WO2014010146A1 - Lampe en forme d'ampoule et dispositif d'éclairage - Google Patents

Lampe en forme d'ampoule et dispositif d'éclairage Download PDF

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Publication number
WO2014010146A1
WO2014010146A1 PCT/JP2013/001518 JP2013001518W WO2014010146A1 WO 2014010146 A1 WO2014010146 A1 WO 2014010146A1 JP 2013001518 W JP2013001518 W JP 2013001518W WO 2014010146 A1 WO2014010146 A1 WO 2014010146A1
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WO
WIPO (PCT)
Prior art keywords
circuit
light bulb
housing
shaped lamp
metal member
Prior art date
Application number
PCT/JP2013/001518
Other languages
English (en)
Japanese (ja)
Inventor
次弘 松田
利雄 森
裕美 田中
美奈子 赤井
洋介 藤巻
一裕 川端
康輔 菅原
Original Assignee
パナソニック株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パナソニック株式会社 filed Critical パナソニック株式会社
Priority to JP2013540150A priority Critical patent/JPWO2014010146A1/ja
Publication of WO2014010146A1 publication Critical patent/WO2014010146A1/fr

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb

Definitions

  • the present invention relates to a light bulb shaped lamp and a lighting device, and more particularly to a light bulb shaped lamp using a light emitting diode (LED: Light Emitting Diode) and a lighting device using the same.
  • LED Light Emitting Diode
  • LEDs Semiconductor light emitting devices such as LEDs are expected to be a new light source in various lamps such as fluorescent lamps and incandescent lamps, since they are small, highly efficient, and have a long lifetime. R & D is underway.
  • LED lamp replace it with a bulb-type fluorescent lamp with a light bulb in a glass bulb, a bulb-type LED lamp (bulb-shaped LED lamp) that replaces an incandescent bulb with a filament coil, or a straight-tube fluorescent lamp There is a straight tube type LED lamp (straight tube type LED lamp).
  • Patent Document 1 discloses a conventional bulb-type LED lamp.
  • Patent Document 2 discloses a conventional straight tube LED lamp.
  • FIG. 14 is a diagram illustrating a configuration of a light bulb shaped LED lamp according to a comparative example having a light distribution characteristic with a wide light distribution angle.
  • a bulb-type LED lamp 100 includes a globe 110 having the same shape as a globe (bulb) used in an incandescent bulb, an LED module 120 disposed in the center of the globe 110, an LED The support column 140 that supports the LED module 120 having a power supply, the drive circuit 170 that supplies power to the LED module 120, the insulating circuit case 150 that houses the drive circuit 170 and serves as an outer member, and the base 180 that receives power.
  • an envelope is configured by the globe 110, the circuit case 150, and the base 180. With this configuration, a light bulb shaped LED lamp having a light distribution characteristic with a wide light distribution angle can be realized.
  • the light bulb shaped LED lamp 100 having the configuration shown in FIG. 14 has a problem that it is difficult to achieve both insulation and high heat dissipation. Hereinafter, this point will be specifically described.
  • the present invention has been made to solve such a problem, and an object of the present invention is to provide a light bulb shaped lamp and an illuminating device having excellent heat dissipation while ensuring insulation.
  • one embodiment of a light bulb shaped lamp according to the present invention includes a light emitting module, a globe covering the light emitting module, a drive circuit for causing the light emitting module to emit light, and the drive circuit inwardly. And a housing having an insulating property, wherein the housing is disposed so as to surround the first housing portion and the first housing portion disposed so as to surround the drive circuit. And at least a second housing part that becomes a part of the envelope, and a metal member that surrounds the first housing part between the first housing part and the second housing part Is arranged.
  • the light bulb shaped lamp further includes a support member that is provided so as to extend inward of the globe and that supports the light emitting module, and the metal member includes It may be in contact with the support member.
  • the metal member may be in non-contact with either the first housing part or the second housing part.
  • the metal member may be in contact with the second housing part and not in contact with the first housing part.
  • the first housing part is separated from the circuit cap part disposed so as to cover the drive circuit, and the circuit cap part.
  • a circuit holder portion arranged to cover the periphery, the circuit cap portion is fixed to the support member, and a part of the circuit cap portion protrudes from the inner surface of the second housing portion. It is good also as being clamped by 1 protrusion part and 2nd protrusion part.
  • the drive circuit includes a circuit board and a circuit element mounted on the circuit board, and the circuit board is provided on the first housing portion and on which the circuit board is placed. It is good also as being clamped by the mounting part and the said 1st protrusion part.
  • circuit holder part and the second housing part may be integrally molded.
  • the metal member may have a notch formed at a position corresponding to the first projecting portion and the second projecting portion.
  • a base for receiving electric power may be further provided, and the housing may have a screwing portion that is screwed with the base.
  • the metal member may be cylindrical.
  • an aspect of the lighting device according to the present invention is characterized by including the light bulb shaped lamp described above.
  • FIG. 1 is an external perspective view of a light bulb shaped lamp according to an embodiment of the present invention.
  • FIG. 2 is an exploded perspective view of the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 3 is a diagram showing one cross section of the configuration of the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 4 is a diagram showing another cross section of the configuration of the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 5A is a plan view of the LED module in the light bulb shaped lamp according to the embodiment of the present invention, and
  • FIG. 5B is a cross-sectional view taken along the line XX ′ in FIG. It is sectional drawing of the LED module.
  • FIG. 5A is a plan view of the LED module in the light bulb shaped lamp according to the embodiment of the present invention
  • FIG. 5B is a cross-sectional view taken along the line XX ′ in FIG. It is sectional drawing of the LED module.
  • FIG. 6 is an enlarged cross-sectional view around the LED (LED chip) in the LED module of the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 7 is an external perspective view of a support member in the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 8A is an external perspective view of a housing (cap portion of the inner housing portion) in the light bulb shaped lamp according to the embodiment of the present invention, and
  • FIG. 8B is the light bulb shaped lamp. It is an external appearance perspective view of the housing
  • FIG. 9 is an external perspective view of a metal member in the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 9 is an external perspective view of a metal member in the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 10 is an enlarged view of a main part of the light bulb shaped lamp according to the embodiment of the present invention (enlarged view of a region surrounded by a broken line A in FIG. 4).
  • FIG. 11 is a diagram for explaining a method of assembling the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 12 is an enlarged view of a main part of a light bulb shaped lamp according to a modification of the embodiment of the present invention.
  • FIG. 13 is a schematic cross-sectional view of the illumination device according to the embodiment of the present invention.
  • FIG. 14 is a diagram showing a configuration of a light bulb shaped LED lamp according to a comparative example.
  • FIG. 1 is an external perspective view of a light bulb shaped lamp according to an embodiment of the present invention.
  • FIG. 2 is an exploded perspective view of the light bulb shaped lamp according to the embodiment of the present invention.
  • a light bulb shaped lamp 1 is a light bulb shaped LED lamp that is a substitute for a light bulb shaped fluorescent light or an incandescent light bulb, and includes a globe 10 and an LED that is a light source. Power is supplied to the module 20, the support member 40 that supports the LED module 20, the housing 50 in which the drive circuit 70 is disposed inside, the metal member 60 disposed in the housing 50, and the LED module 20. A driving circuit 70 for receiving power and a base 80 for receiving power from the outside.
  • the bulb-type lamp 1 further includes lead wires 70a to 70d, a ring-shaped coupling member 30, and a screw 90.
  • an envelope is constituted by the globe 10, the housing 50 (outer housing portion 52), and the base 80. That is, the globe 10, the housing 50 (outer housing portion 52), and the base 80 are exposed to the outside, and each outer surface is exposed to the outside air. Moreover, the light bulb shaped lamp 1 in the present embodiment is configured to have a brightness equivalent to the 40W type.
  • FIG. 3 is a view showing one section of the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 4 is a diagram showing another cross section of the configuration of the light bulb shaped lamp according to the embodiment of the present invention, and shows a cross sectional view when rotated about 45 ° from the state of FIG. 3 around the lamp axis. Yes.
  • the lamp axis is an axis that becomes a rotation center when the bulb lamp 1 is attached to the socket of the lighting device, and coincides with the rotation axis of the base 80.
  • circuit elements are omitted.
  • the globe 10 is a translucent cover that houses the LED module 20 and transmits light from the LED module 20 to the outside of the lamp.
  • the light of the LED module 20 that has entered the inner surface of the globe 10 passes through the globe 10 and is extracted to the outside of the globe 10.
  • the globe 10 in the present embodiment is a glass bulb (clear bulb) made of silica glass that is transparent to visible light. Therefore, the LED module 20 housed in the globe 10 can be viewed from the outside of the globe 10.
  • the shape of the globe 10 is a shape in which one end is closed in a spherical shape and an opening 11 is provided at the other end.
  • the shape of the globe 10 is such that a part of a hollow sphere narrows while extending away from the center of the sphere, and the opening 11 is located away from the center of the sphere. Is formed.
  • a glass bulb having the same shape as a general incandescent bulb can be used.
  • a glass bulb such as an A shape, a G shape, or an E shape can be used as the globe 10.
  • the opening 11 of the globe 10 is located between the support member 40 and the housing 50. More specifically, the opening 11 of the globe 10 is press-fitted into the groove of the coupling member 30 disposed between the support member 40 and the housing 50. Thereby, the globe 10 is fixed.
  • a silicone resin may be apply
  • the globe 10 is not necessarily transparent to visible light, and the globe 10 may have a light diffusion function.
  • a milky white light diffusing film may be formed by applying a resin containing a light diffusing material such as silica or calcium carbonate, a white pigment, or the like to the entire inner surface or outer surface of the globe 10.
  • the shape of the globe 10 is not limited to the A shape, and may be a spheroid or an oblate sphere.
  • the material of the globe 10 is not limited to a glass material, and a resin material such as a synthetic resin such as acrylic (PMMA) or polycarbonate (PC) may be used.
  • the LED module 20 is a light emitting module having a light emitting element, and emits predetermined light. As shown in FIGS. 3 and 4, the LED module 20 is disposed inward of the globe 10, and has a spherical central position formed by the globe 10 (for example, a large diameter portion where the inner diameter of the globe 10 is large). (Inside) is preferably arranged. Thus, by arranging the LED module 20 at the center position of the globe 10, the light distribution characteristic of the light bulb shaped lamp 1 becomes a light distribution characteristic similar to an incandescent light bulb using a conventional filament coil.
  • the LED module 20 is held in the hollow in the globe 10 by the support member 40, and emits light by the electric power supplied via the lead wires 70a and 70b.
  • FIG. 5A is a plan view of the LED module in the light bulb shaped lamp according to the embodiment of the present invention
  • FIG. 5B is a cross-sectional view taken along the line XX ′ in FIG. It is sectional drawing of the LED module.
  • the LED module 20 includes a base 21, an LED 22, a sealing member 23, and a metal wiring 24.
  • the LED module 20 in the present embodiment has a COB (Chip On Board) structure in which a bare chip is directly mounted on the base 21.
  • COB Chip On Board
  • the base 21 is an LED mounting board for mounting the LEDs 22.
  • the base 21 in the present embodiment is composed of a member that has a property of transmitting visible light.
  • the base 21 having translucency the light of the LED 22 is transmitted through the inside of the base 21 and is emitted from the surface (back surface) on which the LED 22 is not mounted. Therefore, even when the LED 22 is mounted only on one surface (front surface) of the base 21, light is emitted from the other surface (back surface), and light distribution characteristics similar to an incandescent bulb can be obtained. It becomes possible.
  • the base 21 is preferably made of a member having a high total transmittance.
  • a ceramic substrate made of sintered alumina (Al 2 O 3 ) having a total transmittance of 90% or more for visible light is used as the base 21.
  • a ceramic substrate made of AlN or MgO can be used as the base 21 as the base 21 as the base 21.
  • the shape of the base 21 in the present embodiment a rectangular substrate having a long shape in plan view (when viewed from the top of the globe 10) is used. Thereby, the shape of the planar view of the LED module 20 is also long.
  • the base 21 is provided with through holes 21a and 21b.
  • the through hole 21 a is provided to fit the base 21 and the support column 41 of the support member 40.
  • the through-hole 21 a is formed in a rectangular shape in plan view at a position shifted in the longitudinal direction from the center of the base 21.
  • two through holes 21b are provided for electrical connection with the two lead wires 70a and 70b.
  • the through holes 21b are provided at both ends in the longitudinal direction of the base 21. Yes.
  • the LED 22 is an example of a light emitting element, and is a bare chip that emits monochromatic visible light. In this embodiment, a blue LED chip that emits blue light when energized is used. Further, the LEDs 22 are mounted only on one surface (front surface) of the base 21, and four element rows each having a plurality of (for example, twelve) LEDs 22 as one row are arranged in a straight line.
  • a plurality of LEDs 22 are mounted.
  • the number of LEDs 22 may be appropriately changed according to the use of the light bulb shaped lamp.
  • the number of LEDs 22 may be one.
  • the number of LEDs 22 in one row may be 12 or more.
  • the plurality of LEDs 22 are mounted in four rows on the base 21, but may be one row or may be a plurality of rows other than the four rows.
  • the light bulb shaped lamp 1 according to the present embodiment is suitable for a high-output type LED lamp having a large number of LEDs 22 because both insulation and high heat dissipation can be achieved.
  • FIG. 6 is an enlarged cross-sectional view around the LED (LED chip) in the LED module of the light bulb shaped lamp according to the embodiment of the present invention.
  • the LED 22 includes a sapphire substrate 22a and a plurality of nitride semiconductor layers 22b having different compositions stacked on the sapphire substrate 22a.
  • a cathode electrode 22c and an anode electrode 22d are provided at the end of the upper surface of the nitride semiconductor layer 22b. Further, wire bond portions 22e and 22f are provided on the cathode electrode 22c and the anode electrode 22d, respectively.
  • the cathode electrode 22c of one LED 22 and the anode electrode 22d of the other LED 22 are electrically connected in series by a gold wire 25 through wire bond portions 22e and 22f.
  • Each LED 22 is mounted on the base 21 with a translucent chip bonding material 26 so that the surface on the sapphire substrate 22 a side faces the mounting surface of the base 21.
  • a silicone resin containing a filler made of metal oxide can be used for the chip bonding material 26.
  • the sealing member 23 is linearly formed so as to collectively seal one row of the plurality of LEDs 22.
  • the sealing member 23 includes a phosphor that is a light wavelength conversion material, and also functions as a wavelength conversion layer that converts the wavelength of light from the LED 22.
  • a phosphor-containing resin in which predetermined phosphor particles (not shown) and a light diffusing material (not shown) are dispersed in a silicone resin can be used.
  • the phosphor particles when the LED 22 is a blue LED that emits blue light, for example, YAG-based yellow phosphor particles can be used to obtain white light. Thereby, a part of the blue light emitted from the LED 22 is converted into yellow light by the yellow phosphor particles contained in the sealing member 23. Then, the blue light that has not been absorbed by the yellow phosphor particles and the yellow light that has been wavelength-converted by the yellow phosphor particles are diffused and mixed in the sealing member 23, so that white light is emitted from the sealing member 23. And emitted.
  • particles such as silica are used as the light diffusing material.
  • the sealing member 23 configured in this way can be formed, for example, by applying and curing an uncured paste-like sealing member 23 containing a wavelength conversion material with a dispenser.
  • the sealing member 23 is not necessarily formed of a silicone resin, and may be formed of an inorganic material such as a low-melting glass or a sol-gel glass in addition to an organic material such as a fluorine-based resin.
  • bonding of fluorescent substance particles, glass, etc. as a 2nd wavelength conversion material between LED22 and the base 21 or the back surface of the base 21 A sintered body film (phosphor film) made of a material (binder) may be further formed. In this way, white light can be emitted from both surfaces of the base 21 by further forming the phosphor film (second wavelength conversion material).
  • the metal wiring 24 is a wiring made of a metal such as Ag patterned on the LED mounting surface (front surface), and supplies power supplied to the LED module 20 from the lead wires 70 a and 70 b to each LED 22.
  • Each LED 22 is electrically connected to the metal wiring 24 via a gold wire 25.
  • the metal wiring 24 formed around the through hole 21b serves as a power feeding portion.
  • the leading ends of the two lead wires 70a and 70b are inserted into the through hole 21b as shown in FIG. 3, and are electrically and physically connected to the metal wiring 24 by solder.
  • the coupling member 30 is a member that couples the globe 10, the support member 40, and the metal member 60. As shown in FIGS. 2 to 4, the coupling member 30 is configured in a ring shape so as to surround the periphery of the base 42 (small diameter portion 42 a) of the support member 40.
  • the coupling member 30 can be molded by curing a fluid insulating resin (for example, silicon) poured into the gap between the outer peripheral surface of the base 42 of the support member 40 and the outer portion 52a of the outer casing 52.
  • the coupling member 30 includes a longitudinal groove portion 30 a formed in an annular shape so that the opening portion 11 of the globe 10 is inserted, and a lateral groove portion provided on the base 42 of the support member 40.
  • the outer surface of the coupling member 30 is in contact with the inner surface of the outer housing portion 52 of the housing 50.
  • the support member 40 is a member that supports the LED module 20 and is made of metal.
  • the configuration of the support member 40 will be described in detail with reference to FIGS. 3 and 4 and FIG.
  • FIG. 7 is an external perspective view of a support member in the light bulb shaped lamp according to the embodiment of the present invention.
  • the support member 40 includes a support column 41 that is mainly located inside the globe 10 and a pedestal 42 that is mainly surrounded by the housing 50 (outer housing portion 52).
  • the support column 41 and the pedestal 42 are integrally formed of the same material.
  • the support column 41 is a metal stem provided so as to extend from the vicinity of the opening 11 of the globe 10 toward the inside of the globe 10.
  • the support column 41 functions as a holding member that holds the LED module 20.
  • One end of the support column 41 is connected to the LED module 20, and the other end of the support column 41 is connected to the pedestal 42.
  • pillar 41 since the support
  • the strut 41 in the present embodiment is a metal strut made of an aluminum alloy.
  • the support column 41 includes a main shaft portion 41a and a fixed portion 41b.
  • the main shaft portion 41a is formed of a cylindrical body having a constant cross-sectional area, one end portion of the main shaft portion 41a is connected to the fixed portion 41b, and the other end portion of the main shaft portion 41a is connected to the pedestal 42.
  • fixed part 41b has a fixing surface (upper surface) fixed with the base 21 of the LED module 20.
  • FIG. The said fixed surface turns into a contact surface of the fixing
  • the LED module 20 is mounted on the fixed surface of the fixing portion 41b and is adhered to the fixed surface with an adhesive or the like.
  • the fixing portion 41b is provided with a protruding portion 41b1 protruding from the fixing surface.
  • the protrusion 41b1 is configured to be fitted into a through hole 21a provided in the base 21 of the LED module 20.
  • the protrusion 41b1 functions as a position restricting portion that restricts the position of the LED module 20, and is configured such that the planar view shape is long.
  • the pedestal 42 is a support base that supports the support column 41, and is configured to close the opening 11 of the globe 10 as shown in FIGS. 3 and 4.
  • the pedestal 42 is a metal support made of a metal material.
  • the pedestal 42 is made of an aluminum alloy like the support column 41. Thereby, the heat
  • a lateral groove portion is formed along the circumferential direction of the small diameter portion 42a.
  • the coupling member 30 is disposed on the step portion of the pedestal 42 (above the large diameter portion 42b), and the flange 30b of the coupling member 30 and the lateral groove portion of the pedestal 42 are fitted, whereby the coupling member 30 is pedestal. 42 is fixed.
  • the small diameter portion 42 a is a disk-shaped member configured to support the support column 41 and close the opening 11 of the globe 10.
  • the support column 41 is formed at the center of the small diameter portion 42a.
  • the outer peripheral surface of the small diameter portion 42a and the inner peripheral surface of the coupling member 30 are in surface contact.
  • the small diameter portion 42a is provided with two through holes 42a1 through which the lead wires 70a and 70b are inserted.
  • the large diameter portion 42 b is configured in a substantially cylindrical shape, and the outer peripheral surface is in surface contact with the inner peripheral surface of the metal member 60. Thereby, the heat of the support member 40 (base 42) can be efficiently conducted to the metal member 60.
  • four concave portions 42b1 are formed as guide holes when caulking with the metal member 60.
  • the support member 40 may be configured using a resin material having a high thermal conductivity instead of a metal material.
  • the housing 50 is an insulating case having an insulating property in which the drive circuit 70 is disposed on the inner side, and includes an inner housing portion (first housing portion) 51 and an outer housing portion (second housing portion) 52. It is constituted by.
  • the housing 50 can be made of an insulating resin material, and can be resin-molded with, for example, polybutylene terephthalate (PBT).
  • PBT polybutylene terephthalate
  • FIG. 8A is an external perspective view of a housing (circuit cap portion of the inner housing portion) in the light bulb shaped lamp according to the embodiment of the present invention, and FIG. It is an external appearance perspective view of the housing
  • the inner housing 51 is an internal member (circuit case) that is disposed so as to surround the drive circuit 70 and is not visible from the outside of the lamp.
  • the inner housing part 51 includes a circuit cap part 51 a disposed so as to cover the drive circuit 70 and a circuit holder part 51 b disposed so as to cover the periphery of the drive circuit 70.
  • the circuit cap part 51a and the circuit holder part 51b are separated, and the circuit cap part 51a and the circuit holder part 51b are arranged in a non-contact state.
  • the circuit cap portion 51a is a substantially bottomed cylindrical member configured in a cap shape as shown in FIG.
  • the circuit cap portion 51a is provided on the entire circumference of the opening end portion of the circuit cap portion 51a, and extends from the flange portion 51a1 projecting outward (outside housing portion side) and the opening end portion of the circuit cap portion 51a. It has four convex portions 51a2 projecting downward (on the base side), and a concave portion 51a3 provided on the inner surface of the open end of the circuit cap portion 51a.
  • the upper surface shape of the circuit cap portion 51 a is configured to follow the inner surface shape of the base 42 of the support member 40. As a result, the circuit cap portion 51 a is fitted into the base 42 of the support member 40 and is fastened and fixed to the support member 40 by the screw 90.
  • the flange part 51a1 is sandwiched between a first projecting part 52a1 and a second projecting part 52a2 provided in the outer casing part 52 (outer part 52a).
  • the circuit cap 51a By pushing the flange 51a1 between the first protrusion 52a1 and the second protrusion 52a2, the circuit cap 51a together with the globe 10, the coupling member 30, the support member 40, and the metal member 60 is placed in the outer casing. It can attach to the part 52 (outer part 52a).
  • the four convex portions 51 a 2 of the circuit cap portion 51 a are in contact with the upper surface of the circuit board 71 of the drive circuit 70. Thereby, when the circuit cap part 51a is attached to the outer side housing part 52, the circuit board 71 is pressed from above by the circuit cap part 51a (the convex part 51a2).
  • the concave portion 51a3 of the circuit cap portion 51a is fitted with a convex portion 52b1 (see FIG. 8 described later) provided in the outer casing portion 52. Thereby, alignment with the circuit cap part 51a and the outer side housing
  • the circuit holder 51b is formed in a cylindrical shape.
  • the base-side end of the circuit holder 51b is connected to the outer casing 52, and in this embodiment, the circuit holder 51b and the outer casing 52 are integrally molded.
  • a substrate mounting portion 51b1 for mounting the circuit substrate 71 of the drive circuit 70 is formed at the globe side end of the circuit holder portion 51b.
  • the substrate platform 51b1 is configured as a stepped portion.
  • the outer casing 52 is at least a part of the lamp envelope and is arranged so that it can be seen from the outside of the lamp. External member. A region other than the portion covered with the base 80 on the outer peripheral surface of the outer casing 52 is exposed to the outside of the lamp.
  • the outer housing part 52 has an outer part 52a exposed to the outside of the lamp and a screwing part 52b screwed into the base 80.
  • the outer portion 52a is configured by a substantially cylindrical member having a diameter larger than that of the screwing portion 52b.
  • the outer portion 52a is configured such that the diameter gradually decreases toward the base 80 side. That is, the inner peripheral surface and the outer peripheral surface of the outer portion 52a are inclined with respect to the lamp axis. Since the outer surface of the outer portion 52a is exposed to the atmosphere, the heat conducted to the housing 50 is radiated mainly from the outer surface of the outer portion 52a.
  • a first protrusion 52a1 and a second protrusion 52a2 that protrude inward from the inner surface are formed on the inner surface of the outer portion 52a. ing.
  • the four first protrusions 52a1 are formed at equal intervals in the circumferential direction of the inner surface of the outer shell 52a.
  • the second protrusion 52a2 is formed below the two first protrusions 52a1 facing each other out of the first protrusions 52a1.
  • the flange 51a1 of the circuit cap 51a is sandwiched between the first protrusion 52a1 and the second protrusion 52a2, so that the circuit cap 51a is attached and fixed to the outer casing 52.
  • the screwing portion 52b is configured by a substantially cylindrical member having a smaller diameter than the outer portion 52a.
  • a base 80 is screwed into the screwing portion 52b. That is, the outer peripheral surface of the screwing portion 52 b is configured to contact the inner peripheral surface of the base 80.
  • the outer casing 52 is provided with a convex portion 52b1 for alignment with the circuit cap portion 51a.
  • the convex portion 52b1 is configured to be fitted to the concave portion 51a3 of the circuit cap portion 51a.
  • the outer casing 52 (outer section 52 a) configured in this way surrounds the inner casing 51, the metal member 60, the base 42 of the support member 40, and the coupling member 30. It is configured as follows. In addition, a predetermined gap is provided between the inner surface of the outer casing 52 (outer part 52a) and the outer surface of the inner casing 51 (circuit cap part 51a and circuit holder part 51b). Furthermore, in the present embodiment, the outer casing 52 (outer section 52a) and the metal member 60 are not in contact with each other, and as shown in FIG. 4, the inner surface of the outer casing 52 (outer section 52a) A certain gap exists between the outer surface of the metal member 60.
  • the circuit holder portion 51b and the outer housing portion 52 (the outer shell portion 52a and the screwing portion 52b) of the housing 50 are integrally molded. Yes.
  • the metal member 60 is configured in a skirt shape so as to surround the inner casing 51 in the casing 50, and is disposed between the inner casing 51 and the outer casing 52. Thereby, the metal member 60 can be in a non-contact state with the drive circuit 70, and the insulation of the drive circuit 70 can be ensured.
  • the metal member 60 is made of a metal material and functions as a heat sink. Thereby, the heat generated from the LED module 20 and the drive circuit 70 can be efficiently radiated using the metal member 60. Specifically, the heat of the LED module 20 and the drive circuit 70 is propagated to the outer casing 52 through the inner casing 51 and the metal member 60, and is radiated from the outer casing 52 to the outside of the lamp. Can do.
  • the metal material of the metal member 60 for example, Al, Ag, Au, Ni, Rh, Pd, an alloy composed of two or more of these, or an alloy of Cu and Ag can be considered. Since such a metal material has good thermal conductivity, the heat propagated to the metal member 60 can be efficiently propagated.
  • the metal member 60 is in contact with the support member 40.
  • the inner peripheral surface of the metal member 60 and the outer peripheral surface of the base 42 (large diameter portion 42b) of the support member 40 are in surface contact. Since both the metal member 60 and the support member 40 are made of metal, the heat of the LED module 20 that has been conducted to the support member 40 is efficiently conducted to the metal member 60.
  • the metal member 60 is not in contact with the outer casing 52.
  • the metal member 60 and the outer casing 52 have a certain gap (air layer) between the outer peripheral surface of the metal member 60 and the inner peripheral surface of the outer portion 52a of the outer casing 52. Oppositely arranged so as to open. Thereby, as will be described later, it is possible to suppress the occurrence of cracks in the outer casing 52 due to the difference in thermal expansion coefficient between the metal member 60 and the outer casing 52, thereby suppressing a decrease in insulation. can do.
  • the metal member 60 is not in contact with the inner housing portion 51, and the metal member 60 and the inner housing portion 51 are configured such that the inner peripheral surface of the metal member 60 and the inner housing portion 51 (the circuit cap portion 51a, the circuit).
  • the holder portion 51b) is opposed to the outer peripheral surface so as to leave a certain gap (air layer).
  • FIG. 9 is an external perspective view of a metal member in the light bulb shaped lamp according to the embodiment of the present invention.
  • the metal member 60 is a thin, substantially cylindrical member, and in this embodiment, the metal member 60 is configured such that the diameter gradually decreases toward the base 80 side. Therefore, the metal member 60 and the support member 40 can be easily fixed by bringing the metal member 60 and the pedestal 42 (large diameter portion 42b) of the support member 40 into surface contact and fitting the metal member 60 into the pedestal 42. Can do.
  • the metal member 60 has a cutout portion 60a formed so as to cut out a part of the metal member 60 from the base side end toward the globe side.
  • the number of cutouts 60a is the same as the number of first protrusions 52a1 provided on the inner surface of the outer casing 52, and four cutouts 60a are formed in the present embodiment.
  • the notch 60a is formed at a position corresponding to the first protrusion 52a1 and the second protrusion 52a2, as shown in FIG.
  • the metal member 60 it is possible to avoid collision (contact) between the metal member 60 and the first and second protrusions 52a1 and 52a2.
  • FIG.3 and FIG.4 it becomes possible to extend the metal member 60 below the position in which the 1st protrusion part 52a1 and the 2nd protrusion part 52a2 were provided.
  • the metal member 60 is extended to a position facing the circuit holder portion 51b.
  • the surface area of the metal member 60 can be increased. Specifically, the surface area is increased until the outer peripheral surface of the metal member 60 is substantially equal to the entire exposed surface (total outer peripheral surface) of the outer shell 52a.
  • the base side end part of the metal member 60 is extended toward the base side in this way, the base side end part of the metal member 60 and the outer housing part 52 and the circuit holder part 51b are in a non-contact state. It is said.
  • the base side end of the metal member 60 is a gap (annular groove) between the outer portion 52a of the outer casing portion 52 and the circuit holder portion 51b of the inner casing portion 51, as shown in FIG. It is stored in.
  • the metal member 60 is not only in contact with the outer casing portion 52 (outer portion 52a, screwed portion 52b) in the casing 50, but also within the inner casing portion 51 (circuit cap).
  • the part 51a and the circuit holder part 51b) are not in contact either. That is, the metal member 60 is disposed in a non-contact state in both the inner housing part 51 and the outer housing part 52. Thereby, the insulation as the whole housing
  • the drive circuit (circuit unit) 70 is a lighting circuit (power supply circuit) for lighting (emitting) the LEDs 22 of the LED module 20, and supplies predetermined power to the LED module 20.
  • the drive circuit 70 converts AC power supplied from the base 80 via the pair of lead wires 70c and 70d into DC power, and the DC power is supplied to the LED module 20 via the pair of lead wires 70a and 70b. Supply.
  • the drive circuit 70 includes a circuit board 71 and a plurality of circuit elements (electronic components) 72 mounted on the circuit board 71.
  • the circuit board 71 is a printed board on which metal wiring is patterned, and electrically connects a plurality of circuit elements 72 mounted on the circuit board 71.
  • the circuit board 71 is arranged in a posture in which the main surface is orthogonal to the lamp axis.
  • the circuit board 71 is placed on a board placement part 51 b 1 provided in the circuit holder part 51 b of the inner case part 51, and the board placement part 51 b 1 and the outer case part 52 (outer casing part 52) Is sandwiched between the second protrusion 52a2 provided in the portion 52a).
  • the outer peripheral end of the circuit board 71 is fitted between the board mounting portion 51b1 and the second protrusion 52a2.
  • the drive circuit 70 is held in the housing 50.
  • the circuit element 72 is, for example, various capacitors, resistor elements, rectifier circuit elements, coil elements, choke coils (choke transformers), noise filters, diodes, or integrated circuit elements.
  • the drive circuit 70 configured as described above is covered with the inner casing portion 51 of the casing 50, and thus is in a non-contact state with the metal member 60. Thereby, the insulation of the drive circuit 70 is ensured.
  • the drive circuit 70 is not limited to a smoothing circuit, and a dimmer circuit, a booster circuit, and the like can be appropriately selected and combined.
  • Each of the lead wires 70a to 70d is an alloy copper lead wire, and is composed of a core wire made of alloy copper and an insulating resin film covering the core wire.
  • the pair of lead wires 70 a and 70 b are electric wires for supplying DC power for lighting the LED module 20 from the drive circuit 70 to the LED module 20.
  • the drive circuit 70 and the LED module 20 are electrically connected by a pair of lead wires 70a and 70b.
  • one end portion (core wire) of each of the lead wires 70a and 70b is electrically connected to the power output portion (metal wiring) of the circuit board 71 by solder or the like, and the other end of each other.
  • the end portion (core wire) is electrically connected to the power input portion (electrode terminal) of the LED module 20 by solder or the like.
  • the pair of lead wires 70 c and 70 d are electric wires for supplying AC power from the base 80 to the drive circuit 70.
  • the drive circuit 70 and the base 80 are electrically connected by a pair of lead wires 70c and 70d.
  • one end portion (core wire) of each of the lead wires 70c and 70d is electrically connected to the base 80 (shell portion or eyelet portion), and each other end portion (core wire) is
  • the power input part (metal wiring) of the circuit board 71 is electrically connected by solder or the like.
  • the base 80 is a power receiving unit that receives power for causing the LEDs 22 of the LED module 20 to emit light from outside the lamp.
  • the base 80 is attached to a socket of a lighting fixture, for example, and when the light bulb shaped lamp 1 is turned on, the base 80 receives electric power from the socket of the lighting fixture.
  • the base 80 is supplied with AC power from a commercial power supply (AC 100 V).
  • the base 80 in the present embodiment receives AC power through two contact points, and the power received by the base 80 is input to the power input unit of the drive circuit 70 via a pair of lead wires 70c and 70b.
  • the base 80 has a metal bottomed cylindrical shape, and includes a shell portion whose outer peripheral surface is a male screw and an eyelet portion attached to the shell portion via an insulating portion. Further, a screwing portion for screwing into the socket of the lighting device is formed on the outer peripheral surface of the base 80, and a screwing portion 52 b of the outer housing portion 52 is screwed on the inner peripheral surface of the base 80. A threaded portion for mating is formed.
  • the type of the base 80 is not particularly limited, but in this embodiment, a screw-type Edison type (E type) base is used.
  • E type screw-type Edison type
  • the base 80 an E26 type, an E17 type, an E16 type, or the like can be given.
  • the light bulb shaped lamp 1 according to the present embodiment is configured.
  • the bulb-type lamp 1 according to the present embodiment uses a globe having the same shape as a globe (bulb) used for an incandescent bulb, and is attached to the support column 41 extending inward of the globe 10.
  • An LED module 20 is provided. Thereby, a light distribution characteristic with a wide light distribution angle can be realized, and a light distribution characteristic similar to that of an incandescent lamp can be obtained.
  • FIG. 10 is an enlarged view of a main part of the light bulb shaped lamp according to the embodiment of the present invention (enlarged view of a region surrounded by a broken line A in FIG. 4).
  • the metal member 60 is disposed between the inner housing portion 51 that houses the drive circuit 70 and the outer housing portion 52 whose outer surface is exposed to the outside of the lamp.
  • the heat generated in the LED module 20 and the drive circuit 70 can be conducted to the metal member 60 and radiated to the atmosphere via the outer casing 52 facing the metal member 60. Therefore, excellent heat dissipation can be obtained.
  • the drive circuit 70 is accommodated in the inner casing 51, and the outer member as a lamp is constituted by the outer casing 52 having an insulating property. As a result, the insulating property of the entire lamp can be ensured.
  • a gap exists between the outer peripheral surface of the metal member 60 and the inner peripheral surface of the outer portion 52a of the outer casing 52 so that the metal member 60 and the outer A housing 52 is disposed. That is, the metal member 60 and the outer casing 52 are configured not to contact each other. As a result, it is possible to suppress a decrease in insulation due to the occurrence of cracks in the outer casing 52 due to the thermal expansion coefficient between the metal member 60 made of metal and the outer casing 52 made of resin.
  • the metal member 60 and the outer casing 52 are thermally expanded (volume expansion) by the heat from the drive circuit 70 and the LED module 20, but the resin outer casing 52 is more than the metal member 60. Since the thermal expansion coefficient (linear expansion coefficient) is several times higher, when the metal member 60 and the outer casing 52 are in surface contact, the metal member 60 is more thermally expanded than the outer casing 52. As a result, a stress distortion may occur in the resin-made outer casing 52 due to this difference in thermal expansion coefficient, and cracks may occur. If a crack or the like occurs in the outer casing 52, the insulating property is lowered.
  • the metal member 60 and the outer housing portion 52 are Even if the heat expands, the difference in thermal expansion coefficient between the metal member 60 and the outer casing 52 can be absorbed by the gap. Thereby, it can suppress that a crack etc. generate
  • FIG. As described above, by providing a gap between the outer peripheral surface of the metal member 60 and the inner peripheral surface of the outer casing portion 52, it is possible to improve insulation while maintaining high thermal conductivity.
  • the gap between the outer peripheral surface of the metal member 60 and the inner peripheral surface of the outer housing portion 52 is at least in consideration of the temperature during lamp lighting and the thermal expansion coefficients of the metal member 60 and the outer housing portion 52. It is 50 ⁇ m or more, preferably 100 ⁇ m or more.
  • a gap (air layer) is also provided between the inner peripheral surface of the metal member 60 and the outer peripheral surface of the inner housing portion 51 (circuit cap portion 51a, circuit holder portion 51b). That is, the metal member 60 and the inner housing part 51 are configured not to contact each other. As a result, it is possible to suppress the occurrence of a crack in the inner casing 51 due to the difference in thermal expansion coefficient between the metal member 60 made of metal and the inner casing 51 made of resin, thereby reducing the insulation. That is, when the metal member 60 and the inner casing 51 having different coefficients of thermal expansion are in surface contact, the metal member is heated by the heat from the drive circuit 70 and the LED module 20 when the lamp is lit, as in the outer casing 52.
  • the 60 and the inner housing part 51 may thermally expand (volume expansion), and a stress strain may occur in the resin inner housing part 51 due to the difference in coefficient of thermal expansion, thereby causing a crack or the like.
  • a crack or the like occurs in the inner casing portion 51 that covers the drive circuit 70 closest to the insulation circuit, the insulation performance is greatly reduced.
  • the metal member 60 and the inner housing part 51 are Even if the heat expands, the difference in thermal expansion coefficient between the metal member 60 and the inner housing 51 can be absorbed by the gap. Thereby, it can suppress that a crack etc. generate
  • FIG. As described above, by providing the gap between the inner peripheral surface of the metal member 60 and the outer peripheral surface of the inner housing portion 51, it is possible to improve insulation while maintaining high thermal conductivity.
  • cracks may occur in the inner casing 51 not only when it thermally expands but also when it shrinks.
  • the inner peripheral surface of the metal member 60 and the inner casing 51 (circuit By providing a gap (air layer) also between the outer peripheral surfaces of the cap part 51a and the circuit holder part 51b), it is possible to suppress the occurrence of cracks during thermal contraction.
  • the outer peripheral surface of the base 42 (large diameter portion 42 b) of the support member 40 is in surface contact with the inner peripheral surface of the metal member 60.
  • the heat of LED module 20 can be efficiently conducted from metal support member 40 (base 42) to metal member 60.
  • the lower end portion (base end portion) of the metal member 60 extends to the lower side (base side) than the lower end portion of the support member 40 (base 42).
  • the notch portion 60a in the metal member 60 the lower end portion of the metal member 60 is moved to the position of the lower end portion of the outer portion 52a exposed to the outside air and the position of the circuit holder portion 51b surrounding the drive circuit 70. It is extended.
  • the surface area of the metal member 60 can be increased, the heat generated in the drive circuit 70 can be efficiently conducted to the metal member 60 and the heat conduction from the metal member 60 to the outer housing portion 52 is achieved.
  • Property can be further improved. Therefore, the heat dissipation of the light bulb shaped lamp 1 can be further improved.
  • FIG. 11 is a diagram for explaining a method of assembling the light bulb shaped lamp according to the embodiment of the present invention.
  • the drive circuit 70 is not shown.
  • the structure body in which the metal member 60 is fitted into the support member 40 to which the circuit cap portion 51a is screwed is inserted into the outer casing portion 52 in which the drive circuit 70 (not shown) is fitted. Until the flange 51a1 of the circuit cap portion 51a is positioned between the first protrusion 52a1 and the second protrusion 52a2 of the outer portion 52a (outer casing 52), the structure is placed on the outer casing. Push into 52.
  • the lead wires 70a and 70b (not shown) are soldered to the LED module 20, and fluid silicon is poured into the gap between the outer peripheral surface of the base 42 and the outer portion 52a, and the globe 10 (not shown) is inserted there. After being inserted, it is cured in an oven at 100 ° C. Note that the silicon cured at this time becomes the coupling member 30.
  • the base 80 is screwed into the screwing portion 52b of the outer casing 52, and the base and the lead wires 70c and 70d (not shown) are connected.
  • the light bulb shaped lamp 1 according to the present embodiment can be assembled.
  • the support member 40, the housing 50, and the metal member 60 can be combined by simply fitting each constituent member without using an adhesive.
  • the inner casing 51 and the outer casing 52 are disposed between the inner casing 51 and the outer casing 52 that house the drive circuit 70.
  • the metal member 60 is disposed with a predetermined interval. Therefore, the heat generated in the LED module 20 and the drive circuit 70 can be efficiently radiated, and insulation can be ensured for the entire lamp. Therefore, it is possible to realize a light bulb shaped lamp having excellent heat dissipation while ensuring insulation. Therefore, it is possible to provide a light bulb shaped lamp that is excellent in electrical safety because it has an excellent withstand voltage characteristic and can suppress a decrease in luminous efficiency and lifetime of the LED due to a temperature rise.
  • the housing space for housing the drive circuit 70 must be reduced.
  • a glove having the same shape as the incandescent light bulb is used, and the housing space for housing the drive circuit 70 must be reduced.
  • it is difficult to use a lot of LED chips in order to increase the output of a bulb-type LED lamp using a globe having the same shape as an incandescent bulb and this can meet the needs for higher output. could not.
  • the lamp envelope is used as the insulating outer casing 52 while the drive circuit 70 is housed in the insulating inner casing 51. Further, a structure in which the metal member 60 is disposed between the inner casing 51 and the outer casing 52 is employed.
  • both insulation and high heat dissipation can be achieved. That is, an excellent withstand voltage characteristic and an excellent heat dissipation characteristic can be obtained even with a high output type light bulb shaped lamp using a globe having the same shape as an incandescent light bulb.
  • the metal member 60 is not in contact with either the inner housing part 51 or the outer housing part 52, but is not limited thereto.
  • a part of the outer casing 52 and a part of the metal member 60 may be brought into contact with each other.
  • FIG. 12 is an enlarged view of a main part of a light bulb shaped lamp according to a modification of the embodiment of the present invention.
  • a part of the outer casing 52 is deformed into a concave shape by caulking several places in the circumferential direction of the outer casing 52 (for example, four places at intervals of 90 °).
  • a convex portion 52a3 protruding toward the metal member 60 side is formed. That is, the convex portion 52 a 3 is formed so that a part of the outer casing portion 52 comes into contact with the outer surface of the metal member 60.
  • the thermal conductivity from the metal member 60 to the outer casing 52 can be improved as compared with the above-described embodiment. Can be improved.
  • FIG. 13 is a schematic cross-sectional view of the illumination device according to the embodiment of the present invention.
  • a lighting device 2 As shown in FIG. 13, a lighting device 2 according to an embodiment of the present invention is used, for example, by being mounted on an indoor ceiling, and includes a light bulb shaped lamp 1 according to the above embodiment and a lighting fixture 3. Prepare.
  • the lighting fixture 3 turns off and turns on the light bulb shaped lamp 1 and includes a fixture main body 4 attached to the ceiling and a lamp cover 5 that covers the light bulb shaped lamp 1.
  • the appliance body 4 has a socket 4a.
  • the base 80 of the light bulb shaped lamp 1 is screwed into the socket 4a. Electric power is supplied to the light bulb shaped lamp 1 through the socket 4a.
  • the light bulb shaped lamp and the lighting device according to the present invention have been described based on the embodiments and the modifications thereof, but the present invention is not limited to these embodiments and modifications.
  • the screwing part 52b is a part of the outer casing part 52, but may be a part of the inner casing part 51. That is, the screwing part 52b may be regarded as a part of a circuit case that houses the drive circuit 70, and more specifically, the screwing part 52b may be a part of the circuit holder part 51b.
  • the metal member 60 does not have a portion cut from the globe side edge toward the base side edge, but is not limited thereto.
  • the cross-sectional shape of the metal member 60 may be a C-shape, and the metal member 60 may be formed with a portion cut from the globe side edge toward the base side edge.
  • the bulb-type LED lamp using the globe 10 having the same shape as the incandescent bulb is used.
  • the present invention is not limited to this. That is, in the present embodiment, the size of the globe 10 is larger than the size of the housing 50, but the present invention is also applicable to a light bulb shaped lamp in which the size of the globe 10 is smaller than the size of the housing 50. Can do.
  • a translucent substrate is used as the base 21 of the LED module 20, but the present invention is not limited thereto.
  • the base 21 an opaque substrate having a very low total transmittance or a total transmittance of almost zero may be used.
  • an opaque substrate an opaque ceramic substrate, a metal base substrate, or the like can be used.
  • two bases 21 on which the LEDs 22 and the sealing member 23 are formed only on the front side are used, and the back side surfaces of the two bases 21 are bonded together.
  • one LED module 20 may be configured. Or you may comprise the one LED module 20 by forming LED22 and the sealing member 23 on both surfaces of one translucent board
  • the LED module 20 is configured to emit white light by the blue LED and the yellow phosphor, but is not limited thereto.
  • a phosphor-containing resin containing a red phosphor and a green phosphor may be used so that white light is emitted by combining this with a blue LED.
  • the LED 22 may be an LED that emits a color other than blue.
  • a combination of phosphor particles that emit light in three primary colors (red, green, and blue) can be used as the phosphor particles.
  • a wavelength conversion material other than the phosphor particles may be used.
  • the wavelength conversion material absorbs light of a certain wavelength such as a semiconductor, a metal complex, an organic dye, or a pigment, and has a wavelength different from the absorbed light.
  • a material containing a substance that emits light may be used.
  • the LED is exemplified as the light emitting element.
  • a semiconductor light emitting element such as a semiconductor laser
  • an EL element such as an organic EL (Electro Luminescence) or an inorganic EL, or other solid state light emitting element. May be used.
  • the LED module 20 has a COB type configuration in which the LED chip is directly mounted on the base 21, but is not limited thereto.
  • a package-type LED element in which an LED chip is mounted in a resin-molded container (cavity) and a phosphor-containing resin is enclosed in the container, that is, a surface-mount type (SMD) LED element.
  • SMD surface-mount type
  • an LED module configured by mounting a plurality of SMD type LED elements on a substrate may be used.
  • the present invention is useful as a light bulb shaped lamp that replaces a conventional incandescent light bulb and the like, and can be widely used in lighting devices and the like.
  • the light bulb shaped lamp according to the present invention is suitable for a high output type light bulb shaped lamp because both insulation and high heat dissipation can be achieved.

Abstract

L'invention concerne une lampe en forme d'ampoule (1) qui est pourvu : d'un module de DEL (20) ; d'un globe (10) qui recouvre le module de DEL (20) ; d'un circuit d'attaque (70) pour amener le module de DEL (20) à émettre de la lumière ; d'un boîtier isolant (50) dans lequel le circuit d'attaque (70) est agencé. Le boîtier (50) comporte une partie de boîtier interne (51), qui est agencée de façon à entourer le circuit d'attaque (70), et une partie de boîtier externe (52), qui est agencée de façon à entourer la partie de boîtier interne (51) et de façon à former au moins une partie d'une enveloppe. Un élément métallique (60) qui entoure la partie de boîtier interne (51) est agencé entre la partie de boîtier interne (51) et la partie de boîtier externe (52).
PCT/JP2013/001518 2012-07-11 2013-03-08 Lampe en forme d'ampoule et dispositif d'éclairage WO2014010146A1 (fr)

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JP2012-155873 2012-07-11
JP2012155873 2012-07-11

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018046031A (ja) * 2017-12-27 2018-03-22 東芝ライテック株式会社 ランプ装置および照明装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3168194U (ja) * 2011-03-22 2011-06-02 麗鴻科技股▲ふん▼有限公司 Ｌｅｄダウンライト
JP2011165438A (ja) * 2010-02-08 2011-08-25 Sharp Corp 照明装置
JP2011228184A (ja) * 2010-04-21 2011-11-10 Panasonic Corp ランプ及び照明装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011165438A (ja) * 2010-02-08 2011-08-25 Sharp Corp 照明装置
JP2011228184A (ja) * 2010-04-21 2011-11-10 Panasonic Corp ランプ及び照明装置
JP3168194U (ja) * 2011-03-22 2011-06-02 麗鴻科技股▲ふん▼有限公司 Ｌｅｄダウンライト

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018046031A (ja) * 2017-12-27 2018-03-22 東芝ライテック株式会社 ランプ装置および照明装置

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