WO2014012329A1 - 印制电路板的保护盖 - Google Patents

印制电路板的保护盖 Download PDF

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Publication number
WO2014012329A1
WO2014012329A1 PCT/CN2012/086383 CN2012086383W WO2014012329A1 WO 2014012329 A1 WO2014012329 A1 WO 2014012329A1 CN 2012086383 W CN2012086383 W CN 2012086383W WO 2014012329 A1 WO2014012329 A1 WO 2014012329A1
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WO
WIPO (PCT)
Prior art keywords
protective cover
printed circuit
circuit board
material layer
electromagnetic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2012/086383
Other languages
English (en)
French (fr)
Inventor
邢红燕
吴昊
崔子巍
赵秀强
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing BOE Optoelectronics Technology Co Ltd
Original Assignee
Beijing BOE Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beijing BOE Optoelectronics Technology Co Ltd filed Critical Beijing BOE Optoelectronics Technology Co Ltd
Publication of WO2014012329A1 publication Critical patent/WO2014012329A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0029—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields made from non-conductive materials intermixed with electro-conductive particles

Definitions

  • Embodiments of the invention relate to a protective cover for a printed circuit board. Background technique
  • the Printed Circuit Board is made by electronic printing.
  • the insulating board is used as a substrate and cut into a certain size.
  • At least one conductive pattern is attached to it and holes are provided (such as component holes and fastening holes). , metallized holes, etc., used to replace the chassis in which electronic components were previously installed, to achieve interconnection between electronic components.
  • electromagnetic shielding is often required in the circuit design process of the printed circuit board to avoid electromagnetic interference of the electronic components.
  • the electromagnetic shielding design in the prior art usually uses circuit design to avoid certain electromagnetic interference, or other ways to avoid electromagnetic interference, but usually makes the circuit design of the printed circuit board complicated or the housing structure of the printed circuit board is complicated. , making manufacturing costs increase. Summary of the invention
  • An object of the present invention is to provide a protective cover for a printed circuit board which can effectively shield electromagnetic interference of a printed circuit board while reducing the cost of the printed circuit board.
  • an embodiment of the present invention provides a protective cover for a printed circuit board, the protective cover includes a protective cover body, the protective cover body is fixed on the printed circuit board, and the protective cover body A layer of material that absorbs electromagnetic waves is provided.
  • the material layer provided on the protective cover body may have a thickness of 0.5 mm to 5 mm.
  • the density of the material layer can be determined according to the intensity of the electromagnetic wave radiation that needs to be shielded.
  • the thickness of the material layer can be determined according to the frequency of electromagnetic waves that need to be shielded.
  • the material layer may be any of the following materials: composite ferrite, silicon carbide, graphite, ferrite, hydroxy iron, metal fine powder.
  • the structure of the material layer may be a pointed microstructure.
  • FIG. 1 is a schematic structural view of a protective cover of a printed circuit board according to an embodiment of the present invention
  • FIG. 2 is a schematic structural view of a protective cover of a printed circuit board for protecting a driving circuit of a liquid crystal display panel.
  • the protective cover 10 of the printed circuit board provided by the embodiment of the present invention includes a protective cover body 11 and a material layer 12 for absorbing electromagnetic waves, and the material layer 12 is disposed on the protective cover body 11.
  • the protective cover 10 is fixed on the printed circuit board for protecting the printed circuit board on the one hand and absorbing electromagnetic components of the electronic components on the printed circuit board by the material layer 12 on the other hand. Radiation, the layer of material 12 dissipates the absorbed electromagnetic waves into thermal energy or other energy.
  • the protective cover 10 may be provided with a connecting member, and the connecting member may be used for fixing the protective cover 10 to the printed circuit board, and the connecting member is, for example, a screw hole or the like.
  • the protective cover 10 can also be fixed to the printed circuit board by means of glue.
  • the protective cover 10 is used to protect the printed circuit board such that the shape of the protective cover 10 can be determined according to the shape of the printed circuit board.
  • the material layer 12 has a thickness of 0.5 mm to 5 mm.
  • the density of the material layer 12 can be determined according to the intensity of the electromagnetic radiation that needs to be shielded.
  • FIG. 2 is a protective cover 20 for protecting a printed circuit board carrying a driving circuit of a liquid crystal display panel.
  • a driving circuit for driving a liquid crystal display panel electromagnetic interference of the electronic component A which is usually controlled by timing is the largest.
  • the density of the material layer 12 can be increased in the area of the electronic component A where the protective cover 20 corresponds to the timing control of the printed circuit board.
  • the density of the material layer 12 of the protective cover corresponding to the area of the electronic component A may be 2-10 times the density of the material layer 12 of the other area of the protective cover, so that the electromagnetic interference of the printed circuit board can be better shielded.
  • the thickness of the material layer 12 of the protective cover can be determined according to the frequency of the electromagnetic wave to be shielded. Assuming that the printed circuit board is used on a device having a network communication function, in order to prevent the influence of electromagnetic radiation on the network communication function, the thickness of the material layer 12 can be determined according to the operating frequency of the communication function.
  • the thickness of the material layer 12 may be The frequency of the electromagnetic wave is determined by 2.4 GHz.
  • the material layer 12 can be a composite ferrite that can be used to absorb electromagnetic waves.
  • the thickness T of the material layer 12 can be obtained by using the formula (1):
  • T c/f, where c is the speed of light and f is the frequency of the electromagnetic wave of electromagnetic radiation.
  • the composite ferrite has a thickness of 1.25 cm.
  • the material layer 12 may also be an absorbing material such as silicon carbide, graphite, ferrite, hydroxy iron or metal micropowder.
  • the material layer 12 may also be of a pointed microstructure.
  • the pointed-shaped microstructure can be generally divided into two parts, a tip and a base, and the pointed-shaped microstructure can achieve good impedance matching and can better absorb electromagnetic radiation.
  • the protective cover of the printed circuit board provided by the embodiment of the invention is fixed on the printed circuit board to protect the printed circuit board, and the protective cover body is provided with a material layer for absorbing electromagnetic waves, so that the printed circuit board can be effectively shielded.
  • the electromagnetic radiation of the electronic components can not shield the electromagnetic interference by using circuit design or the like, thereby effectively reducing the cost of the printed circuit board.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Description

印制电路板的保护盖 技术领域
本发明的实施例涉及一种印制电路板的保护盖。 背景技术
印制电路板（Printed Circuit Board )是釆用电子印刷术制作， 以绝缘 板为基材， 切成一定尺寸， 其上至少附有一个导电图形， 并布有孔（如元 件孔、 紧固孔、 金属化孔等） ， 用来代替以往安装电子元器件的底盘， 实 现电子元器件之间的相互连接。
由于印制电路板上布设有电子元器件， 这样在印制电路板的电路设计 过程中往往都需要进行电磁屏蔽的设计， 以此来规避电子元器件的电磁干 扰。 现有技术中的电磁屏蔽设计通常釆用电路设计来规避一定的电磁干 扰， 或其它方式来规避电磁干扰， 但是通常使得印制电路板的电路设计复 杂或承载印制电路板的壳体结构复杂 , 使得制造成本增加。 发明内容
本发明的目的是提供一种印制电路板的保护盖， 其能够有效屏蔽印制 电路板的电磁干扰， 同时可以降低印制电路板的成本。
为达到上述目的， 本发明的实施例提供了一种印制电路板的保护盖， 该保护盖包括保护盖本体， 所述保护盖本体固定在所述印制电路板上， 所 述保护盖本体上设有吸收电磁波的材料层。
例如， 所述保护盖本体上设有的所述材料层的厚度可以为 0.5mm-5mm。
例如， 所述材料层的密度可以根据需要屏蔽的电磁波辐射强度来确 定。
例如， 所述材料层的厚度可以根据需要屏蔽的电磁波的频率来确定。 例如， 所述材料层可以为以下材料中的任一种： 复合铁氧体、碳化硅、 石墨、 铁氧体、 羟基铁、 金属微粉。
例如， 所述材料层的结构可以是尖劈形微结构。 本发明实施例提供的印制电路板的保护盖， 由于所述保护盖本体固定 在所述印制电路板上保护印制电路板， 同时所述保护盖本体上设有吸收电 磁波的材料层， 这样可以有效屏蔽印制电路板上的电子元器件的电磁辐 射， 同时可以不需要釆用电路设计等方式来屏蔽电磁干扰， 进而有效降低 印制电路板的成本。 附图说明
为了更清楚地说明本发明实施例的技术方案， 下面将对实施例的附图 作简单地介绍， 显而易见地， 下面描述中的附图仅仅涉及本发明的一些实 施例， 而非对本发明的限制。
图 1为本发明实施例提供的一种印制电路板的保护盖的结构示意图； 图 2为保护承载液晶显示面板的驱动电路的印制电路板的保护盖的结 构示意图。 具体实施方式
为使本发明实施例的目的、 技术方案和优点更加清楚， 下面将结合本 发明实施例的附图， 对本发明实施例的技术方案进行清楚、 完整地描述。 显然， 所描述的实施例是本发明的一部分实施例， 而不是全部的实施例。 基于所描述的本发明的实施例， 本领域普通技术人员在无需创造性劳动的 前提下所获得的所有其他实施例， 都属于本发明保护的范围。
如图 1所示， 本发明实施例提供的印制电路板的保护盖 10包括保护 盖本体 11和吸收电磁波的材料层 12,所述材料层 12设在所述保护盖本体 11上。 所述保护盖 10固定在所述印制电路板上， 一方面用于保护所述印 制电路板， 另一方面通过所述材料层 12吸收所述印制电路板上的电子元 器件的电磁辐射， 所述材料层 12将吸收的电磁波转换成热能或其它能量 耗散掉。 其中， 所述保护盖 10上可以设有连接部件， 该连接部件可以用 于将所述保护盖 10 固定在所述印制电路板上， 连接部件例如为螺孔等。 当然， 也可以釆用胶类将所述保护盖 10固定在所述印制电路板上。
在该实施例中， 所述保护盖 10用于保护所述印制电路板， 这样所述 保护盖 10的形状可以根据所述印制电路板的形状来确定。
例如， 所述材料层 12的厚度为 0.5mm-5mm。 所述材料层 12的密度可以根据需要屏蔽的电磁辐射强度来确定。
例如， 参见图 2, 图 2为保护承载液晶显示面板的驱动电路的印制电 路板的保护盖 20,对于用于驱动液晶显示面板的驱动电路，通常时序控制 的电子元器件 A的电磁干扰最大， 这样可以在保护盖 20对应该印制电路 板的时序控制的电子元器件 A的区域增大材料层 12的密度。 例如， 保护 盖对应电子元器件 A的区域的材料层 12的密度可以是保护盖其它区域的 材料层 12的密度的 2-10倍，从而可以更好的屏蔽印制电路板的电磁干扰。
所述保护盖的材料层 12 的厚度可以根据需要屏蔽的电磁波频率来确 定。 假设印制电路板用于具有网络通讯功能的设备上， 为了防止电磁辐射 对网络通讯功能的影响， 可以根据该通讯功能的工作频率来确定所述材料 层 12的厚度。
例如， 对于具有 2.4GHZ 工作频段的 WiFi通讯功能的电子设备， 为 了屏蔽印制电路板上的电子元器件对 2.4GHZ 工作频段的 WiFi通讯功能 的电磁干扰，所述材料层 12的厚度可以根据该电磁波的频率 2.4GHZ来确 定。
例如， 所述材料层 12可以为复合铁氧体， 其可以用于吸收电磁波。 其中若所述材料层 12为复合铁氧体，则材料层 12的厚度 T可以釆用公式 ( 1 )来获得：
公式（1 ) ： T=c/f, 其中 c为光速， f为电磁辐射的电磁波频率。
举例来说， 为了屏蔽电磁波频率为 2.4GHZ电磁辐射， 所述复合铁氧体 的厚度为 1.25cm。
在一个替代实施例中， 所述材料层 12还可以是碳化硅、 石墨、 铁氧体、 羟基铁或金属微粉等吸波材料。
在另一个替代实施例种， 所述材料层 12的结构还可以是尖劈形微结构。 所述尖劈形微结构通常可分为尖部和基部两部分，釆用该尖劈形微结构可以 实现很好的阻抗匹配， 可以更好的吸收电磁辐射。
本发明实施例提供的印制电路板的保护盖固定在印制电路板上以保 护印制电路板， 同时所述保护盖本体上设有吸收电磁波的材料层， 这样可 以有效屏蔽印制电路板上的电子元器件的电磁辐射， 同时可以不需要釆用 电路设计等方式来屏蔽电磁干扰， 进而有效降低印制电路板的成本。
以上所述仅是本发明的示范性实施方式， 而非用于限制本发明的保护范 围， 本发明的保护范围由所附的权利要求确定 t

Claims

权利要求书
1、一种印制电路板的保护盖， 包括保护盖本体， 所述保护盖本体用于固 定在印制电路板上， 所述保护盖还包括用于吸收电磁波的材料层， 所述材料 层设在所述保护盖本体上。
2、 根据权利要求 1 所述的保护盖， 其中， 所述材料层的厚度为 0.5mm-5mm。
3、根据权利要求 1或 2所述的保护盖， 其中， 所述材料层的密度根据需 要屏蔽的电磁辐射强度来确定。
4、根据权利要求 1或 3所述的保护盖， 其中， 所述材料层的厚度根据需 要屏蔽的电磁波的频率来确定。
5、 根据权利要求 1-4中任一项所述的保护盖， 其中， 所述材料层为以下 材料中的任一种： 复合铁氧体、 碳化硅、 石墨、 铁氧体、 羟基铁、 金属微粉。
6、 根据权利要求 1-5任一项所述的保护盖， 其中， 所述材料层的结构是 尖劈形微结构。
PCT/CN2012/086383 2012-07-19 2012-12-11 印制电路板的保护盖 Ceased WO2014012329A1 (zh)

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CN201210250614.6 2012-07-19
CN201210250614.6A CN102833991B (zh) 2012-07-19 2012-07-19 一种印制电路板的保护盖

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WO2014012329A1 true WO2014012329A1 (zh) 2014-01-23

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Publication number Priority date Publication date Assignee Title
CN107300956B (zh) * 2017-07-03 2020-05-19 英业达科技有限公司 噪声抑制组件及具有此噪声抑制组件的主机板

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6309742B1 (en) * 2000-01-28 2001-10-30 Gore Enterprise Holdings, Inc. EMI/RFI shielding gasket
CN2737088Y (zh) * 2004-03-30 2005-10-26 杨国清 防辐射手机套
CN101005754A (zh) * 2006-01-17 2007-07-25 华为技术有限公司 一种屏蔽电磁波干扰的装置
CN101346059A (zh) * 2007-07-12 2009-01-14 阿尔卑斯电气株式会社 电磁波抑制薄板
CN201429632Y (zh) * 2009-07-06 2010-03-24 北京邮电大学 便携电磁屏蔽箱
CN201601710U (zh) * 2010-03-19 2010-10-06 程春雷 防辐射手机
CN102523731A (zh) * 2011-12-06 2012-06-27 惠州Tcl移动通信有限公司 一种移动终端

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6309742B1 (en) * 2000-01-28 2001-10-30 Gore Enterprise Holdings, Inc. EMI/RFI shielding gasket
CN2737088Y (zh) * 2004-03-30 2005-10-26 杨国清 防辐射手机套
CN101005754A (zh) * 2006-01-17 2007-07-25 华为技术有限公司 一种屏蔽电磁波干扰的装置
CN101346059A (zh) * 2007-07-12 2009-01-14 阿尔卑斯电气株式会社 电磁波抑制薄板
CN201429632Y (zh) * 2009-07-06 2010-03-24 北京邮电大学 便携电磁屏蔽箱
CN201601710U (zh) * 2010-03-19 2010-10-06 程春雷 防辐射手机
CN102523731A (zh) * 2011-12-06 2012-06-27 惠州Tcl移动通信有限公司 一种移动终端

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