WO2014032534A1 - 触控感应层及其制造方法 - Google Patents

触控感应层及其制造方法 Download PDF

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Publication number
WO2014032534A1
WO2014032534A1 PCT/CN2013/081829 CN2013081829W WO2014032534A1 WO 2014032534 A1 WO2014032534 A1 WO 2014032534A1 CN 2013081829 W CN2013081829 W CN 2013081829W WO 2014032534 A1 WO2014032534 A1 WO 2014032534A1
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conductive layer
layer
touch sensing
manufacturing
sensing layer
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PCT/CN2013/081829
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English (en)
French (fr)
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张振炘
佘灯永
伍哲毅
陈文春
陈丽娴
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宝宸（厦门）光学科技有限公司
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Publication of WO2014032534A1 publication Critical patent/WO2014032534A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer

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  • the present invention relates to a touch panel, and more particularly to a touch panel sensing layer and a method of fabricating the same.
  • the sensing layer of the touch panel comprises at least an electrode and a peripheral lead, and the manufacturing method thereof comprises a plurality of steps.
  • FIG. 1 it is a flow chart of a conventional method for fabricating an electrode and a peripheral lead, the step comprising: step S1, forming a transparent conductive layer On a substrate; in step S2, a photoresist layer is formed on the transparent conductive layer; in step S3, a patterned transparent conductive layer, that is, an electrode, is obtained by pre-baking, exposure, development, post-baking, etching, and stripping.
  • Step S4 forming a metal layer on the electrode; step S5, forming a photoresist layer on the metal layer; and step S6, patterning by pre-baking, exposure, development, post-baking, etching, and stripping
  • the metal layer that is, the peripheral leads.
  • the electrodes and the peripheral leads are separately patterned, and the process of patterning itself involves complicated process steps such as drying, exposure, development, etching, and stripping, which complicates the process, resulting in a complicated process. Process efficiency cannot be improved.
  • the present invention provides a touch sensing layer and a method for fabricating the same, which utilizes a synchronous patterning process step to form electrodes and peripheral leads, thereby simplifying the production process to improve process efficiency.
  • the invention provides a method for manufacturing a touch sensing layer, comprising the steps of: (a) forming a first conductive layer on a substrate; (b) Forming a second conductive layer on the first conductive layer; (c) synchronously patterning the first conductive layer and the second conductive layer to respectively form a patterned composite conductive layer and at least one peripheral lead; and (d ) The second conductive layer in the patterned composite conductive layer is removed to form at least one electrode, wherein the peripheral leads are electrically connected to the corresponding electrodes.
  • the present invention further provides a touch sensing layer, comprising: at least one electrode pattern, which is made of a first conductive layer; and at least one peripheral lead electrically connected to the electrode patterns, wherein the peripheral leads are a two-layer conductive structure made of the first conductive layer and a second conductive layer.
  • FIG. 1 is a flow chart of a method for fabricating a conventional touch sensing layer.
  • FIG. 2A is a schematic structural diagram of a touch sensing layer according to an embodiment of the invention.
  • Figure 2B is a cross-sectional view taken along line A-A' of Figure 2A.
  • FIG. 3 is a flow chart of a method for fabricating a touch sensing layer according to an embodiment of the invention.
  • FIG. 4A is a schematic structural view of a manufacturing method according to an embodiment of the present invention.
  • Figure 4B is a cross-sectional view of Figure 4A in the horizontal direction.
  • FIG. 5A is a schematic structural diagram of a manufacturing method according to an embodiment of the present invention.
  • Figure 5B is a cross-sectional view of Figure 5A in the horizontal direction.
  • FIG. 6A is a schematic structural diagram of a manufacturing method according to an embodiment of the present invention.
  • Figure 6B is a cross-sectional view taken along line BB' of Figure 6A.
  • FIG. 7A is a schematic structural diagram of a manufacturing method according to an embodiment of the present invention.
  • Figure 7B is a cross-sectional view taken along line CC' of Figure 7A.
  • FIG. 8 is a flow chart of a manufacturing method according to an embodiment of the present invention.
  • FIG. 9A is a schematic structural diagram of a manufacturing method according to an embodiment of the present invention.
  • Figure 9B is a cross-sectional view of Figure 9A taken along the line DD'.
  • FIG. 2A and FIG. 2B are schematic diagrams showing the structure of a touch sensing layer according to an embodiment of the present invention, wherein FIG. 2B is a cross-sectional view taken along line A-A' of FIG. 2A.
  • the touch sensing layer 10 includes an electrode 1 located in the visible area VA and a peripheral lead 2 located in the non-visible area VS, wherein the peripheral lead 2 is electrically connected to the electrode 1.
  • the electrode 1 is made of the first conductive layer 21.
  • the peripheral lead 2 is made of the first conductive layer 21 and the second conductive layer 22, so that the peripheral lead 2 is a double-layer conductive structure.
  • the electrode 1 and the peripheral lead 2 are both made of the first conductive layer 21, so that the electrical connection between the electrode 1 and the peripheral lead 2 is through the first conductive layer 21 itself, so the electrode 1 and the peripheral lead 2 There is no need to conduct conduction by other overlapping laps, in other words, there is no overlap between the electrodes 1 and the peripheral leads, thereby avoiding problems such as disconnection due to the height difference at the overlap.
  • the method for manufacturing the touch sensing layer includes the following steps: (a) Forming a first conductive layer on a substrate; (b) forming a second conductive layer on the first conductive layer; (c) Synchronizing the first conductive layer and the second conductive layer to form a patterned composite conductive layer and at least one peripheral lead, respectively; and (d) The second conductive layer in the patterned composite conductive layer is removed to form at least one electrode, wherein the peripheral leads are electrically connected to the corresponding electrodes.
  • FIG. 4A is a schematic structural view of the above step (a)
  • FIG. 4B is a cross-sectional view of FIG. 4A in the horizontal direction.
  • the first conductive layer 21 is formed on the substrate 20, as shown in FIGS. 4A to 4B, which may be formed by deposition, evaporation, printing, coating, sputtering, or the like.
  • FIG. 5A is a schematic structural view of the above step (b), and FIG. 5B is a cross-sectional view of FIG. 5A along a horizontal direction.
  • the second conductive layer 22 is formed on the first conductive layer 21, as shown in FIGS. 5A and 5B, and may be formed by deposition, evaporation, printing, coating, sputtering, or the like.
  • FIG. 6A and FIG. 6B are a schematic structural view of the above step (c), and FIG. 6B is a cross-sectional view of FIG. 6A along the BB' direction.
  • step (c) the first conductive layer 21 and the second conductive layer 22 are synchronously patterned to form the patterned composite conductive layer 23 and the peripheral leads 2, respectively, as shown in FIGS. 6A and 6B.
  • the peripheral leads 2 are electrically connected to the patterned composite conductive layer 23, and the patterned composite conductive layer 23 is substantially located in the visible region VA of the substrate 20, and the peripheral leads 2 are located substantially in the peripheral region SA of the substrate 20.
  • the first conductive layer 21 and the second conductive layer 22 are simultaneously patterned by a laser etching method.
  • the laser etching line is used to control the appropriate laser etching parameters, and the portion of the second conductive layer 22 and the underlying first conductive layer 21 to be etched is completely etched, and etching is avoided.
  • the laser etching uses a wavelength of 1064.
  • the laser beam of nm is matched with the following parameters: power 3W, laser frequency 70K, and scribing speed 1000mm/s. According to the above parameters, the peripheral lead 2 with line width and line spacing of 30 ⁇ 5 ⁇ m can be etched.
  • the laser etching uses wavelength 355
  • the laser beam of nm is matched with the following parameters: power 0.7W, laser frequency 100K, and scribing speed 1000mm/s.
  • the peripheral lead 2 with line width and line pitch of 15 ⁇ 5 ⁇ m can be etched. Therefore, by adjusting the wavelength and other related parameters used in the laser etching, peripheral leads having a line width of 10 ⁇ m to 35 ⁇ m can be obtained. Since the laser etching precision is relatively easy to control, the line pitch of the peripheral leads 2 can be about 10 ⁇ m to 35 ⁇ m using the manufacturing method of the present embodiment.
  • the first conductive layer 21 and the second conductive layer 22 are simultaneously patterned by photolithography.
  • a photoresist layer is formed on the second conductive layer 22, and then formed by processes such as drying, exposure, development, post-baking, etching, and stripping.
  • the composite conductive layer 23 and the peripheral leads 2 are patterned.
  • FIG. 7A is a schematic structural view of the above step (d)
  • FIG. 7B is a cross-sectional view of FIG. 7A along the C-C' direction.
  • Step (d) The second conductive layer 22 in the patterned composite conductive layer 23 is removed to form the electrode 1, wherein the peripheral leads 2 are electrically connected to the corresponding electrodes 1, as shown in FIGS. 7A and 7B.
  • the second conductive layer 22 is removed using dry etching or wet etching.
  • the second conductive layer 22 in the patterned composite conductive layer 23 in the visible region VA can be removed by an etching solution, wherein the first conductive layer 21 and the second conductive layer 22 have differentities.
  • Etching properties so an appropriate etchant can be selected so that the etchant only etches the second conductive layer 22 without etching the first conductive layer 21. Therefore, the selection of the etching solution is determined according to the material of the second conductive layer 22, for example, if the material of the second conductive layer 22 is a molybdenum-aluminum-molybdenum (Mo-Al-Mo) alloy, acetic acid-nitric acid-phosphoric acid is used. The solution is used as an etching solution; if the material of the second conductive layer 22 is copper, a ferric chloride solution is used as an etching solution.
  • Mo-Al-Mo molybdenum-aluminum-molybdenum
  • FIG. 8 is a flow chart of another method of fabricating the touch sensing layer.
  • the embodiment is different from the above method embodiment in that a step (e) is further included between the step (c) and the step (d), that is, a protective layer 24 is formed on the peripheral lead 2 and patterned.
  • the composite conductive layer 23 is bare.
  • FIG. 9A and FIG. 9B in combination, wherein FIG. 9A is a schematic structural view of the above step (e), and FIG. 9B is a cross-sectional view of FIG. 9A along the DD' direction.
  • the protective layer 24 is an anti-etching ink layer formed by screen printing to shield and protect the peripheral leads 2 of the peripheral region SA while exposing the patterned composite conductive layer 23 located in the visible region VA.
  • the anti-etching ink layer is cured by heating or ultraviolet light irradiation.
  • the peelable adhesive layer 24 is printed in the peripheral region SA by a screen printing method to protect the peripheral leads 2 while exposing the patterned composite conductive layer 23 in the visible region VA; Or heating to cure the peelable adhesive layer.
  • the removal of the second conductive layer 22 in step (d) is performed to prevent the peripheral leads 2 from being corroded during the step (d).
  • a step (f) is further included, that is, the protective layer 24 is removed.
  • the protective layer 24 such as a potassium hydroxide (KOH) solution, is removed using a stripping solution to strip the anti-etching ink 24 or the peelable paste 24.
  • KOH potassium hydroxide
  • the touch sensing layer 10 can be formed on the substrate 20 by the above method.
  • the touch sensing layer 10 is a touch sensing structure for a capacitive touch panel, and the shape thereof is not limited to the single layer single axis structure shown in FIG. 2A, and may also be a single layer. Biaxial structure, a double-layer biaxial structure, and the like.
  • the substrate 20 may be a transparent inorganic substrate, such as a glass substrate, or a transparent organic substrate, such as a plastic substrate, such as polyethylene terephthalate (Polyethylene). Terephthalate, PET), polycarbonate (Poly Carbonate, PC), polyethylene (Polyethylene, PE) or polymethylmethacrylate (PMMA).
  • the first conductive layer 21 is a transparent conductive material, and the material thereof may be selected from one or a combination of the following groups: indium tin oxide (ITO), antimony tin oxide (ATO), zinc oxide (ZnO), and zinc dioxide ( ZnO 2 ), tin dioxide (SnO 2 ), indium trioxide (In 2 O 3 ).
  • the second electrically conductive material 22 is a metallic material comprising any electrically conductive metal or alloy such as copper, copper alloy, molybdenum-aluminum-molybdenum alloy, silver, silver alloy, and the like.
  • the touch sensing layer provided by the embodiment of the invention and the manufacturing method thereof are formed by using a synchronous patterning process step to form electrodes and peripheral leads, thereby simplifying the production process to improve process efficiency, and further if laser etching is used in the patterning step. In this way, the peripheral leads produced are more elaborate.

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  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
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Abstract

本发明提供一种触控感应层及其制造方法，其中触控感应层的制造方法，其特征在于，包含以下步骤：（a）形成一第一导电层于一基板上；（b）形成一第二导电层于该第一导电层上；（c）同步图案化该第一导电层和该第二导电层，以分别形成一图案化复合导电层以及至少一周边引线；以及（d）移除该图案化复合导电层中的该第二导电层以形成至少一电极，其中该些周边引线电性连接至对应的该些电极。本发明乃利用同步图案化的制程步骤形成电极与周边引线，从而可简化生产流程以提升制程效率。

Description

触控感应层及其制造方法 技术领域
本发明系关于一种触控面板，特别是有关于一种触控面板感应层及其制造方法。
背景技术
触控面板的感应层至少包含电极和周边引线，其制造方法涉及多个步骤，请参考图1，是传统制作电极和周边引线的方法流程图，其步骤包含：步骤S1，形成一透明导电层于一基板上；步骤S2，形成一光阻层于该透明导电层上；步骤S3，通过前烘干、曝光、显影、后烘干、蚀刻、剥膜得到图案化的透明导电层，即电极；步骤S4，形成一金属层于该电极上；步骤S5，形成一光阻层于该金属层上；步骤S6，通过前烘干、曝光、显影、后烘干、蚀刻、剥膜得到图案化的金属层，即周边引线。
传统制程中，电极和周边引线需分开进行图案化，而图案化这一制程动作本身又包含了复杂的工序步骤，如烘干、曝光、显影、蚀刻、剥膜，如此使得制程工艺复杂，导致制程效率无法提升。
发明内容
鉴于上述，本发明在于提供一种触控感应层及其制作方法，乃利用同步图案化的制程步骤形成电极与周边引线，从而可简化生产流程以提升制程效率。
　　本发明提供一种触控感应层的制造方法，其特征在于，包含以下步骤：(a) 形成一第一导电层于一基板上；(b) 形成一第二导电层于该第一导电层上；(c) 同步图案化该第一导电层和该第二导电层，以分别形成一图案化复合导电层以及至少一周边引线；以及(d) 移除该图案化复合导电层中的该第二导电层以形成至少一电极，其中该些周边引线电性连接至对应的该些电极。
本发明还提供一种触控感应层，包含：至少一电极图案，是由一第一导电层制成；以及至少一周边引线，分别电性连接于该些电极图案，其中该些周边引线为由该第一导电层与一第二导电层制成的双层导电结构。
附图说明
图1为传统触控感应层的制作方法流程图。
图2A为本发明一实施例中一种触控感应层的结构示意图。
图2B为图2A沿A-A'方向的剖面图。
图3为本发明一实施例的触控感应层的制作方法流程图。
图4A为本发明一实施例的制作方法过程中的结构示意图。
图4B为图4A沿水平方向的剖面图。
图5A为本发明一实施例的制作方法过程中的结构示意图。
图5B为图5A沿水平方向的剖面图。
图6A为本发明一实施例的制作方法过程中的结构示意图。
图6B为图6A沿B-B'方向的剖面图。
图7A为本发明一实施例的制作方法过程中的结构示意图。
图7B为图7A沿C-C'方向的剖面图。
图8为本发明一实施例的制作方法流程图。
图9A为本发明一实施例的制作方法过程中的结构示意图。
图9B为图9A沿D-D'方向的剖面图。
具体实施方式
以下将详述本案的各实施例，并配合图示作为例示。除了这些详细描述之外，本发明还可以广泛地施行在其他的实施例中，任何所述实施例的轻易替代、修改、等效变化都包含在本案的范围内，并以之后的专利范围为准。在说明书的描述中，为了使读者对本发明有较完整的了解，提供了许多特定细节；然而，本发明可能在省略部分或全部这些特定细节的前提下，仍可实施。此外，众所周知的步骤或元件并未描述于细节中，以避免造成本发明不必要之限制。图示中相同或类似之组件将以相同或类似符号来表示。特别注意的是，图示仅为示意之用，并非代表元件实际的尺寸或数量，除非有特别说明。
图2A与图2B为本发明一实施例中的触控感应层结构示意图，其中图2B为图2A沿A-A'方向的剖面图。本实施例中，触控感应层10包含位于可视区VA的电极1与位于非可视区VS的周边引线2，其中周边引线2电性连接电极1。电极1由第一导电层21制成。周边引线2由第一导电层21与第二导电层22制成，故周边引线2为一种双层导电结构。
本发明一实施例中，电极1与周边引线2均由第一导电层21制成，故电极1与周边引线2的电性连接是通过第一导电层21本身，故电极1与周边引线2之间无需通过其他重叠的搭接方式进行导通，换言之，电极1与周边引线的连接处无重叠，从而避免了因重叠处存在高度差而引起的断路等问题。
图3为制作上述触控感应层的方法流程图。请参照图3，触控感应层的制作方法包括以下步骤：(a) 形成一第一导电层于一基板上；(b) 形成一第二导电层于该第一导电层上；(c) 同步图案化该第一导电层和该第二导电层，以分别形成一图案化复合导电层以及至少一周边引线；以及(d) 移除该图案化复合导电层中的该第二导电层以形成至少一电极，其中该些周边引线电性连接至对应的该些电极。
请合并参考图4A与图4B，其中图4A是绘示上述步骤(a)的结构示意图，图4B为图4A沿水平方向的剖面图。步骤(a)，形成第一导电层21于基板20上，如图4A至图4B所示，其中形成的方式可为沉积、蒸镀、印刷、涂布、溅镀等。
请合并参考图5A与图5B，其中图5A是绘示上述步骤(b)的结构示意图，图5B为图5A沿水平方向的剖面图。步骤(b), 形成第二导电层22于第一导电层21上，如图5A及图5B所示，其中形成的方式可为沉积、蒸镀、印刷、涂布、溅镀等。
请合并参考图6A与图6B，其中图6A是绘示上述步骤(c)的结构示意图，图6B为图6A沿B-B'方向的剖面图。步骤(c)，同步图案化第一导电层21和第二导电层22，以分别形成图案化复合导电层23以及周边引线2，如图6A及图6B所示。其中，周边引线2分别电性连接于图案化复合导电层23，且图案化复合导电层23大致上位于基板20的可视区域VA，周边引线2大致上位于基板20的周边区域SA。
于本实施例，较佳地，是采用一雷射蚀刻方式同时图案化第一导电层21和第二导电层22。依照所要形成的图案，利用雷射划线蚀刻机，控制合适的雷射蚀刻参数，同时将第二导电层22与其下方的第一导电层21所需蚀刻的部份蚀刻完全，且避免蚀刻到第一导电层21下的基板20，例如塑胶基板。在一实施例中，雷射蚀刻选用波长1064 nm的雷射光束，并搭配下列参数：功率3W，雷射频率70K，划线速度1000mm/s，按照上述参数，可蚀刻出线宽和线距为30±5μm的周边引线2。在另一实施例中，雷射蚀刻选用波长355 nm的雷射光束，并搭配下列参数：功率0.7W，雷射频率100K，划线速度1000mm/s，按照上述参数，可蚀刻出线宽和线距为15±5μm的周边引线2。故通过调整镭射蚀刻时所使用的波长和其他相关参数，可得到线宽为10μm至35μm的周边引线。由于雷射蚀刻精度上较容易控制，使用本实施例的制作方法，周边引线2的线距可达到大约10μm至35μm。
在本发明另一实施例中，是采用微影蚀刻的方式同步图案化第一导电层21和第二导电层22。在本实施例中，在上述步骤(b)完成后，先形成一光阻层于第二导电层22上，再经过前烘干、曝光、显影、后烘干、蚀刻、剥膜等工序形成图案化复合导电层23以及周边引线2。
请合并参考图7A与图7B，其中图7A是绘示上述步骤(d)的结构示意图，图7B为图7A沿C-C'方向的剖面图。步骤(d) 移除图案化复合导电层23中的第二导电层22以形成电极1，其中该些周边引线2电性连接至对应的该些电极1，如图7A及图7B所示。例如，利用干蚀刻或湿蚀刻移除第二导电层22。于本实施例，可视区域VA中图案化复合导电层23中的第二导电层22，可通过一蚀刻液蚀刻移除，其中由于第一导电层21与第二导电层22具有相异的蚀刻属性，因此可选用适当的蚀刻液，使该蚀刻液仅会对第二导电层22有蚀刻作用，却不会对第一导电层21有蚀刻作用。因此，蚀刻液的选用需根据第二导电层22的材料来确定，例如，如果第二导电层22的材质为钼-铝-钼(Mo-Al-Mo)合金，则使用醋酸-硝酸-磷酸溶液作为蚀刻液；如果第二导电层22的材质为铜，则使用氯化铁溶液作为蚀刻液。
图8为制作上述触控感应层的另一方法流程图。本实施例与上述方法实施例的区别之处在于：于步骤(c)与步骤(d)之间更包含一步骤(e)，即形成一保护层24在周边引线2上，并使图案化复合导电层23裸露。请合并参考图9A与图9B，其中图9A是绘示上述步骤(e)的结构示意图，图9B为图9A沿D-D'方向的剖面图。在一实施例中，保护层24系采用丝网印刷方式形成的一防蚀刻油墨层，以遮蔽并保护周边区域SA的周边引线2，同时暴露出位于可视区域VA的图案化复合导电层23；接着，以加热或紫外光照射方式固化处理防蚀刻油墨层。于另一实施例中，以丝网印刷方法，在周边区域SA印刷可剥离胶层24以保护周边引线2，同时暴露出位于可视区域VA的图案化复合导电层23；接着，通过紫外光或加热方式使可剥离胶层固化。形成保护层24后，再进行步骤(d)的移除第二导电层22动作，以防止周边引线2在步骤(d)的过程中被腐蚀。
在本发明一实施例中，于步骤(d)之后更包含一步骤(f)，即移除上述保护层24。于本实施例，使用一剥膜液移除保护层24，例如氢氧化钾(KOH)溶液，将防蚀刻油墨24或可剥离胶24剥离。
在本实施例中，其余步骤及使用材料皆与上述方法实施例类似，在此不再赘述。
藉由上述方法，即可在基板20上形成触控感应层10。
此外，较佳地，所述触控感应层10是一种用于电容式触控面板的触控感应结构，其形态不拘于图2A所示的单层单轴结构，也可以是一单层双轴结构、一双层双轴结构等。
需要说明的是，在前述各实施例中，基板20可以是一透明无机基板，例如一玻璃基板；或一透明有机基板，例如一塑胶基板，其材质例如聚乙烯对苯二甲酸酯(Polyethylene terephthalate, PET)、聚碳酸酯(Poly Carbonate, PC)、聚乙烯(Polyethylene, PE)或聚甲基丙烯酸甲酯(Polymethylmethacrylate,PMMA)等。第一导电层21为透明导电材料，其材料可以选自下列群组的其中之一或其组合：氧化铟锡(ITO)、氧化锑锡(ATO)、氧化锌(ZnO)、二氧化锌(ZnO2)、二氧化锡(SnO2)、三氧化二铟(In2O3)。第二导电材料22为金属材料，其材料包含任何可以导电的金属或合金，例如铜、铜合金、钼-铝-钼合金、银、银合金等等。
本发明实施例提供的触控感应层及其制作方法，乃利用同步图案化的制程步骤形成电极与周边引线，从而可简化生产流程以提升制程效率，此外若在图案化步骤中使用镭射蚀刻的方式，所制作出的周边引线更加精细。
以上所述仅为本发明之较佳实施例而已，并非用以限定本发明之申请专利范围；凡其他未脱离发明所揭示之精神下所完成之等效改变或修饰，均应包含在下述之申请专利范围内。

Claims (20)

  1. 一种触控感应层的制造方法，其特征在于，包含以下步骤：
    (a) 形成一第一导电层于一基板上；
    (b) 形成一第二导电层于该第一导电层上；
    (c) 同步图案化该第一导电层和该第二导电层，以分别形成一图案化复合导电层以及至少一周边引线；以及
    (d) 移除该图案化复合导电层中的该第二导电层以形成至少一电极，其中该些周边引线电性连接至对应的该些电极。
  2. 如权利要求1所述的触控感应层的制造方法，其特征在于，于步骤(c)与步骤(d)之间更包含一步骤(e)形成一保护层在该些周边引线上，并使该图案化复合导电层裸露。
  3. 如权利要求2所述的触控感应层的制造方法，其特征在于，于步骤(d)之后更包含一步骤(f)移除该保护层。
  4. 如权利要求1所述的触控感应层的制造方法，其特征在于，在步骤(c)中，图案化的步骤是采用一雷射蚀刻方式同时蚀刻该第一导电层与该第二导电层。
  5. 如权利要求4所述的触控感应层的制造方法，其特征在于，该雷射蚀刻方式系使用波长为355nm或1064nm的雷射光束。
  6. 如权利要求1所述的触控感应层的制造方法，其特征在于，在步骤(b)与步骤(c)之间更包含一步骤(g)形成一光阻层与第二导电层上。
  7. 如权利要求6所述的触控感应层的制造方法，其特征在于，在步骤(c)中，图案化的步骤包含工序前烘干、曝光、显影、后烘干、蚀刻、剥膜。
  8. 如权利要求2所述的触控感应层的制造方法，其特征在于，该保护层的形成系采用丝网印刷方式形成的一防蚀刻油墨层或一可剥离胶层。
  9. 如权利要求8所述的触控感应层的制造方法，其特征在于，该保护层的形成更包括采用加热或紫外光固化的方式对该保护层进行固化。
  10. 如权利要求1所述的触控感应层的制造方法，其特征在于，在步骤(d)系以一蚀刻液移除该图案化复合导电层中的该第二导电层，其中该第一导电层与该第二导电层具有相异的蚀刻属性。
  11. 如权利要求10所述的触控感应层的制造方法，其特征在于，该第二导电层的材料为钼-铝-钼合金，该蚀刻液为醋酸-硝酸-磷酸溶液。
  12. 如权利要求10所述的触控感应层的制造方法，其特征在于，该第二导电层的材料为铜，该蚀刻液为氯化铁溶液。
  13. 如权利要求3所述的触控感应层的制造方法，其特征在于，在步骤(f)中，系以一剥膜液移除该保护层。
  14. 如权利要求13所述的触控感应层的制造方法，其特征在于，该剥膜液包含氢氧化钾溶液。
  15. 如权利要求5所述的触控感应层的制造方法，其特征在于，该些周边引线彼此间的线距为10μm至35μm。
  16. 如权利要求5所述的触控感应层的制造方法，其特征在于，该些周边引线的线宽为10μm至35μm。
  17. 如权利要求1所述的触控感应层的制造方法，其特征在于，该第一导电层的材料为透明导电材料，该第二导电层的材料为金属材料。
  18. 一种触控感应层，包含：
    至少一电极，是由一第一导电层制成；以及
    至少一周边引线，分别电性连接于该些电极，其中该些周边引线为由该第一导电层与一第二导电层制成的双层导电结构。
  19. 如权利要求18所述的触控感应层，其特征在于，该第一导电层的材料为透明导电材料，该第二导电层的材料为金属材料。
  20. 如权利要求18所述的触控感应层，其特征在于，该些电极与该些周边引线的连接处无重叠。
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