WO2013159407A1 - 液晶显示装置及其制造方法 - Google Patents

液晶显示装置及其制造方法 Download PDF

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Publication number
WO2013159407A1
WO2013159407A1 PCT/CN2012/075447 CN2012075447W WO2013159407A1 WO 2013159407 A1 WO2013159407 A1 WO 2013159407A1 CN 2012075447 W CN2012075447 W CN 2012075447W WO 2013159407 A1 WO2013159407 A1 WO 2013159407A1
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Prior art keywords
layer
via hole
transparent conductive
metal wiring
disposed
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PCT/CN2012/075447
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English (en)
French (fr)
Inventor
张鑫
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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Priority to US13/522,021 priority Critical patent/US9116369B2/en
Publication of WO2013159407A1 publication Critical patent/WO2013159407A1/zh
Anticipated expiration legal-status Critical
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1306—Details
    • G02F1/1309—Repairing; Testing

Definitions

  • the present invention relates to the field of liquid crystal display technology, and in particular to a liquid crystal display device and a method of fabricating the same.
  • a conventional liquid crystal display device includes a substrate 11 and a metal wiring layer 12 provided on the substrate 11.
  • the metal trace layer 12 is provided with a first via hole 121 and a second via hole 122.
  • the first conductive via 123 is disposed on the first via hole 121 to form a test point 13 at the second via hole 122.
  • a second transparent conductive layer 124 is disposed thereon. The first transparent conductive layer 123 and the second transparent conductive layer 124 are separately disposed, and the test point 13 is connected to the metal wiring layer 12 through the first via hole 121.
  • one of the processes is to perform the edge processing of the metal wiring layer 12 (Edge Exposure), all the metal between the edge of the edge of the edge 125 and the boundary of the substrate 11 is washed away.
  • the metal wiring layer 12 other than the edge boundary 125 is washed away.
  • the metal trace layer 12 between the test point 13 and the second via 122 is washed away, resulting in the test point 13 and the first The two via holes 122 are disconnected, and the test point 13 is disabled.
  • the technical problem to be solved by the present invention is to provide a liquid crystal display device and a method for fabricating the same, which are connected to the second transparent conductive layer through the first transparent conductive layer to prevent test point failure.
  • a technical solution adopted by the present invention is to provide a liquid crystal display device, comprising: a metal trace layer disposed on a substrate, wherein the metal trace layer is provided with a first via hole and a second a via hole and a third via hole, the metal trace layer includes a first metal trace layer and a second metal trace layer, and the first metal trace layer and the second metal trace layer are sequentially disposed on the substrate, first a first insulating layer is disposed between the metal wiring layer and the second metal wiring layer, and a second insulating layer is disposed on the second metal wiring layer; the first conductive via penetrates the second insulating layer and is turned on at the first a first transparent conductive layer is disposed on the hole to form a test point, and the first transparent conductive layer covers the second metal wire layer through the first conductive hole; the second conductive hole penetrates the first insulating layer and the second metal trace And a second insulating layer, the third conductive via penetrating the second insulating layer
  • a liquid crystal display device including: a metal wiring layer disposed on a substrate, and a first via hole on the metal wiring layer; a second via hole and a third via hole, wherein a first transparent conductive layer is disposed on the first via hole to form a test point, and a second transparent conductive layer is disposed on the second via hole and the third via hole And the first transparent conductive layer is connected to the second transparent conductive layer.
  • the metal trace layer includes a first metal trace layer and a second metal trace layer, and the first metal trace layer and the second metal trace layer are sequentially disposed on the substrate, and the first metal trace layer and the second metal layer A first insulating layer is disposed between the wiring layers, and a second insulating layer is disposed on the second metal wiring layer.
  • the first via hole penetrates the second insulating layer, and the first transparent conductive layer covers the second metal line layer through the first via hole.
  • the second conductive via penetrates the first insulating layer, the second metal wiring layer and the second insulating layer, the third conductive via penetrates the second insulating layer, and the second transparent conductive layer passes through the second via and the third The via hole covers the first metal trace layer and the second metal trace layer.
  • the second via hole and the third via hole are both disposed within the edge of the metal trace layer.
  • another technical solution adopted by the present invention is to provide a method for manufacturing a liquid crystal display device, comprising: providing a substrate; providing a metal wiring layer on the substrate; a via hole, a second via hole and a third via hole; a first transparent conductive layer is disposed on the first via hole to form a test point, and is disposed on the second via hole and the third via hole a second transparent conductive layer, wherein the first transparent conductive layer is connected to the second transparent conductive layer; the substrate is subjected to edge treatment of the metal wiring layer, and the first transparent conductive layer and the second transparent conductive layer are processed at the edge Still remain connected afterwards.
  • the metal trace layer includes a first metal trace layer and a second metal trace layer, and the first metal trace layer and the second metal trace layer are sequentially disposed on the substrate, and the first metal trace layer and the second metal layer A first insulating layer is disposed between the wiring layers, and a second insulating layer is disposed on the second metal wiring layer.
  • the first via hole penetrates the second insulating layer, and the first transparent conductive layer covers the second metal line layer through the first via hole.
  • the second conductive via penetrates the first insulating layer, the second metal wiring layer and the second insulating layer, the third conductive via penetrates the second insulating layer, and the second transparent conductive layer passes through the second via and the third The via hole covers the first metal trace layer and the second metal trace layer.
  • the second via hole and the third via hole are both disposed within the edge of the metal trace layer.
  • the invention has the beneficial effects that the liquid crystal display device of the present invention and the manufacturing method thereof are connected by connecting the first transparent conductive layer and the second transparent conductive layer such that the first transparent conductive layer and the second transparent layer are different from the prior art.
  • the conductive layer remains connected after the edge treatment, thereby ensuring that the test point is connected to the first metal trace layer and the second metal trace layer to prevent the test point from failing.
  • FIG. 1 is a schematic structural view of a liquid crystal display device in the prior art
  • FIG. 2 is a schematic view showing the effect of the liquid crystal display device of FIG. 1 after performing the edge washing process
  • FIG. 3 is a schematic structural view of a liquid crystal display device according to a first embodiment of the present invention.
  • FIG. 4 is a schematic structural view of the first via hole in FIG. 3 along a line A-A;
  • FIG. 5 is a schematic structural view of the second via hole and the third via hole in FIG. 3 along a line B-B;
  • Figure 6 is a flow chart showing a method of manufacturing a liquid crystal display device of the present invention.
  • FIG. 7 is a schematic view showing the effect of the edge washing treatment in the method of manufacturing the liquid crystal display device of the present invention.
  • FIG. 8 is a schematic structural view of a liquid crystal display device according to a second embodiment of the present invention.
  • Figure 9 is a schematic structural view of a liquid crystal display device in accordance with a third embodiment of the present invention.
  • FIG. 3 is a schematic structural diagram of a liquid crystal display device according to a first embodiment of the present invention.
  • the liquid crystal display device disclosed in this embodiment includes a substrate 21 and a metal wiring layer 22 on the substrate 21.
  • the first via hole 221, the second via hole 222, and the third via hole 223 are disposed in the metal wiring layer 22.
  • the first via hole 221 , the second via hole 222 , and the third via hole 223 are separately disposed on the metal trace layer 22
  • the first transparent conductive layer 231 is disposed on the first via hole 221 to form the test point 23 .
  • the test point 23 is for detecting whether the metal wiring layer 22 of the liquid crystal display device is abnormal.
  • a second transparent conductive layer 24 is disposed on the second via hole 222 and the third via hole 223. The first transparent conductive layer 231 and the second transparent conductive layer 24 are connected.
  • the broken line shown in FIG. 3 is used to indicate the boundary line at the intersection of the first transparent conductive layer 231 and the second transparent conductive layer 24. It should be understood that in the actual structure, the first transparent conductive layer 231 and the first There is no specific boundary line between the two transparent conductive layers 24, and may be formed by the same transparent conductive layer.
  • the first transparent conductive layer 231 and the second transparent conductive layer 24 are preferably ITO (Indium Tin)
  • ITO Indium Tin
  • the Oxides, indium tin oxide layer may also be Indium Zinc Oxide (IZO) or other materials having both light transmissivity and electrical conductivity.
  • IZO Indium Zinc Oxide
  • the metal trace layer 22 includes a first metal trace layer 224 and a second metal trace layer 225.
  • the first metal wiring layer 224 and the second metal wiring layer 225 are sequentially disposed on the substrate 21, and the first insulating layer 211 is disposed between the first metal wiring layer 224 and the second metal wiring layer 225.
  • a second insulating layer 212 is disposed on the second metal wiring layer 225.
  • the first via hole 221 penetrates the second insulating layer 212, and the first transparent conductive layer 231 is covered on the second metal trace layer 225 through the first via hole 221 to make the first transparent conductive layer Layer 231 is coupled to second metal trace layer 225.
  • FIG. 5 is a schematic structural view of the second via hole 222 and the third via hole 223 of FIG. 3 along a BB section line.
  • the second via hole 222 penetrates the first insulating layer 211 and the second metal.
  • the wiring layer 225 and the second insulating layer 212 penetrate the second insulating layer 212.
  • the second transparent conductive layer 24 is covered on the first metal trace layer 224 and the second metal trace layer 225 through the second via hole 222 and the third via hole 223 to make the first metal trace layer 224
  • the second transparent conductive layer 24 is connected to the second metal wiring layer 225.
  • FIG. 6 is a flow chart showing a method of manufacturing the liquid crystal display device of the present invention. As shown in FIG. 6, the manufacturing method of the liquid crystal display device disclosed in the present embodiment includes the following steps:
  • Step 301 providing a substrate 21;
  • Step 302 a metal trace layer 22 is disposed on the substrate 21, the metal trace layer 22 is provided with a first via hole 221, a second via hole 222 and a third via hole 223;
  • Step 303 providing a first transparent conductive layer 231 on the first via hole 221 to form a test point 23, a second transparent conductive layer 24 on the second via hole 222 and the third via hole 223, and first The transparent conductive layer 231 and the second transparent conductive layer 24 are connected;
  • Step 304 Perform the edge treatment of the metal wiring layer 22 on the substrate 21.
  • Fig. 7 is a view showing the effect of the edge washing treatment in the method of manufacturing the liquid crystal display device of the present invention.
  • the metal wiring layer 22 under the first transparent conductive layer 231 and the second transparent conductive layer 24 is edge-cut along the edge boundary 25.
  • the metal wiring layer 22 other than the edge boundary 25 is removed, the metal wiring layer 22 is broken, but the metal wiring layer 22 is located on the upper layer of the metal wiring layer 22.
  • a transparent conductive layer 231 and a second transparent conductive layer 24 are disposed to be connected to each other. Therefore, the test point 23 can still pass through the first transparent conductive layer 231 and the second transparent conductive layer 24 and the second via hole on the metal trace 22
  • the 222 and the third via hole 223 are connected to each other to effectively prevent the test point 23 from failing.
  • the distance between the edge boundary 25 of the metal wiring layer 22 and the boundary of the substrate 21 is preferably 15 mm, wherein the second via hole 222 and the third via hole 223 are both disposed.
  • the metal wiring layer 22 is within the boundary 25 of the edge cleaning process, that is, the distance between the second via hole 222 and the third via hole 223 and the boundary of the substrate 21 is greater than 15 mm to avoid the coverage of the second transparent conductive layer 24.
  • the first metal trace layer 224 and the second metal trace layer 225 are washed away to further prevent the test point 23 from failing.
  • the shape of the test point 23 is a rectangle. In other implementations, those skilled in the art can fully set the test point 23 to any other shape, for example, the test point 43 is set to a hexagon, as shown in FIG.
  • first transparent conductive layer 231 and the second transparent conductive layer 24 are disposed as a rectangular transparent conductive layer. In other embodiments, those skilled in the art can completely connect the first transparent conductive layer 231 and the second transparent conductive layer 24 into other shapes, such as a "shaped" transparent conductive layer, as shown in FIG.
  • the liquid crystal display device of the present invention and the manufacturing method thereof are connected by connecting the first transparent conductive layer and the second transparent conductive layer, so that the first transparent conductive layer and the second transparent conductive layer remain connected after the edge treatment.
  • the test point is connected to the first metal trace layer and the second metal trace layer to prevent the test point from failing.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
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Description

液晶显示装置及其制造方法
【技术领域】
本发明涉及液晶显示技术领域，特别是涉及一种液晶显示装置及其制造方法。
【背景技术】
如图1所示，现有的液晶显示装置包括：基板11以及设置在基板11上的金属走线层12。其中，金属走线层12设有第一导通孔121和第二导通孔122，第一导通孔121上设置第一透明导电层123以形成测试点13，在第二导通孔122上设置第二透明导电层124。第一透明导电层123和第二透明导电层124分开设置，测试点13通过第一导通孔121与金属走线层12连接。
在液晶显示装置制造过程中，其中一个工序是进行金属走线层12的冼边处理（Edge Exposure），即将位于洗边边界125和基板11边界之间的所有金属全部洗掉。
如图2所示，当洗边边界125比较靠近基板11内侧时，则洗边边界125以外的金属走线层12都会被洗掉。此时，由于测试点13设在金属走线层12的洗边边界125的外侧，测试点13与第二导通孔122之间的金属走线层12被洗掉，导致测试点13与第二导通孔122断开，测试点13失效。
因此，需要提供一种液晶显示装置及其制造方法，以解决上述问题。
【发明内容】
本发明主要解决的技术问题是提供一种液晶显示装置及其制造方法，通过第一透明导电层与第二透明导电层连接，防止测试点失效。
为解决上述技术问题，本发明采用的一个技术方案是：提供一种液晶显示装置，其包括：设置在基板上的金属走线层，金属走线层上设有第一导通孔、第二导通孔和第三导通孔，金属走线层包括第一金属走线层以及第二金属走线层，第一金属走线层和第二金属走线层依次设置在基板上，第一金属走线层与第二金属走线层之间设置有第一绝缘层，第二金属走线层上设置有第二绝缘层；第一导通孔贯穿第二绝缘层，在第一导通孔上设置第一透明导电层以形成测试点，且第一透明导电层通过第一导通孔覆盖在第二金属线层上；第二导通孔贯穿第一绝缘层、第二金属走线层和第二绝缘层，第三导通孔贯穿第二绝缘层，在第二导通孔和第三导通孔上设置第二透明导电层，第二透明导电层通过第二导通孔和第三导通孔覆盖在第一金属走线层和第二金属走线层上；其中，第一透明导电层与第二透明导电层连接。
为解决上述技术问题，本发明采用的另一个技术方案是：提供一种液晶显示装置，其包括：设置在基板上的金属走线层，金属走线层上设有第一导通孔、第二导通孔和第三导通孔，其中，在第一导通孔上设置第一透明导电层以形成测试点，在第二导通孔和第三导通孔上设置第二透明导电层，且第一透明导电层与第二透明导电层连接。
其中，金属走线层包括第一金属走线层以及第二金属走线层，第一金属走线层和第二金属走线层依次设置在基板上，第一金属走线层与第二金属走线层之间设置有第一绝缘层，第二金属走线层上设置有第二绝缘层。
其中，第一导通孔贯穿第二绝缘层，第一透明导电层通过第一导通孔覆盖在第二金属线层上。
其中，第二导通孔贯穿第一绝缘层、第二金属走线层和第二绝缘层，第三导通孔贯穿第二绝缘层，第二透明导电层通过第二导通孔和第三导通孔覆盖在第一金属走线层和第二金属走线层上。
其中，第二导通孔和第三导通孔均设在金属走线层的洗边边界以内。
为解决上述技术问题，本发明采用的另一个技术方案是：提供一种液晶显示装置的制造方法，其包括：提供一基板；在基板上设置金属走线层，金属走线层上设有第一导通孔、第二导通孔和第三导通孔；在第一导通孔上设置第一透明导电层以形成测试点，并且在第二导通孔和第三导通孔上设置第二透明导电层，其中，第一透明导电层与第二透明导电层连接；对基板进行金属走线层的冼边处理，并使得第一透明导电层与第二透明导电层在冼边处理后仍保持连接。
其中，金属走线层包括第一金属走线层以及第二金属走线层，第一金属走线层和第二金属走线层依次设置在基板上，第一金属走线层与第二金属走线层之间设置有第一绝缘层，第二金属走线层上设置有第二绝缘层。
其中，第一导通孔贯穿第二绝缘层，第一透明导电层通过第一导通孔覆盖在第二金属线层上。
其中，第二导通孔贯穿第一绝缘层、第二金属走线层和第二绝缘层，第三导通孔贯穿第二绝缘层，第二透明导电层通过第二导通孔和第三导通孔覆盖在第一金属走线层和第二金属走线层上。
其中，第二导通孔和第三导通孔均设在金属走线层的洗边边界以内。
本发明的有益效果是：区别于现有技术的情况，本发明的液晶显示装置及其制造方法通过将第一透明导电层与第二透明导电层连接，使得第一透明导电层与第二透明导电层在冼边处理后仍保持连接，进而保证测试点与第一金属走线层和第二金属走线层连接，防止测试点失效。
【附图说明】
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。其中：
图1是现有技术中液晶显示装置的结构示意图；
图2是图1中的液晶显示装置进行洗边处理后的效果示意图；
图3是根据本发明第一实施例的液晶显示装置的结构示意图；
图4是图3中第一导通孔处沿A-A剖面线的结构示意图；
图5是图3中第二导通孔和第三导通孔处沿B-B剖面线的结构示意图；
图6是本发明液晶显示装置的制造方法的流程图；
图7是本发明液晶显示装置的制造方法中洗边处理的效果示意图；
图8是根据本发明第二实施例的液晶显示装置的结构示意图；
图9是根据本发明第三实施例的液晶显示装置的结构示意图。
【具体实施方式】
请参见图3，图3是根据本发明第一实施例的液晶显示装置的结构示意图。如图3所示，本实施例所揭示的液晶显示装置包括：基板21以及设置基板21上的金属走线层22。
在本实施例中，在金属走线层22设有第一导通孔221、第二导通孔222和第三导通孔223。第一导通孔221、第二导通孔222和第三导通孔223分开设置在金属走线层22上，在第一导通孔221上设置第一透明导电层231以形成测试点23，测试点23用于检测液晶显示装置的金属走线层22是否异常。此外，在第二导通孔222和第三导通孔223上设置第二透明导电层24。其中，第一透明导电层231和第二透明导电层24连接。
值得注意的是，图3中所示的虚线用来表示第一透明导电层231和第二透明导电层24相交处的分界线，应理解，在实际结构中，第一透明导电层231和第二透明导电层24之间不存在特定的边界线，可由同一层透明导电层形成。
第一透明导电层231和第二透明导电层24优选为ITO（Indium Tin Oxides，氧化铟锡）层，也可以为氧化铟锌（Indium Zinc Oxide，IZO），或者是其他同时具有透光性和导电性的材料。
图4是图3中第一导通孔221处沿A-A剖面线的结构示意图，如图4所示，金属走线层22包括第一金属走线层224和第二金属走线层225。其中，第一金属走线层224和第二金属走线层225依次设置在基板21上，第一金属走线层224与第二金属走线层225之间设置有第一绝缘层211，在第二金属走线层225上设置有第二绝缘层212。
在本实施例中，第一导通孔221贯穿第二绝缘层212，并且第一透明导电层231通过第一导通孔221覆盖在第二金属走线层225上，以使第一透明导电层231与第二金属走线层225连接。
图5是图3中第二导通孔222和第三导通孔223处沿B-B剖面线的结构示意图，如图5所示，第二导通孔222贯穿第一绝缘层211、第二金属走线层225和第二绝缘层212，第三导通孔223贯穿第二绝缘层212。其中，第二透明导电层24通过第二导通孔222和第三导通孔223覆盖在第一金属走线层224和第二金属走线层225上，以使第一金属走线层224通过第二透明导电层24与第二金属走线层225连接。
请在参见图6，图6是本发明的液晶显示装置的制造方法的流程图。如图6所示，本实施所揭示的液晶显示装置的制造方法包括以下步骤：
步骤301：提供一基板21；
步骤302：在基板21上设置金属走线层22，金属走线层22上设有第一导通孔221、第二导通孔222和第三导通孔223；
步骤303：在第一导通孔221上设置第一透明导电层231以形成测试点23，在第二导通孔222和第三导通孔223上设置第二透明导电层24，并且第一透明导电层231和第二透明导电层24连接；
步骤304：对基板21进行金属走线层22的冼边处理。
如图7所示，图7是本发明液晶显示装置的制造方法中洗边处理的效果示意图。在步骤304中，沿着冼边边界25对位于第一透明导电层231和第二透明导电层24下方的金属走线层22进行冼边处理。本发明中，在金属走线层22进行洗边处理后，虽然冼边边界25外的金属走线层22被冼除，金属走线层22断开，但是位于金属走线层22上层的第一透明导电层231和第二透明导电层24设置为相互连接，因此，测试点23依然可以通过第一透明导电层231和第二透明导电层24与金属走线22上的第二导通孔222和第三导通孔223孔处实现连通，有效地防止测试点23失效。
在本实施例中，金属走线层22进行洗边处理的冼边边界25与基板21的边界之间的距离优选为15mm，其中，第二导通孔222和第三导通孔223均设置金属走线层22进行洗边处理的边界25以内，即第二导通孔222和第三导通孔223与基板21的边界的距离均大于15mm，以避免第二透明导电层24所覆盖的第一金属走线层224和第二金属走线层225被洗掉，进一步防止测试点23失效。
值得注意的是，在本实施例中，测试点23的形状为矩形。在其他实施中，本领域的技术人员完全可以将测试点23设置成其他任意形状，例如测试点43设置为六边形，如图8所示。
此外，在本实施例中，第一透明导电层231和第二透明导电层24设置成一矩形透明导电层。在其他实施例中，本领域的技术人员完全可以将第一透明导电层231和第二透明导电层24连接成其他形状，例如“工”字形的透明导电层，如图9所示。
综上所述，本发明的液晶显示装置及其制造方法通过将第一透明导电层与第二透明导电层连接，使得第一透明导电层与第二透明导电层在冼边处理后仍保持连接，进而保证测试点与第一金属走线层和第二金属走线层连接，防止测试点失效。
以上所述仅为本发明的实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (11)

  1. 一种液晶显示装置，其中，所述液晶显示装置包括:
    设置在基板上的金属走线层，所述金属走线层上设有第一导通孔、第二导通孔和第三导通孔，所述金属走线层包括第一金属走线层以及第二金属走线层，所述第一金属走线层和所述第二金属走线层依次设置在所述基板上，所述第一金属走线层与所述第二金属走线层之间设置有第一绝缘层，所述第二金属走线层上设置有第二绝缘层；
    所述第一导通孔贯穿所述第二绝缘层，在所述第一导通孔上设置第一透明导电层以形成测试点，且所述第一透明导电层通过所述第一导通孔覆盖在所述第二金属线层上；
    所述第二导通孔贯穿所述第一绝缘层、第二金属走线层和第二绝缘层，所述第三导通孔贯穿所述第二绝缘层，在所述第二导通孔和所述第三导通孔上设置第二透明导电层，所述第二透明导电层通过所述第二导通孔和所述第三导通孔覆盖在所述第一金属走线层和所述第二金属走线层上；
    其中，所述第一透明导电层与所述第二透明导电层连接。
  2. 一种液晶显示装置，其中，所述液晶显示装置包括:
    设置在基板上的金属走线层，所述金属走线层上设有第一导通孔、第二导通孔和第三导通孔，其中，在所述第一导通孔上设置第一透明导电层以形成测试点，在所述第二导通孔和所述第三导通孔上设置第二透明导电层，且所述第一透明导电层与所述第二透明导电层连接。
  3. 根据权利要求2所述的液晶显示装置，其中，所述金属走线层包括第一金属走线层以及第二金属走线层，所述第一金属走线层和所述第二金属走线层依次设置在所述基板上，所述第一金属走线层与所述第二金属走线层之间设置有第一绝缘层，所述第二金属走线层上设置有第二绝缘层。
  4. 根据权利要求3所述的液晶显示装置，其中，所述第一导通孔贯穿所述第二绝缘层，所述第一透明导电层通过所述第一导通孔覆盖在所述第二金属线层上。
  5. 根据权利要求3所述的液晶显示装置，其中，所述第二导通孔贯穿所述第一绝缘层、第二金属走线层和第二绝缘层，所述第三导通孔贯穿所述第二绝缘层，所述第二透明导电层通过所述第二导通孔和所述第三导通孔覆盖在所述第一金属走线层和所述第二金属走线层上。
  6. 根据权利要求2所述的液晶显示装置，其中，所述第二导通孔和所述第三导通孔均设在所述金属走线层的洗边边界以内。
  7. 一种液晶显示装置的制造方法，其中，所述制造方法包括：
    提供一基板；
    在所述基板上设置金属走线层，所述金属走线层上设有第一导通孔、第二导通孔和第三导通孔；
    在所述第一导通孔上设置第一透明导电层以形成测试点，并且在所述第二导通孔和所述第三导通孔上设置第二透明导电层，其中，所述第一透明导电层与所述第二透明导电层连接；
    对所述基板进行金属走线层的冼边处理，并使得所述第一透明导电层与所述第二透明导电层在所述冼边处理后仍保持连接。
  8. 根据权利要求7所述的制造方法，其中，所述金属走线层包括第一金属走线层以及第二金属走线层，所述第一金属走线层和所述第二金属走线层依次设置在所述基板上，所述第一金属走线层与所述第二金属走线层之间设置有第一绝缘层，所述第二金属走线层上设置有第二绝缘层。
  9. 根据权利要求8所述的制造方法，其中，所述第一导通孔贯穿所述第二绝缘层，所述第一透明导电层通过所述第一导通孔覆盖在所述第二金属线层上。
  10. 根据权利要求8所述的制造方法，其中，所述第二导通孔贯穿所述第一绝缘层、第二金属走线层和第二绝缘层，所述第三导通孔贯穿所述第二绝缘层，所述第二透明导电层通过所述第二导通孔和所述第三导通孔覆盖在所述第一金属走线层和所述第二金属走线层上。
  11. 根据权利要求7所述的制造方法，其中，所述第二导通孔和所述第三导通孔均设在所述金属走线层的洗边边界以内。
PCT/CN2012/075447 2012-04-27 2012-05-14 液晶显示装置及其制造方法 Ceased WO2013159407A1 (zh)

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