WO2013136945A1 - 硬化性樹脂組成物 - Google Patents
硬化性樹脂組成物 Download PDFInfo
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- WO2013136945A1 WO2013136945A1 PCT/JP2013/054511 JP2013054511W WO2013136945A1 WO 2013136945 A1 WO2013136945 A1 WO 2013136945A1 JP 2013054511 W JP2013054511 W JP 2013054511W WO 2013136945 A1 WO2013136945 A1 WO 2013136945A1
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- curable resin
- resin composition
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- diene
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08C—TREATMENT OR CHEMICAL MODIFICATION OF RUBBERS
- C08C19/00—Chemical modification of rubber
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/04—Polymers provided for in subclasses C08C or C08F
- C08F290/048—Polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00
Definitions
- the present invention relates to a curable resin composition.
- the capacitive touch panel has a structure in which a transparent electrode is formed on a transparent substrate and a transparent plate is bonded thereon.
- Patent Document 1 describes (A) a (meth) acrylate oligomer having a polyisoprene, polybutadiene or polyurethane as a skeleton, (B) a softening component, and (C1) phenoxyethyl (meth) acrylate, phenoxypolyethylene glycol (meth) acrylate, (Meth) selected from 2-hydroxy-3-phenoxypropyl (meth) acrylate, cyclohexyl (meth) acrylate, nonylphenol EO adduct (meth) acrylate, methoxytriethylene glycol (meth) acrylate and tetrahydrofurfuryl (meth) acrylate
- Patent Document 1 describes (A) a (meth) acrylate oligomer having a polyisoprene, polybutadiene or polyurethane as a skeleton, (B) a softening component, and (C1) phenoxyethyl (meth)
- Patent Document 3 is a highly elastic resin based on a rigid skeleton monomer such as isobornyl (meth) acrylate.
- the degree to which the adherend can be deformed in a heated atmosphere assuming the usage environment It is desirable to have the flexibility.
- the prior art described in the above literature has room for improvement in the following points.
- the photocurable resin composition described in Patent Literature 1 has insufficient adhesion durability or adhesive strength when the bonded surface has a printing process.
- the UV curable resin of Patent Document 3 cannot withstand the expansion and contraction of the adherend in the high temperature reliability test, and may peel off.
- the present invention has been made in view of the above circumstances. For example, when a decorative plate and an icon sheet used for a display body such as a touch panel are bonded together, when a transparent substrate and a transparent substrate are bonded together, printing is performed.
- the problem of the prior art that it is difficult to give sufficient adhesion durability when bonding parts together, or when the display body and optical functional material are bonded together, the adhesive surface may peel off, or the glass of the display body
- An object of the present invention is to provide a curable resin composition that solves the problem of the prior art that cracks occur.
- a curable resin composition containing the following components (A) to (D).
- this curable resin composition which contains a silane coupling agent as (E) component further to the said curable resin composition is provided.
- this curable resin composition which contains a polymerization inhibitor as a (F) component further to the said curable resin composition is provided.
- the diene-based or hydrogenated diene-based skeleton of the component (A) and / or the component (B) is polybutadiene, polyisoprene, a hydrogenated polybutadiene, and a hydrogenated polyisoprene.
- the above-mentioned curable resin composition which is one or more skeletons selected from the group consisting of products is provided.
- the above curable resin composition wherein the molecular weight of the oligomer having a diene-based or hydrogenated diene-based skeleton of the component (A) and / or the component (B) is 500 to 70000.
- the adhesive composition which consists of said curable resin composition is provided.
- the hardening body of said adhesive composition is provided.
- covered or joined with the said hardening body is provided.
- a composite in which the adherend is one or more selected from the group consisting of triacetylcellulose, fluorine-based polymer, polyester, polycarbonate, polyolefin, glass, and metal.
- the touch-panel laminated body which bonded together the to-be-adhered body with said adhesive composition is provided.
- the liquid crystal panel laminated body which bonded together the to-be-adhered body with said adhesive composition is provided.
- the display using said touch panel laminated body is provided.
- the display using said liquid crystal panel laminated body is provided.
- the curable resin composition of the present invention is excellent in adhesion durability or adhesion when there is a printing process on the bonded surface.
- a to B mean A to B.
- the component (A) that can be used in the present embodiment is an oligomer having a (meth) acryloyl group and having a diene-based or hydrogenated diene-based skeleton.
- the main chain skeleton of the oligomer in this embodiment is a diene-based or hydrogenated diene-based skeleton.
- the diene-based or hydrogenated diene-based skeleton is preferably at least one skeleton selected from the group consisting of polybutadiene, polyisoprene, a hydrogenated polybutadiene, and a hydrogenated polyisoprene.
- at least one selected from the group consisting of polybutadiene and polyisoprene is preferable, and polyisoprene is more preferable in terms of high adhesion durability.
- the oligomer preferably has one or more (meth) acryloyl groups at the terminal or side chain of the main chain skeleton. Among these, those having (meth) acryloyl groups at both ends of the main chain skeleton are preferable.
- the molecular weight of the oligomer is preferably 500 to 70000, more preferably 1000 to 60000, and most preferably 1000 to 55000. If the molecular weight is within this range, the hardness of the cured product obtained by curing the curable resin composition of the present embodiment is high, so that it is easy to form an adhesive layer, while the curable resin composition obtained is Since the viscosity is small, the workability in mixing during the production process and the workability in practical applications are improved.
- the molecular weight is, for example, any of 500, 1000, 2000, 3000, 4000, 5000, 7000, 10000, 15000, 20000, 25000, 30000, 35000, 40000, 45000, 50000, 55000, 60000, 65000, 70000 It may be within a range of two values.
- the molecular weight of the oligomer refers to the number average molecular weight calculated as the average molecular weight per molecule.
- the polystyrene-equivalent number average molecular weight measured by GPC gel permeation chromatography
- the oligomer of component (A) is an esterified oligomer of maleic anhydride adduct of isoprene polymer and 2-hydroxyethyl (meth) acrylate (see the following formula (1) for the structure, “UC-203” manufactured by Kuraray Co., Ltd.) Etc.), Nippon Soda Co., Ltd. “TEAI-1000” (terminal acrylic modified hydrogenated 1,2-polybutadiene oligomer), Nippon Soda Co., Ltd. “TE-2000” (terminal acrylic modified 1,2-polybutadiene oligomer), etc. Can be mentioned.
- an esterified oligomer of a maleic anhydride adduct of isoprene polymer and 2-hydroxyethyl (meth) acrylate is preferable.
- Component (B) The component (B) that can be used in the present embodiment is an oligomer having no (meth) acryloyl group and having a diene-based or hydrogenated diene-based skeleton.
- the main chain skeleton of the oligomer in this embodiment is a diene-based or hydrogenated diene-based skeleton.
- the diene-based or hydrogenated diene-based skeleton is preferably at least one skeleton selected from the group consisting of polybutadiene, polyisoprene, a hydrogenated polybutadiene, and a hydrogenated polyisoprene.
- at least one selected from the group consisting of polybutadiene and polyisoprene is preferable, and polybutadiene is more preferable in terms of high adhesion durability.
- the oligomer preferably has one or more (meth) acryloyl groups at the terminal or side chain of the main chain skeleton. Among these, those having (meth) acryloyl groups at both ends of the main chain skeleton are preferable.
- the molecular weight of the oligomer is preferably 500 to 70000, more preferably 1000 to 60000, and most preferably 1000 to 55000. If the molecular weight is within this range, the hardness of the cured product obtained by curing the curable resin composition of the present embodiment is high, so that it is easy to form an adhesive layer, while the curable resin composition obtained is Since the viscosity is small, the workability in mixing during the production process and the workability in practical applications are improved.
- the molecular weight is, for example, any of 500, 1000, 2000, 3000, 4000, 5000, 7000, 10000, 15000, 20000, 25000, 30000, 35000, 40000, 45000, 50000, 55000, 60000, 65000, 70000 It may be within a range of two values.
- the molecular weight of the oligomer refers to the number average molecular weight calculated as the average molecular weight per molecule.
- the polystyrene-equivalent number average molecular weight measured by GPC gel permeation chromatography
- oligomer of component (B) As the oligomer of component (B), “LIR-50” (isoprene oligomer) manufactured by Kuraray Co., Ltd., “LBR-307” “LBR-50” (butadiene oligomer) manufactured by Kuraray Co., Ltd., “Byron” manufactured by Toyobo Co., Ltd. Polyester resin) and the like.
- isoprene oligomers 1,2-polybutadiene oligomers and 1,4-polybutadiene oligomers are preferable, 1,2-polybutadiene oligomers and 1,4-polybutadiene oligomers are more preferable, 1,4-polybutadiene oligomer is most preferred.
- (C) component (C) component which can be used by this embodiment is (meth) acrylate which has an aromatic ring.
- (meth) acrylate having an aromatic ring include nonylphenoxypolyethylene glycol (meth) acrylate, benzyl (meth) acrylate, ethoxylated phenyl (meth) acrylate, neopentyl glycol benzoate (meth) acrylate, ECH (ECH is epichloro) Abbreviation of hydrin) modified phenoxy (meth) acrylate, phenoxydiethylene glycol (meth) acrylate, phenoxyhexaethylene glycol (meth) acrylate, phenoxytetraethylene glycol (meth) acrylate, 2-hydroxy-3-phenoxypropyl (meth) acrylate, etc.
- (meth) acrylates can be used alone or in combination of two or more.
- the (meth) acrylate which has a phenoxy group is preferable.
- the phenoxy group preferably has a structure represented by the following formula (2).
- R represents an arbitrary substituent. Examples of R include hydrogen, an alkyl group, and a hydroxyl group.
- R an alkyl group is preferable.
- the alkyl group is preferably an alkyl group having 1 to 20 carbon atoms, and more preferably an alkyl group having 6 to 12 carbon atoms.
- (meth) acrylates having a phenoxy group (meth) acrylate and / or phenoxyethyl (meth) acrylate having a nonylphenoxy group are preferable, and (meth) acrylate having a nonylphenoxy group is more preferable.
- the (meth) acrylates having a nonylphenoxy group nonylphenoxypolyalkylene glycol (meth) acrylate is preferable, and nonylphenoxypolyethylene glycol (meth) acrylate and / or nonylphenoxypolypropylene glycol (meth) acrylate is preferable.
- the number of aromatic rings is, for example, 1, 2, or 3, and preferably one.
- (D) component (D) component is a photoinitiator (henceforth a photoinitiator).
- the photoinitiator is not particularly limited as long as it initiates polymerization of (meth) acrylate such as component (A), component (B), and component (C).
- Examples of the photoinitiator include an ultraviolet polymerization initiator and a visible light polymerization initiator, both of which are used without limitation.
- Examples of the ultraviolet polymerization initiator include benzoin, benzophenone, and acetophenone.
- Examples of visible light polymerization initiators include acylphosphine oxide, thioxanthone, metallocene, quinone, and ⁇ -aminoalkylphenone.
- Photoinitiators include benzophenone, 4-phenylbenzophenone, benzoylbenzoic acid, 2,2-diethoxyacetophenone, bisdiethylaminobenzophenone, benzyl, benzoin, benzoylisopropyl ether, benzyldimethyl ketal, 1-hydroxycyclohexyl phenyl ketone Thioxanthone, 2-methylthioxanthone, 2,4-dimethylthioxanthone, isopropylthioxanthone, 2,4-diethylthioxanthone, 2,4-diisopropylthioxanthone, 1- (4-isopropylphenyl) 2-hydroxy-2-methylpropane-1 -One, 1- (4- (2-hydroxyethoxy) -phenyl) -2-hydroxy-2-methyl-1-propan-1-one, 2-hydroxy-2-methyl-1- Enylpropan-1-one, camphorquinone, 2,4,6-
- the curable resin composition of the present embodiment includes (meth) acrylates other than the (A) component and (meth) acrylates other than the (C) component, particularly for the purpose of further improving the adhesion to each adherend. Can be contained.
- a silane coupling agent can be contained as (E) component for the purpose of improving the adhesive force to glass.
- Silane coupling agents include ⁇ -chloropropyltrimethoxysilane, vinyltrimethoxysilane, vinyltrichlorosilane, vinyltriethoxysilane, vinyl-tris ( ⁇ -methoxyethoxy) silane, ⁇ - (meth) acryloxypropyltrimethoxy.
- Silane ⁇ - (3,4-epoxycyclohexyl) ethyltrimethoxysilane, ⁇ -glycidoxypropyltrimethoxysilane, ⁇ -mercaptopropyltrimethoxysilane, ⁇ -aminopropyltriethoxysilane, N- ⁇ - (aminoethyl) ) - ⁇ -aminopropyltrimethoxysilane, N- ⁇ - (aminoethyl) - ⁇ -aminopropylmethyldimethoxysilane, ⁇ -ureidopropyltriethoxysilane, and the like.
- ⁇ -glycidoxypropyltrimethoxysilane and / or ⁇ - (meth) acryloxypropyltrimethoxysilane are preferable from the viewpoint of adhesion to glass or the like, and ⁇ - (meth) acryloxypropyltrimethoxysilane is preferable.
- Methoxysilane is more preferred.
- a polymerization inhibitor can be contained as a (F) component at the point of storage stability.
- the polymerization inhibitor include hindered phenols, bisphenols, and phosphoric acids. In these, a hindered phenol type is preferable.
- the hindered phenol antioxidants include butylhydroxytoluene (BHT), butylhydroxyanisole (BHA), 2,4-dimethyl-6-tert-butylphenol, n-octadecyl- ⁇ - (4′-hydroxy3 ′, 5'-di-t-butylphenyl) propionate, styrenated phenol, styrenated cresol, tocopherol, 2,2'-methylenebis (4-ethyl-6-t-butylphenol), 2,2'-methylenebis (4-methyl) -6-cyclohexylphenol), 2,2'-butylidene-bis (4-methyl-6-tert-butylphenol), 1,6-hexanediol bis [3- (3,5-di-tert-butyl- 4-hydroxyphenyl) propionate], 1,3,5-trimethyl-2,4,6-tris (3,5-di-t-butyl) -4-hydroxybenzyl)
- each component (A) to (D) are contained as essential components, so that they can be cured with light or ultraviolet rays.
- the usage-amount of a component exceeds 400 mass parts with respect to 100 mass parts of (A) component, and the adhesiveness with respect to the adherend of a curable resin composition becomes remarkably high, and it hardens
- the usage-amount of (B) component is 400, 401, 402, 403, 404, 405, 410, 420, 430, 440, 450, 500, 550, 600 with respect to 100 mass parts of (A) component. It may be within a range of any two values (the numerical values at both ends may or may not be included).
- Component (C) is used in an amount of more than 100 parts by weight, more than 100 parts by weight, preferably 450 parts by weight, more preferably 101 to 400 parts by weight, based on 100 parts by weight of component (A). Most preferred is ⁇ 350 parts by weight.
- the amount of component (C) used is 100, 101, 102, 103, 104, 105, 110, 120, 130, 140, 150, 200, 250, 300, 100 parts by weight of component (A). It may be within a range of any two values of 350, 400, and 450 (numerical values at both ends may or may not be included).
- the amount of the component (D) used is 0.01 to 20 parts by mass with respect to 100 parts by mass in total of the components (A), (B) and (C), and the curable resin composition Is preferable in that the adhesion to the adherend is particularly high, the curability is good, and the adhesion is excellent when there is a printing process on the bonding surface. It is more preferable to do.
- the usage-amount of (D) component is 0.01, 0.05, 0.1, 0.5 with respect to a total of 100 mass parts of (A) component, (B) component, and (C) component. It may be within a range of any two values of 1, 5, 10, 15, and 20 (numerical values at both ends may or may not be included).
- the amount of component (E) used is preferably 0.01 to 20 parts by weight, and 0.05 to 5 parts by weight, based on a total of 100 parts by weight of components (A), (B) and (C). More preferred.
- the usage-amount of (E) component is 0.01, 0.05, 0.1, 0.5 with respect to a total of 100 mass parts of (A) component, (B) component, and (C) component. It may be within a range of any two values of 1, 5, 10, 15, and 20 (numerical values at both ends may or may not be included).
- Component (F) is preferably used in an amount of 0.00001 to 3 parts by mass, and 0.001 to 2 parts by mass with respect to 100 parts by mass in total of components (A), (B) and (C). More preferred is 0.05 to 1 part by mass.
- the usage-amount of (F) component is 0.00001, 0.0001, 0.001, 0.01 with respect to a total of 100 mass parts of (A) component, (B) component, and (C) component. It may be within a range of any two values of 0.1, 1, 2, and 3 (numerical values at both ends may or may not be included).
- elastomers various paraffins, plasticizers, fillers, colorants, rust inhibitors and the like can be used as desired.
- the curable resin composition of the present embodiment can be used as an adhesive composition.
- a composite can be produced by bonding or covering an adherend with a cured body of the adhesive composition.
- the various materials of the adherend are preferably at least one selected from the group consisting of polyolefins such as cycloolefin polymers, triacetyl cellulose, fluoropolymers, polyesters such as polyethylene terephthalate, polycarbonates, glasses, metals, polyesters, polyolefins, One or more selected from the group consisting of glass is more preferable.
- the cured body bonded with the curable resin composition of the present embodiment can be reworked (reused) after being completely cured.
- the rework method is not particularly limited, but the adherends are disassembled by applying a load of 0.01 to 100 N between the one or two kinds of adherends bonded together, and the adherend after disassembly The body can be reused.
- the curable resin composition of the present embodiment can impart sufficient adhesion durability when the printed parts are bonded together.
- Examples of the printing method include a method of printing a printing ink mixed with a pigment and a binder on an adherend.
- the thickness of the printing surface is not particularly limited as long as light such as ultraviolet rays and visible light can pass through the printing surface and irradiate the curable resin composition to cure the curable resin composition.
- the thickness of the printing surface may be as thin as several ⁇ m in that light can pass through the printing surface.
- the following compounds were selected as the (A) component oligomer having a (meth) acryloyl group and a diene-based or hydrogenated diene-based skeleton.
- A-1 1,2-polybutadiene oligomer (“TE-2000” manufactured by Nippon Soda Co., Ltd.) (number average molecular weight 2000 in terms of polystyrene by GPC)
- A-2) isoprene oligomer (“UC-203” manufactured by Kuraray Co., Ltd.) (number average molecular weight of 36000 in terms of polystyrene by GPC, maleic anhydride adduct of isoprene polymer and 2-hydroxyethyl (esterified oligomer of methacrylate,
- Y is an ethylene group and R is a methyl group
- the following compounds were selected as oligomers having no (meth) acryloyl group and having a diene-based or hydrogenated diene
- (B-1) Isoprene oligomer (“LIR-30” manufactured by Kuraray Co., Ltd.) (Number average molecular weight 28000 in terms of polystyrene by GPC)
- the component (C) as the (meth) acrylate having a phenoxy group or a nonylphenoxy group, the following compounds were selected.
- a curable resin composition was applied to a surface of Tempax glass (width 25 mm ⁇ length 25 mm ⁇ thickness 2 mm) to a thickness of 0.1 mm. Thereafter, using a curing device manufactured by Fusion Corporation using an electrodeless discharge lamp, UV light having a wavelength of 365 nm was irradiated and cured under the condition of an integrated light quantity of 2000 mJ / cm 2 . Thereafter, the tensile shear bond strength was measured. A curable resin composition was prepared and applied. When the test piece was printed, it was printed by the following method. A black paint composed of carbon powder and a solvent was sprayed on the entire surface of the test piece to prepare a test piece having a printing surface with a thickness of several ⁇ m.
- PET Polyethylene terephthalate
- PAT adhesiveness evaluation (peel adhesion strength between polyethylene terephthalate test pieces)
- Biaxially stretched PET films Limirror T60, average thickness 190 ⁇ m, manufactured by Toray Industries, Inc.
- printed test pieces (width 50 mm ⁇ length 10 mm ⁇ thickness 0.19 mm) are bonded to each other with a curable resin composition as an adhesive.
- the bonded surface was bonded with a thickness of 30 ⁇ m and a bonding area of 40 mm in length and 10 mm in width in a state where printing was performed on the bonding surface.
- the peel adhesion strength was measured.
- the light irradiation conditions in photocuring followed the method described in [Photocuring].
- the peel adhesive strength (unit: N / cm) was measured using a tensile tester at a temperature of 23 ° C. and a humidity of 50% at a tensile speed of 50 mm / min.
- the tensile shear bond strength (unit: MPa) was measured using a tensile tester at a temperature of 23 ° C. and a humidity of 50% at a tensile speed of 10 mm / min.
- COP adhesion evaluation peel adhesion strength between cycloolefin polymer specimens
- COP films ZONOR, average thickness 40 ⁇ m, manufactured by Nippon Zeon Co., Ltd.
- printed test pieces width 50 mm ⁇ length 10 mm ⁇ thickness 0.04 mm
- curable resin compositions adhesive compositions. It was used for bonding with the adhesive layer having a thickness of 10 ⁇ m and a bonding area of 40 mm in length and 10 mm in width in a state where there was printing on the bonding surface.
- the initial 180 ° peel strength was measured by pulling the two film ends that were not in close contact with the test piece that was adhered with the adhesive composition, thereby peeling the portions where the films were in close contact with each other. .
- the light irradiation conditions in photocuring followed the method described in [Photocuring].
- the peel adhesive strength (unit: N / cm) was measured using a tensile tester at a temperature of 23 ° C. and a humidity of 50% at a tensile speed of 50 mm / min.
- Test pieces (width 50 mm ⁇ length 10 mm ⁇ thickness 0.04 mm) obtained by printing PVDF (Polyvinylidene fluoride) film (average thickness 40 ⁇ m, “DX film” manufactured by Denki Kagaku Kogyo Co., Ltd.) The product was used as an adhesive composition, and bonded with a bonding area having a thickness of 10 ⁇ m and a bonding area of 40 mm in length and 10 mm in width in a state where the bonded surface had a printing process.
- PVDF Polyvinylidene fluoride
- the initial 180 ° peel strength was measured by pulling the two film ends that were not in close contact with the test piece that was adhered with the adhesive composition, thereby peeling the portions where the films were in close contact with each other. .
- the light irradiation conditions in photocuring followed the method described in [Photocuring].
- the peel adhesive strength (unit: N / cm) was measured using a tensile tester at a temperature of 23 ° C. and a humidity of 50% at a tensile speed of 50 mm / min.
- an adhesive composition “G-55” manufactured by Denki Kagaku Kogyo Co., Ltd. was used on the Tempax test piece side, and a galvanized steel sheet (width 100 mm ⁇ length 25 mm ⁇ A thickness of 2.0 mm, manufactured by Engineering Test Service Co., Ltd.) was adhered.
- the galvanized steel sheet was chucked, and the initial tensile shear bond strength was measured.
- the tensile shear bond strength (unit: MPa) was measured using a tensile tester at a temperature of 23 ° C. and a humidity of 50% at a tensile speed of 10 mm / min.
- the appearance of the bonded part was visually observed to determine whether it was yellowed.
- the tensile shear bond strength (unit: MPa) was measured using a tensile tester at a temperature of 23 ° C. and a humidity of 50% at a tensile speed of 10 mm / min.
- Tempax glasses (width 25 mm x length 25 mm x thickness 2 mm) are bonded and cured using a curable resin composition as an adhesive composition with an adhesive layer thickness of 100 ⁇ m and an adhesive area of 1.0 mm 2. It was. The light irradiation conditions in photocuring followed the method described in [Photocuring]. After curing, the test piece adhered with the adhesive composition was converted into yellowing degree by a color measuring device (“UV-VISABLE SPECTROPOHOTOMETER” manufactured by SHIMADZU).
- the curable resin compositions corresponding to the examples of the present invention exhibit high adhesiveness, as well as good curing characteristics and wet heat resistance. Moreover, the curable resin composition corresponding to the Example of this invention can provide sufficient adhesion durability, when the printed part is bonded together. In particular, it exhibits high adhesion to triacetyl cellulose, fluoropolymer, polyester, polycarbonate, polyolefin, glass, and metal.
- the curable resin compositions corresponding to the examples show high adhesiveness, and therefore, when a thin glass LCD or other display body is bonded to an optical functional material such as an acrylic plate or a polycarbonate plate, the adhesive surface may be peeled off. , LCD will not break or LCD will not be uneven.
- the curable resin compositions corresponding to the examples have high heat and moisture resistance and can follow the deformation of the adherend in a heated atmosphere, so that the adherend is not peeled off. Note that the curable resin composition corresponding to the above-described example was tested for the case where the printed parts were bonded, but sufficient adhesiveness could be imparted even when the non-printed parts were bonded. Has been confirmed by experiments.
- the curable resin composition of the present invention can be used for an adhesive composition for a touch panel laminate or a liquid crystal panel laminate.
- the touch panel laminate and the liquid crystal panel laminate of the present invention can be used as a display.
- the curable resin composition of the present invention can improve curability even when a transparent part or a translucent part is bonded.
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Abstract
Description
例えば、特許文献1に記載の光硬化型樹脂組成物は、接着耐久性または貼り合わせ面に印刷加工がある場合の接着力が十分ではなかった。
(A)(メタ)アクリロイル基を有し、かつ、ジエン系又は水素添加されたジエン系の骨格を有するオリゴマー100質量部
(B)400質量部を超える、(メタ)アクリロイル基を有さず、かつ、ジエン系又は水素添加されたジエン系の骨格を有するオリゴマー
(C)100質量部を超える、芳香族環を有する(メタ)アクリレート
(D)光重合開始剤
本実施形態で用いることができる(A)成分は、(メタ)アクリロイル基を有し、かつ、ジエン系又は水素添加されたジエン系の骨格を有するオリゴマーである。
本実施形態で用いることができる(B)成分は、(メタ)アクリロイル基を有さず、かつ、ジエン系又は水素添加されたジエン系の骨格を有するオリゴマーである。
本実施形態では貯蔵安定性の点で、(F)成分として、重合禁止剤を含有することができる。重合禁止剤としては、ヒンダードフェノール系、ビスフェノール系、リン酸系等が挙げられる。これらの中では、ヒンダードフェノール系が好ましい。ヒンダードフェノール系酸化防止剤には、ブチルヒドロキシトルエン(BHT)、ブチルヒドロキシアニソール(BHA)、2,4-ジメチル-6-t-ブチルフェノール、n-オクタデシル-β-(4'-ヒドロキシ3',5'-ジ-t-ブチルフェニル)プロピオネート、スチレン化フェノール、スチレン化クレゾール、トコフェロール、2,2'-メチレンビス(4-エチル-6-t-ブチルフェノール)、2,2'-メチレンビス(4-メチル-6-シクロヘクシルフェノール)、2,2'-ブチリデン-ビス(4-メチル-6-t-ブチルフェノール)、1,6-ヘキサンジオールビス[3-(3,5-ジ-t-ブチル-4-ヒドロキシフェニル)プロピオネート]、1,3,5-トリメチル-2,4,6-トリス(3,5-ジ-t-ブチル-4-ヒドロキシベンジル)ベンゼン、テトラキス[メチレン-3-(3',5'-ジ-t-ブチル-4-ヒドロキシフェニル)プロピオネート]メタン、プロピルガレート、オクチルガレート、ラウリルガレート、2,4,6-トリ-t-ブチルフェノール、2,5-ジ-t-ブチルヒドロキノン、2,5-ジ-t-アミルヒドロキノン、4,4'-メチレン-ビス-(2,6-ジ-t-ブチルフェノール)1,3,5-トリメチル-2,4,6-トリス-(3,5-ジ-t-ブチル-4-ヒドロキシベンジル)ベンゼン、ベンゼンプロパン酸、3,5-ビス(1,1-ジメチルエチル)-4-ヒドロキシ、C7-9側鎖アルキルエステル(Cは炭素の数)等が挙げられる。
本実施形態は、前記(A)~(D)成分を必須成分として含有することにより、光や紫外線で硬化させることが可能になる。
特記しない限り、23℃で、実験した。表1~2に示す組成の硬化性樹脂組成物を調製し、評価した。結果を表1~2に示した。
(A-1)1,2-ポリブタジエンオリゴマー(日本曹達社製「TE-2000」)(GPCによるポリスチレン換算の数平均分子量2000)
(A-2)イソプレンオリゴマー(クラレ社製「UC-203」)(GPCによるポリスチレン換算の数平均分子量36000、イソプレン重合物の無水マレイン酸付加物と2-ヒドロキシエチル(メタクリレートとのエステル化物オリゴマー、式(1)にてYはエチレン基、Rはメチル基)
(A)成分の、(メタ)アクリロイル基を有さず、かつ、ジエン系又は水素添加されたジエン系の骨格を有するオリゴマーとして、以下の化合物を選択した。
(B-1)イソプレンオリゴマー(クラレ社製「LIR-30」)(GPCによるポリスチレン換算の数平均分子量28000)
(B-2)ブタジエンオリゴマー(クラレ社製「LBR-307」、1,4-ポリブタジエンオリゴマー)(GPCによるポリスチレン換算の数平均分子量8000)
(C)成分の、フェノキシ基若しくはノニルフェノキシ基を有する(メタ)アクリレートとして、以下の化合物を選択した。
(C-1)ノニルフェノキシポリエチレングリコールアクリレート(n=1)(東亜合成社製「M-111」)
(C-2)2-ヒドロキシ-3-フェノキシプロピルアクリレート(東亜合成社製「アロニックスM-5700」)
(C-3)ノニルフェノキシポリプロピレングリコールアクリレート(n=2.5)(東亜合成社製「M-117」)
(C-4)ノニルフェノキシポリエチレングリコール(n=7)とポリプロピレングリコール(n=2)アクリレートの混合物(「ノニルフェノキシポリエチレングリコール(n=7)/ポリプロピレングリコール(n=2)アクリレート」と略す、日油社製「ブレンマー75ANEP-600」)
(D)成分の光開始剤として、以下の化合物を選択した。
(D-1)1-ヒドロキシシクロヘキシルフェニルケトン(チバスペシャリティケミカル社製「Irgacure184」)
(D-2)2,4,6-トリメチルベンゾイル-ジフェニル-フォスフィンオキサイド(チバスペシャリティケミカル社製「DarocurTPO」)
(E)成分のシランカップリング剤として、以下の化合物を選択した。
(E-1)γ-メタクリロイロキシプロピルトリメトキシシラン(モメンティブ社製「シルクエストA-174」)
(F)成分の重合禁止剤として、以下の化合物を選択した。
(F-1)ベンゼンプロパン酸、3,5-ビス(1,1-ジメチルエチル)-4-ヒドロキシ、C7-9 側鎖アルキルエステル(BASF社製「イルガノックス1135」)
2軸延伸PETフィルム(ルミラーT60、平均厚さ190μm、東レ社製)の印刷加工された試験片(幅50mm×長さ10mm×厚さ0.19mm)同士を、硬化性樹脂組成物を接着剤組成物として用いて、貼り合わせ面に印刷加工がある状態で接着層の厚み30μmで接着面積を縦40mm×横10mmとして接着させた。光硬化による硬化後、接着剤組成物とで接着した該試験片の、密着されていない2箇所のフィルム端部を引っ張ることで、フィルム同士が密着された部分を剥離させて、初期の180°剥離接着強さを測定した。光硬化における光照射条件は〔光硬化性〕に記載の方法に従った。剥離接着強さ(単位:N/cm)は、引張試験器を用いて温度23℃、湿度50%の環境下で引張速度50mm/分で測定した。
印刷加工された耐熱ガラス試験片(幅25mm×長さ25mm×厚さ2.0mm)同士を、厚み80μm×幅11.5mm×長さ25mmのテフロン(登録商標)テープをスペーサーとして用い、硬化性樹脂組成物を接着剤組成物として用いて貼り合わせ面に印刷加工がある状態で接着させた(接着面積3.125cm2)。光硬化における光照射条件は〔光硬化性〕に記載の方法に従った。上記条件にて接着剤組成物を硬化させた後、更に、試験片の両面に電気化学工業社製接着剤組成物「G-55」を使用し、亜鉛メッキ鋼板(幅100mm×長さ25mm×厚さ2.0mm、エンジニアリングテストサービス社製)を接着させた。硬化後、接着剤組成物で接着した該試験片を用いて、亜鉛メッキ鋼板をチャックして、初期の引張剪断接着強さを測定した。引っ張り剪断接着強さ(単位:MPa)は、引張試験器を用いて温度23℃、湿度50%の環境下で引張速度10mm/分で測定した。
COPフィルム(ZEONOR、平均厚さ40μm、日本ゼオン社製)の印刷加工された試験片(幅50mm×長さ10mm×厚さ0.04mm)同士を、硬化性樹脂組成物を接着剤組成物として用いて、貼り合わせ面に印刷加工がある状態で接着層の厚み10μmで接着面積を縦40mm×横10mmとして接着させた。光硬化による硬化後、接着剤組成物で接着した該試験片の、密着されていない2箇所のフィルム端部を引っ張ることで、フィルム同士が密着された部分を剥離させて、初期の180°剥離接着強さを測定した。光硬化における光照射条件は〔光硬化性〕に記載の方法に従った。剥離接着強さ(単位:N/cm)は、引張試験器を用いて温度23℃、湿度50%の環境下で引張速度50mm/分で測定した。
トリアセチルセルロース(TAC)フィルム(平均厚さ40μm、富士フィルム社製)の印刷加工された試験片(幅50mm×長さ10mm×厚さ0.04mm)同士を、硬化性樹脂組成物を接着剤組成物として用いて、貼り合わせ面に印刷加工がある状態で接着層の厚み10μmで接着面積を縦40mm×横10mmとして接着させた。接着剤組成物で接着した該試験片の、密着されていない2箇所のフィルム端部を引っ張ることで、フィルム同士が密着された部分を剥離させて、初期の180°剥離接着強さを測定した。光硬化における光照射条件は〔光硬化性〕に記載の方法に従った。剥離接着強さ(単位:N/cm)は、引張試験器を用いて温度23℃、湿度50%の環境下で引張速度50mm/分で測定した。
PVDF(Polyvinylidene fluoride)フィルム(平均厚さ40μm、電気化学工業社製「DXフィルム」)の印刷加工された試験片(幅50mm×長さ10mm×厚さ0.04mm)同士を、硬化性樹脂組成物を接着剤組成物として用いて、貼り合わせ面に印刷加工がある状態で接着層の厚み10μmで接着面積を縦40mm×横10mmとして接着させた。接着剤組成物で接着した該試験片の、密着されていない2箇所のフィルム端部を引っ張ることで、フィルム同士が密着された部分を剥離させて、初期の180°剥離接着強さを測定した。光硬化における光照射条件は〔光硬化性〕に記載の方法に従った。剥離接着強さ(単位:N/cm)は、引張試験器を用いて温度23℃、湿度50%の環境下で引張速度50mm/分で測定した。
印刷加工されたポリカーボネート(帝人社製「パンライト」)試験片(幅25mm×長さ25mm×厚さ2.0mm)同士を、厚み80μm×幅12.5mm×長さ25mmのテフロン(登録商標)テープをスペーサーとして用い、硬化性樹脂組成物を接着剤組成物として用いて貼り合わせ面に印刷加工がある状態で接着させた(接着面積3.125cm2)。光硬化における光照射条件は〔光硬化性〕に記載の方法に従った。引っ張り剪断接着強さ(単位:MPa)は、引張試験器を用いて温度23℃、湿度50%の環境下で引張速度10mm/分で測定した。
印刷加工されたSPCC試験片(幅25mm×長さ25mm×厚さ1.6mm)とテンパックスガラス(幅25mm×長さ25mm×厚さ2mm)を、厚み80μm×幅12.5mm×長さ25mmのテフロン(登録商標)テープをスペーサーとして用い、硬化性樹脂組成物を接着剤組成物として用いて貼り合わせ面に印刷加工がある状態で接着させた(接着面積3.125cm2)。光硬化における光照射条件は〔光硬化性〕に記載の方法に従った。上記条件にて接着剤組成物を硬化させた後、更に、テンパックス試験片側に電気化学工業社製接着剤組成物「G-55」を使用し、亜鉛メッキ鋼板(幅100mm×長さ25mm×厚さ2.0mm、エンジニアリングテストサービス社製)を接着させた。硬化後、接着剤組成物で接着した該試験片を用いて、亜鉛メッキ鋼板をチャックして、初期の引張剪断接着強さを測定した。引っ張り剪断接着強さ(単位:MPa)は、引張試験器を用いて温度23℃、湿度50%の環境下で引張速度10mm/分で測定した。
印刷加工されたテンパックスガラス(幅25mm×長さ25mm×厚さ2mm)同士を、硬化性樹脂組成物を接着剤組成物として用いて、貼り合わせ面に印刷加工がある状態で接着層の厚み100μmで接着面積を1.0mm2として接着させ硬化させた。光硬化における光照射条件は〔光硬化性〕に記載の方法に従った。硬化後、接着剤組成物で接着した該試験片を、恒温恒湿槽を用いて、温度85℃、相対湿度85%の環境下に1000時間暴露した。暴露後の試験片を用いて、引張剪断接着強さを測定した。接着部位の外観を目視で観察し、黄変しているか否かを調べた。引っ張り剪断接着強さ(単位:MPa)は、引張試験器を用いて温度23℃、湿度50%の環境下で引張速度10mm/分で測定した。
テンパックスガラス(幅25mm×長さ25mm×厚さ2mm)同士を、硬化性樹脂組成物を接着剤組成物として用いて、接着層の厚み100μmで接着面積を1.0mm2として接着させ硬化させた。光硬化における光照射条件は〔光硬化性〕に記載の方法に従った。硬化後、接着剤組成物で接着した該試験片をカラー測定装置(SHIMADZU社製「UV-VISIBLE SPECTROPOHOTOMETER」にてΔb値を黄変度とした。
Claims (13)
- 下記(A)~(D)成分を含有する硬化性樹脂組成物。
(A)(メタ)アクリロイル基を有し、かつ、ジエン系又は水素添加されたジエン系の骨格を有するオリゴマー100質量部
(B)400質量部を超える、(メタ)アクリロイル基を有さず、かつ、ジエン系又は水素添加されたジエン系の骨格を有するオリゴマー
(C)100質量部を超える、芳香族環を有する(メタ)アクリレート
(D)光重合開始剤 - 更に、(E)成分として、シランカップリング剤を含有する請求項1に記載の硬化性樹脂組成物。
- 更に、(F)成分として、重合禁止剤を含有する請求項1に記載の硬化性樹脂組成物。
- 前記(A)成分及び/又は前記(B)成分のジエン系又は水素添加されたジエン系の骨格が、ポリブタジエン、ポリイソプレン、ポリブタジエンの水素添加物、及びポリイソプレンの水素添加物からなる群から選ばれる1種以上の骨格である請求項1に記載の硬化性樹脂組成物。
- 前記(A)成分及び/又は前記(B)成分のジエン系又は水素添加されたジエン系の骨格を有するオリゴマーの分子量が500~70000である請求項1に記載の硬化性樹脂組成物。
- 請求項1~5のうちのいずれか1項に記載の硬化性樹脂組成物からなる接着剤組成物。
- 請求項6記載の接着剤組成物の硬化体。
- 請求項7記載の硬化体により被着体が被覆又は接合された複合体。
- 請求項8記載の被着体がトリアセチルセルロース、フッ素系ポリマー、ポリエステル、ポリカーボネート、ポリオレフィン、ガラス、金属からなる群から選ばれる1種以上である複合体。
- 請求項6に記載の接着剤組成物により被着体を貼り合わせたタッチパネル積層体。
- 請求項6に記載の接着剤組成物により被着体を貼り合わせた液晶パネル積層体。
- 請求項10に記載のタッチパネル積層体を用いたディスプレイ。
- 請求項11に記載の液晶パネル積層体を用いたディスプレイ。
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WO2010027041A1 (ja) * | 2008-09-05 | 2010-03-11 | 協立化学産業株式会社 | 光学機能材料を貼り合わせるための光硬化型樹脂組成物 |
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WO2015129308A1 (ja) * | 2014-02-28 | 2015-09-03 | 富士フイルム株式会社 | タッチパネル用積層体、および、粘着シート |
JP2015179498A (ja) * | 2014-02-28 | 2015-10-08 | 富士フイルム株式会社 | タッチパネル用積層体、および、粘着シート |
WO2016039289A1 (ja) * | 2014-09-08 | 2016-03-17 | 電気化学工業株式会社 | 組成物 |
JPWO2016039289A1 (ja) * | 2014-09-08 | 2017-08-03 | デンカ株式会社 | 組成物 |
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TWI582121B (zh) | 2017-05-11 |
CN104159939B (zh) | 2016-11-09 |
JP6088486B2 (ja) | 2017-03-01 |
CN104159939A (zh) | 2014-11-19 |
KR102004534B1 (ko) | 2019-07-26 |
JPWO2013136945A1 (ja) | 2015-08-03 |
KR20140134656A (ko) | 2014-11-24 |
TW201336876A (zh) | 2013-09-16 |
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