WO2014013671A1 - Lampe de type à ampoule et dispositif d'éclairage - Google Patents

Lampe de type à ampoule et dispositif d'éclairage Download PDF

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Publication number
WO2014013671A1
WO2014013671A1 PCT/JP2013/003665 JP2013003665W WO2014013671A1 WO 2014013671 A1 WO2014013671 A1 WO 2014013671A1 JP 2013003665 W JP2013003665 W JP 2013003665W WO 2014013671 A1 WO2014013671 A1 WO 2014013671A1
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Prior art keywords
substrate
light emitting
light
shaped lamp
emitting module
Prior art date
Application number
PCT/JP2013/003665
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English (en)
Japanese (ja)
Inventor
直紀 田上
倉地　敏明
考志 大村
Original Assignee
パナソニック株式会社
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Priority to JP2013542269A priority Critical patent/JPWO2014013671A1/ja
Publication of WO2014013671A1 publication Critical patent/WO2014013671A1/fr

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/0008—Reflectors for light sources providing for indirect lighting
    • F21V7/0016—Reflectors for light sources providing for indirect lighting on lighting devices that also provide for direct lighting, e.g. by means of independent light sources, by splitting of the light beam, by switching between both lighting modes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/006—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/60—Light sources with three-dimensionally disposed light-generating elements on stacked substrates
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/90—Light sources with three-dimensionally disposed light-generating elements on two opposite sides of supports or substrates
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Definitions

  • the present invention relates to a light bulb-shaped lamp and a lighting device, for example, to a light bulb-shaped lamp using a semiconductor light emitting element and a lighting device using the same.
  • LEDs Light Emitting Diodes
  • LED lamp there is a bulb-shaped LED lamp (bulb-shaped LED lamp), and in the bulb-shaped LED lamp, an LED module including a substrate and a plurality of LEDs mounted on the substrate is used.
  • LED module including a substrate and a plurality of LEDs mounted on the substrate is used.
  • Patent Document 1 discloses a conventional bulb-shaped LED lamp.
  • a heat sink is used to dissipate heat generated by the LED, and the LED module is fixed to the heat sink.
  • a metal casing functioning as a heat sink is provided between the hemispherical glove and the cap, and the LED module is mounted on the upper surface of the metal casing. ing.
  • an LED module used for a bulb-type LED lamp is usually configured to extract light only from one side of the substrate (the side on which the LED is mounted). Therefore, even if the above-described replacement configuration is used, the luminous flux to the base of the bulb-type LED lamp is low, and it is difficult to realize a wide light distribution angle. On the other hand, this can be coped with by adding another LED module that emits light toward the base, but in this case, a configuration for simultaneously supplying power to two LED modules is required, and a light bulb is required. The structure becomes complicated as an LED lamp.
  • the present invention has been made to solve such problems, and it is an object of the present invention to provide a light bulb-shaped lamp and a lighting device with a simple structure having a wide light distribution angle.
  • one aspect of the light bulb shaped lamp according to the present invention is disposed in a translucent glove, a post provided so as to extend inward of the glove, and the glove
  • a second light emitting element group provided on the back surface of the substrate, and a second light emitting element group provided on the back surface of the substrate;
  • a second terminal pair for electrically connecting the second light emitting element group and the drive circuit, and the main light emitting module and the sub light emitting module are connected via the lead wire pair. And electrically connected in parallel.
  • the substrate is a main substrate on which the first light emitting element group is provided on the surface, and a sub substrate on which the second light emitting element group is provided on the surface.
  • the main substrate and the sub substrate may be arranged such that the back surfaces not provided with the first light emitting element group and the second light emitting element group face each other.
  • the first terminal pair is connected to two through holes provided in the substrate and the outer periphery of the two through holes on the surface of the substrate. And a land for connection, wherein the second terminal pair is comprised of the two through holes and a connection land provided on an outer periphery of the two through holes on the back surface of the substrate, the first terminal pair And the second pair of terminals may be disposed so as to be approximately concentric, and the pair of lead wires may be inserted into the through hole.
  • the first light emitting element group and the second light emitting element group are each configured of a plurality of elements connected in series, and the first light emitting element group is It is possible to have the same number of elements as the number of elements in the second light emitting element group.
  • the lead wire pair may be electrically connected to the first terminal pair and the second terminal pair by solder.
  • the solder may be covered with an insulating resin.
  • the insulating resin can be white.
  • the lead wire pair is composed of a core wire and an insulating resin covering the core wire, and protrudes by 3 mm or less from the back surface of the substrate in the lead wire pair.
  • the core wire may not be covered with the insulating resin.
  • the sub light emitting module is directly attached to the support, and heat generated in the sub light emitting module is transferred to the support, and the main light emitting module May be indirectly attached to the support via the sub light emitting module, and the heat generated in the main light emitting module may be indirectly transferred to the support via the sub light emitting module.
  • a heat conducting member may be provided between the main light emitting module and the sub light emitting module.
  • the heat conducting member can be any one of a heat conducting resin, a ceramic paste, and a metal paste.
  • the sub light emitting module can be adhesively fixed to the support.
  • the substrate has a light reflectance of 50% or more with respect to light emitted from the first light emitting element group and the second light emitting element group.
  • the substrate may contain any one of Al 2 O 3 , MgO, SiO and TiO 2 as a main component.
  • the surface of the support can have a light reflectance of 30% or more with respect to light emitted from the main light emitting module and the sub light emitting module. .
  • the support can be made mainly of any of Al, Cu and Fe.
  • the main light emitting module has at least two or more of the first light emitting element groups, and the sub light emitting module has at least two or more of the second light emitting It is possible to have an element group.
  • one aspect of a lighting device according to the present invention is characterized by including the above-described bulb-shaped lamp.
  • FIG. 1 is a side view of a light bulb shaped lamp according to an embodiment of the present invention.
  • FIG. 2 is an exploded perspective view of the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 3 is a cross-sectional view of a light bulb shaped lamp according to an embodiment of the present invention.
  • FIG. 4 is a view showing the configuration of the light bulb shaped lamp according to the embodiment of the present invention, where (a) is a top view and (b), (c) and (d) are cross sectional views.
  • FIG. 5 is an enlarged cross-sectional view of the LED in the LED module of the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 6 is a view showing the configuration of a light bulb shaped lamp according to a modification of the embodiment of the present invention, wherein (a) is a top view and (b), (c) and (d) are cross sectional views.
  • FIG. 7 is a view showing another configuration of the light bulb shaped lamp according to the modification of the embodiment of the present invention, where (a) is a top view and (b), (c) and (d) are cross sectional views. is there.
  • FIG. 8 is a view showing the configuration of a variation of the light bulb shaped lamp according to the embodiment of the present invention, in which (a) is a top view, and (b), (c) and (d) are cross sectional views.
  • FIG. 10A is a cross-sectional view of a first modified example of the LED module in the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 10B is a cross-sectional view of a second modified example of the LED module in the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 10C is a cross-sectional view of a third modified example of the LED module in the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 10D is a cross-sectional view of a fourth modified example of the LED module in the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 10A is a cross-sectional view of a first modified example of the LED module in the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 10B is a cross-sectional view of a second modified example of the LED module in the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 10C is a cross-sectional view of
  • FIG. 11A is a main part enlarged view showing a configuration of a light bulb shaped lamp according to a first modified example of the present invention.
  • FIG. 11B is a main part enlarged view showing another configuration of the light bulb shaped lamp according to the first modified example of the present invention.
  • FIG. 12 is a main part enlarged view showing a configuration of a light bulb shaped lamp according to a second modified example of the present invention.
  • FIG. 13 is a schematic cross-sectional view of a lighting device according to an embodiment of the present invention.
  • FIG. 1 is a side view of a light bulb shaped lamp 1 according to the present embodiment.
  • FIG. 2 is an exploded perspective view of the light bulb shaped lamp 1 according to the present embodiment.
  • FIG. 3 is a cross-sectional view of the light bulb shaped lamp 1 according to the present embodiment.
  • the upper side of the drawing is the front (upper) of the bulb-shaped lamp 1
  • the lower side of the drawing is the rear (lower) of the bulb-shaped lamp 1
  • the left and right sides of the drawing are the sides of the bulb-shaped lamp 1. is there.
  • “rearward” refers to the direction on the base side with respect to the substrate of the LED module
  • “forward” refers to the direction opposite to the base relative to the substrate in the LED module.
  • the “side” is a direction parallel to the main surface of the substrate of the LED module.
  • the bulb-shaped lamp 1 is a bulb-shaped LED lamp (LED bulb) which is a substitute for a bulb-shaped fluorescent lamp or an incandescent lamp.
  • the light bulb-shaped lamp 1 includes a translucent globe 10, LED modules 20a and 20b as light sources, a cap 30, which receives power from the outside of the lamp, a support 40, a support 50, a resin case 60, and lead wires. And a lighting circuit 80.
  • an envelope is configured by the glove 10, the resin case 60 (first case portion 61), and the base 30.
  • the glove 10 accommodates the LED modules 20a and 20b.
  • the globe 10 is made of a material transparent to the light from the LED modules 20a and 20b, and is a translucent globe that transmits the light from the LED modules 20a and 20b and transmits the light to the outside of the lamp.
  • a glass bulb made of silica glass that is transparent to visible light can be used.
  • the LED modules 20 a and 20 b housed in the glove 10 can be viewed from the outside of the glove 10.
  • the shape of the glove 10 is a shape in which one end is closed spherically and the other end has an opening 11. Specifically, the shape of the glove 10 is such that a part of the hollow sphere is narrowed while extending in a direction away from the center of the sphere, and the opening 11 is formed at a position away from the center of the sphere It is done.
  • a glass bulb having the same shape as a general incandescent bulb can be used.
  • a glass bulb such as A-shaped, G-shaped or E-shaped can be used as the glove 10.
  • the globe 10 does not necessarily have to be transparent to visible light, and the globe 10 may have a light diffusing function.
  • a milky white light diffusion film may be formed by applying a resin containing a light diffusion material such as silica or calcium carbonate, a white pigment, or the like on the entire inner surface or outer surface of the glove 10.
  • the glove 10 does not have to be made of silica glass.
  • a glove 10 made of a resin material such as acrylic may be used.
  • the LED modules 20 a and 20 b are light emitting modules that have LEDs (LED chips) and emit light when power is supplied to the LEDs through the lead wires 70.
  • the LED modules 20 a and 20 b are held in the hollow of the glove 10 by the columns 40.
  • the LED modules 20a and 20b be disposed at a central position of the spherical shape formed by the globe 10 (for example, inside the major part of the larger diameter of the globe 10).
  • the light distribution characteristic of the light bulb shaped lamp 1 becomes a light distribution characteristic similar to a general incandescent light bulb using a conventional filament coil. .
  • the LED modules 20a and 20b are arranged such that the main surfaces (front and back surfaces) of the substrate intersect, for example, be substantially perpendicular to the lamp axis.
  • the LED module 20 a emits light toward the front of the bulb-shaped lamp 1
  • the LED module 20 b emits light toward the rear of the bulb-shaped lamp 1.
  • the lamp axis is an axis serving as a rotation center when attaching the light bulb shaped lamp 1 to the socket of the lighting device (not shown), and coincides with the rotation axis of the base.
  • the LED modules 20a and 20b configured in this way are configured as one double-sided LED module that emits light from both sides.
  • the detailed configuration of the LED modules 20a and 20b will be described later.
  • the base 30 is a power receiving unit that receives power for causing the LEDs of the LED modules 20 a and 20 b to emit light from the outside of the light bulb shaped lamp 1.
  • the base 30 receives AC power at the two contacts, and the power received by the base 30 is input to the power input unit of the lighting circuit 80 through the lead wire.
  • the base 30 is attached to a socket of a lighting fixture (lighting device) and receives electric power from the socket to light the light bulb shaped lamp 1 (the LED modules 20a and 20b).
  • the base 30 is E-shaped, and a screwing portion for screwing with a socket of the lighting device is formed on the outer peripheral surface thereof, and a screwing portion for screwing with the resin case 60 is formed on the inner peripheral surface thereof. Is formed.
  • the base 30 is a bottomed cylindrical body made of metal.
  • die etc. can be used as a screw-in type Edison type (E type
  • a plug-in base may be used as the base 30, a plug-in base may be used as the base 30, a plug-in base may be used.
  • the support column 40 is a stem provided to extend from the vicinity of the opening 11 of the glove 10 toward the inside of the glove 10 and functions as a holding member for holding the LED modules 20 a and 20 b in the glove 10.
  • One end of the support 40 is connected to the LED modules 20 a and 20 b, and the other end is connected to the support 50.
  • the columns 40 also function as a heat dissipation member for radiating the heat generated by the LED modules 20a and 20b to the base 30 side. Therefore, the heat dissipation efficiency of the support 40 can be enhanced by configuring the support 40 with a metal material having high thermal conductivity, such as aluminum having a thermal conductivity of 237 [W / m ⁇ K]. As a result, it is possible to suppress the decrease in the light emission efficiency and the life of the LED due to the temperature rise.
  • the columns 40 can also be made of resin or the like.
  • the support column 40 is configured by, for example, integrally molding the main shaft portion 41 and the fixing portion 42.
  • the main shaft portion 41 is a cylindrical member having a constant cross-sectional area.
  • One end of the main shaft portion 41 is connected to the fixing portion 42, and the other end is connected to the support 50.
  • the fixing portion 42 has a fixing surface to which the LED modules 20a and 20b are fixed, and this fixing surface is in contact with the back surface of the substrate of the LED modules 20a and 20b.
  • the fixing portion 42 further has a protrusion which protrudes from the fixing surface, and the protrusion fits with a through hole provided in the substrate of the LED modules 20a and 20b.
  • the LED modules 20a and 20b and the fixing surface are adhered by an adhesive of resin such as silicone resin, for example.
  • the support base (support plate) 50 is a member for supporting the support column 40, and is fixed to the resin case 60.
  • the support 50 is connected to the open end of the opening 11 of the glove 10 and configured to close the opening 11 of the glove 10.
  • the support 50 is formed of a disk-like member having a step portion at the periphery, and the opening end of the opening 11 of the glove 10 is in contact with the step portion. In the step portion, the support 50, the resin case 60, and the open end of the opening 11 of the glove 10 are fixed by an adhesive.
  • the support base 50 is made of a metal material having a high thermal conductivity such as aluminum similarly to the support column 40, so that the heat dissipation efficiency of the heat of the LED modules 20a and 20b which thermally conducts the support column 50 by the support support 50 is enhanced. Be As a result, it is possible to further suppress the decrease in the light emission efficiency and the life of the LED due to the temperature rise.
  • the resin case 60 is an insulating case (circuit holder) for insulating the support 40 and the base 30 and housing the lighting circuit 80, and has a large diameter cylindrical first case portion 61 and a small diameter cylindrical second case. And a case portion 62.
  • the resin case 60 can be formed of, for example, polybutylene terephthalate (PBT).
  • the second case portion 62 is configured such that the outer circumferential surface is in contact with the inner circumferential surface of the mouthpiece 30, and a screwing portion for screwing with the mouthpiece 30 is formed on the outer circumferential surface of the second case portion 62. ing.
  • the two lead wires 70 are a pair of lead wires for supplying power for lighting the LED modules 20a and 20b from the lighting circuit 80 to the LED modules 20a and 20b, and are formed of a metal wire such as a copper wire. It can be configured.
  • Each lead 70 is disposed in the glove 10, one end is electrically connected to the external terminals of the LED modules 20a and 20b, and the other end is electrically connected to the power output portion of the lighting circuit 80, in other words, the cap 30 It is done.
  • the lead wire 70 also functions as a support for supporting the LED modules 20a and 20b by connecting a part of the lead 70 to the external terminals of the LED modules 20a and 20b.
  • the two lead wires 70 are, for example, vinyl wires composed of a metal core wire and an insulating resin covering the core wire, and the LED modules 20a and 20b are not covered with the insulating resin and the surface is exposed. It is electrically connected through the core wire which has been
  • the lighting circuit 80 is a circuit unit for lighting the LEDs of the LED modules 20a and 20b, and includes a plurality of circuit elements and a circuit board on which each circuit element is mounted.
  • the lighting circuit 80 includes a circuit for converting alternating current power supplied from the base 30 into direct current power, and supplies the converted direct current power to the LEDs of the LED modules 20a and 20b via the two lead wires 70. It is a drive circuit.
  • the bulb-shaped lamp 1 does not necessarily have to include the lighting circuit 80.
  • the lighting circuit 80 is not limited to the smoothing circuit, and the light control circuit, the booster circuit, and the like can be appropriately selected and combined.
  • FIG. 4 is a view showing the configuration of the light bulb shaped lamp 1 according to the present embodiment.
  • FIG. 5 is an enlarged cross-sectional view of the LEDs in the LED modules 20a and 20b of the light bulb shaped lamp 1 according to the present embodiment.
  • FIG. 4A is a plan view when the LED module 20 a is viewed from above in a state where the globe 10 is removed in the light bulb shaped lamp 1.
  • (b) of FIG. 4 is a cross-sectional view of the same light bulb shaped lamp 1 cut along the AA 'line of (a), and
  • (c) of FIG. 4 is a BB' line of (a) 4
  • (d) is a cross-sectional view of the same light bulb-shaped lamp 1 taken along the line CC 'of FIG. 4 (a).
  • the LED module 20 a is an example of a main light emitting module (first light emitting module), and has a COB (Chip On Board) structure in which a bare chip is directly mounted on the surface (one main surface) of the substrate 21.
  • the LED module 20 b is an example of a sub light emitting module (second light emitting module), and has a COB structure in which a bare chip is directly mounted on the back surface (other main surface) of the substrate 21.
  • the LED module 20 a includes a substrate 21, a plurality of LEDs 22 provided on the surface of the substrate 21, a sealing member 23, metal wires 24 and 26, a wire 25, a conductive adhesive member 27 and a terminal (external terminal) 28.
  • the LED module 20 b includes the substrate 21, the plurality of LEDs 32 provided on the back surface of the substrate 21, the sealing member 33, the metal wires 34 and 36, the wires 35, the conductive adhesive members 37 and the terminals 38. There is.
  • the substrate 21 can be a light-transmitting substrate or a non-light-transmitting substrate.
  • the substrate 21 is, for example, a ceramic substrate made of a ceramic material such as aluminum oxide (alumina) or aluminum nitride, a metal substrate, a resin substrate, a glass substrate, a flexible substrate, an alumina substrate or the like.
  • the substrate 21 is preferably made of a white substrate such as a white alumina substrate having a low light transmittance with respect to light emitted from the LEDs 22 and 32, for example, 10% or less, or a metal substrate.
  • the substrate 21 has a light reflectance of 50% or more with respect to light emitted from the LEDs 22 and 32, and is made of a substrate containing Al 2 O 3 , MgO, SiO, or TiO 2 as a main component. be able to.
  • the LED module 20a When the light transmittance of the substrate 21 is high, in the LED module 20a, a part of the light of the LED 22 on the front surface side of the substrate 21 passes through the substrate 21 and then passes further through the sealing member 33 on the back surface of the substrate 21 It is emitted from the back side of 21. Similarly, in the LED module 20b, after a part of the light of the LED 32 on the back surface side of the substrate 21 passes through the substrate 21, it further passes through the sealing member 23 on the surface of the substrate 21 and is emitted from the surface side of the substrate 21 . Therefore, in the light bulb shaped lamp 1, color shift occurs with respect to light extracted from the base side and the opposite side. On the other hand, such a color shift can be suppressed by lowering the light transmittance of the substrate 21. Further, since an inexpensive white substrate can be used, cost reduction of the light bulb shaped lamp 1 can be realized.
  • two through holes 21 b penetrating from the front surface to the rear surface of the substrate 21 are provided. These two through holes 21b constitute terminals 28 and 38 for connecting the lead wire 70 for feeding and the LED modules 20a and 20b, and the lead wire 70 is inserted through each of the two through holes 21b. .
  • one through hole 21a penetrating from the front surface to the back surface of the substrate 21 is provided.
  • the through holes 21 a are for fixing the LED modules 20 a and 20 b to the support 40, and the projections 42 b of the support 40 are fitted in the through holes 21 a.
  • the through hole 21a may not be provided.
  • a plurality of LEDs 22 are mounted on the surface of the substrate 21.
  • the plurality of LEDs 22 are arranged such that a plurality of element rows formed by being linearly arranged at the same pitch in the long side direction of the substrate 21 are arranged in the short side direction of the substrate 21.
  • the plurality of LEDs 22 are connected in series in the element row, and are connected in parallel in the element rows.
  • This element row is an example of the first light emitting element group.
  • the distance (pitch) between adjacent LEDs 22 in an element row is 1.8 mm
  • the distance between the LEDs 22 of one element row and the LEDs 22 of the other element row in adjacent element rows is 4 mm, for example It is arranged to be
  • a plurality of LEDs 32 are mounted on the back surface of the substrate 21.
  • the plurality of LEDs 32 are arranged such that a plurality of element rows formed by being linearly arranged at the same pitch in the long side direction of the substrate 21 are arranged in the short side direction of the substrate 21.
  • the plurality of LEDs 32 are connected in series in the element row, and are connected in parallel in the element rows. This element row is an example of the second light emitting element group.
  • the LEDs 22 and 32 are bare chips that emit monochromatic visible light in all directions, that is, sideways, upward and downward.
  • the LEDs 22 and 32 emit, for example, 20% of the total light amount laterally, 60% of the total light amount upward, and 20% of the total light amount downward.
  • the LEDs 22 and 32 are rectangular (square) blue LED chips that emit blue light when energized, for example, each side having a length of about 0.35 mm (350 ⁇ m).
  • the blue LED chip for example, a gallium nitride-based semiconductor light emitting device having a center wavelength of 440 nm to 470 nm, which is made of an InGaN-based material, can be used.
  • the LEDs 22 and 32 have a sapphire substrate 22a and a plurality of nitride semiconductor layers 22b stacked on the sapphire substrate 22a and having different compositions.
  • a cathode electrode 22c and an anode electrode 22d are provided at both ends of the upper surface of the nitride semiconductor layer 22b.
  • a wire bond portion 22e is provided on the cathode electrode 22c, and a wire bond portion 22f is provided on the anode electrode 22d.
  • the cathode electrode 22c of one LED 22 and the anode electrode 22d of the other LED 22 are connected by the wire 25 via the wire bond portions 22e and 22f.
  • the LEDs 22 and 32 are fixed on the substrate 21 by a translucent chip bonding material 22 g such that the surface on the sapphire substrate 22 a side faces the front surface or the back surface of the substrate 21.
  • a translucent chip bonding material 22g a silicone resin containing a filler made of metal oxide can be used.
  • the sealing member 23 is a conversion member that converts the wavelength of light emitted by the LED 22, and is formed to cover the LED 22.
  • the sealing member 23 is a sealing resin composed of a wavelength conversion material for converting the wavelength of light emitted by the LED 22 and a resin material containing the wavelength conversion material.
  • a wavelength conversion material phosphor particles which are excited by the light emitted by the LED 22 and emit light of a desired color (wavelength) may be used, or light of a certain wavelength such as semiconductors, metal complexes, organic dyes and pigments
  • a material containing a substance that absorbs light and emits light of a different wavelength from the absorbed light can also be used.
  • a light diffusing material such as silica particles may be dispersed.
  • phosphor particles when the LED 22 is a blue LED chip that emits blue light, phosphor particles that wavelength-convert blue light to yellow light are used to emit white light from the sealing member 23 .
  • YAG (yttrium aluminum garnet) -based yellow phosphor particles can be used as the phosphor particles.
  • part of the blue light emitted by the LED 22 is wavelength-converted to yellow light by the yellow phosphor particles contained in the sealing member 23.
  • the blue light which is not absorbed by the yellow phosphor particles (the wavelength is not converted) and the yellow light which is wavelength converted by the yellow phosphor particles are diffused and mixed in the sealing member 23.
  • the white light is emitted from the sealing member 23.
  • green phosphor particles, red phosphor particles, etc. may be used as the phosphor particles, and when the LED 22 is an LED 22 that emits ultraviolet light, as phosphor particles that are wavelength conversion materials A combination of phosphor particles emitting light of three primary colors (red, green and blue) is used.
  • transparent resin materials such as silicone resin, organic materials such as fluorine resin, and inorganic materials such as low melting point glass and sol-gel glass can be used as the resin material containing the phosphor particles.
  • the sealing member 23 configured as described above is formed in a straight line along the arrangement direction of the plurality of LEDs 22 constituting the element row, and collectively seals the element row of the LEDs 22. At the same time, a plurality of sealing members 23 are formed along the arrangement direction of the element rows to individually seal different element rows.
  • Each sealing member 23 has, for example, a length of 24 mm, a line width of 1.6 mm, and a central maximum height of 0.7 mm.
  • the sealing member 33 is a conversion member that converts the wavelength of light emitted by the LED 32, and is formed so as to cover the LED 32.
  • the sealing member 33 is a sealing resin composed of a wavelength conversion material for converting the wavelength of light emitted by the LED 32 and a resin material containing the wavelength conversion material.
  • the wavelength conversion material phosphor particles which are excited by the light emitted from the LED 32 and emit light of a desired color (wavelength) may be used, or light of a certain wavelength such as a semiconductor, metal complex, organic dye and pigment
  • a material containing a substance that absorbs light and emits light of a different wavelength from the absorbed light can also be used.
  • the sealing member 33 is linearly formed along the arrangement direction of the plurality of LEDs 32 constituting the element row, and collectively seals the element rows of the LEDs 32. At the same time, a plurality of sealing members 33 are formed along the arrangement direction of the element rows to individually seal different element rows.
  • Metal wiring, terminal In order to electrically connect the element row of the LEDs 22 and the terminals 28 in parallel, two metal wires 26 are formed in the shape of islands in a predetermined shape at both ends of the substrate 21. These two metal wires 26 are formed on the surface of the substrate 21 so as to sandwich the element rows of the plurality of LEDs 22.
  • the metal wiring 26 protrudes toward the element row at a portion adjacent to the element row of the LED 22 on the surface of the substrate 21.
  • the protruding portion of the metal wiring 26 is a connection point with the wire 25 from the LED 22.
  • two metal wirings 36 are formed in the shape of islands in a predetermined shape at both ends of the substrate 21. These two metal wires 36 are formed on the back surface of the substrate 21 so as to sandwich the element rows of the plurality of LEDs 32.
  • the metal wiring 36 protrudes toward the element row at a portion adjacent to the element row of the LED 32 on the back surface of the substrate 21.
  • the protruding portion of the metal wiring 36 is a connection point with the wire 35 from the LED 32.
  • the terminal 28 is a feed electrode on which the conductive adhesive member 27 is provided, for example, a solder electrode to which soldering is performed, and the surface of the substrate 21 is surrounded by the through hole 21 b and the opening on the surface side of the substrate 21 of the through hole 21 b. And a land for connection formed in a predetermined shape.
  • Two terminals 28 are formed corresponding to each of the two metal wires 26.
  • the pair of terminals 28 is an example of a first terminal pair, is integrally formed with the corresponding metal wires 26, and is connected by being in contact with the corresponding metal wires 26.
  • One corresponding wiring pattern is configured by such a corresponding set of metal wires 26 and terminals 28.
  • the terminal 28 is a power supply unit of the LED module 20a, and receives power from the outside of the LED module 20a to emit light from the LED module 20, and supplies the received power to each LED 22 through the metal wires 26 and 24 and the wire 25. .
  • the terminal 38 is a feed electrode provided with the conductive adhesive member 37, and is formed in a predetermined shape on the back surface of the substrate 21 so as to surround the through hole 21b and the opening on the back surface side of the substrate 21 of the through hole 21b. And the land for connection.
  • Two terminals 38 are formed corresponding to each of the two metal wires 36.
  • the pair of terminals 38 is an example of a second terminal pair, is integrally formed with the corresponding metal wires 36, and is connected by being in contact with the corresponding metal wires 36.
  • One corresponding wiring pattern is configured by such a corresponding set of metal wires 36 and terminals 38.
  • the terminal 38 is a power supply unit of the LED module 20b, and receives power from the outside of the LED module 20b to emit light from the LED 32, and supplies the received power to each LED 32 through the metal wires 36 and 34 and the wire 35. .
  • a plurality of metal wires 24 are formed in a predetermined shape on the surface of the substrate 21 in order to electrically connect the plurality of LEDs 22 in series.
  • the plurality of metal wires 24 are formed in an island shape on the surface of the substrate 21 between the adjacent LEDs 22 in the element row.
  • a plurality of metal wires 34 are formed in a predetermined shape on the back surface of the substrate 21 in order to electrically connect the plurality of LEDs 32 in series.
  • the plurality of metal wires 34 are formed in an island shape between the adjacent LEDs 32 in the element row on the back surface of the substrate 21.
  • the metal wires 26 and 24 and the terminals 28 of the above-described configuration are simultaneously patterned with the same metal material.
  • a metal material silver (Ag), tungsten (W) or copper (Cu) etc. can be used, for example.
  • the surfaces of the metal wires 26 and 24 and the terminals 28 may be plated with nickel (Ni) / gold (Au) or the like.
  • the metal wires 26 and 24 and the terminals 28 may be made of different metal materials or may be formed in separate steps.
  • metal lines 36 and 34 and terminal 38 are simultaneously patterned with the same metal material.
  • the wire 25 is a wire for connecting the LED 22 and the metal wire 26 or the LED 22 and the metal wire 24 and is, for example, a gold wire. As described in FIG. 5, wire bonding of each of the wire bonding portions 22 e and 22 f provided on the upper surface of the LED 22 and the metal wiring 26 or the metal wiring 24 formed adjacent to both sides of the LED 22 by the wire 25 It is done.
  • the wire 25 is entirely embedded in the sealing member 23 so as not to be exposed from the sealing member 23, for example.
  • the wire 35 is an electric wire for connecting the LED 32 and the metal wire 36 or the LED 32 and the metal wire 34.
  • wire bonding of the wire bonding portions 22 e and 22 f provided on the upper surface of the LED 32 and the metal wiring 36 or the metal wiring 34 formed adjacent to both sides of the LED 32 by the wire 35 is wire bonding It is done.
  • the wire 35 is entirely embedded in the sealing member 33 so as not to be exposed from the sealing member 33, for example.
  • the conductive adhesive member 27 is a conductive adhesive such as solder or silver paste which connects the terminal 28 to the lead wire 70.
  • the conductive adhesive member 27 is provided in contact with both the terminal 28 and the lead wire 70 so as to cover the side surface of one end of the lead wire 70 on the surface of the terminal 28.
  • the conductive adhesive member 27 is provided to close the opening on the surface side of the substrate 21 of the through hole 21 b.
  • the conductive adhesive member 37 is a conductive adhesive that connects the terminal 38 to the lead 70.
  • the conductive adhesive member 37 is provided in contact with both the terminal 38 and the lead 70 so as to cover the side surface of one end of the lead 70 on the surface of the terminal 38.
  • the conductive adhesive member 37 is provided to close the opening on the back surface side of the substrate 21 of the through hole 21 b.
  • the conductive adhesive members 27 are used to form the two lead wires 70 and the terminals 38 after the members except the conductive adhesive members 27 and 37 are provided on the front and back surfaces of the substrate 21. It forms by connecting and connecting the two lead wires 70 and the terminal 28 by the conductive adhesive member 37.
  • the lead wire 70 is inserted from the opening on the back surface side of the through hole 21b and provided to protrude from the opening on the surface side of the through hole 21b.
  • conductive adhesive member 37 is provided to be in contact with both the back surface portion of lead wire 70 and terminal 38, and conductive adhesive member 27 is in contact with both the surface side portion and terminal 28.
  • the terminal 28 and the terminal 38 are connected by the lead wire 70. Then, the terminals 28 and 38 are connected to the same lead 70, and the plurality of LEDs 22 on the surface of the substrate 21 and the plurality of LEDs 32 on the back of the substrate 21 are connected in parallel to the lead 70.
  • the current supplied to one positive lead wire 70 passes through the conductive adhesive member 27, the terminal 28, the metal wiring 26, the LED 22 and the metal wiring 24, and the other minus It is outputted from the lead wire 70 on the side.
  • the current supplied to the positive lead wire 70 on one side passes through the conductive adhesive member 37, the terminal 38, the metal wiring 36, the LED 32 and the metal wiring 34, and the other negative side It is output from the lead 70.
  • the LED 32 and the sealing member 33 Each member is not provided. Therefore, on the back surface of the substrate 21, the element rows of the plurality of LEDs 32 are provided to sandwich the fixing portion 42, and the distance between the element rows is the element row sandwiching the fixing portion 42 of the support column 40 than the distance between the other element rows. It is getting bigger. Further, in order to make the light emission characteristics of the LED modules 20a and 20b uniform, in the LED module 20a on the surface of the substrate 21, the elements of the plurality of LEDs 22 sandwich a portion located above the contact surface of the substrate 21 with the fixing portion 42. A row is provided. That is, the distance between the element rows of the LEDs 22 is larger than the distance between the other element rows in the element row sandwiching a portion located above the contact surface of the substrate 21 with the fixing portion 42.
  • the conductive adhesive members 27 and 37 are spaced apart from each other in the through hole 21b.
  • the conductive adhesive members 27 and 37 may not be separate members, but may be integrally provided as one adhesive member. That is, one conductive member may be provided continuously in the through hole 21b, on the surface of the substrate 21, and on the back surface of the substrate 21 so as to be in contact with the terminals 28 and 38 and the lead wire 70. .
  • the tip of the lead wire 70 is provided so as to be exposed on the surface of the conductive adhesive member 27, but may be completely covered by the conductive adhesive member 27. In this case, the contact area between the lead wire 70 and the conductive adhesive member 27 is increased, so that the connection between the both can be strengthened.
  • the LED 22 is located in the upper part of the contact surface with the fixing portion An element row of may be provided.
  • the light bulb-shaped lamp 1 of the present embodiment is disposed in the glove 10, the pillar 40 provided so as to extend inward of the glove 10, and fixed to the pillar 40.
  • LED modules 20a and 20b are provided.
  • the light bulb shaped lamp 1 further includes a lighting circuit 80 for supplying power to the LED modules 20a and 20b, and a pair of lead wires 70 for electrically connecting the LED modules 20a and 20b and the lighting circuit 80.
  • the LED module 20 a is provided on the surface of the substrate 21 and the element row of the LEDs 22 provided on the surface of the substrate 21, and is a pair for electrically connecting the element row of the LEDs 22 and the lighting circuit 80. And a terminal 28.
  • the LED module 20b is provided on the rear surface of the substrate 21 and on the rear surface of the substrate 21.
  • the LED module 20b is provided on the rear surface of the substrate 21 and electrically connects the lighting array 80 with the device column of the LED 32. And a terminal 38.
  • the LED module 20 a and the LED module 20 b are electrically connected in parallel via the pair of lead wires 70. That is, one double-sided light emission type LED module which emits light from both sides is configured by the LED module 20 a and the LED module 20 b connected in parallel.
  • the pair of terminals 28 are provided on the outer periphery of the two through holes 21 b provided on the substrate 21 and the two through holes 21 b on the surface of the substrate 21. It consists of lands.
  • the pair of terminals 38 is composed of two through holes 21 b and connection lands provided on the outer surface of the two through holes 21 b on the back surface of the substrate 21. Then, the pair of terminals 28 and the pair of terminals 38 are disposed so as to be approximately concentric, and the pair of lead wires 70 are inserted through the through holes 21 b. In other words, the terminal 28 and the terminal 38 are disposed so as to be approximately concentric, and the lead wire 70 is inserted into the through hole 21 b.
  • the pair of lead wires 70 is composed of a core wire and an insulating resin covering the core wire, and a portion of the pair of lead wires 70 protruding from the surface of the substrate 21 and a back surface of the substrate 21 only 3 mm or less
  • the core wire may not be covered with the insulating resin in the part.
  • the element row of the LEDs 22 and the element row of the LEDs 32 are each composed of a plurality of LEDs connected in series, and the element row of the LEDs 22 is the number of LEDs of the element row of the LEDs 32 Have the same number of LEDs.
  • the pair of lead wires 70 and the pair of terminals 28 and the pair of terminals 38 are electrically connected by the conductive adhesive member 27.
  • the conductive adhesive member 27 may be coated with an insulating resin.
  • this insulating resin may be white resin whose light transmittance is low with respect to the light emitted from LED22 and 32, for example, 10% or less.
  • the surface of the support column 40 has a light reflectance of 30% or more to the light emitted from the LED modules 20a and 20b.
  • the pillars 40 contain any of Al, Cu, and Fe as main components.
  • the LED module 20 a has an element row of a plurality of LEDs 22, and the LED module 20 b has an element row of a plurality of LEDs 32.
  • the light bulb shaped lamp 1 emits light from both sides of the substrate 21, light is taken out from the base side of the light bulb shaped lamp 1 and the opposite side thereof, and the light bulb shaped lamp 1 having a wide light distribution angle is realized. it can.
  • power supply to the LED modules 20a and 20b is realized simply by connecting the lead wire 70 to both of the two terminals 28 and 38 by the conductive adhesive members 27 and 37 through the through holes 21b. Therefore, compared with the configuration in which the lead wire 70 is connected to either of the terminals 28 and 38 and the terminal 28 and the terminal 38 are connected by a via hole or the like, the configuration such as the via hole connecting the terminal 28 and the terminal 38 is unnecessary. It becomes. Further, the number of lead wires 70 can be halved as compared with the configuration in which the separate lead wires 70 are connected to the terminals 28 and 38. As a result, a light bulb shaped lamp 1 with a simple structure can be realized.
  • the substrate 21 has a light reflectance of 50% or more to the light emitted from the LED modules 20a and 20b. Then, the substrate 21 contains any of Al 2 O 3 , MgO, SiO, and TiO 2 as a main component. Thereby, the light transmittance of the substrate 21 can be lowered to suppress the color shift of the light emitted from the LED modules 20a and 20b. In addition, it is possible to reduce the cost of the light bulb shaped lamp 1 by using a low cost white substrate as the substrate 21.
  • the back surface of the substrate 21 is adhesively fixed to the support 40 so as to contact the support 40, and the LED modules 20a and 20b are directly fixed to the support 40. .
  • the heat dissipation efficiency of the substrate 21 can be enhanced. As a result, it is possible to suppress the decrease in the light emission efficiency and the life of the LEDs 22 and 32 due to the temperature rise.
  • the bulb-type lamp 1 according to the present modification is the above-described embodiment in that the substrate 21 of the LED module is configured by bonding the two substrates including the light source and the wiring for emitting light on the surface with an adhesive. It differs from the light bulb shaped lamp 1 in the form.
  • points different from the light bulb shaped lamp 1 of the above embodiment will be mainly described in detail.
  • FIG. 6 is a view showing the configuration of the light bulb shaped lamp 1 according to the present modification.
  • FIG. 6 is a top view when the LED module 120a is seen from upper direction in the state except the globe 10 in the light bulb shaped lamp 1 which concerns on this modification.
  • (b) of FIG. 6 is a cross-sectional view of the same light bulb shaped lamp 1 cut along the AA 'line of (a)
  • (c) of FIG. 6 is a BB' line of (a) 6
  • (d) is a cross-sectional view of the same light bulb-shaped lamp 1 taken along the line CC 'of FIG. 6 (a).
  • the LED module 120 a is an example of a main light emitting module (first light emitting module), and has a COB structure in which a bare chip is directly mounted on the surface (one main surface) of the substrate 29.
  • the LED module 120 b is an example of a sub light emitting module (second light emitting module), and has a COB structure in which a bare chip is directly mounted on the surface (one main surface) of the substrate 39.
  • the LED module 120 a includes a substrate 29, a plurality of LEDs 22 provided on the surface of the substrate 29, a sealing member 23, metal wires 24 and 26, a wire 25, a conductive adhesive member 27, and a terminal 28.
  • the LED module 120 b includes a substrate 39, a plurality of LEDs 32 provided on the surface of the substrate 39, a sealing member 33, metal wires 34 and 36, a wire 35, a conductive adhesive member 37 and terminals 38. There is.
  • the substrate 29 is an example of a main substrate, and the substrate 39 is an example of a sub substrate.
  • the substrates 29 and 39 have similar configurations and shapes, and the back surfaces of the substrates 29 and 39 are bonded to each other by an adhesive 90 to constitute one substrate 21.
  • the substrates 29 and 39 are, for example, a ceramic substrate such as aluminum nitride, a metal substrate, a resin substrate, a glass substrate, a flexible substrate, an alumina substrate or the like.
  • the substrate 29 is a rectangular mounting substrate for mounting the LED 22, and the substrate 39 is a rectangular mounting substrate for mounting the LED 32.
  • the substrates 29 and 39 are preferably made of a white substrate such as a white alumina substrate having a low light transmittance with respect to the light emitted from the LEDs 22 and 32, for example, 10% or less.
  • the substrates 29 and 39 have a light reflectance of 50% or more with respect to light emitted from the LEDs 22 and 32, and are substrates having any of Al 2 O 3 , MgO, SiO, and TiO 2 as main components. It can be configured. As a result, it is possible to reduce the light transmittance of the substrate 21 and to suppress the color shift of the light emitted from the LED modules 120a and 120b. In addition, it is possible to reduce the cost of the light bulb shaped lamp 1 by using a low cost white substrate for the substrates 29 and 39.
  • the two through holes 29 b penetrating from the front surface to the back surface of the substrate 29 are provided at both ends in the long side direction of the substrate 29, and both ends from the front surface to the back surface of the substrate 39 also There are two through holes 39b penetrating to the side.
  • the through hole 29 b constitutes a terminal 28 for connecting the lead wire 70 for feeding and the LED module 120 a
  • the through hole 39 b is a terminal 38 for connecting the lead wire 70 for feeding and the LED module 120 b.
  • the through holes 29 b and 39 b are arranged to be continuous to form the through hole 21 b of the substrate 21. Therefore, one lead 70 passes through one continuous through hole 29b and 39b.
  • a central portion of the substrate 29 is provided with one through hole 29a penetrating from the front surface to the rear surface of the substrate 29, and a central portion of the substrate 39 is a single penetration penetrating from the front surface to the rear surface of the substrate 39
  • a hole 39a is provided.
  • the through holes 29 a and 39 a are for fixing the LED modules 120 a and 120 b to the support column 40, and are arranged continuously to constitute one through hole 21 a of the substrate 21. Accordingly, the protrusions 42b of the support column 40 are fitted with the continuous through holes 29a and 39a.
  • the adhesive 90 is provided between the back surface of the substrate 29 and the back surface of the substrate 39 to bond the two, and is made of, for example, a resin such as silicone resin or a metal paste such as Ag paste.
  • a resin such as silicone resin
  • a metal paste such as Ag paste.
  • the thermal conductivity between the substrate 29 and the substrate 39 is enhanced to enhance the thermal conductivity as the substrate 21, so that the heat radiation efficiency of the substrate 21 can be enhanced.
  • the light shielding property of the adhesive 90 that is, the light shielding property of the substrate 21 can be enhanced, it is possible to suppress the color shift due to the light traveling from the front surface to the back surface of the substrates 29 and 39.
  • Adhesive 90 is at least a part of the space between through holes 29b and 39b between the back surface of substrate 29 and the back surface of substrate 39 so as not to prevent lead wire 70 from penetrating through holes 29b and 39b. Not provided. In addition, between the through holes 29a and 39a between the back surface of the substrate 29 and the back surface of the substrate 39, the adhesive 90 does not disturb the engagement of the through holes 29a and 39a with the protrusions of the support column 40. It is not provided in all of the space.
  • the plurality of LEDs 22, the sealing member 23, the metal wires 24 and 26, the wires 25 and the terminals 28 are provided on the surface of the substrate 29.
  • a plurality of LEDs 32, sealing members 33, metal wires 34 and 36, wires 35 and terminals 38 are provided on the surface of the substrate 39.
  • the two lead wires 70 and the terminals 28 are connected by the conductive adhesive member 27, and the two lead wires 70 and the terminals 38 by the conductive adhesive member 37. Is connected. Therefore, compared with the case where the light source and the wiring which makes this light-emit on both surfaces of the surface and back surface of one board
  • the LED module 120 a and the LED module 120 b constitute one double-sided LED module that emits light from both sides. Therefore, in the light bulb shaped lamp 1 of this modification, the light bulb shaped lamp 1 of a simple structure having a wide light distribution angle can be realized for the same reason as the light bulb shaped lamp 1 of the above embodiment.
  • the substrate 21 is composed of the substrate 29 on which the element row of the LEDs 22 is provided and the substrate 39 on which the element row of the LEDs 32 is provided.
  • the substrates 29 and 39 are disposed such that the element rows of the LEDs 22 and the back surfaces on which the element rows of the LEDs 32 are not provided face each other.
  • the LED module 120 b may be adhesively fixed to the support 40.
  • the LED modules 120a and 120b can be manufactured simply by preparing the separate substrates 29 and 39, providing the respective members individually on the respective surfaces, and bonding them, so that the LED modules 120a and 120b can be manufactured. Can be made easier. As a result, it is possible to realize the light bulb shaped lamp 1 which is easy to manufacture.
  • the LED module 120 b is directly attached to the support 40, and the heat generated in the LED module 120 b is transferred to the support 40.
  • the LED module 120a is indirectly attached to the support via the LED module 120b, and the heat generated in the LED module 120a is indirectly transferred to the support via the LED module 120b.
  • an adhesive 90 as a heat conducting member is provided between the LED modules 120a and 120b.
  • the adhesive 90 is any of a thermally conductive resin, a ceramic paste, and a metal paste.
  • the heat radiation efficiency and the light shielding property of the substrate 21 can be enhanced, it is possible to further suppress the decrease in the light emission efficiency and the life of the LEDs 22 and 32, and at the same time further suppress the color shift of the light emitted by the LED modules 120a and 120b. Can.
  • the substrate 39 has a through hole 39 c penetrating from the front surface to the back surface of the substrate 39, and the support 40 is a through hole 39 c of the substrate 39. And may be in contact with the back surface of the substrate 29. That is, the through hole 39 c may be formed to fit the entire fixing portion 42 of the support column 40, and the fixing surface of the fixing portion 42 of the support column 40 and the back surface of the substrate 29 may be bonded by the adhesive 90.
  • the LED modules 120a and 120b can be easily fixed to the support column 40, and the light bulb shaped lamp 1 can be realized which is easy to manufacture.
  • the LED module 120a is adhesively fixed to the support 40 to shorten the heat radiation path from the substrate 29 to the support 40, and heat conduction such as grease is performed between the inner wall of the through hole 39b of the substrate 39 and the fixing portion 42 of the support 40.
  • the heat radiation path from the substrate 39 to the support 40 can be widened by making contact through the members. As a result, it is possible to further suppress the decrease in the light emission efficiency and the life of the LEDs 22 and 32.
  • FIG. 7 is a view showing another configuration of the light bulb shaped lamp 1 according to the present modification
  • FIG. 7 (a) is a plan view when the LED module 120a is viewed from above with the glove 10 removed.
  • (B) of FIG. 7 is a cross-sectional view of the same light bulb shaped lamp 1 taken along the line AA 'of (a)
  • (c) of FIG. 7 is a BB' of (a)
  • FIG. 7 (d) is a cross-sectional view of the same light bulb-shaped lamp 1 taken along the line CC ′ of FIG. 7 (a).
  • the LED is illustrated as a light emitting element in the above embodiment and modification, a semiconductor light emitting element such as a semiconductor laser, or an EL element such as organic EL (Electro Luminescence) or inorganic EL, or other solid light emitting element May be used.
  • a semiconductor light emitting element such as a semiconductor laser
  • an EL element such as organic EL (Electro Luminescence) or inorganic EL, or other solid light emitting element May be used.
  • the LED module set it as the structure of the COB type which mounted the LED chip directly on the board
  • a package type in which the LED chip is mounted in a recess (cavity) of a resin container and the phosphor-containing resin is enclosed in the recess, that is, a surface mount device (SMD) LED element is used.
  • SMD surface mount device
  • an LED module configured by mounting a plurality of the SMD type LED elements as a light emitting element on a substrate may be used.
  • the support has a shape in which the width in the direction in which the LED element rows are arranged narrows in the direction from the support to the LED module.
  • the support may have a shape in which the width in the arrangement direction of the LED element rows is expanded in the direction from the support to the LED module.
  • FIG. 8A is a plan view of the LED module 20 a as viewed from above with the globe 10 removed in the modification of the light bulb shaped lamp 1 according to the present embodiment.
  • (b) of FIG. 8 is a cross-sectional view of the same light bulb shaped lamp 1 cut along the AA 'line of (a), and (c) of FIG. 8 is a BB' line of (a) 4 is a cross-sectional view of the same bulb-shaped lamp 1 taken along the line.
  • (d) of FIG. 8 is a cross-sectional view of the same light bulb shaped lamp 1 cut along the C-C 'line of (a).
  • the lead wire is provided outside the pillar, as shown in the sectional view of the light bulb shaped lamp in FIG. 9, a cavity is provided in the pillar and the lead wire A portion of may be provided in the support cavity.
  • the lead wire directly enters the cavity in the support from the support base and then protrudes from the upper side of the support near the LED module and is connected to the LED module. Thereby, it can reduce that the light of a LED module is interrupted
  • the lead wires are provided to pierce the substrate from the back surface side of the substrate, but may be provided so as to pierce the lead wires from the front surface side of the substrate by turning the lead wires to the front surface side of the substrate.
  • the LED 22 and the sealing member 23 are provided on one surface of the flexible substrate 21F, and the flexible substrate 21F is bent so that the other surfaces are aligned with each other, thereby providing a dual emission type.
  • the LED module may be configured.
  • the double-sided light emitting type LED module may be configured by pasting together the LED module 20b having the SMD structure with the adhesive 90.
  • the upper LED module 20a has a COB structure and the lower LED module 20b has an SMD structure, but the upper LED module 20a has an SMD structure and the lower LED module 20b has a COB structure.
  • the LED 22 and the sealing member 23 may be provided on one surface of the substrate using one substrate, and the LED 22S may be provided on the other surface.
  • a substrate 49X made of a material having a high light reflectance such as white alumina is embedded in a part of a light transmitting substrate 49Y made of a material having a high light transmittance such as light transmitting alumina or glass.
  • a substrate 49 configured as described above is prepared, and the LED 22 and the sealing member 23 are formed on the surface of each of the substrate 49X and the substrate 49Y.
  • the light from the LED 22 and the sealing member 23 provided on the surface of the translucent substrate 49Y transmits the inside of the substrate 49X and is emitted from the opposite side (downward).
  • the light from the LED 22 and the sealing member 23 provided on the surface of the substrate 49X is not transmitted through the substrate 49X, is reflected by the substrate 49X, and travels upward.
  • a light guide plate 59 may be used to constitute a double-sided light emission type LED module.
  • the LEDs 22S are disposed to face the edge portions on both sides of the light guide plate 59.
  • the light extraction efficiency may be improved by, for example, forming a dot pattern on the surface of the light guide plate 59.
  • the double-sided light emitting type LED module is fixed to the support column 40 so that light is mainly emitted upward and downward, as shown in FIGS. 11A and 11B.
  • the double-sided light emitting type LED module may be fixed to the support 40 so that light is emitted mainly in the lateral direction. That is, the LED module may be erected on the support column 40 such that the main surface of the substrate in the double-sided light emission type LED module is substantially parallel to the lamp axis.
  • the double-sided light emission type LED module as shown in FIG. 11A, the one used in the above embodiment (FIG. 1) may be used, or as shown in FIG. 11B, it is shown in FIG. You may use the thing of a structure.
  • ones used in the other modified examples or ones having the configurations shown in FIGS. 10B to 10D may be used.
  • a bulb-shaped lamp having a wide light distribution angle is realized by using a double-sided light emission type LED module that emits light from both sides, but a wide distribution can be achieved by the configuration shown in FIG.
  • a light bulb-shaped lamp may be realized with a light angle.
  • an LED and a sealing member are provided on the upper surface (upper surface) of the substrate 21, and a reflective substrate with high reflectance such as a mirror is provided on the lower surface (lower surface) of the substrate 21. 69 is attached, and the LED 22S is disposed at a position below the reflective substrate 69 (for example, the support 50).
  • the light emitted from the LED 22S can be reflected by the reflective substrate 69 and travel to the base side.
  • the light emitting unit the LED 22 and the sealing member 23
  • light can be extracted to the upper side and the lower side.
  • a light bulb shaped lamp with a light angle can be realized.
  • this invention can also be implement
  • a lighting device 100 As shown in FIG. 13, as a lighting device 100 according to an embodiment of the present invention, a lighting device comprising the above-described bulb-shaped lamp 1 and a lighting fixture (lighting fixture) 200 to which the bulb-shaped lamp 1 is attached. It can be done.
  • the lighting fixture 200 turns off and lights the bulb-shaped lamp 1, and for example, the fixture body 210 attached to the ceiling and a translucent or non-translucent lamp cover covering the bulb-shaped lamp 1 And 220.
  • the fixture body 210 has a socket 211 to which the base of the bulb-shaped lamp 1 is attached and which supplies power to the bulb-shaped lamp 1.
  • a translucent plate may be provided at the opening of the lamp cover 220.
  • the present invention is useful as a light bulb shaped lamp replacing conventional incandescent light bulbs and the like, and can be widely used in lighting devices and the like.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)

Abstract

La présente invention concerne une lampe (1) de type à ampoule, qui comprend un globe (10), des modules DEL (20a et 20b), un montant de soutien (40), une paire de fils conducteurs (70) et un circuit d'éclairage (80). Le module DEL (20a) possède, disposés sur une surface d'une plaque de base (21), un réseau d'éléments de DEL (22) et une paire de bornes (28) et, disposés sur la surface inverse de la plaque de base (21), un réseau d'éléments de DEL (32) et une paire de bornes (38). Les modules DEL (20a et 20b) sont électriquement raccordés en parallèle par le biais de la paire de fils conducteurs (70).
PCT/JP2013/003665 2012-07-17 2013-06-11 Lampe de type à ampoule et dispositif d'éclairage WO2014013671A1 (fr)

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JP2012-159059 2012-07-17
JP2012159059 2012-07-17

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JP2015148730A (ja) * 2014-02-07 2015-08-20 日立アプライアンス株式会社 Ｌｅｄ照明用光拡散部材及びこれを用いたｌｅｄ照明装置
WO2016165870A1 (fr) * 2015-04-15 2016-10-20 Osram Gmbh Moyen d'éclairage pourvu de led
WO2022207603A1 (fr) * 2021-04-01 2022-10-06 Signify Holding B.V. Amélioration optique et thermique d'un filament multicanal à deux côtés

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JP2002164580A (ja) * 2000-11-16 2002-06-07 Jaenam Kim Ｌｅｄランプ装置
JP2010157459A (ja) * 2008-12-31 2010-07-15 Keiji Iimura Ｌｅｄランプおよび電球形ｌｅｄランプ
JP2010251775A (ja) * 2010-06-04 2010-11-04 Sharp Corp 発光装置
JP2012069303A (ja) * 2010-09-21 2012-04-05 Panasonic Corp ランプ及び照明装置
JP2012084394A (ja) * 2010-10-12 2012-04-26 Panasonic Corp ランプ
JP2012084274A (ja) * 2010-10-07 2012-04-26 Toshiba Lighting & Technology Corp 発光装置、光源体および照明器具

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JP2002164580A (ja) * 2000-11-16 2002-06-07 Jaenam Kim Ｌｅｄランプ装置
JP2010157459A (ja) * 2008-12-31 2010-07-15 Keiji Iimura Ｌｅｄランプおよび電球形ｌｅｄランプ
JP2010251775A (ja) * 2010-06-04 2010-11-04 Sharp Corp 発光装置
JP2012069303A (ja) * 2010-09-21 2012-04-05 Panasonic Corp ランプ及び照明装置
JP2012084274A (ja) * 2010-10-07 2012-04-26 Toshiba Lighting & Technology Corp 発光装置、光源体および照明器具
JP2012084394A (ja) * 2010-10-12 2012-04-26 Panasonic Corp ランプ

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015148730A (ja) * 2014-02-07 2015-08-20 日立アプライアンス株式会社 Ｌｅｄ照明用光拡散部材及びこれを用いたｌｅｄ照明装置
WO2016165870A1 (fr) * 2015-04-15 2016-10-20 Osram Gmbh Moyen d'éclairage pourvu de led
US10655791B2 (en) 2015-04-15 2020-05-19 Ledvance Gmbh Luminous means having LEDs
WO2022207603A1 (fr) * 2021-04-01 2022-10-06 Signify Holding B.V. Amélioration optique et thermique d'un filament multicanal à deux côtés

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