WO2014024786A1 - Feuille d'isolation sonore à diffusion de chaleur et structure d'isolation sonore à diffusion de chaleur - Google Patents

Feuille d'isolation sonore à diffusion de chaleur et structure d'isolation sonore à diffusion de chaleur Download PDF

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Publication number
WO2014024786A1
WO2014024786A1 PCT/JP2013/070968 JP2013070968W WO2014024786A1 WO 2014024786 A1 WO2014024786 A1 WO 2014024786A1 JP 2013070968 W JP2013070968 W JP 2013070968W WO 2014024786 A1 WO2014024786 A1 WO 2014024786A1
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Prior art keywords
heat
sound
diffusing
sound insulation
electronic component
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PCT/JP2013/070968
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English (en)
Japanese (ja)
Inventor
草洋子 仁木
達也 福岡
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ポリマテック株式会社
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Priority to CN201380036808.9A priority Critical patent/CN104471637B/zh
Priority to JP2014529465A priority patent/JP6312323B2/ja
Publication of WO2014024786A1 publication Critical patent/WO2014024786A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/181—Enclosures
    • G06F1/182—Enclosures with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/10—Properties of the layers or laminate having particular acoustical properties
    • B32B2307/102—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/304—Insulating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a technique for suppressing heat generated by an electronic component in an electronic device or a substrate on which the electronic component is mounted, and diffusing heat.
  • Various electronic devices such as personal computers and mobile phones are equipped with many electronic components such as a hard disk drive, a cooling fan, and a motor, and abnormal noise generated from these electronic components has been a problem.
  • small electronic devices such as thin and light notebook computers and smartphones have been reduced in size, and electronic components such as capacitors, inductors, and varistors are mounted on the miniaturized surface with high density.
  • electronic components such as capacitors, inductors, and varistors are mounted on the miniaturized surface with high density.
  • a multilayer ceramic capacitor causes a dielectric ceramic material to vibrate due to electrostriction when an alternating current is applied. When it propagates to the substrate, vibration noise (sounding noise, abnormal noise) may occur.
  • vibration noise sounding noise, abnormal noise
  • a technique for providing a gap between the main body of the capacitor and the electrode connecting portion is described in JP 2012-99538 A (Patent Document 1).
  • the other is a method of covering parts that generate sound with foam and elastic bodies such as urethane foam, which is a sound insulation material.
  • a technique for a composition filled with a heat conductive filler as a foam covering parts It is described in JP2011-511166A (Patent Document 2).
  • the ceramic capacitor component size increases, and a large space for installation is required. Therefore, it becomes a design restriction when performing high-density mounting. In addition, it is difficult to install it later in a place where measures against abnormal noise and heat are required.
  • the electronic component or the substrate on which the electronic component is mounted is covered with a material having a low thermal conductivity such as a foam. It becomes difficult to exhaust heat. Alternatively, heat is transferred to the contact portion with the casing of the electronic device, the keyboard, etc. (exterior member), and a hot spot that is partially heated is generated. In this way, if exhaust heat does not advance, the load on the electronic components and the like will be large, resulting in a decrease in service life and malfunction, and when a hot spot occurs, there is a discomfort caused when the user touches the exterior member. Cause.
  • the present invention has been made paying attention to such problems of the prior art. That is, the object is to provide a heat diffusing sound insulating sheet that can be installed in a narrow space and has sound insulating properties and heat diffusing properties, and a heat diffusing sound insulating structure such as an electronic component using the heat diffusing sound insulating sheet. To do.
  • the present invention is configured as follows. That is, a heat-diffusing sound insulation sheet that is disposed in an exterior member of an electronic device and that isolates noise generated from an electronic component or a substrate on which the electronic component is mounted and diffuses heat, and is a porous material that blocks noise
  • a heat-diffusing sound-insulating sheet comprising a sheet-like sound-insulating member made of a body and a sheet-like heat-diffusing member that is laminated on the sound-insulating member and diffuses heat.
  • a sheet-like sound insulation member made of a porous material such as a foam for insulating noise and a polymer composition filled with a hollow filler is provided, it is possible to suppress leakage of the noise to the outside of the exterior member. .
  • the sheet-like heat diffusing member for diffusing heat is provided on the sound insulating member, the heat generated from the electronic component or the like can be diffused in the surface direction of the sheet through the heat diffusing member. As a result, the heat can be diffused and exhausted without accumulating heat.
  • the sound insulating member and the heat diffusing member are sheet-like, they can be installed in a narrow space such as a gap between the exterior member and the substrate. Therefore, it is difficult to become a design constraint when mounting many electronic components in a small space of a small electronic device, and when measures against abnormal noise or heat are required after design, it can be retrofitted into a narrow space. easy.
  • sound insulation is used as a term including “sound absorption”. Therefore, “sound insulation” includes not only that the sound generated on the substrate side does not escape (shut off) outside the exterior member but also the case where sound is absorbed and reduced.
  • the sound insulation member has a high-density layer made of a compressed porous body. Since the sound insulation member has a high-density layer made of a compressed porous body, the airtightness is increased and the sound insulation can be improved as compared with the case where the porous body is not compressed. In the high-density layer, the bubbles are small (the apparent density is high), the heat insulation action by air is weakened, and the thermal conductivity is increased. Therefore, exhaust heat property can also be improved. In a simple foam that is not compressed, the bubbles forming the porous structure have a spherical shape or an ellipsoidal shape, but the bubbles in the compressed foam are crushed and deformed by pressure to form an indefinite shape. .
  • the high-density layer can be provided partially on the sound insulation member.
  • a laminated structure of a high-density layer made of a compressed porous body and a standard density layer that is a simple porous body can be obtained. Since a pressing load is applied to the electronic component due to the installation of the heat diffusing sound insulation sheet, it is preferable that the load is not applied as much as possible in order not to damage the electronic component. Therefore, depending on the compression resistance required by the electronic component, a high-density layer that is easily subjected to a compressive load is provided in part, and an electronic component having a low compression resistance is covered with a standard density layer.
  • the heat diffusing sound insulation sheet may have a recess for accommodating electronic components. Since it has a recessed part which accommodates an electronic component, it can prevent that an excessive compressive load is applied to the electronic component by accommodating an electronic component in a recessed part. That is, it is possible to avoid such an inconvenience that an excessive compressive load is applied to the electronic component as compared with the case where the electronic component is covered with a heat-diffusing sound insulation sheet having no recess and an equal thickness. Therefore, the pressing load applied to the electronic component can be reduced. Moreover, by accommodating an electronic component in a recessed part, an electronic component can be enclosed with a sound insulation member, and sound insulation can be improved.
  • the electronic part may have a window part facing the heat diffusing member in the concave part. Since the electronic component has a window portion facing the heat diffusing member in the recess, the electronic component can be brought into direct contact with the heat diffusing member without using the sound insulating member. Therefore, the heat generated from the electronic component or the like can be efficiently transmitted to the heat diffusing member and exhausted. Even when the electronic component is not in direct contact with the heat diffusing member, since the sound insulating member is not sandwiched, the exhaust heat performance can be improved.
  • the sound insulating member may have a thin portion that forms a recess. Since the sound insulating member has a thin portion that forms a recess, heat generated from an electronic component or the like can be easily exhausted. That is, if there is a thin portion on the surface facing the upper surface of the electronic component, the thermal conductivity is increased by the thinness. Moreover, since the electronic component is surrounded by the sound insulation member including the thin portion, sound leakage can be effectively prevented.
  • the thin portion can be a high density layer. If the thin-walled portion is formed of a high-density layer, more excellent sound insulation and thermal diffusivity can be provided.
  • a heat insulating member can be further provided on the surface of the heat diffusing member opposite to the surface provided with the sound insulating member. Since the heat insulating member is further provided on the surface opposite to the surface on which the sound insulating member of the heat diffusing member is provided, heat transfer to the exterior member can be suppressed.
  • the heat diffusing sound insulation sheet may be provided so as to cover the entire substrate of a small electronic device, for example, or may be provided so as to cover a part of the substrate.
  • the former since the entire substrate is covered, it is possible to prevent sound leakage and unpleasant sensation when an abnormal sound source or heat generation source covers a wide range on the substrate.
  • the latter can be provided so as to cover a specific electronic component or an integrated part where electronic components are integrated, and according to this, it is possible to concentrate on the places where countermeasures are required and prevent the occurrence of the above-mentioned problems. it can.
  • the heat diffusing sound insulation structure includes the heat diffusing sound insulation sheet in the exterior member of the electronic device, the exterior member is opposed to the heat diffusion member or the heat insulation member, and the electronic component or the electronic is disposed on the sound insulation member side.
  • a heat diffusing sound insulation structure in which a heat diffusing sound insulation sheet is arranged with a substrate on which components are mounted facing each other.
  • the sound insulating member is disposed opposite to the electronic component or the substrate side, the protruding electronic component or the plurality of electronic components having different heights provided on the substrate can be pressed and covered with the soft sound insulating member.
  • the relatively hard heat diffusing member can be brought into contact with the exterior member having relatively few surface irregularities. Therefore, a heat diffusable sound insulation sheet can be installed in a small electronic device without difficulty. Since the sound insulating member and the heat diffusing member are provided, a heat diffusing sound insulating structure excellent in sound insulating property and heat exhausting property, and a small electronic device having such a structure can be provided.
  • the heat-diffusing sound-insulating sheet of the present invention and the heat-diffusing sound-insulating structure using the same can suppress the generation of abnormal noise from electronic equipment. Moreover, it is possible to prevent the occurrence of hot spots that are partially high in temperature. Furthermore, the heat diffusing sound insulation sheet of the present invention and the heat diffusing sound insulation structure using the same can be installed in a narrow space such as a gap between the exterior member and the substrate, and design restrictions when mounting electronic components etc. at high density It can be installed retrospectively in places where sound insulation measures and heat measures are required after design.
  • FIG. 3A is a partial cross-sectional view of a heat diffusing sound insulating sheet
  • FIG. 3A is a heat diffusing sound insulating sheet of the second embodiment
  • FIG. 3B is a modification example 1
  • FIG. Modified example 2 and FIG. 3D show modified example 3
  • divided figure 3E shows modified example 4, respectively.
  • FIG. 4 is a partial cross-sectional view of a state in which a heat diffusing sound insulating sheet is covered on a substrate
  • FIG. 4A shows a heat diffusing sound insulating sheet of the third embodiment
  • FIG. 4B shows a modification thereof.
  • FIG. 5A is a partial cross-sectional view of a heat diffusing sound insulating sheet
  • FIG. 5A is a heat diffusing sound insulating sheet of the fourth embodiment
  • FIG. 5B is a modification example 1
  • FIG. Modification 2 is shown respectively. It is a fragmentary sectional view of the heat diffusion sound insulation sheet of a 5th embodiment.
  • a notebook personal computer 1 as an “electronic device” has a heat diffusing sound insulation sheet 10 or the like installed between a substrate 2 and a housing 2 and a keyboard 3 as “exterior members”. Sound leakage of abnormal noise generated from the component 5 or the substrate 4 is prevented, and heat generated from the electronic component 5 or the substrate 4 is diffused to prevent generation of hot spots.
  • various embodiments of the thermal diffusive sound insulating sheet 10 and the like will be described, but the same reference numerals are given to the configurations common to the respective embodiments, and duplicated descriptions are omitted, and common materials and functions and effects are omitted. The redundant description of the manufacturing method is also omitted.
  • the heat diffusing sound insulating sheet 10 of this embodiment includes a sound insulating member 15 and a heat diffusing member 16, and is formed in a sheet shape in which the sound insulating member 15 and the heat diffusing member 16 are laminated. ing.
  • the heat diffusing sound insulating sheet 10 is installed in the notebook computer 1 with the heat diffusing member 16 facing the housing 2 side and the sound insulating member 15 facing the substrate 4 side.
  • the sound insulation member 15 is constituted by a porous body such as a polymer composition filled with a foam or a hollow filler in order to block sound.
  • the sound insulating member 15 is formed in a sheet shape so as to be easily attached in a narrow space such as a gap between the electronic component 5 and the housing 2 and has flexibility.
  • the material of the foam is resin or rubber, for example, polystyrene, polyurethane, polyethylene, silicone, acrylonitrile copolymer, polyolefin rubber, acrylic rubber, fluorine rubber, or the like.
  • the foam type may be either an open-cell type or a closed-cell type, but the open-cell type has a sound absorbing effect by repeating sound reflection and attenuation through the inside of the continuous cell. In contrast, the closed cell type does not have such an effect. On the other hand, it is considered that the sound blocking effect that reflects the sound on the foam surface so as not to be transmitted to the foam is the same for both the open cell type and the closed cell type. Therefore, the open cell type is preferable because it generally has excellent sound insulation performance.
  • the sound insulation member 15 can be manufactured by a mechanical foaming method, a physical foaming method, or a chemical foaming method.
  • the polymer composition that fills the hollow filler includes urethane, silicone, acrylic rubber, polyolefin rubber, and the like.
  • inorganic hollow filler selected from glass balloon, silica balloon, carbon balloon, alumina balloon, zirconia balloon, etc. phenol resin, urea resin, acrylonitrile, vinylidene chloride, acrylate ester and methacrylate ester
  • Polymers of selected monomers, and organic hollow fillers selected from copolymers of these two or more monomers include phenol resins, urea resins, vinylidene chloride, acrylonitrile, acrylates and methacrylic acid. Polymers of monomers selected from esters and organic hollow fillers selected from copolymers of these two or more monomers are preferred.
  • the specific gravity of these hollow fillers is about 0.1 to 0.8 for inorganic hollow fillers and about 0.01 to 0.2 for organic hollow fillers.
  • the average particle size of the hollow filler is 2 ⁇ m to 100 ⁇ m.
  • the blending amount of the hollow filler in the polymer composition filled with the hollow filler is 20 to 30 parts by weight in the case of the inorganic hollow filler and 5 to 20 parts by weight in the case of the organic hollow filler with respect to 100 parts by weight of the polymer composition. It is.
  • the thickness of the sound insulation member 15 can be 0.1 mm to 10 mm. If it is thinner than this, the handleability will be poor and slicing will be difficult. Moreover, since the strength is reduced, pinholes are likely to occur. On the other hand, if it is thicker than this, a large space is required for installation, so that it is difficult to mount the electronic component 5 in a narrow space such as a gap between the housing 2 and the like.
  • the heat diffusion member 16 is a member that is laminated on a porous body having poor heat conductivity and promotes heat diffusion in a planar shape, and is a metal sheet such as copper foil or aluminum foil having heat conductivity, a graphite sheet, And a high thermal conductive ceramic sheet such as a boron nitride sheet.
  • the thickness of the heat diffusion member 16 can be 0.004 mm to 0.1 mm. When it is thinner than 0.004 mm, the handleability is deteriorated and the strength is lowered. Moreover, since thermal diffusivity falls, so that the cross-sectional area of the thermal diffusion member 16 becomes small, when thickness is thin, thermal diffusivity will fall. When it is thicker than 0.1 mm, the heat-diffusing sound insulation sheet 10 becomes hard and increases in weight, and thus the electronic component 5 and the substrate 4 are easily damaged or damaged. There is also a problem that the manufacturing cost increases as the heat diffusion member 16 becomes thicker.
  • the sound insulation member 15 and the heat diffusion member 16 can be laminated by thermocompression bonding, but can also be bonded with an adhesive or a double-sided tape.
  • the heat diffusing sound insulation sheet 10 When installing the heat diffusing sound insulation sheet 10 on the notebook computer 1, it can be fixed to the upper surface of the electronic component 5 or simply covered without being fixed. If it adheres to the electronic component 5, it can prevent that it deviates from an installation position and the sound-insulation effect reduces. Further, even if the electronic component 5 is simply covered, it is difficult to be displaced depending on the installation location, and there is no need for fixing.
  • the operation and effect of the heat diffusing sound insulation sheet 10 will be described.
  • Abnormal noise generated from the electronic component 5 and the substrate 4 can be prevented from leaking to the outside by the sound insulating member 15 covering the upper surface of the electronic component 5. Further, the heat generated from the electronic component 5 and the substrate 4 is diffused by the heat diffusing member 16 to prevent generation of a hot spot where the heat is concentrated on a part so as not to cause discomfort to the user. it can.
  • the heat-diffusing sound-insulating sheet 10 has a sound-insulating member 15 made of a porous body and has flexibility in the form of a sheet, and has a heat-diffusing member 16 made of copper foil or the like and can maintain a certain shape. Therefore, it is possible to change the shape to suit the installation location and maintain the shape. Therefore, as shown in FIG. 2, it can be retrofitted in a narrow space such as a gap between the housing 2 and the substrate 4 or a place where sound insulation measures and heat measures are required after design.
  • FIG. 3A shows a cross-sectional view of the heat diffusing sound insulation sheet 20 of the present embodiment.
  • the heat diffusing sound insulation sheet 20 has a high density layer 15a made of a compressed foam in the sound insulation member 15, and is laminated with a standard density layer 15b made of a simple foam.
  • the porous structure of the standard density layer 15b made of mere foam forms a spherical or elliptical cavity.
  • the shape of the cavity is It has an indefinite shape that is crushed and deformed by pressure.
  • the high-density layer 15a can be manufactured by heating and compressing an uncompressed foam.
  • a foam that has been compressed so that its apparent density is about 70 to 350 kg / m 3 can be used as the high-density layer 15a.
  • the sound reduction amount was about 13 dB, while it was about 21 dB for 200 kg / m 3 and about 21 dB for 420 kg / m 3. It was 30 dB. That is, it was found that the amount of sound reduction increases with the use of a foam having a high compressibility and a high density, and an excellent sound insulation effect is achieved.
  • the compressive load on the foam exceeds 300 N, the electronic component 5 and the substrate 4 are easily damaged or damaged. Therefore, an experiment was conducted to examine the relationship between the apparent density of the foam and the compression load.
  • Four types of foams having a uniform thickness of 1 mm but different apparent densities were prepared, and the compression load was measured when the volume of the foam was compressed to 75% before compression (25% compression).
  • the foam having an apparent density of about 70 kg / m 3 was about 10 N, 210 kg / m 3 about 5 N, 420 kg / m 3 about 200 N, and 630 kg / m 3 about 550 N.
  • the foam with an apparent density of about 70 kg / m 3 was about 10 N, 210 kg / m 3 about 90 N, 420 kg / m m 3 at about 700 N, was about 1900N at the same 630 kg / m 3. That is, as the density of the foam becomes higher, the compressive load becomes higher and it becomes harder, so that the electronic component 5 and the substrate 4 are easily broken and damaged.
  • a foam with an apparent density of about 70 kg / m 3 is a standard foam that has not been compressed (compression ratio is 1), and a foam with an apparent density of 210 kg / m 3 has a volume of the standard foam of 1 Compressed to / 3 (compression rate 3 times).
  • a foam with an apparent density of 420 kg / m 3 compresses the standard foam to 1/6 (compression ratio 6 times), and a foam with an apparent density of 630 kg / m 3 is a standard foam.
  • the body was compressed to 1/9 (compression rate 9 times).
  • the high-density layer 15a made of the compressed foam has high airtightness and therefore has excellent sound insulation performance. Moreover, although the above-mentioned experiment was performed about the foam which has open cells, when there are some closed cells in the open cells of the foam, the closed cells communicate with the open cells by compressing it. Therefore, even when it has closed cells, it is considered that it has excellent sound insulation performance by compression. In addition, although air has a heat insulating action, the high-density layer 15a has a smaller cavity (higher apparent density) than the standard density layer 15b, and therefore has low heat insulation and high thermal conductivity. However, on the other hand, the compressed foam becomes hard and the compressive load tends to increase. Therefore, it can be seen that the high density layer 15a is partially adopted to improve sound insulation and exhaust heat, while leaving the standard density layer 15b so as not to increase the pressing load more than necessary. It was.
  • the high-density layer 15a can be disposed so as to be in contact with the electronic component 5.
  • excellent sound insulation by the high density layer 15a is obtained. Even if the high-density layer 15a contacts the electronic component 5, the electronic component 5 indirectly contacts the standard density layer 15b, so that the compressive load can be weakened.
  • the sound insulation member 15 can be made of a polymer composition filled with a hollow filler instead of the foam.
  • a hollow filler when used, the high-density layer 15a can be obtained, but it is difficult to increase the degree of compression. For this reason, it is preferable to use a foam because a high-density layer 15a exhibiting desired performance can be easily obtained.
  • each bubble is partitioned by a wall, so there is no water penetration into the bubbles or air convection, and water resistance and It is preferable at the point which is excellent in heat insulation.
  • the thermal diffusive sound insulation sheet 21 shown in FIG. 3B is a thermal diffusive sound insulation sheet in which the thermal diffusion member 16, the high density layer 15a, and the standard density layer 15b are laminated in this order.
  • the standard density layer 15b is exposed to the outside. Therefore, when the standard density layer 15b is brought into contact with the electronic component 5 or the substrate 4, the compressive load received by the electronic component 5 or the substrate 4 can be reduced as compared with the case where the high density layer 15a is brought into contact.
  • FIG. 3C Modification 2 of the second embodiment (FIG. 3C):
  • the heat diffusing sound insulation sheet 22 shown in FIG. 3C forms a sound insulation member 15 having a three-layer structure in which the front and back surfaces are covered with the standard density layer 15b with the high density layer 15a as the center.
  • a heat diffusion member 16 is laminated on the sound insulation member 15. Since the high-density layer 15a excellent in sound insulation and heat transfer is sandwiched between the soft standard density layers 15b, it is suitable when parts with low compression resistance are used not only on the substrate 4 side but also on the exterior member 2 side. Can be used.
  • FIG. 3D Modification 3 of the second embodiment (FIG. 3D):
  • the thermal diffusing sound insulation sheet 23 shown in FIG. 3 (D) is provided with a high density layer 15a only in a portion in contact with the electronic component 5, and a standard density layer 15b over the entire sheet, a thermal diffusion layer.
  • the members 16 are sequentially stacked. Since the high-density layer 15a having high sound insulation properties can be brought into contact with the electronic component 5, effective sound insulation is possible.
  • the thermal diffusive sound insulation sheet 24 shown in FIG. 3E has a high density layer 15a and a standard density layer 15b provided in parallel, and the high density layer 15a and the standard density layer 15b are laminated in the sheet thickness direction. Different from the heat-diffusing sound insulation sheet 20 and the like.
  • the heat diffusing sound insulation sheet 24 can be appropriately arranged with a high density layer 15a and a standard density layer 15b according to the difference in compression resistance of various electronic components 5 provided on the substrate 4 to be coated. For this reason, the electronic component 5 having low compression resistance is covered with the standard density layer 15b, and the electronic component 5 having high compression resistance is covered with the high density layer 15a, so that the electronic component 5 is effectively protected. Sound can be insulated.
  • FIG. 4A shows a cross-sectional view of the heat diffusing sound insulation sheet 30 of this embodiment.
  • the heat-diffusing sound insulation sheet 30 has a recess 18 that accommodates the electronic component 5 protruding from the substrate 4. Further, the recess 18 has a window 18 a where the electronic component 5 faces the heat diffusing member 16.
  • a portion corresponding to the electronic component 5 of the sound-insulating member 15 is punched and the heat-diffusing member 16 is laminated thereon to form the recess 18 with the window portion 18a. it can.
  • the heat diffusing sound insulation sheet 30 surrounds the electronic component 5 with the side surface portion 17, so that sound leakage in the extending direction of the sheet can be reliably prevented. Further, in order to accommodate the electronic component 5 in the recess 18 having the window portion 18a, the electronic component 5 is brought into contact with the heat diffusing member 16, and the heat generated from the electronic component 5 or the substrate 4 is directly passed through the sound insulating member 15 Thus, heat can be exhausted through the heat diffusion member 16. Therefore, the thermal diffusion effect can be enhanced.
  • the thermal diffusive sound insulation sheet 31 shown in FIG. 4B forms a concave portion 18 that matches the shape of the integrated portion 6 in which a plurality of electronic components 5 are integrated and arranged.
  • the noise is generated by resonance between the plurality of electronic components 5. Sound leakage can be effectively prevented in such a case.
  • FIG. 5A shows a cross-sectional view of the heat diffusing sound insulation sheet 40 of the present embodiment.
  • the heat-diffusing sound insulation sheet 40 has a shape in which the sheet-like sound insulation member 15 is partially cut out, and has a recess 18 that accommodates the electronic component 5.
  • the recess 18 provided in the heat diffusing sound insulating sheet 40 is formed with a thin portion 18b made of the sound insulating member 15.
  • the component 5 does not directly contact the heat diffusion member 16.
  • the thin portion 18b in the present embodiment is a standard density layer 15b.
  • the thin portion 18b made of the standard density layer 15b can be provided by partially cutting the sheet-like standard density layer 15b.
  • the heat diffusing sound insulating sheet 40 has the thin portion 18b, not only the side surface of the electronic component 5 but also the upper surface can be covered with the sound insulating member 15, so that the electronic component 5 contacts the heat diffusing member 16 through the window portion 18a. Sound leakage can be reliably prevented as compared with the heat diffusing sound insulation sheet 30. Further, since the upper surface of the electronic component 5 is covered with the heat diffusion member 16 with the thin-walled portion 18b sandwiched therebetween, the heat generated from the electronic component 5 and the substrate 4 is heated through the thin-walled portion 18b having relatively high thermal conductivity. It is easy to be transmitted to the diffusing member 16. As a result, exhaust heat performance can be improved.
  • the thin portion 18b is formed of the high density layer 15a.
  • the thin portion 18b made of the high-density layer 15a can be provided by replenishing the separately formed high-density layer 15a after cutting out the sheet-like standard density layer 15b so as to form a through hole.
  • the high-density layer 15a may be replenished by fixing the high-density layer 15a to the standard density layer 15b with an adhesive.
  • the high-density layer 15a is press-fitted into the standard density layer 15b and the heat diffusion member 16 is filled with the standard density layer 15b. And the high-density layer 15a can be bonded together.
  • the standard density layer 15b can be provided by partial compression. Since the heat-diffusing sound-insulating sheet 41 has the thin-walled portion 18b formed of the high-density layer 15a, both the sound-insulating property and the heat-diffusing property can be improved as compared with the case where the thin-walled portion 18b is formed of the standard-density layer 15b. .
  • the concave portion 18 is formed by the high-density layer 15a
  • the periphery of the concave portion 18 is formed by the standard density layer 15b.
  • the side surface and the upper surface of the electronic component 5 are covered with a high-density layer 15a having a high sound insulation property. Therefore, the sound insulation in the side surface direction can be improved as compared with the case where the side surface of the electronic component 5 is in contact with the standard density layer 15b.
  • the high-density layer 15a in contact with the side surface of the electronic component is also excellent in thermal conductivity to the heat diffusing member 16, the heat dissipation can be improved as compared with the case in which the side surface is in contact with the standard density layer 15b.
  • FIG. 6 shows a cross-sectional view of the heat diffusing sound insulation sheet 50 of the present embodiment.
  • the heat diffusing sound insulating sheet 50 further has a heat insulating member 19 on the surface opposite to the surface on which the sound insulating member 15 of the heat diffusing member 16 is provided. If the heat diffusing member 16 is exposed without providing the heat insulating member 19, heat from the substrate 4 side is directly transmitted to a part of the exterior member through the heat diffusing member 16, so that the portion tends to become a hot spot. May occur. Further, since the heat diffusing member 16 has high conductivity, unexpected conduction may occur in the exterior member that contacts the heat diffusing member 16. On the other hand, if the heat insulating member 19 is provided, heat is diffused widely through the heat diffusing member 16, and unexpected conduction and appearance of hot spots can be prevented.
  • an uncompressed porous body or a compressed porous body similar to the sound insulating member 15 can be used as the material used for the heat insulating member 19.
  • a fiber-based heat insulating material such as a nonwoven fabric or glass cloth, an inorganic heat insulating material such as ceramics or silica, a heat ray reflective sheet, or the like can be used.
  • the sound insulation member 15 of the heat diffusing sound insulation sheets 10, 30 and 50 can be formed by a high density layer 15a which is a compressed porous body instead of the standard density layer 15b made of a simple porous body. Further, it is possible to change the heat diffusing sound insulation sheet 42 having the recesses 18 by providing the heat insulating member 19.
  • the high-density layer 15a can form a number of different types of high-density layers 15a depending on the degree of compression, changes such as providing a plurality of high-density layers 15a having different compression densities for each portion are possible. It is.
  • the heat diffusing sound insulating sheets 10, 30, 50 can be mounted in a narrow space, they can be suitably used for thin and light portable electronic devices.
  • the “exterior member” is not limited to a notebook computer. Various small electronic devices such as smartphones and tablets may be used.
  • the electronic components covered with the heat diffusing sound insulation sheets 10, 30, 50 may be electronic components such as a hard disk drive, a cooling fan, and a motor. It can also be used for sound insulation from these hard disk drives.
  • 1 notebook PC 1 notebook PC, 2 housing, 3 keyboard, 4 substrate, 5 electronic components, 6 integration unit, 10, 11, 12, 20, 21, 22, 23, 24, 30, 31, 40, 41, 42, 50 heat Diffuse sound insulation sheet, 15 sound insulation member, 15a high density layer, 15b standard density layer, 16 heat diffusion member, 17 side surface portion, 18 recess, 18a window portion, 18b thin wall portion, 19 heat insulation member

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Electromagnetism (AREA)
  • Casings For Electric Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
  • Soundproofing, Sound Blocking, And Sound Damping (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

La présente invention concerne une feuille d'isolation sonore à diffusion de chaleur, qui comprend d'excellentes caractéristiques d'isolation sonore et d'excellentes caractéristiques de diffusion de chaleur, et une structure d'isolation sonore à diffusion de chaleur utilisant la feuille d'isolation sonore à diffusion de chaleur. La feuille d'isolation sonore à diffusion de chaleur est obtenue par stratification d'un élément de diffusion de chaleur (16) sur un élément d'isolation sonore (15). Par dépôt à l'intérieur d'un élément externe, tel qu'un boîtier (2), un clavier (3), etc., d'un petit dispositif électronique, le bruit généré par une pièce électronique (5) ou une carte de circuit (4) sur laquelle est montée une pièce électronique (5) peut être isolé. De plus, par diffusion de la chaleur générée par la pièce électronique (5) ou la carte de circuit (4) sur laquelle est montée la pièce électronique (5), une gêne due à des points chauds générés sur l'élément externe peut être réduite.
PCT/JP2013/070968 2012-08-07 2013-08-02 Feuille d'isolation sonore à diffusion de chaleur et structure d'isolation sonore à diffusion de chaleur WO2014024786A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201380036808.9A CN104471637B (zh) 2012-08-07 2013-08-02 热扩散性隔音板及热扩散性隔音结构
JP2014529465A JP6312323B2 (ja) 2012-08-07 2013-08-02 熱拡散性遮音シートおよび熱拡散性遮音構造

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JP2012-174849 2012-08-07

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WO2016042739A1 (fr) * 2014-09-17 2016-03-24 パナソニックＩｐマネジメント株式会社 Feuille de dissipation thermique et structure de dissipation thermique qui l'utilise
WO2016092964A1 (fr) * 2014-12-12 2016-06-16 日東電工株式会社 Boîtier de dispositif électronique et feuille de scellement
JP2017118042A (ja) * 2015-12-25 2017-06-29 株式会社ジャパンディスプレイ 積層フィルム、電子素子、プリント基板及び表示装置
JP2018200099A (ja) * 2017-05-26 2018-12-20 株式会社デンソー 振動伝搬部品を備える製品および車両用空調装置
WO2020116577A1 (fr) * 2018-12-05 2020-06-11 デンカ株式会社 Matériau absorbant acoustique poreux, procédé de production de ce matériau et procédé d'absorption acoustique

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WO2017111695A1 (fr) 2015-12-22 2017-06-29 Razer (Asia-Pacific) Pte. Ltd. Ensembles de maillages, systèmes informatiques et procédés de fabrication d'un ensemble de maillages
EP3411891B1 (fr) * 2016-03-21 2022-01-19 Siemens Energy Global GmbH & Co. KG Dispositif électrique comprenant un dispositif de refroidissement et un dispositif d'atténuation acoustique et appareil électrique comprenant le dispositif électrique
CN107946113A (zh) * 2017-12-20 2018-04-20 苏州佳值电子工业有限公司 一种用于键盘组件的铝箔基材

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WO2016042739A1 (fr) * 2014-09-17 2016-03-24 パナソニックＩｐマネジメント株式会社 Feuille de dissipation thermique et structure de dissipation thermique qui l'utilise
CN106537581A (zh) * 2014-09-17 2017-03-22 松下知识产权经营株式会社 散热片材以及使用该散热片材的散热结构体
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WO2016092964A1 (fr) * 2014-12-12 2016-06-16 日東電工株式会社 Boîtier de dispositif électronique et feuille de scellement
JP2017118042A (ja) * 2015-12-25 2017-06-29 株式会社ジャパンディスプレイ 積層フィルム、電子素子、プリント基板及び表示装置
JP2018200099A (ja) * 2017-05-26 2018-12-20 株式会社デンソー 振動伝搬部品を備える製品および車両用空調装置
JP7077668B2 (ja) 2017-05-26 2022-05-31 株式会社デンソー 振動伝搬部品を備える製品および車両用空調装置
WO2020116577A1 (fr) * 2018-12-05 2020-06-11 デンカ株式会社 Matériau absorbant acoustique poreux, procédé de production de ce matériau et procédé d'absorption acoustique

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CN104471637A (zh) 2015-03-25
CN104471637B (zh) 2018-06-05
TW201428790A (zh) 2014-07-16
JPWO2014024786A1 (ja) 2016-07-25
TWI587331B (zh) 2017-06-11
JP6312323B2 (ja) 2018-04-18

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