WO2014015644A1 - 高频信号双层排线转接卡 - Google Patents

高频信号双层排线转接卡 Download PDF

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Publication number
WO2014015644A1
WO2014015644A1 PCT/CN2013/000341 CN2013000341W WO2014015644A1 WO 2014015644 A1 WO2014015644 A1 WO 2014015644A1 CN 2013000341 W CN2013000341 W CN 2013000341W WO 2014015644 A1 WO2014015644 A1 WO 2014015644A1
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WO
WIPO (PCT)
Prior art keywords
layer
double
frequency signal
adapter card
substrate
Prior art date
Application number
PCT/CN2013/000341
Other languages
English (en)
French (fr)
Inventor
陈亮合
Original Assignee
Cheng Liang-Ho
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cheng Liang-Ho filed Critical Cheng Liang-Ho
Priority to EP13823660.9A priority Critical patent/EP2876746B1/en
Priority to US14/403,635 priority patent/US9215834B2/en
Publication of WO2014015644A1 publication Critical patent/WO2014015644A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/38—Information transfer, e.g. on bus
    • G06F13/40—Bus structure
    • G06F13/4063—Device-to-bus coupling
    • G06F13/409—Mechanical coupling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B11/00—Communication cables or conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/02—Disposition of insulation
    • H01B7/0258—Disposition of insulation comprising one or more longitudinal lapped layers of insulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/08—Flat or ribbon cables
    • H01B7/0846—Parallel wires, fixed upon a support layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/592—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connections to contact elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/594—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures for shielded flat cable
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives

Definitions

  • the invention relates to a cable, in particular to a double-layer cable adapter card which solves the transmission barrier of a double-layer line due to the parallel arrangement and overlap of a high-frequency signal and a DC power supply circuit line.
  • the line connection products generally made of insulating materials are covered, and the transmission capability of the high-frequency signal is doubled beyond the technical bottleneck; the finished product made of such a wire has excellent flexibility. Sex, and the price is much cheaper than the type of flexible printed circuit board, so the applicable field is wider.
  • Fig. 1A is a schematic view showing the structure of a conventional flexible cable 10A, which is formed by pressing a plurality of wires 11 by an adhesive layer 12 and an insulating film 13.
  • a flexible cable 10A can be used as an electrical connection for general transmission.
  • the conventional flexible cable 10A has not met the requirements.
  • the existing flexible cable is a flexible cable 10A, 10B using upper and lower double layers, which has the advantage of reducing the length of the connector (not shown), and utilizing the connector.
  • the circuit board can be electrically connected on both sides to increase the transmission circuit, and when it is required for special needs, a high-frequency transmission line 10 formed by two upper and lower two parallel lines of four lines can be formed. .
  • PCIe bus will become a new standard, and it is a signal channel between the processor and the external device.
  • PCIe is mostly thought of as a display card, in fact, such as USB devices, audio effects, and networks, these data are all data.
  • USB devices, audio effects, and networks these data are all data.
  • PCIe or similar signal channel Must be transmitted via PCIe or similar signal channel. Therefore, the faster the channel is transmitted, the larger the bandwidth, and the faster the data can be transmitted.
  • PCI Express referred to as PCIe
  • PCIe is a kind of computer bus PCI. It uses the existing programming concepts and communication standards, but is built on a faster serial communication system. PCIe has a faster rate to replace the existing internal bus (including AGP and PCI), and the new PCIe does not require an external power supply, can be directly powered by the slot, it has a DC power supply loop, can support +3. 3V, 3. 3Vau X and + 12V three voltages, which also brings convenience to the user.
  • Figure 1C shows a schematic diagram of a PCI Express 3. 0 bus, where the area indicated by Z (1 to 18 pins) is its most important, and Figure 1D shows the 1 to 18 pins in the Z area.
  • the function shows that PCIe 3. 0 can be directly powered by the slot in the Z zone (12V), which has the characteristics of a DC power supply loop and has multiple important grounds.
  • Figure 1E shows the function description of pins 19 ⁇ 32 of PCIe 3. 0.
  • PCIe 3. 0 bus can only be plugged into the expansion device such as a display card on the motherboard.
  • PCIe 3. 0 specification cable adapter (card) available for support.
  • the inventor's invention of the "upright computer mainframe" of No. 099123744 originally used a PCIe xl6 switching device to enable the circuit board and the expansion component to be connected side by side, but in the commercialization, it is necessary to face the The most common display card for the expansion module, the transmission specification is being converted from the original PCIe2.0 specification to PCIe3. 0, making it difficult to complete the PCIe2.0 specification adapter, completely unable to start the next generation PCIe3. 0 specification display card is serious problem.
  • the reason is that the transmission structure of the current PCI-Express converter is only focused on the area where the I/O signals are exchanged at high frequency speed. How to match the settings has sufficient isolation interference, which is almost separated from each other by two pairs.
  • the grounding pin (shown in Figure 1E) ignores the same I/O high-frequency signal is responsible for detection and gives the start of the transmission loop, the grounding pin is not only in pairs, but also side by side In the continuous magnetic field effect brought by the DC link line on the side, when the user has the transfer request of the inventor's invention of the "upright computer host" of the inventor's No. 099123744, in order to smoothly connect the two ends The upper and lower contact faces of the board, and then the two layers of wires arranged side by side, thus making the speed faster and faster
  • the I/O signal exchange frequency is interfered by the magnetic field of the fixed strength of the DC line, which results in the transmission of the high-frequency I/O signal. It is responsible for detecting and giving the signal loop of the start, and then converting it into the transmission of the wire, but because of the original foot.
  • the bit is not configured to a ground line sufficient to provide isolation interference, and is too close to the DC line to be blocked by the magnetic field, and cannot initiate a PCI-Expre SS 3. 0 new generation display card with a round-trip frequency of the signal transmission.
  • the inventors of the present invention have in view of the above-mentioned conventional soft double-layer cable, and the obstacles arising from the high-speed transmission request, and the solution to the problem are the main subjects of the present invention.
  • the main technical problem to be solved by the present invention is to overcome the above-mentioned drawbacks existing in the prior art, and to provide a high-frequency signal double-layer cable riser card, the data transmission bandwidth can exceed the 8Gb/s bottleneck, and the high-frequency signal Undistorted transmission characteristics, excellent flexibility and bending resistance, and low cost.
  • Double layer cable riser card including:
  • a first connecting end having a first substrate and a connector, and a front side and a back side of the first board are respectively provided with a first connecting pin and a second connecting pin;
  • a second connecting end is provided with a second substrate, and a front side and a back side of the second substrate are respectively provided with a third connecting pin position and a fourth connecting pin position;
  • a cable assembly formed by at least two cables is connected between the first and second connection ends in an upper and lower double layer, wherein the front and rear ends of the first row of the upper layer are electrically connected to the first a first pin of the substrate and a third pin of the second substrate, and the front and rear ends of the second row of the lower layer are electrically connected to the second pin of the first substrate and a fourth terminal position of the second substrate; characterized in that - a conductive metal foil is disposed between the upper and lower double layers of the cable group, and the width of the metal foil must cover at least the cable group As the power supply circuit line area, the magnetic field effect of the power supply circuit line area of the upper and lower layers of the cable is separated and resolved; The entire double-layer cable is coated with a conductive tape with high-frequency shielding to minimize the loss of high-frequency signals.
  • the metal foil may be a copper foil, and one surface of the copper foil may be provided with an adhesive.
  • the cable group can be composed of two cables, and further includes four cables, which are arranged side by side on the side of the first and second rows of the upper and lower double-layer cables.
  • the third row line of the upper layer and the fourth row line of the lower layer are formed to form a high frequency signal switching device with four lines arranged side by side and arranged side by side.
  • the metal foil can be provided between the third row and the fourth row according to requirements.
  • the inner edge surface of the conductive adhesive tape may be respectively provided with an insulating layer relative to the position of the connecting pin position of the first and second connecting ends; and the insulating layer may be composed of an insulating tape.
  • the present invention disperses the magnetic field generated by the DC circuit into the ground return line, and removes the maximum factor affecting the I/O signal, and uses the conductive tape with high frequency shielding effect to double
  • the layer of wire is wrapped to minimize the loss of high frequency signal due to outward emission; so that it can effectively and efficiently solve the double-layer of high-frequency signal with increasing transmission capacity under the synergistic effect of the two.
  • Cable riser card a transmission barrier caused by high-frequency signals passing through the magnetic field of the power supply circuit that is too closely aligned.
  • the invention has the beneficial effects that the data transmission bandwidth can break through the 8Gb/s bottleneck, the transmission characteristic of the high-frequency signal is not distorted, and the excellent flexibility and bending resistance can be realized, and the cost is low.
  • Fig. 1A is a schematic structural view of a conventional flexible cable.
  • FIG. 1B is a schematic structural view of a conventional double-layer flexible cable.
  • Figure 1C is a schematic diagram of a PCIe bus.
  • Figure 1D is a schematic view of the 1 to 18 pins of the Z region of Figure 1C.
  • Figure 1E is a schematic view of the pins 19 to 32 in Figure 1C.
  • Figure 2 is an exploded perspective view of a metal foil in accordance with a preferred embodiment of the present invention.
  • Figure 3 is a perspective view of the metal foil of Figure 2 placed between the sets of wires.
  • Fig. 4A is a schematic view of the direction 4A-4A of Fig. 3.
  • Fig. 4B is a view showing another embodiment of the metal foil sheet setting region of the present invention.
  • Fig. 4C is a view showing still another embodiment of the metal foil sheet setting region of the present invention.
  • Fig. 5 is a schematic view (1) of a wire assembly coated with a conductive tape of the present invention.
  • Fig. 6 is a schematic view (2) of the wiring group coated with a conductive tape of the present invention.
  • Fig. 7 is a perspective view showing the completion of the wiring group of the present invention coated with a conductive tape.
  • Figure 8 is an enlarged cross-sectional view showing a portion of the structure of Figure 7.
  • the high-frequency signal double-layer cable adapter card 20 of the present invention uses a flexible cable manufactured by coating each of the insulating materials as a transmission line.
  • the first embodiment of the present invention includes a first substrate 31 and a connector 34, and the first substrate A front and back sides 31 of the 31 are respectively provided with a first pin 32 and a second pin 33.
  • a second connecting end 40 is provided with a second substrate 41, and a front side and a back side of the second board 41 are respectively provided with a third pin position 42 and a fourth pin position 43.
  • the upper and lower double layers are connected between the first connecting end 30 and the second connecting end 40, wherein the upper line and the second connecting end 40 are connected to each other.
  • the second terminal is electrically connected to the first pin 32 of the first substrate 31 and the third pin 42 of the second substrate 41, and the front and rear ends of the second row 52 of the lower layer are respectively connected.
  • the second pin position 33 of the first substrate 31 and the fourth pin position 43 of the second substrate 41 are respectively electrically connected, but are not limited thereto, and the double-layer cable transfer of the present invention is also
  • the card 20 includes two upper and lower double-layer cables, and may also include four cable wires. In this embodiment, the first cable wire 51 and the second cable wire 52 are on the upper and lower rows.
  • the side of the line is provided with an upper third row line 53 and a lower layer fourth row line 54 side by side to form four rows of two rows and two overlapping side by side row group 50.
  • an upper third row line 53 and a lower layer fourth row line 54 side by side to form four rows of two rows and two overlapping side by side row group 50.
  • a conductive metal foil 60 is disposed between the upper and lower double-layer wires 51/52 of the cable group 50, and the width W of the metal foil 60 must cover at least the cable group 50 as a power supply back.
  • the route area Z (1st to 18th pins) is used to isolate the upper and lower two-layer cable 51/52 having the power supply circuit line area Z; in this embodiment, Between the first connection end 30 and the second connection end 40, the cable assembly 50 includes four rows of wires on the sides of the first and second rows of wires 51 and 52 and the lower and second rows of cables.
  • a third row line 53 of the upper layer and a fourth row line 54 of the lower layer are arranged side by side to form a double-layer cable riser card 20 for high frequency signals which are arranged side by side and arranged in parallel.
  • the width can be determined according to requirements ⁇
  • FIG. 3 a preferred embodiment thereof discloses two metal foil sheets 60 respectively disposed between the upper and lower two layers of wires 51/52, 53/54; and the two metal foils
  • the width W of 60 is almost equivalent to the width of the upper and lower two rows of wires, but is not limited thereto; that is, as shown in FIG. 4B, only one metal foil is disposed between the two layers of wires 51/52. Sheet 60, this can also be implemented.
  • the metal foil piece 60 has only one piece, and its width W can cover more than the wire group 50 as the power supply circuit line area Z, so that the area Z of the power supply circuit will be up and down.
  • the metal foil 60 can be used to introduce the magnetic field generated by the DC circuit of the power supply line region Z into the ground line, thereby eliminating the maximum factor affecting the I/O signal.
  • the metal foil 60 is preferably a copper foil, which is a metal excellent in diamagnetism, which meets the requirements of the present invention.
  • the copper foil 60 can be provided with an adhesive 61 on one surface thereof, so that the metal foil 60 can be positioned between the upper and lower layers of the wires 51/52, 53/54; the adhesive 61 can be sprayed or pasted. The method is formed on the entire surface or a part of the surface of the metal foil 60.
  • the present invention further coats the area of the entire double-layer cable group 50 with the metal foil 60 by a conductive adhesive tape 70 having a high-frequency shielding effect.
  • the frequency signal is not leaked.
  • the inner peripheral surface of the conductive adhesive tape 70 is provided with an insulating layer 71, which may be formed of an insulating tape, with respect to the positions of the terminals 32/33, 42/43. Therefore, when the conductive tape 70 covers the cable group 50, the electrical relationship is not affected; of course, the insulating layer 71 is not limited to be disposed on the inner edge surface of the conductive tape 70, and may be directly insulated tape. The surface of the wiring pin is covered to be insulated from the conductive tape 70.
  • the present invention introduces the magnetic field generated by the DC circuit into the grounding wire by the metal foil 60, and eliminates the maximum factor affecting the I/O signal, and uses the conductive adhesive tape 70 having the high-frequency shielding effect to double
  • the layer of wire is wrapped to minimize the loss of high-frequency signals; to effectively and effectively solve the high-frequency signal and the power supply circuit under the action of the two, the transmission obstacles caused by side-by-side and overlapping .
  • the thickness of the metal foil 60 and the conductive tape 70 used in the present invention are very thin, almost no more than 0. lmn! ⁇ 0. 3mm, so it does not affect the flexibility and bendability of the flexible cable, which is not possible with the existing flexible printed circuit type (Flexible Print Circuit) type of cable;
  • the present invention has the advantage of low cost, and is mainly used in the internal space of a personal computer or a server, so the length of 25 cm is sufficient, so the present invention is an experiment with a 25 cm cable, and the existing soft row
  • the line is used on the specifications of various versions of PCI Express, and the test results are as follows: Z means usable, X means unusable
  • the high-frequency signal double-layer cable connection card 20 of the present invention can be used for all versions of PCIel. 0 ⁇ PCIe3.0, even if it is made of a flexible printed circuit board (Flexible Print Circuit) type.
  • PCIe3.0 connector card
  • the present invention is more cost-effective and can achieve excellent flexibility and bending resistance. This is an effect that cannot be achieved with a flexible printed circuit type connector.
  • the invention utilizes the above technical features to experimentally insert the metal foil into the magnetic field generated by the DC circuit, disperse and introduce into the ground return line, and eliminate the maximum factor affecting the 1/0 signal, and then have the high frequency shielding effect.
  • the conductive tape wraps the double-layer cable to minimize the loss of the high-frequency signal due to the outward emission; so that it can successfully start the next-generation PCI-E under the effect of the two.
  • X pres S 3.

Abstract

一种高频信号双层排线转接卡（20），可以解决双层线因高频信号与直流供电回路的并排及重叠而产生传输障碍，包括：一第一连接端（30），其具备一第一基板（31）及一连接器（34）；一第二连接端（40），其具备一第二基板（41）；至少二条排线构成的排线组（50），呈上、下双层连接于第一及第二连接端之间；排线组的上、下双层排线之间设有一导电的金属箔片（60），金属箔片的宽度须至少能覆盖超过排线组作为供电回路线的区域，以将上、下双层排线有供电回路线区域的磁场效应予以隔开化解；以一具有高频遮蔽作用的导电胶布（70），将整个双层排线包覆。该转接卡可突破8Gb/s瓶颈，并具有高频信号不失真的传输特性，还具有优良的可挠性及耐弯曲性以及成本低的功效。

Description

高频信号双层排线转接卡 技术领域
本发明是有关一种排线，尤指一种解决双层线因高频信号与直流供电回路线的并 排及重叠而产生传输障碍的双层排线转接卡。
背景技术
在电脑、 电视等各种电子产品中， 大多使用排线作为主机板与各扩充组件讯号 往返的连接线路， 只是一连串的进步， 主机板与各扩充组件讯号往返的传输容量要求 也就越来越高， 终而导致了用一般绝缘材各别所包覆的排线制成的线路连接产品， 讯 号的传输能力， 每到传输容量的要求被提升时， 传输技术上就会出现一个新的瓶颈。 即使排线的种类， 有以软性印刷电路基板 （Flexible Print Circuit ) 类型所制作而 成， 其虽然传输上有较稳定的优点， 但其成本高， 且其弯折性不如一般由绝缘材各别 包覆的线材， 致使其使用范围受到限制。
因此， 解决一般由绝缘材各别包覆排线所制成的线路连接产品， 使高频讯号的 传输能力突破技术上的瓶颈而倍增； 此种排线材所制的成品具有极佳的可挠性，且价 格上要比软性印刷电路基板类型便宜甚多， 因此可适用的领域更为宽广。
图 1A所示， 是现有软性排线 10A的结构示意图， 其将数条导线 11利用接着层 12及绝缘薄膜 13予以压着成型。 此种软性排线 10A作为一般传输的电性连接， 尚能 满足其须求。 但随着电子产品不断推陈出新， 出现对信号传送的高速化要求， 因此， 传统的软性排线 10A已不符要求。
于是， 如图 1B所示， 现有一种软性排线， 是使用上、 下双层的软性排线 10A、 10B, 其优点是可以减少连接器 （图未示） 的长度， 利用连接器的电路基板双面可以 电性连接的特性， 以增加传输电路， 且其于特殊需求时， 可上面两条而下面两条双层 并列的四条排线所形成的一种高频传输排线 10。
但査， 这种现有高频传输排线 10， 为达信号传输的高速化， 特性阻抗及磁损的 控制为必要。 然而， 目前现有技术中， 大都以遮蔽、 接地以及磁环作用和连接器制作 技术为主要解决方式； 亦有在电路板的回路上增设具有高频信号处理效能的电容、电 感或电抗等电子零件， 作为解决上述问题的方法。
而上述各种解决方法， 对于先前各种不同电子产品或许有其功能性， 但随着传 输速度不断地要求， 传输规格也正由原来的 PCIe 2. 0转换到 PCIe 3. 0。
申言之， PCIe总线将成为一个新的标准， 且是处理器与外部设备的一条信号信 道， 虽然谈到 PCIe多半想到都是显示卡， 但其实诸如 USB设备、 音效、 网络， 这些 数据数据都必须通过 PCIe或类似的讯号信道来传输。是以，这条信道传输速度越快， 频宽越大， 所能传输的数据当然也更快更多。
承上， 所谓的 PCI Express, 简称 PCIe, 是电脑总线 PCI的一种， 它沿用了现 有的编程概念及通讯标准， 但建立于更快的串行通信系统。 PCIe 具有更快的速率， 以取代现有内部总线 （包括 AGP和 PCI ), 且新的 PCIe并不须外接电源， 可直接由插 槽中取电， 其具有直流供电回路， 可支持 +3. 3V, 3. 3VauX及 + 12V三种电压， 这也 给使用者带来方便性。
图 1C所示即为一种 PCI Express 3. 0总线的示意图， 其中 Z所指的区域（1〜 18引脚） 是其最重要的地方， 而图 1D是说明 Z区域中 1〜18引脚的功能， 由图 1C 及图 1D显示得知， PCIe 3. 0可直接由 Z区域的插槽中取电 （12V)， 其具有直流供电 回路的特性， 且其具有多个重要接地。 另， 图 1E显示 PCIe 3. 0第 19〜32引脚的功 能说明。
然査，目前的 PCIe 3. 0总线仅能在主机板上供显示卡等扩充设备插上连接使用， 尚无 PCIe 3. 0规格的排线转接器 （卡） 可供支持使用。
例如，发明人的第 099123744号「直立式电脑主机」发明申请案，原使用一 PCIe xl6的转接装置， 使电路板与扩充组件达成并排连接使用， 但在商品化之际， 必须面 对该扩充组件最为普遍的显示卡，传输规格正由原来 PCIe2. 0的规格转换到 PCIe3. 0， 使得 好不容易完成 PCIe2. 0规格的转接装置， 完全无法启动新一代 PCIe3. 0规格显 示卡的严重问题。 究其原因， 发现目前的 PCI一 Express转接装置的传输结构， 只专注 在 I/O信号以高频速度往返交换的区域， 如何搭配设置具有足够隔离干扰作用，几乎 与之成两两配对相隔的接地线路脚位（如图 1E所示），而忽略了同样是 I/O高频信号 负责侦测并且给予启动的传输回路，接地线路脚位不但没有两两成对的配置，还有并 排在一旁的直流回路线所带来的连续性磁场效应， 当使用者有了类似发明人的第 099123744号 「直立式电脑主机」 发明申请案的转接需求时， 为了能顺利的连接两端 电路板的上下两接触面，进而使用并排在一起的两层线排， 于是使得速度越来越快的
I/O信号交换频率， 受到直流线路固定强度的磁场干扰， 导致同样是高频 I/O信号的 传输， 负责侦测并且给予启动的信号回路， 再转换成线材的传输时， 却因为原脚位没 有配置到足够发挥隔离干扰作用的接地线路， 又过于接近直流线路遭到磁力区的阻 拦， 而无法启动信号传输往返频率几近于倍增的 PCI— ExpreSS3. 0新一代显示卡。
所以， 至今尚未有针对 PCIe 3. 0显示卡所设计的双层排线转接器材， 此外， 即 使软性印刷电路基板 （Flexible Print Circuit ) 类型所制成的转接卡可供使用， 但 此种转接卡仍然有成本高及不耐弯折的缺失， 因此使用范围将受到限制，其使用上不 若双层排线来得便利及实用； 是以， 本发明将不列入考虑。
是以， 本发明人有鉴于前述现有软性双层排线， 因高速传输要求所衍生的障碍， 思及解决的方法， 为本发明的主要课题。
发明内容
本发明所要解决的主要技术问题在于， 克服现有技术存在的上述缺陷， 而提供一 种高频信号双层排线转接卡，其数据传输频宽可突破 8Gb/s瓶颈， 具高频信号不失真 的传输特性， 且可实现优良的可挠性及耐弯曲性， 并具有成本低的功效。
本发明解决其技术问题所采用的技术方案是- 一种高频信号双层排线转接卡， 尤指一种解决双层线因高频信号与直流供电回 路的并排及重叠而产生传输障碍的双层排线转接卡， 包括：
一第一连接端， 其具备一第一基板及一连接器， 且该第一基板的正面及反面分 别设有一第一接线脚位及第二接线脚位；
一第二连接端， 其具备一第二基板， 且该第二基板的正面及反面分别设有一第 三接线脚位及第四接线脚位；
至少二条排线所构成的排线组， 呈上、 下双层并排连接于该第一及第二连接端 之间， 其中上层的第一排线前、后二端分别电性连接于该第一基板的第一接线脚位及 该第二基板的第三接线脚位， 且该下层的第二排线前、后二端分别电性连接于该第一 基板的第二接线脚位及该第二基板的第四接线脚位； 其特征在于- 该排线组的上、 下双层之间设有一导电的金属箔片， 且该金属箔片的宽度须至 少能覆盖超过该排线组作为供电回路线区域， 以将上、下两层排线有供电回路线区域 的磁场效应予以隔开化解； 以一具有高频遮蔽作用的导电胶布， 将整个双层排线予以包覆， 使高频信号的 损失减到最少。
依据前述特征， 该金属箔片可为铜箔， 且该铜箔其中一表面可设有黏胶。
依据前述特征， 该排线组除可由二条排线所构成外， 更包括可设有四条排线， 其于该第一排线及第二排在线、下双层排线的侧边并排设有一上层的第三排线及一下 层的第四排线， 以形成四条排线两两重叠并排的高频信号转接装置。
承上， 该第三排线与第四排线之间可依需求设有金属箔片。
依据前述特征，该导电胶布的内缘面相对该第一及第二连接端的接线脚位位置， 可分别设有绝缘层;且该绝缘层可由一绝缘胶带所构成。
本发明借助上述技术特征， 以该金属箔片将直流电路所产生的磁场， 分散导入接 地回路线， 而将影响 I/O信号的最大因素排除， 并以具有高频遮蔽效用的导电胶布将 双层排线包覆，使高频信号因向外发射而衰减的损失减到最少； 使其在两者相辅相乘 的作用下， 具体且有效地解决传输容量不断提高的高频信号双层排线转接卡， 因高频 信号在穿越与的排列过于紧密的供电回路磁场区时所产生的传输障碍。
本发明的有益效果是，其数据传输频宽可突破 8Gb/s瓶颈， 具高频信号不失真的 传输特性， 且可实现优良的可挠性及耐弯曲性， 并具有成本低的功效。
附图说明
下面结合附图和实施例对本发明进一步说明。
图 1A是现有软性排线的结构示意图。
图 1B是现有双层软性排线的结构示意图。
图 1C是 PCIe总线的示意图。
图 1D是图 1C中 Z区域的 1〜18引脚示意图。
图 1E是图 1C中 19〜32引脚示意图。
图 2是本发明较佳实施例的金属箔片分解立体图。
图 3是图 2中的金属箔片置入排线组之间的立体图。
图 4A是图 3中 4A- 4A方向的示意图。
图 4B是本发明的金属箔片设置区域另一实施例图。
图 4C是本发明的金属箔片设置区域又一实施例图。
图 5是本发明的排线组包覆导电胶布的示意图 （一）。 图 6是本发明的排线组包覆导电胶布的示意图 （二）。
图 7是本发明的排线组包覆导电胶布完成的立体图。
图 8是图 7中部分结构放大剖视图。
图中标号说明-
20双层排线转接卡、 30第一连接端、 31第一基板、 32第一接线脚位、 33第二 接线脚位、 34连接器、 40第二连接端、 41第二基板、 42第三接线脚位、 43第四接 线脚位、 50排线组、 51第一排线、 52第二排线、 53第三排线、 54第四排线、 60金 属箔片、 61黏胶、 70导电胶布、 71绝缘层。
具体实施方式
首先， 请配合图 2至图 7所示， 本发明的高频信号双层排线转接卡 20， 是使用 以绝缘材各别包覆所制造的软性排线， 来作为传输线， 取其可挠性及耐弯曲性， 并 具有成本低的特性， 而本发明一较佳实施例包括- 一第一连接端 30， 其具备一第一基板 31及一连接器 34， 且该第一基板 31的正 面及反面分别设有一第一接线脚位 32及第二接线脚位 33。
一第二连接端 40， 其具备一第二基板 41 , 且该第二基板 41的正面及反面分别 设有一第三接线脚位 42及第四接线脚位 43。
至少二条排线 51， 52所构成的排线组 50， 呈上、 下双层连接于该第一连接端 30及第二连接端 40之间， 其中该上层的第一排线 51的前、 后二端， 分别电性连接 于该第一基板 31的第一接线脚位 32及该第二基板 41的第三接线脚位 42， 且该下层 的第二排线 52的前、 后二端， 分别电性连接于该第一基板 31的第二接线脚位 33及 该第二基板 41的第四接线脚位 43， 但不限定于此， 亦既， 本发明的双层排线转接卡 20， 包括可为两条上、 下双层排线， 亦可包括设有四条排线， 本实施例中， 其于该第 一排线 51及第二排线 52上、 下双层排线的侧边， 并排设有一上层的第三排线 53及 一下层的第四排线 54， 以形成四条排线两两重叠并排的排线组 50。 但， 上述构成为 先前技术 (prior art) , 非本发明的专利目的， 容不赘述。
而本发明的主要特征在于：
该排线组 50的上、下双层排线 51/52之间设有一导电的金属箔片 60，且该金属 箔片 60的宽度 W， 须至少能覆盖超过该排线组 50作为供电回路线区域 Z (第 1~18 引脚）， 以将有供电回路线区域 Z的上下两层排线 51/52予以隔绝； 本实施例中， 该 第一连接端 30及第二连接端 40之间， 该排线组 50包括设有四条排线， 其于该第一 排线 51及第二排线 52上、 下双层排线的侧边， 并排设有一上层的第三排线 53及一 下层的第四排线 54， 以形成四条排线两两重叠并排的高频信号用的双层排线转接卡 20。 至于金属箔片 60的设置可依需求来决定其宽度^
图 4A及图 2， 图 3所示， 其一较佳实施例揭示二片金属箔片 60， 分别设置在上 下两层排线 51/52， 53/54之间；且该二片金属箔片 60的宽度 W, 几乎相当于该上下 两层排线的宽度， 但不限定于此;亦即其可如图 4B所示， 仅在其中两层排线 51/52 之间， 设置一片金属箔片 60， 如此亦可实施。 此外， 其亦可如图 4C所示， 该金属 箔片 60仅有一片， 且其宽度 W大约能覆盖超过该排线组 50作为供电回路线区域 Z， 以将有供电回路的区域 Z的上下两层排线 51/52予以隔开； 如此就能以该金属箔片 60将供电回路线区域 Z的直流电路所产生的磁场， 导入接地线， 而将影响 I/O信号 的最大因素排除。 本实施例中， 该金属箔片 60为铜箔为最佳， 此乃铜为反磁性优异 的金属， 符合本发明的需求。 且该铜箔 60可于其中一表面设有黏胶 61， 如此方便该 金属箔片 60定位在上下两层排线 51/52， 53/54之间;上述黏胶 61能以喷涂或黏贴方 式形成于该金属箔片 60的全部表面或一部分表面。
请续参考图 5至图 8所示，本发明进一步以一具有高频遮蔽作用的导电胶布 70, 至少将整个双层排线组 50设有该金属箔片 60的区域予以包覆， 使高频信号不外泄。 且在一较佳实施例中， 该导电胶布 70的内缘面相对于该接线脚位 32/33， 42/43的位 置， 分别设有绝缘层 71 , 该绝缘层可由一绝缘胶带所构成。 如此当该导电胶布 70包 覆该排线组 50时， 不会影响其电性关系； 当然， 该绝缘层 71不限于预先设在该导电 胶布 70的内缘面， 其亦可直接以绝缘胶带包覆在该接线脚位表面， 使其可与该导电 胶布 70绝缘。
本发明借助上述技术特征， 以该金属箔片 60将直流电路所产生的磁场， 导入接 地线， 而将影响 I/O信号的最大因素排除， 并以具有高频遮蔽效用的导电胶布 70将 双层排线包覆， 使高频信号的损失减到最少； 使其在两者相辅相乘的作用下， 具体且 有效地解决高频信号与供电回路， 因并排及重叠所产生的传输障碍。
更重要的是，本发明上述所采用的金属箔片 60及导电胶布 70的厚度都很薄，几 乎不超过 0. lmn！〜 0. 3mm， 所以不会影响到软性排线的可挠性及可弯曲的特性， 这是 现有软性印刷电路基板 （Flexible Print Circuit ) 类型所制成的排线所无法达成； 再者， 本发明具有成本低的优势， 且其主要是使用在个人电脑或服务器的内部空间， 因此 25cm的长度已经足够， 所以本发明是以 25cm的排线作实验， 与现有软性排线用 于 PCI Express各种版本的规格上使用， 其测试结果如后： Z代表可使用， X代表无 法使用
Figure imgf000009_0001
由上述表列得知，现有软性排线的转接方式被启用于 PCIel. O的版本，但对于传 输规格被提升至 PCIe3. 0的版本时， 则完全无法启动被转接的显示卡而不能使用。而 本发明的高频信号双层排线连接卡 20, 则对于 PCIel. 0〜PCIe3. 0的所有版本， 皆可 使用， 既使有以软性印刷电路基板 (Flexible Print Circuit ) 类型所制成 PCIe3. 0 连接器 （卡）， 但本发明除具有高频信号传输不迟滞或磁损的电气特性外， 更具有成 本低，且可实现优良的可挠性及耐弯曲性。而此为软性印刷电路基板（Flexible Print Circuit ) 类型连接器所无法达成的功效。
本发明借助上述技术特征， 以实验法将该金属箔片置入直流电路所产生的磁场， 分散导入接地回路线， 而将影响 1/0信号的最大因素排除，之后并以具有高频遮蔽效 用的导电胶布将双层排线包覆，使高频信号因向外发射而衰减的损失减到最少；使其 在两者相辅相乘的作用下， 不但顺利的启动了新一代 PCI一 EXpresS3. 0的显示卡， 并 且也通过了发明人所能进行包含多款电脑效能测试软件的种种使用测试，从而证实了 此办法确实能够具体且有效地解决高频信号在线材上所产生的传输障碍及讯号衰减 等的许多问题， 让数据传输频宽从原来 PCI一 Express2. 0 的 4Gb/s， 一口气倍增至 PCI_Express3. 0的 8Gb/s， 由于 PCI— Express3. 0已是目前电脑器材中数据传输频宽 要求的最高规范，而本发明经实际测试确实足堪使用，而能解决当前最新规格显示卡 的转接问题最新规格点。
以上所述， 仅是本发明的较佳实施例而已， 并非对本发明作任何形式上的限制， 凡是依据本发明的技术实质对以上实施例所作的任何简单修改、等同变化与修饰，均 仍属于本发明技术方案的范围内。
综上所述， 本发明在结构设计、使用实用性及成本效益上， 完全符合产业发展所 需， 且所揭示的结构亦是具有前所未有的创新构造， 具有新颖性、 创造性、 实用性， 符合有关发明专利要件的规定， 故依法提起申请。

Claims

权利要求书
1、 一种高频信号双层排线转接卡， 尤指一种解决双层线因高频信号与直流供电 回路的并排及重叠而产生传输障碍的双层排线转接卡， 包括- 一第一连接端， 其具备一第一基板及一连接器， 且该第一基板的正面及反面分 别设有一第一接线脚位及第二接线脚位；
一第二连接端， 其具备一第二基板， 且该第二基板的正面及反面分别设有一第 三接线脚位及第四接线脚位；
至少二条排线所构成的排线组， 呈上、下双层连接于该第一及第二连接端之间， 其中该上层的第一排线前、后二端分别电性连接于该第一基板的第一接线脚位及该第 二基板的第三接线脚位， 且该下层的第二排线前、后二端分别电性连接于该第一基板 的第二接线脚位及该第二基板的第四接线脚位； 其特征在于- 该排线组的上、 下双层排线之间设有一导电的金属箔片， 且该金属箔片的宽度 须至少能覆盖超过该排线组作为供电回路线的区域， 以将上、下双层排线有供电回路 线区域的磁场效应予以隔开化解；
以一具有高频遮蔽作用的导电胶布， 至少将整个双层排线组设有该金属箔片的 区域予以包覆， 而使高频信号的损失减到最少。
2、 根据权利要求 1所述的高频信号双层排线转接卡， 其特征在于， 所述金属箔 片为铜箔。
3、 根据权利要求 2所述的高频信号双层排线转接卡， 其特征在于， 所述排线组 设有四条排线， 其于该第一排线及第二排在线、下双层排线的侧边并排设有一上层的 第三排线及一下层的第四排线， 以形成四条排线两两重叠并排的高频信号转接装置。
4、 根据权利要求 3所述的高频信号双层排线转接卡， 其特征在于， 更于所述第 三及第四排线双层排线之间设有一金属箔片， 该金属箔片由铜箔所构成。
5、 根据权利要求 4所述的高频信号双层排线转接卡， 其特征在于， 所述金属箔 片其中一表面设有黏胶。
6、根据权利要求 1至 5中任一项所述的高频信号双层排线转接卡，其特征在于， 所述导电胶布的内缘面相对于该接线脚位的位置， 分别设有绝缘层。
7、 根据权利要求 6所述的高频信号双层排线转接卡， 其特征在于， 所述绝缘层 由-一绝缘胶带所构成。
PCT/CN2013/000341 2012-07-23 2013-03-25 高频信号双层排线转接卡 WO2014015644A1 (zh)

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