WO2014007211A1 - Film de protection destiné à des modules de cellule solaire et module de cellule solaire utilisant celui-ci - Google Patents
Film de protection destiné à des modules de cellule solaire et module de cellule solaire utilisant celui-ci Download PDFInfo
- Publication number
- WO2014007211A1 WO2014007211A1 PCT/JP2013/068034 JP2013068034W WO2014007211A1 WO 2014007211 A1 WO2014007211 A1 WO 2014007211A1 JP 2013068034 W JP2013068034 W JP 2013068034W WO 2014007211 A1 WO2014007211 A1 WO 2014007211A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- solar cell
- layer
- cell module
- protective film
- heat
- Prior art date
Links
- 230000001681 protective effect Effects 0.000 title claims abstract description 90
- 229920005989 resin Polymers 0.000 claims abstract description 136
- 239000011347 resin Substances 0.000 claims abstract description 136
- -1 polyethylene Polymers 0.000 claims abstract description 66
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 52
- 239000000057 synthetic resin Substances 0.000 claims abstract description 52
- 230000007062 hydrolysis Effects 0.000 claims abstract description 50
- 238000006460 hydrolysis reaction Methods 0.000 claims abstract description 50
- 230000004888 barrier function Effects 0.000 claims abstract description 36
- 238000010894 electron beam technology Methods 0.000 claims abstract description 24
- 239000000049 pigment Substances 0.000 claims abstract description 21
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 18
- 229920000573 polyethylene Polymers 0.000 claims abstract description 11
- 239000004698 Polyethylene Substances 0.000 claims abstract description 8
- 238000007789 sealing Methods 0.000 claims description 68
- 239000000463 material Substances 0.000 claims description 59
- 239000000945 filler Substances 0.000 claims description 50
- 239000000758 substrate Substances 0.000 claims description 14
- 238000011049 filling Methods 0.000 claims description 2
- 230000004927 fusion Effects 0.000 abstract description 16
- 230000007547 defect Effects 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 254
- 239000002585 base Substances 0.000 description 64
- 238000000034 method Methods 0.000 description 54
- 239000000853 adhesive Substances 0.000 description 38
- 230000001070 adhesive effect Effects 0.000 description 35
- 239000007789 gas Substances 0.000 description 34
- 229910052809 inorganic oxide Inorganic materials 0.000 description 26
- 239000011248 coating agent Substances 0.000 description 25
- 238000011282 treatment Methods 0.000 description 21
- 239000003963 antioxidant agent Substances 0.000 description 18
- 229920001577 copolymer Polymers 0.000 description 14
- 230000003078 antioxidant effect Effects 0.000 description 13
- 230000000694 effects Effects 0.000 description 13
- 239000004743 Polypropylene Substances 0.000 description 12
- 229920001155 polypropylene Polymers 0.000 description 12
- 239000000654 additive Substances 0.000 description 11
- 229910052782 aluminium Inorganic materials 0.000 description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 11
- 239000005038 ethylene vinyl acetate Substances 0.000 description 11
- 238000010438 heat treatment Methods 0.000 description 11
- 238000010030 laminating Methods 0.000 description 11
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 11
- 229920000728 polyester Polymers 0.000 description 11
- 230000002829 reductive effect Effects 0.000 description 11
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 10
- 239000011888 foil Substances 0.000 description 10
- 238000003475 lamination Methods 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 10
- 238000007740 vapor deposition Methods 0.000 description 10
- 239000002216 antistatic agent Substances 0.000 description 9
- 238000000576 coating method Methods 0.000 description 9
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 8
- 239000003063 flame retardant Substances 0.000 description 8
- 239000011737 fluorine Substances 0.000 description 8
- 229910052731 fluorine Inorganic materials 0.000 description 8
- 239000012939 laminating adhesive Substances 0.000 description 8
- 229920000642 polymer Polymers 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 239000006096 absorbing agent Substances 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 7
- 238000005229 chemical vapour deposition Methods 0.000 description 7
- 238000004132 cross linking Methods 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- 150000001451 organic peroxides Chemical class 0.000 description 7
- 229920001225 polyester resin Polymers 0.000 description 7
- 239000011112 polyethylene naphthalate Substances 0.000 description 7
- 229920000139 polyethylene terephthalate Polymers 0.000 description 7
- 239000005020 polyethylene terephthalate Substances 0.000 description 7
- 229920005672 polyolefin resin Polymers 0.000 description 7
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 6
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 6
- 239000005977 Ethylene Substances 0.000 description 6
- 239000006087 Silane Coupling Agent Substances 0.000 description 6
- 125000004122 cyclic group Chemical group 0.000 description 6
- 230000006866 deterioration Effects 0.000 description 6
- 239000000178 monomer Substances 0.000 description 6
- 238000005240 physical vapour deposition Methods 0.000 description 6
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 6
- 239000004645 polyester resin Substances 0.000 description 6
- 229920013716 polyethylene resin Polymers 0.000 description 6
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 6
- 230000037303 wrinkles Effects 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 125000003118 aryl group Chemical group 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- 238000000354 decomposition reaction Methods 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 229920000098 polyolefin Polymers 0.000 description 5
- 238000004381 surface treatment Methods 0.000 description 5
- 229920000178 Acrylic resin Polymers 0.000 description 4
- 239000004925 Acrylic resin Substances 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 230000001133 acceleration Effects 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- ZSWFCLXCOIISFI-UHFFFAOYSA-N cyclopentadiene Chemical compound C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 4
- 239000004088 foaming agent Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000003999 initiator Substances 0.000 description 4
- 239000000314 lubricant Substances 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 229920002620 polyvinyl fluoride Polymers 0.000 description 4
- 239000012744 reinforcing agent Substances 0.000 description 4
- 239000012783 reinforcing fiber Substances 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 239000012463 white pigment Substances 0.000 description 4
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 229940121375 antifungal agent Drugs 0.000 description 3
- 239000003429 antifungal agent Substances 0.000 description 3
- 150000001718 carbodiimides Chemical class 0.000 description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 3
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 description 3
- 238000003776 cleavage reaction Methods 0.000 description 3
- 238000013329 compounding Methods 0.000 description 3
- 238000003851 corona treatment Methods 0.000 description 3
- 230000032798 delamination Effects 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- UHPJWJRERDJHOJ-UHFFFAOYSA-N ethene;naphthalene-1-carboxylic acid Chemical compound C=C.C1=CC=C2C(C(=O)O)=CC=CC2=C1 UHPJWJRERDJHOJ-UHFFFAOYSA-N 0.000 description 3
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 230000001678 irradiating effect Effects 0.000 description 3
- 239000004611 light stabiliser Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 229920005668 polycarbonate resin Polymers 0.000 description 3
- 239000004431 polycarbonate resin Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 229920005990 polystyrene resin Polymers 0.000 description 3
- 229920002635 polyurethane Polymers 0.000 description 3
- 239000004814 polyurethane Substances 0.000 description 3
- 239000011118 polyvinyl acetate Substances 0.000 description 3
- 229920002689 polyvinyl acetate Polymers 0.000 description 3
- 239000004800 polyvinyl chloride Substances 0.000 description 3
- 229920000915 polyvinyl chloride Polymers 0.000 description 3
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 3
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 3
- 229920002050 silicone resin Polymers 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229920005992 thermoplastic resin Polymers 0.000 description 3
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 3
- 238000004383 yellowing Methods 0.000 description 3
- BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical compound FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 description 2
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- 229920002126 Acrylic acid copolymer Polymers 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- QOSSAOTZNIDXMA-UHFFFAOYSA-N Dicylcohexylcarbodiimide Chemical compound C1CCCCC1N=C=NC1CCCCC1 QOSSAOTZNIDXMA-UHFFFAOYSA-N 0.000 description 2
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 2
- 229910000640 Fe alloy Inorganic materials 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 2
- 239000002033 PVDF binder Substances 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004962 Polyamide-imide Substances 0.000 description 2
- 239000004695 Polyether sulfone Substances 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000011354 acetal resin Substances 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 229920001893 acrylonitrile styrene Polymers 0.000 description 2
- CYUOWZRAOZFACA-UHFFFAOYSA-N aluminum iron Chemical compound [Al].[Fe] CYUOWZRAOZFACA-UHFFFAOYSA-N 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- RPPBZEBXAAZZJH-UHFFFAOYSA-N cadmium telluride Chemical compound [Te]=[Cd] RPPBZEBXAAZZJH-UHFFFAOYSA-N 0.000 description 2
- 239000001913 cellulose Substances 0.000 description 2
- 229920002678 cellulose Polymers 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- MGNZXYYWBUKAII-UHFFFAOYSA-N cyclohexa-1,3-diene Chemical compound C1CC=CC=C1 MGNZXYYWBUKAII-UHFFFAOYSA-N 0.000 description 2
- 238000006356 dehydrogenation reaction Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 229910001882 dioxygen Inorganic materials 0.000 description 2
- 208000028659 discharge Diseases 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 description 2
- 229920005648 ethylene methacrylic acid copolymer Polymers 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- XUCNUKMRBVNAPB-UHFFFAOYSA-N fluoroethene Chemical compound FC=C XUCNUKMRBVNAPB-UHFFFAOYSA-N 0.000 description 2
- HCDGVLDPFQMKDK-UHFFFAOYSA-N hexafluoropropylene Chemical group FC(F)=C(F)C(F)(F)F HCDGVLDPFQMKDK-UHFFFAOYSA-N 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 238000007733 ion plating Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229940117841 methacrylic acid copolymer Drugs 0.000 description 2
- CMESPBFFDMPSIY-UHFFFAOYSA-N n,n'-diphenylmethanediimine Chemical compound C1=CC=CC=C1N=C=NC1=CC=CC=C1 CMESPBFFDMPSIY-UHFFFAOYSA-N 0.000 description 2
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 2
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 2
- SJYNFBVQFBRSIB-UHFFFAOYSA-N norbornadiene Chemical compound C1=CC2C=CC1C2 SJYNFBVQFBRSIB-UHFFFAOYSA-N 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 235000021317 phosphate Nutrition 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 2
- 238000009832 plasma treatment Methods 0.000 description 2
- 229920002493 poly(chlorotrifluoroethylene) Polymers 0.000 description 2
- 229920002492 poly(sulfone) Polymers 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920006122 polyamide resin Polymers 0.000 description 2
- 229920002312 polyamide-imide Polymers 0.000 description 2
- 239000005023 polychlorotrifluoroethylene (PCTFE) polymer Substances 0.000 description 2
- 229920006393 polyether sulfone Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 239000003505 polymerization initiator Substances 0.000 description 2
- 229920006324 polyoxymethylene Polymers 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 229920005749 polyurethane resin Polymers 0.000 description 2
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 2
- 239000002987 primer (paints) Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- SCUZVMOVTVSBLE-UHFFFAOYSA-N prop-2-enenitrile;styrene Chemical compound C=CC#N.C=CC1=CC=CC=C1 SCUZVMOVTVSBLE-UHFFFAOYSA-N 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 2
- 230000007017 scission Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- FVQMJJQUGGVLEP-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOOC(C)(C)C FVQMJJQUGGVLEP-UHFFFAOYSA-N 0.000 description 1
- QEQBMZQFDDDTPN-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy benzenecarboperoxoate Chemical compound CC(C)(C)OOOC(=O)C1=CC=CC=C1 QEQBMZQFDDDTPN-UHFFFAOYSA-N 0.000 description 1
- KDGNCLDCOVTOCS-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy propan-2-yl carbonate Chemical compound CC(C)OC(=O)OOC(C)(C)C KDGNCLDCOVTOCS-UHFFFAOYSA-N 0.000 description 1
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- RIPYNJLMMFGZSX-UHFFFAOYSA-N (5-benzoylperoxy-2,5-dimethylhexan-2-yl) benzenecarboperoxoate Chemical compound C=1C=CC=CC=1C(=O)OOC(C)(C)CCC(C)(C)OOC(=O)C1=CC=CC=C1 RIPYNJLMMFGZSX-UHFFFAOYSA-N 0.000 description 1
- BLKRGXCGFRXRNQ-SNAWJCMRSA-N (z)-3-carbonoperoxoyl-4,4-dimethylpent-2-enoic acid Chemical compound OC(=O)/C=C(C(C)(C)C)\C(=O)OO BLKRGXCGFRXRNQ-SNAWJCMRSA-N 0.000 description 1
- VMJIDDGLSSJEFK-UHFFFAOYSA-N 1,1,5-trimethyl-3,3-bis(2-methylbutan-2-ylperoxy)cyclohexane Chemical compound CCC(C)(C)OOC1(OOC(C)(C)CC)CC(C)CC(C)(C)C1 VMJIDDGLSSJEFK-UHFFFAOYSA-N 0.000 description 1
- DHKHKXVYLBGOIT-UHFFFAOYSA-N 1,1-Diethoxyethane Chemical compound CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- IMYCVFRTNVMHAD-UHFFFAOYSA-N 1,1-bis(2-methylbutan-2-ylperoxy)cyclohexane Chemical compound CCC(C)(C)OOC1(OOC(C)(C)CC)CCCCC1 IMYCVFRTNVMHAD-UHFFFAOYSA-N 0.000 description 1
- NALFRYPTRXKZPN-UHFFFAOYSA-N 1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane Chemical compound CC1CC(C)(C)CC(OOC(C)(C)C)(OOC(C)(C)C)C1 NALFRYPTRXKZPN-UHFFFAOYSA-N 0.000 description 1
- MFEVGQHCNVXMER-UHFFFAOYSA-L 1,3,2$l^{2}-dioxaplumbetan-4-one Chemical compound [Pb+2].[O-]C([O-])=O MFEVGQHCNVXMER-UHFFFAOYSA-L 0.000 description 1
- MPJPKEMZYOAIRN-UHFFFAOYSA-N 1,3,5-tris(2-methylprop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound CC(=C)CN1C(=O)N(CC(C)=C)C(=O)N(CC(C)=C)C1=O MPJPKEMZYOAIRN-UHFFFAOYSA-N 0.000 description 1
- BDNKZNFMNDZQMI-UHFFFAOYSA-N 1,3-diisopropylcarbodiimide Chemical compound CC(C)N=C=NC(C)C BDNKZNFMNDZQMI-UHFFFAOYSA-N 0.000 description 1
- AYMDJPGTQFHDSA-UHFFFAOYSA-N 1-(2-ethenoxyethoxy)-2-ethoxyethane Chemical compound CCOCCOCCOC=C AYMDJPGTQFHDSA-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- YIKSHDNOAYSSPX-UHFFFAOYSA-N 1-propan-2-ylthioxanthen-9-one Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C=CC=C2C(C)C YIKSHDNOAYSSPX-UHFFFAOYSA-N 0.000 description 1
- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 description 1
- DPGYCJUCJYUHTM-UHFFFAOYSA-N 2,4,4-trimethylpentan-2-yloxy 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOOC(C)(C)CC(C)(C)C DPGYCJUCJYUHTM-UHFFFAOYSA-N 0.000 description 1
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 description 1
- DMWVYCCGCQPJEA-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane Chemical compound CC(C)(C)OOC(C)(C)CCC(C)(C)OOC(C)(C)C DMWVYCCGCQPJEA-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 description 1
- NPSJHQMIVNJLNN-UHFFFAOYSA-N 2-ethylhexyl 4-nitrobenzoate Chemical compound CCCCC(CC)COC(=O)C1=CC=C([N+]([O-])=O)C=C1 NPSJHQMIVNJLNN-UHFFFAOYSA-N 0.000 description 1
- 239000004808 2-ethylhexylester Substances 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- IFXDUNDBQDXPQZ-UHFFFAOYSA-N 2-methylbutan-2-yl 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOC(C)(C)CC IFXDUNDBQDXPQZ-UHFFFAOYSA-N 0.000 description 1
- HDCMRFUDMYGBFU-UHFFFAOYSA-N 2-methylbutan-2-yl 7-methyloctaneperoxoate Chemical compound CCC(C)(C)OOC(=O)CCCCCC(C)C HDCMRFUDMYGBFU-UHFFFAOYSA-N 0.000 description 1
- RFSCGDQQLKVJEJ-UHFFFAOYSA-N 2-methylbutan-2-yl benzenecarboperoxoate Chemical compound CCC(C)(C)OOC(=O)C1=CC=CC=C1 RFSCGDQQLKVJEJ-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- BIISIZOQPWZPPS-UHFFFAOYSA-N 2-tert-butylperoxypropan-2-ylbenzene Chemical compound CC(C)(C)OOC(C)(C)C1=CC=CC=C1 BIISIZOQPWZPPS-UHFFFAOYSA-N 0.000 description 1
- ZDZYGYFHTPFREM-UHFFFAOYSA-N 3-[3-aminopropyl(dimethoxy)silyl]oxypropan-1-amine Chemical compound NCCC[Si](OC)(OC)OCCCN ZDZYGYFHTPFREM-UHFFFAOYSA-N 0.000 description 1
- ZLAOXGYWRBSWOY-UHFFFAOYSA-N 3-chloropropyl(methoxy)silane Chemical compound CO[SiH2]CCCCl ZLAOXGYWRBSWOY-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- NEQFBGHQPUXOFH-UHFFFAOYSA-N 4-(4-carboxyphenyl)benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1C1=CC=C(C(O)=O)C=C1 NEQFBGHQPUXOFH-UHFFFAOYSA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- 229920001651 Cyanoacrylate Polymers 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000004831 Hot glue Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 1
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 description 1
- 229910000003 Lead carbonate Inorganic materials 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- NQSMEZJWJJVYOI-UHFFFAOYSA-N Methyl 2-benzoylbenzoate Chemical compound COC(=O)C1=CC=CC=C1C(=O)C1=CC=CC=C1 NQSMEZJWJJVYOI-UHFFFAOYSA-N 0.000 description 1
- MWCLLHOVUTZFKS-UHFFFAOYSA-N Methyl cyanoacrylate Chemical compound COC(=O)C(=C)C#N MWCLLHOVUTZFKS-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 229920001774 Perfluoroether Polymers 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229920001214 Polysorbate 60 Polymers 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- 239000002174 Styrene-butadiene Substances 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- 239000004830 Super Glue Substances 0.000 description 1
- 229920003182 Surlyn® Polymers 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 240000001417 Vigna umbellata Species 0.000 description 1
- 235000011453 Vigna umbellata Nutrition 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- DBHQYYNDKZDVTN-UHFFFAOYSA-N [4-(4-methylphenyl)sulfanylphenyl]-phenylmethanone Chemical compound C1=CC(C)=CC=C1SC1=CC=C(C(=O)C=2C=CC=CC=2)C=C1 DBHQYYNDKZDVTN-UHFFFAOYSA-N 0.000 description 1
- KTSFMFGEAAANTF-UHFFFAOYSA-N [Cu].[Se].[Se].[In] Chemical compound [Cu].[Se].[Se].[In] KTSFMFGEAAANTF-UHFFFAOYSA-N 0.000 description 1
- AUNAPVYQLLNFOI-UHFFFAOYSA-L [Pb++].[Pb++].[Pb++].[O-]S([O-])(=O)=O.[O-][Cr]([O-])(=O)=O.[O-][Mo]([O-])(=O)=O Chemical compound [Pb++].[Pb++].[Pb++].[O-]S([O-])(=O)=O.[O-][Cr]([O-])(=O)=O.[O-][Mo]([O-])(=O)=O AUNAPVYQLLNFOI-UHFFFAOYSA-L 0.000 description 1
- NOZAQBYNLKNDRT-UHFFFAOYSA-N [diacetyloxy(ethenyl)silyl] acetate Chemical compound CC(=O)O[Si](OC(C)=O)(OC(C)=O)C=C NOZAQBYNLKNDRT-UHFFFAOYSA-N 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 125000004018 acid anhydride group Chemical group 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229910052910 alkali metal silicate Inorganic materials 0.000 description 1
- 150000008051 alkyl sulfates Chemical class 0.000 description 1
- 125000000746 allylic group Chemical group 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 229920003180 amino resin Polymers 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000003373 anti-fouling effect Effects 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 239000010426 asphalt Substances 0.000 description 1
- IRERQBUNZFJFGC-UHFFFAOYSA-L azure blue Chemical compound [Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[S-]S[S-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-] IRERQBUNZFJFGC-UHFFFAOYSA-L 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 239000002981 blocking agent Substances 0.000 description 1
- 239000001055 blue pigment Substances 0.000 description 1
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 1
- BXIQXYOPGBXIEM-UHFFFAOYSA-N butyl 4,4-bis(tert-butylperoxy)pentanoate Chemical compound CCCCOC(=O)CCC(C)(OOC(C)(C)C)OOC(C)(C)C BXIQXYOPGBXIEM-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 125000003262 carboxylic acid ester group Chemical group [H]C([H])([*:2])OC(=O)C([H])([H])[*:1] 0.000 description 1
- 150000001733 carboxylic acid esters Chemical class 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 239000012461 cellulose resin Substances 0.000 description 1
- 238000006757 chemical reactions by type Methods 0.000 description 1
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- ISAOCJYIOMOJEB-UHFFFAOYSA-N desyl alcohol Natural products C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 230000032050 esterification Effects 0.000 description 1
- 238000005886 esterification reaction Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 229920006226 ethylene-acrylic acid Polymers 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000000417 fungicide Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 150000002462 imidazolines Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 150000002505 iron Chemical class 0.000 description 1
- WTFXARWRTYJXII-UHFFFAOYSA-N iron(2+);iron(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[Fe+2].[Fe+3].[Fe+3] WTFXARWRTYJXII-UHFFFAOYSA-N 0.000 description 1
- SZVJSHCCFOBDDC-UHFFFAOYSA-N iron(II,III) oxide Inorganic materials O=[Fe]O[Fe]O[Fe]=O SZVJSHCCFOBDDC-UHFFFAOYSA-N 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- 230000001050 lubricating effect Effects 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229920001179 medium density polyethylene Polymers 0.000 description 1
- 239000004701 medium-density polyethylene Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000002816 methylsulfanyl group Chemical group [H]C([H])([H])S[*] 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- FEKRFYZGYUTGRY-UHFFFAOYSA-N n'-ethylmethanediimine Chemical compound CCN=C=N FEKRFYZGYUTGRY-UHFFFAOYSA-N 0.000 description 1
- CHDRADPXNRULGA-UHFFFAOYSA-N naphthalene-1,3-dicarboxylic acid Chemical compound C1=CC=CC2=CC(C(=O)O)=CC(C(O)=O)=C21 CHDRADPXNRULGA-UHFFFAOYSA-N 0.000 description 1
- ABMFBCRYHDZLRD-UHFFFAOYSA-N naphthalene-1,4-dicarboxylic acid Chemical compound C1=CC=C2C(C(=O)O)=CC=C(C(O)=O)C2=C1 ABMFBCRYHDZLRD-UHFFFAOYSA-N 0.000 description 1
- DFFZOPXDTCDZDP-UHFFFAOYSA-N naphthalene-1,5-dicarboxylic acid Chemical compound C1=CC=C2C(C(=O)O)=CC=CC2=C1C(O)=O DFFZOPXDTCDZDP-UHFFFAOYSA-N 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 125000005474 octanoate group Chemical group 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000001054 red pigment Substances 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 125000005372 silanol group Chemical group 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000011115 styrene butadiene Substances 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- ZUSDEBDNDIJDMZ-UHFFFAOYSA-N tert-butyl 7-methyloctaneperoxoate Chemical compound CC(C)CCCCCC(=O)OOC(C)(C)C ZUSDEBDNDIJDMZ-UHFFFAOYSA-N 0.000 description 1
- SWAXTRYEYUTSAP-UHFFFAOYSA-N tert-butyl ethaneperoxoate Chemical compound CC(=O)OOC(C)(C)C SWAXTRYEYUTSAP-UHFFFAOYSA-N 0.000 description 1
- DLSMLZRPNPCXGY-UHFFFAOYSA-N tert-butylperoxy 2-ethylhexyl carbonate Chemical compound CCCCC(CC)COC(=O)OOOC(C)(C)C DLSMLZRPNPCXGY-UHFFFAOYSA-N 0.000 description 1
- 238000002230 thermal chemical vapour deposition Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 238000005809 transesterification reaction Methods 0.000 description 1
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/16—Layered products comprising a layer of synthetic resin specially treated, e.g. irradiated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/26—Layered products comprising a layer of synthetic resin characterised by the use of special additives using curing agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/049—Protective back sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/308—Heat stability
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/31—Heat sealable
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
- B32B2307/402—Coloured
- B32B2307/4026—Coloured within the layer by addition of a colorant, e.g. pigments, dyes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
- B32B2307/412—Transparent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
- B32B2307/414—Translucent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/554—Wear resistance
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/712—Weather resistant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/724—Permeability to gases, adsorption
- B32B2307/7242—Non-permeable
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/12—Photovoltaic modules
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/322—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of solar panels
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/04—Presence of homo or copolymers of ethene
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- the present invention relates to a protective film suitably used for a solar cell module and a solar cell module using the protective film.
- This solar battery is generally composed of a plurality of solar battery modules that are packaged by a plurality of solar battery cells wired in series or in parallel.
- the solar cell module is required to have sufficient durability and weather resistance that can be used outdoors for a long time.
- a transparent substrate 32 made of glass or the like As a specific structure of the general solar cell module 31, as shown in FIG. 5, a transparent substrate 32 made of glass or the like, a surface side filler layer 33 made of a thermoplastic resin, and a photovoltaic element
- the solar battery cell 34, the back side filler layer 35 made of a thermoplastic resin, and a solar cell module backsheet 40 (hereinafter simply referred to as a backsheet) are laminated in this order and integrally formed. (See, for example, JP 2009-302361 A).
- the back-side filler layer 35 is formed of, for example, ethylene-vinyl acetate copolymer resin (EVA), and the back sheet 40 has a heat melting layer formed of a thermoplastic polyethylene resin.
- a resin layer 36 is provided. And in the said integral molding, generally the laminated body laminated
- the heat-sealing resin layer 36 heat-fuses the back side filler layer 35 and the back sheet 40 by melting by heating and solidification by subsequent cooling. At this time, if the heat-sealing resin layer 35 flows excessively, problems such as leakage from the sheets, generation of wrinkles, thickness non-uniformity, and the like occur, leading to deterioration in quality. However, if the heating temperature is lowered to prevent these problems, sufficient fusion strength cannot be obtained. Therefore, a means for preventing such a problem is required.
- This invention is made
- a base layer made of synthetic resin A heat-sealing resin layer laminated on one surface side of the base material layer, It is a protective film for a solar cell module in which a synthetic resin that is a main component of the heat-sealing resin layer is crosslinked by electron beam irradiation.
- the solar cell module protective film is bonded to the front surface side or the back surface side of the solar cell module by thermally fusing the heat sealing resin layer, and can protect the components of the solar cell module. And since the synthetic resin which is a main component of a heat-fusion resin layer has high heat resistance by being bridge
- the synthetic resin that is the main component of the heat-sealing resin layer is preferably polyethylene.
- polyethylene is usually used for the hydrolysis resistance of the protective film for solar cell module and the filler layer of the protective film for solar cell module and solar cell module. Adhesiveness with the ethylene vinyl acetate copolymer (EVA) can be improved.
- the heat-sealing resin layer may contain a crosslinking agent.
- a crosslinking agent to the heat-sealing resin layer.
- the addition of a cross-linking agent makes the cross-linking reaction of the polypropylene electron irradiation superior to the molecular cutting reaction, and heat resistance is maintained while maintaining the strength of the polypropylene. Can be raised.
- a pigment is dispersed and contained in the heat-sealing resin layer.
- the dispersion of the pigment in the heat-sealing resin layer can improve the heat resistance, thermal dimensional stability, weather resistance, strength, aging resistance, etc. of the protective film for solar cell module. it can.
- the irradiation dose of the electron beam is preferably 5 kGy or more and 300 kGy or less.
- heat resistance can be raised, suppressing deterioration of a heat sealing
- the durability, weather resistance, etc. of the protective film for solar cell module can be dramatically improved.
- the solar cell module which can be used suitably for a long time use outdoors is obtained by using the said protective film for solar cell modules excellent in durability, a weather resistance, etc. in this way.
- a gas barrier layer may be further provided on the other surface side of the base material layer.
- steam, etc. can be provided to the said protective film for solar cell modules.
- the solar cell module which can be used suitably for a long time use outdoors is obtained by using the said protective film for solar cell modules which has gas barrier property in this way.
- the average thickness of the base material layer is preferably 50 ⁇ m or more and 500 ⁇ m or less.
- the average thickness of the base material layer is preferably 50 ⁇ m or more and 500 ⁇ m or less.
- the solar cell module protective film may be used as a back sheet of the solar cell module.
- a photovoltaic cell can be protected easily and reliably by using the said protective film for solar cell modules as a solar cell module backsheet.
- Another invention made to solve the above problems is as follows: The protective film for the solar cell module; A filler layer thermally fused to the surface of the protective film for the solar cell module; Solar cells disposed in the filler layer; A translucent substrate disposed on the surface of the filling layer.
- the synthetic resin constituting the heat-sealing resin layer of the protective film for solar cell modules is cross-linked by electron beam irradiation, between the sheets of the heat-sealing resin layer at the time of heat-sealing the protective film Problems such as leakage, wrinkles, and uneven thickness are prevented. Therefore, the solar cell module is excellent in productivity and quality.
- the “back surface” means the surface opposite to the light receiving surface of the solar cell module.
- the solar cell module protective film of the present invention can prevent problems during heat fusion, and can improve the productivity and quality of the solar cell module.
- a back sheet for a solar cell module (hereinafter sometimes referred to as a back sheet) shown in FIG. 1 and FIG.
- the protective film 1 for solar cell modules of the first embodiment includes a base material layer 2 formed in a sheet shape and a heat-sealing resin layer 3 laminated on the surface side (light receiving side) of the base material layer 2. ing.
- the base material layer 2 is formed with a synthetic resin as a main component.
- the synthetic resin used for the base material layer 2 is not particularly limited.
- ABS resin -Butadiene-styrene copolymer
- polyvinyl chloride resin fluorine resin
- poly (meth) acrylic resin polycarbonate resin
- polyester resin polyamide resin
- polyimide resin polyamideimide resin
- polyaryl phthalate resins silicone resins
- polysulfone resins polyphenylene sulfide resins
- polyether sulfone resins polyurethane resins
- acetal resins acetal resins
- cellulose resins Among the above resins, polyester resins, fluorine resins, and cyclic polyolefin resins having high heat resistance, strength, weather resistance, durability, gas barrier properties against water vapor and the like are preferable.
- polyester resin examples include polyethylene terephthalate and polyethylene naphthalate.
- polyester-based resins polyethylene terephthalate is particularly preferable because it has a good balance between various functions such as heat resistance and weather resistance, and price.
- fluororesin examples include polytetrafluoroethylene (PTFE), perfluoroalkoxy resin (PFA) made of a copolymer of tetrafluoroethylene and perfluoroalkyl vinyl ether, and a copolymer of tetrafluoroethylene and hexafluoropropylene (FEP).
- PTFE polytetrafluoroethylene
- PFA perfluoroalkoxy resin
- FEP hexafluoropropylene
- cyclic polyolefin-based resin examples include (a) polymerizing cyclic dienes such as cyclopentadiene (and derivatives thereof), dicyclopentadiene (and derivatives thereof), cyclohexadiene (and derivatives thereof), norbornadiene (and derivatives thereof), and the like. (B) a copolymer obtained by copolymerizing the cyclic diene with one or more olefinic monomers such as ethylene, propylene, 4-methyl-1-pentene, styrene, butadiene, and isoprene. Can be mentioned.
- cyclopentadiene (and derivatives thereof), dicyclopentadiene (and derivatives thereof) or norbornadiene (and derivatives thereof) such as polymers having excellent strength, heat resistance, and weather resistance are particularly preferred. preferable.
- the said synthetic resin can be used 1 type or in mixture of 2 or more types.
- additives and the like can be mixed in the forming material of the base material layer 2 for the purpose of improving and modifying processability, heat resistance, weather resistance, mechanical properties, dimensional stability, and the like.
- the additive include an ultraviolet absorber, an antistatic agent, a lubricant, a crosslinking agent, an antioxidant, a light stabilizer, a filler, a reinforcing fiber, a reinforcing agent, a flame retardant, a flame retardant, a foaming agent, and an antifungal agent. Agents and the like.
- a pigment to be dispersedly contained in the heat sealing resin layer 3 described later may be dispersedly contained in the base material layer 2.
- the ultraviolet absorber is not particularly limited as long as it is a compound that absorbs ultraviolet rays and can be efficiently converted into thermal energy and is stable to light, and a known one may be used. it can. Among them, salicylic acid-based UV absorbers, benzophenone-based UV absorbers, and benzotriazole-based UV rays that have a high UV-absorbing function, have good compatibility with the synthetic resin forming the base material layer, and are stably present in the synthetic resin Absorbers and cyanoacrylate ultraviolet absorbers are preferred, and one or more selected from these groups may be used. As the ultraviolet absorber, a polymer having an ultraviolet absorbing group in the molecular chain is also preferably used.
- the lower limit of the content of the ultraviolet absorber is preferably 0.1% by mass, more preferably 1% by mass, and even more preferably 3% by mass.
- an upper limit of content of a ultraviolet absorber 10 mass% is preferable, 8 mass% is more preferable, and 5 mass% is further more preferable.
- antistatic agent examples include anionic antistatic agents such as alkyl sulfates and alkyl phosphates, cationic antistatic agents such as quaternary ammonium salts and imidazoline compounds, polyethylene glycols, and polyoxyethylene sorbitan monostearic acid.
- anionic antistatic agents such as esters and ethanolamides
- polymeric antistatic agents such as polyacrylic acid can be used.
- the forming method of the base material layer 2 is not particularly limited, and a known method such as an extrusion method such as a T-die method or an inflation method, a cast forming method, or a cutting method is employed.
- the lower limit of the thickness (average thickness) of the base material layer 2 is preferably 50 ⁇ m, and more preferably 80 ⁇ m.
- the upper limit of the thickness of the base material layer 2 is preferably 500 ⁇ m, and more preferably 300 ⁇ m.
- the thickness of the base material layer 2 is less than the above lower limit, the basic performance such as strength, impact resistance, heat resistance, and the like of the protective film 1 for the solar cell module may decrease, or the protection for the solar cell module may occur. There is a possibility that inconveniences such as handling of the film 1 become difficult.
- the thickness of the base material layer 2 exceeds the upper limit, the flexibility of the protective film 1 for solar cell module may be lowered. Furthermore, it is contrary to the demand for thinner and lighter solar cell modules.
- the heat-sealing resin layer 3 is a synthetic resin layer that melts when the solar cell module protective film 1 is heat-sealed to the back surface of the solar cell module, and is laminated on the surface of the base material layer 2.
- the synthetic resin used for the heat-sealing resin layer 3 is not particularly limited, and for example, a synthetic resin mainly composed of an ethylene-based polymer or polypropylene can be used.
- the ethylene polymer include polyethylene such as low density polyethylene, medium density polyethylene and high density polyethylene, ethylene- ⁇ olefin copolymer, ethylene- (meth) acrylic acid alkyl ester copolymer, ethylene- (meta ) Acrylic acid copolymer, an ionic cross-linked product of ethylene- (meth) acrylic acid copolymer, ethylene-vinyl ester copolymer, and the like can be used.
- the polypropylene excellent in intensity
- the molecular cleavage reaction at the time of electron irradiation is dominant over the crosslinking reaction, so the strength etc. deteriorates if electron irradiation is performed as it is, but the strength etc. is maintained by adding a crosslinking agent and performing electron irradiation.
- the heat resistance can be increased as it is.
- the said synthetic resin can also be used individually by 1 type, and can also use 2 or more types together.
- a polymer obtained by copolymerizing a compound having a reactive functional group such as a glycidyl group, a silanol group, or an amino group with the ethylene polymer can be used for the heat-sealing resin layer 3.
- a photopolymerization initiator can be added to the ethylene polymer to impart photopolymerizability.
- this photopolymerization initiator for example, a hydrogen abstraction type or an internal cleavage type can be used.
- the hydrogen abstraction type (bimolecular reaction type) photopolymerization initiator for example, benzophenone, methyl orthobenzoylbenzoate, 4-benzoyl-4'-methyldiphenyl sulfide, isopropylthioxanthone and the like can be used.
- the internal cleavage type photopolymerization initiator for example, benzoin alkyl ether, benzyl dimethyl ketal or the like can be used.
- ⁇ -hydroxyalkylphenone type polymerization initiators such as 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1-hydroxycyclohexyl phenyl ketone, alkylphenylglyoxylate, diethoxyacetophenone, 2-methyl ⁇ -aminoalkylphenone type such as -1- [4- (methylthio) phenyl] -2-morpholinopropane-1,2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1
- a polymerization initiator, an acyl phosphine oxide, etc. can be used.
- the synthetic resin constituting the heat-sealing resin layer 3 is cross-linked by electron beam irradiation.
- the molecules of the synthetic resin are cross-linked, and heat resistance and the like are increased.
- the lower limit of the electron beam irradiation dose is preferably 5 Gy, more preferably 10 Gy.
- the upper limit of the electron beam irradiation dose is preferably 300 Gy, more preferably 200 Gy.
- the lower limit of the acceleration voltage of the electron beam is preferably 10 kV, more preferably 50 kV.
- the upper limit of the acceleration voltage of the electron beam is preferably 500 kV, more preferably 400 kV.
- the acceleration voltage is less than the above lower limit, the synthetic resin is not sufficiently cross-linked, and the effect of increasing the heat resistance may not be obtained.
- the acceleration voltage exceeds the above upper limit, the penetrating power of the electron beam becomes strong, which may cause damage to other members and the manufacturing apparatus.
- a cross-linking agent is added to the heat-sealing resin layer 3 in order to enhance the cross-linking reaction during electron beam irradiation.
- the cross-linking agent is not particularly limited as long as it can exhibit a cross-linking reaction between molecules by electron beam irradiation, and a known polyfunctional monomer generally used as a cross-linking agent can be used. It is preferable to use a functional monomer.
- the allyl polyfunctional monomer include triallyl isocyanurate (TAIC), triallyl cyanurate, and trimethallyl isocyanurate. Among these, TAIC is particularly preferable. Two or more kinds of the allylic polyfunctional monomers may be used.
- a minimum of content of a crosslinking agent 1 mass% is preferable and 1.5 mass% is more preferable.
- an upper limit of content of a crosslinking agent 30 mass% is preferable and 20 mass% is more preferable.
- the content of the crosslinking agent is less than the above range, a sufficient crosslinking effect may not be obtained.
- the content of the crosslinking agent exceeds the above range, the quality of the synthetic resin may be deteriorated or molding may be difficult.
- the heat-sealing resin layer 3 may contain a pigment in a dispersed manner. Although it does not specifically limit as this pigment, The white pigment which can provide light diffusibility is preferable.
- the white pigment for example, calcium carbonate, titanium oxide, zinc oxide, lead carbonate, barium sulfate and the like can be used.
- titanium oxide is preferable because it is excellent in dispersibility in the resin material forming the synthetic resin layer and has a relatively large effect of improving whiteness and solar reflectance.
- Non-white pigments include black pigments such as carbon black and black iron oxide, blue pigments such as ultramarine and bitumen, red pigments such as red bean (iron oxide red), cadmium red, and molybdenum orange, and metals that give metallic luster.
- black pigments such as carbon black and black iron oxide
- blue pigments such as ultramarine and bitumen
- red pigments such as red bean (iron oxide red), cadmium red, and molybdenum orange
- a powder pigment etc. are mentioned, The designability of a solar cell module can be improved by carrying out dispersion
- the lower limit of the average particle diameter of the pigment is preferably 100 nm, and more preferably 300 nm.
- an upper limit 30 micrometers is preferable and 3 micrometers is more preferable.
- the average particle diameter of the pigment is less than the above lower limit, uniform dispersion in the heat-sealing resin layer 3 may be difficult due to aggregation or the like.
- the average particle diameter exceeds the above upper limit, the effect of improving various properties such as heat resistance to the heat-sealing resin layer 3 may be reduced.
- the lower limit of the pigment content is preferably 3% by mass, and more preferably 5% by mass.
- an upper limit 30 mass% is preferable and 20 mass% is more preferable.
- the pigment content is less than the above lower limit, the effect of improving the durability, heat resistance, strength, etc. of the heat sealing resin layer 3 may be reduced.
- the pigment content exceeds the above upper limit, the dispersibility of the pigment in the heat-sealing resin layer 3 is lowered, and the strength of the heat-sealing resin layer 3 may be lowered.
- the heat-sealing resin layer 3 is provided with, for example, a heat-resistant agent, an antioxidant, and an ultraviolet ray inhibitor.
- a heat-resistant agent for example, an antioxidant, and an ultraviolet ray inhibitor.
- additives such as an antistatic agent, a solvent, a lubricant, a filler, a reinforcing fiber, a reinforcing agent, a flame retardant, a flame retardant, a foaming agent, and an antifungal agent can be appropriately mixed.
- heat-resistant agent examples include aromatic amine-based antioxidants, hindered phenol-based antioxidants, sulfur-based antioxidants, phosphorus-based antioxidants, and the like. The above can be used.
- the lower limit of the thickness (average thickness) of the heat-sealing resin layer 3 is preferably 10 ⁇ m, and more preferably 50 ⁇ m.
- the upper limit of the thickness of the heat-sealing resin layer 3 is preferably 300 ⁇ m, and more preferably 200 ⁇ m.
- the thickness of the heat-sealing resin layer 3 is less than the above lower limit, the bonding between the solar cell module protective film 1 and the solar cell module filler layer may be insufficient.
- the thickness of the heat-sealing resin layer 3 exceeds the upper limit, the flexibility of the protective film 1 for the solar cell module is reduced, and further, the solar cell module is required to be thin and light. It will be contrary.
- the heat-sealing resin layer 3 can be provided by directly laminating the base material layer 2 by a T-die method using a coextrusion method or the like.
- the heat-sealing resin layer 3 may be separately formed into a film, and then adhered and laminated on the surface of the base material layer 2 with an adhesive.
- attaches via an adhesive agent with the adhesive bond layer formed between the base material layer 2 and the heat sealing
- a laminating adhesive or a melt-extruded resin is used as the adhesive for adhering the base material layer 2 and the heat-sealing resin layer 3.
- the laminating adhesive include a dry laminating adhesive, a wet laminating adhesive, a hot melt laminating adhesive, and a non-solvent laminating adhesive.
- it is excellent in adhesive strength, durability, weather resistance, etc., and has a function of sealing and protecting defects (for example, scratches, pinholes, recesses, etc.) of the base material layer 2 and the like.
- An adhesive is particularly preferred.
- Examples of the adhesive for dry laminate include, for example, polyvinyl acetate adhesive, homopolymers such as ethyl acrylate, butyl, 2-ethylhexyl ester, and copolymers thereof with methyl methacrylate, acrylonitrile, styrene, etc.
- Polyacrylate adhesives cyanoacrylate adhesives, ethylene copolymer adhesives made of copolymers of ethylene and monomers such as vinyl acetate, ethyl acrylate, acrylic acid, methacrylic acid, etc., cellulose Adhesive, polyester adhesive, polyamide adhesive, polyimide adhesive, urea resin, melamine resin, amino resin adhesive, phenol resin adhesive, epoxy adhesive, polyurethane adhesive, reactive type (Meth) acrylic adhesive, chloroprene rubber, nitrile rubber , Styrene - butadiene made of rubber or the like rubber adhesive, a silicone-based adhesive, an alkali metal silicate, inorganic adhesive or the like made of a low-melting glass.
- cellulose Adhesive polyester adhesive, polyamide adhesive, polyimide adhesive, urea resin, melamine resin, amino resin adhesive, phenol resin adhesive, epoxy adhesive, polyurethane adhesive, reactive type (Meth) acrylic adhesive, chloroprene rubber, nitrile rubber , St
- a polyurethane system in which a decrease in adhesive strength and delamination caused by long-term outdoor use of the protective film 1 for solar cell modules is prevented, and deterioration such as yellowing is further reduced.
- Adhesives particularly polyester urethane adhesives are preferred.
- the curing agent is preferably an aliphatic polyisocyanate with little thermal yellowing.
- melt-extruded resin examples include a polyethylene resin, a polypropylene resin, an acid-modified polyethylene resin, an acid-modified polypropylene resin, an ethylene-acrylic acid or methacrylic acid copolymer, a Surlyn resin, and an ethylene-vinyl acetate copolymer.
- thermoplastic resins such as a polymer, a polyvinyl acetate resin, an ethylene-acrylic acid ester or a methacrylic acid ester copolymer, a polystyrene resin, and a polyvinyl chloride resin can be used.
- the above-described anchor coat treatment is performed on the lamination facing surface of the film (or layer) laminated via the adhesive.
- a surface treatment such as the above may be performed.
- the amount of lamination of the above-mentioned adhesive solid content conversion
- 1 g / m 2 is preferred and 3 g / m 2 is especially preferred.
- an upper limit of the lamination amount of the adhesive 20 g / m 2 is preferable, and 15 g / m 2 is particularly preferable.
- the amount of the adhesive layered is less than the above lower limit, the adhesive strength and the defect sealing function may not be obtained.
- the lamination amount of the adhesive exceeds the above upper limit, the lamination strength and durability may be lowered.
- a solvent for example, a solvent, a lubricant, a crosslinking agent, an antioxidant, Various additives such as an antistatic agent, a filler, a reinforcing fiber, a reinforcing agent, a flame retardant, a flame retardant, a foaming agent, an antifungal agent, and a pigment can be appropriately mixed.
- the protective film 1 for the solar cell module When the protective film 1 for the solar cell module is bonded to the front surface side or the back surface side of the solar cell module by heating lamination, the synthetic resin that is the main component of the heat-sealing resin layer 3 is crosslinked by electron beam irradiation. Therefore, excessive flow is suppressed. As a result, the protective film 1 for the solar cell module prevents problems such as leakage from the sheet of the heat sealing resin layer 3 during heat sealing, generation of wrinkles, thickness non-uniformity, and the like easily and reliably. It can be adhered to the filler layer.
- the manufacturing method of the protective film 1 for solar cell modules can be manufactured easily and reliably by the manufacturing method which has the following processes, for example.
- A The process of preparing the composition for thermal fusion resin layers by mixing the synthetic resin etc. which comprise the thermal fusion resin layer 3
- B Extruding the said composition for thermal fusion resin layers, and a thermal fusion resin layer
- C The process of adhering and laminating the heat sealing resin layer 3 to the surface of the base material layer 2
- D The process of irradiating the heat sealing resin layer 3 with an electron beam
- a known method can be appropriately employed, and examples thereof include a T-die method and an inflation method.
- a known device can be used as an apparatus for irradiating an electron beam. Further, the irradiating step may be performed before the heat-sealing resin layer 3 is formed and laminated on the base material layer 2 or after the heat-bonding resin layer 3 is laminated on the base material layer 2.
- heat-sealing resin layer 3 may be laminated by extruding directly on the surface of the base material layer 2.
- the solar cell module 21 in FIG. 4 (a) includes a protective film 1 for the solar cell module, filler layers 22 and 24 thermally fused to the surface of the protective film 1 for the solar cell module, and the filler layer.
- the translucent substrate 25 is laminated on the outermost surface, and has (a) transparency to sunlight and electrical insulation, (b) mechanical, chemical and physical strength, specifically Is excellent in weather resistance, heat resistance, durability, water resistance, gas barrier against water vapor, wind pressure resistance, chemical resistance, fastness, etc., and (c) high surface hardness and surface dirt, dust, etc. It is required to have excellent antifouling properties for preventing accumulation.
- Synthetic resins used for the translucent substrate 25 include, for example, polyethylene resins, polypropylene resins, cyclic polyolefin resins, fluorine resins, polystyrene resins, acrylonitrile-styrene copolymers (AS resins), and acrylonitrile.
- ABS resin butadiene-styrene copolymer
- polyvinyl chloride resin fluorine resin
- fluorine resin poly (meth) acrylic resin
- polycarbonate resin polyester resins such as polyethylene terephthalate and polyethylene naphthalate, various nylons, etc.
- Polyamide resin Polyimide resin, polyamideimide resin, polyaryl phthalate resin, silicone resin, polyphenylene sulfide resin, polysulfone resin, acetal resin, polyethersulfone resin, polyurethane resin Fat, and cellulosic resins.
- resins fluorine resins, cyclic polyolefin resins, polycarbonate resins, poly (meth) acrylic resins, or polyester resins are particularly preferable.
- a transparent vapor deposition film of an inorganic oxide such as silicon oxide or aluminum oxide is laminated on one surface by the PVD method or the CVD method for the purpose of improving gas barrier properties.
- an inorganic oxide such as silicon oxide or aluminum oxide
- heat resistance, weather resistance, mechanical properties, dimensional stability, etc. for example, lubricants, crosslinking agents, antioxidants, ultraviolet absorbers, antistatic agents, light stabilizers
- various additives such as fillers, reinforcing fibers, reinforcing agents, flame retardants, flame retardants, foaming agents, fungicides, and pigments.
- the thickness (average thickness) of the translucent substrate 25 is not particularly limited, and is appropriately selected depending on the material to be used so as to have required strength, gas barrier properties, and the like.
- the thickness of the synthetic resin translucent substrate 25 is preferably, for example, 6 ⁇ m to 300 ⁇ m, and more preferably 9 ⁇ m to 150 ⁇ m. Further, the thickness of the glass translucent substrate 25 is generally about 3 mm.
- the filler layer 22 and the filler layer 24 are filled around the solar battery cell 23, and have scratch resistance, shock absorption, and the like for protecting the solar battery cell 23.
- stacked on the surface of the photovoltaic cell 23 has transparency which permeate
- Examples of the material for forming the filler layer 22 and the filler layer 24 include fluorine resin, ethylene vinyl acetate copolymer resin (EVA), ionomer resin, ethylene-acrylic acid or methacrylic acid copolymer, polyethylene resin, polypropylene resin, Examples include acid-modified polyorene fin-based resins obtained by modifying polyolefin-based resins such as polyethylene with unsaturated carboxylic acids such as acrylic acid, polyvinyl butyral resins, silicone-based resins, epoxy-based resins, and (meth) acrylic resins.
- fluorine resins, ethylene vinyl acetate copolymer resins (EVA), or silicone resins that are excellent in weather resistance, heat resistance, gas barrier properties, and the like are preferable.
- Examples of the material for forming the filler layer 22 and the filler layer 24 include a thermoreversible crosslinkable olefin polymer composition disclosed in JP-A No. 2000-34376, specifically, (a) an unsaturated carboxylic acid anhydride.
- those having a ratio of the number of hydroxyl groups of component (b) to the number of carboxylic anhydride groups of component (a) of 0.1 to 5 are used.
- the forming material of the filler layer 22 and the filler layer 24 is, for example, a crosslinking agent, a thermal antioxidant, a light stabilizer, an ultraviolet absorber, a light absorber, and the like.
- Various additives such as an antioxidant can be appropriately contained.
- the thickness (average thickness) of the filler layer 22 and the filler layer 24 is not particularly limited, but is preferably 200 ⁇ m or more and 1000 ⁇ m or less, and more preferably 350 ⁇ m or more and 600 ⁇ m or less.
- the solar battery cell 23 is a photovoltaic element that converts light energy into electrical energy, and is disposed between the filler layer 22 and the filler layer 24.
- the plurality of solar cells 23 are laid in substantially the same plane, and are wired in series or in parallel although not shown.
- Examples of the solar battery cell 23 include a crystalline silicon solar electronic element such as a single crystal silicon type solar cell element and a polycrystalline silicon type solar cell element, an amorphous silicon solar cell element having a single junction type or a tandem structure type, and gallium arsenide.
- Group 3 to 5 compound semiconductor solar electronic devices such as (GaAs) and indium phosphorus (InP)
- Group 2 to 6 compound semiconductor solar electronic devices such as cadmium tellurium (CdTe) and copper indium selenide (CuInSe 2 ) Etc., and those hybrid elements can also be used.
- the filler layer 22 and the filler layer 24 are also filled between the plurality of solar battery cells 23 without any gap.
- the lower limit of the heating temperature in the vacuum heating lamination method is preferably 100 ° C, more preferably 120 ° C.
- an upper limit of heating temperature 200 degreeC is preferable and 180 degreeC is more preferable.
- the heating temperature is less than the above lower limit, the heat-sealing resin layer 3 is not sufficiently melted, and there is a possibility that adhesion to the filler layer 22 is not sufficiently performed.
- the heating temperature exceeds the above upper limit, the heat-sealing resin layer 3 and other layers of the solar cell module 21 may be deteriorated.
- a hot melt adhesive for example, a solvent type adhesive, Apply photo-curing adhesive, etc., or apply corona discharge treatment, ozone treatment, low temperature plasma treatment, glow discharge treatment, oxidation treatment, primer coating treatment, undercoat treatment, anchor coating treatment, etc. Is possible.
- the solar cell module 21 has high heat resistance when the heat-sealing resin layer 3 of the protective film 1 for solar cell module is irradiated with an electron beam to the synthetic resin as a main component. Thereby, the solar cell module 21 prevents inconveniences such as leakage from the sheets of the heat-sealing resin layer 3, generation of wrinkles, thickness non-uniformity, etc. during vacuum heating lamination in the above manufacturing method, It can be easily and reliably bonded to the filler layer 22. As a result, the solar cell module 21 has high productivity and quality.
- a solar cell module backsheet according to a different embodiment from that shown in FIG. 1 and FIG.
- the heat sealing resin layer 3, the base material layer 2, and the hydrolysis resistant layer 13 are laminated in this order from the surface side (light receiving side).
- the base film 2 and the heat-sealing resin layer 3 are the same as the solar cell module protective film 1 shown in FIG.
- the hydrolysis-resistant layer 13 is formed with a synthetic resin as a main component.
- the synthetic resin as the main component of the hydrolysis-resistant layer 13 include hydrolysis-resistant polyethylene terephthalate, polyethylene naphthalate (PEN), vinyl fluoride resin (PVF), and vinylidene fluoride resin that are excellent in hydrolysis resistance and heat resistance.
- Fluorine resin such as (PVDF) or a copolymer of tetrafluoroethylene and ethylene or propylene (ETFE) can be used.
- the hydrolysis-resistant polyethylene terephthalate is polyethylene terephthalate whose hydrolysis resistance is improved by, for example, reducing the content of low-molecular impurities (oligomers).
- the polyethylene naphthalate is a polyester resin having ethylene naphthalate as a main repeating unit, and is synthesized with naphthalenedicarboxylic acid as a main dicarboxylic acid component and ethylene glycol as a main glycol component.
- the ethylene naphthalate unit is preferably 80 mol% or more of all repeating units of the polyester. If the proportion of ethylene naphthalate units is less than 80 mol%, the hydrolysis resistance, strength, and barrier properties of polyethylene naphthalate may be reduced.
- naphthalenedicarboxylic acid examples include 2,6-naphthalenedicarboxylic acid, 1,4-naphthalenedicarboxylic acid, 1,5-naphthalenedicarboxylic acid, 1,3-naphthalenedicarboxylic acid, and the like. In view of surface, 2,6-naphthalenedicarboxylic acid is particularly preferred.
- the terminal carboxyl group amount of polyethylene naphthalate is preferably 10 eq / T (equivalent / 106 g) or more and 40 eq / T or less, more preferably 10 eq / T or more and 30 eq / T or less, and further preferably 10 eq / T or more and 25 eq / T or less.
- the productivity may decrease.
- the amount of the terminal carboxyl group exceeds the above upper limit, the effect of improving the hydrolysis resistance by the carbodiimide compound may be decreased.
- the manufacturing method of polyethylene naphthalate is not particularly limited, and various known methods such as a transesterification method and a direct esterification method can be employed.
- the hydrolysis-resistant layer 13 may contain a carbodiimide compound in the main component synthetic resin. Thus, by containing a carbodiimide compound, the hydrolysis resistance of the hydrolysis-resistant layer 13 is remarkably improved.
- As content of this carbodiimide compound 0.1 mass% or more and 10 mass% or less are preferable, and 0.5 mass% or more and 3 mass% or less are more preferable.
- content of a carbodiimide compound into the said range, the hydrolysis resistance of the hydrolysis-resistant layer 13 can be improved effectively.
- carbodiimide compound for example, (a) N, N′-diphenylcarbodiimide, N, N′-diisopropylphenylcarbodiimide, N, N′-dicyclohexylcarbodiimide, 1,3-diisopropylcarbodiimide, 1- (3-dimethylaminopropyl) And monocarbodiimides such as 3-ethylcarbodiimide, and (b) polycarbodiimide compounds such as poly (1,3,5-triisopropylphenylene-2,4-carbodiimide).
- the molecular weight of the carbodiimide compound is preferably in the range of 200 to 1000, particularly in the range of 200 to 600.
- the scattering property of the carbodiimide compound may increase, and when the molecular weight exceeds the upper limit, the dispersibility of the carbodiimide compound in the resin may decrease.
- the hydrolysis-resistant layer 13 may contain an antioxidant in addition to the carbodiimide compound in the synthetic resin that is the main component.
- an antioxidant in addition to the carbodiimide compound in the synthetic resin that is the main component.
- the said hydrolysis resistance improves markedly, Furthermore, decomposition
- content of this antioxidant 0.05 mass% or more and 1 mass% or less are preferable, and 0.1 mass% or more and 0.5 mass% or less are more preferable.
- the content of the antioxidant is less than the above lower limit, the carbodiimide degradation inhibiting function and the hydrolysis resistance may be reduced.
- the mass ratio of the antioxidant content to the carbodiimide compound content is preferably 0.1 or more and 1.0 or less, and more preferably 0.15 or more and 0.8 or less. If this mass ratio is less than the above lower limit, the effect of suppressing hydrolysis of carbodiimide itself may be insufficient. On the other hand, if this mass ratio exceeds the above upper limit, the effect of suppressing hydrolysis of carbodiimide will peak. become.
- the addition method of a carbodiimide compound and antioxidant may be a method of kneading to a synthetic resin or a method of adding to a polycondensation reaction of a synthetic resin.
- the hydrolysis-resistant layer 13 may contain an aromatic polyester in addition to the main component synthetic resin.
- the aromatic polyester in addition to the main component synthetic resin.
- the knot strength, the delamination resistance, the mechanical strength, and the like can be improved while maintaining the hydrolysis resistance of the hydrolysis-resistant layer 13. it can.
- content of this aromatic polyester 1 to 10 mass% is preferable. By setting the content of the aromatic polyester within the above range, knot strength, delamination resistance, mechanical strength, and the like can be effectively improved.
- the aromatic polyester is preferably a polyester obtained by copolymerizing a terephthalic acid component and 4,4'-diphenyldicarboxylic acid as a main dicarboxylic acid component and ethylene glycol as a main glycol component.
- the hydrolysis-resistant layer 13 may contain a pigment in a dispersed manner. Although it does not specifically limit as this pigment, The white pigment which can provide light diffusibility is preferable. The type, content, etc. of the white pigment can be the same as those of the heat-sealing resin layer 3.
- the forming method of the hydrolysis-resistant layer 13 and the additives in the forming material of the hydrolysis-resistant layer 13 can be the same as those of the base material layer 2.
- the lower limit of the thickness (average thickness) of the hydrolysis-resistant layer 13 is preferably 12 ⁇ m, and more preferably 20 ⁇ m.
- the upper limit of the thickness of the hydrolysis-resistant layer 13 is preferably 100 ⁇ m, and more preferably 50 ⁇ m.
- the thickness of the hydrolysis-resistant layer 13 is less than the above lower limit, the durability improving effect of the hydrolysis-resistant layer 13 may not be sufficiently exhibited and handling may be difficult.
- the thickness of the hydrolysis-resistant layer 13 exceeds the above upper limit, it is contrary to the demand for thinning and lightening the solar cell module.
- the manufacturing process of the solar cell module protective film 11 can be based on the manufacturing process of the solar cell module protective film 1 shown in FIG. Specifically, the protective film 11 for a solar cell module can be obtained by forming each layer and bonding and laminating these layers using the above-described adhesive. In addition, without using an adhesive, for example, a method of applying and laminating the composition of the heat-sealing resin layer 3 on the surface of the base material layer 2 is performed on each layer, and the solar cell module protective film 11 is formed. It can also be manufactured.
- the solar cell module protective film 11 can be heat-sealed to the filler layer of the solar cell module easily and reliably as in the solar cell module protective film 1 of FIG. Moreover, since the said protective film 11 for solar cell modules is equipped with the hydrolysis-resistant layer 13, it exhibits high durability and a weather resistance.
- the back sheet for a solar cell module according to the embodiment shown in FIGS. 1 and 4A and FIG. 2 shown in FIGS. 3 and 4B will be described.
- the protective film 111 for the solar cell module shown in FIG. 3 the heat sealing resin layer 3, the base material layer 2, the gas barrier layer 12, and the hydrolysis resistant layer 13 are laminated in this order from the surface side (light receiving side). .
- thermolysis-resistant layer 13 Since the heat-sealing resin layer 3, the base material layer 2, and the hydrolysis-resistant layer 13 are the same as the solar cell module protective film 11 in FIG.
- the gas barrier layer 12 is a layer having a function of reducing permeation of gas such as hydrogen gas and oxygen gas.
- the gas barrier layer 12 includes a base film and an inorganic oxide layer laminated on the base film.
- the base film of the gas barrier layer 12 is formed with a synthetic resin as a main component.
- the synthetic resin as the main component of the base film the same synthetic resin as that of the base layer 2 can be used, and among them, polyethylene terephthalate having a good balance of various functions such as heat resistance and weather resistance and price. Is particularly preferred.
- the base film forming method and the additives in the base film forming material can be the same as those of the base material layer 2.
- the lower limit of the thickness (average thickness) of the base film is preferably 7 ⁇ m and more preferably 10 ⁇ m.
- an upper limit of the thickness of a base film 20 micrometers is preferable and 15 micrometers is more preferable.
- the thickness of the base film is less than the above lower limit, there is a possibility that inconveniences such as curling easily occur during vapor deposition for forming the inorganic oxide layer, and handling becomes difficult.
- the thickness of the base film exceeds the above upper limit, it is contrary to the demand for thinning and lightening of the solar cell module.
- the inorganic oxide layer is a layer for expressing gas barrier properties against oxygen, water vapor, and the like, and is formed by depositing an inorganic oxide on the back surface of the base film.
- the vapor deposition means for forming this inorganic oxide layer is not particularly limited as long as the inorganic oxide can be vapor deposited on the synthetic resin base film without causing deterioration such as shrinkage and yellowing.
- A Physical vapor deposition methods (Physical Vapor Deposition method; PVD method) such as vacuum deposition method, sputtering method, ion plating method, ion cluster beam method, (b) Plasma chemical vapor deposition method, thermal chemical vapor deposition method, A chemical vapor deposition method (Chemical Vapor Deposition method; CVD method) such as a photochemical vapor deposition method is employed.
- PVD method Physical Vapor Deposition method
- CVD method Chemical Vapor Deposition method
- a vacuum vapor deposition method and an ion plating method that can form a high-quality inorganic oxide layer with high productivity are preferable.
- the inorganic oxide constituting the inorganic oxide layer is not particularly limited as long as it has gas barrier properties.
- aluminum oxide, silica oxide, titanium oxide, zirconium oxide, zinc oxide, tin oxide, magnesium oxide Among them, aluminum oxide or silica oxide having a good balance between gas barrier properties and price is particularly preferable.
- the lower limit of the thickness (average thickness) of the inorganic oxide layer is preferably 3 mm, more preferably 400 mm.
- the upper limit of the thickness of the inorganic oxide layer is preferably 3000 mm, more preferably 800 mm.
- the thickness of the inorganic oxide layer is less than the above lower limit, the gas barrier property may be lowered.
- the thickness of the inorganic oxide layer exceeds the above upper limit, the flexibility of the inorganic oxide layer is reduced, and defects such as cracks are likely to occur.
- the inorganic oxide layer may have a single layer structure or a multilayer structure of two or more layers.
- the vapor deposition conditions in the physical vapor deposition method and the chemical vapor deposition method are appropriately designed according to the resin type of the base film, the thickness of the inorganic oxide layer, and the like.
- the surface of the base film is preferably subjected to a surface treatment.
- adhesion improving surface treatment include (a) corona discharge treatment, ozone treatment, low temperature plasma treatment using oxygen gas or nitrogen gas, glow discharge treatment, oxidation treatment using chemicals, and the like ( b) Primer coat treatment, undercoat treatment, anchor coat treatment, vapor deposition anchor coat treatment and the like.
- corona discharge treatment and anchor coat treatment that improve adhesion strength with the inorganic oxide layer and contribute to the formation of a dense and uniform inorganic oxide layer are preferable.
- the anchor coating agent used for the anchor coating treatment examples include a polyester anchor coating agent, a polyamide anchor coating agent, a polyurethane anchor coating agent, an epoxy anchor coating agent, a phenol anchor coating agent, and a (meth) acrylic anchor coating.
- polyester anchor coating agents that can further improve the adhesive strength between the base film and the inorganic oxide layer are particularly preferable.
- the lower limit of the coating amount of the anchor coating agent (in terms of solid content), preferably from 0.1g / m 2, 1g / m 2 is more preferable.
- the upper limit of the amount of coating of the anchor coating agent is preferably 5g / m 2, 3g / m 2 is more preferable.
- the coating amount of the anchor coating agent is less than the above lower limit, the effect of improving the adhesion between the base film and the inorganic oxide layer may be reduced.
- the coating amount of the anchor coating agent exceeds the above upper limit, the strength, durability, etc. of the gas barrier layer 12 may be lowered.
- the above-mentioned anchor coating agent there are various silane coupling agents for improving adhesion, anti-blocking agents for preventing blocking with a base film, ultraviolet absorbers for improving weather resistance, etc.
- Additives can be mixed as appropriate.
- the mixing amount of the additive is preferably 0.1% by weight or more and 10% by weight or less from the balance between the effect expression of the additive and the function inhibition of the anchor coat agent.
- the said protective film 111 for solar cell modules can be obtained by forming each layer which comprises the said protective film 111 for said solar cell modules, and adhere
- the protective film 111 for solar cell modules can also be manufactured using the method of apply
- the solar cell module protective film 111 can be easily and reliably heat-sealed to the solar cell module filler layer in the same manner as the solar cell module protective film 1 shown in FIG. Moreover, since the said protective film 111 for solar cell modules is provided with the gas barrier layer 12, it has high gas barrier property with respect to oxygen, water vapor
- the solar cell module 121 of FIG. 4 (b) includes the solar cell module protective film 111, the filler layers 22 and 24 thermally bonded to the surface of the solar cell module protective film 111, and the filler layer.
- the solar cell module 121 can easily and reliably heat-fuse the heat-sealing resin layer 3 of the solar cell module protective film 111 to the filler layer 22 as described above. Since the solar cell module 121 includes the gas barrier layer 12, the gas barrier property against oxygen, water vapor, and the like is improved, and the solar cell module 121 can be suitably used for outdoor use for a long time. In addition, since the solar cell module 121 includes the hydrolysis-resistant layer 13 and durability and weather resistance are improved, the solar cell module 121 can be suitably used for a roof-standing solar cell module.
- the protective film for solar cell modules and the solar cell module of the present invention are not limited to the above embodiment.
- the protective film for the solar cell module includes other layers (synthetic resin layers, metal layers, inorganic oxide layers, etc.) and films in addition to the heat-fusion resin layer, the base material layer, the gas barrier layer, and the hydrolysis-resistant layer. May be laminated.
- various characteristics such as the voltage resistance of the said solar cell module protective film, gas-barrier property, a weather resistance, and durability, can be improved significantly.
- an organic peroxide, a silane coupling agent or the like may be added to the forming material.
- the organic peroxide it is preferable to employ one having a decomposition temperature of 145 ° C. or less with a half-life of 10 hours from the viewpoint of reactivity.
- dilauroyl peroxide 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoate, Benzoyl peroxide, t-amylperoxy-2-ethylhexanoate, t-butylperoxy-2-ethylhexanoate, t-butylperoxyisobutyrate, t-butylperoxymaleic acid, 1,1 -Di (t-amylperoxy) -3,3,5-trimethylcyclohexane, 1,1-di (t-amylperoxy) cyclohexane, t-amylperoxyisononanoate, t-amylperoxynormal octoate 1,1-di (t-butylperoxy) -3,3,5-trimethylcyclohexane, 1,1-di (t-butyl) Peroxy) cyclohexane, t-butylperoxy
- the compounding amount of the organic peroxide is preferably 0.05 parts by mass or more and 5 parts by mass or less, and more preferably 0.1 parts by mass or more and 2.0 parts by mass or less with respect to 100 parts by mass of the synthetic resin. If the amount of the organic peroxide is less than the above lower limit, the formation of a crosslinked structure may be insufficient. On the other hand, when the compounding amount of the organic peroxide exceeds the above upper limit, the synthetic resin may be deteriorated due to decomposition due to excessive reaction or the like.
- silane coupling agent examples include vinyltriethoxysilane, vinyltris ( ⁇ -methoxyethoxy) silane, ⁇ -methacryloxypropyltrimethoxysilane, vinyltriacetoxysilane, ⁇ -glycidoxypropyltrimethoxysilane, ⁇ - Glycidoxypropyltriethoxysilane, ⁇ - (3,4-epoxycyclohexyl) ethyltrimethoxysilane, ⁇ -chloropropylmethoxysilane, vinyltrichlorosilane, ⁇ -mercaptopropyltrimethoxysilane, ⁇ -aminopropyltriethoxysilane, N- ⁇ (aminoethyl) - ⁇ -aminopropyltrimethoxysilane or the like can be used.
- the blending amount of the silane coupling agent is preferably 0.1 parts by mass or more and 5 parts by mass or less with respect to 100 parts by mass of the synthetic resin. If the blending amount of the silane coupling agent is smaller than the above lower limit, the adhesiveness may be lowered. On the other hand, if the amount of the silane coupling agent exceeds the upper limit, sufficient heat resistance and weather resistance may not be obtained.
- an inorganic oxide layer is vapor-deposited on a base film to form a gas barrier film, and this gas barrier film is laminated with other layers.
- the gas barrier layer may be formed by directly depositing on the surface of the decomposition layer.
- the vapor deposition method the PVD method or the CVD method described above can be used.
- a metal foil such as an aluminum foil can be used as the gas barrier layer.
- the material of the aluminum foil include aluminum or an aluminum alloy, and an aluminum-iron alloy (soft material) is preferable.
- the iron content in the aluminum-iron alloy is preferably 0.3% or more and 9.0% or less, and particularly preferably 0.7% or more and 2.0% or less. When this iron content is less than the above lower limit, the effect of preventing the generation of pinholes may be insufficient. On the other hand, when the iron content exceeds the above upper limit, flexibility is hindered and workability may be reduced.
- a material of the aluminum foil flexible aluminum subjected to annealing treatment is preferable from the viewpoint of preventing wrinkles and pinholes.
- the lower limit of the thickness (average thickness) of the aluminum foil is preferably 6 ⁇ m, and particularly preferably 15 ⁇ m. Moreover, as an upper limit of the thickness of aluminum foil, 30 micrometers is preferable and 20 micrometers is especially preferable.
- the thickness of the aluminum foil is less than the above lower limit, the aluminum foil is liable to break during processing, and the gas barrier property may be lowered due to pinholes or the like.
- the thickness of the aluminum foil exceeds the above upper limit, cracks or the like may occur during processing, and the thickness and weight of the solar cell module protective film increase, resulting in a request for thin and light weight. It will be contrary.
- the surface of the aluminum foil may be subjected to surface treatment such as chromate treatment, phosphate treatment, and lubricating resin coating treatment from the viewpoint of preventing dissolution and corrosion, and from the viewpoint of promoting adhesion.
- surface treatment such as chromate treatment, phosphate treatment, and lubricating resin coating treatment from the viewpoint of preventing dissolution and corrosion, and from the viewpoint of promoting adhesion.
- a coupling treatment or the like may be performed.
- a film made of cycloolefin polymer (COC) that is particularly excellent in optical isotropy and water vapor blocking property may be used.
- the said protective film for solar cell modules can be used as a back sheet laminated
- the protective film for a solar cell module of the present invention can be easily and reliably heat-sealed with the solar cell module, and the productivity and quality of the solar cell module can be improved. Therefore, the protective film for solar cell modules of the present invention and the solar cell module using the same are useful as a constituent element of the solar cell and can be suitably used.
Abstract
L'objet de la présente invention est de fournir : un film de protection destiné à des modules de cellule solaire, qui est en mesure d'empêcher la formation de défaut au cours de la liaison par fusion thermique ; et un module de cellule solaire qui utilise le film de protection destiné à des modules de cellule solaire. Pour ce faire, la présente invention a trait à un film de protection destiné à des modules de cellule solaire qui est équipé d'une couche de base qui est constituée d'une résine synthétique et d'une couche de résine à liaison par fusion thermique qui est stratifiée sur une surface de la couche de base. Une résine synthétique qui est un composant principal de la couche de résine à liaison par fusion thermique est réticulée par irradiation d'un faisceau électronique. La résine synthétique est de préférence un polyéthylène. La couche de résine à liaison par fusion thermique contient de préférence un agent de réticulation. La couche de résine à liaison par fusion thermique contient de préférence un pigment dans un état dispersé. La dose d'irradiation du faisceau électronique est de préférence de 5 kGy à 300 kGy (inclus). Il est préférable qu'une couche résistant à l'hydrolyse soit prévue sur la surface extérieure de la couche de base. Il est également préférable qu'une couche d'arrêt de gaz soit de plus prévue sur l'autre surface de la couche de base.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012-149724 | 2012-07-03 | ||
JP2012149724A JP2014013790A (ja) | 2012-07-03 | 2012-07-03 | 太陽電池モジュール用保護フィルム及びこれを用いた太陽電池モジュール |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2014007211A1 true WO2014007211A1 (fr) | 2014-01-09 |
Family
ID=49881967
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2013/068034 WO2014007211A1 (fr) | 2012-07-03 | 2013-07-01 | Film de protection destiné à des modules de cellule solaire et module de cellule solaire utilisant celui-ci |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2014013790A (fr) |
WO (1) | WO2014007211A1 (fr) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017512846A (ja) * | 2014-02-24 | 2017-05-25 | 上海海▲優▼威新材料股▲ふん▼有限公司Shanghai HIUV New Materials Co., Ltd. | 放射線照射前架橋ポリオレフィン粘着フィルム及び作製方法並びにパッケージ用の方法及びアセンブリ |
CN109370453A (zh) * | 2017-07-25 | 2019-02-22 | 杭州星庐科技有限公司 | 封装组合物及应用,及包含其的封装胶膜及其制备方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015195316A (ja) * | 2014-03-31 | 2015-11-05 | 大日本印刷株式会社 | 裏面保護シート、及びそれを用いた太陽電池モジュール |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1025357A (ja) * | 1996-07-12 | 1998-01-27 | Dainippon Printing Co Ltd | 透明複合フィルム |
JP2007266382A (ja) * | 2006-03-29 | 2007-10-11 | Toppan Printing Co Ltd | 太陽電池モジュール用のバックシート及び該バックシートを用いた太陽電池モジュール。 |
JP2009249556A (ja) * | 2008-04-09 | 2009-10-29 | Asahi Kasei E-Materials Corp | 樹脂封止シート |
JP2010212357A (ja) * | 2009-03-09 | 2010-09-24 | Toppan Printing Co Ltd | 太陽電池モジュール裏面保護用シートおよび太陽電池モジュール |
JP2010226044A (ja) * | 2009-03-25 | 2010-10-07 | Asahi Kasei E-Materials Corp | 樹脂封止シートの製造方法 |
JP2013080737A (ja) * | 2011-09-30 | 2013-05-02 | Dainippon Printing Co Ltd | 太陽電池モジュール用裏面保護シート及びその製造方法 |
-
2012
- 2012-07-03 JP JP2012149724A patent/JP2014013790A/ja active Pending
-
2013
- 2013-07-01 WO PCT/JP2013/068034 patent/WO2014007211A1/fr active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1025357A (ja) * | 1996-07-12 | 1998-01-27 | Dainippon Printing Co Ltd | 透明複合フィルム |
JP2007266382A (ja) * | 2006-03-29 | 2007-10-11 | Toppan Printing Co Ltd | 太陽電池モジュール用のバックシート及び該バックシートを用いた太陽電池モジュール。 |
JP2009249556A (ja) * | 2008-04-09 | 2009-10-29 | Asahi Kasei E-Materials Corp | 樹脂封止シート |
JP2010212357A (ja) * | 2009-03-09 | 2010-09-24 | Toppan Printing Co Ltd | 太陽電池モジュール裏面保護用シートおよび太陽電池モジュール |
JP2010226044A (ja) * | 2009-03-25 | 2010-10-07 | Asahi Kasei E-Materials Corp | 樹脂封止シートの製造方法 |
JP2013080737A (ja) * | 2011-09-30 | 2013-05-02 | Dainippon Printing Co Ltd | 太陽電池モジュール用裏面保護シート及びその製造方法 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017512846A (ja) * | 2014-02-24 | 2017-05-25 | 上海海▲優▼威新材料股▲ふん▼有限公司Shanghai HIUV New Materials Co., Ltd. | 放射線照射前架橋ポリオレフィン粘着フィルム及び作製方法並びにパッケージ用の方法及びアセンブリ |
CN109370453A (zh) * | 2017-07-25 | 2019-02-22 | 杭州星庐科技有限公司 | 封装组合物及应用,及包含其的封装胶膜及其制备方法 |
CN109370453B (zh) * | 2017-07-25 | 2022-06-17 | 杭州星庐科技有限公司 | 封装组合物及应用,及包含其的封装胶膜及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2014013790A (ja) | 2014-01-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5945552B2 (ja) | 太陽電池モジュール用バックシート及び太陽電池モジュール | |
JP5301107B2 (ja) | 太陽電池モジュール用バックシート及びこれを用いた太陽電池モジュール | |
EP1898470B1 (fr) | Utilisation d'une feuille de fond pour modules photovoltaïques et module photovoltaïque en resultant | |
JP5214087B2 (ja) | 太陽電池モジュール用バックシート及びこれを用いた太陽電池モジュール | |
JP2013145807A (ja) | 太陽電池モジュール用フロントシート及びこれを用いた太陽電池モジュール | |
JP2008085293A (ja) | 太陽電池モジュール用バックシート及びこれを用いた太陽電池モジュール | |
JP2011096988A (ja) | 太陽電池モジュール裏面保護用粘着シート及びこれを用いた太陽電池モジュール | |
WO2013027284A1 (fr) | Feuille de résine d'encapsulation et module de photopile | |
JP2013065708A (ja) | 太陽電池モジュール、太陽電池モジュール用バックシート、太陽電池セル間配設用スペーサ及び太陽電池モジュールの製造方法 | |
JP5156172B2 (ja) | 太陽電池モジュール用バックシート及びこれを用いた太陽電池モジュール | |
KR101165220B1 (ko) | 태양전지 모듈 이면 보호용 점착 시트 및 이것을 사용한 태양전지 모듈 | |
WO2014007211A1 (fr) | Film de protection destiné à des modules de cellule solaire et module de cellule solaire utilisant celui-ci | |
JP2010212356A (ja) | 太陽電池モジュール封止用シートおよび太陽電池モジュール | |
WO2014007212A1 (fr) | Film de protection destiné à des modules de cellule solaire et module de cellule solaire utilisant celui-ci | |
WO2013121838A1 (fr) | Feuille protectrice pour cellule solaire, son procédé de fabrication et module de cellule solaire | |
JP2011119475A (ja) | 太陽電池モジュールの製造方法 | |
JP6305082B2 (ja) | 太陽電池用保護シート、太陽電池用バックシート、太陽電池モジュール及太陽電池モジュールの再加工方法 | |
JP2013080880A (ja) | 太陽電池モジュール用バックシート及び太陽電池モジュール | |
JP2013145801A (ja) | 太陽電池モジュール用保護フィルム及びこれを用いた太陽電池モジュール | |
JP2011056701A (ja) | 太陽電池用シート及び太陽電池モジュール | |
JP2013016748A (ja) | 太陽電池モジュール用バックシート及び太陽電池モジュール | |
JP6547463B2 (ja) | 太陽電池モジュール用封止材シート及びそれを用いてなる封止材一体型裏面保護シート | |
JP2014082337A (ja) | 太陽電池モジュール、太陽電池セル保護シート及び太陽電池モジュールの製造方法 | |
WO2017006695A1 (fr) | Feuille de matériau d'étanchéité pour modules de cellule solaire, et feuille de protection arrière à matériau d'étanchéité intégré qui l'utilise | |
JP2014082335A (ja) | 太陽電池モジュール及び太陽電池モジュールの製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 13813137 Country of ref document: EP Kind code of ref document: A1 |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 13813137 Country of ref document: EP Kind code of ref document: A1 |