WO2014010141A1 - Lampe en forme d'ampoule et dispositif d'éclairage - Google Patents

Lampe en forme d'ampoule et dispositif d'éclairage Download PDF

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Publication number
WO2014010141A1
WO2014010141A1 PCT/JP2013/001040 JP2013001040W WO2014010141A1 WO 2014010141 A1 WO2014010141 A1 WO 2014010141A1 JP 2013001040 W JP2013001040 W JP 2013001040W WO 2014010141 A1 WO2014010141 A1 WO 2014010141A1
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WO
WIPO (PCT)
Prior art keywords
housing
light bulb
shaped lamp
bulb shaped
present
Prior art date
Application number
PCT/JP2013/001040
Other languages
English (en)
Japanese (ja)
Inventor
洋介 藤巻
次弘 松田
康輔 菅原
Original Assignee
パナソニック株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パナソニック株式会社 filed Critical パナソニック株式会社
Priority to JP2013540166A priority Critical patent/JPWO2014010141A1/ja
Publication of WO2014010141A1 publication Critical patent/WO2014010141A1/fr

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/006—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Definitions

  • the present invention relates to a light bulb shaped lamp and a lighting device, and more particularly to a light bulb shaped lamp using a light emitting diode (LED: Light Emitting Diode) and a lighting device using the same.
  • LED Light Emitting Diode
  • LEDs Semiconductor light emitting devices such as LEDs are expected to be a new light source in various lamps such as fluorescent lamps and incandescent lamps, since they are small, highly efficient, and have a long lifetime. R & D is underway.
  • LED lamp replace it with a bulb-type fluorescent lamp with a light bulb in a glass bulb, a bulb-type LED lamp (bulb-shaped LED lamp) that replaces an incandescent bulb with a filament coil, or a straight-tube fluorescent lamp There is a straight tube type LED lamp (straight tube type LED lamp).
  • Patent Document 1 discloses a conventional bulb-type LED lamp.
  • Patent Document 2 discloses a conventional straight tube LED lamp.
  • FIG. 16 is a cross-sectional view of a conventional bulb-type LED lamp disclosed in Patent Document 1.
  • the conventional bulb-type LED lamp 100 includes a hemispherical globe 110, a base 180, and a metal outer member 160.
  • the outer member 160 includes a peripheral portion 161 exposed to the outside, a disk-shaped light source mounting portion 162 formed integrally with the peripheral portion 161, and a concave portion 163 formed inside the peripheral portion 161.
  • An LED module 120 having a plurality of LEDs is attached to the upper surface of the light source attachment portion 162.
  • a resin insulating member (circuit case) 150 formed along the shape of the inner surface is provided on the inner surface of the recess 163 of the outer member 160. Inside the insulating member 150 is housed a drive circuit 170 for lighting the LED.
  • the thermal expansion coefficient (linear expansion coefficient) between the metallic outer member 160 and the resin insulating member 150 is several times different. For this reason, when the outer member 160 and the insulating member 150 are thermally expanded due to the heat generated in the drive circuit 170 and the LED module 120 when the lamp is lit, a stress strain is applied to the resin insulating member 150 due to the difference in thermal expansion coefficient between them. In addition, cracks may occur. When a crack occurs in the insulating member 150, there is a problem that the insulating property is lowered.
  • the present invention has been made to solve such problems, and an object of the present invention is to provide a light bulb shaped lamp and an illuminating device having excellent heat dissipation without deteriorating insulation.
  • a light bulb shaped lamp surrounds a light emitting module, a globe covering the light emitting module, a driving circuit for causing the light emitting module to emit light, and the driving circuit.
  • a surrounding member disposed on the housing, and a housing which is disposed so as to surround the surrounding member and which is at least a part of the envelope; a surface of the surrounding member on the housing side; and the surrounding member side of the housing
  • a coating film formed on any one of the surfaces of the enclosure member, and the enclosure member and the housing have different coefficients of thermal expansion, and the coating film has at least a distal end portion on the enclosure side of the enclosure member at the time of lighting.
  • a plurality of flexible protrusions that come into contact with the other of the surface of the casing and the surface of the casing on the side of the surrounding member.
  • the plurality of protrusions may be formed in a raised shape.
  • the coating film may be formed by powder coating.
  • the light bulb shaped lamp according to the present invention further comprising a circuit case disposed inside the surrounding member, and housing the drive circuit, the housing and the circuit case are made of resin,
  • the surrounding member may be made of metal.
  • the light bulb shaped lamp according to the present invention further comprising a support member made of a metal provided so as to extend inward of the globe and supporting the light emitting module, It may be in contact with the support member.
  • an aspect of the lighting device according to the present invention includes any one of the above light bulb shaped lamps.
  • the present invention it is possible to realize a light bulb shaped lamp and an illuminating device having excellent heat dissipation without deteriorating insulation.
  • FIG. 1 is an external perspective view of a light bulb shaped lamp according to Embodiment 1 of the present invention.
  • FIG. 2 is an exploded perspective view of the light bulb shaped lamp according to Embodiment 1 of the present invention.
  • FIG. 3 is a diagram showing one cross section of the configuration of the light bulb shaped lamp according to Embodiment 1 of the present invention.
  • FIG. 4 is a diagram showing another cross section of the configuration of the light bulb shaped lamp according to the first embodiment of the present invention.
  • FIG. 5 (a) is a plan view of the LED module in the light bulb shaped lamp according to Embodiment 1 of the present invention, and FIG. 5 (b) is cut along the line XX ′ in FIG. 5 (a). It is sectional drawing of the same LED module.
  • FIG. 5 (a) is a plan view of the LED module in the light bulb shaped lamp according to Embodiment 1 of the present invention, and FIG. 5 (b) is cut along the line XX ′ in FIG. 5
  • FIG. 6 is an enlarged cross-sectional view around the LED (LED chip) in the LED module of the light bulb shaped lamp according to Embodiment 1 of the present invention.
  • FIG. 7 is an external perspective view of a support member in the light bulb shaped lamp according to Embodiment 1 of the present invention.
  • (A) of FIG. 8 is an external perspective view of a housing (cap portion of the inner housing portion) in the light bulb shaped lamp according to Embodiment 1 of the present invention, and (b) of FIG. It is an external appearance perspective view of the housing
  • FIG. 9 is an external perspective view of a metal member in the light bulb shaped lamp according to Embodiment 1 of the present invention.
  • FIG. 10 is an enlarged view of a main part of the light bulb shaped lamp according to the first embodiment of the present invention (enlarged view of a region surrounded by a broken line A in FIG. 4).
  • FIG. 11 is a diagram for explaining a method of forming a coating film in the light bulb shaped lamp according to the first embodiment of the present invention.
  • 12 is an enlarged view of a region surrounded by a broken line A in FIG. 4 in the light bulb shaped lamp according to the first embodiment of the present invention, (a) is an enlarged view when the lamp is turned off, and (b) is a lamp. It is an enlarged view at the time of lighting.
  • FIG. 10 is an enlarged view of a main part of the light bulb shaped lamp according to the first embodiment of the present invention (enlarged view of a region surrounded by a broken line A in FIG. 4).
  • FIG. 11
  • FIG. 13 is a diagram for explaining a method of assembling the light bulb shaped lamp according to Embodiment 1 of the present invention.
  • FIG. 14 is a cross-sectional view showing a configuration of a light bulb shaped lamp according to Embodiment 2 of the present invention.
  • FIG. 15 is a schematic cross-sectional view of a lighting apparatus according to Embodiment 3 of the present invention.
  • FIG. 16 is a cross-sectional view of a conventional bulb-type LED lamp disclosed in Patent Document 1.
  • FIG. 1 is an external perspective view of a light bulb shaped lamp according to Embodiment 1 of the present invention.
  • FIG. 2 is an exploded perspective view of the light bulb shaped lamp according to Embodiment 1 of the present invention.
  • a light bulb shaped lamp 1 is a light bulb shaped LED lamp that is a substitute for a light bulb shaped fluorescent light or an incandescent light bulb, and includes a globe 10 and an LED that is a light source.
  • the module 20, the support member 40 that supports the LED module 20, the housing 50 in which the drive circuit 70 is disposed inward, the metal member 60 disposed in the housing 50, and the metal member 60 are formed.
  • die 80 which receives electric power from the outside are provided.
  • the bulb-type lamp 1 further includes lead wires 70a to 70d, a ring-shaped coupling member 30, and a screw 90.
  • an envelope is constituted by the globe 10, the housing 50 (outer housing portion 52), and the base 80. That is, the globe 10, the housing 50 (outer housing portion 52), and the base 80 are exposed to the outside, and each outer surface is exposed to the outside air. Moreover, the light bulb shaped lamp 1 in the present embodiment is configured to have a brightness equivalent to the 40W type.
  • FIG. 3 is a view showing one section of the light bulb shaped lamp according to the first embodiment of the present invention.
  • FIG. 4 is a diagram showing another cross section of the configuration of the light bulb shaped lamp according to the first embodiment of the present invention, and shows a cross sectional view when rotated about 45 ° around the lamp axis from the state of FIG. ing.
  • the lamp axis is an axis that becomes a rotation center when the bulb lamp 1 is attached to the socket of the lighting device, and coincides with the rotation axis of the base 80.
  • circuit elements are omitted.
  • the globe 10 is a translucent cover that houses the LED module 20 and transmits light from the LED module 20 to the outside of the lamp.
  • the light of the LED module 20 that has entered the inner surface of the globe 10 passes through the globe 10 and is extracted to the outside of the globe 10.
  • the globe 10 in the present embodiment is a glass bulb (clear bulb) made of silica glass that is transparent to visible light. Therefore, the LED module 20 housed in the globe 10 can be viewed from the outside of the globe 10.
  • the shape of the globe 10 is a shape in which one end is closed in a spherical shape and an opening 11 is provided at the other end.
  • the shape of the globe 10 is such that a part of a hollow sphere narrows while extending away from the center of the sphere, and the opening 11 is located away from the center of the sphere. Is formed.
  • a glass bulb having the same shape as a general incandescent bulb can be used.
  • a glass bulb such as an A shape, a G shape, or an E shape can be used as the globe 10.
  • the opening 11 of the globe 10 is located between the support member 40 and the housing 50. More specifically, the opening 11 of the globe 10 is press-fitted into the groove of the coupling member 30 disposed between the support member 40 and the housing 50. Thereby, the globe 10 is fixed. Further, a silicone resin is applied between the opening 11 of the globe 10 and the end of the housing 50 on the globe side, but this silicone resin is not always necessary.
  • the globe 10 is not necessarily transparent to visible light, and the globe 10 may have a light diffusion function.
  • a milky white light diffusing film may be formed by applying a resin containing a light diffusing material such as silica or calcium carbonate, a white pigment, or the like to the entire inner surface or outer surface of the globe 10.
  • the shape of the globe 10 is not limited to the A shape, and may be a spheroid or an oblate sphere.
  • the material of the globe 10 is not limited to a glass material, and a resin material such as a synthetic resin such as acrylic (PMMA) or polycarbonate (PC) may be used.
  • the LED module 20 is a light emitting module having a light emitting element, and emits predetermined light. As shown in FIGS. 3 and 4, the LED module 20 is disposed inward of the globe 10, and has a spherical central position formed by the globe 10 (for example, a large diameter portion where the inner diameter of the globe 10 is large). (Inside) is preferably arranged. Thus, by arranging the LED module 20 at the center position of the globe 10, the light distribution characteristic of the light bulb shaped lamp 1 becomes a light distribution characteristic similar to an incandescent light bulb using a conventional filament coil.
  • the LED module 20 is held in the hollow in the globe 10 by the support member 40, and emits light by the electric power supplied via the lead wires 70a and 70b.
  • FIG. 5 (a) is a plan view of the LED module in the light bulb shaped lamp according to Embodiment 1 of the present invention, and FIG. 5 (b) is cut along the line XX ′ in FIG. 5 (a). It is sectional drawing of the same LED module.
  • the LED module 20 includes a base 21, an LED 22, a sealing member 23, and a metal wiring 24.
  • the LED module 20 in the present embodiment has a COB (Chip On Board) structure in which a bare chip is directly mounted on the base 21.
  • COB Chip On Board
  • the base 21 is an LED mounting board for mounting the LEDs 22.
  • the base 21 in the present embodiment is composed of a member that has a property of transmitting visible light.
  • the base 21 having translucency the light of the LED 22 is transmitted through the inside of the base 21 and is emitted from the surface (back surface) on which the LED 22 is not mounted. Therefore, even when the LED 22 is mounted only on one surface (front surface) of the base 21, light is emitted from the other surface (back surface), and light distribution characteristics similar to an incandescent bulb can be obtained. It becomes possible.
  • the base 21 is preferably made of a member having a high total transmittance.
  • a ceramic substrate made of sintered alumina (Al 2 O 3 ) having a total transmittance of 90% or more for visible light is used as the base 21.
  • a ceramic substrate made of AlN or MgO can be used as the base 21 as the base 21 as the base 21.
  • the shape of the base 21 in the present embodiment a rectangular substrate having a long shape in plan view (when viewed from the top of the globe 10) is used. Thereby, the shape of the planar view of the LED module 20 is also long.
  • the base 21 is provided with through holes 21a and 21b.
  • the through hole 21 a is provided to fit the base 21 and the support column 41 of the support member 40.
  • the through-hole 21 a is formed in a rectangular shape in plan view at a position shifted in the longitudinal direction from the center of the base 21.
  • two through holes 21b are provided for electrical connection with the two lead wires 70a and 70b.
  • the through holes 21b are provided at both ends in the longitudinal direction of the base 21. Yes.
  • the LED 22 is an example of a light emitting element, and is a bare chip that emits monochromatic visible light. In this embodiment, a blue LED chip that emits blue light when energized is used. Further, the LEDs 22 are mounted only on one surface (front surface) of the base 21, and four element rows each having a plurality of (for example, twelve) LEDs 22 as one row are arranged in a straight line.
  • a plurality of LEDs 22 are mounted.
  • the number of LEDs 22 may be appropriately changed according to the use of the light bulb shaped lamp.
  • the number of LEDs 22 may be one.
  • the number of LEDs 22 in one row may be 12 or more.
  • the plurality of LEDs 22 are mounted in four rows on the base 21, but may be one row or may be a plurality of rows other than the four rows.
  • the light bulb shaped lamp 1 according to the present embodiment is suitable for a high-output type LED lamp having a large number of LEDs 22 because both insulation and high heat dissipation can be achieved.
  • FIG. 6 is an enlarged cross-sectional view around the LED (LED chip) in the LED module of the light bulb shaped lamp according to Embodiment 1 of the present invention.
  • the LED 22 includes a sapphire substrate 22a and a plurality of nitride semiconductor layers 22b having different compositions stacked on the sapphire substrate 22a.
  • a cathode electrode 22c and an anode electrode 22d are provided at the end of the upper surface of the nitride semiconductor layer 22b. Further, wire bond portions 22e and 22f are provided on the cathode electrode 22c and the anode electrode 22d, respectively.
  • the cathode electrode 22c of one LED 22 and the anode electrode 22d of the other LED 22 are electrically connected in series by a gold wire 25 through wire bond portions 22e and 22f.
  • Each LED 22 is mounted on the base 21 with a translucent chip bonding material 26 so that the surface on the sapphire substrate 22 a side faces the mounting surface of the base 21.
  • a silicone resin containing a filler made of metal oxide can be used for the chip bonding material 26.
  • the sealing member 23 is linearly formed so as to collectively seal one row of the plurality of LEDs 22.
  • the sealing member 23 includes a phosphor that is a light wavelength conversion material, and also functions as a wavelength conversion layer that converts the wavelength of light from the LED 22.
  • a phosphor-containing resin in which predetermined phosphor particles (not shown) and a light diffusing material (not shown) are dispersed in a silicone resin can be used.
  • the phosphor particles when the LED 22 is a blue LED that emits blue light, for example, YAG-based yellow phosphor particles can be used to obtain white light. Thereby, a part of the blue light emitted from the LED 22 is converted into yellow light by the yellow phosphor particles contained in the sealing member 23. Then, the blue light that has not been absorbed by the yellow phosphor particles and the yellow light that has been wavelength-converted by the yellow phosphor particles are diffused and mixed in the sealing member 23, so that white light is emitted from the sealing member 23. And emitted.
  • particles such as silica are used as the light diffusing material.
  • the sealing member 23 configured in this way can be formed, for example, by applying and curing an uncured paste-like sealing member 23 containing a wavelength conversion material with a dispenser.
  • the sealing member 23 is not necessarily formed of a silicone resin, and may be formed of an inorganic material such as a low-melting glass or a sol-gel glass in addition to an organic material such as a fluorine-based resin.
  • phosphor particles as a second wavelength conversion material between the LED 22 and the base 21 (that is, directly below the LED 22) or on the back surface of the base 21.
  • a sintered body film (phosphor film) made of an inorganic binder (binder) such as glass may be further formed. In this way, white light can be emitted from both surfaces of the base 21 by further forming the phosphor film (second wavelength conversion material).
  • the metal wiring 24 is a wiring made of a metal such as Ag patterned on the LED mounting surface (front surface), and supplies power supplied to the LED module 20 from the lead wires 70 a and 70 b to each LED 22.
  • Each LED 22 is electrically connected to the metal wiring 24 via a gold wire 25.
  • the metal wiring 24 formed around the through hole 21b serves as a power feeding portion.
  • the leading ends of the two lead wires 70a and 70b are inserted into the through hole 21b as shown in FIG. 3, and are electrically and physically connected to the metal wiring 24 by solder.
  • the coupling member 30 is a member that couples the globe 10, the support member 40, and the metal member 60. As shown in FIGS. 2 to 4, the coupling member 30 is configured in a ring shape so as to surround the periphery of the pedestal 42 (small diameter portion 42a) of the support member 40.
  • the coupling member 30 may be formed of an insulating resin. Can do.
  • the coupling member 30 includes a longitudinal groove portion 30 a formed in an annular shape so that the opening portion 11 of the globe 10 is inserted, and a lateral groove portion provided on the base 42 of the support member 40.
  • the outer surface of the coupling member 30 is in contact with the inner surface of the outer housing portion 52 of the housing 50.
  • the support member 40 is a member that supports the LED module 20 and is made of metal.
  • the configuration of the support member 40 will be described in detail with reference to FIGS. 3 and 4 and FIG.
  • FIG. 7 is an external perspective view of a support member in the light bulb shaped lamp according to Embodiment 1 of the present invention.
  • the support member 40 includes a support column 41 that is mainly located inside the globe 10 and a pedestal 42 that is mainly surrounded by the housing 50 (outer housing portion 52).
  • the support column 41 and the pedestal 42 are integrally formed of the same material.
  • the support column 41 is a metal stem provided so as to extend from the vicinity of the opening 11 of the globe 10 toward the inside of the globe 10.
  • the support column 41 functions as a holding member that holds the LED module 20.
  • One end of the support column 41 is connected to the LED module 20, and the other end of the support column 41 is connected to the pedestal 42.
  • pillar 41 since the support
  • the strut 41 in the present embodiment is a metal strut made of an aluminum alloy.
  • the support column 41 includes a main shaft portion 41a and a fixed portion 41b.
  • the main shaft portion 41a is formed of a cylindrical body having a constant cross-sectional area, one end portion of the main shaft portion 41a is connected to the fixed portion 41b, and the other end portion of the main shaft portion 41a is connected to the pedestal 42.
  • fixed part 41b has a fixing surface (upper surface) fixed with the base 21 of the LED module 20.
  • FIG. The said fixed surface turns into a contact surface of the fixing
  • the LED module 20 is mounted on the fixed surface of the fixing portion 41b and is adhered to the fixed surface with an adhesive or the like.
  • the fixing portion 41b is provided with a protruding portion 41b1 protruding from the fixing surface.
  • the protrusion 41b1 is configured to be fitted into a through hole 21a provided in the base 21 of the LED module 20.
  • the protrusion 41b1 functions as a position restricting portion that restricts the position of the LED module 20, and is configured such that the planar view shape is long.
  • the pedestal 42 is a support base that supports the support column 41, and is configured to close the opening 11 of the globe 10 as shown in FIGS. 3 and 4.
  • the pedestal 42 is a metal support made of a metal material.
  • the pedestal 42 is made of an aluminum alloy like the support column 41. Thereby, the heat
  • a lateral groove portion is formed along the circumferential direction of the small diameter portion 42a.
  • the coupling member 30 is disposed on the step portion of the pedestal 42 (above the large diameter portion 42b), and the flange 30b of the coupling member 30 and the lateral groove portion of the pedestal 42 are fitted, whereby the coupling member 30 is pedestal. 42 is fixed.
  • the small diameter portion 42 a is a disk-shaped member configured to support the support column 41 and close the opening 11 of the globe 10.
  • the support column 41 is formed at the center of the small diameter portion 42a.
  • the outer peripheral surface of the small diameter portion 42a and the inner peripheral surface of the coupling member 30 are in surface contact.
  • the small diameter portion 42a is provided with two through holes 42a1 through which the lead wires 70a and 70b are inserted.
  • the large diameter portion 42 b is configured in a substantially cylindrical shape, and the outer peripheral surface is in surface contact with the inner peripheral surface of the metal member 60. Thereby, the heat of the support member 40 (base 42) can be efficiently conducted to the metal member 60.
  • the large-diameter portion 42b is formed with four concave portions 42b1. By fitting the convex portion 30c of the coupling member 30 into the concave portion 42b1, the support member 40 and the coupling member 30 are aligned.
  • the support member 40 may be configured using a resin material having a high thermal conductivity instead of a metal material.
  • the housing 50 is an insulating case having an insulating property in which the drive circuit 70 is disposed on the inner side, and includes an inner housing portion (first housing portion) 51 and an outer housing portion (second housing portion) 52. It is constituted by.
  • the housing 50 can be made of an insulating resin material, and can be resin-molded with, for example, polybutylene terephthalate (PBT).
  • PBT polybutylene terephthalate
  • FIG. 8 is an external perspective view of a housing (circuit cap portion of the inner housing portion) in the light bulb shaped lamp according to Embodiment 1 of the present invention, and (b) of FIG. It is an external appearance perspective view of the housing
  • the inner housing 51 is an internal member (circuit case) that is disposed so as to surround the drive circuit 70 and is not visible from the outside of the lamp.
  • the inner housing portion 51 includes a circuit cap portion 51 a disposed so as to cover the drive circuit 70 and a circuit holder portion 51 b disposed so as to cover the periphery of the drive circuit 70.
  • the circuit cap part 51a and the circuit holder part 51b are separated, and the circuit cap part 51a and the circuit holder part 51b are arranged in a non-contact state.
  • the circuit cap portion 51a is a substantially bottomed cylindrical member configured in a cap shape as shown in FIG.
  • the circuit cap portion 51a is provided on the entire circumference of the opening end portion of the circuit cap portion 51a, and extends from the flange portion 51a1 projecting outward (outside housing portion side) and the opening end portion of the circuit cap portion 51a. It has four convex portions 51a2 projecting downward (on the base side), and a concave portion 51a3 provided on the inner surface of the open end of the circuit cap portion 51a.
  • the upper surface shape of the circuit cap portion 51 a is configured to follow the inner surface shape of the base 42 of the support member 40. As a result, the circuit cap portion 51 a is fitted into the base 42 of the support member 40 and is fastened and fixed to the support member 40 by the screw 90.
  • the flange part 51a1 is sandwiched between a first projecting part 52a1 and a second projecting part 52a2 provided in the outer casing part 52 (outer part 52a).
  • the circuit cap 51a By pushing the flange 51a1 between the first protrusion 52a1 and the second protrusion 52a2, the circuit cap 51a together with the globe 10, the coupling member 30, the support member 40, and the metal member 60 is placed in the outer casing. It can attach to the part 52 (outer part 52a).
  • the four convex portions 51 a 2 of the circuit cap portion 51 a are in contact with the upper surface of the circuit board 71 of the drive circuit 70. Thereby, when the circuit cap part 51a is attached to the outer side housing part 52, the circuit board 71 is pressed from above by the circuit cap part 51a (the convex part 51a2).
  • the concave portion 51a3 of the circuit cap portion 51a is fitted with a convex portion 52b1 (see FIG. 8 described later) provided in the outer casing portion 52. Thereby, alignment with the circuit cap part 51a and the outer side housing
  • the circuit holder 51b is formed in a cylindrical shape.
  • the base side end of the circuit holder 51b is connected to the outer casing 52, and in this embodiment, the circuit holder 51b and the outer casing 52 are integrally formed.
  • a substrate mounting portion 51b1 for mounting the circuit substrate 71 of the drive circuit 70 is formed at the globe side end of the circuit holder portion 51b.
  • the substrate platform 51b1 is configured as a stepped portion.
  • the outer casing 52 is disposed so as to surround at least the metal member 60.
  • the outer casing 52 is an external member that is at least a part of the lamp envelope and is arranged so as to be visible from the outside of the lamp. A region other than the portion covered with the base 80 on the outer peripheral surface of the outer casing 52 is exposed to the outside of the lamp.
  • the outer housing part 52 has an outer part 52a exposed to the outside of the lamp and a screwing part 52b screwed into the base 80.
  • the outer portion 52a is configured by a substantially cylindrical member having a diameter larger than that of the screwing portion 52b.
  • the outer portion 52a is configured such that the diameter gradually decreases toward the base 80 side. That is, the inner peripheral surface and the outer peripheral surface of the outer portion 52a are inclined with respect to the lamp axis. Since the outer surface of the outer portion 52a is exposed to the atmosphere, the heat conducted to the housing 50 is radiated mainly from the outer surface of the outer portion 52a.
  • a first protrusion 52a1 and a second protrusion 52a2 that protrude inward from the inner surface are formed on the inner surface of the outer portion 52a. ing.
  • the four first protrusions 52a1 are formed at equal intervals in the circumferential direction of the inner surface of the outer shell 52a.
  • the second protrusion 52a2 is formed below the two first protrusions 52a1 facing each other out of the first protrusions 52a1.
  • the flange 51a1 of the circuit cap 51a is sandwiched between the first protrusion 52a1 and the second protrusion 52a2, so that the circuit cap 51a is attached and fixed to the outer casing 52.
  • the screwing portion 52b is configured by a substantially cylindrical member having a smaller diameter than the outer portion 52a.
  • a base 80 is screwed into the screwing portion 52b. That is, the outer peripheral surface of the screwing portion 52 b is configured to contact the inner peripheral surface of the base 80.
  • the outer casing 52 is provided with a convex portion 52b1 for alignment with the circuit cap portion 51a.
  • the convex portion 52b1 is configured to be fitted to the concave portion 51a3 of the circuit cap portion 51a.
  • the outer casing 52 (outer section 52 a) configured in this way surrounds the inner casing 51, the metal member 60, the base 42 of the support member 40, and the coupling member 30. It is configured as follows. In addition, a predetermined gap is provided between the inner surface of the outer casing 52 (outer part 52a) and the outer surface of the inner casing 51 (circuit cap part 51a and circuit holder part 51b). Furthermore, in the present embodiment, the outer casing 52 (outer section 52a) and the metal member 60 are not in contact with each other, and as shown in FIG. 4, the inner surface of the outer casing 52 (outer section 52a) A predetermined interval is provided between the outer surface of the metal member 60.
  • the circuit holder portion 51b and the outer housing portion 52 (the outer shell portion 52a and the screwing portion 52b) of the housing 50 are integrally formed. Yes.
  • the metal member 60 is an enclosing member arranged so as to surround the drive circuit 70.
  • the metal member 60 in the present embodiment is configured in a skirt shape so as to surround the inner casing 51 in the casing 50, and is disposed between the inner casing 51 and the outer casing 52. Thereby, the metal member 60 can be in a non-contact state with the drive circuit 70, and the insulation of the drive circuit 70 can be ensured.
  • the metal member 60 is made of a metal material and functions as a heat sink. Thereby, the heat generated from the LED module 20 and the drive circuit 70 can be efficiently radiated using the metal member 60. Specifically, the heat of the LED module 20 and the drive circuit 70 is propagated to the outer casing 52 through the inner casing 51 and the metal member 60, and is radiated from the outer casing 52 to the outside of the lamp. Can do.
  • the metal material of the metal member 60 for example, Al, Ag, Au, Ni, Rh, Pd, an alloy composed of two or more of these, or an alloy of Cu and Ag can be considered. Since such a metal material has good thermal conductivity, the heat propagated to the metal member 60 can be efficiently propagated.
  • the metal member 60 is in contact with the support member 40.
  • the inner peripheral surface of the metal member 60 and the outer peripheral surface of the base 42 (large diameter portion 42b) of the support member 40 are in surface contact. Since both the metal member 60 and the support member 40 are made of metal, the heat of the LED module 20 that has been conducted to the support member 40 is efficiently conducted to the metal member 60.
  • the metal member 60 is not in contact with the outer casing 52.
  • the metal member 60 and the outer casing 52 are spaced from each other between the outer peripheral surface of the metal member 60 and the inner peripheral surface of the outer portion 52a of the outer casing 52. Opposed.
  • the outer casing portion 52 of the outer casing portion 52 due to the difference in thermal expansion coefficient between the metal member 60 and the outer casing portion 52 is described later. Crack generation can be suppressed. Thereby, it can suppress that insulating property falls.
  • the metal member 60 is not in contact with the inner housing portion 51, and the metal member 60 and the inner housing portion 51 are configured such that the inner peripheral surface of the metal member 60 and the inner housing portion 51 (the circuit cap portion 51a, the circuit).
  • the holder portion 51b) is opposed to the outer peripheral surface so as to leave a certain gap (air layer).
  • a coating film 61 is formed between the metal member 60 and the outer casing 52.
  • the coating film 61 is formed on the outer surface of the metal member 60 (the surface on the outer casing 52 side).
  • FIG. 9 is an external perspective view of a metal member and a coating film in the light bulb shaped lamp according to Embodiment 1 of the present invention.
  • FIG. 10 is an enlarged view of a main part of the light bulb shaped lamp (when not lit) according to Embodiment 1 of the present invention (an enlarged view of a region surrounded by a broken line A in FIG. 4).
  • the metal member 60 is a thin, substantially cylindrical member, and in this embodiment, the metal member 60 is configured such that the diameter gradually decreases toward the base 80 side. Therefore, the metal member 60 and the support member 40 can be easily fixed by bringing the metal member 60 and the pedestal 42 (large diameter portion 42b) of the support member 40 into surface contact and fitting the metal member 60 into the pedestal 42. Can do.
  • the metal member 60 has a cutout portion 60a formed so as to cut out a part of the metal member 60 from the base side end toward the globe side.
  • the number of cutouts 60a is the same as the number of first protrusions 52a1 provided on the inner surface of the outer casing 52, and four cutouts 60a are formed in the present embodiment.
  • the notch 60a is formed at a position corresponding to the first protrusion 52a1 and the second protrusion 52a2, as shown in FIG.
  • the metal member 60 it is possible to avoid collision (contact) between the metal member 60 and the first and second protrusions 52a1 and 52a2.
  • FIG.3 and FIG.4 it becomes possible to extend the metal member 60 below the position in which the 1st protrusion part 52a1 and the 2nd protrusion part 52a2 were provided.
  • the metal member 60 is extended to a position facing the circuit holder portion 51b.
  • the surface area of the metal member 60 can be increased. Specifically, the surface area is increased until the outer peripheral surface of the metal member 60 is substantially equal to the entire exposed surface (total outer peripheral surface) of the outer shell 52a.
  • a coating film 61 is formed on the entire outer surface of the metal member 60.
  • the coating film 61 has a plurality of protrusions 61 a that protrude toward the outer housing portion 52. That is, the coating film 61 is a concavo-convex film having innumerable protrusions 61a formed on the surface.
  • the protrusions 61 a have flexibility and are formed innumerably in a fibrous form from the surface of the coating film 61.
  • the protrusion 61a is formed in a raised shape and is configured like a fibrous soft hair. That is, the coating film 61 is formed in a fluffy state as a whole.
  • the base layer part of the coating film 61 also has flexibility.
  • the plurality of protrusions 61a are formed so that the front end portion contacts the surface of the outer casing 52 at least when the lamp is lit (when the LED module 20 emits light). That is, when the lamp is not lit, the coating film 61 (the tip portion of the protrusion 61a) may not be in contact with the outer casing 52. In the present embodiment, as shown in FIG. 10, the coating film 61 (the tip portion of the protrusion 61 a) is in contact with the surface of the outer housing portion 52 even when the lamp is not lit.
  • the protrusion 61 a is finely formed in a fibrous shape, so that an infinite number of gaps are formed between the coating film 61 and the outer casing 52. (Air layer) exists. Note that all the protrusions 61 a may not be in contact with the outer housing portion 52.
  • the coating film (coating film) 61 is formed by powder coating.
  • a powder coating material in a powder state of 100% solids is used as a raw material, and the powder coating material in a powder state is applied to the surface of the metal member 60 by, for example, a fluidized dipping method.
  • a perforated plate is placed at the bottom of the paint container, and the powder paint is flowed by sending compressed air from the perforated plate, and the preheated coating is applied to the flowing powder paint. This is a method of immersing an object.
  • the coating film 61 can be formed by heating (baking) and cooling.
  • a plurality of fibrous protrusions 61a are formed during heating. That is, by heating, the protrusion 61a is formed so that the entire powder-coated film is raised.
  • a raw material (powder coating material) for powder coating for example, fine particles made of polyethylene resin or nylon resin can be used.
  • the coating film 61 may also be formed by spray coating (electrostatic powder coating method) as shown in FIG. 11 or liquid coating using an organic solvent containing a raw material resin or the like. Can do.
  • assembling property can be improved by forming the coating film 61 by powder coating as in the present embodiment, rather than by forming the coating film 61 by liquid coating. That is, in liquid coating, there is a problem that a bathtub or the like is required and workability is deteriorated, or that the solvent is dropped from the object to be coated (metal member) during the coating and the work table is soiled.
  • powder coating since dry powder is a raw material, problems such as contamination of the work table do not occur, and the lamp can be easily assembled only by the assembly process.
  • powder coating since no organic solvent is used, there is no air pollution and it is environmentally friendly. In addition, the powder coating can be recovered and reused, thereby reducing the cost. Furthermore, the coating film 61 having a uniform film thickness can be easily formed by powder coating.
  • the drive circuit (circuit unit) 70 is a lighting circuit (power supply circuit) for lighting (emitting) the LEDs 22 of the LED module 20, and supplies predetermined power to the LED module 20.
  • the drive circuit 70 converts AC power supplied from the base 80 via the pair of lead wires 70c and 70d into DC power, and the DC power is supplied to the LED module 20 via the pair of lead wires 70a and 70b. Supply.
  • the drive circuit 70 includes a circuit board 71 and a plurality of circuit elements (electronic components) 72 mounted on the circuit board 71.
  • the circuit board 71 is a printed board on which metal wiring is patterned, and electrically connects a plurality of circuit elements 72 mounted on the circuit board 71.
  • the circuit board 71 is arranged in a posture in which the main surface is orthogonal to the lamp axis.
  • the circuit board 71 is placed on a board placement part 51 b 1 provided in the circuit holder part 51 b of the inner case part 51, and the board placement part 51 b 1 and the outer case part 52 (outer casing part 52) Is sandwiched between the second protrusion 52a2 provided in the portion 52a).
  • the outer peripheral end of the circuit board 71 is fitted between the board mounting portion 51b1 and the second protrusion 52a2.
  • the drive circuit 70 is held in the housing 50.
  • the circuit element 72 is, for example, various capacitors, resistor elements, rectifier circuit elements, coil elements, choke coils (choke transformers), noise filters, diodes, or integrated circuit elements.
  • the drive circuit 70 configured as described above is covered with the inner casing portion 51 of the casing 50, and thus is in a non-contact state with the metal member 60. Thereby, the insulation of the drive circuit 70 is ensured.
  • the drive circuit 70 is not limited to a smoothing circuit, and a dimmer circuit, a booster circuit, and the like can be appropriately selected and combined.
  • Each of the lead wires 70a to 70d is an alloy copper lead wire, and is composed of a core wire made of alloy copper and an insulating resin film covering the core wire.
  • the pair of lead wires 70 a and 70 b are electric wires for supplying DC power for lighting the LED module 20 from the drive circuit 70 to the LED module 20.
  • the drive circuit 70 and the LED module 20 are electrically connected by a pair of lead wires 70a and 70b.
  • one end portion (core wire) of each of the lead wires 70a and 70b is electrically connected to the power output portion (metal wiring) of the circuit board 71 by solder or the like, and the other end of each other.
  • the end portion (core wire) is electrically connected to the power input portion (electrode terminal) of the LED module 20 by solder or the like.
  • the pair of lead wires 70 c and 70 d are electric wires for supplying AC power from the base 80 to the drive circuit 70.
  • the drive circuit 70 and the base 80 are electrically connected by a pair of lead wires 70c and 70d.
  • one end portion (core wire) of each of the lead wires 70c and 70d is electrically connected to the base 80 (shell portion or eyelet portion), and each other end portion (core wire) is
  • the power input part (metal wiring) of the circuit board 71 is electrically connected by solder or the like.
  • the base 80 is a power receiving unit that receives power for causing the LEDs 22 of the LED module 20 to emit light from outside the lamp.
  • the base 80 is attached to a socket of a lighting fixture, for example, and when the light bulb shaped lamp 1 is turned on, the base 80 receives electric power from the socket of the lighting fixture.
  • the base 80 is supplied with AC power from a commercial power supply (AC 100 V).
  • the base 80 in the present embodiment receives AC power through two contact points, and the power received by the base 80 is input to the power input unit of the drive circuit 70 via a pair of lead wires 70c and 70b.
  • the base 80 has a metal bottomed cylindrical shape, and includes a shell portion whose outer peripheral surface is a male screw and an eyelet portion attached to the shell portion via an insulating portion. Further, a screwing portion for screwing into the socket of the lighting device is formed on the outer peripheral surface of the base 80, and a screwing portion 52 b of the outer housing portion 52 is screwed on the inner peripheral surface of the base 80. A threaded portion for mating is formed.
  • the type of the base 80 is not particularly limited, but in this embodiment, a screw-type Edison type (E type) base is used.
  • E type screw-type Edison type
  • the base 80 an E26 type, an E17 type, an E16 type, or the like can be given.
  • the light bulb shaped lamp 1 according to the present embodiment is configured.
  • the effect of the light bulb shaped lamp 1 according to the present embodiment will be described with reference to FIG. 12 is an enlarged view of a main part of the light bulb shaped lamp according to Embodiment 1 of the present invention (enlarged view of a region surrounded by a broken line A in FIG. 4), and (a) is when the light is turned off (when not lighted).
  • An enlarged view, (b) is an enlarged view at the time of lighting.
  • the metal metal member 60 and the resin housing 50 have different thermal expansion coefficients (linear expansion coefficients).
  • the resin housing 50 (outer housing portion 52) is more than the metal member 60.
  • the thermal expansion coefficient is several times higher. Therefore, if the metal member 60 and the housing 50 (outer housing portion 52) are in contact with each other as shown in FIG. 16, the metal member 60 and the metal module 60 and the LED module 20 are heated by the heat from the drive circuit 70 and the LED module 20 when the lamp is lit.
  • the casing 50 (outer casing section 52) is thermally expanded (volume expansion)
  • the resin casing 50 (outside section) is caused by a difference in thermal expansion coefficient between the metal member 60 and the casing 50 (outer casing section 52). There may be a case where stress distortion occurs in the casing 52) to induce cracks. If a crack occurs in the housing 50 (outer housing portion 52), the insulating property is lowered.
  • the metal member 60 and the outer casing section 52 are brought into a non-contact state, and the metal member 60 and the outer casing section 52 are not contacted. If a certain gap is provided between the two to absorb the difference in thermal expansion coefficient between the two, this gap becomes a heat insulating layer and heat dissipation is reduced.
  • the outer casing 52 faces the outer casing 52 so that an infinite number of air layers exist between the metal member 60 and the outer casing 52.
  • a coating film 61 having innumerably protruding protrusions 61 a is formed on the surface of the metal member 60.
  • the difference in thermal expansion coefficient between the metal member 60 and the outer casing 52 can be absorbed by the countless protrusions 61a (countless air layers) of the coating film 61.
  • the coating film 61 is a flexible film.
  • stress that causes cracks is not applied to the outer casing 52, so that occurrence of cracks in the outer casing 52 can be suppressed. Thereby, it can suppress that insulating property falls by the crack of the outer side housing
  • the metal member 60 and the outer casing 52 are in contact with the coating film 61 at least when the lamp is lit, a heat conduction path from the metal member 60 to the outer casing 52 is ensured via the coating film 61. be able to.
  • the thermal resistance from the metal member 60 to the outer casing 52 can be reduced.
  • the heat generated in the drive circuit 70 and the LED module 20 can be efficiently conducted to the outer casing 52, so that the heat dissipation can be improved as a whole lamp.
  • the configuration of the present embodiment is configured such that the thermal resistance between the coating film 61 and the outer casing 52 is reduced by turning on the lamp. Thereby, the heat dissipation at the time of lamp lighting can be improved effectively.
  • the gap between the outer peripheral surface of the metal member 60 and the inner peripheral surface of the outer casing 52 is 100 ⁇ m or more, preferably 200 ⁇ m or more.
  • the coating film 61 can be formed by a fluid immersion method.
  • FIG. 13 is a diagram for explaining a method of assembling the light bulb shaped lamp according to Embodiment 1 of the present invention.
  • the drive circuit 70 is not shown.
  • a structure in which a metal member 60 having a coating film 61 and a coupling member 30 are fitted to a support member 40 to which a circuit cap portion 51a is screwed is connected to a drive circuit 70 (not shown).
  • a drive circuit 70 (not shown).
  • the structure is pushed into the outer casing 52 until it is positioned at the position.
  • the lead wires 70a and 70b and the LED module 20 are then soldered to press the globe 10 into the coupling member 30, and a silicone resin is applied to the boundary between the globe 10 and the coupling member 30. Thereafter, the base 80 is screwed into the screwing portion 52b of the outer casing 52, and the base is connected to the lead wires 70c and 70d.
  • the light bulb shaped lamp 1 according to the present embodiment can be assembled.
  • the support member 40, the housing 50, and the metal member 60 can be combined by simply fitting each constituent member without using an adhesive.
  • the metal member 60 and the housing 50 are arranged with a gap therebetween.
  • a coating film 61 having a plurality of flexible protrusions 61a is formed on the outer surface.
  • the metal member 60 and the outer casing 52 are in contact with the coating film 61.
  • the heat generated in the drive circuit 70 and the LED module 20 can be efficiently conducted to the outer casing 52.
  • heat dissipation can be improved.
  • casing part 52 can be enlarged by lighting a lamp
  • the light bulb shaped lamp 1 according to the present embodiment it is possible to realize a light bulb shaped lamp having excellent heat dissipation without deteriorating insulation.
  • the chip junction temperature (Tj) of the LED module 20 can be reduced by about 5 ° C.
  • the outer peripheral surface of the base 42 (large diameter portion 42 b) of the support member 40 is in surface contact with the inner peripheral surface of the metal member 60.
  • the heat of LED module 20 can be efficiently conducted from metal support member 40 (base 42) to metal member 60.
  • the lower end part (base side end part) of the metal member 60 is extended below the base part (base side) of the lower end part of the support member 40 (base 42). ing.
  • the lower end portion of the metal member 60 is moved to the position of the lower end portion of the outer portion 52a exposed to the outside air and the position of the circuit holder portion 51b surrounding the drive circuit 70. It is extended.
  • the surface area of the metal member 60 can be increased, the heat generated in the drive circuit 70 can be efficiently conducted to the metal member 60 and the heat conduction from the metal member 60 to the outer housing portion 52 is achieved.
  • Property can be further improved. Therefore, the heat dissipation of the light bulb shaped lamp 1 can be further improved.
  • globe of the same shape as the glove (bulb) used for an incandescent lamp is used, and the LED module 20 is provided in the support
  • a light distribution characteristic with a wide light distribution angle can be realized, and a light distribution characteristic similar to that of an incandescent lamp can be obtained.
  • FIG. 14 is a cross-sectional view showing a configuration of a light bulb shaped lamp according to Embodiment 2 of the present invention.
  • the same reference numerals are used for configurations having the same functions as those in Embodiment 1, and detailed description thereof is omitted or simplified.
  • FIG. 14 corresponds to the cross-sectional view of FIG. 3 of the first embodiment.
  • the light bulb shaped lamp 1A includes a globe 10, an LED module 20, a coupling member 30A, a support member 40A, a housing 50A, a coating film 61, and a drive circuit. 70, lead wires 70a to 70d, a cap 80, and a screw 90.
  • an envelope is configured by the globe 10, the housing 50 (outer housing portion 52 ⁇ / b> A), and the base 80.
  • the coupling member 30A is a member that couples the globe 10, the support member 40A, and the housing 50A. As shown in FIG. 14, the coupling member 30A is configured in a ring shape so as to surround the periphery of the pedestal 42A of the support member 40A, and can be formed of, for example, an insulating resin.
  • the support member (metal support) 40A is a member that supports the LED module 20, and is made of metal.
  • the configuration of the support member 40 will be described in detail with reference to FIGS. 3 and 4 and FIG.
  • FIG. 7 is an external perspective view of a support member in the light bulb shaped lamp according to Embodiment 1 of the present invention.
  • the support member 40 includes a support column 41 that is mainly located inside the globe 10 and a pedestal 42A that is mainly surrounded by the housing 50 (outer housing portion 52A).
  • the support column 41 and the base 42A are integrally formed of the same material.
  • the pedestal 42A is a member that supports the support column 41 as in the first embodiment, and is configured to close the opening 11 of the globe 10 as shown in FIG.
  • the pedestal 42A is made of a metal material.
  • the pedestal 42A is made of an aluminum alloy like the support column 41.
  • the outer peripheral surface of the pedestal 42 ⁇ / b> A is in surface contact with the inner peripheral surface of the outer housing portion 52 ⁇ / b> A of the housing 50. Thereby, the heat generated in the LED module 20 can be efficiently radiated to the outside of the lamp.
  • the housing 50A has a drive circuit 70 disposed therein, and is configured by an inner housing part (first housing part) 51A and an outer housing part (second housing part) 52A.
  • the inner housing part 51A is an enclosing member arranged so as to surround the drive circuit 70.
  • the inner housing portion 51A is an insulating case (circuit case), and can be manufactured using a resin such as PBT, for example.
  • the inner housing portion 51A includes a circuit cap portion 51Aa disposed so as to cover the drive circuit 70 and a circuit holder portion 51Ab disposed so as to cover the periphery of the drive circuit 70 side.
  • the circuit cap portion 51Aa is a substantially bottomed cylindrical member configured in a cap shape, and is configured to conform to the inner surface shape of the base 42A of the support member 40A, as in the first embodiment.
  • the circuit holder portion 51Ab is configured in a cylindrical shape, and includes a large-diameter portion that mainly covers the drive circuit 70 and a small-diameter portion that is screwed into the base 80.
  • the outer casing 52A is arranged so as to surround the inner casing 51A.
  • the outer casing 52A is made of a metal material and functions as a heat sink.
  • the outer casing 52A is an outer member that is at least a part of the lamp envelope and is arranged so as to be visible from the outside of the lamp. Accordingly, since the outer surface of the outer casing 52A is exposed to the atmosphere, the heat conducted to the outer casing 52A is radiated from the outer surface of the outer casing 52A.
  • the outer casing 52A is made of a metal made of an aluminum alloy or the like, and is a substantially cylindrical member in the present embodiment.
  • the outer casing 52A is configured such that the diameter gradually decreases toward the base 80 side. That is, the inner peripheral surface and the outer peripheral surface of the outer casing portion 52A are inclined with respect to the lamp axis.
  • the inner casing portion 51A and the outer casing portion 52A are spaced apart from each other between the outer peripheral surface of the inner casing portion 51A and the inner peripheral surface of the outer casing portion 52A. Opposed.
  • a coating film 61 is formed between the inner casing portion 51A and the outer casing portion 52A.
  • the coating film 61 is formed on the outer surface of the inner housing portion 51A.
  • the coating film 61 has a plurality of protrusions 61 a that protrude toward the outer housing portion 52 as in the first embodiment.
  • the protrusion 61a is formed so that the tip portion contacts the inner peripheral surface of the outer casing portion 52A at least when the lamp is lit.
  • the coating film 61 can be formed by powder coating or the like as in the first embodiment.
  • the light bulb shaped lamp 1A according to the present embodiment is configured.
  • the light bulb shaped lamp 1A configured as described above has the same effects as the light bulb shaped lamp 1 according to the first embodiment.
  • the resin-made inner housing part 51A and the metal outer housing part 52A are arranged with a gap therebetween, and the inner housing part 51A A coating film 61 having a plurality of flexible protrusions 61a is formed on the outer surface.
  • the inner casing 51A and the outer casing 52A are in contact with the coating film 61.
  • the heat generated in the drive circuit 70 and the LED module 20 can be efficiently conducted to the outer casing 52A.
  • heat dissipation can be improved.
  • casing part 52A can be enlarged by lighting a lamp
  • the light bulb shaped lamp 1A As described above, according to the light bulb shaped lamp 1A according to the present embodiment, it is possible to realize a light bulb shaped lamp having excellent heat dissipation without deteriorating insulation.
  • a glove having the same shape as a glove (bulb) used for an incandescent bulb is used as in the first embodiment, and a support column 41 extending inward of the glove 10 is used.
  • the LED module 20 is provided. Thereby, a light distribution characteristic with a wide light distribution angle can be realized, and a light distribution characteristic similar to that of an incandescent lamp can be obtained.
  • the outer casing portion 52A that is an outer member is made of metal. Therefore, it is possible to realize a light bulb shaped lamp that is more excellent in heat dissipation than in the first embodiment.
  • the outer peripheral surface of the pedestal 42A of the support member 40A is in surface contact with the inner peripheral surface of the metal outer casing 52A that is the outer member.
  • the heat of LED module 20 can be efficiently conducted from support member 40A (pedestal 42A) to outer case part 52A.
  • FIG. 15 is a schematic cross-sectional view of a lighting apparatus according to Embodiment 3 of the present invention.
  • the lighting device 2 As shown in FIG. 15, the lighting device 2 according to the present embodiment is used, for example, by being mounted on an indoor ceiling, and includes the light bulb shaped lamp 1 and the lighting device 3 according to the above-described embodiment.
  • the lighting fixture 3 turns off and turns on the light bulb shaped lamp 1 and includes a fixture main body 4 attached to the ceiling and a lamp cover 5 that covers the light bulb shaped lamp 1.
  • the appliance body 4 has a socket 4a.
  • the base 80 of the light bulb shaped lamp 1 is screwed into the socket 4a. Electric power is supplied to the light bulb shaped lamp 1 through the socket 4a.
  • the coating film 61 is formed only on the outer peripheral surface of the metal member 60, but is not limited thereto.
  • the metal member 60 may be formed on both the outer peripheral surface and the inner peripheral surface.
  • polyethylene-based or nylon-based resin is used as a raw material for the powder coating material of the coating film 61.
  • the present invention is not limited to this.
  • an epoxy, polyester, acrylic, or modified EVA material can be used as a raw material for the powder coating.
  • the screwing part 52 b is a part of the outer casing part 52, but may be a part of the inner casing part 51. That is, the screwing part 52b may be regarded as a part of a circuit case that houses the drive circuit 70, and more specifically, the screwing part 52b may be a part of the circuit holder part 51b.
  • the metal member 60 does not have a portion cut from the globe side edge toward the base side edge, but is not limited thereto.
  • the cross-sectional shape of the metal member 60 may be a C-shape, and the metal member 60 may be formed with a portion cut from the globe side edge toward the base side edge.
  • the bulb-type LED lamp using the globe 10 having the same shape as the incandescent bulb is used.
  • the present invention is not limited to this. That is, in the above embodiment, the size of the globe 10 is larger than the size of the housing 50, but the present invention is also applied to a light bulb shaped lamp in which the size of the globe 10 is smaller than the size of the housing 50. be able to.
  • a translucent substrate is used as the base 21 of the LED module 20, but the present invention is not limited to this.
  • the base 21 an opaque substrate having a very low total transmittance or a total transmittance of zero may be used.
  • an opaque substrate an opaque ceramic substrate, a metal base substrate, or the like can be used.
  • two bases 21 on which the LEDs 22 and the sealing member 23 are formed only on the front side are used, and the back side surfaces of the two bases 21 are bonded together.
  • one LED module 20 may be configured. Or you may comprise the one LED module 20 by forming LED22 and the sealing member 23 on both surfaces of one translucent board
  • the LED module 20 is configured to emit white light by the blue LED and the yellow phosphor, but is not limited thereto.
  • a phosphor-containing resin containing a red phosphor and a green phosphor may be used so that white light is emitted by combining this with a blue LED.
  • the LED 22 may be an LED that emits a color other than blue.
  • a combination of phosphor particles that emit light in three primary colors (red, green, and blue) can be used as the phosphor particles.
  • a wavelength conversion material other than the phosphor particles may be used.
  • the wavelength conversion material absorbs light of a certain wavelength such as a semiconductor, a metal complex, an organic dye, or a pigment, and has a wavelength different from the absorbed light.
  • a material containing a substance that emits light may be used.
  • the LED is exemplified as the light emitting element.
  • a semiconductor light emitting element such as a semiconductor laser
  • an EL element such as an organic EL (Electro Luminescence) or an inorganic EL, or other solid light emitting element is used. May be.
  • the LED module 20 has a COB type configuration in which the LED chip is directly mounted on the base 21, but the present invention is not limited to this.
  • a package-type LED element in which an LED chip is mounted in a resin-molded container (cavity) and a phosphor-containing resin is enclosed in the container, that is, a surface-mount type (SMD) LED element
  • SMD surface-mount type
  • an LED module configured by mounting a plurality of SMD type LED elements on a substrate may be used.
  • the present invention is useful as a light bulb shaped lamp that replaces a conventional incandescent light bulb and the like, and can be widely used in lighting devices and the like.
  • the light bulb shaped lamp according to the present invention has excellent heat dissipation without degrading insulation, it is suitable for a high power type light bulb shaped lamp.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

La présente invention porte sur une lampe en forme d'ampoule (1) qui comporte : un module de DEL (20) ; un globe (10) qui recouvre le module de DEL (20) ; un circuit de commande (70) pour que le module de DEL (20) émette une lumière ; un élément périphérique (un élément métallique (60)) qui est disposé afin d'entourer le circuit de commande (70) ; un boîtier (50) qui est disposé afin d'entourer l'élément périphérique et forme au moins une partie d'une enveloppe ; un film d'enrobage (61) qui est formé sur la surface côté boîtier de l'élément périphérique ou la surface côté élément périphérique du boîtier. Les coefficients de dilatation thermique de l'élément périphérique et du boîtier sont différents l'un de l'autre, et le film d'enrobage (61) a une pluralité de projections flexibles, les parties d'extrémité frontale de celles-ci étant en contact avec la surface côté boîtier de l'élément périphérique ou la surface côté élément périphérique du boîtier, sur lesquelles le film d'enrobage (61) n'est pas formé, lorsque la lampe en forme d'ampoule (1) est éclairée.
PCT/JP2013/001040 2012-07-12 2013-02-25 Lampe en forme d'ampoule et dispositif d'éclairage WO2014010141A1 (fr)

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JP2012156778 2012-07-12

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103791286A (zh) * 2014-02-21 2014-05-14 李文雄 线状led光源、线状led灯及线状led光源的制备方法
CN104371718A (zh) * 2014-11-13 2015-02-25 沈阳化工大学 稀土NaY(WO4)2:Dy3+, Ho3+荧光粉及其制备方法
GB2535333A (en) * 2015-02-12 2016-08-17 Hexham Ltd Lamp
EP3106740A1 (fr) * 2015-06-19 2016-12-21 Xiamen Lee Brothers Co., Ltd. Ampoule à filament led
CN107305006A (zh) * 2016-04-22 2017-10-31 通用电气公司 用于led改装灯的防分离压盖器及其使用方法
CN111379982A (zh) * 2019-12-10 2020-07-07 宁波凯耀电器制造有限公司 一种led灯具
US12007080B2 (en) * 2020-10-13 2024-06-11 Signify Holding B.V. Deep-drawn MCPCB

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012119280A (ja) * 2010-12-03 2012-06-21 Iwasaki Electric Co Ltd ランプ
JP2013048039A (ja) * 2011-08-29 2013-03-07 Hitachi Appliances Inc 電球型照明装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012119280A (ja) * 2010-12-03 2012-06-21 Iwasaki Electric Co Ltd ランプ
JP2013048039A (ja) * 2011-08-29 2013-03-07 Hitachi Appliances Inc 電球型照明装置

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103791286A (zh) * 2014-02-21 2014-05-14 李文雄 线状led光源、线状led灯及线状led光源的制备方法
CN104371718A (zh) * 2014-11-13 2015-02-25 沈阳化工大学 稀土NaY(WO4)2:Dy3+, Ho3+荧光粉及其制备方法
GB2535333A (en) * 2015-02-12 2016-08-17 Hexham Ltd Lamp
GB2535333B (en) * 2015-02-12 2017-03-22 Hexham Ltd Lamp
EP3106740A1 (fr) * 2015-06-19 2016-12-21 Xiamen Lee Brothers Co., Ltd. Ampoule à filament led
CN107305006A (zh) * 2016-04-22 2017-10-31 通用电气公司 用于led改装灯的防分离压盖器及其使用方法
CN111379982A (zh) * 2019-12-10 2020-07-07 宁波凯耀电器制造有限公司 一种led灯具
CN111379982B (zh) * 2019-12-10 2022-01-07 宁波凯耀电器制造有限公司 一种led灯具
US12007080B2 (en) * 2020-10-13 2024-06-11 Signify Holding B.V. Deep-drawn MCPCB

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