WO2013145161A1 - 金属酸化膜の製造方法および金属酸化膜 - Google Patents
金属酸化膜の製造方法および金属酸化膜 Download PDFInfo
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- WO2013145161A1 WO2013145161A1 PCT/JP2012/058156 JP2012058156W WO2013145161A1 WO 2013145161 A1 WO2013145161 A1 WO 2013145161A1 JP 2012058156 W JP2012058156 W JP 2012058156W WO 2013145161 A1 WO2013145161 A1 WO 2013145161A1
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- Prior art keywords
- metal oxide
- oxide film
- dopant
- solution
- substrate
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
- C23C18/1208—Oxides, e.g. ceramics
- C23C18/1216—Metal oxides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/125—Process of deposition of the inorganic material
- C23C18/1291—Process of deposition of the inorganic material by heating of the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
- H01B1/08—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances oxides
Definitions
- the present invention relates to a method for manufacturing a metal oxide film and a metal oxide film, and can be applied to a method for manufacturing a metal oxide film used in, for example, a solar cell or an electronic device.
- a method for forming a metal oxide film used in solar cells, electronic devices, etc. for example, a MOCVD (Metal Organic Chemical Deposition) method using a vacuum, a sputtering method, or the like is employed.
- MOCVD Metal Organic Chemical Deposition
- the metal oxide films produced by these metal oxide film manufacturing methods have excellent film characteristics.
- the resistance of the transparent conductive film is low, and even if the transparent conductive film after the production is subjected to heat treatment, The resistance of the transparent conductive film does not increase.
- Patent Document 1 exists as a prior document relating to the formation of a zinc oxide film by the MOCVD method.
- Patent Document 2 exists as a prior document relating to the formation of a zinc oxide film by sputtering.
- the MODVD method is inferior in terms of convenience because it requires high cost to realize the method and requires the use of an unstable material in the air.
- a metal oxide film having a laminated structure is produced by sputtering, a plurality of apparatuses are required, which increases the cost of the apparatus. Therefore, a metal oxide film manufacturing method capable of producing a low-resistance metal oxide film at low cost is desired.
- the metal oxide film is formed on the substrate in a non-vacuum state. Therefore, the cost required for the film formation process (film formation apparatus cost) can be reduced, and convenience can be improved.
- the metal oxide film is formed by spraying a solution containing an alkyl metal onto the substrate. Since alkyl metal has high reactivity, it is only necessary to perform low-temperature (200 ° C. or lower) heat treatment on the substrate during film formation, and it is not necessary to perform high-temperature heat treatment on the substrate.
- a film forming process is performed under non-vacuum (atmospheric pressure).
- the metal oxide film formed under the non-vacuum can have high resistance. Therefore, the present invention provides a method for producing a metal oxide film that can suppress high resistance even in a metal oxide film formed under non-vacuum (atmospheric pressure).
- FIG. 1 is an experimental result showing the relationship between the resistivity of the deposited metal oxide film and the molar concentration ratio of indium to zinc (the vertical axis is the resistivity ( ⁇ ⁇ cm), and the horizontal axis is the horizontal axis. In / Zn molar concentration ratio (%)).
- FIG. 2 is an experimental result showing the relationship between the film thickness of the formed metal oxide film and the molar concentration ratio of indium to zinc (the vertical axis is the film thickness (nm), and the horizontal axis is In / Zn molar concentration ratio (%)).
- FIG. 3 of the formed metal oxide film, the experimental results showing the relationship between the molar concentration ratio of indium with respect to the carrier concentration mobility and zinc (Note that the vertical axis on the left side and the carrier concentration (cm - 3 ), the vertical axis on the right is the mobility (cm 2 / V ⁇ s), and the horizontal axis is the In / Zn molar concentration ratio (%)).
- a dopant indium
- the resistivity of the metal oxide film does not decrease.
- the resistivity of the metal oxide film tends to increase more than the resistivity of the non-doped metal oxide film. Also shown in FIG.
- the inventors have increased the dopant concentration slightly by increasing the dopant concentration slightly, and increasing the dopant concentration as shown in FIG. Even so, I discovered the following by repeatedly considering various matters, such as deterioration of mobility and higher resistance.
- the inventors have found that, even when the dopant concentration is increased by adopting a dopant solution containing an organic compound, the metal oxide film to be formed has a high resistance. Furthermore, the inventors have found that by adopting a dopant solution containing an inorganic compound, the metal oxide film to be formed can be reduced in resistance by increasing the dopant concentration.
- the dopant solution 5 containing the dopant which consists of an inorganic compound is produced.
- a boric acid (H 3 BO 3 ) solution can be adopted as the dopant solution 5 containing a dopant made of an inorganic compound.
- the produced dopant solution 5 is filled in the container 3C as shown in FIG.
- the substrate 1 is heated by the heater 2 to about 200 ° C., for example.
- the molar concentration ratio includes the carrier gas supply amount (liter / min) to the nozzle 8 (or substrate 1) of the solution 7, the molar concentration of zinc in the solution 7, and the nozzle 8 of the dopant solution 5. It can be changed by adjusting the carrier gas supply amount (liter / min) to (or substrate 1) and the molar concentration of the dopant in the dopant solution 5.
- a metal oxide film having a B / Zn molar concentration ratio of 0.16% when supplying zinc and boron to the substrate 1 zinc and Metal oxide film having a B / Zn molar concentration ratio of 0.32% when supplying boron, and metal having a B / Zn molar concentration ratio of 0.4% when supplying zinc and boron to the substrate 1 Oxide film, B / Zn molar concentration ratio when supplying zinc and boron to substrate 1 was 1.0%, and B / Zn molar concentration ratio when supplying zinc and boron to substrate 1 This is a metal oxide film with 1.8%.
- the deposition temperature of all the metal oxide films described above is 200 ° C.
- Each metal oxide film is formed in the film forming apparatus shown in FIG. 4, and the film forming conditions are as shown in FIG.
- the supply amount of zinc to the substrate 1 is 1.1 m (mm) mol / min, and the supply amount of the oxidizing agent (water) 6 to the substrate 1 is 67 mmol / min.
- each metal having the B / Zn molar concentration ratio of 0.16%, 0.32%, 0.4%, 0.8%, 1.0%, and 1.8%.
- the supply amount of zinc to the substrate 1 is 1.1 mmol / min
- the supply amount of the oxidizing agent (water) 6 to the substrate 1 is 67 to 133 mmol / min.
- FIG. 5 is measurement data showing the relationship between the resistivity and the molar concentration ratio in each metal oxide film formed in the manufacturing apparatus of FIG. 4 under the film forming conditions.
- the vertical axis of FIG. 5 is the resistivity ( ⁇ ⁇ cm)
- the horizontal axis of FIG. 5 is the B / Zn molar concentration ratio (%).
- FIG. 7 is measurement data showing the relationship among the carrier concentration, mobility, and molar concentration ratio in each metal oxide film formed in the manufacturing apparatus of FIG. 4 under the above film forming conditions.
- the left vertical axis in FIG. 7 is the carrier concentration (cm ⁇ 3 )
- the right vertical axis in FIG. 7 is the mobility (cm 2 / V ⁇ s)
- the horizontal axis in FIG. Zn molar concentration ratio (%) is the carrier concentration (cm ⁇ 3 )
- the horizontal axis in FIG. Zn molar concentration ratio (%) is the horizontal axis in FIG. Zn molar concentration ratio (%).
- a metal oxide film is formed on the substrate 1 by dissolving a dopant made of an organic compound in the dopant solution, dissolving the alkyl metal in the solution, and spraying the dopant solution and the solution on the substrate 1. .
- each doped metal oxide film tended to be larger than the resistivity of the non-doped metal oxide film. Furthermore, as shown in FIG. 1, the resistivity of each metal oxide film tends to increase as the doping concentration increases.
- a dopant made of an inorganic compound is dissolved in the dopant solution 5
- an alkyl metal is dissolved in the solution 7
- the dopant solution 5 and the solution 7 are formed on the substrate. It is assumed that a metal oxide film is formed on the substrate 1 by spraying on the substrate 1.
- a doped metal oxide film having a resistivity lower than that of the non-doped metal oxide film can be formed.
- the resistivity of the non-doped metal oxide film and the resistivity of the metal oxide film whose B / Zn molar concentration ratio was 1.8% were almost the same. It was.
- the resistivity of the metal oxide film having the B / Zn molar concentration ratio of 0.16%, 0.32%, 0.4%, 0.8%, and 1.0% is All were smaller than the resistivity of the non-doped metal oxide film.
- the resistivity of the metal oxide film whose B / Zn molar concentration ratio was less than 1.8% may be lower than the resistivity of the non-doped metal oxide film.
- the metal oxide film forming conditions to be measured in FIGS. 5 to 7 are those contained in the dopant solution, which are organic It differs in whether it is a compound or an inorganic compound, and the main film forming conditions are the same for both.
- the metal oxide film is formed on the substrate 1 in a non-vacuum state. Therefore, the cost required for the film formation process (film formation apparatus cost) can be reduced, and convenience can be improved.
- the inventors formed a metal oxide film using a solution containing a complex metal instead of an alkyl metal. In this case, even if a dopant made of an organic compound is supplied to the substrate, the resistivity of the metal oxide film can be reduced. However, since complex metals have low reactivity, it is necessary to heat the substrate 1 to a considerably high temperature during film formation.
- the metal oxide film is formed by spraying the solution 7 containing the alkyl metal onto the substrate 1.
- the alkyl metal has high reactivity. Therefore, at the time of film formation, the substrate 1 may be subjected to a low-temperature (200 ° C. or lower) heat treatment, and the high-temperature heat treatment need not be performed on the substrate 1.
- a solution 7 containing an alkyl metal and a dopant solution 5 containing a dopant made of an inorganic compound are sprayed onto the substrate 1 placed under non-vacuum. As a result, a metal oxide film is formed on the substrate 1.
- a low-resistance metal oxide film can be formed by a low-temperature film formation process.
- the present invention including the step of spraying the dopant solution 5 containing the dopant made of the inorganic compound onto the substrate 1 is more effective in the film forming process under non-vacuum (atmospheric pressure).
- boric acid is a substance that can be used stably and safely in the atmosphere, so that convenience can be further improved. Further, since boric acid is an inexpensive material, the manufacturing cost of the metal oxide film can be reduced. In addition, metal oxide films (particularly zinc oxide films) are easily etched by strong acids and strong bases, but boric acid is a weak acid. Therefore, even if boric acid is sprayed on the substrate 1 as a dopant during film formation, the metal oxide film can be prevented from being etched during the film formation. Therefore, by using boric acid as a dopant made of an inorganic compound, it is possible to prevent the formation of the metal oxide film on the substrate 1 from being hindered.
- the resistivity of the metal oxide film could be reduced even when a solution containing a complex metal and a dopant solution containing boric acid were supplied to the substrate.
- complex metals since complex metals have low reactivity, it is necessary to heat the substrate to a considerably high temperature during film formation, which does not meet the demand for low-temperature treatment.
- the resistivity of the non-doped metal oxide film is set as shown in FIG. 5 by setting the molar concentration ratio to less than 1.8%.
- a doped metal oxide film having a lower resistivity can be formed.
- the solution 7 and the dopant solution 5 are accommodated in separate containers 3A and 3C, and are transferred to the substrate 1 through different systems L1 and L3 (that is, from different nozzles of the nozzle 8). By spraying the solution 7 and the dopant solution 5 respectively, the above problems can be prevented.
- oxygen in the atmosphere can be used as an oxidation source.
- FIG. 1 by adopting a configuration in which the oxidation source 6 is positively supplied to the substrate 1, it is possible to improve the deposition rate of the metal oxide film and to improve the metal oxide quality. A film can also be formed.
- the solution 7 and the oxidation source 6 are accommodated in separate containers 3A and 3B, and are transferred to the substrate 1 via different systems L1 and L2 (that is, from different outlets of the nozzle 8).
- the reaction between the solution 7 and the oxidizing agent 6 can be limited to the substrate 1 only. In other words, the reaction between the solution 7 and the oxidizing agent 6 in the container can be prevented, and the reaction between the solution 7 and the oxidizing agent 6 in the supply path to the substrate 1 can also be prevented.
- ozone oxygen, or the like can be employed as the oxidizing agent 6.
- oxygen or the like
- ozone is highly reactive and oxygen is less reactive. Therefore, water is adopted as the oxygen source 6.
- the oxidizing agent 6 with appropriate reactivity can be sprayed on the substrate 1 at low cost.
- the container 3A for the solution 7, the container 3B for the oxidation source 6, and the container 3C for the dopant solution 5 are present separately and independently.
- a configuration in which any of these containers 3A, 3B, and 3C is omitted can be employed.
- the solution 7 and the oxidation source 6 are put in the same container and the dopant solution 5 is put in the other container, or the dopant solution 5 and the oxidation source 6 are put in the same container. It is also possible to adopt a configuration in which the solution 7 is put in the other container, and a configuration in which the solution 7 and the dopant solution 5 are put in the same one container and the oxidation source 6 is put in the other container is also possible.
- the container is divided for each of the solutions 5, 6 and 7 or a common container is used for the two solutions depends on the type of the dopant solution 7, the oxidation source 6 and the solution 5 (for example, the solubility of the dopant and Depending on the reactivity of each solution 5, 6 and 7).
- the boric acid dissolves in water
- the boric acid as the dopant solution 5 and the water as the oxidation source 6 can be put in the same container.
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Description
具体的に、本実施の形態に係る金属酸化膜の製造方法を、図4に示す製造装置(成膜装置)を用いて説明する。
2 加熱器
3A,3B,3C 容器
4A,4B,4C 霧化器
5 ドーパント溶液
6 酸化源
7 溶液
8 ノズル
L1,L2,L3 経路
Claims (9)
- (A)アルキル金属を含む溶液(7)を、非真空下に配置された基板(1)に対して噴霧する工程と、
(B)前記工程(A)の際に、前記基板に対して、無機化合物から成るドーパントを含むドーパント溶液(5)を噴霧する工程とを、備える
ことを特徴とする金属酸化膜の製造方法。 - 前記無機化合物から成るドーパントは、
ホウ酸である、
ことを特徴とする請求項1に記載の金属酸化膜の製造方法。 - 前記工程(A)および(B)において、
前記基板に供給される前記アルキル金属のモル濃度に対する、前記基板に供給される前記ドーパントのモル濃度が、1.8%未満である、
ことを特徴とする請求項2に記載の金属酸化膜の製造方法。 - 前記工程(A)および(B)において、
前記溶液および前記ドーパント溶液は各々、別系統(L1,L3)を介して、前記基板に供給される、
ことを特徴とする請求項1に記載の金属酸化膜の製造方法。 - (D)前記工程(A)および(B)の際に、前記基板に対して、酸化源(6)を噴霧する工程を、さらに備えている、
ことを特徴とする請求項1に記載の金属酸化膜の製造方法。 - 前記工程(A)および(D)において、
前記溶液および前記酸化源は各々、別系統(L1,L2)を介して、前記基板に供給される、
ことを特徴とする請求項5に記載の金属酸化膜の製造方法。 - 前記工程(A)、(B)および(D)において、
前記溶液、前記酸化源および前記ドーパント溶液は各々、別系統(L1,L2,L3)を介して、前記基板に供給される、
ことを特徴とする請求項5に記載の金属酸化膜の製造方法。 - 前記酸化源は、
水である、
ことを特徴とする請求項5に記載の金属酸化膜の製造方法。 - 請求項1乃至請求項8の何れかに記載の金属酸化膜の製造方法により作製された、ことを特徴とする金属酸化膜。
Priority Applications (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020147025959A KR20140129197A (ko) | 2012-03-28 | 2012-03-28 | 금속 산화막의 제조 방법 및 금속 산화막 |
| US14/382,827 US20150076422A1 (en) | 2012-03-28 | 2012-03-28 | Method for producing metal oxide film and metal oxide film |
| DE201211006123 DE112012006123T5 (de) | 2012-03-28 | 2012-03-28 | Verfahren zur Erzeugung eines Metalloxidfilms und Metalloxidfilm |
| KR1020167030595A KR20160130527A (ko) | 2012-03-28 | 2012-03-28 | 금속 산화막의 제조 방법 및 금속 산화막 |
| PCT/JP2012/058156 WO2013145161A1 (ja) | 2012-03-28 | 2012-03-28 | 金属酸化膜の製造方法および金属酸化膜 |
| JP2014507129A JP5956560B2 (ja) | 2012-03-28 | 2012-03-28 | 金属酸化膜の製造方法 |
| CN201280071921.6A CN104220375A (zh) | 2012-03-28 | 2012-03-28 | 金属氧化膜的制造方法及金属氧化膜 |
| KR1020197008862A KR20190035964A (ko) | 2012-03-28 | 2012-03-28 | 금속 산화막의 제조 방법 및 금속 산화막 |
| TW101121485A TWI470680B (zh) | 2012-03-28 | 2012-06-15 | 金屬氧化膜之製造方法及金屬氧化膜 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2012/058156 WO2013145161A1 (ja) | 2012-03-28 | 2012-03-28 | 金属酸化膜の製造方法および金属酸化膜 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2013145161A1 true WO2013145161A1 (ja) | 2013-10-03 |
Family
ID=49258527
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2012/058156 Ceased WO2013145161A1 (ja) | 2012-03-28 | 2012-03-28 | 金属酸化膜の製造方法および金属酸化膜 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20150076422A1 (ja) |
| JP (1) | JP5956560B2 (ja) |
| KR (3) | KR20190035964A (ja) |
| CN (1) | CN104220375A (ja) |
| DE (1) | DE112012006123T5 (ja) |
| TW (1) | TWI470680B (ja) |
| WO (1) | WO2013145161A1 (ja) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016001712A (ja) | 2013-11-29 | 2016-01-07 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
Citations (4)
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|---|---|---|---|---|
| JPH01264929A (ja) * | 1988-04-13 | 1989-10-23 | Mitsubishi Metal Corp | 透明導電性酸化亜鉛膜の製造方法 |
| WO2010035313A1 (ja) * | 2008-09-24 | 2010-04-01 | 東芝三菱電機産業システム株式会社 | 金属酸化膜の成膜方法および金属酸化膜の成膜装置 |
| WO2010123030A1 (ja) * | 2009-04-21 | 2010-10-28 | 東ソー・ファインケム株式会社 | ドープまたはノンドープの酸化亜鉛薄膜製造用組成物とそれを用いた酸化亜鉛薄膜の製造方法 |
| WO2011155635A1 (ja) * | 2010-06-08 | 2011-12-15 | 住友金属鉱山株式会社 | 金属酸化物膜の製造方法及び金属酸化物膜、それを用いた素子、金属酸化物膜付き基板並びにそれを用いたデバイス |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0945140A (ja) | 1995-07-28 | 1997-02-14 | Sumitomo Metal Mining Co Ltd | 酸化亜鉛系透明導電性膜 |
| JP5411681B2 (ja) | 2009-12-09 | 2014-02-12 | スタンレー電気株式会社 | 酸化亜鉛系半導体の成長方法及び半導体発光素子の製造方法 |
-
2012
- 2012-03-28 US US14/382,827 patent/US20150076422A1/en not_active Abandoned
- 2012-03-28 KR KR1020197008862A patent/KR20190035964A/ko not_active Ceased
- 2012-03-28 CN CN201280071921.6A patent/CN104220375A/zh active Pending
- 2012-03-28 WO PCT/JP2012/058156 patent/WO2013145161A1/ja not_active Ceased
- 2012-03-28 DE DE201211006123 patent/DE112012006123T5/de active Pending
- 2012-03-28 KR KR1020147025959A patent/KR20140129197A/ko not_active Ceased
- 2012-03-28 JP JP2014507129A patent/JP5956560B2/ja active Active
- 2012-03-28 KR KR1020167030595A patent/KR20160130527A/ko not_active Ceased
- 2012-06-15 TW TW101121485A patent/TWI470680B/zh active
Patent Citations (4)
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Also Published As
| Publication number | Publication date |
|---|---|
| KR20190035964A (ko) | 2019-04-03 |
| KR20160130527A (ko) | 2016-11-11 |
| TW201340182A (zh) | 2013-10-01 |
| JPWO2013145161A1 (ja) | 2015-08-03 |
| DE112012006123T5 (de) | 2014-12-18 |
| US20150076422A1 (en) | 2015-03-19 |
| TWI470680B (zh) | 2015-01-21 |
| JP5956560B2 (ja) | 2016-07-27 |
| KR20140129197A (ko) | 2014-11-06 |
| CN104220375A (zh) | 2014-12-17 |
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