WO2013171915A1 - Actionneur piézoélectrique, dispositif piézoélectrique antivibrations, et terminal mobile - Google Patents

Actionneur piézoélectrique, dispositif piézoélectrique antivibrations, et terminal mobile Download PDF

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Publication number
WO2013171915A1
WO2013171915A1 PCT/JP2012/072201 JP2012072201W WO2013171915A1 WO 2013171915 A1 WO2013171915 A1 WO 2013171915A1 JP 2012072201 W JP2012072201 W JP 2012072201W WO 2013171915 A1 WO2013171915 A1 WO 2013171915A1
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Prior art keywords
piezoelectric
piezoelectric actuator
wiring board
flexible wiring
piezoelectric element
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PCT/JP2012/072201
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English (en)
Japanese (ja)
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中村　成信
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京セラ株式会社
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Priority to KR1020127025687A priority Critical patent/KR101601750B1/ko
Priority to CN201290001193.7U priority patent/CN204170914U/zh
Priority to JP2013516892A priority patent/JP5474262B1/ja
Publication of WO2013171915A1 publication Critical patent/WO2013171915A1/fr

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H04R7/04—Plane diaphragms
    • H04R7/045—Plane diaphragms using the distributed mode principle, i.e. whereby the acoustic radiation is emanated from uniformly distributed free bending wave vibration induced in a stiff panel and not from pistonic motion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0611—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements in a pile
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H04R7/04—Plane diaphragms
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/09—Forming piezoelectric or electrostrictive materials
    • H10N30/093—Forming inorganic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
    • H10N30/2047—Membrane type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/853—Ceramic compositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N35/00—Magnetostrictive devices
    • H10N35/01—Manufacture or treatment
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00—Piezoelectric transducers; Electrostrictive transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10083—Electromechanical or electro-acoustic component, e.g. microphone

Definitions

  • the present invention relates to a piezoelectric vibration device, a piezoelectric actuator suitable for a mobile terminal, a piezoelectric vibration device, and a mobile terminal.
  • a bimorph piezoelectric element 10 in which a surface electrode 104 is formed on the surface of a laminate 103 in which a plurality of internal electrodes 101 and a plurality of piezoelectric layers 102 are laminated, (See Patent Document 1)
  • a flexible wiring board 105 is joined to the main surface of the piezoelectric element 10 with a conductive joining member 106, and the surface electrode 104 of the piezoelectric element 10 and the wiring conductor 107 of the flexible wiring board 105 are electrically connected. It is known to connect to (see Patent Document 2).
  • solder or a conductive adhesive has been used as the conductive bonding member 106 for bonding the flexible wiring board 105 and the piezoelectric element 10.
  • the rigidity of the solder is high, so that it follows the vibration of the piezoelectric actuator due to external vibration generated on the flexible wiring board 105 or resonance of the flexible wiring board 105 itself.
  • the abnormal vibration of the flexible wiring board 105 does not occur, causing stress concentration such as shearing or bending near the end face of the joint between the piezoelectric element 10 and the flexible wiring board 105, and the flexible wiring board 105 is There was a risk of peeling.
  • the piezoelectric element 10 when simply joining with a conductive adhesive, when the piezoelectric element 10 is driven at a high speed by passing a large current, the electrical and thermal resistance value of the conductive adhesive is high. Heat generated by vibration of the conductive adhesive or Joule heat generated by the conductive adhesive itself causes thermal deterioration of the resin constituting the conductive adhesive, resulting in a decrease in bonding strength. As a result, the flexible wiring board 105 may be peeled off from the piezoelectric element 10. It was.
  • the present invention has been devised in view of the above-mentioned problems, and its purpose is to provide a stable for a long time without peeling from the piezoelectric element even when the flexible wiring board bonded to the piezoelectric element is driven for a long period of time. And a piezoelectric actuator, a piezoelectric vibration device, and a portable terminal to be driven.
  • the piezoelectric actuator of the present invention includes a piezoelectric element including a laminate in which an internal electrode and a piezoelectric layer are laminated, and a surface electrode electrically connected to the internal electrode on one main surface of the laminate, On the other hand, a part of the main surface is joined via a conductive adhesive containing conductive particles and resin, and a flexible wiring board including a wiring conductor electrically connected to the surface electrode, In the bonding region between the flexible wiring board and the piezoelectric element, at least a part of the peripheral part is provided with more conductive particles than the other parts.
  • the piezoelectric vibration device includes the piezoelectric actuator and a vibration plate bonded to the other main surface of the piezoelectric element.
  • the portable terminal of the present invention includes the piezoelectric actuator, an electronic circuit, a display, and a housing, and the other main surface of the piezoelectric actuator is bonded to the display or the housing.
  • the present invention it is possible to obtain a piezoelectric actuator in which the flexible wiring board does not peel from the piezoelectric element even when driven for a long time without causing abnormal vibration of the piezoelectric element.
  • FIG. 2A is a schematic cross-sectional view taken along line AA shown in FIG. 1B
  • FIG. 2B is a partially enlarged plan perspective view of the piezoelectric actuator shown in FIG. It is a partially expanded plane perspective view which shows the other example of FIG.2 (b).
  • 1 is a schematic perspective view schematically showing a piezoelectric vibration device according to an embodiment of the present invention. It is a schematic perspective view which shows typically the portable terminal of embodiment of this invention.
  • FIG. 6 is a schematic sectional view taken along line AA shown in FIG.
  • FIG. 6 is a schematic cross-sectional view taken along line BB shown in FIG.
  • (A) is a schematic perspective view which shows an example of embodiment of the conventional piezoelectric actuator
  • (b) is a schematic sectional drawing cut
  • FIG. 1 is a schematic perspective view showing an example of an embodiment of the piezoelectric actuator of the present invention.
  • FIG. 2 (a) is a schematic cross-sectional view taken along line AA shown in FIG. 1 (b).
  • FIG. 2 is a partially enlarged plan perspective view of the piezoelectric actuator shown in FIG. 1.
  • a piezoelectric actuator 1 according to this embodiment shown in FIG. 1 includes a laminate 4 in which an internal electrode 2 and a piezoelectric layer 3 are laminated, and a surface electrode electrically connected to the internal electrode 2 on one main surface of the laminate 4. 5 and a wiring conductor 61 that is partly bonded on one main surface via a conductive adhesive 7 containing conductive particles and resin and electrically connected to the surface electrode 5.
  • the conductive wiring board 6 is provided, and in the bonding region between the flexible wiring board 6 and the piezoelectric element 10, at least a part of the peripheral part 601 has more conductive particles arranged than the other parts.
  • the laminated body 4 constituting the piezoelectric element 10 is formed by laminating the internal electrode 2 and the piezoelectric layer 3, and includes an active portion 41 in which a plurality of internal electrodes 2 overlap in the laminating direction and other inactive portions 42. For example, it is formed in a long shape.
  • the length of the laminate 4 is preferably, for example, 18 mm to 28 mm, and more preferably 22 mm to 25 mm.
  • the width of the laminate 4 is preferably 1 mm to 6 mm, and more preferably 3 mm to 4 mm.
  • the thickness of the laminate 4 is preferably 0.2 mm to 1.0 mm, and more preferably 0.4 mm to 0.8 mm.
  • the internal electrode 2 constituting the laminated body 4 is formed by simultaneous firing with ceramics forming the piezoelectric layer 3 and includes a first electrode 21 and a second electrode 22.
  • the first electrode 21 is a ground electrode
  • the second electrode 22 is a positive electrode or a negative electrode.
  • Piezoelectric layers 3 are alternately stacked to sandwich the piezoelectric layers 3 from above and below, and the first pole 21 and the second pole 22 are arranged in the stacking order, so that the piezoelectric body sandwiched between them.
  • a driving voltage is applied to the layer 3.
  • a conductor mainly composed of silver or a silver-palladium alloy having a low reactivity with piezoelectric ceramics, or a conductor containing copper, platinum, or the like can be used. You may make it contain.
  • the end portions of the first pole 21 and the second pole 22 are alternately led to a pair of side surfaces facing each other of the stacked body 4.
  • the length of the internal electrode 2 is preferably 17 mm to 25 mm, for example, and more preferably 21 mm to 24 mm.
  • the width of the internal electrode 2 is preferably 1 mm to 5 mm, and more preferably 2 mm to 4 mm.
  • the thickness of the internal electrode 2 is preferably 0.1 to 5 ⁇ m, for example.
  • the piezoelectric layer 3 constituting the multilayer body 4 is formed of ceramics having piezoelectric characteristics.
  • ceramics for example, a perovskite oxide made of lead zirconate titanate (PbZrO 3 -PbTiO 3 ), Lithium niobate (LiNbO 3 ), lithium tantalate (LiTaO 3 ), or the like can be used.
  • the thickness of one layer of the piezoelectric layer 3 is preferably set to 0.01 to 0.1 mm, for example, so as to be driven at a low voltage. In order to obtain a large flexural vibration, it is preferable to have a piezoelectric d31 constant of 200 pm / V or more.
  • a surface electrode 5 electrically connected to the internal electrode 2 is provided on one main surface of the laminate 4.
  • the surface electrode 5 in the form shown in FIG. 1 includes a first surface electrode 51 having a large area, a second surface electrode 52 having a small area, and a third surface electrode 53.
  • the first surface electrode 51 is electrically connected to the internal electrode 2 to be the first electrode 21
  • the second surface electrode 52 is the internal electrode to be the second electrode 22 disposed on one main surface side.
  • the third surface electrode 53 is electrically connected to the internal electrode 2 serving as the second electrode 22 disposed on the other main surface side.
  • the length of the first surface electrode 51 is preferably, for example, 17 mm to 23 mm, and more preferably 19 mm to 21 mm.
  • the width of the first surface electrode 51 is preferably 1 mm to 5 mm, for example, and more preferably 2 mm to 4 mm.
  • the lengths of the second surface electrode 52 and the third surface electrode 53 are preferably 1 mm to 3 mm, for example.
  • the widths of the second surface electrode 52 and the third surface electrode 53 are preferably 0.5 mm to 1.5 mm, for example.
  • the piezoelectric actuator 1 has a flexible wiring board 6 partially bonded to one main surface of a laminate 4 constituting the piezoelectric element 10 via a conductive adhesive 7 made of conductive particles and resin. Yes.
  • the flexible wiring board 6 includes a wiring conductor 61, and a part of the flexible wiring board 6 is formed of the laminate 4 so that the surface electrode 5 and the wiring conductor 61 are electrically connected via the conductive adhesive 7. On the other hand, it is joined to the main surface.
  • the flexible wiring board 6 is a flexible printed wiring board in which, for example, two wiring conductors 61 are embedded in a resin film, and a connector (not shown) for connecting to an external circuit is connected to one end. Yes.
  • the conductive adhesive 7 examples include metal powders such as silver powder and gold powder in a resin having a low elastic modulus (Young's modulus) such as polyimide, polyamideimide, silicone rubber, and synthetic rubber, and Au plating on a resin ball. Conductive particles made of conductive coating or the like are dispersed. Thereby, compared with solder, the stress produced by vibration can be reduced. More preferably, the conductive adhesive 7 is preferably an anisotropic conductive material. The anisotropic conductive material is composed of conductive particles responsible for electrical bonding and a resin adhesive responsible for adhesion.
  • anisotropic conductive material can conduct in the thickness direction and insulate in the in-plane direction, even in narrow-pitch wiring, there is no electrical short between surface electrodes of different polarities, and flexible wiring A connection part with the board
  • substrate 6 can be made compact.
  • the bonding region is a region occupied by the conductive adhesive 7, and the peripheral edge portion 601 of the bonding region means a region within 0.4 mm from the end surface.
  • the fact that more conductive particles are arranged in a part of the peripheral part 601 than in other parts means that the peripheral part 601 is obtained when the flexible wiring substrate 6 is peeled off and the surface of the conductive adhesive 7 is observed with an electron microscope. This means that the proportion of conductive particles in a part of the unit area per unit area is larger than that of the other part.
  • the conductive particles are disposed more than the other parts in at least a part of the peripheral part 601 of the joining region between the flexible wiring board 6 and the piezoelectric element 10, the thermal conductivity of this part is improved. Therefore, the conductive adhesive 7 is configured to promote heat conduction and diffusion of the heat generated by the vibration of the piezoelectric element 10 and Joule heat of the conductive adhesive 7 even when driven at a high speed by passing a large current. The problem that the resin is thermally deteriorated and the flexible wiring board 6 is peeled off from the piezoelectric element 10 can be greatly reduced.
  • the peripheral portion 601 by arranging a large number of conductive particles in at least a part of the peripheral portion 601, shearing and tensile stress concentration is reduced due to rotation of the conductive particles and a low Young's modulus. Therefore, the conductive adhesive 7 is prevented from cracking from this portion.
  • a large shearing or tensile stress is concentrated at the base of the joint portion of the flexible wiring board 6. Therefore, the concentration of shear stress can be particularly suppressed by the rotation of the conductive particles of the conductive adhesive 7, and there is no risk that the flexible wiring board 6 is peeled off due to cracks at the base of the joint.
  • the peripheral portion 601 in which many conductive particles are arranged for example, the number or ratio of the conductive particles is 5 to 20% larger than other parts. This ratio can be obtained by removing the flexible wiring board 6 and observing it with an electron microscope.
  • the part is in a region between the outer periphery of one main surface of the piezoelectric element 10 and the surface electrode 5, the low Young's modulus of the resin and the rotation of many conductive particles are external. It is possible to reduce stress generated by vibration that does not follow the actuator such as vibration and resonance of the flexible wiring board 6 itself, and to reduce the amplitude of such vibration that the viscoelasticity of the resin does not follow.
  • the thickness of the conductive adhesive 7 bonded in the region between the outer periphery of the one main surface of the piezoelectric element 10 and the surface electrode 5 is such that the surface electrode 5 and the wiring conductor 61 are electrically connected to face each other.
  • the thermal resistance increases because it is thicker than the thickness of the conductive adhesive 7, a connection with a thermal conductivity function that suppresses an increase in thermal resistance by arranging a large number of conductive particles having high thermal conductivity in this region is used. be able to.
  • heat generated by vibration of the piezoelectric element 10 and Joule heat of the conductive adhesive 7 itself can be conducted and diffused, and cracking due to deterioration of the resin constituting the conductive adhesive 7 can be reduced.
  • the conductive adhesive 7 is an anisotropic conductive material containing, for example, gold-plated resin balls as conductive particles
  • the surface electrode 5 and the wiring conductor 61 overlap in a plan view.
  • the conductive particles constituting the conductive adhesive 7 electrically connect the surface electrode 5 and the wiring conductor 61, and the conductive particles are not joined to each other. In other regions, the piezoelectric element 10 and the wiring conductor are connected. It is easy to form a connection form in which conductive particles that are not connected to either 61 or only connected to either one exist mainly. With such a connection form, it is possible to suppress the stress concentration of shear and tension while maintaining high heat conduction as described above. It may be a joining process.
  • the conductive particles not connected to either the piezoelectric element 10 or the wiring conductor 61 be 70% or more of the whole.
  • the other main surface of the piezoelectric element 10 flat, for example, when the other main surface is bonded to an object to be vibrated (for example, a vibration plate to be described later), it is integrated with the object to be vibrated. As a result, bending vibration is easily generated, and the efficiency of bending vibration can be improved as a whole.
  • an object to be vibrated for example, a vibration plate to be described later
  • the piezoelectric actuator 1 shown in FIG. 1 is a so-called bimorph type piezoelectric actuator that receives an electric signal from the surface electrode 5 and vibrates and vibrates so that one main surface and the other main surface are bent surfaces.
  • the piezoelectric actuator of the present invention is not limited to the bimorph type, and may be a unimorph type. For example, by joining (bonding) the other principal surface of the piezoelectric actuator to a diaphragm described later, It can be bent and vibrated.
  • a ceramic green sheet to be the piezoelectric layer 3 is produced. Specifically, a ceramic slurry is prepared by mixing a calcined powder of piezoelectric ceramic, a binder made of an organic polymer such as acrylic or butyral, and a plasticizer. And a ceramic green sheet is produced using this ceramic slurry by using tape molding methods, such as a doctor blade method and a calender roll method.
  • the piezoelectric ceramic any material having piezoelectric characteristics may be used.
  • a perovskite oxide made of lead zirconate titanate (PbZrO 3 -PbTiO 3 ) can be used.
  • the plasticizer dibutyl phthalate (DBP), dioctyl phthalate (DOP), or the like can be used.
  • a conductive paste to be the internal electrode 2 is produced.
  • a conductive paste is prepared by adding and mixing a binder and a plasticizer to a silver-palladium alloy metal powder. This conductive paste is applied on the ceramic green sheet in the pattern of the internal electrode 2 using a screen printing method. Further, a plurality of ceramic green sheets printed with this conductive paste are laminated, subjected to a binder removal treatment at a predetermined temperature, fired at a temperature of 900 to 1200 ° C., and then subjected to a predetermined grinding using a surface grinder or the like. By performing a grinding process so as to obtain a shape, a laminated body 4 including the internal electrodes 2 and the piezoelectric body layers 3 that are alternately laminated is manufactured.
  • the laminate 4 is not limited to the one produced by the above manufacturing method, and any production method can be used as long as the laminate 4 formed by laminating a plurality of internal electrodes 2 and piezoelectric layers 3 can be produced. It may be produced.
  • a silver glass-containing conductive paste prepared by adding a binder, a plasticizer, and a solvent to a mixture of conductive particles mainly composed of silver and glass is used to form a main surface of the laminate 4 in a pattern of the surface electrode 5.
  • a baking process is performed at a temperature of 650 to 750 ° C. to form the surface electrode 5.
  • a via that penetrates the piezoelectric layer 3 may be formed or connected, or a side electrode may be formed on the side surface of the multilayer body 4. It may be produced by any manufacturing method.
  • the flexible wiring board 6 is connected and fixed (bonded) to the piezoelectric element 10 using the conductive adhesive 7.
  • a conductive adhesive paste is applied and formed on a predetermined position of the piezoelectric element 10 using a technique such as screen printing. Thereafter, the conductive adhesive paste is cured with the flexible wiring board 6 in contact with the flexible wiring board 6, thereby connecting and fixing the flexible wiring board 6 to the piezoelectric element 10.
  • the conductive adhesive paste may be applied and formed on the flexible wiring board 6 side.
  • the conductive adhesive 7 is made of a thermoplastic resin
  • the conductive adhesive is applied to a predetermined position of the piezoelectric element 10 or the flexible wiring board 6, and then the piezoelectric element 10 and the flexible wiring board 6 are formed. Is heated and pressed in a state of being in contact with the conductive adhesive, so that the thermoplastic resin is softened and fluidized and then returned to room temperature, so that the thermoplastic resin is cured again, and the flexible wiring board 6 becomes a piezoelectric element. Connection fixed to 10.
  • the content of the conductive particles is further increased.
  • a large amount of conductive adhesive paste may be prepared, and a conductive adhesive paste having a high content of conductive particles may be applied and formed on the periphery.
  • the method of applying and forming the conductive adhesive 7 on the piezoelectric element 10 or the flexible wiring board 6 has been described.
  • the sheet of the conductive adhesive 7 formed in advance in a sheet shape is connected to the piezoelectric element 10 and the flexible wiring. You may heat-press and join in the state pinched
  • the piezoelectric vibration device of the present invention has a piezoelectric actuator 1 and a vibration plate 81 joined to the other main surface of the piezoelectric actuator 1 as shown in FIG.
  • the diaphragm 81 has a rectangular thin plate shape.
  • the vibration plate 81 can be preferably formed using a material having high rigidity and elasticity such as acrylic resin or glass. Further, the thickness of the diaphragm 81 is set to 0.4 mm to 1.5 mm, for example.
  • the diaphragm 81 is joined to the other main surface of the piezoelectric actuator 1 via a joining member 82.
  • the entire surface of the other main surface may be bonded to the diaphragm 81 via the bonding member 82, or substantially the entire surface may be bonded.
  • the joining member 82 has a film shape. Further, the joining member 82 is formed of a material that is softer and more easily deformed than the diaphragm 81, and has a smaller elastic modulus and rigidity such as Young's modulus, rigidity, and bulk modulus than the diaphragm 81. That is, the joining member 82 is deformable and deforms more greatly than the diaphragm 81 when the same force is applied. Then, the other main surface (main surface on the ⁇ z direction side in the drawing) of the piezoelectric actuator 1 is fixed to the one main surface (main surface on the + z direction side in the drawing) of the bonding member 82 as a whole. A part of one main surface (main surface on the + z direction side in the drawing) of the diaphragm 81 is fixed to the other main surface (main surface on the ⁇ z direction side in the drawing).
  • the joining member 82 may be a single member or a composite composed of several members.
  • a joining member 82 for example, a double-sided tape in which a pressure-sensitive adhesive is attached to both surfaces of a substrate made of a nonwoven fabric or the like, various elastic adhesives which are adhesives having elasticity, and the like can be suitably used.
  • the thickness of the joining member 82 is desirably larger than the amplitude of the flexural vibration of the piezoelectric actuator 1, but if it is too thick, the vibration is attenuated, so it is set to 0.1 mm to 0.6 mm, for example.
  • the material of the bonding member 82 is not limited, and the bonding member 82 may be formed of a material that is harder and less deformable than the vibration plate 81. In some cases, a configuration without the joining member 82 may be used.
  • the piezoelectric vibration device of this example having such a configuration functions as a piezoelectric vibration device that causes the piezoelectric actuator 1 to bend and vibrate by applying an electric signal, thereby vibrating the vibration plate 81.
  • the other end in the length direction of the diaphragm 81 (the end in the ⁇ y direction in the figure, the peripheral edge of the diaphragm 81, and the like) may be supported by a support member (not shown).
  • the piezoelectric vibration device of this example is configured using the piezoelectric actuator 1 in which generation of unnecessary vibration is reduced, the piezoelectric vibration device in which generation of unnecessary vibration is reduced can be obtained.
  • the vibration plate 81 is joined to the other flat main surface of the piezoelectric actuator 1. Thereby, a piezoelectric vibration device in which the piezoelectric actuator 1 and the vibration plate 81 are firmly joined can be obtained.
  • the mobile terminal of the present invention includes the piezoelectric actuator 1, an electronic circuit (not shown), a display 91, and a housing 92, and the other side of the piezoelectric actuator 1.
  • the main surface is joined to the housing 92.
  • 5 is a schematic perspective view schematically showing the portable terminal of the present invention
  • FIG. 6 is a schematic cross-sectional view taken along the line AA shown in FIG. 5
  • FIG. 7 is a line BB shown in FIG. It is the schematic sectional drawing cut
  • the piezoelectric actuator 1 and the housing 92 are joined using a deformable joining member. That is, in FIG. 6 and FIG. 7, the joining member 82 is a deformable joining member.
  • the deformable joining member 82 By joining the piezoelectric actuator 1 and the housing 92 with the deformable joining member 82, when the vibration is transmitted from the piezoelectric actuator 1, the deformable joining member 82 is deformed more greatly than the housing 92.
  • the piezoelectric actuator 1 transmits strong vibration to the casing 92 without being influenced by the surrounding vibration. Can be made.
  • the joining member 82 since at least a part of the joining member 82 is formed of a viscoelastic body, strong vibration from the piezoelectric actuator 1 is transmitted to the housing 92, while weak vibration reflected from the housing 92 is transmitted to the joining member 82. It is preferable in that it can be absorbed.
  • a double-sided tape in which a pressure-sensitive adhesive is attached to both surfaces of a base material made of a nonwoven fabric or the like, or a joining member including an adhesive having elasticity can be used, and the thickness thereof is, for example, 10 ⁇ m to 2000 ⁇ m Can be used.
  • the piezoelectric actuator 1 is attached to a part of the casing 92 that becomes the cover of the display 91, and a part of the casing 92 functions as the diaphragm 922.
  • the piezoelectric actuator 1 is bonded to the housing 92, but the piezoelectric actuator 1 may be bonded to the display 91.
  • the casing 92 includes a box-shaped casing main body 921 having one surface opened, and a diaphragm 922 that closes the opening of the casing main body 921.
  • the casing 92 (the casing main body 921 and the diaphragm 922) can be preferably formed using a material such as a synthetic resin having high rigidity and elastic modulus.
  • the peripheral edge of the diaphragm 922 is attached to the housing main body 921 via a bonding material 93 so as to vibrate.
  • the bonding material 93 is formed of a material that is softer and easier to deform than the diaphragm 922, and has a smaller elastic modulus and rigidity such as Young's modulus, rigidity, and bulk modulus than the diaphragm 922. That is, the bonding material 93 can be deformed, and deforms more greatly than the diaphragm 922 when the same force is applied.
  • the bonding material 93 may be a single material or a composite made up of several members.
  • a bonding material 93 for example, a double-sided tape in which an adhesive is attached to both surfaces of a base material made of a nonwoven fabric or the like can be suitably used.
  • the thickness of the bonding material 93 is set so that the vibration is not attenuated due to being too thick, and is set to, for example, 0.1 mm to 0.6 mm.
  • the material of the bonding material 93 is not limited, and the bonding material 93 may be formed of a material that is harder and more difficult to deform than the diaphragm 922. In some cases, a configuration without the bonding material 93 may be used.
  • Examples of the electronic circuit include a circuit that processes image information displayed on the display 91 and audio information transmitted by the mobile terminal, a communication circuit, and the like. At least one of these circuits may be included, or all the circuits may be included. Further, it may be a circuit having other functions. Furthermore, you may have a some electronic circuit.
  • the electronic circuit and the piezoelectric actuator 1 are connected by a connection wiring (not shown).
  • the display 91 is a display device having a function of displaying image information.
  • a known display such as a liquid crystal display, a plasma display, and an organic EL display can be suitably used.
  • the display 91 may have an input device such as a touch panel.
  • the cover (diaphragm 922) of the display 91 may have an input device such as a touch panel.
  • the entire display 91 or a part of the display 91 may function as a diaphragm.
  • the portable terminal of the present invention is characterized in that the display 91 or the casing 92 generates vibration that transmits sound information through the ear cartilage or air conduction.
  • the portable terminal of this example can transmit sound information by transmitting a vibration to the cartilage of the ear by bringing the diaphragm (display 91 or housing 92) into contact with the ear directly or via another object. That is, sound information can be transmitted by bringing a diaphragm (display 91 or housing 92) into direct or indirect contact with the ear and transmitting vibration to the cartilage of the ear.
  • a portable terminal capable of transmitting sound information even when the surroundings are noisy can be obtained.
  • the object interposed between the diaphragm (display 91 or housing 92) and the ear may be, for example, a cover of a mobile terminal, a headphone or an earphone, and any object that can transmit vibration. Anything can be used. Further, it may be a portable terminal that transmits sound information by propagating sound generated from the diaphragm (display 91 or housing 92) in the air. Furthermore, it may be a portable terminal that transmits sound information via a plurality of routes.
  • the portable terminal of this example transmits sound information using the piezoelectric actuator 1 in which occurrence of unnecessary vibration is reduced, it can transmit high-quality sound information.
  • the piezoelectric actuator shown in FIG. 1 was manufactured as follows.
  • the piezoelectric element had a rectangular parallelepiped shape with a length of 23.5 mm, a width of 3.3 mm, and a thickness of 0.5 mm.
  • the piezoelectric element has a structure in which piezoelectric layers having a thickness of 30 ⁇ m and internal electrodes are alternately stacked, and the total number of piezoelectric layers is 16.
  • the piezoelectric layer was formed of lead zirconate titanate.
  • As the internal electrode an alloy of silver palladium was used.
  • the surface electrode was printed so as to be longer by 1 mm at both ends in the width direction than the internal electrode.
  • a voltage with an electric field strength of 2 kV / mm was applied between the internal electrodes (between the first electrode and the second electrode) via the surface electrode to polarize the piezoelectric element.
  • a conductive adhesive containing gold-plated resin balls as conductive particles was applied and formed on the surface of the piezoelectric element to be bonded to the flexible wiring board.
  • a conductive adhesive containing 20 vol% of conductive particles is contained in a region having a width of 0.3 mm at the peripheral edge of a region where the flexible wiring board and the piezoelectric element overlap, and 10 vol% of conductive particles are contained in an inner region thereof.
  • the formed conductive adhesive was applied and formed.
  • the flexible wiring board was conducted and fixed to the piezoelectric element by heating and pressurizing the flexible wiring board in contact with each other, and a piezoelectric actuator (sample No. 1) of the embodiment of the present invention was manufactured.
  • a piezoelectric actuator (sample No. 1) of the embodiment of the present invention was manufactured.
  • conductive adhesive an anisotropic conductive material that conducts in the thickness direction and does not conduct in the in-plane direction was used.
  • sample No. 1 was used except that the flexible wiring board was joined to the piezoelectric element with solder.
  • a sine wave signal having an effective value of ⁇ 10 Vrms was applied to the piezoelectric element at a frequency of 1 kHz via a flexible wiring board, and a drive test was performed. For both 1 and 2, bending vibration having a displacement of 100 ⁇ m was obtained.
  • sample No. The piezoelectric actuator 1 continued to drive without causing abnormal vibration even after 100,000 cycles. Also, no cracks or cracks were found in the conductive adhesive that connected and fixed the flexible wiring board, and no peeling of the flexible wiring board was found.
  • Piezoelectric actuator 2 Internal electrode 21: First pole 22: Second pole 3: Piezoelectric layer 4: Laminate 41: Active part 42: Inactive part 5: Surface electrode 51: First surface electrode 52: Second surface electrode 53: Third surface electrode 6: Flexible wiring board 61: Wiring conductor 601: peripheral edge 602: Region between the outer periphery of one main surface and the surface electrode 7: Conductive adhesive 81: Diaphragm 82: Joining member 91: Display 92: Housing 921: Housing body 922: Diaphragm 93: Bonding material

Abstract

[Problème] Produire un terminal mobile, un dispositif piézoélectrique antivibrations, et un actionneur piézoélectrique pouvant exciter de manière stable pendant de longues durées sans qu'un panneau de câblage souple fixé à un élément piézoélectrique ne se détache de ce dernier, même lorsque cette excitation s'exerce pendant de longues durées. [Solution] Cet actionneur piézoélectrique (1), selon un mode de réalisation de l'invention, se caractérise en ce qu'il comprend: un élément piézoélectrique (10) qui présente, d'une part un corps empilé (4) à l'intérieur duquel des électrodes internes (2) et des couches piézoélectriques (3) sont empilées, d'autre part des électrodes de surface (5) disposées sur une surface principale du corps empilé (4), lesdites électrodes de surface (5) étant raccordées électriquement aux électrodes internes (2); et un panneau de câblage souple (6) dont une partie est fixée au-dessus de ladite surface principale par un adhésif conducteur (7) comprenant des particules conductrices et de la résine, et qui est équipé d'un conducteur de câblage (61) raccordé électriquement aux électrodes de surface (5). L'actionneur piézoélectrique (1) est en outre caractérisé en ce que, dans une zone de liaison entre le panneau de câblage souple (6) et l'élément piézoélectrique (10), la majorité des particules conductrices sont disposées dans au moins une section de bord périphérique (601) que dans d'autres sections.
PCT/JP2012/072201 2012-05-15 2012-08-31 Actionneur piézoélectrique, dispositif piézoélectrique antivibrations, et terminal mobile WO2013171915A1 (fr)

Priority Applications (3)

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KR1020127025687A KR101601750B1 (ko) 2012-05-15 2012-08-31 압전 액추에이터, 압전 진동 장치 및 휴대 단말
CN201290001193.7U CN204170914U (zh) 2012-05-15 2012-08-31 压电致动器、压电振动装置以及便携式终端
JP2013516892A JP5474262B1 (ja) 2012-05-15 2012-08-31 圧電アクチュエータ、圧電振動装置および携帯端末

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JP2012-111705 2012-05-15
JP2012111705 2012-05-15

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KR (1) KR101601750B1 (fr)
CN (1) CN204170914U (fr)
TW (1) TWI520390B (fr)
WO (1) WO2013171915A1 (fr)

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CN110139478B (zh) * 2019-04-02 2021-08-13 苏州诺莱声科技有限公司 一种一致性好的压电元件与柔性电路板连接方法
JP7351407B2 (ja) * 2020-03-18 2023-09-27 株式会社村田製作所 アクチュエータ、流体制御装置、および、アクチュエータの製造方法

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TW201401591A (zh) 2014-01-01
KR101601750B1 (ko) 2016-03-09
JPWO2013171915A1 (ja) 2016-01-07
TWI520390B (zh) 2016-02-01

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