WO2014021439A1 - ヒートシンク付配線板、ヒートシンク付部品実装配線板及びそれらの製造方法 - Google Patents
ヒートシンク付配線板、ヒートシンク付部品実装配線板及びそれらの製造方法 Download PDFInfo
- Publication number
- WO2014021439A1 WO2014021439A1 PCT/JP2013/070937 JP2013070937W WO2014021439A1 WO 2014021439 A1 WO2014021439 A1 WO 2014021439A1 JP 2013070937 W JP2013070937 W JP 2013070937W WO 2014021439 A1 WO2014021439 A1 WO 2014021439A1
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- WIPO (PCT)
- Prior art keywords
- wiring board
- heat sink
- layer
- adhesive layer
- support
- Prior art date
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
Definitions
- the present invention relates to a wiring board with a heat sink, a component mounting wiring board with a heat sink, and a method of manufacturing the same.
- the amount of heat generated by electronic components is increasing year by year due to the miniaturization or integration of electronic components, and high heat dissipation is required for wiring boards on which electronic components are mounted. For this reason, conventionally, in order to improve heat dissipation, a heat radiating member such as a heat sink is attached to the wiring board. Furthermore, this wiring board is required to release the heat generated by the electronic component to the outside more efficiently. For this reason, a so-called metal-based wiring board is often used in which a metal plate such as aluminum or copper is arranged on one side on the surface opposite to the circuit layer (hereinafter also referred to as “rear surface”) (for example, Japanese Patent Laid-Open 9-46051). Generally, a metal base wiring board is attached to a heat sink via an adhesive sheet or the like after component mounting.
- the metal base wiring board uses a rigid metal substrate having a thickness of about 1 mm, and there is a problem that even if a thin adhesive sheet is inserted between the metal base wiring board and the rigid heat sink, the wiring board cannot be sufficiently adhered.
- a part of the wiring board may be screwed to the heat sink so as not to peel off from the adhesive sheet.
- this method takes time and labor for fixing screws, and if a part of the wiring board is fixed with screws, unevenness occurs in the adhesion of the entire wiring board, which may increase the thermal resistance.
- a flexible wiring board has flexibility among wiring boards, it is possible to attach a wiring board to a heat sink even with a relatively thin adhesive sheet.
- the thickness of the pressure-sensitive adhesive sheet is thin, it cannot be said that the resistance to the reflow process during component mounting is sufficient. For this reason, a comparatively thin adhesive sheet will be affixed on the wiring board after component mounting. Since the component protrudes from the surface of the wiring board on which the component is mounted, if the component is strongly pressed to attach the wiring board on which the component is mounted to the heat sink, the component may be destroyed.
- an object of the present invention is to provide a wiring board with a heat sink, a component mounting wiring board with a heat sink, and a method for manufacturing them, which have excellent adhesion between the wiring board and the heat sink and have high thermal conductivity.
- the metal circuit layer of the first laminate including a wiring board including a metal circuit layer, a support, and an adhesive layer in this order, and a first temporary support disposed on the adhesive layer.
- a second temporary support is arranged to obtain a second laminate, and from the second laminate, the first temporary support is removed to obtain a third laminate,
- the manufacturing method of the wiring board with a heat sink including making the adhesive material layer and heat sink of a said 3rd laminated body contact, and hardening the said adhesive material layer.
- [2] The method for manufacturing a wiring board with a heat sink according to [1], wherein an average value of the total thickness of the support and the adhesive layer is 6 ⁇ m or more and 100 ⁇ m or less.
- [3] The method for manufacturing a wiring board with a heat sink according to [1] or [2], wherein the support includes an insulating layer, and an average thickness of the insulating layer is 3 ⁇ m or more and 60 ⁇ m or less.
- [4] The method for manufacturing a wiring board with a heat sink according to any one of [1] to [3], wherein an average value of the thickness of the adhesive layer is 3 ⁇ m or more and 70 ⁇ m or less.
- [5] The method for manufacturing a wiring board with a heat sink according to any one of [1] to [4], wherein the adhesive layer is thermosetting.
- [6] The method for manufacturing a wiring board with a heat sink according to any one of [1] to [5], wherein the average thickness of the first temporary support is from 15 ⁇ m to 300 ⁇ m.
- the method includes pressurizing to 0.1 MPa to 10 MPa and curing the adhesive layer while heating in a temperature range of 150 ° C.
- the manufacturing method of the wiring board with a heat sink of description [9] including obtaining a wiring board with a heat sink by the manufacturing method according to any one of [1] to [8], and mounting a component on the metal circuit layer of the wiring board with the heat sink. Manufacturing method of component mounting wiring board with heat sink. [10] A wiring board with a heat sink obtained by the production method according to any one of [1] to [8]. [11] A component-mounted wiring board with a heat sink obtained by the manufacturing method according to [9].
- a circuit board material including a circuit forming metal layer, a support, an adhesive layer, and a first temporary support in this order, and a second temporary support, and [1] to [8] The set used for the manufacturing method of the wiring board with a heat sink of any one.
- a wiring board with a heat sink a component mounting wiring board with a heat sink, and a method for manufacturing these having excellent adhesion between the wiring board and the heat sink and high thermal conductivity.
- the term “process” is not limited to an independent process, and is included in the term if the intended purpose of the process is achieved even when it cannot be clearly distinguished from other processes.
- a numerical range indicated by using “to” indicates a range including the numerical values described before and after “to” as the minimum value and the maximum value, respectively.
- the content of each component in the composition means the total amount of the plurality of substances present in the composition unless there is a specific notice when there are a plurality of substances corresponding to each component in the composition.
- the term “layer” includes a configuration formed in a part in addition to a configuration formed in the entire surface when observed as a plan view.
- laminated body means a multilayer body in which two or more layers are superimposed, and the layers included in the multilayer body may be closely bonded to each other, and may be overlapped by peeling or the like. They may be superposed so as to be separable from each other.
- the manufacturing method of a wiring board with a heat sink includes a wiring board including a metal circuit layer, a support, and an adhesive layer in this order, and a first temporary support disposed on the adhesive layer.
- a second temporary support is disposed on the metal circuit layer of the laminate to obtain a second laminate (hereinafter also referred to as a second laminate preparation step).
- Removing the first temporary support to obtain a third laminate (hereinafter also referred to as a third laminate production step), and contacting the adhesive layer of the third laminate and the heat sink And curing the adhesive layer (hereinafter also referred to as an adhesion step).
- the manufacturing method may further include other steps as necessary.
- the method for manufacturing a component mounting wiring board with a heat sink according to the present invention includes obtaining a wiring board with a heat sink by the method for manufacturing a wiring board with a heat sink according to the present invention, and a component on the metal circuit layer of the wiring board with a heat sink.
- the manufacturing method of the component mounting wiring board with a heat sink of the present invention includes a wiring board including a metal circuit layer, a support and an adhesive layer in this order, and a first temporary support disposed on the adhesive layer.
- a second temporary support is disposed on the metal circuit layer of the first laminate including the second laminate (hereinafter also referred to as a second laminate preparation step), the second The first temporary support is removed from the laminated body to obtain a third laminated body in which the adhesive layer is exposed (hereinafter also referred to as a third laminated body production process), and the third The exposed adhesive layer and the heat sink of the laminate are contacted to cure the adhesive layer to obtain a wiring board with a heat sink (hereinafter also referred to as an adhesion step), and the metal circuit of the wiring board with a heat sink Mounting components on the layer (hereinafter also referred to as component mounting process) No.
- the manufacturing method of the component mounting wiring board with a heat sink may further include other steps as necessary.
- the third laminated body obtained by removing the first temporary support from the second laminated body including the wiring board.
- the adhesive layer and the heat sink are bonded to obtain a wiring board with a heat sink.
- the components are mounted on the metal circuit layer of the wiring board with a heat sink.
- a wiring board with a heat sink and a component mounting wiring board with a heat sink obtained by such a manufacturing method are excellent in adhesion between the wiring board and the heat sink and have high thermal conductivity.
- the second temporary support is placed on the metal circuit layer of the wiring board, so the handling and excellent productivity can be achieved. It becomes possible to adhere. Furthermore, since an adhesive generally has higher heat resistance than an adhesive, it is possible to mount a component after obtaining a wiring board with a heat sink. Furthermore, since the wiring board and the heat sink are bonded through an adhesive layer, the thickness of the adhesive layer can be made thinner than in the case of bonding through an adhesive layer, which is further superior. It becomes possible to achieve thermal conductivity. The present invention will be described below.
- the wiring board includes a metal circuit layer, a support, and an adhesive layer in this order.
- the first laminate includes a wiring board and a first temporary support disposed on the adhesive layer of the wiring board. That is, the first laminated body includes a metal circuit layer, a support, an adhesive layer, and a first temporary support in this order.
- the second laminate is obtained by arranging the second temporary support on the metal circuit layer of the first laminate. That is, the second laminated body includes a second temporary support, a metal circuit layer, a support, an adhesive layer, and a first temporary support arranged in this order.
- the third laminate is obtained by removing the first temporary support from the second laminate.
- the third laminated body includes a second temporary support, a metal circuit layer, a support, and an adhesive layer arranged in this order.
- the wiring board with a heat sink is obtained by bringing the adhesive layer and the heat sink in the third laminate into contact with each other and curing the adhesive layer.
- the second temporary support included in the third laminate may be removed.
- the wiring board with a heat sink includes a heat sink, a cured adhesive layer obtained by curing the adhesive layer, a support, and a metal circuit layer in this order.
- a component-mounted wiring board with a heat sink is obtained by mounting a component on the metal circuit layer of the wiring board with a heat sink.
- the component mounting wiring board with a heat sink includes a heat sink, a cured adhesive layer obtained by curing the adhesive layer, a support, a metal circuit layer, and a component in this order.
- a heat sink a cured adhesive layer obtained by curing the adhesive layer
- a support a support
- a metal circuit layer a component in this order.
- Each of the first laminated body, the second laminated body, and the third laminated body can include other layers as necessary.
- the first temporary support in the present invention may also be referred to as a support separator
- the second temporary support may be referred to as a transport support substrate.
- FIG. 1 shows a wiring board 82 with a heat sink including the metal circuit layer 11, the insulating layer 17 as a support, the adhesive layer 16, and the heat sink 50 in this order.
- the adhesive layer 16 in the wiring board 82 with a heat sink is cured to form a cured adhesive layer.
- FIG. 2 shows a wiring board material 35 including the circuit forming metal layer 10, the insulating layer 17 as a support, the adhesive layer 16, and the support separator 22 in this order.
- FIG. 6 shows a component mounting wiring board 102 with a heat sink in which the component 40 is mounted on the metal circuit layer 11 of the wiring board 82 with a heat sink via a conductive connection material 42.
- the wiring board material which contains the metal layer for circuit formation, a support body, an adhesive material layer, and the separator for support in this order is prepared. Since the wiring board material includes a supporting separator, the handling property is excellent.
- the wiring board material is, for example, a laminate having an adhesive layer disposed on a support separator on a support of a laminate of a support and a circuit-forming metal layer so that the adhesive layer is in contact with the support. It can be obtained by overlapping.
- a circuit forming process is performed on the prepared wiring board material, a metal circuit layer is formed on the support, and the wiring board includes the metal circuit layer, the support, and the adhesive layer in this order.
- a first laminate having a supporting separator disposed thereon is obtained. Details of the circuit formation processing will be described later.
- a transport support base material is disposed on the metal circuit layer of the first laminate to obtain a second laminate.
- the supporting separator is removed from the second laminate to obtain a third laminate.
- the third laminate is excellent in handleability because the carrier support substrate is disposed on the metal circuit layer.
- the adhesive layer of the third laminate and the heat sink are brought into contact with each other, and the adhesive layer in contact with the heat sink is cured, so that the surface of the support opposite to the metal circuit layer side and the heat sink To obtain a wiring board with a heat sink bonded through a cured adhesive layer.
- the conveyance support base material in the third laminated body only needs to be removed before the component mounting step described later. That is, it may be removed before the adhesive layer is cured, or may be removed after the adhesive layer is cured.
- the support having the metal circuit layer thereon and the heat sink can be superposed via the cured adhesive layer.
- a wiring board with a heat sink obtained by curing the adhesive layer of the wiring board in contact with the heat sink is used, and the metal circuit layer on the wiring board with the heat sink is used in the component mounting process.
- the component is mounted via a conductive connecting material.
- the heat sink and the support are provided even when subjected to high heat treatment in the component mounting process. Is sufficiently maintained, and component mounting can be performed efficiently.
- FIG. 8 (I) to (III) An example of a conventional method for manufacturing a component-mounted wiring board with a heat sink is shown in FIG.
- FIGS. 8 (I) to (III) conventionally, after the insulating layer 12 and the circuit forming metal layer 10 are arranged in this order on the metal substrate 13, a circuit is formed on the circuit forming metal layer 10.
- the component 40 is mounted on the metal circuit layer 11 obtained by the above process by performing a high temperature process such as a reflow process through the conductive connection material 42 to obtain a component mounting wiring board 75.
- a high temperature process such as a reflow process
- the metal substrate 13 of the component mounting board 75 is brought into contact with the surface of the component mounting wiring board 75 on the metal substrate 13 side by bringing the adhesive material layer 15 with the supporting separator 18 into contact therewith.
- a laminated body in which the adhesive layer 15 and the supporting separator 18 are overlaid is obtained.
- the component mounting wiring board 75 and the heat sink 50 are fixed via the adhesive layer 15, and the heat sink An attached component mounting wiring board 102A is obtained.
- the adhesive material means a substance that has adhesiveness at normal temperature (25 ° C.) and adheres to the adherend with a light pressure, is interposed between objects, and is cured by heat or the like to bond the objects.
- the adhesive is completely different in nature.
- the component mounting wiring board 102A with the heat sink is obtained through such steps. For this reason, in order to bond the component mounting wiring board 75 including the metal substrate 13, the insulating layer 12, the metal circuit layer 11, and the component 40 and the heat sink 50 with sufficient adhesion, the thickness of the adhesive layer 15 is set. It needs to be thick. As a result, the thermal conductivity decreases as the thickness of the adhesive layer 15 increases. Since the component 40 is mounted on the metal circuit layer 11 before the adhesive material layer 15 is disposed, the entire surface of the component mounting wiring board 75 is strongly applied when the component mounting wiring board 75 and the heat sink 50 are bonded together. It cannot be pressed and has poor adhesion. As described above, in the conventional method, the adhesion between the component mounting wiring board 75 and the heat sink 50 is not sufficient, and high thermal conductivity cannot be realized.
- a wiring board with a heat sink and a component mounting with a heat sink having excellent heat-conductivity and excellent adhesion between the wiring board and the heat sink.
- a wiring board can be obtained.
- the component-mounted wiring board with heat sink mounted on the wiring board with heat sink has excellent heat dissipation of the wiring board with heat sink, so that the heat generated by the components can be efficiently released from the heat sink. As a result, the temperature rise of the component can be suppressed, and the electronic component with an improved component life can be provided.
- the wiring board material or the wiring board is handled with at least one of the support separator and the transport support base material, the wiring board material or the wiring board is provided.
- the first laminated body, the second laminated body, and the third laminated body are increased in rigidity and are easy to handle. For this reason, for example, it is possible to individually arrange a plurality of wiring boards that have been segmented into a required size at appropriate positions on the heat sink that are separated from each other. As a result, heat generated from a plurality of components can be dissipated and dissipated, so that an increase in component temperature can be more effectively suppressed.
- a large-sized wiring board corresponding to the entire arrangement region is required to pressurize the entire arrangement region of the plurality of components with good workability.
- a portion of the wiring board that is not effectively used between the plurality of arranged components occupies a large area depending on the arrangement position of the components, so that the efficiency is deteriorated. For this reason, it is not realistic to disperse and arrange a plurality of parts.
- a wiring board can be arrange
- the portion of the wiring board that is not used even if the distance between the components increases is not generated more than necessary, and the components can be arranged efficiently in order to improve heat dissipation.
- a plurality of wiring boards are manufactured together, they are cut into a desired shape and size and pasted at desired positions of individual heat sinks to obtain a wiring board with a heat sink and a component mounting wiring board with a heat sink. It became possible.
- One is necessarily arranged on at least one surface of a laminate such as the first laminate, the second laminate, and the third laminate obtained before the heat sink is attached.
- the workability can be improved by increasing the rigidity of each laminate, and the other surface can be protected when a new layer or member is provided on one surface of each laminate.
- the rigidity of each laminate is increased by at least one of the first temporary support and the second temporary support, for example, the end of the wiring board or the wiring board material is transferred by hand or a jig for transportation or the like.
- the wiring board material includes a circuit-forming metal layer, a support, an adhesive layer, and a support separator in this order.
- the wiring board material may further include other layers as necessary.
- the wiring board includes a metal circuit layer, a support, and an adhesive layer in this order.
- the wiring board may further include other layers as necessary.
- the circuit forming metal layer is not particularly limited as long as it is made of a metal capable of forming a circuit. Generally, it is configured using a metal foil.
- a metal foil a foil of copper, aluminum, iron, gold, silver, nickel, palladium, chromium, molybdenum or an alloy thereof is preferably used.
- a copper foil is preferable from the viewpoint of high conductivity and versatility.
- the average value of the thickness of the metal layer for circuit formation is not particularly limited as long as a circuit can be formed, and is preferably 5 ⁇ m or more and 150 ⁇ m or less from the viewpoint of conductivity, and is 9 ⁇ m or more and 110 ⁇ m or less from the viewpoint of versatility. More preferably, it is more preferably 15 ⁇ m or more and 80 ⁇ m or less from the viewpoint of heat dissipation, and particularly preferably 30 ⁇ m or more and 80 ⁇ m or less from the viewpoint of heat dissipation.
- the average thickness is 5 ⁇ m or more, the heat of the component tends to be diffused from the circuit forming metal layer to the surface of the metal circuit layer formed with the circuit, and the average thickness is 150 ⁇ m or less.
- the average value of the thickness of a layer or a laminate is a value given as an arithmetic average value obtained by measuring the thicknesses of five points of the target layer or laminate.
- the thickness of the layer or laminate can be measured using a micrometer, an eddy current film thickness meter, an electron microscope, or the like.
- the thickness of a layer or a laminated body can be measured directly, it measures using a micrometer.
- the thickness of one layer which comprises a part of laminated body, or the total thickness of several layers it measures by observing the cross section of the laminated body direction of an laminated body using an electron microscope.
- the metal layer for circuit formation may be provided on the entire surface of the support or may be provided only in a partial region on the support.
- the circuit-forming metal layer is preferably provided on the entire surface of the support in order to improve thermal conductivity.
- the metal circuit layer includes a circuit formed on the support. From the viewpoint of high productivity, the metal circuit layer is preferably obtained by a circuit formation process for forming a circuit on the circuit forming metal layer.
- the circuit forming process is not particularly limited, and can be appropriately selected from methods usually used for processing a circuit forming metal layer of a wiring board material.
- a circuit processing method for the circuit-forming metal layer a step of forming a circuit-forming resist in a desired shape on the circuit-forming metal layer using printing, a photoresist film, etc., and a circuit-forming metal layer And a step of removing the circuit forming metal layer in the region where the resist is not formed by etching with a corrosive liquid.
- the average value of the thickness of the metal circuit layer is the average value of the thickness of the portion not eroded by etching or the like, and the specific range of the average thickness is the average value of the thickness of the metal layer for circuit formation described above. Are the same.
- the support in the wiring board material preferably includes an insulating layer.
- the insulating layer is not particularly limited as long as it exhibits insulating properties.
- the insulating layer preferably has an insulating property of 10 10 ⁇ ⁇ cm or more, and more preferably has an insulating property of 10 13 ⁇ ⁇ cm or more from the viewpoint of breakdown voltage.
- the insulation resistance value of the insulating layer is a value measured with an insulation resistance meter at a measurement voltage of 100 V and room temperature (25 ° C.).
- the insulating layer is preferably made of resin in terms of high insulating properties. Examples of the resin include high molecular weight resins such as polyimide and polyester, epoxy resins, silicone resins, acrylic resins, and mixtures thereof.
- These resins may be a mixture of polymer alloys or the like, or may be used alone.
- the polyimide resin is preferably at least one selected from the group consisting of a modified polyimide resin, a polyamideimide resin, and a modified polyamideimide resin from the viewpoint of heat resistance. From the viewpoint of adhesiveness, the polyamideimide resin and the modified polyamideimide are preferable. At least one selected from the group consisting of resins is more preferable, and a silicone-modified polyamideimide resin is more preferable from the viewpoint of stress relaxation.
- the insulating layer may include an acrylic resin having a low crosslink density from the viewpoint of stress relaxation.
- an insulating layer is formed from the resin composition containing an at least 1 sort (s) of polyimide resin or a polyimide precursor from a viewpoint of a mechanical characteristic or an electrical property.
- the polyamic acid which is a polyimide precursor is converted into a polyimide resin in the process of manufacturing the insulating layer.
- the resin composition containing the polyimide resin or the polyimide precursor may optionally contain additional components such as an epoxy compound, an acrylic compound, a diisocyanate compound, a phenol compound and the like, a filler, a coloring material, a leveling agent, and a coupling agent. Is also possible.
- the filler examples include particles of alumina, boron nitride, aluminum nitride, silica, mica and the like.
- the total content of these curing components and additive components is a polyimide resin or a polyimide precursor from the viewpoint of not reducing the mechanical properties or electrical properties that are the effects of using the polyimide resin. It is preferable to make it less than the total content of the body.
- the average thickness of the insulating layer is not particularly limited.
- the average value of the thickness of the insulating layer is preferably 3 ⁇ m or more and 60 ⁇ m or less, more preferably 4 ⁇ m or more and 50 ⁇ m or less, further preferably 5 ⁇ m or more and 40 ⁇ m or less, and more preferably 5 ⁇ m or more and 35 ⁇ m or less. Is more preferably 5 ⁇ m or more and 20 ⁇ m or less, particularly preferably 5 ⁇ m or more and 15 ⁇ m or less, and most preferably 5 ⁇ m or more and 10 ⁇ m or less.
- the insulating layer may be composed of a single layer or may be composed of two or more layers. For example, when the insulating layer has a two-layer structure, the dielectric breakdown voltage is higher in the first layer than the second layer, and the adhesive strength is higher in the second layer than the first layer. You may combine things.
- the glass transition temperature (Tg) of the resin constituting the insulating layer is preferably 100 ° C. or higher, more preferably 150 ° C. or higher, further preferably 200 ° C. or higher, and particularly preferably 250 ° C. or higher in terms of heat resistance. If the glass transition temperature is 100 ° C. or higher, the glass transition temperature can be applied to short-time high-temperature processing in the component mounting process. When the resin has a higher glass transition temperature, for example, if the glass transition temperature is 150 ° C. or higher, the heat resistance against heating during circuit formation tends to be further improved, and if it is 200 ° C. or higher, the heat resistance in the resist forming step. Tend to be more improved, and if it is 250 ° C.
- the glass transition temperature can generally be measured by differential calorimetry (DSC), dynamic viscoelasticity measurement (DMA) or thermomechanical measurement (TMA).
- DSC differential calorimetry
- DMA dynamic viscoelasticity measurement
- TMA thermomechanical measurement
- the glass transition temperature measured under the following measurement conditions by dynamic viscoelasticity measurement (DMA) is adopted as the Tg of the resin constituting the insulating layer.
- a sheet of an insulating layer of 350 ⁇ m obtained by superposing seven insulating layers having an average thickness of 50 ⁇ m is externally processed to a width of 5 mm and a length of 20 mm.
- the insulating layers are stacked using a hot roll laminator at 40 ° C. and 0.3 MPa.
- tan ⁇ when measured under the conditions of a tensile mode, a heating rate of 5 ° C./min, a frequency of 10 Hz, and a measurement temperature of 30 ° C. to 300 ° C.
- the peak temperature is evaluated as Tg.
- Tg When there are a plurality of tan ⁇ peaks, the highest temperature tan ⁇ peak temperature is defined as Tg.
- Examples of other layers applicable to the wiring board as the support include a supporting metal layer.
- the supporting metal layer is not particularly limited as long as it exhibits thermal conductivity, and is generally configured using a metal foil.
- metal foils include the same metal foils used for circuit-forming metal layers or metal circuit layers. From the viewpoint of high thermal conductivity, copper foil is from the viewpoint of workability or weight reduction. Aluminum foil is preferably used for each.
- the surface where the supporting metal layer is in contact with the insulating layer is mechanically roughened by chemical roughening, corona discharge, sanding, plating, aluminum alcoholate, aluminum chelate, silane coupling agent, etc., in order to increase the adhesion to the insulating layer. Alternatively, chemical treatment may be performed.
- a supporting metal layer in the case where a supporting metal layer is included as a support, it may be provided on the entire surface of the insulating layer or only in a part of the region. From the viewpoint of thermal conductivity and workability, it is preferably provided on the entire surface of the insulating layer.
- the average thickness of the supporting metal layer is preferably from 17 ⁇ m to 300 ⁇ m from the viewpoint of weight reduction, and more preferably from 35 ⁇ m to 250 ⁇ m from the viewpoint of heat dissipation.
- a non-thermoplastic polyimide film such as a conventional aromatic polyimide is used.
- Flexible substrate with metal foil using as a polymer insulating film (insulating layer), a material obtained by depositing a metal such as copper on a polyimide film by vapor deposition or sputtering, a material using a thermoformable liquid crystal polymer as a support, etc. can be mentioned.
- an adhesive using an epoxy resin or an acrylic resin described in Japanese Patent Application Laid-Open Nos. 2007-274329, 2007-049502, 2007-168123, etc. is not used because of excellent heat resistance.
- a flexible substrate or a flexible printed substrate can be preferably used.
- the adhesive layer preferably exhibits insulating properties.
- the adhesive layer preferably has an insulation property of 10 10 ⁇ ⁇ cm or more, and more preferably an insulation property of 10 13 ⁇ ⁇ cm or more in terms of dielectric breakdown voltage.
- the insulation resistance value of the adhesive layer is a value measured by the same method as the measurement method of the insulation resistance value of the insulation layer.
- the adhesive layer is preferably thermosetting.
- the thermosetting in the present invention means a property that is cured by heating to become insoluble or infusible and does not return to the original softness.
- the adhesive contained in the adhesive layer has a maximum viscosity of 100 Pa ⁇ s to 1,000,000 Pa ⁇ s before thermosetting and in a temperature range of 20 ° C. to 60 ° C. from the viewpoint of workability.
- the minimum value of the viscosity before temperature setting and in the temperature range of more than 60 ° C. and below 200 ° C. is lower than the maximum value of the viscosity before temperature setting and in the temperature range of 20 ° C. to 60 ° C.
- the maximum value of the viscosity before thermal curing and in the temperature range of 20 ° C. to 60 ° C. is 2 ⁇ 10 2 Pa ⁇ s to 10 ⁇ 10 4 Pa ⁇ s, whereas
- the minimum value of the viscosity in the temperature range of more than 200 ° C. and not more than 200 ° C. is in the range of 10 2 Pa ⁇ s to 7 ⁇ 10 4 Pa ⁇ s, and the maximum in the temperature range of 20 ° C. to 60 ° C. It is more preferable that the viscosity is lower than the viscosity value, and the temperature is 20 to 60 ° C.
- thermosetting Is more preferably in the range of 2 ⁇ 10 2 Pa ⁇ s to 5 ⁇ 10 4 Pa ⁇ s and lower than the maximum value of the viscosity before thermosetting and in the temperature range of 20 ° C. to 60 ° C.
- the high viscosity in the temperature range of 20 ° C. to 60 ° C. before thermosetting facilitates work such as temporary fixing between the wiring board and the heat sink.
- the viscosity of the adhesive layer is lowered within a temperature range exceeding 60 ° C. and not more than 200 ° C. before thermosetting, so that it can be reliably adhered to the support and heat sink of the wiring board. Furthermore, since the adhesive layer is not melted by heating after the adhesive layer is cured, even if a high temperature process such as a reflow process is performed in the component mounting process on the wiring board with a heat sink, It is possible to prevent exudation due to the flow of the adhesive. Further, since the adhesion by curing the adhesive layer is generally stronger than the bonding by the adhesive layer, the wiring board and the heat sink can be coupled without requiring an auxiliary fixing method such as a screw.
- Viscosity is measured by shear viscosity measurement. Specifically, a measurement jig for measuring a shear viscosity measured by ARAS TEST STATION (Rheometric Scientific Co., Ltd.) using a circular flat plate as a measuring jig for sandwiching a sample under conditions of a heating rate of 5 ° C./min and a frequency of 10 Hz To do. The maximum value of the viscosity in the temperature range of 20 ° C. to 60 ° C. may be substituted by the viscosity measured at 60 ° C. from the measurement method and the properties of the thermosetting resin.
- the minimum melt viscosity of the adhesive affects the fluidity of the adhesive contained in the adhesive layer in the heating process or pressure heating process for curing the adhesive layer. Therefore, adjusting the minimum melt viscosity at a temperature range applied in the heating step or the pressure heating step, for example, exceeding 60 ° C. and not more than 200 ° C., can easily prevent handling or outflow of the adhesive material from the end portion. It is preferable from the viewpoint.
- the minimum melt viscosity is the minimum value of the viscosity that appears with a decrease in viscosity due to an increase in temperature and an increase in viscosity due to a curing reaction when the temperature dependence of the viscosity is measured.
- the minimum melt viscosity at 60 ° C. to 200 ° C. is preferably 50 Pa ⁇ s to 7 ⁇ 10 4 Pa ⁇ s, and preferably 10 2 Pa ⁇ s to 2 ⁇ 10 4 Pa ⁇ s.
- the minimum melt viscosity at 60 ° C. and 200 ° C. is 50 Pa ⁇ s or more, the adhesive material from the adhesive layer is temporarily fixed when the wiring board is temporarily fixed to the heat sink or when the adhesive layer of the wiring board with the heat sink is cured. There is a tendency that the decrease in the adhesion area ratio due to the seepage or the occurrence of the thickness variation of the adhesive layer is easily suppressed. Moreover, if the minimum melt viscosity at 60 ° C. and 200 ° C.
- the adhesive contained in the adhesive layer exhibits excellent fluidity when heated, and the heat sink as the adherend is uneven on the surface. Even if it has a structure, it follows the shape of the adherend, and therefore tends to exhibit higher adhesion after curing.
- the adhesive layer adheres the support and the heat sink by a curing process.
- curing means that the viscosity of the adhesive constituting the adhesive layer is increased by the crosslinking reaction, and the adhesive adheres to the adherend and does not melt by heating. For this reason, another layer is simply retained on one layer and can be peeled off with a weaker force (sometimes referred to as “temporary fixation” in this specification), adhesion by an adhesive, and hot melt.
- a weaker force sometimes referred to as “temporary fixation” in this specification
- the adhesive layer preferably contains a thermosetting resin from the viewpoint of reflow resistance during product mounting and adhesion between the heat sink and the wiring board.
- the adhesive layer after the curing treatment contains a thermosetting adhesive, and a laminate in which the support heat sink is more firmly bonded is obtained.
- the thermosetting resin include high molecular weight resins such as polyimide and polyester, epoxy resins, silicone resins, polyurethane resins, acrylic resins, and mixtures thereof.
- the thermosetting resin it is preferable to use at least one selected from the group consisting of a polyimide resin, an epoxy resin, and an acrylic resin from the viewpoint of heat resistance.
- the thermosetting resin may be used as a mixture of a polymer alloy or the like, or may be used alone.
- the polyimide resin is preferably at least one selected from the group consisting of a modified polyimide resin, a polyamideimide resin, and a modified polyamideimide resin from the viewpoint of heat resistance.
- the polyamideimide resin and the modified polyamideimide resin are preferable. More preferable is at least one selected from the group consisting of: a silicone-modified polyamideimide resin from the viewpoint of stress relaxation. These resins may be used as a mixture of polymer alloy or the like, or may be used alone.
- the adhesive layer may include an acrylic resin having a low crosslinking density.
- the adhesive layer may be made from an adhesive composition.
- adhesive compositions used to make adhesive layers are cured components such as epoxy compounds, acrylic compounds, diisocyanate compounds, phenol compounds, fillers, coloring materials, and leveling. It is also possible to optionally include additional components such as an agent and a coupling agent.
- additional components such as an agent and a coupling agent.
- the filler include particles of alumina, boron nitride, aluminum nitride, silica, mica and the like.
- the total content of these curing components and additive components is less than the content of the polyimide resin from the viewpoint of not reducing the mechanical properties or electrical properties that are the effects of using the polyimide resin. It is preferable.
- the glass transition temperature (Tg) of the resin constituting the adhesive layer is preferably 100 ° C. or higher, more preferably 150 ° C. or higher, further preferably 200 ° C. or higher, and particularly preferably 250 ° C. or higher in terms of heat resistance. If the glass transition temperature is 100 ° C. or higher, the glass transition temperature can be applied to short-time high-temperature processing in the component mounting process. When the resin has a higher glass transition temperature, for example, if the glass transition temperature is 150 ° C. or higher, the heat resistance against heating during circuit formation tends to be further improved, and if it is 200 ° C. or higher, the heat resistance in the resist forming step. Tend to be more improved, and if it is 250 ° C.
- the glass transition temperature measured under the following measurement conditions by dynamic viscoelasticity measurement (DMA) is adopted as the Tg of the resin constituting the insulating layer.
- DMA dynamic viscoelasticity measurement
- the bonding of the adhesive layers is performed at 40 ° C. and 0.3 MPa using a hot roll laminator.
- the average value of the thickness of the adhesive layer is not particularly limited. From the viewpoint of thermal conductivity and adhesiveness, the average value of the thickness of the adhesive layer is preferably 3 ⁇ m or more and 70 ⁇ m or less, more preferably 4 ⁇ m or more and 60 ⁇ m or less, and further preferably 5 ⁇ m or more and 50 ⁇ m or less. It is more preferably 5 ⁇ m to 45 ⁇ m, even more preferably 5 ⁇ m to 40 ⁇ m, still more preferably 5 ⁇ m to 30 ⁇ m, still more preferably 5 ⁇ m to 20 ⁇ m, and most preferably 5 ⁇ m to 15 ⁇ m. It is particularly preferable that the thickness is 5 ⁇ m or more and 10 ⁇ m or less. If the average thickness of the adhesive layer is 3 ⁇ m or more, good adhesiveness tends to be obtained, and if it is 70 ⁇ m or less, good thermal conductivity tends to be obtained.
- the average value of the total thickness of the support and the adhesive layer is not particularly limited, and can be appropriately selected according to the purpose.
- the average value of the total thickness of the support and the adhesive layer is preferably 6 ⁇ m to 100 ⁇ m, more preferably 8 ⁇ m to 90 ⁇ m, still more preferably 8 ⁇ m to 80 ⁇ m, and more preferably 8 ⁇ m to 70 ⁇ m. It is particularly preferred.
- the average value of the total thickness of the support and the adhesive layer is 6 ⁇ m or more, the handleability is excellent, and when it is 100 ⁇ m or less, the increase in thermal resistance is suppressed, and the workability tends to be excellent. The increase in mass of can be suppressed.
- the ratio of the average value of the thickness of the adhesive layer to the average value of the thickness of the support is not particularly limited, and can be appropriately selected according to the purpose. From the viewpoint of heat conduction and adhesiveness, the ratio of the average value of the thickness of the adhesive layer to the average value of the thickness of the support (average value of the thickness of the adhesive layer / average value of the thickness of the support) is 0.1. Is preferably from 8.0 to 8.0, more preferably from 0.3 to 6.0, and even more preferably from 0.5 to 4.0.
- the adhesion of the adhesive layer to the heat sink can be evaluated by, for example, the adhesion area ratio measured as follows. Under the same conditions as when the adhesive layer of the wiring board is attached to the heat sink, the adhesive layer of the wiring board is attached to a transparent substrate such as glass or plastic to produce a sample for evaluating the contact area ratio.
- Two fluorescent lamps (1200 mm long, 40 W) are installed in parallel on the ceiling so that the interval is 10.7 cm. The sample is positioned 2 m below the fluorescent lamp so that the two fluorescent lamps are reflected on the transparent substrate and the transparent substrate surface is inclined by 45 ° with respect to the floor direction from the ceiling.
- the longitudinal direction of the light emitting part of the reflected fluorescent lamp and the longitudinal direction (horizontal direction) of the image captured by the digital camera are substantially parallel, and the longitudinal direction of the light emitting part of the reflected fluorescent lamp is
- the positional relationship between the sample and the digital camera is adjusted so that the total length is the same as that of a 75 mm long tape affixed to the sample as a mark, and an evaluation image having 6 million pixels is obtained. From the obtained evaluation image, a part of the region between the two fluorescent lamps and near the center in the longitudinal direction is selected as a rectangular observation region.
- the selected observation area is 80% of the length in the longitudinal direction of the light emitting part of the two fluorescent lamps in which the length in the longitudinal direction is reflected, and the two fluorescent lamps in which the length in the short direction is reflected 70% of the interval.
- All pixels included in the obtained observation area are binarized based on the brightness of each pixel.
- the binarization process is performed by determining a pixel showing a lightness equal to or higher than the reference lightness as a non-contact portion and a pixel showing a lightness lower than the reference lightness as a close contact portion.
- the contact area ratio is calculated as the ratio (%) of the number of pixels in the contact portion to the total number of pixels for all pixels in the binarized observation region.
- the reference brightness for distinguishing between the close contact portion and the non-contact portion is determined as follows. When the adhesive layer of the wiring board is attached to the transparent substrate, a sample in which an adhesion region is partially formed is applied to only a part of the region by applying the same conditions as those applied to the heat sink. An evaluation image is obtained for the prepared sample in the same manner as described above, and an average value obtained from the minimum value of lightness in the close contact region and the maximum value of lightness in other regions is set as the reference lightness.
- the adhesion area ratio is preferably 85% or more, more preferably 90% or more, and further preferably 95% or more. When the adhesion area ratio is 85% or more, sufficient adhesion is obtained and the thermal conductivity is excellent.
- the first laminate including the wiring board and the wiring board material include a support separator (first temporary support) disposed on the adhesive layer.
- the rigidity of the wiring board material is increased, and the productivity of the circuit forming metal layer of the wiring board material in the circuit forming process is improved.
- the rigidity of a 1st laminated body is improved because a 1st laminated body contains a support separator, and it is excellent in handleability.
- the material of the support separator is not particularly limited as long as the rigidity of the first laminate or the wiring board material can be increased.
- a material having high chemical resistance is preferable so that the circuit board processing is not affected by the chemical liquid.
- the material of the support separator is preferably plastic from the viewpoint of flowability or price.
- Plastics applied to the support separator include polyester resins such as polyethylene terephthalate (PET) and polyethylene naphthalate; polyolefin resins such as polyethylene, polypropylene, polystyrene, and ethylene vinyl acetate copolymer (EVA); polyvinyl chloride, poly Vinyl resin such as vinylidene chloride; polysulfone resin; polyethersulfone resin; polycarbonate resin; polyamide resin; polyimide resin; These plastics are preferably used as a film. These can form a supporting separator with a single layer film. Moreover, you may comprise a support separator as a multilayer film which combined two or more layers. Among these, as the plastic film, a polyethylene terephthalate film, a polypropylene film, and a polyethylene film are more preferable in terms of transparency, heat resistance, ease of handling, price, and the like.
- the average thickness of the support separator is not particularly limited. In general, the average thickness of the support separator is preferably 300 ⁇ m or less. There exists a tendency for favorable conveyance property to be acquired as the average value of the thickness of a support separator is 300 micrometers or less.
- the average thickness of the support separator is preferably 15 ⁇ m or more. When the average value of the thickness of the support separator is 15 ⁇ m or more, the rigidity of the first laminate or wiring board material is sufficiently increased, and the handleability tends to be further improved.
- the average thickness of the support separator is preferably 15 ⁇ m or more and 300 ⁇ m or less, more preferably 15 ⁇ m or more and 200 ⁇ m or less, and further preferably 20 ⁇ m or more and 150 ⁇ m or less.
- the average value of the total thickness of the support separator and the adhesive layer is not particularly limited. From the viewpoint of handleability and adhesion of the wiring board material or the first laminate, the average value of the total thickness of the support separator and the adhesive layer is preferably 15 ⁇ m or more and 300 ⁇ m or less, and is 15 ⁇ m or more and 200 ⁇ m or less. Is more preferable, and 20 ⁇ m or more and 150 ⁇ m or less is still more preferable.
- the ratio of the average value of the thickness of the supporting separator to the average value of the total thickness of the wiring board material in the wiring board material is not particularly limited, It is appropriately selected in consideration of handleability and the like. From the viewpoint of handleability and transportability, the ratio of the average value of the thickness of the supporting separator to the average value of the total thickness of the wiring board material is preferably 0.1 to 0.95, preferably 0.1 to 0.00. 9 is more preferable, and 0.2 to 0.8 is even more preferable.
- the first laminate includes a wiring board including a metal circuit layer, a support, and an adhesive layer in this order, and a supporting separator disposed on the adhesive layer of the wiring board.
- the first laminate can include other layers as required.
- the first laminate may be prepared by applying a circuit forming process to the circuit forming metal layer of the wiring board material including the circuit forming metal layer, the support, the adhesive layer, and the first temporary support in this order. Good.
- a laminate of the metal circuit layer and the support, and a laminate of the adhesive layer and the supporting separator may be prepared by overlapping so that the support and the adhesive layer face each other.
- the metal circuit layer, the support, the adhesive layer, and the support separator may be prepared by overlapping them in this order.
- the second laminate includes the first laminate and a transport support substrate (second temporary support) disposed on the surface of the first laminate on the metal circuit layer side.
- the second laminate can include other layers as necessary.
- the material of the support substrate for conveyance is not particularly limited.
- the material of the supporting substrate for conveyance is preferably a plastic from the viewpoint of flowability or price.
- Plastics include polyester resins such as polyethylene terephthalate (PET) and polyethylene naphthalate; polyolefin resins such as polyethylene, polypropylene, polystyrene, and ethylene vinyl acetate copolymer (EVA); vinyl resins such as polyvinyl chloride and polyvinylidene chloride A polysulfone resin; a polyethersulfone resin; a polycarbonate resin; a polyamide resin; a polyimide resin; and an acrylic resin.
- PET polyethylene terephthalate
- EVA ethylene vinyl acetate copolymer
- vinyl resins such as polyvinyl chloride and polyvinylidene chloride
- a polysulfone resin a polyethersulfone resin
- a polycarbonate resin a polyamide resin
- plastics are preferably used in the form of a film.
- These plastic films may be contained in a single layer as a support substrate for conveyance or as a multilayer film in which two or more layers are combined.
- a polyethylene terephthalate film is more preferable in terms of transparency, heat resistance, ease of handling, price, and the like.
- the support substrate for conveyance includes an adhesive layer on the surface of the wiring board that contacts the metal circuit layer. Thereby, peeling of the support base material for conveyance from a wiring board can be prevented, and a wiring board can be supported more reliably.
- the adhesive material layer includes, for example, a high molecular weight component, tackifier, and other additives as necessary.
- a high molecular weight component include polyimide resin, polystyrene resin, polyethylene resin, polyester resin, polyamide resin, butadiene rubber, acrylic rubber, poly (meth) acrylic resin, polyurethane resin, polyphenylene ether resin, polyetherimide resin, Examples include phenoxy resins, modified polyphenylene ether resins, modified phenoxy resins, polycarbonate resins, and mixtures thereof.
- the high molecular weight component is preferably at least one selected from the group consisting of poly (meth) acrylic resin, acrylic rubber, butadiene rubber and polyurethane resin, and poly (meth) acrylic resin and acrylic More preferably, it is at least one selected from the group consisting of rubber.
- the average value of the thickness of the adhesive layer is not particularly limited.
- the average value of the thickness of the adhesive material layer may be a thickness required for the first laminated body including the wiring board as the adherend to be sufficiently adhered to the support substrate for conveyance, and is 0.3 ⁇ m to 30 ⁇ m.
- the thickness is preferably 0.5 ⁇ m to 20 ⁇ m.
- the average value of the thickness of the transport support substrate (when the transport support substrate includes an adhesive layer), the average value of the total thickness of the transport support substrate and the adhesive layer is not particularly limited.
- a support substrate for transport having an average thickness of 1 mm or less is preferable, and the second laminate and the third laminate described below are preferred.
- a transport support base having an average thickness of 10 ⁇ m or more is preferred.
- the average thickness of the support substrate for transport is preferably 10 ⁇ m or more and 500 ⁇ m or less, more preferably 15 ⁇ m or more and 400 ⁇ m or less, and even more preferably 20 ⁇ m or more and 300 ⁇ m or less.
- the third laminate is obtained by removing the supporting separator from the second laminate.
- the third laminate is excellent in handleability because it is configured by disposing a support substrate for conveyance on the metal circuit layer of the wiring board.
- the method for removing the supporting separator from the second laminate is not particularly limited, and can be applied by appropriately selecting from commonly used methods.
- the ratio of the average value of the thickness of the supporting substrate for conveyance to the average value of the thickness of the wiring board is not particularly limited, and can be appropriately selected according to the purpose. From the viewpoint of sufficiently increasing the rigidity of the third laminate and improving the handleability, the ratio of the average value of the thickness of the support substrate for conveyance to the average value of the thickness of the wiring board (average thickness of the support substrate for conveyance) Value / average thickness of the wiring board) is preferably 0.1 to 4.0, more preferably 0.1 to 3.0, and preferably 0.2 to 2.0. Further preferred.
- the wiring board with a heat sink includes a heat sink, a cured adhesive layer, a support, and a metal circuit layer in this order.
- the wiring board with a heat sink can further include other layers as required. Since the support body on which the metal circuit layer is disposed adheres to the heat sink via the cured adhesive layer, a wiring board with a heat sink exhibiting excellent thermal conductivity can be obtained.
- the heat sink is not particularly limited as long as it is made of a material that easily conducts heat.
- Examples of the heat sink include a metal heat sink, a ceramic heat sink, glass, and plastic.
- a metal heat sink is preferable from the viewpoint of efficiently releasing heat from the wiring board to the outside.
- the shape of the heat sink is not particularly limited.
- the shape of the heat sink may be any shape such as a flat plate, a cylinder, a column, a cube, and a rectangular parallelepiped.
- the heat sink may have fins.
- positions a wiring board is not specifically limited. For example, when the wiring board is thin and flexible, the wiring board can follow the shape of the heat sink where the wiring board is disposed. Therefore, the shape of the heat sink at the place where the wiring board is disposed is not limited to a flat plate, and may be a curved surface or a corner.
- the average value of the total thickness of the laminate including the metal layer for circuit formation or the metal circuit layer to the support is not particularly limited. From the viewpoint of thermal conductivity and weight reduction, the average value of the total thickness of the circuit-forming metal layer or the metal circuit layer and the support is preferably 8 ⁇ m or more and 200 ⁇ m or less, and more preferably 13 ⁇ m or more and 150 ⁇ m or less. Preferably, it is 20 ⁇ m or more and 110 ⁇ m or less.
- the average value of the total thickness of the laminate including the support to the cured adhesive layer is not particularly limited and is preferably 6 ⁇ m to 100 ⁇ m, more preferably 8 ⁇ m to 80 ⁇ m.
- the thickness is more preferably 10 ⁇ m or more and 60 ⁇ m or less, and particularly preferably 10 ⁇ m or more and 35 ⁇ m or less.
- the average value of the total thickness of the laminate including the support and the cured adhesive layer is 6 ⁇ m or more, the handleability is excellent, and when it is 100 ⁇ m or less, the increase in thermal resistance is suppressed and the workability tends to be excellent. is there.
- an increase in the mass of the wiring board with a heat sink itself tends to be suppressed.
- the wiring board with a heat sink has characteristics normally required for a wiring board.
- characteristics usually required as a wiring board include that the support is insulating and preferably has an insulating property of 10 10 ⁇ ⁇ cm or more, and a metal circuit layer after heat treatment at 260 ° C. for 5 minutes. It is desirable that there is no swelling, and that the peel strength of the metal circuit layer with respect to the support is desirably 0.5 kN / m or more.
- FIG. 5 is a top view of the whole corresponding to (I) of FIG. 4
- II) of FIG. 5 is a top view of the whole corresponding to (II) of FIG. III) is an overall top view corresponding to (IV) of FIG. 4
- IV) of FIG. 5 is an overall top view corresponding to (VI) of FIG. Note that the broken line shown in FIG. 5 (II) matches the outer shape of the insulating layer 17 as the support in FIG. 5 (IV).
- the manufacturing method of the wiring board 82 with a heat sink includes the second laminated body producing step (see FIG. 4 (III)), the third laminated body producing step (see FIG. 4 (IV)), and the adhering step (FIG. 4 (V) and (VI)). By including these steps, it is possible to efficiently manufacture the wiring board 82 with a heat sink that has excellent adhesion between the wiring board 36 and the heat sink 50 and has high thermal conductivity.
- the method for manufacturing a wiring board with a heat sink may include a first laminate manufacturing step for obtaining a first laminate before the second laminate manufacturing step.
- a circuit board material in which a circuit forming metal layer 10, an insulating layer 17, an adhesive layer 16, and a supporting separator 22 are arranged in this order as shown in FIG. 35 may be prepared, and a circuit forming process may be performed on the circuit forming metal layer 10 to form the metal circuit layer 11 (see FIG. 4 (II)).
- the wiring board material 35 as shown in FIGS. 4I and 5I is, for example, a wiring board material in which the circuit forming metal layer 10 and the insulating layer 17 are overlapped (hereinafter referred to as “with insulating layer”). It can be obtained by preparing an adhesive layer 16 and a supporting separator 22 in this order on the insulating layer 17 of the metal foil with an insulating layer.
- the metal foil with an insulating layer is conventionally used, a flexible substrate with a metal foil using a non-thermoplastic polyimide film such as an aromatic polyimide as a polymer insulating film, a metal such as copper is deposited on the polyimide film, It can be obtained in the same manner as a wiring board material formed by sputtering or the like, or a wiring board material using a thermoformable liquid crystal polymer.
- a method for producing a flexible substrate or a flexible printed wiring board can be preferably referred to.
- an adhesive tape in which the adhesive layer 16 is arranged on the supporting separator 22 examples include a method of preparing an adhesive sheet and arranging the adhesive tape or the adhesive sheet 16 of the adhesive sheet so that the insulating layer 17 of the metal foil with an insulating layer faces each other.
- the adhesive tape or adhesive sheet is not particularly limited as long as it can constitute the adhesive layer 16 and the supporting separator 22 as described above, and is appropriately selected from commonly used adhesive tapes or adhesive sheets. Can be used.
- Alignment methods include pressing and hot roll laminating methods.
- the hot roll laminating method is preferable from the viewpoint of continuous production and good efficiency.
- the press and hot roll laminating methods can be appropriately selected from methods usually performed in the technical field.
- a hot roll laminate a hot roll laminator equipped with a silicone rubber coated roll is used under the conditions of 20 ° C. to 150 ° C., 0.1 MPa to 3.0 MPa, 0.1 m / min to 3.0 m / min. It can be carried out.
- the surface on which the adhesive layer 16 of the insulating layer 17 in the metal foil with an insulating layer is disposed may be activated in order to improve the adhesive force.
- Examples of the activation treatment of the surface of the insulating layer 17 on which the adhesive layer 16 is disposed include chemical or mechanical treatments such as chemical roughening, corona discharge, and sanding.
- the method of forming a circuit on the circuit-forming metal layer 10 of the wiring board material 35 can be appropriately selected from methods usually used for circuit processing of the metal layer of the wiring board material. For example, a step of forming a circuit forming resist in a desired shape on the circuit forming metal layer 10 using a printing method, a photoresist film, and the like, and the resist of the circuit forming metal layer 10 is not formed
- the circuit can be formed by a method including a step of etching and removing the metal foil in the region with a corrosive liquid. Thereby, the 1st laminated body 60 as shown in FIG.4 (II) and FIG.5 (II) is obtained.
- solder resist layer may be formed on the metal circuit layer 11, the insulating layer 17, or both.
- solder resist layer a commonly used method can be applied without particular limitation.
- the solder resist layer may be formed by a method of printing a liquid resist composition into a desired shape, or a coverlay film processed into a desired shape may be disposed.
- the transport support base material 21 is disposed on the metal circuit layer 11 of the wiring board 36 to obtain the second laminate 65 (see FIG. 4 (III)).
- positioning the support base material 21 for conveyance the rigidity of the laminated body containing the wiring board 36 can be improved in the subsequent process.
- the transport support base material 21 includes an adhesive layer
- the transport support base material 21 can be superposed so that the adhesive layer faces the metal circuit layer. Examples of the method of superposing the adhesive layer so as to face the metal circuit layer include a press and a hot roll laminating method. The hot roll laminating method is preferable from the viewpoint of continuous production and good efficiency.
- the pressing and hot roll laminating method can be appropriately selected from methods usually performed in the technical field.
- a hot roll laminate a hot roll laminator equipped with a silicone rubber coated roll is used under the conditions of 20 ° C. to 150 ° C., 0.1 MPa to 3.0 MPa, 0.1 m / min to 3.0 m / min. It can be carried out.
- the support separator 22 is removed from the second laminate 65 to obtain a third laminate 70 as shown in FIGS. 4 (IV) and 5 (III).
- the adhesive layer 16 of the third laminate 70 from which the support separator 22 has been removed is brought into contact with the heat sink 50 (see FIG. 4 (V)), and the adhesive layer 16 is cured.
- the wiring board 36 and the heat sink 50 are firmly bonded via the cured product layer of the adhesive layer 16.
- the bonding step only needs to include a curing step in which the adhesive layer 16 of the wiring board 36 is brought into contact with the heat sink 50 to cure the adhesive layer 16, and the adhesive layer 16 of the wiring board 36 is included before the curing step.
- Temporal fixing is a process in which the adhesive layer 16 of the wiring board 36 and the heat sink 50 are brought into contact with each other and a treatment is performed under a condition in which the curing reaction of the adhesive in the adhesive layer 16 is not sufficiently started. It means that the members are overlapped weaker than when the members are overlapped.
- a method that is normally used can be applied without particular limitation.
- a press and a hot roll laminating method can be mentioned, and a hot roll laminating method is preferable from the viewpoint of continuous production and good efficiency.
- the press and hot roll laminating methods can be appropriately selected from methods usually performed in the technical field.
- hot roll laminating is performed using a hot roll laminator equipped with a silicone rubber coated roll under the conditions of 20 ° C. to 150 ° C., 0.1 MPa to 3.0 MPa, 0.1 m / min to 3.0 m / min. be able to.
- the surface of the heat sink 50 that contacts the adhesive layer 16 may be activated in order to improve the adhesive force.
- the surface of the heat sink 50 that contacts the adhesive layer 16 may be activated by chemical roughening, corona discharge, sanding, plating, aluminum alcoholate, aluminum chelate, silane coupling material, or other mechanical or chemical treatment. Can be mentioned.
- the method for curing the adhesive layer 16 is not particularly limited, and can be selected depending on the type of adhesive contained in the adhesive layer 16.
- the adhesive layer 16 can be cured by applying a temperature necessary to start curing.
- the adhesive layer is preferably cured by heating at a temperature range of 150 ° C. to 220 ° C. for a time range of 10 minutes to 360 minutes, and at a temperature range of 170 ° C. to 200 ° C. for a time period of 30 minutes to 180 minutes. It is more preferable from the point of productivity improvement that it heats in the range and hardens an adhesive material layer.
- the heating device is not particularly limited, and an oven or the like can be used.
- the adhesive layer when the adhesive layer is heated and cured, it may be under atmospheric pressure or under reduced pressure. When the adhesive layer is cured by heating in a reduced pressure state, the reduced pressure condition can be 10 kPa or less.
- the adhesive layer 16 may be cured not only by heating but also by pressure heating. Adhesiveness of the adhesive to the adherend is easily improved by applying the pressure. From the viewpoint of reliably obtaining a high peel strength, the adhesive layer can be cured by applying pressure to 0.1 MPa to 10 MPa while heating in a temperature range of 150 ° C. to 220 ° C. for a time range of 10 minutes to 360 minutes. More preferably, the adhesive layer is cured by applying pressure to 0.3 MPa to 5 MPa while heating in a temperature range of 170 ° C. to 200 ° C. for a time range of 30 minutes to 180 minutes. Alternatively, a part of the curing process may be performed only by heating and the rest may be performed by pressure heating. When the adhesive layer is cured by heating, it may be under atmospheric pressure or under reduced pressure. When the adhesive layer is cured by heating in a reduced pressure state, the reduced pressure condition can be 10 kPa or less.
- the cushioning property is provided on the wiring board 36 side. It is preferable to arrange a sheet having The sheet having the cushioning property is preferable in that the pressure unevenness due to the step of the wiring board 36 does not occur and the adhesive layer 17 is pressed.
- the heat sink 50 has a shape other than a flat plate, for example, a semi-cylinder or a fin, it is preferable to select a pressure at which the shape of the heat sink 50 is not deformed as the pressurizing condition during pressure heating. Or you may pressurize using the jig
- the support base material 21 for conveyance is removed by component mounting. Thereby, the metal circuit layer 11 is exposed on the surface of the wiring board 82 with a heat sink. Peeling of the support base material 21 for conveyance may be before the adhesion
- the outer shape of the stacked body may be processed.
- the outer shape processing of the wiring board 36 and the heat sink 50 may be performed collectively after the bonding step between the heat sink 50 and the wiring board 36.
- a generally used method can be applied to the outer shape processing of the wiring board without particular limitation.
- the wiring board with heat sink 82 has a structure in which the wiring board 36 including the insulating layer 17, the metal circuit layer 11, and the adhesive layer 16 in this order and the heat sink 50 are bonded via the cured adhesive layer 16. Since such a wiring board 82 with a heat sink is fixed via the adhesive layer 16 in which the wiring board 36 and the heat sink 50 are cured, it has excellent adhesion and can exhibit high thermal conductivity.
- solder resist layer may be formed on the metal circuit layer 11, the insulating layer 17, or both.
- a commonly used method can be applied without particular limitation.
- the solder resist layer can be formed by a method of printing a liquid resist composition in a desired shape, a method of arranging a coverlay film processed into a desired shape, or the like.
- the manufacturing method of a component mounting wiring board with a heat sink of the present invention includes a component mounting step of mounting a component on the metal circuit layer 11 of the wiring board 82 with a heat sink obtained by the manufacturing method described above, in addition to the above-described steps. Included (see FIG. 6).
- the component-mounted wiring board with heat sink of the present invention is manufactured using the wiring board with heat sink.
- the component mounting wiring board 102 with a heat sink includes a wiring board 82 with a heat sink having the metal circuit layer 11 and a conductive connection material 42 on the metal circuit layer 11.
- a component 40 mounted via the FIG. 7 shows an example in which the component 40 is mounted on the metal circuit layer 11 of the wiring board 82 with a heat sink shown in FIG. 5 (IV). In FIG. 7, a plurality of components 40 are connected in series via the metal circuit layer 11.
- the component 40 is mounted on the wiring board 82 with the heat sink by placing the component 40 on the metal circuit layer 11 of the wiring board 82 with the heat sink via the conductive connection material 42 such as solder and passing through the reflow furnace in this state. Etc. Thereby, the component mounting wiring board 102 with a heat sink is obtained.
- the component 40 and the conductive connection material 42 such as solder are disposed on the metal circuit layer 11, and the component 40 is mounted on the metal circuit layer 11 by a reflow process.
- the component 40 is mounted on the metal circuit layer 11 by a reflow process.
- other components other than the component 40 may be mounted together.
- the reflow process is performed under the conditions normally used.
- the component 40 includes a semiconductor chip, a transistor, a diode, a thyristor, a thermistor, a MOS-FET (Metal Oxide Semiconductor Conductor), an IGBT (Insulated Gate Bipolar Transistor), an LED (LightEd resistor), an LED (LightEd resistor active element, etc. And passive elements such as a body and a coil.
- the component mounting method can be appropriately selected from commonly used methods. As a component mounting method, for example, a method of mounting via a metal paste or the like provided on the metal circuit layer 11 is used.
- the active element includes a semiconductor element, a terminal that electrically connects the semiconductor element and the outside, and a sealing material that seals and holds the semiconductor element.
- the terminal is not particularly limited, and a conductor such as copper, solder, or the like is used.
- the sealing material is not particularly limited, and an epoxy resin or the like is used. Note that a semiconductor component corresponding to such an active element can be obtained according to the method described in Japanese Patent Application Laid-Open No. 2007-110113.
- the component mounting wiring board 102 with a heat sink uses the wiring board 82 with a heat sink, it becomes an electronic component excellent in thermal conductivity to the heat sink 50.
- the component-mounted wiring board with a heat sink is an electronic component.
- the component mounted wiring board with heat sink has excellent heat dissipation due to the low thermal resistance of the hardened adhesive layer because the wiring board is fixed to the heat sink by the hardened adhesive layer instead of the adhesive layer ing.
- the set of the present invention includes a wiring board material including a metal layer for circuit formation, a support, an adhesive layer, and a first temporary support in this order, and a second temporary support, and the wiring board with a heat sink. It is a set used for the manufacturing method of, and includes other elements as necessary.
- a 2nd support body is arrange
- the other set of this invention is with a temporary support body containing the wiring board which contains a metal circuit layer, a support body, and an adhesive material layer in this order, and the 1st temporary support body arrange
- the set includes a wiring board and a second temporary support, and is used in the method for manufacturing the wiring board with a heat sink, and includes other elements as necessary.
- the second support is disposed on the metal circuit layer. Since said set has the material used for the manufacturing method of the wiring board with a heat sink mentioned above as an element, a wiring board with a heat sink can be obtained simply and efficiently.
- the first temporary support and the second temporary support correspond to the support separator and the transport support substrate described above in the method for manufacturing a wiring board with a heat sink, respectively. Moreover, the member already described in the manufacturing method of the said wiring board with a heat sink can be included as another element which can be added.
- Another embodiment of the present invention is a metal circuit layer formed from a wiring board material including a circuit-forming metal layer, a support, an adhesive layer, and a first temporary support in this order, and the circuit-forming metal layer.
- the use of the set including the second temporary support that can be disposed on the above-described method for manufacturing a wiring board with a heat sink or a method for manufacturing a component mounting wiring board with a heat sink is also included.
- Another aspect of the present invention is a temporary support including a wiring board including a metal circuit layer, a support, and an adhesive layer in this order, and a first temporary support disposed on the adhesive layer.
- the use of the set including the attached wiring board and the second temporary support body that can be disposed on the metal circuit layer in the manufacturing method of the wiring board with heat sink or the manufacturing method of the component mounting wiring board with heat sink is also included.
- the wiring board material, the wiring board, the first temporary support, the adhesive sheet with the temporary support, the second temporary support, and other elements in each of the above aspects the manufacture of the above-described wiring board with a heat sink Regarding the set used in the method or the set used in the manufacturing method of the component mounting wiring board with the heat sink, the above-described contents are applied as they are.
- this invention includes the following aspects.
- a wiring board with a heat sink including a metal circuit layer, a support, a cured adhesive layer, and a heat sink in this order.
- the support and the heat sink are disposed via the cured adhesive layer, the adhesion between the support and the heat sink is excellent, and high thermal conductivity can be exhibited.
- the support in this embodiment, the metal circuit layer and the metal layer for circuit formation for obtaining the metal circuit layer, the wiring board, the heat sink, and the adhesive layer for obtaining the cured adhesive layer and the cured adhesive layer are described above. Apply the contents as they are.
- Component mounting wiring board with heat sink In such a component-mounted wiring board with a heat sink, since the support and the heat sink are disposed via the cured adhesive layer, the adhesion between the support and the heat sink is excellent. Thereby, the omission of components is suppressed and the electronic component excellent in the heat conductivity to a heat sink can be supplied.
- the metal circuit layer and the metal layer for circuit formation for obtaining the metal circuit layer, the wiring board, the heat sink, the adhesive layer for obtaining the cured adhesive layer and the cured adhesive layer, and the components The contents described above are applied as they are.
- the average value of the thickness of each layer or laminate shown below is an average value obtained by measuring the thickness of five points using a micrometer and calculating the arithmetic average value thereof.
- Example 1 ⁇ Production of wiring board material>
- a material (Hitachi Chemical Co., Ltd., MCF-5000IS) in which a copper foil having an average thickness of 35 ⁇ m and a polyimide insulating layer having an average thickness of 30 ⁇ m are arranged in this order; And a polyamide-imide resin (viscosity at 60 ° C .: 6000 Pa ⁇ s, minimum value of viscosity in the temperature range before 60 ° C. and below 200 ° C.
- Adhesive tape having a PET separator on one side of an adhesive layer having a thickness of 35 ⁇ m and a supporting separator which is a PET film having an average thickness of 50 ⁇ m on the other side (Hitachi Chemical Co., Ltd., AS-9000IA) And prepared.
- the above-mentioned polyamide imide resin has a viscosity at 60 ° C. and a minimum value in the temperature range of more than 60 ° C. and not more than 200 ° C. is measured by sandwiching a sample under the conditions of atmospheric temperature, temperature rising rate 5 ° C./min, frequency 10 Hz
- the jig was obtained by measuring shear viscosity with ARAS TEST STATION (Rheometric Scientific) using a circular flat plate.
- the insulation resistance value of the polyamide-imide resin was 3 ⁇ 10 13 ⁇ ⁇ cm or more as measured with a measurement voltage of 100 V using an insulation resistance meter.
- the support insulating separator is disposed so that the polyimide insulating layer of the above material and the adhesive layer exposed by peeling off the PET separator (release PET film) on one side from the above adhesive tape face each other. And a wiring board material having an adhesive layer.
- the arrangement of the adhesive layer was performed by a hot roll laminating method under the conditions of 120 ° C., 2 MPa, and 1.0 m / min.
- clean room ultra tape # 1110 was applied as a guard tape so as to wrap the edge of the wiring board material, and sealed so that the chemical solution did not enter between the copper foil and the separator.
- an adhesive film (Hitachi Chemical Co., Ltd., DT-4300S, average thickness of 50 ⁇ m) is used as a supporting substrate for conveyance.
- the adhesive material layer of the adhesive film and the metal circuit The layers were arranged so as to face each other, and a second laminate as shown in FIG. 4 (III) was obtained.
- the support substrate for transportation was arranged by a roll laminating method under the conditions of 30 ° C., 0.3 MPa, and 0.3 m / min. Next, the outer shape was processed to a width of 6 mm and a length of 100 mm, and the guard tape was removed.
- ⁇ Temporary fixing of wiring board> Arrange the adhesive layer of the obtained third laminate so as to be in contact with the aluminum substrate (A-5052, average thickness 1 mm) as a heat sink, and temporarily fix the third laminate on the heat sink. did.
- the arrangement of the third laminate and the heat sink was performed by a hot roll laminating method under the conditions of 120 ° C., 2.0 MPa, and 1.0 m / min.
- a transparent substrate silicate glass, Matsunami S1111
- a heat-resistant release film (Mitsui Chemicals Tosero Co., Ltd., Opulan X-44B, average thickness 50 ⁇ m) is placed on the heat sink of the laminate in which the wiring board is temporarily fixed on the heat sink, and a vacuum pressure press is used. Pressurized to 3 MPa under a vacuum of 3 kPa, heated at 4 ° C./min, and held at 185 ° C. for 90 minutes to cure the adhesive layer by heating and obtaining a wiring board with a heat sink . Next, a solder resist was applied to a predetermined portion on the surface of the metal circuit layer of the wiring board by printing and cured by heat treatment at 120 ° C. for 90 minutes. It carried out similarly about the sample for contact area rate evaluation.
- ⁇ Component mounting> A plurality of solders (Senju Metal Industry Co., Ltd., ECO SOLDER PASTE Lead Free, M705, Sn-3.0Ag-0.5Cu, melting temperature 220 ° C.), chip resistors (Kamaya Electric Co., Ltd.) Company, RMC1K100FTE, thick film resistance 10 ⁇ , 6.3mm length x 3.2mm width x 0.6mm height), connectors, etc., and reflow processing (maximum 260 ° C), chip resistance etc. on the metal circuit layer A component-mounted wiring board with a heat sink on which the components were mounted was obtained. It carried out similarly about the sample for contact area rate evaluation.
- the longitudinal direction of the light emitting part of the reflected fluorescent lamp and the longitudinal direction (horizontal direction) of the image captured by the digital camera are substantially parallel, and the longitudinal direction of the light emitting part of the reflected fluorescent lamp is
- the positional relationship between the sample and the digital camera was adjusted so that the total length was the same as the 75 mm long tape attached to the sample, and an evaluation image with 6 million pixels was obtained. From the obtained evaluation image, a part of the region between the two fluorescent lamps and near the center in the longitudinal direction was selected as a rectangular observation region.
- the selected observation area is 80% of the length in the longitudinal direction of the light emitting part of the two fluorescent lamps in which the length in the longitudinal direction is reflected, and the two fluorescent lamps in which the length in the short direction is reflected 70% of the interval.
- All pixels included in the obtained observation area were binarized based on the brightness of each pixel.
- the binarization process was performed by determining a pixel showing lightness above the reference lightness as a non-contact portion and a pixel showing lightness below the reference lightness as a contact portion.
- the contact area ratio was calculated as the ratio (%) of the number of pixels in the contact portion to the total number of pixels for all pixels in the binarized observation region.
- the reference brightness for distinguishing between the close contact portion and the non-contact portion was determined as follows. When affixing the adhesive layer of the wiring board to the transparent substrate, a sample in which an adhesion region was partially formed by applying the same conditions as in the case of affixing to the heat sink only in a part of the region was separately prepared. An evaluation image was obtained for the prepared sample in the same manner as described above, and an average value obtained from the minimum value of the brightness in the contact area and the maximum value of the brightness in the other areas was used as the reference brightness.
- Example 2 A material (Hitachi Chemical Co., Ltd., MCF-5000IS) in which a copper foil having an average thickness of 35 ⁇ m and a polyimide insulating layer having an average thickness of 30 ⁇ m are arranged in this order as a metal layer for circuit formation; Except for using an adhesive tape (Hitachi Chemical Co., Ltd., AS-9000IA) which is the same as in Example 1 except that the average thickness of the adhesive layer is 25 ⁇ m, the same as in Example 1 Then, a wiring board with a heat sink and a component mounting wiring board with a heat sink were prepared.
- an adhesive tape Hitachi Chemical Co., Ltd., AS-9000IA
- the adhesion area ratio evaluation and the temperature difference evaluation were performed in the same manner as in Example 1.
- the adhesion area ratio of the wiring board was 98%, and the temperature difference ⁇ T between the component and the wiring board was 35.3 ° C.
- Example 3 A material (Hitachi Chemical Co., Ltd., MCF-5000IS) in which a copper foil having an average thickness of 35 ⁇ m and a polyimide insulating layer having an average thickness of 25 ⁇ m are arranged in this order as a metal layer for circuit formation
- an adhesive tape Hitachi Chemical Co., Ltd., AS-9000IA which is the same as Example 1 was used except that the average thickness of the adhesive layer was 25 ⁇ m.
- the adhesion area ratio evaluation and the temperature difference evaluation were performed in the same manner as in Example 1.
- the adhesion area ratio of the wiring board was 98%
- the temperature difference ⁇ T between the component and the wiring board was 34.0 ° C.
- Example 4 A material (Hitachi Chemical Co., Ltd., MCF-5000IS) in which a copper foil having an average thickness of 35 ⁇ m and a polyimide insulating layer having an average thickness of 20 ⁇ m are arranged in this order as a metal layer for circuit formation
- an adhesive tape Hitachi Chemical Co., Ltd., AS-9000IA which is the same as Example 1 was used except that the average thickness of the adhesive layer was 25 ⁇ m.
- the adhesion area ratio evaluation and the temperature difference evaluation were performed in the same manner as in Example 1.
- the adhesion area ratio of the wiring board was 98%
- the temperature difference ⁇ T between the component and the wiring board was 32.7 ° C.
- Example 5 A material (Hitachi Chemical Co., Ltd., MCF-5000IS) in which a copper foil having an average thickness of 35 ⁇ m and a polyimide insulating layer having an average thickness of 15 ⁇ m are arranged in this order as a metal layer for circuit formation
- an adhesive tape Hitachi Chemical Co., Ltd., AS-9000IA which is the same as Example 1 was used except that the average thickness of the adhesive layer was 25 ⁇ m.
- the adhesion area ratio evaluation and the temperature difference evaluation were performed in the same manner as in Example 1.
- the adhesion area ratio of the wiring board was 98%
- the temperature difference ⁇ T between the component and the wiring board was 31.4 ° C.
- Example 6 A material (Hitachi Chemical Co., Ltd., MCF-5000IS) in which a copper foil having an average thickness of 35 ⁇ m and a polyimide insulating layer having an average thickness of 10 ⁇ m are arranged in this order as a metal layer for circuit formation, Except for using an adhesive tape (Hitachi Chemical Co., Ltd., AS-9000IA) which is the same as in Example 1 except that the average thickness of the adhesive layer is 25 ⁇ m, the same as in Example 1 Then, a wiring board with a heat sink and a component mounting wiring board with a heat sink were prepared.
- an adhesive tape Hitachi Chemical Co., Ltd., AS-9000IA
- the adhesion area ratio evaluation and the temperature difference evaluation were performed in the same manner as in Example 1.
- the adhesion area ratio of the wiring board was 98%
- the temperature difference ⁇ T between the component and the wiring board was 30.1 ° C.
- Example 7 ⁇ Production of wiring board material> A material (Hitachi Chemical Co., Ltd., MCF-5000IS) in which a copper foil having an average thickness of 35 ⁇ m and a polyimide insulating layer having an average thickness of 10 ⁇ m are arranged in this order as a metal layer for circuit formation, Except for using an adhesive tape (Hitachi Chemical Co., Ltd., AS-9000IA) which is the same as in Example 1 except that the average thickness of the adhesive layer is 25 ⁇ m, the same as in Example 1 Then, the production of the wiring board, the arrangement of the supporting substrate for conveyance, and the separation of the supporting separator were performed.
- an adhesive tape Hitachi Chemical Co., Ltd., AS-9000IA
- ⁇ Temporary fixing of wiring board> Arrange the adhesive layer of the obtained third laminate so as to be in contact with the aluminum substrate (A-5052, average thickness 1 mm) as a heat sink, and temporarily fix the third laminate on the heat sink. did.
- the arrangement of the third laminate and heat sink was pressurized and heated by using a vacuum press to pressurize to 2 MPa under a vacuum of 3 kPa, raise the temperature at 6 ° C./min, and hold at 130 ° C. for 3 minutes. I went there.
- a third laminate was fixed on the transparent substrate using a polycarbonate substrate (2 mm thickness) which is a transparent substrate instead of the aluminum substrate.
- a heat-resistant release film (Mitsui Chemicals Tosero Co., Ltd., Opulan X-44B, 50 ⁇ m) was placed on the metal circuit layer surface of the wiring board. After temporary fixing, the support substrate for conveyance was peeled off from the metal circuit layer of the wiring board.
- Example 2 component mounting was performed in the same manner as in Example 1, and the adhesion area ratio evaluation and the temperature difference evaluation were further performed.
- the adhesion area ratio of the wiring board was 98%
- the temperature difference ⁇ T between the component and the wiring board was 30.1 ° C.
- Example 8 A material (Hitachi Chemical Co., Ltd., MCF-5000IS) in which a copper foil having an average thickness of 35 ⁇ m and a polyimide insulating layer having an average thickness of 10 ⁇ m are arranged in this order as a metal layer for circuit formation, Except for using an adhesive tape (Hitachi Chemical Co., Ltd., AS-9000IA) which is the same as in Example 1 except that the average thickness of the adhesive layer is 10 ⁇ m, the same as in Example 1 Then, a wiring board with a heat sink and a component mounting wiring board with a heat sink were prepared.
- an adhesive tape Hitachi Chemical Co., Ltd., AS-9000IA
- the adhesion area ratio evaluation and the temperature difference evaluation were performed in the same manner as in Example 1.
- the adhesion area ratio of the wiring board was 98%
- the temperature difference ⁇ T between the component and the wiring board was 26.2 ° C.
- Example 9 A material (Hitachi Chemical Co., Ltd., MCF-5000IS) in which a copper foil having an average thickness of 35 ⁇ m and a polyimide insulating layer having an average thickness of 5 ⁇ m are arranged in this order as a metal layer for circuit formation, Except for using an adhesive tape (Hitachi Chemical Co., Ltd., AS-9000IA) which is the same as in Example 1 except that the average thickness of the adhesive layer is 10 ⁇ m, the same as in Example 1 Then, a wiring board with a heat sink and a component mounting wiring board with a heat sink were prepared.
- an adhesive tape Hitachi Chemical Co., Ltd., AS-9000IA
- the adhesion area ratio evaluation and the temperature difference evaluation were performed in the same manner as in Example 1.
- the adhesion area ratio of the wiring board was 98%
- the temperature difference ⁇ T between the component and the wiring board was 24.9 ° C.
- Example 10 A material (Hitachi Chemical Co., Ltd., MCF-5000IS) in which a copper foil having an average thickness of 35 ⁇ m and a polyimide insulating layer having an average thickness of 5 ⁇ m are arranged in this order as a metal layer for circuit formation, Except for using an adhesive tape (Hitachi Chemical Co., Ltd., AS-9000IA) which is the same as Example 1 except that the average value of the thickness of the adhesive layer is 5 ⁇ m, it is the same as Example 1. Then, a wiring board with a heat sink and a component mounting wiring board with a heat sink were prepared.
- an adhesive tape Hitachi Chemical Co., Ltd., AS-9000IA
- the adhesion area ratio evaluation and the temperature difference evaluation were performed in the same manner as in Example 1.
- the adhesion area ratio of the wiring board was 98%
- the temperature difference ⁇ T between the component and the wiring board was 23.6 ° C.
- Example 1 A material (Hitachi Chemical Co., Ltd., MCF-5000IS) in which a copper foil having an average thickness of 35 ⁇ m and a polyimide insulating layer having an average thickness of 5 ⁇ m are arranged in this order as a metal layer for circuit formation, Wiring board material in the same manner as in Example 1, using the same adhesive tape (Hitachi Chemical Co., Ltd., AS-9000IA) as in Example 1 except that the average thickness of the adhesive layer is 5 ⁇ m. Got.
- a circuit processing step was carried out using the laminate obtained by peeling the supporting separator from the obtained wiring board material. As a result, the adhesive layer was eroded by the chemical during the circuit processing process. In addition, when the circuit processing process is handled, the wiring board material may be bent or deformed. As a result, the subsequent steps could not be carried out.
- a wiring board material (Hitachi Chemical Co., Ltd., MCF-5000IS) in which a copper foil having an average thickness of 35 ⁇ m and a polyimide insulating layer having an average thickness of 30 ⁇ m are disposed as a metal layer for circuit formation;
- a pressure-sensitive adhesive tape (Hitachi Chemical Co., Ltd., DA-3050) having a PET separator on one side of the pressure-sensitive adhesive layer having an average thickness of 50 ⁇ m and a supporting separator as a PET film on the other side was prepared. .
- a wiring board material having a separator and an adhesive layer was obtained.
- the adhesive material layer was arranged by a roll laminating method under the conditions of 30 ° C., 0.3 MPa, and 0.3 m / min.
- clean room ultra tape # 1110 was applied as a guard tape so as to wrap the edge of the wiring board material, and sealed so that the chemical solution did not enter between the copper foil and the separator.
- the wiring board and the heat sink were arranged by a roll laminating method under the conditions of 30 ° C., 0.3 MPa, and 0.3 m / min.
- a wiring board was fixed on the transparent substrate using a transparent substrate (slide glass, borosilicate glass, Matsunami S1111) instead of the aluminum substrate.
- Example 2 the contact area ratio of the wiring board fixed on the transparent substrate was evaluated. As a result, the adhesion area ratio of the wiring board was 98%.
- Example 2 component mounting was performed in the same manner as in Example 1. As a result, a part of the insulating layer was lifted from the heat sink or the transparent substrate. Subsequently, the adhesion area ratio evaluation of the wiring board fixed on the transparent substrate was performed again. As a result, the adhesion area ratio of the wiring board was 40%. Moreover, temperature difference evaluation of a component and a wiring board was performed. As a result, the temperature difference ⁇ T between the component and the wiring board was 45.1 ° C.
- a wiring board material (Hitachi Chemical Co., Ltd., MCF-5000IS) in which a copper foil having an average thickness of 35 ⁇ m and a polyimide insulating layer having an average thickness of 30 ⁇ m are disposed as a metal layer for circuit formation; Hot melt adhesive tape (polyester resin, Nitto Shinko Co., Ltd., hot melt adhesive sheet FB-ML4, average thickness of adhesive layer 70 ⁇ m, PET separator on one side of the adhesive layer, PET on the other side A supporting separator that is a film).
- a wiring board material having a support separator and a hot melt adhesive layer was obtained.
- the adhesive material layer was arranged by a roll laminating method under the conditions of 130 ° C., 0.2 MPa, and 0.5 m / min.
- clean room ultra tape # 1110 was applied as a guard tape so as to wrap the edge of the wiring board material, and sealed so that the chemical solution did not enter between the copper foil and the separator.
- the wiring board was placed under the same conditions as in Comparative Example 3 except that the pressure condition was set at 130 ° C., 0.2 MPa, 0.5 m / min, followed by cooling to solidify the adhesive layer.
- the plate was fixed to the heat sink.
- a wiring board was fixed on the transparent substrate using a transparent substrate (slide glass, borosilicate glass, Matsunami S1111) instead of the aluminum substrate.
- the adhesion area ratio evaluation of the wiring board fixed on the transparent substrate was performed. As a result, the adhesion area ratio of the wiring board was 98%.
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Abstract
Description
しかしながら、フレキシブルな配線板の部品が配置されていない部分のみを加圧するだけで高い密着性を得ることは困難であり、密着性の不良は熱抵抗を増大させることになる。
[1]金属回路層、支持体、及び接着材層をこの順に含む配線板と、前記接着材層上に配置された第一の仮支持体とを含む第一の積層体の前記金属回路層上に、第二の仮支持体を配置して第二の積層体を得ること、前記第二の積層体から、前記第一の仮支持体を除去して第三の積層体を得ること、並びに前記第三の積層体の接着材層とヒートシンクとを接触させ、前記接着材層を硬化させること、を含むヒートシンク付配線板の製造方法。
[2]前記支持体及び接着材層の総厚みの平均値が6μm以上100μm以下である[1]に記載のヒートシンク付配線板の製造方法。
[3]前記支持体が絶縁層を含み、該絶縁層の厚みの平均値が3μm以上60μm以下である[1]又は[2]に記載のヒートシンク付配線板の製造方法。
[4]前記接着材層の厚みの平均値が3μm以上70μm以下である[1]~[3]のいずれかに記載のヒートシンク付配線板の製造方法。
[5]前記接着材層が熱硬化性である[1]~[4]のいずれかに記載のヒートシンク付配線板の製造方法。
[6]前記第一の仮支持体の厚みの平均値が15μm以上300μm以下である[1]~[5]のいずれか1項に記載のヒートシンク付配線板の製造方法。
[7] 150℃~220℃の温度範囲及び10分~360分の時間範囲で加熱して、前記接着材層を硬化させることを含む[5]又は[6]に記載のヒートシンク付配線板の製造方法。
[8] 150℃~220℃の温度範囲及び10分~360分の時間で加熱しながら、0.1MPa~10MPaに加圧して、前記接着材層を硬化させることを含む[5]又は[6]に記載のヒートシンク付配線板の製造方法。
[9][1]~[8]のいずれか1に記載の製造方法によりヒートシンク付配線板を得ること、及び、前記ヒートシンク付配線板の前記金属回路層上に部品を実装すること、を含むヒートシンク付部品実装配線板の製造方法。
[10][1]~[8]のいずれか1に記載の製造方法により得られたヒートシンク付配線板。
[11][9]に記載の製造方法により得られたヒートシンク付部品実装配線板。
[12]回路形成用金属層、支持体、接着材層及び第一の仮支持体をこの順に含む配線板材料と、第二の仮支持体と、を含み、[1]~[8]のいずれか1に記載のヒートシンク付配線板の製造方法に使用される、セット。
[13]金属回路層、支持体及び接着材層をこの順に含む配線板と、前記接着材層上に配置された第一の仮支持体とを含む仮支持体付配線板と、第二の仮支持体と、を含み、[1]~[8]のいずれか1に記載のヒートシンク付配線板の製造方法に使用される、セット。
[14][1]~[8]のいずれか1に記載のヒートシンク付配線板の製造方法における、回路形成用金属層、支持体、接着材層及び第一の仮支持体をこの順に含む配線板材料と、第二の仮支持体と、を含むセットの使用。
[15][9]に記載のヒートシンク付部品実装配線板の製造方法における、金属回路層、支持体及び接着材層をこの順に含む配線板と、前記接着材層上に配置された第一の仮支持体とを含む仮支持体付配線板と、第二の仮支持体と、を含むセットの使用。
[16][1]~[8]のいずれか1に記載のヒートシンク付配線板の製造方法における、回路形成用金属層、支持体、接着材層及び第一の仮支持体をこの順に含む配線板材料と、第二の仮支持体と、を含むセットの使用。
[17][9]に記載のヒートシンク付部品実装配線板の製造方法における、金属回路層、支持体及び接着材層をこの順に含む配線板と、前記接着材層上に配置された第一の仮支持体とを含む仮支持体付配線板と、第二の仮支持体と、を含むセットの使用。
以下、本発明について説明する。
第一の積層体は、配線板と、配線板の接着材層上に配置された第一の仮支持体とを含む。すなわち、第一の積層体は、金属回路層、支持体、接着材層及び第一の仮支持体がこの順に配置されてなる。
第二の積層体は、第一の積層体の金属回路層上に、第二の仮支持体を配置させて得られる。すなわち、第二の積層体は、第二の仮支持体、金属回路層、支持体、接着材層及び第一の仮支持体がこの順に配置されてなる。
第三の積層体は、第二の積層体から第一の仮支持体を除去して得られる。すなわち、第三の積層体は、第二の仮支持体、金属回路層、支持体及び接着材層がこの順に配置されてなる。
ヒートシンク付配線板は、第三の積層体における接着材層とヒートシンクとを接触させ、接着材層を硬化させて得られる。第三の積層体に含まれる第二の仮支持体は除去されてもよい。すなわち、ヒートシンク付配線板は、ヒートシンク、接着材層を硬化した硬化接着材層、支持体及び金属回路層がこの順に配置されてなる。
ヒートシンク付部品実装配線板は、ヒートシンク付配線板の金属回路層上に部品を実装することにより得られる。すなわち、ヒートシンク付部品実装配線板は、ヒートシンク、接着材層を硬化した硬化接着材層、支持体、金属回路層及び部品がこの順に配置されてなる。
第一の積層体、第二の積層体および第三の積層体は、それぞれ、必要に応じて他の層を含むことができる。なお、本明細書では、本発明における第一の仮支持体を支持用セパレータとも称し、第二の仮支持体を搬送用支持基材とも称することがある。
準備された配線板材料に対して回路形成処理が施されると支持体上に金属回路層が形成されて、金属回路層、支持体及び接着材層をこの順に含む配線板の接着材層上に支持用セパレータが配置された第一の積層体が得られる。回路形成処理の詳細については後述する。なお、配線板と支持用セパレータとを含む第一の積層体は、この構造の積層体として準備されたものを用いてもよい。
接着工程では、第三の積層体の接着材層と、ヒートシンクとを接触させ、ヒートシンクに接触した接着材層を硬化することで、支持体の金属回路層側とは反対側の面とヒートシンクとが硬化接着材層を介して接着されたヒートシンク付配線板を得る。
第三の積層体における搬送用支持基材は、後述する部品実装工程の前までに除去されていればよい。すなわち、接着材層を硬化する前に除去しても、接着材層を硬化した後に除去してもよい。
また、ヒートシンク付部品実装配線板を得る場合には、ヒートシンクと接触した配線板の接着材層を硬化して得られるヒートシンク付配線板を用い、部品実装工程においてヒートシンク付配線板上の金属回路層上に、導電性接続材料を介して部品を実装する。硬化接着材層がヒートシンクと、金属回路層がその上に配置された支持体との間に存在するヒートシンク付配線板を用いることで、部品実装工程において高熱処理される場合でも、ヒートシンクと支持体との間の密着性が充分に維持されて、効率よく部品実装を行うことができる。
従来のヒートシンク付部品実装配線板の製造方法の一例を図8に示す。
図8(I)~(III)に示されるように、従来は、金属基板13上に絶縁層12及び回路形成用金属層10をこの順に配置した後に、回路形成用金属層10に回路を形成することによって得られた金属回路層11上に、リフロー処理等の高温処理を行って部品40を、導電性接続材料42を介して実装し、部品実装配線板75を得ている。次いで、図8(IV)に示されるように、部品実装配線板75の金属基板13側の面に、支持用セパレータ18付の粘着材層15を接触させて、部品実装基板75の金属基板13上に粘着材層15と支持用セパレータ18とが重ね合わされた積層体を得ている。更に図8(V)に示されるように、得られた積層体から、支持用セパレータ18を除去した後に、部品実装配線板75とヒートシンク50とを粘着剤層15を介して固定して、ヒートシンク付部品実装配線板102Aを得ている。ここで粘着材とは、常温(25℃)で粘着性を有し、軽い圧力で被着体に接着する物質を意味し、物体の間に介在し、熱等によって硬化して物体を結合する接着材とは、性質が全く異なるものである。
従来は、複数の部品を分散させて配置する場合、複数の部品の配置領域全体に対して作業性よく加圧するために、その配置領域全体に対応する大きなサイズの配線板が必要であった。しかしこの場合、配置された複数の部品の間に有効利用されない配線板の部分が存在することとなる。このような有効利用されない配線板の部分は、部品の配置位置によっては大きな面積を占めるために効率が悪くなる。このため、複数の部品を分散させて配置することは現実的ではなかった。
一方、本発明では、部品実装又は配線に必要な部分に配線板を配置することができる。そのため、部品間距離が広がっても利用されない配線板の部分は必要以上に発生せず、放熱性を向上させるため、部品を効率よく配置することが可能となった。また、例えば、複数の配線板をまとめて作製した後に、所望の形状及び大きさに切り離して、個々のヒートシンクの所望の位置に貼り付けて、ヒートシンク付配線板及びヒートシンク付部品実装配線板を得ることも可能となった。
以下、本発明のヒートシンク付配線板の製造方法及びヒートシンク付部品実装配線板の製造方法に用いられる各部材について説明する。
配線板材料は、回路形成用金属層と、支持体と、接着材層と、支持用セパレータとをこの順に含む。前記配線板材料は、必要に応じて更に他の層を含むことができる。配線板は、金属回路層と、支持体と、接着材層とをこの順に含む。前記配線板は、必要に応じて更に他の層を含むことができる。
回路形成用金属層は、回路を形成可能な金属からなるものであれば特に制限はない。一般的には金属箔を用いて構成される。金属箔としては、銅、アルミ、鉄、金、銀、ニッケル、パラジウム、クロム、モリブデン又はこれらの合金の箔が好適に用いられる。これらの中でも金属箔としては、高い導電率と汎用性の観点から銅箔が好ましい。
なお本発明において層又は積層体の厚みの平均値は、対象となる層又は積層体の5点の厚みを測定し、その算術平均値として与えられる値とする。層又は積層体の厚みは、マイクロメーター、渦電流式膜厚計、電子顕微鏡等を用いて測定することができる。本発明において、層又は積層体の厚みを直接測定可能な場合には、マイクロメーターを用いて測定する。一方、積層体の一部を構成する1つの層の厚み又は複数の層の総厚みを測定する場合には、電子顕微鏡を用いて、積層体の重層方向の断面を観察することで測定する。
配線板材料における支持体は絶縁層を含むことが好ましい。絶縁層は、絶縁性を示すものであれば特に制限されない。絶縁層は、絶縁破壊電圧の点から、1010Ω・cm以上の絶縁性を有していることが好ましく、1013Ω・cm以上の絶縁性を有していることがより好ましい。絶縁層の絶縁抵抗値は、測定電圧100V、室温(25℃)で、絶縁抵抗計により測定した値とする。
絶縁層は、高絶縁性の点で樹脂によって構成されることが好ましい。前記樹脂としては、ポリイミド、ポリエステル等の高分子量樹脂、エポキシ樹脂、シリコーン樹脂、アクリル樹脂、これらの混合物等を挙げることができる。耐熱性の観点から、絶縁層にはポリイミド樹脂、エポキシ樹脂、及びアクリル樹脂からなる群より選択された少なくとも1種の樹脂を用いることが好ましい。これらの樹脂はポリマーアロイ等の混合物であってもよく、1種単体で用いてもよい。
ガラス転移温度は、一般に、示差熱量測定(DSC)、動的粘弾性測定(DMA)又は熱機械測定(TMA)により測定できる。
本発明において、絶縁層を構成する樹脂のTgには動的粘弾性測定(DMA)によって以下の測定条件で測定されたガラス転移温度を採用する。厚みの平均値が50μmの絶縁層を7層重ね合わせた350μmの絶縁層のシートを、5mm幅、20mm長に外形加工する。絶縁層の重ね合わせはホットロールラミネータを用いて、40℃、0.3MPaで行う。更に、粘弾性アナライザー(レオメトリックス社、商品名:RSA-2)を用いて、引っ張りモード、昇温速度5℃/min、周波数10Hz、測定温度30℃~300℃の条件で測定した時のtanδのピーク温度をTgとして評価する。なお、tanδのピークが複数ある場合は、最も高温側のtanδのピーク温度をTgとする。
接着材層は、絶縁性を示すものが好ましい。接着材層は、絶縁破壊電圧の点で、1010Ω・cm以上の絶縁性を有していることが好ましく、1013Ω・cm以上の絶縁性を有していることがより好ましい。接着材層の絶縁抵抗値は、絶縁層の絶縁抵抗値の測定方法と同様の方法で測定した値とする。
接着材層は、硬化処理により支持体とヒートシンクとを接着する。本明細書において「硬化」とは、接着材層を構成する接着材の粘度が架橋反応によって上昇して、接着材が被着体に接着し、加熱によって溶融しなくなることを意味する。このため、一の層上に他の層が単に留め置かれ、より弱い力で剥離可能な状態(本明細書では、「仮固定」と称する場合がある)、粘着材による付着、及びホットメルト接着材の固化による付着と、接着材の硬化による接着とは明確に区別される。
前記熱硬化性樹脂としては、ポリイミド、ポリエステル等の高分子量樹脂、エポキシ樹脂、シリコーン樹脂、ポリウレタン樹脂、アクリル樹脂及びこれらの混合物を挙げることができる。前記熱硬化性樹脂としては、耐熱性の観点からポリイミド樹脂、エポキシ樹脂及びアクリル樹脂からなる群より選択される少なくとも1種を用いることが好ましい。熱硬化性樹脂は、ポリマーアロイ等の混合物として用いてもよく、1種単体で用いてもよい。
本発明において、絶縁層を構成する樹脂のTgには動的粘弾性測定(DMA)によって以下の測定条件で測定されたガラス転移温度を採用する。厚みの平均値が50μmの絶縁層を7層重ね合わせた350μmの絶縁層のシートを5mm幅、20mm長に外形加工する。接着材層の重ね合わせはホットロールラミネータを用いて、40℃、0.3MPaで行う。次いで、粘弾性アナライザー(レオメトリックス社製、商品名:RSA-2)を用いて、引っ張りモード、昇温速度5℃/min、周波数10Hz、測定温度30℃~300℃の条件で測定した時のtanδのピーク温度をTgとして評価する。なお、tanδのピークが複数ある場合は最も高温側のtanδのピーク温度をTgとする。
接着材層の厚みの平均値が3μm以上であれば、良好な接着性を得られる傾向があり、70μm以下であれば良好な熱伝導性が得られる傾向がある。
なお密着部と非密着部とを区別する基準明度は以下のようにして決定する。配線板の接着材層を透明基板に貼り付ける際に、一部の領域のみに、ヒートシンクに貼り付ける場合と同じ条件を適用して部分的に密着領域が形成された試料を別途作製する。作製した試料について上記と同様にして評価用画像を得て、密着領域における明度の最小値と、それ以外の領域における明度の最大値とから得られる平均値を基準明度とする。
前記配線板を含む第一の積層体及び配線板材料は、接着材層上に配置された支持用セパレータ(第一の仮支持体)を含む。配線板材料が支持用セパレータを含むことで、配線板材料の剛性が高められ、配線板材料の回路形成用金属層を回路形成処理における生産性が向上する。また第一の積層体が支持用セパレータを含むことで、第一の積層体の剛性が高められ、取扱性に優れる。
第一の積層体は、金属回路層、支持体及び接着材層をこの順に含む配線板と、配線板の接着材層上に配置された支持用セパレータとを含む。第一の積層体は必要に応じて他の層を含むことができる。第一の積層体は、回路形成用金属層、支持体、接着材層及び第一の仮支持体をこの順に含む配線板材料の回路形成用金属層に回路形成処理を施して準備してもよい。また金属回路層及び支持体の積層体と、接着材層及び支持用セパレータの積層体とを支持体と接着材層とが対向するように重ね合わせて準備してもよい。また金属回路層と支持体と接着材層と支持用セパレータとをこの順に重ね合わせて準備してもよい。また所望の金属回路層が予め形成された市販品を用いてもよい。
第二の積層体は、第一の積層体と、第一の積層体の金属回路層側の面に配置された搬送用支持基材(第二の仮支持体)とを含む。第二の積層体は、必要に応じて他の層を含むことができる。
搬送用支持基材の材質は特に限定されない。搬送用支持基材の材質は、一般的にはプラスチックであることが流通性又は価格の観点から好ましい。プラスチックとしては、ポリエチレンテレフタレート(PET)、ポリエチレンナフタレート等のポリエステル樹脂;ポリエチレン、ポリプロピレン、ポリスチレン、エチレン酢酸ビニル共重合体(EVA)等のポリオレフィン樹脂;ポリ塩化ビニル、ポリ塩化ビニリデン等のビニル系樹脂;ポリサルホン樹脂;ポリエーテルサルホン樹脂;ポリカーボネート樹脂;ポリアミド樹脂;ポリイミド樹脂;アクリル樹脂などが挙げられる。これらのプラスチックはフィルム状で用いられることが好ましい。これらのプラスチックフィルムは、単層で搬送用支持基材に含まれていてもよく、2層以上を組合せた多層フィルムとして含まれていてもよい。中でも、前記プラスチックフィルムとしては、透明性、耐熱性、取り扱いやすさ、価格等の点からポリエチレンテレフタレートフィルムがより好ましい。
第三の積層体は、第二の積層体から支持用セパレータを除去して得られる。第三の積層体は、配線板の金属回路層上に搬送用支持基材が配置されて構成されていることで、取扱い性に優れる。第二の積層体から支持用セパレータを除去する方法は特に制限されず、通常用いられる方法から適宜選択して適用することができる。
ヒートシンク付配線板は、ヒートシンク、硬化接着材層、支持体及び金属回路層をこの順に含む。ヒートシンク付配線板は、必要に応じて更に他の層を含むことができる。金属回路層がその上に配置された支持体が、硬化接着材層を介してヒートシンクと接着していることで、優れた熱伝導性を示すヒートシンク付配線板を得ることができる。
ヒートシンクとしては、熱を伝えやすい材料から構成されるものであれば、特に限定されない。ヒートシンクとしては、金属ヒートシンク、セラミック製ヒートシンク、ガラス、プラスチック等が挙げられる。配線板からの熱を効率よく外部に逃がす点からは、金属ヒートシンクが好ましい。
本発明のヒートシンク付配線板の製造方法の一実施形態について、図面を参照しながら説明する。
本発明の製造方法の一例を図4及び図5に示す。ただし、本発明のヒートシンク付配線板の製造方法は、これに限定されない。図5の(I)は図4の(I)に対応する全体の上面図であり、図5の(II)は図4の(II)に対応する全体の上面図であり、図5の(III)は図4の(IV)に対応する全体の上面図であり、図5の(IV)は図4の(VI)に対応する全体の上面図である。なお、図5(II)に示す破線は、図5(IV)中の支持体としての絶縁層17の外形と一致する。
搬送用支持基材21を配置することによって、後続する工程において配線板36を含む積層体の剛性を向上させることができる。
搬送用支持基材21の配置は、搬送用支持基材21が粘着層を含む場合には、粘着層が金属回路層に対向するように重ね合わせることができる。粘着層が金属回路層に対向するように重ね合わせる方法としては、プレス、ホットロールラミネート方法等が挙げられる。連続的に製造でき、効率が良好な観点から、ホットロールラミネート方法が好ましい。
接着工程では、配線板36の接着材層16とヒートシンク50と接触させて接着材層16を硬化する硬化工程を含むものであればよく、硬化工程の前に、配線板36の接着材層16とヒートシンク50とが接触するようにいったん配置して仮固定する仮固定工程を更に含むものであってもよく、配線板36の接着材層16とヒートシンク50とが接触するようにいったん配置して仮固定した後、搬送用支持基材21を除去する工程を更に含むものであってもよい。「仮固定」とは、配線板36の接着材層16とヒートシンク50とを接触させ、接着材層16中の接着材の硬化反応が充分に開始されない条件による処理を行い、硬化反応による接着で各部材を重ね合わせる場合よりも弱く各部材を重ね合わせることを意味する。
プレス及びホットロールラミネート方法は当該技術分野で通常行われる方法から適宜選択して行うことができる。例えば、ホットロールラミネートは、シリコーンゴム被覆ロールを備えたホットロールラミネータを用いて、20℃~150℃、0.1MPa~3.0MPa、0.1m/分~3.0m/分という条件で行うことができる。
本発明のヒートシンク付部品実装配線板の製造方法は、上述した各工程に加えて、上述した製造方法により得られたヒートシンク付配線板82の金属回路層11上に部品を実装する部品実装工程を含む(図6参照)。
本発明のヒートシンク付部品実装配線板は、ヒートシンク付配線板を用いて作製される。具体的には、図6及び図7に例示されるように、ヒートシンク付部品実装配線板102は、金属回路層11を有するヒートシンク付配線板82と、金属回路層11上に導電性接続材料42を介して実装された部品40とを有している。図7には、図5(IV)に示されるヒートシンク付配線板82の金属回路層11上に部品40が実装された態様の一例が示されている。図7では、複数の部品40が金属回路層11を介して直列に接続されている。
本発明では、ヒートシンク付部品実装配線板が電子部品となる。ヒートシンク付部品実装配線板は、粘着材層ではなく、硬化した接着材層により配線板がヒートシンクに固定されているために、硬化した接着材層の熱抵抗の低さのために放熱性に優れている。また、部品実装された配線板がヒートシンクから脱落する恐れがなく、ネジによる補強を行わずに済む。
本発明のセットは、回路形成用金属層、支持体、接着材層及び第一の仮支持体をこの順に含む配線板材料と、第二の仮支持体と、を含み、前記ヒートシンク付配線板の製造方法に使用されるセットであり、必要に応じて他の要素も含む。第二の支持体は、回路形成用金属層から形成される金属回路層上に配置されるものである。
また、本発明の他のセットは、金属回路層、支持体及び接着材層をこの順に含む配線板と、前記接着材層上に配置された第一の仮支持体とを含む仮支持体付配線板と、第二の仮支持体と、を含み、前記ヒートシンク付配線板の製造方法に使用されるセットであり、必要に応じて他の要素も含む。第二の支持体は、金属回路層上に配置されるものである。
上記のセットは、上述したヒートシンク付配線板の製造方法に使用される材料を要素として有するので、簡便に且つ効率よく、ヒートシンク付配線板を得ることができる。
上記の各態様における配線板材料、配線板、第一の仮支持体、仮支持体付接着材シート、及び第二の仮支持体、並びに他の要素については、前述したヒートシンク付配線板の製造方法に使用されるセット又はヒートシンク付部品実装配線板の製造方法に使用されるセットに関して、上述した内容をそのまま適用する。
(1)金属回路層と、支持体と、硬化接着材層と、ヒートシンクとをこの順に含むヒートシンク付配線板。
このようなヒートシンク付配線板では、支持体とヒートシンクとが硬化した接着材層を介して配置されているので、支持体とヒートシンクとの密着力に優れ、高い熱伝導性を示すことができる。この態様における支持体、金属回路層及び金属回路層を得るための回路形成用金属層、配線板、ヒートシンク、並びに、硬化接着材層及び硬化接着材層を得るための接着材層については、上述した内容をそのまま適用する。
(2)前記支持体と硬化接着材層の総厚みの平均値が6μm以上100μm以下である、(1)に記載のヒートシンク付配線板。
(3)前記支持体の厚みの平均値が3μm以上50μm以下である、(1)又は(2)に記載のヒートシンク付配線板。
(4)前記硬化接着材層の厚みの平均値が3μm以上50μm以下である、(1)~(3)のいずれかに記載のヒートシンク付配線板。
(5)金属回路層と、支持体と、硬化接着材層と、ヒートシンクとをこの順に含むヒートシンク付配線板と、前記ヒートシンク付配線板の前記金属回路層上に実装された部品と、を含むヒートシンク付部品実装配線板。このようなヒートシンク付部品実装配線板では、支持体とヒートシンクとが硬化した接着材層を介して配置されているので、支持体とヒートシンクとの密着力に優れる。これにより、部品の脱落が抑制され、ヒートシンクへの熱伝導性に優れた電子部品を供給できる。この態様における支持体、金属回路層及び金属回路層を得るための回路形成用金属層、配線板、ヒートシンク、硬化接着材層及び硬化接着材層を得るための接着材層、並びに、部品については、上述した内容をそのまま適用する。
(6)前記支持体と硬化接着材層の総厚みの平均値が6μm以上100μm以下である、(5)に記載のヒートシンク付配線板。
(7)前記支持体の厚みの平均値が3μm以上50μm以下である、(5)又は(6)に記載のヒートシンク付配線板。
(8)前記硬化接着材層の厚みの平均値が3μm以上50μm以下である、(5)~(7)のいずれかに記載のヒートシンク付配線板。
<配線板材料の作製>
回路形成用金属層として、厚みの平均値が35μmである銅箔と、厚みの平均値が30μmであるポリイミド絶縁層とがこの順に配置されてなる材料(日立化成株式会社、MCF-5000IS)と、ポリアミドイミド樹脂(60℃における粘度:6000Pa・s、熱硬化前かつ60℃を超え200℃以下の温度範囲における粘度の最小値:1000Pa・s、Tg:260℃)を含み、厚みの平均値が35μmである接着材層の一方の面にPETセパレータを、他方の面に厚みの平均値が50μmであるPETフィルムである支持用セパレータを有する接着材テープ(日立化成株式会社、AS-9000IA)と、を用意した。
上記で得たシールされた配線板材料の回路形成用金属層に、エッチングレジストを設けた後、塩化第二鉄水溶液中で銅を溶解することで回路加工処理して、金属回路層を形成し、配線板を作製した。これにより図4(II)に示されるような第一の積層体を得た。
得られた第一の積層体の金属回路層上に、搬送用支持基材として粘着フィルム(日立化成株式会社、DT-4300S、厚みの平均値50μm)を、粘着フィルムの粘着材層と金属回路層とが対向するように配置し、図4(III)に示されるような第二の積層体を得た。搬送用支持基材の配置は、30℃、0.3MPa、0.3m/minの条件にてロールラミネート法にて行った。次いで、6mm幅、100mm長に外形加工し、ガードテープを除去した。
上記で得られた外形加工された第二の積層体の接着材層上に配置されている支持用セパレータを180°折り曲げて、折り曲げ方向に引っ張ることにより剥離して、接着材層が露出した第三の積層体を得た。
得られた第三の積層体の接着材層が、ヒートシンクであるアルミニウム基板(A-5052、厚みの平均値1mm)と接触するように配置して、第三の積層体をヒートシンク上に仮固定した。第三の積層体及びヒートシンクの配置は、120℃、2.0MPa、1.0m/minの条件にてホットロールラミネート法にて行った。
同様にして、アルミニウム基板の代わりに透明基板(スライドガラス、ホウ珪酸ガラス、松浪S1111)を用いて、透明基板上に第三の積層体を仮固定し、密着面積率評価用の試料を得た。
次いで、ヒートシンク上に仮固定された第三の積層体の金属回路層上に配置されている搬送用支持基材を180°折り曲げて、折り曲げ方向に引っ張ることにより剥離して、配線板がヒートシンク上に仮固定された積層体を得た。
密着面積率評価用の試料についても同様に行った。
配線板がヒートシンク上に仮固定された積層体のヒートシンクの上に、耐熱離型フィルム(三井化学東セロ株式会社、オピュランX-44B、厚みの平均値50μm)を置き、真空加圧プレスを用い、3kPaの真空下で3MPaに加圧し、4℃/minで昇温し、185℃にて90分間保持することで加圧加熱することで接着材層を硬化して、ヒートシンク付配線板を得た。次いで、配線板の金属回路層面上の所定箇所にソルダレジストを印刷により付与し、120℃90分間の熱処理により硬化した。
密着面積率評価用の試料についても同様に行った。
ヒートシンク付配線板の金属回路層に、複数のはんだ(千住金属工業株式会社、ECO SOLDER PASTE Lead Free、M705、Sn-3.0Ag-0.5Cu、溶融温度220℃)、チップ抵抗(釜屋電機株式会社、RMC1K100FTE、厚膜抵抗10Ω、6.3mm長×3.2mm幅×0.6mm高)、コネクタ等を載せ、リフロー処理(最大260℃)することで、金属回路層上にチップ抵抗等の部品が実装されたヒートシンク付部品実装配線板を得た。
密着面積率評価用の試料についても同様に行った。
<配線板の密着面積率評価>
配線板における接着材層のヒートシンクに対する密着性を、以下のようにして測定される密着面積率により評価した。上記で得られた部品実装までを行った密着面積率評価用の試料に、目印として長さ75mmのテープを貼り付けた。天井に2本の蛍光灯(1200mm長、40W)を間隔が10.7cmとなるように平行に設置した。試料を、蛍光灯から2m下で、2本の蛍光灯が透明基板に写り込み、且つ透明基板面が天井から床方向に対して45°傾いた状態となるように位置決めした。写り込んだ蛍光灯の発光部分の長手方向とデジタルカメラの撮影画像(縦横比3:4)の長手方向(横方向)とがほぼ平行になり、写り込んだ蛍光灯の発光部分の長手方向の全長が、試料に貼り付けた長さ75mmのテープと同じ長さとなるように、試料とデジタルカメラの位置関係を調整して、画素数600万の評価用画像を得た。得られた評価用画像から、2本の蛍光灯に挟まれ、長手方向の中心付近にある領域の一部を矩形状の観察領域として選択した。選択された観察領域は、長手方向の長さが写り込んだ2本の蛍光灯の発光部分の長手方向の長さの80%で、短手方向の長さが写り込んだ2本の蛍光灯の間隔の70%であった。
なお密着部と非密着部とを区別する基準明度は以下のようにして決定した。配線板の接着材層を透明基板に貼り付ける際に、一部の領域のみに、ヒートシンクに貼り付ける場合と同じ条件を適用して部分的に密着領域が形成された試料を別途作製した。作製した試料について上記と同様にして評価用画像を得て、密着領域における明度の最小値と、それ以外の領域における明度の最大値とから得られる平均値を基準明度とした。
ヒートシンク付部品実装配線板の部品が実装された面とは反対側面のヒートシンクに放熱グリース(信越化学工業株式会社、G707)を塗布し、25℃に温調したヒートブロックに放熱グリースを介して固定した。チップ抵抗1個あたり1Wの電力が消費されるように通電し、5分間経過後に、部品の表面温度T1と配線板の部品実装していない部分の表面温度T2とをサーモカメラ(株式会社アピステ、FSV-1200)によってそれぞれ測定し、部品と配線板との温度差ΔT=T1-T2を評価した。その結果、部品と配線板との温度差ΔTは37.9℃であった。
回路形成用金属層として厚みの平均値が35μmである銅箔と、厚みの平均値が30μmであるポリイミド絶縁層とがこの順に配置されてなる材料(日立化成株式会社、MCF-5000IS)と、接着材層の厚みの平均値が25μmであること以外は実施例1と同じである接着材テープ(日立化成株式会社、AS-9000IA)とを用いたこと以外は、実施例1と同様にして、ヒートシンク付配線板及びヒートシンク付部品実装配線板を作製した。
回路形成用金属層として厚みの平均値が35μm厚である銅箔と、厚みの平均値が25μmであるポリイミド絶縁層とがこの順に配置されてなる材料(日立化成株式会社、MCF-5000IS)と、接着材層の厚みの平均値が25μmであること以外は実施例1と同じである接着材テープ(日立化成株式会社、AS-9000IA)とを用いたこと以外は、実施例1と同様にして、ヒートシンク付配線板及びヒートシンク付部品実装配線板を作製した。
回路形成用金属層として厚みの平均値が35μm厚である銅箔と、厚みの平均値が20μmであるポリイミド絶縁層とがこの順に配置されてなる材料(日立化成株式会社、MCF-5000IS)と、接着材層の厚みの平均値が25μmであること以外は実施例1と同じである接着材テープ(日立化成株式会社、AS-9000IA)とを用いたこと以外は、実施例1と同様にして、ヒートシンク付配線板及びヒートシンク付部品実装配線板を作製した。
回路形成用金属層として厚みの平均値が35μm厚である銅箔と、厚みの平均値が15μmであるポリイミド絶縁層とがこの順に配置されてなる材料(日立化成株式会社、MCF-5000IS)と、接着材層の厚みの平均値が25μmであること以外は実施例1と同じである接着材テープ(日立化成株式会社、AS-9000IA)とを用いたこと以外は、実施例1と同様にして、ヒートシンク付配線板及びヒートシンク付部品実装配線板を作製した。
回路形成用金属層として厚みの平均値が35μmである銅箔と、厚みの平均値が10μmであるポリイミド絶縁層とがこの順に配置されてなる材料(日立化成株式会社、MCF-5000IS)と、接着材層の厚みの平均値が25μmであること以外は実施例1と同じである接着材テープ(日立化成株式会社、AS-9000IA)とを用いたこと以外は、実施例1と同様にして、ヒートシンク付配線板及びヒートシンク付部品実装配線板を作製した。
<配線板材料の作製>
回路形成用金属層として厚みの平均値が35μmである銅箔と、厚みの平均値が10μmであるポリイミド絶縁層とがこの順に配置されてなる材料(日立化成株式会社、MCF-5000IS)と、接着材層の厚みの平均値が25μmであること以外は実施例1と同じである接着材テープ(日立化成株式会社、AS-9000IA)とを用いたこと以外は、実施例1と同様にして、配線板の作製、搬送用支持基材の配置、支持用セパレータの剥離を行った。
得られた第三の積層体の接着材層が、ヒートシンクであるアルミニウム基板(A-5052、厚みの平均値1mm)と接触するように配置して、第三の積層体をヒートシンク上に仮固定した。第三の積層体及びヒートシンクの配置は、真空加圧プレスを用い、3kPaの真空下で2MPaに加圧し、6℃/minで昇温し、130℃にて3分間保持することで加圧加熱して行った。
同様にして、アルミニウム基板の代わりに透明基板であるポリカーボネート基板(2mm厚)を用いて、透明基板上に第三の積層体を固定した。なお、真空加圧プレスの前に、配線板の金属回路層面上に耐熱離型フィルム(三井化学東セロ株式会社、オピュランX-44B、50μm)を置いた。仮固定の後に、配線板の金属回路層上から搬送用支持基材を剥離した。
配線板がヒートシンク上に仮固定された積層体を、オーブンを用い、大気圧下で185℃にて90分間加熱して、接着材層を硬化して、ヒートシンク付配線板を得た。
回路形成用金属層として厚みの平均値が35μmである銅箔と、厚みの平均値が10μmであるポリイミド絶縁層とがこの順に配置されてなる材料(日立化成株式会社、MCF-5000IS)と、接着材層の厚みの平均値が10μmであること以外は実施例1と同じである接着材テープ(日立化成株式会社、AS-9000IA)とを用いたこと以外は、実施例1と同様にして、ヒートシンク付配線板及びヒートシンク付部品実装配線板を作製した。
回路形成用金属層として厚みの平均値が35μmである銅箔と、厚みの平均値が5μmであるポリイミド絶縁層とがこの順に配置されてなる材料(日立化成株式会社、MCF-5000IS)と、接着材層の厚みの平均値が10μmであること以外は実施例1と同じである接着材テープ(日立化成株式会社、AS-9000IA)とを用いたこと以外は、実施例1と同様にして、ヒートシンク付配線板及びヒートシンク付部品実装配線板を作製した。
回路形成用金属層として厚みの平均値が35μmである銅箔と、厚みの平均値が5μmであるポリイミド絶縁層とがこの順に配置されてなる材料(日立化成株式会社、MCF-5000IS)と、接着材層の厚みの平均値が5μmであること以外は実施例1と同じである接着材テープ(日立化成株式会社、AS-9000IA)とを用いたこと以外は、実施例1と同様にして、ヒートシンク付配線板及びヒートシンク付部品実装配線板を作製した。
回路形成用金属層として厚みの平均値が35μmである銅箔と、厚みの平均値が5μmであるポリイミド絶縁層とがこの順に配置されてなる材料(日立化成株式会社、MCF-5000IS)と、接着材層の厚みの平均値が5μmであること以外は実施例1と同じである接着材テープ(日立化成株式会社、AS-9000IA)とを用いて、実施例1と同様にして配線板材料を得た。得られた配線板材料から支持用セパレータを剥離して得られた積層体を用いて、回路加工工程を実施した。
その結果、回路加工工程の途中で接着材層が薬液に侵食された。また、回路加工工程の取扱時に、配線板材料に折れ等の変形が生じることがあった。これによりその後の工程を実施することができなかった。
回路形成用金属層として厚みの平均値が35μmである銅箔に、厚みの平均値が25μmである接着材層と厚みの平均値が50μmである支持用セパレータとが配置されてなる接着テープ(日立化成株式会社、AS-9000IA、Tg260℃)を、接着材層が銅箔に接触するように配置した。接着材層の配置は、120℃、2MPa、1.0m/minの条件にてホットロールラミネート法にて行った。得られた積層体を配線板材料として用いたこと以外は、実施例1と同様に配線板を作製した。その結果、回路加工工程の途中で回路層側に露出した接着材層が薬液に侵食され、その後の工程を実施することができなかった。
<配線板材料の作製>
回路形成用金属層として厚みの平均値が35μmである銅箔と、厚みの平均値が30μmであるポリイミド絶縁層とが配置されてなる配線板材料(日立化成株式会社、MCF-5000IS)と、厚みの平均値が50μmである粘着材層の一方の面にPETセパレータ、他方の面にPETフィルムである支持用セパレータを有する粘着材テープ(日立化成株式会社、DA-3050)と、を用意した。
上記の配線板材料のポリイミド絶縁層と、上記の粘着材テープから一方の面のPETセパレータ(離型PETフィルム)を剥離して露出させた粘着材層とが対向するように配置して、支持セパレータと粘着材層とを有する配線板材料を得た。粘着材層の配置は、30℃、0.3MPa、0.3m/minの条件にてロールラミネート法にて行った。
搬送用支持基材が配置され、支持用セパレータが剥離された積層体(配線板)の粘着材層がヒートシンクであるアルミニウム基板(A-5052、厚みの平均値1mm)に対向するように積層体を配置して固定した。配線板とヒートシンクの配置は、30℃、0.3MPa、0.3m/minの条件にてロールラミネート法にて行った。
同様にして、アルミニウム基板の代わりに透明基板(スライドガラス、ホウ珪酸ガラス、松浪S1111)を用いて、透明基板上に配線板を固定した。
次いで、再び透明基板上に固定された配線板の密着面積率評価を行った。その結果、配線板の密着面積率は40%であった。また部品と配線板の温度差評価を行った。その結果、部品と配線板との温度差ΔTは45.1℃であった。
<配線板材料の作製>
回路形成用金属層として厚みの平均値が35μmである銅箔と、厚みの平均値が30μmであるポリイミド絶縁層とが配置されてなる配線板材料(日立化成株式会社、MCF-5000IS)と、ホットメルト接着材テープ(ポリエステル系樹脂、日東シンコー株式会社、ポリエスホットメルト接着シートFB-ML4、接着材層の厚みの平均値70μm、接着材層の一方の面にPETセパレータ、他方の面にPETフィルムである支持用セパレータを有する)と、を用意した。
上記の配線板材料のポリイミド絶縁層と、上記のホットメルト接着材テープから一方の面のPETセパレータ(離型PETフィルム)を剥離して露出させた接着材層とが対向するように配置して、支持セパレータとホットメルト接着材層とを有する配線板材料を得た。粘着材層の配置は、130℃、0.2MPa、0.5m/minの条件にてロールラミネート法にて行った。
同様にして、アルミニウム基板の代わりに透明基板(スライドガラス、ホウ珪酸ガラス、松浪S1111)を用いて、透明基板上に配線板を固定した。
次いで、透明基板上に固定された配線板の密着面積率評価を行った。その結果、配線板の密着面積率は98%であった。
再び透明基板上に固定された配線板の密着面積率評価を行った。その結果、配線板の密着面積率は80%であった。また部品と配線板の温度差評価を行った。その結果、部品と配線板との温度差ΔTは51.6℃であった。
本明細書に記載された全ての文献、特許出願、および技術規格は、個々の文献、特許出願、および技術規格が参照により取り込まれることが具体的かつ個々に記された場合と同程度に、本明細書に参照により取り込まれる。
Claims (11)
- 金属回路層、支持体及び接着材層をこの順に含む配線板と、前記接着材層上に配置された第一の仮支持体とを含む第一の積層体の前記金属回路層上に、第二の仮支持体を配置して第二の積層体を得ること、前記第二の積層体から、前記第一の仮支持体を除去して第三の積層体を得ること、並びに前記第三の積層体の接着材層とヒートシンクとを接触させ、前記接着材層を硬化させること、を含むヒートシンク付配線板の製造方法。
- 前記支持体及び前記接着材層の総厚みの平均値が6μm以上100μm以下である請求項1に記載のヒートシンク付配線板の製造方法。
- 前記支持体が絶縁層を含み、該絶縁層の厚みの平均値が3μm以上60μm以下である請求項1又は請求項2に記載のヒートシンク付配線板の製造方法。
- 前記接着材層の厚みの平均値が3μm以上70μm以下である請求項1~請求項3のいずれか1項に記載のヒートシンク付配線板の製造方法。
- 前記接着材層が熱硬化性である請求項1~請求項4のいずれか1項に記載のヒートシンク付配線板の製造方法。
- 前記第一の仮支持体の厚みの平均値が15μm以上300μm以下である請求項1~請求項5のいずれか1項に記載のヒートシンク付配線板の製造方法。
- 150℃~220℃の温度範囲及び10分~360分の時間範囲で加熱して、前記接着材層を硬化させることを含む請求項5又は請求項6に記載のヒートシンク付配線板の製造方法。
- 150℃~220℃の温度範囲及び10分~360分の時間で加熱しながら、0.1MPa~10MPaに加圧して、前記接着材層を硬化させることを含む請求項5又は請求項6に記載のヒートシンク付配線板の製造方法。
- 請求項1~請求項8のいずれか1項に記載のヒートシンク付配線板の製造方法によりヒートシンク付配線板を得ること、及び、
前記ヒートシンク付配線板の前記金属回路層上に部品を実装すること、
を含むヒートシンク付部品実装配線板の製造方法。 - 請求項1~請求項8のいずれか1項に記載の製造方法により得られたヒートシンク付配線板。
- 請求項9に記載の製造方法により得られたヒートシンク付部品実装配線板。
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KR20157001627A KR20150023840A (ko) | 2012-08-03 | 2013-08-01 | 히트 싱크 부착 배선판, 히트 싱크 부착 부품 실장 배선판 및 이들의 제조 방법 |
CN201380040810.3A CN104584698A (zh) | 2012-08-03 | 2013-08-01 | 带散热器布线板、安装有元件的带散热器布线板及它们的制造方法 |
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JPH098426A (ja) * | 1995-06-16 | 1997-01-10 | Hitachi Chem Co Ltd | 金属ベース多層配線板 |
JPH10335866A (ja) * | 1997-05-27 | 1998-12-18 | Fujitsu Ten Ltd | 回路基板の放熱構造 |
JPH11145627A (ja) * | 1997-11-06 | 1999-05-28 | Hitachi Chem Co Ltd | 金属板付き多層回路板 |
JP2001077486A (ja) * | 1999-09-03 | 2001-03-23 | Hitachi Chem Co Ltd | 配線板の製造方法及び配線板 |
JP2001135909A (ja) * | 1999-08-25 | 2001-05-18 | Hitachi Chem Co Ltd | 配線板の製造方法及び配線板 |
JP2011020393A (ja) * | 2009-07-17 | 2011-02-03 | Toyobo Co Ltd | 剥離性ポリイミドフィルム積層体の製造方法 |
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CN1452853A (zh) * | 2000-08-03 | 2003-10-29 | 哈米尔顿森德斯特兰德公司 | 印刷电路板和散热器的粘接 |
JP3461172B2 (ja) * | 2001-07-05 | 2003-10-27 | 日東電工株式会社 | 多層配線回路基板の製造方法 |
JP2007046003A (ja) * | 2005-08-12 | 2007-02-22 | Three M Innovative Properties Co | 被着体の貼付方法 |
JP5175779B2 (ja) * | 2008-04-18 | 2013-04-03 | 日東電工株式会社 | 配線回路基板の製造方法 |
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JPH098426A (ja) * | 1995-06-16 | 1997-01-10 | Hitachi Chem Co Ltd | 金属ベース多層配線板 |
JPH10335866A (ja) * | 1997-05-27 | 1998-12-18 | Fujitsu Ten Ltd | 回路基板の放熱構造 |
JPH11145627A (ja) * | 1997-11-06 | 1999-05-28 | Hitachi Chem Co Ltd | 金属板付き多層回路板 |
JP2001135909A (ja) * | 1999-08-25 | 2001-05-18 | Hitachi Chem Co Ltd | 配線板の製造方法及び配線板 |
JP2001077486A (ja) * | 1999-09-03 | 2001-03-23 | Hitachi Chem Co Ltd | 配線板の製造方法及び配線板 |
JP2011020393A (ja) * | 2009-07-17 | 2011-02-03 | Toyobo Co Ltd | 剥離性ポリイミドフィルム積層体の製造方法 |
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KR20150023840A (ko) | 2015-03-05 |
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