen the transport path of the substrate P.
  • the substrate P passing through the heating chamber HA1 is heated to a predetermined temperature while being transported along a meandering transport path.
  • the cooling chamber HA2 cools the substrate P to the environmental temperature so that the temperature of the substrate P heated in the heating chamber HA1 matches the environmental temperature of the subsequent process (processing apparatus U3).
  • the cooling chamber HA2 is provided with a plurality of rollers, and the plurality of rollers are arranged in a meandering manner in order to lengthen the conveyance path of the substrate P, similarly to the heating chamber HA1.
  • the substrate P passing through the cooling chamber HA2 is cooled while being transferred along a meandering transfer path.
  • a driving roller DR3 is provided on the downstream side in the transport direction of the cooling chamber HA2, and the driving roller DR3 rotates while sandwiching the substrate P that has passed through the cooling chamber HA2, thereby moving the substrate P toward the processing apparatus U3. Supply.
  • the processing apparatus (substrate processing apparatus) U3 projects and exposes a pattern such as a circuit for display or wiring on the substrate (photosensitive substrate) P having a photosensitive functional layer formed on the surface supplied from the processing apparatus U2. It is an exposure apparatus that performs (transfer). Although details will be described later, the processing device U3 is obtained by illuminating a transmissive or reflective cylindrical mask (mask) DM with an illumination light beam, and transmitting or reflecting the illumination light beam by the cylindrical mask (mask) DM. The projection light beam is projected and exposed onto the substrate P.
  • a transmissive or reflective cylindrical mask (mask) DM with an illumination light beam
  • transmitting or reflecting the illumination light beam by the cylindrical mask (mask) DM The projection light beam is projected and exposed onto the substrate P.
  • the processing apparatus U3 includes a driving roller DR4 that sends the substrate P supplied from the processing apparatus U2 to the downstream side in the transport direction, and an edge position controller EPC that adjusts the position of the substrate P in the width direction (Y direction).
  • the drive roller DR4 rotates while pinching both front and back surfaces of the substrate P, and feeds the substrate P toward the exposure position by sending the substrate P downstream in the transport direction.
  • the edge position controller EPC is configured in the same manner as the edge position controller EPC1, and corrects the position of the substrate P in the width direction so that the width direction of the substrate P at the exposure position becomes the target position.
  • the processing device U3 adjusts the temperature of the substrate P supplied by the edge position controller EPC with the temperature adjusting device 60, and then transports the substrate P to the driving roller DR5.
  • the processing apparatus U3 includes a buffer unit DL having two sets of drive rollers DR6 and DR7 that send the substrate P to the downstream side in the transport direction in a state in which the substrate P after exposure is slackened.
  • the two sets of drive rollers DR6 and DR7 are arranged at a predetermined interval in the transport direction of the substrate P.
  • the drive roller DR6 rotates while sandwiching the upstream side of the substrate P to be transported, and the drive roller DR7 rotates while sandwiching the downstream side of the substrate P to be transported to direct the substrate P toward the processing apparatus U4. And supply.
  • the substrate P is provided with a slack, it is possible to absorb fluctuations in the conveyance speed that occur on the downstream side in the conveyance direction with respect to the driving roller DR7, so that the influence of the exposure processing on the substrate P due to the fluctuations in the conveyance speed is cut off. can do.
  • the processing apparatus U3 in order to relatively align (align) the partial image of the mask pattern of the cylindrical mask (mask) DM with the substrate P, an alignment mark or the like previously formed on the substrate P is provided. Alignment microscopes AMG1 and AMG2 for detection are provided.
  • the processing apparatus U4 is a wet processing apparatus that performs wet development processing, electroless plating processing, and the like on the exposed substrate P transferred from the processing apparatus U3.
  • the processing apparatus U4 has three processing tanks BT1, BT2, BT3 hierarchized in the vertical direction (Z direction) and a plurality of rollers for transporting the substrate P therein.
  • the plurality of rollers are arranged so as to serve as a conveyance path through which the substrate P sequentially passes through the three processing tanks BT1, BT2, and BT3.
  • a driving roller DR8 is provided on the downstream side in the transport direction of the processing tank BT3, and the driving roller DR8 rotates while sandwiching the substrate P that has passed through the processing tank BT3, so that the substrate P is directed toward the processing apparatus U5. Supply.
  • the processing apparatus U5 is a drying apparatus which dries the board
  • the processing apparatus U5 adjusts the moisture content adhering to the substrate P wet-processed in the processing apparatus U4 to a predetermined moisture content.
  • the substrate P dried by the processing apparatus U5 is transferred to the processing apparatus Un through several processing apparatuses. Then, after being processed by the processing device Un, the substrate P is wound up on the recovery roll FR2 of the substrate recovery device 3.
  • the host control device 5 performs overall control of the substrate supply device 2, the substrate recovery device 3, and the plurality of processing devices U1 to Un.
  • the host controller 5 controls the substrate supply device 2 and the substrate recovery device 3 to transport the substrate P from the substrate supply device 2 toward the substrate recovery device 3.
  • the host controller 5 controls the plurality of processing apparatuses U1 to Un to execute various processes on the substrate P while synchronizing with the transport of the substrate P.
  • FIG. 2 is a view showing the overall configuration of the exposure apparatus (substrate processing apparatus) of the first embodiment.
  • FIG. 3 is a view showing the arrangement of illumination areas and projection areas of the exposure apparatus shown in FIG.
  • FIG. 4 is a view showing the arrangement of the projection optical system of the exposure apparatus shown in FIG.
  • the processing device U3 includes an exposure device (processing mechanism) EX, a transport device 9, and a temperature adjustment device 60.
  • the exposure apparatus EX is supplied with a substrate P (sheet, film, etc.) by the transport device 9.
  • the exposure apparatus EX is a so-called scanning exposure apparatus, in which the rotation of the cylindrical mask DM and the feeding of the flexible substrate P are synchronously driven, and the pattern magnification formed on the cylindrical mask DM is equal to the projection magnification. Projection is performed on the substrate P through the double ( ⁇ 1) projection optical system PL (PL1 to PL6).
  • ⁇ 1 projection optical system PL PL1 to PL6
  • the Y axis of the XYZ orthogonal coordinate system is set parallel to the rotation center line AX1 of the first drum member 21.
  • the exposure apparatus EX sets the Y axis of the XYZ orthogonal coordinate system in parallel with the rotation center line AX2 of the second drum member 22 that is a rotating drum.
  • the exposure apparatus EX includes a mask holding device 12, an illumination mechanism IU, a projection optical system PL, and a control device 14.
  • the exposure apparatus EX rotates and moves the cylindrical mask DM held by the mask holding apparatus 12 and transfers the substrate P by the transfer apparatus 9.
  • the illumination mechanism IU illuminates a part of the cylindrical mask DM (illumination region IR) held by the mask holding device 12 with a uniform brightness by the illumination light beam EL1.
  • the projection optical system PL projects the image of the pattern in the illumination area IR on the cylindrical mask DM onto a part of the substrate P (projection area PA) being transported by the transport device 9.
  • the control device 14 controls each part of the exposure apparatus EX and causes each part to execute processing. In the present embodiment, the control device 14 controls the transport device 9.
  • the control device 14 may be a part or all of the host control device 5 that controls the plurality of processing devices of the device manufacturing system 1 as described above.
  • the control device 14 may be a device that is controlled by the host control device 5 and is different from the host control device 5.
  • the control device 14 includes, for example, a computer system.
  • the computer system includes, for example, a CPU, various memories, an OS, and hardware such as peripheral devices.
  • the process of operation of each unit of the processing device U3 is stored in a storage unit of a computer-readable recording medium in the form of a program, and various processes are performed by the computer system reading and executing this program.
  • the computer system can be connected to the Internet or an intranet system, it also includes a homepage providing environment (or display environment).
  • Computer-readable recording media include portable media such as flexible disks, magneto-optical disks, ROMs, CD-ROMs, and storage devices such as hard disks built into computer systems.
  • a computer-readable recording medium is one that dynamically holds a program for a short time, such as a communication line when transmitting a program via a network such as the Internet or a communication line such as a telephone line. Some of them hold programs for a certain period of time, such as volatile memory inside computer systems that serve as servers and clients.
  • the program may be a program for realizing a part of the function of the processing device U3, or may be a program capable of realizing the function of the processing device U3 in combination with a program already recorded in the computer system.
  • the host control device 5 can be realized using a computer system in the same manner as the control device 14.
  • the mask holding device 12 includes a first drum member 21 that holds the cylindrical mask DM, a guide roller 23 that supports the first drum member 21, and a first drive unit 26 that receives a control command from the control device 14.
  • a driving roller 24 that drives the first drum member 21 and a first detector 25 that detects the position of the first drum member 21 are provided.
  • the first drum member 21 is a cylindrical member having a curved surface curved with a certain radius from a rotation center line AX1 (hereinafter also referred to as a first center axis AX1) serving as a predetermined axis, and rotates around the predetermined axis. .
  • the first drum member 21 forms a first surface P1 on which the illumination area IR on the cylindrical mask DM is disposed.
  • the first surface P1 includes a surface (hereinafter referred to as a cylindrical surface) obtained by rotating a line segment (bus line) around an axis (first central axis AX1) parallel to the line segment.
  • the cylindrical surface is, for example, an outer peripheral surface of a cylinder, an outer peripheral surface of a column, or the like.
  • the first drum member 21 is made of, for example, glass or quartz and has a cylindrical shape with a certain thickness, and an outer peripheral surface (cylindrical surface) forms the first surface P1. That is, in the present embodiment, the illumination region IR on the cylindrical mask DM is curved in a cylindrical surface shape having a constant radius r1 from the rotation center line AX1. As described above, the first drum member 21 has a curved surface that is curved with a constant radius from the rotation center line AX1 that is a predetermined axis. The first drum member 21 is driven by the drive roller 24 and can rotate around the rotation center line AX1 that is a predetermined axis.
  • the cylindrical mask DM is produced as a transmission type flat sheet mask in which a pattern is formed with a light shielding layer such as chromium on one surface of a strip-shaped ultrathin glass plate having a good flatness (for example, a thickness of 100 ⁇ m to 500 ⁇ m).
  • the mask holding device 12 is used in a state in which the cylindrical mask DM is curved following the curved surface of the outer peripheral surface of the first drum member 21 and is wound (attached) to the curved surface.
  • the cylindrical mask DM has a pattern non-formation region where no pattern is formed, and is attached to the first drum member 21 in the pattern non-formation region. The cylindrical mask DM can be released with respect to the first drum member 21.
  • the cylindrical mask DM is made of an ultrathin glass plate, and instead of winding the cylindrical mask DM around the first drum member 21 made of a transparent cylindrical base material, chromium is directly applied to the outer peripheral surface of the first drum member 21 made of the transparent cylindrical base material.
  • a mask pattern formed by a light shielding layer may be drawn and integrated.
  • the first drum member 21 functions as a support member for the pattern of the cylindrical mask DM.
  • the first detector 25 optically detects the rotational position of the first drum member 21, and is composed of, for example, a rotary encoder.
  • the first detector 25 outputs information indicating the detected rotational position of the first drum member 21, for example, a two-phase signal from an encoder head described later, to the control device 14.
  • the first drive unit 26 including an actuator such as an electric motor adjusts the torque and rotation speed for rotating the drive roller 24 in accordance with a control signal input from the control device 14.
  • the control device 14 controls the rotational position of the first drum member 21 by controlling the first drive unit 26 based on the detection result by the first detector 25. Then, the control device 14 controls one or both of the rotational position and the rotational speed of the cylindrical mask DM held by the first drum member 21.
  • the second drum member 22 is a cylindrical member having a curved surface (first curved surface) curved at a certain radius from a rotation center line AX2 (hereinafter also referred to as a second central axis AX2) serving as a predetermined axis. It is a rotating drum that rotates around.
  • the second drum member 22 forms a second surface (support surface) P2 that supports a part including the projection area PA on the substrate P onto which the imaging light beam from the projection optical system PL is projected in an arc shape (cylindrical shape).
  • the second drum member 22 is a drive roller DR5 that rotates by torque supplied from a second drive unit 36 including an actuator such as an electric motor.
  • the second drum member 22 is the drive roller DR5 and also serves as a substrate support member (substrate stage) that supports the substrate P to be exposed (processed). That is, the second drum member 22 may be a part of the exposure apparatus EX.
  • the second drum member 22 is rotatable around a rotation center line AX2 (second center axis AX2) of the second drum member 22, and the substrate P is an outer peripheral surface (cylindrical surface) on the second drum member 22. ),
  • the projection area PA is arranged in a part of the curved portion.
  • the principal ray passing through each center point of the projection area PA is viewed from the second central axis AX2 of the second drum member 22, as shown in FIG.
  • the first specific position PX1 and the second specific position PX2 are respectively arranged at positions of the angle ⁇ in the circumferential direction across the center plane P3.
  • the specific position PX which is between the first specific position PX1 and the second specific position PX2 when viewed from the rotation center line AX2, is exposed to the substrate P on the curved surface of the second drum member 22 on average. It is the center of the area.
  • the conveying device 9 includes a drive roller DR4, a second drum member 22 (drive roller DR5), and a drive roller DR6.
  • the transport device 9 moves the substrate P in the transport direction in which the substrate P is transported so that the substrate P passes through the first specific position PX1, the specific position PX, and the second specific position PX2.
  • the second drive unit 36 adjusts the torque for rotating the second drum member 22 in accordance with the control signal output from the control device 14.
  • the substrate P that has been transported from the upstream of the transport path to the drive roller DR4 is transported to the temperature adjusting device 60 via the drive roller DR4.
  • the temperature adjusting device 60 adjusts the temperature of the substrate P before being supplied to the second drum member 22 in accordance with a control signal output from the control device 14.
  • the substrate P whose temperature has been adjusted via the temperature adjusting device 60 is guided by the first guide member 31 and the second guide member 32 and is transported to the second drum member 22.
  • the substrate P is supported on the surface of the second drum member 22 and conveyed to the third guide member 33.
  • the substrate P that has passed through the third guide member 33 is transported downstream of the transport path.
  • the rotation center line AX2 of the second drum member 22 (drive roller DR5) and the rotation center lines of the drive rollers DR4 and DR6 are both set to be parallel to the Y axis.
  • a first guide member 31, a second guide member 32, and a third guide member 33 that regulate the transport direction in which the substrate P is transported and guide the substrate P are disposed.
  • a part of the substrate P is wound around the second drum member 22, and the substrate P starts to move away from the curved surface of the second surface P2 from the entrance position IA in the transport direction where the substrate P starts to contact the curved surface of the second surface P2.
  • the substrate P up to the separation position OA is supported.
  • the second guide member 32 and the third guide member 33 adjust, for example, the tension acting on the substrate P in the transport path by moving in the transport direction of the substrate P, for example.
  • the second guide member 32 and the third guide member 33 for example, move around the outer periphery of the second drum member 22 by moving in the transport direction of the substrate P, and the above-described entry position IA, separation position OA, and the like. Can be adjusted.
  • the transport device 9, the first guide member 31, the second guide member 32, and the third guide member 33 only need to be able to transport the substrate P along the projection area PA of the projection optical system PL.
  • the configurations of the first guide member 31, the second guide member 32, and the third guide member 33 can be changed as appropriate.
  • the second detector 35 is composed of, for example, a rotary encoder and optically detects the rotational position of the second drum member 22.
  • the second detector 35 outputs information indicating the detected rotational position of the second drum member 22 (for example, a two-phase signal from encoder heads EN1, EN2, EN3, EN4, and EN5 described later) to the control device 14. .
  • the control device 14 controls the rotational position of the second drum member 22 by controlling the second drive unit 36 based on the detection result by the second detector 35, and the first drum member 21 (cylindrical mask DM).
  • the second drum member 22 is moved synchronously (synchronized rotation). The detailed configuration of the second detector 35 will be described later.
  • the exposure apparatus EX of the present embodiment is an exposure apparatus that is assumed to be equipped with a so-called multi-lens projection optical system PL.
  • the projection optical system PL includes a plurality of projection modules that project some images in the pattern of the cylindrical mask DM.
  • three projection modules (projection optical systems) PL1, PL3, PL5 are arranged at regular intervals in the Y direction on the left side of the central plane P3, and three projection modules (projection optics) are also arranged on the right side of the central plane P3.
  • System) PL2, PL4, and PL6 are arranged at regular intervals in the Y direction.
  • the end portions in the Y direction of the areas exposed by the plurality of projection modules PL1 to PL6 are overlapped with each other by scanning, thereby forming a desired pattern. Project the whole picture.
  • the projection module PL and the projection module Since it is only necessary to add the module on the illumination mechanism IU side corresponding to the PL in the Y direction, there is an advantage that the panel size (the width of the substrate P) can be easily increased.
  • the exposure apparatus EX may not be a multi-lens system.
  • the exposure apparatus EX may project an image of the full width of the pattern onto the substrate P by one projection module.
  • each of the plurality of projection modules PL1 to PL6 may project a pattern corresponding to one device. That is, the exposure apparatus EX may project a plurality of device patterns in parallel by a plurality of projection modules.
  • the illumination mechanism IU of this embodiment includes a light source device 13 and an illumination optical system.
  • the illumination optical system includes a plurality of (for example, six) illumination modules IL arranged in the Y-axis direction corresponding to each of the plurality of projection modules PL1 to PL6.
  • the light source device 13 includes a lamp light source such as a mercury lamp, or a solid light source such as a laser diode or a light emitting diode (LED).
  • Illumination light emitted from the light source device 13 includes, for example, bright lines (g-line, h-line, i-line) emitted from a lamp light source, far ultraviolet light (DUV light) such as KrF excimer laser light (wavelength 248 nm), and ArF excimer laser. Light (wavelength 193 nm) and the like. Illumination light emitted from the light source device 13 has a uniform illuminance distribution, and is distributed to a plurality of illumination modules IL via a light guide member such as an optical fiber.
  • a light guide member such as an optical fiber.
  • Each of the plurality of illumination modules IL includes a plurality of optical members such as lenses.
  • the light emitted from the light source device 13 and passing through any of the plurality of illumination modules IL is referred to as an illumination light beam EL1.
  • Each of the plurality of illumination modules IL includes, for example, an integrator optical system, a rod lens, a fly-eye lens, and the like, and illuminates the illumination region IR with an illumination light beam EL1 having a uniform illuminance distribution.
  • the plurality of illumination modules IL are arranged inside the cylindrical mask DM.
  • Each of the plurality of illumination modules IL illuminates each illumination region IR of the mask pattern formed on the outer peripheral surface of the cylindrical mask DM from the inside of the cylindrical mask DM.
  • FIG. 3 is a diagram showing the arrangement of the illumination area IR and the projection area PA in the present embodiment.
  • FIG. 3 is a plan view of the illumination area IR on the cylindrical mask DM arranged on the first drum member 21 as viewed from the ⁇ Z side (the left side view in FIG. 3), and the second drum member 22 includes A plan view of the projection area PA on the arranged substrate P as viewed from the + Z side (the figure on the right side in FIG. 3) is shown.
  • a symbol Xs in FIG. 3 indicates the rotation direction (movement direction) of the first drum member 21 or the second drum member 22.
  • the plurality of illumination modules IL respectively illuminate the first to sixth illumination regions IR1 to IR6 on the cylindrical mask DM.
  • the first illumination module IL illuminates the first illumination region IR1
  • the second illumination module IL illuminates the second illumination region IR2.
  • the first illumination region IR1 will be described as a trapezoidal region elongated in the Y direction.
  • the intermediate image Since a field stop plate having a trapezoidal opening can be arranged at the position of, a rectangular region including the trapezoidal opening may be used.
  • the third illumination region IR3 and the fifth illumination region IR5 are regions having the same shape as the first illumination region IR1, respectively, and are arranged at regular intervals in the Y-axis direction.
  • the second illumination region IR2 is a trapezoidal (or rectangular) region symmetrical to the first illumination region IR1 with respect to the center plane P3.
  • the fourth illumination region IR4 and the sixth illumination region IR6 are regions having the same shape as the second illumination region IR2, respectively, and are arranged at regular intervals in the Y-axis direction.
  • each of the first to sixth illumination areas IR1 to IR6 has a triangular portion on the hypotenuse of adjacent trapezoidal illumination areas when viewed along the circumferential direction of the first surface P1. They are arranged so that they overlap (overlapping). Therefore, for example, the first region A1 on the cylindrical mask DM that passes through the first illumination region IR1 by the rotation of the first drum member 21 is the cylindrical mask DM that passes through the second illumination region IR2 by the rotation of the first drum member 21. Partly overlaps with the second region A2 above.
  • the cylindrical mask DM includes a pattern formation region A3 where a pattern is formed and a pattern non-formation region A4 where a pattern is not formed.
  • the pattern non-formation region A4 is arranged so as to surround the pattern formation region A3 in a frame shape, and has a characteristic of shielding the illumination light beam EL1.
  • the pattern formation area A3 of the cylindrical mask DM moves in the movement direction Xs with the rotation of the first drum member 21, and each partial area in the Y-axis direction of the pattern formation area A3 includes first to sixth illumination areas. Passes any one of IR1 to IR6.
  • the first to sixth illumination regions IR1 to IR6 are arranged so as to cover the entire width in the Y-axis direction of the pattern formation region A3.
  • each of the plurality of projection modules PL1 to PL6 arranged in the Y-axis direction has a one-to-one correspondence with each of the first to sixth illumination modules IL, and is illuminated by the corresponding illumination module.
  • An image of a partial pattern of the cylindrical mask DM that appears in the illumination area IR is projected onto each projection area PA on the substrate P.
  • the first projection module PL1 corresponds to the first illumination module IL, and displays an image of the pattern of the cylindrical mask DM in the first illumination region IR1 (see FIG. 3) illuminated by the first illumination module IL on the substrate P. Is projected onto the first projection area PA1.
  • the third projection module PL3 and the fifth projection module PL5 correspond to the third and fifth illumination modules IL, respectively.
  • the third projection module PL3 and the fifth projection module PL5 are arranged at a position overlapping the first projection module PL1 when viewed from the Y-axis direction.
  • the second projection module PL2 corresponds to the second illumination module IL, and displays an image of the pattern of the cylindrical mask DM in the second illumination region IR2 (see FIG. 3) illuminated by the second illumination module IL on the substrate P. Is projected onto the second projection area PA2.
  • the second projection module PL2 is disposed at a symmetrical position with respect to the first projection module PL1 across the center plane P3.
  • the fourth projection module PL4 and the sixth projection module PL6 are respectively arranged corresponding to the fourth and sixth illumination modules IL, and the fourth projection module PL4 and the sixth projection module PL6 are viewed from the Y-axis direction, It is arranged at a position overlapping the second projection module PL2.
  • each illumination region IR1 to IR6 on the cylindrical mask DM from each illumination module IL of the illumination mechanism IU is defined as an illumination light beam EL1.
  • the light that has been subjected to the intensity distribution modulation according to the partial pattern of the cylindrical mask DM appearing in each of the illumination regions IR1 to IR6, is incident on each of the projection modules PL1 to PL6, and reaches the projection regions PA1 to PA6 is formed into an imaging light beam.
  • EL2 Of the imaging light beam EL2 reaching the projection areas PA1 to PA6, the principal ray passing through the center points of the projection areas PA1 to PA6 is, as shown in FIG. 2, the second central axis AX2 of the second drum member 22.
  • the central plane P3 is disposed at a position (specific position) at an angle ⁇ in the circumferential direction.
  • the pattern image in the first illumination area IR1 is projected onto the first projection area PA1
  • the pattern image in the third illumination area IR3 is projected onto the third projection area PA3, and the fifth illumination area
  • the pattern image in IR5 is projected onto the fifth projection area PA5.
  • the first projection area PA1, the third projection area PA3, and the fifth projection area PA5 are arranged in a line in the Y-axis direction.
  • the pattern image in the second illumination area IR2 is projected onto the second projection area PA2.
  • the second projection area PA2 is arranged symmetrically with the first projection area PA1 with respect to the center plane P3 when viewed from the Y-axis direction.
  • the pattern image in the fourth illumination area IR4 is projected on the fourth projection area PA4, and the pattern image in the sixth illumination area IR6 is projected on the sixth projection area PA6.
  • the second projection area PA2, the fourth projection area PA4, and the sixth projection area PA6 are arranged in a line in the Y-axis direction.
  • Each of the first to sixth projection areas PA1 to PA6 is adjacent to each other in the direction parallel to the second central axis AX2 (odd and even) when viewed along the circumferential direction of the second surface P2. It arrange
  • the first projection area PA1 and the second projection area PA2 are set so that the exposure amount in the region where the third region A5 and the fourth region A6 overlap is substantially the same as the exposure amount in the non-overlapping region.
  • the shape etc. are set.
  • the first to sixth projection areas PA1 to PA6 are arranged so as to cover the entire width in the Y direction of the exposure area A7 exposed on the substrate P.
  • each of the second projection module PL2 to the fifth projection module PL5 has the same configuration as the first projection module PL1. Therefore, the configuration of the first projection module PL1 will be described on behalf of the projection optical system PL, and the description of each of the second projection module PL2 to the fifth projection module PL5 will be omitted.
  • the first projection module PL1 shown in FIG. 4 includes a first optical system 41 that forms an image of the pattern of the cylindrical mask DM arranged in the first illumination region IR1 on the intermediate image plane P7, and the first optical system 41.
  • a second optical system 42 that re-images at least a part of the intermediate image on the first projection area PA1 of the substrate P, and a first field stop 43 disposed on the intermediate image plane P7 on which the intermediate image is formed. .
  • the first projection module PL1 includes a focus correction optical member 44, an image shift correction optical member 45, a rotation correction mechanism 46, and a magnification correction optical member 47.
  • the focus correction optical member 44 is a focus adjustment device that finely adjusts the focus state of a pattern image (hereinafter referred to as a projection image) of a mask formed on the substrate P.
  • the image shift correction optical member 45 is a shift adjustment device that slightly shifts the projected image laterally within the image plane.
  • the magnification correcting optical member 47 is a magnification adjusting device that finely corrects the magnification of the projected image.
  • the rotation correction mechanism 46 is a shift adjustment device that slightly rotates the projected image within the image plane.
  • the imaging light beam EL2 from the pattern of the cylindrical mask DM exits from the first illumination region IR1 in the normal direction (D1), and enters the image shift correction optical member 45 through the focus correction optical member 44.
  • the imaging light beam EL ⁇ b> 2 that has passed through the image shift correction optical member 45 is reflected by the first reflecting surface (plane mirror) p ⁇ b> 4 of the first deflecting member 50 that is an element of the first optical system 41, and passes through the first lens group 51.
  • the light is reflected by the first concave mirror 52, passes through the first lens group 51 again, is reflected by the second reflecting surface (plane mirror) p5 of the first deflecting member 50, and enters the first field stop 43.
  • the imaging light beam EL2 that has passed through the first field stop 43 is reflected by the third reflecting surface (plane mirror) p8 of the second deflecting member 57, which is an element of the second optical system 42, and passes through the second lens group 58 for the second.
  • the light is reflected by the two concave mirrors 59, passes through the second lens group 58 again, is reflected by the fourth reflecting surface (plane mirror) p9 of the second deflecting member 57, and enters the optical member 47 for magnification correction.
  • the imaging light beam EL2 emitted from the magnification correcting optical member 47 enters the first projection area PA1 on the substrate P, and an image of the pattern appearing in the first illumination area IR1 is equal to the first projection area PA1 ( ⁇ Projected in 1).
  • each projection module The principal ray of the imaging light beam EL2 on the mask side of PL1 to PL6 is inclined so as to pass through the rotation center line AX1 of the cylindrical mask DM, and the inclination angle is the inclination of the principal ray of the imaging light beam EL2 on the substrate P side. This is the same as the angle ⁇ ( ⁇ ⁇ with respect to the center plane P3).
  • the angle ⁇ 3 formed by the third reflecting surface p8 of the second deflecting member 57 and the second optical axis AX4 is substantially the same as the angle ⁇ 2 formed by the second reflecting surface p5 of the first deflecting member 50 and the first optical axis AX3. is there.
  • the angle ⁇ 4 formed by the fourth reflecting surface p9 of the second deflecting member 57 and the second optical axis AX4 is substantially the same as the angle ⁇ 1 formed by the first reflecting surface p4 of the first deflecting member 50 and the first optical axis AX3. The same.
  • FIG. 5 is a perspective view of a rotating drum applied to the processing apparatus (exposure apparatus) of FIG.
  • FIG. 6 is a perspective view for explaining the relationship between a detection probe and a reading device applied to the processing apparatus (exposure apparatus) in FIG.
  • FIG. 7 is an explanatory diagram for explaining the position of the reading device when the scale disk SD according to the first embodiment is viewed in the direction of the rotation center line AX2.
  • FIG. 5 for convenience, only the second to fourth projection areas PA2 to PA4 are shown, and the first, fifth, and sixth projection areas PA1, PA5, and PA6 are not shown.
  • the second detector 35 shown in FIG. 2 optically detects the rotational position of the second drum member 22, and has a highly circular scale disk (scale member) SD and an encoder head as a reading device. Includes EN1, EN2, EN3, EN4, EN5.
  • the scale disk SD is fixed to the end of the second drum member 22 orthogonal to the rotation axis ST of the second drum member 22. For this reason, the scale disk SD rotates integrally with the rotation axis ST around the rotation center line AX2.
  • a scale (lattice) is engraved on the outer peripheral surface of the scale disk SD as the scale portion GP.
  • the scale part GP is annularly arranged along the circumferential direction in which the second drum member 22 rotates, and rotates around the rotation axis ST (second central axis AX2) together with the second drum member 22.
  • the encoder heads EN1, EN2, EN3, EN4, and EN5 are disposed around the scale portion GP when viewed from the rotation axis ST (second central axis AX2).
  • the encoder heads EN1, EN2, EN3, EN4, and EN5 are disposed to face the scale part GP, and can read the scale part GP in a non-contact manner.
  • the encoder heads EN1, EN2, EN3, EN4, and EN5 are disposed at different positions in the circumferential direction of the second drum member 22.
  • Encoder heads EN1, EN2, EN3, EN4, and EN5 are reading devices having measurement sensitivity (detection sensitivity) with respect to variation in displacement in the tangential direction (in the XZ plane) of the scale part GP.
  • the installation directions (angle directions in the XZ plane with the rotation center line AX2 as the center) of the encoder heads EN1, EN2, EN3, EN4, EN5 are set as the installation direction lines Le1, Le2, Le3, Le4,
  • Le5 When represented by Le5, as shown in FIG. 7, the encoder heads EN1 and EN2 are arranged such that the installation orientation lines Le1 and Le2 are at an angle ⁇ ⁇ ° with respect to the center plane P3. In the present embodiment, for example, the angle ⁇ is 15 °.
  • the projection modules PL1 to PL6 shown in FIG. 4 are processing units of the exposure apparatus EX that performs an irradiation process in which the substrate P is an object to be processed and the substrate P is irradiated with light.
  • the principal rays of the two imaging light beams EL2 enter the substrate P with respect to the substrate P.
  • the projection modules PL1, PL3, and PL5 serve as the first processing unit
  • the projection modules PL2, PL4, and PL6 serve as the second processing unit
  • the principal rays of the two imaging light beams EL2 are incident on the substrate P with respect to the substrate P.
  • the position is a specific position where the irradiation process for irradiating the substrate P with light is performed.
  • the specific position is a position at an angle ⁇ ⁇ in the circumferential direction with respect to the center plane P3 on the curved substrate P on the second drum member 22 when viewed from the second center axis AX2 of the second drum member 22.
  • the installation heading line Le1 of the encoder head EN1 is equal to the inclination angle ⁇ of the principal ray passing through the center point of each projection area (projection field of view) PA1, PA3, PA5 of the odd-numbered projection modules PL1, PL3, PL5 with respect to the central plane P3.
  • the installation heading line Le2 of the encoder head EN2 has an inclination angle ⁇ with respect to the center plane P3 of the principal ray passing through the center points of the projection areas (projection fields) PA2, PA4, PA6 of the even-numbered projection modules PL2, PL4, PL6.
  • the encoder head EN1 serves as a reading device that reads the scale portion GP located in the direction connecting the first specific position PX1 and the second central axis AX2.
  • the encoder head EN2 serves as a reading device that reads the scale portion GP located in the direction connecting the second specific position PX2 and the second central axis AX2.
  • the encoder head EN4 is arranged on the rear side in the feeding direction of the substrate P, that is, before the exposure position (projection area), and rotates the installation direction line Le1 of the encoder head EN1 toward the rear side in the feeding direction of the substrate P. It is set on the installation direction line Le4 rotated around the axis of the center line AX2.
  • the encoder head EN5 is set on the installation direction line Le5 obtained by rotating the installation direction line Le1 of the encoder head EN1 around the axis of the rotation center line AX2 toward the rear side in the feed direction of the substrate P.
  • the encoder head EN3 is disposed on the opposite side of the encoder heads EN1 and EN2 with the rotation center line AX2 interposed therebetween, and the installation orientation line Le3 is set on the center plane P3.
  • the scale disk SD which is a scale member, is made to have a diameter as large as possible (for example, a diameter of 20 cm or more) in order to increase measurement resolution with a base material of low thermal expansion metal, glass, ceramics or the like.
  • the diameter of the scale disk SD is smaller than the diameter of the second drum member 22, but of the outer peripheral surface of the second drum member 22, the diameter of the outer peripheral surface around which the substrate P is wound, and the scale
  • the so-called measurement Abbe error can be further reduced by aligning (substantially matching) the diameter of the scale part GP of the disk SD.
  • the minimum pitch of the scale (lattice) engraved in the circumferential direction of the scale part GP is limited by the performance of a scale engraving device that processes the scale disk SD. For this reason, if the diameter of the scale disk SD is increased, the angle measurement resolution corresponding to the minimum pitch can be increased accordingly.
  • an image of a portion of the mask pattern projected by the projection optical system PL shown in FIG. 2 and the substrate P are relatively placed on a portion of the substrate P supported by the curved surface of the second drum member 22.
  • alignment microscopes AMG1 and AMG2 for detecting alignment marks or the like formed in advance on the substrate P are provided.
  • the alignment microscopes AMG1 and AMG2 have a detection probe for detecting a specific pattern formed discretely or continuously on the substrate P, and a detection region by the detection probe is more in the feeding direction of the substrate P than the specific position described above.
  • the pattern detection device is arranged around the second drum member 22 so as to be set on the rear side.
  • the alignment microscopes AMG1 and AMG2 have a plurality of (for example, four) detection probes arranged in a line in the Y-axis direction (the width direction of the substrate P).
  • the alignment microscopes AMG1 and AMG2 are detection probes on both ends of the second drum member 22 in the Y-axis direction, and can always observe or detect alignment marks formed near both ends of the substrate P.
  • the alignment microscopes AMG1 and AMG2 are detection probes other than both side ends of the second drum member 22 in the Y-axis direction (the width direction of the substrate P).
  • a plurality of alignment microscopes AMG1 and AMG2 are formed on the substrate P along the longitudinal direction. It is possible to observe or detect an alignment mark formed in a blank space between the pattern formation regions of the display panel.
  • the encoder head EN4 is arranged on the installation direction line Le4 set in the radial direction of the scale part GP.
  • the radial direction of the scale portion GP is in the same direction as the detection center AM2 of the substrate P observed by the alignment microscope AMG2 (toward the rotation center line AX2) when viewed from the rotation center line AX2 in the XZ plane.
  • the encoder head EN5 is arranged on the installation azimuth line Le5.
  • the detection probes of the alignment microscopes AMG1 and AMG2 are arranged around the second drum member 22 when viewed from the second central axis AX2, and the position where the encoder heads EN4 and EN5 are arranged is connected to the second central axis AX2.
  • the direction (installation azimuth lines Le4 and Le5) is arranged to coincide with the direction connecting the second central axis AX2 and the detection regions of the alignment microscopes AMG1 and AMG2.
  • the positions around the rotation center line AX2 where the alignment microscopes AMG1 and AMG2 and encoder heads EN4 and EN5 are arranged are from the entrance position IA where the substrate P starts to contact the second drum member 22 and the second drum member 22. It is set between the separation position OA from which the substrate P comes off.
  • the above-described observation direction AM2 of the alignment microscope AMG2 is arranged on the front side in the transport direction of the substrate P, that is, behind the exposure position (projection region), and is formed near the end of the substrate P in the Y direction. (Formed in an area within several tens of ⁇ m to several hundred ⁇ m square) is detected at high speed by an image sensor or the like while the substrate P is being sent at a predetermined speed, and in a microscope field of view (imaging range) Sampling the mark image at high speed.
  • the rotational angle position of the scale disk SD sequentially measured by the encoder head EN5 at the moment when the sampling is performed, the mark position of the alignment mark on the substrate P and the rotational angle position of the second drum member 22 are stored. Is required.
  • the observation direction AM1 of the alignment microscope AMG1 described above is arranged on the rear side in the transport direction of the substrate P, that is, in front of the exposure position (projection region), and is formed in the vicinity of the end portion in the Y direction of the substrate P.
  • the image of the alignment mark (formed in an area within several tens of ⁇ m to several hundreds of ⁇ m square) is sampled at high speed by an imaging device or the like, and is sequentially measured by the encoder head EN4 at the sampling instant.
  • the rotation angle position of the scale disk SD By storing the rotation angle position of the scale disk SD, the correspondence between the mark position of the alignment mark on the substrate P and the rotation angle position of the second drum member 22 is obtained.
  • the difference between the angular position measured and stored by the encoder head EN4 and the angular position measured and stored by the encoder head EN5 is precisely determined in advance. Are compared with the opening angles of the installation orientation lines Le4 and Le5 of the two alignment microscopes AMG1 and AMG2. If the opening angle has an error, there is a possibility that the substrate P is slightly slipped on the second drum member 22 between the entry position IA and the separation position OA, or the conveyance direction (circumferential direction). ) Or in a direction parallel to the second central axis AX2 (Y-axis direction).
  • the positional error during patterning is determined according to the fineness and overlay accuracy of the device pattern formed on the substrate P. For example, a 10 ⁇ m-wide line pattern is accurately superimposed on the underlying pattern layer. In order to perform the alignment exposure, only an error of a fraction of that, that is, a positional error of about ⁇ 2 ⁇ m is allowed in terms of the dimension on the substrate P.
  • the measurement direction of the mark image by each alignment microscope AMG1, AMG2 (peripheral tangent direction of the second drum member 22 in the XZ plane) and the encoder heads EN4, EN5 It is necessary to align the measurement direction (peripheral tangent direction of the scale part GP in the XZ plane) within an allowable angle error.
  • the encoder heads EN4 and EN5 are arranged so as to coincide with the measurement direction of the alignment mark on the substrate P by the alignment microscopes AMG1 and AMG2 (the tangential direction of the circumferential surface of the second drum member 22). .
  • the second drum member 22 scale disk SD
  • the second drum member 22 is orthogonal to the installation orientation lines Le4 and Le5 in the XZ plane. Even when shifting in the circumferential direction (tangential direction), it is possible to perform highly accurate position measurement in consideration of the shift of the second drum member 22.
  • encoder heads EN1 to EN5 are arranged at five locations around the scale portion GP of the scale disk SD as viewed from the second central axis AX2, output of measurement values by appropriate two or three of these encoder heads is output. It is also possible to obtain the roundness (shape distortion), eccentricity error, etc. of the scale part GP of the scale disk SD by performing the arithmetic processing in combination.
  • the substrate P expands and contracts in accordance with the temperature of the substrate P in the transport direction (circumferential direction) or the direction parallel to the second central axis AX2 (Y-axis direction) depending on the temperature environment inside the processing apparatus U3. There may be.
  • the expansion and contraction is determined by the material properties of the substrate P, and there are a material that expands as the temperature of the substrate P increases and a material that contracts as the temperature of the substrate P increases.
  • FIG. 8 is an explanatory diagram for explaining the temperature adjustment device according to the first embodiment. As shown in FIG.
  • the temperature adjustment device 60 is a device that adjusts the temperature of the upstream side in the transport direction of the substrate P that passes through the first specific position PX1, the specific position PX, and the second specific position PX2.
  • the length of the substrate P guided by the first guide member 31 and the second guide member 32 from the end of the temperature adjustment of the temperature adjustment apparatus 60 to the transfer position IA of the second drum member 22 is as follows. Although the shorter one is preferable, it may be determined according to the difference between the temperature set by the temperature adjusting device 60 and the temperature of the second drum member 22. For example, since the second drum member 22 generally has a large heat capacity and it takes time to change the set temperature, the substrate support member temperature adjusting device 73 in FIG.
  • the temperature set by the temperature adjustment device 60 is determined based on the transfer distance from the temperature adjustment device 60 to the entry position IA, the temperature of the transfer space therebetween, and the speed of the substrate P. As an example, when the surface temperature of the second drum member 22 is 25 ° C., the temperature set in the temperature adjusting device 60 is just 25 ° C. after the time (seconds) for the substrate P to move the transport distance. Is set to decrease. However, in general, since the substrate P is thin, it quickly adjusts to the environmental temperature. Therefore, the transport distance from the temperature adjustment device 60 to the entry position IA is made as short as possible, and the change temperature is predicted and controlled as described above. Is desirable.
  • the temperature adjusting device 60 includes a guide member 61, a medium blowing member 62, a blowing pressure equalizing member 63, a medium adjusting device 71, a heating unit HU, and a cooling unit CU.
  • the medium blowing member 62 blows the medium to the substrate P through a medium blowing pressure equalizing member 63 formed of a porous material.
  • the transport device 9 passes the substrate P through a space 67 between the guide member 61 and the medium blowing member 62.
  • the medium blowing member 62 blows the medium supplied from the medium adjusting device 71 via the medium supply pipe AP to the guide member 61 side.
  • the heating unit HU is a first medium supply unit that supplies a high-temperature medium to the medium adjustment device 71 via the medium supply pipe HH.
  • the cooling unit CU is a second medium supply unit that supplies a low-temperature medium having a temperature lower than that of the high-temperature medium of the heating unit HU to the medium adjusting device 71 via the medium supply pipe CC.
  • the medium adjusting device 71 includes a flow rate adjusting valve 72H that adjusts the flow rate of the high-temperature medium supplied from the medium supply pipe HH to the medium supply pipe AP, and a low-temperature medium supplied from the medium supply pipe CC to the medium supply pipe AP. And a flow rate adjustment valve 72C for adjusting the flow rate.
  • the flow rate adjustment valve 72H and the flow rate adjustment valve 72C are constituted by solenoid valves, for example.
  • the medium adjusting device 71 adjusts the amount of the high-temperature medium passing through the flow rate adjusting valve 72H and the amount of the low-temperature medium passing through the flow rate adjusting valve 72C in accordance with the output of the control signal of the control device 14, thereby the medium blowing member 62.
  • the ratio of the hot medium to the cold medium supplied to the can be changed.
  • the medium adjusting device 71 can mix and distribute a high temperature medium and a low temperature medium as a medium supplied to the medium blowing member 62.
  • the temperature adjusting device 60 can adjust the temperature of the substrate P by circulating a medium having an arbitrary temperature around the guide member 61.
  • a member equivalent to the blowing pressure equalizing member 63 in FIG. 8 is also provided on the opposite side of the substrate P, and the temperature-controlled medium is placed on the opposite side of the substrate P via a member equivalent to the medium supply pipe AP. Also, it may be configured to be sprayed.
  • the substrate support member temperature adjusting device 73 is a device that adjusts the temperature of the second drum member 22 that is a substrate support member.
  • the substrate support member temperature adjusting device 73 includes a flow rate adjusting valve 74H that adjusts the flow rate of a high-temperature medium supplied from the medium supply pipe HH to the medium supply pipe AD, and a low temperature supplied from the medium supply pipe CC to the medium supply pipe AD. And a flow rate adjustment valve 74C for adjusting the flow rate of the medium.
  • the flow rate adjustment valve 74H and the flow rate adjustment valve 74C are configured by solenoids, for example.
  • the substrate support member temperature adjusting device 73 adjusts the amount of the high temperature medium passing through the flow rate adjusting valve 74H and the amount of the low temperature medium passing through the flow rate adjusting valve 74C in accordance with the output of the control signal of the control device 14.
  • the ratio of the hot medium and the cold medium supplied to the two-drum member 22 can be changed. Therefore, the substrate support member temperature adjusting device 73 mixes a high-temperature medium and a low-temperature medium as a medium to be supplied to the inside of the second drum member 22, and the second drum member 22 is supplied via the medium supply pipe AD. It can be distributed inside.
  • the substrate support member temperature adjusting device 73 is preferably controlled by the control device 14 so as to keep the temperature of the second drum member 22 constant. Thereby, the heat capacity transmitted to the substrate P in contact with the curved surface of the second drum member 22 is maintained substantially constant, and the expansion / contraction state of the substrate P occurring on the curved surface of the second drum member 22 can be stabilized.
  • the temperature adjusting device 60 and the substrate support member temperature adjusting device 73 are devices for supplying the temperature-adjusted medium to the substrate P or the second drum member 22.
  • the medium is radiated heat by circulating a liquid through a pipe.
  • the medium adjustment device 71 and the substrate support member temperature adjustment device 73 may be configured by combining, for example, a heater and a radiation fin.
  • the temperature measuring device T1 that detects the temperature of the substrate P before being transported to the guide member 61 can output the detection result to the control device 14.
  • the control device 14 can perform feedforward control of the temperature adjustment device 60 based on the detection result of the temperature measurement device T1.
  • the temperature measurement device T2 that detects the temperature of the substrate P after passing through the temperature adjustment device 60 (guide member 61) can output the detection result to the control device 14.
  • the temperature adjusting device 60 can be feedback-controlled.
  • the control device 14 controls the temperature of the medium blown from the medium blowing member 62 by controlling at least one of the feedforward control and the feedback control of the temperature adjustment device 60, and increases the accuracy of the temperature applied to the substrate P. Can do.
  • a non-contact type infrared thermometer that measures the amount of infrared energy emitted by the substrate P can be used.
  • the guide member 61 is preferably provided with a support mechanism for the substrate P.
  • the medium blowing member 62 sends the medium from the medium supply pipe AP to the blowing pressure equalizing member 63 through the through hole AH opened at a position in the blowing pressure equalizing member 63. Since the blowing pressure equalizing member 63 is made of, for example, a porous material, the medium is ejected to the facing surface 63S on the substrate P side so that the medium pressure per unit area becomes uniform.
  • the guide member 61 includes a restriction member 64 that holds an end of the substrate P in the Y direction (width direction), and a restriction member 65, and the restriction member 64 and the restriction member 65 serve to transfer the substrate P when the substrate P is transported. Across the width direction.
  • the restricting member 65 is fixed to the inner surface of the guide member 61 via a bearing BE.
  • the regulating member 64 is connected to the magnet VCMm of the voice coil motor 66 through the spring SS. The position of the magnet VCMm in the Y direction changes according to the current flowing through the coil VCMc of the voice coil motor 66, and the voice coil motor 66 can change the position of the substrate P in the Y direction.
  • an alignment microscope PMG1 for detecting an alignment mark or the like formed in advance on the substrate P is provided inside the temperature control device 60 or on the exit side in the transport direction.
  • a plurality of (for example, four) detection probes are arranged in a line in the Y direction (the width direction of the substrate P) of the alignment microscope PMG1.
  • FIG. 9 is an explanatory diagram for explaining an example of the alignment mark.
  • An alignment microscope PMG1 shown in FIG. 2 is a detection probe at both ends in the Y direction of the guide member 61, and always observes or detects alignment marks ma formed near both ends of the substrate P shown in FIG. can do.
  • FIG. 10 is an explanatory diagram schematically illustrating an example of a change in the alignment mark due to the expansion and contraction of the substrate.
  • FIG. 11 is a flowchart illustrating an example of a procedure for correcting processing of the processing apparatus (exposure apparatus) according to the first embodiment.
  • the alignment microscope AMG1 detects the alignment mark ma as a first detection probe within the range of the microscope field of view (imaging range) mam in the observation direction (detection direction) AM1.
  • the alignment microscope PMG1 detects the alignment mark ma as a second detection probe within the range of the microscope visual field (imaging range) map in the detection direction PM1.
  • alignment microscope AMG1 and alignment microscope PMG1 detect alignment mark ma which is a specific pattern on substrate P shown in FIG. 10 (step S11).
  • the alignment microscope AMG1 outputs the image of the alignment mark ma to the control device 14, and the control device 14 and the alignment microscope AMG1 store the alignment mark ma as image data in the storage unit of the control device 14 as the first pattern detection device.
  • the alignment microscope PMG1 outputs the image of the alignment mark ma to the control device 14, and the control device 14 and the alignment microscope PMG1 store the alignment mark ma as image data in the storage unit of the control device 14 as the second pattern detection device. .
  • step S12 by comparing the imaging data of the alignment mark ma of the microscope visual field (imaging range) map and the imaging data of the alignment mark ma of the microscope visual field (imaging range) ma stored in the storage unit, due to expansion and contraction of the substrate P
  • the control device 14 executes the process of step S11.
  • step S11 As shown in FIG. 10, by comparing the imaging data of the alignment mark ma of the microscope visual field (imaging range) map and the imaging data of the alignment mark ma of the microscope visual field (imaging range) ma stored in the storage unit, When there is a change in the imaging data of the alignment mark ma due to the expansion / contraction of P (Yes in step S12), the control device 14 advances the process to step S13.
  • the change ⁇ m in the imaging data of the alignment mark ma shown in FIG. 10 is allowed by the image shift correction optical member 45 that is a shift adjustment device. This is a case where the projected image exceeds the amount that can be laterally shifted in the image plane.
  • the magnification ⁇ of the projected image that the change ⁇ m in the imaging data of the alignment mark ma allows the magnification correcting optical member 47 that is a magnification adjusting device. This is the case when the magnification exceeds the magnification that can be slightly corrected.
  • the control device 14 controls the medium adjusting device 71 of the temperature adjusting device 60 so that the target width in the width direction of the substrate P, for example, the target width PP shown in FIG. Then, the temperature of the substrate P is adjusted (step S13). If the specific substrate temperature has not been reached based on the detection results of the temperature measuring devices T1 and T2 (step S14, No), the control device 14 continues to adjust the temperature of the substrate P (step S13). Based on the detection results of the temperature measuring devices T1 and T2, the control device 14 advances the processing to step S15 when the specific substrate temperature has been reached (Yes in step S14).
  • the exposure apparatus EX according to the change ⁇ m of the alignment mark ma (specific pattern) obtained by the output of the first pattern detection apparatus and the second pattern detection apparatus newly described above by the image shift adjustment apparatus described above, The projection image is corrected by shifting the position of the projection image (step S15).
  • the exposure apparatus EX uses a projection image according to the change ⁇ m of the alignment mark ma (specific pattern) obtained by the above-described magnification adjustment apparatus again from the outputs of the first pattern detection apparatus and the second pattern detection apparatus.
  • the projection image may be corrected by correcting the magnification.
  • the exposure apparatus EX the change in the alignment mark ma (specific pattern) obtained by the output of the first pattern detection apparatus and the second pattern detection apparatus described above by the magnification adjustment apparatus and the image shift adjustment apparatus described above is obtained. Accordingly, the projection image may be corrected by correcting the shift and magnification of the projection image.
  • the processing device U3 adjusts the temperature of a part of the substrate P before the temperature adjusting device 60 is wound around the second drum member 22, and thus the first specific position PX1 and the specific position PX described above. Or the expansion-contraction state of the board
  • the exposure apparatus EX can precisely perform the process of irradiating the exposure light at the first specific position PX1, the specific position PX, or the second specific position PX2.
  • the substrate support member temperature adjusting device 73 that controls the temperature of the outer peripheral surface (support surface) of the second drum member 22 and the temperature adjusting device 60 provided on the upstream side of the second drum member 22 are provided. It is possible to control the temperature so as to give a certain temperature difference to the substrate P between the specific position of the alignment position and exposure position and the upstream position in the transport direction of the substrate P. Thereby, the expansion-contraction amount of the board
  • FIG. 12 is a schematic diagram showing an overall configuration of a processing apparatus (exposure apparatus) according to the second embodiment.
  • the same reference numerals are given to the same elements as those of the first embodiment, and the description thereof is omitted.
  • the temperature adjustment device 60A has a curved surface (second curved surface) 61S curved at a constant radius r3 from a parallel reference axis BX1 parallel to the second central axis AX2, and a part of the substrate P is formed on the curved surface 61S. 32A, and a medium adjusting device 71 for circulating the temperature-controlled medium in a space 67 around the guide member 32A.
  • the transport device 9 passes the substrate P through the space 67 between the guide member 32A and the medium blowing member 62A.
  • the medium blowing member 62A blows the medium supplied from the medium adjusting device 71 via the medium supply pipe AP to the guide member 32A side.
  • the guide member 32A can suppress the turbulent airflow in the space 67 by being curved along the curved surface 61S as viewed from the parallel reference axis BX1.
  • the temperature adjusting device 60A causes the temperature of the medium to be transmitted to the substrate P by circulating the temperature adjusted medium in the space 67 around the guide member 32A. Since the guide member 32A is configured such that a part of the substrate P is in contact with the curved surface 61S, the substrate P is directly supplied from the guide member 32A to the second drum member 22, and the distance from the guide member 32A to the second drum member 22 is increased. Can be shortened. For this reason, the processing device U3 suppresses the expansion / contraction state of the substrate P adjusted by the temperature adjustment of the temperature adjustment device 60A from changing from the temperature adjustment device 60A to the second drum member 22. Can do.
  • the radius r3 of the curved surface 61S of the guide member 32A described above is more preferably the same as the radius r2 of the second drum member 22.
  • FIG. 13 is a schematic diagram showing an overall configuration of a processing apparatus (exposure apparatus) according to the third embodiment.
  • the same reference numerals are given to the same elements as those of the first embodiment and the second embodiment, and the description thereof is omitted.
  • the medium adjusting device 71 is a guide member temperature adjusting device that adjusts the guide member 32A.
  • the medium adjusting device 71 can mix and distribute a high-temperature medium and a low-temperature medium as a medium supplied into the guide member 32A.
  • the medium adjusting device 71 is controlled by the control device 14 to adjust the temperature of the guide member 32A, and transmits the temperature of the guide member 32A to the substrate P in contact with the guide member 32A. Thereby, the heat capacity transmitted to the substrate P in contact with the curved surface 61S of the guide member 32A is maintained substantially constant.
  • the radius r3 of the curved surface 61S of the guide member 32A described above is more preferably the same as the radius r2 of the second drum member 22.
  • the tension applied to the substrate P wound around the second drum member 22 and the tension applied to the substrate P wound around the guide member 32A can be made the same.
  • the alignment microscope PMG1. can improve the prediction accuracy of the change of the alignment mark in the alignment microscope AMG1 from the alignment mark detected by.
  • FIG. 14 is a schematic diagram showing an overall configuration of a processing apparatus (exposure apparatus) according to the fourth embodiment.
  • the exposure apparatus EX2 emits an illumination light beam EL1 that illuminates the cylindrical mask DM from a light source.
  • the illumination light beam EL1 emitted from the light source is guided to the illumination module IL and a plurality of illumination optical systems are provided, the illumination light beam EL1 from the light source is separated into a plurality of light beams, and the plurality of illumination light beam EL1 is divided into the plurality of illumination modules IL Lead.
  • the illumination light beam EL1 emitted from the light source enters the polarization beam splitters SP1 and SP2.
  • the polarization beam splitters SP1 and SP2 it is preferable that the incident illumination light beam EL1 is totally reflected so as to suppress energy loss due to separation of the illumination light beam EL1.
  • the polarization beam splitters SP1 and SP2 reflect a light beam that becomes S-polarized linearly polarized light and transmit a light beam that becomes P-polarized linearly polarized light. Therefore, the light source emits to the first drum member 21 an illumination light beam EL1 in which the illumination light beam EL1 incident on the polarization beam splitters SP1 and SP2 is a linearly polarized light (S-polarized light). Thereby, the light source emits an illumination light beam EL1 having a uniform wavelength and phase.
  • the polarization beam splitters SP1 and SP2 reflect the illumination light beam EL1 from the light source, while transmitting the imaging light beam (projection light beam) EL2 reflected by the cylindrical mask DM.
  • the illumination light beam EL1 from the illumination optical module enters the polarization beam splitters SP1 and SP2 as a reflected light beam
  • the imaging light beam EL2 from the cylindrical mask DM enters the polarization beam splitters SP1 and SP2 as a transmitted light beam. .
  • the illumination module IL that is a processing unit performs a process of reflecting the illumination light beam EL1 to a predetermined pattern (mask pattern) on the cylindrical mask DM that is an object to be processed.
  • the projection optical system PL can project the image of the pattern in the illumination region IR on the cylindrical mask DM onto a part of the substrate P (projection region PA) being transported by the transport device 9.
  • the exposure apparatus EX2 can perform a process of irradiating the substrate P at the first specific position PX1 and the second specific position PX2 with exposure light by the projected light beam reflected by the cylindrical mask DM.
  • FIG. 15 is a schematic diagram showing an overall configuration of a processing apparatus (exposure apparatus) according to the fifth embodiment.
  • the exposure apparatus EX3 includes a plurality of polygon scanning units PO1 and PO2, and each polygon scanning unit PO scans a beam spot from the ultraviolet laser light source on the substrate P at a high speed in a direction parallel to the rotation center AX2 as an axis.
  • the pattern is drawn on the substrate P by modulating (On / Off) the beam based on pattern drawing data (CAD data) by an AOM (Acousto-Optic Modulator) not shown.
  • CAD data pattern drawing data
  • AOM Acoustic-Optic Modulator
  • the exposure apparatus EX3 is a maskless exposure apparatus that irradiates the substrate P at the first specific position PX1 and the second specific position PX2 with exposure light (laser spot) to form a predetermined pattern without the cylindrical mask DM.
  • a pattern may be drawn using a DMD (Digital Micro mirror Device) or SLM (Spatial light modulator).
  • FIG. 16 is a schematic diagram showing an overall configuration of a processing apparatus (exposure apparatus) according to the sixth embodiment.
  • the same reference numerals are given to the same elements as those of the first embodiment, and the description thereof is omitted.
  • the exposure apparatus EX4 is a processing apparatus that performs so-called proximity exposure on the substrate P.
  • the gap between the cylindrical mask DM and the second drum member 22 is set to be minute, and the illumination mechanism IU directly irradiates the substrate P with the illumination light beam EL to perform non-contact exposure.
  • the 2nd drum member 22 rotates with the torque supplied from the 2nd drive part 36 containing actuators, such as an electric motor.
  • a driving roller MGG connected by, for example, a magnetic gear drives the first drum member 21 so as to be in a direction opposite to the rotation direction of the second driving unit 36.
  • the second drive unit 36 rotates the second drum member 22 and rotates the drive roller MGG and the first drum member 21 to synchronize the first drum member 21 (cylindrical mask DM) and the second drum member 22. Move (synchronized rotation).
  • the exposure apparatus EX4 also includes an encoder head EN6 that detects the position PX6 of the scale portion GP at a specific position where the principal ray of the illumination light beam (imaging light beam) EL is incident on the substrate P with respect to the substrate P.
  • an encoder head EN7 that detects the position PX6 of the scale portion GP at a specific position where the principal ray of the illumination light beam (imaging light beam) EL is incident on the substrate P with respect to the substrate P.
  • the position PX6 is located from the second central axis AX2. This coincides with the specific position described above.
  • the encoder head EN7 is set on an installation direction line Le7 obtained by rotating the installation direction line Le6 of the encoder head EN6 about the rotation center line AX2 by about 90 ° toward the rear side in the feed direction of the substrate P. .
  • the encoder head EN7 is the first reading device
  • the encoder head EN6 is the second reading device
  • the position and identification of the axis of the second drum member 22 obtained from the reading output of the scale part GP are specified. It is possible to perform processing in which a displacement component in a direction that is connected to a position and is orthogonal to the axis is corrected by a reading output of the first reading device.
  • the first to sixth embodiments described above exemplify an exposure apparatus as the processing apparatus.
  • the processing apparatus is not limited to the exposure apparatus, and the processing unit may be an apparatus that prints a pattern on the substrate P, which is an object to be processed, using an inkjet ink dropping apparatus.
  • the processing unit may be an inspection device.
  • FIG. 17 is a flowchart showing a device manufacturing method using the processing apparatus (exposure apparatus) according to the first embodiment.
  • step S201 the function / performance design of a display panel using a self-luminous element such as an organic EL is performed, and necessary circuit patterns and wiring patterns are designed by CAD or the like.
  • step S202 a cylindrical mask DM for a necessary layer is manufactured based on the pattern for each layer designed by CAD or the like.
  • step S203 a supply roll FR1 around which a flexible substrate P (resin film, metal foil film, plastic, etc.) serving as a display panel base material is wound is prepared (step S203).
  • the roll-shaped substrate P prepared in step S203 has a surface modified as necessary, a pre-formed base layer (for example, micro unevenness by an imprint method), and light sensitivity.
  • the functional film or transparent film (insulating material) previously laminated may be used.
  • step S204 a backplane layer composed of electrodes, wiring, insulating film, TFT (thin film semiconductor), etc. constituting the display panel device is formed on the substrate P, and an organic EL or the like is laminated on the backplane.
  • a light emitting layer (display pixel portion) is formed by the self light emitting element (step S204).
  • This step S204 includes a conventional photolithography process in which the photoresist layer is exposed using the exposure apparatuses EX, EX2, EX3, and EX4 described in the previous embodiments.
  • An exposure process in which a substrate P coated with a silane coupling material is subjected to pattern exposure to form a pattern based on hydrophilicity and water repellency on the surface, a light sensitive catalyst layer is subjected to pattern exposure, and a metal film pattern (wiring, electrode) Etc.) or a printing step of drawing a pattern with a conductive ink containing silver nanoparticles or the like.
  • the substrate P is diced for each display panel device continuously manufactured on the long substrate P by a roll method, and a protective film (environmental barrier layer) or a color filter is formed on the surface of each display panel device.
  • a device is assembled by pasting sheets or the like (step S205).
  • an inspection process is performed to determine whether the display panel device functions normally or satisfies desired performance and characteristics (step S206). As described above, a display panel (flexible display) can be manufactured.

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  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
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  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
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PCT/JP2013/071823 2012-09-14 2013-08-12 基板処理装置及びデバイス製造方法 WO2014041941A1 (ja)

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JP2014535457A JP6256338B2 (ja) 2012-09-14 2013-08-12 基板処理装置及びデバイス製造方法
KR1020187007927A KR101890099B1 (ko) 2012-09-14 2013-08-12 기판 처리 장치 및 디바이스 제조 방법
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CN201380047645.4A CN104620178B (zh) 2012-09-14 2013-08-12 基板处理装置及元件制造方法
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JP2017520930A (ja) * 2014-03-21 2017-07-27 カルペ ディエム テクノロジーズ，インク． 可撓性基板上に微細構造体を製造するシステムおよび方法
JP2019023764A (ja) * 2014-04-01 2019-02-14 株式会社ニコン 基板処理方法
JP2019215588A (ja) * 2014-04-01 2019-12-19 株式会社ニコン パターン描画装置、及びデバイス製造方法
JP2015222375A (ja) * 2014-05-23 2015-12-10 株式会社ニコン 搬送装置およびパターン形成方法
JPWO2016204267A1 (ja) * 2015-06-17 2018-04-12 株式会社ニコン パターン描画装置およびパターン描画方法
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JP2018116293A (ja) * 2018-03-05 2018-07-26 株式会社ニコン パターン形成方法
JP2019117393A (ja) * 2019-03-06 2019-07-18 株式会社ニコン パターン形成装置
CN109884861A (zh) * 2019-03-26 2019-06-14 中山新诺科技股份有限公司 一种柔性板双面激光直写数字化曝光机
JP2020101821A (ja) * 2020-02-28 2020-07-02 株式会社ニコン パターン形成装置
JP7004016B2 (ja) 2020-02-28 2022-01-21 株式会社ニコン パターン形成装置

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