WO2013136959A1 - 露光描画装置及び露光描画方法 - Google Patents

露光描画装置及び露光描画方法 Download PDF

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Publication number
WO2013136959A1
WO2013136959A1 PCT/JP2013/054816 JP2013054816W WO2013136959A1 WO 2013136959 A1 WO2013136959 A1 WO 2013136959A1 JP 2013054816 W JP2013054816 W JP 2013054816W WO 2013136959 A1 WO2013136959 A1 WO 2013136959A1
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WIPO (PCT)
Prior art keywords
substrate
exposure
executed
exposure processing
exposed
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Application number
PCT/JP2013/054816
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English (en)
French (fr)
Japanese (ja)
Inventor
橋口　昭浩
Original Assignee
富士フイルム株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 富士フイルム株式会社 filed Critical 富士フイルム株式会社
Priority to CN201380013189.1A priority Critical patent/CN104169799B/zh
Priority to KR1020147025942A priority patent/KR102039373B1/ko
Publication of WO2013136959A1 publication Critical patent/WO2013136959A1/ja

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor

Definitions

  • the present invention relates to an exposure drawing apparatus and an exposure drawing method, and more particularly to an exposure drawing apparatus that draws a circuit pattern by exposing a substrate to be exposed with a light beam, a program executed by the exposure drawing apparatus, and a
  • the present invention relates to an exposure drawing method for drawing a circuit pattern by exposing a light beam to an exposure substrate.
  • the processing is performed. Since it cannot continue, an error is generated and the process is stopped.
  • the apparatus is an exposure drawing apparatus, it takes a certain amount of time to recover once the exposure process is stopped due to an error or the like. Therefore, the exposure process is continued until the end without stopping as much as possible. It is desirable.
  • Patent Document 1 registers a dummy job exposure process when the job set in advance is different, thereby stopping the line due to the occurrence of an error or 2
  • Patent Document 2 A technique for suppressing the occurrence of subsequent damage is disclosed.
  • the recipe that is the job registration data sent from the upstream is not in the recipe file
  • the dummy job is registered, the operator is notified that the dummy job has been registered, and waits for an event. enter.
  • the operator who is notified that the dummy job has been registered replaces the dummy job with a normal job, so that the exposure process continues normally and the exposure process is interrupted even when the job is executed. Can continue without.
  • Patent Document 1 it is necessary to replace a dummy job with a normal job after the dummy job is registered until the dummy job is executed. If the replacement cannot be made in time, the exposure process is interrupted. Even if the process can be continued, there is a problem in that useless exposure processing by a dummy job occurs.
  • the present invention has been made in view of the above problems, and an exposure drawing apparatus and program capable of suppressing an inadvertent line stop without performing unnecessary exposure processing as much as possible when a plurality of jobs are continuously performed.
  • An object of the present invention is to provide an exposure drawing method.
  • an exposure drawing apparatus includes a plurality of exposure processing requests in which substrate information indicating the type of a substrate to be exposed is set and an exposure process corresponding to the exposure information is requested. Based on the exposure processing execution means for sequentially executing each of the exposure processing on the substrate to be exposed, detection means for detecting the substrate information of the exposure target substrate to be exposed, and detected substrate information detected by the detection means And the detection substrate information of the substrate to be exposed next to be subjected to the exposure process based on the comparison result of the comparison means and the comparison result of the comparison means.
  • an ongoing exposure process request is continuously executed for the next exposure target substrate, and the detected substrate information is different from the currently executed substrate information and For exposure processing request If it is the same as the determined substrate information, an exposure processing request executed by the exposure processing execution means is made so that the execution of the next exposure processing request is started after finishing the exposure processing request being executed. Switching means for switching.
  • the substrate information indicating the type of the substrate to be exposed is set by the exposure processing execution unit, and the substrate to be exposed is based on a plurality of exposure processing requests that request exposure processing according to the exposure information. Each of the exposure processes is sequentially executed.
  • the detection unit detects the substrate information of the exposure target substrate
  • the comparison unit detects the detected substrate information detected by the detection unit and the exposure processing request being executed.
  • the set execution board information is compared.
  • the detection substrate information of the substrate to be exposed next to be subjected to exposure processing is the same as the in-execution substrate information based on the comparison result of the comparison unit
  • the exposure processing request being executed for the exposure target substrate to be subjected to the exposure processing is continuously executed, and the detected substrate information is different from the executing substrate information and is set to the next exposure processing request.
  • the exposure process request executed by the exposure process execution means is switched so that the currently executed exposure process request is terminated and the execution of the next exposure process request is started.
  • the exposure drawing apparatus when a plurality of exposure processing requests (jobs) are continuously performed, according to the substrate information of the substrate to be exposed next, If the substrate to be exposed is not the substrate used in the job being executed but the substrate to be used in the next job, unnecessary exposure is performed as a result of starting the next job and starting the next job. An inadvertent line stop can be suppressed without performing processing as much as possible.
  • each of the plurality of exposure processing requests is set with number information indicating the number of processed substrates
  • the switching means is the number of exposure processing executed by the exposure processing executing means.
  • the detection substrate of the substrate to be exposed next based on the comparison result of the comparison means If the information is the same as the in-execution substrate information, the exposure processing request being executed for the next exposure target substrate is continuously executed, and the detected substrate information is changed to the in-execution substrate information. If the substrate information is different and is the same as the substrate information set in the next exposure process request, the exposure process execution means is configured to end the currently executed exposure process request and start executing the next exposure process request. Exposure processing performed in It may be to switch the required. This makes it possible to determine whether or not to switch jobs at an appropriate timing.
  • an exposure drawing apparatus includes a plurality of exposure processes in which substrate information indicating a type of a substrate to be exposed is set and an exposure process corresponding to the exposure information is requested.
  • exposure processing execution means for sequentially performing each of the exposure processing on the substrate to be exposed, detection means for detecting the substrate information of the exposure target substrate, and detection detected by the detection means
  • Comparison means for comparing the substrate information with the switched substrate information set in the switched exposure processing request, and after switching so that the current exposure processing request is terminated and execution of the next exposure processing request is started Based on the comparison result of the comparing means, when the detected substrate information of the next exposure target substrate is the same as the switching substrate information, the next exposure target substrate is switched.
  • the exposure drawing apparatus when a plurality of exposure processing requests (jobs) are continuously performed, after the job is switched, the substrate to be exposed to be processed next is processed.
  • the substrate information if the substrate to be exposed is not the substrate to be used in the job after switching but the substrate to be used in the previous job, the job immediately before switching is continuously executed, which is unnecessary. An inadvertent line stop can be suppressed without performing as much exposure processing as possible.
  • each of the plurality of exposure processing requests is set with the number information indicating the number of processed substrates, and the switching unit terminates the currently executing exposure processing request and After switching so that the execution of the exposure process request is started, the number of exposure processes executed by the exposure process execution unit becomes a predetermined number determined according to the number of processes set in the exposure process request being executed.
  • the detected substrate information of the next exposure target substrate is the same as the switching substrate information based on the comparison result of the comparison means, the next exposure processing target target substrate
  • the exposure processing request after switching is executed and the detected substrate information is different from the switching substrate information and is the same as the substrate information set in the exposure processing request executed immediately before switching, the next exposure is performed.
  • the exposure processing request that was being executed immediately before the switching is continuously performed with respect to the exposure substrate, may be switched to the exposure processing request to be executed in the exposure process execution means. This makes it possible to determine whether or not to switch jobs at an appropriate timing.
  • one aspect of the present invention further includes reception means for receiving an input of the number of substrates to be exposed that allows switching of exposure processing requests, wherein the predetermined number is the number of processed sheets set for the exposure process being executed and It may be determined according to the number of sheets received by the receiving means. This makes it possible to determine whether or not to switch jobs according to the number of substrates to be exposed that allow switching of exposure processing requests.
  • one aspect of the present invention further includes a receiving unit that receives an input of the number of substrates to be exposed that allows switching of an exposure processing request, wherein the switching unit is an exposure processing request being executed by the exposure processing execution unit.
  • the comparison result of the comparison means is obtained when the number of exposure processing executed in the step is equal to or more than the number obtained by subtracting the number accepted by the accepting means from the processing number set for the exposure process being executed. If the detected substrate information of the substrate to be exposed next is the same as the switching substrate information, the exposure processing request after switching is executed for the substrate to be exposed next. If the detected substrate information is different from the switched substrate information and is the same as the substrate information set in the exposure processing request that was executed immediately before switching, the target to be subjected to the next exposure processing is set.
  • the present invention further includes a receiving unit that receives an input of the number of substrates to be exposed that allows switching of an exposure processing request, and the switching unit is executed in the exposure processing request being executed by the exposure processing execution unit.
  • the detected substrate information of the substrate to be exposed next is the same as the switching substrate information based on the comparison result of the comparing means when the number of exposure processing sheets is less than or equal to the number accepted by the accepting means.
  • the exposure processing request after switching is executed for the substrate to be exposed next, and the detected substrate information is different from the switching substrate information and is executed immediately before switching.
  • the exposure processing request that was executed immediately before switching is continuously executed for the next exposure target substrate to be exposed. It may be switched to the exposure processing request to be executed in the exposure process execution means. This makes it possible to determine whether or not to switch jobs according to the number of substrates to be exposed that allow switching of exposure processing requests.
  • the switching unit may further include an output unit that outputs predetermined information when the exposure processing request executed by the exposure processing execution processing unit is switched. . Thereby, it is possible to notify the operator that the job has been switched.
  • the substrate information is information including a size of the substrate and a position and a type of an alignment mark formed on the substrate
  • the detection unit is configured to detect an exposure target substrate to be exposed. At least one of the size, the position of the alignment mark formed on the substrate to be exposed, and the type of alignment mark formed on the substrate to be exposed may be detected as substrate information.
  • substrate can be detected easily.
  • the exposure target to be subjected to the next exposure processing target You may make it further provide the discharge means which discharges
  • the exposure target to be subjected to the next exposure processing target You may make it further provide the discharge means which discharges
  • the detection unit detects a size of the exposure target substrate when the next exposure target substrate is carried in, and is based on a comparison result of the comparison unit. If the detected substrate information is different from the in-execution substrate information and different from the substrate information set in the next exposure processing request, the exposed substrate to be subjected to the next exposure processing is left as it is without performing the exposure processing. You may make it further provide the discharge means discharged
  • the detection means detects the size of the exposure target substrate when the next exposure target substrate is carried in, and detects the size based on the comparison result of the comparison means.
  • the exposure substrate to be exposed next is not subjected to the exposure processing. You may make it further provide the discharge means which discharges to the apparatus exterior as it is. Thereby, it is possible to avoid performing unnecessary exposure processing when the exposure processing cannot be continued.
  • a program according to an aspect of the present invention causes a computer to function as a comparison unit and a switching unit in the exposure drawing apparatus.
  • the computer since the computer can be operated in the same manner as the exposure drawing apparatus, the computer operates in the same way as the exposure drawing apparatus.
  • an inadvertent line stop can be suppressed without performing unnecessary exposure processing as much as possible.
  • an exposure drawing method includes a plurality of exposure processes in which substrate information indicating the type of a substrate to be exposed is set and an exposure process corresponding to the exposure information is requested. Based on the request, an exposure process execution step for sequentially performing each of the exposure processes on the substrate to be exposed, a detection step for detecting the substrate information of the exposure target substrate to be exposed, and the detection detected in the detection step A comparison step for comparing the substrate information with the in-execution substrate information set in the exposure processing request being executed, and detection substrate information of the substrate to be exposed next to be exposed based on the comparison result of the comparison step If it is the same as the in-execution substrate information, the ongoing exposure processing request is continuously executed for the next exposure target substrate, and the detected substrate information is different from the in-execution substrate information. If the same substrate information is set in the next exposure processing request, the exposure processing execution step is performed so that the execution of the next exposure processing request is started after finishing the exposure processing request being executed
  • the exposure drawing method according to one aspect of the present invention operates in the same manner as the exposure drawing apparatus. Therefore, as in the exposure drawing apparatus, unnecessary exposure processing is performed as much as possible when a plurality of jobs are continuously performed. An inadvertent line stop can be suppressed without performing.
  • an exposure drawing method includes a plurality of exposure processes in which substrate information indicating a type of a substrate to be exposed is set and an exposure process corresponding to the exposure information is requested. Based on the request, an exposure process execution step for sequentially performing each of the exposure processes on the substrate to be exposed, a detection step for detecting the substrate information of the exposure target substrate to be exposed, and the detection detected in the detection step After the comparison step for comparing the substrate information with the switched substrate information set in the switched exposure processing request, and switching so that the execution of the next exposure processing request is started after finishing the current exposure processing request Based on the comparison result of the comparison step, if the detected substrate information of the next exposure target substrate is the same as the switching substrate information, the next exposure target target substrate When the exposure processing request after switching is executed and the detected substrate information is different from the switching substrate information and is the same as the substrate information set in the exposure processing request executed immediately before switching, the next exposure is performed.
  • the exposure drawing method according to one aspect of the present invention operates in the same manner as the exposure drawing apparatus. Therefore, as in the exposure drawing apparatus, unnecessary exposure processing is performed as much as possible when a plurality of jobs are continuously performed. An inadvertent line stop can be suppressed without performing.
  • an inadequate line stop can be suppressed without performing unnecessary exposure processing as much as possible.
  • (A) is a schematic diagram which shows an example of the execution job information in the exposure drawing system which concerns on embodiment
  • (B) is a schematic diagram which shows an example of the board
  • (A) And (B) is a conceptual diagram for demonstrating the 1st monitoring process in the exposure drawing system which concerns on 1st Embodiment.
  • (A) And (B) is a conceptual diagram for demonstrating the other example of the 1st monitoring process in the exposure drawing system which concerns on 1st Embodiment.
  • the exposure drawing system 1 is an example of a system that performs exposure drawing on one or both sides of a substrate to be exposed, using a flat substrate such as a printed wiring board and a glass substrate for a flat panel display as a substrate to be exposed. explain.
  • FIG. 1 is a configuration diagram showing the overall configuration of an exposure drawing system 1 according to the first embodiment.
  • an exposure drawing system 1 includes an exposure drawing apparatus 2 that draws an image such as a circuit pattern by exposing a substrate to be exposed (exposed substrate C to be described later) to a light beam, and an exposure drawing apparatus 2. Is provided with a control device 3 for controlling exposure drawing.
  • FIG. 2 is a perspective view showing an internal configuration of the exposure drawing apparatus 2 according to the first embodiment.
  • the direction in which the stage 10 moves is defined as the Y direction
  • the direction perpendicular to the Y direction in the horizontal plane is defined as the X direction
  • the direction orthogonal to the Y direction in the vertical plane is defined as the Z direction.
  • the rotation direction that rotates clockwise about the Z axis is defined as the ⁇ direction.
  • the exposure drawing apparatus 2 includes a flat plate stage 10 for fixing the substrate C to be exposed.
  • the stage 10 sucks air between the exposed substrate C and the stage 10 and causes the exposed substrate C to be vacuum-adsorbed on the upper surface.
  • the stage 10 is supported by a flat base 12 that is movably provided on the upper surface of a table-like base 11.
  • One or a plurality of (in this embodiment, two) guide rails 14 are provided on the upper surface of the base 11.
  • the base 12 is supported so as to be freely movable in the Y direction along the guide rail 14, and is moved by a stage drive unit (stage drive unit 41 described later) configured by a motor or the like.
  • stage drive unit 41 described later configured by a motor or the like.
  • the stage 10 is supported on the upper surface of the movable base 12 and moves along the guide rail 14 in conjunction with the movement of the base 12.
  • the substrate C to be exposed fixed to the stage 10 moves to an exposure position as the stage 10 moves, and an image such as a circuit pattern is drawn by being irradiated with a light beam by an exposure unit 16 described later.
  • a gate-type gate 15 is erected on the upper surface of the base 11 so as to straddle the guide rail 14.
  • the gate 15 exposes the surface of the substrate C to be exposed placed on the stage 10.
  • An exposure unit 16 is attached.
  • the exposure unit 16 includes a plurality (16 in the present embodiment) of exposure heads 16 a and is fixedly arranged on the moving path of the stage 10.
  • An optical fiber 18 drawn from a light source unit 17 described later and a signal cable 20 drawn from an image processing unit 19 described later are connected to the exposure unit 16.
  • Each exposure head 16 a has a digital micromirror device (DMD) as a reflective spatial light modulation element, and controls the DMD based on the image data input from the image processing unit 19 to emit light from the light source unit 17. Modulate the beam.
  • the exposure drawing apparatus 2 performs exposure drawing by irradiating the substrate C to be exposed with the modulated light beam.
  • a transmissive spatial light modulator such as liquid crystal may be used as the spatial light modulator.
  • a gate 22 is provided on the upper surface of the base 11 so as to straddle the guide rail 14.
  • the gate 22 includes one or a plurality (two in the present embodiment) of image capturing units 23 for photographing the alignment marks for exposure reference provided on the substrate C to be exposed placed on the stage 10. It is attached.
  • the photographing unit 23 is a CCD camera or the like having a built-in strobe with a very short light emission time. Each photographing unit 23 is installed to be movable in a direction (X direction) perpendicular to the moving direction (Y direction) of the stage 10 in a horizontal plane.
  • the exposure drawing apparatus 2 is an auto that transports the exposed substrate C carried from the outside to the first transport unit 5 to the upper surface of the stage 10 and transports the exposed substrate C exposed from the stage 10 to the second transport unit 6.
  • a carrier hand (hereinafter referred to as an AC hand) 24 is provided.
  • the AC hand 24 is formed in a flat plate shape and is movably provided in the horizontal direction and the vertical direction. Further, on the lower surface of the AC hand 24, a suction mechanism having a suction portion 25 that sucks and holds the substrate C to be exposed by vacuum suction by sucking air, and a vertically movable member that presses the substrate C to be exposed downward are freely movable.
  • a pressing mechanism having a pressing portion 26 is provided.
  • the AC hand 24 lifts the unexposed substrate C placed on the first transport unit 5 upward by sucking and holding it by a suction mechanism, and the lifted exposed substrate C is predetermined on the upper surface of the stage 10. Place it at a different position.
  • the AC hand 24 When the AC hand 24 places the exposed substrate C on the stage 10, the AC hand 24 releases the suction by the suction unit 25 while pressing the exposed substrate C against the stage 10 by a pressing mechanism, thereby bringing the exposed substrate C into the stage 10.
  • the substrate to be exposed C is sucked and fixed to the stage 10.
  • the AC hand 24 lifts the exposed substrate C, which has been exposed, placed on the upper surface of the stage 10 by suction and holds it by a suction mechanism, and holds the lifted exposed substrate C by suction.
  • the substrate C to be exposed is moved to the second transport unit 6 by moving to the transport unit 6 and then releasing the suction by the suction mechanism.
  • the exposed substrate C transported to the second transport unit 6 is discharged outside the exposure drawing apparatus 2.
  • the conveyor unit 5a includes a plurality of rotating rollers and a drive motor that rotates the rotating rollers. A plurality of rotating rollers are laid in parallel, and a sprocket or pulley that receives a rotational force transmitted by a belt or a wire is attached to one end of the rotating roller. As a means for transmitting the rotational force of the drive motor that rotates the rotating roller, a transmission method using a cylindrical magnet can be employed in addition to the belt or the wire.
  • the conveyor unit 5a is provided with a substrate size measuring unit 27 that measures the size of the substrate C to be exposed.
  • the substrate size measuring unit 27 includes a width measuring unit 27a that measures the width (short side) of the substrate C to be exposed and a length measuring unit 27b that measures the length (long side) of the substrate C to be exposed. Yes.
  • FIG. 3 is a schematic top view showing the installation position of the substrate size measuring unit 27 of the exposure drawing apparatus 2 according to the first embodiment.
  • the width measuring unit 27a is installed in the vicinity of the center where the exposed substrate C always passes through the upper surface of the conveyor unit 5a regardless of the size.
  • the width measuring unit 27a measures the transport time of the exposed substrate C when the exposed substrate C is transported on the conveyor unit 5a, and calculates the exposed substrate C from the product of the transport speed and the transport time of the exposed substrate C. The width of is derived.
  • a plurality (two in this embodiment) of length measuring units 27b are provided so as to be movable in the Y direction on the upper surface of the conveyor unit 5a.
  • the plurality of length measuring units 27b sandwich the exposed substrate C from both sides in the Y direction so that the exposed substrate C is in contact with the side surface of the exposed substrate C when the exposed substrate C is conveyed in the X direction. Then, the distance between each length measuring unit 27b is measured, and the length of the substrate C to be exposed is derived from the measured distance.
  • FIG. 4 is a block diagram showing the configuration of the electrical system of the exposure drawing apparatus 2 according to the first embodiment.
  • the exposure drawing apparatus 2 is provided with a system control unit 40 that is electrically connected to each part of the apparatus, and the system control unit 40 controls each part in an integrated manner.
  • the system control unit 40 controls the AC hand 24 to perform an operation for loading the substrate C to be exposed into the stage 10 and an operation for discharging it from the stage 10.
  • the system control unit 40 acquires information indicating the size (width and length) of the substrate to be exposed from the substrate size measurement unit 27.
  • the system control unit 40 controls the stage driving unit 41 to move the stage 10 and moves the imaging unit 23 via a movement control unit 43 described later to capture the alignment mark of the substrate C to be exposed.
  • the system control unit 40 starts the exposure process for the exposure target substrate C at the timing when the signal for instructing the start of exposure is received from the control device 3, and the timing at which the signal for instructing the stop of exposure is received.
  • the exposure process is stopped when the exposure process for the substrate C to be exposed is completed.
  • the exposure drawing apparatus 2 includes an operation device 42.
  • the operation device 42 includes a display unit that displays information under the control of the system control unit 40 and an input unit that inputs information through a user operation.
  • the input unit is operated by the user when inputting, for example, an instruction to forcibly stop exposure processing on the substrate C to be exposed.
  • the exposure drawing apparatus 2 includes a movement control unit 43. Based on an instruction from the system control unit 40, the movement control unit 43 causes the alignment mark of the substrate to be exposed C to pass through one of the plurality of imaging units 23 or the center of each imaging region when the stage 10 is moved. The moving drive of the photographing unit 23 is controlled.
  • FIG. 5 is a block diagram showing the configuration of the electrical system of the control device 3 of the exposure drawing system 1 according to the first embodiment.
  • the exposure drawing system 1 includes a control unit 50 that controls exposure processing in the exposure drawing system 1, an exposure processing program necessary for exposure processing by the control unit 50, and a ROM and HDD that store various data.
  • a communication interface 54 for transmitting / receiving data to / from the apparatus 2 is provided.
  • the exposure drawing apparatus 2 receives a batch exposure processing request (hereinafter, referred to as the following) from the control apparatus 3 for exposing and drawing the same image on a plurality of exposed substrates C of the same type under the same conditions.
  • a batch exposure processing request hereinafter, referred to as the following
  • exposure processing is performed on a plurality of exposed substrates C according to the contents of the received job.
  • the exposure drawing apparatus 2 receives a plurality of jobs from the control apparatus 3 in a state in which the execution order is designated, the exposure drawing apparatus 2 performs jobs for the plurality of exposed substrates C according to the designated job execution order. It has a function to perform exposure processing continuously every time.
  • the control apparatus 3 When the operator wants the exposure drawing apparatus 2 to continuously execute a plurality of jobs, the control apparatus 3 causes the control apparatus 3 to perform processing for each type of substrate C to be exposed, the number of processed substrates, the front image, and the back surface. An image, image magnification, etc. are input, and the execution order of each job is input.
  • the control device 3 performs job setting processing for setting each job so that a plurality of input jobs are performed in the input execution order.
  • FIG. 6 is a flowchart showing a processing flow of the job setting processing program according to the first embodiment, and the program is stored in advance in a predetermined area of a ROM which is a recording medium provided in the storage unit 51 of the control device 3. ing.
  • the control unit 50 of the control device 3 has a predetermined timing (in this embodiment, a timing when a predetermined operation for instructing job setting via the input unit 53 is performed by the operator). Execute the job setting processing program.
  • step S ⁇ b> 101 the control unit 50 determines whether a job creation instruction has been input via the input unit 53 by the operator.
  • the job creation instruction is input by a predetermined operation of the input unit 53. If no job creation instruction is input in step S101, the control unit 50 waits until a job creation instruction is input.
  • step S103 the control unit 50 accepts an input of the substrate type to the substrate C to be exposed in the job instructed in step S101.
  • Information regarding a plurality of substrate types may be stored in advance in the storage unit 51, and the user may input information on the substrate types by selecting one of the plurality of substrate types via the input unit 53.
  • the storage unit 51 stores the size (width, length, etc.) of the substrate and the position and type of the alignment mark (hereinafter also referred to as “position, etc.”) for each substrate type.
  • step S105 the control unit 50 receives an input of the number of processed substrates C in the job instructed to be created in step S101.
  • step S107 the control unit 50 exposes and draws a surface image on the first surface (hereinafter also referred to as a surface) that is the main surface of the substrate C to be exposed in the job instructed to create in step S101, and the first image.
  • a back surface image to be exposed and drawn on a second surface hereinafter also referred to as a back surface which is a main surface facing the surface C1 is received.
  • step S109 the control unit 50 receives an input of exposure conditions in the job instructed to create in step S101.
  • the exposure condition input at this time is the magnification of the image to be exposed and drawn.
  • step S111 the control unit 50 receives an input of the execution order of the job instructed to create in step S101.
  • the execution order input at this time is information indicating the order in which exposure processing is performed.
  • step S113 the control unit 50 creates the job instructed to be created in step S101 based on the information input in steps S103 to S111, and stores information on the created job in the storage unit 51.
  • FIG. 7A is a schematic diagram showing an example of execution job information 60 in the exposure drawing system according to the first embodiment
  • FIG. 7B is substrate type information in the exposure drawing system according to the first embodiment.
  • the control device 3 stores information relating to a series of jobs to be continuously executed in the storage unit 51 as execution job information 60.
  • the execution job information 60 includes, for each job, job order information 61 indicating job execution order, job identification information 62 for identifying the job, and an exposed substrate in the job.
  • Process number information 63 indicating the number of processed sheets of C
  • front surface image information 64 indicating an image to be exposed and drawn on the surface of the exposed substrate C in the job
  • back surface image information 65 indicating an image to be exposed and drawn on the back surface of the exposed substrate C
  • the magnification information 66 indicating the magnification of the image to be exposed and drawn on the substrate C to be exposed
  • the substrate identification information 67 indicating the type of the substrate C to be exposed, and the like are associated with each other.
  • the execution job information 60 appropriately stores information indicating the exposure pitch of other images, information indicating materials used, and the like for each job. Based on the execution job information 60, the control device 3 continuously executes jobs for a plurality of exposed substrates C in accordance with a predetermined execution order (the order described in the job order information 61). The exposure process is performed while switching.
  • the storage unit 51 stores in advance substrate type information 70 indicating the characteristics of the substrate for each substrate type.
  • the substrate type information 70 includes size information 72 indicating the width, length and thickness of the substrate, the size information 72 indicating the size of the substrate, and the substrate identification information 67 indicating the substrate type.
  • the mark information 73 indicating the position and type (for example, shape and size) of the alignment mark formed in advance is information associated with each other.
  • the control unit 50 can specify the substrate type of the substrate C to be exposed from the size of the substrate C to be exposed or the position of the alignment mark on the substrate C to be exposed.
  • step S115 the control unit 50 determines whether to continue input, that is, whether to create a next job. At this time, for example, when an operation for creating a next job is performed via the input unit 53, the control unit 50 determines to create the next job.
  • step S115 the control unit 50 performs the processing of steps S101 to S115 for the next job, while if it is determined in step S115 that the next job is not to be created, In step S117, the control unit 50 executes an exposure process based on the execution job information 60. Note that the control unit 50 may execute the exposure process when an operator inputs an exposure process execution instruction via the input unit 53 without executing the exposure process in step S117. .
  • FIG. 8 is a conceptual diagram for explaining exposure drawing processing in the exposure drawing system 1 according to the first embodiment.
  • a plurality of jobs are continuously executed based on the execution order according to the execution job information 60.
  • jobs are executed in the execution order of job A (10 processed sheets), job B (15 processed sheets), and job C (20 processed sheets). Executed.
  • the number of processed sheets set in the execution job information 60 is compared with the number of exposed substrates C that are actually subjected to exposure processing, and the job being executed is compared.
  • job switching the job being executed is terminated, and execution of the next job is started.
  • the operator confirms the type and the number of processed substrates C in each of the plurality of jobs according to the execution order set in the execution job information 60, and waits for the exposed substrate C to be exposed.
  • the exposure drawing apparatus 2 sequentially acquires the exposed substrate C arranged at the substrate standby position, and performs the exposure process according to the contents described in the execution job information 60.
  • step S119 the control unit 50 monitors whether or not the executed job is executed as set in the execution job information 60 when a plurality of jobs are executed in step S117.
  • the operator places the exposed substrate C to be exposed with reference to the execution job information 60 at a position for manually loading the exposure drawing apparatus 2 while confirming the type and number of sheets. It is conceivable that the number of substrates C to be exposed is mistakenly arranged due to carelessness of a person. In this case, in the conventional exposure drawing apparatus, an error occurs and the exposure process stops.
  • the control device 3 determines the exposure target based on the size of the substrate C to be exposed and the position of the alignment mark of the substrate C to be obtained, which are obtained immediately before exposure.
  • a first exposure monitor that monitors whether the job being executed matches the set job by comparing the substrate type of the substrate C to be exposed with the substrate type of the set job. Processing and second exposure monitoring processing are performed.
  • FIG. 9 is a flowchart showing the flow of processing of the first exposure monitoring processing program according to the first embodiment. This program is stored in advance in a predetermined area of a ROM, which is a recording medium provided in the storage unit 51 of the control device 3. It is remembered.
  • the control unit 50 of the control device 3 executes the exposure monitoring processing program at a predetermined timing (in this embodiment, the timing when the exposure processing by the exposure drawing device 2 is started in step S119 or the like).
  • k sheets immediately before job switching (k sheets from N ⁇ k + 1 to N sheets in a job with N processing sheets) and k sheets immediately after job switching (number of processed sheets).
  • N jobs it is determined whether or not it is the timing for job switching for k sheets from the first sheet to the kth sheet.
  • the value of k is a value smaller than N (for example, k is 2 or 3 when N is 10), and is input in advance by the operator via the input 53 and stored in the storage unit 51.
  • step S201 the control unit 50 determines that the total number of processed jobs currently being executed is N. It is determined whether the exposed substrate C is Nk + 1 or more in the job currently being executed.
  • step S201 If it is determined in step S201 that the number is N ⁇ k + 1 or more, the control unit 50 acquires the measured size of the substrate C to be processed next in step S203. At this time, the control unit 50 detects the substrate C to be exposed measured by the substrate size measuring unit 27 of the exposure drawing apparatus 2 when the substrate C to be processed next is being transported by the first transport unit 5. Get information about the size of the.
  • step 205 the control unit 50 acquires the position of the alignment mark of the substrate C to be exposed next, and the like.
  • the system control unit 40 detects the alignment mark from the captured image in which the substrate C to be processed next is imaged by the imaging unit 23 and generates information indicating the position of the detected alignment mark. .
  • the control unit 50 acquires the information indicating the position and the like of the alignment mark from the system control unit 40.
  • step S207 the control unit 50 stores the size of the exposed substrate C acquired in step S203, the position of the alignment mark of the exposed substrate acquired in step S205, and the like for each substrate type stored in the storage unit 51 in advance.
  • the substrate type of the substrate C to be exposed to be processed is determined by comparing the size and the position of the alignment mark.
  • step S209 the control unit 50 compares the substrate type of the exposed substrate C to be processed next determined in step S207 with the substrate type set in the job being executed, thereby obtaining the substrate type. Is determined to be suitable for the job set in the execution job information 60. At this time, if the substrate type of the substrate C to be processed next matches the substrate type set in the job being executed, the control unit 50 determines that the job is being executed. To do.
  • step S211 the control unit 50 continues the exposure process with the job being executed as it is.
  • step S209 If it is determined in step S209 that the job is not compatible with the job being executed, in step S213, the control unit 50 determines the substrate type of the substrate C to be processed next determined in step S207 and the execution type. By comparing the board type set in the next job of the middle job, it is determined whether or not the board type is suitable for the next job.
  • step S215 the control unit 50 determines that the number of exposed substrates C for the job being executed is insufficient, The current job is advanced by one, and the next job is switched so that the next job of the current job is executed for the substrate C to be exposed next.
  • FIG. 10A and 10B are conceptual diagrams for explaining the first monitoring process in the exposure drawing system 1 according to the first embodiment.
  • FIG. 10 shows a case where k is set to 1 or more.
  • the control unit 50 shifts the timing of switching from job A to job B one sheet ahead, and the Nth substrate of job A is covered. Assuming that the exposure substrate C is the first substrate C to be exposed in job B, at this point, job A is completed and job B is started.
  • FIGS. 11A and 11B are conceptual diagrams for explaining another example of the first monitoring process in the exposure drawing system 1 according to the first embodiment.
  • the control unit 50 shifts the timing of switching from job A to job B by three sheets before, The N-2th exposed substrate C is set as the first exposed substrate C of job B, and at this point, job A is terminated and job B is started.
  • step S217 the control unit 50 outputs that the job has proceeded because the number of substrates C to be exposed for job A is small, and in step S211, the exposure processing is continued with the next job.
  • the method for outputting the message may be a method for displaying the message on the display unit 52 or a method for outputting the message by voice.
  • step S219 the control unit 50 determines that the exposure process cannot be continued, and discharges the exposed substrate C to the outside of the exposure drawing apparatus 2. .
  • the job executed according to the size of the substrate C to be exposed matches the set job. If they are different, it is further determined whether the job being executed and the next job of the set job match. By switching the target job to the job next to the set job and continuing the execution, an inadvertent line stop can be suppressed without performing unnecessary exposure processing as much as possible.
  • FIG. 12 is a flowchart showing the flow of processing of the second exposure monitoring processing program according to the first embodiment.
  • the program is stored in advance in a predetermined area of a ROM, which is a recording medium provided in the storage unit 51 of the control device 3. It is remembered.
  • the control unit 50 of the control device 3 executes the exposure monitoring processing program at a predetermined timing (in this embodiment, the timing when the exposure processing by the exposure drawing device 2 is started in step S119 or the like).
  • step S301 when the total number of processed jobs currently being executed is N, the control unit 50 sets the next processing target. It is determined whether or not the exposed substrate C is the kth or less in the job currently being executed.
  • step S303 the control unit 50 acquires the size of the substrate C to be processed next in the same manner as in step S203.
  • the control unit 50 acquires the position of the alignment mark of the substrate C to be processed next, etc., using the same method as in step S205.
  • step S307 the control unit 50 stores the size of the exposed substrate C acquired in step S303 and the position of the alignment mark of the exposed substrate C acquired in step S305 in the storage unit 51 in advance.
  • the substrate type of the substrate to be exposed C to be processed next is determined by comparing each size, the position of the alignment mark, and the like.
  • step S309 the control unit 50 uses the same method as the process in step S209, and the substrate type of the exposure target substrate C to be processed next determined in step S307 and the substrate set in the job after switching. By comparing the type, it is determined whether or not the board type is suitable for the job after switching.
  • step S319 If it is determined in step S309 that the job is suitable for the job after switching, in step S311, the control unit 50 continues the exposure process with the job after switching.
  • step S313 the control unit 50 switches the substrate type of the exposed substrate C to be processed next determined in step S307, and the switching type. By comparing the substrate type set in the job immediately before the subsequent job, it is determined whether or not the substrate type is suitable for the previous job.
  • step S315 the control unit 50 determines that the number of exposed substrates C of the job before the job after switching is large, Even when the job switching timing is reached, without switching the job, the current job is returned to one, and the job immediately before the switched job is set.
  • FIGS. 13A and 13B are conceptual diagrams for explaining the second monitoring process in the exposure drawing system 1 according to the first embodiment.
  • FIG. 13 shows a case where k is set to 1 or more.
  • the control unit 50 shifts the timing of switching from the job A to the job B by one sheet, and moves the first exposed substrate C of the job B to the job A.
  • the job B is not started at this point and is switched to the job A and executed.
  • step S317 the control unit 50 outputs that the job has been returned (not advanced) because the number of substrates C to be exposed in job A is large, and in step S311, the exposure processing is continued in the previous job.
  • the method for outputting the message may be a method for displaying the message on the display unit 52 or a method for outputting the message by voice.
  • step S319 the control unit 50 determines that the exposure process cannot be continued, and discharges the exposed substrate C to the outside of the exposure drawing apparatus 2. .
  • the job when a plurality of jobs are continuously performed, the job is set as a job that is executed depending on the size of the substrate C to be exposed and the position of the alignment mark. If they are different, and if they are different, it is further determined whether the job being executed and the next job of the set job match. In such a case, by switching the execution target job to the job next to the set job and continuing the execution, an inadvertent line stop can be suppressed without performing unnecessary exposure processing as much as possible.
  • the exposure drawing system 1 when a plurality of jobs are continuously performed, a job that is executed according to the size of the substrate C to be exposed, the position of the alignment mark, and the like are set. If they are different, it is determined whether the job being executed and the job before the set job match. By switching the execution target job to a job before the set job and continuing the execution, an inadvertent line stop can be suppressed without performing unnecessary exposure processing as much as possible.
  • the timing for monitoring a job is from k sheets immediately before the job switching is scheduled to k sheets immediately after the job switching is performed.
  • step S207 in step S307), the size of the exposed substrate C acquired in step S203 (S303), the position of the alignment mark acquired in step S205 (S305), and the like. Therefore, even if the size of the exposed substrate C is the same between continuously executed jobs, the job can be accurately determined. Job switching can be performed accurately.
  • information related to a job is input.
  • the present invention is not limited to this, and the operator inputs the execution job information stored in advance in the storage unit 51 via the input unit 53.
  • a job to be executed may be set.
  • step S207 the size of the exposed substrate C acquired in step S203 (S303), the position of the alignment mark acquired in step S205 (S305), and the like.
  • the present invention is not limited to this.
  • step S207 (S307) the size of the substrate C to be exposed, the position of the alignment mark formed on the substrate C to be exposed, and the substrate C to be exposed.
  • the substrate type may be determined using at least one of the types of alignment marks formed on the substrate.
  • the exposure drawing system 1 according to the second embodiment will be described in detail with reference to the accompanying drawings. Since the exposure / drawing system 1 according to the second embodiment has the configuration shown in FIGS. 1 to 5 like the exposure / drawing system 1 according to the first embodiment, overlapping description of the configuration is given. Omitted.
  • the substrate type of the substrate C to be exposed is estimated based on the size of the substrate C to be exposed, the position of the alignment mark, and the like.
  • the estimated substrate type is different from the substrate type set for the job, it is determined that the job is different.
  • the exposure drawing system 1 according to the second embodiment If the size of the exposed substrate C is assumed to be the substrate type of the exposed substrate C, and the estimated substrate type is different from the substrate type set in the job, it is determined that the job is different. It is.
  • a plurality of jobs are continuously executed according to the execution job information 60 of the first embodiment, and the job being executed at that time is different from the set job.
  • a third exposure monitoring process is performed to monitor whether or not there is any.
  • FIG. 14 is a flowchart showing the flow of processing of the third exposure monitoring processing program according to the second embodiment. This program is stored in advance in a predetermined area of a ROM, which is a recording medium provided in the storage unit 51 of the control device 3. It is remembered.
  • the control unit 50 of the control device 3 executes the exposure monitoring processing program at a predetermined timing (in this embodiment, the timing when the exposure processing by the exposure drawing device 2 is started in step S119 or the like).
  • k sheets immediately before job switching (k sheets from N ⁇ k + 1 to N sheets in a job with N processing sheets) and k sheets immediately after job switching (number of processed sheets).
  • N jobs it is determined whether or not it is the timing for job switching for k sheets from the first sheet to the kth sheet.
  • the value of k is a value smaller than N, which is input in advance by the operator via the input 53 and stored in the storage unit 51.
  • step S401 in a state where the exposure process is being executed in step S117, the control unit 50 determines that the total number of processed jobs currently being executed is N, and sets the next processing target. It is determined whether the exposed substrate C is Nk + 1 or more in the job currently being executed.
  • step S403 the control unit 50 sets the size of the substrate C to be processed next in the same manner as the process in step S201. get.
  • step S405 the control unit 50 compares the size of the substrate C to be exposed acquired in step S403 with the size of each substrate type stored in advance in the storage unit 51, thereby exposing the object to be processed next.
  • the board type of the board C is determined.
  • step 407 the control unit 50 uses the same method as that in step S205 to align the substrate C to be processed next. Get the mark position and so on.
  • step S409 the control unit 50 compares the position or the like of the alignment mark of the substrate to be exposed acquired in step S407 with the position or the like of the alignment mark stored in advance in the storage unit 51. Judge whether it conforms.
  • step S409 If it is determined in step S409 that it is suitable for the job being executed, in step S411, the control unit 50 continues the exposure process for the job being executed.
  • step S409 If it is determined in step S409 that the job is not compatible with the job being executed, in step S413, the control unit 50 determines the substrate type of the exposure target substrate C to be processed next determined in step S409, and the execution. By comparing the board type set in the next job of the middle job, it is determined whether or not the board type is suitable for the next job.
  • step S415 the control unit 50 determines that the number of exposed substrates C for the job being executed is insufficient, The current job is advanced by one, and the next job of the job being executed is switched to the next target substrate C to be processed.
  • step S417 the control unit 50 outputs that the job has proceeded because the number of substrates C to be exposed for job A is small, and in step S411, the exposure processing is continued with the next job.
  • the method for outputting the message may be a method for displaying the message on the display unit 52 or a method for outputting the message by voice.
  • step S419 the control unit 50 determines the size of the substrate C to be processed next determined in step S409, It is determined whether or not the board type is suitable for the next job by comparing the size of the board set in the next job of the job being executed.
  • step S421 the control unit 50 uses the same method as that in step S205 to align the alignment mark of the substrate C to be processed next. Get the position etc.
  • step S ⁇ b> 421 the control unit 50 compares the position of the alignment mark on the substrate C to be exposed acquired in step S ⁇ b> 419 with the position of the alignment mark stored in the storage unit 51 in advance, thereby executing the job being executed. It is determined whether or not the job matches the next job. If it is determined in step S423 that the job matches the next job, the process proceeds to step S415.
  • step S425 the control unit 50 determines that the exposure process cannot be continued, and exposes the substrate C to be processed next as an exposure drawing. Discharge to the outside of the device 2.
  • the job executed and the set job differ depending on the size of the exposure substrate C when the exposure substrate C has been transported.
  • the exposure process is not performed (the target The exposed substrate C can be quickly discharged out of the exposure drawing apparatus 2 (without placing the exposed substrate C on the stage 10).
  • the image data switching start timing can be advanced.
  • the data volume of the image data of the exposure target image is large, it takes a certain time to switch the image data, but the waiting time for switching the image data can be shortened.
  • the present invention is not limited to this, and it may be determined immediately after job switching whether the substrate type is compatible with the previous job (corresponding to the second exposure monitoring process).
  • step S401 it is determined whether or not the current number of processed sheets is N or less in the N number of processed jobs.
  • step S409 it is determined whether or not the job is suitable for the switched job.
  • step S415 the job after switching is returned to one, and the previous job is set.
  • step S417 the fact that the job has been returned is output.
  • the exposure target to be exposed next to the exposure target substrate C while the exposure target substrate C is being exposed may be performed on the exposure substrate C.
  • it is possible to make a judgment on job switching in advance before starting the exposure process.
  • SYMBOLS 1 Exposure drawing system, 2 ... Exposure drawing apparatus, 3 ... Control apparatus, 5 ... 1st conveyance part, 5a ... Conveyor part, 6 ... 2nd conveyance part, 10 ... Stage, 11 ... Base
  • DESCRIPTION OF SYMBOLS 43 Movement drive part, 50 ... Control part, 51 ... Memory

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
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CN104169799B (zh) 2016-06-29

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