WO2013153726A1 - Lampe en forme d'ampoule et dispositif d'éclairage - Google Patents

Lampe en forme d'ampoule et dispositif d'éclairage Download PDF

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Publication number
WO2013153726A1
WO2013153726A1 PCT/JP2013/001041 JP2013001041W WO2013153726A1 WO 2013153726 A1 WO2013153726 A1 WO 2013153726A1 JP 2013001041 W JP2013001041 W JP 2013001041W WO 2013153726 A1 WO2013153726 A1 WO 2013153726A1
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WO
WIPO (PCT)
Prior art keywords
light
light emitting
shaped lamp
base
support
Prior art date
Application number
PCT/JP2013/001041
Other languages
English (en)
Japanese (ja)
Inventor
直紀 田上
利雄 森
次弘 松田
亨 岡崎
裕美 田中
考志 大村
健太 渡邉
康輔 菅原
Original Assignee
パナソニック株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パナソニック株式会社 filed Critical パナソニック株式会社
Priority to JP2013528166A priority Critical patent/JP5420118B1/ja
Priority to CN201390000394.XU priority patent/CN204201514U/zh
Publication of WO2013153726A1 publication Critical patent/WO2013153726A1/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/494—Connecting portions
    • H01L2224/4945—Wire connectors having connecting portions of different types on the semiconductor or solid-state body, e.g. regular and reverse stitches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Definitions

  • the present invention relates to a light bulb-shaped lamp and a lighting device, for example, a light bulb-shaped LED lamp using a light emitting diode (LED) and a lighting device using the same.
  • a light bulb-shaped lamp for example, a light bulb-shaped LED lamp using a light emitting diode (LED) and a lighting device using the same.
  • LED light emitting diode
  • LEDs Since semiconductor light emitting devices such as LEDs are small in size, high in efficiency, and have a long life, they are expected as new light sources in various lamps such as fluorescent lamps and incandescent lamps conventionally known, and lamps using LEDs (LED lamps Research and development is underway.
  • a bulb-shaped LED lamp replacing a bulb-shaped fluorescent lamp provided with an arc tube in a glass bulb or an incandescent bulb using a filament coil, or a straight-tube type fluorescent lamp Straight tube type LED lamp (straight tube type LED lamp) etc.
  • Patent Document 1 discloses a conventional bulb-shaped LED lamp.
  • FIG. 13 is a cross-sectional view of the conventional bulb-shaped LED lamp disclosed in Patent Document 1. As shown in FIG.
  • the conventional light bulb-shaped LED lamp 100 includes a translucent cover 110 which is a hemispherical glove, a base 130 and an outer shell member 190 which is a metal casing.
  • the outer shell member 190 has a peripheral portion 191 exposed to the outside, a disk-like light source attachment portion 192 integrally formed on the peripheral portion 191, and a recess 193 formed on the inner side of the peripheral portion 191.
  • an LED module 120 composed of a plurality of LEDs mounted on a base is attached.
  • An insulating member 160 formed along the inner surface shape is provided on the inner surface of the recess 193, and a lighting circuit 180 for lighting the LED is accommodated in the insulating member 160.
  • the outer shell member 190 metal housing in which the light source mounting portion 192 and the peripheral portion 191 are integrally formed
  • this outer shell member 190 functions as a heat sink for dissipating the heat generated by the LED to the outside.
  • the heat generated by the LED can be efficiently thermally conducted from the light source attachment portion 192 toward the peripheral portion 191.
  • the temperature rise of the LED is suppressed, it is possible to suppress the decrease of the light output of the LED.
  • the LED module 120 is provided on the disk-shaped light source attachment portion 192, the light toward the base 130 is blocked by the outer shell member 190. Therefore, in the conventional bulb-shaped LED lamp 100, the spread of light is different from that of the incandescent lamp. That is, in the structure of the conventional bulb-shaped LED lamp 100, it is difficult to obtain light distribution characteristics similar to those of incandescent light bulbs, and it is difficult to realize a wide light distribution angle.
  • the LED mounting substrate of the LED module 220 is formed using the globe 210 having the same shape as the globe (bulb) of the incandescent bulb.
  • the amount of light of the LED module 220 directed to the base can be increased as compared with the conventional light bulb-shaped LED lamp 100 shown in FIG. 13, so that the light distribution angle can be expanded.
  • the light bulb-shaped LED lamp 200 shown in FIG. 14 in order to dissipate the heat generated from the LED module 220, a metal support is used as the support 240 for holding the LED module 220. For this reason, the light which permeate
  • the present invention has been made to solve such a problem, and it is an object of the present invention to provide a bulb-shaped lamp and a lighting device capable of improving the light extraction efficiency toward the base of the LED module. .
  • one aspect of the light bulb shaped lamp according to the present invention is a light bulb shaped lamp having a glove and a cap, and is made of metal provided so as to extend inward of the glove. And a light emitting module disposed in the globe and fixed to the support, the light emitting module having a light transmitting base and a light emitting element mounted on the base.
  • the support has a fixed surface fixed to the base of the light emitting module, and the light emitting module and the support are arranged such that the fixed surface and the light emitting element do not overlap when viewed in plan. It is characterized by
  • the light emitting module further includes a sealing member for sealing the light emitting element, and the sealing member converts the wavelength of light emitted by the light emitting element.
  • a resin containing the wavelength conversion material, and the sealing member is formed so as not to overlap the fixing surface when viewed in plan.
  • the light emitting module is elongated when viewed in a plan view, and the support is provided between the main shaft and the main shaft and the light emitting module.
  • the length in the lateral direction of the light emitting module may be shorter than the length in the lateral direction of the light emitting module of the main spindle.
  • a side surface of the fixing portion is connected to the light emitting module, and a straight surface parallel to an axis of the support and a lower portion of the straight surface It may be configured to include a curved surface that curves toward the side away from the axis of the support.
  • the side surface of the fixing portion may be configured to include an inclined surface which inclines away from the axis of the support towards the base.
  • the base can be a ceramic substrate made of Al 2 O 3 , AlN or MgO.
  • the support can be made of aluminum.
  • a lead wire for supplying power to the light emitting element, and an insulating case accommodating a lighting circuit for lighting the light emitting element are provided. can do.
  • one aspect of a lighting device according to the present invention is a lighting device including any one of the above-described bulb-shaped lamps.
  • the present invention it is possible to realize a light bulb shaped lamp and a lighting device capable of improving the light extraction efficiency to the base of the light emitting module.
  • FIG. 1 is a side view of a light bulb shaped lamp according to an embodiment of the present invention.
  • FIG. 2 is an exploded perspective view of the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 3 is a cross-sectional view of a light bulb shaped lamp according to an embodiment of the present invention.
  • Fig.4 (a) is a top view of the LED module in the lightbulb-shaped lamp which concerns on embodiment of this invention, FIG.4 (b) was cut
  • FIG. 5 is an enlarged cross-sectional view of the periphery of the LED chip in the LED module of the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 5 is an enlarged cross-sectional view of the periphery of the LED chip in the LED module of the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 6 is a perspective view showing a configuration of a support and a support in the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 7 shows the configuration of a support and a support in a light bulb shaped lamp according to an embodiment of the present invention, wherein (a) is a top view, (b) is a front view, and (c) is a side view.
  • FIG. 8 is a view for explaining the connection relationship between the LED module and the support in the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 9 is a view showing a lighted state of the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 10 is a view for explaining the relationship between the length of the fixed portion and the luminous flux in the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 11A is a view showing a configuration of an LED module and a support in a light bulb shaped lamp according to Modification 1 of the present invention.
  • FIG. 11B is a view showing the configuration of the LED module and the support in the light bulb shaped lamp according to the second modification of the present invention.
  • FIG. 11C is a view showing the configuration of the LED module and the support in the light bulb shaped lamp according to the third modification of the present invention.
  • FIG. 11D is a view showing the configuration of the LED module and the support in the light bulb shaped lamp according to the fourth modification of the present invention.
  • FIG. 11A is a view showing a configuration of an LED module and a support in a light bulb shaped lamp according to Modification 1 of the present invention.
  • FIG. 11B is a view showing the configuration of the LED module and the support in the light bulb
  • FIG. 12 is a schematic cross-sectional view of a lighting device according to the present invention.
  • FIG. 13 is a cross-sectional view of the conventional bulb-shaped LED lamp disclosed in Patent Document 1.
  • FIG. 14 is a cross-sectional view showing a configuration of an example of a bulb-type LED lamp.
  • FIG. 1 is a side view of a light bulb shaped lamp according to an embodiment of the present invention.
  • FIG. 2 is an exploded perspective view of the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 3 is a cross-sectional view of the light bulb shaped lamp according to the embodiment of the present invention.
  • the light bulb shaped lamp 1 is a light bulb shaped LED lamp which is a substitute for a light bulb shaped fluorescent lamp or an incandescent bulb, and is a translucent globe 10 And an LED module 20 which is a light source, a base 30 for receiving power, and a metal support column 40. Furthermore, the light bulb shaped lamp 1 according to the present embodiment includes a support 50, a resin case 60, a lead wire 70, and a lighting circuit 80. In the light bulb-shaped lamp 1 in the present embodiment, an envelope is configured by the glove 10, the resin case 60 (first case portion 61), and the base 30.
  • the globe 10 accommodates the LED module 20 and transmits the light from the LED module 20 to the outside of the lamp.
  • the globe 10 is a glass bulb (clear bulb) made of silica glass that is transparent to visible light. Therefore, the LED module 20 housed in the glove 10 can be viewed from the outside of the glove 10.
  • the shape of the glove 10 is a shape in which one end is closed spherically and the other end has an opening 11.
  • the shape of the glove 10 is such that a part of the hollow sphere is narrowed while extending away from the center of the sphere, and the opening 11 is formed at a position away from the center of the sphere ing.
  • a glass bulb having the same shape as a general incandescent bulb can be used.
  • a glass bulb such as A-shaped, G-shaped or E-shaped can be used as the glove 10.
  • the globe 10 does not necessarily have to be transparent to visible light, and the globe 10 may have a light diffusing function.
  • a milky white light diffusion film may be formed by applying a resin containing a light diffusion material such as silica or calcium carbonate, a white pigment, or the like on the entire inner surface or outer surface of the glove 10.
  • the glove 10 does not have to be made of silica glass.
  • a glove 10 made of a resin material such as acrylic may be used.
  • the LED module 20 is a light emitting module having a light emitting element, and is housed in the glove 10. It is preferable that the LED module 20 be disposed at a central position of the spherical shape formed by the globe 10 (for example, inside the large diameter of the large diameter of the globe 10). Thus, by arranging the LED module 20 at the center position of the globe 10, the light distribution characteristic of the light bulb shaped lamp 1 becomes a light distribution characteristic similar to a general incandescent light bulb using a conventional filament coil.
  • the LED module 20 is held in the hollow of the globe 10 by the support column 40, and emits light when power is supplied from the lead wire 70.
  • FIG. 4 is a plan view of the LED module in the light bulb shaped lamp according to the embodiment of the present invention, and (b) of FIG. 4 is cut along line AA 'of (a) It is a sectional view of the LED module.
  • the LED module 20 has the translucent base 21, LED chip 22, the sealing member 23, and the metal wiring 24.
  • the LED module 20 in the present embodiment has a COB (Chip On Board) structure in which a bare chip is mounted directly on the base 21.
  • COB Chip On Board
  • the base 21 is an LED mounting substrate for mounting the LED chip 22 and is made of a member having a light transmitting property with respect to visible light.
  • the base 21 is preferably made of a member having a high transmittance. Thereby, the light of LED chip 22 permeate
  • a ceramic substrate made of alumina (Al 2 O 3 ) having a transmittance of 90% or more is used as the base 21.
  • the ceramic substrate which consists of AlN or MgO can also be used.
  • a rectangular substrate having a long planar view (when viewed from the top of the glove 10) is used. Thus, the shape of the LED module 20 in plan view is elongated.
  • through holes 21 a and 21 b are provided in the base 21.
  • the through hole 21 a is provided to fit the base 21 and the support column 40.
  • the through hole 21 a is formed in a rectangular shape in plan view at a position shifted from the center of the base 21 in the longitudinal direction.
  • two through holes 21 b are provided in order to make an electrical connection with the two lead wires 70, and in the present embodiment, they are provided at both end portions in the longitudinal direction of the base 21.
  • the LED chip 22 is an example of a semiconductor light emitting element, and is a bare chip that emits monochromatic visible light. In the present embodiment, a blue LED chip that emits blue light when energized is used. In the present embodiment, the LED chips 22 are mounted only on one surface (front surface) of the base 21, and a plurality of (for example, 12) LED chips 22 are linearly arranged in a row. The columns are arranged.
  • the number of LED chips 22 may be appropriately changed according to the application of the light bulb shaped lamp.
  • one LED chip 22 may be mounted on the base 21.
  • the plurality of LED chips 22 are mounted on the base 21 in four rows, but may be one row or a plurality of rows other than four rows.
  • the present invention is suitable for a high power LED module having a large number of LED chips 22.
  • FIG. 5 is an enlarged cross-sectional view of the periphery of the LED chip in the LED module of the light bulb shaped lamp according to the embodiment of the present invention.
  • the LED chip 22 has a sapphire substrate 22a and a plurality of nitride semiconductor layers 22b stacked on the sapphire substrate 22a and having different compositions.
  • a cathode electrode 22c and an anode electrode 22d are provided at the end of the upper surface of the nitride semiconductor layer 22b.
  • Wire bond parts 22e and 22f are provided on the cathode electrode 22c and the anode electrode 22d, respectively.
  • each LED chip 22 is mounted on the base 21 by a translucent chip bonding material 26 so that the surface on the sapphire substrate 22 a side faces the mounting surface of the base 21.
  • a translucent chip bonding material 26 a silicone resin containing a filler made of metal oxide can be used.
  • the sealing member 23 is formed in a straight line so as to collectively seal a row of a plurality of LED chips 22. In the present embodiment, since the LED chips 22 are mounted in four rows, four sealing members 23 are formed.
  • the sealing member 23 also includes a phosphor that is a light wavelength conversion material, and also functions as a wavelength conversion layer that performs wavelength conversion of light from the LED chip 22.
  • a phosphor-containing resin in which predetermined phosphor particles (not shown) and a light diffusing material (not shown) are dispersed in silicone resin can be used as the sealing member 23, a phosphor-containing resin in which predetermined phosphor particles (not shown) and a light diffusing material (not shown) are dispersed in silicone resin can be used.
  • the LED chip 22 is a blue LED chip that emits blue light
  • YAG-based yellow phosphor particles can be used to obtain white light.
  • part of the blue light emitted from the LED chip 22 is wavelength-converted to yellow light by the yellow phosphor particles contained in the sealing member 23.
  • the blue light not absorbed by the yellow phosphor particles and the yellow light whose wavelength is converted by the yellow phosphor particles are diffused and mixed in the sealing member 23 so that the white light from the sealing member 23 It will be emitted.
  • particles such as silica are used.
  • the white light emitted from the sealing member 23 is transmitted through the inside of the base 21, and also from the back surface of the base 21. It is emitted.
  • the sealing member 23 configured in this manner can be formed, for example, by applying and curing an uncured paste-like sealing member 23 containing a wavelength conversion material by a dispenser.
  • the sealing member 23 is not necessarily formed of a silicone resin, and may be formed of an inorganic material such as a low melting point glass or a sol-gel glass besides an organic material such as a fluorine resin.
  • an inorganic material such as a low melting point glass or a sol-gel glass
  • organic material such as a fluorine resin.
  • phosphor particles and glass in order to convert the wavelength of light directed to the back surface side of the base 21, it is possible to use phosphor particles and glass as a second wavelength conversion material between the LED chip 22 and the base 21 or on the back surface of the base 21.
  • You may further form the sintered compact film (phosphor film) which consists of an inorganic binder (binder).
  • phosphor film second wavelength conversion material
  • the metal wiring 24 is a wiring made of metal such as Ag patterned on the LED mounting surface (surface), and supplies the power supplied from the lead wire 70 to the LED module 20 to each of the LED chips 22.
  • Each LED chip 22 is electrically connected to the metal wiring 24 via a gold wire 25.
  • the metal wiring 24 formed around the through hole 21 b serves as a power feeding portion.
  • the tip portions of the two lead wires 70 are inserted into the through holes 21 b and electrically and physically connected to the metal wires 24 by solder.
  • the base 30 is a power receiving unit that receives power for causing the LEDs of the LED module 20 to emit light from the outside, and is attached to, for example, a socket of a lighting fixture.
  • the base 30 receives power from the light fixture socket.
  • the base 30 in the present embodiment receives alternating current power by two contacts, and the power received by the base 30 is input to the power input unit of the lighting circuit 80 through the lead wire.
  • the base 30 is E-shaped, and a screwing portion for screwing with a socket of the lighting device is formed on the outer peripheral surface thereof. Further, a screwing portion for screwing the resin case 60 is formed on the inner circumferential surface of the die 30.
  • the base 30 is a bottomed cylindrical body made of metal.
  • the type of the base 30 is not particularly limited.
  • a screw-in type Edison type (E type) base can be used, and examples include an E26 type or an E17 type.
  • the support column 40 is a metal stem provided so as to extend from the vicinity of the opening 11 of the glove 10 toward the inside of the glove 10.
  • the support 40 functions as a holding member for holding the LED module 20, one end of the support 40 is connected to the LED module 20, and the other end of the support 40 is connected to the support 50.
  • the support column 40 is made of a metal material, and also functions as a heat dissipation member for releasing the heat generated by the LED module 20.
  • the support columns 40 are made of aluminum having a thermal conductivity of 237 [W / m ⁇ K]. As described above, since the columns 40 are made of a metal material, the heat of the LED module 20 is efficiently conducted to the columns 40 through the base 21. Thereby, the heat of the LED module 20 can be released to the base 30 side. As a result, it is possible to suppress the decrease in the light emission efficiency and the decrease in the life of the LED chip 22 due to the temperature rise. In addition, the detailed structure of the support
  • the support base (support plate) 50 is a support member that supports the support column 40, and is connected to the open end of the opening 11 of the glove 10, as shown in FIG.
  • the support 50 is configured to close the opening 11 of the glove 10.
  • the support 50 is fixed to the resin case 60.
  • the support base 50 is made of a metal material, and in the present embodiment, like the columns 40, it is made of aluminum. Thus, the heat of the LED module 20 thermally conducted to the support column 40 is efficiently conducted to the support 50. As a result, it is possible to suppress the decrease in the light emission efficiency and the decrease in the life of the LED chip 22 due to the temperature rise.
  • the support 50 is formed of a disk-like member having a stepped portion.
  • the open end of the opening 11 of the glove 10 is in contact with the step portion, whereby the opening 11 of the glove 10 is closed.
  • the support 50, the resin case 60, and the open end of the opening 11 of the glove 10 are fixed by an adhesive.
  • the resin case 60 is an insulating case (circuit holder) for insulating the support column 40 and the base 30, and for housing and holding the lighting circuit 80. As shown in FIGS. 2 and 3, the resin case 60 includes a large diameter cylindrical first case portion 61 and a small diameter cylindrical second case portion 62. Since the outer surface of the first case portion 61 is exposed to the outside air, the heat conducted to the resin case 60 is mainly dissipated from the first case portion 61.
  • the second case portion 62 is configured such that the outer peripheral surface is in contact with the inner peripheral surface of the mouthpiece 30, and in the present embodiment, the outer peripheral surface of the second case portion 62 is for screwing with the mouthpiece 30. A screwing portion is formed.
  • the resin case 60 can be formed of, for example, polybutylene terephthalate (PBT).
  • the two lead wires 70 are electric wires for supplying power for lighting the LED module 20 from the lighting circuit 80 to the LED module 20. As shown in FIG. 3, one end of each lead 70 is electrically connected to the power supply of the LED module 20, and the other end of each lead 70 is electrically connected to the power output of the lighting circuit 80. It is connected.
  • the lighting circuit 80 is a circuit unit for lighting the LED module 20 (the LED chip 22), and as shown in FIG. Specifically, lighting circuit 80 has a plurality of circuit elements and a circuit board on which each circuit element is mounted. In the present embodiment, the lighting circuit 80 converts AC power supplied from the base 30 into DC power, and supplies the DC power to the LED module 20 (LED chip 22) via the two lead wires 70. .
  • the bulb-shaped lamp 1 does not necessarily have to include the lighting circuit 80.
  • the bulb-shaped lamp 1 may not include the lighting circuit 80.
  • the lighting circuit 80 is not limited to the smoothing circuit, and a light control circuit, a booster circuit, and the like can be appropriately selected and combined.
  • FIG. 6 is a perspective view showing a configuration of a support and a support in the light bulb shaped lamp according to the embodiment of the present invention.
  • A) of FIG. 7 is a top view showing the configuration of the column and the support base, and
  • B) of FIG. 7 is a front view showing the configuration of the column and the support base.
  • c) is a side view which shows the structure of the same support
  • the support column 40 includes a main shaft portion (first stem portion) 41 and a fixing portion (second stem portion) 42.
  • the main shaft portion 41 and the fixing portion 42 are integrally molded.
  • the main shaft portion 41 is a cylindrical member having a constant cross-sectional area. An end on one side of the main shaft 41 is connected to the fixed portion 42, and an end on the other side of the main shaft 41 is connected to the support 50.
  • the fixing portion 42 is located between the main shaft portion 41 and the LED module 20, connected to the main shaft portion 41 and connected to the LED module 20.
  • the fixing portion 42 also has a fixing surface 42 a fixed to the base 21 of the LED module 20.
  • the fixing surface 42 a is a contact surface between the fixing portion 42 (the support 40) and the back surface (the LED module 20) of the base 21.
  • the fixing portion 42 has a projection 42 b for fitting with the through hole 21 a provided in the base 21 of the LED module 20.
  • the protrusion 42 b is provided so as to protrude from the fixing surface 42 a.
  • the protrusion 42 b functions as a position restricting portion that restricts the position of the LED module 20. That is, the protrusion 42 b is configured to determine the arrangement direction of the LED module 20, and in the present embodiment, in the plan view shape of the protrusion 42 b, the longitudinal direction matches the longitudinal direction of the base 21. It is a rectangle whose short side direction matches the width direction of the base 21.
  • the length W1 of the fixed surface 42 a in the longitudinal direction of the LED module 20 is the length in the longitudinal direction of the LED module 20 of the main spindle 41 (the main spindle 41 While the length W2 of the fixed surface 42a in the short direction of the LED module 20 is the length in the short direction of the LED module 20 of the main shaft portion 41 (the main shaft portion 41 It is configured to be shorter than the diameter ⁇ ).
  • W1 15 mm
  • W2 4.5 mm
  • ⁇ 8 mm.
  • the cross-sectional area of the portion of the support 40 immediately below the LED module 20 is reduced to suppress light shielding by the support 40, it is possible to suppress the decrease in the envelope volume of the support 40. That is, even if the length W2 of the fixed surface 42a is shortened to suppress the blocking of light of the LED module 20 by the support column 40, the contact area with the LED module 20 can be increased by increasing the length W1 of the fixed surface 42a. It can be secured. Thereby, it can suppress that the heat dissipation effect of LED module 20 falls.
  • both side surfaces in the short direction of the LED module in the fixing portion 42 are straight surfaces 42 c connected to the LED module 20. And a curved surface 42d connected to the straight surface 42c.
  • the straight surface 42 c is a surface on the LED module 20 side of one side surface of the fixed portion 42 and is a surface parallel to the axis of the support column 40 (the axis of the main shaft portion 41). That is, the distance between the straight surface 42c and the axis of the support 40 is constant toward the base. As described above, by providing the straight surface 42c in the portion directly below the LED module 20 in the fixing portion 42, the light directed to the support 40 side (the base 30 side) of the light emitted from the LED module 20 is the support 40 (fixed It can suppress that it reflects by the part 42).
  • the curved surface 42 d is a surface (surface on the main spindle 41 side) of the one side of the fixed portion 42 opposite to the LED module 20, and the axis of the support 40 toward the base (lower side) Is a surface that curves away from the That is, the distance between the curved surface 42d and the axis of the support column 40 gradually increases toward the base.
  • the envelope volume of the support column 40 (fixing portion 42) is improved as compared to the case where the fixing portion is configured by only a straight surface. It can be done.
  • the curved surface 42d the light of the LED module 20 can be dropped to the base side, so that the light of the LED module 20 can be reduced to be reflected by the support column 40 and be incident on the LED module 20 again. .
  • the side surface of the fixing portion 42 is configured by the straight surface 42c and the curved surface 42d, the heat radiation effect of the LED module 20 is suppressed while the light of the LED module 20 is blocked by the support column 40. Can be maintained.
  • the axial length L1 of the column 40 of the straight surface 42c is about 0.7 mm
  • the axial length L2 of the column 40 of the curved surface 42d is about 5.4 mm
  • the radius of curvature of the curved surface 42d is R was 10 mm.
  • the direction of the reflected light reflected by the fixed portion 42 can be adjusted as desired. Since the light which goes to the nozzle
  • the column 40 configured in this manner is fixed to the upper surface of the support 50. Specifically, the main shaft portion 41 of the support column 40 and the upper surface of the support 50 are fixed by bonding or screws. Further, the support 50 is provided with a through hole 51 for passing the lead wire 70 therethrough.
  • FIG. 8 is a view for explaining the connection relationship between the LED module and the support in the light bulb shaped lamp according to the embodiment of the present invention.
  • (a) is a top view of the LED module in a state of being fixed to a support
  • (b) is a cross-sectional view taken along the line BB ′ of (a)
  • (c ) Is a cross-sectional view taken along the line CC ′ of (a).
  • the metal wiring 24 is not shown.
  • pillar 40 are arrange
  • the fixing surface 42 a of the fixing portion 42 is configured not to overlap with the sealing member 23 which is the light emitting portion of the LED module 20. That is, the support column 40 is disposed such that the fixing surface 42 a of the fixing portion 42 is not located below the LED chip 22 and the sealing member 23. In other words, the support column 40 is disposed such that the fixed surface 42 a of the fixed unit 42 overlaps the non-light emitting unit of the LED module 20.
  • the LED module 20 is disposed with the surface of the base 21 (the surface on which the sealing member 23 is formed) facing the top of the globe 10.
  • the LED module 20 makes the base 21 contact by bringing the back surface of the base 21 (the surface on which the sealing member 23 is not formed) into contact with the fixing surface 42 a of the fixing portion 42 of the support column 40. It is directly fixed to the column 40.
  • the projection 42b of the support column 40 and the through hole 21b of the base 21 are fitted, whereby the position of the LED module 20 is restricted and the attitude of the LED module 20 is fixed.
  • an adhesive is applied between the back surface of the base 21 and the fixing surface 42 a of the fixing portion 42, whereby the support 40 and the base 21 are fixed.
  • the adhesive for example, an adhesive made of a silicone resin can be used, but in order to efficiently conduct the heat of the LED module 20 to the columns 40, it is preferable to use an adhesive having a high thermal conductivity.
  • the thermal conductivity can be increased by dispersing metal particles in a silicone resin.
  • FIG. 9 is a view showing a lighted state of the light bulb shaped lamp according to the embodiment of the present invention.
  • the LED chip 22 of the LED module 20 emits light, and the LED module 20 emits light to the surroundings. Specifically, the light emitted from the LED chip 22 is emitted upward, sideward and downward of the LED chip 22 and becomes white light by the sealing member 23 and is emitted around the entire periphery of the LED module 20. Be done. Among these, a part of the light emitted from the back surface side of the base 21 is reflected by the support column 40 and blocked. That is, the pillars 40 cause shadows.
  • the fixing surface 42 a of the fixing portion 42 of the support column 40 is configured not to overlap the LED chip 22 in plan view (when viewed from the top of the globe 10 toward the base 30) . That is, the pillar 40 is not present immediately below the LED chip 22 having the highest light output among the LED modules 20. Thus, the light of the LED module 20 can be prevented from being blocked by the support column 40, and therefore the light extraction efficiency to the base of the LED module 20 can be improved.
  • the fixing surface 42 a of the support column 40 is configured so as not to overlap the sealing member 23 serving as the light emitting portion in plan view. Thereby, the light of the LED module 20 can be further suppressed from being blocked by the support column 40, so that the light extraction efficiency to the base of the LED module 20 can be further improved.
  • the side surface directly below the LED module 20 of the fixing portion 42 is the straight surface 42 c
  • the side surface following the straight surface 42 c of the fixing portion 42 is the curved surface 42 d.
  • the curved surface 42 d it is possible to reduce that the light of the LED module 20 is reflected by the support 40 and is incident on the LED module 20 again. That is, when the fixed portion 42 is formed of only the straight surface 42c without the curved surface 42d, a step having a surface parallel to the base 21 is formed between the fixed portion 42 and the main shaft portion 41. The light of the LED module 20 is reflected by the surface of the step (the exposed upper surface of the main shaft portion 41) and reenters the LED module 20 again.
  • the light of the LED module 20 can be reflected by the curved surface 42 d and dropped below the column 40, so the LED by the reflection of the column 40 Re-incident light of the module 20 can be suppressed. As a result, it is possible to suppress color shift due to light re-incident.
  • FIG. 10 is a view for explaining the relationship between the length of the fixed portion and the luminous flux in the light bulb shaped lamp according to the embodiment of the present invention.
  • the length L of the fixed portion of the horizontal axis is the axial length L (L1 + L2) of the support column 40 of the fixed portion 42 in FIG. 7C.
  • FIG. 11A is a view showing a configuration of an LED module and a support in a light bulb shaped lamp according to Modification 1 of the present invention.
  • the fixing portion 42A of the support 40A has a frusto-conical shape, and the side faces away from the axis of the support 40A toward the base of the fixing portion 42A. It becomes an inclined surface (taper surface) which inclines like. That is, the distance between the surface of the fixing portion 42A and the axis of the support 40A is gradually increased toward the base.
  • the area of the fixing surface 42 a of the fixing portion 42 A is smaller than the area of the fixing surface 42 a of the fixing portion 42 in the above embodiment, so the LED module 20 is compared with the above embodiment.
  • FIG. 11B is a view showing the configuration of the LED module and the support in the light bulb shaped lamp according to the second modification of the present invention.
  • the fixing portion 42B of the support 40B is constituted by a cylindrical portion 42B1 and a truncated cone portion 42B2.
  • the diameter of the cylindrical portion 42B1 is the same as the diameter of the upper surface of the truncated cone portion 42B2, and smaller than the diameter of the lower surface of the truncated cone portion 42B2.
  • the diameter of the lower surface of the truncated cone portion 42B2 is the same as the diameter of the main shaft portion 41.
  • the side surface of the truncated cone portion is an inclined surface (taper surface) inclined so as to be away from the axis of the support 40B.
  • the support 40B does not exist below the LED chip 22 and the sealing member 23, the light extraction efficiency to the base of the LED module 20 can be improved.
  • the portion fixed to the LED module 20 in the support 40B is the small diameter cylindrical portion 42B1, so that the light extraction efficiency to the base of the LED module 20 is further improved compared to the first modification. It can be done.
  • the area of the fixing surface 42a of the fixing portion 42B is smaller than the area of the fixing surface 42a of the fixing portion 42 in the above embodiment, as in the first modification.
  • the heat dissipation of the LED module 20 is slightly reduced compared to the above embodiment.
  • FIG. 11C is a view showing the configuration of the LED module and the support in the light bulb shaped lamp according to the third modification of the present invention.
  • the entire fixing portion 42C of the support 40C is constituted by a small diameter cylindrical member.
  • the diameter of the fixing portion 42C in the present modification is the same as the diameter of the cylindrical portion 42B1 in the modification 2.
  • the support 40C is not present below the LED chip 22 and the sealing member 23, the light extraction efficiency to the base of the LED module 20 can be improved. Moreover, in the present modification, since the entire fixing portion 42C in the support 40C has a small diameter, the light extraction efficiency to the base of the LED module 20 can be further improved as compared with the second modification.
  • FIG. 11D is a view showing the configuration of the LED module and the support in the light bulb shaped lamp according to the fourth modification of the present invention.
  • the length in the longitudinal direction of the LED module 20 of the fixed portion 42D is configured to be longer than the diameter of the main shaft portion 41. That is, in the present modification, in the first modification, the fixing portion is extended in the longitudinal direction of the LED module 20.
  • the support 40D does not exist below the LED chip 22 and the sealing member 23, the light extraction efficiency to the base of the LED module 20 can be improved.
  • the fixed portion 42D since the fixed portion 42D is extended, the area of the fixed surface 42a is increased, so that the decrease in the heat dissipation as in the first to third modifications can be suppressed. it can.
  • LED module 20 was constituted so that white light might be emitted with blue LED and yellow fluorescent substance, it does not restrict to this.
  • a phosphor-containing resin containing a red phosphor and a green phosphor may be used to emit white light by combining this with a blue LED.
  • the LED chip 22 may use an LED that emits a color other than blue.
  • an LED chip emitting ultraviolet light as the LED chip 22, as the phosphor particles, a combination of phosphor particles of respective colors that emit light in three primary colors (red, green, and blue) can be used.
  • wavelength conversion materials other than phosphor particles may be used.
  • a wavelength conversion material a semiconductor, a metal complex, an organic dye, a pigment, etc. absorbs light of a certain wavelength and the wavelength is different from the absorbed light
  • a material containing a substance that emits light may be used.
  • an LED is illustrated as a light emitting element, but a semiconductor light emitting element such as a semiconductor laser, or an EL element such as organic EL (Electro Luminescence) or inorganic EL, or other solid light emitting element May be used.
  • a semiconductor light emitting element such as a semiconductor laser
  • an EL element such as organic EL (Electro Luminescence) or inorganic EL, or other solid light emitting element May be used.
  • the structure of the COB type which mounted the LED chip directly on the base 21 it is not restricted to this.
  • SMD surface mount device
  • an LED module configured by mounting a plurality of SMD type LED elements on a substrate may be used.
  • the lighting device 2 may be configured to include the light bulb shaped lamp 1 and the lighting fixture (lighting fixture) 3 to which the light bulb shaped lamp 1 is attached.
  • the lighting fixture 3 turns off and lights the bulb-shaped lamp 1 and includes, for example, a fixture body 4 mounted on a ceiling and a lamp cover 5 covering the bulb-shaped lamp 1.
  • the fixture body 4 has a socket 4 a to which the base 30 of the light bulb shaped lamp 1 is attached and which supplies power to the light bulb shaped lamp 1.
  • a translucent plate may be provided at the opening of the lamp cover 5.
  • the present invention is useful as a light bulb shaped lamp or the like that substitutes a conventional incandescent light bulb or the like, and can be widely used in a lighting device or the like.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)

Abstract

L'invention concerne une lampe en forme d'ampoule (1) qui comprend un globe (10) et une base (30) et qui est dotée des éléments suivants : un montant de support en métal (40) disposé de manière à s'étendre en direction de l'intérieur du globe (10) ; et un module à DEL (20) situé à l'intérieur du globe (10) et fixé sur le montant de support (40). Le module à DEL (20) comprend un cadre de transmission de lumière (21) et une puce à DEL (22) montée sur celui-ci. Le montant de support (40) comprend une surface de fixation (42a) sur laquelle le cadre (21) du module à DEL (20) est fixé. Le module à DEL (20) et le montant de support (40) sont disposés de sorte que, dans une vue en plan, la surface de fixation susmentionnée (42a) et la puce à DEL (22) ne se chevauchent pas.
PCT/JP2013/001041 2012-04-10 2013-02-25 Lampe en forme d'ampoule et dispositif d'éclairage WO2013153726A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2013528166A JP5420118B1 (ja) 2012-04-10 2013-02-25 電球形ランプ及び照明装置
CN201390000394.XU CN204201514U (zh) 2012-04-10 2013-02-25 灯泡形灯以及照明装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012-089005 2012-04-10
JP2012089005 2012-04-10

Publications (1)

Publication Number Publication Date
WO2013153726A1 true WO2013153726A1 (fr) 2013-10-17

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JP (1) JP5420118B1 (fr)
CN (1) CN204201514U (fr)
TW (1) TW201341709A (fr)
WO (1) WO2013153726A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104976547A (zh) * 2014-04-01 2015-10-14 广镓光电股份有限公司 发光二极管组件及用此发光二极管组件的发光二极管灯泡

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3154158U (ja) * 2009-07-17 2009-10-08 徳銘 荘 発光ダイオードを光源とする全方向電球
JP2010199145A (ja) * 2009-02-23 2010-09-09 Ushio Inc 光源装置
JP2011146253A (ja) * 2010-01-14 2011-07-28 Toshiba Lighting & Technology Corp 電球形ランプおよび照明器具
WO2012011279A1 (fr) * 2010-07-20 2012-01-26 パナソニック株式会社 Lampe en forme d'ampoule

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010199145A (ja) * 2009-02-23 2010-09-09 Ushio Inc 光源装置
JP3154158U (ja) * 2009-07-17 2009-10-08 徳銘 荘 発光ダイオードを光源とする全方向電球
JP2011146253A (ja) * 2010-01-14 2011-07-28 Toshiba Lighting & Technology Corp 電球形ランプおよび照明器具
WO2012011279A1 (fr) * 2010-07-20 2012-01-26 パナソニック株式会社 Lampe en forme d'ampoule

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104976547A (zh) * 2014-04-01 2015-10-14 广镓光电股份有限公司 发光二极管组件及用此发光二极管组件的发光二极管灯泡
US9874318B2 (en) 2014-04-01 2018-01-23 Epistar Corporation LED assembly and LED bulb using the same
CN104976547B (zh) * 2014-04-01 2019-05-28 晶元光电股份有限公司 发光二极管组件及用此发光二极管组件的发光二极管灯泡

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JPWO2013153726A1 (ja) 2015-12-17
TW201341709A (zh) 2013-10-16
JP5420118B1 (ja) 2014-02-19
CN204201514U (zh) 2015-03-11

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